WO2016096131A1 - Carte à circuit imprimé multicouche avec élément thermoconducteur - Google Patents

Carte à circuit imprimé multicouche avec élément thermoconducteur Download PDF

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Publication number
WO2016096131A1
WO2016096131A1 PCT/EP2015/002534 EP2015002534W WO2016096131A1 WO 2016096131 A1 WO2016096131 A1 WO 2016096131A1 EP 2015002534 W EP2015002534 W EP 2015002534W WO 2016096131 A1 WO2016096131 A1 WO 2016096131A1
Authority
WO
WIPO (PCT)
Prior art keywords
circuit board
printed circuit
heat
thick copper
multilayer printed
Prior art date
Application number
PCT/EP2015/002534
Other languages
German (de)
English (en)
Inventor
Johann Hackl
Stefan Hörth
Norbert REDL
Original Assignee
Häusermann GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Häusermann GmbH filed Critical Häusermann GmbH
Publication of WO2016096131A1 publication Critical patent/WO2016096131A1/fr

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0207—Cooling of mounted components using internal conductor planes parallel to the surface for thermal conduction, e.g. power planes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0263—High current adaptations, e.g. printed high current conductors or using auxiliary non-printed means; Fine and coarse circuit patterns on one circuit board
    • H05K1/0265—High current adaptations, e.g. printed high current conductors or using auxiliary non-printed means; Fine and coarse circuit patterns on one circuit board characterized by the lay-out of or details of the printed conductors, e.g. reinforced conductors, redundant conductors, conductors having different cross-sections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0277—Bendability or stretchability details
    • H05K1/0278—Rigid circuit boards or rigid supports of circuit boards locally made bendable, e.g. by removal or replacement of material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
    • H05K1/0206—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate by printed thermal vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/06—Thermal details
    • H05K2201/066—Heatsink mounted on the surface of the PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/091—Locally and permanently deformed areas including dielectric material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10416—Metallic blocks or heatsinks completely inserted in a PCB

Definitions

  • Multi-layer printed circuit board with heat-conducting element Multi-layer printed circuit board with heat-conducting element
  • the invention relates to a multilayer printed circuit board with thermally conductive element according to the preamble of claim 1.
  • EP 1 980 142 B1 discloses a multifunctional printed circuit board with an additional heat-conducting, functional element, this element being thermally well-conductively connected to one side of a through-hole and the other side on the back of the component being thermally highly conductive with a flat, thermally well conductive element is connected.
  • the functional element is attached by means of ultrasound or friction welding piecewise flat on a copper foil with an intermetallic compound.
  • a disadvantage of this embodiment is that no lateral heat conduction function is present, which emits the waste heat of a mounted on the multi-layer PCB cooling device.
  • a multilayer printed circuit board in which a thermally conductive element is integrated in the printed circuit board assembly.
  • This thermally conductive element is referred to as a heat sink and is formed in the embodiment shown as a wire or a sheet of rectangular cross-section.
  • the multilayer printed circuit board has no segments which can be bent apart from one another and it is therefore not possible to arrange a heat source and a heat sink on the various segments of a multi-layer printed circuit board, wherein these segments can be angled away from one another in their position .
  • bendable profile sections are arranged in the upper region of the printed circuit board structure, whereby a bendability of the entire printed circuit board is possible.
  • no self-supporting function is achieved, with the result that the segmented circuit board structure shown there is not suitable, To ensure a permanent bendability of the individual, one another taking an angular position engaging segments.
  • the invention is therefore based on the object, the connection between a heat source and a heat sink educate so that the two said parts (heat sink and heat source) can be arranged on different sections of a bendable multilayer printed circuit board.
  • the invention is characterized by the technical teaching of claim 1.
  • An essential feature of the invention is that on a segmented and separated by different segments from each other multi-layer circuit board on each segment a heat source and / or heat sink and on the other segment turn a heat sink and / or a heat source to order and the two thermally-acting parts be thermally conductively connected by a thick copper profile, the thick copper profile bridges the bending gap between the segmented circuit board sections and acts heat-conducting.
  • the advantage arises for the first time that with the use of a thick copper profile integrated in the multi-layer structure, it is possible to bend the individual segments continuously and with a predetermined angular position so as to form different printed circuit board segments having a spatial structure result.
  • this thick copper profile still assumes additional current-carrying tasks, ie. is also electrically integrated into the circuit board structure and in the interconnection of the individual interconnects.
  • the thick copper profile according to the invention is assigned a threefold task, which was not previously known.
  • the relevant thick copper element in a preferred embodiment has a thickness of at least 500 ⁇ m and a width of at least 500 ⁇ m and a length of e.g. 10 to 100 mm.
  • Thick copper elements arranged on different inner and / or outer layers of the circuit board. Further, two or more thick copper elements may be arranged side by side on the same or different layers. It is also possible that the at least one thick copper element is used, which is formed by exposure of the upper or lower or both sides of the circuit board self-supporting angled. By exposing the thick copper element a good thermal coupling or decoupling is achieved.
  • the thick copper element is designed to be live.
  • the thick copper element from above and / or from below by means of thermovias or blind hole or
  • Microvias (general intoleitbohrung) with outer layer copper structures thermally well conductive, so that the electrical or electronic components and cooling devices can be contacted with good thermal conductivity.
  • thermovias or blind hole or microvias are thermally highly conductive, but electrically insulating.
  • the cooling device may for example consist of at least one heat pipe (heat pipe or heat pipe), wherein the heat pipe is directly connected to the thick copper element by a soldering or welding or gluing process.
  • the one plane is in this case preferably angled arranged to the other plane.
  • any installation difficulties can be overcome, and on the other hand, the heat output can be optimized, because it is now possible to optimally arrange the heat sink in a housing in order to achieve optimized heat dissipation, without taking into account restrictive housing dimensions or installation conditions got to.
  • Another advantage is that it is now possible for the first time with three-dimensionally deformed multilayer printed circuit boards to arrange additional electrical components on angled segments of a multilayer printed circuit board, which in turn hereby ensures that no consideration has to be taken to limited installation conditions.
  • a particular advantage of the invention is the fact that the heat-conducting element now consists of a thick copper profile, which is for the first time able to ensure a heat conduction from the heat source to the heat sink.
  • the thick copper profile having a thickness of about more than 500 ⁇ m, a width of 0.5 to 20 mm and a length of e.g. 10 to 100 mm.
  • the solution it is not necessary for the solution to form the thick copper profile smooth. It may also be surface profiled to a certain extent, wherein it is preferred that in the longitudinal axis of the thick copper profile parallel juxtaposed grooves, grooves or other surface-increasing structures are included.
  • the thick coupler profile according to the invention is a heat sink which is laid in the longitudinal direction in the printed circuit board assembly of the multilayer printed circuit board and is also available.
  • the thick copper profile is plastically and permanently deformable, so that once bent from the multilayer printed circuit board Segments that are angular to the plane of the base circuit board, remain in this angled position, without the need for further mounting and fastening means, but such tools are additionally usable.
  • Figure 1 Top view of a not yet segmented multi-layer circuit board
  • FIG. 2 shows a section through the multilayer printed circuit board according to FIG. 1
  • Figure 4 the section through the multilayer printed circuit board in a second
  • Figure 5 a section through the multilayer printed circuit board in the region of the bending edge with view of the printed circuit board segment on which the heat sources are arranged
  • Figure 6 the section in the opposite direction of the bending edge on the circuit board segment in which the heat sinks are arranged.
  • Figure 7 an embodiment modified from the aforementioned embodiment, in which it results that not only heat sinks and heat sources can be arranged on angled portions of a multilayer printed circuit board, but also additional electrical connection elements in the embodiment of Figure 1 is not one deformed multilayer printed circuit board 1, as it is subjected to a conventional manufacturing process.
  • the advantage here is that during this manufacturing process a bend is not yet given, so that the multilayer printed circuit board can be manufactured and assembled in any way.
  • the bending edge 8 can be formed by a milling groove 15 extending over the width of the multilayer printed circuit board, so that a material weakening along the bending edge 8 takes place in the base material of the multilayer printed circuit board in order to achieve a bending according to FIG.
  • a bending angle 11 which may preferably be in the range between 0 and 150 °. It is important now that either a heat source 4 or a heat sink 7 can be arranged on the one printed circuit board segment 2 and reversibly the heat sink 7 or the heat source 4 on the opposite circuit board segment.
  • the heat source 4 is arranged on the printed circuit board segment 2, which is thermally conductively connected, for example via heat conducting holes 10 with the surface of the thick copper profile 5, in which case the heat conduction from this heat source 4 takes place in the direction of arrow 6 in the direction of arrow 6 in the longitudinal direction of the thick copper profile 5 on the bending edge 8 away from the angled printed circuit board segment 3, on the the heat sink 7 is arranged.
  • the heat sink 7 is formed in the embodiment shown as a heat sink. It could also be designed as a heat pipe or as a housing part, with which the printed circuit board segment 3 is thermally conductively connected.
  • the heat sink 7 is thermally conductively connected via heat conducting bores 10 with the thick copper profile 5. Additional continuous heat conducting holes 9 (thermal vias) can be used.
  • Such various types of heat conducting bores 9, 10 can also be used on the heat source 4 side.
  • FIG. 4 it is shown that it is not necessary to obtain the surface in the angled segmented printed circuit board segment 3. It can then be provided that in this area the top and / or the bottom of the thick copper profile 5 is exempted, which is given as an example with the two exemptions 12, 13. Likewise, it may be provided on the side of the heat source to connect the heat source directly via an exemption thermally conductive with the surface of the thick copper profile 5.
  • Figures 5 and 6 respectively show the opposite views on the heat-dissipating and the heat-receiving circuit board 2, 3rd
  • the heat-emitting side is formed in the embodiment shown in Figure 5 by two adjacent heat sources 4a, 4b, which are formed in the embodiment shown as LEDs.
  • the one LED has additional continuous heat conducting holes 9 to the bottom of the printed circuit board segment 2, while the other LED is arranged as a heat source 4b at a short distance above the thick copper profile 5b.
  • two thick copper profiles 5a, 5b arranged parallel to one another act as heat-conducting elements, which extend over the bending edge 8 and are connected in a heat-conducting manner to the heat sinks 7a, 7b shown in FIG. It is only shown by way of example that the thermal connection takes place in each case by means of heat conducting bores 10 (in the form of blind bores) or via continuous heat conducting bores 9.
  • FIG. 7 shows a third embodiment of the invention, wherein in the region of a base plate, which is a first bearing plate segment 3, a middle heat sink 7 is mounted as a heat sink and at the top of this multilayer printed circuit board, a heat source 4b is arranged. The heat conduction takes place directly over the vertical arrow shown here.
  • a heat source 4a is arranged, which initiates its heat output according to the arrow shown on the inventive permanently flexible and plastically deformable thick copper profile 5b on the heat sink 7.
  • the thick copper profile is thus formed as a heat-conducting or functional element.
  • the printed circuit board segment 2 is shown angled over the bending edge 8a, and this segment carries a contact element 13, which serves for electrical contacting either of arranged in the printed circuit board assembly of the multilayer printed circuit board further interconnects 14 or which - in another embodiment - also for electrical Contacting the thick copper profile 5 is used.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Structure Of Printed Boards (AREA)

Abstract

L'invention concerne une carte à circuit imprimé multicouche (1) comprenant au moins deux segments de carte (2, 3) pliables l'un par rapport à l'autre, lesquels peuvent être reliés au moyen d'au moins un élément fonctionnel (5) par l'intermédiaire d'au moins un bord de pliage (8), au moins une source thermique (4) étant disposée sur le segment de carte et, de l'autre côté du bord de pliage, au moins un dissipateur thermique (7) étant disposé sur le segment de carte, le transfert thermique entre la source thermique et le dissipateur thermique étant réalisé par l'intermédiaire d'au moins un profilé de cuivre épais (5) pouvant subir une déformation plastique durable.
PCT/EP2015/002534 2014-12-18 2015-12-16 Carte à circuit imprimé multicouche avec élément thermoconducteur WO2016096131A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102014018986.4 2014-12-18
DE102014018986.4A DE102014018986A1 (de) 2014-12-18 2014-12-18 Mehrlagen-Leiterplatte mit wärmeleitendem Element

Publications (1)

Publication Number Publication Date
WO2016096131A1 true WO2016096131A1 (fr) 2016-06-23

Family

ID=55070977

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2015/002534 WO2016096131A1 (fr) 2014-12-18 2015-12-16 Carte à circuit imprimé multicouche avec élément thermoconducteur

Country Status (2)

Country Link
DE (1) DE102014018986A1 (fr)
WO (1) WO2016096131A1 (fr)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110024491A (zh) * 2016-11-23 2019-07-16 恩德莱斯和豪瑟尔欧洲两合公司 印刷电路板和用于制造印刷电路板的方法
JPWO2018181770A1 (ja) * 2017-03-31 2020-02-20 リンテック株式会社 粘着シート

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102006004321A1 (de) 2006-01-31 2007-08-16 Häusermann GmbH Biegbare Leiterplatte mit zusätzlichem funktionalem Element und einer Kerbfräsung und Herstellverfahren und Anwendung
EP1980142B1 (fr) 2006-01-31 2009-05-13 Häusermann GmbH Carte de circuits imprimés comportant des éléments fonctionnels ainsi que des trous d'interconnexion thermoconducteurs remplis de manière sélective, et procédé de production et utilisation de cette carte de circuits imprimés
DE102012221002A1 (de) * 2012-11-16 2014-05-22 Jumatech Gmbh Abwinkelbare und/oder abgewinkelte Leiterplattenstruktur mit zumindest zwei Leiterplattenabschnitten und Verfahren zu deren Herstellung
DE102013220951A1 (de) 2012-12-12 2014-06-26 Robert Bosch Gmbh Leiterplatte mit einer drahtgeschriebenen Wärmesenke

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US8029165B2 (en) * 2007-05-21 2011-10-04 Goldeneye, Inc. Foldable LED light recycling cavity

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102006004321A1 (de) 2006-01-31 2007-08-16 Häusermann GmbH Biegbare Leiterplatte mit zusätzlichem funktionalem Element und einer Kerbfräsung und Herstellverfahren und Anwendung
EP1980142B1 (fr) 2006-01-31 2009-05-13 Häusermann GmbH Carte de circuits imprimés comportant des éléments fonctionnels ainsi que des trous d'interconnexion thermoconducteurs remplis de manière sélective, et procédé de production et utilisation de cette carte de circuits imprimés
DE102012221002A1 (de) * 2012-11-16 2014-05-22 Jumatech Gmbh Abwinkelbare und/oder abgewinkelte Leiterplattenstruktur mit zumindest zwei Leiterplattenabschnitten und Verfahren zu deren Herstellung
DE102013220951A1 (de) 2012-12-12 2014-06-26 Robert Bosch Gmbh Leiterplatte mit einer drahtgeschriebenen Wärmesenke

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
"Kalte Platte", SPECIAL PROJECT LEDS 4, 1 June 2013 (2013-06-01), pages 52 - 56, XP055260815, Retrieved from the Internet <URL:http://www.haeusermann.at/downloads/presseartikel/kalte_platte.pdf> [retrieved on 20160323] *
STEFAN HÖRTH: "Hart im Nehmen - Effizientes Wärmemanagement in Leiterplatten", PRODUCTRONIK, 1 April 2012 (2012-04-01), Heidelberg, XP055261623, Retrieved from the Internet <URL:http://www.productronic.de/wp-content/uploads/sites/10/2012/04/Prod-04_12_geamt_web.pdf> [retrieved on 20160330] *

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110024491A (zh) * 2016-11-23 2019-07-16 恩德莱斯和豪瑟尔欧洲两合公司 印刷电路板和用于制造印刷电路板的方法
US11134565B2 (en) 2016-11-23 2021-09-28 Endress+Hauser SE+Co. KG Printed circuit board and method for producing the printed circuit board
CN110024491B (zh) * 2016-11-23 2022-07-01 恩德莱斯和豪瑟尔欧洲两合公司 印刷电路板和用于制造印刷电路板的方法
JPWO2018181770A1 (ja) * 2017-03-31 2020-02-20 リンテック株式会社 粘着シート

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