JP2014038884A - Electronic component and method for manufacturing electronic component - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an electronic component which is compact and excellent in inductance characteristics, and to provide a method for manufacturing the electronic component.SOLUTION: An electronic component 1 includes: an insulating substrate 2 in which a plurality of insulating layers L1 to L3 are laminated; a magnetic substance 4 arranged in the insulating substrate 2; and coil patterns 5a and 5b formed in the insulating substrate 2 such that the magnetic substance 4 is wound. Inter-layer connection conductors forming the coil patterns 5a and 5b are formed of columnar conductors 6a1, 6a2, 6b1 and 6b2 such that the columnar conductors 6a1, 6a2, 6b1 and 6b2 are more adjacently arranged than the case that the inter-layer connection conductors are formed of hollow through-holes just like a conventional electronic component having an inductor element. Therefore, it is possible to increase the number of winding of the coil patterns to be wound around the magnetic substance 4. Thus, it is possible to provide a compact electronic component 1 which is excellent in inductance characteristics.

Description

The present invention relates to an electronic component in which a coil pattern wound around a magnetic body embedded in a multilayer substrate is formed on an insulating substrate, and a method for manufacturing the electronic component.

  Conventionally, an endless magnetic layer 102 is formed on a printed wiring board 101, and a coil pattern 103 is wound around the endless magnetic layer 102, as an example of an electronic component including an inductor element shown in FIG. There is known an electronic component 100 in which is formed (Patent Document 1).

  In this case, the endless magnetic layer 102 is embedded in the printed wiring board 101, and the coil pattern 103 that winds the endless magnetic layer 102 is formed on the front and back surfaces of the printed wiring board 101. And a plurality of through-holes 105 that connect the ends of the corresponding linear conductor patterns 104 on the front and back surfaces. With this configuration, the magnetic path of the magnetic lines of force generated by the electronic component 100 is a closed magnetic path, and thus the electronic component 100 capable of obtaining a large inductance value can be provided.

JP 2000-40620 (see paragraph 0018, FIG. 1, etc.)

  By the way, in recent years, there is an increasing demand for further miniaturization and higher performance of electronic components including such inductor elements. Therefore, it is conceivable to increase the inductance value generated by the electronic component 100 by increasing the number of turns of the coil pattern 103 around which the endless magnetic layer 102 is wound. Since the conductor connecting the end portions of the conductor pattern 104 is formed by the through holes 105, a predetermined amount of gap is formed between the adjacent through holes 105 so that the adjacent through holes 105 do not overlap each other. It is necessary to provide. Therefore, the number of through-holes 105 that can be formed in a limited space is limited, and it has been difficult to simultaneously realize downsizing and high performance of the electronic component 100.

  The present invention has been made in view of the above problems, and an object of the present invention is to provide a small electronic component having excellent inductance characteristics and a method for manufacturing the electronic component.

  In order to achieve the above object, an electronic component of the present invention includes an insulating substrate, a magnetic body disposed in the insulating substrate, and a coil pattern formed on the insulating substrate so as to wind the magnetic body. The coil pattern is formed on one side of the magnetic body in the length direction of the columnar conductor, and a plurality of columnar conductors embedded in the insulating substrate and standing around the magnetic body, A plurality of one-side wiring electrodes connecting the corresponding one ends of the columnar conductors, and the other ends corresponding to the columnar conductors are formed on the other side of the magnetic body in the stacking direction of the insulating layers. A plurality of other side wiring electrodes to be connected, and the magnetic body is spirally wound by the one side wiring electrodes and the other side wiring electrodes that connect the columnar conductors and the columnar conductors in series. Being done It is characterized in.

  By configuring in this way, a coil pattern can be formed without providing a through hole, so there is no need to provide a gap between adjacent through holes as in conventional electronic components, and the columnar conductors are arranged close to each other. can do. Therefore, by increasing the number of columnar conductors arranged around the magnetic body, the number of coil patterns wound around the magnetic body can be increased, and thus a small electronic component capable of obtaining a large inductance value is provided. be able to.

  In addition, since the columnar conductor can have a lower specific resistance than a through hole, the direct current resistance as a coil pattern is lowered, and the inductance characteristics of the electronic component can be improved.

  And an insulating substrate in which a plurality of insulating layers are laminated, a magnetic body disposed in the insulating substrate, and a coil pattern formed on the insulating substrate so as to wind the magnetic body, The coil pattern includes a plurality of columnar conductors embedded in the insulating substrate and erected around the magnetic body, and a plurality of the insulating layers positioned on one side of the magnetic body in the length direction of the columnar conductors. Formed on at least two of the plurality of one-sided wiring electrodes formed on at least two of the layers and the plurality of insulating layers located on the other side of the magnetic body in the lengthwise direction of the columnar conductors A plurality of other wiring electrodes, and each of the columnar conductors includes ones having different lengths, and one set of the columnar conductors adjacent to each other across the magnetic body is one of the one Side wiring electrode and one Alternatively, the other side wiring electrodes are connected in series and wound around the magnetic body in a predetermined coil diameter, and the other sets of the columnar conductors are connected to the other one side wiring electrodes, and It may be configured to be formed in a spiral pattern by being connected in series by one or other of the other wiring electrodes and wound around the magnetic body to a coil diameter different from the predetermined coil diameter.

  With this configuration, a part of the wiring electrodes can be formed in different insulating layers in each one-side wiring electrode and each other-side wiring electrode, so that the number of wiring electrodes formed on the insulating substrate can be increased. . Therefore, the number of coil patterns wound around the magnetic body can be increased, and the inductance value generated by the electronic component can be increased.

  Further, since the length of the entire coil pattern can be adjusted by adjusting the number of wiring electrodes formed on the insulating substrate, an electronic component having a desired inductance value can be easily obtained.

  The magnetic body has an annular shape, and the columnar conductor includes a plurality of inner columnar conductors disposed in a region surrounded by an inner peripheral surface of the annular magnetic body, and the annular magnetic body. A plurality of outer columnar conductors disposed outside the outer peripheral surface of the outer peripheral surface, and the annular magnetic body may be spirally wound along the circumferential direction by the coil pattern.

  With this configuration, the magnetic path of the magnetic force lines generated by the electronic component becomes a closed magnetic path, so that the inductance value generated by the electronic component can be increased.

  In addition, as compared with a conventional module in which a through hole is formed, a larger number of inner columnar conductors can be arranged in a region surrounded by an inner peripheral surface of an annular magnetic body, so that the magnetic body is wound. The number of turns of the coil pattern can be increased, and thereby the value of inductance generated by the electronic component can be increased.

  Each columnar conductor is preferably coated with an insulating material on the outer surface of the pin material. With this configuration, the inductance value is not reduced even if the columnar conductors are arranged in contact with each other, and therefore, the number of turns of the coil pattern around which the magnetic material is wound can be increased.

  The magnetic body may be made of ferrite. By comprising in this way, it can apply to the electronic component in which the magnetic body of this invention was formed with the ferrite.

  The insulating substrate may be a resin substrate. With this configuration, the magnetic body and the coil pattern (or a part thereof) disposed in the insulating substrate are protected by the resin, so that an electronic component with high environmental reliability can be provided.

  A plurality of the magnetic bodies may be arranged in the insulating substrate. With this configuration, a plurality of inductor elements can be formed on the insulating substrate, and various functions can be formed by the plurality of inductor elements in the electronic component. Further, by combining a plurality of inductor elements, it is possible to easily adjust the inductance value in the electronic component.

  The insulating substrate has a storage space for arranging the magnetic body therein, and there is a gap between at least the outer surface of the magnetic body and the wall surface of the insulating substrate that appears in the storage space. The storage space may be formed so that it is possible.

  In the electronic component including the above-described conventional inductor element, the endless magnetic layer is disposed so as to be in contact with the inside of the printed wiring board, so that the printed wiring board is easily subjected to pressure due to shrinkage of the printed wiring board. This pressure is considered to be an obstacle to increasing the inductance value. The inventor of the present invention provides a gap between the outer surface of the magnetic body and the wall surface of the insulating substrate that appears in the storage space, and suppresses the pressure that the magnetic body receives from the insulating substrate. It has been experimentally confirmed that an inductance value can be obtained, and it has been found that providing such a gap is effective in obtaining a high inductance value.

  In order to achieve the above-described object, an electronic component manufacturing method according to the present invention includes a magnetic body and a plurality of columnar conductors, each of which forms a coil pattern erected around the magnetic body, as an insulating layer. An embedding step for embedding, a polishing / grinding step for polishing or grinding both main surfaces of the insulating layer so that both end faces of each columnar conductor are exposed, and the columnar conductor exposed by forming the coil pattern, respectively. A plurality of one-side wiring electrodes for connecting the one end surfaces of the first and second electrode electrodes, and an electrode forming step for forming a plurality of other-side wiring electrodes for connecting the other end surfaces of the exposed columnar conductors on the insulating layer. It is said.

  By comprising in this way, the electronic component by which the conductor which connects each one side wiring electrode and each other side wiring electrode was formed with each columnar conductor can be manufactured easily.

  Further, the embedding step includes a step of disposing the magnetic body and the columnar conductors in the insulating layer having a plurality of positioning recesses for disposing the magnetic body and the columnar conductors at predetermined positions. You may have.

  By comprising in this way, each columnar conductor can be easily embed | buried in the state stood in the insulating layer.

  In addition, the electrode forming step includes the one side wiring electrode, a first resin sheet on which a plurality of via conductors connected to the one side wiring electrode are formed, the other side wiring electrode, Preparing a second resin sheet on which a plurality of via conductors connected to the other side wiring electrode are formed, laminating the first resin sheet on one main surface of the insulating layer, and the second resin sheet You may make it carry out by laminating | stacking on the other main surface of an insulating layer.

  By comprising in this way, each one side wiring electrode and each other side wiring electrode can be easily formed in both the main surfaces of an insulating layer.

  According to the present invention, a plurality of one-side wiring electrodes formed on one side of the magnetic body in the length direction of the columnar conductor and a plurality of other sides formed on the other side of the magnetic body in the length direction of the columnar conductor. By forming the conductor connecting the wiring electrode with a columnar conductor, the columnar conductors can be arranged close to each other as compared with a conventional electronic component in which the conductor is formed with a through hole. Therefore, by increasing the number of columnar conductors arranged around the magnetic body, the number of turns of the coil pattern wound around the magnetic body can be increased, thereby providing a small electronic component with excellent inductance characteristics. can do.

1 is a plan view of an electronic component according to a first embodiment of the present invention. FIG. 2 is a cut front view of the electronic component of FIG. 1. It is a principal part perspective view of the electronic component of FIG. It is a figure for demonstrating the manufacturing method of the electronic component of FIG. It is a figure for demonstrating the manufacturing method of the electronic component of FIG. It is a figure for demonstrating the manufacturing method of the electronic component of FIG. It is a disassembled cut front view of the electronic component concerning 2nd Embodiment of this invention. It is a perspective view of the conventional electronic component.

(First embodiment)
(Configuration of electronic parts)
An electronic component 1 according to a first embodiment of the present invention will be described with reference to FIGS. 1 is a plan view of the electronic component 1, FIG. 2 is a cut front view of the electronic component 1, and FIG. 3 is a view showing a magnetic body and a coil pattern that are the main parts of the electronic component 1.

  An electronic component 1 according to this embodiment is an electronic component in which an inductor element is formed on an insulating substrate 2, and as shown in FIGS. 1 and 2, an insulating substrate 2 in which a plurality of insulating layers L1 to L3 are laminated. And an annular magnetic body 4 disposed in the insulating substrate 2, and two coil patterns 5a and 5b formed on the insulating substrate 2 so as to wind the magnetic body 4, respectively. It is mounted on an electronic device such as a mobile phone that uses a high frequency. In this embodiment, a choke coil is formed on the insulating substrate 2 as an example of an inductor element. Further, both ends of each of the coil patterns 5a and 5b are connected to the external electrode 9 for connection to the outside formed on the insulating substrate 2.

  As shown in FIG. 2, the insulating substrate 2 is formed by laminating a plurality of insulating layers (three layers in this embodiment) L1, L2, and L3. The insulating layer L2 constituting the insulating substrate 2 is, for example, It is made of glass epoxy resin. Further, the insulating layer L3 positioned on the upper side (corresponding to one side in the present invention) of the magnetic body 4 in the stacking direction of the insulating layers L1 to L3, and the insulating layer positioned on the lower side (corresponding to the other side in the present invention). Each of the layers L1 is a resin sheet formed of, for example, an epoxy resin. Note that the number of insulating layers L1, L2, and L3 may be four or more. The insulating layer L2 may be formed of, for example, low temperature co-fired ceramic (LTCC) or glass. Further, the insulating layer L2 may have a multilayer structure including a plurality of layers.

  As shown in FIGS. 1 and 2, a magnetic body 4 made of, for example, Ni—Zn—Fe-based or Mn—Zn—Fe-based ferrite is disposed in the insulating substrate 2. Note that the shape of the magnetic body 4 is not limited to an annular shape, and may be, for example, a square shape, a U shape, a U shape, a rectangular parallelepiped shape, or a cylindrical shape in plan view. There may be a plurality of magnetic bodies 4 stored in the insulating substrate 2.

  As shown in FIGS. 2 and 3, each coil pattern 5a, 5b includes a plurality of columnar conductors 6a1, 6a2, 6b1, and 6b2, and columnar conductors 6a1, 6a2, 6b1, and 6b2. A plurality of upper layers that are formed on the insulating layer L3 located on the upper side of the magnetic body 4 in the longitudinal direction and connect corresponding upper ends (corresponding to one end in the present invention) of the columnar conductors 6a1, 6a2, 6b1, and 6b2. Side wiring electrodes (corresponding to one side wiring electrode in the present invention) 7a1 and 7b1, and columnar conductors 6a1, 6a2, 6b1 and 6b2 are formed on the insulating layer L1 located below the magnetic body 4 in the length direction, A plurality of lower layer side arrangements connecting the corresponding lower ends (corresponding to the other end in the present invention) of the columnar conductors 6a1, 6a2 and 6b1 and 6b2 Electrodes (corresponding to the other side wiring electrode in the present invention) is formed in a 7a2 and 7b2.

  In addition, since each coil pattern 5a, 5b is the respectively same structure, below, the coil pattern a is demonstrated to an example by attaching | subjecting a corresponding code | symbol.

  Each of the columnar conductors 6a1 and 6a2 forming the coil pattern 5a includes a plurality of inner columnar conductors 6a1 disposed in a region surrounded by the inner peripheral surface of the annular magnetic body 4 and a plurality of outer columnar conductors. The outer columnar conductor 6a2. In this case, for example, as shown in FIG. 2, one of the inner columnar conductors 6a1 includes a via conductor 8c formed in the upper insulating layer L3 and a via conductor 8a formed in the lower insulating layer L1. And the pin-shaped conductor 8b made of a metal wire such as Cu formed on the insulating layer L2 in which the magnetic body 4 is disposed, and each via conductor 8a, 8c and the pin-shaped conductor 8b are connected to form one inner columnar shape. Conductor 6a1 is formed.

  In addition, for example, one outer columnar conductor 6a2 includes an via conductor 8i formed in the upper insulating layer L3, an via conductor 8g formed in the lower insulating layer L1, and an insulating member in which the magnetic body 4 is disposed. A pin-shaped conductor 8h made of a metal wire such as Cu formed on the layer L2, and each via conductor 8g, 8i and the pin-shaped conductor 8h are connected to form one outer columnar conductor 6a2. The outer surface of each pin-shaped conductor 8b, 8e, 8h, 8k may be covered with an insulating material. Further, instead of the via conductors 8a to 8l, pin-like conductors similar to the pin-like conductors 8b, 8e, 8h, and 8k arranged in the insulating layer L2 are used, and the columnar conductors 6a1, 6a2, 6b1, and 6b2 are replaced with each other. It may be formed. The pin-shaped conductors 8b, 8e, 8h, and 8k have a predetermined diameter, and a wire made of Cu or the like having a circular or polygonal cross-sectional shape is sheared to a predetermined length, whereby a predetermined length is obtained. It is a metal pin formed in a cylindrical shape or a polygonal column shape with a length of.

  Each upper wiring electrode 7a1 forming each coil pattern 5a is formed on the surface L3a of the upper insulating layer L3, and connects the upper end of the corresponding inner columnar conductor 6a1 and the upper end of the outer columnar conductor 6a2. Each lower layer side wiring electrode 7a2, 7b2 forming each coil pattern 5a is formed on the back surface L1a of the lower insulating layer L1, and the lower end of the corresponding inner columnar conductor 6a1 and the lower end of the outer columnar conductor 6a2 are connected to each other. Connecting.

  As a specific example, the upper end of the illustrated inner columnar conductor 6a1 of the coil pattern 5a shown in FIG. 2 is connected to the upper wiring electrode 7a1 shown in the figure, and the lower end is connected to the lower wiring electrode 7a2 shown in the figure. The On the other hand, the lower end of the outer wiring electrode 6a2 shown in the figure is connected to the lower wiring electrode 7a2 shown in the figure, but the upper end is connected to the upper wiring electrode 7a1 (not shown). That is, the coil pattern 5a formed by the respective columnar conductors 6a1 and 6a2, the upper layer side wiring electrode 7a1, and the lower layer side wiring electrode 7a2 has an annular magnetic body 4 along the circumferential direction as shown in FIGS. And spirally wound. FIG. 2 schematically shows a cross section of the electronic component 1. The upper end of the upper and outer wiring electrodes 6a2 should be connected to the upper wiring electrode 7a1 (not shown) as described above. It is described so as to be connected to the upper layer side electrode 7a1.

(Method for manufacturing electronic parts)
Next, an example of a method for manufacturing the electronic component 1 according to this embodiment will be described with reference to FIGS. 4 is a plan view of the assembly 11 of the resin bodies 10 constituting the electronic component 1, and FIG. 5 is a plan view of the single resin body 10, and FIGS. 6 (a) to 6 (e). Each is a cut front view of the electronic component 1 and shows each manufacturing process.

  In this embodiment, the electronic component 1 is formed by separating an assembly formed by a plurality of electronic components 1 for each electronic component 1. At this time, as shown in FIG. 4 and FIG. 5, for each unit electronic component 1, a recess 12 a for arranging the magnetic body 4, and each pin-shaped conductor 8 b, 8 e formed around the recess 12 a, An assembly 11 of resin bodies 10 having a plurality of recesses 12b for arranging 8h and 8k is prepared. Note that the number and location of the recesses 12a for arranging the pin-shaped conductors 8b, 8e, 8h, and 8k are appropriately changed according to the number of turns of the coil patterns 5a and 5b around which the magnetic body 4 is wound. Good. In addition, in order to simplify the description, a method for manufacturing the separated electronic component 1 will be described below.

  First, as shown in FIG. 6 (a), a plurality of through holes 13 for disposing the pin-shaped conductors 8b, 8e, 8h, 8k at predetermined positions and a recess for disposing the magnetic body 4 at the predetermined positions. A resin body 10 formed of a cured resin layer 10a formed with 12a and a semi-cured resin layer sheet 10b laminated on the lower side of the resin layer 10a so as to close the lower end of each through hole 13 prepare. Thus, by laminating the resin layer 10a and the resin sheet 10b, each recess 12b for arranging the pin-shaped conductors 8b, 8e, 8h, 8k is formed in the resin body 10. Each of the recesses 12a and 12b corresponds to a positioning recess in the present invention.

  Next, as shown in FIG. 6B, the pin-shaped conductors 8b, 8e, 8h, and 8k are disposed in the recess 12b of the resin body 10, and the annular magnetic body 4 is disposed in the recess 12a. Of the pin-shaped conductors 8b, 8e, 8h, and 8k, the pin-shaped conductors 8b and 8e disposed in the region surrounded by the inner peripheral surface of the annular magnetic body 4 are in contact with each other. It may be formed as a bundle of pin-shaped conductors 8b and 8e that have a circular shape in plan view, and the bundle of pin-shaped conductors 8b and 8e may be disposed in the recess 12b of the resin body 10. In this case, one concave portion 12b having a circular shape in plan view corresponding to the shape of the bundle of pin-like conductors 8b and 8e is formed in a region inside the concave portion 12a for arranging the magnetic body 4 in the resin body 10, and the concave portion A bundle of pin-like conductors 8b and 8e may be disposed on 12b.

  Next, as shown in FIG. 6 (c), the upper surface of the resin body 10 is covered so as to cover the respective concave portions 12a, 12b of the resin body 10 in which the pin-shaped conductors 8b, 8e, 8h, 8k and the magnetic body 4 are arranged. A semi-cured resin sheet 14 is laminated to produce a first laminated body 15, and the first laminated body 15 is hot pressed (for example, 120 ° C.).

  At this time, in the storage space of the magnetic body 4 of the first laminate 15 formed by the recess 12a for arranging the magnetic body 4 and the resin sheet 14, a part of the outer surface of the magnetic body 4 and the storage space The first laminated body 15 is pressed with a pressing pressure that creates a gap between the wall surface of the first laminated body 15 that appears.

  The first laminated body 15 may be pressed with a pressing pressure that fills the periphery of the magnetic body 4 and each of the pin-like conductors 8b, 8e, 8h, and 8k with the resin of the resin sheet 14. That is, the magnetic body 4 and the pin-shaped conductors 8b, 8e, 8h, and 8k that form the coil patterns 5a and 5b standing around the magnetic body 4 may be embedded in the first laminated body 15. (Embedding process).

  Next, as shown in FIG. 6 (d), both main surfaces of the first laminate 15 are polished or ground so that both end surfaces of each pin-shaped conductor 8b, 8e, 8h, 8k are exposed, The insulating layer L2 is produced (polishing / grinding step).

  Next, as shown in FIG. 6E, the upper layer side wiring electrodes 7a1, 7b1 and the via conductors 8c, 8f, 8i, 8l connected to the upper layer side wiring electrodes 7a1, 7b1 were formed. An insulating layer L3 (corresponding to the first resin sheet in the present invention), each lower layer side wiring electrode 7a2, 7b2, and each via conductor 8a, 8d, 8j, 8g connected to each lower layer side wiring electrode 7a2, 7b2 The formed insulating layer L1 is prepared. At this time, the insulating layer L1 and the insulating layer L3 are formed of a semi-cured resin sheet.

  The via conductors 8a, 8c, 8d, 8f, 8g, 8i, 8j, and 8l formed in the insulating layers L1 and L3 form via holes at predetermined positions of the insulating layers L1 and L3 by laser processing or the like. The via hole thus formed is filled with a conductive paste containing Ag, Cu or the like. Each wiring electrode 7a1, 7a2, 7b1, 7b2 is formed by a printing technique or plating using a metal foil such as Cu or a conductor paste.

  Then, the insulating layer L3 is laminated on one main surface of the insulating layer L2 on which the magnetic body 4 is disposed, and the insulating layer L1 is laminated on the other main surface to form a second laminated body, and the second laminated body After pressing both main surfaces, the insulating layers L1 and L3 are completely cured at a predetermined temperature (for example, 180 ° C.) to manufacture the electronic component 1.

  At this time, among the columnar conductors 6a1, 6a2, 6b1, 6b2, for example, the inner columnar conductor 6a1 is connected to the via conductor 8c formed in the insulating layer L3 and the upper end of the pin-shaped conductor 8b, and the insulating layer The via conductor 8a formed at L1 is connected to the lower end of the pin-shaped conductor 8b.

  The method for forming the upper layer side wiring electrodes 7a1 and 7b1 and the lower layer side wiring electrodes 7a2 and 7b2 is not limited to the above-described case. For example, the upper layer side wiring electrodes 7a1 and 7b2 are directly formed on both main surfaces of the polished and ground insulating layer L2. The side wiring electrodes 7a1 and 7b1 and the lower layer side wiring electrodes 7a2 and 7b2 may be formed. In this case, each upper layer side wiring electrode 7a1, 7b1 and each lower layer side wiring electrode 7a2, 7b2 are formed by wire bonding mounting of a metal foil (ribbon) such as Cu, or by a printing technique or plating using a conductive paste. Can do. By doing in this way, since it is not necessary to form each insulating layer L1, L3, the electronic component 1 can be reduced more in size.

  Therefore, according to the above-described embodiment, the columnar conductors (inner columnar conductors 6a1 and 6b1, outer columnar conductors 6a2 and 6b2) connecting the upper layer side wiring electrodes 7a1 and 7b1 and the lower layer side wiring electrodes 7a2 and 7b2, respectively. By forming each of the conductors forming the pin-shaped conductors 8b, 8d, 8h, and 8k, the gap formed between the adjacent through holes is smaller than when the conductor formed in the insulating layer L2 is formed by a through hole. The columnar conductors (inner columnar conductors 6a1 and 6b1 and outer columnar conductors 6a2 and 6b2) can be arranged close to each other. Therefore, by increasing the number of columnar conductors (inner columnar conductors 6a1 and 6b1 and outer columnar conductors 6a2 and 6b2) arranged around the magnetic body 4, the number of turns of the coil patterns 5a and 5b around which the magnetic body 4 is wound is increased. Therefore, it is possible to provide the electronic component 1 that is small and can obtain a large inductance value.

  Further, each of the columnar conductors 6a1, 6a2, 6b1, 6b2 has a larger cross-sectional area than the hollow through-hole 105 that forms the coil pattern of the conventional electronic component 100. Therefore, each of the columnar conductors 6a1, 6a2, 6b1. , 6b2 can be reduced. Therefore, the direct current resistance as the coil patterns 5a and 5b is lowered, and the inductance characteristics of the electronic component 1 can be improved.

  Further, by configuring the conductors forming the coil patterns 5a and 5b formed in the insulating layer L2 with the respective pin-shaped conductors 8b, 8e, 8h, and 8k, compared to the case where the conductor is configured with a via conductor, Since the pin-like conductor is a metal itself with respect to the conductor paste constituting the via conductor, the specific resistance can be reduced.

  Moreover, since the magnetic body 4 has an annular shape, the magnetic path of the magnetic force lines generated by the electronic component 1 becomes a closed magnetic path, so that the inductance value generated by the electronic component 1 can be increased.

  Further, as compared with the conventional electronic component 100 in which through holes are formed, more inner columnar conductors 6a1 and 6b1 are formed in a limited region called a region surrounded by the inner peripheral surface of the annular magnetic body 4. Since the number of turns of the coil patterns 5a and 5b around which the magnetic body 4 is wound can be increased, the value of the inductance generated by the electronic component 1 can be increased.

  When the outer surfaces of the pin-shaped conductors 8b, 8e, 8h, and 8k forming the columnar conductors 6a1, 6a2, 6b1, and 6b2 are covered with an insulating material, the pin-shaped conductors 8b, 8e, 8h, and 8k are Even if they are arranged in contact with each other, the inductance value is not reduced, and the number of turns of the coil patterns 5a and 5b around which the magnetic body 4 is wound can be increased. Of course, the plurality of pin conductors 8b, 8e, 8h, 8k may be arranged in contact with each other without covering the outer surface of each pin conductor 8b, 8e, 8h, 8k with an insulating material. This is preferable because a larger number of windings can be obtained.

  In addition, since a part of the magnetic body 4 and the coil patterns 5a and 5b arranged in the insulating substrate 2 are protected by the resin of the insulating layers L1 to L3, it is possible to provide the electronic component 1 with high environmental reliability. it can.

  When a plurality of magnetic bodies 4 are arranged in the insulating substrate 2, a plurality of inductor elements can be formed on the insulating substrate 2, and various functions are formed by the plurality of inductor elements in the electronic component 1. Can do. Moreover, the inductance value in the electronic component 1 can be easily adjusted by combining a plurality of inductor elements.

  The insulating substrate 2 has a recess 12a formed in the insulating layer L2 and an insulating layer L3 to form a storage space for placing the magnetic body 4 therein. The storage space is formed so that a gap is formed between a part and the wall surface of the insulating substrate 2 appearing in the storage space.

  In the electronic component 100 including the conventional inductor element, the endless magnetic layer 102 is disposed so as to be in contact with the inside of the printed wiring board 101, so that the printed wiring board 101 is easily subjected to pressure due to shrinkage or the like. This pressure is considered to be an obstacle to increasing the inductance value. The inventor of the present invention provides a gap between the outer surface of the magnetic body 4 and the wall surface of the insulating substrate 2 that appears in the storage space, thereby suppressing the pressure that the magnetic body 4 receives from the insulating substrate 2, thereby 1, it was experimentally confirmed that a larger inductance value was obtained, and it was found that providing such a gap was effective in obtaining a high inductance value.

  Further, the magnetic body 4 and each of the magnetic body 4 and each columnar conductor 6a1, 6a2, 6b1, 6b2 are formed on the resin body 10 that forms the insulating layer L2 in which the concave portions 12a and 12b for disposing the magnetic body 4 and the columnar conductors 6a1, 6a2, 6b1, and 6b2 are formed. The columnar conductors 6a1, 6a2, 6b1, 6b2 are arranged, and the periphery of each of the magnetic body 4 and each of the columnar conductors 6a1, 6a2, 6b1, 6b2 is filled with the resin of the resin sheet 14, whereby each of the columnar conductors 6a1, 6a2, 6b1, Since 6b2 can be easily embedded while standing on the insulating layer L2, the electronic component 1 having excellent inductance characteristics can be easily manufactured.

  Further, the resin sheet forming the insulating layer L3 on which the via conductors 8c, 8f, 8i, 8l connected to the respective one side wiring electrodes 7a1, 7b1 are connected, and the other side wiring electrodes 7a2, 7b2. A resin sheet for forming the insulating layer L1 in which the via conductors 8a, 8d, 8g, and 8j are formed, and one main surface of the insulating layer L2 in which the magnetic body 4 is disposed as the resin sheet for forming the insulating layer L3. Are laminated on the other main surface of the insulating layer L2, and thereby the upper wiring electrodes 7a1, 7b1 and the upper wiring electrodes 7a1, 7b1 forming the coil patterns 5a, 5b of the electronic component 1 are formed. Since the lower layer side wiring electrodes 7a2 and 7b2 can be easily formed, the electronic component 1 having excellent inductance characteristics can be easily manufactured.

(Second Embodiment)
An electronic component 1a according to a second embodiment of the present invention will be described with reference to FIG. FIG. 7 is an exploded front view of the electronic component 1a.

  The electronic component 1a of this embodiment differs from the electronic component 1 of the first embodiment described with reference to FIGS. 1 to 3 in the stacking direction of the insulating layers L4 to L10 as shown in FIG. A plurality of coil patterns 5c and 5d are formed on two layers (insulating layers L8 and L10) among the plurality of insulating layers L8 to L10 located above the magnetic body 4 (corresponding to one side in the present invention). Upper layer side wiring electrodes 7c1 to 7c3 and 7d1 to 7d3 are formed, and two of the plurality of insulating layers L4 to L6 (insulating layers L4 and L6) located on the lower side (corresponding to the other side in the present invention) ) And a plurality of lower layer side wiring electrodes 7c4 to 7c6 and 7d4 to 7d6 forming the coil patterns 5c and 5d, and the columnar conductors (inner columnar conductors 6c1, 6c2 and 6d1, 6d). (Not shown), of the outer cylindrical conductor 6c3,6c4 and 6D3,6d4 (not shown)), it is that there is different lengths. Since other configurations are the same as those of the electronic component 1 of the first embodiment, the description thereof is omitted by giving the same reference numerals or corresponding signs. Since the configurations of the coil patterns 5c and 5d are the same, the coil pattern 5c will be described below as an example.

  In this case, each of the upper layer side wiring electrodes 7c1 to 7c3 includes a plurality of upper layer side wiring electrodes 7c1 formed on one main surface of the insulating layer L8 and a plurality of upper layer side wirings formed on both main surfaces of the insulating layer L10. The electrodes 7c2 and 7c3 are formed separately. Each of the lower layer side wiring electrodes 7c4 to 7c6 is also composed of a plurality of lower layer side wiring electrodes 7c4 formed on one main surface of the insulating layer L6 and a plurality of lower layer side wiring electrodes formed on both main surfaces of the insulating layer L4. 7c5 and 7c6.

  Further, some of the columnar conductors (inner columnar conductors 6c1 and 6c2, outer columnar conductors 6c3 and 6c4) have different lengths. For example, in the case of the inner columnar conductors 6c1 and 6c2, each insulating layer L6 , L8 via conductors 16c, 16e and a plurality of first inner columnar conductors 6c1 formed of pin-like conductors 16d of the insulating layer L7, and via conductors 16b of the insulating layers L5, L6, L8, L9, respectively. 16c, 16e, 16f and a plurality of second inner columnar conductors 6c2 formed by the pin-shaped conductors 16d of the insulating layer L7.

  On the other hand, in the case of the outer columnar conductors 6c3, 6c4, for example, a plurality of first conductors formed by the via conductors 16i, 16j, 16l of the insulating layers L5, L6, L8 and the pin-shaped conductors 16k of the insulating layer L7, for example. A plurality of second outer columnar conductors 6c4 formed of the outer columnar conductor 6c3, the via conductors 16h to 16j, 16l, and 16m of each of the insulating layers L4 to L6, L8, and L9 and the pin-shaped conductor 16k of the insulating layer L7; There is.

  For example, the upper ends of a pair of columnar conductors (the first inner columnar conductor 6c1 and the first outer columnar conductor 6c3) adjacent to each other with the magnetic body 4 interposed therebetween are connected to the upper layer side wiring electrode 7c1 and the first The lower end of the inner columnar conductor 6c1 is connected to the lower layer side wiring electrode 7c4, and the lower end of the first outer columnar conductor 6c3 is connected to the lower layer side wiring electrode 7c5. Further, the upper layer of the other set of columnar conductors (second inner columnar conductor 6c2, second outer columnar conductor 6c4) is formed in an insulating layer L10 different from the insulating layer L8 in which the upper layer side wiring electrode 7c1 is formed. Connected to the side wiring electrode 7c2, and the lower end of the second inner columnar conductor 6c2 is connected to the lower layer side wiring electrode 7c5 formed in the insulating layer L4 different from the insulating layer L6 in which the lower layer side wiring electrode 7c4 is formed. The lower end of the outer columnar conductor 6c4 is connected to the lower wiring electrode 7c6.

  Thus, a part of the coil pattern 5c in which the lower layer side wiring electrode 7c4, the first inner columnar conductor 6c1, the upper layer side wiring electrode 7c1, and the first outer columnar conductor 6c3 are connected in series is formed of the magnetic body 4. The coil is wound around a predetermined coil diameter. Also, a part of the coil pattern 5c in which the lower layer side wiring electrode 7c5, the second inner columnar conductor 6c2, the upper layer side wiring electrode 7c2, and the second outer columnar conductor 6c4 are connected in series is formed around the magnetic body 4 The coil is wound around a coil diameter different from the predetermined coil diameter. And a part of both above-mentioned coil patterns 5c are connected in series, and the coil pattern 5c is formed helically.

  FIG. 7 schematically shows a cross section of the electronic component 1a. For example, the first inner columnar conductor 6c1 and the second inner columnar conductor 6c2 are arranged at different positions in the planar direction of the electronic component 1a. It is described so that it can be seen on the same cross section. The same applies to the first outer columnar conductor 6c3 and the second outer columnar conductor 6c4.

  Further, the length and arrangement relationship of each of the columnar conductors 6c1 to 6c4 described above is an example, and depending on the positional relationship between the upper layer side wiring electrodes 7c1 to 7c3 and the lower layer side wiring electrodes 7c4 to 7c6 to be connected, It is preferable to change the length of the columnar conductors 6c1 to 6c4 and the arrangement of the insulating layers L4 to L10 in the stacking direction.

  As described above, in this embodiment, each of the columnar conductors (inner columnar conductors 6c1 and 6c2, outer columnar conductors 6c3 and 6c4) having different lengths is included, and each upper layer side wiring electrode 7c1 is included. ˜7c3 and each lower layer side wiring electrode 7c4˜7c6, each wiring electrode can be arranged across a plurality of insulating layers L4, L6, L8, L10.

  The electronic component 1a can be manufactured by a method similar to the manufacturing method described in the first embodiment. At this time, each of the insulating layers L5, L6, L8, and L9 is a semi-cured resin sheet formed of an epoxy resin or the like, and is provided as a layer for bonding the insulating layers L4 to L10.

  Therefore, by configuring in this way, in each of the upper layer side wiring electrodes 7c1 to 7c3 and the lower layer side wiring electrodes 7c4 to 7c6, a part of the wiring electrodes can be formed in different insulating layers, and thus formed on the insulating substrate 2a. The number of wiring electrodes can be increased. Therefore, the number of coil patterns wound around the magnetic body 4 can be increased, and the inductance value generated by the electronic component 1a can be increased.

  Further, since the number of wiring electrodes formed on the insulating substrate 2b can be easily changed, the length of the entire coil pattern can be adjusted, and an electronic component 1a having a desired inductance value can be easily obtained. Can do.

  As in the first embodiment, the via conductors 16a to 16c, 16e to 16j, and 16l to 16n formed in the insulating layers L4 to L6 and L8 to L10 are replaced with pin-shaped conductors 16d formed on the insulating layer L7. You may form with the same pin conductor as 16k.

  The present invention is not limited to the above-described embodiments, and various modifications other than those described above can be made without departing from the spirit of the invention.

  For example, the coil pattern may be one instead of plural. In addition, by forming an element having a function different from that of an inductor element such as a capacitor element on the insulating substrates 2 and 2a, various circuits (for example, filter circuits) are formed on each electronic component 1 and 1a. There may be.

  Further, in each of the embodiments described above, in each of the insulating layers L2 and L7, the recess 12a is formed in the resin body 10 and the magnetic body 4 is disposed in the recess 12a. A structure formed of an insulating layer may be used. In this case, for example, the magnetic body 4 may be disposed by providing a recess in each adjacent insulating layer and laminating the both insulating layers so that the both recesses face each other.

  In each of the above-described embodiments, each of the columnar conductors 6a1, 6a2, 6b1, 6b2, 6c1 to 6c4, 6d1 to 6d4, the upper layer side wiring electrodes 7a1, 7b1, 7c1 to 7c3, 7d1 to 7d3, and the lower layer wiring electrodes 7a2, 7b2 7c4 to 7c6 and 7d4 to 7d6 are not in contact with the magnetic body 4, but the columnar conductors 6a1, 6a2, 6b1, 6b2, 6c1 to 6c4, 6d1 to 6d4, upper layer side wiring electrodes 7a1, 7b1, 7c1 Any or all of 7c3, 7d1-7d3, lower layer wiring electrodes 7a2, 7b2, 7c4-7c6, 7d4-7d6 may be arranged in contact with the magnetic body 4.

  Furthermore, the present invention can be applied to any electronic component as long as the coil patterns 5a to 5d are formed in the insulating substrates 2 and 2a.

DESCRIPTION OF SYMBOLS 1,1a Electronic component 2,2a Insulating substrate 4 Magnetic body 5a-5d Coil pattern 6a1, 6a2, 6b1, 6b2, 6c1-6c4, 6d1-6d4 Columnar conductor 7a1, 7b1, 7c1-7c3, 7d1-7d3 Upper layer side wiring electrode (One side wiring electrode)
7a2, 7b2, 7c4-7c6, 7d4-7d6 Lower layer side wiring electrode (the other side wiring electrode)
10 Resin body 12a, 12b Recess (Positioning recess)
L1 to L10 Insulating layer

Claims (11)

An insulating substrate;
A magnetic body disposed in the insulating substrate;
A coil pattern formed on the insulating substrate so as to wind the magnetic body,
The coil pattern is
A plurality of columnar conductors embedded in the insulating substrate and standing around the magnetic body;
A plurality of one-side wiring electrodes that are formed on one side of the magnetic body in the length direction of the columnar conductor and connect corresponding one ends of the columnar conductors;
A plurality of other side wiring electrodes that are formed on the other side of the magnetic body in the stacking direction of the insulating layers and connect the corresponding other ends of the columnar conductors;
The electronic component, wherein the magnetic body is spirally wound around the one side wiring electrode and the other side wiring electrode that connect the columnar conductors and the columnar conductors in series. An insulating substrate formed by laminating a plurality of insulating layers;
A magnetic body disposed in the insulating substrate;
A coil pattern formed on the insulating substrate so as to wind the magnetic body,
The coil pattern is
A plurality of columnar conductors embedded in the insulating substrate and standing around the magnetic body;
A plurality of one-side wiring electrodes formed on at least two of the plurality of insulating layers located on one side of the magnetic body in the length direction of the columnar conductor;
A plurality of other wiring electrodes formed on at least two of the plurality of insulating layers located on the other side of the magnetic body in the length direction of the columnar conductor;
Each of the columnar conductors includes those having different lengths,
A pair of the columnar conductors adjacent to each other with the magnetic body interposed therebetween are connected in series by one of the one side wiring electrode and one or the other side wiring electrode, and have a predetermined coil diameter around the magnetic body. And the other set of the columnar conductors are connected in series by the other one side wiring electrode and one or the other side wiring electrode, and the predetermined coil is disposed around the magnetic body. An electronic component that is wound around a coil diameter different from the diameter and formed in a spiral pattern. The magnetic body has an annular shape,
The columnar conductor is
A plurality of inner columnar conductors arranged in a region surrounded by an inner peripheral surface of the annular magnetic body;
A plurality of outer columnar conductors arranged outside the outer peripheral surface of the annular magnetic body,
The electronic component according to claim 1, wherein the annular magnetic body is spirally wound along a circumferential direction by the coil pattern.   4. The electronic component according to claim 1, wherein each of the columnar conductors has an outer surface of a pin material covered with an insulating material.   The electronic component according to claim 1, wherein the magnetic body is made of ferrite.   6. The electronic component according to claim 1, wherein the insulating substrate is a resin substrate.   The electronic component according to claim 1, wherein a plurality of the magnetic bodies are arranged in the insulating substrate. The insulating substrate is formed with a storage space for arranging the magnetic body therein,
The storage space is formed so that a gap is formed at least between the outer surface of the magnetic body and the wall surface of the insulating substrate that appears in the storage space. The electronic component described. An embedding step of embedding a magnetic body and a plurality of columnar conductors each forming a coil pattern standing around the magnetic body in an insulating layer;
A polishing / grinding step of polishing or grinding both main surfaces of the insulating layer so that both end surfaces of each of the columnar conductors are exposed;
Insulating the plurality of one-side wiring electrodes that respectively form the coil pattern and connect the exposed one end surfaces of the columnar conductors, and the plurality of other-side wiring electrodes that connect the exposed other end surfaces of the columnar conductors And an electrode forming step for forming the layer. The embedding process includes
The step of disposing the magnetic body and the columnar conductors on the insulating layer having a plurality of positioning recesses for disposing the magnetic body and the columnar conductors at predetermined positions is provided. Item 10. A method for manufacturing an electronic component according to Item 9. The electrode forming step includes
Each one-side wiring electrode, and a first resin sheet on which a plurality of via conductors connected to each one-side wiring electrode are formed,
Preparing each second wiring electrode and a second resin sheet on which a plurality of via conductors connected to the other wiring electrode are formed;
11. The method according to claim 9, wherein the first resin sheet is laminated on one main surface of the insulating layer and the second resin sheet is laminated on the other main surface of the insulating layer. Manufacturing method of electronic components.

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