EP2143989A1 - Unité d'éclairage, module DEL et procédé - Google Patents

Unité d'éclairage, module DEL et procédé Download PDF

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Publication number
EP2143989A1
EP2143989A1 EP09165351A EP09165351A EP2143989A1 EP 2143989 A1 EP2143989 A1 EP 2143989A1 EP 09165351 A EP09165351 A EP 09165351A EP 09165351 A EP09165351 A EP 09165351A EP 2143989 A1 EP2143989 A1 EP 2143989A1
Authority
EP
European Patent Office
Prior art keywords
led module
lighting unit
housing
head
unit according
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP09165351A
Other languages
German (de)
English (en)
Other versions
EP2143989B1 (fr
Inventor
Jan Dr. Kostelnik
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Wuerth Elektronik Rot am See GmbH and Co KG
Original Assignee
Wuerth Elektronik Rot am See GmbH and Co KG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Wuerth Elektronik Rot am See GmbH and Co KG filed Critical Wuerth Elektronik Rot am See GmbH and Co KG
Publication of EP2143989A1 publication Critical patent/EP2143989A1/fr
Application granted granted Critical
Publication of EP2143989B1 publication Critical patent/EP2143989B1/fr
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00—Arrangement of electric circuit elements in or on lighting devices
    • F21V23/06—Arrangement of electric circuit elements in or on lighting devices the elements being coupling devices, e.g. connectors
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S4/00—Lighting devices or systems using a string or strip of light sources
    • F21S4/20—Lighting devices or systems using a string or strip of light sources with light sources held by or within elongate supports
    • F21S4/28—Lighting devices or systems using a string or strip of light sources with light sources held by or within elongate supports rigid, e.g. LED bars
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00—Fastening of light sources or lamp holders
    • F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
    • F21V19/003—Fastening of light source holders, e.g. of circuit boards or substrates holding light sources
    • F21V19/0055—Fastening of light source holders, e.g. of circuit boards or substrates holding light sources by screwing
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]

Definitions

  • the invention relates to a lighting unit, an LED module and a method for mounting an LED module.
  • Lighting units with LEDs as light sources are known. Such lighting units serve, for example, as room lighting or for lighting artworks or billboards.
  • a flexible circuit board is mounted on a support, which has a plurality of LED areas. These LEDs are mounted on the flexible printed circuit board where they are electrically interconnected ( DE 103 50 913 ).
  • Another lighting unit with LED is off DE 10 2005 018175 known.
  • a device for contacting optoelectronic components, in particular light emitting diodes, on busbars consists of a pot-like holding element, which has on its underside latching elements for latching the retaining element on the busbar and at its top one or more through holes for the terminals of the device to be contacted.
  • the invention is based on the object to provide an improved lighting unit for at least one LED module, a corresponding LED module and a method for mounting an LED module to a lighting unit.
  • the invention proposes a lighting unit with the features mentioned in claim 1. Further developments of the invention are the subject of dependent claims.
  • the lighting unit thus contains at least one LED module, which is for example mounted on the outside of a housing.
  • busbar which is connectable to another power supply.
  • a contact element is mechanically and electrically connected for each pole of the LED module.
  • head element for each pole of the LED module, which produces the electrical connection with the LED module outside the housing wall and within the housing, the electrical and mechanical connection with the contact element.
  • a "head element” is understood in particular to be any fastening element for fastening the LED module to the outside of the housing, wherein the fastening element is designed to form an electrically conductive connection between the LED module and the busbar via a contact element that can be mounted on the fastening element ,
  • the bus bar can be made by methods known per se for the manufacture of printed circuit boards.
  • the bus bar has a carrier material, such as e.g. made of plastic, which carries a conductor track on one or both sides.
  • the busbar can be a length of z. B. 0, 25 to 1 m, in particular 0.5 m, and a width of e.g. 5 mm to 20mm, in particular 12mm.
  • the head element rests with the underside of its protruding over its shaft head on the housing facing away from the front of the LED module.
  • Another proposed by the invention mounting option is that the head element is pressed with at least one contact pin in a plated-through hole of the LED module.
  • the head element like the contact element, is a metallic or at least partially metallic element. It can therefore also be used to position the LED module and, if necessary, fix it mechanically.
  • the LED module When formed as a partial metallic element, it preferably has a sheath or coating of insulating material to isolate it from the edge of an opening of a metal housing.
  • connection between the head element and the contact element can be done in one of the usual way for the connection of metallic elements.
  • connection of metallic elements can be a connector that can make both a mechanical and an electrically secure connection.
  • connection is a screw connection.
  • head element is designed as a sleeve element, for example with a blind hole.
  • Such a bore or blind hole can be used to compress the head element with the contact element.
  • the opening of the formed as a sleeve member head member has an internal thread.
  • the head element can be screwed onto an external thread of the contact element.
  • This external thread can be advantageously formed on a threaded projection of the contact element. It is possible in this way that the head element connected to the contact element merges with its outer surface flush into the outer surface of the contact element.
  • the contact element is pressed with a plurality of contact pins in plated-through holes of the busbar. This pressing leads both to a mechanically secure and to an electrically good connection between the contact element and the busbar.
  • the contact element is connected to terminal pads in SMT.
  • the mechanical connection between the head element and the contact element is a spacer element forms, which defines a distance between the housing wall and the busbar defined.
  • the LED module is thermally conductively connected to the housing wall. In the operation of the LED module occurring heat can therefore be transferred to the housing wall and thus derived.
  • this can according to the invention have an opening with a closed edge for at least one head element.
  • the head element is thus guided from the front through this opening and then pushed through the opening of the wall of the housing inwardly, where it is then connected to the contact element.
  • the LED module for at least one head element has an outgoing from an edge of the LED module recess, which allows for appropriate dimensioning, the LED module laterally under the head of the head element to push.
  • the LED module can have several individual LEDs, which are also optically separated from one another.
  • the LED module has a large-area LED.
  • the LED module has a plurality of individual LEDs.
  • the LED module has a single large-area LED.
  • At least one contact element is connected to a connection pad of the busbar in SMT technology.
  • the bus bar can be inserted into the housing.
  • a groove is formed for this purpose in the housing, via which the busbar can be inserted into the housing until the busbar reaches an end position.
  • the end position can be given for example by an end stop or a latching connection to be formed in the end position.
  • the already mounted on the busbar contact elements are positioned below the openings of the housing, so that an LED module can be conveniently mounted from the outside of the lighting unit using the head elements.
  • the lighting unit with the preassembled busbar and mounted on the busbar contact elements is delivered to a customer. The customer can then even mount the LED modules requested by the customer on the lighting unit or dismantle an LED module to replace it with a new one.
  • the easy interchangeability of an LED module of the lighting unit has the particular advantage that an existing LED module can be replaced by a new, advanced LED module.
  • the invention makes it possible that the LED module is replaced by an organic LED module, ie an LED module with a so-called organic light emitting diode (OLED).
  • OLED organic light emitting diode
  • the lighting unit is modular, with a busbar defining a module.
  • a busbar for example, be designed to power eight to ten LED modules.
  • the bus bar must be dimensioned accordingly to supply the supply current for the multiple LED modules, the supply current may be in the range of a few amps.
  • the housing has at least a portion of a metallic material, which is thermally conductively connected to the LED module when the LED module is mounted on the illumination unit. This makes it possible to use the housing as a heat sink to dissipate power loss of the LED module.
  • the housing can be made entirely of a metallic material such. B. aluminum.
  • the invention relates to an LED module for mounting to an embodiment of a lighting unit according to the invention.
  • the one or more LEDs, which carries the carrier of the LED module, can be electrically connected to the carrier via per se known construction and connection technologies, in particular so-called. Bonding technologies, such. B. by SMD, flip-chip or chip-on-board techniques.
  • the LED module has an exemption, in particular a defined depth exemption, which is also referred to here as a cavity in which an LED of the LED module is implanted.
  • a defined depth exemption which is also referred to here as a cavity in which an LED of the LED module is implanted.
  • the invention relates to a method for mounting an LED module to an embodiment of a lighting unit according to the invention.
  • Embodiments of the method according to the invention are particularly advantageous since the customer can make the assembly itself as well as the disassembly, especially for the purpose of initial installation, the replacement of a defective LED module or to replace the LED module by an advanced LED module greater efficiency, especially an OLED module.
  • FIG. 1 shows a plan view of a busbar.
  • the busbar includes a busbar support 1, which is responsible for the mechanical stability of the busbar;
  • a conventional printed circuit board substrate can be used.
  • On the carrier 1 of the busbar are two printed conductors 2, which are insulated from each other. These interconnects 2 are connected to different potential.
  • the tracks are widened, with the left in FIG. 1 to be seen broadened sites with plated through holes 3 are provided. For example, each of the widened locations has a number of 4, 5 or 3 * 3 holes 3. As will be shown below, these widened locations of the conductor tracks 2 serve to connect contact elements, so-called power elements.
  • the FIG. 2 shows a plan view of an LED module 4.
  • the LED module 4 includes a flat support 5, on which in FIG. 2 three LEDs 6 are mounted.
  • the carrier 5 has the shape of an elongated rectangle, at both ends of which a hole 7 is formed in each case. In the in FIG. 2 It can not be seen that the carrier 5 is designed as a plate with parallel upper sides and lower sides.
  • the support 5 is again formed as an elongated rectangle with holes 7 in the region of its two ends.
  • the LED 6 has here but the shape of an elongated rectangle whose length is about the arrangement of the three LEDs 6 of the FIG. 2 equivalent.
  • FIG. 4 While in the embodiments according to FIG. 2 and FIG. 3 at the ends of the carrier 5 holes 7 are arranged with a closed edge shows FIG. 4 an LED module 4, at the two ends recesses 8 are present, which are open to the edge.
  • FIG. 5 shows how the individual parts are arranged to form a lighting unit.
  • a housing with a housing wall 9.
  • an LED module 4 is to be attached.
  • This LED module 4 runs in FIG. 5 with its longitudinal direction perpendicular to the plane of the drawing.
  • a through opening 11 is present.
  • the LED module 4 is arranged in the region of this opening 11.
  • a head element 12 with its shaft 13 is inserted through the hole 7 of the LED module 4 and through the opening 11 in the housing wall 9.
  • the head element 12 has a flat with respect to its shaft 13 radially projecting head 14.
  • the diameter of the shaft 13 of the head element 12 is smaller than the diameter of the hole 11 in the housing wall 9, so that there can be a clearance between the outside of the shaft 13 and the edge of the hole 11 on all sides.
  • the shaft 13 of the head element 12 is provided by the head 14 facing away from the front side with a blind hole having an internal thread.
  • the head element 12 is designed to cooperate with a contact element 15, which is also referred to as a power element.
  • This contact element 15, which consists of solid metal, points to his in FIG. 5 lower side a plurality of pins 16 on.
  • 4 contact pins 16 may be present on the contact element 15, depending on how the holes 3 in the conductor track 2 are arranged. These usually have a rectangular or square cross-section.
  • the arrangement of the contact pins 16 corresponds to the arrangement of the plated-through holes 3 in the conductor 2 on the carrier 1 of the busbar. This is so in FIG. 5 shown.
  • the contact element 15 is pressed with its contact pins 16 in the plated-through holes 3. The offset is determined by the concern of the body of the contact element 15 at the top of the conductor 2.
  • the contact element 15 has a projection 17 with an external thread. On this external thread, the head member 14 is screwed. In this case, the underside of the head 14 of the head element 12 comes to rest on the upper side of the carrier 5 of the LED module 4 and establishes an electrical connection there. The result of this process is in FIG. 6 shown.
  • the head member 12 engages with a widened head 14 at the top of the LED module 4.
  • a head element is pressed with an LED module.
  • FIG. 7 one of the FIG. 2 corresponding representation of a further LED module 4, in which for connection to a head element 12 'at both ends of the carrier 5 through holes 20 are provided, for example four such openings 20.
  • the associated head element 12' has at its the LED module 4 facing Side of the number of holes 20 corresponding number of pins 21, see FIG. 8 , For example, 4, 5 or 3 * 3 pins 21. With these pins 21, the head member 12 'is pressed into the holes 20. This is schematically in FIG. 8 shown.
  • the LED module 4 which now has at both ends in each case such a head piece 12 ', reversed and inserted with the head element 12' ahead through the opening 11 of the housing, see FIG. 9 .
  • the combination of head element 12' and contact element 15 with the Busbar 1 pressed this step is not from the intersection of the FIG. 6 different. It is of course also possible that the process of compression between the head piece 12 'and the contact element 15 on the one hand and the contact element 15 and the busbar 1 on the other hand, a different order.
  • FIG. 11 a busbar, in which there is a conductor track 2 with recesses on the upper side. With this existing on the top of conductor 2 groups of plated holes are connected. On the opposite side of the busbar 1, a conductor path is also present, which is connected to the other through-plated holes 3. As a result, more total space is available for each of the two tracks 2.
  • FIG. 12 schematically shows the arrangement of an LED module with a carrier 5 and an LED 6.
  • a head element 12 ' is used, which has on its underside a blind hole, the left in FIG. 12 indicated by dashed lines.
  • the associated contact element 15 has on its upper side a projection 17, which is adapted to the blind hole. The connection between the two parts is done by a compression.
  • the head element 12 "assigned to the other end of the carrier 5 of the LED module has a projection on its underside facing the contact element, while the upwardly directed end face of the contact element 15 has a blind hole which fits for this purpose.
  • contact elements 15 have contact pins 16 with different arrangement patterns on their undersides, which are intended for connection to the through-holes 3 of the busbar 1. This is in FIG. 12 represented by the fact that the two contact elements have a different number of contact pins.
  • FIG. 14 shows a perspective embodiment of a lighting unit according to the invention, wherein in this embodiment, both conductor tracks two are arranged on the same side of the carrier 1 of the busbar.
  • FIG. 15 shows a further embodiment, wherein at one end of the carrier 1 of the busbar, a connector 22 is located, via which the busbar can be connected to a power supply.

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Led Device Packages (AREA)
  • Fastening Of Light Sources Or Lamp Holders (AREA)
EP09165351A 2008-07-11 2009-07-13 Unité d'éclairage, module DEL et procédé Active EP2143989B1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE202008009589U DE202008009589U1 (de) 2008-07-11 2008-07-11 Beleuchtungseinheit

Publications (2)

Publication Number Publication Date
EP2143989A1 true EP2143989A1 (fr) 2010-01-13
EP2143989B1 EP2143989B1 (fr) 2011-05-18

Family

ID=40953405

Family Applications (1)

Application Number Title Priority Date Filing Date
EP09165351A Active EP2143989B1 (fr) 2008-07-11 2009-07-13 Unité d'éclairage, module DEL et procédé

Country Status (3)

Country Link
EP (1) EP2143989B1 (fr)
AT (1) ATE510166T1 (fr)
DE (1) DE202008009589U1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3348896A1 (fr) * 2017-01-16 2018-07-18 OSRAM GmbH Profil de montage, module de signalisation séparable capable d'émettre de la lumière et système d'éclairage

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102009042615B4 (de) * 2009-09-23 2015-08-27 Bjb Gmbh & Co. Kg Anschlusselement zur elektrischen Anbindung einer LED
DE102012216665B4 (de) 2012-09-18 2014-05-15 Würth Elektronik GmbH & Co. KG Beleuchtungseinheit

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20030218417A1 (en) * 2002-05-22 2003-11-27 Unity Opto Technology Co., Ltd. Light emitting diode lamp with light emitting diode module having improved heat dissipation
WO2006122392A1 (fr) * 2005-05-20 2006-11-23 Tir Systems Ltd. Module d’éclairage à corniches et système
EP1760392A1 (fr) * 2005-08-29 2007-03-07 Patent-Treuhand-Gesellschaft für elektrische Glühlampen mbH Boîtier de montage pour un dispositif d'éclairage à diodes électroluminescentes

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10350913B4 (de) 2003-10-31 2005-11-03 Osram Opto Semiconductors Gmbh Leuchtdioden-Modul und Verfahren zu dessen Herstellung
DE102005018175A1 (de) 2005-04-19 2006-10-26 Patent-Treuhand-Gesellschaft für elektrische Glühlampen mbH LED-Modul und LED-Beleuchtungseinrichtung mit mehreren LED-Modulen

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20030218417A1 (en) * 2002-05-22 2003-11-27 Unity Opto Technology Co., Ltd. Light emitting diode lamp with light emitting diode module having improved heat dissipation
WO2006122392A1 (fr) * 2005-05-20 2006-11-23 Tir Systems Ltd. Module d’éclairage à corniches et système
EP1760392A1 (fr) * 2005-08-29 2007-03-07 Patent-Treuhand-Gesellschaft für elektrische Glühlampen mbH Boîtier de montage pour un dispositif d'éclairage à diodes électroluminescentes

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3348896A1 (fr) * 2017-01-16 2018-07-18 OSRAM GmbH Profil de montage, module de signalisation séparable capable d'émettre de la lumière et système d'éclairage

Also Published As

Publication number Publication date
EP2143989B1 (fr) 2011-05-18
DE202008009589U1 (de) 2009-08-13
ATE510166T1 (de) 2011-06-15

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