WO2016041265A1 - 一种倒装式电子器件引脚成型装置 - Google Patents

一种倒装式电子器件引脚成型装置 Download PDF

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Publication number
WO2016041265A1
WO2016041265A1 PCT/CN2014/093380 CN2014093380W WO2016041265A1 WO 2016041265 A1 WO2016041265 A1 WO 2016041265A1 CN 2014093380 W CN2014093380 W CN 2014093380W WO 2016041265 A1 WO2016041265 A1 WO 2016041265A1
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Prior art keywords
positioning
electronic device
die
die table
forming apparatus
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PCT/CN2014/093380
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English (en)
French (fr)
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苏松得
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苏松得
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21D—WORKING OR PROCESSING OF SHEET METAL OR METAL TUBES, RODS OR PROFILES WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21D22/00—Shaping without cutting, by stamping, spinning, or deep-drawing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21D—WORKING OR PROCESSING OF SHEET METAL OR METAL TUBES, RODS OR PROFILES WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21D22/00—Shaping without cutting, by stamping, spinning, or deep-drawing
    • B21D22/02—Stamping using rigid devices or tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21D—WORKING OR PROCESSING OF SHEET METAL OR METAL TUBES, RODS OR PROFILES WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21D43/00—Feeding, positioning or storing devices combined with, or arranged in, or specially adapted for use in connection with, apparatus for working or processing sheet metal, metal tubes or metal profiles; Associations therewith of cutting devices
    • B21D43/003—Positioning devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21D—WORKING OR PROCESSING OF SHEET METAL OR METAL TUBES, RODS OR PROFILES WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21D45/00—Ejecting or stripping-off devices arranged in machines or tools dealt with in this subclass
    • B21D45/06—Stripping-off devices

Definitions

  • the present invention relates to an electronic device processing apparatus, and more particularly to an electronic device lead forming apparatus.
  • SOP Small Out-Line Package
  • MMIc microwave monolithic integration
  • McM multi-chip components
  • optical integration technologies It combines microwave and RF front-end, digital and analog signal processing circuits, memory, and optical components.
  • a quadratic integration technology that integrates the module in a single package.
  • the processing of the pins of the SOP-packaged electronic components is usually done in a formal process.
  • the upper and lower die are used to cut and shape the pins.
  • the number of tools consumed is low, and the efficiency is low.
  • Different degrees of wear lead to uneven flatness of the pins.
  • the front-mounted molds need to be positioned and collided in the tube for positioning due to the pin-down after molding. If there is any improper operation, The lead is deformed, it is not easy to enter the tube, and due to the large mechanical friction, the tin plating layer is easily damaged, which affects the product quality and the life of the mold.
  • a technical problem to be solved by embodiments of the present invention is to provide a flip-chip electronic device lead forming apparatus. It can efficiently form the lead of the electronic device and reduce the defect rate.
  • an embodiment of the present invention provides a flip-chip electronic device lead forming device, which comprises a stamper, a die table, a press holder, and a positioning device, and the stamper is opened and closed with the die table.
  • the pressing frame is rotatably disposed between the stamper and the die table;
  • the die table has a receiving groove of the sealing body of the electronic device;
  • the positioning mechanism includes a seat disposed at the bottom of the pressing frame Determining a bead corresponding to the groove, a positioning angle of the positioning material piece disposed on the die table; an edge of the receiving groove on both sides and the The die fit cooperates to stamp the pins of the electronic device.
  • the present invention further includes an air blowing device and an inlet pipe device respectively disposed on both ends of the accommodating groove, wherein the air blowing device supplies air to the accommodating groove by providing air holes, and the pipe feeding device has a storage pipe groove and a receiving device The tube is fixed to the cover.
  • the positioning mechanism further includes at least one positioning pin disposed on the die table, and the positioning pin is cooperatively positioned with the positioning hole provided on the raw material piece.
  • the die table is provided with a sliding table on the side of the receiving groove.
  • the die table is provided with a slide bar
  • the stamper is provided with a shaft hole that is slidably engaged with the slide bar.
  • the present invention performs flip-chip stamping on the pins of the electronic device through the accommodating groove and the stamper, so that the pin height is uniform, and the stamper is easy to maintain, and the positioning mechanism is used to make the raw material.
  • the sheet is accurately positioned to improve the yield, and the stamped product is automatically collected into the tube through the air blowing device and the inlet device, thereby reducing manpower operation.
  • Figure 1 is a schematic view of the overall structure of the present invention
  • FIG. 2 is a schematic structural view of a press holder rotated on a die table
  • Figure 3 is a schematic view showing another structure of the press holder rotating on the die table
  • Figure 4 is a schematic structural view of a die table
  • FIG. 5 is a schematic structural view of a receiving groove on a die table, a positioning angle, and a positioning pin;
  • Figure 6 is a schematic structural view of a slide table on a die table
  • Figure 7 is a schematic structural view of the inlet pipe device
  • Figure 8 is a schematic structural view of an air blowing device
  • Fig. 9 is a structural diagram of a raw material sheet.
  • FIG. 1 Referring to the overall structural diagram of the present invention shown in FIG. 1
  • a flip-chip electronic device lead forming device includes a stamper 10, a die table 20, a press holder 30, and a positioning device.
  • a sliding rod 21 is disposed at the rear of the die table 20, and the die 10 is provided with a shaft hole 11 which is slidably engaged with the sliding rod, and is connected to the die table 20 through the shaft hole 11 and the sliding bar 21 by the die 10.
  • the pressure holder 30 is rotatably connected to the shaft seat provided on the die table 20 through the rotating shaft, and is placed between the stamper 10 and the die table 20.
  • the mold base 20 is provided with a receiving groove 22 for the sealing body of the electronic device.
  • the number of the receiving grooves 22 can be set according to actual needs. In the embodiment of the present invention, preferably two And set it side by side.
  • the positioning mechanism 40 includes a bead 41 disposed on the pressing frame 30 corresponding to the receiving groove 22, at least two positioning angles 42 disposed on the die table 20, and at least one positioning pin 43 disposed on the die table, as shown in FIG. 5.
  • the positioning angles 42 are preferably four, which are respectively disposed at four outer corners of the accommodating groove 22, and the positioning pins 43 are preferably two, which are disposed in the two accommodating grooves 22.
  • the positioning angle 32 is used for fixing the raw material sheet 70.
  • the raw material sheet is shown in the structural diagram of FIG. 9.
  • the raw material sheet 70 is disposed on the positioning hole 71 corresponding to the positioning pin 43, and the raw material sheet 70 is further positioned by the positioning 43. Further, the sealing body on the raw material sheet is fixed in the accommodating groove 22 by the bead 41, thereby preventing the sealing body from being displaced and affecting the quality.
  • the stamper 10 is pressed against the die table 20 such that the pins of the electronic device in the accommodating groove 22 are press-formed under the cooperation of the edge of the accommodating groove 22 and the stamper 10 of the 22a.
  • the die table 20 is provided with a sliding table 23 on the side of the receiving groove 22, as shown in FIG. 5 and FIG.
  • the embodiment further includes being respectively disposed in the receiving slot.
  • the inlet pipe device 50 and the air blowing device 60 at both ends of the 22 are provided with a storage pipe groove 51 and a storage pipe fixing cover 52.
  • the storage pipe is inserted into the storage pipe groove 51 and the accommodation groove 22 through the fixed cover 52.
  • the air blowing device 60 is disposed on the other end of the accommodating groove 22, and the air blowing device 60 is provided with an air hole 61 connecting the air pipe.
  • the lead of the electronic device is stamped and formed, and then blown by the air blowing device 60, so that the finished product slides into the receiving tube through the receiving groove 22 and the receiving tube groove 51, and the bead 41 is ensured.
  • the seal is limited to the receiving groove 22, so that the finished product is quickly received in the receiving tube.
  • the invention performs flip-chip stamping forming on the pins of the electronic device, avoids the problem of inconsistent pin height, and the stamper is easy to maintain or replace, and the three-layer positioning enables the raw material sheet to be accurately positioned to improve the yield, and the air blowing device is utilized.
  • the finished product in the accommodating tank is automatically blown into the accommodating tube, so that the molding and storage are completed in one time, and the production efficiency is improved.

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)

Abstract

一种倒装式电子器件引脚成型装置，包括压模(10)、模台(20)、压料架(30)、定位装置，所述压模与所述模台开合连接，所述压料架转动设置于所述压模与模台之间；所述模台具有电子器件的封体的容置槽(22)；所述定位机构包括设置于所述压料架底部的与所述容置槽对应的压条(41)、设置在所述模台上的定位原料片的定位角(42)；所述容置槽两侧的边缘与所述压模配合使所述电子器件的引脚冲压成型。该引脚装置中的引脚高度一致，并且压模易于维护，原料片定位准确，成品率提高。

Description

一种倒装式电子器件引脚成型装置 技术领域
本发明涉及一种电子器件加工设备，尤其涉及一种电子器件引脚成型装置。
背景技术
SOP(Small Out-Line Package小外形封装)是一种很常见的元器件形式。表面贴装型封装之一，引脚从封装两侧引出呈海鸥翼状(L字形或S型)。材料有塑料和陶瓷两种。SOP是在微波单片集成(MMIc)、多芯片组件(McM)、数字与模拟集成以及光集成技术基础上，将微波与射频前端、数字与模拟信号处理电路、存储器以及光器件等多个功能模块集成在一个封装内的一种二次集成技术，
而对SOP封装的电子器件的引脚进行加工通常采用的是正装加工方式，其使用上下刀模对引脚进行切段并成型，所耗费的刀具数量多，其效率低，长期使用还导致刀具不同程度的磨损，导致引脚不统一平整，另一方面，正装式模具由于成型后引脚向下，在进行定位时需要定位胶体及引脚，以便收集入管中，操作过程中如有不当将导致引脚变形，不易进管，且由于机械摩擦大，使镀锡层容易破坏，致使影响产品质量以及模具寿命。
发明内容
本发明实施例所要解决的技术问题在于，提供一种倒装式电子器件引脚成型装置。可高效率地对电子器件的引脚成型，且降低了次品率。
为了解决上述技术问题，本发明实施例提供了一种倒装式电子器件引脚成型装置，包括压模、模台、压料架、定位装置，所述压模与所述模台开合连接，所述压料架转动设置于所述压模与模台之间；所述模台具有电子器件的封体的容置槽；所述定位机构包括设置于所述压料架底部的与所述容置槽对应的压条、设置在所述模台上的定位原料片的定位角；所述容置槽两侧的边缘与所述 压模配合使所述电子器件的引脚冲压成型。
进一步地，还包括分别设置于所述容置槽两端上的吹气装置与入管装置，所述吹气装置通过设置气孔对所述容置槽送气，所述入管装置具有收纳管槽以及收纳管固定盖板。
进一步地，所述定位机构还包括设置于所述模台上的至少一个定位针，所述定位针与所述原料片上设置的定位孔配合定位。
更进一步地，所述模台于所述容置槽侧面上设置有滑料台。
更进一步地，所述模台设置有滑杆，所述压模设置有与所述滑杆升降滑动配合的轴孔。
实施本发明实施例，具有如下有益效果：本发明通过容置槽与压模对电子器件的引脚进行倒装式冲压成型，使得引脚高度一致，并且压模易于维护，采用定位机构使得原料片准确定位，提高成品率，通过吹气装置与入管装置将冲压成型的成品自动收集入管，减少了人力操作。
附图说明
图1是本发明的整体结构示意图；
图2是压料架转动设置于模台上的结构示意图；
图3是压料架转动设置于模台上的又一结构示意图；
图4是模台的结构示意图；
图5是模台上的容置槽以及定位角、定位针的结构示意图；
图6是模台上的滑料台的结构示意图；
图7是入管装置的结构示意图；
图8是吹气装置的结构示意图；
图9是原料片的结构示图。
具体实施方式
为使本发明的目的、技术方案和优点更加清楚，下面将结合附图对本发明作进一步地详细描述。
参照图1所示的本发明的整体结构示意图。
本发明实施例的一种倒装式电子器件引脚成型装置，包括了压模10、模台20、压料架30、定位装置。
模台20后部设置有滑杆21，压模10上设置有与滑杆升降滑动配合的轴孔11，通过轴孔11、滑杆21压模10与模台20开合连接。
如图2、图3所示结构示意图，压料架30通过转轴与模台20上设置的轴座转动连接，并且置于压模10、模台20之间。
再结合图4所示结构示意图，模台20上设置有电子器件的封体的容置槽22，容置槽22的数量可以根据实际需要进设置，在本发明实施例中，优选为两条，且为并列设置。
定位机构40包括了设置于压料架30上与容置槽22对应的压条41、设置于模台20上的至少两个定位角42、设置于模台上至少一个定位针43，如图5所示结构示意图，在本实施例中，定位角42优选为四个，分别设置于容置槽22外侧四个边角，而定位针43优选为两个，设置于两个容置槽22之间，定位角32用于固定位原料片70，原料片如图9所示结构示意图，原料片70上设置于与定位针43对应位置的定位孔71，通过定位43进一步将原料片70定位，而进一步通过压条41将原料片上的封体固定于容置槽22内，防止封体走位而影响质量。
压模10与模台20压合，使得容置槽22内的电子器件的引脚在容置槽22的边缘与22a压模10的配合下冲压成型。
为了使冲压引脚产生的废料及时滑落不造成堆积，模台20于容置槽22侧边上设置了滑料台23，如图5、图6所示结构示意图。
参照图7、图8所示的结构示意图，本实施例还包括了分别设置于容置槽 22两端上的入管装置50与吹气装置60，入管装置50上设置有收纳管槽51以及收纳管固定盖板52，收纳管通过固定盖板52插入收纳管槽51中与容置槽22一端对应，吹气装置60设置于容置槽22的另一端上，吹气装置60上设置有连接气管的气孔61。在压模10与模台20压合，电子器件的引脚冲压成型后，通过吹气装置60吹气，使得成品通过容置槽22、收纳管槽51滑入收纳管中，而压条41保证了封体限制于容置槽22中，使得成品快速收于收纳管中。
本发明对电子器件的引脚进行倒装式的冲压成型，避免了引脚高度不一致的问题，压模易于维护或更换，通过三层定位使得原料片准确定位，提高成品率，利用吹气装置对容置槽中的成品自动吹入收纳管中，使得成型、收纳一次性完成，提高了生产效率。
以上所揭露的仅为本发明一种较佳实施例而已，当然不能以此来限定本发明之权利范围，因此依本发明权利要求所作的等同变化，仍属本发明所涵盖的范围。

Claims (5)

  1. 一种倒装式电子器件引脚成型装置，其特征在于，包括压模、模台、压料架、定位装置，所述压模与所述模台开合连接，所述压料架转动设置于所述压模与模台之间；所述模台具有电子器件的封体的容置槽；所述定位机构包括设置于所述压料架底部的与所述容置槽对应的压条、设置在所述模台上的定位原料片的定位角；所述容置槽两侧的边缘与所述压模配合使所述电子器件的引脚冲压成型。
  2. 根据权利要求1所述的倒装式电子器件引脚成型装置，其特征在于，还包括分别设置于所述容置槽两端上的吹气装置与入管装置，所述吹气装置通过设置气孔对所述容置槽送气，所述入管装置具有收纳管槽以及收纳管固定盖板。
  3. 根据权利要求1所述的倒装式电子器件引脚成型装置，其特征在于，所述定位机构还包括设置于所述模台上的至少一个定位针，所述定位针与所述原料片上设置的定位孔配合定位。
  4. 根据权利要求2或3所述的倒装式电子器件引脚成型装置，其特征在于，所述模台于所述容置槽侧面上设置有滑料台。
  5. 根据权利要求4所述的倒装式电子器件引脚成型装置，其特征在于，所述模台设置有滑杆，所述压模设置有与所述滑杆升降滑动配合的轴孔。
PCT/CN2014/093380 2014-09-15 2014-12-09 一种倒装式电子器件引脚成型装置 WO2016041265A1 (zh)

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CN116493510B (zh) * 2023-03-13 2023-09-29 江苏上达半导体有限公司 一种电子元件引脚成型设备
CN118023429A (zh) * 2024-04-11 2024-05-14 江苏丰泓半导体科技有限公司 一种固态电容器引脚成型处理设备
CN118060451A (zh) * 2024-04-18 2024-05-24 珠海瑞鑫智能科技有限公司 一种高精度多引脚成型设备

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