WO2016002923A1 - Photocurable composition and method for manufacturing electronic component - Google Patents
Photocurable composition and method for manufacturing electronic component Download PDFInfo
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- WO2016002923A1 WO2016002923A1 PCT/JP2015/069241 JP2015069241W WO2016002923A1 WO 2016002923 A1 WO2016002923 A1 WO 2016002923A1 JP 2015069241 W JP2015069241 W JP 2015069241W WO 2016002923 A1 WO2016002923 A1 WO 2016002923A1
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- photocurable composition
- photocurable
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- epoxy
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
- C08F290/02—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated end groups
- C08F290/06—Polymers provided for in subclass C08G
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
Definitions
- the present invention relates to a photocurable composition that is used by being applied partially and at a plurality of locations on the surface of an application target member. Moreover, this invention relates to the manufacturing method of the electronic component using the said photocurable composition.
- Solder resist films are widely used as protective films for protecting printed wiring boards from high-temperature solder.
- a light emitting diode (hereinafter abbreviated as LED) chip is mounted on the upper surface of the printed wiring board.
- a white solder resist film may be formed on the upper surface of the printed wiring board in order to use light that has reached the upper surface side of the printed wiring board among the light emitted from the LEDs.
- the white solder resist film contains a white pigment.
- the white solder resist film reaches not only the light directly irradiated from the surface of the LED chip to the opposite side of the printed wiring board but also the upper surface side of the printed wiring board.
- the reflected light reflected by can also be used. Therefore, the utilization efficiency of the light generated from the LED can be increased.
- a cured product film containing a white pigment may be used in a light reflection application.
- Patent Document 1 contains an alkoxy group-containing silane-modified epoxy resin obtained by a dealcoholization reaction between an epoxy resin and a hydrolyzable alkoxysilane.
- a resist material further containing an unsaturated group-containing polycarboxylic acid resin, a diluent, a photopolymerization initiator, and a cured adhesion-imparting agent is disclosed.
- Patent Document 2 discloses a white solder resist material containing a carboxyl group-containing resin having no aromatic ring, a photopolymerization initiator, an epoxy compound, a rutile titanium oxide, and a diluent. Yes.
- Patent Document 3 discloses a composition for forming a two-layer LED solder resist film including a white ink layer and an undercoat layer.
- the composition for forming the white ink layer is (A1) a photopolymerization reactive polymer that is a urethane acrylate resin or a mixture of a urethane acrylate resin and an epoxy acrylate resin, and (A2) the photopolymerization reactive polymer (A1). 100 to 170 parts by mass of a white pigment with respect to 100 parts by mass, and (A3) 10 to 50 parts by mass of a photopolymerization initiator with respect to 100 parts by mass of the photopolymerizable polymer (A1).
- the composition for forming the undercoat layer is (B1) a photopolymerization reactive polymer that is an epoxy acrylate resin, (B2) 200 to 300 parts by mass with respect to 100 parts by mass of the photopolymerization reactive polymer (B1). And (B3) 10 to 50 parts by mass of a photopolymerization initiator with respect to 100 parts by mass of the photopolymerizable polymer (B1).
- Patent Documents 1 and 2 require many processes such as an exposure process and a development process in photolithography in order to form a resist film. For this reason, the number of processes is large, and the production efficiency of electronic parts and the like is poor.
- Patent Documents 1 and 2 are developed using a chemical solution such as acid or alkali, the environmental load is large. Furthermore, extra resist material must be used to form the resist layer portion that is removed by development. Further, the resist layer portion removed by development becomes waste. For this reason, since the amount of waste is large, the environmental load is large.
- Patent Document 3 a two-layer solder resist film for LED including a white ink layer and an undercoat layer is formed.
- This resist film is formed without development, but a composition for forming a white ink layer and a composition for forming an undercoat layer are prepared separately, and these two compositions are further prepared. A separate application work is required. For this reason, the manufacturing efficiency of electronic parts and the like is poor, and the manufacturing cost of electronic parts also increases.
- the inventor examined materials with low environmental impact and good manufacturing efficiency, but when the cured material film was formed by applying the material to the application target member, the adhesion of the cured product film to the application target member was The subject that it was low or the heat resistance of hardened
- the content of the white pigment is 20% by weight or more and 70% by weight or less.
- the photocurable compound is not an epoxy (meth) acrylate having a weight average molecular weight of 2000 or more, and does not have a weight average molecular weight of 2000 or more. And it is a photocurable compound which has at least one (meth) acryloyl group.
- the content of the epoxy (meth) acrylate is 10% by weight or more and 30% by weight or less.
- the photocurable composition contains a thiol group-containing compound having at least one thiol group.
- the photocurable composition is used by being cured by irradiation with light, and is used for forming a resist film without performing development, It is a non-developing resist photocurable composition.
- the ratio of the viscosity ⁇ 1 at 25 ° C. and 1 rpm to the viscosity ⁇ 2 at 25 ° C. and 10 rpm is 1.1 or more and 2.2 or less.
- the photocurable composition according to the present invention is preferably not used after being thermoset by the action of a thermosetting agent.
- the photocurable composition does not contain a thermosetting compound or contains a thermosetting compound at 5% by weight or less.
- the photocurable composition is not used to form a multilayer resist film together with another photocurable composition.
- the composition layer in order to form the cured product film, is not thermally cured by the action of a thermosetting agent.
- the composition layer is a resist layer
- the cured product film is a resist film
- the photocurable composition according to the present invention is not an epoxy (meth) acrylate having a carboxyl group and having a weight average molecular weight of 2000 or more and an epoxy (meth) acrylate having a weight average molecular weight of 2000 or more, A photocurable compound having no weight average molecular weight of 2000 or more and having at least one ethylenically unsaturated bond, a white pigment, and a photopolymerization initiator, wherein the content of the epoxy (meth) acrylate is Since it is 5% by weight or more and 30% by weight or less, when the photocurable composition according to the present invention is applied to the surface of the application target member partially and at a plurality of locations and cured, the application target The adhesion of the cured film to the member can be increased, the light reflectance of the cured film can be increased by being white, and the heat resistance of the cured film is increased. It is possible.
- FIGS. 1A to 1C are cross-sectional views for explaining an example of a method for producing an electronic component using the photocurable composition according to one embodiment of the present invention.
- FIGS. 2A to 2E are cross-sectional views for explaining an example of a method for producing an electronic component using a conventional development resist composition.
- the photocurable compound according to the present invention is used by being partially applied to a plurality of locations on the surface of the application target member.
- the photocurable composition according to the present invention is preferably used after being cured by irradiation with light, and is used for forming a resist film without performing development.
- the photocurable composition according to the present invention is preferably a non-developing resist photocurable composition.
- the photocurable composition according to the present invention is different from a developing resist composition in which development is performed to form a resist film when development is not performed to form a resist film.
- a composition capable of obtaining a good resist film without being developed is employed.
- the photocurable composition according to the present invention comprises (A) an epoxy (meth) acrylate having no carboxyl group and having a weight average molecular weight of 2000 or more, and (B) an epoxy having a weight average molecular weight of 2000 or more ( A photocurable compound that is not (meth) acrylate and does not have a weight average molecular weight of 2000 or more and has at least one ethylenically unsaturated bond; (C) a white pigment; and (D) a photopolymerization initiator. Including.
- the adhesion of a cured product film (such as a resist film) to the application target member can be improved.
- cured material film with respect to a coating object member becomes high.
- adhesion between the electronic component main body such as a substrate and a cured product film (resist film or the like) can be improved, and peeling of the cured product film (resist film or the like) can be suppressed.
- the photocurable composition according to the present invention contains (C) a white pigment, a white cured product film (such as a resist film) can be formed.
- the cured product film (resist film or the like)
- the light reflectance of the cured product film can be increased.
- the heat resistance of the cured product film (resist film or the like) can be improved. For example, discoloration of a cured product film (such as a resist film) can be suppressed.
- the content of (A) epoxy (meth) acrylate is 5% by weight or more and 30% by weight or less. For this reason, the adhesiveness of the hardened
- a good cured product film (resist film or the like) can be formed without performing many steps such as an exposure step and a development step in photolithography.
- the exposure process and the development process are not performed, the amount of waste can be reduced and the environmental load can be reduced. Furthermore, the manufacturing cost of electronic components can be reduced.
- the ratio of the viscosity ⁇ 1 at 25 ° C. and 1 rpm to the viscosity ⁇ 2 at 25 ° C. and 10 rpm is preferably 0.5 or more, more preferably 1.1 or more, and further Preferably it is 1.4 or more, Preferably it is 2.2 or less, More preferably, it is 2.0 or less. Since the photocurable composition is suitably used for forming a resist film without development, the photocurable composition is partially and on the surface of an application target member such as an electronic component body. It may be used by applying to multiple locations. For example, the photocurable composition may be applied in a pattern.
- the resist film can be formed in a predetermined region with higher accuracy. For example, even if it is applied in a pattern with a width of 150 ⁇ m or less, a cured product film (resist film or the like) can be formed with high accuracy.
- the photocurable composition is preferably used for forming a cured product film by pattern printing.
- the above viscosity can be measured using an E-type viscometer.
- a cured product is obtained by irradiating light having a wavelength of 365 nm so as to have an integrated light quantity of 2000 mJ / cm 2 , and the obtained cured product is allowed to stand at 270 ° C. for 5 minutes.
- the color difference ⁇ E in the L * a * b * color system before and after standing is preferably 5.0 or less, more preferably 4.0 or less, still more preferably 3.5 or less, and particularly preferably 3.0 or less.
- the ⁇ E is less than or equal to the above upper limit, the heat resistance of the cured film is considerably excellent, and a decrease in the light reflectance of the cured film due to long-term use can be suppressed.
- the lamp for irradiating light having a wavelength of 365 nm include a metal halide, a mercury lamp, and an LED lamp.
- the photocurable composition is preferably used for forming a single-layer resist film.
- a resist film exhibiting the above effects can be formed even with a single layer resist film.
- the said photocurable composition is not used in order to form a multilayer resist film with another photocurable composition.
- the single-layer resist film formed using the photocurable composition is preferably not stacked with other resist films. When a multilayer resist film is formed using two or more kinds of photocurable compositions, the production efficiency of the resist film is lowered.
- the photocurable composition is cured by irradiation with light, it does not need to contain a thermosetting compound or a thermosetting agent. It is preferable that the photocurable composition is not used after being thermoset by the action of a thermosetting agent.
- the composition layer (resist layer or the like) disposed on the surface of the application target member may not be thermally cured. Since the said hardened
- the composition layer is preferably not heated to 280 ° C or higher, more preferably not heated to 180 ° C or higher, and still more preferably not heated to 60 ° C or higher.
- the lower the temperature at which the composition layer is heated the more the thermal degradation of the application target member such as the electronic component body can be suppressed.
- the photocurable composition contains a photocurable component having a weight average molecular weight of 2000 or more.
- the said photocurable composition contains at least the epoxy (meth) acrylate which does not have a carboxyl group and has a weight average molecular weight of 2000 or more as said photocurable component.
- the said photocurable composition may contain the photocurable component which has 2000 or more weight average molecular weights other than (A) epoxy (meth) acrylate as said photocurable component.
- the total content of the photocurable component contained in the photocurable composition (B) on a weight basis in the photocurable composition is preferably 0.1 or more, more preferably 0.2 or more, and further preferably 0.3 or more.
- the total content of the photocurable component contained in the photocurable composition on a weight basis is preferably 1.5 or less, more preferably 1.25 or less, still more preferably 0.95 or less, particularly preferably 0.8. 7 or less.
- the total content of the photocurable component contained in the photocurable composition is (A) epoxy (meth) as a photocurable component in which the photocurable composition has a weight average molecular weight of 2000 or more.
- the content of (A) epoxy (meth) acrylate is shown, and the photocurable composition has (A) epoxy (meta) as a photocurable component having a weight average molecular weight of 2000 or more.
- ((A) Epoxy (meth) acrylate) The (A) epoxy (meth) acrylate contained in the photocurable composition does not have a carboxyl group.
- the weight average molecular weight of (A) epoxy (meth) acrylate contained in the said photocurable composition is 2000 or more.
- (A) By using epoxy (meth) acrylate the adhesion of the cured product film to the application target member is effectively increased. In particular, when the content of (C) the white pigment is large, if (A) epoxy (meth) acrylate is not used, the adhesion of the cured film tends to be lowered.
- epoxy (meth) acrylate By using epoxy (meth) acrylate, even if there is much content of (C) white pigment, the adhesiveness of hardened
- epoxy (meth) acrylate only 1 type may be used and 2 or more types may be used together.
- the (A) epoxy (meth) acrylate preferably contains a bifunctional epoxy (meth) acrylate and a tri- or higher functional epoxy (meth) acrylate.
- the bifunctional epoxy (meth) acrylate preferably has two (meth) acryloyl groups.
- the tri- or higher functional epoxy (meth) acrylate preferably has three or more (meth) acryloyl groups.
- Epoxy (meth) acrylate is obtained by reacting (meth) acrylic acid with an epoxy compound.
- Epoxy (meth) acrylate can be obtained by converting an epoxy group into a (meth) acryloyl group. Since the said photocurable composition is hardened
- epoxy (meth) acrylate bisphenol type epoxy (meth) acrylate (for example, bisphenol A type epoxy (meth) acrylate, bisphenol F type epoxy (meth) acrylate, bisphenol S type epoxy (meth) acrylate), cresol Novolak type epoxy (meth) acrylate, amine modified bisphenol type epoxy (meth) acrylate, caprolactone modified bisphenol type epoxy (meth) acrylate, carboxylic anhydride modified epoxy (meth) acrylate, phenol novolac type epoxy (meth) acrylate, etc. Can be mentioned.
- bisphenol type epoxy (meth) acrylate for example, bisphenol A type epoxy (meth) acrylate, bisphenol F type epoxy (meth) acrylate, bisphenol S type epoxy (meth) acrylate), cresol Novolak type epoxy (meth) acrylate, amine modified bisphenol type epoxy (meth) acrylate, caprolactone modified bisphenol type epoxy (meth) acrylate, carboxylic anhydride
- bifunctional epoxy (meth) acrylates include KAYARAD R-381 (Nippon Kayaku, bisphenol A type epoxy acrylate), PE2100P (MIWON, bisphenol A type epoxy acrylate), lipoxy PC-3F ( And EBECRYL 3708 (manufactured by Daicel Ornex Co., Ltd., modified bisphenol A type epoxy acrylate).
- EBECRYL3603 the Daicel Ornex company make, novolak epoxy acrylate
- a trifunctional or higher functional epoxy (meth) acrylate may be obtained by modifying a hydroxyl group of a bifunctional epoxy (meth) acrylate and introducing a (meth) acryloyl group.
- (Meth) acryloyl group means an acryloyl group and a methacryloyl group.
- (Meth) acryl refers to acrylic and methacrylic.
- (Meth) acrylate refers to acrylate and methacrylate.
- the weight average molecular weight of the epoxy (meth) acrylate is 2000 or more. When the weight average molecular weight of (A) epoxy (meth) acrylate is less than 2000, the adhesiveness of the cured product film tends to deteriorate.
- the weight average molecular weight of (A) epoxy (meth) acrylate is preferably 20000 or less. However, you may use the epoxy (meth) acrylate whose weight average molecular weight is less than 2000 with the (A) epoxy (meth) acrylate whose weight average molecular weight is 2000 or more.
- the weight average molecular weight of epoxy (meth) acrylate becomes like this. Preferably it is 3000 or more, More preferably, it is 5000 or more.
- the weight average molecular weight is a weight average molecular weight in terms of polystyrene measured by gel permeation chromatography (GPC), and can be measured with the following measuring apparatus and measurement conditions.
- Measuring device “Waters GPC System (Waters 2690 + Waters 2414 (RI))” manufactured by Nihon Waters Measurement condition columns: Shodex GPC LF-G ⁇ 1, Shodex GPC LF-804 ⁇ 2
- Mobile phase THF 1.0 mL / min
- Sample concentration 5 mg / mL
- Detector Differential refractive index detector (RID)
- Reference material polystyrene (Made by TOSOH, molecular weight: 620 to 590000)
- the epoxy (meth) acrylate may be an epoxy (meth) acrylate obtained by modifying a hydroxyl group of an epoxy (meth) acrylate having a hydroxyl group. In this case, the degree of crosslinking can be increased and the hardness can be increased.
- the compound that can be used for modification include a silane coupling agent and a monomer having an isocyanate group.
- the silane coupling agent include compounds having a functional group such as vinyl group, (meth) acryloyl group, styryl group, mercapto group, epoxy group, amino group, sulfide group, ureido group, and isocyanate group.
- a compound having a vinyl group, a (meth) acryloyl group, a styryl group, or a mercapto group is preferred because of photoreactivity.
- the monomer having an isocyanate group include a compound having a vinyl group, a (meth) acryloyl group, a styryl group, or a mercapto group.
- Epoxy (meth) acrylate does not have a carboxyl group.
- an epoxy (meth) acrylate having no carboxyl group adverse effects due to carboxyl groups in the cured product film can be prevented, and for example, discoloration of the cured product film can be suppressed.
- the content of (A) epoxy (meth) acrylate is 5% by weight or more and 30% by weight or less. In 100% by weight of the photocurable composition, the content of (A) epoxy (meth) acrylate is preferably 10% by weight or more.
- cured material becomes high effectively that content of an epoxy (meth) acrylate is more than the said minimum.
- the pencil hardness of the cured product film is effectively increased, and a uniform coating film is easily obtained during printing.
- a bifunctional epoxy (meth) acrylate having a weight average molecular weight of 2000 or more and a weight average molecular weight of 2000 in 100% by weight of the photocurable composition.
- the total content of the above-described trifunctional or higher functional epoxy (meth) acrylate is preferably 5% by weight or more, more preferably 10% by weight or more, and preferably 30% by weight or less.
- (B) Photocurable compound having at least one ethylenically unsaturated bond (A) By using a photocurable compound having (B) at least one ethylenically unsaturated bond together with epoxy (meth) acrylate, even if the content of (C) white pigment is large, the adhesion of the cured product film It is easy to control the viscosity ratio ( ⁇ 1 / ⁇ 2) of the photocurable composition to an optimum range. (B) The photocurable compound having at least one ethylenically unsaturated bond does not include an epoxy (meth) acrylate having a weight average molecular weight of 2000 or more. (B) Only 1 type may be used for the photocurable compound which has at least 1 ethylenically unsaturated bond, and 2 or more types may be used together.
- the photocurable compound having at least one ethylenically unsaturated bond does not have a weight average molecular weight of 2000 or more.
- the photocurable compound having at least one ethylenically unsaturated bond preferably has a molecular weight of less than 2000.
- the molecular weight of a photocurable compound is 1000 or less, More preferably, it is 800 or less, More preferably, it is 600 or less.
- the molecular weight means a value calculated when it can be calculated from the molecular structure, and a weight average molecular weight when it cannot be calculated from the molecular structure.
- the photocurable compound (B) having at least one ethylenically unsaturated bond is a photocurable compound having at least one (meth) acryloyl group. Is preferred.
- the photocurable compound having at least one ethylenically unsaturated bond preferably has at least one (meth) acryloyl group as a group containing an ethylenically unsaturated bond.
- the photocurable compound having at least one ethylenically unsaturated bond is not particularly limited, and is a (meth) acrylic acid adduct of a polyhydric alcohol or a (meth) acrylic polyalkylene oxide modified product.
- examples include acid addition products, urethane (meth) acrylates, and polyester (meth) acrylates.
- the polyhydric alcohol include diethylene glycol, triethylene glycol, polyethylene glycol, dipropylene glycol, tripropylene glycol, polypropylene glycol, trimethylol propane, cyclohexane dimethanol, tricyclodecane dimethanol, an alkylene oxide adduct of bisphenol A, and Examples include pentaerythritol.
- some hydroxyl groups may remain.
- the photocurable composition may contain urethane (meth) acrylate or polyester (meth) acrylate.
- a photocurable compound having at least one ethylenically unsaturated bond is (B1) a photocurable compound having one ethylenically unsaturated bond. It is preferable to include.
- the photocurable compound having at least one ethylenically unsaturated bond may include (B2) a photocurable compound having two or more ethylenically unsaturated bonds, and (B3) ethylenically unsaturated. A photocurable compound having three or more bonds may be included. From the viewpoint of further improving the adhesion of the cured film, (B) a photocurable compound having at least one ethylenically unsaturated bond is (B1) a photocurable compound having one ethylenically unsaturated bond and And (B2) a photocurable compound having two or more ethylenically unsaturated bonds.
- the photocurable compound having at least one ethylenically unsaturated bond contains an alicyclic compound, or contains an aromatic ring or a hydroxyl group.
- a monofunctional component is preferable, but a polyfunctional plural component such as a bifunctional component may be contained.
- the photocurable compound having at least one ethylenically unsaturated bond preferably has no carboxyl group.
- membrane can be prevented, for example, discoloration of a cured
- the viscosity at 25 ° C. of the photocurable compound having at least one ethylenically unsaturated bond is preferably 1 mPa ⁇ s or more, more preferably 3 mPa ⁇ s or more. From the viewpoint of further improving the adhesion of the cured film, the viscosity at 25 ° C. of the photocurable compound having at least one ethylenically unsaturated bond is preferably 200 mPa ⁇ s or less, more preferably 100 mPa. -S or less.
- the viscosity can be measured using an E-type viscometer under the conditions of 25 ° C. and 10 rpm.
- the content of (B) the photocurable compound having at least one ethylenically unsaturated bond is preferably 5% by weight or more, more preferably 10% by weight or more, preferably 50%. % By weight or less, more preferably 40% by weight or less.
- the content of the photocurable compound having at least one ethylenically unsaturated bond is not less than the above lower limit and not more than the above upper limit, the physical properties of the cured film are effectively increased.
- the content of the (B1) photocurable compound having one ethylenically unsaturated bond is preferably 10% by weight or more, more preferably 20% by weight or more, preferably 50% by weight. % Or less, more preferably 40% by weight or less.
- the content of the photocurable compound having at least one ethylenically unsaturated bond is not less than the above lower limit and not more than the above upper limit, the adhesiveness of the cured film is effectively increased.
- the content of (B3) a photocurable compound having three or more ethylenically unsaturated bonds in 100% by weight of the photocurable composition is preferably 5% by weight or more, and preferably 20% by weight or less. (B3) When the content of the photocurable compound having three or more ethylenically unsaturated bonds is not less than the above lower limit and not more than the above upper limit, the adhesion of the cured product film is effectively increased.
- ((C) White pigment When the said photocurable composition contains the (C) white pigment, the cured
- a white pigment As for a white pigment, only 1 type may be used and 2 or more types may be used together.
- white pigments examples include alumina, titanium oxide, zinc oxide, zirconium oxide, antimony oxide, and magnesium oxide.
- the (C) white pigment is preferably titanium oxide, zinc oxide, barium sulfate, calcium carbonate, talc or zirconium oxide.
- this preferred white pigment one or more white pigments can be used among titanium oxide, zinc oxide, barium sulfate, calcium carbonate, talc and zirconium oxide.
- the white pigment is preferably titanium oxide or zinc oxide, preferably titanium oxide, and preferably zinc oxide.
- the white pigment may be zirconium oxide.
- the titanium oxide is preferably rutile type titanium oxide.
- rutile type titanium oxide By using rutile type titanium oxide, the heat resistance of the cured product film is further increased, and discoloration of the cured product film is further suppressed.
- the titanium oxide is preferably rutile titanium oxide that has been surface-treated with aluminum oxide, zirconium oxide, silicon oxide, or the like. By using the surface-treated rutile-type titanium oxide, the heat resistance of the cured product film is further increased.
- Examples of the surface-treated rutile type titanium oxide include, for example, “CR-90-2” manufactured by Ishihara Sangyo Co., Ltd. which is a rutile chlorine method titanium oxide, “CR-58” manufactured by Ishihara Sangyo Co., Ltd. which is a rutile chlorine method titanium oxide, Examples include “R-900” manufactured by DuPont, which is a rutile chlorine method titanium oxide, and “R-630” manufactured by Ishihara Sangyo Co., Ltd., which is a rutile sulfuric acid method titanium oxide. White pigments other than rutile type titanium oxide may be similarly surface-treated.
- the white pigment may contain titanium oxide and a white pigment different from titanium oxide.
- the surface treatment method is not particularly limited. As a surface treatment method, a dry method, a wet method, an integral blend method, and other known and commonly used surface treatment methods can be used.
- the average particle diameter of the white pigment is preferably 0.1 ⁇ m or more, and preferably 40 ⁇ m or less.
- the average particle size is not less than the above lower limit and not more than the above upper limit, the light reflectance of the cured product film can be further increased.
- the content of the (C) white pigment is preferably 20% by weight or more, more preferably 30% by weight or more, still more preferably 40% by weight or more, preferably 70% by weight or less. More preferably, it is 60% by weight or less.
- the content of the white pigment is not less than the above lower limit and not more than the above upper limit, the light reflectance of the cured product film is further increased, and the adhesion of the cured product film is further enhanced.
- the content of (C) the white pigment may be 50% by weight or more.
- the adhesion of the cured product film can be enhanced.
- the content of (C) the white pigment is 50% by weight or more in 100% by weight of the photocurable composition, the adhesion of the cured film is sufficiently high.
- the content of the (C) white pigment on the weight basis in the photocurable composition is as follows.
- the ratio of the content of the (C) white pigment to the content of the (A) epoxy (meth) acrylate is based on the weight in the photocurable composition. , Preferably 10 or less, more preferably 5.0 or less, still more preferably 4.0 or less.
- the white pigment (C) contains titanium oxide
- the ratio of the titanium oxide content to the (C) white pigment content is preferably 0.4 or more, more preferably 0.6 or more, and even more preferably 0.8 or more.
- the ratio of the content of titanium oxide to the content of (C) the white pigment is preferably 1.0 on the basis of weight in the photocurable composition. It is as follows.
- (D) Photopolymerization initiator Since the photocurable composition contains (D) a photopolymerization initiator, the photocurable composition can be cured by light irradiation. (D) As for a photoinitiator, only 1 type may be used and 2 or more types may be used together.
- Photopolymerization initiators include acylphosphine oxide, halomethylated triazine, halomethylated oxadiazole, imidazole, benzoin, benzoin alkyl ether, anthraquinone, benzanthrone, benzophenone, alkylphenone, thioxanthone, benzoate, acridine , Phenazine, titanocene, ⁇ -aminoalkylphenone, oxime, and derivatives thereof.
- benzophenone photopolymerization initiator examples include methyl o-benzoylbenzoate and Michler's ketone. EAB (made by Hodogaya Chemical Co., Ltd.) etc. are mentioned as a commercial item of a benzophenone series photoinitiator.
- alkylphenone photopolymerization initiators examples include Darocur 1173, Darocur 2959, Irgacure 184, Irgacure 907, Irgacure 369, Irgacure 651 (manufactured by BASF), and Esacure 1001M (manufactured by Lamberti).
- acylphosphine oxide photopolymerization initiators examples include Lucirin TPO (manufactured by BASF) and Irgacure 819 (manufactured by BASF).
- Examples of commercially available thioxanthone photopolymerization initiators include isopropyl thioxanthone and diethyl thioxanthone.
- oxime ester photopolymerization initiators examples include Irgacure OXE-01 and Irgacure OXE-02 (manufactured by BASF).
- the (D) photopolymerization initiator preferably contains both an acylphosphine photopolymerization initiator and an alkylphenone photopolymerization initiator.
- the (D) photopolymerization initiator preferably contains both an alkylphenone photopolymerization initiator and an acylphosphine oxide photopolymerization initiator. It is also preferable to contain both an acyl phosphine oxide photopolymerization initiator and a bisacyl phosphine oxide photopolymerization initiator.
- the content of the (D) photopolymerization initiator is preferably 1 with respect to 100 parts by weight in total of (A) the epoxy (meth) acrylate and (B) the photocurable compound having at least one ethylenically unsaturated bond. Part by weight or more, more preferably 3 parts by weight or more, preferably 20 parts by weight or less, more preferably 15 parts by weight or less.
- a photocurable composition can be photocured favorably.
- the photocurable composition preferably contains two or more photopolymerization initiators.
- Irgacure 819 bis (2,4,6-trimethylbenzoyl) -phenylphosphine oxide, manufactured by BASF) and TPO (2,4,6-trimethylbenzoyl-diphenyl-phosphine oxide, BASF)
- ESACURE 1001M (1- [4- (4-benzoylphenylsulfanyl) phenyl] -2-methyl-2- (4-methylphenylsulfonyl) propan-1-one, manufactured by Lamberti
- Darocur 1173 Darocur 2959
- Irgacure 907, Irgacure 369, Irgacure 651 or Irgacure 184 is more preferable.
- the content of Irgacure 819 is preferably 1% by weight or more, more preferably 15% by weight or more, and preferably 99% by weight or less, more preferably 85% in the total amount of (D) photopolymerization initiator of 100% by weight. % By weight or less.
- Irgacure 819 may be used as an essential component, and three or more kinds of photopolymerization initiators may be used in combination.
- the lower limit and the upper limit of the preferable content of Irgacure 819 are the same as the above values.
- thiol group-containing compound examples include trimethylolpropane tris (3-mercaptopropionate) (TMMP), pentaerythritol tetrakis (3-mercaptopropionate) (PEMP) manufactured by SC Organic Chemical Co., Ltd.
- TMMP trimethylolpropane tris
- PEMP pentaerythritol tetrakis
- Tris-[(3-mercaptopropionyloxy) -ethyl] -isocyanurate (TEMPIC), tetraethylene glycol bis (3-mercaptopropionate) (EGMP-4), dipentaerythritol hexakis (3-mercaptopropionate) ) (DPMP), etc., primary polyfunctional thiol, pentaerythritol tetrakis (3-mercaptobutyrate) (Karenz MT PE1), 1,3,5-tris (3-mercaptobutyryloxyethyl)- 1,3,5-triazine-2 Secondary polyfunctional thiols such as 4,6 (1H, 3H, 5H) -trione (Karenz MT NR1), 1,4-bis (3-mercaptobutyryloxy) butane (Karenz MT BD1), manufactured by SC Organic Chemical Co., Ltd.
- TEMPIC tetraethylene glycol bis (3-mercaptopropionate
- BMPA ⁇ -mercaptopropionic acid
- MPM methyl-3-mercaptopropionate
- EHMP 2-ethylhexyl-3-mercaptopropionate
- NOMP n-octyl-3-mercaptopropionate
- MMP methoxybutyl-3-mercaptopropionate
- STMP stearyl-3-mercaptopropionate
- a thiol group-containing compound having at least one thiol group is (E1) a thiol having two or more thiol groups. It is preferable to include a compound.
- the content of the (E) thiol group-containing compound and the (E1) thiol compound is preferably 0.1% by weight or more, more preferably 0.5% by weight or more, preferably in 100% by weight of the photocurable composition. Is 10% by weight or less, more preferably 5% by weight or less.
- the content of the (E) thiol group-containing compound and the (E1) thiol compound is preferably 1.0 parts by weight or more, more preferably 3.0 parts by weight with respect to 100 parts by weight of the epoxy (meth) acrylate. Part or more, preferably 35 parts by weight or less, more preferably 25 parts by weight or less, still more preferably 20 parts by weight or less.
- the content of (E) thiol group-containing compound and (E1) thiol compound is preferably 0.2 with respect to 100 parts by weight of the total of (A) epoxy (meth) acrylate and (B) photoreactive compound. It is at least 1 part by weight, more preferably at least 1 part by weight, preferably at most 20 parts by weight, more preferably at most 10 parts by weight, even more preferably at most 6 parts by weight.
- the content of the (E) thiol group-containing compound and the (E1) thiol compound is not less than the above lower limit and not more than the above upper limit, the moisture resistance of the cured film is increased, and peeling of the cured film is further suppressed.
- the adhesion of the cured product film and the storage stability of the photocurable composition are compatible at a high level. Further, when the content of the (E) thiol group-containing compound and (E1) thiol compound is not more than the above upper limit, gelation hardly proceeds during storage. When the content of the (E) thiol group-containing compound and the (E1) thiol compound is equal to or more than the above lower limit, the curability is further enhanced. From the viewpoint of enhancing storage stability, it is preferable to use a secondary thiol compound. From the viewpoint of enhancing the storage stability, a polymerization inhibitor may be used.
- thermosetting compound The photocurable composition preferably does not contain (F) a thermosetting compound or contains (F) a thermosetting compound at 5% by weight or less. In the present invention, when the (F) thermosetting compound is used, it is preferable to reduce the amount of the (F) thermosetting compound used.
- the composition having a thermosetting compound content of 5% by weight or less and the composition (F) having a thermosetting compound content of, for example, 10% by weight or more have a basic physical property of the cured product. Generally different.
- thermosetting compound only 1 type may be used and 2 or more types may be used together.
- thermosetting compound examples include epoxy compounds.
- the photocurable composition does not contain an epoxy compound or contains an epoxy compound at 5% by weight or less.
- the content of the (F) thermosetting compound is preferably as small as possible in 100% by weight of the photocurable composition.
- the content of the (F) thermosetting compound is preferably 3% by weight or less, more preferably 1% by weight or less, still more preferably 0.5% by weight or less, particularly preferably 0. % By weight (unused).
- the content of the epoxy compound is preferably 3% by weight or less, more preferably 1% by weight or less, still more preferably 0.5% by weight or less, particularly preferably 0% by weight (unused) ).
- the photocurable composition may contain (G) an organic solvent, or may not contain (G) an organic solvent.
- the photocurable composition preferably does not contain (G) an organic solvent or contains (G) an organic solvent at 10% by weight or less.
- the content of the organic solvent (G) is preferably as small as possible in 100% by weight of the photocurable composition.
- the content of the organic solvent (G) is preferably 3% by weight or less, more preferably 1% by weight or less, still more preferably 0.5% by weight or less, particularly preferably 0% by weight. (Unused).
- the said photocurable composition may contain the organic solvent and does not need to contain it.
- the photocurable composition includes inorganic fillers other than white pigments, organic fillers, colorants, polymerization inhibitors, chain transfer agents, curing aids, antioxidants, ultraviolet absorbers, antifoaming agents. , Leveling agents, surfactants, slip agents, anti-blocking agents, waxes, masking agents, deodorants, fragrances, preservatives, antibacterial agents, antistatic agents, and adhesion-imparting agents.
- adhesion imparting agent include silane coupling agents.
- the photocurable compound may contain an inorganic filler that is different from titanium oxide and is not a white pigment.
- the method for manufacturing an electronic component includes a step of applying the photocurable composition on the surface of the electronic component body to form a composition layer, and irradiating the composition layer with light to form a cured film. Forming. In the method for producing an electronic component, it is preferable not to develop the composition layer in order to form the cured film.
- the composition layer is preferably a resist layer, and the cured product film is preferably a resist film.
- the photocurable composition is suitably used for forming a cured product film without development, the photocurable composition is partially and plurally provided on the surface of the electronic component body. Can be applied.
- thermosetting agent it is preferable not to thermally cure the composition layer by the action of a thermosetting agent in order to form the cured product film.
- the composition layer is a resist layer
- the cured product film is a resist film.
- a non-developing resist photocurable composition is used.
- an application target member 11 is prepared.
- the application target member 11 is an electronic component main body.
- a substrate 11A is used as the application target member 11, and a plurality of electrodes 11B are arranged on the surface of the substrate 11A.
- a non-developing resist photocurable composition is applied onto the surface of the application target member 11 to form a resist layer 12 (composition layer).
- the non-developing resist photocurable composition is applied partially and at a plurality of locations on the surface of the application target member 11 to form a plurality of resist layers 12.
- a plurality of resist layers 12 are formed between a plurality of electrodes 11B on the surface of the substrate 11A.
- the resist layer 12 is a resist pattern, for example.
- the resist layer 12 is formed only at a position corresponding to a resist layer portion that is formed to remain after development, assuming that a conventional development resist composition is used.
- the resist layer 12 is not formed at a position corresponding to a resist layer portion to be removed by development using a conventional developing resist composition.
- Examples of the coating method of the non-developing resist photocurable composition include a coating method using a dispenser, a coating method using screen printing, and a coating method using an ink jet apparatus. Screen printing is preferred because of its excellent manufacturing efficiency. It is preferable to pattern-print the non-developing resist photocurable composition.
- the resist layer 12 is irradiated with light.
- the resist layer 12 is irradiated with light from the side opposite to the application target member 11 side of the resist layer 12.
- the resist layer 12 is photocured, and a resist film 2 (cured product film) is formed.
- the electronic component 1 in which the resist film 2 is formed on the surface of the application target member 11 is obtained.
- the manufacturing method of an electronic component provided with the resist film demonstrated using FIG. 1 (a)-(c) is an example, and the manufacturing method of an electronic component can be changed suitably. It is preferable that development is not performed to form a resist film at the time of manufacturing an electronic component.
- two or more resist layers may be formed on the surface of the coating target member, and the two or more resist layers may be formed.
- the layer may be formed partially and at a plurality of locations.
- the resist layer may be formed by irradiating light, or the light is applied after two or more layers are applied. Irradiation may form a resist layer.
- a development resist composition has often been used.
- a negative development resist composition as shown in FIG. 2A, for example, a coating target member 111 having a substrate 111A and an electrode 111B arranged on the surface of the substrate 111A is prepared. To do.
- a resist layer 112 is formed on the entire surface of the application target member 111.
- FIG. 2C light is irradiated only to the resist layer 112 on the electrode 111 ⁇ / b> B through a mask 113.
- FIG. 2D development is performed, and the resist layer 112 located between the electrodes 111B is partially removed.
- the remaining resist layer 112 is thermally cured.
- the electronic component 101 in which the resist film 102 is formed on the surface of the application target member 111 (electronic component main body) is obtained.
- the formation efficiency of the resist film and the production efficiency of the electronic component are poor. Furthermore, it is necessary to perform development.
- the photocurable composition according to the present invention by using the photocurable composition according to the present invention, the formation efficiency of a cured product film (resist film or the like) and the production efficiency of an electronic component can be increased. Further, there is no need to perform development.
- a reflector having the cured product film as a light reflecting film may be produced.
- the cured product film may be provided as a light reflecting film, or may be disposed at a position where light should be reflected.
- the electronic component may include a light irradiation unit. When light is reflected by the cured product film, the cured product film may be exposed or a transparent member may be laminated.
- Examples 1 to 17 and Comparative Examples 1 to 7 (1) Preparation of non-developing resist photocurable composition The compounding ingredients shown in the following Tables 1 to 3 were blended in the blending amounts shown in the following Tables 1 to 3, to obtain a non-developing resist photocurable composition. Prepared.
- a substrate was prepared by laminating copper foil on FR-4 having a size of 100 mm x 100 mm x thickness 0.8 mm.
- a non-developing resist photocurable composition was printed with a mask pattern using a 255 mesh polyester-biased plate by a screen printing method to form a resist layer.
- UV light with a wavelength of 365 nm is flown through the belt conveyor type exposure device once so that the integrated light quantity is 2000 mJ / cm 2 as a measurement sample.
- a resist film was obtained. The thickness of the obtained resist film was 20 ⁇ m.
- the line width value was described with the line width in a state where the resin could not be flowed between the lines and the line could be confirmed and the resin was not flowed between the width and the width and the space could be confirmed as acceptable.
- Adhesion (cross cut test) The obtained electronic component was confirmed by a cross-cut tape test (JIS 5600) and confirmed by the following criteria. Make a cut of 20 squares at 1 mm intervals on the cured product with a cutter, and then apply cellophane tape (JIS Z1522) to the cured product with the incised portion, and attach one end of the tape at an angle of 60 degrees. And peeled off strongly to confirm the peeled state. The peeled state was classified according to JIS. In the case of classifications 0, 1, and 2, the number of peeled bases is 0.
- the obtained photocurable composition was apply
- cured material was obtained by irradiating the ultraviolet-ray with a wavelength of 365 nm so that it may become the integrated light quantity 2000mJ / cm ⁇ 2 >. The appearance of the resulting cured product was confirmed.
- Pencil hardness The obtained photocurable composition was apply
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Abstract
Description
本発明に係る光硬化性化合物は、塗布対象部材の表面上に、部分的にかつ複数の箇所に塗布して用いられる。本発明に係る光硬化性組成物は、光の照射により硬化されて用いられ、かつ現像を行わずにレジスト膜を形成するために用いられることが好ましい。本発明に係る光硬化性組成物は、非現像型レジスト光硬化性組成物であることが好ましい。本発明に係る光硬化性組成物は、レジスト膜を形成するために現像が行われない場合には、レジスト膜を形成するために現像を行う現像型レジスト組成物とは異なる。本発明に係る光硬化性組成物では、現像を行わなくても、良好なレジスト膜を得ることができる組成が採用されている。 [Photocurable composition]
The photocurable compound according to the present invention is used by being partially applied to a plurality of locations on the surface of the application target member. The photocurable composition according to the present invention is preferably used after being cured by irradiation with light, and is used for forming a resist film without performing development. The photocurable composition according to the present invention is preferably a non-developing resist photocurable composition. The photocurable composition according to the present invention is different from a developing resist composition in which development is performed to form a resist film when development is not performed to form a resist film. In the photocurable composition according to the present invention, a composition capable of obtaining a good resist film without being developed is employed.
上記光硬化性組成物に含まれる(A)エポキシ(メタ)アクリレートは、カルボキシル基を有さない。上記光硬化性組成物に含まれる(A)エポキシ(メタ)アクリレートの重量平均分子量は2000以上である。(A)エポキシ(メタ)アクリレートの使用により、塗布対象部材に対する硬化物膜の密着性が効果的に高くなる。特に(C)白色顔料の含有量が多い場合に、(A)エポキシ(メタ)アクリレートを用いていないと、硬化物膜の密着性が低くなりやすい傾向がある。(A)エポキシ(メタ)アクリレートを用いることで、(C)白色顔料の含有量が多くても、硬化物膜の密着性を高めることができる。(A)エポキシ(メタ)アクリレートは1種のみが用いられてもよく、2種以上が併用されてもよい。 ((A) Epoxy (meth) acrylate)
The (A) epoxy (meth) acrylate contained in the photocurable composition does not have a carboxyl group. The weight average molecular weight of (A) epoxy (meth) acrylate contained in the said photocurable composition is 2000 or more. (A) By using epoxy (meth) acrylate, the adhesion of the cured product film to the application target member is effectively increased. In particular, when the content of (C) the white pigment is large, if (A) epoxy (meth) acrylate is not used, the adhesion of the cured film tends to be lowered. (A) By using epoxy (meth) acrylate, even if there is much content of (C) white pigment, the adhesiveness of hardened | cured material film | membrane can be improved. (A) As for epoxy (meth) acrylate, only 1 type may be used and 2 or more types may be used together.
測定条件カラム:Shodex GPC LF-G×1本、Shodex GPC LF-804×2本
移動相:THF 1.0mL/分
サンプル濃度:5mg/mL
検出器:示差屈折率検出器(RID)
標準物質:ポリスチレン(TOSOH社製、分子量:620~590000) Measuring device: “Waters GPC System (Waters 2690 + Waters 2414 (RI))” manufactured by Nihon Waters
Measurement condition columns: Shodex GPC LF-G × 1, Shodex GPC LF-804 × 2 Mobile phase: THF 1.0 mL / min Sample concentration: 5 mg / mL
Detector: Differential refractive index detector (RID)
Reference material: polystyrene (Made by TOSOH, molecular weight: 620 to 590000)
(A)エポキシ(メタ)アクリレートとともに(B)エチレン性不飽和結合を少なくとも1つ有する光硬化性化合物を用いることにより、(C)白色顔料の含有量が多くても、硬化物膜の密着性を効果的に高めることができ、更に光硬化性組成物の粘度比(η1/η2)を最適な範囲に制御することが容易である。(B)エチレン性不飽和結合を少なくとも1つ有する光硬化性化合物には、2000以上の重量平均分子量を有するエポキシ(メタ)アクリレートは含まれない。(B)エチレン性不飽和結合を少なくとも1つ有する光硬化性化合物は1種のみが用いられてもよく、2種以上が併用されてもよい。 ((B) Photocurable compound having at least one ethylenically unsaturated bond)
(A) By using a photocurable compound having (B) at least one ethylenically unsaturated bond together with epoxy (meth) acrylate, even if the content of (C) white pigment is large, the adhesion of the cured product film It is easy to control the viscosity ratio (η1 / η2) of the photocurable composition to an optimum range. (B) The photocurable compound having at least one ethylenically unsaturated bond does not include an epoxy (meth) acrylate having a weight average molecular weight of 2000 or more. (B) Only 1 type may be used for the photocurable compound which has at least 1 ethylenically unsaturated bond, and 2 or more types may be used together.
上記光硬化性組成物が(C)白色顔料を含むことにより、光の反射率が高い硬化物膜を形成することができる。(C)白色顔料の使用によって、(C)白色顔料以外の充填材のみを用いた場合と比較して、光の反射率が高い硬化物膜が得られる。(C)白色顔料は、1種のみが用いられてもよく、2種以上が併用されてもよい。 ((C) White pigment)
When the said photocurable composition contains the (C) white pigment, the cured | curing material film | membrane with a high light reflectance can be formed. By using the (C) white pigment, a cured film having a high light reflectance can be obtained as compared with the case where only the filler other than the (C) white pigment is used. (C) As for a white pigment, only 1 type may be used and 2 or more types may be used together.
上記光硬化性組成物は、(D)光重合開始剤を含むので、光の照射により光硬化性組成物を硬化させることができる。(D)光重合開始剤は、1種のみが用いられてもよく、2種以上が併用されてもよい。 ((D) Photopolymerization initiator)
Since the photocurable composition contains (D) a photopolymerization initiator, the photocurable composition can be cured by light irradiation. (D) As for a photoinitiator, only 1 type may be used and 2 or more types may be used together.
(E)チオール基を少なくとも1つ有するチオール基含有化合物を他の化合物と併用することにより、耐湿性に優れた硬化物膜を得ることができ、かつ、耐熱性が高い硬化物膜を得ることができる。さらに、(E)チオール基含有化合物を塩素法により製造されたルチル型酸化チタンと併用することにより、硬化物膜の密着性と光硬化性組成物の保存安定性とを両立させることができる。(E)チオール基含有化合物は、1種のみが用いられてもよく、2種以上が併用されてもよい。 ((E) Thiol group-containing compound having at least one thiol group)
(E) By using a thiol group-containing compound having at least one thiol group in combination with another compound, a cured product film excellent in moisture resistance can be obtained, and a cured product film having high heat resistance can be obtained. Can do. Furthermore, (E) By using together the thiol group containing compound with the rutile type titanium oxide manufactured by the chlorine method, the adhesiveness of a cured | curing material film | membrane and the storage stability of a photocurable composition can be made compatible. (E) As for a thiol group containing compound, only 1 type may be used and 2 or more types may be used together.
上記光硬化性組成物は、(F)熱硬化性化合物を含まないか、又は、(F)熱硬化性化合物を5重量%以下で含むことが好ましい。本発明では、(F)熱硬化性化合物の使用する場合には、(F)熱硬化性化合物の使用量を少なくすることが好ましい。(F)熱硬化性化合物の含有量が5重量%以下である組成物と、(F)熱硬化性化合物の含有量が例えば10重量%以上である組成物とでは、硬化物の基本物性が一般に異なる。(F)熱硬化性化合物は、1種のみが用いられてもよく、2種以上が併用されてもよい。 ((F) thermosetting compound)
The photocurable composition preferably does not contain (F) a thermosetting compound or contains (F) a thermosetting compound at 5% by weight or less. In the present invention, when the (F) thermosetting compound is used, it is preferable to reduce the amount of the (F) thermosetting compound used. (F) The composition having a thermosetting compound content of 5% by weight or less and the composition (F) having a thermosetting compound content of, for example, 10% by weight or more have a basic physical property of the cured product. Generally different. (F) As for a thermosetting compound, only 1 type may be used and 2 or more types may be used together.
上記光硬化性組成物は、(G)有機溶剤を含んでいてもよく、(G)有機溶剤を含んでいなくてもよい。 ((G) organic solvent)
The photocurable composition may contain (G) an organic solvent, or may not contain (G) an organic solvent.
上記光硬化性組成物は、有機溶剤を含んでいてもよく、含んでいなくてもよい。
上記光硬化性組成物は、上述した成分以外に、白色顔料以外の無機フィラー、有機フィラー、着色剤、重合禁止剤、連鎖移動剤、硬化助剤、酸化防止剤、紫外線吸収剤、消泡剤、レベリング剤、界面活性剤、スリップ剤、アンチブロッキング剤、ワックス、マスキング剤、消臭剤、芳香剤、防腐剤、抗菌剤、帯電防止剤及び密着性付与剤等を含んでいてもよい。上記密着性付与剤としては、シランカップリング剤等が挙げられる。 (Other ingredients)
The said photocurable composition may contain the organic solvent and does not need to contain it.
In addition to the components described above, the photocurable composition includes inorganic fillers other than white pigments, organic fillers, colorants, polymerization inhibitors, chain transfer agents, curing aids, antioxidants, ultraviolet absorbers, antifoaming agents. , Leveling agents, surfactants, slip agents, anti-blocking agents, waxes, masking agents, deodorants, fragrances, preservatives, antibacterial agents, antistatic agents, and adhesion-imparting agents. Examples of the adhesion imparting agent include silane coupling agents.
電子部品の製造方法は、電子部品本体の表面上に、上記光硬化性組成物を塗布して、組成物層を形成する工程と、上記組成物層に光を照射して、硬化物膜を形成する工程とを備える。電子部品の製造方法では、上記硬化物膜を形成するために、上記組成物層を現像しないことが好ましい。上記組成物層がレジスト層であることが好ましく、上記硬化物膜がレジスト膜であることが好ましい。 [Electronic component and method of manufacturing electronic component]
The method for manufacturing an electronic component includes a step of applying the photocurable composition on the surface of the electronic component body to form a composition layer, and irradiating the composition layer with light to form a cured film. Forming. In the method for producing an electronic component, it is preferable not to develop the composition layer in order to form the cured film. The composition layer is preferably a resist layer, and the cured product film is preferably a resist film.
(1)非現像型レジスト光硬化性組成物の調製
以下の表1~3に示す配合成分を以下の表1~3に示す配合量で配合して、非現像型レジスト光硬化性組成物を調製した。 (Examples 1 to 17 and Comparative Examples 1 to 7)
(1) Preparation of non-developing resist photocurable composition The compounding ingredients shown in the following Tables 1 to 3 were blended in the blending amounts shown in the following Tables 1 to 3, to obtain a non-developing resist photocurable composition. Prepared.
100mm×100mm×厚さ0.8mmのFR-4に銅箔を積層した基板を用意した。この基板上に、スクリーン印刷法により、255メッシュのポリエステルバイアス製の版を用いて、マスクパターンで非現像型レジスト光硬化性組成物を印刷して、レジスト層を形成した。印刷後、高圧水銀灯が設置された紫外線照射装置を用い、レジスト層に波長365nmの紫外線を、積算光量が2000mJ/cm2となるようにベルトコンベアー式露光器に1回流すことにより、測定サンプルとしてのレジスト膜を得た。得られたレジスト膜の厚みは20μmであった。 (2) Production of electronic component A substrate was prepared by laminating copper foil on FR-4 having a size of 100 mm x 100 mm x thickness 0.8 mm. On this substrate, a non-developing resist photocurable composition was printed with a mask pattern using a 255 mesh polyester-biased plate by a screen printing method to form a resist layer. After printing, using a UV irradiation device with a high-pressure mercury lamp, UV light with a wavelength of 365 nm is flown through the belt conveyor type exposure device once so that the integrated light quantity is 2000 mJ / cm 2 as a measurement sample. A resist film was obtained. The thickness of the obtained resist film was 20 μm.
(1)塗布精度(粘度(比(η1/η2)))
得られた光硬化性組成物について、E型粘度計を用いて、光硬化性組成物の25℃及び1rpmでの粘度η1と、25℃及び10rpmでの粘度η2とを測定した。比(η1/η2)を求めた。 (Evaluation)
(1) Application accuracy (viscosity (ratio (η1 / η2)))
About the obtained photocurable composition, the viscosity η1 at 25 ° C. and 1 rpm and the viscosity η2 at 25 ° C. and 10 rpm of the photocurable composition were measured using an E-type viscometer. The ratio (η1 / η2) was determined.
500μm、300μm、200μm、150uμm、100μmの各線幅のL/Sがパターニングされたマスクを用いてスクリーン印刷及び露光し、L/Sの印刷精度を確認した。判定は下記に従って実施した。 (2) Application accuracy (L / S (μm))
Screen printing and exposure were performed using a mask patterned with L / S having line widths of 500 μm, 300 μm, 200 μm, 150 μm, and 100 μm, and the L / S printing accuracy was confirmed. The determination was carried out according to the following.
得られた電子部品について、クロスカットテープ試験(JIS 5600)で確認し、下記の判定基準で確認した。1mm間隔で碁盤目に、硬化物に切り込みを20マス分カッターで作成し、次に切り込み部分を有する硬化物にセロハンテープ(JIS Z1522)を十分に貼りつけて、テープの一端を60度の角度で強く引き剥がして剥離状態を確認した。剥離状態をJISに従い分類した。分類0,1,2の場合に、剥離した基盤目の数は0である。 (3) Adhesion (cross cut test)
The obtained electronic component was confirmed by a cross-cut tape test (JIS 5600) and confirmed by the following criteria. Make a cut of 20 squares at 1 mm intervals on the cured product with a cutter, and then apply cellophane tape (JIS Z1522) to the cured product with the incised portion, and attach one end of the tape at an angle of 60 degrees. And peeled off strongly to confirm the peeled state. The peeled state was classified according to JIS. In the case of
測定サンプルを121℃、2atmの条件下に96時間放置した後、評価サンプルの剥離の有無を確認した。 (4) Adhesion (PCT test 96h)
After leaving the measurement sample at 121 ° C. and 2 atm for 96 hours, the evaluation sample was checked for peeling.
○:レジスト膜の剥離なし
×:レジスト膜の剥離あり [Criteria for PCT test 96h]
○: No peeling of resist film ×: With peeling of resist film
得られた光硬化性組成物を支持部材上に厚み20μmに塗布した。塗布後の光硬化性組成物について、波長365nmの紫外線を積算光量2000mJ/cm2になるように照射して硬化物を得た。得られた硬化物の外観を確認した。 (5) Uniformity of coating film The obtained photocurable composition was apply | coated to 20 micrometers in thickness on the support member. About the photocurable composition after application | coating, the hardened | cured material was obtained by irradiating the ultraviolet-ray with a wavelength of 365 nm so that it may become the integrated light quantity 2000mJ / cm < 2 >. The appearance of the resulting cured product was confirmed.
○:×の判定基準に相当しない
×:表面に凹凸や筋が複数確認される [Criteria for coating uniformity]
○: Not equivalent to the criterion of × ×: Multiple irregularities and streaks are confirmed on the surface
得られた電子部品について、色彩・色差計(コニカミノルタ社製「CR-400」)を用いて、評価サンプルの反射率Y値を測定した。 (6) Reflectance (Y (%))
About the obtained electronic component, the reflectance Y value of the evaluation sample was measured using a color / color difference meter (“CR-400” manufactured by Konica Minolta).
得られた光硬化性組成物を支持部材上に厚み20μmに塗布した。塗布後の光硬化性組成物について、波長365nmの紫外線を積算光量2000mJ/cm2になるように照射して硬化物を得て、得られた硬化物を270℃で5分放置した。色彩色度計を用いて、放置前後のL*a*b*表色系における色差ΔEを求めた。 (7) Heat resistance (reflectance (ΔE))
The obtained photocurable composition was apply | coated to 20 micrometers in thickness on the support member. About the photocurable composition after application | coating, the ultraviolet-ray of wavelength 365nm was irradiated so that it might become the integrated light quantity 2000mJ / cm < 2 >, the cured | curing material was obtained, and the obtained cured | curing material was left at 270 degreeC for 5 minutes. Using a chromaticity meter, the color difference ΔE in the L * a * b * color system before and after standing was determined.
得られた光硬化性組成物を支持部材上に厚み20μmに塗布した。塗布後の光硬化性組成物について、波長365nmの紫外線を積算光量2000mJ/cm2になるように照射して硬化物を得た。得られた硬化物について、JIS K5600-5-4に準拠して、鉛筆硬度を求めた。 (8) Pencil hardness The obtained photocurable composition was apply | coated to the thickness of 20 micrometers on the supporting member. About the photocurable composition after application | coating, the hardened | cured material was obtained by irradiating the ultraviolet-ray with a wavelength of 365 nm so that it may become the integrated light quantity 2000mJ / cm < 2 >. With respect to the obtained cured product, the pencil hardness was determined according to JIS K5600-5-4.
2…レジスト膜(硬化物膜)
11…塗布対象部材(電子部品本体)
11A…基板
11B…電極
12…レジスト層(組成物層) DESCRIPTION OF
11 ... Application target member (electronic component body)
11A ...
Claims (14)
- 塗布対象部材の表面上に、部分的にかつ複数の箇所に塗布して用いられ、
カルボキシル基を有さず、かつ2000以上の重量平均分子量を有するエポキシ(メタ)アクリレートと、
2000以上の重量平均分子量を有するエポキシ(メタ)アクリレートではなく、2000以上の重量平均分子量を有さず、かつエチレン性不飽和結合を少なくとも1つ有する光硬化性化合物と、
白色顔料と、
光重合開始剤とを含み、
前記エポキシ(メタ)アクリレートの含有量が5重量%以上、30重量%以下である、光硬化性組成物。 On the surface of the application target member, partially and used by applying to a plurality of locations,
An epoxy (meth) acrylate having no carboxyl group and having a weight average molecular weight of 2000 or more;
A photocurable compound that is not an epoxy (meth) acrylate having a weight average molecular weight of 2000 or more, has no weight average molecular weight of 2000 or more, and has at least one ethylenically unsaturated bond;
White pigment,
A photopolymerization initiator,
The photocurable composition whose content of the said epoxy (meth) acrylate is 5 to 30 weight%. - 前記白色顔料の含有量が20重量%以上、70重量%以下である、請求項1に記載の光硬化性組成物。 The photocurable composition according to claim 1, wherein the content of the white pigment is 20 wt% or more and 70 wt% or less.
- 前記光硬化性化合物が、2000以上の重量平均分子量を有するエポキシ(メタ)アクリレートではなく、2000以上の重量平均分子量を有さず、かつ(メタ)アクリロイル基を少なくとも1つ有する光硬化性化合物である、請求項1又は2に記載の光硬化性組成物。 The photocurable compound is not an epoxy (meth) acrylate having a weight average molecular weight of 2000 or more, a photocurable compound having no weight average molecular weight of 2000 or more and having at least one (meth) acryloyl group. The photocurable composition according to claim 1 or 2.
- 前記エポキシ(メタ)アクリレートの含有量が10重量%以上、30重量%以下である、請求項1~3のいずれか1項に記載の光硬化性組成物。 The photocurable composition according to any one of claims 1 to 3, wherein the content of the epoxy (meth) acrylate is 10 wt% or more and 30 wt% or less.
- チオール基を少なくとも1つ有するチオール基含有化合物を含む、請求項1~4のいずれか1項に記載の光硬化性組成物。 The photocurable composition according to any one of claims 1 to 4, comprising a thiol group-containing compound having at least one thiol group.
- 光硬化性組成物に含まれる2000以上の重量平均分子量を有する光硬化性成分の全体の含有量の前記光硬化性化合物の含有量に対する比が、1.25以下である、請求項1~5のいずれか1項に記載の光硬化性組成物。 The ratio of the total content of the photocurable component having a weight average molecular weight of 2000 or more contained in the photocurable composition to the content of the photocurable compound is 1.25 or less. The photocurable composition of any one of these.
- 光の照射により硬化されて用いられ、かつ現像を行わずにレジスト膜を形成するために用いられ、
非現像型レジスト光硬化性組成物である、請求項1~6のいずれか1項に記載の光硬化性組成物。 Used to be cured by light irradiation, and used to form a resist film without development,
The photocurable composition according to any one of claims 1 to 6, which is a non-developing resist photocurable composition. - 25℃及び1rpmでの粘度η1の25℃及び10rpmでの粘度η2に対する比が、1.1以上、2.2以下である、請求項1~7のいずれか1項に記載の光硬化性組成物。 The photocurable composition according to any one of claims 1 to 7, wherein the ratio of the viscosity η1 at 25 ° C and 1 rpm to the viscosity η2 at 25 ° C and 10 rpm is 1.1 or more and 2.2 or less. object.
- 熱硬化剤の作用により熱硬化させて用いられない、請求項1~8のいずれか1項に記載の光硬化性組成物。 The photocurable composition according to any one of claims 1 to 8, which is not used after being thermally cured by the action of a thermosetting agent.
- 熱硬化性化合物を含まないか、又は、熱硬化性化合物を5重量%以下で含む、請求項1~9のいずれか1項に記載の光硬化性組成物。 The photocurable composition according to any one of claims 1 to 9, which does not contain a thermosetting compound or contains a thermosetting compound at 5% by weight or less.
- 他の光硬化性組成物とともに多層のレジスト膜を形成するために用いられない、請求項1~10のいずれか1項に記載の光硬化性組成物。 The photocurable composition according to any one of claims 1 to 10, which is not used for forming a multilayer resist film together with another photocurable composition.
- 電子部品本体の表面上に、部分的にかつ複数の箇所に、請求項1~11のいずれか1項に記載の光硬化性組成物を塗布して、組成物層を形成する工程と、
前記組成物層に光を照射して、硬化物膜を形成する工程とを備え、
前記硬化物膜を形成するために、前記組成物層を現像しない、電子部品の製造方法。 A step of applying the photocurable composition according to any one of claims 1 to 11 on the surface of the electronic component body partially and at a plurality of locations to form a composition layer;
Irradiating the composition layer with light to form a cured product film,
A method for producing an electronic component, wherein the composition layer is not developed to form the cured product film. - 前記硬化物膜を形成するために、熱硬化剤の作用により前記組成物層を熱硬化させない、請求項12に記載の電子部品の製造方法。 13. The method of manufacturing an electronic component according to claim 12, wherein the composition layer is not thermally cured by the action of a thermosetting agent in order to form the cured product film.
- 前記組成物層がレジスト層であり、
前記硬化物膜がレジスト膜である、請求項12又は13に記載の電子部品の製造方法。 The composition layer is a resist layer;
The method for manufacturing an electronic component according to claim 12 or 13, wherein the cured product film is a resist film.
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JPWO2016002923A1 (en) | 2017-04-27 |
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