WO2016093098A1 - Dispositif et procédé de formation d'un jet de gouttelettes - Google Patents

Dispositif et procédé de formation d'un jet de gouttelettes Download PDF

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Publication number
WO2016093098A1
WO2016093098A1 PCT/JP2015/083618 JP2015083618W WO2016093098A1 WO 2016093098 A1 WO2016093098 A1 WO 2016093098A1 JP 2015083618 W JP2015083618 W JP 2015083618W WO 2016093098 A1 WO2016093098 A1 WO 2016093098A1
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WIPO (PCT)
Prior art keywords
flow
water vapor
flow path
gas
injection port
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Application number
PCT/JP2015/083618
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English (en)
Japanese (ja)
Inventor
恭太 森平
映子 関
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アクアサイエンス株式会社
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Publication of WO2016093098A1 publication Critical patent/WO2016093098A1/fr

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/02—Cleaning by the force of jets or sprays
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting

Definitions

  • the present invention relates to a technique that can be used in the field of cleaning a predetermined part or a predetermined surface of an object and can realize a high cleaning ability.
  • Patent Document 1 proposes a method of processing an object using water or water vapor instead of a drug or the like.
  • it is an object processing apparatus for performing processing including any of peeling / cleaning / processing on an object having a processing target surface, and pressurizes pure water to a predetermined value downstream.
  • a pressurized water supply unit that supplies water, a water vapor supply unit that generates pure water by heating pure water and supplies the water downstream, and a pure water from the pressurized water supply unit and water vapor from the water vapor supply unit are mixed and ejected to the target processing surface
  • an object processing apparatus including a nozzle unit.
  • the present invention has been made in view of the above circumstances, and an object thereof is to provide an apparatus having a high cleaning ability without damaging an object.
  • the droplet jet flow generation device of the present invention is configured to condense water vapor and form a droplet jet flow through mixing of a water vapor stream and a gas stream. It is characterized by that.
  • the present invention is as follows.
  • the present invention is a droplet jet generation device, A flow path capable of fluid communication; Water vapor supply means for supplying a flow of water vapor into the flow path; Gas supply means for supplying a gas flow into the flow path; With In the flow path, there is a collision mixing unit that mixes the air currents by causing the gas air currents to collide with each other from a direction different from the direction of the water vapor airflow,
  • the apparatus is configured such that the droplet jet flow can be formed by condensing the water vapor through collision mixing of the airflows in the flow path.
  • the present invention also provides: A droplet jet generation device, A first flow path having a first injection port capable of fluid conduction; A second flow path having a second injection port capable of fluid conduction; Water vapor supply means for supplying a flow of water vapor into the first flow path; Gas supply means for supplying a gas flow into the second flow path; With The first injection port and the second injection port are separately arranged in a state in which the first injection port side and the first injection port side are inward, respectively. Through the collision mixing of the airflows ejected outside the first flow path and the second flow path through the first ejection port and the second ejection port, the water vapor is condensed and the droplet ejection flow is generated.
  • a device characterized in that it can be formed.
  • the condensation adjustment means which can adjust the temperature, pressure, and flow volume of each said airflow. Further, it may be used for generating a droplet jet flow having an average particle size (D50) of droplets of 20 ⁇ m or less.
  • the present invention is a droplet jet generation method, A water vapor supply step for supplying a flow of water vapor into the flow path; A gas supply step for supplying a gas flow into the flow path; In the flow path, the water vapor is condensed by colliding the gas flow from a direction different from the direction of the water vapor flow to collide the gas flow from the direction different from the direction of the water vapor flow.
  • the present invention is a droplet jet generation method, A water vapor supply step of supplying a flow of water vapor into the first flow path having the first injection port; A gas supply step of supplying a gas flow into the second flow path having the second injection port; The first injection port and the second injection port are separately arranged in a state in which the first injection port side and the first injection port side are inward, respectively.
  • the gas may be one or more selected from air, nitrogen, oxygen, carbon dioxide, chlorine, fluorine, ammonia, and a rare gas.
  • the average particle diameter (D50) of the droplets may be 20 ⁇ m or less.
  • FIG. 1 is an overall configuration diagram of a droplet jet generation device in the present embodiment. It is the figure (photograph) which showed the mode of injection of water vapor
  • FIG. 3 is a diagram (photograph) showing a measurement result of a droplet diameter in Example 1. It is the figure (photograph) which showed the washing
  • FIG. 3 is a diagram (photograph) showing a measurement result of a droplet diameter in Example 1. It is the figure (photograph) which showed the washing
  • FIG. 1 It is an enlarged view (photograph) of the washing
  • the two-phase fluid in the production process used in the present invention may be a fluid containing water vapor and gas as a fluid for cleaning the object.
  • the form using the two-phase fluid of gas and water vapor is illustrated below.
  • the cleaning device 1 is configured to include a water vapor generation unit 2, a water vapor fluid adjustment unit 3, a water vapor condensation adjustment unit 4, and a droplet ejection unit 5.
  • a water vapor generation unit 2 a water vapor fluid adjustment unit 3
  • a water vapor condensation adjustment unit 4 a water vapor condensation adjustment unit 4
  • a droplet ejection unit 5 a droplet ejection unit 5.
  • the water vapor generation unit 2 supplies water and heats it, a water heating unit 21 that heats the water, a saturated water vapor storage unit 22 that stores water vapor generated by heating the water heating unit 21 to a predetermined temperature D1 ° C. or higher, and saturated water vapor And a flow path (for example, a pipe) 23 for supplying.
  • Water is used as ion-exchanged water, pure water, or ultrapure water for applications where the contamination of minute foreign objects or metal ions on the target object is a concern, such as in the cleaning process of semiconductor device manufacturing. It refers to characteristic water, and uses that do not care about contamination such as minute foreign matter or metal ions on the object include even lower grade tap water.
  • the object is not particularly limited.
  • an electronic component for example, an electronic component, a semiconductor substrate, an LED substrate, a solar cell substrate, a printed substrate, a glass substrate, a lens, a disk member, a precision machined member, a molded resin member, or a human body (for example, , Hands, feet, head, face, skin).
  • the steam fluid adjusting unit 3 generates, for example, superheated steam by heating (for example, 200 ° C.) the saturated steam supplied from the steam generating unit 2.
  • the superheated steam is limited to a temperature of 100 ° C. or lower when saturated steam is released to atmospheric pressure, but the range of temperature control is limited. This is because it can be used.
  • the water vapor condensation adjusting unit 4 sets and adjusts the temperature of the dried gas (for example, air) (for example, heating by a heater, cooling by a chiller), and supplies a gas (air) air flow, , A flow meter 42 for measuring and adjusting the gas flow rate, a pressure gauge 43 for measuring and adjusting the pressure of superheated steam, and a flow path (for example, a pipe) 44.
  • the steam condensing adjustment unit 4 mixes (mixes) the superheated steam air stream supplied from the steam fluid adjusting unit 3 and the gas (for example, air) air stream in the mixing unit 45 in the flow path 44, thereby superheated steam. Is condensed. Droplets can be formed when some of the superheated steam is condensed.
  • the gas is not particularly limited, and may be one or more selected from air, nitrogen, oxygen, carbon dioxide, chlorine, fluorine, ammonia, and a rare gas.
  • the droplet is not particularly limited, and may be, for example, a pure water droplet not containing impurities, a water droplet containing an active ingredient such as a chemical solution or a chemical solution.
  • the droplet ejecting unit 5 is an ejecting nozzle that is movable in the front-rear and left-right directions for ejecting droplets onto an object.
  • the nozzle is, for example, an ultra-high speed nozzle.
  • the ultra-high speed nozzle is not particularly limited as long as it is a nozzle capable of accelerating droplets at a speed higher than the sound speed.
  • FIG. 2 shows the cleaning apparatus 1 of FIG. 1 in which a part of superheated steam is condensed through mixing (mixed flow) of superheated steam and gas (hereinafter referred to as air) ejected from the droplet ejecting section 5. It is the figure (photograph) which showed the mode of ejection of the droplet formed.
  • FIG. 2 (a) is a diagram (photograph) showing the state of injection when only superheated steam supplied from the steam fluid adjusting unit 3 is used.
  • FIGS. 2B to 2D show the case where air (airflow) is mixed (mixed flow) from a small amount to a large amount with respect to the superheated steam (airflow) supplied from the steam fluid adjusting unit 3. It is the figure (photograph) which showed the mode of injection of.
  • FIG. 2B shows a state of injection when 100 L / min of air (airflow) is mixed (mixed flow) with superheated steam (airflow) supplied from the steam fluid adjusting unit 3. It is the figure (photograph) which showed.
  • FIG. 2B shows a state of injection when 100 L / min of air (airflow) is mixed (mixed flow) with superheated steam (airflow) supplied from the steam fluid adjusting unit 3. It is the figure (photograph) which showed.
  • FIG. 2B shows a state of injection when 100 L / min of air (
  • FIG. 2 (c) is a view showing a state of injection when 150 L / min air (airflow) is mixed (mixed flow) with superheated steam (airflow) supplied from the steam fluid adjusting unit 3.
  • FIG. 2 (d) is a diagram showing an injection state when 300 L / min of air (airflow) is mixed (mixed flow) with superheated steam (airflow) supplied from the steam fluid adjusting unit 3.
  • the pressure applied to the superheated steam is 0.05 MPa.
  • FIG. 2A air is not mixed (mixed) from the steam condensation adjusting unit 4 with the superheated steam supplied from the steam fluid adjusting unit 3, that is, in the case of only superheated steam, injection is performed. It can be seen that the color produced is colorless.
  • FIG. 2B when 100 L / min of air (airflow) is mixed (mixed flow) with superheated steam (airflow) supplied from the steam fluid adjusting unit 3.
  • the color of the jet is colorless and transparent.
  • FIG. 2 (c) when 150 L / min of air (airflow) is mixed (mixed flow) with superheated steam (airflow) supplied from the steam fluid adjusting unit 3, It can be seen that the color of the jet is slightly white.
  • FIG. 2D when the superheated steam (airflow) supplied from the steam fluid adjusting unit 3 is mixed (mixed) with 300 L / min air (airflow), It can be understood that the color of white is slightly darker in white.
  • the superheated steam is cooled by mixing (mixing) air (the airflow) with the superheated steam (the airflow), and the superheated steam is condensed and changed into droplets. That is, it is conceivable that the droplet diameter is decreased and the number of droplets is increased by mixing (mixed flow) air (current flow) with superheated water vapor (current flow).
  • the droplet diameter to be ejected is 5 ⁇ m or less.
  • FIG. 3 is an overall configuration diagram of the cleaning apparatus 100 in the comparative example (prior art) in the present embodiment.
  • the cleaning apparatus 100 includes a water vapor generation unit 200, a valve 300, a pressure gauge 400, a water supply unit 500, and a fluid ejection unit 600.
  • a water vapor generation unit 200 includes a water vapor generation unit 200, a valve 300, a pressure gauge 400, a water supply unit 500, and a fluid ejection unit 600.
  • the steam generation unit 200 supplies water and heats the water heating unit 201, the saturated steam storage unit 202 that stores the steam generated by heating the water heating unit 201 to a predetermined temperature D1 or higher, and saturated steam And a supply pipe 203.
  • the steam flow adjusting unit 300 generates, for example, superheated steam by heating (for example, 200 ° C.) the saturated steam supplied from the steam generating unit 200.
  • the pressure gauge 400 has a function of measuring and adjusting the pressure of saturated water vapor.
  • the water supply unit 500 measures a flow rate of water, a water generation unit 501 that generates water, a water supply pipe 502 that supplies water, a water opening and closing valve 503 that controls stop and restart of water supply, and Water flow meter 504.
  • the fluid ejection unit 600 is an ejection nozzle that is movable in the front-rear and left-right directions for ejecting a fluid onto an object.
  • the nozzle is the same as that of the droplet ejecting section 5 of FIG.
  • FIG. 4 is a diagram (photograph) showing a state of jetting of fluid in which superheated steam and water jetted from the fluid jet unit 600 are mixed in the cleaning apparatus 100 of FIG.
  • FIG. 2B when the amount of air is set to 100 L / min and FIG. 4 when the amount of water is set to 100 L / min
  • FIG. 4 when the amount of water is set to 100 L / min
  • FIG. 2B shows that the color of the jet is pure white in FIG. 4 (this is because the droplet diameter included in the jet in FIG. 4 is larger than that in FIG. 2B). Show that ⁇ . That is, in FIG. 2B, the superheated steam is cooled by mixing (mixing) air (the airflow) with the superheated steam (the airflow), and the superheated steam is condensed and changed into droplets. I can understand the situation.
  • the droplet diameter is reduced and the number of droplets is increased.
  • the droplet diameter ejected is 5 ⁇ m or less.
  • the droplets generated by pulverizing the mixed water are dominant, and the liquid generated by the condensation of superheated steam is dominant. Drops are ignored. For this reason, the diameter of the droplets contained during the ejection is not reduced (more than about 10 ⁇ m), and the variation is increased.
  • FIG. 5 shows Example 1 (in which droplets obtained by mixing “air” with superheated steam are jetted onto a substrate) and Comparative Example 1 (conventional technology, where “water” is mixed with superheated steam
  • FIG. 6 is a diagram (photograph) showing wiring damage (cleaning result) in a case where the fluid is sprayed onto the substrate.
  • the distance between the nozzle and the object was 30 nm, and the scanning speed of the nozzle was 100 mm / sec, and the test conditions shown in Table 1 were used.
  • the wiring material on the substrate is amorphous silicon
  • the wiring width is 37 nm
  • the wiring height is 100 nm
  • the space width is 500 nm
  • the measurement principle of this apparatus is a fluid image measurement method that simultaneously analyzes velocity and direction from a flow field image visualized by particles by a particle image velocimetry (abbreviation of Particle Image Velocimetry).
  • the laser beam source for visualization is irradiated to the tracer particles mixed in the flow field, and the position of the particles in the two-dimensional section of the flow field cut out by the light sheet is photographed with a camera. Record.
  • This device is a measurement system that uses pulsed light as a backlight and uses high-resolution imaging. ⁇ Test conditions> Table 1
  • FIG. 5A shows a state before processing.
  • FIG. 5 (b) shows the result after the superheated steam temperature is 200 ° C., the superheated steam pressure is 0.05 MPa, and the supply amount of “air” is 150 L / min. (See (b)).
  • FIG.5 (c) is a result after injecting the temperature of superheated steam at 200 degreeC, the pressure of superheated steam at 0.05 MPa, and the supply amount of "water” at 100 mL / min. reference).
  • FIG. 6A is an image recorded by recording a particle position in a two-dimensional section with a camera.
  • the white spots in the image are droplets.
  • One pixel of the image has a droplet diameter of 1 ⁇ m (0.001 mm), and a size of about 2 ⁇ m (0.002 mm) is the measurement limit.
  • FIG. 6B shows the result of summing up the sizes of the white spots in FIG. It can be understood from the result of the aggregation that the distribution ranges from a size of 5 ⁇ m (0.005 mm) or less to about 2 ⁇ m (0.002), but measurement of 2 ⁇ m (0.002 mm) or less is not possible. I understand that. Actually, it is considered that most of the liquid droplets (water droplets) (for example, 0.1 ⁇ m to 2.0 ⁇ m) are 2 ⁇ m (0.002 mm) or less.
  • Example 1 it can be understood that the wiring on the substrate is not damaged as in FIG. 5A before processing. This can be attributed to the fact that the droplet diameter is fine (for example, 0.1 ⁇ m to 2.0 ⁇ m). It was also confirmed that the substrate had a cleaning effect.
  • FIG. 5C which is Comparative Example 1, it can be seen that the substrate is white.
  • the whitened portion is a portion where the pattern is damaged by the droplet, in other words, a lot of damage is given to the wiring. This is because the droplet diameter is 10 ⁇ m or more and 20 ⁇ m or less, and relatively large droplet diameters vary.
  • Example 2 As Example 2, an object was a human body, and a test was performed on how dirt on the human body can be removed. Specifically, an eye shadow was applied to a human hand (skin), and a test was conducted to determine how much the eye shadow can be removed. Table 2 shows the test conditions. FIG. 7 shows the results obtained under the test conditions shown in Table 2. Comparative Example 2 is a conventional technique in which a fluid obtained by mixing (mixing) water with superheated steam is jetted onto a substrate.
  • FIG. 7A is a photograph showing a state before processing.
  • FIG. 7 (b) shows the result after three injections with the temperature of the superheated steam being 200 ° C., the pressure of the superheated steam being 0.01 MPa, the supply amount of air being 150 L / min, and the injection time being 5 seconds / 1 time. It is.
  • FIG.7 (c) is a result after injecting 6 times by making injection time into 5 second / 1 time with respect to FIG.7 (b).
  • FIG. 7 (b) can remove the eye shadow (dirt) as compared with FIG. 7 (a) before processing. it can.
  • FIG. 7C it can be understood that the eye shadow (dirt) can be further removed than in FIG. 7B.
  • injection temperature it was 43 degreeC as body temperature. That is, human hands can safely remove eye shadow (dirt) without burning.
  • Comparative Example 2 in Table 2 it can be understood that the injection temperature is 60 ° C. or higher and cannot be used for the human body.
  • FIG. 8 is a photograph of the state of FIG. 7 magnified 200 times with a microscope.
  • FIG. 8A is an enlarged photograph before processing, in which an eye shadow (dirt) is attached.
  • FIG. 8B shows the result after three injections with an injection time of 5 seconds / 1 time, compared to FIG. 8A before the process.
  • FIG.8 (c) is a result after injecting 6 times by making injection time into 5 second / 1 time with respect to FIG.8 (b).
  • FIG. 8 (d) shows the result after injecting 6 times with an injection time of 5 seconds / 1 time and further injecting once with an injection time of 10 seconds / 1 time, compared to FIG. 8 (c).
  • FIG. 8 (e) shows the result after injecting 6 times with an injection time of 5 seconds / once and further injecting twice with an injection time of 10 seconds / once, compared to FIG. 8 (d).
  • FIGS. 8 (a) to 8 (e) As shown in FIGS. 8 (a) to 8 (e), as shown in FIG. 8 (b), as shown in FIG. It can be understood that the eye shadow (dirt) can be removed cleanly just by spraying. Further, it can be clearly understood that the removal effect is remarkable when the injection is continued while changing the conditions as shown in order in FIGS. 8C to 8E.
  • the water vapor condensation adjusting unit 4 includes a flow path of superheated water vapor supplied from the water vapor fluid adjusting unit 3 and gas (for example, air) supplied from the gas supply unit 41.
  • gas for example, air
  • the mixing is described in the mixing unit 45 in the inside, as shown in FIG. 9, the flow of superheated steam injected from the outside of the flow path 44, that is, from the injection unit 46, and the gas supply unit 41.
  • the gas (for example, air) supplied from the air may be mixed (mixed) by the mixing unit 45 outside the flow path 44.
  • FIG. 10 shows an example of superheated steam through mixing (mixed flow) of superheated water vapor jetted from the jetting unit 46 and gas (for example, air) supplied from the gas supply unit 41 in the cleaning device 1 of FIG. It is the figure (photograph) which showed the mode of the ejection of the droplet formed by condensing a part. It has been confirmed that the result (effect) similar to that of the configuration of FIG. 1 can be obtained by the configuration of FIG.
  • a droplet jet flow can be formed by condensing a part of water vapor (for example, superheated water vapor) by mixing (mixing) gas (for example, air) with water vapor (for example, superheated water vapor). .
  • the water vapor for example, superheated water vapor
  • the air flow of water vapor for example, superheated water vapor
  • the gas for example, air
  • the water vapor for example, superheated water vapor
  • the liquid (water) originally does not necessarily be dispersed small as in the prior art it is possible to generate droplets from a state without any liquid. Therefore, since it is possible to increase from a fine droplet diameter to a desired droplet diameter, it is possible to easily control the droplet diameter. In other words, there is an effect that the cleaning ability can be easily adjusted.
  • the present invention can be applied to the generation of a droplet jet flow having an average particle size (D50) of droplets of 20 ⁇ m (more preferably 5 ⁇ m) or less.
  • the droplet diameter is fine, it is considered that an excellent penetrating action is exerted on the skin. For this reason, not only the scalp and skin dirt are removed, but also, for example, it is possible to improve the dryness, lack of firmness and roughness of the skin as a facial device, and lead to moisturized beautiful skin.
  • the present invention can be applied to a wide range of objects from materials to the human body.
  • semiconductor devices liquid crystals, magnetic heads, disks, printed circuit boards, camera lenses, etc., unnecessary waste removal, cleaning, polishing, etc., and application to the human body, such as scalp cortex removal, skin dirt removal,
  • the present invention can also be used for nail polish and the like.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning By Liquid Or Steam (AREA)
  • Cleaning Or Drying Semiconductors (AREA)

Abstract

[Problème] L'invention a pour objet de réaliser un dispositif et un procédé donnant des gouttelettes plus fines qu'auparavant et présentant de ce fait une aptitude élevée au nettoyage sans endommager un objet à nettoyer. [Solution] Le dispositif selon l'invention est configuré de telle façon qu'un flux de vapeur d'eau soit mélangé à un flux d'un gaz à l'intérieur ou à l'intérieur d'un conduit, afin de condenser ainsi la vapeur d'eau pour former un jet de gouttelettes.
PCT/JP2015/083618 2014-12-12 2015-11-30 Dispositif et procédé de formation d'un jet de gouttelettes WO2016093098A1 (fr)

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JP2014252209A JP5757003B1 (ja) 2014-12-12 2014-12-12 液滴噴射流生成装置及び液滴噴射流生成方法

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JP2017006233A (ja) * 2015-06-18 2017-01-12 アクアサイエンス株式会社 皮膚用水分印加装置及び皮膚用水分印加方法
JP6698396B2 (ja) 2016-03-25 2020-05-27 株式会社Ｓｃｒｅｅｎホールディングス 基板処理方法および基板処理装置
JP2019024944A (ja) * 2017-07-28 2019-02-21 株式会社メイコー 洗浄装置

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04348871A (ja) * 1991-05-27 1992-12-03 Mitsubishi Heavy Ind Ltd 微細氷粒を用いる洗浄方法
WO2009013797A1 (fr) * 2007-07-20 2009-01-29 Aqua Science Corporation Procédé de traitement de pièce de travail et système pour le traitement d'une pièce de travail
JP2014050771A (ja) * 2012-09-05 2014-03-20 Denso Corp 洗浄方法、およびこれに用いる洗浄装置
JP2014069100A (ja) * 2012-09-27 2014-04-21 Furusho Electric Industry Co Ltd 急冷ノズルを有する洗浄装置

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04348871A (ja) * 1991-05-27 1992-12-03 Mitsubishi Heavy Ind Ltd 微細氷粒を用いる洗浄方法
WO2009013797A1 (fr) * 2007-07-20 2009-01-29 Aqua Science Corporation Procédé de traitement de pièce de travail et système pour le traitement d'une pièce de travail
JP2014050771A (ja) * 2012-09-05 2014-03-20 Denso Corp 洗浄方法、およびこれに用いる洗浄装置
JP2014069100A (ja) * 2012-09-27 2014-04-21 Furusho Electric Industry Co Ltd 急冷ノズルを有する洗浄装置

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