WO2016074792A1 - Carte de circuit imprimé multicouche à profilé en cuivre épais intégré, pouvant être cintré par déformation plastique - Google Patents

Carte de circuit imprimé multicouche à profilé en cuivre épais intégré, pouvant être cintré par déformation plastique Download PDF

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Publication number
WO2016074792A1
WO2016074792A1 PCT/EP2015/002267 EP2015002267W WO2016074792A1 WO 2016074792 A1 WO2016074792 A1 WO 2016074792A1 EP 2015002267 W EP2015002267 W EP 2015002267W WO 2016074792 A1 WO2016074792 A1 WO 2016074792A1
Authority
WO
WIPO (PCT)
Prior art keywords
circuit board
printed circuit
profile
thick copper
bendable
Prior art date
Application number
PCT/EP2015/002267
Other languages
German (de)
English (en)
Inventor
Johann Hackl
Stefan HOERTH
Norbert REDL
Original Assignee
Häusermann GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Häusermann GmbH filed Critical Häusermann GmbH
Publication of WO2016074792A1 publication Critical patent/WO2016074792A1/fr

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0207—Cooling of mounted components using internal conductor planes parallel to the surface for thermal conduction, e.g. power planes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0263—High current adaptations, e.g. printed high current conductors or using auxiliary non-printed means; Fine and coarse circuit patterns on one circuit board
    • H05K1/0265—High current adaptations, e.g. printed high current conductors or using auxiliary non-printed means; Fine and coarse circuit patterns on one circuit board characterized by the lay-out of or details of the printed conductors, e.g. reinforced conductors, redundant conductors, conductors having different cross-sections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0277—Bendability or stretchability details
    • H05K1/0278—Rigid circuit boards or rigid supports of circuit boards locally made bendable, e.g. by removal or replacement of material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
    • H05K1/0206—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate by printed thermal vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/06—Thermal details
    • H05K2201/066—Heatsink mounted on the surface of the PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/091—Locally and permanently deformed areas including dielectric material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10272—Busbars, i.e. thick metal bars mounted on the PCB as high-current conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10416—Metallic blocks or heatsinks completely inserted in a PCB

Definitions

  • the invention relates to a multilayer printed circuit board with integrated, plastically bendable thick copper profile according to the preamble of claim 1.
  • At the center of the invention is the desire to create bendable, interleaved multi-layer printed circuit boards in which it is possible to permanently angwinkein certain segments with respect to the other existing segments from each other and maintain this angular position.
  • Such an embodiment in which the multilayer printed circuit board is segmented several times and consists of different segment parts, which are bendable to one another and permanently maintain their bending, is for example also the subject of WO 2014/0076233 A1.
  • a major disadvantage of this embodiment is that the bendable portion consists of a rectangular copper profile, which forms the outside of the bending edge of the multilayer printed circuit board. As a result, only relatively large bending radii are possible because the section to be bent is arranged only on the outside of the circuit board. He must be released to allow a bend.
  • the bending on the outer circumference of a bending radius also has the disadvantage that a relatively large material consumption occurs because of high tensile forces on the profile to be bent arise.
  • a corresponding anchoring must be created on the top of the circuit board.
  • the profile to be bent is embedded only in the outer layer of the multilayer printed circuit board, which is associated with the above-mentioned disadvantages.
  • DE 10 2006 004 321 A1 always has a substrate layer in the region of the notched edge, even below the copper profile, which likewise prevents a permanent plastic deformation in the bending region.
  • the invention is therefore based on the own DE 10 2006 004 321 A1 the object of developing a multilayer printed circuit board, consisting of individual segments segmented and mutually angled segment parts existing multilayer circuit board so that the individual segment parts permanently and permanently their unique bent position maintained.
  • the invention is characterized by the technical teaching of claim 1.
  • An essential feature of the invention is that at least one thick copper profile is arranged in the bending section of the at least one bendable segment part as a functional element, which is permanently deformable at a bend.
  • each thick copper profile is formed so thick that it is permanently deformable during bending and its bending maintains.
  • the width of such a thick copper profile is approximately in the range of 500 pm to 12 mm.
  • the base part is attached to the multilayer printed circuit board still on any base plate or a mounting foundation; However, this is not necessary for the solution.
  • a preferred embodiment is z.
  • a lamp which is characterized in that a plurality of LED elements are arranged on a multi-angled strip, and it requires this no fixings or stabilizations to maintain the once angled structure of the multilayer printed circuit board in this form.
  • the exposure of the at least one thick copper element can be done by means of milling or laser technology several times in the form of V- or U-shaped exposures. As a result, multiple bends up to over 180 ° C can be formed. Since at least part of the printed circuit board is designed so self-supporting, no additional mechanical attachment or support is required more.
  • the at least one thick copper element has a lateral extent of at least 500 ⁇ m along the bending edge of the copper element.
  • a region with a thick copper element is exposed in a U-shape or on more than one side with a desired shape or cut through the printed circuit board, said inner region is angled after placement and soldering and thus self-supporting this part of the circuit board in holds the angled position.
  • a plurality of thick copper elements can be integrated into the printed circuit board and the printed circuit board have a plurality of cut-throughs, so that the printed circuit board is angled after assembly and soldering into a multidimensional structure and formed self-supporting by means of the thick copper element.
  • At least one structured copper layer with a conventional copper structure is arranged to the thick copper elements in the bending region. Furthermore, it is possible for at least one thick copper element to be current-carrying. Likewise, the thick copper element may have a thermally conductive function.
  • the invention is not limited to the use of a thick copper profile. It can be used as a functional element as well as other metal profiles, such. As iron profiles, aluminum profiles, copper alloys and the like.
  • the arrangement of the plastically bendable and permanently bendable profile is intended to solve a total of three different tasks:
  • Figure 1 Top view of a still undeformed multi-layer circuit board
  • FIG. 2 side view of the multilayer printed circuit board according to FIG. 1
  • Figure 3 compared to Figure 2 angled multi-layer circuit board
  • Figure 4 a comparison with Figure 2 and 3 modified embodiment with a component equipped with multi-layer circuit board
  • Figure 5 section through the multilayer printed circuit board in height of the line V-V
  • Figure 6 section through the bending edge of the multilayer printed circuit board in height of the part Vl-Vl
  • FIG. 7 shows a micrograph of a microscope photograph of the bending edge of the multilayer printed circuit board
  • FIG. 9 the side view of the arrangement according to FIG. 8
  • the figure 1 to 3 shows a multi-layer circuit board 1 of a conventional printed circuit board material, which z. B. from FR-4, in which a plurality of inner and outer layers are arranged.
  • the multilayer printed circuit board 1 consists of a base part 2 with mounting holes 4 arranged therein and that one or more segment parts 3 can be bent from this base part 2, which retain their shape after bending, as shown in FIG Figure 3 is shown.
  • the multi-layer printed circuit board can also consist of a plurality of contiguous segment parts 3, so that therefore the base part 2 is omitted altogether.
  • the multilayer printed circuit board is represented by a base part 2, which is connected via a number of several mutually parallel thick copper profiles 5 bendable with a segment part 3.
  • the thick copper profiles 5 can show quite different cross section and different dimensions, as shown in Figure 1.
  • a bending line 6 is defined, which forms a notched edge 9 (see Figure 3), wherein in the illustrated embodiment, the notched edge 9 does not pass, but at the lower end of the multilayer printed circuit board forms an open bending gap 8.
  • the bending gap 8 is thus preferably arranged in the bending section 10 and extends, for example, from the side surface into the center of the printed circuit board 1.
  • the arrangement of a continuous or open bending gap 8 allows easier plastic deformation of the segment part 3 in the region of the bending section 10.
  • the depth of the notched edge 9 is selected so that the depth of the notch edge can either end at the bottom of the thick copper profile 5, whereby it is exposed visually visible. In the bending section 10 thus the notched edge 9 extends up to the thick copper profile. 5
  • the depth of the notched edge is smaller, whereby even a material layer 24 consisting of the base material 17 of the multilayer printed circuit board can be retained.
  • a thin material layer 25 of the base material 17 is still obtained even above the bent portion, which may however be blasted off.
  • the notch angle 19 is characterized by the two score lines 20, as shown in FIG.
  • a bending section 10 is defined between a plurality of parts of a multilayer printed circuit board 1, whereby - as stated above - a material section 11 above the notched edge 9 is also retained. be thrown or blown off. This is shown with reference to FIG. 4 with the material layer 25.
  • the thick copper profile 5 is integrated in a multilayer composite of a printed circuit board, d. H. the thick copper profile 5 can also be used for power management and heat dissipation.
  • strip conductors 12 may be present in the multi-layer conductor composite, as shown for example in FIG. This strip conductors 12 are guided by the base part 2 in the segment part 3.
  • FIG. 6 shows the section through the bending line 6, it being possible for additional material layers to be present above and below.
  • FIG. 7 shows a microscopically enlarged sectional view in the region of the bending line, the same parts being provided with the same reference numerals. It is shown at reference numeral 21 that the material layer 25 located there is broken. It is not a preferred embodiment, but only an example from practice. It can also be seen that the printed conductors 12 are interrupted in the upper region, as well as in the lower region of the multilayer printed circuit board 1.
  • the remaining strip conductors are led through and extend from the base part 2 into the segment part 3, wherein such a leadthrough is shown only in FIG. 1, while in FIG. 7 these strip conductors are interrupted. It can also be seen that the conductor track 12 can be at least partially connected electrically conductively with the thick copper profile 5.
  • Figures 8 and 9 show as a modified embodiment, a three-dimensional bending, wherein it can be seen that the thick copper profile now not consists of a rectangular profile, but preferably from a round profile.
  • This round profile is bendable in two mutually perpendicular planes, namely both in the X and in the Y plane, which means that it can be angled along the bending edge 6 on the one hand and on the other hand along the rotation axis 23 in the direction of arrow 22 can be rotated.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Structure Of Printed Boards (AREA)

Abstract

Carte de circuit imprimé multicouche comprenant au moins un segment pouvant être coudé. Au moins un élément fonctionnel conçu de manière à pouvoir être cintré est intégré dans une partie flexible du segment, au moins une arête entaillée est ménagée dans ladite partie flexible et la carte de circuit imprimé est conçue de manière partiellement flexible au moins dans cette zone. Au moins un profilé en cuivre épais, pouvant être déformé de manière durable sous l'effet d'une flexion, est agencé en tant qu'élément fonctionnel dans la partie flexible dudit au moins un segment pouvant être coudé.
PCT/EP2015/002267 2014-11-13 2015-11-12 Carte de circuit imprimé multicouche à profilé en cuivre épais intégré, pouvant être cintré par déformation plastique WO2016074792A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102014016846.8 2014-11-13
DE102014016846.8A DE102014016846A1 (de) 2014-11-13 2014-11-13 Mehrlagen-Leiterplatte mit integriertem, plastisch biegbarem Dickkupfer-Profil

Publications (1)

Publication Number Publication Date
WO2016074792A1 true WO2016074792A1 (fr) 2016-05-19

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Family Applications (1)

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PCT/EP2015/002267 WO2016074792A1 (fr) 2014-11-13 2015-11-12 Carte de circuit imprimé multicouche à profilé en cuivre épais intégré, pouvant être cintré par déformation plastique

Country Status (2)

Country Link
DE (1) DE102014016846A1 (fr)
WO (1) WO2016074792A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10237970B2 (en) 2017-02-16 2019-03-19 Ford Global Technologies, Llc Bending method for printed circuit board

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR3109051A1 (fr) * 2020-04-03 2021-10-08 Safran Ventilation Systems Circuit électronique comprenant une pluralité de circuits imprimés reliés par au moins une barre-bus

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2007087982A1 (fr) * 2006-01-31 2007-08-09 Häusermann GmbH Carte de circuits imprimés comportant des éléments fonctionnels supplémentaires, son procédé de production et son utilisation
DE102006004321A1 (de) * 2006-01-31 2007-08-16 Häusermann GmbH Biegbare Leiterplatte mit zusätzlichem funktionalem Element und einer Kerbfräsung und Herstellverfahren und Anwendung
WO2014076233A1 (fr) * 2012-11-16 2014-05-22 Jumatech Gmbh Structure de carte de circuits imprimés coudée et/ou pouvant être coudée et comprenant au moins deux parties de carte de circuits imprimés, et procédé de fabrication de ladite structure

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19634371A1 (de) 1996-08-24 1998-02-26 Grundig Ag Verfahren zur Herstellung flexibler Leiterplatten
DE102005003369A1 (de) * 2005-01-24 2006-07-27 Juma Pcb Gmbh Verfahren zur Herstellung einer räumlichen Leiterplattenstruktur aus wenigstens zwei zueinander winkelig angeordneten Leiterplattenabschnitten
US8029165B2 (en) * 2007-05-21 2011-10-04 Goldeneye, Inc. Foldable LED light recycling cavity

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2007087982A1 (fr) * 2006-01-31 2007-08-09 Häusermann GmbH Carte de circuits imprimés comportant des éléments fonctionnels supplémentaires, son procédé de production et son utilisation
DE102006004321A1 (de) * 2006-01-31 2007-08-16 Häusermann GmbH Biegbare Leiterplatte mit zusätzlichem funktionalem Element und einer Kerbfräsung und Herstellverfahren und Anwendung
WO2014076233A1 (fr) * 2012-11-16 2014-05-22 Jumatech Gmbh Structure de carte de circuits imprimés coudée et/ou pouvant être coudée et comprenant au moins deux parties de carte de circuits imprimés, et procédé de fabrication de ladite structure
DE102012221002A1 (de) * 2012-11-16 2014-05-22 Jumatech Gmbh Abwinkelbare und/oder abgewinkelte Leiterplattenstruktur mit zumindest zwei Leiterplattenabschnitten und Verfahren zu deren Herstellung

Non-Patent Citations (3)

* Cited by examiner, † Cited by third party
Title
"Kalte Platte", SPECIAL PROJECT LEDS 4, 1 June 2013 (2013-06-01), pages 52 - 56, XP055260815, Retrieved from the Internet <URL:http://www.haeusermann.at/downloads/presseartikel/kalte_platte.pdf> [retrieved on 20160323] *
SIMPEX ELECTRONIK: "HOCHSTROM- UND WÄRMEMANAGEMENT AUF DER LEITERPLATTE Mehr als nur eine Leiterplatte", MEGALINK, 1 August 2011 (2011-08-01), XP055261981, Retrieved from the Internet <URL:http://www.simpex.ch/fileadmin/allgemein/Presse/Megalink 8 11 Seite 32.jpg.pdf> [retrieved on 20160331] *
STEFAN HÖRTH: "Hart im Nehmen - Effizientes Wärmemanagement in Leiterplatten", PRODUCTRONIK, 1 April 2012 (2012-04-01), Heidelberg, XP055261623, Retrieved from the Internet <URL:http://www.productronic.de/wp-content/uploads/sites/10/2012/04/Prod-04_12_geamt_web.pdf> [retrieved on 20160330] *

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10237970B2 (en) 2017-02-16 2019-03-19 Ford Global Technologies, Llc Bending method for printed circuit board

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