WO2016074378A1 - 顶发射白光oled器件及其制备方法、显示装置 - Google Patents
顶发射白光oled器件及其制备方法、显示装置 Download PDFInfo
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 6
- 239000010410 layer Substances 0.000 claims abstract description 167
- 239000012044 organic layer Substances 0.000 claims abstract description 67
- 239000000758 substrate Substances 0.000 claims abstract description 43
- 239000011347 resin Substances 0.000 claims description 58
- 229920005989 resin Polymers 0.000 claims description 58
- 238000000034 method Methods 0.000 claims description 21
- 230000000737 periodic effect Effects 0.000 claims description 10
- 230000003287 optical effect Effects 0.000 claims description 7
- 239000011248 coating agent Substances 0.000 claims description 6
- 238000000576 coating method Methods 0.000 claims description 6
- 239000011159 matrix material Substances 0.000 claims description 6
- 238000007639 printing Methods 0.000 claims description 6
- 239000002243 precursor Substances 0.000 claims description 4
- 239000002904 solvent Substances 0.000 claims description 4
- 239000004642 Polyimide Substances 0.000 claims description 3
- 238000004132 cross linking Methods 0.000 claims description 3
- 229920001721 polyimide Polymers 0.000 claims description 3
- 238000006116 polymerization reaction Methods 0.000 claims description 3
- 238000002360 preparation method Methods 0.000 claims description 3
- 238000011161 development Methods 0.000 claims description 2
- 238000010586 diagram Methods 0.000 description 12
- 230000000694 effects Effects 0.000 description 11
- 230000008569 process Effects 0.000 description 7
- 238000002347 injection Methods 0.000 description 6
- 239000007924 injection Substances 0.000 description 6
- 238000005516 engineering process Methods 0.000 description 5
- 230000000903 blocking effect Effects 0.000 description 4
- 238000000151 deposition Methods 0.000 description 4
- 239000002346 layers by function Substances 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 239000000956 alloy Substances 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000003086 colorant Substances 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 230000008020 evaporation Effects 0.000 description 2
- 238000001704 evaporation Methods 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 230000005525 hole transport Effects 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- 238000001228 spectrum Methods 0.000 description 2
- 238000004528 spin coating Methods 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000007772 electrode material Substances 0.000 description 1
- 238000001194 electroluminescence spectrum Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000012827 research and development Methods 0.000 description 1
- 230000004044 response Effects 0.000 description 1
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- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/10—OLEDs or polymer light-emitting diodes [PLED]
- H10K50/11—OLEDs or polymer light-emitting diodes [PLED] characterised by the electroluminescent [EL] layers
- H10K50/125—OLEDs or polymer light-emitting diodes [PLED] characterised by the electroluminescent [EL] layers specially adapted for multicolour light emission, e.g. for emitting white light
- H10K50/13—OLEDs or polymer light-emitting diodes [PLED] characterised by the electroluminescent [EL] layers specially adapted for multicolour light emission, e.g. for emitting white light comprising stacked EL layers within one EL unit
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- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/805—Electrodes
- H10K59/8051—Anodes
- H10K59/80515—Anodes characterised by their shape
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- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
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- H10K50/00—Organic light-emitting devices
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- H10K50/82—Cathodes
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- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/85—Arrangements for extracting light from the devices
- H10K50/852—Arrangements for extracting light from the devices comprising a resonant cavity structure, e.g. Bragg reflector pair
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- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/875—Arrangements for extracting light from the devices
- H10K59/876—Arrangements for extracting light from the devices comprising a resonant cavity structure, e.g. Bragg reflector pair
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- H10K2102/301—Details of OLEDs
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- H10K2102/3023—Direction of light emission
- H10K2102/3026—Top emission
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- H10K2102/301—Details of OLEDs
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Definitions
- the present disclosure relates to the field of display technologies of organic light-emitting devices (OLEDs), and more particularly to a top-emitting white light OLED device, a method for fabricating the same, and a display device.
- OLEDs organic light-emitting devices
- OLED is called the third generation of fantasy display technology because of its active illumination, good temperature characteristics, low power consumption, fast response, flexibility, ultra-thin and low cost.
- OLED flat panel display technology is tending to become more mature in mass production technology and high-speed growth in market demand.
- OLEDs are mainly classified into two types according to the light-emitting direction, namely, a bottom-emitting OLED and a top-emitting OLED.
- the bottom-emitting OLED refers to an OLED that emits light from the direction of the substrate
- the top-emitting OLED refers to an OLED that emits light from the top direction of the device.
- the top-emitting OLED can effectively improve the aperture ratio of the display panel due to the influence of the substrate, and expand the design of the TFT circuit on the substrate, enriching the selection of the electrode material, and facilitating the integration of the device and the TFT circuit.
- top-emitting OLEDs have the advantages of improving device efficiency, narrowing the spectrum, and improving color purity, they tend to have a strong microcavity effect.
- the microcavity effect changes the electroluminescence spectrum of the OLED with the observation angle, and the efficiency decreases significantly at a large viewing angle. That is, the microcavity effect causes the observation angle dependence of the OLED.
- the present disclosure provides a top-emitting white light OLED device, a preparation method thereof, and a display device, which solve the problem that the conventional top-emitting white light OLED device has a lightening effect as the viewing angle becomes larger due to the microcavity effect.
- a top-emitting white light OLED device including:
- each of the pixel units including a first electrode layer, an organic layer and a second electrode layer disposed in a direction away from the substrate, the organic in each of the pixel units
- the layers have a gradual cavity length that corresponds to a range of wavelengths from red to blue, respectively.
- the first electrode layer has a periodic undulating structure toward the interface of the organic layer.
- the periodic relief structure is a lattice structure
- the lattice structure includes a plurality of continuously disposed bumps, or includes a plurality of spaced apart bumps and pits.
- a height difference between valley peaks of the bumps is within a difference range of optical cavity lengths corresponding to changes in visible wavelengths, and a length between intervals of peaks or troughs of the bumps is less than or equal to the pixel unit The width.
- the height difference between the valley peaks of the bumps is in the range of 20-150 nanometers, and the interval between the peaks or troughs of the bumps is in the range of 1-10 micrometers.
- the bump is a hemispherical or hemispherical bump
- the pit is a hemispherical or hemispherical pit.
- the side shape thereof is in the form of a sinusoidal wave.
- the top-emitting white light OLED device further includes: a resin layer under the first electrode layer, the resin layer having the same interface as the first electrode layer and having the same interface as the first electrode layer Periodically undulating structure.
- the resin layer is made of polyimide.
- the organic layer at least partially or completely fills in a periodic relief structure of the first electrode layer.
- the first electrode layer is a reflective electrode
- the second electrode layer is a translucent semi-reflective electrode
- the present disclosure also provides a method for fabricating a top-emitting white light OLED device, comprising the steps of forming a plurality of pixel units on a substrate, wherein each of the pixel units includes a first electrode layer in a direction away from the substrate, The organic layer and the second electrode layer, the organic layer in each of the pixel units has a gradual cavity length, and the gradual cavity lengths respectively correspond to a wavelength range from red light to blue light.
- the method specifically includes:
- a resin layer on the substrate Forming a resin layer on the substrate, the surface of the resin layer being a lattice structure, and the lattice structure package a plurality of consecutively disposed bumps or a plurality of spaced apart bumps and pits;
- first electrode layer Forming a first electrode layer on the resin layer, the surface of the first electrode layer being the same lattice structure as the resin layer;
- the organic layer capable of filling at least partially or completely the undulating surface of the first electrode layer
- a second electrode layer is formed on the organic layer.
- the bump is a hemispherical or hemispherical structure, and the peak height difference of the bump is between 20 and 150 nanometers, and the dot spacing is 1-10. Micron.
- the step of forming a resin layer on the substrate comprises:
- the step of forming a resin layer on the substrate comprises:
- the resin film is subjected to exposure development by a mask mask to form a resin layer having a lattice structure.
- the present disclosure also provides a display device comprising the above-described top emission white light OLED device.
- an organic layer in a pixel unit has a gradual cavity length, and the gradual cavity length corresponds to a wavelength range from red light to blue light, so that different positions of the organic layer correspond to different microcavity enhancement cavity lengths, Thereby the pixel unit can be enhanced in white light emission.
- FIG. 1 is a schematic structural view of a conventional top-emitting white OLED device
- FIG. 2 is a schematic structural view of a top-emitting white light OLED device according to Embodiment 1 of the present disclosure
- FIG. 3 is a schematic diagram of an enhanced light-emitting principle of the top-emitting white OLED device of FIG. 2;
- FIG. 4 is a schematic structural diagram of a top-emitting white light OLED device according to Embodiment 2 of the present disclosure
- Figure 5 is a plan view of the top of the resin layer of the embodiment of the present disclosure.
- Figure 6 is a cross-sectional view showing a resin layer of an embodiment of the present disclosure.
- FIG. 7 is a schematic diagram of an enhanced light-emitting principle of the top-emitting white OLED device of FIG. 4;
- FIG. 8 is a schematic structural diagram of a top-emitting white light OLED device according to Embodiment 3 of the present disclosure.
- FIG. 9 is a schematic structural diagram of a top-emitting white OLED device according to Embodiment 4 of the present disclosure.
- FIG. 1 is a schematic structural diagram of a conventional top-emitting white OLED device including: a glass substrate 101, a TFT functional layer and a planarization layer 102, a first electrode layer 103, an organic layer 104, and a second The electrode layer 105, and the pixel defining layer 106.
- the direction indicated by the arrow is the light outgoing direction.
- the cavity length of the organic layer 104 in one pixel unit is the same at different positions. Due to the microcavity effect, only one optimal wavelength of visible light is enhanced, while other wavelengths of visible light are visible. It is filtered out, which is the reason for the decrease in light intensity when a large viewing angle is obtained.
- the embodiment of the present disclosure provides a top-emitting white light OLED device, including a plurality of pixel units on the substrate, each of which The pixel unit includes a first electrode layer, an organic layer and a second electrode layer disposed in sequence away from the substrate, and the organic layer in each of the pixel units has a gradual cavity length (ie, thickness)
- the grading cavity lengths respectively correspond to the wavelength range from red light to blue light, so that the corresponding white light of the pixel unit is enhanced.
- the organic layer in one pixel unit has a gradual cavity length
- the gradual cavity lengths respectively correspond to the wavelength range from red light to blue light, so that different positions of the organic layer correspond to different microcavity enhancement cavity lengths,
- the pixel unit can be enhanced in white light emission.
- the first electrode layer is a bottom electrode, typically as an anode
- the second electrode layer is a top electrode, typically as a cathode.
- the first electrode layer is a reflective electrode, and the material thereof may be one of gold, silver, aluminum, or an alloy thereof.
- the second electrode layer is a translucent and semi-reflective electrode which may be made of gold, silver, or an alloy thereof.
- the top-emitting white light OLED device of the embodiments of the present disclosure may be of various structures. An example will be described below.
- FIG. 2 is a schematic structural diagram of a top-emitting white light OLED device according to Embodiment 1 of the present disclosure.
- the top-emitting white light OLED device includes a substrate 200, a first electrode layer 201 formed on the substrate 200, an organic layer 202 over the first electrode layer 201, and the organic layer 202.
- the periodic relief structure is a lattice structure, and the lattice structure includes a plurality of continuously arranged bumps 2011.
- the substrate 200 may include a base substrate, a TFT functional layer, and a planarization layer.
- Figure 2 shows only a portion of one pixel unit.
- FIG. 3 is a schematic diagram of the enhanced light-emitting principle of the top-emitting white OLED device of FIG.
- the thickness of the organic layer 202 at different positions in one pixel unit is different, since the wavelength of the red visible light is about 630-780 nm, and the wavelength of the blue visible light is about 420-470 nm, so the red visible light corresponds to
- the organic layer portion 2021 has the longest cavity length, and the organic visible portion 2023 corresponding to the blue visible light has the shortest cavity length.
- 2022 is an organic layer portion corresponding to visible light of other colors.
- the height difference a1 between the valley peaks of the bumps 2011 is within a difference range of the optical cavity length corresponding to the visible wavelength variation range, and the interval length b1 between the peaks (or troughs) of the bumps 2011 (ie, the fluctuation period of the peak) is less than or equal to the width of the pixel unit.
- the height difference between the valley peaks of the bumps 2011 is in the range of 20-150 nanometers, and the interval length between the peaks (or troughs) of the bumps 2011 is 1- Within the 10 micron range.
- the organic layer 202 may include a multilayer structure including, for example, a hole injection layer (HIL), a hole transport layer, a light emitting layer, a charge generating layer, a connecting layer, an electron transport layer, and an electron injecting layer. a plurality of layers in a hole blocking layer, an electron blocking layer, and the like. Wherein at least one of the organic layers 202 (such as a hole injection layer) has a wide thickness adjustment tolerance to at least partially or completely fill the undulating interface of the first electrode layer such that each pixel The organic layer within the cell has a gradual cavity length.
- HIL hole injection layer
- the bumps 2011 in the embodiment of the present disclosure are hemispherical or hemispherical bumps.
- the bumps 2011 may also be bumps of other shapes.
- the thickness (cavity length) of the organic layer 104 corresponding to the pixel unit is the same at different positions, the cavity length and the front view of the actual optical path are observed when viewed from a large viewing angle.
- the length of the cavity through which the light path passes becomes longer, which causes color shift to occur.
- the lattice structure of the first electrode layer 201 has a curved surface structure
- the optical cavity length reflected at different positions also satisfies the gradation spectrum of the white light OLED device, and can ensure even in a large viewing angle.
- the different positions of the pixels have approximately equal cavity lengths, so the color shift effect is also greatly reduced, and the intensity is not significantly reduced.
- FIG. 4 is a schematic structural diagram of a top-emitting white light OLED device according to Embodiment 2 of the present disclosure.
- the OLED device includes a substrate 200, and a resin layer 204 formed on the substrate 200, located in the resin layer. a first electrode layer 201, an organic layer 202 over the first electrode layer 201, and a second electrode layer 203 over the organic layer 202, wherein the resin layer 204 is located at the Below the electrode layer 201, the interface of the resin layer 204 toward the first electrode layer 201 has the same periodic undulating structure as the first electrode layer 201.
- the substrate 200 may include a base substrate, a TFT functional layer, and a planarization layer.
- the first electrode layer 201 having a reflective function is generally made of a metal material, the process of forming the first electrode layer 201 having a lattice structure on the substrate 200 alone is difficult, and thus, in the embodiment of the present disclosure, A resin layer 204 having a lattice structure is formed on the substrate 200 for molding the first electrode layer 201. Then, the first electrode layer 201 having the same lattice structure is formed on the resin layer 204 having a lattice structure to reduce the process difficulty.
- the resin layer 204 may be made of a material such as PI (polyimide).
- PI polyimide
- the resin layer 204 for molding is not limited to a resin material, and may be formed of other materials that are easy to shape.
- FIG. 5 is a top view of the top of the resin layer according to the embodiment of the present disclosure
- FIG. 6 is a cross-sectional view of the resin layer of the embodiment of the present disclosure.
- FIG. 7 is a schematic diagram of the enhanced light-emitting principle of the top-emitting white OLED device of FIG. 4.
- the organic layer 202 has different thicknesses at different positions in one pixel unit due to the wavelength of red visible light.
- the wavelength of the blue visible light is about 420 to 470 nm
- the organic layer portion 2021 corresponding to the red visible light has the longest cavity length
- the organic visible layer portion 2023 corresponding to the blue visible light has the shortest cavity length.
- 2022 is an organic layer portion corresponding to visible light of other colors.
- the height difference a2 between the valley peaks of the bumps 2011 is in the visible light wavelength variation range.
- the interval length b2 (i.e., the undulation period of the valley peak) between the peaks (or troughs) of the bumps 2011 is less than or equal to the width of the pixel unit within a range of the difference in the optical cavity length corresponding to the circumference.
- the height difference between the valley peaks of the bumps 2011 is in the range of 20-150 nanometers, and the interval length between the peaks (or troughs) of the bumps 2011 is 1- Within the 10 micron range.
- the organic layer 202 may include a multilayer structure including, for example, a hole injection layer (HIL), a hole transport layer, a light emitting layer, a charge generating layer, a connecting layer, an electron transport layer, and an electron injecting layer. a plurality of layers in a hole blocking layer, an electron blocking layer, and the like. Wherein at least one of the organic layers 202 (such as a hole injection layer) has a wide thickness adjustment tolerance to at least partially or completely fill the undulating interface of the first electrode layer such that each pixel The organic layer within the cell has a gradual cavity length.
- HIL hole injection layer
- the organic layer 202 due to the process, it is difficult for the organic layer 202 to completely fill the undulating interface of the first electrode layer, but only partially fill, so the second electrode layer 203 above the organic layer 202 remains approximately horizontal.
- the bumps 2011 in the embodiment of the present disclosure are hemispherical or hemispherical bumps.
- the bumps 2011 may also be bumps of other shapes.
- FIG. 8 is a schematic structural diagram of a top-emitting white light OLED device according to Embodiment 3 of the present disclosure.
- the present embodiment has only the following difference: the dot matrix structure includes a plurality of spaced apart protrusions. Point 2011 and pit 2012 have a side shape that is similar to a sine wave form.
- the height difference a3 between the valley peaks of the bumps 2011 is within a difference range of the optical cavity length corresponding to the visible wavelength variation range, and the interval length b3 between the peaks (or troughs) of the bumps 2011 (ie, the fluctuation period of the peak) is less than or equal to the width of the pixel unit.
- the height difference between the valley peaks of the bumps 2011 is in the range of 20-150 nanometers, and the interval length between the peaks (or troughs) of the bumps 2011 is 1- Within the 10 micron range.
- the bumps 2011 in the embodiment of the present disclosure are hemispherical or hemispherical bumps
- the pits 2012 are hemispherical or hemispherical pits.
- bumps 2011 And the pits 2012 can also be other shapes, as shown in FIG. 9.
- FIG. 9 is a schematic structural diagram of a top-emitting white OLED device according to Embodiment 4 of the present disclosure.
- the shape of the first electrode layer (bottom electrode) of the top-emitting white OLED device is changed such that the organic layers in each pixel unit have different cavity lengths at different positions, of course, in other implementations of the present disclosure.
- the bottom electrode may be kept unchanged, and the shape of the second electrode layer (top electrode) may be changed, that is, a periodic undulating structure (such as a lattice structure) may be disposed at an interface of the second electrode layer toward the organic layer to
- a periodic undulating structure such as a lattice structure
- the light-emitting effect of the top-emitting white OLED device can be effectively enhanced, and significant problems such as intensity drop and color shift do not occur at a large viewing angle.
- the process of the present disclosure is simple, and the microcavity effect of the metal mirror can be effectively utilized to improve the external quantum efficiency of the device while reducing the angular dependence of the device, and is particularly suitable for use in a large-sized OLED display.
- the embodiment of the present disclosure further provides a method for fabricating an OLED device, including the steps of forming a plurality of pixel units on a substrate, wherein each pixel unit includes a first electrode layer, an organic layer, and sequentially along a direction away from the substrate.
- the second electrode layer, the organic layer in each of the pixel units has a gradual cavity length, and the gradual cavity length respectively corresponds to a wavelength range from red light to blue light, so that the corresponding white light of the pixel unit is enhanced.
- the method for preparing the OLED device specifically includes:
- Step S11 forming a resin layer on the substrate, the surface of the resin layer being a dot matrix structure, the dot matrix structure comprising a plurality of consecutively disposed bumps, or comprising a plurality of spaced apart bumps and pits;
- Step S12 forming a first electrode layer on the resin layer, the surface of the first electrode layer being the same lattice structure as the resin layer;
- Step S13 forming an organic layer on the first electrode layer, the organic layer capable of filling at least part or all of the undulating surface of the first electrode layer;
- Step S14 forming a second electrode layer on the organic layer.
- the substrate may include a base substrate, a TFT functional layer, and a planarization layer.
- the resin layer can be prepared by the following two methods:
- a resin film is formed on the substrate by coating; the resin film is exposed and developed by means of a mask to form a resin layer having a lattice structure.
- the method for preparing the top-emitting white light OLED device of the embodiment of the present disclosure includes the following steps (see FIG. 4 for the structure of the OLED device prepared by using the embodiment):
- the resin-forming precursor ink is applied to the planarization layer by printing to form a uniform droplet dot matrix, then the solvent is removed and cross-linked and polymerized to form a resin layer having a lattice structure.
- Each of the resin dots after curing has a hemispherical or hemispherical structure, and the peak height difference of the bumps is between 20 and 150 nanometers, and the lattice spacing is 1-10 micrometers.
- a first electrode layer that is, a bottom electrode, is deposited on the resin layer, and the undulating shape of the resin layer is maintained.
- the method of forming the organic layer is, wet coating, such as spin coating, printing, and dry evaporation, or a combination of the two. Preferred is a wet process which can preferably partially fill the recessed areas.
- Another preparation method of the top-emission white OLED device of the embodiment of the present disclosure includes (see FIG. 6 for the structure of the OLED device prepared by the embodiment):
- a first electrode layer that is, a bottom electrode, is deposited on the resin layer, and the undulating shape of the resin layer is maintained.
- the method of forming the organic layer is, wet coating, such as spin coating, printing, and dry evaporation, or a combination of the two. Preferred is a wet process which can preferably partially fill the recessed areas.
- the present disclosure also provides a display device comprising the top-emitting white light OLED device provided by the above embodiments.
- the display device may be: an OLED panel, a mobile phone, a tablet computer, a television, a display, a notebook computer, a digital photo frame, a navigator, and the like, or any product or component having a display function.
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Abstract
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Claims (17)
- 一种顶发射白光OLED器件,包括位于基板上的多个像素单元,每一所述像素单元包括沿远离所述基板方向上依次设置的第一电极层、有机层和第二电极层,其中,每一所述像素单元内的所述有机层具有渐变的腔长,所述渐变的腔长分别对应从红光到蓝光波长范围。
- 根据权利要求1所述的顶发射白光OLED器件,其中,所述第一电极层朝向所述有机层的界面具有周期性起伏状结构。
- 根据权利要求2所述的顶发射白光OLED器件,其中,所述周期性起伏状结构为点阵结构,所述点阵结构包括多个连续设置的凸点,或者包括多个间隔设置的凸点和凹坑。
- 根据权利要求3所述的顶发射白光OLED器件,其中,所述凸点的谷峰之间的高度差位于可见光波长变化对应的光学腔长的差值范围内,所述凸点的波峰或波谷之间的间隔长度小于或等于所述像素单元的宽度。
- 根据权利要求4所述的顶发射白光OLED器件,其中,所述凸点的谷峰之间的高度差在20-150纳米范围内,所述凸点的波峰或波谷之间的间隔长度在1-10微米范围内。
- 根据权利要求3所述的顶发射白光OLED器件,其中,所述凸点为半球状或类半球状凸点,所述凹坑为半球状或类半球状凹坑。
- 根据权利要求3所述的顶发射白光OLED器件,其中,当所述点阵结构包括多个间隔设置的凸点和凹坑时,其侧面形状为类正弦波的形式。
- 根据权利要求2所述的顶发射白光OLED器件,还包括:树脂层,位于所述第一电极层之下,所述树脂层朝向所述第一电极层的界面具有与所述第一电极层相同的周期性起伏状结构。
- 根据权利要求8所述的顶发射白光OLED器件,所述树脂层由聚酰亚胺制成。
- 根据权利要求2所述的顶发射白光OLED器件,其中,所述有机层至少部分或全部填平所述第一电极层的周期性起伏状结构。
- 根据权利要求1-10任一项所述的顶发射白光OLED器件,其中,所述 第一电极层为反射电极,所述第二电极层为半透明半反射电极。
- 一种顶发射白光OLED器件的制备方法,包括在基板上形成多个像素单元的步骤,其中,每一所述像素单元沿远离所述基板方向上依序包括第一电极层、有机层及第二电极层,每一所述像素单元内的所述有机层具有渐变的腔长,所述渐变的腔长分别对应从红光到蓝光波长范围。
- 根据权利要求12所述的制备方法,其中,所述方法具体包括:在基板上形成树脂层,所述树脂层的表面为点阵结构,所述点阵结构包括多个连续设置的凸点,或者包括多个间隔设置的凸点与凹坑;在所述树脂层上形成第一电极层,所述第一电极层的表面为与所述树脂层相同的点阵结构;在所述第一电极层上形成有机层,所述有机层能够至少部分或全部填平所述第一电极层的起伏表面;在所述有机层上形成第二电极层。
- 根据权利要求13所述的制备方法,其中,所述树脂层的点阵结构中,所述凸点为半球状或类半球状结构,凸点的谷峰高度差在20-150纳米之间,点阵的间隔为1-10微米。
- 根据权利要求13所述的制备方法,其中,所述在基板上形成树脂层的步骤包括:将形成树脂的前体墨水采用打印方式涂覆到基板上,形成均匀的液滴点阵,然后除去所述液滴点阵中的溶剂并交联聚合,固化后形成具有点阵结构的所述树脂层。
- 根据权利要求13所述的制备方法,其中,所述在基板上形成树脂层的步骤包括:采取涂覆的方式在基板上形成树脂薄膜;利用光罩掩膜的方式对所述树脂薄膜进行曝光显影,形成具有点阵结构的树脂层。
- 一种显示装置,包括权利要求1-11中任一项所述的顶发射白光OLED器件。
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