JP6520130B2 - Coil parts - Google Patents

Description

The present invention relates to a coil component including an insulating layer in which an annular coil core is embedded, and a coil electrode wound around the coil core.

  In electronic devices using high frequency signals, for example, a toroidal coil may be used as a component for preventing noise. Since this toroidal coil is relatively large compared to other electronic components mounted on the wiring board, there is a problem that the mounting area of the wiring board is widely occupied. In addition, mounting a large toroidal coil on a wiring board also makes it difficult to reduce the overall height of the coil component.

  Therefore, in the related art, a technology has been proposed in which a toroidal coil is incorporated in a wiring board to reduce the size of the coil component. For example, as shown in FIG. 6, the coil component 100 described in Patent Document 1 includes a wiring board 101 formed by laminating a plurality of insulating layers, an annular coil core 102 built in the wiring board 101, and the coil core. And a coil electrode 103 spirally wound around the periphery of the coil 102.

  The coil electrode 103 includes a plurality of upper wiring patterns 103a formed in the upper insulating layer of the coil core 102 and a plurality of lower wiring patterns 103b formed in the lower insulating layer of the coil core 102, respectively. And a plurality of interlayer connection conductors 104 for connecting the upper wiring pattern 103a and the lower wiring pattern 103b. Further, an end of the coil electrode 103 is connected to the lead wire 105, and is configured to be connectable to the outside by, for example, a pad electrode for input and output provided at a lead-out destination. At this time, the upper wiring patterns 103a, the lower wiring patterns 103b, and the lead wirings 105 are formed by etching Cu foil, for example. Each interlayer connection conductor 104 is formed by plating the via hole in which the insulating layer is formed. As described above, by incorporating the coil core 102 and the coil electrode 103 in the wiring substrate 101, the area of the main surface of the wiring substrate 101 can be reduced while securing the mounting area of the components, and the entire coil component 100 can be reduced. It is possible to make it tall.

JP, 2013-207149, A (paragraph 0015-0021, refer to figure 1 grade)

  With the recent miniaturization and high functionality of electronic devices, further miniaturization and high functionality of coil components mounted on the electronic devices are required. In this case, it is conceivable to increase the number of turns of the coil electrode without changing the size of the coil core and to increase the inductance of the coil component. However, in the conventional coil component 100, the upper wiring pattern 103a and the lower wiring pattern 103b connected to the lead wiring 105 for the pad electrode for input and output are arranged so as not to overlap in plan view. There is a limit to increasing 103 turns.

  The present invention has been made in view of the above problems, and in a coil component in which an annular coil core is embedded in an insulating layer, the number of turns of the coil electrode wound around the coil core while maintaining the size of the coil core. Aim to increase the

In order to achieve the above object, the coil component of the present invention comprises an insulating layer in which an annular coil core is embedded, a coil electrode wound around the coil core, and an external connected to one end of the coil electrode. The coil electrode includes an input electrode for connection and an output electrode for external connection connected to the other end of the coil electrode, and one end of the coil electrode is disposed on the inner peripheral side of the coil core and the other end is the coil core And an input wiring pattern forming the one end of the coil electrode formed on one of the main surfaces of the insulating layer, and one end being disposed on the inner peripheral side of the coil core and the other end being And an output wiring pattern forming the other end of the coil electrode formed on the other main surface of the insulating layer so as to be disposed on the outer peripheral side of the coil core, and the output wiring pattern is partially flat Are arranged so as to overlap the input wiring pattern is viewed, the area overlapping the input wiring pattern of said output wiring pattern, an inner peripheral side region of the coil cores of the output wiring pattern in plan view, the outer peripheral side of the coil core It is characterized in that it is in all of a field and a field which overlaps with the coil core .

  According to this configuration, by arranging the output wiring pattern forming the other end of the coil electrode so as to partially overlap the input wiring pattern forming the one end of the coil electrode in plan view, the space between the coil electrodes in the circumferential direction of the coil core Because the coil can be wound without waste, the number of turns of the coil electrode can be increased while maintaining the size of the coil core.

  Further, the input electrode and the output electrode are both formed on the one main surface of the insulating layer, and the output wiring pattern is a position where the input wiring pattern and the output wiring pattern do not overlap in plan view. It may be connected to the output electrode by the connection conductor provided penetrating the insulating layer. In this case, since both the input electrode and the output electrode are formed on one main surface of the insulating layer, the mountability of the coil component to the outside can be improved.

  In addition, the input electrode and the output electrode are both formed on the other main surface of the insulating layer, and the input wiring pattern is a position where the input wiring pattern and the output wiring pattern do not overlap in a plan view. The connection electrode may be connected to the input electrode by a connection conductor provided through the insulating layer. In this case, since both the input electrode and the output electrode are formed on the other main surface of the insulating layer, the mountability of the coil component to the outside can be improved.

  Further, the coil electrode has a winding portion formed by being wound around the coil core between the input wiring pattern and the output wiring pattern, and one end of the winding portion is an inner periphery of the coil core. A plurality of first wiring patterns disposed on the side and the other end disposed on the outer peripheral side of the coil core, and arranged in the circumferential direction of the coil core on one main surface of the insulating layer; They are arranged on the circumferential side and the other end is arranged on the outer circumferential side of the coil core, and arranged in the circumferential direction of the coil core on the other main surface of the insulating layer so as to form a plurality of pairs with each first wiring pattern The plurality of second wiring patterns and the second wiring pattern disposed on the inner circumferential side of the coil core and forming one end of each of the first wiring patterns and the first wiring pattern. A plurality of inner conductors connecting one end and an outer peripheral side of the coil core, the other end of each of the first wiring patterns and the second wiring pattern forming a pair with the first wiring pattern A plurality of outer conductors may be connected to the other end of the adjacent second wiring pattern, and each of the inner conductors and the outer conductors may be formed of a metal pin.

  When the inner and outer conductors are composed of via conductors or through-hole conductors that require the formation of through holes, adjacent conductors need to be spaced to form separate through holes, so adjacent There is a limit to narrowing the gap between the conductors to increase the number of turns of the coil. In the case of a metal pin which does not form a through hole, it is easy to narrow the gap between the adjacent metal pins, so the number of turns of the coil electrode is increased by forming each of the inner and outer conductors with metal pins. As a result, coil characteristics can be improved (higher inductance).

  In addition, since the metal pin has a lower specific resistance than a via conductor or a through hole conductor formed by filling a via hole with a conductive paste, the resistance value of the entire coil electrode can be reduced. Therefore, for example, a coil component excellent in coil characteristics such as Q value can be provided.

  According to the present invention, the coil electrode is disposed in the circumferential direction of the coil core by arranging the output wiring pattern forming the other end of the coil electrode to overlap with the input wiring pattern forming a part of the coil electrode in plan view. Since the space can be wound without wasting, the number of turns of the coil electrode can be increased while maintaining the size of the coil core.

It is a sectional view of coil parts concerning a 1st embodiment of the present invention. It is a top view of the coil component of FIG. It is a figure for demonstrating the wiring pattern of FIG. It is a top view of the coil component concerning a 2nd embodiment of the present invention. It is a figure for demonstrating the wiring pattern of FIG. It is a top view of the conventional coil component.

First Embodiment
A coil component 1 a according to a first embodiment of the present invention will be described with reference to FIGS. 1 to 3. 1 is a cross-sectional view of the coil component 1a, FIG. 2 is a plan view of the coil component 1a, and FIG. 3 is a diagram for explaining the wiring patterns 6a, 6b, 7a, 7b. 3 (a) is a plan view of the coil component 1a in a state where the lower side wiring pattern 6b and the output wiring pattern 7b are removed, and FIG. 3 (b) is a state where the upper side wiring pattern 6a and the input wiring pattern 7a are removed. It is a top view of coil component 1a.

  As shown in FIGS. 1 to 3, the coil component 1 a according to this embodiment includes the insulating layer 2 in which the coil core 3 is embedded, the coil electrode 4 wound around the coil core 3, and one end of the coil electrode 4. And an output electrode 8b for external connection connected to the other end of the coil electrode 4 and mounted on an electronic device such as a portable telephone using a high frequency signal. .

  The insulating layer 2 is formed of, for example, a resin such as an epoxy resin, and is formed to have a predetermined thickness so as to cover the coil core 3 and a plurality of metal pins 5a, 5b, 5c described later. In this embodiment, the main surfaces (upper surface and lower surface) of the insulating layer 2 are formed in a rectangular shape.

  The coil core 3 is formed of a magnetic material adopted as a general coil core such as Mn-Zn ferrite. The coil core 3 of this embodiment is formed in an annular shape.

  The coil electrode 4 spirals around the coil core 3 and is formed on the upper surface (corresponding to the “one main surface” of the present invention) of the insulating layer 2 and forms an input wiring forming one end of the coil electrode 4 A pattern 7a, an output wiring pattern 7b formed on the lower surface of the insulating layer 2 (corresponding to the “other main surface” of the present invention) and forming the other end of the coil electrode 4; an input wiring pattern 7a and an output wiring pattern 7b And a winding portion 12 wound around the coil core 3. One end of each of the input wiring pattern 7 a and the output wiring pattern 7 b is disposed on the inner peripheral side of the coil core 3, and the other end is disposed on the outer peripheral side of the coil core 3.

  The winding portion 12 spirals around the coil core 3 and forms a plurality of upper wiring patterns 6a formed on the upper surface of the insulating layer 2 and a plurality of pairs with each upper wiring pattern 6a. A plurality of lower wiring patterns 6b formed on the lower surface of insulating layer 2 and a plurality of inner metal pins 5a and outer metal pins 5b connecting predetermined upper wiring patterns 6a and lower wiring patterns 6b are provided. .

  Each upper wiring pattern 6a has one end disposed on the inner peripheral side of the coil core 3 and the other end disposed on the outer peripheral side of the coil core 3, and the winding axial direction of the coil electrode 4 together with the input wiring pattern 7a (coil core 3 In the circumferential direction of Each lower wiring pattern 6b has the coil core 3 together with the output wiring pattern 7b in a state where one end is arranged on the inner peripheral side of the coil core 3 and the other end is arranged on the outer peripheral side of the coil core 3 like the upper wiring pattern 6a. Arranged in the circumferential direction of Further, in this embodiment, the upper and lower wiring patterns 6a and 6b are formed in a tapered shape from the outer peripheral side toward the inner peripheral side.

  The upper and lower wiring patterns 6a and 6b are laminated on the base electrode 9 formed by screen printing using a conductive paste containing a metal such as Cu or Ag and the base electrode 9 by, for example, Cu plating. It has a two-layer structure with the front surface electrode 10. The upper and lower wiring patterns 6a and 6b may have a single-layer structure. In this case, as in the base electrode 9, it can be formed by screen printing using a conductive paste containing a metal such as Cu or Ag. Here, the upper wiring pattern 6a described above corresponds to the "first wiring pattern" of the present invention, and the lower wiring pattern 6b corresponds to the "second wiring pattern" of the present invention.

  Each inner metal pin 5a connects one end of each upper wiring pattern 6a to one end of lower wiring pattern 6b which forms a pair with the upper wiring pattern 6a, and stands in the thickness direction of insulating layer 2 respectively. It is arranged along the inner circumferential surface of the coil core 3 in the installed state.

  Each outer metal pin 5b is a lower side adjacent to the other end of each upper wiring pattern 6a and a predetermined side (counterclockwise in this embodiment) of the lower wiring pattern 6b paired with the upper wiring pattern 6a. The other end of the wiring pattern 6b is connected. Each of the outer metal pins 5 b is arranged along the outer peripheral surface of the coil core 3 in a state of being erected in the thickness direction of the insulating layer 2. Here, each inner metal pin 5a corresponds to the "inner conductor" of the present invention, and each outer metal pin 5b corresponds to the "outer conductor" of the present invention.

  The upper end surface of each inner metal pin 5a and each outer metal pin 5b is exposed from the upper surface of insulating layer 2, and the lower end surface of each inner metal pin 5a and each outer metal pin 5b is the lower surface of insulating layer 2. It is provided exposed from The metal pins 5a and 5b are formed of a metal material generally employed as a wiring electrode, such as Cu, Au, Ag, Al, or a Cu-based alloy. Moreover, in this embodiment, each metal pin 5a, 5b is formed in a cylindrical shape with substantially the same thickness and length. In this embodiment, the inner and outer metal pins 5a and 5b are formed in a cylindrical shape, but may be formed, for example, in a prismatic shape. In addition, those corresponding to the inner and outer metal pins 5a and 5b may be formed of columnar conductors such as via conductors.

  By the way, in coil components of this type, it is considered to increase the number of turns of the coil electrode to achieve high inductance while maintaining the size. Therefore, in this embodiment, the number of turns of the coil electrode 4 can be increased while maintaining the size of the coil core 3.

  In the case of the annular coil core 3, in order to maximize the number of turns of the coil electrode 4, the coil electrode 4 is wound around the entire circumference of the coil core 3. Here, in the coil electrode 4 of this embodiment, as shown in FIG. 2, the input wiring pattern 7a forming one end of the coil electrode 4 is formed on the upper surface of the insulating layer 2, and the output wiring pattern 7b forming the other end is insulating. By utilizing the formation on the lower surface of the layer 2, a part of the output wiring pattern 7b is disposed so as to overlap the input wiring pattern 7a in a plan view. In this case, it is not necessary to reduce the number of turns of the coil electrode 4 and to separate the two from each other in order to prevent the input wiring pattern 7a and the output wiring pattern 7b from shorting. That is, since the space in the circumferential direction of the coil core 3 can be effectively used, the number of turns of the coil electrode 4 can be easily increased.

  The other end of the input wiring pattern 7 a located on the outer peripheral side of the coil core 3 is connected to one end of the lead wiring 11 a, and is drawn out to the edge of the upper surface of the insulating layer 2. Further, the other end of the lead-out wiring 11 a is connected to the input electrode 8 a formed on the lower surface of the insulating layer 2 by the metal pin 5 c for connection (corresponding to “connection conductor” in the present invention). The metal pin 5c is provided to penetrate the insulating layer 2 at a position where the input wiring pattern 7a and the output wiring pattern 7b do not overlap in a plan view. In addition, you may use interlayer connection conductors, such as a via conductor, instead of the metal pin 5c.

  The other end of the output wiring pattern 7 b located on the outer peripheral side of the coil core 3 is connected to one end of the lead wiring 11 b, and is drawn out to the edge of the lower surface of the insulating layer 2. Further, the other end of the lead wire 11 b is connected to the output electrode 8 b formed on the lower surface of the insulating layer 2. Thus, in the present embodiment, as described above, by arranging the lead wirings 11a and the lead wirings 11b on both main surfaces of the insulating layer 2, the input wiring pattern 7a and the output wiring pattern 7b in a plan view It is possible to arrange so as to overlap.

  Further, in the present embodiment, the area where the output wiring pattern 7b and the input wiring pattern 7a overlap is formed both in the area overlapping with the coil core 3 in plan view and the area not overlapping with the coil core 3 in plan view. By doing this, the output and input wiring patterns 7a and 7b, and the winding portion 12 are disposed more on both the upper surface and the lower surface of the insulating layer 2 in a state where the dead space is reduced compared to the prior art. It becomes possible. That is, the number of turns of the coil electrode 4 can be increased.

  The area where the output wiring pattern 7b and the input wiring pattern 7a overlap does not necessarily have to be formed both in the area overlapping the coil core 3 in plan view and the area not overlapping the coil core 3 in plan view, You may form in the area | region which overlaps with the coil core 3 by planar view, and the area | region which does not overlap with the coil core 3 by planar view.

  In this embodiment, the input and output wiring patterns 7a and 7b, the input and output electrodes 8a and 8b, and the lead wirings 11a and 11b are all similar to the upper and lower wiring patterns 6a and 6b, respectively, with the base electrode 9 and the surface. And an electrode 10. And each upper side wiring pattern 6a, the input wiring pattern 7a, and the lead-out wiring 11a which are arrange | positioned on the upper surface of the insulating layer 2 are formed simultaneously. Further, the lower wiring patterns 6b, the output wiring patterns 7b, the lead wirings 11b, and the input and output electrodes 8a and 8b, which are disposed on the lower surface of the insulating layer 2, are simultaneously formed.

  In this embodiment, the input and output electrodes 8a and 8b are both provided on the lower surface of the insulating layer 2. However, both the electrodes 8a and 8b may be provided on the upper surface of the insulating layer 2. Absent. In this case, a metal pin or a via conductor provided through the insulating layer 2 may be used to connect the other end of the lead wiring 11b and the output electrode 8b. Then, the input wiring pattern 7a and the input electrode 8a may be directly connected by the lead wiring 11a.

(Method of manufacturing coil parts)
Next, an example of a method of manufacturing the coil component 1a will be briefly described.

  First, the metal pins 5a, 5b and 5c are arranged on one main surface of a flat transfer plate. In this case, the upper end surfaces of the metal pins 5a, 5b, 5c are fixed to one main surface of the transfer plate, and the metal pins 5a, 5b, 5c are fixed in a standing state. The metal pins 5a, 5b and 5c can be formed, for example, by shearing a metal wire (for example, Cu, Au, Ag, Al, Cu-based alloy) having a circular cross section.

  Next, a resin layer is formed on one main surface of the release layer-attached resin sheet (flat plate shape). In this case, the resin sheet, the release layer, and the resin layer are disposed in this order to form the resin layer in an uncured state.

  Next, after the transfer plate is reversely mounted on the resin sheet so that the lower end surfaces of the metal pins 5a, 5b, 5c abut on the resin layer, the resin of the resin layer is cured.

  Next, after peeling off the transfer plate, the coil core 3 is disposed at a predetermined position on the resin sheet, and the metal pins 5a, 5b and 5c and the coil core 3 are molded with epoxy resin, for example. Form

  Next, the resin sheet with release layer is peeled off, and the front and back surfaces of the insulating layer 2 are polished or ground. As a result, the upper end surfaces of the metal pins 5a, 5b, and 5c are exposed from the upper surface of the insulating layer 2, and the lower end surfaces are exposed from the lower surface of the insulating layer 2.

  Finally, the upper wiring pattern 6a, the input wiring pattern 7a and the lead wiring 11a are formed on the upper surface of the insulating layer 2, and the lower wiring pattern 6b, the output wiring pattern 7b, the lead wiring 11b and the input on the lower surface of the insulating layer 2 Then, the output electrodes 8a and 8b are formed to complete the coil component 1a. The upper and lower wiring patterns 6a and 6b, the input and output wiring patterns 7a and 7b, the lead wirings 11a and 11b, and the input and output electrodes 8a and 8b are each made of, for example, a conductive paste containing a metal such as Cu. Can be formed by screen printing. In addition, Cu plating may be performed on the wiring pattern formed of the conductive paste to form a two-layer structure. In addition, as another example of these forming methods, for example, one having a Cu foil attached to one main surface of a plate-like member is etched into a predetermined pattern shape (shape of upper or lower wiring patterns 6, 7) Process This plate-like member is separately prepared for the pattern formed on the upper surface of the insulating layer 2 and the pattern formed on the lower surface. In this case, the upper and lower wiring patterns 6a and 6b can be bonded to the upper end surface or the lower end surface of each metal pin 5a or 5b by ultrasonic bonding using the plate-like member.

  Therefore, according to the above-described embodiment, by arranging the output wiring pattern 7b of the coil electrode 4 so that a part thereof overlaps the input wiring pattern 7a in a plan view, the coil electrode 4 can be spaced from the coil core 3 in the circumferential direction. Can be wound without waste, so the number of turns of the coil electrode 4 can be increased while maintaining the size of the coil core 3.

  Further, since both the input electrode 8a and the output electrode 8b are formed on the lower surface of the insulating layer 2, the mountability of the coil component 1a to the outside can be improved.

  Also, in the case of forming via holes or through hole conductors that require the formation of through holes instead of each metal pin 5a, 5b, 5c, a predetermined distance between adjacent conductors is required to form independent through holes. There is a limit to narrowing the gap between adjacent conductors and increasing the number of turns of the coil electrode because it is necessary to make space. As in this embodiment, in the case of the metal pins 5a, 5b, 5c in which the through holes are not formed, it is easy to narrow the gaps between the adjacent metal pins 5a, 5b, 5c. To improve the coil characteristics (increase the inductance).

  In addition, since the metal pins 5a and 5b have lower specific resistance compared to a via conductor or a through hole conductor formed by filling a via hole with a conductive paste, the overall resistance of the coil electrode 4 can be lowered. . Therefore, for example, coil component 1a excellent in coil characteristics, such as Q value, can be provided.

Second Embodiment
A coil component 1 b according to a second embodiment of the present invention will be described with reference to FIGS. 4 and 5. 4 is a plan view of the coil component 1b, and FIG. 5 is a view for explaining the wiring patterns 6a, 6b, 7a, 7b. 5 (a) is a plan view of the coil component 1b with the lower wiring pattern 6b and the output wiring pattern 7b removed, and FIG. 5 (b) is a state with the upper wiring pattern 6a and the input wiring pattern 7a removed. It is a top view of coil component 1b.

  The coil component 1b according to this embodiment differs from the coil component 1a of the first embodiment described with reference to FIGS. 1 to 3 in the upper and lower wiring as shown in FIGS. 4 and 5, respectively. The shapes of the patterns 6a and 6b and the input and output wiring patterns 7a and 7b are different. The other configuration is the same as that of the coil component 1 b of the first embodiment, and thus the description will be omitted by giving the same reference numerals.

  In this case, the upper and lower wiring patterns 6a and 6b and the input and output wiring patterns 7a and 7b are formed in substantially the same shape. The upper wiring patterns 6a and the input wiring patterns 7a are arranged at equal intervals, and the lower wiring patterns 6b and the output wiring patterns 7b are also arranged at equal intervals (equal pitch). Furthermore, in this embodiment, the distance between the upper wiring patterns 6a and the distance between the lower wiring patterns 6b are designed to be substantially the same.

  Further, in a plan view, in a region sandwiched by an outer circle formed by arranging each outer metal pin 5b and an inner circle formed by arranging each inner metal pin 5a, As shown in FIG. 5A, except for a predetermined amount of gap between the upper wiring pattern 6a and the input wiring pattern 7a adjacent to each other, the region is substantially formed with the upper wiring pattern 6a and the input wiring pattern 7a. The circumferential widths of the upper wiring patterns 6a and the input wiring patterns 7a are increased. The same applies to each lower wiring pattern 6b and output wiring pattern 7b (see FIG. 5B).

  Here, as shown in FIG. 4, each upper wiring pattern 6 a is in plan view with the lower wiring pattern 6 b forming a pair and the lower wiring pattern 6 b adjacent to the predetermined side (counterclockwise direction) of the pair. In order to have an overlapping portion, they are arranged offset to the predetermined side in plan view with respect to the pair of lower wiring patterns 6b. In this embodiment, the upper wiring patterns 6a are arranged to be displaced in parallel in the circumferential direction (winding axis direction) with respect to the lower wiring patterns 6b forming a pair. Both the input wiring pattern 7a and the output wiring pattern 7b are arranged so as to have an overlapping portion in plan view.

  Each inner metal pin 5a is disposed at the overlapping portion of the upper wiring pattern 6a to be connected and the lower wiring pattern 6b forming a pair, and each outer metal pin 5b is connected to the upper wiring pattern to be connected 6a and a lower wiring pattern 6b which forms a pair with the lower wiring pattern 6b, which are arranged on the predetermined side and which overlap with the lower wiring pattern 6b adjacent in the counterclockwise direction.

  According to this embodiment, in addition to the effects exhibited by the coil component 1 a of the first embodiment, the following effects can be obtained. That is, since each upper wiring, lower wiring patterns 6a and 6b, and input and output wiring patterns 7a and 7b are formed in the same shape, the wiring resistances of the wiring patterns 6a, 6b, 7a and 7b are the same. Can be Therefore, local heat generation due to a change in wiring resistance in the coil electrode 4 can be reduced. In addition, it is possible to suppress an impedance mismatch between the upper wiring pattern 6a and the lower wiring pattern 6b to which the metal pins 5a and 5b are respectively connected. In addition, the above-mentioned "the same shape" includes the substantially the same shape from which a shape differs a little by manufacturing variation.

  Further, as described above, on the upper surface and the lower surface of the insulating layer 2, the outer circle formed by arranging the outer metal pins 5 b and the inner circle formed of the inner metal pins 5 a are formed. The wiring patterns 6a, 6b, 7a, 7b are formed in most of the region sandwiched by the inner circle. As described above, if the formation areas of the wiring patterns 6a, 6b, 7a, 7b are enlarged, for example, the heat radiation characteristics of heat generated when the coil electrode 4 is energized can be improved.

  The present invention is not limited to the above-described embodiments, and various modifications can be made other than those described above without departing from the scope of the invention. For example, the insulating layer 2 may be formed of, for example, a ceramic material.

  In addition, protective films may be provided on the upper and lower surfaces of the insulating layer 2 to protect the upper and lower wiring patterns 6 and 7. In this case, an epoxy resin, a polyimide resin, etc. are mentioned as a material which forms a protective film, for example.

  Furthermore, the present invention can be widely applied to various coil parts including an insulating layer in which an annular coil core is embedded and a coil electrode wound around the coil core.

1a, 1b Coil parts 2 Insulating layer 3 Coil core 4 Coil electrode 5a Inner metal pin (inner conductor)
5b Outer metal pin (outer conductor)
5c Metal pin (connection conductor)
6a Upper wiring pattern (first wiring pattern)
6b Lower side wiring pattern (second wiring pattern)
7a input wiring pattern 7b output wiring pattern 8a input electrode 8b output electrode 12 turns

Claims (4)

An insulating layer in which an annular coil core is embedded;
A coil electrode wound around the coil core;
An external connection input electrode connected to one end of the coil electrode;
And an output electrode for external connection connected to the other end of the coil electrode,
The coil electrode is
An input wiring pattern forming the one end of the coil electrode formed on one main surface of the insulating layer such that one end is arranged on the inner peripheral side of the coil core and the other end is arranged on the outer peripheral side of the coil core When,
An output wiring forming the other end of the coil electrode formed on the other main surface of the insulating layer such that one end is disposed on the inner peripheral side of the coil core and the other end is disposed on the outer peripheral side of the coil core. Have a pattern and
The output wiring pattern is disposed so that a part thereof overlaps the input wiring pattern in plan view ,
The area overlapping the input wiring pattern of the output wiring pattern is in all of the area on the inner peripheral side of the coil core of the output wiring pattern, the area on the outer peripheral side of the coil core, and the area overlapping the coil core in plan view Coil parts characterized by The input electrode and the output electrode are both formed on the one main surface of the insulating layer,
The output wiring pattern is connected to the output electrode by a connection conductor provided through the insulating layer at a position where the input wiring pattern and the output wiring pattern do not overlap in plan view. The coil component according to claim 1. The input electrode and the output electrode are both formed on the other main surface of the insulating layer,
The input wiring pattern is connected to the input electrode by a connection conductor provided through the insulating layer at a position where the input wiring pattern and the output wiring pattern do not overlap in plan view. The coil component according to claim 1. The coil electrode has a winding portion wound around the coil core between the input wiring pattern and the output wiring pattern,
The winding section is
A plurality of first wiring patterns disposed at one end on the inner peripheral side of the coil core and at the other end on the outer peripheral side of the coil core, and arranged in the circumferential direction of the coil core on one main surface of the insulating layer; ,
One end is disposed on the inner peripheral side of the coil core, and the other end is disposed on the outer peripheral side of the coil core, and the other main surface of the insulating layer is configured to form a plurality of pairs with each first wiring pattern. A plurality of second wiring patterns arranged in the circumferential direction of the coil core,
A plurality of inner conductors disposed on the inner circumferential side of the coil core and connecting one end of each of the first wiring patterns to one end of the second wiring pattern forming a pair with the first wiring pattern;
The other end of each of the first wiring patterns and the other end of the second wiring pattern adjacent to the second wiring pattern forming a pair with the first wiring pattern are disposed on the outer peripheral side of the coil core And a plurality of outer conductors connecting the
The coil component according to any one of claims 1 to 3, wherein each of the inner conductors and the outer conductors is formed of a metal pin.

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