JP6574787B2 - 樹脂膜形成用シート積層体 - Google Patents

樹脂膜形成用シート積層体 Download PDF

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Publication number
JP6574787B2
JP6574787B2 JP2016564827A JP2016564827A JP6574787B2 JP 6574787 B2 JP6574787 B2 JP 6574787B2 JP 2016564827 A JP2016564827 A JP 2016564827A JP 2016564827 A JP2016564827 A JP 2016564827A JP 6574787 B2 JP6574787 B2 JP 6574787B2
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JP
Japan
Prior art keywords
resin film
sheet
film forming
forming layer
layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
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JP2016564827A
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English (en)
Japanese (ja)
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JPWO2016098697A1 (ja
Inventor
啓示 布施
啓示 布施
泰紀 柄澤
泰紀 柄澤
雄太 佐川
雄太 佐川
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Lintec Corp
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Lintec Corp
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Publication date
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Publication of JPWO2016098697A1 publication Critical patent/JPWO2016098697A1/ja
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Publication of JP6574787B2 publication Critical patent/JP6574787B2/ja
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J201/00—Adhesives based on unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping

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  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Laminated Bodies (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Adhesive Tapes (AREA)
JP2016564827A 2014-12-19 2015-12-11 樹脂膜形成用シート積層体 Active JP6574787B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2014257128 2014-12-19
JP2014257128 2014-12-19
PCT/JP2015/084790 WO2016098697A1 (ja) 2014-12-19 2015-12-11 樹脂膜形成用シート積層体

Publications (2)

Publication Number Publication Date
JPWO2016098697A1 JPWO2016098697A1 (ja) 2017-09-28
JP6574787B2 true JP6574787B2 (ja) 2019-09-11

Family

ID=56126587

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2016564827A Active JP6574787B2 (ja) 2014-12-19 2015-12-11 樹脂膜形成用シート積層体

Country Status (4)

Country Link
JP (1) JP6574787B2 (zh)
SG (1) SG11201705001TA (zh)
TW (1) TWI667733B (zh)
WO (1) WO2016098697A1 (zh)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11799442B2 (en) 2017-09-29 2023-10-24 Nagase Chemtex Corporation Manufacturing method of mounting structure, and laminate sheet therefor
JP7540884B2 (ja) * 2019-11-21 2024-08-27 リンテック株式会社 キット、及び、そのキットを用いる第三積層体の製造方法
JP7540885B2 (ja) * 2019-11-21 2024-08-27 リンテック株式会社 キット、及び、そのキットを用いる第三積層体の製造方法
JP7475923B2 (ja) * 2020-03-27 2024-04-30 リンテック株式会社 半導体装置製造用シート及び半導体装置製造用シートの製造方法。
JP6827144B1 (ja) * 2020-11-12 2021-02-10 リンテック株式会社 積層体製造方法および積層体製造装置

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009130320A (ja) * 2007-11-28 2009-06-11 Furukawa Electric Co Ltd:The チップ保護用フィルム
CN104685609B (zh) * 2012-10-05 2018-06-08 琳得科株式会社 带有保护膜形成层的切片及芯片的制造方法
WO2014157426A1 (ja) * 2013-03-27 2014-10-02 リンテック株式会社 保護膜形成用複合シート

Also Published As

Publication number Publication date
TW201635422A (zh) 2016-10-01
WO2016098697A1 (ja) 2016-06-23
TWI667733B (zh) 2019-08-01
JPWO2016098697A1 (ja) 2017-09-28
SG11201705001TA (en) 2017-07-28

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