WO2016020446A2 - Support de diodes électroluminescentes ainsi que lampe à del ou système d'éclairage servant à l'éclairage - Google Patents

Support de diodes électroluminescentes ainsi que lampe à del ou système d'éclairage servant à l'éclairage Download PDF

Info

Publication number
WO2016020446A2
WO2016020446A2 PCT/EP2015/068079 EP2015068079W WO2016020446A2 WO 2016020446 A2 WO2016020446 A2 WO 2016020446A2 EP 2015068079 W EP2015068079 W EP 2015068079W WO 2016020446 A2 WO2016020446 A2 WO 2016020446A2
Authority
WO
WIPO (PCT)
Prior art keywords
light
emitting diode
holder
diode holder
led
Prior art date
Application number
PCT/EP2015/068079
Other languages
German (de)
English (en)
Other versions
WO2016020446A3 (fr
Inventor
Ralph Peter Bertram
Alexander Wilm
Alfons Siedersbeck
Original Assignee
Osram Opto Semiconductors Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Osram Opto Semiconductors Gmbh filed Critical Osram Opto Semiconductors Gmbh
Publication of WO2016020446A2 publication Critical patent/WO2016020446A2/fr
Publication of WO2016020446A3 publication Critical patent/WO2016020446A3/fr

Links

Classifications

    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00Fastening of light sources or lamp holders
    • F21V19/001Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
    • F21V19/003Fastening of light source holders, e.g. of circuit boards or substrates holding light sources
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00Fastening of light sources or lamp holders
    • F21V19/001Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
    • F21V19/003Fastening of light source holders, e.g. of circuit boards or substrates holding light sources
    • F21V19/0055Fastening of light source holders, e.g. of circuit boards or substrates holding light sources by screwing
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21YINDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00Light-generating elements of semiconductor light sources
    • F21Y2115/10Light-emitting diodes [LED]

Definitions

  • the invention relates to a light-emitting diode holder, in particular a chip-on-board light-emitting diode holder, for an LED lamp or light. Furthermore, the invention relates to a method for producing a light-emitting diode holder, in particular a chip-on-board light-emitting diode holder, for an LED lamp or light. Furthermore, the invention relates to a method for mounting an LED lighting device for an LED lamp or luminaire, as well as an LED lamp or luminaire for ei ⁇ ne lighting, with at least one inventive
  • Light-emitting diode holder for at least one light-emitting diode.
  • LED Light-emitting diode; light- ⁇ -emitting diode, light emitting diode
  • LED lamps have a variety of applications such.
  • B. rie on / in houses / buildings, for the automotive industry, the hospitality industry, for office buildings, on roads ⁇ outside and into cities / towns, in retail, indus-, exhibitions, sports facilities, on / in supermarkets, for industrial applications, for studio, stage and TV, for airfield lighting, for microlithography, for light advertising, for medical applications, infrared radiant heaters, for effect lighting, for projection systems, for animal care, for private applications etc.
  • An electrical contact of the light emitting diode with an electrical line must be made by means of a cohesive soldering or a mechanical clamping connection on an upper side of the light emitting diode.
  • Such a holder consists of an injection-molded part made of plastic with inserted metal springs for electrical contact with the
  • Such an injection-molded part is comparatively expensive due to an injection mold which is restricted in its cycle duration and due to the metal springs to be inserted into the injection mold. Further, the insertion of the relatively small metal springs in the comparatively large ⁇ SSE injection mold is associated with uncertainties, so that an increased Committee results in the production of such light-holder made of plastic. It is an object of the invention to provide an improved light-holder, in particular an improved chip-on-board LEDs Holder, for an LED lamp or light suits ⁇ ben. Furthermore, it is an object of the invention to provide a method for producing a light-emitting diode holder and a method for mounting an LED lighting device with the light-emitting diode holder.
  • a cost-effective light-emitting diode holder is provided which, in particular, should not be producible by a comparatively expensive injection molding process. Furthermore, a design freedom of the light-emitting diode holder in Be ⁇ train to a realization of a conductor track and / or a
  • the object of the invention is by means of a light-emitting diode holder, in particular a chip-on-board light-emitting diode holder, for an LED lamp or luminaire, according to claim 1; by a method for producing a light-emitting diode holder, in particular a chip-on-board LED holder, for an LED lamp or luminaire, according to claim 11; by a method for mounting an LED lighting device for an LED lamp or luminaire, according to claim 14; and by means of a LED-lamp or luminaire for lighting, with light-emitting diodes we ⁇ iquess a holder for at least one
  • the light-emitting diode holder has an electrically insulating laminated material, in particular a printed circuit board laminate.
  • the light-emitting diode holder is preferably constructed mainly or essentially of this material or printed circuit board or printed circuit board laminate.
  • a material or Pla ⁇ tinenlaminat is z.
  • a platinum core material such as a laminable composite material.
  • the material may comprise an epoxy resin, a glass and / or a glass fiber fabric.
  • Such a material is z.
  • the light-emitting diode holder may include at least two areas umfas ⁇ sen, wherein the two areas are preferably designed such that the first area serves a free holding a light-emitting diode of an LED light bulb and the second region a Fi ⁇ Xieren a substrate of the LED light source.
  • the two areas are, apart from a possibly envisaged ⁇ nen electrical trace and / or a mechanical, electrical, electronic and / or optical component or a module, etc., from the above electrically insulating material.
  • the two regions are preferably arranged one above another, where ⁇ has a through hole for passage of an originating from the light-emitting diode light on ⁇ at the first area, and / or the second area has a through-hole for housing the substrate of the LED-lighting means on ⁇ .
  • the through-passage recess of the first region and the through-passage recess of the second region can form a passage recess extending completely through the light-emitting diode holder, in and on which the LED lighting device can be accommodated in sections.
  • the through-passage of the first region may be formed in such a way that an outer boundary of the light-emitting diode of the LED light-emitting device can essentially be surrounded in a form-fitting manner.
  • a preferably annular spacing may be provided between the outer boundary of the light-emitting diode and the through-passage of the first region.
  • an inner surface of the through-hole of the first region may be formed inclined. A frontal boundary of this is preferred
  • Through-passage (ie inside and / or outside) of the first region at least partially arcuate, in particular substantially oval, elliptical or circular, formed.
  • the through-hole of the second region may be formed such that in the sub ⁇ strat of the LED-lighting means is at least partially form-locking ⁇ receivable.
  • the second region may be formed so as to protrude or protrudes at a accommodated in the recess fürgangsaus ⁇ substrate, the substrate away from the ers ⁇ th region from the second region of the LED holder.
  • Preferred is a frontal boundary of the through hole (that is inside and / or outside) at least in sections straight ⁇ linig of the second region, in particular substantially regular polygonal, hexagonally, rectangular or square.
  • Both the first region and the second region may be formed from laminated layers.
  • the first region and the second region of the LED holder can be laminate layers.
  • the two regions are arranged substantially coaxially one above the other.
  • the through-hole of the first region and the through-hole of the second region do not lead fully ⁇ constantly by the light-holder therethrough. This is done only by means of both Mandaringangsaus traditions.
  • the passage recesses of the first and second regions are preferably arranged coaxially with one another.
  • the light-emitting diode holder may have an electrical contact or an attachment for an electrical line, by means of which or which an electrical contact of the LED light source is electrically contactable.
  • the first region on the inside of the light-emitting diode holder has an electrical contact or a strand of an electrical line which can be electrically contacted by an electrical contact of the LED light source.
  • the light-emitting diode holder may be formed as a circuit board or printed circuit board with a conductor track.
  • the light-emitting diode holder may have a mechanical, an electrical, an electronic and / or an optical component.
  • the light-emitting diode holder may have a fastening device by means of which it can be fastened to / on a mounting surface.
  • the Fixed To ⁇ restriction device is a through hole, especially a bore, or a hole through which and through which the light-holder by means of a fastening means, such. As a screw, on / on the mounting surface fastened ⁇ bar.
  • the electrical contact may be formed as a solder point or a ped.
  • the mounting base may be formed as a heat sink or a body that is (well) thermally conductive connected to a heat sink.
  • the light-emitting diode holder in particular the second region of the light-emitting diode holder, may have a coding for the LED light source.
  • a fastener z As a clip, a clip, etc. are applied.
  • the light-emitting diode holder is formed from an electrically insulating, laminated or laminatable material, in particular a printed circuit board laminate.
  • the light-emitting diode holder is preferably constructed mainly or essentially of this material or board or printed circuit board laminate (CEM, FR4, etc.).
  • an electrical trace on / in the holder light-emitting diode or a portion of the light-holder can be provided or formed, where reasonable ⁇ a method for inter-layer connection at preferably turns is. Another method is of course applicable. As a result, printed conductors or complex circuits can be realized on / in the light-emitting diode holder.
  • At least two regions constituting the light emitting diode retainer which are formed from the laminated or laminatable material, in particular the platinum laminate of ⁇ .
  • the light-emitting diode holder may be formed as a light-emitting diode holder beschriener above.
  • a conductor track can extend on or in the light-emitting diode holder, it being particularly advantageous if a conductor track extends through the light-emitting diode holder between the two regions.
  • an LED lighting means by means of a light-emitting diode holder, in particular a chip-on-board light-emitting diode holder, mounted on a mounting surface.
  • the light-emitting diode holder comprises two superimposed regions, by means of which a substrate of the LED Illuminant is attached to the mounting surface, wherein the substrate protrudes away from the first region of the second region of the light-emitting diode holder.
  • the mounting surface may be formed as a heat sink or a body that is thermally conductively connected to a heat sink.
  • the substrate is preferably regularly polygonal, hexagonal, rectangular or square.
  • the LED lighting means may have a coding for the light-emitting diode holder, in particular its second region.
  • the LED lamp or luminaire has a light-emitting diode holder. Furthermore, the LED lamp or luminaire may have an LED lighting device.
  • Fig. 1 in a perspective view obliquely from above a first
  • Fig. 2 is an analogous to Fig. 1 situation, however, in one
  • FIG. 4 shows the light-emitting diode holder from FIG. 3, wherein the light-emitting diode holder is cut in a region of an electrical contact contacted by an electrical line, FIG.
  • Fig. 5 is a perspective view obliquely from above of a drit ⁇ th embodiment of the LED holder, and to a LED light source and two fastening means for the light-holder, and
  • Fig. 6 is a perspective view obliquely from above of a set ready ⁇ a LED lighting device, wherein the light-emitting diode holder of Fig. 5 holds the LED lamps Fig. 5 on an exemplary mounting base.
  • a variant cf., FIGS. 1 to 6
  • FIGS. 1 to 6 embodiments of a variant of a light-emitting diode holder 10 for a substantially flat-extending LED light-emitting means 20 in chip-on-board technology with a flat and essentially circular light-emitting diode 210 are shown explained in more detail.
  • the OF INVENTION ⁇ dung is not limited to such a variant and / or these embodiments, but is more basic nature, so that it can be applied to all LED lamps according to the invention.
  • the invention is further illustrated and described in detail by preferred embodiments, the invention is not limited by these disclosed examples.
  • Other variations Kgs ⁇ NEN be derived therefrom by the skilled artisan without departing from the scope of the invention.
  • FIGS. Show essentially analogous embodiments of the open as a sort of lid 10 designed light emitting diode holder 10.
  • the LED holder 10 comprises at least two superimposed, preferably materially einstü- one piece interconnected or integrally formed preparation ⁇ surface 110, 120.
  • a shape of the light-emitting diode holder 10 is prin ⁇ zipiell arbitrarily.
  • the light-emitting diode holder 10 has, in a first approximation, a flat cuboid (FIGS. 1 to 4) or a flat cylindrical (FIGS. 5 and 6) appearance.
  • the light-emitting diode holder 10 or its at least two regions 110, 120 are formed of a plate or Lei ⁇ terplattenmaterial, preferably from a particular lami ⁇ ned or laminatable composite material such as CEM, FR4, etc.
  • the light-emitting diode holder 10 serves, on the one hand, to fix the LED illuminant 20 on a mounting base 30 (see FIG. B. a heat sink 30 or a body 30 which is preferably connected with good heat conduction with a heat sink.
  • a mounted on a mounting base 30 by means of the Leuchtdi ⁇ oden holder 10 (and electrically connected) LED light source 20 (see FIG.. 6) is present as (a ⁇ set ready) LED light-emitting device 2, respectively.
  • the assembly Underground 30 may form a portion of an LED lamp 1 or a lamp 1.
  • the light-emitting diode 210 is preferably designed as a chip-on-board light-emitting diode 210.
  • a first region 110 of the light-emitting diode holder 10 has, in its layers or as a layer, a preferably central through-passage recess 112 or recess 112 for a passage of the light originating from the light-emitting diode 210.
  • the through-hole 112 and recess 112 is in an end view (ie, for. Example, with reference. To Figures 3 or 4 when viewed from above or below) preferably at least partially arcuate and, if necessary, in sections straight lined ⁇ forms.
  • a shape of an oval, an ellipse or a circle is preferred (compare, for example, FIGS. 1 and 2 and 5 and 6).
  • a second region 120 of the light-emitting diode holder 10 has in its layers or as a layer a preferably central through-passage 122 or recess 122 for receiving the LED light-emitting means 20 or its substrate 220.
  • the through-passage 122 or recess 122 is preferably formed in a front view (that is, again, for example, with reference to FIGS. 3 or 4, viewed from above or below), at least in sections in a straight line and, if necessary, in sections in a bogen- shaped manner .
  • Preferred is a shape of a (regular) polygon, a hexagon, a rectangle or a square (see, for example, Figures 1 and 5).
  • Hexagons preferably regular
  • rectangles, squares and possibly equilateral triangles are suitable as a basic form of the substrate 220 or of the LED illuminant 20.
  • an area, apart from the edges of the area, which are in principle arbitrarily shaped, is in the Essentially without gaps between the individual substrates 220 and LED bulbs 20 pavable or parquet.
  • the shape of an oval, an ellipse or a circle see FIGS. For a spotlight, for example.
  • the passage recess 112 of the first region 110 is formed smaller in at least one diameter dimension than the passage recess 122 of the second region 120. This preferably relates to all diameter dimensions of the through-passage 112 of the first region 110.
  • an edge 114 or holding edge 114 forms on the first region 110 on the inside of the light-emitting diode holder 10 (see FIG a hold of the LED bulb 20 on / on the mounting surface 30 is responsible ⁇ word.
  • the regions 110, 120 and / or the passage recesses 112, 122 have two or four axes of symmetry in one end view in common. It is of course possible to arrange the regions 110, 120 and / or the passage recesses 112, 122 offset from one another.
  • the substrate 220 of the LED lamp 20 may be used as a circuit board 220 or board 220 z. B. be formed with a ceramic or a metal core.
  • An electrical contact of the LED bulb 20 may, for. B. be done as follows.
  • the LED illuminant 20 has an electrical contact 230 (see FIGS. 1 and 5) on its substrate 220, preferably on the side on which its light-emitting diode 210 is also provided.
  • the electrical contact 230 may be formed, for example, as a ped, a solder pad, a solder point, etc.
  • the electrical contact 230 of the LED luminous means 20 is Within the light-emitting diode holder 10 from the light-emitting diode holder 10 or a strand 410 of an electrical line 40 or an electrical cable 40 electrically contacted.
  • the light-emitting diode holder 10 preferably has a planar electrical contact 130, in particular a soldering point 130, a soldering pad 130 or a pad 130, in a corner section inside the first area 110.
  • the strand 410 of the electrical line 40 can be fixed, in particular solderable.
  • the second electrical Kon ⁇ clock 130 is preferably arranged at a corner portion of the first dia gonal ⁇ second corner portion analogous provided (see. Fig. 1). Instead of a respective electrical contact 130, only the electrical line 40 may be provided.
  • the first region 110 and / or the second region 120 may have a recess 124 or a passage 124 for the electrical line 40.
  • the recess 124 or feed-through 124 also makes it possible to provide the line 40 in an interior of the light-emitting diode holder 10, where, if necessary, the strand 410 of the line 40 is provided on the electrical contact 130.
  • the line 40 is preferably supplied laterally (cf., FIGS. 1, 4, 5 and 6). It is also possible to supply the line 40 additionally or alternatively from below or above. 1
  • Light-emitting diode holder 10 electrical contact springs providable, which may be supplied via a conductor on / in the light-emitting diode holder 10 and / or an electrical line on / in the light-emitting diode holder 10 with electrical voltage. Furthermore, instead of z. B. pads 130 on / in the light-emitting diode holder 10 massive, possibly deformable electrical contacts are provided, which z. B. together with a corresponding positioning of a fastening device (see below) of the LED holder 10, the electrical contacting of the LED bulb 20 allows.
  • the light-emitting diode holder 10 has a fastening device 150 for fastening the light-emitting diode holder 10 on / on the mounting base 30.
  • the Befest Trentsein ⁇ direction 150 as a through-hole 150, z. B. formed as a hole 150 or a bore 150.
  • the through-hole 150 drilled (bore 150) or z. B. during lamination (hole 150) are introduced.
  • a fastening device 150 may be provided or formed as a latching hook or as a clip on the light-emitting diode holder 10.
  • the light-emitting diode holder 10 is firmly ver ⁇ bindable by means of or via its fastening device 150 with the mounting base 30.
  • the fastening device 150 is a through-hole 150
  • the fastening means 150 is preferably a screw 150 (compare FIGS. 1, 2, 5, and 6). Instead of Be ⁇ fastening device 150 and z.
  • the fastening means 150 of the light emitting diode holder 10 may be formed as a locking device for another Fixed To ⁇ restriction means 50th This locking device is z. B.
  • the fastening 50 can be designed as a latching hook or a clip with egg ⁇ ner complementary latching shoulder.
  • the locking device z.
  • An electrically insulating laminated or laminatable material is used for the light-emitting diode holder 10.
  • Some of the laminated layers of the LED holder 10 have recesses on at least a partial area.
  • sections of circular recesses (through-passage 112 in the first region 110) preferably guarantee an exit of the light which originates from the light-emitting diode 210 of the LED light-emitting means 20.
  • the attachment of the light-emitting diode holder 10 is preferably carried out by means of screws 50 and suitable holes
  • the square training saving 122 has in the laminated layers of the LED holder 10 has a slightly smaller depth than a thickness of the substrate 220 of the LED-lighting means 20, so that a good thermal by a resulting when mounting the light emitting diode holder 10 mechanical ⁇ thermal power Contact with the mounting base 30 is created.
  • the manufacture of printed circuit boards or printed circuit boards is a highly standardized method, which in a comparison, for. B. with an injection molding process, extremely low cost in both small and high volumes is feasible.
  • a lamination of several layers with recesses, holes, etc. in individual layers of the LED holder 10 is possible by default and is z. B. used for producing multi-layer boards.
  • the LED holder 10 can be produced significantly cheaper compared to a plastic part.
  • Herbei solder pads 130 for electrical contacting or for fixing strands 410 can be realized easily.
  • a loading with a plug or a socket, z. B. in the SMD method (SMD: surface-mounted device, devisflä ⁇ chenmontharis component), or other mechanical, electrical, electronic and / or optical component, eg. B. for light control, emergency shutdown in case of overheating o. ⁇ ., Is possible.
  • This can be recessed in recesses of the LED holder 10.
  • essentially all standard methods for inter-layer connection of printed conductors can be used, as a result of which complex circuits can also be realized on / in the light-emitting diode holder 10.
  • Possible circuits are z.
  • a thermal fuse but also a complex circuit such as a DC-DC converter (DC: direct current, DC) to supply with z. B. 24 V DC and conversion to constant current, is relatively easy to implement.
  • DC-DC converter direct current, DC
  • fastening means in particular screw, clip, Klam ⁇ mer, locking device

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Fastening Of Light Sources Or Lamp Holders (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)

Abstract

L'invention concerne un support de diodes électroluminescentes (10), en particulier un support de diodes électroluminescentes (10) à puce embarquée, pour une lampe à DEL (1) ou un système d'éclairage (1). Le support de diodes électroluminescentes (10) comporte un matériau stratifié à isolation électrique, en particulier un stratifié de platines. L'invention concerne en outre un procédé servant à fabriquer un support de diodes électroluminescentes (10), en particulier un support de diodes électroluminescentes (10) à puce embarquée, pour une lampe à DEL ou un système d'éclairage. Le support de diodes électroluminescentes (10) est réalisé à partir d'un matériau à isolation électrique, stratifié ou pouvant être stratifié, en particulier à partir d'un stratifié de platines. L'invention concerne en outre un procédé servant à monter un dispositif d'éclairage à DEL pour une lampe à DEL ou un système d'éclairage. Un moyen d'éclairage à DEL (20) est fixé sur une structure de montage (30) au moyen d'un support de diodes électroluminescentes (10), en particulier au moyen d'un support de diodes électroluminescentes (10) à puce embarquée. Le support de diodes électroluminescentes (10) comprend deux zones (110, 120) superposées, au moyen desquelles un substrat (220) du moyen d'éclairage à DEL (20) est fixé sur la structure de montage (30), le substrat (220) faisant saillie, de part et d'autre de la première zone (110), de la deuxième zone (120).
PCT/EP2015/068079 2014-08-07 2015-08-05 Support de diodes électroluminescentes ainsi que lampe à del ou système d'éclairage servant à l'éclairage WO2016020446A2 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102014111278.4 2014-08-07
DE102014111278.4A DE102014111278A1 (de) 2014-08-07 2014-08-07 Leuchtdioden-Halter sowie LED-Lampe oder Leuchte zur Beleuchtung

Publications (2)

Publication Number Publication Date
WO2016020446A2 true WO2016020446A2 (fr) 2016-02-11
WO2016020446A3 WO2016020446A3 (fr) 2016-04-28

Family

ID=53938313

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2015/068079 WO2016020446A2 (fr) 2014-08-07 2015-08-05 Support de diodes électroluminescentes ainsi que lampe à del ou système d'éclairage servant à l'éclairage

Country Status (2)

Country Link
DE (1) DE102014111278A1 (fr)
WO (1) WO2016020446A2 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10670250B2 (en) 2017-12-22 2020-06-02 Lumileds Llc Chip-on-board modular lighting system and method of manufacture

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102022111490A1 (de) 2022-05-09 2023-11-09 HELLA GmbH & Co. KGaA Lichtmodul für eine Kraftfahrzeugbeleuchtungseinrichtung und Verfahren zur Herstellung eines Lichtmoduls

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7211835B2 (en) * 2003-07-09 2007-05-01 Nichia Corporation Light emitting device, method of manufacturing the same and lighting equipment
JP4753904B2 (ja) * 2007-03-15 2011-08-24 シャープ株式会社 発光装置
DE102008021435A1 (de) * 2008-04-29 2009-11-19 Schott Ag Gehäuse für LEDs mit hoher Leistung
US9385285B2 (en) * 2009-09-17 2016-07-05 Koninklijke Philips N.V. LED module with high index lens
US8602593B2 (en) * 2009-10-15 2013-12-10 Cree, Inc. Lamp assemblies and methods of making the same
DE102012101818B4 (de) * 2012-03-05 2018-11-08 Osram Opto Semiconductors Gmbh Optoelektronisches Modul mit einem Kodierelement in einer Aussparung, Beleuchtungseinrichtung mit diesem Modul und Verfahren zu seiner Herstellung
JP5979494B2 (ja) * 2012-12-20 2016-08-24 パナソニックIpマネジメント株式会社 照明装置及び発光モジュール

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10670250B2 (en) 2017-12-22 2020-06-02 Lumileds Llc Chip-on-board modular lighting system and method of manufacture
US11092321B2 (en) 2017-12-22 2021-08-17 Lumileds Llc Chip-on-board modular lighting system and method of manufacture

Also Published As

Publication number Publication date
DE102014111278A1 (de) 2016-02-11
WO2016020446A3 (fr) 2016-04-28

Similar Documents

Publication Publication Date Title
DE102010039120A1 (de) Leiterplatte mit mindestens einer Halbleiterlichtquelle, Auflage für die Leiterplatte, System aus der Leiterplatte und der Auflage sowie Verfahren zum Befestigen der Leiterplatte an der Auflage
EP2198196B1 (fr) Lampe
DE102009001405A1 (de) Montageanordnung eines Leuchtkörpers
DE102008016458A1 (de) Leiterplatte
DE112008001425T5 (de) Verbindungsvorrichtung, die eine Wärmesenke sowie elektrische Verbindungen zwischen einem Wärme erzeugenden Bauelement und einer Stromversorgungsquelle bildet
DE202010006197U1 (de) LED-Lampe
DE112014004403T5 (de) Flexible Leiterplatte für Elektronikanwendungen, diese enthaltende Lichtquelle, sowie ein Verfahren zurHerstellung
DE112011103188B4 (de) Einrichtung zur Wärmeisolation für eine LED-Lampe, LED Lampe damit und Herstellungsverfahren dafür sowie Modulare LED Lampe
DE202010009679U1 (de) Eine LED-Beleuchtungseinrichtung
EP2694875A2 (fr) Procédé de fixation et de mise en contact d'une lampe et/ou d'un module de luminaire ainsi que luminaire
EP2459927A1 (fr) Dispositif d'éclairage et procédé pour monter un dispositif d'éclairage
EP2732209B1 (fr) Moyen d'éclairage comportant au moins une diode électroluminescente organique
DE112015004420T5 (de) Led-glühlampe
WO2009153031A1 (fr) Elément d’éclairage à fixation plastique
WO2010054924A1 (fr) Dispositif d'éclairage avec deux cartes de circuits
WO2016020446A2 (fr) Support de diodes électroluminescentes ainsi que lampe à del ou système d'éclairage servant à l'éclairage
EP1467140B1 (fr) Dispositif de signalisation
DE202010008943U1 (de) Ein Leuchtkörper und Beleuchtungsvorrichtung
EP2143989B1 (fr) Unité d'éclairage, module DEL et procédé
DE102013206728A1 (de) Leuchtsystem
DE102012210196A1 (de) Lichtsystem
AT518330A2 (de) Leuchte
DE102014202761A1 (de) Beleuchtungseinheit mit einer Mehrzahl LEDs
DE102012103198B4 (de) Trägereinrichtung für ein Leuchtmodul und Verfahren zu deren Herstellung
EP2206150B1 (fr) Corps modulaire de diode del pret a raccorder

Legal Events

Date Code Title Description
NENP Non-entry into the national phase in:

Ref country code: DE

121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 15753642

Country of ref document: EP

Kind code of ref document: A2

122 Ep: pct application non-entry in european phase

Ref document number: 15753642

Country of ref document: EP

Kind code of ref document: A2