JP2017204490A - Component mounting board, manufacturing method of component mounting board - Google Patents

Abstract

PROBLEM TO BE SOLVED: To allow for easy formation of a conductor pattern, different from a conductor to which a component is joined, while joining a component placed on the surface of a circuit board to a conductor of the inner layer of the circuit board.SOLUTION: A component mounting board 10 includes a circuit board 20 having the front side and back side, and a surface mounting component 30 having a terminal conductor 32 for mounting. The circuit board 20 is formed by laminating a first resin layer 211 having a conductor placed on one side, and multiple second resin layers 212-216 each having a conductor placed on one side. The side in the first resin layer 211 where a conductor is placed is the front surface of the circuit board 20. The first resin layer 211 includes a through hole 230 for exposing the mounting land, that is joined to the terminal conductor 32 for mounting on the second resin layer 212, to the surface of the circuit board 20. The conductor formed on the first resin layer 211 is a shield conductor 240.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a component mounting board including a circuit board and an electronic component mounted on the surface of the circuit board, and a method for manufacturing the component mounting board.

  Currently, many component mounting boards are used in electronic devices. The component mounting board includes a circuit board and an electronic component. A predetermined conductor pattern is formed on the circuit board. The electronic component is mounted on the circuit board.

  For example, as a circuit board, a wiring board described in Patent Document 1 is formed by alternately laminating a plurality of insulating layers and a plurality of wiring layers. In the uppermost insulating layer, an opening exposing a part of the uppermost wiring layer is formed. The electronic component is joined to the wiring layer exposed through the opening by solder or the like. With this configuration, the electronic component is mounted on the wiring board.

JP 2011-258590 A

  However, in the above-described wiring board of Patent Document 1, the conductor pattern (wiring layer) excluding the conductor to which the electronic component is bonded is provided on the surface of the wiring board (the surface on the opposite side of the uppermost wiring layer in the uppermost insulating layer). In the case of forming a wiring board, a new wiring layer must be added to the surface of the wiring board.

  Accordingly, an object of the present invention is to easily form a conductor pattern different from a conductor to which a component is bonded on the surface of the circuit board while bonding the component arranged on the surface of the circuit board to a conductor on the inner layer of the circuit board. It is to provide a component mounting board.

  The component mounting board of this invention includes a circuit board having a front surface and a back surface, and a surface mounting component having a mounting terminal conductor. The circuit board is formed by laminating a first resin layer having a conductor disposed on at least one side and at least one second resin layer having a conductor disposed on one side. The surface on which the conductor is disposed in the first resin layer includes the surface of the circuit board. The circuit board includes a mounting land portion formed at the interface between the first resin layer and the second resin layer and bonded to the mounting terminal conductor. The first resin layer includes a hole exposing the mounting land portion on the surface of the circuit board. The conductor formed in the first resin layer is a shield conductor.

  In this configuration, the shield conductor is disposed on the surface of the circuit board without separately preparing the circuit board.

  In the component mounting board of the present invention, the mounting terminal conductor and the mounting land portion may be bonded by ultrasonic bonding. Alternatively, the mounting terminal conductor and the mounting land portion may be joined by an anisotropic conductive film.

  In this configuration, the deformation of the first resin layer is suppressed by the hard shield conductor at the time of bonding in a bonding method involving pressurization such as bonding by ultrasonic bonding or anisotropic conductive film.

  In the component mounting board of the present invention, a built-in component may be disposed in the circuit board.

  In this configuration, the electromagnetic coupling between the built-in component and the outside is suppressed by the shield conductor.

  In the component mounting board of the present invention, the resin layer that forms the surface of the circuit board may be thinner than other resin layers that form the circuit board.

  In this configuration, the mounting terminal conductor of the mounting-type component and the mounting land conductor of the circuit board are bonded with a smaller amount of the bonding member.

  In the component mounting board of the present invention, it is preferable that the shield conductor is disposed so as to surround the surface mounting component in a plan view of the component mounting board.

  In this configuration, deformation of the resin layer at the time of ultrasonic bonding or anisotropic conductive film bonding, and electromagnetic coupling between the built-in component and the conductor in the circuit board and the outside are more reliably suppressed.

  In the component mounting board of the present invention, it is preferable that the shield conductor is disposed in the whole area except for the area where the surface mounting component is disposed in plan view of the component mounting board.

  In this configuration, even if the shield conductor is damaged, the influence on the electrical characteristics is small.

  In addition, the component mounting board of the present invention includes an auxiliary shield conductor made of a part of the conductor disposed in the first resin layer at a position overlapping the surface mounting component in plan view of the component mounting board. Also good.

  In this configuration, the deformation of the resin layer and the electromagnetic coupling between the conductor in the circuit board and the outside at the time of bonding by ultrasonic bonding or anisotropic conductive film are more reliably suppressed. Further, when the circuit board has a built-in component, the electromagnetic coupling between the built-in component and the outside is more reliably suppressed.

  In the component mounting board of the present invention, the shield conductor is preferably a grounding conductor.

  In this configuration, the electromagnetic coupling between the conductor in the circuit board and the outside is more reliably suppressed. Further, when the circuit board has a built-in component, the electromagnetic coupling between the built-in component and the outside is more reliably suppressed.

  Moreover, the manufacturing method of the component mounting board | substrate of this invention has the following structure. This method for manufacturing a component mounting board includes a step of forming a shield conductor by performing a conductor patterning process on a first resin sheet having a conductor attached to one side. This method for manufacturing a component mounting board includes a step of forming a conductor pattern by performing a conductor patterning process on a second resin sheet having a conductor attached to one side. This method for manufacturing a component mounting board includes a step of forming a through hole in the first resin sheet. In this method of manufacturing a component mounting board, the first resin sheet is used as the outermost layer, and the first resin sheet and the second resin sheet are laminated so that the through hole and a part of the conductor pattern overlap each other. Forming a substrate. This method of manufacturing a component mounting board includes a step of bonding a mounting terminal conductor and a part of a conductor pattern by ultrasonic bonding.

  In this manufacturing method, the circuit board having the shield conductor disposed on the surface is manufactured by a simpler process than the conventional manufacturing method.

  According to the present invention, a conductor pattern different from a conductor to which an electronic component is bonded can be easily formed on the surface of the circuit board while bonding the electronic component disposed on the surface of the circuit board to the conductor on the inner layer of the circuit board. . Further, since the different conductor pattern is a shield conductor, unnecessary electromagnetic coupling between the circuit element in the circuit board and the outside is suppressed.

(A) is a side view which shows the structure of the component mounting board which concerns on the 1st Embodiment of this invention, (B) is a top view of the component mounting board which concerns on the 1st Embodiment of this invention. . It is an exploded side view showing the composition of the component mounting board concerning a 1st embodiment of the present invention. It is a flowchart which shows the manufacturing method of the component mounting board | substrate which concerns on the 1st Embodiment of this invention. It is a side view which shows the structure of the component mounting board which concerns on the 2nd Embodiment of this invention. (A) is a side view which shows the structure of the component mounting board | substrate which concerns on the 3rd Embodiment of this invention, (B) is a top view of the component mounting board which concerns on the 3rd Embodiment of this invention. . It is a disassembled side view which shows the derivative example of the component mounting board | substrate which concerns on embodiment of this invention.

  The configuration of the component mounting board and the method for manufacturing the component mounting board according to the first embodiment of the present invention will be described with reference to the drawings. FIG. 1A is a side view showing the configuration of the component mounting board according to the first embodiment of the present invention, and FIG. 1B shows the component mounting board according to the first embodiment of the present invention. It is a top view. FIG. 2 is an exploded side view showing the configuration of the component mounting board according to the first embodiment of the present invention. In FIGS. 1A and 2, the conductors in the circuit board are also indicated by solid lines in order to clarify the structure of the component mounting board.

  As shown in FIGS. 1A and 1B, the component mounting board 10 includes a circuit board 20 and a surface mounting component 30. The surface mount component 30 is an electronic component such as an IC, for example. The surface mounting component 30 includes a component main body 31 and a plurality of mounting terminal conductors 32. The plurality of mounting terminal conductors 32 are provided on the bottom surface of the component main body 31. The plurality of mounting terminal conductors 32 are respectively joined to the conductor pattern 221 disposed inside the circuit board 20 via the joining member 400. The joining member 400 is, for example, solder, an anisotropic conductive film, or the like. With this configuration, the surface mount component 30 is mounted on the surface of the circuit board 20. The specific structure of this joined portion will be described later.

  As shown in FIG. 2, the circuit board 20 includes a multilayer body 21, a plurality of conductor patterns 221, a plurality of interlayer connection conductors 222, a plurality of external connection conductors 223, and a shield conductor 240. The laminate 21 includes a plurality of resin layers 211, 212, 213, 214, 215, and 216 (211 to 216). Each of the plurality of resin layers 211 to 216 has a first main surface and a second main surface that face each other. The plurality of resin layers 211 to 216 are made of a thermoplastic resin and include, for example, a liquid crystal polymer as a main component. In the plurality of resin layers 211 to 216, a conductor made of, for example, a metal foil is disposed on each one surface (first main surface). The conductor is, for example, copper (Cu). That is, the plurality of resin layers 211 to 216 are formed of a so-called single-sided resin sheet. The resin layer 211 corresponds to the “first resin layer” of the present invention, and the resin layers 212, 213, 214, 215, and 216 correspond to the “second resin layer” of the present invention.

  A plurality of through holes 230 are formed in the resin layer 211. The plurality of through holes 230 are formed in accordance with the arrangement pattern of the plurality of mounting terminal conductors 32 of the surface mount component 30. A shield conductor 240 is formed on the first main surface of the resin layer 211, that is, on the surface of the multilayer body 21. As shown in FIG. 1B, the shield conductor 240 surrounds the surface-mounted component 30 in a plan view of the component-mounted substrate 10, that is, surrounds the region where the surface-mounted component 30 is disposed, It is arranged in the whole area excluding the area where the mounting component 30 is arranged. The shield conductor 240 is a conductor that is not connected to other circuit elements or wirings in the circuit board 20. Therefore, the interlayer connection conductor connected to the shield conductor 240 is not provided in the resin layer 211. The shield conductor 240 is formed in a planar shape. Thereby, even if the shield conductor 240 is damaged, the influence on the electrical characteristics is small.

  A plurality of conductor patterns 221 are formed on the first main surface of the resin layers 212, 213, 214, and 215. In addition to the wiring conductor, the conductor pattern 221 may include, for example, a pad conductor, an inductor pattern, a capacitor pattern, or a ground pattern. The resin layers 212, 213, and 214 are laminated so that the upper surface side in FIG. 1 is the first main surface, and the resin layer 215 is stacked so that the lower surface side in FIG. 1 is the first main surface. Further, an interlayer connection conductor 222 is provided on the resin layers 212, 213, 214, and 215 as necessary. However, the interlayer connection conductor 222 is not necessarily provided in all the resin layers 212, 213, 214, and 215.

  A plurality of external connection conductors 223 are formed on the first main surface of the resin layer 216. The resin layer 216 is laminated so that the lower surface side in FIG. 1 is the first main surface. Although not shown, an interlayer connection conductor may be formed on the resin layer 216.

  The resin layers 211 to 216 are laminated so that their main surfaces come into contact with each other. Specifically, the second main surface of the resin layer 211 is in contact with the first main surface of the resin layer 212, and the second main surface of the resin layer 212 is in contact with the first main surface of the resin layer 213. The second main surface of the resin layer 213 is in contact with the first main surface of the resin layer 214. The second main surface of the resin layer 214 is in contact with the second main surface of the resin layer 215. The first main surface of the resin layer 215 is in contact with the second main surface of the resin layer 216.

  With this configuration, the first main surface of the resin layer 211 becomes the surface of the stacked body 21, that is, the surface of the circuit board 20. The first main surface of the resin layer 216 is the back surface of the multilayer body 21, that is, the back surface of the circuit board 20. With such a configuration, the shield conductor 240 is disposed on the surface of the circuit board 20.

  A part of the conductor pattern 221 of the resin layer 212 overlaps the region opened by the through hole 230 of the resin layer 211. With this configuration, a part of the conductor pattern 221 in the circuit board 20 is exposed on the surface of the circuit board 20. In other words, a part of the conductor pattern 221 disposed at the interface between the resin layer 211 and the resin layer 212 is exposed on the surface of the circuit board 20.

  The joining member 400 is disposed in the through hole 230 and joins a part of the conductor pattern 221 exposed through the through hole 230 and the mounting terminal conductor 32. With this configuration, it is possible to prevent the joining member 400 from flowing and causing a short circuit between the plurality of mounting terminal conductors 32. Note that the mounting terminal conductor 32 and a part of the conductor pattern 221 may be ultrasonically bonded by metal bumps provided on the mounting terminal conductor 32 instead of the bonding member 400.

  By using the above configuration, the surface mount component 30 arranged on the surface of the circuit board 20 is joined to the conductor pattern 221 on the inner layer of the circuit board 20, and the shield conductor 240 different from the conductor pattern 221 is attached to the circuit board 20. It can be easily formed on the surface.

  Further, by providing the shield conductor 240, even if the circuit element is formed by the conductor pattern 221 and the interlayer connection conductor 222 in the circuit board 20, it is possible to suppress the circuit element from being electromagnetically coupled to the outside.

  In addition, when a part of the conductor pattern 221 and the mounting terminal conductor 32 are joined by joining with pressure such as ultrasonic joining or joining with an anisotropic conductive film, the shield conductor 240 harder than the resin layer is used. Thus, deformation of the resin layer 211 is suppressed. Thereby, a part of conductor pattern 221 and the terminal conductor 32 for mounting can be joined reliably.

  In addition, the thickness of the resin layers 211-216 may be the same or different. Preferably, the resin layer 211 is thinner than the resin layers 212-216. Thereby, the distance between the part of the conductor pattern 221 exposed by the through hole 230 and the mounting terminal conductor 32 is shortened, and the joining by the joining member 400 becomes more reliable. Moreover, the shield conductor 240 becomes relatively thick with respect to the resin layer 211, and the deformation | transformation at the time of joining is further suppressed.

  The component mounting board 10 of this embodiment is manufactured by the flow shown in FIG. FIG. 3 is a flowchart showing the method for manufacturing the component mounting board according to the first embodiment of the present invention.

  First, as a previous stage, a plurality of single-sided copper-attached resin sheets are prepared. The plurality of resin sheets include a first resin sheet and a plurality of second resin sheets. The first resin sheet becomes the resin layer 211, and the plurality of second resin sheets become the resin layers 212-216, respectively.

  The shield conductor 240 is formed by performing a patterning process on the first resin sheet with the single-sided copper (S101).

  A plurality of through holes 230 are formed in the first resin sheet (S102).

  By performing a patterning process on the plurality of second resin sheets bonded with copper on one side, the conductor pattern 221 or the external connection conductor 223 is formed on each predetermined second resin sheet (S103).

  An interlayer connection through hole is formed in a predetermined second resin sheet of the plurality of second resin sheets (S104). A conductive paste is filled into the through holes for interlayer connection (S105).

  The patterning process for the first resin sheet and the patterning process for the second resin sheet may be performed simultaneously.

  The first resin sheet and the plurality of second resin sheets are laminated with the first resin sheet as the outermost layer so that the shield conductor 240 is on the surface (S106). The laminate is heated and pressed to form the circuit board 20 (S107).

  The joining member 400 is disposed in the through hole 230 of the first resin sheet (S108). A part of the conductor pattern 221 exposed by the through hole 230 in the circuit board 20 and the mounting terminal conductor 32 in the surface-mounted component 30 are bonded via the bonding member (S109). The joining member 400 may be disposed on the mounting terminal conductor 32 of the surface mount component 30 instead of being disposed in the through hole 230 of the first resin sheet. Further, without providing the joining member 400, a metal bump may be provided on the mounting terminal conductor 32 of the surface mount component 30, and the mounting terminal conductor 32 and the conductor pattern 221 may be ultrasonically joined.

  By using such a manufacturing method, the surface mounting component 30 arranged on the surface of the circuit board 20 is joined to the conductor pattern 221 on the inner layer of the circuit board 20, and the shield conductor 240 different from the conductor pattern 221 is connected to the circuit board. It can be easily formed on 20 surfaces. At this time, even when bonding such as ultrasonic bonding or bonding with an anisotropic conductive film is performed, deformation on the surface side of the circuit board 20 can be suppressed by the shield conductor 240, and bonding reliability is improved. To do.

  Next, a component mounting board according to a second embodiment will be described with reference to the drawings. FIG. 4 is a side view showing the configuration of the component mounting board according to the second embodiment of the present invention.

  As shown in FIG. 4, the component mounting board 10A according to the present embodiment is different from the component mounting board 10 according to the first embodiment in that a built-in component 40 is provided. The other configuration of the component mounting board 10A is the same as that of the component mounting board 10, and the description of the same portion is omitted.

  The built-in component 40 includes a component main body 41 and a plurality of mounting terminal conductors 42. The plurality of mounting terminal conductors 42 are formed on the back surface of the component main body 41. The built-in component 40 is built in the circuit board 20. The plurality of mounting terminal conductors 42 are in contact with the interlayer connection conductor 222, and are connected to the conductor pattern 221 in the circuit board 20 via the interlayer connection conductor 222.

  Even if it is such a structure, the effect similar to 1st Embodiment can be acquired. Further, by using the configuration of the present embodiment, the shield conductor 240 can suppress electromagnetic coupling between the built-in component 40 and the outside.

  Further, as shown in FIG. 4, when the component mounting board 10 </ b> A is viewed in plan, a part of the conductor pattern 221 exposed through the through hole 230 and the joint between the mounting terminal conductor 32 and the built-in component 40 overlap. For example, the efficiency of ultrasonic bonding in the case of performing bonding by ultrasonic bonding is improved, and ultrasonic bonding is more reliably performed.

  Next, a component mounting board according to a third embodiment will be described with reference to the drawings. FIG. 5A is a side view showing the configuration of the component mounting board according to the third embodiment of the present invention. FIG. 5B is a plan view of a component mounting board according to the third embodiment of the present invention.

  As shown in FIGS. 5A and 5B, the component mounting board 10B according to the present embodiment includes an auxiliary shield conductor 241 with respect to the component mounting board 10 according to the first embodiment. It is different. The other configuration of the component mounting board 10B is the same as that of the component mounting board 10, and the description of the same portion is omitted.

  The auxiliary shield conductor 241 is disposed on the surface of the circuit board 20. The auxiliary shield conductor 241 overlaps the surface-mounted component 30 in plan view of the component mounting board 10B. In other words, the auxiliary shield conductor 241 is disposed on the opposite side of the shield conductor 240 with respect to the mounting terminal conductor 32. The auxiliary shield conductor 241 is provided at a position avoiding the mounting terminal conductor 32 in a region overlapping the surface-mounted component 30 in plan view of the component mounting board 10B.

  The auxiliary shield conductor 241 is realized by patterning the conductor on one side of the first resin sheet that becomes the resin layer 211, as with the shield conductor 240.

  By using such a configuration, the electromagnetic coupling between the conductor pattern 221 in the circuit board 20 and the outside can be further suppressed, and the joining can be further ensured.

  The configuration of the component mounting board 10B can also be applied to the component mounting board 10A in the second embodiment.

  Further, the shield conductor 240 or the auxiliary shield conductor 241 shown in each of the above embodiments may be a grounding conductor. For example, the ground potential is obtained by connecting an external circuit element (not shown) having the ground potential to at least one of the shield conductor 240 and the auxiliary shield conductor 241. Thereby, it is possible to further reliably suppress the electromagnetic coupling between the conductor pattern inside the circuit board or the built-in component and the outside.

  Further, in each of the above-described embodiments, the aspect in which all the resin layers constituting the circuit board are made of a conductor disposed on one side (for example, one-sided copper attached) is shown. However, as a derivative example of the component mounting board, the first resin layer constituting the surface of the circuit board may be one in which conductors are arranged on both sides (for example, one with double-sided copper bonding). FIG. 6 is an exploded side view showing a derivative example of the component mounting board according to the embodiment of the present invention.

  As shown in FIG. 6, the circuit board 20 </ b> C of the component mounting board is different from the circuit board 20 according to the first embodiment in that a resin layer 211 </ b> C having conductors arranged on both surfaces is provided. The basic configuration of the circuit board 20 </ b> C is the same as that of the circuit board 20 according to the first embodiment, although there are differences in detailed portions such as the front and back of the resin layer. Therefore, only the part related to the resin layer 211C will be specifically described.

  The resin layer 211C corresponds to the “first resin layer” of the present invention, and has a first main surface and a second main surface. A shield conductor 240 is formed on the first main surface of the resin layer 211C. The first main surface of the resin layer 211C is the surface of the circuit board 20C (laminated body 21C). A conductor pattern 221 is formed on the second main surface of the resin layer 211C.

  A plurality of through holes 230 are formed in the resin layer 211C. The plurality of through holes 230 overlap a part of the conductor pattern 221 on the second main surface. The portion where the conductor pattern 221 is exposed by these through holes 230 corresponds to the “mounting land portion” of the present invention.

  As described above, even when the resin layer 211C serving as the surface of the circuit board 20C has the conductors disposed on both sides, the same effects as those of the above-described embodiment can be obtained.

  In this case, what is necessary is just to manufacture using the process shown next. A patterning process is performed on the first resin sheet on which the double-sided copper is adhered. Thereby, the shield conductor 240 is formed on the first main surface of the first resin sheet, and the conductor pattern 221 is formed on the second main surface. Next, a plurality of through holes 230 are formed in the first resin sheet so as to overlap a part of the conductor pattern 221. The following steps are the same as those in the first embodiment, and a description thereof will be omitted.

10, 10A, 10B: Component mounting substrate 20, 20C: Circuit board 21, 21C: Laminate 30: Surface mount component 31: Component main body 32: Mounting terminal conductor 40: Built-in component 41: Component main body 42: Mounting terminal conductor 211-216, 211C: Resin layer 221: Conductor pattern 222: Interlayer connection conductor 223: External connection conductor 230: Through hole 240: Shield conductor 241: Auxiliary shield conductor

Claims (9)

A circuit board having a front surface and a back surface;
A surface mounting component having a mounting terminal conductor,
The circuit board is
A first resin layer having a conductor disposed on at least one side and at least one second resin layer having a conductor disposed on one side are laminated,
The surface on which the conductor in the first resin layer is disposed includes the surface of the circuit board,
A mounting land portion formed at an interface between the first resin layer and the second resin layer and bonded to the mounting terminal conductor;
The first resin layer includes a hole exposing the mounting land portion on the surface of the circuit board,
The conductor formed in the first resin layer is a shield conductor.
Component mounting board. The mounting terminal conductor and the mounting land portion are bonded by ultrasonic bonding, or bonded by an anisotropic conductive film,
The component mounting board according to claim 1. Built-in components are arranged in the circuit board,
The component mounting board according to claim 2. The resin layer forming the surface of the circuit board is thinner than other resin layers forming the circuit board,
The component mounting board according to claim 1. The shield conductor is disposed so as to surround the surface-mounted component in a plan view of the component-mounted substrate.
The component mounting board according to claim 1. The shield conductor is disposed in the whole area except for a region where the surface-mounted component is disposed in a plan view of the component mounting board.
The component mounting board according to claim 1. The component mounting board is provided with an auxiliary shield conductor made of a part of the conductor disposed in the first resin layer at a position overlapping the surface mounting component in plan view.
The component mounting board according to claim 1. The shield conductor is a grounding conductor,
The component mounting board according to claim 1. A step of forming a shield conductor by performing a conductor patterning process on the first resin sheet having a conductor attached to at least one side;
A step of forming a conductor pattern by performing a conductor patterning process on one or more second resin sheets having a conductor attached to one side; and
Forming a through hole in the first resin sheet;
The first resin sheet is the outermost layer, and the first hole is overlapped with a part of the conductor pattern formed at the interface between the through hole, the first resin sheet, and the second resin sheet. Laminating a resin sheet and the second resin sheet to form a circuit board;
Bonding a terminal conductor for mounting a surface-mounted component to a part of the conductor pattern;
A method for manufacturing a component mounting board.

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