JP2015173189A - Coil device and manufacturing method of coil device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a coil device in which coil characteristics of a coil can be easily adjusted.SOLUTION: Wiring of a coil electrode 4 in a direction substantially perpendicular to a central axis direction of a coil 5 is formed by a plurality of columnar conductors 6 and 7. One end of the first columnar conductor 6 and one end of the second columnar conductor 7 which are paired with each other are connected to each other via a bonding wire 8. The other end of the first columnar conductor 6 and the other end of another second columnar conductor 7 adjacent to one side of the second columnar conductor 7 which is paired with the first columnar conductor 6 are connected to each other via a wiring electrode pattern 10. Consequently, it is possible to provide a coil device 1 in which coil characteristics of the coil 5 such as impedance and inductance can be easily adjusted just by adjusting the length and the angular shape of the bonding wire 8.

Description

  The present invention relates to a coil device including a coil formed by spirally winding a coil electrode around a coil core and a manufacturing method thereof.

  Conventionally, as shown in FIG. 20, a coil device 500 including a coil 501 provided on a core substrate 502 formed of a printed board or a prepreg is known (for example, see Patent Document 1). The coil 501 is formed by spirally winding a coil pattern 504 (coil electrode) around an endless magnetic layer 503 formed in a ring shape on the core substrate 502. In addition, FIG. 20 is a figure which shows the conventional coil apparatus.

  The coil pattern 504 is formed on the core substrate 502 and a plurality of line-shaped wiring electrode patterns 505 and 506 formed on the front and back surfaces of the core substrate 502 so as to straddle the magnetic layer 503 in plan view. A plurality of columnar interlayer connection conductors 507 are provided. The corresponding end portions of the wiring electrode patterns 505 and 506 on the front and back surfaces are connected to each other by the interlayer connection conductor 507, whereby the coil pattern 504 is formed so that the magnetic layer 503 is spirally wound. The In this way, a toroidal coil core is formed by the endless magnetic layer 503, and the lines of magnetic force generated by the coil device 500 (coil 501) mainly pass through the endless magnetic layer 503, thereby leaking magnetic flux. Therefore, a large inductance value can be obtained.

JP 2000-40620 (see paragraph 0018, FIG. 1, etc.)

  In the coil device 500 described above, a plurality of interlayer connection conductors 507 arranged so as to be orthogonal to the circumferential direction of the magnetic layer 503 (coil 501) are arranged along the outer periphery and the outer periphery of the magnetic layer 503, respectively. Further, one end of the outer peripheral side interlayer connection conductor 507 and the inner peripheral side interlayer connection conductor 507 which are paired with each other is connected to each other by the wiring electrode pattern 505 on the upper surface side of the core substrate 502.

  Then, the interlayer connection conductor 507 on the outer periphery side and the inner layer side interlayer connection adjacent to one side (clockwise direction in FIG. 20) of the interlayer connection conductor 507 on the inner periphery side that forms a pair with the interlayer connection conductor 507. The other ends of the conductors 507 are connected to each other by the wiring electrode pattern 506 on the lower surface side of the core substrate 502, so that the coil pattern 504 is formed so as to be spirally wound around the magnetic layer 503. Therefore, when adjusting coil characteristics such as the inductance and impedance of the coil 501, the length of each interlayer connection conductor 507 is adjusted by changing the thickness of the core substrate 502, or the lines of the wiring electrode patterns 505 and 506 are adjusted. It is necessary to change the shape. Therefore, the coil characteristics of the coil 501 included in the coil device 500 cannot be easily adjusted.

  Further, the above-described conventional interlayer connection conductor 507 is formed as follows, for example. That is, the interlayer connection conductor 507 is formed of, for example, a through-hole conductor formed by plating the inner surface of the through hole as shown in FIG. In addition, the interlayer connection conductor 507 is formed of a via conductor formed by filling a through hole with a conductive paste or performing via fill plating, for example. Therefore, various problems as shown below may occur.

  First, in order to form through-hole conductors and via conductors, it is necessary to apply plating or fill conductive paste into the small-diameter through holes formed in the core substrate 502. However, when the thickness of the core substrate 502 is large, it is difficult to plate the entire inside of the small-diameter through hole or fill the conductive paste from the front surface side to the back surface side of the core substrate 502. It is difficult to form the back interlayer connection conductor 507. Therefore, there arises a problem that it is difficult to increase the thickness of the magnetic layer 503 constituting the coil core.

  Further, in order to improve the connectivity between the interlayer connection conductor 507 and the wiring electrode patterns 505 and 506 formed on the front and back surfaces of the core substrate 502, both ends of the interlayer connection conductor 507 are slightly connected from the front and back surfaces of the core substrate 502. May protrude. However, in the interlayer connection conductor 507 formed by conventional plating or conductive paste, when the through holes are plated or filled with the conductive paste, the through holes on the front and back surfaces of the core substrate 502 are respectively formed. In the portion protruding from both openings, the conductive material spreads (bleeds) in the surface direction of the core substrate 502. Therefore, there arises a problem that both end portions of the interlayer connection conductor 507 are larger in diameter than the inner diameter of the through hole.

  In addition, the conventional interlayer connection conductor 507 is formed by first penetrating through holes in the core substrate 502 by laser processing or the like, and plating or filling with conductive paste in the through holes. Therefore, in order to form the plurality of interlayer connection conductors 507, it is necessary to form a plurality of through holes in the core substrate 502 with a predetermined gap. Therefore, it is difficult to reduce the pitch between the interlayer connection conductors 507.

  Further, in the conventional coil device 500, in order to form the coil pattern 504 of the coil 501, it is necessary to prepare a core substrate 502 and a resin layer in which a plurality of through holes for forming the interlayer connection conductor 507 are formed. Therefore, since the core substrate 502 and the resin layer are necessary to form the coil device 500, the coil device 500 is increased in size.

  The present invention has been made in view of the above-described problems, and provides a coil device capable of easily adjusting the coil characteristics of a coil, and a manufacturing method capable of manufacturing the coil device inexpensively and easily. It is a first object to provide

  It is a second object of the present invention to provide a coil device having a coil core having a large thickness, excellent inductance characteristics, a coil with little leakage magnetic flux, and a coil electrode having a narrow pitch.

  A third object is to provide a coil device that can be miniaturized.

  In order to achieve the first object described above, a coil device according to the present invention includes a coil having a coil core and a coil electrode spirally wound around the core, and the coil electrode includes the coil A plurality of first columnar conductors arranged so as to intersect the direction of the central axis of the core and arranged on one side of the core, and other cores disposed so as to intersect the direction of the central axis of the coil A plurality of first columnar conductors and a plurality of second columnar conductors arranged so as to sandwich the core, and one ends of the first columnar conductor and the second columnar conductor paired with each other. A plurality of first connecting members connected to each other, and the first columnar conductor and the second columnar conductor adjacent to one side of the second columnar conductor paired with the first columnar conductor. Multiple second connections that connect the other ends to each other And a member, one of the first connecting member and the second connecting member is characterized by being formed by a bonding wire.

  In the invention configured as described above, the plurality of first columnar conductors are arranged so as to intersect the direction of the central axis (magnetic flux) of the coil and arranged on one side of the core. The plurality of second columnar conductors are arranged so as to intersect the direction of the central axis of the coil, and are arranged so as to sandwich the plurality of first columnar conductors and the coil core on the other side of the coil core. Further, one ends of the first columnar conductor and the second columnar conductor that are paired with each other are connected to each other by the first connection member. The other ends of the first columnar conductor and the second columnar conductor adjacent to one side of the second columnar conductor paired with the first columnar conductor are connected to each other by the second connecting member. Thus, the coil electrode is formed so as to be spirally wound around the coil core.

  One of the first connection member and the second connection member is formed of a bonding wire. Therefore, the length of the entire coil electrode can be adjusted only by adjusting the length of the bonding wire, the shape of the angle, etc. In addition, the inductance and impedance of the coil can be easily adjusted by adjusting the length of the entire coil electrode. Therefore, it is possible to provide a coil device that can easily adjust the coil characteristics. Further, even when the distance between the first columnar conductor and the second columnar conductor is changed, it is possible to easily connect the wires.

  The coil device manufacturing method of the present invention is a coil device manufacturing method comprising a coil having a coil core and a coil electrode spirally wound around the core. A plurality of first columnar conductors forming a coil electrode are formed by a non-magnetic member and a first support member arranged in parallel, and a plurality of second columnar conductors forming the coil electrode are arranged in parallel The second support member provided, and the first columnar conductors and the second columnar conductors are opposed to each other with the core interposed therebetween. The first support member is disposed on one side of the core so that each columnar conductor intersects the direction of the central axis of the coil, and each of the second columnar conductors intersects the direction of the central axis of the coil. So that the second An arrangement step of disposing a holding member on the other side of the core, and ends of the first columnar conductor and the second columnar conductor that are paired with each other are connected by a first connecting member, respectively, A connecting step of connecting the other ends of the columnar conductor and the second columnar conductor adjacent to one side of the second columnar conductor paired with the first columnar conductor by the second connecting member; And at least one of the first connecting member and the second connecting member is formed of a bonding wire.

  In the invention configured as described above, a first support member is provided which is formed of a nonmagnetic member and provided with a plurality of first columnar conductors forming a coil electrode arranged in parallel. In addition, a second support member is prepared, which is formed of a nonmagnetic member and provided with a plurality of second columnar conductors forming coil electrodes arranged in parallel. Next, the first support is made so that each first columnar conductor intersects the direction of the central axis of the coil so that each first columnar conductor and each second columnar conductor face each other across the coil core. A member is disposed on one side of the coil core. Further, the second support member is disposed on the other side of the coil core such that each of the second columnar conductors intersects the direction of the central axis of the coil.

  Subsequently, one ends of the first columnar conductor and the second columnar conductor that are paired with each other are connected to each other by the first connection member. Also, the other ends of the first columnar conductor and the second columnar conductor adjacent to one side of the second columnar conductor paired with the first columnar conductor are connected by the second connecting member, respectively. Is done. At least one of the first connection member and the second connection member is formed by a bonding wire.

  Therefore, only by arranging the first and second support members at predetermined positions, the first columnar conductors and the second columnar conductors (hereinafter sometimes simply referred to as “columnar conductors”), the coil cores, Can be positioned. Therefore, as in the prior art, through holes for forming through-hole conductors and via conductors are formed in core substrates such as printed boards and prepregs, and holes for arranging coil cores are formed. It is not necessary to perform special processing for forming the arrangement place. Therefore, the manufacturing process of the coil device can be greatly simplified, and the coil device can be easily manufactured.

  In addition, each columnar conductor and coil core that forms a coil electrode can be obtained by simply changing the shape of the first and second support members or adjusting the arrangement of the columnar conductors on the first and second support members. It is possible to easily adjust the arrangement relationship such as the interval. It is also possible to easily adjust the number of turns. Furthermore, when adjusting the positional relationship between each columnar conductor and the coil core, it is not necessary to change the design of the core substrate or a mold for resin sealing. Therefore, an increase in the manufacturing cost of the coil device due to the design change can be suppressed.

  Further, at least one of the first and second connection members is formed by a bonding wire. Therefore, it is possible to easily adjust the inductance and impedance of the coil included in the coil device only by adjusting the length of the bonding wire and the shape of the chevron. In addition, the coil device can be manufactured at a very low cost because the core substrate is unnecessary. Further, the coil device can be reduced in height because the core substrate is unnecessary. Further, since it is formed by a bonding wire, it is possible to easily connect even when the distance between the first columnar conductor and the second columnar conductor is changed.

  In order to achieve the second object, the coil device according to the present invention is such that the coil has the toroidal core, and each of the first columnar conductor and the second columnar conductor is formed by a metal pin. The first columnar conductors are arranged on the outer side which is one side of the core, and the second columnar conductors are arranged on the inner side which is the other side of the core.

  In the invention thus configured, each columnar conductor forming the wiring of the coil electrode in a direction intersecting with the direction of the central axis of the coil (hereinafter sometimes referred to as “columnar conductor direction”) is formed by a metal pin. ing. Therefore, the wiring length of the coil electrode in the columnar conductor direction can be easily increased only by increasing the length of each metal pin. Therefore, the thickness of the coil core in the columnar conductor direction can be easily increased.

  In addition, since each columnar conductor is formed of a metal pin, a plurality of through-holes such as a printed circuit board and a prepreg are provided by providing a predetermined gap as in the prior art in order to form the wiring of the coil electrode in the columnar conductor direction. Even if it does not form in a core board | substrate, the wiring of the coil electrode in a columnar conductor direction can be formed only by arranging each metal pin. Further, unlike conventional through-hole conductors and via conductors, there is no possibility that the thickness of the wiring of the coil electrode in the direction of the columnar conductor formed by each metal pin will change. Therefore, it is possible to provide a coil device that includes a coil having a thick coil core and excellent inductance characteristics, and can achieve a narrow pitch between coil electrodes.

  The coil has a toroidal coil core, and each first columnar conductor is arranged on the outer side which is one side of the coil core, and each second columnar conductor is arranged on the inner side which is the other side of the coil core. Therefore, since the magnetic field lines generated in the coil have a closed magnetic circuit structure that mainly passes through the annular toroidal coil core, a coil device with little leakage magnetic flux can be provided.

  In order to achieve the third object described above, the coil device of the present invention is a first support in which a non-magnetic material is formed in a ring shape or a substantially C shape, and the core is disposed substantially concentrically on the inside thereof. And a second support member formed in a columnar shape by a nonmagnetic material and disposed substantially concentrically on the inner side of the core, and the first columnar conductors on the outer peripheral surface of the first support member. And the second columnar conductors are arranged on the outer peripheral surface of the second support member.

  In the invention configured as described above, the first columnar conductors are arranged on the outer peripheral surface of the first support member formed in a ring shape or a substantially C shape by the nonmagnetic material, and the first support member is disposed inside the first support member. Toroidal coil cores are arranged substantially concentrically. Each second columnar conductor is disposed on the outer peripheral surface of the second support member formed in a columnar shape from a nonmagnetic material, and the second columnar conductor is disposed substantially concentrically on the inner side of the coil core.

  Therefore, when placing each columnar conductor and the coil core at a predetermined position, as in the past, through-holes for forming a through-hole conductor or a via conductor in a core substrate such as a printed circuit board or a prepreg, There is no need to perform special processing for forming the coil core placement location by forming a hole for placing the coil core. Therefore, the coil device can be manufactured at a very low cost because the core substrate is unnecessary, and the coil device can be reduced in size.

  In addition, each columnar conductor and coil core that forms a coil electrode can be obtained by simply changing the shape of the first and second support members or adjusting the arrangement of the columnar conductors on the first and second support members. It is possible to easily adjust the arrangement relationship such as the distance between the two. Further, when adjusting the positional relationship between each columnar conductor and the coil core, it is not necessary to change the design of the core substrate, the mold for resin sealing, or the like. Therefore, an increase in the manufacturing cost of the coil device due to the design change can be suppressed.

  The first support member is formed of an adhesive tape-like resin sheet adhered to the outer peripheral surface of the core, and the first columnar conductors are adhesively arranged on the outer peripheral surface. Good.

  If it does in this way, the 1st support member which has a ring shape or a substantially C shape can be easily formed with the tape-like resin sheet which has the adhesiveness stuck on the outer peripheral surface of a coil core. Further, since the first support member is formed of an adhesive tape-like resin sheet, the plurality of first columnar conductors formed of metal pins on the outer peripheral surface of the first support member can be easily adhered. Can be arranged. Moreover, since the resin sheet is arrange | positioned between each 1st columnar conductor and a coil core, each 1st columnar conductor and a coil core can be arrange | positioned closely in the insulated state. Moreover, since the stress from each first columnar conductor on the coil core can be relaxed by the resin sheet, the coil characteristics can be improved.

  A plurality of grooves for disposing the first columnar conductors may be formed on the outer peripheral surface of the first support member so as to intersect the direction of the central axis of the coil.

  When comprised in this way, the 1st columnar conductor formed with the metal pin is arrange | positioned at each of the some groove | channel formed in the outer peripheral surface of the 1st support member, and the outer peripheral surface of the 1st support member The first columnar conductors can be arranged with high positional accuracy.

  Each of the second columnar conductors may be adhesively disposed on the outer peripheral surface of the second support member via an adhesive resin film formed on the outer peripheral surface of the second support member. .

  In this case, since the adhesive resin film is formed on the outer peripheral surface of the second support member, the plurality of second columnar conductors formed of the metal pins on the outer peripheral surface of the second support member. Adhesive placement can be done easily.

  The resin film may be formed by sticking an adhesive tape-like resin sheet to the outer peripheral surface of the second support member.

  If it does in this way, the resin film which has adhesiveness can be easily formed in the outer peripheral surface of a 2nd supporting member by affixing the tape-shaped resin sheet which has adhesiveness.

  In addition, the first support member and the second support member are formed of a thermosetting resin, and the first columnar conductors are directly adhered to the outer peripheral surface of the first support member, and the second The second columnar conductor may be directly adhered to the outer peripheral surface of the supporting member.

  In this case, the first columnar conductor and the second columnar conductor can be easily adhered to the outer peripheral surfaces of the first support member and the second support member, respectively, formed of an adhesive thermosetting resin. Can be arranged.

  A plurality of grooves for arranging the second columnar conductors may be formed on the outer peripheral surface of the second support member so as to intersect the direction of the central axis of the coil.

  When comprised in this way, the 2nd columnar conductor formed with the metal pin is arrange | positioned at each of the some groove | channel formed in the outer peripheral surface of the 2nd supporting member, and the outer peripheral surface of the 2nd supporting member Each of the second columnar conductors can be arranged with high positional accuracy.

  Further, it is desirable that the first columnar conductor is formed to have a larger diameter than the second columnar conductor.

  In this case, when it is desired to increase the number of turns of the coil in order to increase the inductance, the space for arranging the second columnar conductors inside the annular coil core is limited. By reducing the diameter and reducing the cross-sectional area, the number of turns of the coil can be increased. Further, although the resistance value of each second columnar conductor increases by reducing the diameter and the coil characteristics may be deteriorated, the first columnar conductors arranged outside the coil core having a sufficient arrangement space are arranged. By increasing the diameter of each second columnar conductor, it is possible to suppress an increase in the resistance value of the entire coil electrode. In addition, the wire bonding process can be efficiently performed by setting each first columnar conductor outside the coil core whose diameter has been increased to the secondary side.

  The other of the first connection member and the second connection member may be formed by the bonding wire.

  In this way, since each connecting member is formed of a bonding wire, wiring at the portion connecting the columnar conductors of the coil electrode can be easily performed by adjusting the length of each bonding wire and the shape of the chevron. It can be formed in three dimensions. Therefore, when compared with the wiring electrode pattern formed two-dimensionally on the main surface of the insulating substrate or the resin insulating layer, the bonding wires are in contact with each other because the bonding wires are three-dimensionally wired. The wiring density of each bonding wire can be improved while preventing this. Accordingly, it is possible to further reduce the pitch between the coil electrodes, and to improve the coil characteristics by increasing the number of turns of the coil.

  Further, the first connection member and / or the second connection member may be formed by a plurality of the bonding wires.

  In this case, the first connecting member and / or the second connecting member are formed by a plurality of bonding wires, so that the ends of the first columnar conductor and the second columnar conductor that are paired with each other, and / Or the other ends of the first columnar conductor and the second columnar conductor adjacent to one side of the second columnar conductor paired with the first columnar conductor are connected by a plurality of bonding wires. . Therefore, it is possible to reduce the resistance of the wiring in the portion where the columnar conductors of the coil electrode are connected to each other.

  One of the first connection member and the second connection member may be formed of a bonding wire, and the other may be formed of a line-shaped wiring electrode pattern formed on an insulating substrate.

  If it does in this way, the practical coil apparatus with high versatility which can further mount other parts on an insulating substrate can be provided.

  Moreover, you may further provide the resin insulating layer by which the said core was embed | buried and the said coil electrode was provided.

  If comprised in this way, the coil apparatus of the practical structure by which the coil electrode was provided in the resin insulating layer which can be protected by embedding a coil core can be provided.

  According to the present invention, the wiring of the coil electrode in the direction intersecting the direction of the central axis (magnetic flux) of the coil is formed by the plurality of first columnar conductors and the plurality of second columnar conductors. Also, one end of the first columnar conductor and the second columnar conductor that are paired with each other are connected by the first connecting member, and the other end of the first columnar conductor and the first columnar conductor are paired with each other. The other end of the second columnar conductor adjacent to one side of the second columnar conductor is connected by the second connecting member. One of the first connection member and the second connection member is formed by a bonding wire. Therefore, it is possible to provide a coil device that can easily adjust the coil characteristics such as the impedance and inductance of the coil only by adjusting the length of the bonding wire and the shape of the angle.

It is a top view which shows the coil apparatus concerning 1st Embodiment of this invention. It is AA arrow sectional drawing of the coil apparatus of FIG. It is a figure which shows an example of the manufacturing method of the coil apparatus of FIG. 1, Comprising: (a) is a figure which shows a tape-shaped resin sheet, (b) is a perspective view which shows a coil core, (c) is 1st support to a coil core. It is a perspective view which shows the state in which the member was provided. It is a figure which shows an example of the manufacturing method of the coil apparatus of FIG. 1, Comprising: (a) is a figure which shows a tape-shaped resin sheet, (b) is a perspective view which shows a 2nd supporting member, (c) is 2nd It is a perspective view which shows the state by which the 2nd columnar conductor was provided in the supporting member through the resin film. It is a figure which shows an example of the manufacturing method of the coil apparatus of FIG. 1, Comprising: It is a top view which shows an insulated substrate. It is a figure which shows an example of the manufacturing method of the coil apparatus of FIG. 1, Comprising: It is a top view which shows an insulated substrate. It is a figure which shows an example of the manufacturing method of the coil apparatus of FIG. 1, Comprising: (a) is a perspective view, (b) is a top view, (c) is a front view. It is a front view which shows an example of the manufacturing method of the coil apparatus of FIG. It is a front view which shows an example of the manufacturing method of the coil apparatus of FIG. It is a front view which shows an example of the manufacturing method of the coil apparatus of FIG. It is sectional drawing which shows the coil apparatus concerning 2nd Embodiment of this invention. It is a figure which shows the arrangement | positioning state of a 1st supporting member, a 2nd supporting member, and a coil core, Comprising: (a) is a perspective view, (b) is a top view. It is a figure which shows an example of the manufacturing method of the 1st supporting member with which the coil apparatus of FIG. 11 is equipped, Comprising: (a) is a perspective view, (b) is a top view. It is a top view which shows an example of the manufacturing method of the 1st supporting member with which the coil apparatus of FIG. 11 is provided. It is a figure which shows an example of the manufacturing method of the 1st supporting member with which the coil apparatus of FIG. 11 is equipped, Comprising: (a) is a perspective view, (b) is a top view. It is a figure which shows an example of the manufacturing method of the 2nd supporting member with which the coil apparatus of FIG. 11 is provided, Comprising: (a) is a perspective view, (b) is a top view. It is a figure which shows an example of the manufacturing method of the 2nd supporting member with which the coil apparatus of FIG. 11 is provided, Comprising: (a) is a perspective view, (b) is a top view. It is a figure which shows an example of the manufacturing method of the coil apparatus concerning 3rd Embodiment of this invention, Comprising: (a)-(c) is a figure which shows a different process, respectively. It is sectional drawing which shows the coil apparatus concerning 4th Embodiment of this invention. It is a figure which shows an example of the conventional coil apparatus.

<First Embodiment>
A coil device according to a first embodiment of the present invention will be described.

(Schematic configuration of the coil device)
A schematic configuration of the coil device 1 will be described with reference to FIGS. 1 and 2. 1 is a plan view showing a coil device according to a first embodiment of the present invention, and FIG. 2 is a cross-sectional view taken along line AA of the coil device of FIG.

  As shown in FIGS. 1 and 2, the coil device 1 includes a coil core 3 embedded in the resin insulating layer 2, and a coil electrode 4 provided on the resin insulating layer 2 spirally wound around the coil core 3. The coil 5 having In this embodiment, the coil 5 has an annular toroidal coil core 3.

  The resin insulating layer 2 is formed of a general resin for resin sealing (molding) such as a thermosetting epoxy resin. The coil core 3 is formed of a magnetic material that is generally employed as a coil core, such as ferrite or iron.

  The coil electrode 4 is provided on the first main surface 2a side of the resin insulating layer 2 and a plurality of first columnar conductors 6 formed of metal pins, a plurality of second columnar conductors 7 formed of metal pins. A plurality of bonding wires 8 (corresponding to the “first connecting member” of the present invention) and a line-like wiring electrode pattern formed on the insulating substrate 9 disposed on the other main surface 2b side of the resin insulating layer 2 10 (corresponding to the “second connecting member” of the present invention).

  Moreover, the 1st support member 11 is formed in cyclic | annular form by sticking the tape-shaped resin sheet which has the adhesiveness which is a nonmagnetic material on the outer peripheral surface of the coil core 3. As shown in FIG. Therefore, the coil core 3 is disposed substantially concentrically inside the first support member 11. Further, each first columnar conductor 6 is disposed on the outer peripheral surface of the first support member so as to be substantially orthogonal to the direction of the central axis (magnetic flux) of the coil 5, so that one of the coil cores 3 is arranged. Arranged on the outside which is the side.

  A second support member 12 formed in a columnar shape by a nonmagnetic material such as an epoxy resin is disposed substantially concentrically inside the annular coil core 3. Moreover, the adhesive resin film 12 a is formed on the outer peripheral surface of the second support member 12 by sticking the adhesive tape-like resin sheet to the outer peripheral surface of the second support member 12. Yes. In addition, each second columnar conductor 7 is adhesively disposed on the outer peripheral surface of the second support member 12 via the resin film 12a, so that it is substantially orthogonal to the direction of the central axis (magnetic flux) of the coil 5. It arrange | positions so that each 1st columnar conductor 6 and the coil core 3 may be pinched | interposed on the inner side which is the other side of the coil core 3, and is arrange | positioned. Each of the first columnar conductors 6 and / or each of the second columnar conductors 7 may be disposed so as to intersect with the direction of the central axis (magnetic flux) of the coil 5, for example, the direction of the central axis It may be arranged to be inclined with respect to the direction orthogonal to the direction.

  In this embodiment, the bonding wire 8 is formed of an Au wire. Therefore, each of the columnar conductors 6 and 7 is arranged so that one end thereof is exposed from the one main surface 2a of the resin insulating layer 2, and in order to improve the connectivity with the bonding wire 8, the resin insulating layer 2 On the other hand, Ni / Au plating layers 6a and 7a are formed on the end surfaces of the columnar conductors 6 and 7 exposed on the main surface 2a. The columnar conductors 6 and 7 are formed of a metal material generally employed as a wiring electrode, such as Cu, Au, Ag, Al, or an alloy thereof. Further, the columnar conductors 6 and 7 may be formed of pin-shaped members in which Cu is plated with Ni. In addition, the cross-sectional shape of each columnar conductor 6 and 7 in the length direction may be rectangular or trapezoidal. Moreover, as long as the edge part connected with the 1st and 2nd connection members, such as the bonding wire 8 and the wiring electrode pattern 10, is covered with the metal, the inside may be a hollow structure.

  Also, one end of each of the first columnar conductor 6 and the second columnar conductor 7 paired with each other is connected by two bonding wires 8. And the other end of the first columnar conductor 6 and one side of the second columnar conductor 7 paired with the first columnar conductor 6 (in this embodiment, counterclockwise in FIG. 1) are adjacent to each other. The other end of each of the two columnar conductors 7 is connected by a wiring electrode pattern 10. By connecting the columnar conductors 6 and 7 in this manner, the coil electrode 4 that spirally winds around the coil core 3 is formed on the resin insulating layer 2.

  In this embodiment, each first columnar conductor 6 arranged outside the coil core 3 is formed to have a larger diameter than each second columnar conductor 7 arranged inside the coil core 3. When it is desired to increase the number of turns of the coil 5 in order to increase the inductance, the space for disposing the columnar conductors 7 on the inner side of the annular coil core 3 is limited. The number of turns of the coil 5 can be increased by reducing. Further, although the resistance value of each columnar conductor 7 may increase and the coil characteristics may be deteriorated by reducing the diameter, each columnar conductor 6 arranged outside the coil core 3 having a sufficient arrangement space is replaced with each columnar conductor. By making the diameter larger than 7, it is possible to suppress an increase in the resistance value of the entire coil electrode 4.

  In addition, the wire bonding process can be efficiently performed by setting the first columnar conductors 6 outside the coil core 3 having the increased diameter to the secondary side in the wire bonding process. In addition, a first connecting member that connects one ends of the first columnar conductor 6 and the second columnar conductor 7 that are paired with each other is formed by two (plural) bonding wires 8. Therefore, it is possible to reduce the resistance of the wiring at the portion where the ends of the columnar conductors 6 and 7 of the coil electrode 4 are connected to each other.

  Further, as shown in FIG. 1, in this embodiment, the wiring electrode pattern 10 is formed so as to match the impedance between the first columnar conductor 6 and the second columnar conductor 7 having different diameters. . That is, the impedance between the columnar conductors 6 and 7 is matched by forming the wiring electrode pattern 10 in a tapered shape. Moreover, as shown in the figure, the other end of the columnar conductors 6, 7 not connected to the wiring electrode pattern 10 among the columnar conductors 6, 7 is the lead-out wiring electrode pattern formed on the insulating substrate 9. When 13 is connected, it is used as a terminal for signal extraction.

  Further, as shown in FIG. 2, in this embodiment, the portion where the coil core 3 is disposed in order to prevent the bottom surface of the coil core 3 from contacting the wiring electrode pattern 10 formed on the insulating substrate 9. A solder resist layer 14 is formed.

(Manufacturing method of coil device)
An example of the manufacturing method of the coil apparatus 1 is demonstrated with reference to FIGS.

  3-10 is a figure which shows an example of the manufacturing method of the coil apparatus of FIG. 1, Comprising: It is a figure which shows each different process. 3A is a view showing a tape-shaped resin sheet, FIG. 3B is a perspective view showing the coil core 3, and FIG. 3C is a perspective view showing a state in which the first support member 11 is provided on the coil core 3. 4A is a view showing a tape-shaped resin sheet, FIG. 4B is a perspective view showing the second support member 12, and FIG. 4C is a view showing the second support member 12 with a resin film 12a interposed therebetween. It is a perspective view which shows the state in which the 2nd columnar conductor 7 was provided. 5 and 6 are plan views showing the insulating substrate 9, FIG. 7A is a perspective view, FIG. 7B is a plan view, FIG. 7C is a front view, and FIGS. It is a front view which shows an example of the manufacturing method of 1 coil apparatus.

  First, as shown in FIG. 3A, a member is prepared in which a plurality of metal pins constituting the first columnar conductor 6 are adhered to a tape-like resin sheet having adhesiveness, which is a nonmagnetic material. As shown in FIG. 3B, an annular toroidal coil core 3 is prepared. Then, a member made of a tape-like resin sheet on which a plurality of metal pins (columnar conductors 6) are adhered is attached to the outer peripheral surface of the coil core 3, thereby forming a coil electrode 4. An annular first support member 11 provided with a plurality of first columnar conductors 6 arranged in parallel to the outer peripheral surface thereof is prepared (preparation step). In addition, the 1st support member 11 may be formed in the substantially C shape by forming the length of a tape-shaped resin sheet shorter than the circumferential length in the planar view shape of the coil core 3. FIG.

  Subsequently, as shown in FIG. 4, a member is prepared in which a plurality of metal pins constituting the second columnar conductor 7 are adhesively arranged on a tape-like resin sheet having adhesiveness, which is a nonmagnetic material. A columnar second support member 12 made of a material such as epoxy resin is prepared. In addition, an adhesive resin film 12 a is formed by sticking a member made of a tape-like resin sheet on which a plurality of metal pins (columnar conductors 7) are adhered to the second support member 12. Then, a second support member 12 provided with a plurality of second columnar conductors 7 constituting the coil electrode 4 arranged in parallel on the outer peripheral surface via a resin film 12a is prepared (preparation step).

  In order to form the columnar conductors 6 and 7, metal pins having a diameter of about 100 μm to about 300 μm can be used. For example, the first columnar conductor 6 is a metal pin having a diameter of about 100 μm. The second columnar conductor 7 may be formed of a metal pin having a diameter of about 70 μm.

  Subsequently, a Cu-clad insulating substrate 9 on which a Cu foil is laminated is prepared. Then, as shown in FIG. 5, the wiring electrode pattern 10 and the lead-out wiring electrode pattern 13 are formed on the insulating substrate 9 by etching using photolithography. Next, as shown in FIG. 6, a solder resist layer 14 is formed on a portion excluding the connection position of the other end of each columnar conductor 6, 7 and a portion where the coil core 3 is disposed. And the solder paste 15 is apply | coated to the position where the other end of each columnar conductor 6 and 7 is connected.

  In this embodiment, the position at which the other end of each columnar conductor 6 is connected to the outer end of each wiring electrode pattern 10 is set so that the connection position with the other end of each columnar conductor 6 is substantially the same. It is arranged on the great circumference. In addition, by setting the position where the other end of each columnar conductor 7 is connected to the inner end of each wiring electrode pattern 10, the connection position with the other end of each columnar conductor 7 is on a substantially small circumference. Has been placed.

  Subsequently, as shown in FIGS. 7A to 7B, the other end of each first columnar conductor 6 disposed on the outer peripheral surface of the first support member 11 disposed outside the coil core 3 is The first support member 11 and the coil core 3 are arranged at predetermined positions on the insulating substrate 9 by being connected to the outer ends of the respective wiring electrode patterns 10 arranged on the substantially large circumference. The other end of each second columnar conductor 7 disposed on the outer peripheral surface of the second support member 12 is connected to an inner end of each wiring electrode pattern 10 disposed on a substantially small circumference. Thus, the second support member 12 is arranged at a predetermined position on the insulating substrate 9 inside the coil core 3.

  Accordingly, each of the first columnar conductors 6 is disposed outside the coil core 3 so as to be substantially orthogonal to the central axis direction of the coil 5, and each of the second columnar conductors 7 is substantially orthogonal to the central axis direction of the coil 5. Thus, the first columnar conductors 6 and the second columnar conductors 7 are arranged so as to face each other with the coil core 3 interposed therebetween (arrangement step). In the arranging step, the other ends of the first columnar conductor 6 and the second columnar conductor 7 adjacent to one side of the second columnar conductor 7 paired with the first columnar conductor 6 are connected to each other. Each is connected by a wiring electrode pattern 10. As shown in FIG. 7B, the columnar conductors 6 and 7 that are not connected to the wiring electrode patterns 10 are connected to the lead wiring electrode patterns 13, respectively.

  7A to 7C, a part of the configuration is not shown in order to simplify the drawing. That is, the wiring electrode patterns 10 and 13 are not shown in the figure (a), the wiring electrode patterns 10 and 13 are indicated by dotted lines in the figure (b), and each columnar conductor 6 is shown in the figure (c). , 7 are partially omitted. Also, in FIGS. 8 to 10, FIGS. 18A to 18C and FIG. 19 to be referred to in the following description, a part of the configuration is omitted for simplification of the drawing. Is omitted.

  Subsequently, as shown in FIG. 8, the coil core 3 and the columnar conductors 6 and 7 are resin-sealed using a general thermosetting mold resin to form the resin insulating layer 2 (sealing). Process). Subsequently, as shown in FIG. 9, the resin on the one principal surface 2a of the resin insulating layer 2 is removed by polishing or grinding so that one end of each of the columnar conductors 6 and 7 is exposed (removal step). Then, Ni / Au plating layers 6 a and 7 a are formed on the end surfaces of the columnar conductors 6 and 7 exposed on the one main surface 2 a of the resin insulating layer 2.

  In the removing step, the resin on the one main surface 2a of the resin insulating layer 2 is removed so that one end of each of the columnar conductors 6 and 7 protrudes slightly from the one main surface 2a of the resin insulating layer 2 and is exposed. Also good. Further, for example, one end surface of each columnar conductor 6, 7 is polished by polishing one main surface 2 a of the resin insulating layer 2 a with an abrasive material softer than each columnar conductor 6, 7 and harder than the resin insulating layer 2. It can be exposed so as to protrude from the resin insulating layer 2.

  Then, as shown in FIG. 10, the ends of the first columnar conductor 6 and the second columnar conductor 7 that are paired with each other are connected to each other by a bonding wire 8 in the wire bonding process. Is completed (connection process). In addition, resin for molding may be further filled so that the bonding wire 8 is embedded in the resin insulating layer 2. In addition, by performing a wire bonding process before resin sealing, the ends of the first columnar conductor 6 and the second columnar conductor 7 that are paired with each other are connected to each other by the bonding wire 8, and then the coil core 3 and The bonding wire 8 may be resin-sealed.

  Note that, as described above, a part of the connection process is simultaneously performed in the arrangement process illustrated in FIGS. That is, in the arranging step, the other ends of the first columnar conductor 6 and the second columnar conductor 7 adjacent to one side of the second columnar conductor 7 paired with the first columnar conductor 6 are connected to each other. Are respectively connected by the wiring electrode pattern 10. In the wire bonding process, a bonding wire 8 having a diameter of about 20 μm to about 30 μm may be used.

  As described above, in this embodiment, the plurality of first columnar conductors 6 are arranged so as to be substantially orthogonal to the direction of the central axis of the coil 5 and arranged on the outer side that is one side of the coil core 3. The second columnar conductors 7 are arranged so as to be substantially orthogonal to the direction of the central axis of the coil 5, and are arranged so as to sandwich the plurality of first columnar conductors 6 and the coil core core 3 inside the coil core 3. Has been. The ends of the first columnar conductor 6 and the second columnar conductor 7 that are paired with each other are connected to each other by a bonding wire 8. Therefore, the entire length of the coil electrode 4 can be adjusted only by adjusting the length of the bonding wire 8 or the shape of the mountain. Further, by adjusting the overall length of the coil electrode 4, the inductance and impedance of the coil 5 can be easily adjusted. Therefore, the coil apparatus 1 which can adjust the coil characteristic of the coil 5 easily can be provided.

  Further, each of the columnar conductors 6 and 7 forming the wiring of the coil electrode 4 in the columnar conductor direction (vertical direction toward the paper surface of FIG. 2) is formed of a metal pin. Therefore, the wiring length of the coil electrode 4 in the columnar conductor direction can be easily increased only by increasing the length of each metal pin. Therefore, the thickness of the coil core 3 in the columnar conductor direction can be easily increased.

  Further, since each of the columnar conductors 6 and 7 is formed of a metal pin, a plurality of through holes are formed by providing a predetermined gap as in the prior art in order to form the wiring of the coil electrode 4 in the columnar conductor direction. Even if it is not formed on a core substrate such as a prepreg or the like, the wiring of the coil electrode 4 in the columnar conductor direction can be formed only by arranging the metal pins. Further, unlike conventional through-hole conductors and via conductors, the thickness of the wiring of the coil electrode 4 in the direction of the columnar conductor formed by each metal pin does not change. Therefore, it is possible to provide a coil device 1 that includes the coil 5 having a thick coil core 3 and excellent inductance characteristics, and can achieve a narrow pitch of the coil electrodes 4. In addition, since the number of turns of the coil 5 can be increased by reducing the pitch of the coil electrodes 4, the coil device 1 including the coil 5 having excellent coil characteristics can be provided.

  The coil 1 has a toroidal type coil core 3, each first columnar conductor 6 is arranged on the outer side which is one side of the coil core 3, and each second columnar conductor 7 is arranged on the inner side which is the other side of the coil core 3. It is arranged. Therefore, since the magnetic field lines generated in the coil 5 mainly have a closed magnetic circuit structure that passes through the annular toroidal coil core 3, the coil device 1 with less leakage magnetic flux can be provided.

  In addition, each first columnar conductor 6 is disposed on the outer peripheral surface of the first support member 11 formed in a ring shape or a substantially C shape by a nonmagnetic material, and a toroidal coil core is provided inside the first support member 11. 3 are arranged substantially concentrically. In addition, each second columnar conductor 7 is disposed on the outer peripheral surface of the second support member 12 formed in a columnar shape from a nonmagnetic material, and the second columnar conductors 7 are disposed substantially concentrically inside the coil core 3. ing.

  For this reason, when the columnar conductors 6 and 7 and the coil core 3 are arranged at predetermined positions, a through-hole for forming a through-hole conductor or a via conductor in a core substrate such as a printed board or a prepreg is made transparent as in the prior art. It is not necessary to perform special processing for forming the arrangement place of the coil core 3 by forming the hole for arranging the coil core 3 or forming the coil core 3. Therefore, the coil device 1 can be manufactured at a very low cost because the core substrate is not required, and the coil device 1 can be reduced in size.

  Further, the coil can be obtained simply by changing the shapes of the first and second support members 11 and 12 and adjusting the arrangement state of the columnar conductors 6 and 7 on the first and second support members 11 and 12. The arrangement relationship such as the interval between the respective columnar conductors 6 and 7 forming the electrode 4 and the coil core 3 can be easily adjusted. In addition, when adjusting the positional relationship between the columnar conductors 6 and 7 and the coil core 3, it is not necessary to change the design of the core substrate and the mold for resin sealing. Therefore, the increase in the manufacturing cost of the coil apparatus 1 accompanying a design change can be suppressed.

  Moreover, the 1st supporting member 11 which has a cyclic | annular form or a substantially C shape can be easily formed with the tape-shaped resin sheet which has the adhesiveness stuck on the outer peripheral surface of the coil core 3. FIG. Moreover, since the 1st support member 11 is formed with the tape-shaped resin sheet which has adhesiveness, the several 1st columnar conductor 6 formed in the outer peripheral surface of the 1st support member 11 with the metal pin is provided. Adhesive placement can be easily performed. Moreover, since a resin sheet is arrange | positioned between each 1st columnar conductor 6 and the coil core 3, each 1st columnar conductor 6 and the coil core 3 can be arrange | positioned closely in the insulated state.

  Moreover, since the stress from the first columnar conductors 6 on the coil core 3 can be relaxed by the resin sheet, the coil characteristics can be improved. In addition, since the ends of the paired columnar conductor 6 and columnar conductor 7 are connected to each other by the bonding wire 8 without being in contact with the coil core 3, the stress on the coil core 3 due to the coil electrode 4 can be further relaxed. The characteristics can be improved.

  In addition, since the adhesive resin film 12 a is formed on the outer peripheral surface of the second support member 12, a plurality of second columnar conductors 7 formed of metal pins on the outer peripheral surface of the second support member 12. Can be easily placed with adhesive. Further, the adhesive resin film 12 a can be easily formed on the outer peripheral surface of the second support member 12 by sticking the adhesive tape-like resin sheet.

  A plurality of metal pins may be adhesively arranged on the outer peripheral surface of the second support member 12 by imparting tackiness to the outer peripheral surface of the columnar second support member 12. Further, a plurality of metal pins imparted with adhesiveness are arranged in parallel at equal intervals, and the second support member 12 is rolled on each of the arranged metal pins, whereby a metal is formed on the outer peripheral surface of the second support member 12. A pin may be disposed by bonding.

  Further, one ends of the first columnar conductor 6 and the second columnar conductor 7 that are paired with each other are connected to each other by a bonding wire 8 so that the first columnar conductor 6 and the first columnar conductor 6 are paired with each other. The other end of the second columnar conductor 7 adjacent to one side of the second columnar conductor 7 is connected to each other by a line-shaped wiring electrode pattern 10 formed on the insulating substrate 9 to form the coil device 1. Has been. Therefore, for example, a highly versatile practical coil device 1 that can further mount other components on the insulating substrate 9 can be provided.

  Further, since the resin insulating layer 2 in which the coil core 3 is embedded is provided, the coil core 3 can be protected by the resin insulating layer 2.

  Moreover, in the manufacturing method of the coil device 1 described above, the columnar conductors 6 and 7 and the coil core 3 can be positioned and arranged only by arranging the first and second support members 11 and 12 and the coil core 3 at predetermined positions. it can. Therefore, when each of the columnar conductors 6 and 7 and the coil core 3 are arranged at predetermined positions, a through-hole for forming a through-hole conductor or a via conductor in a core substrate such as a printed circuit board or a prepreg is made transparent as in the prior art. It is not necessary to perform special processing for forming the arrangement place of the coil core 3 by forming the hole for arranging the coil core 3 or forming the coil core 3. Therefore, the manufacturing process of the coil device 1 can be greatly simplified, and the coil device 1 can be easily manufactured.

  Further, the shape of the first and second support members 11 and 12 is changed, and the arrangement state of the columnar conductors 6 and 7 on the outer peripheral surfaces of the first and second support members 11 and 12 is only adjusted. Thus, it is possible to easily adjust the arrangement relationship such as the spacing between the respective columnar conductors 6 and 7 forming the coil electrode 4 and the coil core 3. In addition, when adjusting the positional relationship between the columnar conductors 6 and 7 and the coil core 3, it is not necessary to change the design of the core substrate and the mold for resin sealing. Therefore, the increase in the manufacturing cost of the coil apparatus 1 accompanying a design change can be suppressed.

  In addition, the coil device 1 can be manufactured at a very low cost because the core substrate is unnecessary. Further, the coil device 1 can be reduced in height because the core substrate 1 is unnecessary.

  In addition, the conventional interlayer connection conductor 507 shown in FIG. 20 is formed by first penetrating through holes in the wiring substrate 502 by laser processing or the like, and plating or filling the through holes with conductive paste. Is done. Therefore, the outer diameter of the interlayer connection conductor 507 is determined by the size of the inner diameter of the through hole. Therefore, in order to change the outer diameter of the interlayer connection conductor 507, it is necessary to change the inner diameter of the through hole. However, in order to change the size of the inner diameter of the through hole, conditions such as laser processing must be changed. Therefore, since the operation of changing the outer diameter of the interlayer connection conductor 507 is very laborious, changing the outer diameter of the interlayer connection conductor 507 causes a problem that the manufacturing cost increases. When the through hole is formed by laser processing, a mortar-like through hole is formed due to the characteristics of the laser, and it is difficult to make the outer diameter of the interlayer connection conductor 507 constant.

  However, in this embodiment, the wiring of the coil electrode 4 in the direction (columnar conductor direction) substantially orthogonal to the direction of the central axis of the coil 5 is formed by the columnar conductors 6 and 7 made of metal pins. Therefore, by simply changing the outer diameter of each of the columnar conductors 6 and 7, the thickness of the wiring of the coil electrode 4 in the columnar conductor direction can be easily changed and the outer shape thereof can be made constant.

  In addition, the coil core 3 is disposed between the plurality of first columnar conductors 6 and the plurality of second columnar conductors 7, and one end of the paired columnar conductors 6 and the columnar conductors 7 are connected by bonding wires 8. ing. Therefore, for example, the columnar conductors 6 and 7 are not provided, and one end of the wiring electrode pattern 10 and the other end of the wiring electrode pattern 10 adjacent to one side of the wiring electrode pattern 10 are bonded wires. Compared with the configuration in which the coil conductor 3 is connected across the coil core 8, the shape of the angle of the bonding wire 8 can be reduced by the length of each of the columnar conductors 6 and 7. Therefore, in the wire bonding process, one end of the paired columnar conductor 6 and columnar conductor 7 can be easily connected by the bonding wire 8. In addition, by making the length of each columnar conductor 6 and 7 longer than the thickness of the coil core 3, a wire bonding process can be performed still more easily.

Second Embodiment
A coil device according to a second embodiment of the present invention will be described with reference to FIGS.

  FIG. 11 is a sectional view showing a coil device according to a second embodiment of the present invention. FIG. 12 is a view showing the arrangement of the first support member, the second support member, and the coil core, where (a) is a perspective view and (b) is a plan view. Each of FIGS. 13 to 15 is a diagram illustrating an example of a method for manufacturing the first support member included in the coil device of FIG. 11, and is a diagram illustrating different processes. Each of FIGS. 13 and 15 is a perspective view, FIG. 14B is a plan view, and FIG. 14 is a plan view. FIGS. 16 and 17 are views showing an example of a method for manufacturing the second support member provided in the coil device of FIG. 11, and showing different steps. 16A and 17B are a perspective view and a plan view, respectively.

  The coil device 1a according to this embodiment is different from the coil device 1 described with reference to FIGS. 1 and 2 as shown in FIGS. 11 and 12 (a) and 12 (b). 111 is formed in a ring shape by a nonmagnetic material such as a thermosetting epoxy resin, and the coil core 3 is disposed concentrically on the inside. In addition, a plurality of grooves 111 a for arranging the first columnar conductors 6 (metal pins) are provided on the outer peripheral surface of the first support member 111. The central axis of the coil 5 (the circumferential direction of the first support member 111). The first columnar conductor 6 is disposed in each of the grooves 111a. Moreover, each 1st columnar conductor 6 is arrange | positioned in each groove | channel 111a, for example by being transferred. For example, the first columnar conductor 6 is adhesively fixed in the groove 111a by providing tackiness in each groove 111a.

  A plurality of grooves 112a for arranging the second columnar conductors 7 (metal pins) are formed on the outer peripheral surface of the second support member 112. The central axis of the coil 5 (the circumferential direction of the second support member 112). The second columnar conductors 7 are arranged in each of the respective 112a. In addition, each second columnar conductor 7 is disposed in each groove 112a by being transferred, for example. For example, the second columnar conductor 7 is adhesively fixed in the groove 112a by providing tackiness in each groove 112a. In the following description, different points from the above-described first embodiment will be described, and other configurations are the same as those of the above-described first embodiment, and thus the same reference numerals are given and description of the configurations will be omitted.

  An example of a method for manufacturing the first support member 111 will be described.

  First, as shown in FIGS. 13A and 13B, the first columnar conductors 6 are formed on the outer peripheral surface of a large-diameter columnar member formed of a thermosetting resin material such as an epoxy resin. A plurality of grooves 111a for placement are formed so as to be substantially orthogonal to the circumferential direction of the cylindrical member. Next, as shown in FIG. 14, the first columnar conductor 6 is disposed in each of the plurality of grooves 111a formed on the outer peripheral surface of the columnar member. And as shown to Fig.15 (a), (b), by forming a hole by punching etc. in the center part of a cylindrical member so that the coil core 3 can be arrange | positioned, the outer peripheral surface Thus, the first support member 111 in which the plurality of first columnar members 6 are arranged is completed.

  In order to prevent the cylindrical member from cracking, it is preferable to perform a punching process for forming a hole in a semi-cured (B stage) state. In addition, the first columnar conductors 6 may be disposed on the outer peripheral surface of the first support member 111 after the annular first support member 111 is formed by forming a hole by punching.

  An example of the manufacturing direction of the second support member 112 will be described.

  First, as shown in FIGS. 16A and 16B, a cylindrical member formed in a shape that can be disposed inside the coil core 3 is prepared using a thermosetting resin material such as an epoxy resin. And the 2nd support member 112 is formed in the outer peripheral surface of a cylindrical member by forming the several groove | channel 112a for arrange | positioning each 2nd columnar conductor 7 substantially orthogonally to the circumferential direction. Is done. Next, as shown in FIGS. 17A and 17B, the second columnar conductor 7 is disposed in each of the plurality of grooves 112 a formed on the outer peripheral surface of the columnar second support member 112. Thereby, the 2nd support member 112 by which the some 2nd columnar member 7 is arrange | positioned on the outer peripheral surface is completed.

  Subsequently, the first support member 111, the second support member 112, and the coil core 3 are integrated as shown in FIGS. 12 (a) and 12 (b). Then, similarly to the manufacturing method described in the first embodiment, the integrated first support member 111 and second support member 112 and the coil core 3 are disposed on the insulating substrate 9 (arrangement step). After the resin insulating layer 2 is formed (sealing process, removing process), a connecting process using the bonding wires 8 is performed, whereby the coil device 1a is manufactured.

  As in the first embodiment described above, the molding resin may be further filled so that the bonding wire 8 is embedded in the resin insulating layer 2. In addition, by performing a wire bonding process before resin sealing, the ends of the first columnar conductor 6 and the second columnar conductor 7 that are paired with each other are connected to each other by the bonding wire 8, and then the coil core 3 and The bonding wire 8 may be resin-sealed.

  As described above, in this embodiment, the integrated first support member 111, second support member 112, and coil core 3 are arranged on the insulating substrate 9, whereby the columnar conductor direction of the coil electrode 4. The wiring in can be easily formed as in the first embodiment.

  In addition, the first columnar conductor 6 formed of a metal pin is disposed in each of the plurality of grooves 111 a formed on the outer peripheral surface of the first support member 111, thereby the outer peripheral surface of the first support member 111. The first columnar conductors 6 can be arranged with high positional accuracy. In addition, the second columnar conductor 7 formed of a metal pin is disposed in each of the plurality of grooves 112 a formed on the outer peripheral surface of the second support member 112, thereby the outer peripheral surface of the second support member 112. The second columnar conductors 7 can be arranged with high positional accuracy.

  The plurality of metal pins are attached to the outer peripheral surface on which the plurality of grooves 111 a are not formed without forming the plurality of grooves 111 a on the outer peripheral surface of the columnar first support member 111. One support member 111 may be adhesively arranged on the outer peripheral surface. In addition, a plurality of metal pins provided with adhesiveness are arranged in parallel at equal intervals, and the first support member 111 is rolled on each of the arranged metal pins, whereby a metal is formed on the outer peripheral surface of the first support member 111. A pin may be disposed by bonding.

<Third Embodiment>
A method for manufacturing the coil device according to the third embodiment of the present invention will be described with reference to FIG. FIG. 18 is a view showing an example of a method of manufacturing a coil device according to the third embodiment of the present invention, and (a) to (c) are views showing different processes.

  The coil device of this embodiment differs from the coil devices 1 and 1a described in the first and second embodiments described above, as shown in FIGS. 18 (a) to (c). The support members 11 and 111 and the second support members 12 and 112 are not provided. In the following description, differences from the first and second embodiments described above will be described with reference to FIGS. 18A to 18C and also with reference to FIGS. Therefore, the same reference numerals are used to omit the description of the configuration.

  An example of the manufacturing method of the coil apparatus of this embodiment is demonstrated.

  First, a Cu-clad insulating substrate 9 on which a Cu foil is laminated is prepared. Then, as shown in FIG. 5, the wiring electrode pattern 10 and the lead-out wiring electrode pattern 13 are formed on the insulating substrate 9 by etching using photolithography. Next, as shown in FIG. 6, a solder resist layer 14 is formed on a portion excluding the connection position of the other end of each columnar conductor 6, 7 and a portion where the coil core 3 is disposed. And the solder paste 15 is apply | coated to the position where the other end of each columnar conductor 6 and 7 is connected.

  As in the first and second embodiments described above, by setting the position where the other end of each columnar conductor 6 is connected to the outer end of each wiring electrode pattern 10, The connection position with the other end is arranged on a substantially large circumference. In addition, by setting the position where the other end of each columnar conductor 7 is connected to the inner end of each wiring electrode pattern 10, the connection position with the other end of each columnar conductor 7 is on a substantially small circumference. Has been placed.

  Subsequently, as shown in FIG. 18A, the other end of each first columnar conductor 6 formed of a metal pin is an outer end of each wiring electrode pattern 10 arranged on a substantially large circumference. Each first columnar conductor 6 is arranged at a predetermined position on the insulating substrate 9 by being connected to the portion. In addition, the other end of each second columnar conductor 7 formed of a metal pin is connected to the inner end of each wiring electrode pattern 10 arranged on a substantially small circumference, whereby each second columnar conductor 7 is connected. The columnar conductors 7 are arranged at predetermined positions on the insulating substrate 9.

  Then, as shown in FIG. 18B, the annular coil core 3 is arranged in a donut-shaped region on the insulating substrate 9 between each first columnar conductor 6 and each second columnar conductor 7. . Accordingly, each of the first columnar conductors 6 is disposed outside the coil core 3 so as to be substantially orthogonal to the central axis direction of the coil 5, and each of the second columnar conductors 7 is substantially orthogonal to the central axis direction of the coil 5. Thus, each first columnar conductor 6 and each second columnar conductor 7 are arranged so as to face each other with the coil core 3 interposed therebetween.

  At this time, the other ends of the first columnar conductor 6 and the second columnar conductor 7 adjacent to one side of the second columnar conductor 7 paired with the first columnar conductor 6 are connected to each other. Each is connected by a wiring electrode pattern 10. Subsequently, the coil core 3 and the columnar conductors 6 and 7 are resin-sealed by using a general thermosetting mold resin to form the resin insulating layer 2. Next, as shown in FIG. 18C, the resin on one main surface 2a of the resin insulating layer 2 is removed by polishing or grinding so that one end of each of the columnar conductors 6 and 7 is exposed. Then, Ni / Au plating layers 6 a and 7 a are formed on the end surfaces of the columnar conductors 6 and 7 exposed on the one main surface 2 a of the resin insulating layer 2.

  Subsequently, one end of each of the first columnar conductor 6 and the second columnar conductor 7 paired with each other is connected by a bonding wire 8 in a wire bonding process, whereby the coil device 1 is completed. As in the first embodiment described above, the molding resin may be further filled so that the bonding wire 8 is embedded in the resin insulating layer 2. In addition, by performing a wire bonding process before resin sealing, the ends of the first columnar conductor 6 and the second columnar conductor 7 that are paired with each other are connected to each other by the bonding wire 8, and then the coil core 3 and The bonding wire 8 may be resin-sealed.

<Fourth embodiment>
The manufacturing method of the coil apparatus concerning 4th Embodiment of this invention is demonstrated with reference to FIG. FIG. 19 is a sectional view showing a coil device according to a fourth embodiment of the present invention.

  The coil device 1b of this embodiment is different from the coil device 1 described in the first embodiment described above in that the first columnar conductor 6 and the first columnar conductor 6 are mutually connected as shown in FIG. The second connecting member for connecting the other ends of the second columnar conductors 7 adjacent to one side of the paired second columnar conductors 7 is also formed by the two bonding wires 8. . In the following description, different points from the above-described first embodiment will be described, and other configurations are the same as those of the above-described first embodiment, and thus the same reference numerals are given and description of the configurations will be omitted.

  An example of the manufacturing method of the coil apparatus of this embodiment is demonstrated.

  First, instead of the insulating substrate 9 on which the wiring electrode pattern 10 is formed, a release sheet provided with a support layer formed of an adhesive thermosetting resin is prepared. And like the above-mentioned 1st Embodiment, the 1st support member 11 (coil core 3) and the 2nd support member 12 are arrange | positioned in the predetermined position on the support layer provided in the release sheet. The release sheet may be any type of release sheet such as a sheet in which a release layer is formed on a resin sheet such as polyethylene terephthalate, polyethylene naphthalate, or polyimide, or a sheet in which a resin sheet such as a fluororesin itself has a release function. A mold sheet may be used.

  Subsequently, the coil core 3, the first support member 11, and the second support member 12 are resin-sealed using the same resin as the support layer on the release sheet to form the resin insulating layer 2 including the support layer. Is done. In addition, you may resin-seal using resin different from a support layer. Next, after the release sheet is peeled off, the resin on both main surfaces 2a and 2b of the resin insulating layer 2 is removed by polishing or grinding so that both ends of each of the columnar conductors 6 and 7 are exposed. Then, Ni / Au plating layers 6a and 7a are formed on the end surfaces of the respective columnar conductors 6 and 7 exposed on both main surfaces 2a and 2b of the resin insulating layer 2.

  Subsequently, as shown in FIG. 19, on one main surface 2a of the resin insulating layer 2, the first columnar conductor 6 and the second columnar conductor 7 that are paired with each other are connected to each other with bonding wires 8 (first Connection member). Further, on the other main surface 2 b of the resin insulating layer 2, the second end adjacent to the other end of the first columnar conductor 6 and one side of the second columnar conductor 7 paired with the first columnar conductor 6. The other end of each columnar conductor 7 is connected to each other by a bonding wire 8 (second connecting member) to complete the coil device 1b.

  In the second and third embodiments described above, the second columnar conductor adjacent to one side of the first columnar conductor 6 and the second columnar conductor 7 paired with the first columnar conductor 6 is also provided. The other ends of the conductor 7 may be connected to each other by a bonding wire 8 (second connecting member). Also in this case, instead of the insulating substrate 9, the resin insulating layer 2 is formed after the first supporting member 111 and the second supporting member 112 are arranged at predetermined positions on the supporting layer provided on the release sheet. The resin insulating layer 2 may be formed after the columnar conductors 6 and 7 are disposed.

  As described above, in this embodiment, since each connection member is formed by the bonding wire 8, each columnar conductor 6 of the coil electrode 4 can be adjusted by adjusting the length or the mountain shape of each bonding wire 8. It is possible to easily form a three-dimensional (three-dimensional) wiring at a portion connecting the seven. Therefore, as compared with the wiring electrode pattern 10 formed planarly (two-dimensionally) on the main surface of the insulating substrate 9 or the resin insulating layer 2, each bonding wire 8 is three-dimensionally wired, so that each bonding The wiring density of each bonding wire 8 can be improved while preventing the wires 8 from contacting each other. Therefore, the pitch between the coil electrodes 4 can be further reduced, and the coil characteristics can be improved by increasing the number of turns of the coil 5.

  In addition, each columnar conductor 6 supported by the first support members 11 and 111 and each columnar conductor 7 supported by the second support members 12 and 112 are connected to the wiring electrode pattern 10 of the insulating substrate 9. Then, the wiring electrode pattern 10 and the columnar conductors 6 and 7 are aligned and connected. On the other hand, in this embodiment, the end portions of the corresponding columnar conductors 6 and 7 are connected by the bonding wire 8 in the wire bonding process. Therefore, compared with the configuration in which the columnar conductors 6 and 7 are connected to the wiring electrode pattern 10 of the insulating substrate 9, even when the distance between the columnar conductors 6 and 7 is changed, the columnar shapes arranged at a narrow pitch are used. The ends of the conductors 6 and 7 can be connected by the bonding wire 8 with very high positional accuracy. As a result, it is possible to further reduce the pitch between the coil electrodes 4.

  Further, the number of turns of the coil 5 can be increased by reducing the pitch between the coil electrodes 4. Further, by reducing the pitch between the coil electrodes 4, the coil 5 can be reduced in size, and the coil device 1b can be reduced in size.

  The present invention is not limited to the above-described embodiments, and various modifications other than those described above can be made without departing from the spirit of the invention. For example, in the above-described embodiment, the toroidal type coil core 3 has been described as an example. However, the shape of the coil core is not limited to the toroidal type, but is linear or substantially C-shaped. Various shapes of coil cores can be employed. Moreover, the coil provided with various functions, such as a common mode noise filter and a choke coil, can be comprised with the coil with which a coil apparatus is provided.

  Further, the first connecting member and / or the second connecting member may be formed by one or three or more bonding wires. The diameters of the columnar conductors 6 and 7 may be the same. Further, each of the columnar conductors 6 and 7 may be formed, for example, by a via conductor formed by plating or filling a through-hole formed in the resin insulating layer 2 with a conductive paste. Good. Such via conductors may be formed in the first support member and / or the second support member. The coil device 1 may be embedded in another resin layer or another substrate.

  Further, both ends of each of the columnar conductors 6 and 7 may be configured to protrude from the resin insulating layer 2 and exposed, or may be configured not to be exposed. Moreover, what is necessary is just to change suitably the thickness, length, etc. of each columnar conductor 6 and 7 according to the structure of the required coil apparatus. Further, in each of the embodiments described above, the resin insulating layer 2 is not necessarily required.

  Further, the method of connecting the corresponding one ends of the columnar conductors 6 and 7 and the method of connecting the corresponding other ends of the columnar conductors 6 and 7 are not limited to the above-described examples. You may connect by the wiring electrode pattern formed on the main surfaces 2a and 2b of the resin insulation layer 2 using a lithography technique or screen printing, or connect the columnar conductors 6 and 7 by any member. Also good. Moreover, both the 1st connection member and the 2nd connection member may be formed with the wiring electrode pattern formed in the insulated substrate or the resin insulating layer.

  Further, the first support member and the second support member may be formed of a thermosetting resin. The first columnar conductors are directly adhered and arranged on the outer peripheral surface of the first support member provided with tackiness, and the second columnar conductor is provided on the outer peripheral surface of the second support member provided with tackiness. May be directly adhered. In this way, the first columnar conductor and the second columnar conductor can be easily placed on the outer peripheral surfaces of the first support member and the second support member, respectively, formed of an adhesive thermosetting resin. Adhesive can be arranged.

  The present invention can be widely applied to a coil device including a coil formed by spirally winding a coil electrode around a coil core and a manufacturing method thereof.

DESCRIPTION OF SYMBOLS 1, 1a, 1b Coil apparatus 2 Resin insulation layer 3 Coil core 4 Coil electrode 5 Coil 6 1st columnar conductor 7 2nd columnar conductor 8 Bonding wire (1st connection member, 2nd connection member)
9 Insulating substrate 10 Wiring electrode pattern (second connecting member)
11, 111 First support member 12, 112 Second support member 12a Resin film 111a, 112a Groove

Claims (15)

A coil having a coil core and a coil electrode spirally wound around the core;
The coil electrode is
A plurality of first columnar conductors arranged so as to intersect the direction of the central axis of the coil and arranged on one side of the core;
A plurality of first columnar conductors arranged so as to intersect the direction of the central axis of the coil and arranged to sandwich the cores on the other side of the core; and
A plurality of first connecting members that respectively connect ends of the first columnar conductor and the second columnar conductor that are paired with each other;
A plurality of second columnar conductors respectively connecting the other ends of the first columnar conductor and the second columnar conductor adjacent to one side of the second columnar conductor paired with the first columnar conductor. A connecting member,
One of said 1st connection member and said 2nd connection member is formed of the bonding wire. The coil apparatus characterized by the above-mentioned. The coil has a toroidal core;
Each of the first columnar conductor and the second columnar conductor is formed by a metal pin,
The first columnar conductors are arranged on the outer side which is one side of the core, and the second columnar conductors are arranged on the inner side which is the other side of the core. The coil apparatus as described. A first support member that is formed of a non-magnetic material in a ring shape or substantially C-shape, and in which the core is disposed substantially concentrically;
A second support member formed in a columnar shape by a nonmagnetic material and disposed substantially concentrically inside the core;
Each of the first columnar conductors is disposed on the outer peripheral surface of the first support member,
The coil device according to claim 2, wherein each of the second columnar conductors is disposed on an outer peripheral surface of the second support member.   The first support member is formed of an adhesive tape-like resin sheet adhered to the outer peripheral surface of the core, and the first columnar conductors are adhesively arranged on the outer peripheral surface. The coil device according to claim 3, wherein   A plurality of grooves for disposing each of the first columnar conductors are formed on the outer peripheral surface of the first support member so as to intersect with the direction of the central axis of the coil, respectively. Item 4. The coil device according to Item 3. Each of the second columnar conductors is adhesively arranged on the outer peripheral surface of the second support member via an adhesive resin film formed on the outer peripheral surface of the second support member. The coil device according to any one of claims 3 to 5.   The coil device according to claim 6, wherein the resin film is formed by sticking an adhesive tape-like resin sheet to an outer peripheral surface of the second support member. The first support member and the second support member are formed of a thermosetting resin, the first columnar conductors are directly disposed on the outer peripheral surface of the first support member, and the second support The coil device according to claim 3, wherein the second columnar conductor is directly adhered to the outer peripheral surface of the member.   A plurality of grooves for arranging the respective second columnar conductors are formed on the outer peripheral surface of the second support member so as to intersect with the direction of the central axis of the coil, respectively. Item 6. The coil device according to any one of Items 3 to 5.   The coil device according to any one of claims 2 to 9, wherein the first columnar conductor is formed to have a larger diameter than the second columnar conductor.   The coil device according to any one of claims 1 to 10, wherein the other of the first connection member and the second connection member is formed by the bonding wire.   The coil device according to any one of claims 1 to 11, wherein the first connection member and / or the second connection member are formed of a plurality of the bonding wires.   2. One of the first connection member and the second connection member is formed by a bonding wire, and the other is formed by a line-shaped wiring electrode pattern formed on an insulating substrate. The coil apparatus in any one of thru | or 11.   The coil device according to any one of claims 1 to 13, further comprising a resin insulating layer in which the core is embedded and the coil electrode is provided. In a manufacturing method of a coil device comprising a coil having a coil core and a coil electrode spirally wound around the core,
A first support member formed of a non-magnetic member and provided with a plurality of first columnar conductors forming the coil electrode arranged in parallel; and a plurality of second support members formed of the non-magnetic member and forming the coil electrode. A preparation step of preparing a second support member provided with two columnar conductors arranged in parallel;
The first columnar conductors and the second columnar conductors face each other across the core, and the first columnar conductors intersect each other in the direction of the central axis of the coil. One support member is disposed on one side of the core, and the second support member is disposed on the other side of the core so that each of the second columnar conductors intersects the direction of the central axis of the coil. The placement process;
The ends of the first columnar conductor and the second columnar conductor that form a pair are connected to each other by a first connecting member, and the first columnar conductor and the first columnar conductor are paired with each other. A connecting step of connecting the other ends of the second columnar conductors adjacent to one side of the second columnar conductors with the second connecting members, respectively.
At least one of the first connection member and the second connection member is formed of a bonding wire. A method of manufacturing a coil device, wherein:

Images