JP2016204630A - Photocurable composition and manufacturing method of electronic component - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a photocurable composition capable of increasing the adhesiveness of a cured article film to an application target member, increasing the light reflectance of the cured article film because of its while color and increasing the heat resistance of the cured article film.SOLUTION: The photocurable composition is applied partially and in a plurality of locations on the surface of an application target member and contains epoxy (meth)acrylate having no carboxyl group and having a weight average molecular weight of 2000 or more, a photocurable compound which is not the epoxy (meth)acrylate having a weight average molecular weight of 2000 or more, does not have a weight average molecule weight of 2000 or more and has at least one ethylenic unsaturated bond, a white pigment, and a photoinitiator. The content of the epoxy (meth)acrylate is 5 wt.% to 30 wt.% inclusive. The photocurable composition contains no thermosetting compound or contains a thermosetting compound of 3 wt.% or less.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a photocurable composition that is used by being partially applied to a plurality of locations on the surface of a member to be coated. Moreover, this invention relates to the manufacturing method of the electronic component using the said photocurable composition.

  A solder resist film is widely used as a protective film for protecting a printed wiring board from high-temperature solder.

  In various electronic components, a light emitting diode (hereinafter abbreviated as LED) chip is mounted on the upper surface of a printed wiring board. A white solder resist film may be formed on the upper surface of the printed wiring board in order to use light that has reached the upper surface side of the printed wiring board among the light emitted from the LEDs. The white solder resist film contains a white pigment. When such a white solder resist film is formed, the white solder resist film reaches not only the light directly irradiated from the surface of the LED chip to the opposite side of the printed wiring board but also the upper surface side of the printed wiring board. The reflected light reflected by can also be used. Therefore, the utilization efficiency of the light generated from the LED can be increased.

  In addition to the solder resist film application, a cured product film containing a white pigment may be used in a light reflection application.

  As an example of a material for forming the white solder resist film, the following Patent Document 1 contains an alkoxy group-containing silane-modified epoxy resin obtained by a dealcoholization reaction between an epoxy resin and a hydrolyzable alkoxysilane. A resist material further containing an unsaturated group-containing polycarboxylic acid resin, a diluent, a photopolymerization initiator, and a cured adhesion-imparting agent is disclosed.

  Patent Document 2 below discloses a white solder resist material containing a carboxyl group-containing resin having no aromatic ring, a photopolymerization initiator, an epoxy compound, a rutile titanium oxide, and a diluent. Yes.

  Patent Document 3 below discloses a composition for forming a two-layer solder resist film for LED including a white ink layer and an undercoat layer. The composition for forming the white ink layer is (A1) a photopolymerization reactive polymer that is a urethane acrylate resin or a mixture of a urethane acrylate resin and an epoxy acrylate resin, and (A2) the photopolymerization reactive polymer (A1). 100 to 170 parts by mass of a white pigment with respect to 100 parts by mass, and (A3) 10 to 50 parts by mass of a photopolymerization initiator with respect to 100 parts by mass of the photopolymerization reactive polymer (A1). The composition for forming the undercoat layer is (B1) a photopolymerization reactive polymer that is an epoxy acrylate resin, (B2) 200 to 300 parts by mass with respect to 100 parts by mass of the photopolymerization reactive polymer (B1). And (B3) 10 to 50 parts by mass of a photopolymerization initiator with respect to 100 parts by mass of the photopolymerization reactive polymer (B1).

JP 2007-249148 A JP 2007-322546 A JP 2013-194057 A

  In the materials described in Patent Documents 1 and 2, many processes such as an exposure process and a development process in photolithography are required to form a resist film. For this reason, the number of processes is large, and the production efficiency of electronic parts and the like is poor.

  Furthermore, since the materials described in Patent Documents 1 and 2 are developed using a chemical solution such as acid or alkali, the environmental load is large. Furthermore, extra resist material must be used to form the resist layer portion that is removed by development. Further, the resist layer portion removed by development becomes waste. For this reason, since the amount of waste is large, the environmental load is large.

  In Patent Document 3, a two-layer LED solder resist film including a white ink layer and an undercoat layer is formed. This resist film is formed without development, but a composition for forming a white ink layer and a composition for forming an undercoat layer are prepared separately, and these two compositions are further prepared. A separate application work is required. For this reason, the manufacturing efficiency of electronic parts and the like is poor, and the manufacturing cost of electronic parts also increases.

  Therefore, the inventor examined materials with low environmental impact and good manufacturing efficiency, but when the cured material film was formed by applying the material to the application target member, the adhesion of the cured product film to the application target member was The subject that it was low or the heat resistance of hardened | cured material film | membrane may be low was discovered.

  The object of the present invention is to improve the adhesion of the cured film to the coating target member, to increase the light reflectance of the cured film by being white, and to improve the heat resistance of the cured film. It is to provide a photocurable composition that can be enhanced. Another object of the present invention is to provide a method for producing an electronic component using the photocurable composition.

  According to a wide aspect of the present invention, an epoxy (meta) having a weight average molecular weight of 2000 or more, having no carboxyl group, partially used on a surface of a coating target member and applied to a plurality of locations. ) An acrylate, an epoxy (meth) acrylate having a weight average molecular weight of 2000 or more, a photocurable compound having no weight average molecular weight of 2000 or more and having at least one ethylenically unsaturated bond, and a white pigment There is provided a photocurable composition containing titanium oxide and a photopolymerization initiator, wherein the content of the epoxy (meth) acrylate is 5% by weight or more and 30% by weight or less.

  On the specific situation with the photocurable composition which concerns on this invention, content of the said white pigment titanium oxide is 20 to 70 weight%.

  In a specific aspect of the photocurable composition according to the present invention, the photocurable compound is not an epoxy (meth) acrylate having a weight average molecular weight of 2000 or more, and does not have a weight average molecular weight of 2000 or more. And it is a photocurable compound which has at least one (meth) acryloyl group.

  On the specific situation with the photocurable composition which concerns on this invention, content of the said epoxy (meth) acrylate is 10 weight% or more and 30 weight% or less.

  On the specific situation with the photocurable composition concerning this invention, the said photocurable composition contains the thiol group containing compound which has at least 1 thiol group.

  On the specific situation with the photocurable composition which concerns on this invention, content of the said photocurable compound of the whole content of the photocurable component which has a weight average molecular weight of 2000 or more contained in a photocurable composition. The ratio to is 1.25 or less.

  In a specific aspect of the photocurable composition according to the present invention, the photocurable composition is used by being cured by irradiation with light, and is used for forming a resist film without performing development, It is a non-developing resist photocurable composition.

  In the photocurable composition according to the present invention, the ratio of the viscosity η1 at 25 ° C. and 1 rpm to the viscosity η2 at 25 ° C. and 10 rpm is 1.1 or more and 2.2 or less.

  The photocurable composition according to the present invention is preferably not used after being thermally cured by the action of a thermosetting agent.

  On the specific situation with the photocurable composition which concerns on this invention, the said photocurable composition does not contain a thermosetting compound, or contains a thermosetting compound at 5 weight% or less.

  On the specific situation with the photocurable composition which concerns on this invention, the said photocurable composition is not used in order to form a multilayer resist film with another photocurable composition.

  According to a wide aspect of the present invention, a step of applying the above-described photocurable composition to the surface of the electronic component main body partially and at a plurality of locations to form a composition layer, and the composition And a step of forming a cured product film by irradiating the layer with light, and a method for producing an electronic component is provided in which the composition layer is not developed in order to form the cured product film.

  On the specific situation with the manufacturing method of the electronic component which concerns on this invention, in order to form the said hardened | cured material film, the said composition layer is not thermosetted by the effect | action of a thermosetting agent.

  On the specific situation with the manufacturing method of the electronic component which concerns on this invention, the said composition layer is a resist layer and the said hardened | cured material film is a resist film.

  The photocurable composition according to the present invention is not an epoxy (meth) acrylate having a carboxyl group and having a weight average molecular weight of 2000 or more and an epoxy (meth) acrylate having a weight average molecular weight of 2000 or more, Containing a photocurable compound having no weight average molecular weight of 2000 or more and having at least one ethylenically unsaturated bond, white pigment titanium oxide, and a photopolymerization initiator, and containing the epoxy (meth) acrylate Since the amount is 5% by weight or more and 30% by weight or less, when the photocurable composition according to the present invention is applied to the surface of the application target member partially and at a plurality of locations and cured, The adhesion of the cured product film to the application target member can be increased, the light reflectance of the cured product film can be increased by being white, and the heat resistance of the cured product film It can be increased.

1A to 1C are cross-sectional views for explaining an example of a method for producing an electronic component using the photocurable composition according to one embodiment of the present invention. 2A to 2E are cross-sectional views for explaining an example of a method for producing an electronic component using a conventional developing resist composition.

  Details of the present invention will be described below.

[Photocurable composition]
The photocurable compound according to the present invention is used by being partially applied to a plurality of locations on the surface of the application target member. The photocurable composition according to the present invention is preferably used after being cured by irradiation with light, and is used for forming a resist film without performing development. The photocurable composition according to the present invention is preferably a non-developing resist photocurable composition. The photocurable composition according to the present invention is different from a developing resist composition in which development is performed to form a resist film when development is not performed to form a resist film. In the photocurable composition according to the present invention, a composition capable of obtaining a good resist film without being developed is employed.

  The photocurable composition according to the present invention comprises (A) an epoxy (meth) acrylate having no carboxyl group and having a weight average molecular weight of 2000 or more, and (B) an epoxy having a weight average molecular weight of 2000 or more ( A photocurable compound that is not (meth) acrylate and does not have a weight average molecular weight of 2000 or more and has at least one ethylenically unsaturated bond; (C) a white pigment; and (D) a photopolymerization initiator. Including.

  In this invention, since said structure is employ | adopted, the adhesiveness of hardened | cured material films (resist film etc.) with respect to a coating object member can be improved. In this invention, even if it does not develop, the adhesiveness of the hardened | cured material film with respect to a coating object member becomes high. For example, adhesion between the electronic component main body such as a substrate and a cured product film (resist film or the like) can be improved, and peeling of the cured product film (resist film or the like) can be suppressed. Furthermore, since the photocurable composition according to the present invention contains (C) a white pigment, a white cured product film (such as a resist film) can be formed. When the cured product film (resist film or the like) is white, the light reflectance of the cured product film (resist film or the like) can be increased. Furthermore, in the present invention, since the above configuration is employed, the heat resistance of the cured product film (resist film or the like) can be improved. For example, discoloration of a cured product film (such as a resist film) can be suppressed.

  Furthermore, in 100% by weight of the photocurable composition according to the present invention, the content of (A) epoxy (meth) acrylate is 5% by weight or more and 30% by weight or less. For this reason, the adhesiveness of the hardened | cured material film with respect to a coating object member can be improved effectively. Furthermore, when the content of (A) epoxy (meth) acrylate is within the above range, the appearance is improved when the photocurable composition according to the present invention is printed. In the present invention, the content of the (A) epoxy (meth) acrylate being within the above range is an important configuration for obtaining the effects of the present invention at a high level.

  Furthermore, in the present invention, a good cured product film (resist film or the like) can be formed without performing many steps such as an exposure step and a development step in photolithography. When the exposure process and the development process are not performed, the amount of waste can be reduced and the environmental load can be reduced. Furthermore, the manufacturing cost of electronic components can be reduced.

  In the photocurable composition, the ratio of the viscosity η1 at 25 ° C. and 1 rpm to the viscosity η2 at 25 ° C. and 10 rpm (η1 / η2) is preferably 0.5 or more, more preferably 1.1 or more, and further Preferably it is 1.4 or more, Preferably it is 2.2 or less, More preferably, it is 2.0 or less. Since the photocurable composition is suitably used for forming a resist film without development, the photocurable composition is partially and on the surface of an application target member such as an electronic component body. It may be used by applying to multiple locations. For example, the photocurable composition may be applied in a pattern. When the ratio (η1 / η2) is not less than the lower limit and not more than the upper limit, the resist film can be formed in a predetermined region with higher accuracy. For example, even if it is applied in a pattern with a width of 150 μm or less, a cured product film (resist film or the like) can be formed with high accuracy. The photocurable composition is preferably used for forming a cured product film by pattern printing.

  The viscosity can be measured using an E-type viscometer.

Using the photocurable composition, a cured product is obtained by irradiating light having a wavelength of 365 nm so as to have an integrated light quantity of 2000 mJ / cm ² , and the obtained cured product is allowed to stand at 270 ° C. for 5 minutes. The color difference ΔE in the L ^* a ^* b ^* color system before and after standing is preferably 5.0 or less, more preferably 4.0 or less, still more preferably 3.5 or less, and particularly preferably 3.0 or less. When the ΔE is less than or equal to the above upper limit, the heat resistance of the cured film is considerably excellent, and a decrease in the light reflectance of the cured film due to long-term use can be suppressed. Examples of the lamp for irradiating light having a wavelength of 365 nm include a metal halide, a mercury lamp, and an LED lamp.

  The photocurable composition is preferably used for forming a single-layer resist film. In the present invention, a resist film exhibiting the above effects can be formed even with a single layer resist film. It is preferable that the said photocurable composition is not used in order to form a multilayer resist film with another photocurable composition. The single-layer resist film formed using the photocurable composition is preferably not stacked with other resist films. When a multilayer resist film is formed using two or more kinds of photocurable compositions, the production efficiency of the resist film is lowered.

  Since the said photocurable composition is hardened | cured by irradiation of light, it does not need to contain the thermosetting compound and does not need to contain the thermosetting agent. It is preferable that the photocurable composition is not used after being thermoset by the action of a thermosetting agent. In order to form the cured product film (resist film or the like), the composition layer (resist layer or the like) disposed on the surface of the application target member may not be thermally cured. Since the said hardened | cured material film | membrane is formed, it is not necessary to heat the composition layer arrange | positioned on the surface of a coating object member. However, the composition layer may be heated at a low temperature. In order to form the cured product film, the composition layer is preferably not heated to 280 ° C or higher, more preferably not heated to 180 ° C or higher, and still more preferably not heated to 60 ° C or higher. The lower the temperature at which the composition layer is heated, the more the thermal degradation of the application target member such as the electronic component body can be suppressed.

  The photocurable composition includes a photocurable component having a weight average molecular weight of 2000 or more. The said photocurable composition contains at least the epoxy (meth) acrylate which does not have a carboxyl group and has a weight average molecular weight of 2000 or more as said photocurable component. The said photocurable composition may contain the photocurable component which has 2000 or more weight average molecular weights other than (A) epoxy (meth) acrylate as said photocurable component.

  From the viewpoint of further improving the adhesion of the cured film, the total content of the photocurable component contained in the photocurable composition (B) on a weight basis in the photocurable composition. The ratio with respect to the content of the photocurable compound having at least one ethylenically unsaturated bond is preferably 0.1 or more, more preferably 0.2 or more, and further preferably 0.3 or more. In addition, from the viewpoint of further improving the adhesion of the cured film, in the photocurable composition, the total content of the photocurable component contained in the photocurable composition on a weight basis (B ) The ratio to the content of the photocurable compound having at least one ethylenically unsaturated bond is preferably 1.5 or less, more preferably 1.25 or less, still more preferably 0.95 or less, particularly preferably 0.8. 7 or less.

  The total content of the photocurable component contained in the photocurable composition is (A) epoxy (meth) as a photocurable component in which the photocurable composition has a weight average molecular weight of 2000 or more. In the case of containing only acrylate, the content of (A) epoxy (meth) acrylate is shown, and the photocurable composition has (A) epoxy (meta) as a photocurable component having a weight average molecular weight of 2000 or more. ) Acrylate and (A) a photocurable component having a weight average molecular weight of 2000 or more other than epoxy (meth) acrylate, and other than (A) epoxy (meth) acrylate and (A) epoxy (meth) acrylate The total content of the photocurable component having a weight average molecular weight of 2000 or more is shown.

  Hereinafter, each component contained in the photocurable composition will be described.

((A) Epoxy (meth) acrylate)
The (A) epoxy (meth) acrylate contained in the photocurable composition does not have a carboxyl group. The weight average molecular weight of (A) epoxy (meth) acrylate contained in the said photocurable composition is 2000 or more. (A) By using epoxy (meth) acrylate, the adhesion of the cured product film to the application target member is effectively increased. In particular, when the content of (C) the white pigment is large, if (A) epoxy (meth) acrylate is not used, the adhesion of the cured film tends to be lowered. (A) By using epoxy (meth) acrylate, even if there is much content of (C) white pigment, the adhesiveness of hardened | cured material film | membrane can be improved. (A) As for epoxy (meth) acrylate, only 1 type may be used and 2 or more types may be used together.

  From the viewpoint of increasing the hardness of the cured film, the (A) epoxy (meth) acrylate preferably contains a bifunctional epoxy (meth) acrylate and a trifunctional or higher functional epoxy (meth) acrylate. The bifunctional epoxy (meth) acrylate preferably has two (meth) acryloyl groups. The tri- or higher functional epoxy (meth) acrylate preferably has three or more (meth) acryloyl groups.

  (A) Epoxy (meth) acrylate is obtained by reacting (meth) acrylic acid with an epoxy compound. (A) Epoxy (meth) acrylate can be obtained by converting an epoxy group into a (meth) acryloyl group. Since the said photocurable composition is hardened | cured by irradiation of light, it is preferable that (A) epoxy (meth) acrylate does not have an epoxy group.

  (A) As epoxy (meth) acrylate, bisphenol type epoxy (meth) acrylate (for example, bisphenol A type epoxy (meth) acrylate, bisphenol F type epoxy (meth) acrylate, bisphenol S type epoxy (meth) acrylate), cresol Novolak type epoxy (meth) acrylate, amine modified bisphenol type epoxy (meth) acrylate, caprolactone modified bisphenol type epoxy (meth) acrylate, carboxylic anhydride modified epoxy (meth) acrylate, phenol novolac type epoxy (meth) acrylate, etc. Can be mentioned.

  Commercially available products of bifunctional epoxy (meth) acrylate include KAYARAD R-381 (Nippon Kayaku Co., Ltd., bisphenol A type epoxy acrylate), PE2100P (MIWON Corp., bisphenol A type epoxy acrylate), Lipoxy PC-3F ( And EBECRYL 3708 (manufactured by Daicel Ornex Co., Ltd., modified bisphenol A type epoxy acrylate). Moreover, EBECRYL3603 (the Daicel Ornex company make, novolak epoxy acrylate) etc. are mentioned as a commercial item of the epoxy (meth) acrylate more than trifunctional. Further, a trifunctional or higher functional epoxy (meth) acrylate may be obtained by modifying a hydroxyl group of a bifunctional epoxy (meth) acrylate and introducing a (meth) acryloyl group.

  “(Meth) acryloyl group” refers to an acryloyl group and a methacryloyl group. “(Meth) acryl” refers to acrylic and methacrylic. “(Meth) acrylate” refers to acrylate and methacrylate.

  (A) The weight average molecular weight of epoxy (meth) acrylate is 2000 or more. When the weight average molecular weight of (A) epoxy (meth) acrylate is less than 2000, the adhesiveness of the cured product film tends to deteriorate. The weight average molecular weight of (A) epoxy (meth) acrylate is preferably 20000 or less. However, you may use the epoxy (meth) acrylate whose weight average molecular weight is less than 2000 with the (A) epoxy (meth) acrylate whose weight average molecular weight is 2000 or more. (A) The weight average molecular weight of epoxy (meth) acrylate becomes like this. Preferably it is 3000 or more, More preferably, it is 5000 or more.

  The weight average molecular weight is a weight average molecular weight in terms of polystyrene measured by gel permeation chromatography (GPC), and can be measured by the following measuring apparatus and measurement conditions.

Measuring device: “Waters GPC System (Waters 2690 + Waters 2414 (RI))” manufactured by Nihon Waters
Measurement condition columns: Shodex GPC LF-G × 1, Shodex GPC LF-804 × 2 Mobile phase: THF 1.0 mL / min Sample concentration: 5 mg / mL
Detector: Differential refractive index detector (RID)
Standard substance: polystyrene (Made by TOSOH, molecular weight: 620 to 590000)

  (A) The epoxy (meth) acrylate may be an epoxy (meth) acrylate obtained by modifying a hydroxyl group of an epoxy (meth) acrylate having a hydroxyl group. In this case, the degree of crosslinking can be increased and the hardness can be increased. Examples of the compound that can be used for modification include a silane coupling agent and a monomer having an isocyanate group. Examples of the silane coupling agent include compounds having a functional group such as vinyl group, (meth) acryloyl group, styryl group, mercapto group, epoxy group, amino group, sulfide group, ureido group, and isocyanate group. A compound having a vinyl group, a (meth) acryloyl group, a styryl group, or a mercapto group is preferred because of photoreactivity. Examples of the monomer having an isocyanate group include a compound having a vinyl group, a (meth) acryloyl group, a styryl group, or a mercapto group.

  (A) Epoxy (meth) acrylate does not have a carboxyl group. By using an epoxy (meth) acrylate having no carboxyl group, adverse effects due to carboxyl groups in the cured product film can be prevented, and for example, discoloration of the cured product film can be suppressed.

  In 100% by weight of the photocurable composition, the content of (A) epoxy (meth) acrylate is 5% by weight or more and 30% by weight or less. In 100% by weight of the photocurable composition, the content of (A) epoxy (meth) acrylate is preferably 10% by weight or more. (A) The adhesiveness of hardened | cured material becomes high effectively that content of an epoxy (meth) acrylate is more than the said minimum. (A) When the content of the epoxy (meth) acrylate is not more than the above upper limit, the pencil hardness of the cured product film is effectively increased, and a uniform coating film is easily obtained during printing. Further, from the viewpoint of effectively increasing the adhesion of the cured film, a bifunctional epoxy (meth) acrylate having a weight average molecular weight of 2000 or more and a weight average molecular weight of 2000 in 100% by weight of the photocurable composition. The total content of the above-described trifunctional or higher functional epoxy (meth) acrylate is preferably 5% by weight or more, more preferably 10% by weight or more, and preferably 30% by weight or less.

((B) Photocurable compound having at least one ethylenically unsaturated bond)
(A) By using a photocurable compound having (B) at least one ethylenically unsaturated bond together with epoxy (meth) acrylate, even if the content of (C) white pigment is large, the adhesion of the cured product film It is easy to control the viscosity ratio (η1 / η2) of the photocurable composition to an optimum range. (B) The photocurable compound having at least one ethylenically unsaturated bond does not include an epoxy (meth) acrylate having a weight average molecular weight of 2000 or more. (B) Only 1 type may be used for the photocurable compound which has at least 1 ethylenically unsaturated bond, and 2 or more types may be used together.

  (B) The photocurable compound having at least one ethylenically unsaturated bond does not have a weight average molecular weight of 2000 or more. For this reason, (B) the photocurable compound having at least one ethylenically unsaturated bond preferably has a molecular weight of less than 2000. (B) Preferably the molecular weight of a photocurable compound is 1000 or less, More preferably, it is 800 or less, More preferably, it is 600 or less. In the present invention, the molecular weight means a value calculated when it can be calculated from the molecular structure, and a weight average molecular weight when it cannot be calculated from the molecular structure.

  From the viewpoint of further improving the adhesion of the cured film, the photocurable compound (B) having at least one ethylenically unsaturated bond is a photocurable compound having at least one (meth) acryloyl group. Is preferred. (B) The photocurable compound having at least one ethylenically unsaturated bond preferably has at least one (meth) acryloyl group as a group containing an ethylenically unsaturated bond.

  (B) The photocurable compound having at least one ethylenically unsaturated bond is not particularly limited, and is a (meth) acrylic acid adduct of a polyhydric alcohol or a (meth) acrylic polyalkylene oxide modified product. Examples include acid addition products, urethane (meth) acrylates, and polyester (meth) acrylates. Examples of the polyhydric alcohol include diethylene glycol, triethylene glycol, polyethylene glycol, dipropylene glycol, tripropylene glycol, polypropylene glycol, trimethylol propane, cyclohexane dimethanol, tricyclodecane dimethanol, an alkylene oxide adduct of bisphenol A, and Examples include pentaerythritol. (B) In the photocurable compound, some hydroxyl groups may remain.

  From the viewpoint of further improving the adhesion of the cured film, the photocurable composition may contain urethane (meth) acrylate or polyester (meth) acrylate.

  From the viewpoint of further improving the adhesion of the cured film, (B) a photocurable compound having at least one ethylenically unsaturated bond is (B1) a photocurable compound having one ethylenically unsaturated bond. It is preferable to include.

  (B) The photocurable compound having at least one ethylenically unsaturated bond may include (B2) a photocurable compound having two or more ethylenically unsaturated bonds, and (B3) ethylenically unsaturated. A photocurable compound having three or more bonds may be included. From the viewpoint of further improving the adhesion of the cured film, (B) a photocurable compound having at least one ethylenically unsaturated bond is (B1) a photocurable compound having one ethylenically unsaturated bond and And (B2) a photocurable compound having two or more ethylenically unsaturated bonds.

  From the viewpoint of further improving the adhesion of the cured film, (B) the photocurable compound having at least one ethylenically unsaturated bond contains an alicyclic compound, or contains an aromatic ring or a hydroxyl group. Is preferred. A monofunctional component is preferable, but a polyfunctional plural component such as a bifunctional component may be contained.

  (B) It is preferable that the photocurable compound having at least one ethylenically unsaturated bond does not have a carboxyl group. By using the photocurable compound which does not have a carboxyl group, the bad influence by the carboxyl group in a cured | curing material film | membrane can be prevented, for example, discoloration of a cured | curing material film | membrane can be suppressed.

  (B) The viscosity at 25 ° C. of the photocurable compound having at least one ethylenically unsaturated bond is preferably 1 mPa · s or more, more preferably 3 mPa · s or more. From the viewpoint of further improving the adhesion of the cured film, the viscosity at 25 ° C. of the photocurable compound having at least one ethylenically unsaturated bond is preferably 200 mPa · s or less, more preferably 100 mPa. -S or less.

  The said viscosity can be measured on 25 degreeC and 10 rpm conditions using an E-type viscosity meter.

  In 100% by weight of the photocurable composition, the content of (B) the photocurable compound having at least one ethylenically unsaturated bond is preferably 5% by weight or more, more preferably 10% by weight or more, preferably 50%. % By weight or less, more preferably 40% by weight or less. (B) When the content of the photocurable compound having at least one ethylenically unsaturated bond is not less than the above lower limit and not more than the above upper limit, the physical properties of the cured film are effectively increased.

  In 100% by weight of the photocurable composition, the content of the (B1) photocurable compound having one ethylenically unsaturated bond is preferably 10% by weight or more, more preferably 20% by weight or more, preferably 50% by weight. % Or less, more preferably 40% by weight or less. (B1) When the content of the photocurable compound having at least one ethylenically unsaturated bond is not less than the above lower limit and not more than the above upper limit, the adhesiveness of the cured film is effectively increased.

  In 100% by weight of the photocurable composition, the content of the (B3) photocurable compound having 3 or more ethylenically unsaturated bonds is preferably 5% by weight or more, and preferably 20% by weight or less. (B3) When the content of the photocurable compound having three or more ethylenically unsaturated bonds is not less than the above lower limit and not more than the above upper limit, the adhesion of the cured product film is effectively increased.

((C) White pigment)
When the said photocurable composition contains the (C) white pigment, the cured | curing material film | membrane with a high light reflectance can be formed. By using the (C) white pigment, a cured film having a high light reflectance can be obtained as compared with the case where only the filler other than the (C) white pigment is used. (C) As for a white pigment, only 1 type may be used and 2 or more types may be used together.

  Examples of (C) white pigments include alumina, titanium oxide, zinc oxide, zirconium oxide, antimony oxide, and magnesium oxide.

  From the viewpoint of further increasing the light reflectance of the cured film, the (C) white pigment is preferably titanium oxide, zinc oxide, barium sulfate, calcium carbonate, talc or zirconium oxide. When this preferred white pigment is used, one or more white pigments can be used among titanium oxide, zinc oxide, barium sulfate, calcium carbonate, talc and zirconium oxide. (C) The white pigment is preferably titanium oxide or zinc oxide, preferably titanium oxide, and preferably zinc oxide. (C) The white pigment may be zirconium oxide.

  The titanium oxide is preferably rutile titanium oxide. By using rutile type titanium oxide, the heat resistance of the cured product film is further increased, and discoloration of the cured product film is further suppressed.

  The titanium oxide is preferably rutile titanium oxide that has been surface-treated with aluminum oxide, zirconium oxide, silicon oxide, or the like. By using the surface-treated rutile-type titanium oxide, the heat resistance of the cured product film is further increased.

  Examples of the surface-treated rutile type titanium oxide include, for example, “CR-90-2” manufactured by Ishihara Sangyo Co., Ltd., which is a rutile chlorine method titanium oxide, “CR-58” manufactured by Ishihara Sangyo Co., Ltd., which is a rutile chlorine method titanium oxide, “R-900” manufactured by DuPont, which is a rutile chlorine method titanium oxide, and “R-630” manufactured by Ishihara Sangyo Co., Ltd., which is a rutile sulfuric acid method titanium oxide. White pigments other than rutile type titanium oxide may be similarly surface-treated.

  From the viewpoint of further improving the adhesion and strength of the cured film, the (C) white pigment may contain titanium oxide and a white pigment different from titanium oxide.

  The surface treatment method is not particularly limited. As a surface treatment method, a dry method, a wet method, an integral blend method, and other known and commonly used surface treatment methods can be used.

  (C) The average particle diameter of the white pigment is preferably 0.1 μm or more, and preferably 40 μm or less. When the average particle size is not less than the above lower limit and not more than the above upper limit, the light reflectance of the cured product film can be further increased.

  In 100% by weight of the photocurable composition, the content of the (C) white pigment is preferably 20% by weight or more, more preferably 30% by weight or more, still more preferably 40% by weight or more, preferably 70% by weight or less. More preferably, it is 60% by weight or less. (C) When the content of the white pigment is not less than the above lower limit and not more than the above upper limit, the light reflectance of the cured product film is further increased, and the adhesion of the cured product film is further enhanced. In 100% by weight of the photocurable composition, the content of (C) the white pigment may be 50% by weight or more.

  In the present invention, since a specific composition is adopted, even if the content of (C) the white pigment is large, the adhesion of the cured product film can be improved. For example, even when the content of (C) the white pigment is 50% by weight or more in 100% by weight of the photocurable composition, the adhesion of the cured film is sufficiently high.

  From the viewpoint of further improving the adhesiveness of the cured product film and further improving the light reflectance of the cured product film, the content of the (C) white pigment on the weight basis in the photocurable composition is as follows. (A) Ratio with respect to content of an epoxy (meth) acrylate becomes like this. Preferably it is 0.5 or more, More preferably, it is 1.0 or more, More preferably, it is 1.5 or more. From the viewpoint of further improving the adhesion of the cured film, the ratio of the content of the (C) white pigment to the content of the (A) epoxy (meth) acrylate is based on the weight in the photocurable composition. , Preferably 10 or less, more preferably 5.0 or less, still more preferably 4.0 or less.

  In the case where the white pigment (C) contains titanium oxide, from the viewpoint of further improving the adhesion of the cured film and further improving the light reflectance of the cured film, On the basis, the ratio of the titanium oxide content to the (C) white pigment content is preferably 0.4 or more, more preferably 0.6 or more, and even more preferably 0.8 or more. From the viewpoint of further improving the adhesion of the cured film, the ratio of the content of titanium oxide to the content of (C) the white pigment is preferably 1.0 on the basis of weight in the photocurable composition. It is as follows.

((D) Photopolymerization initiator)
Since the photocurable composition contains (D) a photopolymerization initiator, the photocurable composition can be cured by light irradiation. (D) As for a photoinitiator, only 1 type may be used and 2 or more types may be used together.

  (D) Photopolymerization initiators include acylphosphine oxide, halomethylated triazine, halomethylated oxadiazole, imidazole, benzoin, benzoin alkyl ether, anthraquinone, benzanthrone, benzophenone, alkylphenone, thioxanthone, benzoate, acridine , Phenazine, titanocene, α-aminoalkylphenone, oxime, and derivatives thereof.

  Examples of the benzophenone photopolymerization initiator include methyl o-benzoylbenzoate and Michler's ketone. EAB (made by Hodogaya Chemical Co., Ltd.) etc. are mentioned as a commercial item of a benzophenone series photoinitiator.

  Examples of commercially available alkylphenone photopolymerization initiators include Darocur 1173, Darocur 2959, Irgacure 184, Irgacure 907, Irgacure 369, Irgacure 651 (manufactured by BASF), and Esacure 1001M (manufactured by Lamberti).

  Examples of commercially available acylphosphine oxide photopolymerization initiators include Lucirin TPO (BASF) and Irgacure 819 (BASF).

  Examples of commercially available thioxanthone photopolymerization initiators include isopropyl thioxanthone and diethyl thioxanthone.

  Examples of commercially available oxime ester photopolymerization initiators include Irgacure OXE-01 and Irgacure OXE-02 (manufactured by BASF).

  From the viewpoint of further improving the adhesion of the cured film, the (D) photopolymerization initiator preferably contains both an acylphosphine photopolymerization initiator and an alkylphenone photopolymerization initiator.

  From the viewpoint of further suppressing foaming, peeling and discoloration, the (D) photopolymerization initiator preferably contains both an alkylphenone photopolymerization initiator and an acylphosphine oxide photopolymerization initiator. It is also preferable to contain both an acyl phosphine oxide photopolymerization initiator and a bisacyl phosphine oxide photopolymerization initiator.

  The content of the (D) photopolymerization initiator is preferably 1 with respect to 100 parts by weight in total of (A) the epoxy (meth) acrylate and (B) the photocurable compound having at least one ethylenically unsaturated bond. Part by weight or more, more preferably 3 parts by weight or more, preferably 20 parts by weight or less, more preferably 15 parts by weight or less. (D) When content of a photoinitiator is more than the said minimum and below the said upper limit, a photocurable composition can be photocured favorably.

  (D) It is preferable to use 2 or more types of photoinitiators together from a viewpoint of improving sclerosis | hardenability of both the inside and outer surface of hardened | cured material. The photocurable composition preferably contains two or more photopolymerization initiators. Specifically, Irgacure 819 (bis (2,4,6-trimethylbenzoyl) -phenylphosphine oxide, manufactured by BASF) and TPO (2,4,6-trimethylbenzoyl-diphenyl-phosphine oxide, BASF) ), Esacure 1001M (1- [4- (4-benzoylphenylsulfanyl) phenyl] -2-methyl-2- (4-methylphenylsulfonyl) propan-1-one, manufactured by Lamberti), Darocur 1173, Darocur 2959 A combination with Irgacure 907, Irgacure 369, Irgacure 651 or Irgacure 184 is more preferable. In that case, the content of Irgacure 819 is preferably 1% by weight or more, more preferably 15% by weight or more, and preferably 99% by weight or less, more preferably 85% in the total amount of (D) photopolymerization initiator of 100% by weight. % By weight or less. Further, Irgacure 819 may be used as an essential component, and three or more kinds of photopolymerization initiators may be used in combination. Also in this case, the lower limit and the upper limit of the preferable content of Irgacure 819 are the same as the above values.

((E) Thiol group-containing compound having at least one thiol group)
(E) By using a thiol group-containing compound having at least one thiol group in combination with another compound, a cured product film excellent in moisture resistance can be obtained, and a cured product film having high heat resistance can be obtained. Can do. Furthermore, (E) By using together the thiol group containing compound with the rutile type titanium oxide manufactured by the chlorine method, the adhesiveness of a cured | curing material film | membrane and the storage stability of a photocurable composition can be made compatible. (E) As for a thiol group containing compound, only 1 type may be used and 2 or more types may be used together.

  (E) Specific examples of the thiol group-containing compound include trimethylolpropane tris (3-mercaptopropionate) (TMMP), pentaerythritol tetrakis (3-mercaptopropionate) (PEMP) manufactured by SC Organic Chemical Co., Ltd. Tris-[(3-mercaptopropionyloxy) -ethyl] -isocyanurate (TEMPIC), tetraethylene glycol bis (3-mercaptopropionate) (EGMP-4), dipentaerythritol hexakis (3-mercaptopropionate) ) (DPMP) and other primary polyfunctional thiols, pentaerythritol tetrakis (3-mercaptobutyrate) (Karenz MT PE1), 1,3,5-tris (3-mercaptobutyryloxyethyl)- 1,3,5-triazine-2, , 6 (1H, 3H, 5H) -trione (Karenz MT NR1), secondary polyfunctional thiol such as 1,4-bis (3-mercaptobutyryloxy) butane (Karenz MT BD1), manufactured by SC Organic Chemical Co., Ltd. (Β-mercaptopropionic acid (BMPA), methyl-3-mercaptopropionate (MPM), 2-ethylhexyl-3-mercaptopropionate (EHMP), n-octyl-3-mercaptopropionate (NOMP), And monofunctional thiols such as methoxybutyl-3-mercaptopropionate (MBMP) and stearyl-3-mercaptopropionate (STMP).

  From the viewpoint of further improving the moisture resistance of the cured film and improving the adhesion of the cured film, (E) a thiol group-containing compound having at least one thiol group is (E1) a thiol having two or more thiol groups. It is preferable to include a compound.

  The content of the (E) thiol group-containing compound and the (E1) thiol compound is preferably 0.1% by weight or more, more preferably 0.5% by weight or more, preferably in 100% by weight of the photocurable composition. Is 10% by weight or less, more preferably 5% by weight or less. (A) The content of the (E) thiol group-containing compound and the (E1) thiol compound is preferably 1.0 parts by weight or more, more preferably 3.0 parts by weight with respect to 100 parts by weight of the epoxy (meth) acrylate. Part or more, preferably 35 parts by weight or less, more preferably 25 parts by weight or less, still more preferably 20 parts by weight or less. The content of (E) thiol group-containing compound and (E1) thiol compound is preferably 0.2 with respect to 100 parts by weight of the total of (A) epoxy (meth) acrylate and (B) photoreactive compound. It is at least 1 part by weight, more preferably at least 1 part by weight, preferably at most 20 parts by weight, more preferably at most 10 parts by weight, even more preferably at most 6 parts by weight. When the content of the (E) thiol group-containing compound and the (E1) thiol compound is not less than the above lower limit and not more than the above upper limit, the moisture resistance of the cured film is increased, and peeling of the cured film is further suppressed. The adhesion of the cured product film and the storage stability of the photocurable composition are compatible at a high level. Further, when the content of the (E) thiol group-containing compound and (E1) thiol compound is not more than the above upper limit, gelation hardly proceeds during storage. When the content of the (E) thiol group-containing compound and the (E1) thiol compound is equal to or more than the above lower limit, the curability is further enhanced. From the viewpoint of enhancing storage stability, it is preferable to use a secondary thiol compound. From the viewpoint of enhancing the storage stability, a polymerization inhibitor may be used.

((F) thermosetting compound)
The photocurable composition preferably does not contain (F) a thermosetting compound or contains (F) a thermosetting compound at 5% by weight or less. In the present invention, when the (F) thermosetting compound is used, it is preferable to reduce the amount of the (F) thermosetting compound used. (F) The composition having a thermosetting compound content of 5% by weight or less and the composition (F) having a thermosetting compound content of, for example, 10% by weight or more have a basic physical property of the cured product. Generally different. (F) As for a thermosetting compound, only 1 type may be used and 2 or more types may be used together.

  (F) An epoxy compound etc. are mentioned as a thermosetting compound.

  It is preferable that the said photocurable composition does not contain an epoxy compound or contains an epoxy compound at 5 weight% or less.

  From the viewpoint of further suppressing foaming, peeling, and discoloration, the content of the (F) thermosetting compound is preferably as small as possible in 100% by weight of the photocurable composition. In 100% by weight of the photocurable composition, the content of the (F) thermosetting compound is preferably 3% by weight or less, more preferably 1% by weight or less, still more preferably 0.5% by weight or less, particularly preferably 0. % By weight (unused). In 100% by weight of the photocurable composition, the content of the epoxy compound is preferably 3% by weight or less, more preferably 1% by weight or less, still more preferably 0.5% by weight or less, particularly preferably 0% by weight (unused) ).

((G) organic solvent)
The photocurable composition may contain (G) an organic solvent, or may not contain (G) an organic solvent.

  The photocurable composition preferably does not contain (G) an organic solvent, or contains (G) an organic solvent at 10% by weight or less.

  From the viewpoint of further improving the adhesion of the cured film, the content of the organic solvent (G) is preferably as small as possible in 100% by weight of the photocurable composition. In 100% by weight of the photocurable composition, the content of the organic solvent (G) is preferably 3% by weight or less, more preferably 1% by weight or less, still more preferably 0.5% by weight or less, particularly preferably 0% by weight. (Unused).

(Other ingredients)
The said photocurable composition may contain the organic solvent and does not need to contain it.
In addition to the components described above, the photocurable composition includes inorganic fillers other than white pigments, organic fillers, colorants, polymerization inhibitors, chain transfer agents, curing aids, antioxidants, ultraviolet absorbers, antifoaming agents. , Leveling agents, surfactants, slip agents, anti-blocking agents, waxes, masking agents, deodorants, fragrances, preservatives, antibacterial agents, antistatic agents, and adhesion-imparting agents. Examples of the adhesion imparting agent include silane coupling agents.

  From the viewpoint of further improving the adhesion and strength of the cured film, the photocurable compound may contain an inorganic filler that is different from titanium oxide and is not a white pigment.

[Electronic component and method of manufacturing electronic component]
The method for manufacturing an electronic component includes a step of applying the photocurable composition on the surface of the electronic component body to form a composition layer, and irradiating the composition layer with light to form a cured film. Forming. In the method for producing an electronic component, it is preferable not to develop the composition layer in order to form the cured film. The composition layer is preferably a resist layer, and the cured product film is preferably a resist film.

  Since the photocurable composition is suitably used for forming a cured product film without development, the photocurable composition is partially and plurally provided on the surface of the electronic component body. Can be applied.

  From the viewpoint of preventing thermal deterioration of the electronic component body, it is preferable not to thermally cure the composition layer by the action of a thermosetting agent in order to form the cured product film.

  Hereinafter, a specific method for manufacturing an electronic component of the present invention will be described with reference to the drawings. In the embodiment described below, the composition layer is a resist layer, and the cured product film is a resist film. In order to form a resist film, a non-developing resist photocurable composition is used.

  First, as shown in FIG. 1A, an application target member 11 is prepared. The application target member 11 is an electronic component main body. A substrate 11A is used as the application target member 11, and a plurality of electrodes 11B are arranged on the surface of the substrate 11A.

  Next, as shown in FIG. 1B, a non-developing resist photocurable composition is applied on the surface of the application target member 11 to form a resist layer 12 (composition layer). In FIG. 1 (b), the non-developing resist photocurable composition is applied partially and at a plurality of locations on the surface of the application target member 11 to form a plurality of resist layers 12. Specifically, a plurality of resist layers 12 are formed between a plurality of electrodes 11B on the surface of the substrate 11A. The resist layer 12 is a resist pattern, for example. For example, the resist layer 12 is formed only at a position corresponding to a resist layer portion that is formed to remain after development, assuming that a conventional development resist composition is used. The resist layer 12 is not formed at a position corresponding to a resist layer portion to be removed by development using a conventional developing resist composition.

  Examples of the coating method of the non-developing resist photocurable composition include a coating method using a dispenser, a coating method using screen printing, and a coating method using an inkjet apparatus. Screen printing is preferred because of its excellent manufacturing efficiency. It is preferable to pattern-print the non-developing resist photocurable composition.

  Next, the resist layer 12 is irradiated with light. For example, the resist layer 12 is irradiated with light from the side opposite to the application target member 11 side of the resist layer 12. As a result, as shown in FIG. 1C, the resist layer 12 is photocured, and a resist film 2 (cured product film) is formed. As a result, the electronic component 1 in which the resist film 2 is formed on the surface of the application target member 11 (electronic component main body) is obtained.

  In addition, the manufacturing method of an electronic component provided with the resist film demonstrated using FIG. 1 (a)-(c) is an example, and the manufacturing method of an electronic component can be changed suitably. It is preferable that development is not performed to form a resist film at the time of manufacturing an electronic component.

  When producing an electronic component using the non-developing resist photocurable composition of the present invention, two or more resist layers may be formed on the surface of the coating target member, and the two or more resist layers may be formed. The layer may be formed partially and at a plurality of locations. At that time, each time one layer of the non-developable resist photocurable composition is applied to the surface of the application target member, the resist layer may be formed by irradiating light, or the light is applied after two or more layers are applied. Irradiation may form a resist layer.

  Conventionally, a development resist composition has often been used. When using a negative development resist composition, as shown in FIG. 2A, for example, a coating target member 111 having a substrate 111A and an electrode 111B arranged on the surface of the substrate 111A is prepared. To do. Next, as shown in FIG. 2B, a resist layer 112 is formed on the entire surface of the application target member 111. Next, as illustrated in FIG. 2C, light is irradiated only to the resist layer 112 on the electrode 111 </ b> B through a mask 113. Thereafter, as shown in FIG. 2D, development is performed, and the resist layer 112 located between the electrodes 111B is partially removed. After the resist layer 112 is partially removed, the remaining resist layer 112 is thermally cured. As a result, as shown in FIG. 2E, the electronic component 101 in which the resist film 102 is formed on the surface of the application target member 111 (electronic component main body) is obtained.

  As described above, when the development resist composition is used, the resist film formation efficiency and the electronic component manufacturing efficiency are poor. Furthermore, it is necessary to perform development.

  On the other hand, by using the photocurable composition according to the present invention, the formation efficiency of a cured product film (resist film or the like) and the production efficiency of an electronic component can be increased. Further, there is no need to perform development.

  Moreover, in this invention, you may produce the reflecting plate provided with the said hardened | cured material film | membrane as a light reflection film as an electronic component. In the electronic component, the cured product film may be provided as a light reflecting film, or may be disposed at a position where light should be reflected. The electronic component may include a light irradiation unit. When light is reflected by the cured product film, the cured product film may be exposed or a transparent member may be laminated.

  Hereinafter, the present invention will be specifically described with reference to Examples and Comparative Examples. The present invention is not limited only to the following examples.

(Examples 1-17 and Comparative Examples 1-7)
(1) Preparation of non-developable resist photocurable composition The blending components shown in Tables 1 to 3 below are blended in the blending amounts shown in Tables 1 to 3 below. Prepared.

(2) Production of electronic component A substrate was prepared by laminating copper foil on FR-4 having a size of 100 mm x 100 mm x thickness 0.8 mm. On this substrate, a non-developing resist photocurable composition was printed with a mask pattern using a 255 mesh polyester-biased plate by a screen printing method to form a resist layer. After printing, using a UV irradiation device with a high-pressure mercury lamp, UV light with a wavelength of 365 nm is flowed once through the belt conveyor type exposure device so that the integrated light quantity is 2000 mJ / cm ² as a measurement sample. A resist film was obtained. The thickness of the obtained resist film was 20 μm.

(Evaluation)
(1) Application accuracy (viscosity (ratio (η1 / η2)))
About the obtained photocurable composition, the viscosity η1 at 25 ° C. and 1 rpm and the viscosity η2 at 25 ° C. and 10 rpm of the photocurable composition were measured using an E-type viscometer. The ratio (η1 / η2) was determined.

(2) Application accuracy (L / S (μm))
Screen printing and exposure were performed using a mask patterned with L / S having line widths of 500 μm, 300 μm, 200 μm, 150 μm, and 100 μm, and the L / S printing accuracy was confirmed. The determination was carried out according to the following.

  The line width value was described with the line width in a state where the resin was not flowing between the lines and the line was confirmed and the resin was not flowed between the width and the width and the space was confirmed as acceptable.

(3) Adhesion (cross cut test)
The obtained electronic component was confirmed by a cross-cut tape test (JIS 5600) and confirmed by the following criteria. Make a cut of 20 squares at 1 mm intervals on the cured product with a cutter, and then apply cellophane tape (JIS Z1522) to the cured product with the incised portion, and attach one end of the tape at an angle of 60 degrees. And peeled off strongly to confirm the peeled state. The peeled state was classified according to JIS. In the case of classifications 0, 1, and 2, the number of peeled bases is 0.

(4) Adhesion (PCT test 96h)
After leaving the measurement sample at 121 ° C. and 2 atm for 96 hours, the evaluation sample was checked for peeling.

[Criteria for PCT test 96h]
○: No peeling of resist film ×: With peeling of resist film

(5) Uniformity of coating film The obtained photocurable composition was apply | coated to 20 micrometers in thickness on the support member. About the photocurable composition after application | coating, the hardened | cured material was obtained by irradiating the ultraviolet-ray with a wavelength of 365 nm so that it may become the integrated light quantity 2000mJ / cm < ² >. The appearance of the resulting cured product was confirmed.

[Criteria for coating uniformity]
○: Not equivalent to the criterion of × ×: Multiple irregularities and streaks are confirmed on the surface

(6) Reflectance (Y (%))
About the obtained electronic component, the reflectance Y value of the evaluation sample was measured using the color and color difference meter ("CR-400" by Konica Minolta).

(7) Heat resistance (reflectance (ΔE))
The obtained photocurable composition was apply | coated to 20 micrometers in thickness on the support member. About the photocurable composition after application | coating, the ultraviolet-ray of wavelength 365nm was irradiated so that it might become the integrated light quantity 2000mJ / cm < ² >, the cured | curing material was obtained, and the obtained cured | curing material was left at 270 degreeC for 5 minutes. Using a chromaticity meter, the color difference ΔE in the L ^* a ^* b ^* color system before and after standing was determined.

(8) Pencil hardness The obtained photocurable composition was apply | coated to the thickness of 20 micrometers on the supporting member. About the photocurable composition after application | coating, the hardened | cured material was obtained by irradiating the ultraviolet-ray with a wavelength of 365 nm so that it may become the integrated light quantity 2000mJ / cm < ² >. About the obtained hardened | cured material, pencil hardness was calculated | required based on JISK5600-5-4.

  The composition and results are shown in Tables 1 to 3 below.

DESCRIPTION OF SYMBOLS 1 ... Electronic component 2 ... Resist film (cured material film)
11 ... Application target member (electronic component body)
11A ... substrate 11B ... electrode 12 ... resist layer (composition layer)

Claims (14)

On the surface of the application target member, partially and used by applying to a plurality of locations,
An epoxy (meth) acrylate having no carboxyl group and having a weight average molecular weight of 2000 or more;
A photocurable compound that is not an epoxy (meth) acrylate having a weight average molecular weight of 2000 or more, has no weight average molecular weight of 2000 or more, and has at least one ethylenically unsaturated bond;
White pigment,
A photopolymerization initiator,
The content of the epoxy (meth) acrylate is 5 wt% or more and 30 wt% or less,
The photocurable composition which does not contain a thermosetting compound or contains a thermosetting compound at 3 weight% or less.   The photocurable composition according to claim 1, wherein the content of the white pigment is 20% by weight or more and 70% by weight or less.   The photocurable compound is not an epoxy (meth) acrylate having a weight average molecular weight of 2000 or more, a photocurable compound having no weight average molecular weight of 2000 or more and having at least one (meth) acryloyl group. The photocurable composition according to claim 1 or 2.   The photocurable composition of any one of Claims 1-3 whose content of the said epoxy (meth) acrylate is 10 weight% or more and 30 weight% or less.   The photocurable composition of any one of Claims 1-4 containing the thiol group containing compound which has at least 1 thiol group.   The ratio of the total content of the photocurable component having a weight average molecular weight of 2000 or more contained in the photocurable composition to the content of the photocurable compound is 1.25 or less. The photocurable composition of any one of these. Used to be cured by light irradiation, and used to form a resist film without development,
The photocurable composition according to any one of claims 1 to 6, which is a non-developing resist photocurable composition.   The photocurable composition according to any one of claims 1 to 7, wherein the ratio of the viscosity η1 at 25 ° C and 1 rpm to the viscosity η2 at 25 ° C and 10 rpm is 1.1 or more and 2.2 or less. object.   The photocurable composition according to any one of claims 1 to 8, which is not used after being thermally cured by the action of a thermosetting agent.   The photocurable composition of any one of Claims 1-9 which does not contain a thermosetting compound or contains a thermosetting compound at 0.5 weight% or less.   The photocurable composition of any one of Claims 1-10 which is not used in order to form a multilayer resist film with another photocurable composition. Applying the photocurable composition according to any one of claims 1 to 11 on the surface of the electronic component body partially and at a plurality of locations to form a composition layer;
Irradiating the composition layer with light to form a cured product film,
A method for producing an electronic component, wherein the composition layer is not developed to form the cured product film.   The method for manufacturing an electronic component according to claim 12, wherein the composition layer is not thermally cured by the action of a thermosetting agent in order to form the cured product film. The composition layer is a resist layer;
The method for manufacturing an electronic component according to claim 12 or 13, wherein the cured product film is a resist film.

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