SG11201705001TA - Sheet laminate for forming resin film - Google Patents
Sheet laminate for forming resin filmInfo
- Publication number
- SG11201705001TA SG11201705001TA SG11201705001TA SG11201705001TA SG11201705001TA SG 11201705001T A SG11201705001T A SG 11201705001TA SG 11201705001T A SG11201705001T A SG 11201705001TA SG 11201705001T A SG11201705001T A SG 11201705001TA SG 11201705001T A SG11201705001T A SG 11201705001TA
- Authority
- SG
- Singapore
- Prior art keywords
- resin film
- forming resin
- sheet laminate
- laminate
- sheet
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B38/00—Ancillary operations in connection with laminating processes
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J201/00—Adhesives based on unspecified macromolecular compounds
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
Landscapes
- Engineering & Computer Science (AREA)
- Organic Chemistry (AREA)
- Chemical & Material Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Laminated Bodies (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Adhesive Tapes (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014257128 | 2014-12-19 | ||
| PCT/JP2015/084790 WO2016098697A1 (ja) | 2014-12-19 | 2015-12-11 | 樹脂膜形成用シート積層体 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| SG11201705001TA true SG11201705001TA (en) | 2017-07-28 |
Family
ID=56126587
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SG11201705001TA SG11201705001TA (en) | 2014-12-19 | 2015-12-11 | Sheet laminate for forming resin film |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP6574787B2 (zh) |
| SG (1) | SG11201705001TA (zh) |
| TW (1) | TWI667733B (zh) |
| WO (1) | WO2016098697A1 (zh) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR102522785B1 (ko) * | 2017-09-29 | 2023-04-18 | 나가세케무텍쿠스가부시키가이샤 | 실장 구조체의 제조 방법 및 이것에 이용되는 적층 시트 |
| JP7540885B2 (ja) * | 2019-11-21 | 2024-08-27 | リンテック株式会社 | キット、及び、そのキットを用いる第三積層体の製造方法 |
| JP7540884B2 (ja) * | 2019-11-21 | 2024-08-27 | リンテック株式会社 | キット、及び、そのキットを用いる第三積層体の製造方法 |
| JP7475923B2 (ja) * | 2020-03-27 | 2024-04-30 | リンテック株式会社 | 半導体装置製造用シート及び半導体装置製造用シートの製造方法。 |
| JP6827144B1 (ja) * | 2020-11-12 | 2021-02-10 | リンテック株式会社 | 積層体製造方法および積層体製造装置 |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009130320A (ja) * | 2007-11-28 | 2009-06-11 | Furukawa Electric Co Ltd:The | チップ保護用フィルム |
| KR102103169B1 (ko) * | 2012-10-05 | 2020-04-22 | 린텍 가부시키가이샤 | 보호막 형성층이 형성된 다이싱 시트 및 칩의 제조 방법 |
| JP5774799B2 (ja) * | 2013-03-27 | 2015-09-09 | リンテック株式会社 | 保護膜形成用複合シート |
-
2015
- 2015-12-11 SG SG11201705001TA patent/SG11201705001TA/en unknown
- 2015-12-11 JP JP2016564827A patent/JP6574787B2/ja active Active
- 2015-12-11 WO PCT/JP2015/084790 patent/WO2016098697A1/ja active Application Filing
- 2015-12-16 TW TW104142222A patent/TWI667733B/zh active
Also Published As
| Publication number | Publication date |
|---|---|
| TW201635422A (zh) | 2016-10-01 |
| WO2016098697A1 (ja) | 2016-06-23 |
| JP6574787B2 (ja) | 2019-09-11 |
| TWI667733B (zh) | 2019-08-01 |
| JPWO2016098697A1 (ja) | 2017-09-28 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| SG11201704894WA (en) | Adhesive sheet | |
| SG11201602049TA (en) | Composite sheet for resin film formation | |
| SG11201610591XA (en) | Adhesive sheet for cooling | |
| SG11201609543VA (en) | Composite sheet for forming protective film | |
| PT3119603T (pt) | Película de embalagem | |
| EP3208087A4 (en) | Synthetic resin laminated sheet | |
| PL3129695T3 (pl) | Polimerowa folia wielowarstwowa | |
| EP3095807A4 (en) | Stampable sheet | |
| EP3221137A4 (en) | Multi-layered textured printing | |
| PL3165360T3 (pl) | Laminat | |
| SG11201700740QA (en) | Adhesive film | |
| HK1223962A1 (zh) | 粘合片 | |
| EP3122558A4 (en) | Film | |
| SG11201709978PA (en) | Composite sheet for forming protective film | |
| EP3078681A4 (en) | Non-stretched polypropylene-based film | |
| SG11201701507QA (en) | Inorganic multilayer lamination transfer films | |
| EP3117990A4 (en) | Composite multi-layer sheet | |
| SG11201508893YA (en) | Laminate | |
| SG11201803250TA (en) | First protective film forming sheet | |
| GB201412153D0 (en) | Polyester film | |
| SG11201705001TA (en) | Sheet laminate for forming resin film | |
| PL3463876T3 (pl) | Folia wielowarstwowa | |
| SG11201704075PA (en) | Sheet for forming resin film and composite sheet for forming resin film | |
| EP3385190A4 (en) | Laminated resin film | |
| SG11201610344QA (en) | Resin sheet for sealing |