WO2016086855A2 - 一种电子终端 - Google Patents
一种电子终端 Download PDFInfo
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- WO2016086855A2 WO2016086855A2 PCT/CN2015/096186 CN2015096186W WO2016086855A2 WO 2016086855 A2 WO2016086855 A2 WO 2016086855A2 CN 2015096186 W CN2015096186 W CN 2015096186W WO 2016086855 A2 WO2016086855 A2 WO 2016086855A2
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- WIPO (PCT)
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- heat dissipation
- air inlet
- housing
- bottom plate
- chamber
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
Definitions
- the present invention relates to the field of electronic device technologies, and in particular, to an electronic terminal.
- the heat dissipation performance of the electronic terminal is an important factor considered by the user when selecting the product.
- the size of the electronic terminal in the miniaturized terminal device is small, and specifically includes a housing, a circuit board mounted in the housing, a heat dissipation block mounted on the circuit board, a fan mounted on the heat dissipation block to blow the heat dissipation block, and a heat dissipation block
- the air is provided with a groove, and the wind blown by the fan to the heat sink is blown along the groove after passing through the groove of the heat block.
- the invention provides an electronic terminal capable of preventing hot air radiated from the heat dissipation block from entering the air inlet of the fan again, thereby improving the heat dissipation efficiency of the electronic terminal.
- an electronic terminal includes a housing and a circuit board mounted in the housing, a heat dissipation block mounted on the circuit board, and a heat dissipation fan mounted on the heat dissipation block, the heat dissipation block having a heat dissipation block a groove for the flow of gas; further comprising a wind deflector; wherein:
- the wind deflector is mounted in the housing and sealingly cooperates with the outer casing of the heat dissipation fan and the inner wall of the housing to partition the inner space of the housing into a cold air inlet chamber and a heat dissipation chamber;
- the heat dissipation block is located in the heat dissipation chamber;
- the air inlet of the heat dissipation fan is in communication with the cold air inlet chamber, and the air outlet is in communication with the heat dissipation chamber;
- the housing is provided with an air inlet hole communicating with the cold air inlet chamber and an air outlet hole communicating with the heat dissipation chamber, and the air inlet hole is disposed at a bottom side of the housing, The air outlet hole is disposed on a top side of the housing.
- the housing includes a barrel, a bottom plate, and a top plate, the wind shield is sealingly engaged with the barrel and the bottom plate, and the circuit board is The axial center line of the cylinder is disposed in parallel within the cylinder.
- the air inlet hole is:
- the air inlet hole is a plurality of through holes provided on the bottom plate and communicating with the cold air inlet chamber
- the bottom plate has a mesh plate structure at a portion opposite to the cold air inlet chamber, and the mesh hole on the bottom plate having the mesh plate structure forms the through hole.
- the air outlet hole is:
- the top plate is provided with a plurality of through holes communicating with the heat dissipation chamber;
- a through-air gap formed between the top plate and the cylindrical body and communicating with the heat dissipation chamber.
- the air baffle includes:
- Two vertical windshields extending along the axial direction of the cylinder and located on both sides of the cooling fan;
- a first cross wind deflector extending in a direction perpendicular to the axial direction of the cylinder and located on a side of the heat dissipation fan toward the top plate;
- a second cross wind deflector extending in a direction perpendicular to the axial direction of the cylinder and located on a side of the heat dissipation fan facing the bottom plate.
- the bottom plate is provided with a screw column protruding toward the top plate, and the inner wall of the cylinder is extended along the axial direction of the cylinder body. Reinforcement; where:
- Each of the vertical windshields is a rib provided on an outer circumferential surface of the screw column;
- the first cross wind deflector is provided with a sliding slot that is slidingly sealed with the reinforcing rib of the cylinder; the first transverse wind deflecting plate is riveted with the cylindrical body; and the first transverse wind deflecting plate faces the side of the top plate And a pressing surface of the reinforcing rib facing the bottom plate; the one side of the first horizontal wind deflecting plate facing the bottom plate is opposite to the supporting surface of the screw column facing the top plate;
- the second cross wind deflector is disposed on the bottom plate.
- the dissipating groove of the heat dissipating block has a cross structure.
- the wind deflector divides the space inside the casing into a heat dissipation chamber and a cold air inlet chamber, and the air inlet of the heat dissipation fan communicates with the cold air inlet chamber, so the heat dissipation disposed in the electronic terminal
- the cold air enters the cold air inlet chamber from the air inlet hole on the bottom side of the housing, and the cooling fan blows the cold air from the cold air into the air chamber to the heat dissipation block to dissipate the heat dissipation block; since the heat dissipation block is located in the heat dissipation chamber
- the cold air blown by the cooling fan exchanges heat with the heat sink block to become hot air, and the hot air is blown out from the air outlet hole provided on the top side of the casing and communicating with the heat dissipation chamber.
- the hot air in the heat dissipation chamber cannot enter the cold air inlet chamber, and the cold air entering the air chamber from the cold air enters from the bottom side of the housing.
- the air hole enters, and the hot air in the heat dissipation chamber blows out the housing from the air outlet hole at the top of the housing. Therefore, the hot air rises after blowing out the housing, so the hot air blown from the heat dissipation chamber cannot be from the bottom side of the housing.
- the air inlet hole is installed into the cold air inlet chamber. Therefore, the air blown to the heat sink by the heat dissipation fan is cold air, thereby improving the heat dissipation efficiency of the electronic terminal.
- FIG. 1 is a schematic diagram of a heat dissipation principle of an electronic terminal provided by the present invention
- FIG. 2 is a schematic diagram of a mating structure between a wind deflector, a heat dissipation fan, and a housing in an electronic terminal according to an embodiment of the present invention
- FIG. 3 is a schematic diagram of a cooperation structure between a heat dissipation fan, a heat dissipation block, and a circuit board in an electronic terminal according to an embodiment of the present invention
- FIG. 4 is a schematic view showing the working principle of heat dissipation in the structure of the electronic terminal shown in FIG. 2;
- FIG. 5 is a schematic structural diagram of an air inlet hole in an electronic terminal according to an embodiment of the present invention.
- FIG. 6 is a schematic diagram of a windshield installation structure in an electronic terminal according to an embodiment of the present invention.
- FIG. 1 is a schematic diagram of a heat dissipation principle of an electronic terminal according to the present invention
- FIG. 3 is a schematic diagram of a matching structure between a wind deflector and a heat dissipating fan and a casing in an electronic terminal according to an embodiment of the present invention
- FIG. 3 is a schematic diagram of a heat dissipating fan, a heat dissipating block, and a circuit board in an electronic terminal according to an embodiment of the present invention; Schematic diagram of the cooperation between the two.
- an electronic terminal includes: a housing, a circuit board 7 mounted in the housing, a heat dissipation block 6 mounted on the circuit board 7, and heat dissipation mounted on the heat dissipation block 6. a fan 4 having a heat dissipating block 6 having a dividing groove 61 for guiding a gas; the electronic terminal further comprising a wind deflector 5, as shown in FIGS. 2 and 3;
- the wind deflector 5 is mounted in the housing and is in sealing engagement with the outer casing of the heat dissipation fan 4 and the inner wall of the housing to divide the inner space of the housing into a cold air inlet chamber and a heat dissipation chamber; the circuit board 7 and the heat dissipation block 6 are located in the heat dissipation chamber.
- the air inlet of the cooling fan 4 is in communication with the cold air inlet chamber, and the air outlet is connected to the heat dissipation chamber;
- the housing is provided with an air inlet hole 21 communicating with the cold air inlet chamber and an air outlet hole 13 communicating with the heat dissipation chamber.
- the air inlet hole 21 is disposed at the bottom side of the housing, and the air outlet hole 13 is disposed at the housing.
- the top side is shown in Figures 1 and 2.
- the wind deflector 5 divides the space inside the casing into a heat dissipation chamber and a cold air inlet chamber, and the air inlet of the heat dissipation fan 4 communicates with the cold air inlet chamber, and therefore, the cooling fan 4 provided in the electronic terminal operates.
- the cold air enters the cold air inlet chamber from the air inlet hole 21 on the bottom side of the casing, and the cooling fan 4 blows the cold air entering the air chamber into the heat dissipation block 6 .
- the heat dissipating block 6 is dissipated; since the heat dissipating block 6 is located in the heat dissipating cavity, the cold air blown by the cooling fan 4 exchanges heat with the heat dissipating block 6 to become hot air, and the hot air is disposed on the top side of the casing and is cooled.
- the air outlet hole 13 communicating with the chamber blows out the casing. Since the heat dissipation chamber and the cold air inlet chamber are separated by the wind shield 5, the hot air in the heat dissipation chamber cannot enter the cold air inlet chamber, and the cold air entering the air chamber from the cold air is from the bottom side of the housing.
- the air inlet 21 enters, and the hot air in the heat dissipation chamber blows out the housing from the air outlet 13 at the top of the housing. Therefore, the hot air rises after blowing out the housing, so the hot air blown from the heat dissipation chamber cannot be self-shelled.
- the air inlet hole 21 provided on the bottom side of the body enters the cold air inlet chamber. Therefore, the air blown to the heat sink block 6 by the heat dissipation fan 4 is cold air, thereby improving the heat dissipation efficiency of the electronic terminal.
- the housing comprises a cylinder 1, a bottom plate 2 and a top plate 3.
- the wind shield 5 is sealingly engaged with the cylinder 1 and the bottom plate 2, and the axis line of the circuit board 7 and the cylinder 1
- the cylinders 1 are disposed in parallel.
- the above-described housing structure facilitates assembly of a circuit board, a windshield, and the like.
- the air inlet holes 21 provided on the bottom side of the housing can be arranged in various ways:
- the air inlet hole 21 may be a plurality of through holes provided in the bottom plate 2 to communicate with the cold air inlet chamber, as shown in FIG. 2, FIG. 4 and FIG.
- the air inlet hole 21 can also be a through-air gap formed between the bottom plate 2 and the cylinder 1 (not shown) Out).
- the bottom plate 2 has a mesh plate structure at a portion opposite to the cold air inlet chamber.
- the mesh holes on the bottom plate 2 having the stencil structure form through holes.
- the bottom plate having the stencil structure can improve the fluency of the cold air entering the cold air inlet chamber, and reduce the obstruction of the bottom plate 2 to the cold air.
- the air outlet 13 can also be arranged in various ways:
- the air outlet hole 13 may be a plurality of through holes provided in the top plate 3 to communicate with the heat dissipation chamber.
- the air outlet hole 13 may also be a through-air gap formed between the top plate 3 and the cylindrical body 1 and communicating with the heat dissipation chamber.
- the windshield 5 includes:
- a first transverse wind deflector 51 extending perpendicular to the axial direction of the cylinder 1 and located on the side of the cooling fan 4 toward the top plate 3;
- the second cross wind deflector 53 extends in a direction perpendicular to the axis of the cylinder 1 and is located on the side of the heat sink fan 4 facing the bottom plate 2.
- the wind deflector 5 of the above structure can reduce the space occupied by the cold air inlet chamber in the casing, and improve the utilization ratio of the space inside the casing.
- the bottom plate 2 is provided with a screw column protruding toward the top plate 3, as shown in FIG. 6.
- the screw post 22 and the screw post 23 are shown, and the inner wall of the cylinder 1 is provided with reinforcing ribs 11 extending along the axial direction of the cylinder 1;
- Each vertical windshield is a rib provided on the outer peripheral surface of a screw column.
- the vertical wind deflector 52 is a rib plate provided on the outer peripheral surface of the screw post 22, and the vertical wind deflector 54 is provided.
- the ribs are provided on the outer peripheral surface of the screw column 23; each vertical windshield and the screw column have an integral structure, and each screw post is fixed on the bottom plate 2, thereby realizing the connection between the two wind deflectors and the bottom plate 2. ;
- the first cross wind deflector 51 is provided with a sliding slot which is slidingly sealed with the reinforcing rib 11 in the cylinder body 1; the first cross wind deflecting plate 51 is riveted to the cylinder body 1, as shown in FIG.
- a cross wind deflector 51 is riveted to the tubular body 1 by a hot-melt method, and the first cross wind deflector 51 faces the top surface 3 and the pressing surface of the reinforcing rib 11 facing the bottom plate 2 is offset.
- One side of the cross wind deflector 51 facing the bottom plate 2 is abutted against the screw post 22 and the support surface of the screw post 23 facing the top plate 3 (not shown); the first cross wind deflector 51 can pass through the tubular body 1 and Bottom plate
- the structure on 2 achieves positioning;
- the second cross wind deflector 53 is disposed on the bottom plate 2.
- the second cross wind deflector 53 may have an integral structure with the bottom plate 2.
- the outer edge of the cross section of the cylinder 1 is circular, square, or diamond-shaped and the like. shape.
- the cooling groove 6 has a cross-shaped groove 61 which can be a cross-shaped structure, so that the air blown into the heat-dissipating block 6 by the heat-dissipating fan 4 can be blown out from the periphery of the heat-dissipating block 6 so that the hot air can be timely
- the air is blown out from the heat sink block 6 to improve the heat dissipation efficiency of the electronic terminal.
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Abstract
本发明涉及电子设备技术领域，公开一种电子终端，包括壳体和安装于壳体内的电路板、散热块以及散热风扇；还包括挡风板；挡风板安装于壳体内以将壳体内空间分隔为冷风入风腔室和散热腔室；电路板以及散热块位于散热腔室内；散热风扇的入风口与冷风入风腔室连通，出风口与散热腔室连通；壳体上设有入风孔和出风孔，入风孔设置于壳体的底侧，出风孔设置于壳体的顶侧。上述电子终端中，冷风入风腔室内的冷空气自壳体底侧的入风孔进入，散热腔室内的热空气自壳体顶部的出风孔吹出壳体，散热腔室吹出的热空气无法自壳体底侧设置的入风孔进入冷风入风腔室内，因此，散热风扇吹向散热块的空气为冷空气，进而提高了电子终端的散热效率。
Description
本申请要求于2014年12月03日提交中国专利局、申请号为201410729759.3、发明名称为“一种电子终端”的中国专利申请的优先权，其全部内容通过引用结合在本申请中。
本发明涉及电子设备技术领域，特别涉及一种电子终端。
在电子设备技术领域，小型化的终端设备中，电子终端的散热性能是用户选择产品时考虑的一个重要因素。
由于小型化终端设备中电子终端的尺寸较小，具体包括壳体、安装于壳体内的电路板、安装于电路板上的散热块、安装于散热块以向散热块吹风的风扇；散热块上设有剖沟，风扇吹向散热块的风在经过散热块的剖沟后沿剖沟吹出。
但是，现有技术中，电子终端内没有设计风道，自散热块的剖沟吹出的热风大部分会直接进入风扇的进风口，从而再次吹向散热块，降低了散热块的散热效率，从而导致电子终端的散热效率较低。
发明内容
本发明提供了一种电子终端，该电子终端能够防止散热块散出的热空气再次进入到风扇的进风口，进而能够提高电子终端的散热效率。
第一方面，提供一种电子终端，包括壳体和安装于壳体内的电路板、安装于所述电路板上的散热块以及安装于散热块上的散热风扇，所述散热块具有用于导流气体的剖沟；还包括挡风板；其中：
所述挡风板安装于所述壳体内、且与所述散热风扇的外壳以及所述壳体内壁密封配合以将所述壳体内空间分隔为冷风入风腔室和散热腔室；所述电路板以及所述散热块位于所述散热腔室内；所述散热风扇的入风口与所述冷风入风腔室连通，出风口与所述散热腔室连通；
所述壳体上设有与所述冷风入风腔室连通的入风孔和与所述散热腔室连通的出风孔，所述入风孔设置于所述壳体的底侧，所述出风孔设置于所述壳体的顶侧。
结合上述第一方面，在第一种可能的实现方式中，壳体包括筒体、底板和顶板，所述挡风板与所述筒体以及所述底板密封配合，所述电路板与所述筒体的轴心线平行地设置于所述筒体内。
结合上述第一种可能的实现方式，在第二种可能的实现方式中，所述入风孔为：
所述底板上设有的多个与所述冷风入风腔室连通的通孔；或者，
所述底板与所述筒体之间形成的透风间隙。
结合上述第一种可能的实现方式，在第三种可能的实现方式中，当所述入风孔为所述底板上设有的多个与所述冷风入风腔室连通的通孔时，所述底板与所述冷风入风腔室相对的部位具有网板结构，具有网板结构的底板上的网孔形成所述通孔。
结合上述第一种可能的实现方式，在第四种可能的实现方式中，所述出风孔为：
所述顶板设有的多个与所述散热腔室连通的通孔；或者，
所述顶板与所述筒体之间形成的与散热腔室连通的透风间隙。
结合上述第一种可能的实现方式，在第五种可能的实现方式中，所述挡风板包括：
沿筒体轴心线方向延伸、且位于所述散热风扇两侧的两个竖挡风板；
沿垂直于所述筒体轴心线方向延伸、且位于所述散热风扇朝向顶板一侧的第一横挡风板；
沿垂直于所述筒体轴心线方向延伸、且位于所述散热风扇朝向底板一侧的第二横挡风板。
结合上述第五种可能的实现方式，在第六种可能的实现方式中，所述底板上设有向顶板方向凸起的螺丝柱，所述筒体内壁设有沿筒体轴心线方向延伸的加强筋；其中：
每一个所述竖挡风板为一个所述螺丝柱外周面上设置的筋板；
所述第一横挡风板设有与所述筒体内加强筋滑动密封的滑槽；所述第一横挡风板与所述筒体铆接；所述第一横挡风板朝向顶板的一面与所述加强筋设有的朝向所述底板的压面相抵；所述第一横挡风板朝向底板的一面与所述螺丝柱设有的朝向所述顶板的支撑面相抵；
所述第二横挡风板设置于所述底板。
结合上述第一方面、第一方面的第一种可能的实现方式、第二种可能的实现方式、第三种可能的实现方式、第四种可能的实现方式、第五种可能的实现方式、第六种可能的实现方式，在第七种可能的实现方式中，沿垂直于所述筒体轴心线方向，所述筒体的横截面外边缘的形状为圆形、方形、或菱形。
结合上述第一方面、第一方面的第一种可能的实现方式、第二种可能的实现方式、第三种可能的实现方式、第四种可能的实现方式、第五种可能的实现方式、第六种可能的实现方式，在第八种可能的实现方式中，所述散热块的剖沟具有十字型结构。
上述第一方面提供的电子终端中，挡风板将壳体内空间分割为散热腔室和冷风入风腔室，散热风扇的入风口与冷风入风腔室连通，因此，在电子终端设置的散热风扇工作时，冷空气自壳体底侧的入风孔进入冷风入风腔室内，散热风扇将冷风入风腔室内的冷空气吹向散热块对散热块进行散热；由于散热块位于散热腔室内，散热风扇吹入的冷空气与散热块进行热交换后变为热空气，热空气自设置于壳体顶侧、且与散热腔室连通的出风孔吹出壳体。由于散热腔室与冷风入风腔室之间通过挡风板隔离，散热腔室内的热空气无法进入到冷风入风腔室内，并且，冷风入风腔室内的冷空气自壳体底侧的入风孔进入，而散热腔室内的热空气自壳体顶部的出风孔吹出壳体，因此，热空气在吹出壳体后向上升，所以，散热腔室吹出的热空气无法自壳体底侧设置的入风孔进入冷风入风腔室内，因此，散热风扇吹向散热块的空气为冷空气，进而提高了电子终端的散热效率。
图1为本发明提供的电子终端的散热原理示意图；
图2为本发明一种实施例提供的电子终端中挡风板与散热风扇以及壳体之间的配合结构示意图；
图3为本发明一种实施例提供的电子终端中散热风扇与散热块以及电路板之间的配合结构示意图；
图4为图2所示电子终端结构中散热时工作原理示意图；
图5为本发明一种实施例提供的电子终端中入风孔的一种结构示意图；
图6为本发明一种实施例提供的电子终端中挡风板安装结构示意图。
下面将结合本发明实施例中的附图，对本发明实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅仅是本发明一部分实施例，而不是全部的实施例。基于本发明中的实施例，本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例，都属于本发明保护的范围。
请参考图1、图2和图3，图1为本发明提供的电子终端的散热原理示意图；图2
为本发明一种实施例提供的电子终端中挡风板与散热风扇以及壳体之间的配合结构示意图；图3为本发明一种实施例提供的电子终端中散热风扇与散热块以及电路板之间的配合结构示意图。
如图1-图3所示，本发明实施例提供的电子终端包括：壳体和安装于壳体内的电路板7、安装于电路板7上的散热块6以及安装于散热块6上的散热风扇4，散热块6具有用于导流气体的剖沟61；上述电子终端还包括挡风板5，如图2和图3所示；其中：
挡风板5安装于壳体内、且与散热风扇4的外壳以及壳体内壁密封配合以将壳体内空间分隔为冷风入风腔室和散热腔室；电路板7以及散热块6位于散热腔室内；散热风扇4的入风口与冷风入风腔室连通，出风口与散热腔室连通；
壳体上设有与冷风入风腔室连通的入风孔21和与散热腔室连通的出风孔13，入风孔21设置于壳体的底侧，出风孔13设置于壳体的顶侧，如图1和图2所示。
上述电子终端中，挡风板5将壳体内空间分割为散热腔室和冷风入风腔室，散热风扇4的入风口与冷风入风腔室连通，因此，在电子终端设置的散热风扇4工作时，如图1、图2和图4所示，冷空气自壳体底侧的入风孔21进入冷风入风腔室内，散热风扇4将冷风入风腔室内的冷空气吹向散热块6对散热块6进行散热；由于散热块6位于散热腔室内，散热风扇4吹入的冷空气与散热块6进行热交换后变为热空气，热空气自设置于壳体顶侧、且与散热腔室连通的出风孔13吹出壳体。由于散热腔室与冷风入风腔室之间通过挡风板5隔离，散热腔室内的热空气无法进入到冷风入风腔室内，并且，冷风入风腔室内的冷空气自壳体底侧的入风孔21进入，而散热腔室内的热空气自壳体顶部的出风孔13吹出壳体，因此，热空气在吹出壳体后向上升，所以，散热腔室吹出的热空气无法自壳体底侧设置的入风孔21进入冷风入风腔室内，因此，散热风扇4吹向散热块6的空气为冷空气，进而提高了电子终端的散热效率。
具体地，如图1和图2所示，壳体包括筒体1、底板2和顶板3，挡风板5与筒体1以及底板2密封配合，电路板7与筒体1的轴心线平行地设置于筒体1内。上述壳体结构便于实现电路板以及挡风板等的组装。
具体地，上述实施方式提供的电子终端中，壳体底侧设置的入风孔21可以有多种设置方式：
方式一，上述入风孔21可以为底板2上设有的多个与冷风入风腔室连通的通孔，如图2、图4以及图5所示；
方式二，上述入风孔21还可以为底板2与筒体1之间形成的透风间隙(图中未示
出)。
在上述方式一的基础上，当入风孔21为底板2上设有的多个与冷风入风腔室连通的通孔时，底板2与冷风入风腔室相对的部位具有网板结构，具有网板结构的底板2上的网孔形成通孔。具有网板结构的底板能够提高冷空气进入冷风入风腔室时的流畅性，减小底板2对冷空气的阻碍。
当然，上述实施方式提供的电子终端中，出风孔13也可以有多种设置方式：
方式一，上述出风孔13可以为顶板3设有的多个与散热腔室连通的通孔。
方式二，上述出风孔13还可以为顶板3与筒体1之间形成的与散热腔室连通的透风间隙。
进一步地，在上述各实施方式的基础上，如图2和图4所示，本实施方式提供的电子终端中，挡风板5包括：
沿筒体1轴心线方向延伸、且位于散热风扇4两侧的竖挡风板52和竖挡风板54；
沿垂直于筒体1轴心线方向延伸、且位于散热风扇4朝向顶板3一侧的第一横挡风板51；
沿垂直于筒体1轴心线方向延伸、且位于散热风扇4朝向底板2一侧的第二横挡风板53。
上述结构的挡风板5能够减小冷风入风腔室在壳体内所占空间，提高壳体内空间的利用率。
在上述实施方式的基础上，如图2、图4、图5以及图6所示，本实施方式提供的电子终端中，底板2上设有向顶板3方向凸起的螺丝柱，如图6中所示的螺丝柱22和螺丝柱23，筒体1内壁设有沿筒体1轴心线方向延伸的加强筋11；其中：
每一个竖挡风板为一个螺丝柱外周面上设置的筋板，如图5和图6中所示，竖挡风板52为螺丝柱22外周面设有的筋板，竖挡风板54为螺丝柱23外周面设有的筋板；每一个竖挡风板与螺丝柱具有一体式结构，而每一个螺丝柱固定于底板2上，进而实现了两个挡风板与底板2的连接；
如图6所示，第一横挡风板51设有与筒体1内加强筋11滑动密封的滑槽；第一横挡风板51与筒体1铆接，如图6中所示，第一横挡风板51通过热熔方式形成的铆接点12与筒体1铆接；第一横挡风板51朝向顶板3的一面与加强筋11设有的朝向底板2的压面相抵，第一横挡风板51朝向底板2的一面与螺丝柱22以及螺丝柱23设有的朝向顶板3的支撑面相抵(图中未示出)；上述第一横挡风板51能够通过筒体1以及底板
2上的结构实现定位；
如图2和图4所示，上述第二横挡风板53设置于底板2，当然，上述第二横挡风板53可以与底板2具有一体式结构。
具体地，在上述各实施方式的基础上，壳体中，沿垂直于筒体1轴心线方向，筒体1的横截面外边缘的形状为圆形、方形、或菱形以及其它类似筒类形状。
一种优选实施方式中，散热块6上具有的剖沟61可以为十字型结构，以使散热风扇4吹入散热块6的空气能够从散热块6份四周吹出，以使热空气能够及时地从散热块6内吹出，提高电子终端的散热效率。
显然，本领域的技术人员可以对本发明实施例进行各种改动和变型而不脱离本发明的精神和范围。这样，倘若本发明的这些修改和变型属于本发明权利要求及其等同技术的范围之内，则本发明也意图包含这些改动和变型在内。
Claims (9)
- 一种电子终端，包括壳体和安装于壳体内的电路板、安装于所述电路板上的散热块以及安装于散热块上的散热风扇，所述散热块具有用于导流气体的剖沟；其特征在于，还包括挡风板；其中：所述挡风板安装于所述壳体内、且与所述散热风扇的外壳以及所述壳体内壁密封配合以将所述壳体内空间分隔为冷风入风腔室和散热腔室；所述电路板以及所述散热块位于所述散热腔室内；所述散热风扇的入风口与所述冷风入风腔室连通，出风口与所述散热腔室连通；所述壳体上设有与所述冷风入风腔室连通的入风孔和与所述散热腔室连通的出风孔，所述入风孔设置于所述壳体的底侧，所述出风孔设置于所述壳体的顶侧。
- 根据权利要求1所述的电子终端，其特征在于，壳体包括筒体、底板和顶板，所述挡风板与所述筒体以及所述底板密封配合，所述电路板与所述筒体的轴心线平行地设置于所述筒体内。
- 根据权利要求2所述的电子终端，其特征在于，所述入风孔为：所述底板上设有的多个与所述冷风入风腔室连通的通孔；或者，所述底板与所述筒体之间形成的透风间隙。
- 根据权利要求2所述的电子终端，其特征在于，当所述入风孔为所述底板上设有的多个与所述冷风入风腔室连通的通孔时，所述底板与所述冷风入风腔室相对的部位具有网板结构，具有网板结构的底板上的网孔形成所述通孔。
- 根据权利要求2所述的电子终端，其特征在于，所述出风孔为：所述顶板设有的多个与所述散热腔室连通的通孔；或者，所述顶板与所述筒体之间形成的与散热腔室连通的透风间隙。
- 根据权利要求2所述的电子终端，其特征在于，所述挡风板包括：沿筒体轴心线方向延伸、且位于所述散热风扇两侧的两个竖挡风板；沿垂直于所述筒体轴心线方向延伸、且位于所述散热风扇朝向顶板一侧的第一横挡风板；沿垂直于所述筒体轴心线方向延伸、且位于所述散热风扇朝向底板一侧的第二横挡风板。
- 根据权利要求6所述的电子终端，其特征在于，所述底板上设有向顶板方向凸起的螺丝柱，所述筒体内壁设有沿筒体轴心线方向延伸的加强筋；其中：每一个所述竖挡风板为一个所述螺丝柱外周面上设置的筋板；所述第一横挡风板设有与所述筒体内加强筋滑动密封的滑槽；所述第一横挡风板与所述筒体铆接；所述第一横挡风板朝向顶板的一面与所述加强筋设有的朝向所述底板的压面相抵；所述第一横挡风板朝向底板的一面与所述螺丝柱设有的朝向所述顶板的支撑面相抵；所述第二横挡风板设置于所述底板。
- 根据权利要求1-7任一项所述的电子终端，其特征在于，沿垂直于所述筒体轴心线方向，所述筒体的横截面外边缘的形状为圆形、方形、或菱形。
- 根据权利要求1-7任一项所述的电子终端，其特征在于，所述散热块的剖沟具有十字型结构。
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| CN108260334A (zh) * | 2018-03-22 | 2018-07-06 | 四川畅云出行信息技术有限公司 | 一种车载通信终端的壳体结构 |
| CN111465262A (zh) * | 2020-03-23 | 2020-07-28 | 珠海精讯知识产权管理有限公司 | 一种具有强散热功能的设备和基因测序设备 |
| CN117336236A (zh) * | 2023-09-27 | 2024-01-02 | 东莞市唯仕达通讯科技有限公司 | 一种路由器散热调节装置及其方法 |
| CN117336236B (zh) * | 2023-09-27 | 2024-05-14 | 东莞市唯仕达通讯科技有限公司 | 一种路由器散热调节装置及其方法 |
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Family Cites Families (14)
| Publication number | Priority date | Publication date | Assignee | Title |
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| JPH0282693A (ja) * | 1988-09-20 | 1990-03-23 | Matsushita Electric Ind Co Ltd | 筺体内冷却装置 |
| CN2739793Y (zh) * | 2004-11-10 | 2005-11-09 | 福华电子股份有限公司 | 热交换式散热器改良结构 |
| CN100470777C (zh) * | 2005-08-18 | 2009-03-18 | 富准精密工业(深圳)有限公司 | 散热装置 |
| CN201167281Y (zh) * | 2007-02-09 | 2008-12-17 | 唐山松下产业机器有限公司 | 一种逆变焊接电源的整体结构 |
| CN201008252Y (zh) * | 2007-03-27 | 2008-01-16 | 曾国辉 | 一种热交换器及带热交换器的机柜 |
| CN100563415C (zh) * | 2007-07-04 | 2009-11-25 | 华为技术有限公司 | 直通风散热装置及其控制方法 |
| US7839637B2 (en) * | 2008-09-24 | 2010-11-23 | Cisco Technology, Inc. | Air-cooling of electronics cards |
| TW201028638A (en) * | 2009-01-21 | 2010-08-01 | Young Green Energy Co | Heat sink module |
| CN102271478B (zh) * | 2011-08-02 | 2014-05-14 | 浙江海利普电子科技有限公司 | 用于容纳电子元件的壳体 |
| CN202455722U (zh) * | 2012-02-14 | 2012-09-26 | 上海正泰电源系统有限公司 | 一种大功率电力电子设备的布局结构 |
| CN202455251U (zh) * | 2012-03-08 | 2012-09-26 | 成都希望电子研究所有限公司 | 小型变频器的散热防尘结构 |
| CN202634974U (zh) * | 2012-04-09 | 2012-12-26 | 深圳市汇川技术股份有限公司 | 散热结构及具有该散热结构的功率单元 |
| CN104105378B (zh) * | 2013-04-03 | 2018-01-09 | 华为技术有限公司 | 单板散热装置 |
| CN203377798U (zh) * | 2013-08-02 | 2014-01-01 | 东软飞利浦医疗设备系统有限责任公司 | 大功率高压发生器 |
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| CN106639371A (zh) * | 2016-11-24 | 2017-05-10 | 河北郎尊电力科技有限公司 | 防涝充电桩 |
| CN108260334A (zh) * | 2018-03-22 | 2018-07-06 | 四川畅云出行信息技术有限公司 | 一种车载通信终端的壳体结构 |
| CN111465262A (zh) * | 2020-03-23 | 2020-07-28 | 珠海精讯知识产权管理有限公司 | 一种具有强散热功能的设备和基因测序设备 |
| CN117336236A (zh) * | 2023-09-27 | 2024-01-02 | 东莞市唯仕达通讯科技有限公司 | 一种路由器散热调节装置及其方法 |
| CN117336236B (zh) * | 2023-09-27 | 2024-05-14 | 东莞市唯仕达通讯科技有限公司 | 一种路由器散热调节装置及其方法 |
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