WO2016104276A1 - Pâte électroconductrice, structure de connexion et procédé de production d'une structure de connexion - Google Patents

Pâte électroconductrice, structure de connexion et procédé de production d'une structure de connexion Download PDF

Info

Publication number
WO2016104276A1
WO2016104276A1 PCT/JP2015/085195 JP2015085195W WO2016104276A1 WO 2016104276 A1 WO2016104276 A1 WO 2016104276A1 JP 2015085195 W JP2015085195 W JP 2015085195W WO 2016104276 A1 WO2016104276 A1 WO 2016104276A1
Authority
WO
WIPO (PCT)
Prior art keywords
electrode
connection
solder
conductive paste
target member
Prior art date
Application number
PCT/JP2015/085195
Other languages
English (en)
Japanese (ja)
Inventor
石澤　英亮
伸也 上野山
Original Assignee
積水化学工業株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 積水化学工業株式会社 filed Critical 積水化学工業株式会社
Priority to KR1020167031972A priority Critical patent/KR20170102184A/ko
Priority to JP2015561808A priority patent/JP5966102B1/ja
Priority to CN201580052378.9A priority patent/CN106716550B/zh
Publication of WO2016104276A1 publication Critical patent/WO2016104276A1/fr

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J201/00—Adhesives based on unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R11/00—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts
    • H01R11/01—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts characterised by the form or arrangement of the conductive interconnection between the connecting locations
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3485—Applying solder paste, slurry or powder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/11—Manufacturing methods
    • H01L2224/115—Manufacturing methods by chemical or physical modification of a pre-existing or pre-deposited material
    • H01L2224/1152—Self-assembly, e.g. self-agglomeration of the bump material in a fluid
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector

Definitions

  • the present invention relates to a conductive paste containing solder particles.
  • the present invention also relates to a connection structure using the conductive paste and a method for manufacturing the connection structure.
  • Anisotropic conductive materials such as anisotropic conductive paste and anisotropic conductive film are widely known.
  • anisotropic conductive material conductive particles are dispersed in a binder resin.
  • the anisotropic conductive material may be connected between a flexible printed circuit board and a glass substrate (FOG (Film on Glass)), or connected between a semiconductor chip and a flexible printed circuit board (COF ( (Chip on Film)), connection between a semiconductor chip and a glass substrate (COG (Chip on Glass)), connection between a flexible printed circuit board and a glass epoxy substrate (FOB (Film on Board)), and the like.
  • FOG Glass
  • COF Chip on Film
  • an anisotropic conductive material containing conductive particles is disposed on the glass epoxy substrate. To do.
  • a flexible printed circuit board is laminated, and heated and pressurized. As a result, the anisotropic conductive material is cured, and the electrodes are electrically connected via the conductive particles to obtain a connection structure.
  • Patent Document 1 includes a resin layer containing a thermosetting resin, solder powder, and a curing agent, and the solder powder and the curing agent include the resin layer.
  • An adhesive tape present therein is disclosed. This adhesive tape is in the form of a film, not a paste.
  • Patent Document 1 discloses a bonding method using the above-mentioned adhesive tape. Specifically, a first substrate, an adhesive tape, a second substrate, an adhesive tape, and a third substrate are laminated in this order from the bottom to obtain a laminate. At this time, the first electrode provided on the surface of the first substrate is opposed to the second electrode provided on the surface of the second substrate. Moreover, the 2nd electrode provided in the surface of the 2nd board
  • Patent Document 2 discloses an anisotropic conductive material in which conductive particles are dispersed in an insulating binder.
  • This anisotropic conductive material has a minimum melt viscosity [ ⁇ 0 ] of 1.0 ⁇ 10 2 to 1.0 ⁇ 10 6 mPa ⁇ sec.
  • 1 ⁇ [ ⁇ 1 ] / [ ⁇ 0 ] ⁇ 3 ([ ⁇ 0 ] is the minimum melt viscosity of the anisotropic conductive material, and [ ⁇ 1 ] is the temperature T 0 indicating the minimum melt viscosity. (Melt viscosity at a temperature T 1 lower by 30 ° C.).
  • Patent Document 3 discloses an anisotropic conductive material containing a curable compound, a thermal radical initiator, a photo radical initiator, and conductive particles.
  • the adhesive tape described in Patent Document 1 is a film, not a paste. For this reason, it is difficult to efficiently arrange the solder powder on the electrodes (lines). For example, in the adhesive tape described in Patent Document 1, a part of the solder powder is easily placed in a region (space) where no electrode is formed. Solder powder disposed in a region where no electrode is formed does not contribute to conduction between the electrodes.
  • the solder powder may not be efficiently disposed on the electrodes (lines).
  • An object of the present invention is to provide a conductive paste capable of efficiently arranging solder particles on electrodes, preventing positional displacement between the electrodes, and improving conduction reliability between the electrodes. is there. Moreover, this invention is providing the manufacturing method of the connection structure and connection structure using the said electrically conductive paste.
  • the solder includes a thermosetting compound and a thermosetting agent as a thermosetting component, and a plurality of solder particles, and the solder paste has a melting point of ⁇ 80 ° C. and a viscosity of the conductive paste.
  • a conductive paste is provided in which the ratio of the particles to the viscosity of the conductive paste at a melting point of ⁇ 30 ° C. is 1.5 or more and 4 or less.
  • the temperature indicating the minimum melt viscosity of the conductive paste is in a temperature range of the melting point of the solder particles ⁇ 30 ° C. or higher and the melting point of the solder particles + 20 ° C. or lower.
  • the thermosetting compound includes a thermosetting compound that is solid at 25 ° C.
  • the solder particles have an average particle diameter of 1 ⁇ m or more and 40 ⁇ m or less.
  • the content of the solder particles is 10% by weight or more and 90% by weight or less.
  • a first connection target member having at least one first electrode on the surface
  • a second connection target member having at least one second electrode on the surface
  • the first connection target member and the connection part connecting the second connection target member, and the material of the connection part is the conductive paste described above, and the first electrode and the second electrode Are connected electrically by a solder portion in the connection portion.
  • the first connection target member and the second connection target member are disposed so as to face each other, and by heating the conductive paste to a temperature equal to or higher than the melting point of the solder particles and equal to or higher than the curing temperature of the thermosetting component.
  • a step of electrically connecting the first electrode and the second electrode with a solder portion in the connection portion How to manufacture connection structures There is provided.
  • the conductive paste in the step of arranging the second connection target member and the step of forming the connection portion, no pressure is applied, and the conductive paste includes The weight of the second connection target member is added, or at least one of the step of arranging the second connection target member and the step of forming the connection portion is pressurized, and the first The pressure of pressurization is less than 1 MPa in both the step of disposing the connection target member 2 and the step of forming the connection portion.
  • the second connection target member is a semiconductor chip, a resin film, a flexible printed board, a flexible flat cable, or a rigid flexible board.
  • connection structure when a portion where the first electrode and the second electrode face each other in the stacking direction of the first electrode, the connection portion, and the second electrode is viewed, it is preferable that the solder portion in the connection portion is arranged in 50% or more of the area of 100% of the portion where the first electrode and the second electrode face each other. In the connection structure, when a portion where the first electrode and the second electrode face each other in a direction orthogonal to the stacking direction of the first electrode, the connection portion, and the second electrode is viewed In addition, it is preferable that 70% or more of the solder portion in the connection portion is disposed in a portion where the first electrode and the second electrode face each other.
  • the conductive paste according to the present invention includes a thermosetting compound and a thermosetting agent as a thermosetting component, and a plurality of solder particles, and the solder particles having a viscosity of the conductive paste at a melting point of ⁇ 80 ° C. of the solder particles. Since the ratio of the melting point to the viscosity of the conductive paste at ⁇ 30 ° C. is 1.5 or more and 4 or less, the solder particles can be arranged efficiently on the electrodes when the electrodes are electrically connected. The positional deviation between the electrodes can be prevented, and the conduction reliability between the electrodes can be improved.
  • FIG. 1 is a cross-sectional view schematically showing a connection structure obtained using a conductive paste according to an embodiment of the present invention.
  • 2A to 2C are cross-sectional views for explaining each step of an example of a method for manufacturing a connection structure using the conductive paste according to the embodiment of the present invention.
  • FIG. 3 is a cross-sectional view showing a modification of the connection structure.
  • the conductive paste according to the present invention includes a thermosetting compound and a thermosetting agent as a thermosetting component, and a plurality of solder particles.
  • the ratio (viscosity ( ⁇ -80) / viscosity ( ⁇ -30)) to viscosity ( ⁇ -30) is 1.5 or more and 4 or less.
  • the conductive paste according to the present invention since the above-described configuration is adopted, when the electrodes are electrically connected, the plurality of solder particles are likely to gather between the upper and lower electrodes, and the plurality of solder particles are collected. It can arrange
  • the alignment of the electrode of the first connection target member and the electrode of the second connection target member is performed. Even when the first connection target member and the second connection target member are overlapped in a shifted state, the shift is corrected and the electrodes of the first connection target member and the second connection target member are corrected. Can be connected (self-alignment effect). In order to obtain such an effect, it is a conductive paste, the conductive particles used together with the thermosetting compound and the thermosetting agent are solder particles, and the ratio (viscosity ( ⁇ 80) / viscosity ( ⁇ -30)) within the above range greatly contributes.
  • the ratio (viscosity ( ⁇ -80) / viscosity ( ⁇ -30)) is preferably 2 or more from the viewpoint of more efficiently arranging the solder particles on the electrodes and further improving the conduction reliability between the electrodes. Yes, preferably 2.8 or less.
  • the viscosity ( ⁇ -30) of the conductive paste at the melting point (° C.) ⁇ 30 ° C. of the solder particles is preferably 0.1 Pa ⁇ s or more, more preferably 0.2 Pa ⁇ s or more, preferably 1 Pa ⁇ s or less. More preferably, it is 0.5 Pa ⁇ s or less.
  • the viscosity ( ⁇ -30) greatly affects the movement of the conductive particles on the electrode.
  • the viscosity ( ⁇ -30) is not less than the above lower limit and not more than the above upper limit, the conduction reliability and insulation reliability between the electrodes are further enhanced.
  • the viscosity ( ⁇ mp) of the conductive paste at the melting point (° C.) of the solder particles is preferably 0.2 Pa ⁇ s or more, more preferably 0.3 Pa ⁇ s or more, preferably 2 Pa ⁇ s or less, more preferably 1 Pa. -S or less.
  • the viscosity ( ⁇ mp) greatly affects the thickness of the solder part between the electrodes. When the viscosity ( ⁇ mp) is not less than the above lower limit and not more than the above upper limit, the conduction reliability between the electrodes is further enhanced by increasing the thickness of the solder portion between the electrodes.
  • the viscosity ( ⁇ 25) of the conductive paste at 25 ° C. is preferably 10 Pa ⁇ s or more, more preferably 20 Pa ⁇ s or more, still more preferably 50 Pa ⁇ s or more, particularly preferably 80 Pa ⁇ s or more, preferably 600 Pa ⁇ s. Hereinafter, it is more preferably 300 Pa ⁇ s or less, and still more preferably 200 Pa ⁇ s or less.
  • the viscosity ( ⁇ 25) suppresses excessive wetting and spreading of the conductive paste and solder particles applied on the connection target member, and suppresses the placement of the cured product portion and the solder portion in an unintended region.
  • the conduction reliability between the electrodes is further enhanced.
  • the viscosity ( ⁇ 25) is 80 Pa ⁇ s or more and 200 Pa ⁇ s or less, the solder particles are arranged more efficiently on the electrodes, and the conduction reliability between the electrodes is further enhanced.
  • the temperature indicating the melt viscosity is preferably in the temperature range of the melting point of the solder particles (° C.) ⁇ 30 ° C. or higher and the melting point of the solder particles (° C.) + 20 ° C. or lower.
  • the melting point of the solder particles (° C.) ⁇ More preferably, it exists in a temperature range of 30 ° C. or higher and below the melting point (° C.) of the solder particles, and the melting point of the solder particles (° C.) ⁇ 30 ° C. More preferably, it exists in a temperature range.
  • the temperature indicated by the viscosity of the conductive paste and the minimum melt viscosity at each temperature is a condition using a rheometer (“STRESSTECH” manufactured by EOLOGICA), etc. Can be measured. In the measurement of the minimum melt viscosity, heating can be performed from room temperature (23 ° C.) until the conductive paste is cured.
  • the conductive paste according to the present invention can be suitably used for a connection structure according to the present invention described later and a method for manufacturing the connection structure.
  • the conductive paste is preferably an anisotropic conductive paste.
  • the conductive paste is preferably used for electrical connection of electrodes.
  • the conductive material is preferably a circuit connection material.
  • solder particles have solder on a conductive outer surface. As for the said solder particle, both a center part and an electroconductive outer surface are formed with the solder.
  • the solder particles are particles in which both the central portion and the outer surface of the conductive (conductive portion) are solder.
  • the zeta potential on the surface of the solder particles is positive.
  • the zeta potential of the surface of the solder particle may not be positive.
  • Zeta potential measurement method 0.05 g of solder particles are put in 10 g of methanol and subjected to ultrasonic treatment or the like to uniformly disperse to obtain a dispersion. Using this dispersion and using “Delsamax PRO” manufactured by Beckman Coulter, the zeta potential can be measured at 23 ° C. by electrophoretic measurement.
  • the zeta potential of the solder particles is preferably 0 mV or more, more preferably more than 0 mV, preferably 10 mV or less, more preferably 5 mV or less, even more preferably 1 mV or less, still more preferably 0.7 mV or less, particularly preferably 0.5 mV. It is as follows. When the zeta potential is less than or equal to the above upper limit, the solder particles hardly aggregate in the conductive paste before use. When the zeta potential is 0 mV or more, the solder particles efficiently aggregate on the electrode during mounting.
  • the solder particles preferably have a solder particle body and an anionic polymer disposed on the surface of the solder particle body.
  • the solder particles are preferably obtained by surface-treating the solder particle body with an anionic polymer or a compound that becomes an anionic polymer.
  • the solder particles are preferably a surface treated product of an anion polymer or a compound that becomes an anion polymer.
  • the said anion polymer and the compound used as the said anion polymer only 1 type may respectively be used and 2 or more types may be used together.
  • an anionic polymer for example, a (meth) acrylic polymer copolymerized with (meth) acrylic acid, synthesized from a dicarboxylic acid and a diol and having carboxyl groups at both ends
  • Polyester polymer polymer obtained by intermolecular dehydration condensation reaction of dicarboxylic acid and having carboxyl groups at both ends, polyester polymer synthesized from dicarboxylic acid and diamine and having carboxyl groups at both ends, and modified poval having carboxyl groups ( A method of reacting a carboxyl group of an anionic polymer with a hydroxyl group on the surface of a solder particle body using “GOHSEX T” manufactured by Nippon Synthetic Chemical Co., Ltd., etc.
  • anion portion of the anionic polymer examples include the carboxyl group, and other than that, a tosyl group (p—H 3 CC 6 H 4 S ( ⁇ O) 2 —), a sulfonate ion group (—SO 3 —) ), And phosphate ion groups (—PO 4 ⁇ ) and the like.
  • a compound having a functional group that reacts with a hydroxyl group on the surface of the solder particle body and having a functional group that can be polymerized by addition or condensation reaction is used.
  • the method of polymerizing on the surface is mentioned.
  • the functional group that reacts with the hydroxyl group on the surface of the solder particle body include a carboxyl group and an isocyanate group.
  • the functional group that polymerizes by addition and condensation reactions include a hydroxyl group, a carboxyl group, an amino group, and (meth).
  • An acryloyl group is mentioned.
  • the weight average molecular weight of the anionic polymer is preferably 2000 or more, more preferably 3000 or more, preferably 10,000 or less, more preferably 8000 or less.
  • the weight average molecular weight is not less than the above lower limit and not more than the above upper limit, it is easy to dispose an anionic polymer on the surface of the solder particle body, and it is easy to make the zeta potential on the surface of the solder particle positive.
  • the solder particles can be arranged on the electrodes even more efficiently.
  • the weight average molecular weight indicates a weight average molecular weight in terms of polystyrene measured by gel permeation chromatography (GPC).
  • the weight average molecular weight of the polymer obtained by surface-treating the solder particle body with a compound that becomes an anionic polymer is obtained by dissolving the solder in the solder particles and removing the solder particles with dilute hydrochloric acid or the like that does not cause decomposition of the polymer. It can be determined by measuring the weight average molecular weight of the remaining polymer.
  • the solder is preferably a metal (low melting point metal) having a melting point of 450 ° C. or lower.
  • the solder particles are preferably metal particles (low melting point metal particles) having a melting point of 450 ° C. or lower.
  • the low melting point metal particles are particles containing a low melting point metal.
  • the low melting point metal is a metal having a melting point of 450 ° C. or lower.
  • the melting point of the low melting point metal is preferably 300 ° C. or lower, more preferably 160 ° C. or lower.
  • the solder particles include tin.
  • the content of tin is preferably 30% by weight or more, more preferably 40% by weight or more, still more preferably 70% by weight or more, and particularly preferably 90% by weight or more.
  • the content of tin in the solder particles is equal to or higher than the lower limit, the connection reliability between the solder portion and the electrode is further enhanced.
  • the tin content is determined using a high-frequency inductively coupled plasma emission spectrometer (“ICP-AES” manufactured by Horiba, Ltd.) or a fluorescent X-ray analyzer (“EDX-800HS” manufactured by Shimadzu). It can be measured.
  • ICP-AES high-frequency inductively coupled plasma emission spectrometer
  • EDX-800HS fluorescent X-ray analyzer
  • solder particles By using the above solder particles, the solder is melted and joined to the electrodes, and the solder portion conducts between the electrodes. For example, since the solder portion and the electrode are not in point contact but in surface contact, the connection resistance is lowered. In addition, the use of solder particles increases the bonding strength between the solder portion and the electrode. As a result, peeling between the solder portion and the electrode is further less likely to occur, and the conduction reliability and the connection reliability are effectively increased.
  • the low melting point metal constituting the solder particles is not particularly limited.
  • the low melting point metal is preferably tin or an alloy containing tin.
  • the alloy include a tin-silver alloy, a tin-copper alloy, a tin-silver-copper alloy, a tin-bismuth alloy, a tin-zinc alloy, and a tin-indium alloy.
  • the low melting point metal is preferably tin, tin-silver alloy, tin-silver-copper alloy, tin-bismuth alloy, or tin-indium alloy because of its excellent wettability to the electrode. More preferred are a tin-bismuth alloy and a tin-indium alloy.
  • the solder particles are preferably a filler material having a liquidus line of 450 ° C. or lower based on JIS Z3001: Welding terms.
  • the composition of the solder particles include metal compositions containing zinc, gold, silver, lead, copper, tin, bismuth, indium and the like.
  • the solder particles include nickel, copper, antimony, aluminum, zinc, iron, gold, titanium, phosphorus, germanium, tellurium, cobalt, bismuth, manganese, chromium. Further, it may contain a metal such as molybdenum and palladium. Moreover, from the viewpoint of further increasing the bonding strength between the solder portion and the electrode, the solder particles preferably contain nickel, copper, antimony, aluminum, or zinc. From the viewpoint of further increasing the bonding strength between the solder part and the electrode, the content of these metals for increasing the bonding strength is preferably 0.0001% by weight or more, preferably 1% by weight in 100% by weight of the solder particles. % Or less.
  • the average particle diameter of the solder particles is preferably 0.5 ⁇ m or more, more preferably 1 ⁇ m or more, further preferably 3 ⁇ m or more, particularly preferably 5 ⁇ m or more, preferably 100 ⁇ m or less, more preferably 60 ⁇ m or less, and even more preferably 40 ⁇ m.
  • it is more preferably 30 ⁇ m or less, still more preferably 20 ⁇ m or less, particularly preferably 15 ⁇ m or less, and most preferably 10 ⁇ m or less.
  • the average particle diameter of the solder particles is particularly preferably 3 ⁇ m or more and 30 ⁇ m or less.
  • the average particle diameter” of the solder particles indicates the number average particle diameter.
  • the average particle diameter of the solder particles is obtained, for example, by observing 50 arbitrary solder particles with an electron microscope or an optical microscope and calculating an average value.
  • the coefficient of variation of the particle diameter of the solder particles is preferably 5% or more, more preferably 10% or more, preferably 40% or less, more preferably 30% or less.
  • the variation coefficient of the particle diameter is not less than the above lower limit and not more than the above upper limit, the solder particles can be more efficiently arranged on the electrode.
  • the coefficient of variation of the particle diameter of the solder particles may be less than 5%.
  • CV value (%) ( ⁇ / Dn) ⁇ 100 ⁇ : Standard deviation of particle diameter of solder particles Dn: Average value of particle diameter of solder particles
  • the shape of the solder particles is not particularly limited.
  • the solder particles may have a spherical shape or a shape other than a spherical shape such as a flat shape.
  • the content of the solder particles in 100% by weight of the conductive paste is preferably 1% by weight or more, more preferably 2% by weight or more, still more preferably 10% by weight or more, particularly preferably 20% by weight or more, and most preferably 30%. % By weight or more, preferably 90% by weight or less, more preferably 80% by weight or less, still more preferably 60% by weight or less, and particularly preferably 50% by weight or less.
  • the content of the solder particles is not less than the above lower limit and not more than the above upper limit, it is possible to more efficiently arrange the solder particles on the electrodes, and it is easy to arrange many solder particles between the electrodes, The conduction reliability is further increased. From the viewpoint of further improving the conduction reliability, it is preferable that the content of the solder particles is large.
  • the content of the solder particles is preferably 100% by weight of the conductive paste from the viewpoint of further improving the conduction reliability. Is 20% by weight or more, more preferably 30% by weight or more, preferably 55% by weight or less, more preferably 45% by weight or less.
  • the content of the solder particles is preferably 100% by weight of the conductive paste. Is 30% by weight or more, more preferably 40% by weight or more, preferably 70% by weight or less, more preferably 60% by weight or less.
  • the content of the solder particles is preferably 100% by weight of the conductive paste from the viewpoint of further improving the conduction reliability. Is 30% by weight or more, more preferably 40% by weight or more, preferably 70% by weight or less, more preferably 60% by weight or less.
  • the content of the solder particles is preferably 100% by weight of the conductive paste. Is 30% by weight or more, more preferably 40% by weight or more, preferably 70% by weight or less, more preferably 60% by weight or less.
  • thermosetting compound thermosetting component
  • the thermosetting compound is a compound that can be cured by heating.
  • examples of the thermosetting compound include oxetane compounds, epoxy compounds, episulfide compounds, (meth) acrylic compounds, phenolic compounds, amino compounds, unsaturated polyester compounds, polyurethane compounds, silicone compounds, and polyimide compounds.
  • an epoxy compound is preferable.
  • the said thermosetting compound only 1 type may be used and 2 or more types may be used together.
  • thermosetting compound having a melting point of 80 ° C. or higher and 140 ° C. or lower.
  • the melting point of the thermosetting compound is preferably equal to or lower than the melting point (° C.) of the solder in the solder particles, More preferably, the melting point of the solder in the solder particles is ⁇ 20 ° C. or lower, and still more preferably the melting point of the solder in the solder particles is ⁇ 40 ° C. or lower.
  • thermosetting compound Preferably contains a crystalline thermosetting compound.
  • crystalline thermosetting compound only 1 type may be used and 2 or more types may be used together.
  • thermosetting compound preferably contains a thermosetting compound having a molecular weight of 200 or more and 800 or less, and more preferably contains a crystalline thermosetting compound having a molecular weight of 200 or more and 800 or less.
  • the molecular weight means a molecular weight that can be calculated from the structural formula when the thermosetting compound is not a polymer and when the structural formula of the thermosetting compound can be specified. Moreover, when the said thermosetting compound is a polymer, a weight average molecular weight is meant.
  • the weight average molecular weight is a weight average molecular weight in terms of polystyrene measured by gel permeation chromatography (GPC).
  • the active compound is preferably solid at 25 ° C.
  • the above crystalline thermosetting The melting point of the functional compound is preferably 80 ° C. or higher, more preferably 85 ° C. or higher, preferably 150 ° C. or lower, more preferably 140 ° C. or lower.
  • the above crystalline thermosetting The molecular weight of the functional compound is preferably 300 or more, more preferably 350 or more, preferably 500 or less, more preferably 400 or less.
  • the molecular weight means a molecular weight that can be calculated from the structural formula when the thermosetting compound is not a polymer and when the structural formula of the thermosetting compound can be specified. Moreover, when the said thermosetting compound is a polymer, a weight average molecular weight is meant.
  • thermosetting compound examples include epoxy compounds and (meth) acrylic compounds.
  • the above-mentioned epoxy compound includes an aromatic epoxy compound.
  • crystalline epoxy compounds such as resorcinol type epoxy compounds, naphthalene type epoxy compounds, biphenyl type epoxy compounds, and benzophenone type epoxy compounds are preferable.
  • An epoxy compound that is solid at normal temperature (23 ° C.) and has a melting temperature equal to or lower than the melting point of the solder is preferable.
  • the melting temperature is preferably 100 ° C. or lower, more preferably 80 ° C. or lower, and preferably 40 ° C. or higher.
  • the above (meth) acrylic compound is a compound having a (meth) acryloyl group.
  • examples of the (meth) acrylic compound include epoxy (meth) acrylate compounds.
  • a compound in which a (meth) acryloyl group is introduced into the epoxy compound with (meth) acrylic acid or the like is preferable.
  • the content of the thermosetting compound is preferably 20% by weight or more, more preferably 40% by weight or more, still more preferably 50% by weight or more, and preferably 99% by weight or less. Is 98% by weight or less, more preferably 90% by weight or less, and particularly preferably 80% by weight or less. From the viewpoint of further improving the impact resistance, it is preferable that the content of the thermosetting component is large.
  • the content of the thermosetting compound having a melting point of 80 ° C. or more and 140 ° C. or less and the content of the crystalline thermosetting compound are each preferably 20% by weight or more, more preferably 40%.
  • % By weight or more more preferably 50% by weight or more, preferably 99% by weight or less, more preferably 98% by weight or less, still more preferably 90% by weight or less, and particularly preferably 80% by weight or less.
  • the content of the thermosetting compound having a melting point of 80 ° C. or more and 140 ° C. or less and the content of the crystalline thermosetting compound are preferably 10% by weight or more, respectively. More preferably, it is 30% by weight or more, further preferably 50% by weight or more, particularly preferably 70% by weight or more, and preferably 100% by weight or less.
  • thermosetting agent thermosetting component
  • the thermosetting agent thermosets the thermosetting compound.
  • examples of the thermosetting agent include imidazole curing agents, amine curing agents, phenol curing agents, polythiol curing agents, and other thiol curing agents, acid anhydrides, thermal cation initiators (thermal cation curing agents), and thermal radical generators. It is done. As for the said thermosetting agent, only 1 type may be used and 2 or more types may be used together.
  • An imidazole curing agent, a thiol curing agent, or an amine curing agent is preferable because the conductive paste can be cured more rapidly at a low temperature. Moreover, since a storage stability becomes high when the curable compound curable by heating and the thermosetting agent are mixed, a latent curing agent is preferable.
  • the latent curing agent is preferably a latent imidazole curing agent, a latent thiol curing agent, or a latent amine curing agent.
  • the said thermosetting agent may be coat
  • the imidazole curing agent is not particularly limited, and 2-methylimidazole, 2-ethyl-4-methylimidazole, 1-cyanoethyl-2-phenylimidazole, 1-cyanoethyl-2-phenylimidazolium trimellitate, 2, 4-Diamino-6- [2'-methylimidazolyl- (1 ')]-ethyl-s-triazine and 2,4-diamino-6- [2'-methylimidazolyl- (1')]-ethyl-s- Examples include triazine isocyanuric acid adducts.
  • the thiol curing agent is not particularly limited, and examples thereof include trimethylolpropane tris-3-mercaptopropionate, pentaerythritol tetrakis-3-mercaptopropionate, and dipentaerythritol hexa-3-mercaptopropionate. .
  • the amine curing agent is not particularly limited, and hexamethylenediamine, octamethylenediamine, decamethylenediamine, 3,9-bis (3-aminopropyl) -2,4,8,10-tetraspiro [5.5].
  • examples include undecane, bis (4-aminocyclohexyl) methane, metaphenylenediamine, and diaminodiphenylsulfone.
  • thermal cation initiator examples include iodonium cation curing agents, oxonium cation curing agents, and sulfonium cation curing agents.
  • examples of the iodonium-based cationic curing agent include bis (4-tert-butylphenyl) iodonium hexafluorophosphate.
  • examples of the oxonium-based cationic curing agent include trimethyloxonium tetrafluoroborate.
  • sulfonium-based cationic curing agent examples include tri-p-tolylsulfonium hexafluorophosphate.
  • the thermal radical generator is not particularly limited, and examples thereof include azo compounds and organic peroxides.
  • examples of the azo compound include azobisisobutyronitrile (AIBN).
  • examples of the organic peroxide include di-tert-butyl peroxide and methyl ethyl ketone peroxide.
  • the reaction initiation temperature of the thermosetting agent is preferably 50 ° C or higher, more preferably 70 ° C or higher, still more preferably 80 ° C or higher, preferably 250 ° C or lower, more preferably 200 ° C or lower, still more preferably 150 ° C or lower, Especially preferably, it is 140 degrees C or less.
  • the reaction start temperature of the thermosetting agent is not less than the above lower limit and not more than the above upper limit, the solder particles are more efficiently arranged on the electrode.
  • the reaction initiation temperature of the thermosetting agent is particularly preferably 80 ° C. or higher and 140 ° C. or lower.
  • the reaction initiation temperature of the thermosetting agent is preferably higher than the melting point of the solder in the solder particles, more preferably 5 ° C. or more, more preferably 10 It is more preferable that the temperature is higher than ° C.
  • the reaction start temperature of the thermosetting agent means the temperature at which the exothermic peak of DSC starts to rise.
  • the content of the thermosetting agent is not particularly limited.
  • the content of the thermosetting agent is preferably 0.01 parts by weight or more, more preferably 1 part by weight or more, preferably 200 parts by weight or less, more preferably 100 parts by weight with respect to 100 parts by weight of the thermosetting compound. Part or less, more preferably 75 parts by weight or less.
  • the content of the thermosetting agent is at least the above lower limit, it is easy to sufficiently cure the conductive paste.
  • the content of the thermosetting agent is not more than the above upper limit, it is difficult for an excess thermosetting agent that did not participate in curing after curing to remain, and the heat resistance of the cured product is further enhanced.
  • the conductive paste preferably contains a flux.
  • the flux is not particularly limited.
  • a flux generally used for soldering or the like can be used.
  • the flux include zinc chloride, a mixture of zinc chloride and an inorganic halide, a mixture of zinc chloride and an inorganic acid, a molten salt, phosphoric acid, a derivative of phosphoric acid, an organic halide, hydrazine, an organic acid, and pine resin.
  • Etc As for the said flux, only 1 type may be used and 2 or more types may be used together.
  • the flux is preferably solid at 25 ° C.
  • Examples of the molten salt include ammonium chloride.
  • Examples of the organic acid include lactic acid, citric acid, stearic acid, glutamic acid, and glutaric acid.
  • Examples of the pine resin include activated pine resin and non-activated pine resin.
  • the flux is preferably an organic acid having two or more carboxyl groups, pine resin.
  • the flux may be an organic acid having two or more carboxyl groups, or pine resin.
  • the above rosins are rosins whose main component is abietic acid.
  • the flux is preferably rosins, and more preferably abietic acid. By using this preferable flux, the conduction reliability between the electrodes is further enhanced.
  • the active temperature (melting point) of the flux is preferably 50 ° C. or higher, more preferably 70 ° C. or higher, further preferably 80 ° C. or higher, preferably 200 ° C. or lower, more preferably 190 ° C. or lower, even more preferably 160 ° C. or lower. More preferably, it is 150 ° C. or less, and still more preferably 140 ° C. or less.
  • the activation temperature of the flux is preferably 80 ° C. or higher and 190 ° C. or lower.
  • the active temperature of the flux is particularly preferably 80 ° C. or higher and 140 ° C. or lower.
  • Examples of the flux having a melting point of 80 ° C. or higher and 190 ° C. or lower include succinic acid (melting point 186 ° C.), glutaric acid (melting point 96 ° C.), adipic acid (melting point 152 ° C.), pimelic acid (melting point 104 ° C.), suberic acid
  • Examples thereof include dicarboxylic acids such as (melting point 142 ° C.), benzoic acid (melting point 122 ° C.), and malic acid (melting point 130 ° C.).
  • the boiling point of the flux is preferably 200 ° C. or lower.
  • the melting point of the flux is preferably higher than the melting point of the solder in the solder particles, preferably 5 ° C or higher, more preferably 10 ° C or higher. Is more preferable.
  • the melting point of the flux is preferably higher than the reaction start temperature of the thermosetting agent, more preferably 5 ° C or higher, more preferably 10 ° C or higher. More preferably.
  • the solder particles can be efficiently aggregated on the electrode portion. This is because, when heat is applied at the time of joining, when the electrode formed on the connection target member is compared with the portion of the connection target member around the electrode, the thermal conductivity of the electrode portion is that of the connection target member portion around the electrode. Due to the fact that it is higher than the thermal conductivity, the temperature rise of the electrode portion is fast. At the stage where the melting point of the solder particles is exceeded, the inside of the solder particles dissolves, but the oxide film formed on the surface does not reach the melting point (activation temperature) of the flux and is not removed.
  • the flux may be dispersed in the conductive paste or may be adhered on the surface of the solder particles.
  • the flux is preferably a flux that releases cations by heating.
  • a flux that releases cations upon heating the solder particles can be arranged more efficiently on the electrode.
  • the content of the flux is preferably 0.5% by weight or more, preferably 30% by weight or less, more preferably 25% by weight or less.
  • the conductive paste may not contain a flux.
  • the flux content is not less than the above lower limit and not more than the above upper limit, it becomes more difficult to form an oxide film on the surface of the solder and the electrode, and the oxide film formed on the surface of the solder and the electrode is more effective. Can be removed.
  • a filler may be added to the conductive paste.
  • the filler may be an organic filler or an inorganic filler. By adding the filler, the distance at which the solder particles aggregate can be suppressed, and the solder particles can be uniformly aggregated on all the electrodes of the substrate.
  • the filler content is preferably 0% by weight or more, preferably 5% by weight or less, more preferably 2% by weight or less, and further preferably 1% by weight or less.
  • the content of the filler is not less than the above lower limit and not more than the above upper limit, the solder particles are more efficiently arranged on the electrode.
  • the conductive paste is, for example, a filler, an extender, a softener, a plasticizer, a polymerization catalyst, a curing catalyst, a colorant, an antioxidant, a heat stabilizer, a light stabilizer, an ultraviolet absorber, and a lubricant.
  • various additives such as an antistatic agent and a flame retardant may be included.
  • connection structure includes a first connection target member having at least one first electrode on the surface, a second connection target member having at least one second electrode on the surface, and the first The connection object member and the connection part which has connected the said 2nd connection object member are provided.
  • the material of the connection portion is the conductive paste described above.
  • the connection part is formed of the conductive paste described above.
  • the connection part is a cured product of the conductive paste.
  • the first electrode and the second electrode are electrically connected by a solder portion in the connection portion.
  • the manufacturing method of the connection structure according to the present invention includes the step of disposing the conductive paste on the surface of the first connection target member having at least one first electrode on the surface using the conductive paste described above.
  • the second connection target member having at least one second electrode on the surface of the conductive paste opposite to the first connection target member side is provided with the first electrode and the second connection target.
  • connection structure according to the present invention since a specific conductive paste is used, a plurality of solder particles are likely to gather between the first electrode and the second electrode.
  • a plurality of solder particles can be efficiently arranged on the electrode (line).
  • another method for efficiently collecting a plurality of solder particles between the electrodes may be further employed.
  • a method for efficiently collecting a plurality of solder particles between electrodes when heat is applied to the conductive paste between the first connection target member and the second connection target member, the viscosity of the conductive paste by heat is applied.
  • the method of generating the convection of the electrically conductive paste between a 1st connection object member and a 2nd connection object member etc. is mentioned because it falls.
  • a method of generating convection due to a difference in heat capacity between the electrode on the surface of the connection target member and the other surface member, a method of generating convection as water vapor from the heat of the connection target member, and the first Examples include a method of generating convection due to a temperature difference between the connection target member and the second connection target member.
  • a method of selectively aggregating solder particles on the surface of the electrode may be further employed.
  • a method of selectively agglomerating solder particles on the surface of the electrode there is a connection target member formed of an electrode material having good wettability of molten solder particles and another surface material having poor wettability of molten solder particles.
  • a method of selectively adhering molten solder particles that have reached the surface of the electrode to the electrode and then melting and adhering another solder particle to the molten solder particles, and an electrode material with good thermal conductivity And other surface materials with poor thermal conductivity are selected, and when heat is applied, the temperature of the electrode is raised relative to the other surface members to selectively
  • the solder particles are selectively agglomerated on the electrodes by using solder particles that have been treated so as to have a positive charge with respect to the negative charges existing on the electrode formed of metal.
  • the thickness of the solder part between the electrodes is preferably 10 ⁇ m or more, more preferably 20 ⁇ m or more, preferably 100 ⁇ m or less, more preferably 80 ⁇ m or less.
  • the solder wetted area on the surface of the electrode is preferably 50% or more, more preferably 60% or more, still more preferably 70% or more, preferably 100. % Or less.
  • the step of arranging the second connection target member and the step of forming the connection portion no pressure is applied, and the second connection is applied to the conductive paste.
  • the weight of the target member is added, or pressure is applied in at least one of the step of arranging the second connection target member and the step of forming the connection portion, and the second connection target member It is preferable that the pressure of pressurization is less than 1 MPa in both the step of disposing and the step of forming the connecting portion. By not applying a pressure of 1 MPa or more, the aggregation of solder particles is considerably promoted.
  • the pressure of pressurization may be less than 1 MPa in both the step of performing pressure and arranging the second connection target member and the step of forming the connection portion.
  • the pressurization may be performed only in the step of arranging the second connection target member, or the pressurization may be performed only in the step of forming the connection portion.
  • Pressurization may be performed in both the step of arranging the connection target member and the step of forming the connection portion.
  • the case where the pressure is less than 1 MPa includes the case where no pressure is applied.
  • the pressure of pressurization is preferably 0.9 MPa or less, more preferably 0.8 MPa or less.
  • the pressure of the pressurization is 0.8 MPa or less, the aggregation of the solder particles is further promoted more remarkably than when the pressure of the pressurization exceeds 0.8 MPa.
  • connection structure in the step of arranging the second connection target member and the step of forming the connection portion, no pressure is applied, and the second connection is applied to the conductive paste.
  • the weight of the target member is preferably added, and in the step of arranging the second connection target member and the step of forming the connection portion, the conductive paste exceeds the weight force of the second connection target member. It is preferable that no pressure is applied.
  • the uniformity of the amount of solder can be further enhanced in the plurality of solder portions.
  • the thickness of the solder portion can be increased more effectively, and a plurality of solder particles can be easily collected between the electrodes, and the plurality of solder particles can be arranged more efficiently on the electrodes (lines).
  • the conduction reliability between the electrodes can be further enhanced.
  • the electrical connection between the laterally adjacent electrodes that should not be connected can be further prevented, and the insulation reliability can be further improved.
  • the connection portion is Solder particles arranged in a region (space) where no electrode is formed before being formed are more easily collected between the first electrode and the second electrode, and a plurality of solder particles are separated into electrodes (lines).
  • the inventor has also found that the arrangement can be made more efficient.
  • a configuration in which a conductive paste is used instead of a conductive film and a configuration in which the weight of the second connection target member is added to the conductive paste without applying pressure are used in combination. This has a great meaning in order to obtain the effects of the present invention at a higher level.
  • WO2008 / 023452A1 describes that it is preferable to pressurize with a predetermined pressure at the time of bonding from the viewpoint of efficiently moving the solder powder to the electrode surface, and the pressurizing pressure further ensures the solder area.
  • the pressure is set to 0 MPa or more, preferably 1 MPa or more.
  • a predetermined pressure may be applied to the adhesive tape by its own weight.
  • WO2008 / 023452A1 it is described that the pressure applied intentionally to the adhesive tape may be 0 MPa, but there is no difference between the effect when the pressure exceeding 0 MPa is applied and when the pressure is set to 0 MPa. Not listed.
  • WO2008 / 023452A1 recognizes nothing about the importance of using a paste-like conductive paste instead of a film.
  • the conductive film in order to change or adjust the thickness of the connection portion, it is necessary to prepare a conductive film having a different thickness or to prepare a conductive film having a predetermined thickness. There is.
  • the conductive film has a problem that the melt viscosity of the conductive film cannot be sufficiently lowered at the melting temperature of the solder, and the aggregation of the solder particles is hindered.
  • FIG. 1 is a cross-sectional view schematically showing a connection structure obtained using a conductive paste according to an embodiment of the present invention.
  • connection structure 1 shown in FIG. 1 is a connection that connects a first connection target member 2, a second connection target member 3, and the first connection target member 2 and the second connection target member 3.
  • Part 4 includes a thermosetting compound, a thermosetting agent, and a plurality of solder particles, and the ratio (viscosity ( ⁇ -80) / viscosity ( ⁇ -30)) is in the above range. It is formed of a conductive paste containing an agent.
  • the thermosetting compound and the thermosetting agent are thermosetting components.
  • the connecting portion 4 includes a solder portion 4A in which a plurality of solder particles are gathered and joined to each other, and a cured product portion 4B in which a thermosetting component is thermally cured.
  • the first connection object member 2 has a plurality of first electrodes 2a on the surface (upper surface).
  • the second connection target member 3 has a plurality of second electrodes 3a on the surface (lower surface).
  • the first electrode 2a and the second electrode 3a are electrically connected by the solder portion 4A. Therefore, the first connection target member 2 and the second connection target member 3 are electrically connected by the solder portion 4A.
  • no solder exists in a region (cured product portion 4B portion) different from the solder portion 4A gathered between the first electrode 2a and the second electrode 3a.
  • connection structure 1 a plurality of solder particles gather between the first electrode 2 a and the second electrode 3 a, and after the plurality of solder particles melt, After the electrode surface wets and spreads, it solidifies to form the solder portion 4A. For this reason, the connection area of 4 A of solder parts and the 1st electrode 2a, and 4 A of solder parts, and the 2nd electrode 3a becomes large. That is, by using the solder particles, the solder portion 4A, the first electrode 2a, and the solder portion are compared with the case where the conductive outer surface is made of a metal such as nickel, gold or copper. The contact area between 4A and the second electrode 3a increases. For this reason, the conduction
  • the conductive paste may contain a flux. When the flux is used, the flux is generally deactivated gradually by heating.
  • connection structure 1 shown in FIG. 1 all of the solder portions 4A are located in the facing region between the first and second electrodes 2a and 3a.
  • the connection structure 1X of the modification shown in FIG. 3 is different from the connection structure 1 shown in FIG. 1 only in the connection portion 4X.
  • the connection part 4X has the solder part 4XA and the hardened
  • most of the solder portions 4XA are located in regions where the first and second electrodes 2a and 3a are opposed to each other, and a part of the solder portion 4XA is first and second. You may protrude to the side from the area
  • the solder part 4XA protruding laterally from the region where the first and second electrodes 2a and 3a are opposed is a part of the solder part 4XA and is not a solder separated from the solder part 4XA.
  • the amount of solder away from the solder portion can be reduced, but the solder away from the solder portion may exist in the cured product portion.
  • connection structure 1 If the amount of solder particles used is reduced, the connection structure 1 can be easily obtained. If the amount of the solder particles used is increased, it becomes easy to obtain the connection structure 1X.
  • the portion where the first electrode and the second electrode face each other in the stacking direction of the first electrode, the connection portion, and the second electrode is seen.
  • the solder portion in the connection portion is preferably disposed.
  • the first electrode and the second electrode are opposed to each other in a direction orthogonal to the stacking direction of the first electrode, the connection portion, and the second electrode.
  • the portion where the first electrode and the second electrode face each other is 70% or more (more preferably 80% or more, more preferably 90%) of the solder portion in the connection portion. In particular, it is preferable that 95% or more, most preferably 99% or more) is disposed.
  • connection structure 1 using the conductive paste according to the embodiment of the present invention will be described.
  • the first connection target member 2 having the first electrode 2a on the surface (upper surface) is prepared.
  • a conductive paste 11 including a thermosetting component 11B and a plurality of solder particles 11A is disposed on the surface of the first connection target member 2 (first Process).
  • the conductive paste 11 is disposed on the surface of the first connection target member 2 on which the first electrode 2a is provided.
  • the solder particles 11A are disposed both on the first electrode 2a (line) and on a region (space) where the first electrode 2a is not formed.
  • the arrangement method of the conductive paste 11 is not particularly limited, and examples thereof include application with a dispenser, screen printing, and ejection with an inkjet device.
  • the 2nd connection object member 3 which has the 2nd electrode 3a on the surface (lower surface) is prepared.
  • the 2nd connection object member 3 is arrange
  • the second connection target member 3 is disposed from the second electrode 3a side. At this time, the first electrode 2a and the second electrode 3a are opposed to each other.
  • the conductive paste 11 is heated above the melting point of the solder particles 11A and above the curing temperature of the thermosetting component 11B (third step). That is, the conductive paste 11 is heated to a temperature higher than the melting point of the solder particles 11A and the curing temperature of the thermosetting component 11B. At the time of this heating, the solder particles 11A that existed in the region where no electrode is formed gather between the first electrode 2a and the second electrode 3a (self-alignment effect).
  • the conductive paste since the conductive paste is used instead of the conductive film, the conductive paste further has a specific composition, so that the solder particles 11A are disposed between the first electrode 2a and the second electrode 3a. To gather effectively. Also, the solder particles 11A are melted and joined together.
  • thermosetting component 11B is thermoset.
  • the connection portion 4 connecting the first connection target member 2 and the second connection target member 3 is formed with the conductive paste 11.
  • the connection part 4 is formed by the conductive paste 11
  • the solder part 4A is formed by joining a plurality of solder particles 11A
  • the cured part 4B is formed by thermosetting the thermosetting component 11B. If the solder particles 11A are sufficiently moved, the first electrode 2a and the second electrode are moved after the movement of the solder particles 11A not located between the first electrode 2a and the second electrode 3a starts. It is not necessary to keep the temperature constant until the movement of the solder particles 11A is completed.
  • the electrode of the first connection target member Even when the first connection target member and the second connection target member are overlapped in a state where the alignment with the electrode of the second connection target member is shifted, the shift is corrected and the first connection target is corrected.
  • the electrode of the member can be connected to the electrode of the second connection target member (self-alignment effect). This is because the molten solder self-aggregated between the electrode of the first connection target member and the electrode of the second connection target member is the electrode of the first connection target member and the electrode of the second connection target member.
  • the area where the solder and the other components of the conductive paste are in contact with each other is minimized, the area becomes more stable in terms of energy. Because. At this time, it is desirable that the conductive paste is not cured and that the viscosity of components other than the solder particles of the conductive paste is sufficiently low at that temperature and time.
  • connection structure 1 shown in FIG. 1 is obtained.
  • the second step and the third step may be performed continuously.
  • the laminated body of the obtained 1st connection object member 2, the electrically conductive paste 11, and the 2nd connection object member 3 is moved to a heating member,
  • the said 3rd You may perform a process.
  • the laminate In order to perform the heating, the laminate may be disposed on a heating member, or the laminate may be disposed in a heated space.
  • the heating temperature in the third step is not particularly limited as long as it is higher than the melting point of the solder particles and higher than the curing temperature of the thermosetting component.
  • the heating temperature is preferably 140 ° C. or higher, more preferably 160 ° C. or higher, preferably 450 ° C. or lower, more preferably 250 ° C. or lower, and still more preferably 200 ° C. or lower.
  • a 1st connection object member or a 2nd connection object member can be peeled from a connection part for the purpose of correction of a position, or re-production.
  • the heating temperature for performing this peeling is preferably not lower than the melting point of the solder particles, more preferably not lower than the melting point (° C.) of the solder particles + 10 ° C.
  • the heating temperature for performing this peeling may be the melting point (° C.) of the solder particles + 100 ° C. or less.
  • connection structure As the heating method in the third step, a method of heating the entire connection structure using a reflow furnace or an oven above the melting point of the solder particles and the curing temperature of the thermosetting component, or a connection structure The method of heating only the connection part of a body locally is mentioned.
  • instruments used in the method of locally heating include a hot plate, a heat gun that applies hot air, a soldering iron, and an infrared heater.
  • the metal directly under the connection is made of a metal with high thermal conductivity, and other places where heating is not preferred are made of a material with low thermal conductivity such as a fluororesin.
  • the upper surface of the hot plate is preferably formed.
  • the first and second connection target members are not particularly limited. Specifically as said 1st, 2nd connection object member, electronic components, such as a semiconductor chip, a semiconductor package, LED chip, LED package, a capacitor
  • the first and second connection target members are preferably electronic components.
  • At least one of the first connection target member and the second connection target member is a resin film, a flexible printed board, a flexible flat cable, or a rigid flexible board.
  • the second connection target member is preferably a resin film, a flexible printed board, a flexible flat cable, or a rigid flexible board. Resin films, flexible printed boards, flexible flat cables, and rigid flexible boards have the property of being highly flexible and relatively lightweight. When a conductive film is used for connection of such a connection object member, there exists a tendency for a solder particle not to gather on an electrode.
  • connection target member Peripherals, area arrays, etc. exist in the form of the connection target member.
  • the electrodes are present only on the outer peripheral portion of the substrate.
  • the area array substrate there are electrodes in the plane.
  • the electrode provided on the connection target member examples include metal electrodes such as a gold electrode, a nickel electrode, a tin electrode, an aluminum electrode, a copper electrode, a molybdenum electrode, a silver electrode, a SUS electrode, and a tungsten electrode.
  • the electrode is preferably a gold electrode, a nickel electrode, a tin electrode, a silver electrode, or a copper electrode.
  • the electrode is preferably an aluminum electrode, a copper electrode, a molybdenum electrode, a silver electrode, or a tungsten electrode.
  • the electrode formed only with aluminum may be sufficient and the electrode by which the aluminum layer was laminated
  • the material for the metal oxide layer include indium oxide doped with a trivalent metal element and zinc oxide doped with a trivalent metal element.
  • the trivalent metal element include Sn, Al, and Ga.
  • the reaction product (Polymer A) is a hydroxyl group derived from bisphenol F, 1,6-hexanediol diglycidyl ether, bisphenol F type epoxy resin, and resorcinol type epoxy compound. It was confirmed that the structural unit bonded to the epoxy group in the main chain has an epoxy group at both ends.
  • the weight average molecular weight of the reaction product (polymer A) obtained by GPC was 28,000, and the number average molecular weight was 8,000.
  • Polymer B both ends epoxy group rigid skeleton phenoxy resin, “YX6900BH45” manufactured by Mitsubishi Chemical Corporation, weight average molecular weight 16000
  • Thermosetting compound 1 Naphthalene type epoxy compound (DIC Corporation “HP-4032D”, molecular weight 272)
  • Thermosetting compound 2 Resorcinol type epoxy compound (manufactured by Nagase ChemteX "EX-201", molecular weight 222)
  • Thermosetting compound 3 bisphenol F type epoxy resin compound, “EPICLON EXA-830CRP” manufactured by DIC
  • Thermosetting agent 1 Pentaerythritol tetrakis (3-mercaptobutyrate), “Karenz MT PE1” manufactured by Showa Denko KK
  • Latent epoxy thermosetting agent 1 T & K TOKA's “Fujicure 7000”
  • Flux 1 Adipic acid, manufactured by Wako Pure Chemical Industries, Ltd., melting point (activation temperature) 152 ° C.
  • Flux 2 Succinic acid, manufactured by Wako Pure Chemical Industries, Ltd., melting point (active temperature) 186 ° C.
  • solder particles having anionic polymer 1 200 g of solder particle main body, 40 g of adipic acid, and 70 g of acetone are weighed in a three-necked flask, and then dehydration condensation between the hydroxyl group on the surface of the solder particle main body and the carboxyl group of adipic acid 0.3 g of dibutyltin oxide as a catalyst was added and reacted at 60 ° C. for 4 hours. Thereafter, the solder particles were collected by filtration.
  • the collected solder particles, 50 g of adipic acid, 200 g of toluene, and 0.3 g of paratoluenesulfonic acid were weighed in a three-necked flask and reacted at 120 ° C. for 3 hours while evacuating and refluxing. . At this time, the reaction was carried out while removing water produced by dehydration condensation using a Dean-Stark extraction device.
  • solder particles were collected by filtration, washed with hexane, and dried. Thereafter, the obtained solder particles were pulverized with a ball mill and then sieved to a predetermined CV value.
  • solder particles were put in 10 g of methanol and subjected to ultrasonic treatment to uniformly disperse to obtain a dispersion.
  • the zeta potential was measured by electrophoretic measurement using this dispersion and “Delsamax PRO” manufactured by Beckman Coulter.
  • the weight average molecular weight of the anionic polymer 1 on the surface of the solder particles was obtained by dissolving the solder using 0.1N hydrochloric acid, collecting the polymer by filtration, and determining by GPC.
  • CV value of particle diameter of solder particles The CV value was measured with a laser diffraction particle size distribution analyzer (“LA-920” manufactured by Horiba, Ltd.).
  • conductive particles 1 Production method of conductive particles 1: Divinylbenzene resin particles having an average particle diameter of 10 ⁇ m (“Micropearl SP-210” manufactured by Sekisui Chemical Co., Ltd.) were subjected to electroless nickel plating to form a base nickel plating layer having a thickness of 0.1 ⁇ m on the surface of the resin particles. Next, the resin particles on which the base nickel plating layer was formed were subjected to electrolytic copper plating to form a 1 ⁇ m thick copper layer. Furthermore, electrolytic plating was performed using an electrolytic plating solution containing tin and bismuth to form a solder layer having a thickness of 3 ⁇ m.
  • Conductive particles 1 were prepared.
  • Glass epoxy substrate having a copper electrode pattern (copper electrode thickness 12 ⁇ m) having an L / S of 50 ⁇ m / 50 ⁇ m and an electrode length of 3 mm on the upper surface ( FR-4 substrate) (first connection target member) was prepared.
  • the flexible printed circuit board (2nd connection object member) which has a copper electrode pattern (copper electrode thickness 12 micrometers) of L / S 50 micrometers / 50 micrometers and electrode length 3mm on the lower surface was prepared.
  • the overlapping area of the glass epoxy substrate and the flexible printed circuit board was 1.5 cm ⁇ 3 mm, and the number of connected electrodes was 75 pairs.
  • the anisotropic conductive paste immediately after production is applied by screen printing using a metal mask so that the thickness is 100 ⁇ m on the electrode of the glass epoxy substrate, and anisotropic conductive A paste layer was formed.
  • the flexible printed circuit board was laminated on the upper surface of the anisotropic conductive paste layer so that the electrodes face each other. At this time, no pressure was applied. The weight of the flexible printed board is added to the anisotropic conductive paste layer. Thereafter, while heating the anisotropic conductive paste layer to 190 ° C., the solder is melted, and the anisotropic conductive paste layer is cured at 190 ° C. for 10 seconds. Obtained.
  • 2nd connection structure was obtained like manufacture of the 1st connection structure except having used the above-mentioned glass epoxy board and flexible printed circuit board from which L / S differs.
  • Glass epoxy substrate having a copper electrode pattern (copper electrode thickness 12 ⁇ m) having an L / S of 100 ⁇ m / 100 ⁇ m and an electrode length of 3 mm on the upper surface ( FR-4 substrate) (first connection target member) was prepared.
  • the flexible printed circuit board (2nd connection object member) which has a copper electrode pattern (copper electrode thickness 12 micrometers) of L / S of 100 micrometers / 100 micrometers and an electrode length of 3 mm on the lower surface was prepared.
  • 3rd connection structure was obtained like manufacture of the 1st connection structure except having used the above-mentioned glass epoxy board and flexible printed circuit board from which L / S differs.
  • Viscosity in the anisotropic conductive paste the viscosity and minimum melt viscosity at each temperature (25 ° C., solder particle melting point ⁇ 80 ° C., solder particle melting point ⁇ 30 ° C., solder particle melting point) Using a meter (“STRESSTECH” manufactured by EOLOGICA), etc., the rotor diameter was 20 mm, the oscillation strain was controlled, and the temperature increase rate was 10 ° C./min.
  • solder placement accuracy 1 In the obtained connection structure, when the portion where the first electrode and the second electrode face each other in the stacking direction of the first electrode, the connection portion, and the second electrode is viewed, The ratio X of the area where the solder part in the connection part is arranged in the area of 100% of the part facing the second electrode was evaluated.
  • the solder placement accuracy 1 on the electrode was determined according to the following criteria.
  • Ratio X is 70% or more ⁇ : Ratio X is 60% or more and less than 70% ⁇ : Ratio X is 50% or more and less than 60% X: Ratio X is less than 50%
  • solder placement accuracy on electrode 2 In the obtained connection structure, when the portion where the first electrode and the second electrode face each other in the direction orthogonal to the stacking direction of the first electrode, the connection portion, and the second electrode is seen, The ratio Y of the solder part in the connection part arrange
  • the solder placement accuracy 2 on the electrode was determined according to the following criteria.
  • Ratio Y is 99% or more ⁇ : Ratio Y is 90% or more and less than 99% ⁇ : Ratio Y is 70% or more and less than 90% X: Ratio Y is less than 70%
  • ⁇ Average value of connection resistance is 10 7 ⁇ or more ⁇ : Average value of connection resistance is 10 6 ⁇ or more, less than 10 7 ⁇ ⁇ : Average value of connection resistance is 10 5 ⁇ or more, less than 10 6 ⁇ ⁇ : Connection The average resistance is less than 10 5 ⁇
  • connection structure a portion where the first electrode and the second electrode face each other in the stacking direction of the first electrode, the connection portion, and the second electrode
  • the center line of the first electrode and the center line of the second electrode were aligned, and the distance of the displacement was evaluated.
  • the positional deviation between the upper and lower electrodes was determined according to the following criteria.
  • Misalignment is less than 15 ⁇ m ⁇ : Misalignment is 15 ⁇ m or more and less than 25 ⁇ m ⁇ : Misalignment is 25 ⁇ m or more and less than 40 ⁇ m ⁇ : Misalignment is 40 ⁇ m or more

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Organic Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Dispersion Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Inorganic Chemistry (AREA)
  • Conductive Materials (AREA)
  • Non-Insulated Conductors (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Combinations Of Printed Boards (AREA)

Abstract

L'invention concerne une pâte électroconductrice permettant d'agencer de manière efficace des particules de brasure sur une électrode, d'éviter un décalage de position entre des électrodes et d'accroître la fiabilité de la conduction entre des électrodes. Cette pâte électroconductrice comprend : en tant que composante thermodurcissable, un composé thermodurcissable et un agent de durcissement à chaud; et une pluralité de particules de brasure. Le rapport viscosité de la pâte électroconductrice à 80 °C en dessous du point de fusion des particules de brasure/viscosité de la pâte électroconductrice à 30 °C en dessous du point de fusion des particules de brasure est compris entre 1,5 et 4.
PCT/JP2015/085195 2014-12-26 2015-12-16 Pâte électroconductrice, structure de connexion et procédé de production d'une structure de connexion WO2016104276A1 (fr)

Priority Applications (3)

Application Number Priority Date Filing Date Title
KR1020167031972A KR20170102184A (ko) 2014-12-26 2015-12-16 도전 페이스트, 접속 구조체 및 접속 구조체의 제조 방법
JP2015561808A JP5966102B1 (ja) 2014-12-26 2015-12-16 導電ペースト、接続構造体及び接続構造体の製造方法
CN201580052378.9A CN106716550B (zh) 2014-12-26 2015-12-16 导电糊剂、连接结构体及连接结构体的制造方法

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2014-265715 2014-12-26
JP2014265715 2014-12-26

Publications (1)

Publication Number Publication Date
WO2016104276A1 true WO2016104276A1 (fr) 2016-06-30

Family

ID=56150301

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2015/085195 WO2016104276A1 (fr) 2014-12-26 2015-12-16 Pâte électroconductrice, structure de connexion et procédé de production d'une structure de connexion

Country Status (5)

Country Link
JP (1) JP5966102B1 (fr)
KR (1) KR20170102184A (fr)
CN (1) CN106716550B (fr)
TW (1) TW201629988A (fr)
WO (1) WO2016104276A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2021079812A1 (fr) * 2019-10-25 2021-04-29 デクセリアルズ株式会社 Procédé de production d'une structure connectée, matériau de liaison électroconducteur anisotrope et structure connectée

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7312105B2 (ja) * 2018-04-18 2023-07-20 積水化学工業株式会社 導電材料、接続構造体及び接続構造体の製造方法
KR102556928B1 (ko) * 2021-03-31 2023-07-20 주식회사 노피온 자가 조립형 이방성 도전 접착제 및 이를 이용한 부품 실장 방법
CN113319454B (zh) * 2021-04-29 2022-08-23 中国电子科技集团公司第二十九研究所 一种表贴自带固态焊料连接器焊端焊料预置方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2008023452A1 (fr) * 2006-08-25 2008-02-28 Sumitomo Bakelite Co., Ltd. Bande adhésive, structure de jonction, et ensemble semi-conducteur
JP2010040893A (ja) * 2008-08-07 2010-02-18 Sumitomo Bakelite Co Ltd 端子間の接続方法、それを用いた半導体装置の製造方法、および導電性粒子の凝集方法
JP2010226140A (ja) * 2010-06-15 2010-10-07 Sony Chemical & Information Device Corp 接続構造体の製造方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8962986B2 (en) * 2009-10-15 2015-02-24 Hitachi Chemical Company, Ltd. Conductive adhesive, solar cell, method for manufacturing solar cell, and solar cell module
CN102513739A (zh) * 2011-12-30 2012-06-27 深圳市晨日科技有限公司 一种高温无铅无卤锡膏及其制备方法
JP5869911B2 (ja) * 2012-02-23 2016-02-24 株式会社タムラ製作所 熱硬化性樹脂組成物
JP5323284B1 (ja) * 2012-03-26 2013-10-23 積水化学工業株式会社 導電材料及び接続構造体

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2008023452A1 (fr) * 2006-08-25 2008-02-28 Sumitomo Bakelite Co., Ltd. Bande adhésive, structure de jonction, et ensemble semi-conducteur
JP2010040893A (ja) * 2008-08-07 2010-02-18 Sumitomo Bakelite Co Ltd 端子間の接続方法、それを用いた半導体装置の製造方法、および導電性粒子の凝集方法
JP2010226140A (ja) * 2010-06-15 2010-10-07 Sony Chemical & Information Device Corp 接続構造体の製造方法

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2021079812A1 (fr) * 2019-10-25 2021-04-29 デクセリアルズ株式会社 Procédé de production d'une structure connectée, matériau de liaison électroconducteur anisotrope et structure connectée
JP2021068842A (ja) * 2019-10-25 2021-04-30 デクセリアルズ株式会社 接続体の製造方法、異方性導電接合材料、及び接続体
JP7032367B2 (ja) 2019-10-25 2022-03-08 デクセリアルズ株式会社 接続体の製造方法、異方性導電接合材料、及び接続体
JP7432633B2 (ja) 2019-10-25 2024-02-16 デクセリアルズ株式会社 接続体の製造方法、異方性導電接合材料、及び接続体

Also Published As

Publication number Publication date
TW201629988A (zh) 2016-08-16
CN106716550A (zh) 2017-05-24
CN106716550B (zh) 2019-04-19
JP5966102B1 (ja) 2016-08-10
KR20170102184A (ko) 2017-09-08
JPWO2016104276A1 (ja) 2017-04-27

Similar Documents

Publication Publication Date Title
JP6067149B2 (ja) 導電ペースト、接続構造体及び接続構造体の製造方法
JP6577867B2 (ja) 導電ペースト、接続構造体及び接続構造体の製造方法
JP5830196B1 (ja) 導電ペースト、接続構造体及び接続構造体の製造方法
JP6557591B2 (ja) 導電フィルム、接続構造体及び接続構造体の製造方法
WO2015186704A1 (fr) Pâte conductrice, structure connectée et procédé de fabrication de structure connectée
JP5966101B1 (ja) 導電ペースト、接続構造体及び接続構造体の製造方法
JP5966102B1 (ja) 導電ペースト、接続構造体及び接続構造体の製造方法
JP6592350B2 (ja) 異方性導電材料、接続構造体及び接続構造体の製造方法
WO2015133343A1 (fr) Pâte conductrice, structure de connexion et procédé de production de structure de connexion
JP2016126878A (ja) 導電ペースト、接続構造体及び接続構造体の製造方法
JP2016126877A (ja) 導電ペースト、接続構造体及び接続構造体の製造方法
JP6085031B2 (ja) 接続構造体の製造方法
JP6514610B2 (ja) 接続構造体の製造方法
JP2016062768A (ja) 接続構造体の製造方法及び接続構造体
WO2016035637A1 (fr) Procédé de fabrication de structure de connexion
JP6514615B2 (ja) 接続構造体の製造方法
JP2019160788A (ja) 導電材料、接続構造体及び接続構造体の製造方法
JP2016066614A (ja) 導電ペースト、接続構造体及び接続構造体の製造方法
JP2016054296A (ja) 接続構造体の製造方法
JP6514614B2 (ja) 接続構造体の製造方法及び接続構造体
JP2016076355A (ja) 接続構造体の製造方法及び接続構造体
JP2016066615A (ja) 導電ペースト、接続構造体及び接続構造体の製造方法
JP2019145501A (ja) 導電材料、接続構造体及び接続構造体の製造方法
JP2016126876A (ja) 導電材料、接続構造体及び接続構造体の製造方法
JP2016076693A (ja) 接続構造体の製造方法

Legal Events

Date Code Title Description
ENP Entry into the national phase

Ref document number: 2015561808

Country of ref document: JP

Kind code of ref document: A

121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 15872845

Country of ref document: EP

Kind code of ref document: A1

ENP Entry into the national phase

Ref document number: 20167031972

Country of ref document: KR

Kind code of ref document: A

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 15872845

Country of ref document: EP

Kind code of ref document: A1