CN108417551B - Mixed woven cloth integrated column - Google Patents

Mixed woven cloth integrated column Download PDF

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CN108417551B
CN108417551B CN201810078213.4A CN201810078213A CN108417551B CN 108417551 B CN108417551 B CN 108417551B CN 201810078213 A CN201810078213 A CN 201810078213A CN 108417551 B CN108417551 B CN 108417551B
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columnar
woven cloth
hybrid
layer
wire
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CN108417551A (en
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申宇慈
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49534—Multi-layer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49517—Additional leads
    • H01L23/49527—Additional leads the additional leads being a multilayer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49838—Geometry or layout

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  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Geometry (AREA)
  • Laminated Bodies (AREA)
  • Woven Fabrics (AREA)

Abstract

The invention discloses a mixed woven cloth integrated column body capable of being used for manufacturing a substrate containing a conductive through hole, which comprises: the composite wire comprises a columnar matrix and a plurality of layers of mixed woven cloth fixedly sealed in the columnar matrix, wherein each layer of mixed woven cloth is formed by weaving conducting wires and supporting wires and comprises at least one two-dimensional parallel conducting wire family; the multilayer hybrid-woven cloth is arranged in the columnar matrix, so that a plurality of two-dimensional parallel conductor families contained in the multilayer hybrid-woven cloth form at least one three-dimensional parallel conductor family extending along the columnar direction of the columnar matrix, and therefore the hybrid-woven cloth integrated column can be divided into substrates containing conductive through holes along the direction perpendicular to the three-dimensional parallel conductor families.

Description

Mixed woven cloth integrated column
Technical Field
The invention relates to the technical field of integrated circuit semiconductor packaging, in particular to a mixed woven integrated column body capable of being used for manufacturing a substrate containing a conductive through hole. By forming the circuit and pads on the upper and lower surfaces of the substrate containing the conductive vias, the substrate containing the conductive vias can be further formed into a circuit substrate for use in integrated circuit semiconductor packages.
Background
Through-hole silicon, glass, ceramic or organic material substrates have been widely used in integrated circuit semiconductor packaging technology, and are key elements in 3D integrated circuit semiconductor packaging. Circuit substrates made based on substrates containing through-holes are commonly used in 3D and 2.5D integrated circuit semiconductor packaging technologies, as components for integrating the functionality of electronic products. The substrate having a through-hole includes a silicon substrate having a through-hole, a glass substrate, a ceramic substrate, and an organic material substrate. Currently, the manufacturing methods of the substrate including the through-hole used can be classified into two types: one is a substrate-based approach and the other is a via-based approach. The substrate-based method basically comprises: 1) making the desired holes in the substrate, 2) and then filling the holes with a conductive material to form a substrate containing conductive vias. The via-based method basically comprises: 1) firstly, making some small punctiform metal columns on a carrier, 2) then covering the punctiform metal columns with a substrate material, then removing the carrier and polishing the upper surface and the lower surface to expose the punctiform metal columns, thereby forming the substrate with conductive through holes. At present, the conventional method is to further manufacture the substrate with the through holes into the circuit substrate with the through holes through the circuit and the bonding pads which are manufactured on the surface of the substrate, so as to connect the electronic components which are positioned on the upper surface of the substrate with other electronic components or printed circuit boards which are positioned below the substrate in the integrated circuit semiconductor package, and the circuit which is positioned on the upper surface of the substrate can also directly communicate with the electronic components which are positioned on the circuit substrate, and then connect with other electronic components or circuit boards which are positioned below the substrate.
The method of manufacturing a substrate containing a conductive via by an opening method in the related art may be referred to as a microscopic method, and the basic features of the substrate containing a conductive via manufactured include: 1) the upper and lower surfaces of the substrate are flat for further fabrication of circuits and pads thereon; 2) vias are a type of conductive metal stud embedded in the substrate and formed in the desired arrangement at the desired pitch, 3) the base material of the substrate serves as a carrier for holding the vias and further making circuits and pads thereon. It is noted that these prior art microscopic methods of fabricating substrates containing conductive vias have many limitations in fabrication and use. Some limitations include, due to their manufacturing process: 1) the fabrication of which is very time consuming and expensive, 2) the side edges of the via are not very flat due to the opening by etching, mechanical drill or laser 3) the diameter of the via cannot be very small, prior art fabrication of vias less than 10 microns and substrates over a certain thickness (e.g., over 100 microns) is very difficult, 4) the pitch of the via cannot be very small, (e.g., prior art fabrication of vias less than 50 micron pitch on substrates over 100 microns is difficult and expensive, 5) the thickness of the substrate containing the via is limited by the size and pitch of the via, the smaller the via pitch, the thinner the substrate.
In the prior art, there is a class of methods for fabricating substrates containing conductive vias through metal lines, which may be referred to as macroscopic methods. As shown by numeral 40 in fig. 1, the common features of the various solutions in the prior art method for manufacturing a substrate with conductive vias by metal lines are that a metal line substrate pillar 41 including a group of metal lines arranged in parallel is first fabricated, and then cut into a plurality of substrates 42 including conductive vias; among other things, the difference between the different schemes is how to efficiently manufacture the metal wire base material cylinder 41. As shown in fig. 2, in the prior art, the following three schemes are included to fabricate the metal wire substrate cylinder: wherein, the scheme of numeral symbol 10 is that the metal wire substrate cylinder is manufactured on each side of the polygonal cylinder by winding the metal wire 10 with the insulating outer layer 12 on the polygonal cylinder and then bonding the insulating outer layers to each other by high temperature and pressure; the scheme shown by the numeral symbol 20 is that firstly, the metal wire 21 is attached to the sheet-shaped base material 22, then a plurality of sheet-shaped base materials containing the metal wire are stacked into a column, and then the sheet-shaped base material 22 and the metal wire 21 are mutually bonded together between layers through high temperature and pressure, so that the metal wire base material column is manufactured; the third solution, indicated by numeral 30, is to fix both ends of a set of parallel arranged metal wires 31 therein by a frame or jig, indicated by numerals 33 and 34, and then to add a filler material 32 between and around the metal wires by a container, and then to cure the filler material 32, thereby forming the metal wire base cylinder. The characteristics of the schemes are as follows: solution one and solution two use solid matrix materials 12 and 22, respectively, while solution three uses a filler material 32; when manufacturing a plastic substrate with conductive vias, several solutions are technically feasible, wherein the first solution and the second solution are cheaper and more effective, and the first design and the actual application are also directed to plastic substrates with conductive vias, while the third solution enables more complicated arrangements of metal lines to be manufactured, wherein the second solution has the advantage that the metal lines are completely fixed by the sheet-like substrate, and the third solution has the advantage that a filling material can be used. However, these three prior art solutions have certain disadvantages in practical applications for manufacturing ceramic substrates containing conductive vias. The disadvantage of the first solution is obvious, that it is very expensive to make a metal wire with a ceramic outer layer first and it is difficult to make a thicker ceramic outer layer outside the metal wire, and in addition, it is technically difficult to make a thin ceramic outer layer firmly bonded to each other into a whole and avoid forming too many holes between them; the second solution has the disadvantage that the problem of interlayer cracking is technically difficult to overcome when sintering a cylindrical ceramic green body stacked from at least hundreds to thousands of layers of sheet-like green ceramic tapes containing metal wires, in addition to the fact that it is very expensive to manufacture sheet-like green ceramic tapes containing metal wires; in the third embodiment, since the filling material is used instead of the sheet-like base material, there is no problem of interlayer cracking during sintering when the ceramic substrate including the conductive via is manufactured, but the method has a great disadvantage in that since the metal wires are fixed only at both ends by the frame, it is difficult to ensure that the very thin and long metal wires are not moved or damaged when the filling ceramic slurry is introduced between the metal wires. In summary, the prior art methods of manufacturing a substrate comprising conductive vias by means of metal lines all have technical drawbacks when manufacturing ceramic substrates comprising conductive vias.
Disclosure of Invention
In view of the above technical problems, the present invention provides a novel hybrid fabric integrated column capable of being used for manufacturing a substrate including a conductive via, which is different from a conductive wire substrate column consisting of a conductive wire and a single substrate in the prior art, and the hybrid fabric integrated column of the present invention includes more materials due to the adoption of the hybrid fabric of the conductive wire supporting wire, so that the substrate including the conductive via can be designed and manufactured more flexibly. In an embodiment of the present invention, the hybrid cloth integrated column mainly includes:
a columnar matrix;
the multi-layer mixed woven cloth is fixedly sealed in the columnar matrix, wherein each layer of mixed woven cloth is formed by weaving conducting wires and supporting wires and comprises at least one two-dimensional parallel conducting wire family;
the multilayer hybrid-woven cloth is arranged in the columnar matrix, so that a plurality of two-dimensional parallel conductor families contained in the multilayer hybrid-woven cloth form at least one three-dimensional parallel conductor family extending along the columnar direction of the columnar matrix, and therefore the hybrid-woven cloth integrated column can be divided into substrates containing conductive through holes along the direction perpendicular to the three-dimensional parallel conductor families.
According to an embodiment of the invention, in the hybrid knitted fabric integrated column, the columnar substrate comprises a multi-layer supporting sheet for sealing and separating the multi-layer hybrid knitted fabric;
the multilayer support sheets are arranged in the columnar base body to form a columnar layer-shaped structure with the multilayer mixed woven cloth, in the columnar layer-shaped structure, each layer of the mixed woven cloth is fixedly sealed between two layers of the support sheets, and meanwhile, the adjacent two layers of the mixed woven cloth are separated by at least one layer of the support sheets;
further, in the columnar layer-shaped structure, the support sheets and the mixed woven cloth in two adjacent layers and the support sheets in two adjacent layers are fixedly connected together through set temperature and pressure;
or further, the columnar substrate further comprises a filling material for filling and curing interlayer gaps of the columnar layer-shaped structure, and in the columnar layer-shaped structure, the supporting sheets and the mixed woven fabric in two adjacent layers and the supporting sheets in two adjacent layers are bonded together through curing of the filling material therebetween.
Further preferably, the filling material may also wrap the columnar layer structure, so that the columnar matrix is composed of the filling material and the columnar layer structure encapsulated in the filling material.
According to an embodiment of the invention, in the hybrid woven fabric integrated column, the columnar layer-shaped structure is formed by stacking the hybrid woven fabric and a support sheet.
According to an embodiment of the invention, in the hybrid woven fabric integrated column, the columnar layer-shaped structure is formed by rolling and stacking the hybrid woven fabric and a supporting sheet;
further, the columnar layer-shaped structure is formed by winding and folding the mixed woven cloth and the supporting sheet around the column core.
According to an embodiment of the invention, in the above-mentioned hybrid woven fabric integrated column, the support sheet is a mesh support wire woven fabric, and/or the hybrid woven fabric is a mesh wire support wire hybrid woven fabric.
According to another embodiment of the present invention, the columnar matrix may further be composed of a filler material, and the columnar layer structure formed by the multiple layers of mixed woven fabrics is sealed in the filler material by curing the filler material.
According to another embodiment of the invention, in the hybrid woven fabric integrated column, at least one layer of the hybrid woven fabric further has conducting wires in a direction perpendicular to the two-dimensional parallel conducting wire family contained in the hybrid woven fabric integrated column, so that the hybrid woven fabric has a reticular conducting wire structure.
According to one embodiment of the invention, the filling material may be a metal material, and the wires in the wire support wire braid are metal wires with an insulating outer layer.
According to another embodiment of the invention, the filling material may also be a ceramic or glass material.
It should be noted that the present invention is a new hybrid integrated column that can be used to fabricate substrates containing conductive vias; the mixed woven cloth integrated column has the following advantages:
1) a ceramic or glass substrate containing conductive through-holes can be inexpensively and quickly mass-produced;
2) there are more parameters to choose from so that many novel substrates containing conductive vias, i.e. substrates containing some other metal topography in addition to the conductive vias, can be flexibly designed and manufactured.
It should be particularly noted that, since the novel hybrid-woven-cloth integrated column of the present invention creatively adopts the wire supporting wire hybrid-woven cloth, in addition to the advantages of completely fixing the metal wire of the second solution and the advantages of using the filling material of the third solution in the prior art, one or more embodiments of the present invention further include more design parameters, so that the substrate including the conductive via to be manufactured can be very flexibly designed based on the hybrid-woven-cloth integrated column to manufacture the substrate including the conductive via satisfying various requirements. For example, the conductive wire substrate column manufactured by the macro method in the prior art only includes two material parameters of the conductive wire and the substrate and one conductive wire arrangement parameter, but the hybrid woven fabric integrated column of the present invention may include a very large number of parameters in addition to these parameters, and the parameters included in the hybrid woven fabric of the conductive wire support wires include the type and size of the support wires, the arrangement of the mesh metal wires, etc., while the support sheet included therein may have more material and structure parameters for flexible design.
Additional features and advantages of the invention will be set forth in the description which follows, and in part will be obvious from the description, or may be learned by the practice of the invention. The objectives and other advantages of the invention will be realized and attained by the structure particularly pointed out in the written description and claims hereof as well as the appended drawings.
Drawings
The accompanying drawings, which are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description serve to explain the principles of the invention and not to limit the invention. In the drawings:
FIG. 1 is a schematic diagram of common features of various aspects of a prior art macro-method of fabricating a substrate including conductive vias;
FIG. 2 is a schematic illustration of three approaches in a prior art macro method of fabricating a substrate containing conductive vias;
FIG. 3 is a schematic diagram of a wire support strand braid employed in one embodiment of the present invention;
FIG. 4 is a schematic diagram of a wire arrangement in one embodiment of the present invention;
FIG. 5 is a schematic view of another wire arrangement in one embodiment of the present invention;
FIG. 6 is a schematic diagram illustrating and describing the main features of a hybrid woven integrated column in an embodiment of the present invention;
FIG. 7 is a flow chart of a method for fabricating a substrate including conductive vias in one embodiment of the present invention;
fig. 8 is a schematic view illustrating a method of manufacturing a substrate with a conductive via according to the present invention, i.e., a method of mixedly weaving a wire supporting line → a columnar layer-shaped structure → an integrated column of mixedly weaving → a substrate with a conductive via according to the present invention;
FIG. 9 is a schematic cross-sectional view of the columnar layered structure fabricated in one embodiment of the present invention;
FIG. 10 is a schematic view of the columnar layered structure being secured between its layers by a set temperature and pressure in one embodiment of the present invention;
FIG. 11 is a schematic cross-sectional view of the hybrid fabric integrated column fabricated by fixedly connecting the columnar layered structure between layers thereof by a set temperature and pressure according to an embodiment of the present invention;
FIG. 12 is a schematic view of the columnar layer structure being secured between layers by a filler material in an embodiment of the present invention;
FIG. 13 is a schematic cross-sectional view of the hybrid integrated column fabricated by fixedly connecting the columnar layered structures between layers thereof with a filler material according to an embodiment of the present invention;
fig. 14 is a schematic cross-sectional view of the hybrid fabric integrated column according to an embodiment of the present invention, which is manufactured by using a porous support sheet and filling a filler material into the periphery of the columnar layered structure;
fig. 15 is a schematic cross-sectional view of the hybrid woven cloth integrated column manufactured by weaving cloth using mesh-shaped supporting wires as the supporting sheet according to an embodiment of the present invention;
fig. 16 is a schematic view of the columnar layer structure formed by stacking or rolling the mixed woven fabric and the supporting sheet according to an embodiment of the present invention;
fig. 17 is a schematic diagram of a method for manufacturing the hybrid fabric integrated column by combining the wire supporting wire hybrid fabric with a filling material through an auxiliary frame and further manufacturing a substrate including a conductive through hole according to an embodiment of the present invention;
FIG. 18 is a schematic representation of a cross-section of the hybrid woven cloth integrated cylinder made by the combination of the sub-frame and the filler material in one embodiment of the present invention;
FIG. 19 is a schematic diagram of the woven fabric used to explain the cutting method according to an embodiment of the present invention;
FIG. 20 is a schematic diagram illustrating the features of the hybrid woven cloth integrated column of the present invention;
FIG. 21 is a flow chart of a method of fabricating a substrate containing redistributed conductive vias based on a substrate comprising conductive vias in one embodiment of the invention;
FIG. 22 is a schematic diagram of a method of fabricating a substrate containing redistributed conductive vias based on a substrate comprising conductive vias in one embodiment of the invention;
FIG. 23 is a flow chart of a method of fabricating a substrate containing redistributed conductive vias based on a substrate comprising conductive vias in another embodiment of the invention;
fig. 24 is a schematic diagram of a method of fabricating a substrate with redistributed conductive vias based on a substrate comprising conductive vias in another embodiment of the invention.
Detailed Description
The following detailed description of the embodiments of the present invention will be provided with reference to the drawings and examples, so that how to apply the technical means to solve the technical problems and achieve the technical effects can be fully understood and implemented. It should be noted that, as long as there is no conflict, the embodiments and the features of the embodiments of the present invention may be combined with each other, and the technical solutions formed are within the scope of the present invention.
In order to clearly illustrate the embodiments of the present invention by referring to the accompanying drawings, some terms used are first explained as follows: 1) a support wire, which may be a non-conductive wire such as a glass fiber wire, a carbon fiber wire or a plastic wire, is referred to as a support wire in the present invention because its primary function in the present invention is an auxiliary function for supporting and fixing the wire; 2) the support sheet, which represents a sheet-like material, is referred to as the support sheet in the present invention because its main function in the present invention is an auxiliary function for supporting and fixing the lead; 3) a support thread knitted fabric, which represents a fabric knitted by support threads, is a support sheet in the present invention; 4) a net-shaped supporting thread woven cloth, which represents a cloth woven from supporting threads, in which pores much larger than the diameter of the threads are left between the threads, is a very loose woven cloth; 5) a wire supporting wire mixed-braiding cloth, which represents a cloth formed by mixed-braiding of supporting wires and wires; 6) the reticular wire support wire mixed woven cloth represents a cloth formed by mixed weaving of support wires and wires, wherein pores which are much larger than the diameters of the wires are reserved between the wires, and the reticular wire support wire mixed woven cloth is a very loose woven cloth; 7) a two-dimensional parallel conductor family, which represents a family of conductors arranged in parallel at a set pitch within a layer, will be further explained with reference to the drawings; 8) a three-dimensional parallel conductor group, which represents a group of conductors arranged in parallel at a set pitch within a column, is formed by arranging a plurality of two-dimensional parallel conductor groups along one direction, and will be further explained with reference to the accompanying drawings; 9) conductive vias, which represent conductive paths embedded in the substrate and penetrating through the thickness direction of the substrate, such as columnar metals; 10) a redistribution conductive via representing a conductive channel formed from a piece of metal on the upper surface of the substrate containing the conductive via connected to a piece of metal on the lower surface of the substrate via a portion of the conductive via; 11) a columnar layer-shaped structure representing a structure composed of a plurality of layers and having a columnar shape in appearance; 12) a substrate, which represents a sheet material, such as a sheet of ceramic, a sheet of glass, a sheet of wafer, a sheet of polymeric material or a sheet of composite material; 13) a matrix, which represents a material for enclosing or housing other specific components in the composite structure, and which may be composed of one material or a plurality of materials; 14) filler materials, which represent a class of materials capable of filling in spaces and spaces between layers, such as liquids, slurries, powders, and the like, can become the matrix or part of the matrix in a composite structure after curing. It is to be noted that the above terms are explained for the purpose of illustration only, and do not limit the scope and spirit of the present invention.
Fig. 3 is a schematic diagram of a wire support wire braid employed in one embodiment of the present invention. The mixed woven cloth of the supporting wires of the conducting wires is formed by mixed weaving of the conducting wires and the supporting wires, and is called mixed woven cloth for short, and the mixed woven cloth is one of core technologies of the invention. A detailed description thereof will be given first with reference to fig. 3, and the inclusion thereof and the resulting arrangement of the conductive lines will be further described with reference to fig. 4 and 5.
The reference numeral 1000 in fig. 3 illustrates two examples of the hybrid woven fabric, wherein the hybrid woven fabric 100 is composed of the conductive wires 110 arranged in the longitudinal direction, the support wires 120 arranged in the longitudinal direction, and the support wires 130 arranged in the transverse direction. Wherein 140 represents the interline gap included in the mixed braiding cloth 100, 111 and 121 represent the round conducting wire and the supporting wire, respectively, and p1 and p2 represent the spacing between the metal wires; the hybrid fabric 150 includes other features such as a large interline gap 141 and metal wires 132 arranged in a transverse direction, wherein 113 and 121 represent conductive wires and supporting wires arranged in a longitudinal direction, and 131 represent supporting wires arranged in a transverse direction. When the space between the wires is large, it is generally called a mesh, and accordingly, the hybrid fabric including the mesh is called a mesh hybrid fabric. From these two examples of woven fabrics, it can be seen that this can be achieved by a wide range of alternative materials and dimensional parameters. By selecting these parameters, the method of the present invention can produce a wide variety of novel substrates containing conductive vias. This point will be further described later with reference to an embodiment, and the arrangement of the conductive wires included in the hybrid fabric used in the present invention will be described in detail.
For simplicity and clarity in describing specific embodiments of the present invention, two terms are used in describing the arrangement of the conductive lines in the description of the embodiments of the present invention: namely a family of two-dimensional parallel wires and a family of three-dimensional parallel wires. The two-dimensional parallel conductor group represents a group of conductors which are arranged in parallel in a layer according to a set interval, and the shape of the layer can be a plane or a curved surface; the three-dimensional parallel wire family represents a family of wires arranged in parallel at a set pitch in the direction of the column within one column, and further, in the present invention, the three-dimensional parallel wire family is composed of a plurality of two-dimensional parallel wire families. These terms are explained further below in conjunction with fig. 4 and 5.
Numeral 160 in fig. 4 illustrates two wire arrangements shown as 161 and 170, where 161 illustrates a two-dimensional parallel wire family and 170 illustrates a three-dimensional parallel wire family, where numeral 162 represents the wire spacing in the two-dimensional parallel wire family 161 and numerals 162 and 171 in 170 represent the intra-layer wire spacing and the inter-layer wire spacing in the three-dimensional parallel wire family 170. The wires 110 included in the wire support hybrid fabric 100 illustrated in fig. 3 form a two-dimensional parallel wire family as indicated at 161 in fig. 4. when a plurality of rectangular wire support hybrid fabrics 100 are stacked into a columnar layer structure, the included wires form a three-dimensional parallel wire family as indicated at 170 in fig. 4, and the inter-layer wire spacing 171 can be set during the fabrication of the columnar layer structure. When a long strip of wire support cord hybrid is rolled up into a columnar layered structure, another three-dimensional parallel wire family 181 and two-dimensional parallel wire family 190 are produced as indicated by reference numeral 180 in fig. 5, fig. 5 being a cross-sectional view of the parallel wire families 181 and 190, where the three-dimensional parallel wire family represented by 181 comprises multiple layers of two-dimensional parallel wire families, where 190 represents the outermost layer of the two-dimensional parallel wire family in 181, and similarly, the inter-layer wire spacing 182 in 181 may be set when making the columnar layered structure, and the intra-layer wire spacing 191 may be set when weaving the wire support cord hybrid. In addition, the three-dimensional parallel wire family 170 in fig. 4 and the three-dimensional parallel wire family 181 in fig. 5 correspond to the columnar layer structure in the stacked form and the columnar layer structure in the rolled form.
It should be noted that both the two types of wire arrangement described in fig. 4 and fig. 5 are embodied in the embodiment of the present invention, but for simplicity, the schematic diagram for describing the embodiment mainly refers to the wire arrangement shown in fig. 4.
Fig. 6 is a schematic diagram illustrating and describing main features of the hybrid woven integrated column in the embodiment of the present invention. Reference numeral 1600 in fig. 6 illustrates a main feature of the hybrid-laid integrated pillar of the present invention that can be used to fabricate a substrate containing conductive vias, which includes: a columnar layer structure 600 composed of a plurality of layers of mixed woven cloth 601 of lead supporting wires, wherein each layer of mixed woven cloth 601 of lead supporting wires at least comprises a two-dimensional parallel lead group 602 in one direction, and a set distance 604 is arranged between two adjacent layers of mixed woven cloth 601 of lead supporting wires; and a columnar substrate composed of multiple layers of supporting sheets and/or filling materials and used for packaging the columnar layered structure 600 into a columnar solid, as shown by an arrow 611, filling and curing the filling material 610 among the layers, in the gap and around the columnar layered structure to form the columnar substrate, as shown by an arrow 621, adding the multiple layers of supporting sheets 620 into the columnar layered structure 600 and fixedly connecting the multiple layers of supporting sheets 620 together to form the columnar substrate, or as shown by arrows 621 and 611, adding the multiple layers of supporting sheets 620 and the filling material 610 into the columnar layered structure 600 and fixedly connecting the multiple layers of supporting sheets 620 and the filling material 610 together to form the columnar substrate; wherein the multilayer hybrid fabric 601 is arranged in the columnar layer structure 600 such that a plurality of the two-dimensional parallel conductor families 602 included in the multilayer hybrid fabric form at least one three-dimensional parallel conductor family 603 along the cylinder direction, thereby enabling the hybrid fabric integrated cylinder to be divided into substrates including conductive vias along a direction perpendicular to the three-dimensional parallel conductor families.
The method for manufacturing the hybrid woven cloth integrated column of the present invention will be described with reference to fig. 7 to 18, and further features of the hybrid woven cloth integrated column will be further described in the description of the method for manufacturing the same.
Fig. 7 and 8 are a flowchart and schematic diagram of an embodiment of the present invention, which is used to illustrate key concepts of the present invention and explain some of them. The basic steps S1 to S4 of the method of manufacturing a substrate including a conductive via of the present invention shown in fig. 7 are explained with reference to fig. 8 as follows:
in step S1, a wire supporting wire mixed woven fabric 100 and a supporting sheet 200 are manufactured, wherein the wire supporting wire mixed woven fabric at least comprises a two-dimensional parallel wire group 101 in one direction, which can be manufactured by weaving wires and metal wires in a mixed woven manner, the spacing between the wires can be set during the process, and the spacing between the wires can be set according to the need and is not limited to equal spacing;
in step S2, the hybrid knitted fabric 100 is fabricated into a columnar layer structure 300 by means of the support sheet 200, which includes a plurality of layers of hybrid knitted fabrics with a set interlayer spacing, represented by numeral 304, and a plurality of layers of support sheets 305, wherein a plurality of two-dimensional parallel conductor families 101 in the plurality of layers of hybrid knitted fabrics 304 are fixed in the columnar layer structure and form a three-dimensional parallel conductor family 303, wherein the plurality of layers of support sheets 305 are used for separating and fixing the plurality of layers of hybrid knitted fabrics 304 and setting the interlayer spacing between two adjacent layers of hybrid knitted fabrics, which may have various structures, which will be described in the further embodiments below, and further, the dotted arrows represented by numerals 301 and 302 indicate two representative cross-sectional positions, i.e., positions where the multilayer hybrid knitted fabrics 304 do not include and include transverse support lines, which will be described in the further embodiments; it should be noted that, in this step, whether to fill the filling material between the layers and the periphery of the pillar-shaped layered structure 300 may be selected according to the needs, which will be described in further embodiments below.
In step S3, the multilayer hybrid fabric 304 and the multilayer supporting sheet 305 included in the columnar layered structure 300 are fixedly connected to form a columnar entity through the set conditions, so as to manufacture a hybrid fabric integrated pillar 400 including a three-dimensional parallel wire family, wherein the dotted arrow represented by the numeral 401 indicates that the hybrid fabric integrated pillar 400 is divided in a direction perpendicular to the three-dimensional parallel wire family in the next step; it should be noted that the set conditions for fixing the columnar layer-shaped structure 300 into a columnar entity depend on whether a filling material is used in step S2, which will be described in further embodiments below.
In step S4, the hybrid-woven-fabric integrated pillar is divided into pieces along a direction perpendicular to the three-dimensional parallel conductor group 303, and a plurality of substrates 500 including conductive vias are obtained.
The hybrid fabric 100 as indicated by the reference numeral 100 in fig. 8, which is manufactured in step S1, has already been described in detail above with reference to fig. 3, 4 and 5, and the following describes in detail the interlayer bonding morphology in the columnar layered structure 300 manufactured by means of the supporting sheet in step S2, the corresponding bonding means adopted in step S3 and the selection of the supporting sheet 200 with reference to fig. 9 to 15.
Reference numerals 2100 and 2200 in fig. 9 represent two typical cross-sectional views of the columnar layered structure 300 in fig. 8, where 2100 illustrates a cross-sectional view of the columnar layered structure 300 at the position where the co-woven fabric has no lateral support lines, 230 represents a multi-layered co-woven fabric at the corresponding position, which also illustrates an interlayer morphology at the corresponding position, and 2200 illustrates a cross-sectional view of the columnar layered structure 300 at the position where the co-woven fabric has lateral support lines, and 240 represents a multi-layered co-woven fabric at the corresponding position, which also illustrates an interlayer morphology at the corresponding position; as can be seen from the interlayer morphology of the hybrid-knitted fabric indicated by reference numeral 240 in fig. 9, due to the existence of the transverse support lines 241, the distance between the support sheets is larger than the thickness or diameter of the conductive line, so that in the columnar layer structure 300, in addition to the gap 231 included between the lines of the multi-layer hybrid-knitted fabric 304, gaps 232 and 233 are also included between the support sheets and the hybrid-knitted fabric, the former is referred to as an interline gap, and the latter is referred to as an interlayer gap, which is referred to as a structural gap included in the columnar layer structure 300. It should be noted that, when the mixed braid 100 of the wire supporting wires as shown in fig. 8 is woven in step S1, only a small number of transverse supporting wires may be woven as needed, so that the column portion having the transverse supporting wires in the cross section only occupies a small part of the whole columnar layered structure 300, that is, the column portion having the cross section as shown in 2100 in fig. 9 is mainly used in the whole columnar layered structure 300.
The means by which the columnar layered structure 300 comprising the interlaminar forms 230 and 240 shown in fig. 9 are fixedly joined into a columnar entity, including high temperature crimping and filler material bonding, is described below.
As shown in fig. 10, one of the methods of fastening the columnar layered structure 300 as illustrated in fig. 8 is to press and bond the support sheet and the woven fabric together at their interface with each other by an appropriate temperature and pressure, wherein 230A and 240A indicate bonding surfaces corresponding to the interlayer morphologies 230 and 240 in fig. 10, 231A and 232A indicate lead wires and support wires in the bonding surface 230A, 233A indicate holes that may be created near the bonding surface, and 241A indicates lateral support wires included in the bonding surface 240A. The support wires existing at the joint surface can play a role in strengthening the interlayer strength by selecting the material of the support wires in the mixed woven cloth and designing the structure. Two typical cross sections of the hybrid woven fabric integrated column manufactured by fixedly connecting the columnar layer-shaped structure 300 into a columnar entity by means of high-temperature crimping as shown in fig. 10 are shown by reference numeral 2400 in fig. 11, wherein 230A represents a portion of the hybrid woven fabric integrated column not including the transverse support wires, and 240A represents a portion of the hybrid woven fabric integrated column including the transverse support wires, one of the portions can selectively occupy a larger specific gravity in the whole hybrid woven fabric integrated column by designing the wire support wire hybrid woven fabric, 235 and 236 distributions represent a plurality of layers of the support sheets and a plurality of layers of the hybrid woven fabric, wherein each layer of the hybrid woven fabric 236 is fixedly sealed between two layers of the support sheets 235, and a distance between two adjacent layers of the hybrid woven fabric 236 is set by at least one layer of the support sheets 235 located therebetween.
Another means of securing the columnar layered structure 300 as illustrated in fig. 8 is to add a filler material between the layers, as indicated by the number 2500 in fig. 12, wherein 250 and 260 illustrate the interlayer morphology corresponding to 230 and 240 in fig. 10 with the filler material added, wherein 251 represents the filler material filled in all the interlayer and interline voids, and 24 represents the lateral support lines between the layers; and then the filling material 251 is solidified through the set conditions, so that the columnar layered structures are fixedly connected together to form a columnar entity, and the mixed woven cloth integrated column is manufactured. Two typical cross sections of the hybrid integrated column manufactured by fixedly connecting the columnar layered structure 300 into a columnar entity through the means of filling material adhesion as shown in fig. 12 are shown as numeral 2600 in fig. 13, wherein 250A represents the part of the hybrid woven cloth integrated column which does not contain the transverse supporting lines, and 260A represents the part of the hybrid woven cloth integrated column which contains the transverse supporting lines, the mixed woven cloth of the lead wire supporting lines can be selectively made to be dominant in the whole mixed woven cloth integrated column body by designing the mixed woven cloth of the lead wire supporting lines, 28, 282 and 283 distribution represents a plurality of layers of the supporting sheets, the filling materials between the layers are solidified, and a plurality of layers of the mixed woven cloth, wherein each layer of the woven fabric 283 is sealed between two layers of the support sheet 281 by the filling material 282, and the distance between two adjacent layers of the mixed woven cloth 283 is set by at least one layer of the support sheet 281 positioned therebetween.
The means for fixing the pillar-shaped layer structure 300 by hot pressing as shown in fig. 10 is relatively simple in manufacturing, but the support sheet can only be used as a main body in the base material of the substrate including the conductive through-holes manufactured therethrough, while the means for fixing the pillar-shaped layer structure 300 by the filling material as shown in fig. 12 has a few manufacturing steps, but has the advantage that two material parameters are available for design, so that the filling material can be used as a main body in the base material of the substrate including the conductive through-holes manufactured therethrough by selecting the structure of the support sheet and the matching with the mixed fabric, as will be further described below.
Alternatively, numeral 5000 in fig. 14 indicates that a support sheet containing holes and a hybrid woven fabric integrated column made therefrom are used in the embodiment of the present invention shown in fig. 8, wherein 501 represents the holes in the support sheet 500. When the porous support sheet is used in the embodiment shown in fig. 8, and the filling material is filled between the layers and the gap and also filled around the hole 501 and the pillar-shaped layer-shaped structure 300, this embodiment will produce a hybrid-woven integrated pillar or a substrate containing conductive through holes, as shown by numeral 520 in fig. 14, wherein numeral 520 indicates a cross section of the pillar that does not contain transverse wires, which also indicates a surface view of the substrate containing conductive through holes, and wherein numeral 516 indicates the filling material filled between the layers, the gap and the gap of the pillar-shaped layer-shaped structure 300 and the hole 501 of the support sheet 500, and since all the filling materials are cured simultaneously, they will be well integrated and become the main component of the matrix of the hybrid-woven integrated pillar. It should be noted that the base material of the substrate with conductive vias 520 shown in 520 includes the filling material 516, the support sheet material 514 and the support line material 515 in the mixed fabric, so the substrate material of the substrate with conductive vias 520 is not unitary, but since both the support sheet material 514 and the support line material 515 can be provided as insulating materials, they do not affect the electrical property of the substrate with conductive vias 520 manufactured by the present invention, but only affect the mechanical and thermal properties of the substrate, therefore, the mechanical and thermal properties of the substrate with conductive vias 520 can be improved by properly selecting and designing the materials and structures of the support sheet and the support line.
Alternatively, numeral 5400 in fig. 15 indicates that the mesh-shaped supporting thread woven cloth 540 is adopted as the supporting sheet and the hybrid woven cloth integrated column made therefrom in the embodiment of the invention shown in fig. 8, numeral 541 and 542 in fig. 540 respectively represent the transverse and longitudinal supporting threads contained in 540, numeral 543 represents the meshes contained in it, and numeral 544 indicates the cross-sectional position; 530 represents a main cross section at a position shown by 544 or a surface view of a corresponding substrate including a conductive via, of a hybrid woven-fabric integrated column manufactured using a mesh-shaped supporting-wire woven fabric 540 as the supporting sheet in the embodiment shown in fig. 8, wherein reference numeral 533 represents a conductive wire included in the hybrid woven-fabric integrated column or a conductive via included in the substrate including a conductive via, 534, 535 and 536 represent a supporting wire from the mesh-shaped supporting-wire woven fabric 540, a supporting wire from the hybrid woven-fabric and the filling material, 537 and 538 represent a multi-layered mesh-shaped supporting-wire woven fabric and a multi-layered conductive-wire supporting-wire hybrid woven fabric, respectively, which are fixedly encapsulated in the filling material 536, 534, 535 and 536 together constitute a matrix of the hybrid woven-fabric integrated column or the substrate including a conductive via, and the mechanical and mechanical properties of the matrix can be improved by appropriately selecting and designing mesh size and supporting-wire material in the mesh-shaped supporting-wire woven fabric 540 The thermal properties, 537 and 538 distribution, represent a plurality of layers of the mesh support wire weave cloth and a plurality of layers of the hybrid weave cloth, wherein each layer of the hybrid weave cloth 538 is secured between two layers of the support sheet 537 by the filler material 536, and the spacing between adjacent layers of the hybrid weave cloth 538 is set by at least one layer of the mesh support wire weave cloth 537 therebetween.
It should be noted that for a composite structure comprising multiple materials, the matrix being made of those materials depends on that for that component, such as the hybrid integrated column represented at 530, for the wires 533, the matrix comprises all the other materials than the wires 533, i.e., the matrix is made of 534, 535, and 536; if the multi-layer woven and knitted fabric 538 is used, the matrix is composed of the filler 536 and the multi-layer mesh support wire woven and knitted fabric 537.
Preferably, some technical means of the method as shown by the reference numeral 1000 in fig. 8, i.e., the method of manufacturing the multi-layer woven fabric 304 and the multi-layer support sheet 305 into one of the columnar layer-shaped structures 300 by means of the support sheet 200 at step S2, are described below.
As shown by the numeral 4000 in fig. 16, fabricating a columnar structure comprising a plurality of layers of woven and knitted fabric and a plurality of support sheets includes two approaches as shown by the numerals 410 and 420: 410, laminating a plurality of mixed woven fabrics 412 and a plurality of supporting sheets 411 together to form a columnar layer structure, wherein two adjacent layers of mixed woven fabrics are separated by at least one supporting sheet, so that the mutual insulation between the conducting wires is ensured; wherein 420 illustrates a layered columnar structure formed by stacking a long strip-shaped support sheet 421 and a long strip-shaped wire support line 422 into a double-layered long strip 423, and then rolling the double-layered long strip 423 into a column of a multi-layered structure as shown by 435 or 450 as shown by a rolling arrow 424; where 450 represents a layered cylindrical porous structure formed by rolling the double layer long strips 423 around a cylindrical core 440, where 441 and 442 indicate that the cylindrical core 440 may comprise some metal structures, and 430 indicates a filling material, and an arrow indicates that a filling material may be applied on one or both of the support sheet and the hybrid woven fabric to better fill all voids before stacking or rolling the support sheet and the hybrid woven fabric to form the cylindrical layered structure 410 or 450. The columnar layered porous structure made of the hybrid woven fabric and the support sheet may have a layered configuration in two forms, one is in a stacked form as shown in 410, and the other is in a rolled form as shown in 435 and 450, and the rolled columnar layered structure may further preferably contain a core, as compared with the stacked form; in addition, the columnar layer structure in a roll-up form is not limited to being formed by rolling up only one double-layer long strip 423, and may be formed by rolling up one multi-layer long strip. It should be further noted that the stacked columnar layer structure can be formed by stacking a plurality of rectangular woven fabric and support sheets into a column as shown in 410 of fig. 16, or can be formed by winding the double-layer strip 423 or the multi-layer strip around a polygonal frame a plurality of times, so as to form a stacked columnar layer structure on each side of the polygonal frame.
In summary, the means for forming the wire support wire and the support sheet into the cylindrical layer structure in the embodiment includes stacking and rolling, so as to form the stacked cylindrical layer structure and the rolled cylindrical layer structure, wherein the rolled cylindrical layer structure may further include a pillar core, and the pillar core may include some metal structures extending in the axial direction of the pillar; in addition, the filling material may be coated on the support sheet and/or the mixed woven cloth before the columnar layer structure is manufactured, or may be filled after the columnar layer structure is manufactured, which may be preferably selected according to the structure of the support sheet and the design of the mixed woven cloth.
Another embodiment of the present invention is described below by making a multilayer hybrid fabric into a columnar layer structure by means of an auxiliary frame and further making a substrate including conductive through holes.
As shown by numeral 3000 in fig. 17, a container-shaped frame 320 is manufactured, which includes a clamping plate 321/322 and a side wall 323, wherein 330 indicates that clamping plates 321 and 322 fix both ends of a plurality of pieces of mixed woven fabric 310 therein and set the interlayer spacing, so that the plurality of pieces of mixed woven fabric 310 form a columnar layer structure, then a filling material 350 is added into the container-shaped frame 320 from an opening of the side wall 323 as shown by an arrow 351, and all gaps and the periphery in the columnar layer structure 310 are filled, and then the filling material 350 is cured, thereby manufacturing a column body which contains a columnar layer structure formed by a plurality of layers of mixed woven fabric in a filling material matrix, i.e. a mixed woven fabric integrated column body. Due to the adoption of the mixed woven fabric 310, the method in one embodiment of the invention shown in fig. 17 solves the defect that the metal wires are fixed only at two ends and are easy to move or damage in the prior art as shown by the numeral 30 in fig. 2.
Reference numeral 5800 in fig. 18 illustrates a cross-sectional view of the hybrid-woven cloth integrated column made in this embodiment of the present invention shown in fig. 17, which also represents a surface view of the substrate including the conductive through-holes made in this embodiment, the hybrid-woven cloth integrated column 5800 being composed of a base 583 solidified by the filling material and a multi-layer hybrid-woven cloth 580 sealed therein; compared with the embodiment of the invention shown in fig. 8, the embodiment shown in fig. 17 has the advantage that both the filling material and the matrix material in the substrate in the conventional sense are made of the substrate containing the conductive through holes, i.e. when the hybrid fabric only containing the conducting wires in the longitudinal direction and the sparse supporting wires in the transverse direction of the hybrid fabric are used, the matrix material in the substrate in the conventional sense is separated into the substrate containing the conductive through holes in the portion not containing the transverse supporting wires in the hybrid fabric integrated column made in the embodiment, i.e. the substrate containing the conductive through holes in 5800 does not contain the supporting wires 582 from the hybrid fabric any more.
It should be noted that there is no explicit choice of materials in the description and illustration of the above-described embodiments of the invention, which is briefly described below. One or more of the above embodiments of the present invention relate to four materials, a wire, a support sheet, and a filler material; wherein the optional conductive wires comprise various metal wires or metal wires with insulating layers, the optional support wires comprise various non-conductive wires, such as glass fiber wires, plastic wires, cotton wires, etc., the optional support sheets comprise various sheet materials, such as green ceramic sheets, glass sheets, plastic sheets, woven glass fiber cloth, etc., and the optional filling materials comprise various curable liquids, pastes and powders, such as liquid polymer materials, ceramic pastes, glass powders, silicon powders, metal pastes and metal powders, etc. Generally, the material is selected so as to complete the steps of the above embodiments of the present invention, particularly the step of curing the filler material. Several preferred examples regarding material selection include: 1) in the embodiment of manufacturing the hybrid woven cloth integrated column as illustrated in fig. 11, the glass substrate including the conductive through hole can be manufactured by adopting the copper wire and glass fiber wire hybrid woven cloth and the glass fiber wire woven cloth; 2) in the embodiment of manufacturing the hybrid woven cloth integrated column as illustrated in fig. 15, a ceramic substrate including a conductive through hole can be manufactured by using a mesh copper wire and glass fiber wire hybrid woven cloth, a mesh glass fiber wire woven cloth and a ceramic slurry capable of being sintered at a low temperature; 3) in the embodiment of manufacturing the hybrid woven cloth integrated column as illustrated in fig. 18, a ceramic substrate including a conductive through hole can be manufactured by using a copper wire and glass fiber wire hybrid woven cloth and a ceramic slurry capable of being sintered at a low temperature; 4) in the above 2) and 3), a low melting point metal material such as aluminum or an aluminum alloy is used as a filler material; the conducting wire adopts a copper wire with a ceramic or glass outer layer, so that an aluminum substrate containing a conducting through hole can be manufactured; 5) the lead adopts a high-temperature-resistant tungsten wire, and the filling material can adopt ceramic slurry which needs high-temperature sintering or silicon powder which needs high-temperature nitridation, so that the high-temperature ceramic substrate containing the conductive through hole can be manufactured. In summary, one or more embodiments of the present invention provide great flexibility in the choice of materials to fabricate a wide variety of substrates containing conductive vias as desired.
Fig. 19 is a diagram 5500 illustrating a hybrid fabric including a two-dimensional parallel wire family in the longitudinal direction and a metal wire 550 in the transverse direction according to an embodiment of the present invention, and various substrates including conductive vias can be cut from the same hybrid fabric integrated cylinder by cutting the hybrid fabric integrated cylinder manufactured based on the hybrid fabric 5500 at cutting positions indicated by arrows 551, 552 and 553.
The characteristics of the hybrid woven cloth integrated column of the present invention as illustrated in fig. 11, 13, 14, 15 and 18, which is manufactured in the above-described embodiment of the present invention, will be explained and described below by a hybrid woven cloth integrated column of the present invention as illustrated by reference numeral 5600 in fig. 20.
As shown in fig. 20, the hybrid woven/knitted fabric integrated column of the present invention is composed of a columnar substrate 562 composed of a plurality of support sheets and/or filling materials and a columnar layered structure 560A encapsulated therein and composed of a plurality of hybrid woven/knitted fabrics 560. The multi-layer mixed woven fabric 560 is characterized in that each layer of mixed woven fabric 560 is woven by conducting wires and supporting wires, and each layer of mixed woven fabric 560 contains at least one two-dimensional parallel conductor group 565, as shown by the numerical symbols 560, 561, 563, 565 and 567. The multi-layered hybrid braid 560 is arranged in the columnar substrate 562 such that a plurality of two-dimensional parallel conductor families 565 included in the multi-layered hybrid braid 560 form a three-dimensional parallel conductor family 561 extending in a columnar direction of the columnar substrate indicated by numeral 566, thereby enabling the hybrid braid integrated column to be divided into substrates including conductive vias along a direction 564 perpendicular to the three-dimensional parallel conductor family 561.
In addition, as shown by the arrow 570, in one or more embodiments of the present invention, the columnar substrate 562 may be composed of the filling material 571 and the supporting sheet 572, or only of the filling material 571, or only of the supporting sheet 572. For example, the column-shaped base body of the hybrid woven fabric integrated column illustrated in fig. 11 is composed of a plurality of support sheets 235 for fixing and sealing and separating the plurality of layers of hybrid woven fabrics, wherein the plurality of support sheets and the plurality of layers of hybrid woven fabrics form a column-shaped layer structure, in the column-shaped layer structure, each layer of the hybrid woven fabrics 236 is fixed and sealed between two support sheets 235, and adjacent two layers of the hybrid woven fabrics are separated by at least one support sheet 235. For another example, the pillar-shaped base of the hybrid woven fabric integrated column illustrated in fig. 13 is composed of a plurality of support sheets 281 for clamping and spacing the plurality of layers of hybrid woven fabrics, and the filling material 282 for filling and curing in gaps between all the layers, wherein the plurality of support sheets and the plurality of layers of hybrid woven fabrics form a pillar-shaped layer structure, each layer of the hybrid woven fabrics 283 is clamped between two support sheets 281 and is sealed therein by the filling material 282, and adjacent two layers of the hybrid woven fabrics are separated by at least one support sheet 281. For another example, the cylindrical substrate of the hybrid woven fabric integrated column illustrated in fig. 14 is composed of a plurality of layers of perforated support sheets 514 for clamping and separating the plurality of layers of hybrid woven fabrics, and a filling material 516 for filling and curing all structural gaps (in the interlayer gaps, in the holes of the perforated support sheets 514) and the whole structure periphery, wherein the plurality of layers of support sheets and the plurality of layers of hybrid woven fabrics form a cylindrical layer structure, each layer of hybrid woven fabrics is clamped between two layers of perforated support sheets 514 and is sealed therein by the filling material 516, and two adjacent layers of hybrid woven fabrics are separated by at least one layer of the support sheets 514. In contrast to fig. 14, the support sheet 500 with holes used in the hybrid woven fabric integrated column 520 shown in fig. 14 is replaced with a mesh-shaped support wire woven fabric 540 in the hybrid woven fabric integrated column 530 shown in fig. 15. For another example, the pillar-shaped base of the hybrid-woven cloth integrated column illustrated in fig. 18 is composed of a filling material 583 for filling and curing the layers, the gaps and the periphery of the multi-layer hybrid-woven cloth 580 and thereby forming a sealing seal for the multi-layer hybrid-woven cloth 580.
In addition, as shown by the numerical symbols 560, 561, 563, 565 and 567, the multilayer hybrid woven fabric 560 included in the hybrid woven fabric integrated cylinder is characterized in that each layer of hybrid woven fabric 560 includes at least one two-dimensional parallel conductor family 565, the multilayer hybrid woven fabric 560 is arranged in the columnar substrate 562 in a columnar layer-shaped structure having a set interlayer spacing 567, and the plurality of two-dimensional parallel conductor families 565 included in the multilayer hybrid woven fabric 560 are made to form a three-dimensional parallel conductor family 561 extending in a columnar direction of the columnar substrate, for example, as shown by the numerical symbol 566, so that the hybrid woven fabric integrated cylinder can be divided into substrates including conductive vias in a direction 564 perpendicular to the three-dimensional parallel conductor family 561. Optionally, as shown at 563, one or more of the multiple layers of hybrid fabric 560 also contains conducting wires in other directions, which form a mesh conducting wire structure with the two-dimensional parallel conducting wire family 565, thereby making a substrate containing conducting vias containing mesh conducting wire structure; preferably, the support sheet 572 may comprise various configurations, and may be a mesh support wire weave as shown at 573.
It should be noted that, when the structural features of the hybrid woven fabric integrated column of the present invention are illustrated and described, the substrate is for the hybrid woven fabric of the wire supporting wires, and therefore, the substrate is composed of all other materials except for the hybrid woven fabric of the wire supporting wires in the hybrid woven fabric integrated column. In addition, it should be noted that the length of the hybrid woven and knitted integrated column illustrated in fig. 20 in the column direction is not limited to be larger than that in the other directions, and the length in each direction can be flexibly set according to the needs and the production efficiency.
Fig. 21 is a flowchart of a method of manufacturing a substrate with redistributed conductive vias based on the substrate with conductive vias in the above embodiments of the present invention. As shown in fig. 21, the following steps 9A to 9C may be included. A method for manufacturing a substrate having redistributed conductive vias based on the substrate having conductive vias of the first embodiment is described in detail below with reference to fig. 22.
In step 9A, insulating layers are respectively covered on the upper surface and the lower surface of the substrate including the conductive via. As shown in fig. 22, numeral 900 denotes a conductive via-containing substrate including upper and lower surfaces, and the step shown by arrow 9A is intended to cover insulating layers 911 and 911A on the upper and lower surfaces of the conductive via-containing substrate 900, 911A denotes an insulating layer covering the lower surface or the back surface, and 910 denotes the conductive via-containing substrate 900 covered with the insulating layer 911/911A.
In step 9B, holes are opened at opposite positions of the two insulating layers, pairs of holes of the same size and aligned with each other are formed, and the substrate area under the two openings of each pair of holes is provided with at least one conductive via. In this embodiment, as shown in fig. 22, the step shown by the arrow 9B is to open a hole 921/921A in the insulating layer 911/911A, make a hole 921 in the upper surface correspond to a hole 921A in the lower surface, form a pair of holes 921/921A aligned with each other in equal size, indicate by numeral 922 at least one conductive via hole covering the lower surface thereof exposed after opening the hole in the insulating layer 911, and denote a substrate containing a conductive via hole having a plurality of pairs of holes 921/921A opened in the insulating layer 911.
In step 9C, the two openings of each pair of holes are covered with conductive layers respectively, so that the conductive layers in the two openings can form conductive channels via the underlying conductive vias, thereby obtaining a substrate comprising redistributed conductive vias. As shown in fig. 22, the step shown by the arrow 9C is to cover the conductive layer 931/931A in the hole 921/921A, and for each pair of holes 921/921A, a conductive path is formed from the conductive layer 931 in the upper surface hole 921 to the conductive layer 931A in the lower surface hole 921A via the conductive via 922 connecting them, that is, a conductive path from 931/via 922 to 931A via 931A, which is called a redistribution conductive via, thereby manufacturing a substrate 930 having redistribution conductive vias. Circuit substrates for chip packaging can be further fabricated by fabricating circuits and pads thereon by conventional methods based on the substrate containing the redistributed conductive vias.
It should be noted that the position of the conductive via in the substrate containing the conductive via manufactured by the macroscopic method is difficult to be arbitrarily and precisely located, and the position of the conductive via must be precisely located in the application of the chip package. The method for manufacturing the substrate with the redistributed conductive through holes based on the substrate with the conductive through holes of the embodiment can effectively solve the problem, the position of the redistributed conductive through holes can be accurately positioned according to the requirement, but the density and the spacing of the redistributed conductive through holes are limited by the density of the conductive through holes and the diameter of the conductive through holes, roughly speaking, the density of the redistributed conductive through holes is about 4 times smaller than that of the conductive through holes, that is, 4 conductive vias can create a redistribution conductive via, the spacing between adjacent redistribution conductive vias must be larger than the diameter of the conductive via, in practical application, a substrate containing redistributed conductive through holes, the pitch of which can be about 200 microns, can be made based on a substrate containing conductive through holes, the pitch of which is 100 microns, and the substrate containing redistributed conductive through holes can be made, which can basically meet the requirements of the current chip package.
Fig. 23 is a flow chart of another method of the present invention for manufacturing a substrate with redistributed conductive vias based on the substrate with conductive vias in the above embodiments. As shown in fig. 23, the following steps 10A to 10C may be included. A method for manufacturing a substrate having redistributed conductive vias based on the substrate having conductive vias of the first embodiment is described in detail below with reference to fig. 24.
In step 10A, sheet metal is covered at opposite positions of the upper and lower surfaces of a substrate including conductive vias, a plurality of pairs of sheet metal pairs of equal size and aligned with each other are formed, and at least one conductive via is provided in the substrate area under both sheet metals of each pair of sheet metal pairs. As shown in fig. 24, reference numeral 950 represents a substrate including a conductive via 951, which includes upper and lower surfaces, and the step shown by an arrow 9A is intended to cover the upper and lower surfaces of the substrate including a conductive via with a sheet metal 961/961 a; each sheet metal 961 in the upper surface corresponds to one sheet metal 961A in the lower surface, forming a plurality of pairs 961/961A, 960 of equal size aligned with each other representing the substrate 950 containing the conductive via 951 covered with the pair 961/961A.
In step 10B, the upper and lower surfaces of the substrate covered with the pair of sheet metals are covered with insulating layers, respectively. As shown in fig. 24, the step shown by the arrow 10B is to cover the upper and lower surfaces of the sheet metal-covered substrate 710 with an insulation 971/971 a.
In step 10C, holes are opened at positions of the two insulating layers corresponding to the sheet metal pairs to expose partial areas of the two sheet metals of each pair of sheet metals, so that the exposed parts of the two sheet metals of each pair of sheet metals form conductive channels via the underlying conductive vias, thereby obtaining a substrate including redistributed conductive vias. As shown in fig. 24, the step shown by arrow 10C schematically corresponds to the pair of sheet metals 961/961A, 981/981A is opened in the insulating layer 971/971A so that each hole 981/981A falls within the range of the sheet metal, and for each pair of sheet metals 961/961A, a conductive path is formed from the exposed metal 981 in the upper surface hole 981 to the exposed metal 981A in the lower surface hole via a conductive via connecting them (i.e., a portion of the conductive via covered by the pair of sheet metals 961/961A, and further, numeral 981/981A also represents the exposed metal in the corresponding hole), i.e., a conductive path connected from the metal 981/via the portion of the conductive via to the metal 981A, referred to as a redistribution conductive via, thereby producing a substrate containing redistribution conductive vias.
Preferably, the circuit substrate for chip packaging can be further manufactured by fabricating circuits and pads thereon by conventional methods based on the substrate containing the redistributed conductive vias.
It should be noted that the position of the conductive via in the substrate containing the conductive via manufactured by the macroscopic method is difficult to be arbitrarily and precisely located, and the position of the conductive via must be precisely located in the application of the chip package. The method for manufacturing the substrate with the redistributed conductive through holes based on the substrate with the conductive through holes of the embodiment can effectively solve the problem, the position of the redistributed conductive through holes can be accurately positioned according to the requirement, but the density and the spacing of the redistributed conductive through holes are limited by the density of the conductive through holes and the diameter of the conductive through holes, roughly speaking, the density of the redistributed conductive through holes is about 4 times smaller than that of the conductive through holes, that is, 4 conductive vias can create a redistribution conductive via, the spacing between adjacent redistribution conductive vias must be larger than the diameter of the conductive via, in practical application, a substrate containing redistributed conductive through holes, the pitch of which can be about 200 microns, can be made based on a substrate containing conductive through holes, the pitch of which is 100 microns, and the substrate containing redistributed conductive through holes can be made, which can basically meet the requirements of the current chip package.
It is further understood that the foregoing description of the present invention with reference to examples and accompanying drawings is illustrative only and is not intended to limit the spirit and scope of the invention, which may be modified by those skilled in the art to include equivalent embodiments.

Claims (10)

1. The utility model provides an integrated cylinder of mixed plaiting, its characterized in that includes:
a columnar matrix;
the multi-layer mixed woven cloth is fixedly sealed in the columnar matrix, wherein each layer of mixed woven cloth is formed by weaving conducting wires and supporting wires and comprises at least one two-dimensional parallel conducting wire family;
wherein the plurality of layers of mixed woven cloth are arranged in the columnar matrix in such a way that a plurality of two-dimensional parallel conductor families contained in the plurality of layers of mixed woven cloth form at least one three-dimensional parallel conductor family extending in the columnar direction of the columnar matrix, so that the mixed woven cloth integrated columnar body can be divided into substrates containing conductive through holes along the direction perpendicular to the three-dimensional parallel conductor families;
wherein, at least one layer of the mixed woven cloth is also provided with wires in the direction vertical to the two-dimensional parallel wire family contained in the mixed woven cloth, thereby having a reticular wire structure.
2. The hybrid woven integrated column of claim 1, wherein:
the columnar substrate comprises a multilayer supporting sheet for fixedly sealing and separating the multilayer mixed woven cloth;
the multi-layer supporting sheets are arranged in the columnar base body to form a columnar layer-shaped structure with the multi-layer mixed woven cloth, in the columnar layer-shaped structure, each layer of mixed woven cloth is fixedly sealed between two layers of supporting sheets, and meanwhile, the two adjacent layers of mixed woven cloth are separated by at least one layer of supporting sheet.
3. The hybrid woven integrated column of claim 2, wherein:
in the columnar layer-shaped structure, the two adjacent layers of support sheets and the mixed woven cloth are fixedly connected together and the two adjacent layers of support sheets are fixedly connected together through set temperature and pressure.
4. The hybrid woven integrated column of claim 2, wherein:
the columnar matrix further comprises a filling material for filling and curing interlayer gaps of the columnar layered structure;
in the columnar layer structure, the support sheets and the mixed woven cloth are bonded together by solidifying the filling material between the support sheets.
5. The hybrid woven integrated column of claim 4, wherein:
the filling material also wraps the columnar layer-shaped structure, so that the columnar matrix is composed of the filling material and the columnar layer-shaped structure which is fixedly sealed in the filling material.
6. The hybrid woven integrated column of any one of claims 2 to 5, wherein:
the columnar layer-shaped structure is formed by stacking the mixed woven cloth and the supporting sheet.
7. The hybrid woven integrated column of any one of claims 2 to 5, wherein:
the columnar layer-shaped structure is formed by rolling and folding the mixed woven cloth and the supporting sheet.
8. The hybrid woven integrated column of claim 7, wherein:
the columnar layered structure is formed by rolling and folding the mixed woven cloth and the supporting sheet around a column core.
9. The hybrid woven integrated column of any one of claims 2 to 5, wherein:
the support sheet is a mesh support wire woven cloth, and/or the mixed woven cloth is a mesh wire support wire mixed woven cloth.
10. The hybrid woven integrated column of claim 1, wherein:
the columnar matrix is made of filling materials, and a columnar layer type structure formed by the multiple layers of mixed woven cloth is fixedly sealed in the columnar matrix through solidification of the filling materials.
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