WO2016098697A1 - 樹脂膜形成用シート積層体 - Google Patents

樹脂膜形成用シート積層体 Download PDF

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Publication number
WO2016098697A1
WO2016098697A1 PCT/JP2015/084790 JP2015084790W WO2016098697A1 WO 2016098697 A1 WO2016098697 A1 WO 2016098697A1 JP 2015084790 W JP2015084790 W JP 2015084790W WO 2016098697 A1 WO2016098697 A1 WO 2016098697A1
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WIPO (PCT)
Prior art keywords
resin film
sheet
film forming
forming layer
layer
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PCT/JP2015/084790
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English (en)
French (fr)
Japanese (ja)
Inventor
啓示 布施
泰紀 柄澤
雄太 佐川
Original Assignee
リンテック株式会社
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Application filed by リンテック株式会社 filed Critical リンテック株式会社
Priority to JP2016564827A priority Critical patent/JP6574787B2/ja
Priority to SG11201705001TA priority patent/SG11201705001TA/en
Publication of WO2016098697A1 publication Critical patent/WO2016098697A1/ja

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J201/00—Adhesives based on unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping

Definitions

  • the present invention relates to a resin film forming sheet laminate in which a resin film forming sheet can be easily attached to an adherend.
  • chip a semiconductor chip having electrodes such as bumps on a circuit surface
  • the electrodes are bonded to a substrate.
  • the surface (chip back surface) opposite to the circuit surface of the chip may be exposed.
  • the exposed chip back surface may be protected by an organic film.
  • a chip having a protective film made of an organic film is obtained by applying a liquid resin to the back surface of a wafer by spin coating, drying and curing, and cutting the protective film together with the wafer.
  • the thickness accuracy of the protective film formed in this way is not sufficient, the product yield may be lowered.
  • a protective film forming sheet in which a film for forming a semiconductor back surface protective film is laminated on an adhesive layer of an adhesive sheet having an adhesive layer may be used.
  • a semiconductor wafer manufactured in a large diameter state may be cut and separated (diced) into element pieces (semiconductor chips) and then transferred to the next bonding process.
  • the semiconductor wafer is subjected to dicing, cleaning, drying, expanding, and pick-up processes in a state of being adhered to the adhesive sheet in advance, and then transferred to the next bonding process.
  • various dicing / die bonding adhesive sheets having both a wafer fixing function and a die bonding function have been proposed in order to simplify the pick-up process and the bonding process.
  • the adhesive sheet by using the adhesive sheet, it is possible to obtain a semiconductor chip having an adhesive layer attached to the back surface, and direct die bonding such as between an organic substrate and a chip, between a lead frame and a chip, and between a chip and a chip is possible. It becomes.
  • Patent Document 1 Japanese Patent No. 46777758 includes a release substrate, a substrate film, and an adhesive layer disposed between the release substrate and the substrate film. Discloses a die bond dicing sheet in which a cut portion having a predetermined depth is formed from the surface on the adhesive layer side along the outer periphery of the adhesive layer.
  • Patent Document 2 Japanese Patent No. 5546985
  • a dicing tape with an adhesive layer in which an adhesive layer is laminated on a dicing tape is used with the adhesive layer as a bonding surface, with a predetermined interval.
  • a film for manufacturing a semiconductor device is disclosed, which is laminated on a separator, and in which a notch of a predetermined depth is formed along the outer periphery of the dicing tape.
  • a resin film forming sheet having a resin film forming layer such as the adhesive layer or the adhesive layer is attached to an adherend such as a semiconductor wafer.
  • the resin film forming sheet becomes unusable when the resin film forming layer is not smoothly fed out from the release substrate (separator). was there. That is, the resin film forming layer is in close contact with the release sheet, and the resin film forming sheet may not be attached to the adherend.
  • an object of the present invention is to provide a resin film-forming sheet laminate in which the resin film-forming sheet can be easily fed out from the release sheet and can be stably attached to the adherend. To do.
  • the inventors of the present invention formed a slit in the outer peripheral portion of the resin film-forming layer formed when producing a resin film-forming sheet laminate. It has been found that this is a cause of hindering the feeding of the resin film forming layer from the sheet. In other words, in the manufacturing process of the resin film forming sheet laminate, when the release sheet is cut when the resin film forming layer is die-cut, the resin film forming layer bites into the cut portion of the release sheet, and the release sheet It was found that peeling did not occur smoothly at the interface between the resin layer and the resin film forming layer. Based on this knowledge, it discovered that the said subject could be solved by using the sheet
  • the present invention includes the following gist.
  • a release sheet is laminated on the resin film forming layer side of the resin film forming sheet including the support sheet and the resin film forming layer,
  • the release sheet is a sheet laminate for resin film formation that does not have a cut portion along the outer peripheral portion of the resin film formation layer from the surface on the resin film formation layer side.
  • the support sheet has a cut portion along the outer peripheral portion of the resin film forming layer from the surface on the resin film forming layer side,
  • the resin film forming sheet laminate of the present invention when the resin film forming sheet is fed out from the release sheet, the resin film forming sheet is smoothly fed out.
  • FIG. 4 is a series of process diagrams for performing an operation of attaching a resin film forming sheet 10 including a support sheet 11 and a resin film forming layer 12 a to a semiconductor wafer 32.
  • FIG. 4 is a series of process diagrams for performing an operation of attaching a resin film forming sheet 10 including a support sheet 11 and a resin film forming layer 12 a to a semiconductor wafer 32.
  • FIG. 4 is a series of process diagrams for performing an operation of attaching a resin film forming sheet 10 including a support sheet 11 and a resin film forming layer 12 a to a semiconductor wafer 32.
  • FIG. 4 is a series of process diagrams for performing an operation of attaching a resin film forming sheet 10 including a support sheet 11 and a resin film forming layer 12 a to a semiconductor wafer 32.
  • FIG. 4 is a series of process diagrams for performing an operation of attaching a resin film forming sheet 10 including a support sheet 11 and a resin film forming layer 12 a to a semiconductor wafer 32.
  • seat laminated body for resin film formation which concerns on this invention is shown.
  • FIG. 3 shows a schematic cross-sectional view of the resin film-forming sheet laminate shown in FIG. 2 taken along the line AA (the resin film-forming sheet laminate of the first embodiment).
  • seat laminated body for resin film formation of a 2nd aspect is shown.
  • seat laminated body for resin film formation of a 1st aspect is shown.
  • seat laminated body for resin film formation of a 1st aspect is shown.
  • seat laminated body for resin film formation of a 1st aspect is shown.
  • seat laminated body for resin film formation of a 1st aspect is shown.
  • seat laminated body for resin film formation of a 1st aspect is shown.
  • seat laminated body for resin film formation of a 1st aspect is shown.
  • seat laminated body for resin film formation of a 1st aspect is shown.
  • the resin film-forming sheet laminate according to the present invention is formed by laminating a release sheet on the resin film-forming layer side of a resin film-forming sheet including a support sheet and a resin film-forming layer. And a peeling sheet does not have a notch part along the outer peripheral part of a resin film formation layer from the surface by the side of the resin film formation layer.
  • the resin film forming sheet laminate when a cut portion is formed in the release sheet along the outer peripheral portion of the resin film forming layer from the surface on the resin film forming layer side, the resin film forming layer is moved to the outer peripheral portion. And bite into the release sheet.
  • the step of applying the resin film forming sheet 10 of the resin film forming sheet laminate 100 shown in FIGS. 1 a to 1 d to the adherend 32 (hereinafter referred to as “adherent attachment step”).
  • adherend attachment step it is difficult to feed out the resin film forming layer sheet 10 from the release sheet 13.
  • This problem arises when the resin film forming sheet of the resin film forming sheet laminate is applied to the adherend without using the adherend attaching process shown in FIGS. This also occurs when the release sheet of the film-forming sheet laminate is removed and the resin film-forming sheet is attached to an adherend).
  • the resin film-forming layer side is cut into the release sheet along the outer peripheral portion of the resin film-forming layer. Since the part is not formed, the resin film forming layer does not bite into the cut portion of the release sheet, and in the adherend pasting step shown in FIGS. 1a to 1d, for example, in the pasting step to the adherend by manual work, It becomes easy to pay out the resin film forming sheet 10 from the release sheet 13. As a result, the resin film forming layer 12a can be stably attached to the adherend 32.
  • the method of confirming that a peeling sheet does not have a notch part is performed by the method as described in the Example mentioned later.
  • the support sheet 11 has a cut portion D ⁇ b> 1 along the outer periphery of the resin film forming layer from the surface on the resin film forming layer side.
  • the depth of cut d1 of the cut portion D1 is 0 ⁇ m or more and preferably 2/3 or less of the thickness of the support sheet, more preferably 0 ⁇ m or more and 1/2 or less of the thickness of the support sheet.
  • it is 0 ⁇ m or more and 1/3 or less of the thickness of the support sheet, more preferably 0 ⁇ m or more and 1/4 or less of the thickness of the support sheet.
  • the cutting depth d1 of the cutting part D1 is 0 micrometer, it means that the support sheet 11 does not have the cutting part D1.
  • the adhesive sheet which consists of the base material 11a and the adhesive layer 11b is used as the support sheet 11.
  • FIG. 1 When the adhesive sheet is used as the support sheet 11 by providing the cut portion D1 having a predetermined depth, the adhesive layer 11b of the support sheet 11 is bitten into the base material 11a, thereby causing a resin film forming sheet. In the manufacturing process of the laminated body 100 and the manufacturing process of the semiconductor device, delamination between the base material 11a and the pressure-sensitive adhesive layer 11b can be prevented.
  • the depth of cut of the cut portion in the present invention is obtained by observing the cross section of the cut portion with an optical microscope at a magnification of 300 times, and measuring the depth of cut of any four cut portions. The average value.
  • the release sheet 13 has a cutting depth d ⁇ b> 2 along the outer periphery of the support sheet 11 from the surface on the resin film forming layer side. You may have the notch part D2.
  • the adhesive layer 11 b may bite into the release sheet 13 when the cut portion D ⁇ b> 2 is formed in the manufacturing process of the resin film forming sheet laminate 100. As a result, it may be difficult to feed out the resin film forming sheet 10 from the release sheet 13 in the attaching process to the adherend.
  • the pressure-sensitive adhesive layer 11b generally has a lower pressure-sensitive adhesive force (adhesive force) than the resin film-forming layer 12a, the pressure-sensitive adhesive layer 11b is difficult to bite into the release sheet 13.
  • the cutting depth d2 is 2/3 or less of the thickness of the release sheet 13
  • the biting of the pressure-sensitive adhesive layer 11b into the release sheet 13 is minimized, and in the step of attaching to the adherend
  • the feeding of the resin film forming sheet 10 from the release sheet 13 does not become difficult.
  • the support sheet which consists only of a base material the said problem of biting does not arise.
  • the cut portion D2 having a cut depth of 1/10 or more of the thickness of the release sheet 13, it is easy to create a release start point at the interface between the resin film forming sheet 10 and the release sheet 13. Become. As a result, the feeding property of the resin film forming sheet is improved.
  • the release sheet 13 is prevented from being broken due to stress applied in the longitudinal direction (flow direction) of the release sheet 13 during the step of attaching to the adherend 32. it can.
  • the resin film forming sheet 10 can be reliably cut into a predetermined shape in the manufacturing process of the resin film forming sheet laminate 100.
  • the release sheet 13 is stressed in the longitudinal direction (flow direction). If the cut portion D2 is not formed in the release sheet 13, the stress may propagate to the resin film forming layer 12a and the resin film forming layer 12a may extend in the flow direction. The deformation (elongation) of the resin film forming layer 12a reduces the thickness accuracy. As a result, the reliability of the semiconductor device obtained using the resin film forming layer 12a may be reduced.
  • the cut portion D2 having a predetermined depth in the release sheet 13, the stress applied to the resin film forming layer 12a is relieved, and the deformation of the resin film forming layer 12a can be suppressed.
  • the depth of cut d2 of the cut portion D2 is preferably 1/10 or more and 2/3 or less of the thickness of the release sheet 13, more preferably 1/5 or more and 3/5 or less, More preferably, it is 1/2 or more and 3/5 or less, particularly preferably more than 1/2 and 3/5 or less.
  • the support sheet 11 and the resin film forming layer 12a are cut into a desired planar shape and partially laminated on the release sheet 13.
  • the desired planar shape in the support sheet 11 and the resin film forming layer 12a is a state in which the support sheet 11 and the resin film forming layer 12a are partially laminated on the release sheet 13, for example, as shown in FIG. If it becomes the shape used as it, it will not specifically limit.
  • the planar shape of the support sheet 11 is preferably a shape that can be easily attached to a jig such as a ring frame used in the manufacturing process of a semiconductor device to be described later.
  • a circular shape, a substantially circular shape, a rectangular shape, a pentagonal shape, a hexagonal shape examples thereof include a rectangular shape, an octagonal shape, and a wafer shape (a shape in which a part of the outer periphery of the circle is a straight line).
  • a circular shape or a wafer shape is preferable.
  • the planar shape of the resin film forming layer 12a is preferably a shape that matches the planar shape of an adherend such as a semiconductor wafer.
  • an adherend such as a semiconductor wafer.
  • a shape that is easy to be attached to the adherend such as a wafer shape (a shape in which a part of the outer periphery of the circle is a straight line), is preferable.
  • a circular shape or a wafer shape is preferable in order to reduce useless portions other than the portion attached to the adherend.
  • FIG. 2 is a plan view showing a first embodiment of the resin film-forming sheet laminate 100 according to the present invention
  • FIG. 3 shows the resin film-forming sheet laminate 100 shown in FIG. It is a schematic sectional drawing at the time of cutting along.
  • the diameter of the support sheet 11 is larger than the diameter of the resin film forming layer 12a.
  • the support sheet 11 is a pressure-sensitive adhesive sheet composed of a base material 11a and a pressure-sensitive adhesive layer 11b. As will be described later, only the substrate 11a can be used as a support sheet.
  • FIG. 4 is a schematic cross-sectional view of the resin film forming sheet laminate 100 of the second embodiment.
  • the diameter of the support sheet 11 is larger than the diameter of the resin film-forming layer 12a in plan view.
  • An annular jig adhesive layer 14 is provided between the release sheet 13 and the support sheet 11 on the outer peripheral portion of the resin film forming sheet 10. Further, the release sheet 13 may have a cut portion D3 along the inner periphery of the annular jig adhesive layer 14.
  • the cut depth d3 of the cut portion D3 is not particularly limited, and may be the same as the cut depth d2 of the cut portion D2, or may be larger or smaller, but 1/10 or more of the thickness of the release sheet It is preferably 2/3 or less, more preferably 1/10 or more and 3/5 or less of the thickness of the release sheet, and further preferably 1/10 or more and 1/2 or less of the thickness of the release sheet. preferable.
  • Support sheet 11 examples include polyethylene film, polypropylene film, polybutene film, polybutadiene film, polymethylpentene film, polyvinyl chloride film, vinyl chloride copolymer film, polyethylene terephthalate film, polyethylene naphthalate film, polybutylene terephthalate film, Polyurethane film, ethylene vinyl acetate copolymer film, ionomer resin film, ethylene / (meth) acrylic acid copolymer film, ethylene / (meth) acrylic acid ester copolymer film, polystyrene film, polycarbonate film, polyimide film, fluorine A resin film or the like is used. These crosslinked films are also used. Furthermore, these laminated films may be sufficient.
  • ⁇ A peeling agent may be applied to the surface of the film to perform a peeling treatment.
  • the release agent alkyd type, silicone type, fluorine type, unsaturated polyester type, polyolefin type, wax type and the like are used, and alkyd type, silicone type and fluorine type release agents are particularly preferable since they have heat resistance.
  • the release agent can be applied as it is without solvent, or after solvent dilution or emulsification, using a gravure coater, Mayer bar coater, air knife coater, roll coater, etc. Then, the release agent layer may be formed by subjecting the film coated with the release agent to room temperature or heating, or curing it with an electron beam.
  • the surface of the film may be subjected to easy adhesion treatment.
  • easy adhesion treatment there is no restriction
  • the thickness of the film is usually about 30 to 300 ⁇ m, preferably about 50 to 200 ⁇ m.
  • an adhesive sheet composed of a base material 11 a and an adhesive layer 11 b can be used as the support sheet 11.
  • the resin film forming layer 12a is laminated on the pressure-sensitive adhesive layer 11b provided on the base material 11a.
  • the base material 11a include the above-described films exemplified as a support sheet.
  • the substrate 11a is transparent to the ultraviolet rays.
  • the base material which is is preferable.
  • the base material 11a does not need to be transparent.
  • a transparent film or an opaque film colored with these can be used.
  • the pressure-sensitive adhesive layer 11b is not particularly limited as long as the resin film forming layer 12a formed thereon can be peeled off, and can be formed of various conventionally known pressure-sensitive adhesives.
  • Such an adhesive is not limited at all, but for example, a releasable adhesive such as rubber, acrylic, silicone or polyvinyl ether is used.
  • a releasable adhesive such as rubber, acrylic, silicone or polyvinyl ether is used.
  • an energy ray curable adhesive, a heat-foaming adhesive, or a water swelling adhesive can also be used. Since the adhesive strength of these adhesives is reduced by a predetermined operation, it becomes easy to peel the resin film forming layer 12a from the adhesive layer 11b.
  • the energy ray curable (UV curable, electron beam curable, etc.) type adhesive it is particularly preferable to use an ultraviolet curable adhesive.
  • the thickness of the pressure-sensitive adhesive layer 11b is usually about 1 to 100 ⁇ m, preferably about 2 to 80 ⁇ m.
  • the adhesive layer 11b may be irradiated with ultraviolet rays before the resin film forming layer 12a is laminated on the adhesive layer 11b.
  • the pressure-sensitive adhesive layer 11b may be irradiated with ultraviolet rays after the resin film forming layer 12a is laminated on the pressure-sensitive adhesive layer 11b.
  • the ratio of the thickness of a base material and the thickness of an adhesive layer is (the thickness of a base material) from a viewpoint of ensuring the effect resulting from the notch part D1 mentioned above. ): (Thickness of the pressure-sensitive adhesive layer), preferably 1: 1 to 200: 1, more preferably 2: 1 to 150: 1.
  • a resin film forming layer 12a On the support sheet 11, a resin film forming layer 12a is detachably laminated.
  • the breaking elongation of the resin film forming layer is preferably 1000% or less, and the breaking strength of the resin film forming layer is preferably 10 N / mm 2 or less.
  • the breaking elongation and breaking strength of the resin film forming layer can be easily cleaved in the manufacturing process of the resin film forming sheet laminate described below. From such a viewpoint, the breaking elongation of the resin film forming layer is more preferably 0.5 to 1000%, still more preferably 0.5 to 800%, and the breaking strength is more preferably 0.1 to 10N.
  • the elongation at break and the breaking strength of the resin film-forming layer are, for example, the content of the polymer component (A) described later, its weight average molecular weight, and the weight average molecular weight of the curable component (B) (specifically, epoxy compound)
  • the weight average molecular weight of (B11) and the weight average molecular weight of the thermosetting agent (B12) can be controlled.
  • the breaking elongation and breaking strength of the resin film forming layer are measured by the methods described in the examples described later.
  • At least the functions required for the resin film forming layer are (1) sheet shape maintenance, (2) initial adhesiveness, and (3) curability.
  • the resin film forming layer can be provided with (1) sheet shape maintaining property and (3) curability by adding a binder component.
  • a binder component As the binder component, the polymer component (A) and the curable component (B). Or a second binder component containing a curable polymer component (AB) having the properties of the component (A) and the component (B).
  • AB curable polymer component
  • the initial adhesiveness may be pressure-sensitive adhesiveness, and is softened and bonded by heat. It may be a property to do.
  • the initial adhesiveness is usually controlled by adjusting various properties of the binder component and adjusting the blending amount of the inorganic filler (C) described later.
  • a 1st binder component provides a sheet
  • the 1st binder component does not contain a curable polymer component (AB) for the convenience of distinguishing from a 2nd binder component.
  • the polymer component (A) is added to the resin film forming layer mainly for the purpose of imparting sheet shape maintenance to the resin film forming layer.
  • the weight average molecular weight (Mw) of the polymer component (A) is usually 20,000 or more, preferably 20,000 to 3,000,000.
  • the value of the weight average molecular weight (Mw) is a value when measured by a gel permeation chromatography method (GPC) method (polystyrene standard).
  • the measurement by such a method is carried out, for example, by using a high-speed GPC apparatus “HLC-8120GPC” manufactured by Tosoh Corporation and a high-speed column “TSK gold column H XL- H”, “TSK Gel GMH XL ”, “TSK Gel G2000 H XL ”. (All the above, manufactured by Tosoh Corporation) are connected in this order, and the detector is used as a differential refractometer at a column temperature of 40 ° C. and a liquid feed rate of 1.0 mL / min (hereinafter referred to as a differential refractometer). the same).
  • the polymer component (A) does not have a curing functional functional group described later.
  • an acrylic polymer obtained by reacting a urethane prepolymer having an isocyanate group at a molecular terminal with an acrylic polyol which is an acrylic polymer having a hydroxyl group, which is a combination of two or more of these. May be. Furthermore, two or more of these may be used in combination, including a polymer in which two or more are bonded.
  • acrylic polymer (A1) As the acrylic polymer polymer component (A), acrylic polymer (A1) is preferably used.
  • the glass transition temperature (Tg) of the acrylic polymer (A1) is preferably in the range of ⁇ 60 to 50 ° C., more preferably ⁇ 50 to 40 ° C., and further preferably ⁇ 40 to 30 ° C. If the glass transition temperature of the acrylic polymer (A1) is high, the adhesiveness of the resin film forming layer is lowered, so that it cannot be transferred to the adherend, or the resin film forming layer or the resin film forming layer from the adherend after the transfer. May cause problems such as peeling of the resin film obtained by curing. In addition, when the glass transition temperature of the acrylic polymer (A1) is low, the peeling force between the resin film forming layer and the support sheet is increased, and transfer failure of the resin film forming layer may occur.
  • the weight average molecular weight of the acrylic polymer (A1) is preferably 100,000 to 2,000,000, more preferably 300,000 to 1,500,000. If the weight average molecular weight of the acrylic polymer (A1) is high, the adhesiveness of the resin film forming layer is reduced, and transfer to the adherend becomes impossible, or the resin film forming layer or the resin film peels off from the adherend after transfer. May cause problems such as Further, when the weight average molecular weight of the acrylic polymer (A1) is low, the adhesiveness between the resin film forming layer and the support sheet is increased, and transfer failure of the resin film forming layer may occur. By making the weight average molecular weight of an acrylic polymer (A1) into the said range, it becomes easy to make the breaking elongation and breaking strength of a resin film formation layer into a predetermined range.
  • the acrylic polymer (A1) contains (meth) acrylic acid ester in at least a constituent monomer.
  • (meth) acrylic acid esters include alkyl (meth) acrylates having an alkyl group having 1 to 18 carbon atoms, specifically methyl (meth) acrylate, ethyl (meth) acrylate, propyl (meth) acrylate, butyl ( (Meth) acrylate, 2-ethylhexyl (meth) acrylate, etc .; (meth) acrylate having a cyclic skeleton, specifically cycloalkyl (meth) acrylate, benzyl (meth) acrylate, isobornyl (meth) acrylate, dicyclopentanyl ( Examples include meth) acrylate, dicyclopentenyl (meth) acrylate, dicyclopentenyloxyethyl (meth) acrylate, and imide (meth) acrylate. Moreover, what is (meth
  • (meth) acryl may be used in the meaning including both acryl and methacryl.
  • a monomer having a hydroxyl group may be used as the monomer constituting the acrylic polymer (A1).
  • a monomer having a hydroxyl group when used, when a hydroxyl group is introduced into the acrylic polymer (A1) and the resin film forming layer additionally contains an energy ray-curable component (B2), this and the acrylic polymer Compatibility with (A1) is improved.
  • the monomer having a hydroxyl group include (meth) acrylic acid ester having a hydroxyl group such as 2-hydroxylethyl (meth) acrylate and 2-hydroxypropyl (meth) acrylate; N-methylol (meth) acrylamide and the like.
  • a monomer having a carboxyl group may be used as the monomer constituting the acrylic polymer (A1).
  • a carboxyl group is introduced into the acrylic polymer (A1), and the resin film forming layer additionally contains an energy ray curable component (B2).
  • the monomer having a carboxyl group include (meth) acrylic acid esters having a carboxyl group such as 2- (meth) acryloyloxyethyl phthalate and 2- (meth) acryloyloxypropyl phthalate; Maleic acid, fumaric acid, itaconic acid and the like can be mentioned.
  • an epoxy-based thermosetting component as the curable component (B) described below, the carboxyl group and the epoxy group in the epoxy-based thermosetting component react with each other. The amount used is preferably small.
  • a monomer having an amino group may be used as a monomer constituting the acrylic polymer (A1).
  • a monomer having an amino group examples include (meth) acrylic acid esters having an amino group such as monoethylamino (meth) acrylate.
  • the monomer constituting the acrylic polymer (A1) vinyl acetate, styrene, ethylene, ⁇ -olefin and the like may be used.
  • the acrylic polymer (A1) is preferably 1 to 95 parts by mass, more preferably 5 to 80 parts by mass with respect to 100 parts by mass of the total solid content constituting the resin film forming layer. More preferably, it is contained in an amount of 10 to 60 parts by mass, particularly preferably 10 to 50 parts by mass.
  • the acrylic polymer (A1) may be cross-linked.
  • Crosslinking is performed by adding a crosslinking agent to the composition for forming the resin film-forming layer in which the acrylic polymer (A1) before being crosslinked has a crosslinkable functional group such as a hydroxyl group. This is carried out by the reaction of the functional group with the functional group of the crosslinking agent.
  • crosslinking agent examples include organic polyvalent isocyanate compounds and organic polyvalent imine compounds.
  • organic polyvalent isocyanate compounds include aromatic polyvalent isocyanate compounds, aliphatic polyvalent isocyanate compounds, alicyclic polyvalent isocyanate compounds, trimers of these organic polyvalent isocyanate compounds, and these organic polyvalent isocyanate compounds.
  • examples thereof include terminal isocyanate urethane prepolymers obtained by reacting with a polyol compound.
  • organic polyvalent isocyanate compound examples include 2,4-tolylene diisocyanate, 2,6-tolylene diisocyanate, 1,3-xylylene diisocyanate, 1,4-xylene diisocyanate, diphenylmethane-4,4′-.
  • organic polyvalent imine compounds include N, N′-diphenylmethane-4,4′-bis (1-aziridinecarboxamide), trimethylolpropane-tri- ⁇ -aziridinylpropionate, tetramethylol. Mention may be made of methane-tri- ⁇ -aziridinylpropionate and N, N′-toluene-2,4-bis (1-aziridinecarboxamide) triethylenemelamine.
  • the crosslinking agent is usually 0.01 to 20 parts by weight, preferably 0.1 to 10 parts by weight, more preferably 0.5 to 5 parts by weight with respect to 100 parts by weight of the acrylic polymer (A1) before crosslinking. Used in ratio.
  • the polymer component (A) when the content of the component constituting the resin film forming layer is determined based on the content of the polymer component (A), the polymer component (A) is a crosslinked acrylic polymer. In some cases, the reference content is the content of the acrylic polymer before being crosslinked.
  • Non-acrylic resin In addition, as the polymer component (A), polyester, phenoxy resin (for the purpose of distinguishing from the curable polymer component (AB) described later, limited to those having no epoxy group), polycarbonate, One type of non-acrylic resin (A2) selected from polyether, polyurethane, polysiloxane, rubber polymer, or a combination of two or more of these may be used, or a combination of two or more types. Such a resin preferably has a weight average molecular weight of 20,000 to 100,000, more preferably 20,000 to 80,000.
  • the glass transition temperature of the non-acrylic resin (A2) is preferably in the range of ⁇ 30 to 150 ° C., more preferably in the range of ⁇ 20 to 120 ° C.
  • the non-acrylic resin (A2) when used in combination with the above-mentioned acrylic polymer (A1), when the resin film forming layer is transferred to the adherend using the resin film forming sheet, The delamination from the resin film forming layer can be performed more easily, and the resin film forming layer can follow the transfer surface and the generation of voids can be suppressed.
  • the content of the non-acrylic resin (A2) is such that the non-acrylic resin (A2) and the acrylic polymer (
  • the mass ratio (A2: A1) to A1) is usually in the range of 1:99 to 80:20, preferably 1:99 to 60:40, more preferably 1:99 to 55:45.
  • the content of the non-acrylic resin (A2) is in this range, the above effect can be obtained.
  • the curable component (B) is added to the resin film forming layer mainly for the purpose of imparting curability to the resin film forming layer.
  • a thermosetting component (B1) or an energy beam curable component (B2) can be used. Moreover, you may use combining these.
  • the thermosetting component (B1) contains at least a compound having a functional group that reacts by heating.
  • the energy ray-curable component (B2) contains a compound (B21) having a functional group that reacts by irradiation with energy rays, and is polymerized and cured when irradiated with energy rays such as ultraviolet rays and electron beams.
  • Curing is realized by the functional groups of these curable components reacting to form a three-dimensional network structure. Since the curable component (B) is used in combination with the polymer component (A), from the viewpoint of suppressing the viscosity of the coating composition for forming the resin film-forming layer and improving the handleability, etc. Usually, its weight average molecular weight (Mw) is 10,000 or less, preferably 100 to 10,000.
  • thermosetting component for example, an epoxy thermosetting component is preferable.
  • the epoxy thermosetting component preferably contains a compound (B11) having an epoxy group and a combination of a compound (B11) having an epoxy group and a thermosetting agent (B12).
  • epoxy compound (B11) Compound having an epoxy group
  • a conventionally known compound can be used. Specifically, polyfunctional epoxy resin, bisphenol A diglycidyl ether and its hydrogenated product, orthocresol novolac epoxy resin, dicyclopentadiene type epoxy resin, biphenyl type epoxy resin, bisphenol A type epoxy resin, bisphenol F type Examples thereof include epoxy compounds having two or more functional groups in the molecule, such as epoxy resins and phenylene skeleton type epoxy resins. These can be used individually by 1 type or in combination of 2 or more types.
  • the resin film forming layer preferably contains 1 to 1500 parts by mass of the epoxy compound (B11), more preferably 100 parts by mass of the polymer component (A). Is contained in an amount of 3 to 1200 parts by mass.
  • the adhesiveness after hardening of a resin film formation layer to fall.
  • the peeling force of a resin film formation layer and a support sheet will become high, and the transfer defect of a resin film formation layer may arise.
  • the weight average molecular weight (Mw) of the epoxy compound (B11) is preferably 100 to 2,000, more preferably 200 to 1,500. By making the weight average molecular weight of an epoxy compound (B11) into the said range, it becomes easy to make the breaking elongation and breaking strength of a resin film formation layer into a predetermined range.
  • thermosetting agent (B12) functions as a curing agent for the epoxy compound (B11).
  • a preferable thermosetting agent includes a compound having two or more functional groups capable of reacting with an epoxy group in one molecule. Examples of the functional group include a phenolic hydroxyl group, an alcoholic hydroxyl group, an amino group, a carboxyl group, and an acid anhydride. Of these, phenolic hydroxyl groups, amino groups, acid anhydrides and the like are preferable, and phenolic hydroxyl groups and amino groups are more preferable.
  • phenolic curing agent examples include polyfunctional phenolic resins, biphenols, biphenylphenolic resins, novolac type phenolic resins, dicyclopentadiene type phenolic resins, zylock type phenolic resins, and aralkylphenolic resins.
  • amine curing agent is DICY (dicyandiamide). These can be used individually by 1 type or in mixture of 2 or more types.
  • the weight average molecular weight (Mw) of the thermosetting agent (B12) is not particularly limited, but is preferably 100 to 20,000, more preferably 200 to 20,000.
  • the thermosetting agent (B12) is preferably in a liquid state at 180 ° C. or lower, more preferably in a liquid state at 160 ° C. or lower, and particularly preferably in a liquid state at around normal temperature (23 ° C.).
  • the weight average molecular weight of the thermosetting agent (B12) in the above range, or using the thermosetting agent (B12) having the above properties (softening point)
  • the softening point can be measured, for example, by a method based on the ring and ball method described in JIS K7234: 1986.
  • the content of the thermosetting agent (B12) is preferably 0.1 to 500 parts by mass and more preferably 1 to 200 parts by mass with respect to 100 parts by mass of the epoxy compound (B11). When there is little content of a thermosetting agent, there exists a tendency for the adhesiveness after hardening to fall.
  • Curing accelerator A curing accelerator (B13) may be used to adjust the thermosetting speed of the resin film-forming layer.
  • the curing accelerator (B13) is particularly preferably used when an epoxy thermosetting component is used as the thermosetting component (B1).
  • Preferred curing accelerators include tertiary amines such as triethylenediamine, benzyldimethylamine, triethanolamine, dimethylaminoethanol, tris (dimethylaminomethyl) phenol; 2-methylimidazole, 2-phenylimidazole, 2-phenyl- Imidazoles such as 4-methylimidazole, 2-phenyl-4,5-dihydroxymethylimidazole and 2-phenyl-4-methyl-5-hydroxymethylimidazole; Organic phosphines such as tributylphosphine, diphenylphosphine and triphenylphosphine; And tetraphenylboron salts such as tetraphenylphosphonium tetraphenylborate and triphenylphosphinetetraphenylborate. These can be used individually by 1 type or in mixture of 2 or more types.
  • the curing accelerator (B13) is preferably 0.01 to 10 parts by mass, more preferably 0.1 to 1 part by mass with respect to 100 parts by mass of the total amount of the epoxy compound (B11) and the thermosetting agent (B12). Included in the amount of.
  • the curing accelerator (B13) By containing the curing accelerator (B13) in an amount within the above range, it has excellent adhesiveness even when exposed to high temperatures and high humidity, and has high reliability even when exposed to severe reflow conditions. Can be achieved.
  • the adhesiveness of the resin film forming layer after curing can be improved. Such an action becomes stronger as the content of the curing accelerator (B13) increases.
  • the resin film-forming layer contains the energy-ray-curable component, so that the resin film-forming layer can be cured without performing a heat curing step that requires a large amount of energy and a long time. . Thereby, the manufacturing cost can be reduced.
  • the energy ray-curable component the compound (B21) having a functional group that reacts by irradiation with energy rays may be used alone, but the compound (B21) having a functional group that reacts by irradiation with energy rays and a photopolymerization initiator ( It is preferable to use a combination of B22).
  • (B21) Compound having a functional group that reacts upon irradiation with energy rays
  • Compound (B21) having a functional group that reacts upon irradiation with energy rays (hereinafter sometimes referred to as “energy ray-reactive compound (B21)”)
  • energy ray-reactive compound (B21) trimethylolpropane triacrylate, pentaerythritol triacrylate, pentaerythritol tetraacrylate, dipentaerythritol monohydroxypentaacrylate, dipentaerythritol hexaacrylate or 1,4-butylene glycol diacrylate, 1,6-hexanediol diacrylate
  • Examples include acrylate compounds such as acrylates, oligoester acrylates, urethane acrylate oligomers, epoxy acrylates, polyether acrylates, and esters.
  • the resin film forming layer preferably contains 1 to 1500 parts by mass of the energy ray reactive compound (B21) with respect to 100 parts by mass of the polymer component (A). More preferably, it is contained in an amount of 3 to 1200 parts by mass.
  • photopolymerization initiator (B22) examples include benzophenone, acetophenone, benzoin, benzoin methyl ether, benzoin ethyl ether, benzoin isopropyl ether, benzoin isobutyl ether, benzoin benzoic acid, benzoin methyl benzoate, and benzoin dimethyl ketal.
  • a photoinitiator (B22) can be used individually by 1 type or in combination of 2 or more types.
  • the blending ratio of the photopolymerization initiator (B22) is preferably 0.1 to 10 parts by mass and more preferably 1 to 5 parts by mass with respect to 100 parts by mass of the energy ray reactive compound (B21). . If the blending ratio of the photopolymerization initiator (B22) is less than 0.1 parts by mass, sufficient curability may not be obtained due to insufficient photopolymerization, and if it exceeds 10 parts by mass, the residue does not contribute to photopolymerization. May cause a malfunction.
  • a 2nd binder component provides sheet shape maintenance property and curability to a resin film formation layer by containing a curable polymer component (AB).
  • the curable polymer component is a polymer having a functional functional group.
  • the curing functional group is a functional group that can react with each other to form a three-dimensional network structure, and examples thereof include a functional group that reacts by heating and a functional group that reacts by energy rays.
  • the functional functional group may be added to the unit of the continuous structure that becomes the skeleton of the curable polymer component (AB) or may be added to the terminal. When the functional functional group is added in the unit of the continuous structure that becomes the skeleton of the curable polymer component (AB), the functional functional group may be added to the side chain or directly to the main chain. You may do it.
  • the weight average molecular weight (Mw) of the curable polymer component (AB) is usually 20,000 or more from the viewpoint of achieving the purpose of imparting sheet shape maintainability to the resin film-forming layer.
  • An example of a functional group that reacts by heating is an epoxy group.
  • the curable polymer component (AB) having an epoxy group include a high molecular weight epoxy group-containing compound and a phenoxy resin having an epoxy group.
  • High molecular weight epoxy group-containing compounds are disclosed, for example, in JP-A No. 2001-261789.
  • it is a polymer similar to the above-mentioned acrylic polymer (A1), which is polymerized using a monomer having an epoxy group as a monomer (epoxy group-containing acrylic polymer).
  • the monomer having an epoxy group include (meth) acrylic acid esters having a glycidyl group such as glycidyl (meth) acrylate.
  • an epoxy group-containing acrylic polymer When an epoxy group-containing acrylic polymer is used, its preferred embodiment is the same as that of the acrylic polymer (A1) except for the epoxy group.
  • thermosetting agent (B12) or the curing accelerator (B13) is used as in the case of using an epoxy thermosetting component as the curable component (B). ) May be used in combination.
  • Examples of the functional group that reacts with energy rays include a (meth) acryloyl group.
  • the curable polymer component (AB) having a functional group that reacts with energy rays an acrylate compound having a polymer structure such as polyether acrylate, and the like having a high molecular weight can be used.
  • a polymer prepared by reacting a low molecular compound having a functional group that reacts with the above may be used.
  • the preferred mode of the raw material polymer is the same as that of the acrylic polymer (A1).
  • the photopolymerization initiator (B22) may be used in the same manner as when the energy ray curable component (B2) is used. .
  • the second binder component may contain the above-described polymer component (A) and curable component (B) in combination with the curable polymer component (AB).
  • the resin film forming layer may contain the following components.
  • the inorganic filler resin film forming layer may contain an inorganic filler (C).
  • an inorganic filler (C) By blending the inorganic filler (C) in the resin film forming layer, it becomes possible to adjust the thermal expansion coefficient of the cured resin film, and the optimal thermal expansion coefficient of the cured resin film for the adherend. Therefore, the reliability of the semiconductor device can be improved. It is also possible to reduce the hygroscopicity of the cured resin film.
  • the resin film obtained by curing the resin film-forming layer in the present invention functions as a protective film for an adherend or a chip in which the adherend is separated, a laser marking is applied to the protective film.
  • the inorganic filler (C) is exposed at the portion scraped off by the laser beam, and the reflected light diffuses to exhibit a color close to white. Therefore, when the resin film forming layer contains a colorant (D) described later, there is an effect that a contrast difference is obtained between the laser marking portion and other portions, and the printing becomes clear.
  • Preferred inorganic fillers include powders of silica, alumina, talc, calcium carbonate, titanium oxide, iron oxide, silicon carbide, boron nitride, and the like, beads formed by spheroidizing these, single crystal fibers, glass fibers, and the like.
  • silica filler and alumina filler are preferable.
  • the surface of these inorganic fillers can be modified with a functional group such as an epoxy group or a (meth) acryloyl group.
  • the said inorganic filler (C) can be used individually or in mixture of 2 or more types.
  • the range of the content of the inorganic filler (C) for obtaining the above-mentioned effect more reliably is preferably 1 to 80 parts by mass with respect to 100 parts by mass of the total solid content constituting the resin film forming layer.
  • the amount is preferably 5 to 75 parts by mass, particularly preferably 10 to 70 parts by mass.
  • Colorant (D) can be mix
  • the colorant By blending the colorant, malfunction of the semiconductor device due to infrared rays or the like generated from surrounding devices when the semiconductor device is incorporated into equipment can be prevented.
  • the resin film is engraved by means such as laser marking, there is an effect that marks such as characters and symbols can be easily recognized. That is, in a semiconductor device or semiconductor chip on which a resin film is formed, the product number or the like is usually printed on the surface of the resin film by a laser marking method (a method in which the surface of the protective film is scraped off and printed).
  • a laser marking method a method in which the surface of the protective film is scraped off and printed.
  • colorant organic or inorganic pigments and dyes are used.
  • black pigments are preferable from the viewpoint of electromagnetic wave and infrared shielding properties.
  • the black pigment include carbon black, iron oxide, manganese dioxide, aniline black, activated carbon, and the like, but are not limited thereto. Carbon black is particularly preferable from the viewpoint of increasing the reliability of the semiconductor device.
  • a coloring agent (D) may be used individually by 1 type, and may be used in combination of 2 or more type.
  • the blending amount of the colorant (D) is preferably 0.1 to 35 parts by mass, more preferably 0.5 to 25 parts by mass, particularly preferably 100 parts by mass of the total solid content constituting the resin film forming layer. Is 1 to 15 parts by mass.
  • a bonding agent (E) having a functional group that reacts with an inorganic substance and a functional group that reacts with an organic functional group can be applied to an adherend of a resin film-forming layer, adhesion, and / or resin film. You may use in order to improve the cohesion of. Moreover, the water resistance can be improved by using a coupling agent (E), without impairing the heat resistance of the resin film obtained by hardening
  • Examples of such coupling agents include titanate coupling agents, aluminate coupling agents, silane coupling agents, and the like. Of these, silane coupling agents are preferred.
  • the functional group that reacts with the organic functional group is a group that reacts with the functional group of the polymer component (A), the curable component (B), the curable polymer component (AB), and the like.
  • Some silane coupling agents are preferably used.
  • Such silane coupling agents include ⁇ -glycidoxypropyltrimethoxysilane, ⁇ -glycidoxypropylmethyldiethoxysilane, ⁇ - (3,4-epoxycyclohexyl) ethyltrimethoxysilane, ⁇ - (methacryloxy).
  • the silane coupling agent is usually 0.1 to 20 parts by weight, preferably 0.8 parts per 100 parts by weight in total of the polymer component (A), the curable component (B) and the curable polymer component (AB). 2 to 10 parts by mass, more preferably 0.3 to 5 parts by mass. If the content of the silane coupling agent is less than 0.1 parts by mass, the above effect may not be obtained, and if it exceeds 20 parts by mass, it may cause outgassing.
  • additives may be blended in the general-purpose additive resin film forming layer as necessary.
  • additives include leveling agents, plasticizers, antistatic agents, antioxidants, ion scavengers, gettering agents, chain transfer agents, release agents, and the like.
  • the resin film-forming layer is obtained, for example, using a composition (composition for forming a resin film) obtained by mixing the above-described components at an appropriate ratio.
  • the resin film forming composition may be diluted with a solvent in advance, or may be added to the solvent during mixing. Moreover, you may dilute with a solvent at the time of use of the composition for resin film formation. Examples of such a solvent include ethyl acetate, methyl acetate, diethyl ether, dimethyl ether, acetone, methyl ethyl ketone, acetonitrile, hexane, cyclohexane, toluene, heptane and the like.
  • the resin film-forming layer has initial adhesiveness and curability, and in an uncured state, it is easily bonded by being pressed against the adherend at room temperature or under heating. Moreover, you may heat a resin film formation layer, when pressing. Then, after curing, a resin film having high impact resistance can be provided, the adhesive strength is excellent, and sufficient reliability can be maintained even under severe high temperature and high humidity conditions.
  • the resin film forming layer may have a single layer structure or a multilayer structure.
  • the thickness of the resin film forming layer is preferably 1 to 100 ⁇ m, more preferably 2 to 90 ⁇ m, and particularly preferably 3 to 80 ⁇ m. By setting the thickness of the resin film forming layer within the above range, the resin film forming layer protects the adhesive for bonding the adherend to the substrate or other chips, or the back surface of the adherend. Excellent function as a protective film.
  • the release sheet 13 is laminated on the resin film forming layer 12a side.
  • the release sheet 13 serves as a carrier film when the resin film forming sheet 10 is used, and the film exemplified as the support sheet 11 described above can be used.
  • the surface tension of the surface in contact with the resin film forming layer of the release sheet is preferably 40 mN / m or less, more preferably 37 mN / m or less, and particularly preferably 35 mN / m or less.
  • the lower limit is usually about 25 mN / m.
  • Such a release sheet having a relatively low surface tension can be obtained by appropriately selecting the material, and can also be obtained by applying a release agent to the surface of the release sheet and performing a release treatment. .
  • alkyd, silicone, fluorine, unsaturated polyester, polyolefin, wax, and the like are used as the release agent used for the release treatment.
  • alkyd, silicone, and fluorine release agents are heat resistant. This is preferable.
  • the release agent can be used without any solvent, or can be diluted or emulsified in a solvent to obtain a gravure coater, Mayer bar coater, air knife coater.
  • the release sheet coated with a release coater may be applied at room temperature or under heating, or may be cured with an electron beam to form a release agent layer.
  • the surface tension of the release sheet may be adjusted by laminating films by wet lamination, dry lamination, hot melt lamination, melt extrusion lamination, coextrusion processing, or the like. That is, a film in which the surface tension of at least one surface is in a preferable range as the surface in contact with the resin film forming layer of the release sheet described above is set so that the surface is in contact with the resin film forming layer. It is good also as a peeling sheet by manufacturing the laminated body laminated
  • the thickness of the release sheet is not particularly limited, but is preferably 10 to 200 ⁇ m, more preferably 30 to 150 ⁇ m.
  • the jig adhesive layer As a jig
  • the jig adhesive layer is, for example, an annular shape (ring shape), has a hollow portion (internal opening), and has a size that can be fixed to a jig such as a ring frame.
  • the inner diameter of the ring frame is smaller than the outer diameter of the jig adhesive layer. Further, the inner diameter of the ring frame is slightly larger than the inner diameter of the jig adhesive layer.
  • the ring frame is usually a molded body of metal or plastic.
  • the pressure-sensitive adhesive forming the pressure-sensitive adhesive layer is not particularly limited, but for example, it is made of an acrylic pressure-sensitive adhesive, a rubber pressure-sensitive adhesive, or a silicone pressure-sensitive adhesive. Is preferred.
  • the acrylic polymer (A1) described above is included in consideration of the peel strength of the release sheet, the adhesive strength to the ring frame, and the removability from the ring frame at the outer peripheral portion of the resin film forming sheet.
  • Acrylic adhesive is preferred.
  • the said adhesive may be used independently or may be used in mixture of 2 or more types.
  • the thickness of the pressure-sensitive adhesive layer constituting the jig adhesion layer is preferably 2 to 20 ⁇ m, more preferably 3 to 15 ⁇ m, and further preferably 4 to 10 ⁇ m.
  • the thickness of the pressure-sensitive adhesive layer is less than 2 ⁇ m, sufficient peeling force or adhesive force may not be exhibited.
  • the thickness of the pressure-sensitive adhesive layer exceeds 20 ⁇ m, the peeling force and the pressure-sensitive adhesive force are increased, and the effect of the present invention cannot be exhibited, or a residue of the pressure-sensitive adhesive remains on the ring frame when peeling from the ring frame, May contaminate the ring frame.
  • the pressure-sensitive adhesive forming the pressure-sensitive adhesive layer is the same as the pressure-sensitive adhesive forming the pressure-sensitive adhesive layer in the pressure-sensitive adhesive member composed of the above pressure-sensitive adhesive layer alone. The same applies to the thickness of the pressure-sensitive adhesive layer.
  • the base material constituting the jig adhesive layer is not particularly limited.
  • examples thereof include polyolefin films such as acrylate copolymer films and ionomer resin films, polyvinyl chloride films, and polyethylene terephthalate films.
  • a polyethylene film and a polyvinyl chloride film are preferable, and a polyvinyl chloride film is more preferable.
  • the thickness of the base material constituting the jig adhesion layer is preferably 15 to 200 ⁇ m, more preferably 30 to 150 ⁇ m, and still more preferably 40 to 100 ⁇ m.
  • the double-sided pressure-sensitive adhesive member When a double-sided pressure-sensitive adhesive member having a core material is used as a jig adhesive layer, the double-sided pressure-sensitive adhesive member is formed on the core material, a laminating pressure-sensitive adhesive layer formed on one surface thereof, and the other surface. It consists of an adhesive layer for fixing.
  • the pressure-sensitive adhesive layer for lamination is a pressure-sensitive adhesive layer on the side attached to the support sheet 11.
  • the fixing pressure-sensitive adhesive layer is a pressure-sensitive adhesive layer on the side attached to the release sheet 13 and is used for fixing the jig after the release sheet 13 is removed.
  • the core material of the double-sided pressure-sensitive adhesive member the same material as the base material of the pressure-sensitive adhesive member can be mentioned.
  • polyolefin film and plasticized polyvinyl chloride film are preferred in view of expandability.
  • the thickness of the core material is usually 15 to 200 ⁇ m, preferably 30 to 150 ⁇ m, more preferably 40 to 100 ⁇ m.
  • the double-sided pressure-sensitive adhesive layer and the fixing pressure-sensitive adhesive layer may be the same pressure-sensitive adhesive layer or different pressure-sensitive adhesive layers.
  • the pressure-sensitive adhesive constituting the fixing pressure-sensitive adhesive layer is formed so that the peeling force of the release sheet and the pressure-sensitive adhesive force on the ring frame are within an appropriate range at the outer peripheral portion of the resin film-forming sheet, and
  • the adhesive strength with the ring frame is appropriately selected so as to be smaller than the adhesive strength between the support sheet and the laminating pressure-sensitive adhesive layer.
  • Examples of such pressure-sensitive adhesives include acrylic pressure-sensitive adhesives, rubber-based pressure-sensitive adhesives, and silicone pressure-sensitive adhesives.
  • an acrylic pressure-sensitive adhesive containing the above-mentioned acrylic polymer (A1) is preferable.
  • the pressure-sensitive adhesive forming the fixing pressure-sensitive adhesive layer may be used alone or in combination of two or more.
  • the pressure-sensitive adhesive constituting the lamination pressure-sensitive adhesive layer is not particularly limited, and examples thereof include an acrylic pressure-sensitive adhesive, a rubber rubber pressure-sensitive adhesive and a silicone pressure-sensitive adhesive.
  • an acrylic pressure-sensitive adhesive containing the above-described acrylic polymer (A1) is preferable from the viewpoint of easy control of the adhesive force with the support sheet.
  • stacking may be used independently, or 2 or more types may be mixed and used for it.
  • the thickness of the laminating pressure-sensitive adhesive layer and the fixing pressure-sensitive adhesive layer is the same as the thickness of the pressure-sensitive adhesive layer of the pressure-sensitive adhesive member.
  • the jig adhesive layer By providing the jig adhesive layer, it becomes easy to bond the resin film forming sheet to a jig such as a ring frame.
  • the resin film-forming sheet laminate 100 including the above layers is obtained by removing the release sheet 13 and then applying the resin film-forming layer 12a to the adherend 32. Necessary processing such as dicing is performed. Then, the support film 11 is peeled off while the resin film forming layer 12a remains fixed to the adherend 32. That is, the resin film forming layer 12 a is used in a process including a step of transferring the resin film forming layer 12 a from the support sheet 11 to the adherend 32.
  • the adherend that can be applied in the present invention is not limited to its material.
  • various articles such as semiconductor materials such as semiconductor wafers, glass substrates, ceramic substrates, organic material substrates such as FPC, precision parts and the like, and these The chip
  • the shape of the resin film-forming sheet laminate can be a belt-like shape in which a resin film-forming sheet including a support sheet and a resin film-forming layer is laminated on a long release sheet, which can be rolled up.
  • a resin film forming sheet 10 including a support sheet 11 and a resin film forming layer 12 a cut out in accordance with a desired shape can be peeled on a long release sheet 13 at regular intervals.
  • the form laminated with is preferable.
  • the shape of the resin film-forming sheet laminate can also be a single wafer.
  • a resin film including a support sheet and a resin film forming layer cut out in accordance with a desired shape is laminated on a long release sheet so as to be peeled at regular intervals.
  • the thickness of the sheet laminate for resin film formation becomes nonuniform between the portion where the sheet for application is laminated and the portion where the sheet for resin film formation is not laminated.
  • the thickness becomes non-uniform, the non-uniform winding pressure may occur, and the roll may collapse. Therefore, it is preferable to make the thickness uniform in the sheet laminate for forming a resin film in such a form.
  • the peripheral tape 14 having the same thickness as the resin film forming sheet 10 is bonded.
  • the distance between the resin film-forming sheet 10 and the peripheral tape 14 is preferably about 1 to 20 mm, and particularly preferably about 2 to 10 mm. The peripheral tape 14 makes it easier to avoid the above problems by eliminating the uneven thickness.
  • a resin film-forming sheet laminate in which a resin film-forming sheet cut out in accordance with a desired shape is laminated on a long release sheet so as to be peeled at regular intervals.
  • the method for producing the body will be described by taking the resin film-forming sheet laminate of the first embodiment shown in FIG. 3 as an example.
  • the resin film-forming sheet laminate of the present invention is obtained by such a production method. It is not limited to.
  • a laminate is prepared in which a first release sheet 15 is laminated on an adhesive layer 11b of an adhesive sheet (support sheet 11) composed of a base material 11a and an adhesive layer 11b. Then, as shown in FIG. 5b, the first release sheet 15 is half-cut into a desired shape.
  • first long release sheet 15 a long adhesive sheet (hereinafter sometimes referred to as “long adhesive sheet 11”) and a long first release sheet 15 (hereinafter “first long release sheet 15”). Is prepared.) Is prepared. In addition, the 1st elongate peeling sheet 15 is laminated
  • the first long release sheet 15 is completely cut into a desired shape, and the long adhesive sheet 11 is die-cut (half cut) so as not to be cut completely.
  • Die cutting is performed by a general-purpose apparatus (rotary blade or flat blade) and method such as die cutting.
  • the cutting depth at this time is not particularly limited as long as the first long release sheet 15 can be cut completely.
  • a cut portion D1 having a cut depth d1 is formed. The cut depth d1 of the cut portion D1 formed in this way and the effect thereof are as described above.
  • first laminated body a laminated body in which openings 15c having a desired shape are formed.
  • the first laminate is a laminate of the remaining portion 15 a of the first long release sheet 15 and the long adhesive sheet 11.
  • a laminate having the resin film forming layer 12 on a long release sheet 16 (hereinafter sometimes referred to as a “resin film forming layer transfer sheet 16”) is prepared.
  • the resin film forming layer 12 previously formed into a film shape may be laminated on the resin film forming layer transfer sheet 16, and the resin for forming the resin film forming layer 12 may be used.
  • the film forming composition may be applied to the resin film forming layer transfer sheet 16 and dried.
  • the resin film forming layer 12 of the laminate including the resin film forming layer transfer sheet 16 and the resin film forming layer 12 is attached to the opening 15c side of the first laminate. Through this step, a part of the resin film forming layer 12 is fitted into the opening 15c.
  • the resin film forming layer 12 is cleaved into a shape fitted into the opening 15c. Then, the resin film forming layer 12 a having a desired shape remains on the pressure-sensitive adhesive layer 11 b of the long pressure-sensitive adhesive sheet 11.
  • the laminate of the resin film forming layer transfer sheet 16 Since the laminate of the resin film forming layer transfer sheet 16, the remaining portion 12b of the resin film forming layer 12 and the remaining portion 15a of the first long release sheet 15 is continuous in the longitudinal direction, the removal of the laminate
  • a laminate in which the resin film forming layer 12a having a desired shape is aligned on the adhesive layer 11b of the long adhesive sheet 11 is obtained.
  • a long second release sheet 13 (hereinafter referred to as “second long release sheet 13”) may be described on the surface of the laminate having the resin film forming layer 12a. .) Is pasted to obtain a laminate (hereinafter sometimes referred to as “second laminate”) having a resin film-forming layer 12a between the second long release sheet 13 and the long adhesive sheet 11. . And the long adhesive sheet 11 of a 2nd laminated body is die-cut from the long adhesive sheet 11 side to the desired shape of the magnitude
  • the die is cut so that the center point of the resin film forming layer 12a coincides with the center point of the long adhesive sheet 11 after die cutting.
  • the cutting depth in this case will not be specifically limited if the long adhesive sheet 11 can be cut completely.
  • a cut portion D2 having a cut depth d2 is formed as shown in FIGS. 3 and 5g. The cut depth d2 of the cut portion D2 formed in this way and the effect thereof are as described above.
  • the resin film forming sheet 10 according to the present invention in which the resin film forming sheet 10 including the resin film forming layer 12 a having a desired shape and the adhesive sheet (support sheet 11) is laminated on the second long release sheet 13. A sheet laminate 100 is obtained.
  • the long pressure-sensitive adhesive sheet when performing the die cutting of the long pressure-sensitive adhesive sheet, the long pressure-sensitive adhesive sheet is cut into a desired shape, and a small gap is provided from the pressure-sensitive adhesive sheet outside the long pressure-sensitive adhesive sheet 11 having the shape. 2 It is preferable to perform die cutting so that the adhesive sheet as the peripheral tape 14 remains along both edges 17 in the short direction of the long release sheet 13. Thereafter, the adhesive sheet 11 and the peripheral tape 14 having a desired shape are left on the second long release sheet 13 and the remaining adhesive sheet is removed, whereby the resin including the adhesive sheet 11 and the resin film forming layer 12a.
  • seat 10 for film formation and the peripheral tape 14 were continuously bonded on the elongate peeling sheet 13 is obtained.
  • the resin film forming sheet laminate of the first embodiment shown in FIGS. 2 and 3 is applied to the semiconductor device manufacturing method. This will be described as an example.
  • a resin film forming layer of a resin film forming sheet laminate is attached to an adherend, and the adherend is diced into a chip, on any surface of the chip. It is preferable to include a step of fixing and remaining the resin film forming layer and peeling it from the support sheet, and placing the chip on the substrate or another chip via the resin film forming layer.
  • the resin film forming layer is an adhesive film between the chip and the substrate or another chip.
  • the formation of a circuit on the wafer surface can be performed by various methods including conventionally used methods such as an etching method and a lift-off method.
  • the opposite surface (back surface) of the circuit surface of the wafer is ground.
  • the grinding method is not particularly limited, and grinding may be performed by a known means using a grinder or the like.
  • an adhesive sheet called a surface protection sheet is attached to the circuit surface in order to protect the circuit on the surface.
  • the circuit surface side (that is, the surface protection sheet side) of the wafer is fixed by a chuck table or the like, and the back surface side on which no circuit is formed is ground by a grinder.
  • the thickness of the wafer after grinding is not particularly limited, but is usually about 50 to 500 ⁇ m.
  • the crushed layer generated during back grinding is removed.
  • the crushed layer is removed by chemical etching, plasma etching, or the like.
  • the resin film forming layer of the resin film forming sheet laminate is pasted on the back surface of the wafer.
  • the attaching method is not particularly limited.
  • the resin film forming layer is attached to the semiconductor wafer in the steps shown in FIGS. 1a to 1d.
  • FIGS. 1a to 1d are a series of process diagrams for performing an operation of attaching the resin film forming sheet 10 to a semiconductor wafer as an adherend 32.
  • FIG. 1a in the resin film-forming sheet laminate 100, the release sheet 13 serves as a carrier film, and is supported by two rolls 62 and 66 and a peel plate 64, while one end of the sheet laminate 100 is circular.
  • the first roll 42 is formed while being connected to the columnar core 44
  • the second roll 52 is formed by being wound with the other end connected to the columnar core 54.
  • a core driving motor (not shown) for rotating the core 54 is connected to the core 54 of the second roll 52, and the resin film forming sheet 10 is peeled off.
  • the release sheet 13 is wound at a predetermined speed.
  • the core 54 of the second roll 52 rotates, and the resin film is formed from the resin film forming sheet laminate 100 wound around the core 44 of the first roll 42.
  • the forming sheet 10 is pulled out of the first roll 42.
  • the drawn resin film forming sheet 10 is guided onto a disk-shaped semiconductor wafer 32 disposed on a movable stage and a ring frame 34 disposed so as to surround the semiconductor wafer 32.
  • the resin film forming sheet 10 is peeled from the release sheet 13.
  • a peel plate 64 may be applied from the release sheet 13 side of the resin film forming sheet 10.
  • the release sheet 13 is bent toward the peel plate 64 from the cut portion D2, and the release sheet 13 and the resin film forming sheet are formed.
  • the separation starting point can be easily created between 10 and 10.
  • air may be blown to the boundary surface between the release sheet 13 and the resin film forming sheet 10 so that the release start point is more efficiently created. As a result, the feeding of the resin film forming sheet 10 is further facilitated.
  • the resin film forming sheet 10 is attached so that the resin film forming sheet 10 is in close contact with the ring frame 34 and the semiconductor wafer 32. At this time, the resin film forming sheet 10 is pressed against the semiconductor wafer 32 by the roll 68. Then, as shown in FIG. 1d, the attachment of the resin film forming sheet 10 onto the semiconductor wafer 32 is completed, and a semiconductor wafer with a resin film forming sheet is obtained.
  • the resin film forming sheet 10 can be attached to the semiconductor wafer 32 continuously in an automated process.
  • An example of an apparatus for performing the operation of attaching the resin film forming sheet 10 to the semiconductor wafer 32 is RAD-2500 (trade name) manufactured by Lintec Corporation.
  • the resin film forming sheet 10 is attached to the semiconductor wafer 32 by such a process, the resin film forming sheet 10 is separated from the release sheet 13 by using the resin film forming sheet laminate 100 according to the present invention. Can be extended easily.
  • the resin film forming layer When the resin film forming layer does not have tackiness at room temperature, it may be heated appropriately (although it is not limited, 40 to 80 ° C. is preferable).
  • the resin film forming layer When the resin film forming layer is blended with the energy ray reactive compound (B21) or the curable polymer component (AB) having a functional group that reacts with energy rays, the resin film forming layer has a support sheet side.
  • the resin film forming layer may be preliminarily cured by irradiating with an energy beam, increasing the cohesive force of the resin film forming layer, and decreasing the adhesive force between the resin film forming layer and the support sheet.
  • the cutting depth at this time is a depth that takes into account the sum of the thickness of the semiconductor wafer and the thickness of the resin film forming layer and the amount of wear of the dicing saw.
  • Laser light can also be used as the cutting means.
  • the energy beam irradiation may be performed at any stage after the semiconductor wafer is pasted and before the semiconductor chip is peeled off (pickup). For example, the irradiation may be performed after dicing or after the following expanding step. Although it is good, it is preferably performed after the semiconductor wafer is attached and before dicing. Further, the energy beam irradiation may be performed in a plurality of times.
  • the resin film forming sheet is expanded, the interval between the semiconductor chips is expanded, and the semiconductor chips can be picked up more easily. At this time, a deviation occurs between the resin film forming layer and the support sheet, the adhesive force between the resin film forming layer and the support sheet is reduced, and the pick-up property of the semiconductor chip is improved. When the semiconductor chip is picked up in this manner, the cut resin film forming layer can be adhered to the back surface of the semiconductor chip and peeled off from the support sheet.
  • a so-called tip dicing method can be used as a method for obtaining a semiconductor chip by cutting a semiconductor wafer. Specifically, a groove having a depth of cut shallower than the wafer thickness is formed from the surface of the semiconductor wafer on which the circuit is formed, and the resin of the sheet laminate for resin film formation according to the present invention is formed on the circuit forming surface. A film forming sheet is attached as a surface protective sheet. Thereafter, by grinding the back surface of the semiconductor wafer, the thickness of the wafer is reduced, and finally, the wafer is divided into individual chips.
  • a method for cutting the resin film forming layer into a chip size is not particularly limited, and for example, a laser dicing method can be applied.
  • the semiconductor chip is placed on the substrate or the surface of another semiconductor chip (lower chip) via the resin film forming layer (hereinafter, the substrate on which the chip is mounted or the lower chip surface is referred to as “chip mounting portion”). ).
  • the pressure when mounting is usually 1 kPa to 200 MPa.
  • the chip mounting portion may be heated before mounting the semiconductor chip or heated immediately after mounting.
  • the heating temperature is usually 80 to 200 ° C., preferably 100 to 180 ° C.
  • the heating time is usually 0.1 seconds to 5 minutes, preferably 0.5 seconds to 3 minutes.
  • the heating conditions at this time are in the above heating temperature range, and the heating time is usually 1 to 180 minutes, preferably 10 to 120 minutes.
  • the resin film forming layer may be cured by using a heat in resin sealing that is normally performed in package manufacturing, without temporarily performing the heat treatment after placement.
  • the resin film formation layer hardens
  • the second method for manufacturing a semiconductor device includes attaching a resin film forming layer of a resin film forming sheet to the back surface of a semiconductor wafer having a circuit formed on the front surface, and then attaching a semiconductor chip having the resin film on the back surface. It is preferable to obtain.
  • the resin film is a protective film for a semiconductor chip.
  • the second method for manufacturing a semiconductor device preferably further includes the following steps (1) to (3), wherein the steps (1) to (3) are performed in an arbitrary order. Step (1): The resin film forming layer is cured to obtain a resin film. Step (2): peeling the resin film forming layer or resin film and the support sheet, Step (3): dicing the semiconductor wafer and the resin film forming layer or resin film.
  • the resin film forming layer of the resin film forming sheet is attached to the back surface of the semiconductor wafer. This step is the same as the attaching step in the first method for manufacturing a semiconductor device.
  • steps (1) to (3) are performed in an arbitrary order.
  • the steps (1) to (3) are performed in the order of the steps (2), (1), (3), the steps (1), (2), (3), the steps (1), (3), It is performed in the order of (2), the order of steps (3), (1), (2), or the order of steps (3), (2), (1). Details of this process are described in detail in JP-A-2002-280329. As an example, a case where the steps (2), (1), and (3) are performed in this order will be described.
  • a resin film forming layer of a resin film forming sheet is attached to the back surface of a semiconductor wafer having a circuit formed on the front surface.
  • the support sheet is peeled from the resin film forming layer to obtain a laminate of the semiconductor wafer and the resin film forming layer.
  • the resin film forming layer is cured to form a resin film on the entire surface of the wafer.
  • the resin film forming layer contains an epoxy compound (B11) or a curable polymer component (AB) having an epoxy group
  • the resin film forming layer is cured by thermal curing.
  • the resin film forming layer is blended with the energy ray reactive compound (B21) or the curable polymer component (AB) having a functional group that reacts with energy rays
  • the resin film forming layer is cured with energy. It can be performed by irradiation with a beam.
  • the curable polymer component (AB) which has an epoxy compound (B11) and an epoxy group and the curable polymer component (AB) which has a functional group which reacts with an energy ray reactive compound (B21) or an energy ray.
  • curing by heating and energy beam irradiation may be performed simultaneously or sequentially.
  • Examples of the energy rays to be irradiated include ultraviolet rays (UV) and electron beams (EB), and preferably ultraviolet rays are used.
  • UV ultraviolet rays
  • EB electron beams
  • UV ultraviolet rays
  • a resin film made of a cured resin is formed on the back surface of the wafer, and the strength is improved as compared with the case of the wafer alone, so that damage during handling of the thinned wafer can be reduced.
  • the thickness of the resin film is excellent.
  • the laminated body of the semiconductor wafer and the resin film is diced for each circuit formed on the wafer surface. Dicing is performed so as to cut both the wafer and the resin film.
  • the wafer is diced by a conventional method using a dicing sheet. As a result, a semiconductor chip having a resin film on the back surface is obtained.
  • Laser printing can be performed on the resin film.
  • Laser printing is performed by a laser marking method, and the surface of the protective film is scraped off by laser light irradiation to mark a product number or the like on the protective film.
  • Laser printing can also be performed before the resin film forming layer is cured.
  • a semiconductor chip having a resin film on the back surface can be obtained.
  • the semiconductor device can be manufactured by mounting the semiconductor chip on a predetermined base by the face-down method.
  • a semiconductor device can be manufactured by bonding a semiconductor chip having a resin film on the back surface to another member (on a chip mounting portion) such as a substrate or another semiconductor chip. According to such a method for manufacturing a semiconductor device using a resin film forming sheet laminate according to the present invention, a highly uniform resin film can be easily formed on the back surface of a chip. Later cracks are less likely to occur.
  • the resin film formation sheet serves as a dicing sheet.
  • the semiconductor wafer is bonded to the inner peripheral portion of the resin film forming sheet via the resin film forming layer, and the outer peripheral portion of the resin film forming sheet is bonded to another jig such as a ring frame, A resin film forming sheet affixed to the semiconductor wafer is fixed to the apparatus, and dicing is performed.
  • a semiconductor chip having a resin film forming layer on the back surface is mounted on a predetermined chip mounting portion by a face-down method, and then package manufacturing is performed.
  • the resin film forming layer can also be cured using heating in resin sealing that is usually performed.
  • Resin Film Forming Composition The following components were blended in the amounts shown in Table 1 to prepare Resin Film Forming Compositions 1-5.
  • Acrylic polymer acrylic polymer comprising 95 parts by mass of methyl acrylate and 5 parts by mass of 2-hydroxyethyl acrylate (weight average molecular weight: 1,200,000, glass transition temperature: 8 ° C., manufactured by Toyochem)
  • Non-acrylic resin polyester resin (Byron 220 manufactured by Toyobo Co., Ltd.)
  • C-1) Inorganic filler Silica filler (manufactured by Admatechs SC2050-MA, particle size: 500 nm)
  • C-2) Inorganic filler Silica filler (Ya050C-MJA manufactured by Admatechs)
  • E-1 Coupling agent Silane coupling agent (KBM403 manufactured by Shin-Etsu Chemical Co., Ltd.)
  • E-2) Coupling agent Silane coupling agent (KBE403 manufactured by Shin-Etsu Chemical Co., Ltd.)
  • E-4) Coupling agent Silane coupling agent (MKC silicate MSEP2 manufactured by Mitsubishi Chemical Corporation)
  • Crosslinking agent Aromatic polyvalent isocyanate compound (Coronate L manufactured by Nippon Polyurethane Industry Co., Ltd.)
  • Example 1 The obtained methyl ethyl ketone solution (solid content concentration: 61% by weight) of the resin film-forming composition 1 was applied onto the release-treated surface of the release-treated resin film-forming layer transfer sheet (SPPET 381031 manufactured by Lintec Corporation) and dried ( Drying conditions: 100 ° C. for 1 minute in an oven, and a resin film forming layer having a thickness of 7 ⁇ m was formed on the resin film forming layer transfer sheet.
  • SPPET 381031 manufactured by Lintec Corporation
  • an adhesive sheet (D-175, manufactured by Lintec, adhesive layer thickness: 10 ⁇ m, substrate thickness: 80 ⁇ m) was prepared as a support sheet, and a first release sheet (SPPET 381031, thickness: 38 ⁇ m) was prepared on the adhesive layer. It laminated
  • a peeling adhesive tape was applied to the release sheet side of the laminate, and then the peeling adhesive tape was removed. Thereby, the circular 1st peeling sheet with a diameter of 330 mm was removed, the remaining part of the 1st peeling sheet was laminated
  • the resin film forming layer of the laminate of the resin film forming layer transfer sheet obtained above and the resin film forming layer is pasted on the opening side of the first laminate, and the resin film forming layer is fitted into the opening.
  • a second release sheet (SPPET 381031, thickness: 38 ⁇ m) is attached to the surface of the adhesive sheet having the resin film forming layer, and the second laminate having the resin film forming layer between the second release sheet and the adhesive sheet.
  • Examples 2 to 5 A resin film-forming sheet laminate was obtained in the same manner as in Example 1 except that the resin film-forming compositions 2 to 5 were used instead of the resin film-forming composition 1 used in Example 1. . It was confirmed that the release sheets of the resin film-forming sheet laminates of Examples 2 to 5 did not have cut portions along the outer periphery of the resin film-forming layer from the surface on the resin film-forming layer side.
  • Resin film forming sheet laminate 10 Resin film forming sheet 11: Support sheet 12 (12a): Resin film forming layer 13: Release sheet (second release sheet) D1: Cut part D2: Cut part

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  • Organic Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Laminated Bodies (AREA)
  • Adhesive Tapes (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
PCT/JP2015/084790 2014-12-19 2015-12-11 樹脂膜形成用シート積層体 WO2016098697A1 (ja)

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JP2021082767A (ja) * 2019-11-21 2021-05-27 リンテック株式会社 キット、及び、そのキットを用いる第三積層体の製造方法
JP2021082768A (ja) * 2019-11-21 2021-05-27 リンテック株式会社 キット、及び、そのキットを用いる第三積層体の製造方法
TWI754103B (zh) * 2017-09-29 2022-02-01 日商長瀨化成股份有限公司 安裝結構體之製造方法及使用於其之積層片材
JP2022077742A (ja) * 2020-11-12 2022-05-24 リンテック株式会社 積層体製造方法および積層体製造装置
JP7475923B2 (ja) 2020-03-27 2024-04-30 リンテック株式会社 半導体装置製造用シート及び半導体装置製造用シートの製造方法。

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JP2009130320A (ja) * 2007-11-28 2009-06-11 Furukawa Electric Co Ltd:The チップ保護用フィルム
WO2014054781A1 (ja) * 2012-10-05 2014-04-10 リンテック株式会社 保護膜形成層付ダイシングシートおよびチップの製造方法
WO2014157426A1 (ja) * 2013-03-27 2014-10-02 リンテック株式会社 保護膜形成用複合シート

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JP2009130320A (ja) * 2007-11-28 2009-06-11 Furukawa Electric Co Ltd:The チップ保護用フィルム
WO2014054781A1 (ja) * 2012-10-05 2014-04-10 リンテック株式会社 保護膜形成層付ダイシングシートおよびチップの製造方法
WO2014157426A1 (ja) * 2013-03-27 2014-10-02 リンテック株式会社 保護膜形成用複合シート

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI754103B (zh) * 2017-09-29 2022-02-01 日商長瀨化成股份有限公司 安裝結構體之製造方法及使用於其之積層片材
US11799442B2 (en) 2017-09-29 2023-10-24 Nagase Chemtex Corporation Manufacturing method of mounting structure, and laminate sheet therefor
JP2021082767A (ja) * 2019-11-21 2021-05-27 リンテック株式会社 キット、及び、そのキットを用いる第三積層体の製造方法
JP2021082768A (ja) * 2019-11-21 2021-05-27 リンテック株式会社 キット、及び、そのキットを用いる第三積層体の製造方法
JP7475923B2 (ja) 2020-03-27 2024-04-30 リンテック株式会社 半導体装置製造用シート及び半導体装置製造用シートの製造方法。
JP2022077742A (ja) * 2020-11-12 2022-05-24 リンテック株式会社 積層体製造方法および積層体製造装置

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JPWO2016098697A1 (ja) 2017-09-28

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