WO2016050077A1 - 利用激光切割基板的方法及激光切割设备 - Google Patents

利用激光切割基板的方法及激光切割设备 Download PDF

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Publication number
WO2016050077A1
WO2016050077A1 PCT/CN2015/079307 CN2015079307W WO2016050077A1 WO 2016050077 A1 WO2016050077 A1 WO 2016050077A1 CN 2015079307 W CN2015079307 W CN 2015079307W WO 2016050077 A1 WO2016050077 A1 WO 2016050077A1
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Prior art keywords
line
substrate
shape
parallel
cutting
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PCT/CN2015/079307
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English (en)
French (fr)
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陶胜
黄阳
董岱
褚兵兵
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京东方科技集团股份有限公司
合肥鑫晟光电科技有限公司
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Priority to US14/770,581 priority Critical patent/US9963376B2/en
Publication of WO2016050077A1 publication Critical patent/WO2016050077A1/zh

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    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/08—Severing cooled glass by fusing, i.e. by melting through the glass
    • C03B33/082—Severing cooled glass by fusing, i.e. by melting through the glass using a focussed radiation beam, e.g. laser
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/362—Laser etching
    • B23K26/364—Laser etching for making a groove or trench, e.g. for scribing a break initiation groove
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/0006—Working by laser beam, e.g. welding, cutting or boring taking account of the properties of the material involved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/352—Working by laser beam, e.g. welding, cutting or boring for surface treatment
    • B23K26/359—Working by laser beam, e.g. welding, cutting or boring for surface treatment by providing a line or line pattern, e.g. a dotted break initiation line
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • B23K26/402—Removing material taking account of the properties of the material involved involving non-metallic material, e.g. isolators
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/0222—Scoring using a focussed radiation beam, e.g. laser
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C03B33/037—Controlling or regulating
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/04—Cutting or splitting in curves, especially for making spectacle lenses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
    • B23K2103/54—Glass

Definitions

  • Embodiments of the present invention relate to a method of cutting a substrate using a laser and a laser cutting apparatus.
  • the existing glass cutting equipment is mainly divided into cutter wheel cutting and CO 2 laser cutting.
  • the cutter wheel splitting methods mainly include natural splitting, steam type, hot air type and pressure type, and the splitting mode of CO 2 laser cutting is mainly cold and hot impact.
  • the cutting path of the cutter wheel cutting and CO 2 laser cutting is single, and only the horizontal and vertical straight cutting paths are included, and only the substrate with a relatively simple shape can be cut, and the cutting can not be correspondingly shaped, and the cutting order is fixed.
  • the embodiment of the invention provides a method for laser cutting a substrate and a laser cutting device, which are used to increase the stress destructive force point when the substrate is cut, improve the cutting effect of the substrate, and reduce the fragmentation of the substrate.
  • Embodiments of the present invention provide a method for cutting a substrate by using a laser, the method comprising the following steps:
  • the auxiliary split line is drawn outside the shape line; and the minimum distance of the auxiliary split line toward the end of the shape line from the shape line is located at the first position Within the threshold.
  • the embodiment of the invention further provides a laser cutting device, the device comprising: a laser knife and a control device connected to the laser knife, wherein
  • the control device is configured to control the laser knife to trace the first parallel line, the second parallel line, the shape line and the auxiliary split line on the substrate; the first parallel line is along the first direction, and the second parallel line is along the In the two directions, the second direction is perpendicular to the first direction, the second parallel line intersects the first parallel line, and the mutually intersecting first parallel line and the second parallel line are enclosed
  • the laser knife engraves a first parallel line, a second parallel line, a shape line, and an auxiliary split line on the substrate according to the set stroke.
  • FIG. 1 is a flow chart of a method for cutting a substrate by using a laser according to an embodiment of the present invention
  • FIG. 2 is a schematic diagram of a scribe line on a substrate in a method for cutting a substrate by using a laser according to an embodiment of the present invention
  • FIG. 3 is a schematic diagram of another scribe line on a substrate in a method for cutting a substrate by using a laser according to an embodiment of the present invention
  • FIG. 4 is a schematic diagram of another scribe line on a substrate in a method of cutting a substrate by using a laser according to an embodiment of the present invention
  • FIG. 5 is a schematic diagram of another scribe line on a substrate in a method for cutting a substrate by using a laser according to an embodiment of the present invention
  • FIG. 6 is a schematic diagram of another scribe line on a substrate in a method of cutting a substrate by using a laser according to an embodiment of the present invention.
  • the embodiment of the invention provides a method for cutting a substrate by using a laser and a laser cutting device.
  • the auxiliary splitting line is added to improve the effect of cutting the profile when cutting the substrate by laser, thereby improving the substrate cutting.
  • the effect is to improve the cracking of the substrate.
  • Embodiments of the present invention provide a method of cutting a substrate by using a laser, the method comprising the following steps.
  • the auxiliary split line is drawn outside the shape line; and the minimum distance of the end of the auxiliary split line toward the shape line from the shape line is within the first set threshold.
  • the first parallel line, the second parallel line and the auxiliary split line are provided to help split the substrate, thereby increasing the stress damage point when the substrate is cut, thereby facilitating the cutting of the substrate, and avoiding the glass substrate during cutting.
  • the yield of substrate cutting can be effectively improved, and waste of materials can be avoided.
  • the cutting path of the cutting method is reasonable and ingenious, and the cut substrate can be completely separated, and the automatic take-out condition is provided.
  • FIG. 1 In order to facilitate the understanding of the embodiments of the present invention, a detailed description will be made below with reference to FIG. 1, FIG. 2, FIG. 3, FIG. 4, FIG. 5, FIG.
  • Embodiments of the present invention provide a method of cutting a substrate by using a laser, the method comprising the following steps.
  • Step 001 drawing, on the substrate, a plurality of first parallel lines along the first direction and a plurality of second parallel lines along the second direction, wherein the second direction is perpendicular to the first direction, and the plurality of second parallel lines are a plurality of first parallel lines intersecting, and a region between the first parallel line and the second parallel line intersecting each other for engraving the shape of the sub-substrate;
  • first parallel lines 20 and second parallel lines 30 are depicted on the substrate 10, wherein the first direction is a horizontal direction and the second direction is a vertical direction. Therefore, the plurality of first parallel lines 20 and The two parallel lines 30 are enclosed in a rectangular frame, and when cutting, the size of the glass substrate 10 can be described.
  • a parallel line 20 and a second parallel line 30, as shown in FIG. 2, according to the size of the substrate 10, a second parallel line 30 arranged offset may be used to form three rectangular frames, thereby maximizing the use of the substrate 10. material.
  • a plurality of rectangular frames arranged in an array may also be formed, which is not limited herein.
  • Step 002 in the area for depicting the shape of the sub-substrate, the shape line 50 of the sub-substrate is drawn;
  • a shape line 50 is drawn on the substrate 10, and the shape line 50 may form lines of different shapes depending on the shape of the sub-substrate.
  • the shape line 50 shown in FIG. 2 is a rectangular line with rounded corners.
  • the shape line shown in Fig. 5 is such that a recessed notch is provided on the shape line shown in Fig. 2.
  • the shape line shown in Fig. 6 is an elliptical line. It should be noted that the shape of the shape line is not limited thereto, and can be characterized according to actual needs.
  • the minimum distance between the first parallel line 20 and the line of the shape line 50 on the side close to the first parallel line is within the second set threshold; the second parallel line 30 is adjacent to the second parallel line.
  • the distance of the line of the side shape line 50 is within a second set threshold, for example, the second set threshold is 0.5 mm to 1.5 mm.
  • any value between 0.5mm and 1.5mm for example, the first parallel line 20 and the side close to the first parallel line
  • the distance of the line of the shape line 50 is 0.5 mm; the distance between the second parallel line 30 and the line of the shape line 50 on the side close to the second parallel line is 0.5 mm.
  • Step 003 in the region for characterizing the shape of the sub-substrate, the auxiliary split line 40 is drawn on the outer side 60 of the shape line 50; and the minimum distance of the auxiliary split line 40 toward the end of the shape line 50 from the shape line 50 is located at the first position. Within the threshold.
  • auxiliary split lines 40 are depicted in accordance with different shape lines 50 to help split the substrate 10.
  • the shape line 50 is a rectangular line
  • the corners of the rectangular line are rounded, and each rounded corner corresponds to a intersection of the first parallel line 20 and the second parallel line
  • the auxiliary split line 40 is a straight line or an arc line along the intersection of each of the first parallel line 20 and the second parallel line 30 toward its corresponding rounded direction, or the auxiliary split line 40 is respectively paralleled to the adjacent first line
  • the fold line connecting the line 20 and the second parallel line 30, the end of the auxiliary split line 40 toward the shape line 50 is a corner of the fold line.
  • the auxiliary splitting line 40 is used to help shape the shape of the rounded corners, avoiding the occurrence of cracks in the shape line 50 at the rounded corners during cutting, and the auxiliary splitting line 40 can be depicted at the rounded corners.
  • the shape of the auxiliary splitting line 40 can be selected according to the actual situation.
  • the auxiliary splitting line 40 is not limited to the above description.
  • the auxiliary splitting line 40 may have one end at a point of intersection with the first parallel line 20 and the second parallel line 30. As shown in FIG. 2, the end may also be located at the first parallel line. 20 or second parallel line 30.
  • the auxiliary split line 40 may include the following:
  • the auxiliary splitting line 40 is a straight line, and the intersection of the first parallel line 20 and the second parallel line 30 points to the rounded corner corresponding to the intersection point, and the straight line is close to the end of the rounded corner.
  • the minimum distance is within the first set threshold.
  • the distance d shown in FIG. 2 is the distance from the rounded end of the straight line to the rounded corner.
  • the auxiliary split line 40 is an angle bisector of the angle between the first parallel line 20 and the second parallel line 30 to which the auxiliary split line 40 is connected. For easy portrayal.
  • the auxiliary splitting line 40 is a curved line, and the intersecting point of the curved line along the first parallel line 20 and the second parallel line 30 points to a rounded corner corresponding to the intersection, and the curved line is close to the circle.
  • the minimum distance from one end of the corner to the fillet is within a first set threshold.
  • the auxiliary splitting line 40 is a broken line, and the auxiliary splitting line 40 is a fold line whose two ends are respectively connected to the adjacent first parallel line 20 and the second parallel line 30, and the auxiliary splitting line 40 is oriented toward the shape line.
  • the end of 50 is the corner of the fold line, and the minimum distance of the corner from its corresponding fillet is within a first set threshold.
  • the auxiliary split line 40 includes an X-shaped line disposed in the concave bend line, in addition to any of the types of lines shown in FIG. 2, FIG. 3, and FIG. And the minimum distance of the end of the X-shaped line from its adjacent shape line 50 should be within a first set threshold.
  • the shape line 50 is an elliptical line, and the long axis of the elliptical line is located on the center line of the two second parallel lines 30 forming the region for patterning the shape of the sub-substrate, the auxiliary split line 40 is an arcuate line drawn along the intersection of each of the first parallel line 20 and the second parallel line 30 toward its corresponding long axis end. And the minimum distance of the curved line from the corresponding shape line 50 is within the first set threshold.
  • the long axis of the elliptical line may also be located on the center line of the two first parallel lines 20 forming the area for characterizing the shape of the sub-substrate.
  • the portion between the first parallel line 20, the second parallel line 30, and the shape line 50 can be divided by the auxiliary split line 40 provided, thereby facilitating the formation of different small pieces of the substrate 10 during cutting. Avoid cracks during cutting.
  • the first set threshold is, for example, 50 ⁇ m to 150 ⁇ m, such as: 50 ⁇ m, 60 ⁇ m, 80 ⁇ m, 90 ⁇ m, 100 ⁇ m, Any value between 50 ⁇ m and 150 ⁇ m such as 120 ⁇ m or 150 ⁇ m.
  • the minimum distance of the auxiliary split line 40 toward the end of the shape line 50 from the shape line 50 is 100 ⁇ m.
  • the above specific embodiment only gives a specific operation mode, and any technical solution including cutting the substrate 10 by using the auxiliary splitting line 40 should be included in the content of the present invention, such as step 001 and step 002.
  • the order of the characterization may be determined according to actual needs, that is, the first parallel line 20 and the second parallel line 30 may be first drawn according to the above specific embodiment, and then the shape line 50 may be scribed; The shape line 50 is followed by the first parallel line 20 and the second parallel line 30.
  • the principle is the same as the principle of the foregoing specific embodiment, and details are not described herein again.
  • the auxiliary splitting line is provided to help split the substrate, thereby avoiding the cracking of the glass substrate during cutting, effectively improving the yield of the substrate cutting, and avoiding waste of materials.
  • the cutting path of the cutting method is reasonable and ingenious, and the cut substrate can be completely separated, and the automatic take-out condition is provided.
  • the substrate when the lines are drawn, microcracks are formed on the substrate, and after the lines are drawn, the substrate can be split and the cutting is completed under the action of stress. A sub-substrate of the desired shape is obtained. If the substrate fails to split, laser cutting can be performed to complete the cutting by the principle of thermal expansion and contraction.
  • the embodiment of the invention further provides a laser cutting device, the device comprising: a laser knife and a control device connected to the laser knife, wherein
  • the control device is provided with a control laser knife for drawing a stroke of the first parallel line, the second parallel line, the shape line and the auxiliary split line on the substrate; and the minimum distance of the auxiliary split line toward the end of the shape line from the shape line is located at the first Set the threshold;
  • the laser knife engraves the first parallel line, the second parallel line, the shape line and the auxiliary split line on the substrate according to the set stroke.
  • the setting of controlling the laser knife to trace the first parallel line, the second parallel line, the shape line and the auxiliary split line on the substrate comprises: controlling the laser knife to draw a plurality of first parallel lines along the first direction on the substrate a plurality of second parallel lines along a second direction perpendicular to the first direction and intersecting the first parallel line, and a shape line of the sub-substrate, wherein the first parallel line and the second parallel line intersecting each other Enclosing a region for characterizing the shape of the sub-substrate, the shape line is located in a region for depicting the shape of the sub-substrate, and in the region for characterizing the shape of the sub-substrate, the auxiliary split line is drawn outside the shape line; and the auxiliary split line is oriented toward the shape The minimum distance of the end of the line from the shape line is within a first set threshold.
  • control device sets the path of the auxiliary splitting line, and controls the laser cutter to cut the auxiliary splitting line to help split the substrate, thereby avoiding the cracking of the glass substrate during cutting, and effectively improving the yield of the substrate cutting and avoiding Waste of materials.
  • the cutting path of the cutting method is reasonable and ingenious, and the cut substrate can be completely separated, and the automatic take-out condition is provided.

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Abstract

一种利用激光切割基板的方法及激光切割设备。该方法包括以下步骤：在基板上刻画出多条交叉的第一平行线（20）及第二平行线（30），其中，第一平行线（20）与第二平行线（30）之间围成用于刻画子基板形状的区域（23），形状线（50）位于该区域（23）内；在该区域（23）内，在形状线外侧刻画辅助分裂线（40）；且辅助分裂线（40）朝向形状线（50）的端部距离形状线（50）的最小距离位于第一设定阈值内。该方法通过设置平行线及辅助分裂线来帮助分裂基板，可增加基板切割时的应力破坏点，避免玻璃基板在切割时出现破裂，提高基板切割的成品率。

Description

利用激光切割基板的方法及激光切割设备 技术领域
本发明实施例涉及一种利用激光切割基板的方法及激光切割设备。
背景技术
现有的玻璃切割设备主要分为刀轮切割和CO2激光切割，刀轮裂片方式主要有自然裂片、蒸汽式、热空气式和压力式，CO2激光切割的裂片方式主要是冷热冲击。其中刀轮切割和CO2激光切割的切割路径单一，只包含横向和纵向的直线切割路径，只能切割形状比较简单的基板，无法对应异形切割，且切割顺序固定。
发明内容
本发明实施例提供一种激光切割基板的方法及激光切割设备，用以增加基板切割时的应力破坏力点，提高基板切割的效果，降低基板碎裂的情况。
本发明实施例提供一种利用激光切割基板的方法，该方法包括以下步骤：
在基板上刻画出多条沿第一方向的第一平行线、多条沿第二方向的第二平行线、以及子基板的形状线，其中，所述第二方向与所述第一方向垂直，多条所述第二平行线与多条所述第一平行线交叉，所述相互交叉的第一平行线与第二平行线之间围成用于刻画子基板形状的区域，所述形状线位于所述用于刻画子基板形状的区域内；
在所述用于刻画子基板形状的区域内，在所述形状线外侧刻画辅助分裂线；且所述辅助分裂线朝向所述形状线的端部距离所述形状线的最小距离位于第一设定阈值内。
本发明实施例还提供一种激光切割设备，该设备包括：激光刀以及与所述激光刀连接的控制装置，其中，
所述控制装置内设定有控制所述激光刀在基板上刻画第一平行线、第二平行线、形状线及辅助分裂线的行程；第一平行线沿第一方向，第二平行线沿第二方向，所述第二方向与所述第一方向垂直，所述第二平行线与所述第一平行线交叉，所述相互交叉的第一平行线与第二平行线之间围成用于刻画 子基板形状的区域，所述形状线位于所述用于刻画子基板形状的区域内；在所述用于刻画子基板形状的区域内，在所述形状线外侧刻画辅助分裂线，且辅助分裂线朝向所述形状线的端部距离所述形状线的最小距离位于第一设定阈值内；
所述激光刀按照所述设定的行程在基板上刻画出第一平行线、第二平行线、形状线及辅助分裂线。
附图说明
为了更清楚地说明本发明实施例的技术方案，下面将对实施例的附图作简单地介绍，显而易见地，下面描述中的附图仅仅涉及本发明的一些实施例，而非对本发明的限制。
图1为本发明实施例提供的利用激光切割基板的方法的流程图；
图2为本发明实施例提供的利用激光切割基板的方法中在基板上的一种刻画线的示意图；
图3为本发明实施例提供的利用激光切割基板的方法中在基板上的另一种刻画线的示意图；
图4为本发明实施例提供的利用激光切割基板的方法中在基板上的另一种刻画线的示意图；
图5为本发明实施例提供的利用激光切割基板的方法中在基板上的另一种刻画线的示意图；
图6为本发明实施例提供的利用激光切割基板的方法中在基板上的另一种刻画线的示意图。
附图标记：
10-基板；20-第一平行线；30-第二平行线；40-辅助分裂线；50-形状线；23-用于刻画子基板形状的区域；60-形状线外侧。
具体实施方式
为使本发明实施例的目的、技术方案和优点更加清楚，下面将结合本发明实施例的附图，对本发明实施例的技术方案进行清楚、完整地描述。显然，所描述的实施例是本发明的一部分实施例，而不是全部的实施例。基于所描 述的本发明的实施例，本领域普通技术人员在无需创造性劳动的前提下所获得的所有其他实施例，都属于本发明保护的范围。
为了增加基板切割时的应力破坏力点，提高基板切割的效果，降低基板碎裂的情况。本发明实施例提供一种利用激光切割基板的方法及激光切割设备，在本发明实施例的技术方案中，通过增设辅助分裂线从而提高利用激光切割基板时切割出异形的效果，从而提高基板切割的效果，改善基板碎裂的情况。为使本发明的目的、技术方案和优点更加清楚，以下以非限制性的实施例为例对本发明作进一步详细说明。
本发明实施例提供一种利用激光切割基板的方法，该方法包括以下步骤。
在基板上刻画出多条沿第一方向的第一平行线、多条沿第二方向的第二平行线、以及子基板的形状线，其中，第二方向与第一方向垂直，多条第二平行线与多条第一平行线交叉，相互交叉的第一平行线与第二平行线之间围成用于刻画子基板形状的区域，形状线位于用于刻画子基板形状的区域内；
在用于刻画子基板形状的区域内，在形状线外侧刻画辅助分裂线；且辅助分裂线朝向形状线的端部距离形状线的最小距离位于第一设定阈值内。
在上述实施例中，通过设置的第一平行线、第二平行线及辅助分裂线来帮助分裂基板，可增加基板切割时的应力破坏点，从而方便基板的切割，可避免玻璃基板在切割时出现破裂的情况，可有效的提高基板切割的成品率，避免材料的浪费。同时，该切割方法的切割路径设计合理、巧妙，切割的基板能够完全分离，具备自动取出条件。
为了方便对本发明实施例的理解，下面结合图1、图2、图3、图4、图5、图6以及具体的实施例进行详细的描述：
本发明实施例提供一种利用激光切割基板的方法，该方法包括以下步骤。
步骤001、在基板上刻画出多条沿第一方向的第一平行线及多条沿第二方向的第二平行线，其中，第二方向与第一方向垂直，多条第二平行线与多条第一平行线交叉，相互交叉的第一平行线与第二平行线之间围成用于刻画子基板形状的区域；
例如，在基板10上刻画出多条第一平行线20及第二平行线30，其中，第一方向为水平方向，第二方向为竖直方向，因此，多个第一平行线20及第二平行线30围成矩形框，在切割时，可以根据玻璃基板10的大小来刻画第 一平行线20及第二平行线30，如图2所示，根据基板10的大小，可以采用错位设置的第二平行线30，围成三个矩形框，从而能够最大限度的利用基板10的材料。亦可形成呈阵列形式排布的多个矩形框，在此对此不作限定。
步骤002、在用于刻画子基板形状的区域内刻画出子基板的形状线50；
例如，在基板10上刻画出形状线50，该形状线50可根据子基板的形状的不同而形成不同形状的线条。如图2、图5及图6所示，图2中示出的形状线50为带圆角的矩形线。图5中示出的形状线为在图2示出的形状线上设置了一个凹陷的缺口。图6示出的形状线为一椭圆形的线。需要说明的是，该形状线的形状不限于此，可以根据实际的需要进行刻画。
此外，在刻画时，第一平行线20与靠近该第一平行线一侧的形状线50的线条的最小距离位于第二设定阈值内；第二平行线30与靠近该第二平行线一侧的形状线50的线条的距离位于第二设定阈值内，例如，第二设定阈值为0.5mm～1.5mm。如：0.5mm、0.7mm、0.9mm、1.1mm、1.2mm、1.5mm等任意介于0.5mm～1.5mm之间的数值，例如，第一平行线20与靠近该第一平行线一侧的形状线50的线条的距离为0.5mm；第二平行线30与靠近该第二平行线一侧的形状线50的线条的距离为0.5mm。
步骤003、在用于刻画子基板形状的区域内，在形状线50外侧60刻画有辅助分裂线40；且辅助分裂线40朝向形状线50的端部距离形状线50的最小距离位于第一设定阈值内。
例如，根据不同的形状线50刻画出不同的辅助分裂线40来帮助分裂基板10。其中，如图2所示，在形状线50为矩形线，且矩形线的边角为圆角，每个圆角对应一个第一平行线20与第二平行线30的交汇点，辅助分裂线40为沿每个第一平行线20与第二平行线30的交汇点朝向其对应的圆角方向的直线或弧形线，或辅助分裂线40为其两端分别与相邻的第一平行线20及第二平行线30相连的折线，辅助分裂线40朝向形状线50的端部为折线的拐角。例如，辅助分裂线40为了帮助分裂圆角处的形状，避免在切割时，圆角处的形状线50出现破裂，可在圆角处刻画辅助分裂线40。该辅助分裂线40的形状可以根据实际情况选择不同的形状。且辅助分裂线40不限于上述描述中，例如，辅助分裂线40可以一端位于与第一平行线20及第二平行线30交汇点，如图2所示，该端还可以位于第一平行线20或第二平行线30上。
对图2中所示的形状线50：该辅助分裂线40可以包括以下几种：
如图2所示，该辅助分裂线40为直线，该直线沿第一平行线20与第二平行线30的交汇点指向该交汇点对应的圆角，且直线靠近圆角的一端距离圆角的最小距离位于第一设定阈值内。如图2所示，图2示出的距离d为直线靠近圆角的一端距离圆角的距离。例如，在辅助分裂线40采用直线时，辅助分裂线40为其连接的第一平行线20及第二平行线30之间夹角的角平分线。以方便刻画。
如图3所示，该辅助分裂线40为弧形线，该弧形线沿第一平行线20与第二平行线30的交汇点指向该交汇点对应的圆角，且弧形线靠近圆角的一端距离圆角的最小距离位于第一设定阈值内。
如图4所示，该辅助分裂线40为折线，该辅助分裂线40为其两端分别与相邻的第一平行线20及第二平行线30相连的折线，辅助分裂线40朝向形状线50的端部为折线的拐角，该拐角距离其对应的圆角的最小距离位于第一设定阈值内。
针对图5所示的形状线50，该辅助分裂线40除包括图2、图3及图4示出的任一类型的线条外，还包括设置在凹陷的折弯线内的X形线；且该X形线的端部与其靠近的形状线50的最小距离应位于第一设定阈值内。
在图6所示的形状线50，该形状线50为椭圆形线，椭圆形线的长轴位于形成用于刻画子基板形状的区域的两条第二平行线30的中线上，辅助分裂线40为沿每个第一平行线20与第二平行线30的交汇点朝向其对应的长轴端刻画的弧形线。且该弧形线与对应的形状线50的最小距离位于第一设定阈值内。椭圆形线的长轴也可以位于形成用于刻画子基板形状的区域的两条第一平行线20的中线上。
通过上述描述可以看出，通过设置的辅助分裂线40可切分第一平行线20、第二平行线30以及形状线50之间的部分，从而方便基板10在切割时形成不同的小块，避免在切割时出现裂纹的情况。为了保证辅助分裂线40与形状线50之间的间距能够保证辅助分裂线40能够将基板进行分裂，该第一设定阈值例如为50μm～150μm，如：50μm、60μm、80μm、90μm、100μm、120μm、150μm等任意介于50μm～150μm之间的数值。例如，辅助分裂线40朝向形状线50的端部距离形状线50的最小距离为100μm。
应当理解的是，上述具体实施例仅是给出具体的操作方式，任何包含采用辅助分裂线40来进行切割基板10的技术方案，应当都包含在本发明的内容中，如步骤001与步骤002在刻画时的先后顺序，可以根据实际需要确定，即可以先按照上述具体实施例中所示的先刻画第一平行线20及第二平行线30，再刻画形状线50；也可以采用先刻画形状线50，之后再刻画第一平行线20及第二平行线30。其原理与上述具体实施例的原理相同，在此不再详细赘述。
本发明实施例提供的利用激光切割基板的方法中，通过设置的辅助分裂线来帮助分裂基板，可避免玻璃基板在切割时出现破裂的情况，有效提高基板切割的成品率，避免材料的浪费。同时，该切割方法的切割路径设计合理、巧妙，切割的基板能够完全分离，具备自动取出条件。
本发明实施例提供的利用激光切割基板的方法中，在刻画各线条时，在基板上形成微裂纹，在各线条刻画完成后，在应力的作用下，基板即可分裂开来，完成切割，获得所需形状的子基板。若基板未能分裂开来的，可再进行激光切割，利用热胀冷缩的原理完成切割。
本发明实施例还提供一种激光切割设备，该设备包括：激光刀以及与激光刀连接的控制装置，其中，
控制装置内设定有控制激光刀在基板上刻画第一平行线、第二平行线、形状线及辅助分裂线的行程；且辅助分裂线朝向形状线的端部距离形状线的最小距离位于第一设定阈值内；
激光刀按照设定的行程在基板上刻画出第一平行线、第二平行线、形状线及辅助分裂线。
其中，该设定有控制激光刀在基板上刻画第一平行线、第二平行线、形状线及辅助分裂线的行程包括：控制激光刀在基板上刻画出多条沿第一方向的第一平行线、多条沿与第一方向垂直的第二方向的并与第一平行线交叉的第二平行线，以及子基板的形状线，其中，相互交叉的第一平行线与第二平行线之间围成用于刻画子基板形状的区域，形状线位于用于刻画子基板形状的区域内，在用于刻画子基板形状的区域内，在形状线外侧刻画辅助分裂线；且辅助分裂线朝向形状线的端部距离形状线的最小距离位于第一设定阈值内。
在上述实施例中，控制装置设置辅助分裂线的路径，并控制激光刀切割辅助分裂线来帮助分裂基板，可避免玻璃基板在切割时出现破裂的情况，可有效的提高基板切割的成品率，避免材料的浪费。同时，该切割方法的切割路径设计合理、巧妙，切割的基板能够完全分离，具备自动取出条件。
显然，本领域的技术人员可以对本发明进行各种改动和变型而不脱离本发明的精神和范围。这样，倘若本发明的这些修改和变型属于本发明权利要求及其等同技术的范围之内，则本发明也意图包含这些改动和变型在内。
本专利申请要求于2014年9月29日递交的中国专利申请第201410515814.9号的优先权，在此全文引用上述中国专利申请公开的内容以作为本申请的一部分。

Claims (12)

  1. 一种利用激光切割基板的方法，包括以下步骤：
    在基板上刻画出多条沿第一方向的第一平行线、多条沿第二方向的第二平行线、以及子基板的形状线，其中，所述第二方向与所述第一方向垂直，多条所述第二平行线与多条所述第一平行线交叉，所述相互交叉的第一平行线与第二平行线之间围成用于刻画子基板形状的区域，所述形状线位于所述用于刻画子基板形状的区域内；
    在所述用于刻画子基板形状的区域内，在所述形状线外侧刻画辅助分裂线；且所述辅助分裂线朝向所述形状线的端部距离所述形状线的最小距离位于第一设定阈值内。
  2. 根据权利要求1所述的利用激光切割基板的方法，其中，所述在基板上刻画出多条沿第一方向的第一平行线、多条沿第二方向的第二平行线，以及子基板的形状线，其中，所述第二方向与所述第一方向垂直，所述第二平行线与所述第一平行线交叉，所述相互交叉的第一平行线与第二平行线之间围成用于刻画子基板形状的区域，所述形状线位于所述用于刻画子基板形状的区域内包括：
    在基板上刻画出多条沿第一方向的第一平行线及多条沿第二方向的第二平行线，其中，所述第二方向与所述第一方向垂直，所述第二平行线与所述第一平行线交叉，所述相互交叉的第一平行线与第二平行线之间围成用于刻画子基板形状的区域；
    在所述用于刻画子基板形状的区域内刻画出子基板的形状线。
  3. 根据权利要求1所述的利用激光切割基板的方法，其中，所述形状线为矩形线，且矩形线的边角为圆角，每个圆角对应一个第一平行线与第二平行线的交汇点；
    所述辅助分裂线为沿每个第一平行线与第二平行线的交汇点朝向其对应的圆角方向的直线或弧形线，或所述辅助分裂线为其两端分别与相邻的第一平行线及第二平行线相连的折线，所述辅助分裂线朝向所述形状线的端部为折线的拐角。
  4. 根据权利要求3所述的利用激光切割基板的方法，其中，所述形状线 的一端具有凹陷的折弯线，所述辅助分裂线还包括设置在所述凹陷的折弯线内的X形线。
  5. 根据权利要求1所述的利用激光切割基板的方法，其中，所述辅助分裂线为其连接的第一平行线及第二平行线之间夹角的角平分线。
  6. 根据权利要求1所述的利用激光切割基板的方法，其中，所述形状线为椭圆形线，所述椭圆形线的长轴位于形成用于刻画子基板形状的区域的两条第一平行线或两条第二平行线的中线上，所述辅助分裂线为沿每个第一平行线与第二平行线的交汇点朝向其对应的长轴端刻画的弧形线。
  7. 如权利要求1～6任一项所述的利用激光切割基板的方法，其中，所述第一平行线与所述形状线靠近其一侧的线条的距离位于第二设定阈值内；所述第二平行线与所述形状线靠近其一侧的线条的距离位于第二设定阈值内。
  8. 如权利要求7所述的利用激光切割基板的方法，其中，所述第二设定阈值为0.5mm～1.5mm。
  9. 如权利要求8所述的利用激光切割基板的方法，其中，所述第一平行线与靠近该第一平行线一侧的所述形状线的线条的最小距离为0.5mm；所述第二平行线与靠近该第二平行线一侧的所述形状线的线条的最小距离为0.5mm。
  10. 如权利要求1或8所述的利用激光切割基板的方法，其中，所述第一设定阈值为50μm～150μm。
  11. 如权利要求10所述的激光切割基板的方法，其特征在于，所述第一设定阈值为100μm。
  12. 一种激光切割设备，包括：激光刀以及与所述激光刀连接的控制装置，其中，
    所述控制装置内设定有控制所述激光刀在基板上刻画第一平行线、第二平行线、形状线及辅助分裂线的行程；第一平行线沿第一方向，第二平行线沿第二方向，所述第二方向与所述第一方向垂直，所述第二平行线与所述第一平行线交叉，所述相互交叉的第一平行线与第二平行线之间围成用于刻画子基板形状的区域，所述形状线位于所述用于刻画子基板形状的区域内；在所述用于刻画子基板形状的区域内，在所述形状线外侧刻画辅助分裂线，且 辅助分裂线朝向所述形状线的端部距离所述形状线的最小距离位于第一设定阈值内；
    所述激光刀按照所述设定的行程在基板上刻画出第一平行线、第二平行线、形状线及辅助分裂线。
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