Classifications

• • C—CHEMISTRY; METALLURGY
  • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
  • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
  • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
  • C23C18/02—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition
  • C23C18/08—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of metallic material

Definitions

• the present invention relates to a copper film forming composition for forming a copper film on various substrates and a method for producing a copper film using the composition.
• Patent Documents 1 to 4 a liquid mixture containing copper hydroxide or organic acid copper and a polyhydric alcohol as essential components is applied to various substrates and heated to a temperature of 165 ° C. or higher in a non-oxidizing atmosphere.
• a series of characteristic methods for producing copper film-formed articles have been proposed.
• copper formate is disclosed as an organic acid copper used in the liquid process
• diethanolamine and triethanolamine are disclosed as polyhydric alcohols.
• Patent Document 5 proposes a metal paste containing silver fine particles and an organic compound of copper, which can form a metal film having excellent solder heat resistance on a base electrode.
• Copper formate is disclosed as an organic compound of copper used in the paste
• diethanolamine is disclosed as an amino compound that is reacted with the paste to form a paste.
• Patent Document 6 proposes a metal salt mixture for forming a metal pattern used in a circuit.
• copper formate is disclosed as a metal salt
• organic solvents such as diethanolamine, N-methyldiethanolamine, N-ethyldiethanolamine, and morpholine are disclosed as organic components.
• Pyridine is disclosed as a ligand.
• Patent Document 7 discloses a low temperature decomposable copper precursor containing copper formate that can be thermally decomposed at a low temperature after printing and a 3-dialkylaminopropane-1,2-diol compound, which is useful for the formation of wiring for electronics and the like. A composition is disclosed.
• Patent Document 8 discloses a composition for forming a copper thin film containing copper formate and alkanolamine useful for the liquid process described above.
• alkanolamines include monoethanolamine, diethanolamine, and triethanolamine.
• a composition for forming a copper film In order to produce a fine wiring or film at a low cost in a liquid process using a composition for forming a copper film, it is desirable to provide a composition that satisfies the following requirements. That is, it is a solution type that does not contain a solid phase such as fine particles, gives a copper film excellent in conductivity, can be converted into a copper film at low temperature, has good coating properties, and precipitates such as metallic copper It is desired that there is no generation and that the film thickness obtained by one application can be easily controlled. In particular, it is desired that a copper film having excellent conductivity can be formed by heating at less than 160 ° C. However, a composition for forming a copper film that sufficiently satisfies all of these requirements is not yet known.
• an object of the present invention is to provide a composition for forming a copper film that sufficiently satisfies all of the above requirements. More specifically, it is possible to obtain a copper film having sufficient conductivity by coating on a substrate and heating at less than 160 ° C. Forming a solution-like copper film containing no solid phase such as fine particles It is to provide a composition for use.
• the present invention relates to a copper film-forming composition containing copper formate or a hydrate thereof 0.1 to 3.0 mol / kg and 4-aminopiperidine 0.01 to 18.0 mol / kg. I will provide a.
• the present invention also includes a step of applying the copper film forming composition on a substrate, and a step of heating the substrate coated with the copper film forming composition to 200 ° C. or lower to form a copper film. And a method for producing a copper film.
• a solution-like copper containing no solid phase such as fine particles which can be applied on a substrate and heated at a temperature of 200 ° C. or less to obtain a copper film having sufficient conductivity.
• a film forming composition is provided.
• copper formate is used as a precursor (precursor) of the copper film.
• the copper formate used in the composition for forming a copper film of the present invention may be a hydrate or a hydrate.
• anhydrous copper formate (II), copper formate (II) dihydrate, copper formate (II) tetrahydrate and the like can be used.
• These copper formates may be mixed as they are, or may be mixed as an aqueous solution, an organic solvent solution, or an organic solvent suspension.
• the content of copper formate in the composition for forming a copper film of the present invention may be appropriately adjusted according to the thickness of the copper film to be produced.
• the content of copper formate is 0.1 to 3.0 mol / kg, preferably 1.0 to 2.5 mol / kg.
• “mol (mol) / kg” in the present invention represents “amount (mol) of solute dissolved in 1 kg of solution”.
• the molecular weight of copper (II) formate is 153.58, when 153.58 g of copper formate is contained in 1 kg of the composition for forming a copper film of the present invention, it is 1.0 mol / kg. .
• the composition for forming a copper film of the present invention contains 4-aminopiperidine as an essential component.
• 4-aminopiperidine acts as a solubilizer for copper formate and copper formate hydrate.
• a copper film forming composition prepared by combining 4-aminopiperidine, copper formate and copper formate hydrate can be converted into a copper film by firing at 200 ° C. or lower.
• the content of 4-aminopiperidine in the composition for forming a copper film of the present invention is 0.01 to 18.0 mol / kg.
• the amount is less than 0.01 mol / kg, the conductivity of the obtained copper film becomes insufficient.
• it exceeds 18.0 mol / kg applicability deteriorates and a uniform copper film cannot be obtained.
• a more preferable range is 0.2 to 5.0 mol / kg.
• a more preferable range is 0.5 to 2.0 mol / kg.
• the composition for forming a copper film of the present invention contains copper formate or a hydrate thereof and 4-aminopiperidine as essential components. However, you may contain arbitrary components other than these essential components in the range which does not inhibit the effect of this invention.
• Optional components include: an organic solvent; an additive for increasing the film thickness of the obtained copper film; an additive for imparting stability to the composition for forming a copper film, such as an anti-gelling agent and a stabilizer; Examples include additives for improving the coating property of the composition for forming a copper film such as an antifoaming agent, a thickener, a thixotropic agent, and a leveling agent; and film forming aids such as a combustion aid and a crosslinking aid.
• the organic solvent may be any one as long as it can stably dissolve the copper formate or a hydrate thereof and 4-aminopiperidine.
• the organic solvent may be a single composition or a mixture.
• Examples of organic solvents that can be used in the copper film forming composition of the present invention include alcohol solvents, diol solvents, ketone solvents, ester solvents, ether solvents, aliphatic or alicyclic hydrocarbons. Solvent, aromatic hydrocarbon solvent, hydrocarbon solvent having a cyano group, and other solvents.
• alcohol solvents examples include methanol, ethanol, propanol, isopropanol, 1-butanol, isobutanol, 2-butanol, tertiary butanol, pentanol, isopentanol, 2-pentanol, neopentanol, and third pen.
• diol solvent examples include ethylene glycol, propylene glycol, 1,2-butanediol, 1,3-butanediol, 1,4-butanediol, 1,5-pentanediol, neopentyl glycol, isoprene glycol (3 -Methyl-1,3-butanediol), 1,2-hexanediol, 1,6-hexanediol, 3-methyl-1,5-pentanediol, 1,2-octanediol, octanediol (2-ethyl- 1,3-hexanediol), 2-butyl-2-ethyl-1,3-propanediol, 2,5-dimethyl-2,5-hexanediol, 1,2-cyclohexanediol, 1,4-cyclohexanediol, Examples include 1,4-cyclohexan
• ketone solvent examples include acetone, ethyl methyl ketone, methyl butyl ketone, methyl isobutyl ketone, ethyl butyl ketone, dipropyl ketone, diisobutyl ketone, methyl amyl ketone, cyclohexanone, and methylcyclohexanone.
• ester solvent examples include methyl formate, ethyl formate, methyl acetate, ethyl acetate, isopropyl acetate, butyl acetate, isobutyl acetate, sec-butyl acetate, sec-butyl acetate, amyl acetate, isoamyl acetate, triamyl acetate, Phenyl acetate, methyl propionate, ethyl propionate, isopropyl propionate, butyl propionate, isobutyl propionate, butyl propionate, tert-butyl propionate, amyl propionate, isoamyl propionate, 3 amyl propionate, propionate Acid phenyl, methyl 2-ethylhexanoate, ethyl 2-ethylhexanoate, propyl 2-ethylhexanoate, isopropyl 2-ethylhex
• ether solvent examples include tetrahydrofuran, tetrahydropyran, morpholine, ethylene glycol dimethyl ether, diethylene glycol dimethyl ether, triethylene glycol dimethyl ether, dibutyl ether, diethyl ether, dioxane and the like.
• Examples of the aliphatic or alicyclic hydrocarbon solvent include pentane, hexane, cyclohexane, methylcyclohexane, dimethylcyclohexane, ethylcyclohexane, heptane, octane, decalin, and solvent naphtha.
• aromatic hydrocarbon solvent examples include benzene, toluene, ethylbenzene, xylene, mesitylene, diethylbenzene, cumene, isobutylbenzene, cymene, and tetralin.
• hydrocarbon solvents having a cyano group examples include 1-cyanopropane, 1-cyanobutane, 1-cyanohexane, cyanocyclohexane, cyanobenzene, 1,3-dicyanopropane, 1,4-dicyanobutane, 1,6-dicyanohexane. 1,4-dicyanocyclohexane, 1,4-dicyanobenzene and the like.
• solvents include N-methyl-2-pyrrolidone, dimethyl sulfoxide, and dimethylformamide.
• alcohol-based solvents, diol-based solvents, and ester-based solvents are inexpensive and exhibit sufficient solubility in solutes, and further include silicon substrates, metal substrates, and ceramic substrates. It is preferable because it exhibits good coating properties as a coating solvent for various substrates such as glass substrates and resin substrates. Of these, alcohol solvents are particularly preferred because of their high solubility in solutes.
• Content of said organic solvent in the composition for copper film formation of this invention is not specifically limited, If it adjusts suitably according to the thickness of the copper film to form and the manufacturing method of a copper film Good.
• 0.01 mass of the organic solvent is used with respect to 100 mass parts of copper formate (even in the case of copper formate hydrate, converted to copper formate, the same shall apply hereinafter). Part to 5,000 parts by mass are preferably used.
• the amount of the organic solvent is less than 0.01 parts by mass, there may be a problem that the resulting copper film is cracked or has poor applicability.
• the copper film obtained becomes thin, so that the ratio of an organic solvent increases, it is preferable not to exceed 5,000 mass parts from the surface of productivity. More specifically, when a copper film is produced by spin coating, it is preferable to use 20 to 1,000 parts by mass of an organic solvent with respect to 100 parts by mass of copper formate. In the case of producing a copper film by screen printing, 0.01 to 20 parts by mass of an organic solvent is preferably used with respect to 100 parts by mass of copper formate.
• copper acetate or a hydrate thereof can be used as an additive for increasing the thickness of the obtained copper film.
• the copper concentration in the composition for forming a copper film can be increased, and a thick copper film can be obtained.
• the content of copper acetate or the hydrate is not particularly limited, and depends on the thickness of the copper film to be formed. And adjust as appropriate.
• the concentration ratio of copper formate or hydrate thereof and copper acetate or hydrate thereof is not particularly limited, but 40% by mass or more of all copper in the copper film forming composition is copper formate. It is preferable to be due to the addition of.
• the content of copper acetate or a hydrate thereof is preferably in the range of 0.1 to 2.0 mol / kg when copper formate or a hydrate thereof is 1 mol / kg. More preferably, it is in the range of ⁇ 1.5 mol / kg. Moreover, it is especially preferable that the ratio of the concentration (mol / kg) of copper formate and copper acetate is about 1: 1 because a copper film having excellent electrical characteristics can be obtained.
• Additives for imparting stability to the copper film forming composition include piperidine, 1-aminopiperidine, N-ethylpiperidine, N-methylpiperidine, 2-methylpiperidine, 3-methylpiperidine, 4-methylpiperidine Nitrogen-containing heterocyclic compounds other than 4-aminopiperidine represented by 2,6-dimethylpiperidine, 3,5-dimethylpiperidine, etc .; represented by diethanolamine, N-methyldiethanolamine, N-ethyldiethanolamine, N-aminopropyldiethanolamine And diol compounds having one or more amino groups represented by 3-dimethylamino-1,2-propanediol.
• the addition of N-methyldiethanolamine as a stabilizer is particularly preferred because the effect of suppressing the generation of precipitates such as metallic copper is enhanced.
• the method for producing a copper film of the present invention comprises a step of applying the composition for forming a copper film of the present invention described above on a substrate (coating step), and a substrate coated with the composition for forming a copper film in 200 steps. And a step (film formation step) of forming a copper film by heating to a temperature not higher than ° C.
• the substrate may be kept at 50 ° C. or higher and lower than 100 ° C. to further dry the low boiling point component such as an organic solvent.
• a copper film having sufficient conductivity can be produced even when the temperature at which the substrate coated with the composition for forming a copper film is heated is less than 160 ° C.
• the copper film can be produced with less energy, which is advantageous in terms of cost.
• substrate with which the composition for copper film formation was applied is 120 degrees C or less, the copper film which has sufficient electroconductivity can be manufactured.
• a copper film can be produced with less energy.
• a resin substrate represented by polyethylene terephthalate resin or the like it is preferable because a copper film can be formed without degrading the substrate.
• spin coating method dip method, spray coating method, mist coating method, flow coating method, curtain coating method, roll coating method, knife coating method, bar coating method, slit coating method, screen Examples thereof include a printing method, a gravure printing method, an offset printing method, an ink jet method, and a brush coating.
• a plurality of processes from the above coating process to an arbitrary process can be repeated.
• all the steps from the coating step to the film forming step may be repeated a plurality of times, or the coating step and the drying step may be repeated a plurality of times.
• Examples of the substrate that can be used in the method for producing a copper film of the present invention include resin, paper, metal, and glass. More specifically, low density polyethylene resin, high density polyethylene resin, ABS resin (acrylonitrile-butadiene-styrene copolymer), acrylic resin, styrene resin, vinyl chloride resin, polyester resin (polyethylene terephthalate, polytrimethylene terephthalate, Resin base materials such as polybutylene terephthalate, polyethylene naphthalate, polybutylene naphthalate), polyacetal resin, cellulose derivatives; uncoated printing paper, finely coated printing paper, coated printing paper (art paper, coated paper), special Printing paper, copy paper (PPC paper), unbleached wrapping paper (both kraft paper for heavy bags, both kraft paper), bleached wrapping paper (bleached kraft paper, pure white roll paper), coated balls, chipboard cardboard, etc.
• low density polyethylene resin high density polyethylene resin
• ABS resin acrylonitrile-
• Paper base material such as copper plate, iron plate, aluminum plate; Soda Las, borosilicate glass, silica glass, glass substrate such as quartz glass, alumina, sapphire, zirconia, titania, yttrium oxide, ITO (indium tin oxide) and the like.
• the atmosphere of the above drying process, film forming process, and annealing process is usually either a reducing gas atmosphere or an inert gas atmosphere.
• a reducing gas atmosphere can provide a copper film with more excellent conductivity.
• the reducing gas includes hydrogen
• the inert gas includes helium, nitrogen, and argon.
• the inert gas may be used as a diluent gas for the reducing gas.
• the copper film formed by the method for producing a copper film of the present invention can be used as a wiring or an electrode of an electronic device represented by a touch panel, a liquid crystal display element, an organic EL element or the like.
• an electronic device such as a liquid crystal display element or an organic EL element having such a touch panel is provided by configuring a touch panel using the copper film formed by the copper film manufacturing method of the present invention as a lead wiring. be able to.
• composition for forming copper film [Examples 1 to 7]
• the compounds listed in Table 1 were blended so that the numerical values in parentheses (mol / kg, mass%) were respectively obtained to obtain compositions 1 to 7 for forming a copper film.
• concentration of each compound described in Table 1 is the quantity in 1 kg of the manufactured composition for copper film formation (hereinafter, the same). The remainder was ethanol.
• Comparative compounds 1 to 4 were obtained by blending the compounds shown in Table 2 so that the concentration in the parenthesis was the numerical value (mol / kg, mass%), respectively. The remainder was ethanol.
• a copper thin film was produced by a coating method using compositions 1 to 7 for forming a copper film. Specifically, first, each copper film forming composition was cast on various substrates described in Table 3. Then, each copper film formation composition was apply
• RTP-6 infrared heating furnace
• the argon flow conditions during the main baking step are 300 mL / min, and the rate of temperature increase is 100 ° C./30 seconds when the main baking temperature is 100 ° C. and 120 ° C./30 seconds when the main baking temperature is 120 ° C. When it was 150 ° C., it was set to 150 ° C./30 seconds.
• the glass substrate (Eagle XG (brand name): Corning company make) for liquid crystal screens was used for the glass substrate.
• Cosmo Shine A4100 (trade name) (manufactured by Toyobo Co., Ltd., film thickness: 100 ⁇ m) was used for the PET substrate.
• Comparative compositions 1 to 4 were used, respectively, to produce a copper thin film by a coating method. Specifically, first, each copper film forming composition was cast on a PET substrate (Cosmo Shine A4100 (trade name): manufactured by Toyobo Co., Ltd., film thickness: 100 ⁇ m). Then, each copper film formation composition was apply
• a PET substrate Cosmo Shine A4100 (trade name): manufactured by Toyobo Co., Ltd., film thickness: 100 ⁇ m). Then, each copper film formation composition was apply
• the dried substrate was heated (main firing step) for 20 minutes at a predetermined temperature shown in Table 3 in an argon atmosphere using an infrared heating furnace (RTP-6 (trade name): ULVAC-RIKO).
• RTP-6 trade name: ULVAC-RIKO
• a thin film was obtained.
• the flow conditions of argon at the time of this baking process were 300 mL / min, and the temperature increase rate was 120 degreeC / 30 second.

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• 2014
  • 2014-10-10 JP JP2014208520A patent/JP6387282B2/ja active Active
• 2015
  • 2015-10-02 WO PCT/JP2015/078023 patent/WO2016056478A1/ja active Application Filing
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