JP2014038883A - Electronic component and method for manufacturing electronic component - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an electronic component which is excellent in inductance characteristics, and to provide a method for manufacturing the electronic component.SOLUTION: An electronic component 1 includes: an insulating substrate 2 in which a plurality of insulating layers L1 to L3 are laminated, and a storage space 3 is formed; a magnetic substance 4 stored in the storage space 3; and coil patterns 5a and 5b formed in the insulating substrate 2 such that the magnetic substance 4 is wound. A gap is disposed between the outer surface of the magnetic substance 4 and the wall surface of the insulating substrate 2 appearing in the storage space 3 so that it is possible to suppress a pressure which the magnetic substance 4 receives from the insulating substrate 2. Thus, it is possible to increase the value of inductance to be generated by the electronic component 1.

Description

The present invention relates to an electronic component in which a coil pattern wound around a magnetic material housed in an insulating substrate is formed on the insulating substrate, and a method for manufacturing the electronic component.

  Conventionally, an endless magnetic layer 102 is formed on a printed wiring board 101, and a coil pattern 103 is wound around the endless magnetic layer 102, as an example of an electronic component including an inductor element shown in FIG. There is known an electronic component 100 in which is formed (Patent Document 1).

  In this case, the endless magnetic layer 102 is embedded in the printed wiring board 101, and the coil pattern 103 that winds the endless magnetic layer 102 is formed on the front and back surfaces of the printed wiring board 101. And a plurality of through-holes 105 that connect the ends of the corresponding linear conductor patterns 104 on the front and back surfaces. With this configuration, the magnetic path of the magnetic lines of force generated by the electronic component 100 is a closed magnetic path, and thus the electronic component 100 capable of obtaining a large inductance value can be provided.

JP 2000-40620 (see paragraph 0018, FIG. 1, etc.)

  However, in recent years, there has been an increasing demand for higher performance of electronic components including inductor elements, and research and development of electronic components that can obtain an inductance value larger than that of the conventional electronic component 100 are being promoted.

  The present invention has been made in view of the above-described problems, and an object thereof is to provide an electronic component having excellent inductance characteristics and a method for manufacturing the electronic component.

  In order to achieve the above-described object, an electronic component according to the present invention includes an insulating substrate having a storage space formed therein, a magnetic body stored in the storage space, and the magnetic body wound around the magnetic body. A coil pattern formed on the insulating substrate, and a gap is provided at least between the outer surface of the magnetic body and the wall surface of the insulating substrate appearing in the storage space.

  In the electronic component including the above-described conventional inductor element, the endless magnetic layer is disposed so as to be in contact with the inside of the printed wiring board, so that the printed wiring board is easily subjected to pressure due to shrinkage of the printed wiring board. This pressure is considered to be an obstacle to increasing the inductance value. The inventor of the present invention provides a gap between the outer surface of the magnetic body and the wall surface of the insulating substrate that appears in the storage space, and suppresses the pressure that the magnetic body receives from the insulating substrate. It has been experimentally confirmed that an inductance value can be obtained, and it has been found that providing such a gap is effective in obtaining a high inductance value.

  Further, the storage space may be formed by providing a concave portion on one main surface of the insulating substrate. By comprising in this way, the storage space which stores a magnetic body in an insulated substrate can be formed.

  The insulating substrate may be formed by laminating a plurality of insulating layers, and the storage space may be formed by a recess provided facing each of the adjacent insulating layers. By comprising in this way, the storage space which stores a magnetic body in an insulated substrate can be formed.

  The insulating substrate may be a resin substrate. With this configuration, the magnetic body and the coil pattern (or a part thereof) disposed in the insulating substrate are protected by the resin, so that an electronic component with high environmental reliability can be provided.

  The magnetic body may be formed of ferrite. By comprising in this way, it can apply to the electronic component in which the magnetic body of this invention was formed with the ferrite.

  The insulating substrate may have a plurality of storage spaces, and the magnetic body may be disposed in each of the storage spaces. With this configuration, a plurality of inductor elements can be formed on the insulating substrate, and various functions can be formed by the plurality of inductor elements in the electronic component. Further, by combining a plurality of inductor elements, it is possible to easily adjust the inductance value in the electronic component.

  The coil pattern is formed on one side of the magnetic body in the length direction of the columnar conductors and a plurality of columnar conductors erected around the magnetic body, and corresponding one ends of the columnar conductors. A plurality of one-side wiring electrodes that connect each other, and a plurality of other-side wiring electrodes that are formed on the other side of the magnetic body in the length direction of the columnar conductors and that connect the corresponding other ends of the columnar conductors, The magnetic body may be spirally wound by the one-side wiring electrodes and the other-side wiring electrodes that connect the columnar conductors and the columnar conductors in series.

  In this way, by connecting the one-side wiring electrode and the other-side wiring electrode with a columnar conductor, the conductor connecting the one-side wiring electrode and the other-side wiring electrode is formed with a through hole. Thus, the cross-sectional area of the columnar conductor connecting both wiring electrodes can be increased. In addition, when the columnar conductor is formed of, for example, a pin-shaped metal wire formed of Cu or the like, unlike the case where the columnar conductor is formed of a via conductor, the columnar conductor can be disposed close to the columnar conductor. The number of turns of the coil pattern to be performed can be increased, and the inductance can be increased.

  The insulating substrate is configured by laminating a plurality of insulating layers, and the coil pattern includes a plurality of columnar conductors erected around the magnetic body and a length direction of the columnar conductors. A plurality of one-side wiring electrodes formed on at least two of the plurality of insulating layers positioned on one side of the magnetic body, and a position on the other side of the magnetic body in the length direction of the columnar conductor A plurality of other wiring electrodes formed on at least two of the plurality of insulating layers, and each of the columnar conductors includes one having a different length, and sandwiching the magnetic body A pair of adjacent columnar conductors are connected in series by one of the one side wiring electrodes and one or the other side wiring electrodes and wound around the magnetic body to a predetermined coil diameter. The other set of pillars The conductors are connected in series by the other one-side wiring electrode and the one or other other-side wiring electrode, and are wound around the magnetic body to a coil diameter different from the predetermined coil diameter, thereby forming a spiral pattern. It may be formed.

  With this configuration, a part of the wiring electrodes can be formed in different insulating layers in each one-side wiring electrode and each other-side wiring electrode, so that the number of wiring electrodes formed on the insulating substrate can be increased. . Therefore, the number of turns of the coil pattern for winding the magnetic body can be increased, and the inductance value generated by the electronic component can be increased. Moreover, since the length of the whole coil pattern can be adjusted by adjusting the number of wiring electrodes formed in each insulating layer, an electronic component having a desired inductance value can be easily obtained.

  Moreover, the outer side surfaces of the columnar conductors other than the connection end surface with the one-side wiring electrode and the connection end surface with the other-side wiring electrode may be covered with an insulating material. With this configuration, the columnar conductors can be arranged in contact with each other, and the number of columnar conductors formed on the insulating substrate can be increased. Therefore, the number of turns of the coil pattern can be easily increased.

  The magnetic body may have an annular shape. With this configuration, the magnetic path of the magnetic force lines generated by the electronic component becomes a closed magnetic path, so that the inductance value generated by the electronic component can be increased.

  In order to achieve the above-described object, the electronic component manufacturing method of the present invention includes a first and a second one in which a concave portion is formed on one main surface and a plurality of conductor patterns forming a coil pattern are formed. Preparing two insulating layers, laminating the first and second insulating layers so that the magnetic body is positioned in the concave portions disposed opposite to each other, and the conductor pattern of the first insulating layer and the And a step of joining the conductor patterns of the second insulating layer.

  With this configuration, a storage space for storing the magnetic material can be easily formed inside the insulating substrate, and thus an electronic component having high inductance characteristics can be easily manufactured.

  In addition, the manufacturing method of the electronic component includes a third insulating layer in which a plurality of conductor patterns for forming a coil pattern and a plurality of conductor patterns for forming the coil pattern are formed on one main surface. Providing a fourth insulating layer formed and laminated on the third insulating layer; disposing the magnetic body in the recess; and third insulating the fourth insulating layer so as to cover the recess. A structure may be provided that includes laminating the layers and joining the conductor pattern of the third insulating layer and the conductor pattern of the fourth insulating layer.

  Even if comprised in this way, since the accommodation space for accommodating a magnetic body can be easily formed in the inside of an insulated substrate, an electronic component with a high inductance characteristic can be manufactured easily.

  According to the present invention, the magnetic body is stored in the storage space formed inside the insulating substrate constituting the electronic component, and the coil pattern for winding the magnetic body is formed on the insulating substrate. By providing a gap between the insulating substrate and the wall surface of the insulating substrate that appears in the storage space, an inductance value generated by the electronic component can be increased, and thus an electronic component having excellent inductance characteristics can be provided.

1 is a plan view of an electronic component according to a first embodiment of the present invention. FIG. 2 is a cut front view of the electronic component of FIG. 1. It is a principal part perspective view of the electronic component of FIG. It is a figure for demonstrating the manufacturing method of the electronic component of FIG. It is a cutting front view of the electronic component concerning a 2nd embodiment of the present invention. It is a figure for demonstrating the manufacturing method of the electronic component of FIG. It is a disassembled cut front view of the electronic component concerning 3rd Embodiment of this invention. It is a perspective view of the conventional electronic component.

(First embodiment)
(Configuration of electronic parts)
An electronic component 1 according to a first embodiment of the present invention will be described with reference to FIGS. 1 is a plan view of the electronic component 1, FIG. 2 is a cut front view of the electronic component 1, and FIG. 3 is a view showing a magnetic body and a coil pattern that are the main parts of the electronic component 1.

  An electronic component 1 according to this embodiment is an electronic component in which an inductor element is formed on an insulating substrate 2, and as shown in FIGS. 1 and 2, a plurality of insulating layers L1 to L3 are laminated inside. An insulating substrate 2 in which the storage space 3 is formed, an annular magnetic body 4 stored in the storage space 3, and two coils formed on the insulating substrate 2 so as to wind the magnetic body 4 For example, it is mounted on an electronic device such as a mobile phone using high frequency. In this embodiment, a choke coil is formed on the insulating substrate 2 as an example of an inductor element. Further, both ends of each of the coil patterns 5a and 5b are connected to the external electrode 9 for connection to the outside formed on the insulating substrate 2. Other examples of electronic components in which inductor elements are formed include sensors and transformers (formed by winding a plurality of coil patterns 5a and 5b around an annular magnetic body 4). It is done.

  As shown in FIG. 2, the insulating substrate 2 is formed by laminating a plurality of insulating layers (three layers in this embodiment) L1, L2, and L3. The insulating layers L1 and L3 constituting the insulating substrate 2 are , For example, formed of glass epoxy resin. The intermediate layer L2 is a resin sheet formed of, for example, an epoxy resin, and functions as an adhesive layer for bonding the upper and lower insulating layers L1 and L3. Note that the number of insulating layers L1, L2, and L3 may be four or more. In addition, each of the insulating layers L1 and L3 may be formed of, for example, low temperature co-fired ceramic (LTCC) or glass. Further, the insulating layer L2 may have a multilayer structure including a plurality of layers.

  As shown in FIG. 1 and FIG. 2, a storage space 3 for storing the magnetic body 4 is formed in one side of each of the insulating layer L1 and the insulating layer L3 inside the insulating substrate 2. 10a, 10b and a through hole 10c formed in the intermediate layer L2, and the magnetic body 4 is stored in the storage space 3. At this time, the storage space 3 is formed in such a size that a gap is formed between the outer surface of the magnetic body 4 and the wall surface of the insulating substrate 2 appearing in the storage space 3 when the magnetic body 4 is stored. The The storage space 3 is not limited to the case where it is formed by the recesses 10a and 10b and the through holes 10c formed in the insulating layers L1 to L3. For example, the number of insulating layers to be stacked is increased to increase the number of insulating layers. You may form by providing a recessed part thru | or a through-hole in a layer.

  The magnetic body 4 is made of, for example, Ni—Zn—Fe or Mn—Zn—Fe ferrite and has an annular shape as described above. In this embodiment, the magnetic body 4 is accommodated in the accommodation space 3 in a movable state. The shape of the magnetic body 4 is not limited to an annular shape, and may be, for example, a square shape, a U shape, a U shape, a rectangular parallelepiped shape, or a cylindrical shape in plan view. In addition, the magnetic body 4 is not necessarily stored in a movable state in the storage space 3, and may be fixed in the storage space 3 with an adhesive or the like. There may be a plurality of magnetic bodies 4 stored in the insulating substrate 2. In this case, a plurality of storage spaces 3 may be formed in the insulating substrate 2 and the magnetic body 4 may be disposed in each of the storage spaces 3.

  As shown in FIGS. 2 and 3, each coil pattern 5a and 5b includes a plurality of columnar conductors 6a1, 6a2, 6b1 and 6b2, and a plurality of insulating layers L1 to L3. A plurality of upper-layer wirings formed on the insulating layer L3 located on the upper side of the magnetic body 4 in the direction (corresponding to one side in the present invention) and connecting corresponding one ends of the columnar conductors 6a1, 6a2, 6b1, and 6b2 Electrodes (corresponding to one side wiring electrode in the present invention) 7a1, 7b1 and the insulating layer L1 located below the magnetic body 4 (corresponding to the other side in the present invention) in the stacking direction of the insulating layers L1 to L3 And a plurality of lower layer side wiring electrodes (corresponding to the other side wiring electrodes in the present invention) for connecting the corresponding other ends of the columnar conductors 6a1, 6a2, 6b1 and 6b2. And the magnetic body 4 includes the columnar conductors 6a1, 6a2, 6b1 and 6b2, and the upper layer side wiring electrodes 7a1, 7b1 and the lower layer side wiring electrodes 7a2, which connect the columnar conductors 6a1, 6a2, 6b1 and 6b2 in series. 7b2 and spirally wound.

  Specifically, each of the columnar conductors 6a1, 6a2 and 6b1, 6b2 forming the coil patterns 5a, 5b is a plurality of inner columnar conductors arranged in a region surrounded by the inner peripheral surface of the annular magnetic body 4. 6a1 and 6b1 and a plurality of outer columnar conductors 6a2 and 6b2 arranged outside the outer peripheral surface. In this case, as shown in FIG. 2, each of the inner columnar conductors 6a1 and 6b1 includes via conductors 8f and 8c formed in the upper insulating layer L3, and via conductors 8d and 8d formed in the lower insulating layer L1. 8a and via conductors 8e and 8b formed in the intermediate layer L2, for example, the via conductors 8a to 8c are connected to form one inner columnar conductor 6b1. Each of the outer columnar conductors 6a2 and 6b2 is connected to via conductors 8l and 8i formed in the upper insulating layer L3, via conductors 8j and 8g formed in the lower insulating layer L1, and an intermediate layer L2. The via conductors 8k and 8h are formed. For example, the via conductors 8g to 8i are connected to form one outer columnar conductor 6b2. In addition, the pin-shaped metal formed by the metal member such as Cu, for example, is used for the interlayer connection conductor formed by the via conductors 8a to 8l formed by filling the via holes formed in the insulating layers L1 to L3 with the conductive paste. It may be formed by a wire or may be formed by plating a via hole.

  The upper wiring electrodes 7a1 and 7b1 forming the coil patterns 5a and 5b are respectively formed on the surface L3a of the upper insulating layer L3, and the upper ends of the corresponding inner columnar conductors 6a1 and 6b1 and the outer columnar conductors 6a2. , 6b2 are connected to each other. The lower layer side wiring electrodes 7a2 and 7b2 forming the coil patterns 5a and 5b are respectively formed on the back surface L1a of the lower layer side insulating layer L1, and the lower ends of the corresponding inner columnar conductors 6a1 and 6b1 and the outer columnar conductors 6a2. , 6b2 are connected to each other. In this case, for example, the upper end of the outer columnar conductor 6a2 of the coil pattern 5a shown in FIG. 2 and the upper end of the outer columnar conductor 6b2 of the coil pattern 5b are connected to upper layer side wiring electrodes 7a1 and 7b1 (not shown). That is, each of the coil patterns 5a and 5b formed by the columnar conductors 6a1, 6a2 and 6b1, 6b2, the upper layer side wiring electrodes 7a1 and 7b1, and the lower layer side wiring electrodes 7a2 and 7b2, respectively, as shown in FIGS. An annular magnetic body 4 is spirally wound along its circumferential direction. FIG. 2 schematically shows a cross section of the electronic component 1, and the upper ends of the outer columnar conductors 6a2 and 6b2 are to be connected to upper wiring electrodes 7a1 and 7b1 (not shown) as described above. Is connected to the upper wiring electrodes 7a1 and 7b1 shown in the drawing.

(Method for manufacturing electronic parts)
Next, an example of a method for manufacturing the electronic component 1 according to this embodiment will be described with reference to FIG. FIG. 4 is a diagram for explaining a method of manufacturing the electronic component 1 and is an exploded cut front view of the electronic component 1.

  First, a concave portion 10a that forms a storage space 3 for storing the magnetic body 4 is formed on one main surface thereof, and a plurality of upper layer side wiring electrodes 7a1 and 7b1 that form the coil patterns 5a and 5b, respectively. An insulating layer L3 (first insulating layer in the present invention) in which a plurality of via conductors 8c, 8f, 8i, 8l forming columnar conductors (inner columnar conductors 6a1 and 6b1, outer columnar conductors 6a2 and 6b2) are formed; On the other hand, a recess 10b that forms a storage space 3 for storing the magnetic body 4 is formed on the main surface, and a plurality of lower layer side wiring electrodes 7a2 and 7b2 that form the coil patterns 5a and 5b, and columnar conductors (inside Insulating layer L1 formed with a plurality of via conductors 8a, 8d, 8g, 8j forming columnar conductors 6a1 and 6b1, outer columnar conductors 6a2 and 6b2) And a plurality of via conductors 8b, 8e, 8h, 8k for forming the respective columnar conductors (inner columnar conductors 6a1 and 6b1, outer columnar conductors 6a2 and 6b2). In addition, an intermediate layer L2 in which a through hole 10c that forms the storage space 3 is formed is prepared.

  In this case, the upper layer side wiring electrodes 7a1 and 7b1 and the lower layer side wiring electrodes 7a2 and 7b2 are formed by a printing technique using a metal foil such as Cu or a conductive paste, plating, or the like.

  The via conductors 8a to 8l are formed by forming via holes at predetermined positions of the insulating layers L1 to L3 by laser processing or the like, and filling the formed via holes with a conductor paste containing Ag, Cu, or the like.

  The intermediate layer L2 is a semi-cured resin sheet formed of, for example, an epoxy resin, and is prepared as a layer for bonding the insulating layer L1 and the insulating layer L3.

  In addition, each of the recesses 10a and 10b of the insulating layer L1 and the insulating layer L3 is integrally formed when the insulating layers L1 and L3 are formed, processed using a drill, or so-called counterbore processing or the like. It is formed. The through hole 10c of the intermediate layer L2 is formed by, for example, punching or integral molding. At this time, each of the recesses 10 a and 10 b is formed to be slightly larger than the magnetic body 4.

  Next, the insulating layers L1 to L3 are stacked so that the magnetic body 4 is positioned in the concave portions 10a and 10b and the through holes 10c of the intermediate layer L2, which are arranged to face each other, and the stacked insulating layers L1 to L3 are After pressing, the electronic component 1 is manufactured by completely curing the resin of the intermediate layer L2 at a predetermined temperature (for example, 180 ° C.). At this time, for example, the via conductors 8a formed in the corresponding insulating layer L1 and the via conductors 8c formed in the insulating layer L3 are joined together via the via conductors 8b formed in the intermediate layer L2. The height of the storage space 3 formed by this process is set to be higher than the height of the magnetic body 4.

  At this time, for example, the pattern formed by the via conductor 8f, the upper wiring electrode 7a1, and the via conductor 8l formed in the insulating layer L3 corresponds to the conductor pattern formed in the first insulating layer in the present invention. The pattern formed by the via conductor 8d, the lower wiring electrode 7a2 and the via conductor 8j formed in the layer L1 corresponds to the conductor pattern formed in the second insulating layer in the present invention.

  Therefore, according to the above-described embodiment, the magnetic body 4 receives from the insulating substrate 2 by providing a gap between the outer surface of the magnetic body 4 and the wall surface of the insulating substrate 2 that appears in the storage space 3 and the top surface. Since the pressure can be suppressed, the inductance value generated by the electronic component 1 is increased as compared with the electronic component 100 including the conventional inductor element arranged so that the magnetic body 4 is in contact with the inside of the insulating substrate 2. As a result, the inductance characteristics of the electronic component 1 can be improved. Even if there is no gap between the magnetic body 4 and the storage space 3, the inductance characteristic of the electronic component 1 can be improved by providing a gap between at least the wall surface of the insulating substrate 2.

  Also, the respective columnar conductors (inner columnar conductors 6a1 and 6b1, outer columnar conductors 6a2 and 6b2) connecting the corresponding upper layer side wiring electrodes 7a1 and 7b1 and lower layer side wiring electrodes 7a2 and 7b2 are formed by the respective via conductors 8a to 8l. Therefore, the cross-sectional areas of the columnar conductors 6a1 and 6b1, 6a2 and 6b2 can be increased as compared with the conventional electronic component 100 in which the columnar conductors 6a1 and 6b1, 6a2 and 6b2 are formed by through holes. The connection resistance when connecting the wiring electrodes 7a1 and 7b1, 7a2 and 7b2 can be reduced.

  Further, when the columnar conductors 6a1 and 6b1, 6a2 and 6b2 are formed of pin-shaped metal wires, the columnar conductors 6a1 and 6b1, 6a2 and 6b2 are adjacent to each other, unlike the case of forming the via conductors 8a to 8l. Since it is not necessary to provide a gap between the via holes so that the via holes necessary for forming the respective via conductors do not overlap with each other, both the columnar conductors 6a1 and 6b1, 6a2 and 6b2 can be arranged close to each other. The number of windings of the coil patterns 5a and 5b for winding can be increased, and the inductance can be increased.

  Further, when the inner columnar conductors 6a1 and 6b1 and the outer columnar conductors 6a2 and 6b2 are formed of pin-shaped metal wires made of a metal wire, the pin-shaped conductor is a metal itself, so compared to the via conductor, The specific resistance can be reduced.

  Further, by protecting the via conductors 8a to 8l forming the coil patterns 5a and 5b with resin, it is possible to prevent the via conductors 8a to 8l from being deteriorated by the influence of external moisture or the like. The environmental reliability of the electronic component 1 is improved.

  Further, when a plurality of magnetic bodies 4 are arranged in the insulating substrate 2, a plurality of inductor elements can be formed on the insulating substrate 2, so that various functions are formed by the plurality of inductor elements in the electronic component 1. can do. Moreover, the inductance value in the electronic component 1 can be easily adjusted by combining these inductor elements.

  In addition, by forming the magnetic body 4 in an annular shape, the magnetic path of the magnetic lines of force generated by the electronic component 1 becomes a closed magnetic path, so that the inductance value generated by the electronic component 1 can be increased.

  Further, the concave portions 10a and 10b are formed on one main surface of each of the insulating layers L1 and L3, and the through hole 10c is formed in the intermediate layer L2, so that the concave portions 10a and 10b are arranged to face each other through the through hole 10c. In addition, since the storage space 3 for storing the magnetic body 4 can be formed by laminating the insulating layers L1 to L3, the electronic component 1 having excellent inductance characteristics can be easily manufactured.

(Second Embodiment)
An electronic component 1a according to a second embodiment of the present invention will be described with reference to FIG. FIG. 5 is a cut front view of the electronic component 1a.

  The electronic component 1a according to this embodiment differs from the electronic component 1 according to the first embodiment described with reference to FIGS. 1 to 3 in that an insulating substrate 2a has two insulating layers L4 as shown in FIG. , L5 and the storage space 3a formed inside the insulating substrate 2a is provided with the recess 11 in the insulating layer L4 which is one of the two insulating layers L4 and L5 adjacent to each other. It is a point formed by. Since the other configuration is the same as that of the first embodiment, description thereof is omitted by attaching the same reference numerals.

  In this case, the recess 11 is formed inside the insulating substrate 2a formed by the adjacent insulating layers L4 and L5, and a plurality of columnar conductors 6c1 and 6c2, 6d1 and 6d2 forming the coil patterns 5c and 5d are formed. Is done. Further, a plurality of upper layer side wiring electrodes 7c1, 7d1 for forming the coil patterns 5c, 5d are formed on the surface L5a of the insulating substrate 2a, and a plurality of lower layer side wiring electrodes 7c2, for forming the coil patterns 5c, 5d on the back surface L4a. 7d2 is formed. The insulating layer L4 corresponds to the third insulating layer in the present invention, and the insulating layer L5 corresponds to the fourth insulating layer.

  Specifically, a concave portion 11 is formed on one main surface of the insulating layer L4 located on the lower layer side between the two adjacent insulating layers L4 and L5, and each columnar conductor (inner columnar conductors 6c1 and 6d1, A plurality of via conductors 10a and 10c, 10e and 10g forming outer columnar conductors 6c2 and 6c2), and a plurality of lower layer side wiring electrodes 7c2 and 7d2 are formed on one main surface L4a thereof. In addition, a plurality of via conductors 10b and 10d, 10f, and 10h forming the respective columnar conductors (inner columnar conductors 6c1 and 6d1, outer columnar conductors 6c2 and 6c2) are formed in the insulating layer L5 located on the upper layer side. At the same time, a plurality of upper layer side wiring electrodes 7c1 and 7d1 are formed on one main surface L5a.

  At this time, for example, the pattern formed by the corresponding via conductor 10a, the lower layer side wiring electrode 7c2, and the via conductor 10e corresponds to the conductor pattern formed in the third insulating layer in the present invention, and each corresponding via conductor. The pattern formed by 10b, the upper layer side wiring electrode 7c1, and the via conductor 10f corresponds to the conductor pattern formed in the fourth insulating layer in the present invention.

  Then, for example, by connecting the via conductors 10a of the insulating layer L4 and the via conductors 10b formed in the insulating layer L5 disposed in a region surrounded by the inner peripheral surface of the annular magnetic body 4, an insulating substrate is obtained. One inner columnar conductor 6c1 erected on 2a is formed, and the via conductor 10e of the insulating layer L4 and the via conductor 10f formed on the insulating layer L5 are arranged outside the outer peripheral surface of the annular magnetic body 4. By being connected, one outer columnar conductor 6c2 is formed.

  Also in this embodiment, the number of the insulating layers L4 and L5 forming the insulating substrate 2a, the shape and the number of the magnetic bodies 4 can be appropriately changed. Further, the via conductors 10a to 10h forming the columnar conductors (inner columnar conductors 6c1 and 6d1, outer columnar conductors 6c2 and 6c2) may be formed of a pin metal wire.

  In this embodiment, the insulating substrate 2a may be formed only of the insulating layer L4 without including the insulating layer L5. In this case, for example, each upper wiring electrode 7c1 and 71d are formed of a metal foil (ribbon) such as Cu and wire-bonding mounted so that each upper wiring electrode 7c1 connects each via conductor 10e and each via conductor 10a. Moreover, each upper wiring electrode 7d1 can connect each via conductor 10c and each via conductor 10g. By doing in this way, since it is not necessary to provide each insulating layer L5, the electronic component 1a can be reduced more in size.

(Method for manufacturing electronic component 1a)
Next, an example of a method for manufacturing the electronic component 1a will be described with reference to FIG. FIG. 6 is an exploded front view of the electronic component 1a.

  First, an insulating layer L4 in which a concave portion 11 is formed on one main surface, a plurality of via conductors 10a, 10c, 10e, 10g are formed therein, and a plurality of lower layer side wiring electrodes 7c2, 7d2 are formed on the other main surface L4a; An insulating layer L5 having a plurality of via conductors 10b, 10d, 10f, 10h and a plurality of upper layer side wiring electrodes 7c1, 7d1 formed on one main surface L5a is prepared.

  At this time, the concave portion 11 of the insulating layer L4, the via conductors 10a, 10c, 10e, and 10g, and the lower layer side wiring electrodes 7c2 and 7d2 are formed by the same method as in the first embodiment. The recess 11 is formed in such a size that a gap is formed when the magnetic body 4 is stored.

  The insulating layer L5 is, for example, a semi-cured resin sheet formed of an epoxy resin, and each of the via conductors 10b, 10d, 10f, 10h and the upper-layer side wiring electrodes 7c1, 7d1 in the first embodiment are also implemented. It is formed by the same method as the form.

  Next, the magnetic body 4 is disposed in the concave portion 11 of the insulating layer L4, and the insulating layer L5 is laminated on the insulating layer L4 so as to cover the concave portion 11. Then, after pressing the laminated insulating layers L4 and L5, the semi-cured insulating layer L5 is completely cured at a temperature of, for example, 180 ° C. to manufacture the electronic component 1a. At this time, the via conductors 10a, 10c, 10e, 10g of the corresponding insulating layer L4 and the via conductors 10b, 10d, 10f, 10h of the insulating layer L5 are joined to each other, and the inner columnar conductors 6c1, 6d1 and the outer columnar conductors 6c2 are joined. , 6d2 are formed.

  According to this embodiment, by forming the recess 11 in the insulating layer L4 and laminating the insulating layer L5 so as to cover the recess 11, the storage space 3a for storing the magnetic body 4 can be easily formed. Therefore, the electronic component 1a having excellent inductance characteristics can be easily manufactured. Moreover, since the storage space 3a can be formed by forming the recessed part 11 only in one insulating layer L4, the manufacturing cost of the electronic component 1a can be reduced.

(Third embodiment)
An electronic component 1b according to a third embodiment of the present invention will be described with reference to FIG. FIG. 7 is an exploded front view of the electronic component 1b.

  The electronic component 1b of this embodiment is different from the electronic component 1a of the second embodiment described with reference to FIG. 5 and FIG. 6 in that the columnar conductors 6e1 to 6e4 and 6f1 to 6f4 are as shown in FIG. The coil patterns 5e and 5f are formed on two layers (insulating layers L10 and L12) among the plurality of insulating layers L10 to L12 located above the magnetic body 4 in the length direction (corresponding to one side in the present invention). A plurality of upper layer side wiring electrodes 7e1 to 7e3 and 7f1 to 7f3 to be formed are formed, and two of the plurality of insulating layers L6 to L8 (insulating) located on the lower side (corresponding to the other side in the present invention) The layers L6 and L8) are formed with a plurality of lower layer side wiring electrodes 7e4 to 7e6 and 7f4 to 7f6 that form the coil patterns 5e and 5f, and each columnar conductor (inner columnar conductor: 6e1). 6e2 and 6F1,6f2 (not shown), an outer cylindrical conductor: 6E3,6e4 and 6F3,6f4 (not shown)) of is that there is different lengths. Since other configurations are the same as those of the electronic component 1a of the second embodiment, the description thereof is omitted by giving the same reference numerals. Since the configurations of the coil patterns 5e and 5f are the same, the following description will be given by taking the coil pattern 5e as an example.

  In this case, each upper layer side wiring electrode 7e1 to 7e3 includes a plurality of upper layer side wiring electrodes 7e1 formed on one main surface of the insulating layer L10 and a plurality of upper layer side wirings formed on both main surfaces of the insulating layer L12. The electrodes 7e2 and 7e3 are formed separately. Each of the lower layer side wiring electrodes 7e4 to 7e6 also includes a plurality of lower layer side wiring electrodes 7e4 formed on one main surface of the insulating layer L8 and a plurality of lower layer side wiring electrodes formed on both main surfaces of the insulating layer L6. 7e5 and 7e6.

  Further, some of the columnar conductors (inner columnar conductors: 6e1, 6e2, outer columnar conductors: 6e3, 6e4) have different lengths. For example, in the case of the inner columnar conductors 6e1, 6e2, each insulation A plurality of first inner columnar conductors 6e1 formed by the respective via conductors 13a to 13c of the layers L8 to L10 and a plurality of second inner columnar shapes formed by the respective via conductors 13a to 13e of the respective insulating layers L7 to L11. There is a conductor 6e2.

  On the other hand, in the case of the outer columnar conductors 6e3 and 6e4, for example, a plurality of first outer columnar conductors 6e3 formed by the respective via conductors 13h to 13k of the insulating layers L7 to L10, and the insulating layers L6 to L11, respectively. And a plurality of second outer columnar conductors 6e4 formed of the respective via conductors 13h to 13m.

  For example, the upper ends of a pair of columnar conductors (first inner columnar conductor 6e1 and first outer columnar conductor 6e3) adjacent to each other with the magnetic body 4 interposed therebetween are connected to the upper layer side wiring electrode 7e1, and the first The lower end of the inner columnar conductor 6e1 is connected to the lower layer side wiring electrode 7e4, and the lower end of the first outer columnar conductor 6e3 is connected to the lower layer side wiring electrode 7e5. The upper ends of the other sets of columnar conductors (second inner columnar conductor 6e2 and second outer columnar conductor 6e4) are connected to the upper wiring electrode 7e2, and the lower end of the second inner columnar conductor 6e2 is on the lower layer side. Connected to the wiring electrode 7e5, the lower end of the second outer columnar conductor 6e4 is connected to the lower layer side wiring electrode 7e6.

  Thus, a part of the coil pattern 5e in which the lower layer side wiring electrode 7e4, the first inner columnar conductor 6e1, the upper layer side wiring electrode 7e1, and the first outer columnar conductor 6e3 are connected in series is formed of the magnetic body 4 The coil is wound around one coil diameter. Further, a part of the coil pattern 5e in which the lower layer side wiring electrode 7e5, the second inner columnar conductor 6e2, the upper layer side wiring electrode 7e2, and the second outer columnar conductor 6e4 are connected in series is formed around the magnetic body 4. It is wound around a coil diameter different from the one coil diameter described above. And a part of both above-mentioned coil pattern 5e is connected in series, and the coil pattern 5e is formed in the helical form. FIG. 7 schematically shows a cross section of the electronic component 1a. For example, the first inner columnar conductor 6e1, the second inner columnar conductor 6e2, and the electronic component 1a are arranged at different positions in the plane direction. It is described so that it can be seen on the same cross section. The same applies to the first outer columnar conductor 6e3 and the second outer columnar conductor 6e4.

  Note that the lengths and arrangement relationships of the columnar conductors 6e1 to 6e4 described above are examples, and each of the columnar conductors 6e1 to 6e4 is appropriately selected according to the positional relationship between the upper layer side wiring electrodes 7e1 to 7e3 and the lower layer side wiring electrodes 7e4 to 7e6 to be connected. The length of the columnar conductors 6e1 to 6e4 and the arrangement of the insulating layers L6 to L12 in the stacking direction may be changed.

  As described above, in this embodiment, each of the columnar conductors (inner columnar conductors 6e1 and 6e2, outer columnar conductors 6e3 and 6e4) having different lengths is included, and each upper wiring electrode 7e1 is included. ˜7e3 and each lower layer side wiring electrode 7e4˜7e6 are configured such that each wiring electrode can be arranged across a plurality of insulating layers L6, L8, L10, L12.

  The electronic component 1b can be manufactured by a method similar to the manufacturing method described in the first and second embodiments. At this time, each of the insulating layers L7, L8, L10, and L11 is a semi-cured resin sheet formed of an epoxy resin or the like.

  Therefore, by configuring in this way, in each of the upper layer side wiring electrodes 7e1 to 7e3 and the lower layer side wiring electrodes 7e4 to 7e6, a part of the wiring electrodes can be formed in different insulating layers, and thus formed on the insulating substrate 2b. The number of wiring electrodes can be increased. Therefore, the number of coil patterns wound around the magnetic body 4 can be increased, and the inductance value generated by the electronic component 1b can be increased.

  Further, since the number of wiring electrodes formed on the insulating substrate 2b can be easily changed, the overall length of the coil patterns 5e and 5f can be adjusted, and an electronic component 1b having a desired inductance value can be easily obtained. Can get to.

  The present invention is not limited to the above-described embodiments, and various modifications other than those described above can be made without departing from the spirit of the invention.

  For example, in each of the above-described embodiments, when each of the columnar conductors 6a1, 6a2, 6b1, 6b2, 6c1, 6c2, 6d1, 6d2, 6e1 to 6e4, 6f1 to 6f4 is formed of a pin metal wire, each via conductor 8a Since it is not necessary to secure a gap between adjacent via holes, which is necessary when forming each via hole for ˜8f, 10a to 10h, and 13a to 13n, each columnar conductor 6a1, 6a2, 6b1, 6b2, 6c1 , 6c2, 6d1, 6d2, 6e1 to 6e4, 6f1 to 6f4 can be densely arranged in the insulating substrates 2, 2a and 2b. Therefore, the number of turns of the coil patterns 5a to 5f around which the magnetic body 4 is wound can be increased, and the electronic components 1, 1a, 1b having excellent inductance characteristics can be provided.

  In this case, the columnar conductors 6a1, 6a2, 6b1, 6b2, 6c1, 6c2, 6d1, 6d2, 6e1 to 6e4, 6f1 to 6f4, upper wiring electrodes 7a1, 7b1, 7c1, 7d1, 7e1 to 7e3, 7f1 It is preferable that the outer surface excluding the connection surface to 7f3 and the lower surface side wiring electrodes 7a2, 7b2, 7c2, 7d2, 7e4 to 7e6, 7f4 to 7f6 be covered with an insulating material. With this configuration, it is possible to place the columnar conductors 6a1, 6a2, 6b1, 6b2, 6c1, 6c2, 6d1, 6d2, 6e1 to 6e4, 6f1 to 6f4 in contact with each other on the insulating substrates 2, 2a, 2b. Since the number of the columnar conductors 6a1, 6a2, 6b1, 6b2, 6c1, 6c2, 6d1, 6d2, 6e1 to 6e4, 6f1 to 6f4 to be formed can be increased, the number of turns of the coil patterns 5a to 5f can be further increased. .

  The coil pattern may be one instead of plural. Further, various circuits (for example, filter circuits) are formed on the electronic components 1, 1a, 1b by forming elements having different functions such as capacitor elements on the insulating substrates 2, 2a, 2b. It may be a configuration.

  Furthermore, the present invention can be applied to any electronic component as long as the magnetic body 4 is housed in the insulating substrates 2, 2a, 2b.

1, 1a, 1b Electronic component 2, 2a, 2b Insulating substrate 3 Storage space 4 Magnetic material 5a-5f Coil pattern 6a1, 6a2, 6b1, 6b2, 6c1, 6c2, 6d1, 6d2, 6e1-6e4, 6f1-6f4 Columnar conductor 7a1, 7b1, 7c1, 7d1, 7e1-7e3, 7f1-7f3 Upper layer side wiring electrode (one side wiring electrode)
7a2, 7b2, 7c2, 7d2, 7e4-7e6, 7f4-7f6 Lower layer side wiring electrode (other side wiring electrode)
L1-L12 insulation layer

Claims (12)

An insulating substrate having a storage space formed therein;
A magnetic body stored in the storage space;
A coil pattern formed on the insulating substrate so as to wind the magnetic body,
An electronic component, wherein a gap is provided at least between an outer surface of the magnetic body and a wall surface of the insulating substrate that appears in the storage space.   The electronic component according to claim 1, wherein the storage space is formed by providing a concave portion on one main surface of the insulating substrate.   The insulating substrate is configured by laminating a plurality of insulating layers, and the storage space is formed by a recess provided to face each of the adjacent insulating layers. The electronic component according to 1.   The electronic component according to claim 1, wherein the insulating substrate is a resin substrate.   The electronic component according to claim 1, wherein the magnetic body is made of ferrite. The insulating substrate has a plurality of the storage spaces,
The electronic component according to claim 1, wherein the magnetic body is disposed in each of the storage spaces. The coil pattern is
A plurality of columnar conductors erected around the magnetic body;
A plurality of one-side wiring electrodes that are formed on one side of the magnetic body in the length direction of the columnar conductor and connect corresponding one ends of the columnar conductors;
A plurality of other side wiring electrodes that are formed on the other side of the magnetic body in the length direction of the columnar conductor and connect the corresponding other ends of the columnar conductors;
The said magnetic body is helically wound by each said one side wiring electrode and each said other side wiring electrode which connect each said columnar conductor and each said columnar conductor in series. 6. The electronic component according to any one of 6. The insulating substrate is configured by laminating a plurality of insulating layers,
The coil pattern is
A plurality of columnar conductors erected around the magnetic body;
A plurality of one-side wiring electrodes formed on at least two of the plurality of insulating layers located on one side of the magnetic body in the length direction of the columnar conductor;
A plurality of other wiring electrodes formed on at least two of the plurality of insulating layers located on the other side of the magnetic body in the length direction of the columnar conductor;
Each of the columnar conductors includes those having different lengths,
A pair of the columnar conductors adjacent to each other with the magnetic body interposed therebetween are connected in series by one of the one side wiring electrode and one or the other side wiring electrode, and have a predetermined coil diameter around the magnetic body. And the other set of the columnar conductors are connected in series by the other one side wiring electrode and one or the other side wiring electrode, and the predetermined coil is disposed around the magnetic body. The electronic component according to any one of claims 1 to 6, wherein the electronic component is wound in a coil diameter different from the diameter and formed in a spiral pattern.   9. The outer surface of each of the columnar conductors excluding the connection end surface with the one-side wiring electrode and the connection end surface with the other-side wiring electrode is covered with an insulating material. Electronic components.   The electronic component according to claim 1, wherein the magnetic body has an annular shape. A step of preparing first and second insulating layers each having a recess formed on one main surface and a plurality of conductor patterns forming a coil pattern;
The first and second insulating layers are laminated so that the magnetic body is positioned in the two concave portions opposed to each other, and the conductor pattern of the first insulating layer and the conductor pattern of the second insulating layer are arranged. A method for manufacturing an electronic component comprising the steps of: On the other hand, a concave portion is formed on the main surface, and a third insulating layer formed with a plurality of conductor patterns forming a coil pattern, and a plurality of conductor patterns forming the coil pattern are formed and stacked on the third insulating layer Preparing a fourth insulating layer to be formed;
Disposing the magnetic body in the recess;
A step of laminating the fourth insulating layer on the third insulating layer so as to cover the concave portion, and joining the conductor pattern of the third insulating layer and the conductor pattern of the fourth insulating layer. A method for manufacturing electronic components.

Images