WO2016017511A1 - Composant électronique et son procédé de production - Google Patents

Composant électronique et son procédé de production Download PDF

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Publication number
WO2016017511A1
WO2016017511A1 PCT/JP2015/070908 JP2015070908W WO2016017511A1 WO 2016017511 A1 WO2016017511 A1 WO 2016017511A1 JP 2015070908 W JP2015070908 W JP 2015070908W WO 2016017511 A1 WO2016017511 A1 WO 2016017511A1
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WIPO (PCT)
Prior art keywords
main body
electronic component
coating film
magnetic powder
manufacturing
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PCT/JP2015/070908
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English (en)
Japanese (ja)
Inventor
博信 久保田
光典 井上
上田　佳功
裕介 荒川
北島　正樹
剛太 篠原
典子 清水
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株式会社村田製作所
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Publication of WO2016017511A1 publication Critical patent/WO2016017511A1/fr

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type 
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/02—Casings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/28—Coils; Windings; Conductive connections
    • H01F27/29—Terminals; Tapping arrangements for signal inductances
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
    • H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
    • H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils

Definitions

  • the present invention relates to an electronic component and a manufacturing method thereof, and more particularly, to an electronic component using a mixture of metal magnetic powder and an insulating material and a manufacturing method thereof.
  • an end surface electrode forming method for an electronic component described in Patent Document 1 is known.
  • electrolytic plating is performed using the conductive material attached to the end face of the main body as a conductive layer. Thereby, an end surface electrode is formed on the end surface of the main body of the electronic component.
  • a mixture of metal magnetic powder and an insulating material may be used as a material for the main body of an electronic component.
  • the main body is produced by cutting the mother main body with a dicer or the like. Then, at the time of cutting, the metal magnetic powder exposed on the surface of the main body falls off, and a recess is formed on the surface of the main body. Therefore, when the end face electrode is formed on the main body by the end face electrode forming method described in Patent Document 1, a plating film may not be sufficiently formed in the recess, and a pin hole may be formed in the end face electrode.
  • a pinhole means the part in which a conductor film is not formed in an end surface electrode.
  • the shape of the pinhole is generally a circle or an ellipse in many cases, but is not particularly limited to these shapes.
  • An object of the present invention is to provide an electronic component capable of suppressing the formation of a pinhole in an external electrode and a manufacturing method thereof.
  • An electronic component includes a main body made of a mixture of metal magnetic powder and an insulating material, a circuit element provided in the main body, and a coating that covers at least a part of the surface of the main body. And a film, and an external electrode electrically connected to the circuit element and provided on the coating film.
  • An electronic component manufacturing method includes a main body manufacturing step in which a mother body, which is an assembly of a plurality of main bodies each provided with a circuit element, is manufactured using a mixture of metal magnetic powder and an insulating material.
  • pinholes can be prevented from being formed in the external electrode.
  • FIG. 1 is an external perspective view of an electronic component 1.
  • FIG. 1 is an exploded perspective view of a main body 10 of an electronic component 1.
  • FIG. 2 is a sectional structural view and a partially enlarged view taken along line AA of FIG.
  • FIG. 3 is a process cross-sectional view when the electronic component 1 is manufactured.
  • FIG. 3 is a process cross-sectional view when the electronic component 1 is manufactured.
  • FIG. 3 is a process cross-sectional view when the electronic component 1 is manufactured.
  • FIG. 3 is a process cross-sectional view when the electronic component 1 is manufactured.
  • FIG. 3 is a process cross-sectional view when the electronic component 1 is manufactured.
  • FIG. 3 is a process cross-sectional view when the electronic component 1 is manufactured.
  • FIG. 3 is a process cross-sectional view when the electronic component 1 is manufactured.
  • FIG. 3 is a process cross-sectional view when the electronic component 1 is manufactured.
  • FIG. 3 is a process cross-sectional view when the
  • FIG. 3 is a process cross-sectional view when the electronic component 1 is manufactured.
  • FIG. 3 is a process cross-sectional view when the electronic component 1 is manufactured.
  • FIG. 3 is a process cross-sectional view when the electronic component 1 is manufactured. It is the figure which planarly viewed the jig
  • FIG. FIG. 2 is a view showing a main body 10 when forming external electrodes 20 and 25.
  • FIG. 2 is a view showing a main body 10 when forming external electrodes 20 and 25.
  • FIG. 2 is a view showing a main body 10 when forming external electrodes 20 and 25.
  • FIG. 1 is an external perspective view of the electronic component 1.
  • FIG. 2 is an exploded perspective view of the main body 10 of the electronic component 1.
  • 3 is a cross-sectional structural view and a partially enlarged view taken along line AA in FIG.
  • the stacking direction of the main body 10 is defined as the vertical direction. Further, when viewed from above, the direction in which the long side of the main body 10 extends is defined as the left-right direction, and the direction in which the short side of the main body extends is defined as the front-back direction.
  • the up-down direction, the left-right direction, and the front-rear direction are orthogonal to each other.
  • the electronic component 1 includes a coating film 9, a main body 10, external electrodes 20, 25, and a circuit element 30, as shown in FIGS.
  • the main body 10 has a rectangular parallelepiped shape.
  • the upper surface of the main body 10 is referred to as the upper surface, the lower surface as the bottom surface S1, the right surface as the right surface S2, the left surface as the left surface S3, the front surface as the front surface, and the rear surface as the rear surface.
  • the main body 10 includes insulator layers 11 to 14, an insulator substrate 16, and a magnetic path 18.
  • the insulator layers 11 and 12, the insulator substrate 16, and the insulator layers 13 and 14 have a rectangular shape when viewed from above, and are stacked in this order from the upper side to the lower side.
  • the upper main surface of the insulator layers 11 to 14 and the insulator substrate 16 is referred to as a front surface
  • the lower main surface of the insulator layers 11 to 14 and the insulator substrate 16 is referred to as a back surface.
  • the bottom surface S1 is a mounting surface that faces the circuit board when the electronic component 1 is mounted on the circuit board.
  • the insulator layers 11 and 14 are made of a mixture of a metal magnetic powder and an insulating material.
  • the insulator layers 11 and 14 are made of a mixture of a metal magnetic powder and an epoxy resin.
  • the insulator layers 11 and 14 include two types of metal magnetic powders having different particle sizes.
  • the metal magnetic powder is a mixed powder of magnetic powder (maximum particle size 100 ⁇ m) made of an Fe—Si—Cr alloy having an average particle size of 80 ⁇ m and magnetic powder made of carbonyl Fe having an average particle size of 3 ⁇ m. .
  • the metal magnetic powder is contained in an amount of 90 wt% or more with respect to the insulator layers 11 and 14.
  • the material of the insulator layers 11 and 14 may be a mixture of metal magnetic powder and an insulating inorganic material such as glass ceramics, or a mixture of metal magnetic powder and polyimide resin.
  • the thickness of the insulator layers 11 and 14 in this embodiment is about 60 ⁇ m, which is smaller than the maximum particle size of the metal magnetic powder contained in the insulator layers 11 and 14.
  • the insulator layers 12 and 13 are made of an insulating material, and in this embodiment, are made of an epoxy resin.
  • the insulator layers 12 and 13 may be made of an insulating resin such as benzodiclobutene or an insulating inorganic material such as glass ceramics.
  • the insulator substrate 16 is a printed wiring board in which a glass cloth is impregnated with an epoxy resin, and is sandwiched between the insulator layer 12 and the insulator layer 13 from above and below.
  • the insulator substrate 16 may be made of an insulating resin such as benzodic clobutene or an insulating inorganic material such as glass ceramics.
  • the magnetic path 18 is made of a mixture of metal magnetic powder and an insulating material located substantially in the center of the main body 10. In the present embodiment, 90% by weight or more of magnetic powder is included in consideration of the L value of the electronic component 1 and the direct current superposition characteristics. Furthermore, in order to improve the filling property to the magnetic path 18, two kinds of powders having different particle sizes are mixed as the magnetic powder.
  • the magnetic path 18 has a column shape penetrating the insulating layers 12 and 13 and the insulating substrate 16 in the vertical direction, and has an oval cross-sectional shape. Further, the magnetic path 18 is provided so as to be positioned on the inner periphery of coils 32 and 37 described later.
  • the circuit element 30 is provided in the main body 10 and is built in the main body 10 in this embodiment.
  • the circuit element 30 is made of a conductive material.
  • the circuit element 30 is made of a material containing a metal such as Au, Ag, Cu, Pd, or Ni.
  • the circuit element 30 includes a coil 32, a lead conductor 32a, a coil 37, a lead conductor 37a, and a via-hole conductor 39.
  • the coil 32 is a spiral conductor layer that is provided on the surface of the insulator substrate 16 and approaches the center while turning clockwise when viewed from above.
  • the upstream end of the coil 32 in the clockwise direction is referred to as an upstream end
  • the downstream end of the coil 32 in the clockwise direction is referred to as a downstream end.
  • the coil 37 is a spiral conductor layer that is provided on the back surface of the insulating substrate 16 and turns away from the center while turning clockwise when viewed from above.
  • the coil 37 is illustrated on the surface of the insulating layer 13 from the viewpoint of ease of visual recognition.
  • the upstream end of the coil 37 in the clockwise direction is referred to as an upstream end
  • the downstream end of the coil 37 in the clockwise direction is referred to as a downstream end.
  • the via-hole conductor 39 penetrates the insulator substrate 16 in the vertical direction, and connects the downstream end of the coil 32 and the upstream end of the coil 37. Thereby, the coil 32 and the coil 37 are electrically connected in series.
  • the lead conductor 32 a is provided on the surface of the insulator substrate 16 and is connected to the upstream end of the coil 32. Further, the lead conductor 32 a is drawn to the right short side of the insulator substrate 16. Thereby, the lead conductor 32a is exposed outside the main body 10 from the right surface S2, as shown in FIG.
  • the lead conductor 37 a is provided on the back surface of the insulating substrate 16 and is connected to the downstream end of the coil 37.
  • the lead conductor 37 a is illustrated on the surface of the insulator layer 13 from the viewpoint of easy visual recognition. Further, the lead conductor 37 a is drawn to the left short side of the insulating substrate 16. Thereby, the lead conductor 37a is exposed outside the main body 10 from the left surface S3, as shown in FIG.
  • the coating film 9 covers at least a part of the surface of the main body 10, and covers substantially the entire surface of the main body 10 in this embodiment. However, the coating film 9 does not cover the portion where the circuit element 30 is exposed on the surface of the main body 10 (that is, the lead conductors 32a and 37a).
  • the coating film 9 contains a metal and a resin contained in the metal magnetic powder material. That is, the coating film 9 contains an acrylic resin and Fe.
  • the acrylic resin contained in the coating film 9 has a crosslinked structure. In consideration of using solder when mounting the electronic component 1 on the circuit board, it is preferable that the thermal decomposition temperature of the resin constituting the coating film 9 is higher.
  • the thermal decomposition temperature is 240 ° C. or higher.
  • the thermal decomposition temperature can be measured by the following analyzer and analysis conditions. ⁇ Analyzer: TG-DTA 2000SA (manufactured by Netch Japan) ⁇ Analysis conditions Temperature profile: RT ⁇ 300 °C (10 °C / min) Measurement atmosphere: Reduced pressure (using a rotary pump: 0.1 Pa) Sample container (cell) material: Al Measurement sample weight: 100 mg
  • the coating film 9 flattens the surface of the electronic component 1 as shown in the enlarged view of FIG. More specifically, innumerable depressions C are formed on the surface of the main body 10.
  • the dent C is formed by the metal magnetic powder buried in the vicinity of the surface of the main body 10 falling off during manufacturing (particularly during the cutting process).
  • the coating film 9 fills the recess C.
  • the unevenness of the coating film 9 is smaller than the unevenness of the main body 10. That is, the surface roughness Ra of the coating film 9 is smaller than the surface roughness Ra of the main body 10.
  • the external electrode 20 covers the right surface S ⁇ b> 2 of the electronic component 1 and is folded back to the top surface, the bottom surface S ⁇ b> 1, the front surface, and the rear surface of the electronic component 1.
  • the external electrode 20 is provided on the coating film 9. That is, a part of the coating film 9 is provided between the main body 10 and the external electrode 20. Further, the external electrode 20 is electrically connected to the circuit element 30.
  • the lead conductor 32a is not covered with the coating film 9 on the right surface S2, as shown in FIG. Therefore, the external electrode 20 and the lead conductor 32a are in contact with each other.
  • the external electrode 20 is composed of a conductor film in which a Cu film, a Ni film, and a Sn film are laminated from the lower layer side to the upper layer side.
  • the external electrode 25 covers the left surface S ⁇ b> 3 of the electronic component 1 and is folded back to the top surface, the bottom surface S ⁇ b> 1, the front surface, and the rear surface of the electronic component 1.
  • the external electrode 25 is provided on the coating film 9. That is, a part of the coating film 9 is provided between the main body 10 and the external electrode 25. Further, the external electrode 25 is electrically connected to the circuit element 30.
  • the lead conductor 37a is not covered with the coating film 9 on the left surface S3, as shown in FIG. Therefore, the external electrode 25 and the lead conductor 37a are in contact with each other.
  • the external electrode 25 is composed of a conductor film in which a Cu film, a Ni film, and a Sn film are laminated from the lower layer side to the upper layer side.
  • the electronic component 1 configured as described above functions as an inductor when, for example, a signal input from the external electrode 20 is output from the external electrode 25 via the circuit element 30.
  • FIG. 4 to 12 are process cross-sectional views when the electronic component 1 is manufactured.
  • FIG. 13 is a plan view of the jig 200 for holding the main body 10.
  • 14 to 16 are views showing the main body 10 when the external electrodes 20 and 25 are formed.
  • a mother insulator substrate 116 to be a plurality of insulator substrates 16 is prepared. Then, as shown in FIG. 5, the through-hole H ⁇ b> 1 is formed by irradiating a beam to the position where the via-hole conductor 39 of the mother insulator substrate 116 is provided.
  • the thickness of the insulating substrate 16 is preferably 60 ⁇ m or less.
  • Cu plating is further performed to form coils 32 and 37 having a sufficient thickness as shown in FIG.
  • the mother insulating substrate 116 is sandwiched from both the upper and lower sides by the insulating sheets 112 and 113 to be the plurality of insulating layers 12 and 13. Further, the step of sandwiching the mother insulator substrate 116 between the insulator sheets 112 and 113 is preferably performed in a vacuum in order to allow the insulator sheets 112 and 113 to enter the minute gap between the coils 32 and 37. In order to suppress the generation of stray capacitance due to the coils 32 and 37, the relative dielectric constant of the insulator sheets 112 and 113 is preferably 4 or less.
  • a plurality of through holes ⁇ penetrating the mother insulator substrate 116 and the insulator sheets 112 and 113 in the vertical direction are formed by irradiating a beam.
  • the position where the through hole ⁇ is formed is a position where the magnetic path 18 is provided, and is on the inner peripheral side of each of the plurality of coils 32 and 37 provided on the mother insulator substrate 116.
  • the laminated body in which the insulator sheet 112, the mother insulator substrate 116, and the insulator sheet 113 are stacked in this order is moved up and down by the resin sheets 111 and 114 corresponding to the insulator layers 11 and 14.
  • the both sides are sandwiched and crimped in the same manner as the insulator sheets 112 and 113 shown in FIG.
  • the resin sheets 111 and 114 enter the plurality of through holes ⁇ , and a plurality of magnetic paths 18 are formed.
  • the resin sheets 111 and 114 are cured by heat treatment using a thermostat such as an oven.
  • the surfaces of the resin sheets 111 and 114 are ground by buffing, lapping and grinders.
  • the metal magnetic powder embedded in the vicinity of the upper surface and the bottom surface of the mother insulator substrate 116 is dropped, and innumerable depressions are formed on the upper surface and the bottom surface of the mother insulator substrate 116.
  • a mother substrate 120 that is an assembly of a plurality of electronic components is completed.
  • the steps of FIGS. 4 to 10 are main body manufacturing steps for manufacturing the mother substrate 120 that is an aggregate of a plurality of main bodies 10 each provided with the circuit element 30.
  • the mother substrate 120 is cut into a plurality of main bodies 10 with a dicer or the like.
  • the lead conductors 32a and 37a are exposed from the main body 10.
  • the metal magnetic powder embedded in the vicinity of the surface of the main body 10 falls off, and innumerable depressions are formed on the surface of the main body 10.
  • an etching process or a polishing process is performed in order to remove cut chips adhering to the portions where the lead conductors 32 a and 37 a are exposed from the main body 10.
  • the main body 10 was immersed in a ferric chloride solution and subjected to an etching process.
  • a coating film 9 is formed on the surface of the main body 10. More specifically, the main body 10 is immersed in a mixed solution containing a commercially available latex in which an etching component and a resin component are dispersed in an aqueous solvent and an etching promoting component and a surfactant added as necessary.
  • the specific composition of the mixed solution is shown in Table 1.
  • the surface of the main body 10 is etched. This etching is due to the action of sulfuric acid and hydrogen peroxide contained in the mixed solution.
  • various organic acids such as hydrofluoric acid, nitric acid, hydrochloric acid, phosphoric acid, and carboxylic acid may be used in place of the sulfuric acid and the hydrogen peroxide solution in the mixed solution.
  • this etching ionizes Fe, which is a cationic element, which is a constituent element of the insulator layers 11 and 14. Further, the ionized cationic element reacts with Nipo lLATEX SX-1706A (manufactured by Nippon Zeon Co., Ltd.) in the mixed solution. As a result, as shown in FIG. 12, the resin component in the mixed solution is neutralized and settles on the surface of the main body 10 constituting the electronic component, and the main body 10 is covered with the coating film 9. However, the lead conductors 32 a and 37 a are not covered with the coating film 9.
  • the metal (Cu) contained in the material of the lead conductors 32a and 37a is less likely to be ionized than the metal (Fe) contained in the material of the metal magnetic powder, and does not easily react with the resin component in the mixed solution.
  • Eleminol JS-2 (manufactured by Sanyo Chemical Co., Ltd.) contained in the mixed solution is a surfactant that adjusts the reaction amount of Fe and the resin component. Thereby, the thickness of the coating film 9 can be adjusted.
  • the coating film 9 is subjected to heat treatment after being washed with pure water and drained.
  • the resin component contained in the coating film 9 is crosslinked through Fe or between the resin components.
  • the coating film 9 penetrates into the depressions caused by the drop of the metal magnetic material generated by the dicer or polishing process (buffing or lapping), and the size of the depressions is reduced.
  • FIG. 13 is a plan view of the jig 200 for holding the main body 10.
  • 14 to 16 are views showing the main body 10 when the external electrodes 20 and 25 are formed.
  • the surface of the main body 10 is cleaned by a method such as degreasing or etching.
  • a jig 200 shown in FIG. 13 is prepared. Holes 202 are arranged in a matrix in the jig 200. Then, the main body 10 is inserted into the hole 202 as shown in FIG. When the main body 10 is inserted into the hole 202, only a portion where the external electrode 20 is formed is exposed to the outside of the jig 200.
  • the jig 200 is lowered, and the main body 10 is placed in a conductive solution containing a conductive material containing at least one selected from the group consisting of palladium, tin, silver, and copper. Immersion is performed, and a conductive solution is applied to the portion where the external electrode 20 is formed on the surface of the main body 10. Thereby, a conductive layer is formed in a portion where the external electrode 20 is formed.
  • the conductive material is a material that can be attached to the main body 10 to impart conductivity, and examples thereof include transition metal ions as described above, colloids containing them, conductive polymers, and graphite.
  • the minimum value of the surface tension of the conductive solution is preferably 30 ⁇ 10 ⁇ 3 N / m or more, and more preferably 40 ⁇ 10 ⁇ 3 N / m or more.
  • the maximum value of the surface tension in the conductive solution is preferably 70 ⁇ 10 ⁇ 3 N / m or less, and more preferably 60 ⁇ 10 ⁇ 3 N / m or less.
  • the minimum value of the viscosity of the conductive solution is preferably 0.003 Pa ⁇ s (3 mPa ⁇ s) or more, more preferably 0.1 Pa ⁇ s or more, and 1 Pa ⁇ s or more. Is even more preferred.
  • the maximum value of the viscosity in the conductive solution is preferably 30 Pa ⁇ s or less.
  • the surface tension and viscosity of the conductive solution may be adjusted using additives. Any additive may be used as long as it does not affect the physical properties of the conductive material in the conductive solution.
  • the adhesion amount of the conductive material to the main body 10 may be an amount that can be plated by electrolytic plating. Further, the surface tension and viscosity of the conductive solution are determined by the size of the main body 10.
  • the main body 10 may be immersed in a surfactant before being immersed in the conductive solution. With this surfactant, the adhesion of the conductive material to the surface of the main body 10 can be increased.
  • the surfactant used here is selected from any of anionic, cationic, nonionic and amphoteric surfactants so as to match the type of conductive material applied to the main body 10.
  • the conductive material adheres to the surface so that the applied amount (0.2 ⁇ g / cm 2 to 50 ⁇ g / cm 2 ) of the conductive material necessary for electrolytic plating is left on the surface.
  • the main body 10 is washed with water or a solvent. Further, the main body 10 is dried.
  • a conductive solution is applied to a portion of the surface of the main body 10 where the external electrode 25 is formed by repeating the same steps as those described with reference to FIGS.
  • External electrodes 20 and 25 are formed on the conductive layer made of the conductive material of the main body 10 by electrolytic plating.
  • electrolytic plating is performed in the order of copper plating, nickel plating, and tin plating.
  • the electronic component 1 is completed through the above steps.
  • the metal species that can be used in electrolytic plating are not particularly limited, and at least one metal selected from the group consisting of tin, tin alloy, nickel, copper, silver, gold, palladium, and the like is used. Can be used.
  • the tin alloy is preferably tin-lead, tin-silver, tin-copper, tin-zinc, tin-bismuth, tin-indium or the like.
  • this method can be applied to any of an acidic bath, a neutral bath, and an alkaline bath.
  • various electrolytic plating methods such as a barrel plating method and a rack plating method can also be used for the electrolytic plating method.
  • the coating film 9 covers the surface of the main body 10. Thereby, the coating film 9 fills the depression formed on the surface of the main body 10 by dropping the metal magnetic powder embedded in the main body 10 at the time of manufacture. As a result, the surface roughness of the coating film 9 is smaller than the surface roughness of the surface of the main body 10.
  • the external electrodes 20 and 25 are provided on the flat coating film 9. Thereby, the formation of pinholes in the external electrodes 20 and 25 is suppressed.
  • the electronic component 1 after the mother substrate 120 is cut into the plurality of main bodies 10, an etching process or a polishing process is performed in order to remove cut waste.
  • the etching process is performed, a part of the surface of the metal magnetic powder is dissolved by the etching solution, so that the bonding strength between the metal magnetic powder and the insulating material is lowered. Thereby, dropping of the metal magnetic powder embedded near the surface of the main body 10 is further promoted.
  • the polishing process when the polishing process is performed, the abrasive or the like collides with the metal magnetic powder, and the falling of the metal magnetic powder embedded near the surface of the main body 10 is further promoted. Therefore, like the electronic component 1, the coating film 9 covers the surface of the main body 10, and the external electrodes 20 and 25 are provided on the coating film 9, so that pinholes are more effectively formed in the external electrodes 20 and 25. Is suppressed.
  • the metal (Cu) included in the material of the lead conductors 32a and 37a is less likely to be ionized than the metal (Fe) included in the material of the metal magnetic powder.
  • the metal (Cu) contained in the material of the lead conductors 32 a and 37 a is unlikely to react with the resin component in the mixed solution used when forming the coating film 9. Therefore, the coating film 9 does not cover the lead conductors 32a and 37a.
  • the external electrode 20 and the lead conductor 32a can be connected, and the external electrode 25 and the lead conductor 37a can be connected.
  • the inventor of the present application conducted an experiment described below in order to clarify the effects of the electronic component 1 and the manufacturing method thereof.
  • the inventor of the present application produced the electronic component 1 by the method for manufacturing the electronic component 1 according to the above embodiment, and used it as the first sample. Further, the inventor of the present application produced an electronic component without forming the coating film 9 in the method for manufacturing the electronic component 1 according to the above embodiment, and used it as a second sample.
  • the inventor of the present application does not perform the etching process for removing the cut waste after the mother substrate 120 is cut and does not form the coating film 9. A part was produced as a third sample.
  • the unevenness is a parameter related to the surface roughness Ra, and is an average of the depths of the recesses C formed in the main body 10 (or the coating film 9 when the coating film 9 is formed).
  • the depth of the recess C is a distance from the surface of the main body 10 to the bottom of the recess C of the main body 10 or a distance from the surface of the coating film 9 to the bottom of the recess of the coating film 9.
  • the pinhole occurrence rate is a value obtained by dividing the area of the pinhole by the area of the external electrodes 20 and 25 and multiplying by 100.
  • the DC resistance value was determined by OK or NG.
  • the determination criteria for OK and NG are OK within ⁇ 5% with respect to the resistance value of the circuit element 30 itself in the main body 10, and NG is a value exceeding the OK.
  • Table 2 is a table showing experimental results.
  • the DC resistance value between the external electrodes 20 and 25 is large. (That is, the DC resistance value is NG).
  • the direct current resistance value between the external electrodes 20 and 25 is reduced by performing the etching process (that is, the direct current resistance value is OK). )
  • the unevenness of the main body 10 is larger in the second sample subjected to the etching process than in the third sample not subjected to the etching process, It can be seen that the pinhole incidence is increasing. That is, in the second sample, pin holes are easily formed in the external electrodes 20 and 25 instead of decreasing the DC resistance value.
  • the coating film 9 is formed in the first sample. Thereby, it can be seen that the unevenness of the main body 10 is reduced and the pinhole occurrence rate is reduced.
  • the electronic component and the manufacturing method thereof according to the present invention are not limited to the electronic component 1 and the manufacturing method thereof according to the embodiment, and can be variously changed within the scope of the gist.
  • Ba, Ti, Ca, Zr, Ni, Cu, Zn, Mn, Co, Al, etc. may be used as the metal magnetic powder used in the insulator layer in consideration of the ionization tendency with the electrode material.
  • the resin constituting the coating film 9 may be an epoxy resin, a polyimide resin, a silicone resin, a polyamideimide resin, a polyether ether ketone resin, a fluorine resin, an acrylic silicone resin, or the like.
  • Examples thereof include polymer resins composed of one or more selected monomers. It should be noted that the presence of a polymerization initiator such as ammonium persulfate, potassium persulfate, or t-butyl hydroperoxide for obtaining the resin in the resin does not affect the properties of the coating film 9.
  • a polymerization initiator such as ammonium persulfate, potassium persulfate, or t-butyl hydroperoxide for obtaining the resin in the resin does not affect the properties of the coating film 9.
  • an anionic surfactant or a nonionic surfactant may be used in place of the surfactant Eleminol JS-2 (manufactured by Sanyo Kasei Co., Ltd.).
  • an activator, naphthalenesulfonic acid formalin condensate, polycarboxylic acid type surfactant and the like can be mentioned.
  • Nonionic surfactants include polyoxyethylene alkyl ethers (alkyl groups; octyl, decyl, lauryl, stearyl, oleyl, etc.), polyoxyethylene alkyl phenyl ethers (alkyl groups; octyl, nonyl, etc.), polyoxyethylene polyoxy A propylene block copolymer etc. are mentioned.
  • the water-soluble resin which has a sulfonic acid group and its salt, a carboxyl group and its salt, a phosphoric acid group, its salt, etc. is mentioned.
  • the mixed solution for forming the coating film 9 is a tannin that improves corrosion resistance, a plasticizer such as dibutyl phthalate that gives the coating film 9 flexibility, and the film formability of the coating film 9 is improved.
  • a mixed solution of metal ions such as silver fluoride and a lubricant for preventing scratches on the surface of the coating film 9 and improving water resistance, for example, fluororesin lubricant, polyolefin wax, melamine cyanurate, molybdenum disulfide You may add to.
  • a pigment such as carbon black or phthalocyanine blue may be added to the mixed solution for forming the coating film 9 for the purpose of improving the corrosion resistance of the coating film 9 and coloring the electronic parts.
  • a polymer having an acid group containing phosphorus for example, a main chain of a phosphoric acid group, a phosphorous acid group, a phosphonic acid group, a phosphinic acid group,
  • corrosion resistance and chemical resistance can be improved by adding an organic polymer compound having a side chain.
  • fillers such as glass fiber, calcium carbonate, aramid fiber, graphite, alumina, aluminum nitride, boron nitride are added to the mixed solution. Also good.
  • the external electrodes 20 and 25 are formed by electrolytic plating, but may be formed by other methods. Examples of the method of forming the external electrodes 20 and 25 include a method of applying a conductive paste in which a conductive material such as Ag and a resin are mixed, a method of forming by sputtering, and the like.
  • the coating film 9 may be an iron phosphate film or a zinc phosphate film formed by a chemical conversion treatment.
  • the coating film 9 may be a glass coat or an organic film.
  • the circuit element 30 is not limited to an inductor, and may be another element such as a capacitor.
  • the external electrodes 20 and 25 are electrically connected to the circuit element 30 in addition to the state in which the external electrodes 20 and 25 and the circuit element 30 are in physical contact with each other. And a state in which a signal is transmitted between the external electrodes 20 and 25 and the circuit element 30 without physically contacting the circuit element 30.
  • the shape of the external electrode 20 is not limited to the shape straddling the five surfaces as shown in FIG. 1, but may be, for example, a shape straddling the two surfaces of the bottom surface S1 and the right surface S2, or the bottom surface S1. It may be a flat surface provided only on the surface.
  • the shape of the external electrode 25 is the same as that of the external electrode 20.
  • the main body 10 is not limited to the laminate, and may be manufactured by, for example, solidifying a mixture of metal magnetic powder and resin.
  • the present invention is useful for an electronic component and a manufacturing method thereof, and is particularly excellent in that the occurrence of pinholes in an external electrode can be suppressed.

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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Coils Or Transformers For Communication (AREA)

Abstract

L'invention concerne un composant électronique qui peut éviter la formation de piqûres au niveau d'une électrode externe, ainsi qu'un procédé de production du composant électronique. Le composant électronique est caractérisé en ce qu'il comprend : un corps principal ayant un mélange de poudre magnétique métallique et d'un matériau isolant en guise de matériaux constitutifs ; un élément de circuit prévu sur le corps principal ; un film de revêtement qui recouvre au moins une partie de la surface du corps principal ; et une électrode externe électriquement connectée à l'élément de circuit et prévue sur le film de revêtement.
PCT/JP2015/070908 2014-07-28 2015-07-23 Composant électronique et son procédé de production WO2016017511A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2014152736 2014-07-28
JP2014-152736 2014-07-28

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WO2016017511A1 true WO2016017511A1 (fr) 2016-02-04

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018195760A (ja) * 2017-05-19 2018-12-06 Tdk株式会社 電子部品
US11227721B2 (en) 2016-11-24 2022-01-18 Tdk Corporation Electronic component

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2008133026A1 (fr) * 2007-04-13 2008-11-06 Hitachi Metals, Ltd. Noyau magnétique pour antenne, procédé de fabrication d'un noyau magnétique pour antenne et antenne
JP2014013815A (ja) * 2012-07-04 2014-01-23 Tdk Corp コイル部品及びその製造方法
WO2014119564A1 (fr) * 2013-01-29 2014-08-07 株式会社村田製作所 Composant électronique céramique et procédé de fabrication associé

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2008133026A1 (fr) * 2007-04-13 2008-11-06 Hitachi Metals, Ltd. Noyau magnétique pour antenne, procédé de fabrication d'un noyau magnétique pour antenne et antenne
JP2014013815A (ja) * 2012-07-04 2014-01-23 Tdk Corp コイル部品及びその製造方法
WO2014119564A1 (fr) * 2013-01-29 2014-08-07 株式会社村田製作所 Composant électronique céramique et procédé de fabrication associé

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11227721B2 (en) 2016-11-24 2022-01-18 Tdk Corporation Electronic component
US11894195B2 (en) 2016-11-24 2024-02-06 Tdk Corporation Electronic component
JP2018195760A (ja) * 2017-05-19 2018-12-06 Tdk株式会社 電子部品
JP7106817B2 (ja) 2017-05-19 2022-07-27 Tdk株式会社 電子部品

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