WO2016058543A1 - Procédé de fabrication de substrat fonctionnel et substrat fonctionnel - Google Patents

Procédé de fabrication de substrat fonctionnel et substrat fonctionnel Download PDF

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Publication number
WO2016058543A1
WO2016058543A1 PCT/CN2015/091988 CN2015091988W WO2016058543A1 WO 2016058543 A1 WO2016058543 A1 WO 2016058543A1 CN 2015091988 W CN2015091988 W CN 2015091988W WO 2016058543 A1 WO2016058543 A1 WO 2016058543A1
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Prior art keywords
functional
cylinder
assembly
wire
column
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PCT/CN2015/091988
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English (en)
Chinese (zh)
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申宇慈
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申宇慈
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Application filed by 申宇慈 filed Critical 申宇慈
Publication of WO2016058543A1 publication Critical patent/WO2016058543A1/fr

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H01L23/13—Mountings, e.g. non-detachable insulating substrates characterised by the shape

Definitions

  • This invention relates generally to integrated circuit semiconductor packaging technology, and more particularly to a method of fabricating a functional substrate.
  • the circuit and the pad can be fabricated on the upper and lower surfaces of the functional substrate, which can be further fabricated into a functional circuit substrate for an integrated circuit semiconductor package.
  • the functional circuit substrate makes the structural design of the integrated circuit semiconductor package more flexible, and can effectively enhance the performance of the integrated circuit semiconductor package.
  • a circuit substrate is an element for integrating functions of an electronic product, which constitutes a bridge between an integrated circuit semiconductor chip and other chips or electronic components.
  • TSV Through Silicon Via
  • TGV Through Glass Via
  • Silicon, glass, ceramic or organic material substrates have been widely used in integrated circuit semiconductor packaging technology, 3D and 2.5D A key component in integrated circuit semiconductor packaging.
  • Circuit boards made based on substrates containing vias are commonly used in 3D and 2.5D integrated circuit semiconductor packaging technologies, which can effectively integrate the functions of electronic products.
  • the substrate including the via holes includes a silicon substrate including a via hole, a glass substrate, a ceramic substrate, and an organic material substrate.
  • the manufacturing methods of the through-hole-containing substrates can be divided into two types: one is a substrate-based method, and the other is a via-based method.
  • the substrate-based method basically comprises: 1) first opening some of the desired holes on the substrate, 2) then filling the holes with a conductive material to form a substrate containing the conductive vias.
  • the method based on the through hole basically comprises: 1) first making some small metal pillars on a carrier, 2) then covering the small metal pillars with a substrate material, removing the carrier and grinding the upper and lower sides. The surface is exposed to a small metal pillar in a dot shape to form a substrate containing conductive via holes.
  • the use of a substrate including a via hole is to form a via hole-containing substrate through a circuit and a pad formed on the surface of the substrate.
  • the board is further fabricated into a circuit substrate including through holes, so that the electronic components on the upper surface of the substrate are connected to other electronic components or printed circuit boards under the substrate in the integrated circuit semiconductor package, and the circuit on the upper surface of the substrate can also be located.
  • the electronic components thereon are first directly communicated and then connected to other electronic components or boards below the substrate.
  • the basic features of the prior art substrate containing vias include: 1) the upper and lower surfaces of the substrate are flat to further fabricate circuits and pads thereon; 2) the vias are conductive metal posts embedded in A regular arrangement is formed in the substrate and at a desired pitch, 3) the substrate material of the substrate is used as a carrier for holding the vias and further fabricating the pads and pads thereon. It should be noted that these prior art substrates containing conductive vias have a number of limitations in their manufacture and use.
  • the manufacturing process Due to its manufacturing process, some limitations include: 1) its manufacture is very time consuming and expensive, 2) the metal posts or vias described therein do not contain an insulating outer layer, and 3) due to etching, mechanical drills or Laser opening, the side of the through hole is not very flat, 4) the diameter of the through hole can not be very small, the prior art manufacturing through hole is less than 10 microns, and the substrate exceeding a certain thickness (such as 100 microns or more) is very expensive, 5) The pitch of the via holes cannot be very small (as in the prior art, it is difficult and expensive to fabricate via holes having a pitch of less than 50 micrometers on a substrate having a thickness of 100 micrometers or more), 6) the thickness of the substrate including the via holes is affected by the via holes. The size and spacing are limited, and the smaller the via pitch, the thinner the substrate.
  • a method of fabricating a circuit substrate containing passive electronic components includes: 1) passive electronic components are mounted on the surface of the circuit substrate by another process, and 2) passive electronic components It is buried in the circuit substrate by another process, and 3) passive electricity is formed by making a conductive pattern on the surface of the circuit substrate.
  • the present invention is a further development of the Chinese invention patent applications CN201310651705.5 and CN201310737666.0 submitted by the applicant on December 5, 2013 and December 27, 2013.
  • the above-mentioned published patent application CN201310651705.5 discloses a method of manufacturing a metal wire integrated body or a wire integrated body based on a metal wire pattern array, and further manufacturing a substrate including a pattern array through hole.
  • the method comprises the following key steps: fabricating a metal line pattern array; forming a solid dielectric matrix between the spaces between and around the metal lines to form a metal line integrated body comprising a metal line pattern array;
  • the film is divided into a plurality of sheets to form a plurality of substrates including through holes of the pattern array.
  • the published patent application CN201310737666.0 discloses a unidirectional conductive plate which is electrically conductive in the thickness direction based on a wire. Manufacturing method. The method includes the following key steps: making a wire assembly made of unidirectional closely aligned wires; dividing the wire assembly into pieces to form a plurality of unidirectional conductive plates or substrates comprising conductive vias.
  • the key idea in the Chinese invention patent application filed by the present applicant is to manufacture a substrate containing a through hole by fabricating a cylinder including a wire and further dividing into a sheet.
  • the present invention is a further development of the concept, which discloses a functional cylinder assembly comprising a conductor post and a functional cylinder having a conductor in a cross-section having a set configuration, and discloses manufacturing
  • the functional pillar assembly can be further divided into sheets to form a functional substrate referred to in the present invention.
  • a circuit layer is further formed on the surface of the functional substrate to form a functional circuit substrate for an integrated circuit semiconductor package.
  • the method of manufacturing a functional substrate of the present invention comprises the following key steps: a) providing a functional cylinder; b) arranging a plurality of functional pillars in parallel with each other according to a set distribution pattern; c) The plurality of functional cylinders that have been arranged are solidified into a whole by set conditions, such as by set temperature and pressure, thereby forming a functional cylinder assembly having a plurality of functional cylinders; The functional pillar assembly is divided into pieces to form a plurality of functional substrates.
  • a method of manufacturing a functional substrate according to the present invention characterized in that, in step b), a plurality of functional pillars are closely arranged together, and in step c), said arranged ones are arranged by setting conditions
  • the good functional cylinders are connected to each other as a whole to form a functional pillar assembly comprising a plurality of functional cylinders;
  • the method of manufacturing a functional substrate of the present invention characterized in that in step b) And arranging a plurality of functional pillars in parallel with each other according to a set pitch and a distribution pattern, and in step c), filling a space between and around the functional pillars with a base material, and setting Conditions for solidifying the aligned functional pillars together with the matrix material to form a functional pillar assembly comprising a plurality of functional pillars;
  • the method of manufacturing a functional substrate of the present invention The distribution pattern of the plurality of functional cylinders arranged in parallel with each other constitutes a plurality of regularly arranged functional cylinder groups
  • the method of manufacturing a functional substrate of the present invention is characterized in that the functional pillar comprises a wire integrated body, and the wire integrated body is manufactured by the following steps: I) providing a wire, II) passing a plurality of sets of jigs The plurality of wires are arranged in parallel at a set pitch in the longitudinal direction and the lateral direction, and are tensioned and fixed between each two clamps, III) solidifying a plurality of aligned wires between each two clamps in one In the base material, a columnar wire assembly is thus produced.
  • the method of manufacturing a functional substrate according to the present invention is characterized in that the functional pillar comprises a conductor pillar assembly, and the conductor pillar assembly is manufactured by the following steps: I) providing a plurality of wires and a column Body, II) arranging the plurality of wires at a set pitch along the column direction and fixing to the side of the column, thereby forming a wire column assembly.
  • the method of manufacturing a functional substrate according to the present invention is characterized in that the functional pillar comprises a conductor pillar assembly, and the conductor pillar assembly is manufactured by the following steps: I) providing or fabricating a strip material, It comprises a wire arranged unidirectionally at a set pitch, II) fixing the wire-like material containing the wire to the side of the cylinder, and placing the wire-like material containing the wire under a set condition
  • the cylinder is solidified into a unitary body to form a conductor pillar assembly.
  • the method of manufacturing a functional substrate of the present invention characterized in that the functional pillar comprises a resistor cylinder, the resistor cylinder being manufactured by the following steps: I) providing or fabricating a three-layered square or a rectangular sheet material, wherein two outer layers are an insulating material layer, the middle layer is a conductive material layer, and I) the square or rectangular sheet material of the three-layer structure is folded into a cylinder by folding back and forth.
  • the method for manufacturing a functional substrate of the present invention characterized in that the functional column
  • the body comprises a capacitor cylinder which is manufactured by: I) providing a strip of dielectric material, II) coating a strip of conductive material on the strip of dielectric material to form a strip comprising a double-layer slab of a dielectric material and a layer of conductive material, III) stacking a plurality of said double-layer slats into a cylinder, and curing said stacked cylinders by a set temperature and pressure Integral Forming a capacitor cylinder; the method of manufacturing a functional substrate of the present invention, characterized in that the functional pillar comprises an inductor cylinder: I) a square or rectangular sheet material providing or fabricating a two-layer structure, wherein One layer is a layer of dielectric material and the other layer is a layer of conductive material; II) the square or rectangular sheet material of the double layer structure is tightly
  • the functional substrate of the present invention is characterized in that the functional substrate comprises a plurality of set spacings Regularly arranged functional substrates, each of said functional substrates comprising one or more functional sheets, said type of functional sheets comprising sheet-like semiconductor material, sheet magnet material, wire pass Sheet, wire cylinder through piece, resistor through piece, capacitor through piece, inductor through piece, layered strip through piece or transformer through piece.
  • the wire column assembly of the present invention is characterized in that the wire column assembly comprises a cylinder and a plurality of wires, wherein the plurality of wires are along the direction of the column at a set interval Arranged circumferentially on the side of the cylinder.
  • the functional cylinder of the present invention comprises: a resistor cylinder, a capacitor cylinder or an inductor cylinder, wherein the resistor cylinder comprises a plurality of strips in a form of a forward and reverse fold forming a resistor structure. a conductor and an insulating material separating the plurality of strip conductors; the capacitor cylinder comprising a plurality of strip conductors constituting a staggered form of the capacitor structure and a dielectric material separating the plurality of strip conductors;
  • the inductor core includes a rolled multilayer conductor constituting the inductor structure and an insulating material separating the rolled multilayer conductor.
  • the functional cylinder assembly of the present invention comprises: a plurality of functional cylinder groups regularly arranged at a set pitch, each functional cylinder group comprising one or more functional cylinders,
  • the functional pillars include columnar semiconductors. Materials, columnar or strip magnets, wire assemblies, wire column assemblies, resistor columns, capacitor banks, inductor columns, layered bars, or transformer columns.
  • the functional cylinder assembly of the present invention is characterized in that the functional cylinder group comprises two or more types of functional cylinders; the functional cylinder assembly of the present invention, characterized in that A matrix material is included wherein the plurality of functional pillars are interconnected as a unit by the matrix material.
  • a key inventive concept is to arrange a plurality of functional cylinders into a functional pillar assembly and further divide into sheets to form a plurality of functional substrates.
  • the cylinders are referred to herein as functional cylinders because the conductor, semiconductor or magnet material within the cross-section of the cylinder has a defined configuration that cooperate to form a set conductive function.
  • substrates containing specific conductive functions such as functional substrates comprising conductive vias and passive electronic devices, that are difficult to manufacture in the prior art can be manufactured inexpensively and quickly.
  • FIGS. 1 and 1A are schematic diagrams of a method of fabricating a functional substrate via a functional pillar assembly in accordance with one embodiment of the present invention
  • FIG. 2 is a schematic cross-sectional view of various functional columns in one embodiment of the present invention.
  • FIG. 3 is a schematic view of a double or triple slab for making a functional cylinder used in an embodiment of the present invention
  • 3A is a schematic view of a functional cylinder formed by folding a double or triple slab or by stacking a plurality of double or triple slats according to an embodiment of the invention
  • FIG. 4 is a schematic view of a jig for arranging and fixing wires according to an embodiment of the present invention
  • FIG. 4A, FIG. 4B and FIG. 4C are schematic diagrams showing main steps of fabricating a columnar conductor assembly using the jig illustrated in FIG. 4 according to an embodiment of the present invention
  • FIG. 5 is a schematic view showing a method of fabricating a wire column assembly by laying a strip-shaped substrate including a wire on a side of a cylinder according to an embodiment of the present invention
  • FIG. 6 is a schematic view showing a method of fabricating a wire column assembly by winding a unidirectionally aligned wire on a side of a cylinder according to an embodiment of the present invention
  • FIG. 7 is a schematic view of a circular functional substrate in accordance with one embodiment of the present invention, wherein the functional substrate includes a plurality of functional substrates regularly arranged at a set pitch, each functional substrate including a plurality of functional substrates. Functional film.
  • a functional cylinder that represents a composite cylinder comprising: a matrix material, a conductor material, and a semiconductor material, Wherein the conductor material penetrates the cylinder and has a set configuration in a cross section of the cylinder, such as a regularly arranged dot or strip pattern, as shown in Figure 2 for the cross-section of some functional cylinders.
  • functionality in the present invention represents the conductive function of the conductor material in the cross-section of the cylinder, forming a specific pattern, conductive function, and 2) a functional column group, which represents a A cylinder combination of a plurality of functional cylinders, a cross-sectional view of a functional cylinder group as indicated by numeral numeral 112 in FIG.
  • a functional cylinder assembly representing a plurality of functional cylinders a set of cylinders, such as a functional cylinder assembly as indicated by numeral 100 in Figure 1;
  • a wire assembly representing a column of matrix material comprising wires, wherein the wires follow a set pattern
  • the body direction is regularly arranged, as shown by the numeral symbol 210 in FIG. 2, a cross-sectional view of a wire assembly;
  • a wire cylinder assembly representing an integrated body comprising a plurality of wires and a cylinder in the base material
  • the plurality of wires are circumferentially arranged on the side of the column along the direction of the column at a set interval, such as a wire column assembly as indicated by numeral 220 in FIG. 2, FIG.
  • the middle number symbol 290 is indicative of a A conductor column assembly of a transformer, referred to herein as a transformer cylinder; 6) a resistor cylinder, which represents a matrix material cylinder, the matrix material cylinder comprising a forward and reverse folded form in the direction of the cylinder a conductive strip, such as a resistor post as indicated by numeral numeral 230 in Figure 2; 7) a capacitor post that represents a matrix of material, the matrix of material comprising interleaved stacks in the direction of the cylinder a conductive strip, such as a capacitor cylinder as indicated by the reference numerals 240 and 250 in FIG.
  • an inductor cylinder which represents a base material cylinder, the base material cylinder being included in the direction of the cylinder a rolled multi-layer conductive strip, such as an inductor cylinder as indicated by numeral 260 in Figure 2; 9) a layered strip cylinder, which represents a matrix material cylinder, said matrix material cylinder being contained in the column a plurality of conductive strips extending in a body direction, such as a layered strip cylinder as indicated by numeral 270 in FIG.
  • a passive electronic component cylinder including the resistor pillar, the capacitor cylinder, and the inductor pillar Body and layered cylinderIt is pointed out that the term functionality in the present invention represents the electrically conductive function of the conductor material in the cross section of the cylinder; since the conductor material forms a defined pattern in the cross section, it may have a set function, Passive electronic components are formed as in the cross section.
  • the terms related to the functional substrate are: 1) a functional sheet representing a sheet divided by the functional cylinder, as shown in FIG. Numerical functional symbols 821, 822, 823, 824 and 825, wherein the electrical conductors pass through a sheet divided by the functional cylinder; 2) a functional substrate, which represents via the functionality a sheet into which a cylinder group is divided, such as a functional substrate as indicated by reference numerals 811 and 812 in FIG. 7, which includes one or more functional sheets; and 3) a functional substrate represented by the functional cylinder A sheet into which the integrated body is divided, such as a circular functional substrate as illustrated by numeral 800 in FIG.
  • a sheet divided by a transformer cylinder is called a transformer sheet; 6) a resistor sheet Representing via the resistor cylinder a sliced sheet; 7) a capacitor sheet, which represents a sheet divided by the capacitor cylinder; 8) an inductor sheet, which represents a sheet divided by the inductor cylinder; 9) a layer strip a sheet, which represents a sheet divided by the layered strip cylinder; 10) a passive electronic component sheet, which represents a sheet divided by the passive electronic element cylinder.
  • the term sheet is used herein to mean a piece of matrix material that includes a conductive material having a defined configuration and distribution.
  • FIG. 1 and 1A are schematic diagrams of a method of fabricating a functional substrate via a functional pillar assembly in accordance with one embodiment of the present invention.
  • the numeral symbol 1000 in FIG. 1 illustrates that a plurality of functional cylinders are arranged in parallel with each other in a set distribution pattern to form a plurality of functional cylinder groups as indicated by numeral symbols 110, wherein the numeral symbols 111 and the arrows indicate one An example of a functional cylinder set comprising a plurality of functional cylinders as illustrated by numeral symbol 112, numeral symbol 113 illustrates a matrix material that joins the plurality of functional cylinders into a single unit to form a A functional cylinder assembly, indicated by numeral symbol 100, numeral symbols 120 and arrows illustrate the division of the functional pillar assembly into a sheet, thereby producing a plurality of functional substrates as indicated by numeral 121.
  • FIG. 1A is a cross-sectional view of a plurality of columns arranged according to a set rule, wherein numeral 1500 indicates that a plurality of functional columns 151 are arranged in parallel with each other in accordance with a set distribution pattern to form a plurality of functions.
  • a set of cylinders 150 wherein numeral 152 indicates a split channel between functional cylinder sets 150, numeral 155 and arrows indicate curing of the plurality of functional pillars 151 arranged in a matrix material 163 to form digital symbols 160 shows a functional cylinder assembly.
  • each functional cylinder set 150 includes 3 x 3 functional pillars 151, and in the schematic example of FIG.
  • each functional pillar set 110 includes 12 conductor assemblies and one Inductor cylinder.
  • the type and number of functional cylinders included in one functional cylinder group can be set as needed, and is not limited to the case of the illustrative example; in addition, the functional cylinder integration in the illustrative example
  • the body 100 or 160 is a square cylinder which can also be set to other shapes such as a rectangle or a circle as needed.
  • the functional cylinder assembly in one embodiment of the invention illustrated in Figures 1 and 1A includes a matrix material, such as numeral symbol 113 or 163, connecting the plurality of cylinders, the plurality of The functional cylinders are hermetically sealed to form the functional cylinder assembly. It should be noted that, as needed, the plurality of functional pillars may also be closely arranged together and solidified together by their own matrix materials to form a functional cylinder under a set temperature and pressure. Integration body.
  • the functional cylinder including: a numeral symbol 210 and an arrow assembly indicating a wire assembly including a wire 211 and a base material 212; a wire cylinder assembly indicated by the numeral symbol 220 and the arrow, comprising a column material 221, a plurality of roots arranged on the side of the column circumferentially along the direction of the column 221 at a set interval A wire 222 and a base material 223 connecting the column material 221 and the plurality of wires 222 as a whole; a symbol bar and a resistor block indicated by an arrow, comprising a plurality of strip conductors 231 in a forward and reverse folded form.
  • the column in the wire cylinder assembly indicated by the numeral symbol 220 and the arrow in FIG. 2 and the material and cross-sectional shape of the single material cylinder indicated by the numeral symbol 280 and the arrow can be set as needed without Limited to semiconductor materials, magnet materials, and squares; in addition, the shape and number of wires in the wire cylinder assembly illustrated by numeral symbols 220 and 290 in FIG. 2 can also be set as needed, and is not limited to the one layer circle illustrated in FIG. The shaped wires are distributed on four or both sides of the cylinder.
  • the conductor post assembly illustrated by numeral 290 in Fig. 2 is also referred to as a transformer cylinder, which can be similarly fabricated in accordance with the method of manufacturing the conductor post assembly.
  • the functional cylinders illustrated in FIG. 2 are the basic units of the functional cylindrical assembly of the present invention, but in addition to the single material column illustrated by numeral 280, other functional cylinders need to be fabricated. . Accordingly, in the present invention, in order to manufacture the functional pillar assembly, it discloses key steps of the method of manufacturing the functional cylinder, such as some of the fabrication methods illustrated in Figures 3-6.
  • FIGS. 3 and 3A are schematic diagrams showing a method of fabricating a passive electronic component cylinder illustrated by the numeral symbol 3400 by a double or triple slab illustrated by the numeral symbol 3000 in one embodiment of the present invention.
  • the numeral symbol 300 in Fig. 3 illustrates a multilayer slat; the numeral symbols 310, 320 and 330 illustrate a cross-sectional view of the multilayer slat, wherein 310 indicates a three-layer board in which the conductive layer or the dielectric layer is insulated or dielectric layer.
  • 320 illustrates a two-layer slat having a conductive layer on top and an insulating or dielectric layer on the lower surface; 320 is a two-layer slat having an upper conductive layer or an insulating or dielectric layer thereon, but the upper conductive layer is The left or right side is shorter than the underlying insulating layer to form a staggered structure.
  • the numeral 341 in Fig. 3A illustrates a resistor cylinder which can be closely folded into a cylinder by the three-layer slats 310 of Fig. 3, and is folded back and forth.
  • the set temperature and pressure are made by solidifying the stacked cylinders into one unit; numeral 342 in Figure 3A illustrates an inductor cylinder that can be double slat 320 or three in Figure 3.
  • the layer strip 310 is tightly wound into a cylinder and is formed by solidifying the rolled cylinder into a unit by a set temperature and pressure; numeral 343 in FIG. 3A indicates a capacitor cylinder. It can be stacked into a column by a plurality of double-layer slats 330 having a staggered structure as illustrated in FIG. 3, and is formed by solidifying the stacked columns into a whole by a set temperature and pressure; FIG.
  • the numeral 344 in the middle indicates a layered strip cylinder which can be stacked into a cylinder by a plurality of double slats 320 or three slats 310 as illustrated in Fig. 3, and the said temperature has been set by a set temperature and pressure.
  • the stacked cylinders are solidified into one unit.
  • numeral symbol 5000 illustrates a first portion of the jig illustrated by numeral 510 and a second portion indicated by numeral 520.
  • the first portion 510 includes a set of transverse round bars as indicated by numeral symbols 511/514 and support members as indicated by numeral symbols 512/513 on either side of the transverse round bars, said The two portions 520 comprise a set of longitudinal round bars as illustrated by numeral symbols 521/224 and support members as indicated by numeral symbols 522/523 at the upper and lower ends of said longitudinal round bars, numeral 530 indicating the first portion of the clamp
  • the 510 and second portion 520 are stacked together to form a mesh structure in which each mesh receives and positions a wire to regularly align and secure a set of wires in the fixture.
  • Numeral symbol 5100 in FIG. 4A illustrates the plurality of sets of clamps illustrated by numeral symbols 530, 540 and 550.
  • the conductors indicated by numeral 561 are pulled from the supply end, such as the plurality of spools indicated by numeral 560, and positioned in each of the two.
  • the dotted line indicated by numeral 545 indicates a cutting line, so that the line segment 561 which is tensioned and fixed between the jigs 530 and 540 together with the jig can be It is placed in a mold to fill or cast the base material to manufacture a wire assembly.
  • FIG. 4B illustrates another option of filling or casting the line segments between the clamps 530 and 540 with a base material, wherein the dashed lines indicated by numeral 545/555 indicate a surrounding fixture 530. 540 and the open slot of the line segment 561, the base material can be filled or cast in the open slot 545/555 to create a wire assembly.
  • the numeral symbol 5300 in Figure 4C illustrates a continuous production process in which the line segments indicated by numeral 562 are pulled from the spool 560 by the clamp 550, the numerical symbols 570 and 580 indicate the newly inserted clamp, and then the repetition of Figure 4A or Figure 4B is repeated.
  • the step of tensioning and fixing the line segment between the jigs 550 and 570 is filled or cast with a base material to manufacture the next wire assembly.
  • Figure 5 is a perspective view of a belt-shaped base comprising a wire on the side of a cylinder in one embodiment of the invention.
  • Numerals 610 and 620 in FIG. 5 illustrate a front view and a cross-sectional view of a strip substrate including wires, wherein numerals 612 or 622 illustrate wires laid on a strip substrate 611 or 621;
  • the strip-shaped substrate comprising the wires is laid or wrapped to the side of a cylinder to form a conductor pillar assembly as indicated by numeral 630 or 640, wherein the reference numerals 630 and 640 respectively indicate the conductor pillars
  • FIG. 6 is a schematic diagram of a method of fabricating a conductor post assembly by laying a wire on the side of a cylinder in accordance with one embodiment of the present invention, wherein numeral 7000 illustrates a critical step in laying the conductor 700 on the side of a cylinder 710.
  • the numeral symbol 700 in Fig. 6 indicates a wire source end, such as a coil
  • the numeral symbol 710 indicates a cylinder
  • the numeral symbol 720 and the arrow indicate that the wires are layer by layer along the side of the column.
  • the predetermined pitch is entangled, and the numerical symbols 730 and 740 are schematically disposed at the two ends of the column for separating the spacing between the wire layers, and the spacing between the wires in the same layer can be when the wire is wound.
  • Numeral symbol 750 in Fig. 6 illustrates a cross-sectional view along column A to A of a cylinder 710 wound with two layers of conductors
  • numeral 760 indicates a conductor formed by winding a cylinder of two layers of conductors in a base material 761. Cylinder integration.
  • FIG. 7 is a schematic diagram 8000 of a circular functional substrate in accordance with one embodiment of the present invention, wherein the functional substrate 800 includes a plurality of functional substrates 810 regularly arranged at a set pitch, each functional basis
  • the sheet comprises a plurality of functional sheets, such as a plurality of functional sheets illustrated by numeral 811, comprising a cylindrical sheet 820 and twelve wire sheets 830 surrounding the column sheets;
  • the substrate 810 may also include only one functional via, such as the conductor post tab illustrated by numeral 812, which is comprised of wire vias 850 and post tabs 840 that are cured in the base material 860.
  • the pillar through sheets, such as 820 or 840, included in the functional substrate 810 may be a piece of semiconductor material or a functional through sheet such as numeral symbols 821, 822, 823, 824, 825, or 826 illustrates resistor vias, capacitor vias, inductor vias, capacitor vias with electrodes, layered strips or transformer vias.
  • the functional cylinder set 110 of Figure 1 is set to a base material of ceramic or glass.
  • the wire assembly body, the base material 113 for bonding the ceramic or glass-based wire assembly together is set as an organic material, such as a polymer material or a molding compound, thereby forming a functional substrate 121 which is a A flexible functional ceramic or glass substrate comprising a plurality of ceramic or glass substrates comprising wire vias.
  • the functional cylinder set 110 of FIG. 1 is configured as a conductor pillar assembly, wherein the cylinder is a column of semiconductor material, such as a silicon pillar, and the conductor is a metal wire.
  • the material of the semiconductor material column and the metal wire are connected to form a wire column assembly, and the base material 113 connecting the wire column assembly body is set as a ceramic or glass material, thereby
  • the resulting functional substrate 121 is a functional silicon substrate comprising a plurality of silicon substrates having wire vias around them.
  • the functional cylinder set 110 of FIG. 1 is configured to include a wire assembly and a passive electronic component cylinder, wherein the passive electronic component cylinder can be a resistor cylinder, a capacitor cylinder, an inductor
  • the pillar, or the layered strip is formed into a functional substrate 121 which is a substrate including conductive vias and passive electronic component sheets.

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Abstract

L'invention concerne un procédé de fabrication d'un substrat fonctionnel au moyen d'un corps intégré de colonnes fonctionnelles et un substrat fonctionnel. Le corps intégré de colonnes fonctionnelles (100) est intégré au moyen d'une pluralité de colonnes fonctionnelles (110), et le substrat fonctionnel (121) est fabriqué par segmentation du corps intégré de colonnes fonctionnelles (100) en morceaux; la colonne fonctionnelle (110) comprend un matériau semi-conducteur colonnaire, un matériau magnétique colonnaire, un corps intégré de conducteur, un corps intégré de colonne de conducteur et une colonne électrique de composant électronique passif ou une colonne de transformateur. Le corps intégré de colonnes fonctionnelles comprend : une colonne de silicium, un corps intégré de colonne de conducteur constitué d'un corps intégré de conducteur de colonne de silicium, d'une colonne de composant électronique passif et d'un corps intégré de colonne de conducteur constitué d'une colonne de composant électronique passif et d'une colonne de conducteur. Le substrat fonctionnel précité permet de concevoir, en termes de structure et d'efficacité, des boîtiers de semi-conducteurs de circuit intégré qui sont plus souples et efficaces.
PCT/CN2015/091988 2014-10-15 2015-10-15 Procédé de fabrication de substrat fonctionnel et substrat fonctionnel WO2016058543A1 (fr)

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