WO2016017497A1 - Composition de résine pour former un film durci - Google Patents

Composition de résine pour former un film durci Download PDF

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Publication number
WO2016017497A1
WO2016017497A1 PCT/JP2015/070810 JP2015070810W WO2016017497A1 WO 2016017497 A1 WO2016017497 A1 WO 2016017497A1 JP 2015070810 W JP2015070810 W JP 2015070810W WO 2016017497 A1 WO2016017497 A1 WO 2016017497A1
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Prior art keywords
cured film
resin composition
group
forming
ether
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PCT/JP2015/070810
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English (en)
Japanese (ja)
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隼人 服部
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日産化学工業株式会社
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Priority to CN201580039405.9A priority Critical patent/CN106536647B/zh
Priority to JP2016538289A priority patent/JP6555266B2/ja
Priority to KR1020167034453A priority patent/KR102149165B1/ko
Publication of WO2016017497A1 publication Critical patent/WO2016017497A1/fr

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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L33/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
    • C08L33/04—Homopolymers or copolymers of esters
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F8/00—Chemical modification by after-treatment
    • C08F8/14—Esterification
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/10—Esters; Ether-esters
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/34—Heterocyclic compounds having nitrogen in the ring
    • C08K5/3467—Heterocyclic compounds having nitrogen in the ring having more than two nitrogen atoms in the ring
    • C08K5/3477—Six-membered rings
    • C08K5/3492—Triazines
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/34—Heterocyclic compounds having nitrogen in the ring
    • C08K5/3467—Heterocyclic compounds having nitrogen in the ring having more than two nitrogen atoms in the ring
    • C08K5/3477—Six-membered rings
    • C08K5/3492—Triazines
    • C08K5/34922—Melamine; Derivatives thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/54—Silicon-containing compounds
    • C08K5/541—Silicon-containing compounds containing oxygen
    • C08K5/5415—Silicon-containing compounds containing oxygen containing at least one Si—O bond
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L33/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
    • C08L33/04—Homopolymers or copolymers of esters
    • C08L33/14—Homopolymers or copolymers of esters of esters containing halogen, nitrogen, sulfur, or oxygen atoms in addition to the carboxy oxygen
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D133/00—Coating compositions based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Coating compositions based on derivatives of such polymers
    • C09D133/04—Homopolymers or copolymers of esters
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D133/00—Coating compositions based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Coating compositions based on derivatives of such polymers
    • C09D133/04—Homopolymers or copolymers of esters
    • C09D133/14—Homopolymers or copolymers of esters of esters containing halogen, nitrogen, sulfur or oxygen atoms in addition to the carboxy oxygen
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
    • C09D7/40—Additives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
    • C09D7/40—Additives
    • C09D7/60—Additives non-macromolecular
    • C09D7/63—Additives non-macromolecular organic

Definitions

  • the present invention relates to a resin composition for forming a cured film.
  • Patent Document 1 a protective film, an insulating film, and the like necessary for a touch panel and the like have been formed in a necessary portion by pattern processing by a photolithography method using a photosensitive resin composition.
  • the present inventor can solve the above problems with a composition containing a specific copolymer, a melamine-based crosslinking agent, a thermal radical polymerization initiator, and a solvent.
  • the present invention was completed.
  • this invention provides the following resin composition for cured film formation.
  • A a copolymer containing monomer units represented by formulas (1) and (2), (In the formula, each R 1 independently represents a hydrogen atom or a methyl group.
  • R 2 represents a hydrogen atom or an alkyl group having 1 to 5 carbon atoms.
  • R 3 represents a hydrogen atom or a methyl group.
  • B Melamine-based crosslinking agent, A cured film-forming resin composition comprising (C) a thermal radical polymerization initiator and (D) a solvent.
  • A The cured film forming resin composition of 1, wherein the copolymer is a copolymer containing monomer units represented by formulas (1), (2-1), and (2-2).
  • the cured film obtained by using the resin composition for forming a cured film of the present invention has high hardness, excellent adhesion, transparency and resistance to ITO sputtering, and also has resistance to a resist stripper. Therefore, it is useful as a material for forming a cured film such as a protective film, an insulating film, or the like in a touch panel such as a protective film, a planarizing film, or an insulating film in various displays such as an organic electroluminescence (EL) element. Moreover, since it is excellent also in a softness
  • R ⁇ 1 > represents a hydrogen atom or a methyl group each independently, and a methyl group is preferable.
  • R 2 represents a hydrogen atom or an alkyl group having 1 to 5 carbon atoms.
  • R 3 represents a hydrogen atom or a methyl group, and preferably a hydrogen atom.
  • the alkyl group may be linear, branched or cyclic, and specific examples thereof include a methyl group, an ethyl group, an n-propyl group, an i-propyl group, a cyclopropyl group, an n-butyl group, i -Butyl group, s-butyl group, t-butyl group, cyclobutyl group, n-pentyl group and the like.
  • part or all of the hydrogen atoms of the alkyl group may be substituted with a substituent, and examples of the substituent include a halogen atom, a hydroxy group, and an amino group.
  • the copolymer preferably contains a monomer unit represented by the formulas (1), (2-1) and (2-2) from the viewpoint of improving adhesion.
  • R 1 and R 3 are the same as described above.
  • R 4 represents an alkyl group having 1 to 5 carbon atoms. Examples of the alkyl group having 1 to 5 carbon atoms are the same as those described above.
  • the weight average molecular weight (Mw) of the copolymer is preferably 5,000 to 200,000, more preferably 10,000 to 100,000, and still more preferably 15,000 in consideration of handling properties and adhesion. ⁇ 80,000.
  • Mw exceeds 200,000, solubility in a solvent may be reduced and handling properties may be reduced.
  • Mw is less than 5,000, adhesion may be reduced.
  • Mw is a polystyrene conversion measured value by gel permeation chromatography (GPC).
  • the copolymer of component (A) is prepared by synthesizing poly (meth) acrylic acid, poly (meth) acrylic acid ester or (meth) acrylic acid- (meth) acrylic acid ester copolymer by a conventionally known method.
  • the copolymer can be synthesized by ring-opening addition of 3,4-epoxycyclohexylmethyl (meth) acrylate to the copolymer. Specifically, the ring-opening addition reaction can be carried out according to the method described in JP-A-10-087725 and the like.
  • the upper limit of the content of the component (B) is preferably 200 parts by mass, more preferably 100 parts by mass, with respect to 100 parts by mass of the component (A), from the viewpoint of suppressing a decrease in storage stability.
  • the lower limit is preferably 30 parts by mass, more preferably 50 parts by mass with respect to 100 parts by mass of the component (A), from the viewpoint of obtaining a cured film having excellent solvent resistance with good reproducibility.
  • the solvent examples include ethylene glycol, ethylene glycol monomethyl ether, ethylene glycol monoethyl ether, ethylene glycol diethyl ether, ethylene glycol isopropyl ether, ethylene glycol monobutyl ether, ethylene glycol dibutyl ether, ethylene glycol monohexyl ether, ethylene glycol mono Benzyl ether, ethylene glycol monophenyl ether, ethylene glycol monoacetate, ethylene glycol diacetate, ethylene glycol monomethyl ether acetate, ethylene glycol monoethyl ether acetate, ethylene glycol monobutyl ether acetate, diethylene glycol, diethylene glycol monomethyl ether, die Lenglycol dimethyl ether, diethylene glycol methyl ethyl ether, diethylene glycol monoethyl ether, diethylene glycol diethyl ether, diethylene glycol monobutyl ether, diethylene glycol dibutyl ether, diethylene glycol
  • Solvents can be used singly or in combination of two or more. Moreover, the solvent used when superposing
  • the solvent preferably has a boiling point of 150 ° C. or higher, more preferably 180 ° C. or higher, and even more preferably 200 ° C. or higher.
  • solvents include diethylene glycol monomethyl ether, diethylene glycol monoethyl ether, diethylene glycol monoethyl ether acetate, diethylene glycol monobutyl ether, diethylene glycol monobutyl ether acetate, diethylene glycol dimethyl ether, diethylene glycol diethyl ether, diethylene glycol dibutyl ether, diethylene glycol monohexyl ether, triethylene glycol Monobutyl ether, propylene glycol monobutyl ether, dipropylene glycol, dipropylene glycol monomethyl ether, dipropylene glycol monoethyl ether, diethylene glycol monophenyl ether, ethylene glycol monobenzyl ether Le, diethylene glycol benzyl ether or the like are particularly preferable.
  • the amount of the solvent is preferably such that the solid content concentration in the composition of the present invention is 1 to 95% by mass, more preferably the solid content concentration is 5 to 90% by mass, and the solid content concentration Is more preferably 10 to 85% by mass.
  • solid content removes (D) solvent from all the components of the composition of this invention.
  • the composition of the present invention preferably contains a silane coupling agent as the component (E).
  • a silane coupling agent is a silane compound represented by the formula (3).
  • R 5 represents a methyl group or an ethyl group.
  • X represents a hydrolyzable group.
  • Y represents a reactive functional group.
  • m is an integer of 0 to 3.
  • n is an integer of 0 to 3, preferably an integer of 0 to 2.
  • silane coupling agent examples include 3-aminopropyltrichlorosilane, 3-aminopropyltrimethoxysilane, 3-aminopropyltriethoxysilane, 3-aminopropylmethyldimethoxysilane, and 3-aminopropylmethyldiethoxysilane.
  • 3-aminopropyltrimethoxysilane, 3-aminopropyltriethoxysilane, 3-ureidopropyltrimethoxysilane, 3-ureidopropyltriethoxysilane, 3-methacryloxypropyltrimethoxysilane, 3-methacryloxypropyl Triethoxysilane and the like are particularly preferable.
  • a commercial item can be used as said silane coupling agent.
  • the content thereof is preferably 0.001 to 10 parts by weight, more preferably 0.01 to 5 parts by weight with respect to 100 parts by weight of the component (A). More preferably, the amount is 0.05 to 1 part by mass. If the content is less than 0.001 part by mass, the effect of improving the adhesion may not be obtained, and if it exceeds 10 parts by mass, the hardness may decrease.
  • the composition of the present invention preferably contains a polyfunctional (meth) acrylate compound as the component (F).
  • the polyfunctional (meth) acrylate compound is a compound having at least three (meth) acryloxy groups in the molecule, and specifically includes an ester of a polyhydric alcohol and (meth) acrylic acid.
  • the number of (meth) acryloxy groups in one molecule is 3 to 6, preferably 3 or 4.
  • polyhydric alcohol examples include glycerol, erythritol, pentaerythritol, trimethylolethane, trimethylolpropane, dipentaerythritol, ditrimethylolpropane, and the like.
  • polyfunctional (meth) acrylate compound examples include pentaerythritol tetraacrylate, pentaerythritol tetramethacrylate, pentaerythritol triacrylate, pentaerythritol trimethacrylate, dipentaerythritol hexaacrylate, dipentaerythritol hexamethacrylate, dipentaerythritol pentane.
  • Examples include acrylate, dipentaerythritol pentamethacrylate, trimethylolethane triacrylate, trimethylolethane trimethacrylate, trimethylolpropane triacrylate, trimethylolpropane trimethacrylate, ditrimethylolpropane tetraacrylate, ditrimethylolpropane tetramethacrylate, and the like.
  • the polyfunctional (meth) acrylate compound can be easily obtained as a commercial product.
  • Specific examples thereof include, for example, KAYARAD (registered trademark) T-1420, DPHA, DPHA-2C, manufactured by Nippon Kayaku Co., Ltd.
  • Aronix (registered trademark) M-210, M-240, M-6200, M-309, M-400, M-402, M-405, M-450, M-7100, M-8030, M-8060, M -1310, M-1600, M-1960, M-8100, M-8530, M-8560, M-9050; Biscoat 295, 300, 360, GPT, 3PA, 400, 260, manufactured by Osaka Organic Chemical Industry Co., Ltd. 312, 335HP; NK ester A-9300, A-9300-1CL, A-GLY-9E, A-GLY-20E, A-TMM-3, A-TMM-3L, A- from Shin-Nakamura Chemical Co., Ltd. TMM-3LM-N, A-TMPT, AD-TMP, ATM-35E, A-TMMT, A-9550, A-DPH, TMPT, and the like.
  • the content thereof is preferably 10 to 300 parts by weight, more preferably 20 to 200 parts by weight, even more preferably 100 parts by weight of the component (A). Is 50 to 150 parts by mass.
  • the content is less than 10 parts by mass, the effect of improving the hardness of the cured film may not be obtained.
  • the content exceeds 300 parts by mass the adhesion and flexibility characteristics are degraded and cracks are generated. May be easier to do.
  • a polyfunctional (meth) acrylate compound can be used 1 type or in combination of 2 or more types.
  • the composition of the present invention preferably contains an ion trap agent from the viewpoint of suppressing migration of a metal wiring or the like in contact with the cured film.
  • an ion trapping agent a compound having a chelating ability having an unpaired electron in the structure is preferable.
  • N, N′-bis [3- (3,5-di-t-butyl-4- Hydroxyphenyl) propionyl] hydrazine Irganox MD1024, manufactured by BASF
  • bis (benzylidene hydrazide) oxalate Eastman Inhibitor OABH, manufactured by Eastman Chemical
  • benzotriazole 5-methylbenzotriazole and the like.
  • ADK STAB CDA-1 manufactured by ADEKA
  • ADK STAB CDA-6 manufactured by ADEKA
  • Qunox manufactured by Mitsui Toatsu Fine Co., Ltd.
  • Naugard XL-1 uniroyal Etc.
  • 5-methylbenzotriazole is particularly preferable.
  • the content thereof is preferably 0.0001 to 20 parts by mass, more preferably 0.001 to 10 parts by mass with respect to 100 parts by mass of the component (A). It is. If the amount is less than 0.0001 parts by mass, the effect of protecting the metal wiring may not be obtained. If the amount exceeds 20 parts by mass, characteristics such as hardness and adhesion as a cured film may be reduced, and the cost may be reduced. May also be disadvantageous.
  • the composition of this invention contains a polyfunctional thiol compound as needed.
  • the polyfunctional thiol compound used in the composition of the present invention is preferably a trifunctional or higher functional thiol compound.
  • the polyfunctional thiol compound can be obtained as an addition reaction product of a polyhydric alcohol and a monofunctional and / or polyfunctional thiol compound.
  • Specific compounds include 1,3,5-tris (3-mercaptopropionyloxyethyl) isocyanurate and 1,3,5-tris (3-mercaptobutyryloxyethyl) isocyanurate (manufactured by Showa Denko KK).
  • the content thereof is preferably 0.1 to 8% by mass, more preferably 0.8 to 5% by mass in the total solid content. If the content is too large, the stability, odor, adhesion and the like of the composition may deteriorate.
  • composition of this invention contains a polymerization inhibitor as needed.
  • the polymerization inhibitor include 2,6-diisobutylphenol, 3,5-di-t-butylphenol, 3,5-di-t-butylcresol, hydroquinone, hydroquinone monomethyl ether, pyrogallol, and t-butylcatechol. 4-methoxy-1-naphthol and the like.
  • the content thereof is preferably 1% by mass or less, more preferably 0.5% by mass or less, based on the total solid content.
  • the content exceeds 1% by mass, poor curing may occur and the reaction may become insufficient.
  • composition of the present invention may further comprise a surfactant, an antifoaming agent, a rheology modifier, a pigment, a dye, a storage stabilizer, a polyhydric phenol or a polycarboxylic acid as long as the effects of the present invention are not impaired.
  • a dissolution accelerator such as an acid may be included.
  • the surfactant is not particularly limited, and examples thereof include a fluorine-based surfactant, a silicon-based surfactant, and a nonionic surfactant.
  • this type of surfactant include, for example, F-top (registered trademark) EF301, EF303, EF352 manufactured by Mitsubishi Materials Electronics Chemical Co., Ltd .; Mega-Fac® (registered trademark) F171, F173 manufactured by DIC Corporation; FLUORAD manufactured by 3M (Registered trademark) FC430, FC431; Asahi Guard Co., Ltd. Asahi Guard (registered trademark) AG710, AGC Seimi Chemical Co., Ltd. Surflon (registered trademark) S-382, SC101, SC102, SC103, SC104, SC105, SC106 etc. Can be mentioned.
  • Antifoaming agents include, but are not limited to, acetylene glycol, silicone fluids and emulsions, ethoxylated or propoxylated silicones, hydrocarbons, fatty acid ester derivatives, acetylated polyamides, poly (alkylene oxide) polymers and copolymers, and the like. .
  • the composition of the present invention preferably contains an antifoaming agent.
  • the viscosity at 25 ° C. of the composition of the present invention is preferably 1 to 10,000 mPa ⁇ s, more preferably 1 to 5,000 mPa ⁇ s, and still more preferably 1 to 1,000 mPa ⁇ s from the viewpoint of applicability. It is. If the viscosity is too low, the desired film thickness may not be obtained, and if the viscosity is too high, the coatability may deteriorate.
  • the viscosity at 25 ° C. of the composition of the present invention is preferably 10 to 100,000 mPa ⁇ s, more preferably 500 to 100,000 mPa ⁇ s, and still more preferably 1,000 to 100 from the viewpoint of printability. 1,000 mPa ⁇ s. If the viscosity is too low, the composition may diffuse after application, and a desired pattern may not be formed. If the viscosity is too high, the discharge performance may be reduced, and a load on the process may occur. Transferability to the surface may be reduced.
  • the viscosity at 25 ° C. of the composition is preferably 10 to 100,000 mPa ⁇ s, more preferably 5,000 to 100,000 mPa ⁇ s, and even more preferably 20,000 to 100,000 mPa ⁇ s. If the viscosity is too low, the composition may diffuse after application, and a desired pattern may not be formed. If the viscosity is too high, the discharge performance may be reduced, and a load on the process may occur. Transferability to the surface may be reduced.
  • the viscosity is a value measured with an E-type viscometer.
  • the method for preparing the composition of the present invention is not particularly limited. As an example, there may be mentioned a method in which the component (A) is dissolved in the solvent (D) and the components (B) and (C) are mixed in this solution at a predetermined ratio in an arbitrary order to obtain a uniform solution. In addition, in an appropriate stage of this preparation method, there may be mentioned a preparation method in which components (E) to (I) and other components are further added and mixed as necessary.
  • the resin composition for forming a cured film in a solution state thus prepared is preferably used after being filtered using a filter having a pore size of about 0.2 ⁇ m.
  • the resin composition for forming a cured film of the present invention is a substrate (for example, a silicon / silicon dioxide-coated substrate; a silicon nitride substrate; a metal such as aluminum, molybdenum, chromium, copper, or silver; a metal nanowire such as a silver nanowire; or a silver nanoparticle.
  • a substrate for example, a silicon / silicon dioxide-coated substrate; a silicon nitride substrate; a metal such as aluminum, molybdenum, chromium, copper, or silver; a metal nanowire such as a silver nanowire; or a silver nanoparticle.
  • the coating film can be formed by coating by a printing method such as ink printing, flexographic printing, gravure printing, offset printing, gravure offset printing, etc., and then pre-drying (prebaking) with a hot plate or oven.
  • the composition of the present invention is particularly suitable for printing methods such as inkjet coating, screen printing, flexographic printing, and gravure offset printing.
  • the pre-bake is generally preferably performed at 60 ° C. to 150 ° C., more preferably at 80 ° C. to 120 ° C., for 0.5 to 30 minutes when using a hot plate, and 0.5 to 90 minutes when using an oven. The method of doing is taken.
  • post-baking for thermosetting is performed. Specifically, heating is performed using a hot plate, an oven, or the like.
  • the post-baking is generally performed at a temperature of preferably 150 ° C. to 300 ° C., more preferably 200 ° C. to 250 ° C. for 1 to 30 minutes when using a hot plate, and 1 to 90 minutes when using an oven. Is taken.
  • the step of the substrate can be sufficiently flattened, and a cured film having high transparency can be formed.
  • the cured film of the present invention has at least the necessary level of flatness, hardness and adhesion, the protective film, flattening film, and insulating film in various displays such as thin film transistor (TFT) type liquid crystal display elements and organic EL elements. It is also useful as a material for forming a cured film such as a protective film or an insulating film in a touch panel. Moreover, since it is excellent also in a softness
  • TFT thin film transistor
  • the reagents and devices used in the examples are as follows. ⁇ Reagent> ⁇ DEGEEA (diethylene glycol monoethyl ether acetate), DEGME (diethylene glycol monomethyl ether): manufactured by Tokyo Chemical Industry Co., Ltd. ⁇ MEA (2-aminoethanol): manufactured by Kanto Chemical Co., Ltd. ⁇ PET-30: pentaerythritol (tri / tetra) ) Acrylate, Nippon Kayaku Co., Ltd. UPS: 3-ureidopropyltriethoxysilane, Toray Dow Corning AY43-031 ⁇ CYCLOMER-P: Cyclomer P (ACA) Z250 manufactured by Daicel Ornex Co., Ltd.
  • CYMEL303 Melamine-based crosslinking agent, manufactured by Nippon Cytec Industries, Ltd.
  • Perbutyl L Thermal radical polymerization initiator, manufactured by NOF Corporation ⁇ Device>
  • Stirrer Shintaro Awatori Nertaro ARE-310 ⁇
  • Ultraviolet visible near infrared spectrophotometer ultraviolet-3100PC manufactured by Shimadzu Corporation
  • composition [Example 1] In a 200 mL container, 41.5 g of CYCLOMER-P, 9.8 g of PET-30, 9.8 g of CYMEL 303, 0.6 g of perbutyl L, 0.2 g of UPS, and 37.5 g of DEGEA were placed. This was put into a stirrer and stirred at 2,000 rpm for 10 minutes to prepare a composition (varnish).
  • Example 2 In a 200 mL container, 33.5 g of CYCLOMER-P, 11.8 g of PET-30, 11.8 g of CYMEL 303, 0.5 g of perbutyl L, 0.2 g of UPS, and 42.2 g of DEGEA were placed. This was put into a stirrer and stirred at 2,000 rpm for 10 minutes to prepare a composition (varnish).
  • the cured film obtained from the composition (varnish) of the present invention is excellent in hardness and adhesion, has a high light transmittance of 92% or more, and also has good solvent resistance and ITO sputtering resistance. It was excellent.

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  • Laminated Bodies (AREA)

Abstract

　Cette invention concerne une composition de résine pour former un film durci, la composition de résine comprenant (A) un copolymère contenant des motifs monomères représentés par les formules (1) et (2), (B) un agent de réticulation de type mélamine, (C) un amorceur de polymérisation radicalaire thermique, et (D) un solvant. (Dans les formules, chaque R1 représente indépendamment un atome d'hydrogène ou un groupe méthyle ; R2 représente un atome d'hydrogène ou un groupe alkyle C1-5 ; et R3 représente un atome d'hydrogène ou un groupe méthyle).
PCT/JP2015/070810 2014-08-01 2015-07-22 Composition de résine pour former un film durci WO2016017497A1 (fr)

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CN201580039405.9A CN106536647B (zh) 2014-08-01 2015-07-22 固化膜形成用树脂组合物
JP2016538289A JP6555266B2 (ja) 2014-08-01 2015-07-22 硬化膜形成用樹脂組成物
KR1020167034453A KR102149165B1 (ko) 2014-08-01 2015-07-22 경화막 형성용 수지 조성물

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JP2014157566 2014-08-01

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WO2021157571A1 (fr) * 2020-02-03 2021-08-12 富士フイルム株式会社 Composition de résine durcissable, film de résine, film durci ainsi que procédé de fabrication de celui-ci, stratifié, et dispositif à semi-conducteurs
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JPWO2016017497A1 (ja) 2017-05-18
CN106536647A (zh) 2017-03-22
JP6555266B2 (ja) 2019-08-07
KR102149165B1 (ko) 2020-08-28
CN106536647B (zh) 2019-05-07
KR20170039082A (ko) 2017-04-10
TWI666274B (zh) 2019-07-21
TW201610013A (zh) 2016-03-16

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