WO2016058543A1 - Method for manufacturing functional substrate and functional substrate - Google Patents

Method for manufacturing functional substrate and functional substrate Download PDF

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Publication number
WO2016058543A1
WO2016058543A1 PCT/CN2015/091988 CN2015091988W WO2016058543A1 WO 2016058543 A1 WO2016058543 A1 WO 2016058543A1 CN 2015091988 W CN2015091988 W CN 2015091988W WO 2016058543 A1 WO2016058543 A1 WO 2016058543A1
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WIPO (PCT)
Prior art keywords
functional
cylinder
assembly
wire
column
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PCT/CN2015/091988
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French (fr)
Chinese (zh)
Inventor
申宇慈
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申宇慈
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Publication of WO2016058543A1 publication Critical patent/WO2016058543A1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H01L23/13—Mountings, e.g. non-detachable insulating substrates characterised by the shape

Definitions

  • This invention relates generally to integrated circuit semiconductor packaging technology, and more particularly to a method of fabricating a functional substrate.
  • the circuit and the pad can be fabricated on the upper and lower surfaces of the functional substrate, which can be further fabricated into a functional circuit substrate for an integrated circuit semiconductor package.
  • the functional circuit substrate makes the structural design of the integrated circuit semiconductor package more flexible, and can effectively enhance the performance of the integrated circuit semiconductor package.
  • a circuit substrate is an element for integrating functions of an electronic product, which constitutes a bridge between an integrated circuit semiconductor chip and other chips or electronic components.
  • TSV Through Silicon Via
  • TGV Through Glass Via
  • Silicon, glass, ceramic or organic material substrates have been widely used in integrated circuit semiconductor packaging technology, 3D and 2.5D A key component in integrated circuit semiconductor packaging.
  • Circuit boards made based on substrates containing vias are commonly used in 3D and 2.5D integrated circuit semiconductor packaging technologies, which can effectively integrate the functions of electronic products.
  • the substrate including the via holes includes a silicon substrate including a via hole, a glass substrate, a ceramic substrate, and an organic material substrate.
  • the manufacturing methods of the through-hole-containing substrates can be divided into two types: one is a substrate-based method, and the other is a via-based method.
  • the substrate-based method basically comprises: 1) first opening some of the desired holes on the substrate, 2) then filling the holes with a conductive material to form a substrate containing the conductive vias.
  • the method based on the through hole basically comprises: 1) first making some small metal pillars on a carrier, 2) then covering the small metal pillars with a substrate material, removing the carrier and grinding the upper and lower sides. The surface is exposed to a small metal pillar in a dot shape to form a substrate containing conductive via holes.
  • the use of a substrate including a via hole is to form a via hole-containing substrate through a circuit and a pad formed on the surface of the substrate.
  • the board is further fabricated into a circuit substrate including through holes, so that the electronic components on the upper surface of the substrate are connected to other electronic components or printed circuit boards under the substrate in the integrated circuit semiconductor package, and the circuit on the upper surface of the substrate can also be located.
  • the electronic components thereon are first directly communicated and then connected to other electronic components or boards below the substrate.
  • the basic features of the prior art substrate containing vias include: 1) the upper and lower surfaces of the substrate are flat to further fabricate circuits and pads thereon; 2) the vias are conductive metal posts embedded in A regular arrangement is formed in the substrate and at a desired pitch, 3) the substrate material of the substrate is used as a carrier for holding the vias and further fabricating the pads and pads thereon. It should be noted that these prior art substrates containing conductive vias have a number of limitations in their manufacture and use.
  • the manufacturing process Due to its manufacturing process, some limitations include: 1) its manufacture is very time consuming and expensive, 2) the metal posts or vias described therein do not contain an insulating outer layer, and 3) due to etching, mechanical drills or Laser opening, the side of the through hole is not very flat, 4) the diameter of the through hole can not be very small, the prior art manufacturing through hole is less than 10 microns, and the substrate exceeding a certain thickness (such as 100 microns or more) is very expensive, 5) The pitch of the via holes cannot be very small (as in the prior art, it is difficult and expensive to fabricate via holes having a pitch of less than 50 micrometers on a substrate having a thickness of 100 micrometers or more), 6) the thickness of the substrate including the via holes is affected by the via holes. The size and spacing are limited, and the smaller the via pitch, the thinner the substrate.
  • a method of fabricating a circuit substrate containing passive electronic components includes: 1) passive electronic components are mounted on the surface of the circuit substrate by another process, and 2) passive electronic components It is buried in the circuit substrate by another process, and 3) passive electricity is formed by making a conductive pattern on the surface of the circuit substrate.
  • the present invention is a further development of the Chinese invention patent applications CN201310651705.5 and CN201310737666.0 submitted by the applicant on December 5, 2013 and December 27, 2013.
  • the above-mentioned published patent application CN201310651705.5 discloses a method of manufacturing a metal wire integrated body or a wire integrated body based on a metal wire pattern array, and further manufacturing a substrate including a pattern array through hole.
  • the method comprises the following key steps: fabricating a metal line pattern array; forming a solid dielectric matrix between the spaces between and around the metal lines to form a metal line integrated body comprising a metal line pattern array;
  • the film is divided into a plurality of sheets to form a plurality of substrates including through holes of the pattern array.
  • the published patent application CN201310737666.0 discloses a unidirectional conductive plate which is electrically conductive in the thickness direction based on a wire. Manufacturing method. The method includes the following key steps: making a wire assembly made of unidirectional closely aligned wires; dividing the wire assembly into pieces to form a plurality of unidirectional conductive plates or substrates comprising conductive vias.
  • the key idea in the Chinese invention patent application filed by the present applicant is to manufacture a substrate containing a through hole by fabricating a cylinder including a wire and further dividing into a sheet.
  • the present invention is a further development of the concept, which discloses a functional cylinder assembly comprising a conductor post and a functional cylinder having a conductor in a cross-section having a set configuration, and discloses manufacturing
  • the functional pillar assembly can be further divided into sheets to form a functional substrate referred to in the present invention.
  • a circuit layer is further formed on the surface of the functional substrate to form a functional circuit substrate for an integrated circuit semiconductor package.
  • the method of manufacturing a functional substrate of the present invention comprises the following key steps: a) providing a functional cylinder; b) arranging a plurality of functional pillars in parallel with each other according to a set distribution pattern; c) The plurality of functional cylinders that have been arranged are solidified into a whole by set conditions, such as by set temperature and pressure, thereby forming a functional cylinder assembly having a plurality of functional cylinders; The functional pillar assembly is divided into pieces to form a plurality of functional substrates.
  • a method of manufacturing a functional substrate according to the present invention characterized in that, in step b), a plurality of functional pillars are closely arranged together, and in step c), said arranged ones are arranged by setting conditions
  • the good functional cylinders are connected to each other as a whole to form a functional pillar assembly comprising a plurality of functional cylinders;
  • the method of manufacturing a functional substrate of the present invention characterized in that in step b) And arranging a plurality of functional pillars in parallel with each other according to a set pitch and a distribution pattern, and in step c), filling a space between and around the functional pillars with a base material, and setting Conditions for solidifying the aligned functional pillars together with the matrix material to form a functional pillar assembly comprising a plurality of functional pillars;
  • the method of manufacturing a functional substrate of the present invention The distribution pattern of the plurality of functional cylinders arranged in parallel with each other constitutes a plurality of regularly arranged functional cylinder groups
  • the method of manufacturing a functional substrate of the present invention is characterized in that the functional pillar comprises a wire integrated body, and the wire integrated body is manufactured by the following steps: I) providing a wire, II) passing a plurality of sets of jigs The plurality of wires are arranged in parallel at a set pitch in the longitudinal direction and the lateral direction, and are tensioned and fixed between each two clamps, III) solidifying a plurality of aligned wires between each two clamps in one In the base material, a columnar wire assembly is thus produced.
  • the method of manufacturing a functional substrate according to the present invention is characterized in that the functional pillar comprises a conductor pillar assembly, and the conductor pillar assembly is manufactured by the following steps: I) providing a plurality of wires and a column Body, II) arranging the plurality of wires at a set pitch along the column direction and fixing to the side of the column, thereby forming a wire column assembly.
  • the method of manufacturing a functional substrate according to the present invention is characterized in that the functional pillar comprises a conductor pillar assembly, and the conductor pillar assembly is manufactured by the following steps: I) providing or fabricating a strip material, It comprises a wire arranged unidirectionally at a set pitch, II) fixing the wire-like material containing the wire to the side of the cylinder, and placing the wire-like material containing the wire under a set condition
  • the cylinder is solidified into a unitary body to form a conductor pillar assembly.
  • the method of manufacturing a functional substrate of the present invention characterized in that the functional pillar comprises a resistor cylinder, the resistor cylinder being manufactured by the following steps: I) providing or fabricating a three-layered square or a rectangular sheet material, wherein two outer layers are an insulating material layer, the middle layer is a conductive material layer, and I) the square or rectangular sheet material of the three-layer structure is folded into a cylinder by folding back and forth.
  • the method for manufacturing a functional substrate of the present invention characterized in that the functional column
  • the body comprises a capacitor cylinder which is manufactured by: I) providing a strip of dielectric material, II) coating a strip of conductive material on the strip of dielectric material to form a strip comprising a double-layer slab of a dielectric material and a layer of conductive material, III) stacking a plurality of said double-layer slats into a cylinder, and curing said stacked cylinders by a set temperature and pressure Integral Forming a capacitor cylinder; the method of manufacturing a functional substrate of the present invention, characterized in that the functional pillar comprises an inductor cylinder: I) a square or rectangular sheet material providing or fabricating a two-layer structure, wherein One layer is a layer of dielectric material and the other layer is a layer of conductive material; II) the square or rectangular sheet material of the double layer structure is tightly
  • the functional substrate of the present invention is characterized in that the functional substrate comprises a plurality of set spacings Regularly arranged functional substrates, each of said functional substrates comprising one or more functional sheets, said type of functional sheets comprising sheet-like semiconductor material, sheet magnet material, wire pass Sheet, wire cylinder through piece, resistor through piece, capacitor through piece, inductor through piece, layered strip through piece or transformer through piece.
  • the wire column assembly of the present invention is characterized in that the wire column assembly comprises a cylinder and a plurality of wires, wherein the plurality of wires are along the direction of the column at a set interval Arranged circumferentially on the side of the cylinder.
  • the functional cylinder of the present invention comprises: a resistor cylinder, a capacitor cylinder or an inductor cylinder, wherein the resistor cylinder comprises a plurality of strips in a form of a forward and reverse fold forming a resistor structure. a conductor and an insulating material separating the plurality of strip conductors; the capacitor cylinder comprising a plurality of strip conductors constituting a staggered form of the capacitor structure and a dielectric material separating the plurality of strip conductors;
  • the inductor core includes a rolled multilayer conductor constituting the inductor structure and an insulating material separating the rolled multilayer conductor.
  • the functional cylinder assembly of the present invention comprises: a plurality of functional cylinder groups regularly arranged at a set pitch, each functional cylinder group comprising one or more functional cylinders,
  • the functional pillars include columnar semiconductors. Materials, columnar or strip magnets, wire assemblies, wire column assemblies, resistor columns, capacitor banks, inductor columns, layered bars, or transformer columns.
  • the functional cylinder assembly of the present invention is characterized in that the functional cylinder group comprises two or more types of functional cylinders; the functional cylinder assembly of the present invention, characterized in that A matrix material is included wherein the plurality of functional pillars are interconnected as a unit by the matrix material.
  • a key inventive concept is to arrange a plurality of functional cylinders into a functional pillar assembly and further divide into sheets to form a plurality of functional substrates.
  • the cylinders are referred to herein as functional cylinders because the conductor, semiconductor or magnet material within the cross-section of the cylinder has a defined configuration that cooperate to form a set conductive function.
  • substrates containing specific conductive functions such as functional substrates comprising conductive vias and passive electronic devices, that are difficult to manufacture in the prior art can be manufactured inexpensively and quickly.
  • FIGS. 1 and 1A are schematic diagrams of a method of fabricating a functional substrate via a functional pillar assembly in accordance with one embodiment of the present invention
  • FIG. 2 is a schematic cross-sectional view of various functional columns in one embodiment of the present invention.
  • FIG. 3 is a schematic view of a double or triple slab for making a functional cylinder used in an embodiment of the present invention
  • 3A is a schematic view of a functional cylinder formed by folding a double or triple slab or by stacking a plurality of double or triple slats according to an embodiment of the invention
  • FIG. 4 is a schematic view of a jig for arranging and fixing wires according to an embodiment of the present invention
  • FIG. 4A, FIG. 4B and FIG. 4C are schematic diagrams showing main steps of fabricating a columnar conductor assembly using the jig illustrated in FIG. 4 according to an embodiment of the present invention
  • FIG. 5 is a schematic view showing a method of fabricating a wire column assembly by laying a strip-shaped substrate including a wire on a side of a cylinder according to an embodiment of the present invention
  • FIG. 6 is a schematic view showing a method of fabricating a wire column assembly by winding a unidirectionally aligned wire on a side of a cylinder according to an embodiment of the present invention
  • FIG. 7 is a schematic view of a circular functional substrate in accordance with one embodiment of the present invention, wherein the functional substrate includes a plurality of functional substrates regularly arranged at a set pitch, each functional substrate including a plurality of functional substrates. Functional film.
  • a functional cylinder that represents a composite cylinder comprising: a matrix material, a conductor material, and a semiconductor material, Wherein the conductor material penetrates the cylinder and has a set configuration in a cross section of the cylinder, such as a regularly arranged dot or strip pattern, as shown in Figure 2 for the cross-section of some functional cylinders.
  • functionality in the present invention represents the conductive function of the conductor material in the cross-section of the cylinder, forming a specific pattern, conductive function, and 2) a functional column group, which represents a A cylinder combination of a plurality of functional cylinders, a cross-sectional view of a functional cylinder group as indicated by numeral numeral 112 in FIG.
  • a functional cylinder assembly representing a plurality of functional cylinders a set of cylinders, such as a functional cylinder assembly as indicated by numeral 100 in Figure 1;
  • a wire assembly representing a column of matrix material comprising wires, wherein the wires follow a set pattern
  • the body direction is regularly arranged, as shown by the numeral symbol 210 in FIG. 2, a cross-sectional view of a wire assembly;
  • a wire cylinder assembly representing an integrated body comprising a plurality of wires and a cylinder in the base material
  • the plurality of wires are circumferentially arranged on the side of the column along the direction of the column at a set interval, such as a wire column assembly as indicated by numeral 220 in FIG. 2, FIG.
  • the middle number symbol 290 is indicative of a A conductor column assembly of a transformer, referred to herein as a transformer cylinder; 6) a resistor cylinder, which represents a matrix material cylinder, the matrix material cylinder comprising a forward and reverse folded form in the direction of the cylinder a conductive strip, such as a resistor post as indicated by numeral numeral 230 in Figure 2; 7) a capacitor post that represents a matrix of material, the matrix of material comprising interleaved stacks in the direction of the cylinder a conductive strip, such as a capacitor cylinder as indicated by the reference numerals 240 and 250 in FIG.
  • an inductor cylinder which represents a base material cylinder, the base material cylinder being included in the direction of the cylinder a rolled multi-layer conductive strip, such as an inductor cylinder as indicated by numeral 260 in Figure 2; 9) a layered strip cylinder, which represents a matrix material cylinder, said matrix material cylinder being contained in the column a plurality of conductive strips extending in a body direction, such as a layered strip cylinder as indicated by numeral 270 in FIG.
  • a passive electronic component cylinder including the resistor pillar, the capacitor cylinder, and the inductor pillar Body and layered cylinderIt is pointed out that the term functionality in the present invention represents the electrically conductive function of the conductor material in the cross section of the cylinder; since the conductor material forms a defined pattern in the cross section, it may have a set function, Passive electronic components are formed as in the cross section.
  • the terms related to the functional substrate are: 1) a functional sheet representing a sheet divided by the functional cylinder, as shown in FIG. Numerical functional symbols 821, 822, 823, 824 and 825, wherein the electrical conductors pass through a sheet divided by the functional cylinder; 2) a functional substrate, which represents via the functionality a sheet into which a cylinder group is divided, such as a functional substrate as indicated by reference numerals 811 and 812 in FIG. 7, which includes one or more functional sheets; and 3) a functional substrate represented by the functional cylinder A sheet into which the integrated body is divided, such as a circular functional substrate as illustrated by numeral 800 in FIG.
  • a sheet divided by a transformer cylinder is called a transformer sheet; 6) a resistor sheet Representing via the resistor cylinder a sliced sheet; 7) a capacitor sheet, which represents a sheet divided by the capacitor cylinder; 8) an inductor sheet, which represents a sheet divided by the inductor cylinder; 9) a layer strip a sheet, which represents a sheet divided by the layered strip cylinder; 10) a passive electronic component sheet, which represents a sheet divided by the passive electronic element cylinder.
  • the term sheet is used herein to mean a piece of matrix material that includes a conductive material having a defined configuration and distribution.
  • FIG. 1 and 1A are schematic diagrams of a method of fabricating a functional substrate via a functional pillar assembly in accordance with one embodiment of the present invention.
  • the numeral symbol 1000 in FIG. 1 illustrates that a plurality of functional cylinders are arranged in parallel with each other in a set distribution pattern to form a plurality of functional cylinder groups as indicated by numeral symbols 110, wherein the numeral symbols 111 and the arrows indicate one An example of a functional cylinder set comprising a plurality of functional cylinders as illustrated by numeral symbol 112, numeral symbol 113 illustrates a matrix material that joins the plurality of functional cylinders into a single unit to form a A functional cylinder assembly, indicated by numeral symbol 100, numeral symbols 120 and arrows illustrate the division of the functional pillar assembly into a sheet, thereby producing a plurality of functional substrates as indicated by numeral 121.
  • FIG. 1A is a cross-sectional view of a plurality of columns arranged according to a set rule, wherein numeral 1500 indicates that a plurality of functional columns 151 are arranged in parallel with each other in accordance with a set distribution pattern to form a plurality of functions.
  • a set of cylinders 150 wherein numeral 152 indicates a split channel between functional cylinder sets 150, numeral 155 and arrows indicate curing of the plurality of functional pillars 151 arranged in a matrix material 163 to form digital symbols 160 shows a functional cylinder assembly.
  • each functional cylinder set 150 includes 3 x 3 functional pillars 151, and in the schematic example of FIG.
  • each functional pillar set 110 includes 12 conductor assemblies and one Inductor cylinder.
  • the type and number of functional cylinders included in one functional cylinder group can be set as needed, and is not limited to the case of the illustrative example; in addition, the functional cylinder integration in the illustrative example
  • the body 100 or 160 is a square cylinder which can also be set to other shapes such as a rectangle or a circle as needed.
  • the functional cylinder assembly in one embodiment of the invention illustrated in Figures 1 and 1A includes a matrix material, such as numeral symbol 113 or 163, connecting the plurality of cylinders, the plurality of The functional cylinders are hermetically sealed to form the functional cylinder assembly. It should be noted that, as needed, the plurality of functional pillars may also be closely arranged together and solidified together by their own matrix materials to form a functional cylinder under a set temperature and pressure. Integration body.
  • the functional cylinder including: a numeral symbol 210 and an arrow assembly indicating a wire assembly including a wire 211 and a base material 212; a wire cylinder assembly indicated by the numeral symbol 220 and the arrow, comprising a column material 221, a plurality of roots arranged on the side of the column circumferentially along the direction of the column 221 at a set interval A wire 222 and a base material 223 connecting the column material 221 and the plurality of wires 222 as a whole; a symbol bar and a resistor block indicated by an arrow, comprising a plurality of strip conductors 231 in a forward and reverse folded form.
  • the column in the wire cylinder assembly indicated by the numeral symbol 220 and the arrow in FIG. 2 and the material and cross-sectional shape of the single material cylinder indicated by the numeral symbol 280 and the arrow can be set as needed without Limited to semiconductor materials, magnet materials, and squares; in addition, the shape and number of wires in the wire cylinder assembly illustrated by numeral symbols 220 and 290 in FIG. 2 can also be set as needed, and is not limited to the one layer circle illustrated in FIG. The shaped wires are distributed on four or both sides of the cylinder.
  • the conductor post assembly illustrated by numeral 290 in Fig. 2 is also referred to as a transformer cylinder, which can be similarly fabricated in accordance with the method of manufacturing the conductor post assembly.
  • the functional cylinders illustrated in FIG. 2 are the basic units of the functional cylindrical assembly of the present invention, but in addition to the single material column illustrated by numeral 280, other functional cylinders need to be fabricated. . Accordingly, in the present invention, in order to manufacture the functional pillar assembly, it discloses key steps of the method of manufacturing the functional cylinder, such as some of the fabrication methods illustrated in Figures 3-6.
  • FIGS. 3 and 3A are schematic diagrams showing a method of fabricating a passive electronic component cylinder illustrated by the numeral symbol 3400 by a double or triple slab illustrated by the numeral symbol 3000 in one embodiment of the present invention.
  • the numeral symbol 300 in Fig. 3 illustrates a multilayer slat; the numeral symbols 310, 320 and 330 illustrate a cross-sectional view of the multilayer slat, wherein 310 indicates a three-layer board in which the conductive layer or the dielectric layer is insulated or dielectric layer.
  • 320 illustrates a two-layer slat having a conductive layer on top and an insulating or dielectric layer on the lower surface; 320 is a two-layer slat having an upper conductive layer or an insulating or dielectric layer thereon, but the upper conductive layer is The left or right side is shorter than the underlying insulating layer to form a staggered structure.
  • the numeral 341 in Fig. 3A illustrates a resistor cylinder which can be closely folded into a cylinder by the three-layer slats 310 of Fig. 3, and is folded back and forth.
  • the set temperature and pressure are made by solidifying the stacked cylinders into one unit; numeral 342 in Figure 3A illustrates an inductor cylinder that can be double slat 320 or three in Figure 3.
  • the layer strip 310 is tightly wound into a cylinder and is formed by solidifying the rolled cylinder into a unit by a set temperature and pressure; numeral 343 in FIG. 3A indicates a capacitor cylinder. It can be stacked into a column by a plurality of double-layer slats 330 having a staggered structure as illustrated in FIG. 3, and is formed by solidifying the stacked columns into a whole by a set temperature and pressure; FIG.
  • the numeral 344 in the middle indicates a layered strip cylinder which can be stacked into a cylinder by a plurality of double slats 320 or three slats 310 as illustrated in Fig. 3, and the said temperature has been set by a set temperature and pressure.
  • the stacked cylinders are solidified into one unit.
  • numeral symbol 5000 illustrates a first portion of the jig illustrated by numeral 510 and a second portion indicated by numeral 520.
  • the first portion 510 includes a set of transverse round bars as indicated by numeral symbols 511/514 and support members as indicated by numeral symbols 512/513 on either side of the transverse round bars, said The two portions 520 comprise a set of longitudinal round bars as illustrated by numeral symbols 521/224 and support members as indicated by numeral symbols 522/523 at the upper and lower ends of said longitudinal round bars, numeral 530 indicating the first portion of the clamp
  • the 510 and second portion 520 are stacked together to form a mesh structure in which each mesh receives and positions a wire to regularly align and secure a set of wires in the fixture.
  • Numeral symbol 5100 in FIG. 4A illustrates the plurality of sets of clamps illustrated by numeral symbols 530, 540 and 550.
  • the conductors indicated by numeral 561 are pulled from the supply end, such as the plurality of spools indicated by numeral 560, and positioned in each of the two.
  • the dotted line indicated by numeral 545 indicates a cutting line, so that the line segment 561 which is tensioned and fixed between the jigs 530 and 540 together with the jig can be It is placed in a mold to fill or cast the base material to manufacture a wire assembly.
  • FIG. 4B illustrates another option of filling or casting the line segments between the clamps 530 and 540 with a base material, wherein the dashed lines indicated by numeral 545/555 indicate a surrounding fixture 530. 540 and the open slot of the line segment 561, the base material can be filled or cast in the open slot 545/555 to create a wire assembly.
  • the numeral symbol 5300 in Figure 4C illustrates a continuous production process in which the line segments indicated by numeral 562 are pulled from the spool 560 by the clamp 550, the numerical symbols 570 and 580 indicate the newly inserted clamp, and then the repetition of Figure 4A or Figure 4B is repeated.
  • the step of tensioning and fixing the line segment between the jigs 550 and 570 is filled or cast with a base material to manufacture the next wire assembly.
  • Figure 5 is a perspective view of a belt-shaped base comprising a wire on the side of a cylinder in one embodiment of the invention.
  • Numerals 610 and 620 in FIG. 5 illustrate a front view and a cross-sectional view of a strip substrate including wires, wherein numerals 612 or 622 illustrate wires laid on a strip substrate 611 or 621;
  • the strip-shaped substrate comprising the wires is laid or wrapped to the side of a cylinder to form a conductor pillar assembly as indicated by numeral 630 or 640, wherein the reference numerals 630 and 640 respectively indicate the conductor pillars
  • FIG. 6 is a schematic diagram of a method of fabricating a conductor post assembly by laying a wire on the side of a cylinder in accordance with one embodiment of the present invention, wherein numeral 7000 illustrates a critical step in laying the conductor 700 on the side of a cylinder 710.
  • the numeral symbol 700 in Fig. 6 indicates a wire source end, such as a coil
  • the numeral symbol 710 indicates a cylinder
  • the numeral symbol 720 and the arrow indicate that the wires are layer by layer along the side of the column.
  • the predetermined pitch is entangled, and the numerical symbols 730 and 740 are schematically disposed at the two ends of the column for separating the spacing between the wire layers, and the spacing between the wires in the same layer can be when the wire is wound.
  • Numeral symbol 750 in Fig. 6 illustrates a cross-sectional view along column A to A of a cylinder 710 wound with two layers of conductors
  • numeral 760 indicates a conductor formed by winding a cylinder of two layers of conductors in a base material 761. Cylinder integration.
  • FIG. 7 is a schematic diagram 8000 of a circular functional substrate in accordance with one embodiment of the present invention, wherein the functional substrate 800 includes a plurality of functional substrates 810 regularly arranged at a set pitch, each functional basis
  • the sheet comprises a plurality of functional sheets, such as a plurality of functional sheets illustrated by numeral 811, comprising a cylindrical sheet 820 and twelve wire sheets 830 surrounding the column sheets;
  • the substrate 810 may also include only one functional via, such as the conductor post tab illustrated by numeral 812, which is comprised of wire vias 850 and post tabs 840 that are cured in the base material 860.
  • the pillar through sheets, such as 820 or 840, included in the functional substrate 810 may be a piece of semiconductor material or a functional through sheet such as numeral symbols 821, 822, 823, 824, 825, or 826 illustrates resistor vias, capacitor vias, inductor vias, capacitor vias with electrodes, layered strips or transformer vias.
  • the functional cylinder set 110 of Figure 1 is set to a base material of ceramic or glass.
  • the wire assembly body, the base material 113 for bonding the ceramic or glass-based wire assembly together is set as an organic material, such as a polymer material or a molding compound, thereby forming a functional substrate 121 which is a A flexible functional ceramic or glass substrate comprising a plurality of ceramic or glass substrates comprising wire vias.
  • the functional cylinder set 110 of FIG. 1 is configured as a conductor pillar assembly, wherein the cylinder is a column of semiconductor material, such as a silicon pillar, and the conductor is a metal wire.
  • the material of the semiconductor material column and the metal wire are connected to form a wire column assembly, and the base material 113 connecting the wire column assembly body is set as a ceramic or glass material, thereby
  • the resulting functional substrate 121 is a functional silicon substrate comprising a plurality of silicon substrates having wire vias around them.
  • the functional cylinder set 110 of FIG. 1 is configured to include a wire assembly and a passive electronic component cylinder, wherein the passive electronic component cylinder can be a resistor cylinder, a capacitor cylinder, an inductor
  • the pillar, or the layered strip is formed into a functional substrate 121 which is a substrate including conductive vias and passive electronic component sheets.

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Abstract

Provided are a method for manufacturing a functional substrate by means of a functional column integrated body and a functional substrate. The functional column integrated body (100) is integrated by means of a plurality of functional columns (110), and the functional substrate (121) is manufactured by segmenting the functional column integrated body (100) into pieces; the functional column (110) comprises a columnar semiconductor material, a columnar magnetic material, a lead integrated body, a lead column integrated body and a passive electronic component electric column or a transformer column. The functional column integrated body comprises: a silicon column and lead column integrated body made of a silicon column lead integrated body and a passive electronic component column and lead column integrated body made of the passive electronic component column and a lead column. The above-mentioned functional substrate can make the structural and performance design of integrated circuit semiconductor packages more flexible and efficient.

Description

制造功能性基板的方法和功能性基板Method of manufacturing a functional substrate and functional substrate
相关申请的交叉引用Cross-reference to related applications
本申请要求享有于2014年10月15日提交的名称为“制造功能性基板的方法和功能性基板”的中国专利申请CN201410544633.9的优先权，该申请的全部内容通过引用并入本文中。The present application claims priority to Chinese Patent Application No. CN20141054463, filed on Jan. 15, 2014, which is hereby incorporated by reference.
技术领域Technical field
本发明一般地涉及集成电路半导体封装技术，特别地涉及制造一种功能性基板的方法。通过在所述的功能性基板的上下表面制作电路和焊盘，其可以进一步制作成用于集成电路半导体封装的功能性电路基板。所述的功能性电路基板使集成电路半导体封装的结构设计更加灵活，并可有效地加强集成电路半导体封装的性能。This invention relates generally to integrated circuit semiconductor packaging technology, and more particularly to a method of fabricating a functional substrate. The circuit and the pad can be fabricated on the upper and lower surfaces of the functional substrate, which can be further fabricated into a functional circuit substrate for an integrated circuit semiconductor package. The functional circuit substrate makes the structural design of the integrated circuit semiconductor package more flexible, and can effectively enhance the performance of the integrated circuit semiconductor package.
背景技术Background technique
在集成电路半导体封装技术中，电路基板是用于整合电子产品功能的元件，其构成了集成电路半导体芯片与其它芯片或电子元件的桥梁。有通孔的(TSV:Through Silicon Via,TSV:Through Substrate Via and TGV:Through Glass Via)硅，玻璃，陶瓷或有机材料基板在集成电路半导体封装技术中已有广泛的应用，是3D和2.5D集成电路半导体封装中的关键元件。基于含有通孔的基板制成的电路基板通常用于3D和2.5D集成电路半导体封装技术中，其可有效地整合电子产品的功能。含有通孔的基板包括含有通孔的硅基板，玻璃基板，陶瓷基板和有机材料基板。目前，使用的含有通孔的基板的制造方法可以分为两类：一类是基于基板的方法，另一类是基于通孔的方法。基于基板的方法基本上包括：1)在基板上先开一些所需的孔，2)然后用导电材料填充这些孔，从而形成一个含有导电通孔的基板。基于通孔的方法基本上包括：1)先在一个载体上制作一些点状的小金属柱，2)然后用一个基板材料覆盖这些点状的小金属柱，再去掉所述的载体并打磨上下表面以露出点状的小金属柱，从而形成一个含有导电通孔的基板。目前，含有通孔的基板的使用是通过制作于基板表面的电路和焊盘把含有通孔的基 板进一步制作成含有通孔的电路基板，从而在集成电路半导体封装中把位于基板上表面的电子元件与基板下方的其它电子元件或印刷电路板相连接，位于基板上表面的电路也可以使位于其上的电子元件先直接地进行通讯，然后再与基板下方的其它电子元件或电路板相连接。In integrated circuit semiconductor packaging technology, a circuit substrate is an element for integrating functions of an electronic product, which constitutes a bridge between an integrated circuit semiconductor chip and other chips or electronic components. TSV: Through Silicon Via (TSV: Through Substrate Via and TGV: Through Glass Via) Silicon, glass, ceramic or organic material substrates have been widely used in integrated circuit semiconductor packaging technology, 3D and 2.5D A key component in integrated circuit semiconductor packaging. Circuit boards made based on substrates containing vias are commonly used in 3D and 2.5D integrated circuit semiconductor packaging technologies, which can effectively integrate the functions of electronic products. The substrate including the via holes includes a silicon substrate including a via hole, a glass substrate, a ceramic substrate, and an organic material substrate. At present, the manufacturing methods of the through-hole-containing substrates can be divided into two types: one is a substrate-based method, and the other is a via-based method. The substrate-based method basically comprises: 1) first opening some of the desired holes on the substrate, 2) then filling the holes with a conductive material to form a substrate containing the conductive vias. The method based on the through hole basically comprises: 1) first making some small metal pillars on a carrier, 2) then covering the small metal pillars with a substrate material, removing the carrier and grinding the upper and lower sides. The surface is exposed to a small metal pillar in a dot shape to form a substrate containing conductive via holes. At present, the use of a substrate including a via hole is to form a via hole-containing substrate through a circuit and a pad formed on the surface of the substrate. The board is further fabricated into a circuit substrate including through holes, so that the electronic components on the upper surface of the substrate are connected to other electronic components or printed circuit boards under the substrate in the integrated circuit semiconductor package, and the circuit on the upper surface of the substrate can also be located The electronic components thereon are first directly communicated and then connected to other electronic components or boards below the substrate.
在现有技术中的含有通孔的基板的基本特征包括：1)基板的上下表面是平整的以便在其上进一步制作电路和焊盘；2)通孔是一种导电的金属小柱，嵌入在基板中并按照所需的间距形成规则的排列，3)基板的基体材料是用作保持通孔和在其上进一步制作电路和焊盘的一种载体。需要注意的是，这些现有技术中的含有导电通孔的基板在制造和使用上具有许多局限性。由于其制造工艺，一些局限性包括：1)其制造是非常费时和昂贵的，2)其中所述的金属小柱或通孔不包含绝缘外层，3)由于是通过刻蚀、机械钻头或激光开孔，通孔的侧边不是很平整，4)通孔的直径不能非常小，现有技术制造通孔小于10微米，并且超过一定厚度(如100微米以上)的基板是非常昂贵的，5)通孔的间距不能非常小，(如现有技术在100微米以上厚度的基板上制造小于50微米间距的通孔是困难和昂贵的)，6)含有通孔的基板的厚度受到通孔尺寸和间距的限制，通孔间距越小，基板就得越薄。The basic features of the prior art substrate containing vias include: 1) the upper and lower surfaces of the substrate are flat to further fabricate circuits and pads thereon; 2) the vias are conductive metal posts embedded in A regular arrangement is formed in the substrate and at a desired pitch, 3) the substrate material of the substrate is used as a carrier for holding the vias and further fabricating the pads and pads thereon. It should be noted that these prior art substrates containing conductive vias have a number of limitations in their manufacture and use. Due to its manufacturing process, some limitations include: 1) its manufacture is very time consuming and expensive, 2) the metal posts or vias described therein do not contain an insulating outer layer, and 3) due to etching, mechanical drills or Laser opening, the side of the through hole is not very flat, 4) the diameter of the through hole can not be very small, the prior art manufacturing through hole is less than 10 microns, and the substrate exceeding a certain thickness (such as 100 microns or more) is very expensive, 5) The pitch of the via holes cannot be very small (as in the prior art, it is difficult and expensive to fabricate via holes having a pitch of less than 50 micrometers on a substrate having a thickness of 100 micrometers or more), 6) the thickness of the substrate including the via holes is affected by the via holes. The size and spacing are limited, and the smaller the via pitch, the thinner the substrate.
在现有技术中制作含有被动电子元件(如电阻器，电感器，电容器等)的电路基板的方法包括：1)被动电子元件通过另外的工艺被安装在电路基板的表面，2)被动电子元件通过另外的工艺被埋入电路基板中，3)通过在电路基板的表面制作导电图案来形成被动电。A method of fabricating a circuit substrate containing passive electronic components (such as resistors, inductors, capacitors, etc.) in the prior art includes: 1) passive electronic components are mounted on the surface of the circuit substrate by another process, and 2) passive electronic components It is buried in the circuit substrate by another process, and 3) passive electricity is formed by making a conductive pattern on the surface of the circuit substrate.
发明内容Summary of the invention
本发明是本申请人于2013年12月5日和2013年12月27日提交的中国发明专利申请CN201310651705.5和CN201310737666.0的进一步发展。所述的已提交的专利申请CN201310651705.5公开了一种基于金属线图形阵列制造金属线集成体或导线集成体，并进一步制造含有图形阵列通孔的基板的方法。该方法包括如下关键步骤：制作一个金属线图形阵列；在金属线之间和周围的空间制作固态介电基体，从而形成一个包含金属线图形阵列的金属线集成体；把所述金属线集成体分割成片，从而形成多个含有图形阵列通孔的基板。所述的已提交的专利申请CN201310737666.0公开了一种基于导线的在厚度方向导电的单向导电板 的制造方法。该方法包括如下关键步骤：制作一个经由单向紧密排列的导线制成的导线集成体；把所述导线集成体分割成片，从而制成多个单向导电板或包含导电通孔的基板。The present invention is a further development of the Chinese invention patent applications CN201310651705.5 and CN201310737666.0 submitted by the applicant on December 5, 2013 and December 27, 2013. The above-mentioned published patent application CN201310651705.5 discloses a method of manufacturing a metal wire integrated body or a wire integrated body based on a metal wire pattern array, and further manufacturing a substrate including a pattern array through hole. The method comprises the following key steps: fabricating a metal line pattern array; forming a solid dielectric matrix between the spaces between and around the metal lines to form a metal line integrated body comprising a metal line pattern array; The film is divided into a plurality of sheets to form a plurality of substrates including through holes of the pattern array. The published patent application CN201310737666.0 discloses a unidirectional conductive plate which is electrically conductive in the thickness direction based on a wire. Manufacturing method. The method includes the following key steps: making a wire assembly made of unidirectional closely aligned wires; dividing the wire assembly into pieces to form a plurality of unidirectional conductive plates or substrates comprising conductive vias.
所述的本申请人已提交的中国发明专利申请中的关键构思是通过制作一个包含导线的柱体，并进一步分割成片，从而制造含有通孔的基板。本发明是所述构思的进一步发展，其公开了一种功能性柱体集成体，其即包含导线柱体也包含横截面中的导体具有设定构形的功能性柱体，并公开了制造所述的功能性柱体集成体的方法，所述的功能性柱体集成体可被进一步分割成片，从而制成本发明中称作的功能性基板。在所述功能性基板的表面进一步制作电路层，可制成用于集成电路半导体封装的功能性电路基板。The key idea in the Chinese invention patent application filed by the present applicant is to manufacture a substrate containing a through hole by fabricating a cylinder including a wire and further dividing into a sheet. The present invention is a further development of the concept, which discloses a functional cylinder assembly comprising a conductor post and a functional cylinder having a conductor in a cross-section having a set configuration, and discloses manufacturing In the method of the functional pillar assembly, the functional pillar assembly can be further divided into sheets to form a functional substrate referred to in the present invention. A circuit layer is further formed on the surface of the functional substrate to form a functional circuit substrate for an integrated circuit semiconductor package.
本发明的制造功能性基板的方法，包括如下关键步骤：a)提供功能性柱体；b)把多个功能性柱体按照设定的分布图案相互平行地排列在一起；c)把所述已排列好的多个功能性柱体通过设定的条件，如通过设定的温度和压力，固化成一个整体，从而制成一个含有多个功能性柱体的功能性柱体集成体；d)把所述功能性柱体集成体分割成片，从而制成多片功能性基板。The method of manufacturing a functional substrate of the present invention comprises the following key steps: a) providing a functional cylinder; b) arranging a plurality of functional pillars in parallel with each other according to a set distribution pattern; c) The plurality of functional cylinders that have been arranged are solidified into a whole by set conditions, such as by set temperature and pressure, thereby forming a functional cylinder assembly having a plurality of functional cylinders; The functional pillar assembly is divided into pieces to form a plurality of functional substrates.
本发明的制造功能性基板的方法，其特征在于，在步骤b)中，把多个功能性柱体紧密地排列在一起，并且在步骤c)中，通过设定的条件使所述已排列好的功能性柱体相互连接成一个整体，从而制成一个含有多个功能性柱体的功能性柱体集成体；本发明的制造功能性基板的方法，其特征在于，在步骤b)中，把多个功能性柱体按照设定的间距和分布图案相互平行地排列在一起，并且在步骤c)中，用一个基体材料填充功能性柱体之间和周围的空间，并通过设定的条件把所述已排列好的功能性柱体连同基体材料一起固化成一个整体，从而制成一个含有多个功能性柱体的功能性柱体集成体；本发明的制造功能性基板的方法，其特征在于，所述的相互平行地排列在一起的多个功能性柱体的分布图案构成多个规则地排列的功能性柱体组，其中所述的功能性柱体组包含多个功能性柱体；本发明的制造功能性基板的方法，其特征在于，在步骤a)中所采用的功能性柱体是柱状半导体材料、柱状或条状磁体、导线集成体、导线柱体集成体、电阻器柱体、电容器柱体、电感器柱体或层状板条柱体。本发明的制造功能性基板的方法，其特征在于，包含在所述功能性基板的表面进一步制作电路层，从而制成功能性电路基板的步骤。 A method of manufacturing a functional substrate according to the present invention, characterized in that, in step b), a plurality of functional pillars are closely arranged together, and in step c), said arranged ones are arranged by setting conditions The good functional cylinders are connected to each other as a whole to form a functional pillar assembly comprising a plurality of functional cylinders; the method of manufacturing a functional substrate of the present invention, characterized in that in step b) And arranging a plurality of functional pillars in parallel with each other according to a set pitch and a distribution pattern, and in step c), filling a space between and around the functional pillars with a base material, and setting Conditions for solidifying the aligned functional pillars together with the matrix material to form a functional pillar assembly comprising a plurality of functional pillars; the method of manufacturing a functional substrate of the present invention The distribution pattern of the plurality of functional cylinders arranged in parallel with each other constitutes a plurality of regularly arranged functional cylinder groups, wherein the functional cylinder group A plurality of functional pillars; the method of manufacturing a functional substrate of the present invention, characterized in that the functional pillar used in the step a) is a columnar semiconductor material, a columnar or strip magnet, a wire assembly, a wire column Body assembly, resistor cylinder, capacitor cylinder, inductor cylinder or layered slab cylinder. A method of producing a functional substrate according to the present invention is characterized by comprising the step of further forming a circuit layer on the surface of the functional substrate to form a functional circuit substrate.
本发明的制造功能性基板的方法，其特征在于，所述功能性柱体包括导线集成体，所述导线集成体通过下述步骤来制造：I)提供导线，II)通过多组夹具把所述的多根导线在纵向和横向按设定的间距平行地排列，并拉紧和固定在每两个夹具之间，III)把每两个夹具之间已排列好的多根导线固化在一个基体材料中，从而制成一个柱状的导线集成体。The method of manufacturing a functional substrate of the present invention is characterized in that the functional pillar comprises a wire integrated body, and the wire integrated body is manufactured by the following steps: I) providing a wire, II) passing a plurality of sets of jigs The plurality of wires are arranged in parallel at a set pitch in the longitudinal direction and the lateral direction, and are tensioned and fixed between each two clamps, III) solidifying a plurality of aligned wires between each two clamps in one In the base material, a columnar wire assembly is thus produced.
本发明的制造功能性基板的方法，其特征在于，所述功能性柱体包括导线柱体集成体，所述导线柱体集成体通过下述步骤来制造：I)提供多根导线和一个柱体，II)把所述的多根导线按设定的间距沿着柱体方向排列并固定在所述柱体的侧面，从而制成一个导线柱体集成体。The method of manufacturing a functional substrate according to the present invention is characterized in that the functional pillar comprises a conductor pillar assembly, and the conductor pillar assembly is manufactured by the following steps: I) providing a plurality of wires and a column Body, II) arranging the plurality of wires at a set pitch along the column direction and fixing to the side of the column, thereby forming a wire column assembly.
本发明的制造功能性基板的方法，其特征在于，所述功能性柱体包括导线柱体集成体，所述导线柱体集成体通过下述步骤来制造：I)提供或制作带状材料，其包含按设定间距单向排列的导线，II)把所述的含有导线的带状材料固定在所述柱体的侧面，并在设定的条件下把所述含有导线的带状材料和所述柱体固化成一个整体，从而制成一个导线柱体集成体。The method of manufacturing a functional substrate according to the present invention is characterized in that the functional pillar comprises a conductor pillar assembly, and the conductor pillar assembly is manufactured by the following steps: I) providing or fabricating a strip material, It comprises a wire arranged unidirectionally at a set pitch, II) fixing the wire-like material containing the wire to the side of the cylinder, and placing the wire-like material containing the wire under a set condition The cylinder is solidified into a unitary body to form a conductor pillar assembly.
本发明的制造功能性基板的方法，其特征在于，所述功能性柱体包括电阻器柱体，所述电阻器柱体通过下述步骤来制造：I)提供或制作三层结构的方形或长方形片状材料，其中的两层外层是绝缘材料层，中间层是导电材料层，I)把所述三层结构的方形或长方形片状材料通过正反折叠的方式折叠成一个柱体，并通过设定的温度和压力把所述叠成好的柱体固化成一个整体，从而制成一个电阻器柱体；本发明的制造功能性基板的方法，其特征在于，所述功能性柱体包括电容器柱体，所述电容器柱体通过下述步骤来制造：I)提供条状介电材料，II)在所述条状介电材料上覆盖一层导电材料层，从而制成包含条状介电材料和导电材料层的双层板条，III)把多个所述的双层板条堆叠成一个柱体，并通过设定的温度和压力把所述已堆叠成的柱体固化成一个整体，从而制成一个电容器柱体；本发明的制造功能性基板的方法，其特征在于，所述功能性柱体包括电感器柱体：I)提供或制作双层结构的方形或长方形片状材料，其中的一层是介电材料层，另一层是导电材料层；II)把所述双层结构的方形或长方形片状材料通过螺旋折叠的方式紧密地折叠成一个柱体，并通过设定的温度和压力把所述已折叠好的柱体固化成一个整体，从而制成一个电感器柱体。The method of manufacturing a functional substrate of the present invention, characterized in that the functional pillar comprises a resistor cylinder, the resistor cylinder being manufactured by the following steps: I) providing or fabricating a three-layered square or a rectangular sheet material, wherein two outer layers are an insulating material layer, the middle layer is a conductive material layer, and I) the square or rectangular sheet material of the three-layer structure is folded into a cylinder by folding back and forth. And forming the resistor cylinder into a whole by setting the temperature and pressure to form a resistor cylinder; the method for manufacturing a functional substrate of the present invention, characterized in that the functional column The body comprises a capacitor cylinder which is manufactured by: I) providing a strip of dielectric material, II) coating a strip of conductive material on the strip of dielectric material to form a strip comprising a double-layer slab of a dielectric material and a layer of conductive material, III) stacking a plurality of said double-layer slats into a cylinder, and curing said stacked cylinders by a set temperature and pressure Integral Forming a capacitor cylinder; the method of manufacturing a functional substrate of the present invention, characterized in that the functional pillar comprises an inductor cylinder: I) a square or rectangular sheet material providing or fabricating a two-layer structure, wherein One layer is a layer of dielectric material and the other layer is a layer of conductive material; II) the square or rectangular sheet material of the double layer structure is tightly folded into a cylinder by spiral folding, and passes through a set temperature And the pressure solidifies the folded cylinder into a whole to form an inductor cylinder.
本发明的功能性基板，其特征在于，所述的功能性基板包括多个按设定间距 规则地排列的功能性基片，每个所述的功能性基片包含一个或多个功能性通片，所述的功能性通片的类型包括片状半导体材料、片状磁体材料、导线通片、导线柱体通片、电阻器通片、电容器通片、电感器通片、层形条通片或者变压器通片。本发明的导线柱体集成体，其特征在于，所述的导线柱体集成体包含一个柱体和多根导线，其中所述的多根导线按设定的间距沿着所述柱体的方向环绕地排列在所述柱体的侧面。本发明的功能性柱体，包括：电阻器柱体、电容器柱体或者电感器柱体，其特征在于，所述的电阻器柱体包含构成电阻器结构的正反折叠形式的多层条状导体和分隔所述多层条状导体的绝缘材料；所述的电容器柱体包含构成电容器结构的交错形式的多层条状导体和分隔所述的多层条状导体的介电材料；所述的电感器柱体包含构成电感器结构的卷状的多层导体和分隔所述卷状的多层导体的绝缘材料。The functional substrate of the present invention is characterized in that the functional substrate comprises a plurality of set spacings Regularly arranged functional substrates, each of said functional substrates comprising one or more functional sheets, said type of functional sheets comprising sheet-like semiconductor material, sheet magnet material, wire pass Sheet, wire cylinder through piece, resistor through piece, capacitor through piece, inductor through piece, layered strip through piece or transformer through piece. The wire column assembly of the present invention is characterized in that the wire column assembly comprises a cylinder and a plurality of wires, wherein the plurality of wires are along the direction of the column at a set interval Arranged circumferentially on the side of the cylinder. The functional cylinder of the present invention comprises: a resistor cylinder, a capacitor cylinder or an inductor cylinder, wherein the resistor cylinder comprises a plurality of strips in a form of a forward and reverse fold forming a resistor structure. a conductor and an insulating material separating the plurality of strip conductors; the capacitor cylinder comprising a plurality of strip conductors constituting a staggered form of the capacitor structure and a dielectric material separating the plurality of strip conductors; The inductor core includes a rolled multilayer conductor constituting the inductor structure and an insulating material separating the rolled multilayer conductor.
本发明的功能性柱体集成体，包括：多个按设定间距规则地排列的功能性柱体组，所述的每个功能性柱体组包含一个或多个功能性柱体，所述的功能性柱体包括柱状半导体。材料、柱状或条状磁体、导线集成体、导线柱体集成体、电阻器柱体、电容器柱体、电感器柱体、层形条柱体、或者变压器柱体。本发明的功能性柱体集成体，其特征在于，所述的功能性柱体组包含两种或多种类型的功能性柱体；本发明的功能性柱体集成体，其特征在于，其包含一种基体材料，其中所述的多个功能性柱体通过所述的基体材料相互连接成一个整体。The functional cylinder assembly of the present invention comprises: a plurality of functional cylinder groups regularly arranged at a set pitch, each functional cylinder group comprising one or more functional cylinders, The functional pillars include columnar semiconductors. Materials, columnar or strip magnets, wire assemblies, wire column assemblies, resistor columns, capacitor banks, inductor columns, layered bars, or transformer columns. The functional cylinder assembly of the present invention is characterized in that the functional cylinder group comprises two or more types of functional cylinders; the functional cylinder assembly of the present invention, characterized in that A matrix material is included wherein the plurality of functional pillars are interconnected as a unit by the matrix material.
在本发明中，关键的发明构思是把多个功能性柱体排列好并固化成一个功能性柱体集成体并进一步分割成片，从而制成多片功能性基板。这里把所述柱体称作功能性柱体是因为所述柱体的横截面内的导体、半导体或磁体材料具有设定的构形，其相互配合可以形成设定的导电功能。本发明的最大优点是可便宜和快捷地制造现有技术不易制造的包含特定导电功能的基板，如包含导电通孔和被动电子器件的功能性基板。本发明中一些其它的优点，特征和相关的发明性概念会参照下面的附图说明在本发明的具体实施方式中加以详述。In the present invention, a key inventive concept is to arrange a plurality of functional cylinders into a functional pillar assembly and further divide into sheets to form a plurality of functional substrates. The cylinders are referred to herein as functional cylinders because the conductor, semiconductor or magnet material within the cross-section of the cylinder has a defined configuration that cooperate to form a set conductive function. The greatest advantage of the present invention is that substrates containing specific conductive functions, such as functional substrates comprising conductive vias and passive electronic devices, that are difficult to manufacture in the prior art can be manufactured inexpensively and quickly. Some other advantages, features, and related inventive concepts of the present invention will be described in detail in the Detailed Description of the Invention.
附图说明DRAWINGS
图1和图1A为本发明一个实施例中经由一个功能性柱体集成体制造功能性基板的方法的示意图；1 and 1A are schematic diagrams of a method of fabricating a functional substrate via a functional pillar assembly in accordance with one embodiment of the present invention;
图2为本发明一个实施例中的各种功能性柱体的横截面示意图； 2 is a schematic cross-sectional view of various functional columns in one embodiment of the present invention;
图3为本发明一个实施例中所采用的用于制作功能性柱体的双层或三层板条的示意图；3 is a schematic view of a double or triple slab for making a functional cylinder used in an embodiment of the present invention;
图3A为本发明一个实施例中通过折叠一个双层或三层板条，或通过堆叠多个双层或三层板条制作功能性柱体的示意图；3A is a schematic view of a functional cylinder formed by folding a double or triple slab or by stacking a plurality of double or triple slats according to an embodiment of the invention;
图4为本发明一个实施例中一种用于排列和固定导线的夹具的示意图；4 is a schematic view of a jig for arranging and fixing wires according to an embodiment of the present invention;
图4A，图4B和图4C为本发明一个实施例中利用图4示意的夹具制作柱状导线集成体的主要步骤的示意图；4A, FIG. 4B and FIG. 4C are schematic diagrams showing main steps of fabricating a columnar conductor assembly using the jig illustrated in FIG. 4 according to an embodiment of the present invention; FIG.
图5为本发明一个实施例中通过在一个柱体的侧面铺设包含导线的带状基材制作导线柱体集成体的方法的示意图；5 is a schematic view showing a method of fabricating a wire column assembly by laying a strip-shaped substrate including a wire on a side of a cylinder according to an embodiment of the present invention;
图6为本发明一个实施例中通过在一个柱体的侧面缠绕单向排列的导线制作导线柱体集成体的方法的示意图；6 is a schematic view showing a method of fabricating a wire column assembly by winding a unidirectionally aligned wire on a side of a cylinder according to an embodiment of the present invention;
图7为本发明一个实施例中一个圆形的功能性基板的示意图，其中所述的功能性基板包括多个按设定间距规则地排列的功能性基片，每个功能性基片包括多个功能性通片。7 is a schematic view of a circular functional substrate in accordance with one embodiment of the present invention, wherein the functional substrate includes a plurality of functional substrates regularly arranged at a set pitch, each functional substrate including a plurality of functional substrates. Functional film.
具体实施方式detailed description
为清楚地通过参照附图说明本发明的具体实施方式，首先对一些使用的术语解释如下：1)功能性柱体，其代表一个复合材料柱体，包括：基体材料，导体材料和半导体材料，其中的导体材料贯通所述柱体、并在所述柱体的横截面内具有设定的构形，如规则排列的点状或条状图案，如图2示意的一些功能性柱体的横截面图；需要指出的是，术语功能性在本发明中代表所述柱体横截面中的导体材料的导电功能，形成特定的图案，导电功能，2)功能性柱体组，其代表一个包含多个功能性柱体的柱体组合，如图1中数字符号112示意的一个功能性柱体组的横截面图；3)功能性柱体集成体，其代表一个包含多个功能性柱体组的柱体集合，如图1中数字符号100示意的一个功能性柱体集成体；4)导线集成体，其代表一个包含导线的基体材料柱体，其中的导线按设定图案沿柱体方向规则地排列，如图2中数字符号210示意的一个导线集成体的横截面图；5)导线柱体集成体，其代表一个在基体材料中包含多根导线和一个柱体的集成体，其中所述的多根导线按设定的间距沿着所述柱体的方向环绕地排列在所述柱体的侧面，如图2中数字符号220示意的一个导线柱体集成体，图2中数字符号290示意的是一个可 制作变压器的一个导线柱体集成体，这里称作变压器柱体；6)电阻器柱体，其代表一个基体材料柱体，所述的基体材料柱体包含在柱体方向贯通的正反折叠形式的导电板条，如图2中数字符号230示意的一个电阻器柱体；7)电容器柱体，其代表一个基体材料柱体，所述的基体材料柱体包含在柱体方向贯通的交错堆叠的导电板条，如图2中数字符号240和250示意的一个电容器柱体；8)电感器柱体，其代表一个基体材料柱体，所述的基体材料柱体包含在柱体方向贯通的卷状的多层导电板条，如图2中数字符号260示意的一个电感器柱体；9)层形条柱体，其代表一个基体材料柱体，所述的基体材料柱体包含在柱体方向贯通的多层导电板条，如图2中数字符号270示意的一个层形条柱体；10)被动电子元件柱体，包括所述的电阻器柱体、电容器柱体、电感器柱体和层形条柱体。需要指出的是，术语功能性在本发明中代表所述柱体横截面中的导体材料的导电功能；由于导体材料在所述横截面中形成设定的图案，其可具有设定的功能，如在所述横截面内形成被动电子元件。To clearly illustrate the specific embodiments of the present invention by referring to the figures, some of the terms used are first explained as follows: 1) a functional cylinder that represents a composite cylinder comprising: a matrix material, a conductor material, and a semiconductor material, Wherein the conductor material penetrates the cylinder and has a set configuration in a cross section of the cylinder, such as a regularly arranged dot or strip pattern, as shown in Figure 2 for the cross-section of some functional cylinders. Cross-sectional view; it should be noted that the term functionality in the present invention represents the conductive function of the conductor material in the cross-section of the cylinder, forming a specific pattern, conductive function, and 2) a functional column group, which represents a A cylinder combination of a plurality of functional cylinders, a cross-sectional view of a functional cylinder group as indicated by numeral numeral 112 in FIG. 1; 3) a functional cylinder assembly representing a plurality of functional cylinders a set of cylinders, such as a functional cylinder assembly as indicated by numeral 100 in Figure 1; 4) a wire assembly representing a column of matrix material comprising wires, wherein the wires follow a set pattern The body direction is regularly arranged, as shown by the numeral symbol 210 in FIG. 2, a cross-sectional view of a wire assembly; 5) a wire cylinder assembly representing an integrated body comprising a plurality of wires and a cylinder in the base material The plurality of wires are circumferentially arranged on the side of the column along the direction of the column at a set interval, such as a wire column assembly as indicated by numeral 220 in FIG. 2, FIG. The middle number symbol 290 is indicative of a A conductor column assembly of a transformer, referred to herein as a transformer cylinder; 6) a resistor cylinder, which represents a matrix material cylinder, the matrix material cylinder comprising a forward and reverse folded form in the direction of the cylinder a conductive strip, such as a resistor post as indicated by numeral numeral 230 in Figure 2; 7) a capacitor post that represents a matrix of material, the matrix of material comprising interleaved stacks in the direction of the cylinder a conductive strip, such as a capacitor cylinder as indicated by the reference numerals 240 and 250 in FIG. 2; 8) an inductor cylinder, which represents a base material cylinder, the base material cylinder being included in the direction of the cylinder a rolled multi-layer conductive strip, such as an inductor cylinder as indicated by numeral 260 in Figure 2; 9) a layered strip cylinder, which represents a matrix material cylinder, said matrix material cylinder being contained in the column a plurality of conductive strips extending in a body direction, such as a layered strip cylinder as indicated by numeral 270 in FIG. 2; 10) a passive electronic component cylinder including the resistor pillar, the capacitor cylinder, and the inductor pillar Body and layered cylinderIt is pointed out that the term functionality in the present invention represents the electrically conductive function of the conductor material in the cross section of the cylinder; since the conductor material forms a defined pattern in the cross section, it may have a set function, Passive electronic components are formed as in the cross section.
以上是与功能性柱体集成体相关的术语；对应地，与功能性基板相关的术语为：1)功能性通片，其代表经由所述功能性柱体分割成的薄片，如图7中数字符号821，822，823，824和825示意的一些功能性通片，其中的导电体贯通由所述功能性柱体分割成的薄片；2)功能性基片，其代表经由所述功能性柱体组分割成的薄片，如图7中数字符号811和812示意的功能性基片，其包含一个或多个功能性通片；3)功能性基板，其代表经由所述功能性柱体集成体分割成的薄片，如图7中数字符号800示意的一个圆形的功能性基板，其包含多个规则排列的功能性基片；4)导线通片，其代表经由所述导线集成体分割成的薄片；5)导线柱体通片；其代表经由所述导线柱体集成体分割成的薄片，相应地，变压器柱体分割成的薄片称作变压器通片；6)电阻器通片，其代表经由所述电阻器柱体分割成的薄片；7)电容器通片，其代表经由所述电容器柱体分割成的薄片；8)电感器通片，其代表经由所述电感器柱体分割成的薄片；9)层形条通片，其代表经由所述层形条柱体分割成的薄片；10)被动电子元件通片，其代表经由所述被动电子元件柱体分割成的薄片。一般的说，术语通片在这里代表一片基体材料，其包含贯通性的具有设定构形和分布的导体材料。The above are terms related to the functional cylinder assembly; correspondingly, the terms related to the functional substrate are: 1) a functional sheet representing a sheet divided by the functional cylinder, as shown in FIG. Numerical functional symbols 821, 822, 823, 824 and 825, wherein the electrical conductors pass through a sheet divided by the functional cylinder; 2) a functional substrate, which represents via the functionality a sheet into which a cylinder group is divided, such as a functional substrate as indicated by reference numerals 811 and 812 in FIG. 7, which includes one or more functional sheets; and 3) a functional substrate represented by the functional cylinder A sheet into which the integrated body is divided, such as a circular functional substrate as illustrated by numeral 800 in FIG. 7, comprising a plurality of regularly arranged functional substrates; 4) a wire through sheet representing the conductor integrated body a divided sheet; 5) a conductor post sheet; it represents a sheet divided by the conductor pillar assembly, and correspondingly, a sheet divided by a transformer cylinder is called a transformer sheet; 6) a resistor sheet Representing via the resistor cylinder a sliced sheet; 7) a capacitor sheet, which represents a sheet divided by the capacitor cylinder; 8) an inductor sheet, which represents a sheet divided by the inductor cylinder; 9) a layer strip a sheet, which represents a sheet divided by the layered strip cylinder; 10) a passive electronic component sheet, which represents a sheet divided by the passive electronic element cylinder. In general, the term sheet is used herein to mean a piece of matrix material that includes a conductive material having a defined configuration and distribution.
需要注意的是，以上的术语解释仅是为了说明的目的，而不限制本发明的范围和精神。 It is to be understood that the above terms are intended to be illustrative only and not to limit the scope and spirit of the invention.
图1和图1A为本发明一个实施例中经由功能性柱体集成体制造功能性基板的方法的示意图。图1中的数字符号1000示意把多个功能性柱体按照设定的分布图案相互平行地排列在一起形成多个如数字符号110示意的功能性柱体组，其中数字符号111和箭头示意一个包含如数字符号112示意的多个功能性柱体的功能性柱体组的例子，数字符号113示意一种基体材料，其把所述多个功能性柱体连接成一个整体，从而形成一个如数字符号100示意的功能性柱体集成体，数字符号120和箭头示意把所述功能性柱体集成体分割成片，从而制成多片如数字符121示意的功能性基板。图1A是多个按设定的规则排列好的柱体的横截面图，其中的数字符号1500示意把多个功能性柱体151按照设定的分布图案相互平行地排列在一起形成多个功能性柱体组150，其中数字符号152示意功能性柱体组150之间的分割通道，数字符号155和箭头示意把排列好的多个功能性柱体151固化在一个基体材料163中形成数字符号160示意的功能性柱体集成体。在图1A的示意例中，每一个功能性柱体组150包含3x3个功能性柱体151，而在图1的示意例中，每一个功能性柱体组110包含12个导线集成体和一个电感器柱体。需要说明的是，一个功能性柱体组包含的功能性柱体的类型和数量可以根据需要设定，而不限于所述示意例的情况；另外，所述示意例中的功能性柱体集成体100或160是一个方形的柱体，其也可以根据需要设定为其它的形状，如长方形或圆形。1 and 1A are schematic diagrams of a method of fabricating a functional substrate via a functional pillar assembly in accordance with one embodiment of the present invention. The numeral symbol 1000 in FIG. 1 illustrates that a plurality of functional cylinders are arranged in parallel with each other in a set distribution pattern to form a plurality of functional cylinder groups as indicated by numeral symbols 110, wherein the numeral symbols 111 and the arrows indicate one An example of a functional cylinder set comprising a plurality of functional cylinders as illustrated by numeral symbol 112, numeral symbol 113 illustrates a matrix material that joins the plurality of functional cylinders into a single unit to form a A functional cylinder assembly, indicated by numeral symbol 100, numeral symbols 120 and arrows illustrate the division of the functional pillar assembly into a sheet, thereby producing a plurality of functional substrates as indicated by numeral 121. 1A is a cross-sectional view of a plurality of columns arranged according to a set rule, wherein numeral 1500 indicates that a plurality of functional columns 151 are arranged in parallel with each other in accordance with a set distribution pattern to form a plurality of functions. A set of cylinders 150, wherein numeral 152 indicates a split channel between functional cylinder sets 150, numeral 155 and arrows indicate curing of the plurality of functional pillars 151 arranged in a matrix material 163 to form digital symbols 160 shows a functional cylinder assembly. In the schematic example of FIG. 1A, each functional cylinder set 150 includes 3 x 3 functional pillars 151, and in the schematic example of FIG. 1, each functional pillar set 110 includes 12 conductor assemblies and one Inductor cylinder. It should be noted that the type and number of functional cylinders included in one functional cylinder group can be set as needed, and is not limited to the case of the illustrative example; in addition, the functional cylinder integration in the illustrative example The body 100 or 160 is a square cylinder which can also be set to other shapes such as a rectangle or a circle as needed.
在图1和图1A示意的本发明的一个实施例中的功能性柱体集成体包含一个连接所述多个柱体的如数字符号113或163示意的基体材料，其把所述的多个功能性柱体固封在一起形成所述的功能性柱体集成体。需要说明的是，根据需要，所述的多个功能性柱体也可以紧密地排列在一起，并在设定的温度和压力下，通过自身的基体材料相互固化在一起形成一个功能性柱体集成体。The functional cylinder assembly in one embodiment of the invention illustrated in Figures 1 and 1A includes a matrix material, such as numeral symbol 113 or 163, connecting the plurality of cylinders, the plurality of The functional cylinders are hermetically sealed to form the functional cylinder assembly. It should be noted that, as needed, the plurality of functional pillars may also be closely arranged together and solidified together by their own matrix materials to form a functional cylinder under a set temperature and pressure. Integration body.
图2示意本发明一个实施例中所采用的一些功能性柱体的横截面图，所述的功能性柱体包括：数字符号210和箭头示意的一个导线集成体，其包含导线211和基体材料212；数字符号220和箭头示意的一个导线柱体集成体，其包含柱体材料221，按设定的间距沿着所述柱体221的方向环绕地排列在所述柱体的侧面的多根导线222和把所述柱体材料221和多根导线222连接成一个整体的基体材料223；数字符号230和箭头示意的一个电阻器柱体，其包含正反折叠形式的多层条状导体231和分隔所述多层条状导体231的绝缘材料232；数字符 号240和箭头示意的一个电容器柱体，其包含交错形式的多层条状导体241和分隔所述的多层条状导体的介电材料242；数字符号250和箭头示意的另一个电容器柱体，其包含交错形式的多层条状导体251，分隔所述的多层条状导体的介电材料252和连接所述的多层条状导体251的端部的导电板条253；数字符号260和箭头示意的一个电感器柱体，其包含卷状的多层导体261和分隔所述卷状的多层导体的绝缘材料262；数字符号270和箭头示意的一个层形条柱体，其包含导电板条271和绝缘或介电材料层272；数字符号280和箭头示意的一个单一材料柱体，如半导体材料柱体或磁体柱体；数字符号290和箭头示意的一个变压器柱体，其包含一个管状的磁体材料柱体291、排列在所述管状柱体两个对边的里外侧的导线292和293、以及把所述的管状柱体和导线固化成一个柱体的基体材料294和295。2 illustrates a cross-sectional view of some of the functional pillars employed in one embodiment of the present invention, the functional cylinder including: a numeral symbol 210 and an arrow assembly indicating a wire assembly including a wire 211 and a base material 212; a wire cylinder assembly indicated by the numeral symbol 220 and the arrow, comprising a column material 221, a plurality of roots arranged on the side of the column circumferentially along the direction of the column 221 at a set interval A wire 222 and a base material 223 connecting the column material 221 and the plurality of wires 222 as a whole; a symbol bar and a resistor block indicated by an arrow, comprising a plurality of strip conductors 231 in a forward and reverse folded form. And an insulating material 232 separating the multilayer strip conductors 231; a number of characters No. 240 and an arrow indicate a capacitor cylinder comprising a plurality of strip conductors 241 in a staggered form and a dielectric material 242 separating the plurality of strip conductors; numeral symbol 250 and another capacitor cylinder indicated by an arrow a multi-layer strip conductor 251 in a staggered form, a dielectric material 252 separating the multi-layer strip conductors, and a conductive strip 253 connecting the ends of the multi-layer strip conductor 251; numeral 260 And an inductor cylinder illustrated by an arrow, comprising a rolled multilayer conductor 261 and an insulating material 262 separating the rolled multilayer conductor; a symbol 270 and a layered bar indicated by an arrow, comprising Conductive strip 271 and insulating or dielectric material layer 272; numeral 280 and a single material cylinder indicated by arrows, such as a semiconductor material cylinder or magnet cylinder; numeral 290 and an arrow indicating a transformer cylinder, including a tubular magnet material cylinder 291, wires 292 and 293 arranged inside and outside the two opposite sides of the tubular cylinder, and base materials 294 and 2 for solidifying the tubular cylinder and the wire into a cylinder 95.
需要说明的是，图2中数字符号220和箭头示意的导线柱体集成体中的柱体以及数字符号280和箭头示意的单一材料柱体的材料和横截面形状可以按照需要设定，而不限于半导体材料、磁体材料及方形；另外，图2中数字符号220和290示意的导线柱体集成体中的导线的形状和数量也可以按照需要设定，而不限于图2示意的一层圆形导线及分布在柱体的四边或两边。图2中数字符号290示意的导线柱体集成体也被称作变压器柱体，其可按照导线柱体集成体的制造方法被类似地制造。另外，需要说明的是，图2示意的这些功能性柱体是本发明制造功能性柱体集成体的基本单元，但除了数字符号280示意的单一材料柱体外，需要制作其它的功能性柱体。因此，在本发明中，为了制造所述的功能性柱体集成体，其公开了制造所述的功能性柱体的方法的关键步骤，如图3到图6示意的一些制作方法。It should be noted that the column in the wire cylinder assembly indicated by the numeral symbol 220 and the arrow in FIG. 2 and the material and cross-sectional shape of the single material cylinder indicated by the numeral symbol 280 and the arrow can be set as needed without Limited to semiconductor materials, magnet materials, and squares; in addition, the shape and number of wires in the wire cylinder assembly illustrated by numeral symbols 220 and 290 in FIG. 2 can also be set as needed, and is not limited to the one layer circle illustrated in FIG. The shaped wires are distributed on four or both sides of the cylinder. The conductor post assembly illustrated by numeral 290 in Fig. 2 is also referred to as a transformer cylinder, which can be similarly fabricated in accordance with the method of manufacturing the conductor post assembly. In addition, it should be noted that the functional cylinders illustrated in FIG. 2 are the basic units of the functional cylindrical assembly of the present invention, but in addition to the single material column illustrated by numeral 280, other functional cylinders need to be fabricated. . Accordingly, in the present invention, in order to manufacture the functional pillar assembly, it discloses key steps of the method of manufacturing the functional cylinder, such as some of the fabrication methods illustrated in Figures 3-6.
图3和图3A为本发明一个实施例中通过数字符号3000示意的双层或三层板条制作数字符号3400示意的被动电子元件柱体的方法的示意图。图3中的数字符号300示意一个多层板条；数字符号310，320和330示意多层板条的截面图，其中310示意一个中间为导电层，两边为绝缘或介电层的三层板条；320示意一个上面为导电层，下面为绝缘或介电层的双层板条；320示意一个上面为导电层，下面为绝缘或介电层的双层板条，但上面的导电层在左侧或右侧比下面的绝缘层短，形成交错结构。图3A中的数字符号341示意一个电阻器柱体，其可由图3中的三层板条310经过正反折叠的方式紧密地折叠成一个柱体，并通过 设定的温度和压力把所述叠成好的柱体固化成一个整体而制成；图3A中的数字符号342示意一个电感器柱体，其可由图3中的双层板条320或三层板条310紧密地卷成一个柱体，并通过设定的温度和压力把所述已卷好的柱体固化成一个整体而制成；图3A中的数字符号343示意一个电容器柱体，其可由图3示意的多个具有交错结构的双层板条330堆叠成一个柱体，并通过设定的温度和压力把所述已堆叠成的柱体固化成一个整体而制成；图3A中的数字符号344示意一个层形条柱体，其可由图3示意的多个双层板条320或三层板条310堆叠成一个柱体，并通过设定的温度和压力把所述已堆叠成的柱体固化成一个整体而制成。3 and 3A are schematic diagrams showing a method of fabricating a passive electronic component cylinder illustrated by the numeral symbol 3400 by a double or triple slab illustrated by the numeral symbol 3000 in one embodiment of the present invention. The numeral symbol 300 in Fig. 3 illustrates a multilayer slat; the numeral symbols 310, 320 and 330 illustrate a cross-sectional view of the multilayer slat, wherein 310 indicates a three-layer board in which the conductive layer or the dielectric layer is insulated or dielectric layer. Bar; 320 illustrates a two-layer slat having a conductive layer on top and an insulating or dielectric layer on the lower surface; 320 is a two-layer slat having an upper conductive layer or an insulating or dielectric layer thereon, but the upper conductive layer is The left or right side is shorter than the underlying insulating layer to form a staggered structure. The numeral 341 in Fig. 3A illustrates a resistor cylinder which can be closely folded into a cylinder by the three-layer slats 310 of Fig. 3, and is folded back and forth. The set temperature and pressure are made by solidifying the stacked cylinders into one unit; numeral 342 in Figure 3A illustrates an inductor cylinder that can be double slat 320 or three in Figure 3. The layer strip 310 is tightly wound into a cylinder and is formed by solidifying the rolled cylinder into a unit by a set temperature and pressure; numeral 343 in FIG. 3A indicates a capacitor cylinder. It can be stacked into a column by a plurality of double-layer slats 330 having a staggered structure as illustrated in FIG. 3, and is formed by solidifying the stacked columns into a whole by a set temperature and pressure; FIG. 3A The numeral 344 in the middle indicates a layered strip cylinder which can be stacked into a cylinder by a plurality of double slats 320 or three slats 310 as illustrated in Fig. 3, and the said temperature has been set by a set temperature and pressure. The stacked cylinders are solidified into one unit.
图4为本发明一个实施例中用于规则地排列和固定导线的一种夹具的示意图，其中数字符号5000示意所述的夹具由数字符号510示意的第一部分和数字符号520示意的第二部分组成；所述的的第一部分510包含一组如数字符号511/514示意的横向圆杆和在所述的横向圆杆两侧的如数字符号512/513示意的支撑部件，所述的的第二部分520包含一组如数字符号521/524示意的纵向圆杆和在所述的纵向圆杆的上下端的如数字符号522/523示意的支撑部件，数字符号530示意所述的夹具的第一部分510和第二部分520叠在一起形成的网眼结构，其中每一个网眼容纳并定位一根导线，从而把一组导线规则地排列和固定在所述的夹具中。图4A中的数字符号5100示意通过数字符号530，540和550示意的多组夹具把数字符号561示意的导线从供线端，如数字符号560示意的多个线轴拉出并定位在每两个夹具中，如线段561被拉紧和固定在夹具530和540之间，数字符号545表示的虚线示意一个切割线，从而被拉紧和固定在夹具530和540之间的线段561连同夹具可以被安置到一个模具中进行基体材料的填充或浇铸，从而制造一个导线集成体。图4B中的数字符号5200示意用一个基体材料填充或浇铸所述的拉紧和固定在夹具530和540之间的线段的另一个选择，其中数字符号545/555表示的虚线示意一个包围夹具530，540和线段561的开口槽，基体材料可以填充或浇铸在所述的开口槽545/555中，从而制造一个导线集成体。图4C中的数字符号5300示意一个连续的生产过程，其中数字符号562示意的线段被夹具550从线轴560拉出，数字符号570和580示意新插入的夹具，然后重复图4A或图4B示意的用一个基体材料填充或浇铸拉紧和固定在夹具550和570之间的线段的步骤，从而制造下一个导线集成体。4 is a schematic view of a jig for regularly arranging and securing wires in an embodiment of the present invention, wherein numeral symbol 5000 illustrates a first portion of the jig illustrated by numeral 510 and a second portion indicated by numeral 520. Composition; the first portion 510 includes a set of transverse round bars as indicated by numeral symbols 511/514 and support members as indicated by numeral symbols 512/513 on either side of the transverse round bars, said The two portions 520 comprise a set of longitudinal round bars as illustrated by numeral symbols 521/224 and support members as indicated by numeral symbols 522/523 at the upper and lower ends of said longitudinal round bars, numeral 530 indicating the first portion of the clamp The 510 and second portion 520 are stacked together to form a mesh structure in which each mesh receives and positions a wire to regularly align and secure a set of wires in the fixture. Numeral symbol 5100 in FIG. 4A illustrates the plurality of sets of clamps illustrated by numeral symbols 530, 540 and 550. The conductors indicated by numeral 561 are pulled from the supply end, such as the plurality of spools indicated by numeral 560, and positioned in each of the two. In the jig, as the line segment 561 is tensioned and fixed between the jigs 530 and 540, the dotted line indicated by numeral 545 indicates a cutting line, so that the line segment 561 which is tensioned and fixed between the jigs 530 and 540 together with the jig can be It is placed in a mold to fill or cast the base material to manufacture a wire assembly. The numeral 5200 in Fig. 4B illustrates another option of filling or casting the line segments between the clamps 530 and 540 with a base material, wherein the dashed lines indicated by numeral 545/555 indicate a surrounding fixture 530. 540 and the open slot of the line segment 561, the base material can be filled or cast in the open slot 545/555 to create a wire assembly. The numeral symbol 5300 in Figure 4C illustrates a continuous production process in which the line segments indicated by numeral 562 are pulled from the spool 560 by the clamp 550, the numerical symbols 570 and 580 indicate the newly inserted clamp, and then the repetition of Figure 4A or Figure 4B is repeated. The step of tensioning and fixing the line segment between the jigs 550 and 570 is filled or cast with a base material to manufacture the next wire assembly.
图5为本发明一个实施例中通过在一个柱体的侧面铺设包含导线的带状基 材制作导线柱体集成体的方法的示意图。图5中的数字符号610和620示意一个包含导线的带状基材的正视图和横截面图，其中数字符号612或622示意铺设在带状基材611或621上的导线；数字符号6000示意把所述的包含导线的带状基材铺设或包裹到一个柱体的侧面，从而制成如数字符号630或640示意的导线柱体集成体，其中数字符号630和640分别示意所述导线柱体集成体的沿柱体方向的截面图和横截面图，数字符号631和641示意所述的柱体，数字符号632/633和642/643示意铺设或包裹在所述柱体侧面的包含导线的带状基材中的导线和基体材料。Figure 5 is a perspective view of a belt-shaped base comprising a wire on the side of a cylinder in one embodiment of the invention. Schematic representation of the method of making a wire cylinder assembly. Numerals 610 and 620 in FIG. 5 illustrate a front view and a cross-sectional view of a strip substrate including wires, wherein numerals 612 or 622 illustrate wires laid on a strip substrate 611 or 621; The strip-shaped substrate comprising the wires is laid or wrapped to the side of a cylinder to form a conductor pillar assembly as indicated by numeral 630 or 640, wherein the reference numerals 630 and 640 respectively indicate the conductor pillars Cross-sectional and cross-sectional views of the body assembly in the direction of the cylinder, numerals 631 and 641 illustrating the cylinders, numerals 632/633 and 642/643 indicating the inclusion of wires on the sides of the cylinder Wire and matrix material in a strip substrate.
图6为本发明一个实施例中通过在一个柱体的侧面铺设导线制作导线柱体集成体的方法的示意图，其中的数字符号7000示意在一个柱体710的侧面铺设导线700的关键步骤。图6中的数字符号700示意一个导线来源端，如一个线圈，数字符号710示意一个柱体，数字符号720及箭头示意把所述导线沿着所述柱体的侧面一层一层地按设定的间距缠绕，数字符号730和740示意设置在所述柱体两端的用来设定导线层之间的间距的分隔板条，在同一层中的导线间的间距可在缠绕导线的时候通过导线的移动来设定。图6中的数字符号750示意缠绕了两层导线的柱体710的沿着A到A的截面图，数字符号760示意缠绕了两层导线的柱体被固化在一个基体材料761中形成的导线柱体集成体。6 is a schematic diagram of a method of fabricating a conductor post assembly by laying a wire on the side of a cylinder in accordance with one embodiment of the present invention, wherein numeral 7000 illustrates a critical step in laying the conductor 700 on the side of a cylinder 710. The numeral symbol 700 in Fig. 6 indicates a wire source end, such as a coil, the numeral symbol 710 indicates a cylinder, the numeral symbol 720 and the arrow indicate that the wires are layer by layer along the side of the column. The predetermined pitch is entangled, and the numerical symbols 730 and 740 are schematically disposed at the two ends of the column for separating the spacing between the wire layers, and the spacing between the wires in the same layer can be when the wire is wound. Set by the movement of the wire. Numeral symbol 750 in Fig. 6 illustrates a cross-sectional view along column A to A of a cylinder 710 wound with two layers of conductors, and numeral 760 indicates a conductor formed by winding a cylinder of two layers of conductors in a base material 761. Cylinder integration.
图7为本发明一个实施例中一个圆形的功能性基板的示意图8000，其中所述的功能性基板800包括多个按设定间距规则地排列的功能性基片810，每个功能性基片包括多个功能性通片，如数字符号811示意的多个功能性通片，其包含一个柱体通片820和12个环绕所述柱体通片的导线通片830；所述的功能性基片810也可只包含一个功能性通片，如数字符号812示意的导线柱体通片，其由固化在基体材料860中的导线通孔850和柱体通片840组成。需要注意的是，包含在功能性基片810中的柱体通片，如820或840可以是一片半导体材料，也可以是一种功能性通片，如数字符号821、822、823、824、825、或826示意的电阻器通片、电容器通片、电感器通片、带电极的电容器通片、层形条通片或变压器通片。7 is a schematic diagram 8000 of a circular functional substrate in accordance with one embodiment of the present invention, wherein the functional substrate 800 includes a plurality of functional substrates 810 regularly arranged at a set pitch, each functional basis The sheet comprises a plurality of functional sheets, such as a plurality of functional sheets illustrated by numeral 811, comprising a cylindrical sheet 820 and twelve wire sheets 830 surrounding the column sheets; The substrate 810 may also include only one functional via, such as the conductor post tab illustrated by numeral 812, which is comprised of wire vias 850 and post tabs 840 that are cured in the base material 860. It should be noted that the pillar through sheets, such as 820 or 840, included in the functional substrate 810 may be a piece of semiconductor material or a functional through sheet such as numeral symbols 821, 822, 823, 824, 825, or 826 illustrates resistor vias, capacitor vias, inductor vias, capacitor vias with electrodes, layered strips or transformer vias.
图1为本发明一个实施例中经由功能性柱体集成体制造功能性基板的方法的示意图，除了其中已示意的一些例子外，下面进一步公开一些具体的应用例。在第一个例子中，图1的功能性柱体组110设定为一个基体材料为陶瓷或玻璃 的导线集成体，把所述的陶瓷或玻璃基的导线集成体粘接在一起的基体材料113设定为一个有机材料，如聚合物材料或塑封料，从而制成的功能性基板121是一个柔性的功能性陶瓷或玻璃基板，其包含多个含有导线通孔的陶瓷或玻璃基片。在第二个例子中，图1的功能性柱体组110设定为一个基体材料为铝基的导线集成体，其中的导线是带有玻璃或陶瓷外层的金属线，把所述的基体材料为铝基的导线集成体粘接在一起的基体材料113设定为一个有机材料，如聚合物材料或塑封料，从而制成的功能性基板121是一个柔性的包含导电通孔的铝基板，其包含多个含有导线通孔的铝基片。在第三个例子中，图1的功能性柱体组110设定为一个导线柱体集成体，其中的柱体是一个半导体材料柱体，如硅柱，导线是金属线，把所述的半导体材料柱体和所述的金属线连接成一个导线柱体集成体的材料为陶瓷或玻璃，把所述的导线柱体集成体连接在一起的基体材料113设定为陶瓷或玻璃材料，从而制成的功能性基板121是一个功能性硅基板，其包含多个在周围含有导线通孔的硅基片。在第四个例子中，图1的功能性柱体组110设定为包含导线集成体和被动电子元件柱体，其中的被动电子元件柱体可以是电阻器柱体、电容器柱体、电感器柱体、或者层形条柱，从而制成的功能性基板121是一个包含导电通孔和被动电子元件通片的基板。1 is a schematic diagram of a method of fabricating a functional substrate via a functional pillar assembly in accordance with one embodiment of the present invention. In addition to some of the examples already illustrated, some specific applications are further disclosed below. In the first example, the functional cylinder set 110 of Figure 1 is set to a base material of ceramic or glass. The wire assembly body, the base material 113 for bonding the ceramic or glass-based wire assembly together is set as an organic material, such as a polymer material or a molding compound, thereby forming a functional substrate 121 which is a A flexible functional ceramic or glass substrate comprising a plurality of ceramic or glass substrates comprising wire vias. In a second example, the functional cylinder set 110 of FIG. 1 is configured as a wire-based integrated body having an aluminum matrix, wherein the wires are metal wires with a glass or ceramic outer layer, and the substrate is The base material 113 to which the aluminum-based wire integrated body is bonded together is set as an organic material, such as a polymer material or a molding compound, so that the functional substrate 121 is a flexible aluminum substrate including conductive via holes. It contains a plurality of aluminum substrates containing wire vias. In a third example, the functional cylinder set 110 of FIG. 1 is configured as a conductor pillar assembly, wherein the cylinder is a column of semiconductor material, such as a silicon pillar, and the conductor is a metal wire. The material of the semiconductor material column and the metal wire are connected to form a wire column assembly, and the base material 113 connecting the wire column assembly body is set as a ceramic or glass material, thereby The resulting functional substrate 121 is a functional silicon substrate comprising a plurality of silicon substrates having wire vias around them. In a fourth example, the functional cylinder set 110 of FIG. 1 is configured to include a wire assembly and a passive electronic component cylinder, wherein the passive electronic component cylinder can be a resistor cylinder, a capacitor cylinder, an inductor The pillar, or the layered strip, is formed into a functional substrate 121 which is a substrate including conductive vias and passive electronic component sheets.
需要说明的是，以上参照实施例和附图说明对本发明的描述仅为举例说明，而不是限定本发明的精神和范围，熟悉此技术者当可据此进行修改而得到等效实施例。 It should be noted that the above description of the present invention with reference to the embodiments and the accompanying drawings is merely illustrative and not intended to limit the scope of the invention.

Claims (18)

  1. 一种制造功能性基板的方法，该方法包括如下步骤：A method of manufacturing a functional substrate, the method comprising the steps of:
    a)提供功能性柱体；a) providing a functional cylinder;
    b)把多个功能性柱体按照设定的分布图案相互平行地排列在一起；b) arranging a plurality of functional cylinders in parallel with each other in accordance with a set distribution pattern;
    c)把所述已排列好的多个功能性柱体通过设定的条件固化成一个整体，从而制成一个c) curing the arranged plurality of functional cylinders into a whole by setting conditions, thereby forming one
    含有多个功能性柱体的功能性柱体集成体；a functional cylinder assembly containing a plurality of functional cylinders;
    d)把所述功能性柱体集成体分割成片，从而制成多片功能性基板。d) dividing the functional pillar assembly into pieces to form a plurality of functional substrates.
  2. 如权利要求1所述的制造功能性基板的方法，其特征在于，在步骤b)中，把多个功能性柱体紧密地排列在一起，并且在步骤c)中，通过设定的条件使所述已排列好的多个功能性柱体相互连接成一个整体，从而制成一个含有多个功能性柱体的功能性柱体集成体。A method of manufacturing a functional substrate according to claim 1, wherein in step b), a plurality of functional pillars are closely arranged together, and in step c), by setting conditions The arranged plurality of functional cylinders are interconnected to form a unitary body to form a functional cylinder assembly comprising a plurality of functional cylinders.
  3. 如权利要求1所述的制造功能性基板的方法，其特征在于，在步骤b)中，把多个功能性柱体按照设定的间距和分布图案相互平行地排列在一起，并且在步骤c)中，用一个基体材料填充所述多个功能性柱体之间和周围的空间，并通过设定的条件把所述已排列好的多个功能性柱体连同基体材料一起固化成一个整体，从而制成一个含有多个功能性柱体的功能性柱体集成体。A method of manufacturing a functional substrate according to claim 1, wherein in step b), a plurality of functional pillars are arranged in parallel with each other in accordance with a set pitch and a distribution pattern, and in step c Filling a space between and around the plurality of functional pillars with a matrix material, and solidifying the aligned plurality of functional pillars together with the matrix material into a whole by set conditions Thus, a functional cylinder assembly containing a plurality of functional cylinders is fabricated.
  4. 如权利要求1所述的制造功能性基板的方法，其特征在于，所述的相互平行地排列在一起的多个功能性柱体的分布图案构成多个规则地排列的功能性柱体组，其中所述的每个功能性柱体组包含多个功能性柱体。The method of manufacturing a functional substrate according to claim 1, wherein the distribution pattern of the plurality of functional pillars arranged in parallel with each other constitutes a plurality of regularly arranged functional cylinder groups. Each of the functional cylinder sets described therein comprises a plurality of functional cylinders.
  5. 如权利要求1所述的制造功能性基板的方法，其特征在于，在步骤a)中所采用的功能性柱体是柱状半导体材料、柱状磁体、导线集成体、导线柱体集成体、电阻器柱体、电容器柱体、电感器柱体、层形条柱体或者变压器柱体。The method of manufacturing a functional substrate according to claim 1, wherein the functional pillars used in the step a) are a columnar semiconductor material, a columnar magnet, a wire assembly, a wire column assembly, and a resistor. Cylinder, capacitor cylinder, inductor cylinder, layered cylinder or transformer cylinder.
  6. 如权利要求1所述的制造功能性基板的方法，其特征在于，包含在所述功能性基板的表面进一步制作电路层，从而制成功能性电路基板的步骤。A method of manufacturing a functional substrate according to claim 1, comprising the step of further forming a circuit layer on the surface of said functional substrate to form a functional circuit substrate.
  7. 如权利要求1所述的制造功能性基板的方法，其特征在于，所述功能性柱体包括导线集成体，所述导线集成体通过下述步骤来制造：A method of manufacturing a functional substrate according to claim 1, wherein said functional pillar comprises a wire assembly, and said wire assembly is manufactured by the following steps:
    i)提供多根导线；i) providing a plurality of wires;
    ii)通过多组夹具把所述的多根导线在纵向和横向按设定的间距平行地排列， 并拉紧和固定在每两个夹具之间；Ii) arranging the plurality of wires in parallel in the longitudinal direction and the lateral direction at a set pitch by a plurality of sets of jigs, And tightened and fixed between every two clamps;
    iii)把每两个夹具之间已排列好的多根导线固化在一个基体材料中，从而制成一个柱状的导线集成体。Iii) Curing a plurality of aligned wires between each of the two clamps in a base material to form a columnar wire assembly.
  8. 如权利要求1所述的制造功能性基板的方法，其特征在于，所述功能性柱体包括导线柱体集成体，所述导线柱体集成体通过下述步骤来制造：The method of fabricating a functional substrate according to claim 1, wherein the functional pillar comprises a conductor pillar assembly, and the conductor pillar assembly is manufactured by the following steps:
    i)提供柱体和导线；i) providing cylinders and wires;
    ii)把所述的导线按设定的间距沿着柱体方向排列并固定在所述柱体的侧面；Ii) arranging the wires at a set pitch along the direction of the cylinder and fixing to the side of the column;
    iii)把所述在柱体侧面已排列好的导线连同所述柱体固化在一个基体材料中，从而制成一个导线柱体集成体。Iii) solidifying the aligned wires on the side of the cylinder together with the pillars in a matrix material to form a conductor pillar assembly.
  9. 如权利要求1所述的制造功能性基板的方法，其特征在于，所述功能性柱体包括导线柱体集成体，所述导线柱体集成体通过下述步骤来制造：The method of fabricating a functional substrate according to claim 1, wherein the functional pillar comprises a conductor pillar assembly, and the conductor pillar assembly is manufactured by the following steps:
    i)提供柱体和包含按设定间距单向排列的导线的带状材料；i) providing a cylinder and a strip of material comprising wires arranged unidirectionally at a set spacing;
    ii)把所述的含有导线的带状材料固定在所述柱体的侧面，并在设定的条件下把所述含有导线的带状材料和所述柱体固化成一个整体，从而制成一个导线柱体集成体。Ii) fixing the strip-shaped material containing the wire to the side of the column, and curing the strip-shaped material containing the wire and the column into a whole under a set condition A wire cylinder assembly.
  10. 如权利要求1所述的制造功能性基板的方法，其特征在于，所述功能性柱体包括电阻器柱体，所述电阻器柱体通过下述步骤来制造：A method of fabricating a functional substrate according to claim 1 wherein said functional pillar comprises a resistor cylinder, said resistor cylinder being fabricated by the following steps:
    i)提供三层结构的方形或长方形片状材料，其中的两层外层是绝缘材料层，中间层是导电材料层；i) providing a three-layered square or rectangular sheet material, wherein two outer layers are insulating material layers, and the intermediate layer is a conductive material layer;
    ii)把所述三层结构的方形或长方形片状材料通过正反折叠的方式紧密地折叠成一个柱体，并通过设定的条件把所述叠成好的柱体固化成一个整体，从而制成一个电阻器柱体。Ii) the square or rectangular sheet material of the three-layer structure is closely folded into a cylinder by folding in a forward and reverse manner, and the stacked cylinder is solidified into a whole by setting conditions, thereby Make a resistor cylinder.
  11. 如权利要求1所述的制造功能性基板的方法，其特征在于，所述功能性柱体包括电容器柱体，所述电容器柱体通过下述步骤来制造：A method of manufacturing a functional substrate according to claim 1, wherein said functional pillar comprises a capacitor cylinder, said capacitor cylinder being manufactured by the following steps:
    i)提供多个双层带状材料，其中一层是介电材料层，另一层是导电材料层；i) providing a plurality of double-layer strip materials, one of which is a layer of dielectric material and the other layer is a layer of conductive material;
    ii)把多个所述的双层带状材料堆叠成一个柱体，并通过设定的条件把所述已堆叠成的柱体固化成一个整体，从而制成一个电容器柱体。Ii) stacking a plurality of said double-layered strip materials into a single cylinder, and solidifying said stacked cylinders into a unit by a set condition, thereby forming a capacitor cylinder.
  12. 如权利要求1所述的制造功能性基板的方法，其特征在于，所述功能性柱体包括电感器柱体，所述电感器柱体通过下述步骤来制造：A method of fabricating a functional substrate according to claim 1 wherein said functional pillar comprises an inductor cylinder, said inductor cylinder being fabricated by the following steps:
    i)提供双层结构的方形或长方形片状材料，其中的一层是介电材料层，另一 层是导电材料层；i) a square or rectangular sheet material with a two-layer structure, one of which is a layer of dielectric material and the other The layer is a layer of conductive material;
    ii)把所述双层结构的方形或长方形片状材料紧密地卷成一个柱体，并通过设定的条件把所述已卷好的柱体固化成一个整体，从而制成一个电感器柱体。Ii) compactly winding the square or rectangular sheet material of the two-layer structure into a cylinder, and solidifying the rolled cylinder into a whole by setting conditions, thereby forming an inductor column body.
  13. 一种通过如权利要求1所述的方法制造的功能性基板，其特征在于，所述的功能性基板包括多个按设定间距规则地排列的功能性基片，每个所述的功能性基片包含一个或多个功能性通片，所述的功能性通片包括片状半导体材料、片状磁体材料、导线通片、导线柱体通片、电阻器通片、电容器通片、电感器通片、层形条通片或者变压器通片。A functional substrate manufactured by the method of claim 1, wherein the functional substrate comprises a plurality of functional substrates regularly arranged at a set pitch, each of said functionalities The substrate comprises one or more functional through sheets, including a sheet-like semiconductor material, a sheet-like magnet material, a wire through sheet, a conductor post sheet, a resistor through sheet, a capacitor through sheet, and an inductor. Transmitter, layered strip or transformer pass.
  14. 一种导线柱体集成体，其特征在于，所述的导线柱体集成体包含一个柱体和多根导线，其中所述的多根导线按设定的间距沿着所述柱体的方向排列在所述柱体的侧面。A wire cylinder assembly body, characterized in that the wire cylinder assembly body comprises a cylinder and a plurality of wires, wherein the plurality of wires are arranged along the direction of the column at a set interval On the side of the cylinder.
  15. 一种功能性柱体，包括电阻器柱体、电容器柱体或者电感器柱体，其特征在于，所述的电阻器柱体包含构成电阻器结构的正反折叠形式的多层条状导体和分隔所述多层条状导体的绝缘材料；所述的电容器柱体包含构成电容器结构的交错形式的多层条状导体和分隔所述的多层条状导体的介电材料；所述的电感器柱体包含构成电感器结构的卷状的多层导体和分隔所述卷状的多层导体的绝缘材料。A functional cylinder comprising a resistor cylinder, a capacitor cylinder or an inductor cylinder, wherein the resistor cylinder comprises a plurality of strip conductors in a forward and reverse folded form of a resistor structure and An insulating material separating the plurality of strip conductors; the capacitor cylinder comprising a plurality of strip conductors constituting a staggered form of the capacitor structure and a dielectric material separating the plurality of strip conductors; the inductor The cylinder includes a rolled multilayer conductor constituting the inductor structure and an insulating material separating the rolled multilayer conductor.
  16. 一种功能性柱体集成体，包括：多个按设定间距规则地排列的功能性柱体组，所述的每个功能性柱体组包含一个或多个功能性柱体，所述的功能性柱体包括柱状半导体材料、柱状磁体、导线集成体、导线柱体集成体、电阻器柱体、电容器柱体、电感器柱体、层形条柱体或者变压器柱体。A functional cylinder assembly comprising: a plurality of functional cylinder groups regularly arranged at a set pitch, each functional cylinder group comprising one or more functional cylinders, said The functional pillars include a columnar semiconductor material, a columnar magnet, a wire assembly, a wire cylinder assembly, a resistor cylinder, a capacitor cylinder, an inductor cylinder, a layered cylinder or a transformer cylinder.
  17. 如权利要求16所述的功能性柱体集成体，其特征在于，所述的每个功能性柱体组包含两种或多种类型的功能性柱体。The functional cylinder assembly of claim 16 wherein each of said functional cylinder sets comprises two or more types of functional cylinders.
  18. 如权利要求16所述的功能性柱体集成体，其特征在于，其包含一种基体材料，其中所述的多个功能性柱体通过所述的基体材料相互连接成一个整体。 The functional pillar assembly of claim 16 comprising a matrix material, wherein said plurality of functional pillars are interconnected by said matrix material as a unitary body.
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