TW201606428A - Photocurable composition and method for manufacturing electronic component - Google Patents

Abstract

Provided is a photocurable composition whereby adhesion of a cured film thereof to a member to which the composition is applied can be increased, the light reflectance of the cured film can be increased, due to the cured film being white, and the heat resistance of the cured film can be increased. The photocurable composition pertaining to this invention is applied partially and in a plurality of locations on the surface of a member to which the composition is applied, and includes: an epoxy (meth)acrylate not having a carboxyl group and having a weight-average molecular weight of 2000 or greater; a photocurable compound which is not an epoxy (meth)acrylate having a weight-average molecular weight of 2000 or greater, does not have a weight-average molecular weight of 2000 or greater, and has at least one ethylenically unsaturated bond; a white pigment; and a photopolymerization initiator; the content of the epoxy (meth)acrylate being 5 wt% to 30 wt%.

Description

Photocurable composition and method of manufacturing electronic part

The present invention relates to a photocurable composition which is applied to a surface of a member to be coated in a partial and plural portions. Further, the present invention relates to a method of producing an electronic component using the above photocurable composition.

As a protective film for protecting a printed wiring board from high-temperature solder, a solder resist film is widely used.

Further, in various electronic components, a light-emitting diode (hereinafter abbreviated as LED) wafer is mounted on the upper surface of the printed wiring board. There is a case where a white solder resist film is formed on the upper surface of the printed wiring board by using light from the LED to reach the upper surface side of the printed wiring board. The white solder mask contains white pigment. In the case of forming such a white solder resist film, it is possible to directly irradiate light from the surface of the LED chip to the side opposite to the printed wiring board, and also to reach the upper surface side of the printed wiring board and be white solder resisted. Reflected light reflected by the film. Therefore, the utilization efficiency of light generated from the LED can be improved.

Further, in addition to the use of the solder resist film, there is also a case where a cured film containing a white pigment is used for light reflection use.

As an example of a material for forming the white solder resist film, Patent Document 1 below discloses a photoresist material containing a dealcoholization reaction of an epoxy resin and a hydrolyzable alkoxysilane. The alkoxy-containing decane-modified epoxy resin further contains an unsaturated group-containing polycarboxylic acid resin, a diluent, a photopolymerization initiator, and a hardening adhesion imparting agent.

Patent Document 2 listed below discloses a white solder resist material containing a carboxyl group-containing resin having no aromatic ring, a photopolymerization initiator, an epoxy compound, rutile-type titanium oxide, and a diluent.

Patent Document 3 listed below discloses a composition for forming a solder resist film for LEDs including two layers of a white ink layer and a primer layer. The composition for forming the above white ink layer comprises (A1) a photopolymerizable polymer as a mixture of an urethane acrylate resin or an urethane urethane resin and an epoxy acrylate resin, (A2) 100 parts by mass of the photopolymerizable polymer (A1) is 100 to 170 parts by mass of the white pigment, and (A3) is 10 to 50 parts by mass based on 100 parts by mass of the photopolymerizable polymer (A1). Photopolymerization initiator. The composition for forming the undercoat layer contains (B1) a photopolymerizable polymer as an epoxy acrylate resin, and (B2) is 200 to 300 parts by mass based on 100 parts by mass of the photopolymerizable polymer (B1). The filler of the mass fraction and (B3) are 10 to 50 parts by mass of a photopolymerization initiator based on 100 parts by mass of the photopolymerizable polymer (B1).

[Previous Technical Literature] [Patent Literature]

[Patent Document 1] Japanese Patent Laid-Open Publication No. 2007-249148

[Patent Document 2] Japanese Patent Laid-Open Publication No. 2007-322546

[Patent Document 3] Japanese Patent Laid-Open Publication No. 2013-194057

In the materials described in Patent Documents 1 and 2, in order to form a photoresist film, a plurality of steps such as an exposure step and a development step in the photolithography method are required. Therefore, the number of steps is large, and the manufacturing efficiency of electronic parts and the like is inferior.

Further, in the materials described in Patent Documents 1 and 2, since the development of a chemical liquid such as an acid or an alkali is performed, the environmental load is large. Further, in order to form by development Excess photoresist material has to be used to remove portions of the photoresist layer. Further, the portion of the photoresist layer removed by development becomes waste. Therefore, since the amount of waste is large, the environmental load is large.

In Patent Document 3, a solder resist film for LEDs including two layers of a white ink layer and an undercoat layer is formed. The photoresist film is formed without development, but requires the following work: separately preparing a composition for forming a white ink layer, and a composition for forming an undercoat layer, and further coating the two compositions . Therefore, the manufacturing efficiency of electronic parts and the like is inferior, and the manufacturing cost of electronic parts is also high.

Therefore, the inventors have studied a material having a small environmental load and a high production efficiency, and found that when a material is applied to a member to be coated to form a cured film, the cured film is applied to the member to be coated. The adhesion is low, or the heat resistance of the cured film is low.

An object of the present invention is to provide a photocurable composition which can improve the adhesion of a cured film to a member to be coated, and can improve the light reflectance of the cured film by being white, and can improve the cured film. Heat resistance. Further, another object of the present invention is to provide a method for producing an electronic component using the above photocurable composition.

According to a broad aspect of the present invention, there is provided a photocurable composition which is applied to a surface of a member to be coated in a partial and plural part, and comprises: an epoxy (meth) acrylate , which has no carboxyl group and has a weight average molecular weight of 2,000 or more; a photocurable compound which is not an epoxy (meth) acrylate having a weight average molecular weight of 2,000 or more, and which has a weight average molecular weight of not more than 2,000 and has At least one ethylenically unsaturated bond; a white pigment; and a photopolymerization initiator; and the content of the epoxy (meth) acrylate is 5% by weight or more and 30% by weight or less.

In a specific aspect of the photocurable composition of the present invention, the content of the white pigment is 20% by weight or more and 70% by weight or less.

In a specific aspect of the photocurable composition of the present invention, the photocurable compound is not an epoxy (meth) acrylate having a weight average molecular weight of 2,000 or more, and has a weight average molecular weight of not more than 2,000. And having at least one (meth) acrylonitrile group.

In a specific aspect of the photocurable composition of the present invention, the content of the epoxy (meth) acrylate is 10% by weight or more and 30% by weight or less.

In a specific aspect of the photocurable composition of the present invention, the photocurable composition comprises a thiol group-containing compound having at least one thiol group.

In a specific aspect of the photocurable composition of the present invention, the photocurable composition contains a photocurable component having a weight average molecular weight of 2,000 or more as a whole, and the content of the photocurable compound is relative to the photocurable compound. The ratio is 1.25 or less.

In a specific aspect of the photocurable composition of the present invention, the photocurable composition is used by being cured by light irradiation, and is used to form a photoresist film without development, which is non-developing. Type photoresist photocurable composition.

The ratio of the viscosity η1 at 25 ° C and 1 rpm of the photocurable composition of the present invention to the viscosity η 2 at 25 ° C and 10 rpm is 1.1 or more and 2.2 or less.

The photocurable composition of the present invention is preferably used without being thermally hardened by the action of a thermosetting agent.

In a specific aspect of the photocurable composition of the present invention, the photocurable composition does not contain a thermosetting compound or a thermosetting compound containing 5% by weight or less.

In a specific aspect of the photocurable composition of the present invention, the photocurable composition is not used to form a multilayer photoresist film together with other photocurable compositions.

According to a broad aspect of the present invention, there is provided a method of manufacturing an electronic component comprising the steps of: applying a photocurable composition to a surface of an electronic component body at a local and plural locations to form a composition layer a step of irradiating light to the above composition layer The step of forming a cured film; and, in order to form the cured film, the composition layer is not developed.

In a specific aspect of the method for producing an electronic component of the present invention, in order to form the cured film, the composition layer is not thermally cured by the action of a thermosetting agent.

In a specific aspect of the method of manufacturing an electronic component of the present invention, the composition layer is a photoresist layer, and the cured film is a photoresist film.

The photocurable composition of the present invention comprises: an epoxy (meth) acrylate having no carboxyl group and having a weight average molecular weight of 2,000 or more; and a photocurable compound which is not an epoxy having a weight average molecular weight of 2,000 or more ( a methyl acrylate, which is a weight average molecular weight of not more than 2000 and having at least one ethylenically unsaturated bond; a white pigment; and a photopolymerization initiator; and the content of the above epoxy (meth) acrylate When it is 5% by weight or more and 30% by weight or less, when the photocurable composition of the present invention is applied to the surface of the member to be coated in a plurality of portions and cured, the cured film can be improved. The adhesion of the member to be coated can increase the light reflectance of the cured film by white color, and can improve the heat resistance of the cured film.

1‧‧‧Electronic parts

2‧‧‧ photoresist film (hardened film)

11‧‧‧Application target member (electronic parts body)

11A‧‧‧Substrate

11B‧‧‧electrode

12‧‧‧ photoresist layer (composition layer)

101‧‧‧Electronic parts

102‧‧‧ photoresist film

111‧‧‧Application target member (electronic parts body)

111A‧‧‧Substrate

111B‧‧‧electrode

112‧‧‧ photoresist layer (composition layer)

113‧‧‧Photomask

1(a) to 1(c) are cross-sectional views for explaining an example of a method of manufacturing an electronic component using the photocurable composition of one embodiment of the present invention.

2(a) to 2(e) are cross-sectional views for explaining an example of a method of manufacturing an electronic component using the conventional developing resist composition.

Hereinafter, the details of the present invention will be described.

[Photocurable composition]

The photocurable compound of the present invention is applied to a surface of a member to be coated in a partial and plural part. The photocurable composition of the present invention is preferably irradiated with light It is used for hardening and is used to form a photoresist film without development. The photocurable composition of the present invention is preferably a non-developing photoresist photocurable composition. The photocurable composition of the present invention is different from the development type photoresist composition which is developed for forming a photoresist film in the case where the photoresist film is not formed for development. In the photocurable composition of the present invention, a composition of a good photoresist film can be obtained without performing development.

The photocurable composition of the present invention comprises: (A) an epoxy (meth) acrylate having no carboxyl group and having a weight average molecular weight of 2,000 or more; and (B) a photocurable compound which does not have a weight of 2000 or more. An epoxy (meth) acrylate having an average molecular weight, which is a weight average molecular weight of not more than 2,000 and having at least one ethylenically unsaturated bond; (C) a white pigment; and (D) a photopolymerization initiator.

In the present invention, since the above configuration is employed, the adhesion of the cured film (such as a photoresist film) to the member to be coated can be improved. In the present invention, even if the development is not performed, the adhesion of the cured film to the member to be coated is also high. For example, the adhesion between the main body of the electronic component such as a substrate and the cured film (such as a photoresist film) can be improved, and peeling of the cured film (such as a photoresist film) can be suppressed. Further, since the photocurable composition of the present invention contains (C) a white pigment, a white cured film (such as a photoresist film) can be formed. When the cured film (such as a photoresist film) is white, the light reflectance of the cured film (such as a photoresist film) can be improved. Further, in the present invention, since the above configuration is employed, the heat resistance of the cured film (such as a photoresist film) can be improved. For example, discoloration of a cured film (such as a photoresist film) can be suppressed.

Further, in 100% by weight of the photocurable composition of the present invention, the content of the (A) epoxy (meth) acrylate is 5% by weight or more and 30% by weight or less. Therefore, the adhesion of the cured film to the member to be coated can be effectively improved. Further, when the content of the (A) epoxy (meth) acrylate is in the above range, the appearance is improved when the photocurable composition of the present invention is printed. In the present invention, in order to highly obtain the effects of the present invention, it is important that the content of the (A) epoxy (meth) acrylate is within the above range.

Further, in the present invention, even if the exposure step and development in the photolithography method are not performed A plurality of steps, such as a step, can also form a good cured film (photoresist film, etc.). When the exposure step and the development step are not performed, the amount of waste can be reduced, and the environmental load can be reduced. Further, the manufacturing cost of electronic parts and the like can be reduced.

In the photocurable composition, the ratio (η1/η2) of the viscosity η1 at 25 ° C and 1 rpm to the viscosity η 2 at 25 ° C and 10 rpm is preferably 0.5 or more, more preferably 1.1 or more, and further preferably 1.4 or more, and preferably 2.2 or less, more preferably 2.0 or less. The photocurable composition can be preferably used for forming a photoresist film without performing development. Therefore, the photocurable composition is applied to a surface of a coating member such as an electronic component main body in a part or a plurality of portions. Used in the case of use. For example, there is a case where the photocurable composition is applied in a pattern. When the ratio (η1/η2) is not less than the above lower limit and not more than the above upper limit, the photoresist film can be formed in a specific region with higher precision. For example, even if it is applied in a pattern shape within a range of 150 μm or less in width, a cured film (such as a photoresist film) can be formed with high precision. The above photocurable composition can be preferably used to form a cured film by pattern printing.

The above viscosity can be measured using an E-type viscometer.

Using the photocurable composition, light having a wavelength of 365 nm was irradiated so as to have an integrated light amount of 2000 mJ/cm ² to obtain a cured product, and the obtained cured product was allowed to stand at 270 ° C for 5 minutes. The color difference ΔE in the L ^* a ^* b ^* color system before and after the placement is preferably 5.0 or less, more preferably 4.0 or less, still more preferably 3.5 or less, and still more preferably 3.0 or less. When the ΔE is at most the above upper limit, the heat resistance of the cured film is relatively excellent, and the decrease in the light reflectance of the cured film due to long-term use can be suppressed. Examples of the lamp for irradiating light having a wavelength of 365 nm include a metal halide lamp, a mercury lamp, and an LED lamp.

The photocurable composition is preferably a photoresist film for forming a single layer. In the present invention, even if it is a single-layer photoresist film, a photoresist film which exhibits the above effects can be formed. The photocurable composition is preferably a photoresist film which is not used to form a plurality of layers together with other photocurable compositions. The single-layer photoresist film formed using the above photocurable composition is preferably not laminated with other photoresist films. Formed using two or more photocurable compositions In the case of a multilayer photoresist film, the manufacturing efficiency of the photoresist film is lowered.

Since the photocurable composition is cured by irradiation with light, it may not contain a thermosetting compound or may not contain a thermosetting agent. The photocurable composition is preferably used without being thermally hardened by the action of a thermosetting agent. In order to form the cured film (such as a photoresist film), the composition layer (photoresist layer or the like) disposed on the surface of the member to be coated may not be thermally cured. Since the cured film is formed, the composition layer disposed on the surface of the member to be coated may not be heated. However, the above composition layer can also be heated at a low temperature. In order to form the cured film, it is preferred that the composition layer is not heated to 280 ° C or higher, more preferably not heated to 180 ° C or higher, and further preferably not heated to 60 ° C or higher. The lower the temperature at which the composition layer is heated, the more the thermal deterioration of the member to be coated such as the electronic component body can be suppressed.

The photocurable composition contains a photocurable component having a weight average molecular weight of 2,000 or more. The photocurable composition contains at least (A) an epoxy (meth) acrylate having no carboxyl group and having a weight average molecular weight of 2,000 or more as the photocurable component. The photocurable composition may further contain, as the photocurable component, a photocurable component having a weight average molecular weight of 2,000 or more excluding (A) epoxy (meth) acrylate.

In the photocurable composition, the content of the entire photocurable component contained in the photocurable composition is (B) based on the weight of the photocurable composition. The content of the photocurable compound having at least one ethylenically unsaturated bond is preferably 0.1 or more, more preferably 0.2 or more, still more preferably 0.3 or more. In addition, in the photocurable composition, the content of the photocurable component contained in the photocurable composition is relative to (B) in terms of the weight of the cured film. The content of the photocurable compound having at least one ethylenically unsaturated bond is preferably 1.5 or less, more preferably 1.25 or less, still more preferably 0.95 or less, and still more preferably 0.7 or less.

The content of the photocurable component contained in the photocurable composition is such that the photocurable composition contains only (A) epoxy (meth) acrylate as photohardening having a weight average molecular weight of 2,000 or more. In the case of a sexual component, the content indicates the content of (A) epoxy (meth) acrylate, and the photocurable composition contains (A) epoxy (meth) acrylate and (A) epoxy ( When a photocurable component having a weight average molecular weight of 2,000 or more other than methyl acrylate is used as a photocurable component having a weight average molecular weight of 2,000 or more, the content means (A) epoxy (meth) acrylate The total content of the photocurable components having a weight average molecular weight of 2,000 or more excluding (A) epoxy (meth) acrylate.

Hereinafter, each component contained in the photocurable composition will be described.

((A) Epoxy (meth) acrylate)

The (A) epoxy (meth) acrylate contained in the photocurable composition does not have a carboxyl group. The weight average molecular weight of the (A) epoxy (meth) acrylate contained in the photocurable composition is 2,000 or more. By using the (A) epoxy (meth) acrylate, the adhesion of the cured film to the member to be coated is effectively improved. In particular, when (A) epoxy (meth) acrylate is not used in the case where the content of the (C) white pigment is large, the adhesion of the cured film tends to be low. By using (A) epoxy (meth) acrylate, even if the content of the (C) white pigment is large, the adhesion of the cured film can be improved. (A) Epoxy (meth) acrylate may be used alone or in combination of two or more.

From the viewpoint of improving the hardness of the cured film, the (A) epoxy (meth) acrylate preferably contains a bifunctional epoxy (meth) acrylate and a trifunctional or higher epoxy (methyl). Acrylate. The bifunctional epoxy (meth) acrylate preferably has two (meth) acrylonitrile groups. The trifunctional or higher epoxy (meth) acrylate preferably has three or more (meth) acrylonitrile groups.

(A) Epoxy (meth) acrylate is obtained by reacting (meth)acrylic acid with an epoxy compound. (A) Epoxy (meth) acrylate can be converted to (meth) propylene by converting an epoxy group Obtained by the base. Since the photocurable composition is cured by light irradiation, the (A) epoxy (meth) acrylate preferably does not have an epoxy group.

Examples of the (A) epoxy (meth) acrylate include bisphenol type epoxy (meth) acrylate (for example, bisphenol A type epoxy (meth) acrylate, bisphenol F type epoxy (A) Acrylate, bisphenol S type epoxy (meth) acrylate), cresol novolak type epoxy (meth) acrylate, amine modified bisphenol type epoxy (meth) acrylate, An ester-modified bisphenol epoxy (meth) acrylate, a carboxylic anhydride-modified epoxy (meth) acrylate, and a phenolic novolak epoxy (meth) acrylate.

Commercial products of the bifunctional epoxy (meth) acrylate include KAYARAD R-381 (manufactured by Nippon Kayaku Co., Ltd., bisphenol A epoxy acrylate), and PE2100P (manufactured by MIWON Co., Ltd., bisphenol A) Epoxy acrylate), Ripoxy PC-3F (manufactured by Showa Denko Co., Ltd., bisphenol A epoxy acrylate), and EBECRYL 3708 (manufactured by DAICEL-ALLNEX, modified bisphenol A epoxy acrylate). In addition, as a commercial item of the trifunctional or more epoxy (meth) acrylate, EBECRYL 3603 (manufactured by DAICEL-ALLNEX Co., Ltd., novolak type epoxy acrylate), etc. are mentioned. Further, a hydroxyl group of a bifunctional epoxy (meth) acrylate may be modified to introduce a (meth) acrylonitrile group, whereby a trifunctional or higher epoxy (meth) acrylate may be obtained.

The "(meth)acryloyl group" means an acryloyl group and a methacryloyl group. "(Meth)acrylic acid" means acrylic acid and methacrylic acid. "(Meth)acrylate" means acrylate and methacrylate.

(A) The epoxy (meth) acrylate has a weight average molecular weight of 2,000 or more. When the weight average molecular weight of the (A) epoxy (meth) acrylate is less than 2,000, the adhesion of the cured film tends to be deteriorated. The weight average molecular weight of the (A) epoxy (meth) acrylate is preferably 20,000 or less. However, (A) epoxy (meth) acrylate having a weight average molecular weight of 2,000 or more and epoxy (meth) acrylate having a weight average molecular weight of less than 2,000 may also be used together. (A) The weight average molecular weight of the epoxy (meth) acrylate is preferably 3,000 or more, more preferably It is 5000 or more.

The weight average molecular weight is a weight average molecular weight obtained by polystyrene conversion measured by gel permeation chromatography (GPC), and can be measured by the following measuring apparatus and measurement conditions.

Measuring device: "Waters GPC System (Waters 2690 + Waters 2414 (RI))" manufactured by Nihon Waters

Measuring condition column: Shodex GPC LF-G×1 root, Shodex GPC LF-804×2 root

Mobile phase: THF 1.0mL/min

Sample concentration: 5mg/mL

Detector: Differential Index Detector (RID)

Standard material: polystyrene (manufactured by TOSOH, molecular weight: 620~590000)

(A) The epoxy (meth) acrylate may be an epoxy (meth) acrylate obtained by modifying a hydroxyl group of an epoxy (meth) acrylate having a hydroxyl group. In this case, the degree of crosslinking can be increased and the hardness can be improved. Examples of the compound which can be used for the modification include a decane coupling agent, a monomer having an isocyanate group, and the like. The decane coupling agent may, for example, be a compound having a functional group such as a vinyl group, a (meth)acryl fluorenyl group, a styryl group, a fluorenyl group, an epoxy group, an amine group, a thio group, a ureido group or an isocyanate group. Since it has photoreactivity, it is preferably a compound having a vinyl group, a (meth)acryl fluorenyl group, a styryl group, or a fluorenyl group. Examples of the monomer having an isocyanate group include a compound having a vinyl group, a (meth)acryl fluorenyl group, a styryl group, or a fluorenyl group.

(A) Epoxy (meth) acrylate does not have a carboxyl group. By using an epoxy (meth) acrylate having no carboxyl group, adverse effects due to carboxyl groups in the cured film can be prevented, for example, discoloration of the cured film can be suppressed.

The content of the (A) epoxy (meth) acrylate in 100% by weight of the photocurable composition is 5% by weight or more and 30% by weight or less. In 100% by weight of the photocurable composition, the content of the (A) epoxy (meth) acrylate is preferably 10% by weight or more. If (A) epoxy When the content of the (meth) acrylate is at least the above lower limit, the adhesion of the cured product is effectively improved. When the content of the (A) epoxy (meth) acrylate is not more than the above upper limit, the pencil hardness of the cured film is effectively improved, and a uniform coating film is easily obtained at the time of printing. In the 100% by weight of the photocurable composition, the bifunctional epoxy (meth) acrylate having a weight average molecular weight of 2,000 or more and the weight average molecular weight are 100% by weight of the photocurable composition. The total content of the trifunctional or higher epoxy (meth) acrylate of 2,000 or more is preferably 5% by weight or more, more preferably 10% by weight or more, and still more preferably 30% by weight or less.

((B) Photocurable compound having at least one ethylenically unsaturated bond)

By using together (A) epoxy (meth) acrylate and (B) photocurable compound having at least one ethylenically unsaturated bond, even if the content of (C) white pigment is large, it can be effectively improved. Further, the adhesion between the cured film and the viscosity ratio (η1/η2) of the photocurable composition are easily controlled within an optimum range. (B) The photocurable compound having at least one ethylenically unsaturated bond does not contain an epoxy (meth) acrylate having a weight average molecular weight of 2,000 or more. (B) The photocurable compound having at least one ethylenically unsaturated bond may be used alone or in combination of two or more.

(B) The photocurable compound having at least one ethylenically unsaturated bond does not have a weight average molecular weight of 2,000 or more. Therefore, (B) the photocurable compound having at least one ethylenically unsaturated bond preferably has a molecular weight of less than 2,000. The molecular weight of the (B) photocurable compound is preferably 1,000 or less, more preferably 800 or less, still more preferably 600 or less. In the present invention, the molecular weight refers to the calculated value when it is calculated based on the molecular structure, and refers to the weight average molecular weight when it cannot be calculated from the molecular structure.

From the viewpoint of further improving the adhesion of the cured film, (B) the photocurable compound having at least one ethylenically unsaturated bond is preferably a photocurable compound having at least one (meth)acryl fluorenyl group. . (B) The photocurable compound having at least one ethylenically unsaturated bond preferably has at least one (meth) acrylonitrile group as the ethylenically unsaturated bond. base.

The photocurable compound having at least one ethylenically unsaturated bond (B) is not particularly limited, and examples thereof include a (meth)acrylic acid addition product of a polyhydric alcohol and an alkylene oxide modified product of a polyhydric alcohol ( Methyl)acrylic acid adducts, (meth)acrylic acid urethanes, and polyester (meth)acrylates. Examples of the polyhydric alcohol include diethylene glycol, triethylene glycol, polyethylene glycol, dipropylene glycol, tripropylene glycol, polypropylene glycol, trimethylolpropane, cyclohexane dimethanol, and tricyclodecane dimethanol. , an alkylene oxide adduct of bisphenol A, and pentaerythritol. (B) In the photocurable compound, a part of the hydroxyl group may remain.

The photocurable composition may further contain (meth)acrylic acid urethane or polyester (meth) acrylate from the viewpoint of further improving the adhesion of the cured film.

From the viewpoint of further improving the adhesion of the cured film, (B) the photocurable compound having at least one ethylenically unsaturated bond preferably contains (B1) photocuring property having one ethylenically unsaturated bond. Compound.

(B) The photocurable compound having at least one ethylenically unsaturated bond may further comprise (B2) a photocurable compound having two or more ethylenically unsaturated bonds, and may further contain (B3) having three or more ethylenic groups. A photocurable compound that is unsaturated. From the viewpoint of further improving the adhesion of the cured film, (B) the photocurable compound having at least one ethylenically unsaturated bond preferably contains (B1) photocuring property having one ethylenically unsaturated bond. A compound and (B2) a photocurable compound having two or more ethylenically unsaturated bonds.

From the viewpoint of further improving the adhesion of the cured film, (B) the photocurable compound having at least one ethylenically unsaturated bond preferably contains an alicyclic compound or an aromatic ring or a hydroxyl group. It is preferably a monofunctional component, but may also contain a plurality of components such as a difunctional multifunctional.

(B) The photocurable compound having at least one ethylenically unsaturated bond preferably does not have a carboxyl group. By using a photocurable compound having no carboxyl group, adverse effects due to carboxyl groups in the cured film can be prevented, and for example, discoloration of the cured film can be suppressed.

(B) The photocurable compound having at least one ethylenically unsaturated bond preferably has a viscosity at 25 ° C of 1 mPa ‧ or more, more preferably 3 mPa ‧ s or more. From the viewpoint of further improving the adhesion of the cured film, (B) the photocurable compound having at least one ethylenically unsaturated bond preferably has a viscosity at 25 ° C of 200 mPa ‧ or less, more preferably 100 mPa ‧ s below.

The above viscosity can be measured using an E-type viscometer at 25 ° C and 10 rpm.

The content of the photocurable compound having at least one ethylenically unsaturated bond in (B) 100% by weight of the photocurable composition is preferably 5% by weight or more, more preferably 10% by weight or more, and preferably 50% by weight or less, more preferably 40% by weight or less. When the content of the photocurable compound having at least one ethylenically unsaturated bond (B) is at least the above lower limit and not more than the above upper limit, the physical properties of the cured film are effectively improved.

In 100% by weight of the photocurable composition, the content of the photocurable compound having one ethylenically unsaturated bond in (B1) is preferably 10% by weight or more, more preferably 20% by weight or more, and preferably 50% by weight. The weight% or less is more preferably 40% by weight or less. When the content of the photocurable compound having at least one ethylenically unsaturated bond in (B1) is at least the above lower limit and not more than the above upper limit, the adhesion of the cured film is effectively improved.

In 100% by weight of the photocurable composition, the content of the photocurable compound having three or more ethylenically unsaturated bonds in (B3) is preferably 5% by weight or more, and preferably 20% by weight or less. When the content of the photocurable compound having three or more ethylenically unsaturated bonds (B3) is at least the above lower limit and not more than the above upper limit, the adhesion of the cured film is effectively improved.

((C) white pigment)

When the photocurable composition contains (C) a white pigment, a cured film having a high light reflectance can be formed. By using the (C) white pigment, a cured film having a higher light reflectance is obtained as compared with the case of using only a filler other than the (C) white pigment. (C) The white pigment may be used alone or in combination of two or more.

Examples of the (C) white pigment include alumina, titania, zinc oxide, zirconium oxide, cerium oxide, and magnesium oxide.

The (C) white pigment is preferably titanium dioxide, zinc oxide, barium sulfate, calcium carbonate, talc or zirconia from the viewpoint of further increasing the light reflectance of the cured film. In the case of using the preferred white pigment, one or two or more kinds of white pigments may be used in the titanium dioxide, zinc oxide, barium sulfate, calcium carbonate, talc, and zirconia. The (C) white pigment is preferably titanium dioxide or zinc oxide, preferably titanium dioxide, preferably zinc oxide. (C) The white pigment may also be zirconia.

The above titanium dioxide is preferably rutile type titanium dioxide. By using rutile-type titanium oxide, the heat resistance of the cured film is further improved, and the discoloration of the cured film is further suppressed.

The titanium dioxide is preferably a rutile-type titanium oxide surface-treated with an aluminum oxide, a zirconium oxide, or a cerium oxide. By using the above-described surface-treated rutile-type titanium oxide, the heat resistance of the cured film is further improved.

For example, "CR-90-2" manufactured by Ishihara Sangyo Co., Ltd., which is rutile chlorinated titanium dioxide, and "Ishihara Industrial Co., Ltd., which is rutile chlorinated titanium dioxide", are exemplified as the rutile-type titanium dioxide. "R-900" manufactured by Dupont Co., Ltd., a rutile chlorination method, and "R-630" manufactured by Ishihara Sangyo Co., Ltd., a rutile sulfuric acid method. The white pigment other than rutile-type titanium dioxide can also be surface-treated in the same manner.

The (C) white pigment may further contain titanium dioxide and a white pigment different from titanium dioxide from the viewpoint of further improving the adhesion and strength of the cured film.

The method of the above surface treatment is not particularly limited. As the method of the surface treatment, a dry method, a wet method, an integral blending method, and other well-known conventional surface treatment methods can be used.

The average particle diameter of the (C) white pigment is preferably 0.1 μm or more, and preferably 40 μm. under. When the average particle diameter is not less than the above lower limit and not more than the above upper limit, the light reflectance of the cured film can be further increased.

The content of the (C) white pigment in 100% by weight of the photocurable composition is preferably 20% by weight or more, more preferably 30% by weight or more, still more preferably 40% by weight or more, and preferably 70% by weight. Hereinafter, it is more preferably 60% by weight or less. When the content of the (C) white pigment is not less than the above lower limit and not more than the above upper limit, the light reflectance of the cured film is further improved, and the adhesion of the cured film is further improved. The content of the (C) white pigment in 100% by weight of the photocurable composition may be 50% by weight or more.

In the present invention, since a specific composition is employed, even if the content of the (C) white pigment is large, the adhesion of the cured film can be improved. For example, even in the case of 100% by weight of the photocurable composition, the content of the (C) white pigment is 50% by weight or more, and the adhesion of the cured film is sufficiently improved.

From the viewpoint of further improving the adhesion between the cured film and further improving the light reflectance of the cured film, the content of the (C) white pigment relative to the (A) ring is based on the weight of the photocurable composition. The content of the oxygen (meth) acrylate is preferably 0.5 or more, more preferably 1.0 or more, still more preferably 1.5 or more. From the viewpoint of further improving the adhesion of the cured film, the content of the (C) white pigment relative to the content of the (A) epoxy (meth) acrylate is based on the weight of the photocurable composition. It is preferably 10 or less, more preferably 5.0 or less, still more preferably 4.0 or less.

In the case where the (C) white pigment contains titanium dioxide, the photocurable composition is based on the weight, further improving the adhesion between the cured film and further improving the light reflectance of the cured film. The content of the titanium dioxide is preferably 0.4 or more, more preferably 0.6 or more, still more preferably 0.8 or more, based on the content of the (C) white pigment. From the viewpoint of further improving the adhesion between the cured film, the photocurable composition preferably has a content of titanium dioxide of 1.0 or less based on the weight of the (C) white pigment based on the weight.

((D) Photopolymerization initiator)

Since the photocurable composition contains (D) a photopolymerization initiator, the photocurable composition can be cured by light irradiation. (D) The photopolymerization initiator may be used alone or in combination of two or more.

As the (D) photopolymerization initiator, fluorenylphosphine oxide, halomethylation III Halomethylation Diazole, imidazole, benzoin, benzoin alkyl ether, hydrazine, benzofluorenone, benzophenone, alkyl benzophenone, 9-oxosulfur Benzoate, acridine, brown , ferrocene, α-aminoalkylphenone, anthraquinone, and derivatives thereof.

Examples of the benzophenone-based photopolymerization initiator include methyl phthalic acid benzoate and michechone. A commercially available product of a benzophenone-based photopolymerization initiator is EAB (manufactured by Hodogaya Chemical Industry Co., Ltd.).

Commercial products of the alkylphenone-based photopolymerization initiator include Darocure 1173, Darocure 2959, Irgacure 184, Irgacure 907, Irgacure 369, Irgacure 651 (manufactured by BASF Corporation), and Esacure 1001M (manufactured by Lamberti Co., Ltd.). Wait.

The commercially available product of the fluorenylphosphine oxide-based photopolymerization initiator may, for example, be Lucirin TPO (manufactured by BASF Corporation) or Irgacure 819 (manufactured by BASF Corporation).

9-oxosulfur A commercially available product of a photopolymerization initiator, exemplified by isopropyl 9-oxosulfur And diethyl 9-oxosulfur Wait.

The commercially available product of the oxime ester photopolymerization initiator may, for example, be Irgacure OXE-01 or Irgacure OXE-02 (manufactured by BASF Corporation).

The (D) photopolymerization initiator preferably contains both a mercaptophosphine photopolymerization initiator and an alkylphenone photopolymerization initiator, from the viewpoint of further improving the adhesion of the cured film. .

The (D) photopolymerization initiator preferably contains an alkylphenone photopolymerization initiator and a mercaptophosphine oxide photopolymerization initiator, from the viewpoint of further suppressing foaming, peeling, and discoloration. Both of them are preferably both a fluorenylphosphine oxide-based photopolymerization initiator and a bis-indenylphosphine oxide-based photopolymerization initiator.

The content of the (D) photopolymerization initiator is preferably 100 parts by weight based on 100 parts by weight of the total of (A) epoxy (meth) acrylate and (B) photocurable compound having at least one ethylenically unsaturated bond. 1 part by weight or more, more preferably 3 parts by weight or more, and still more preferably 20 parts by weight or less, still more preferably 15 parts by weight or less. When the content of the (D) photopolymerization initiator is not less than the above lower limit and not more than the above upper limit, the photocurable composition can be photocured satisfactorily.

In view of further improving the hardenability of both the inner and outer surfaces of the cured product, the (D) photopolymerization initiator is preferably used in combination of two or more kinds. The photocurable composition preferably contains two or more kinds of photopolymerization initiators. Specifically, Irgacure 819 (bis(2,4,6-trimethylbenzylidene)-phenylphosphine oxide, manufactured by BASF Corporation) and TPO (2,4,6-trimethylbenzene) are further preferred. Mercapto-diphenyl-phosphine oxide, manufactured by BASF Corporation, Esacure 1001M (1-[4-(4-benzylidenephenylthio)phenyl]-2-methyl-2-(4- A combination of methylphensulfonyl)propan-1-one, manufactured by Lamberti, Darocure 1173, Darocure 2959, Irgacure 907, Irgacure 369, Irgacure 651 or Irgacure 184. In this case, the content of Irgacure 819 is preferably 1% by weight or more, more preferably 15% by weight or more, and preferably 99% by weight or less, based on 100% by weight of the total amount of the (D) photopolymerization initiator. More preferably, it is 85% by weight or less. Further, Irgacure 819 can be used as an essential component and three or more kinds of photopolymerization initiators can be used in combination. In this case, the lower and upper limits of the preferred content of Irgacure 819 are also the same as above.

((E) a thiol group-containing compound having at least one thiol group)

By using (E) a thiol group-containing compound having at least one thiol group in combination with another compound, a cured film excellent in moisture resistance can be obtained, and a cured film having high heat resistance can be obtained. Further, by using the (E) thiol group-containing compound in combination with the rutile-type titanium oxide produced by the chlorination method, the adhesion between the cured film and the storage stability of the photocurable composition can be simultaneously achieved. (E) The thiol group-containing compound may be used alone or in combination of two or more.

Specific examples of the (E) thiol group-containing compound include trimethylolpropane tris(3-mercaptopropionate) (TMMP) manufactured by SC Organic Chemical Co., Ltd., and pentaerythritol tetrakis(3-mercaptopropionate). (PEMP), tris[(3-mercaptopropoxy)-ethyl]isocyanurate (TEMPIC), tetraethylene glycol bis(3-mercaptopropionate) (EGMP-4), dipentaerythritol Grade 1 polyfunctional thiol such as 3-mercaptopropionate (DPMP), pentaerythritol tetrakis(3-mercaptobutyrate) manufactured by Showa Denko Co., Ltd. (Karenz MT PE1), 1,3,5-tris(3-mercapto Butyloxyethyl)-1,3,5-three 2-grade polyfunctional thiol such as -2,4,6(1H,3H,5H)-trione (Karenz MT NR1), 1,4-bis(3-mercaptobutoxy)butane (Karenz MT BD1) Β-mercaptopropionic acid (BMPA), methyl 3-mercaptopropionate (MPM), 2-ethylhexyl 3-mercaptopropionate (EHMP), n-octyl 3-mercaptopropionate manufactured by SC Organic Chemical Co., Ltd. (NOMP), monofunctional thiol such as 3-mercaptopropionic acid methoxybutyl ester (MBMP) or 3-mercaptopropionate stearyl ester (STMP).

In view of further improving the moisture resistance of the cured film and improving the adhesion between the cured film, (E) the thiol group-containing compound having at least one thiol group preferably has two or more (E1) a thiol-based thiol compound.

The content of the (E) thiol group-containing compound and the (E1) thiol compound in 100% by weight of the photocurable composition is preferably 0.1% by weight or more, more preferably 0.5% by weight or more, and preferably 10% by weight. The weight% or less is more preferably 5% by weight or less. The content of the (E) thiol group-containing compound and the (E1) thiol compound is preferably 1.0 part by weight or more, more preferably 3.0 parts by weight or more, per 100 parts by weight of the (A) epoxy (meth) acrylate. It is preferably 35 parts by weight or less, more preferably 25 parts by weight or less, still more preferably 20 parts by weight or less. The content of the (E) thiol group-containing compound and the (E1) thiol compound is preferably 0.2% by weight based on 100 parts by weight of the total of (A) epoxy (meth) acrylate and (B) photoreactive compound. The amount is preferably 1 part by weight or more, more preferably 20 parts by weight or less, still more preferably 10 parts by weight or less, still more preferably 6 parts by weight or less. When the content of the (E) thiol group-containing compound and the (E1) thiol compound is not less than the above lower limit and not more than the above upper limit, the moisture resistance of the cured film is improved, and the peeling of the cured film is further suppressed, and further, to a high degree. At the same time, the dense film of the hardened film is realized. The storage stability of the splicable and photocurable compositions. Further, when the content of the (E) thiol group-containing compound and the (E1) thiol compound is at most the above upper limit, gelation is less likely to occur during storage. When the content of the (E) thiol group-containing compound and the (E1) thiol compound is at least the above lower limit, the hardenability is further improved. From the viewpoint of improving storage stability, it is preferred to use a secondary thiol compound. A polymerization inhibitor can also be used from the viewpoint of improving storage stability.

((F) thermosetting compound)

The photocurable composition preferably contains no (F) thermosetting compound or 5% by weight or less (F) of a thermosetting compound. In the case of using (F) a thermosetting compound in the present invention, it is preferred to use a small amount of the (F) thermosetting compound. The composition of the (F) composition having a content of the thermosetting compound of 5% by weight or less and the content of the (F) thermosetting compound is, for example, 10% by weight or more, and the basic physical properties of the cured product are usually different. (F) The thermosetting compound may be used alone or in combination of two or more.

Examples of the (F) thermosetting compound include an epoxy compound and the like.

The photocurable composition preferably contains no epoxy compound or contains 5% by weight or less of an epoxy compound.

From the viewpoint of further suppressing foaming, peeling, and discoloration, the content of the (F) thermosetting compound is preferably as small as 100% by weight of the photocurable composition. The content of the (F) thermosetting compound in 100% by weight of the photocurable composition is preferably 3% by weight or less, more preferably 1% by weight or less, still more preferably 0.5% by weight or less, and particularly preferably 0% by weight. (Unused). The content of the epoxy compound in 100% by weight of the photocurable composition is preferably 3% by weight or less, more preferably 1% by weight or less, still more preferably 0.5% by weight or less, and particularly preferably 0% by weight (unused). .

((G) organic solvent)

The photocurable composition may contain (G) an organic solvent or may not contain (G) an organic solvent.

The photocurable composition preferably contains no (G) organic solvent or contains 10% by weight or less of (G) an organic solvent.

From the viewpoint of further improving the adhesion of the cured film, the content of the (G) organic solvent is preferably as small as 100% by weight of the photocurable composition. The content of the (G) organic solvent in 100% by weight of the photocurable composition is preferably 3% by weight or less, more preferably 1% by weight or less, further preferably 0.5% by weight or less, and particularly preferably 0% by weight (not use).

(other ingredients)

The photocurable composition may contain an organic solvent or may not contain an organic solvent.

The photocurable composition may contain, in addition to the above components, an inorganic filler other than a white pigment, an organic filler, a colorant, a polymerization inhibitor, a chain transfer agent, a hardening aid, an antioxidant, an ultraviolet absorber, an antifoaming agent, Leveling agent, surfactant, slip agent, anti-blocking agent, wax, masking agent, deodorant, fragrance, preservative, antibacterial agent, antistatic agent and adhesion imparting agent. Examples of the adhesion imparting agent include a decane coupling agent and the like.

The photocurable compound may further contain an inorganic filler which is different from titanium dioxide and which is not a white pigment from the viewpoint of further improving the adhesion and strength of the cured film.

[Manufacturing method of electronic parts and electronic parts]

The method for producing an electronic component includes the steps of: applying a photocurable composition to the surface of the electronic component body to form a composition layer; and irradiating the composition layer with light to form a cured film. In the method of producing an electronic component, in order to form the cured film, it is preferred not to develop the composition layer. Preferably, the composition layer is a photoresist layer, and preferably the cured film is a photoresist film.

The photocurable composition can be preferably used to form a cured film without performing development, and the photocurable composition can be applied to a part of the surface of the electronic component body in a plurality of portions.

In order to prevent thermal deterioration of the body of the electronic component, in order to form the above hardening Preferably, the film is thermally hardened without the action of a thermal hardener.

Hereinafter, a method of manufacturing a specific electronic component of the present invention will be described with reference to the drawings. In the embodiment described below, the composition layer is a photoresist layer, and the cured film is a photoresist film. In order to form a photoresist film, a non-developing type photoresist photocurable composition is used.

First, as shown in FIG. 1(a), the coating target member 11 is prepared. The coating target member 11 is an electronic component body. The substrate 11A is used as the coating target member 11, and a plurality of electrodes 11B are disposed on the surface of the substrate 11A.

Next, as shown in FIG. 1(b), a non-developing photoresist photocurable composition is applied onto the surface of the coating member 11 to form a photoresist layer 12 (composition layer). In FIG. 1(b), the non-developing photoresist photocurable composition is applied to a part of the surface of the coating member 11 in a plurality of portions to form a plurality of photoresist layers 12. Specifically, a plurality of photoresist layers 12 are formed between the plurality of electrodes 11B on the surface of the substrate 11A. The photoresist layer 12 is, for example, a resist pattern. For example, when it is assumed that the prior development type photoresist composition is used, the photoresist layer 12 is formed only at a position corresponding to the portion of the photoresist layer which remains after development. The photoresist layer 12 is not formed at a position corresponding to a portion of the photoresist layer which is removed by development using the prior development type photoresist composition.

Examples of the coating method of the non-developing photoresist photocurable composition include a coating method using a dispenser, a coating method using screen printing, and a coating method using an inkjet device. In terms of excellent manufacturing efficiency, screen printing is preferred. Preferably, the pattern-printing non-developing photoresist photocurable composition is printed.

Next, the photoresist layer 12 is irradiated with light. For example, the photoresist layer 12 is irradiated with light from the side opposite to the side of the coating member 11 from the photoresist layer 12. As a result, as shown in FIG. 1(c), the photoresist layer 12 is photocured to form a photoresist film 2 (cured film). As a result, the electronic component 1 in which the photoresist film 2 is formed on the surface of the coating member 11 (electronic component body) is obtained.

Further, a method of manufacturing an electronic component including a photoresist film described in FIGS. 1(a) to 1(c) is used as an example, and a method of manufacturing an electronic component can be appropriately changed. In the production of electronic parts, in order to form a photoresist film, development is preferably not performed.

When an electronic component is produced by using the non-developing photoresist photocurable composition of the present invention, two or more photoresist layers may be formed on the surface of the member to be coated, and the two or more photoresist layers may be used. It is formed locally and in multiple parts. In this case, one layer of the non-developing type photoresist photocurable composition may be applied to the surface of the member to be coated to form a photoresist layer by irradiation with light, or two or more layers may be applied. The light is then irradiated to form a photoresist layer.

Further, in the past, the use of the developed photoresist composition was mostly the case. When a negative development type resist composition is used, as shown in FIG. 2(a), for example, a coating member 111 having a substrate 111A and an electrode 111B disposed on the surface of the substrate 111A is prepared. Next, as shown in FIG. 2(b), a photoresist layer 112 is formed on the entire surface of the coating member 111. Next, as shown in FIG. 2(c), the photomask 113 is interposed, and only the photoresist layer 112 on the electrode 111B is irradiated with light. Thereafter, as shown in FIG. 2(d), development is performed and the photoresist layer 112 located between the electrodes 111B is partially removed. After the photoresist layer 112 is partially removed, the residual photoresist layer 112 is thermally hardened. As a result, as shown in FIG. 2(e), the electronic component 101 in which the photoresist film 102 is formed on the surface of the coating member 111 (electronic component body) is obtained.

Thus, in the case of using the developing type resist composition, the formation efficiency of the photoresist film and the manufacturing efficiency of the electronic component are inferior. Further, development is necessary.

On the other hand, by using the photocurable composition of the present invention, the formation efficiency of the cured film (such as a photoresist film) and the production efficiency of the electronic component can be improved. Also, no development is required.

Moreover, in the present invention, as the electronic component, a reflector having the cured film as a light reflection film can be produced. In the electronic component, the cured film may be provided as a light reflecting film, or may be disposed at a position where light should be reflected. The electronic component may also have a light irradiation unit. When the light is reflected by the cured film, the cured film can be exposed Out, or may be laminated with transparent members.

Hereinafter, the present invention will be specifically described by way of examples and comparative examples. The invention is not limited to the following examples.

(Examples 1 to 17 and Comparative Examples 1 to 7)

(1) Preparation of non-developing type photoresist photocurable composition

The formulation components shown in the following Tables 1 to 3 were blended in the amounts shown in the following Tables 1 to 3 to prepare a non-developing photoresist photocurable composition.

(2) Production of electronic parts

A substrate made of FR-4 laminated copper foil of 100 mm × 100 mm × 0.8 mm in thickness was prepared. On the substrate, a non-developing photoresist photocurable composition was printed in a reticle pattern by a screen printing method using a 255 mesh polyester obliquely stretched cloth to form a photoresist layer. After the printing, an ultraviolet ray device equipped with a high-pressure mercury lamp was used to irradiate the photoresist layer with ultraviolet light having a wavelength of 365 nm in a conveyor belt type exposer at a cumulative light amount of 2000 mJ/cm ² , thereby obtaining a sample as a measurement sample. Photoresist film. The thickness of the obtained photoresist film was 20 μm.

(Evaluation)

(1) Coating accuracy (viscosity (ratio (η1/η2)))

The photocurable composition obtained was measured for the photocurable composition at 25 ° C and the viscosity η 1 at 1 rpm and the viscosity η 2 at 25 ° C and 10 rpm using an E-type viscometer. Find the ratio (η1/η2).

(2) Coating accuracy (L/S (μm))

Screen printing and exposure were carried out using a mask of L/S having a line width of 500 μm, 300 μm, 200 μm, 150 μm, and 100 μm, and the printing precision of L/S was confirmed. The decision is based on the following implementation.

When the resin does not flow between the wire and the wire, the state of the wire can be confirmed, and the resin does not flow between the width and the width, and the line width in which the state of the space can be confirmed is qualified, and the line width is described. Value.

(3) Adhesion (checkerboard test)

The obtained electronic component was confirmed by a cross-cut tape test (JIS 5600) and confirmed by the following criteria. A 20-square checkerboard was formed by cutting the slit at a distance of 1 mm from the hardened material by a cutter, and then a transparent tape (JIS Z1522) was firmly attached to the cured product having the slit portion, and one end of the tape was forcibly opened at an angle of 60 degrees. Peel off and confirm the peeling state. The peeling state is classified according to JIS. In the case of categories 0, 1, 2, the number of strips that are stripped is zero.

(4) Adhesion (PCT (Pressure Cooker Test) test 96h)

The measurement sample was allowed to stand at 121 ° C and 2 atm for 96 hours, and it was confirmed whether or not the evaluation sample was peeled off.

[Criteria for the PCT Test 96h]

○: There is no peeling of the photoresist film

×: peeling of the photoresist film

(5) Uniformity of the coating film

The obtained photocurable composition was applied to a support member to a thickness of 20 μm. The photocurable composition after application was irradiated with ultraviolet rays having a wavelength of 365 nm so as to have an integrated light amount of 2000 mJ/cm ² to obtain a cured product. Confirm the appearance of the hardened material obtained.

[Criteria for judging the uniformity of the coating film]

○: Not suitable for the judgment criteria of ×

×: A plurality of irregularities or streaks are confirmed on the surface.

(6) Reflectance (Y (%))

For the obtained electronic parts, the reflectance Y value of the evaluation sample was measured using a color-color difference meter ("CR-400" manufactured by Konica Minolta Co., Ltd.).

(7) Heat resistance (reflectance (ΔE))

The obtained photocurable composition was applied to a support member to a thickness of 20 μm. The photocurable composition after application was irradiated with ultraviolet rays having a wavelength of 365 nm so as to have an integrated light amount of 2000 mJ/cm ² to obtain a cured product, and the obtained cured product was allowed to stand at 270 ° C for 5 minutes. The color difference ΔE in the L ^* a ^* b ^* color system before and after placement was determined using a colorimeter.

(8) Pencil hardness

The obtained photocurable composition was applied to a support member to a thickness of 20 μm. The photocurable composition after application was irradiated with ultraviolet rays having a wavelength of 365 nm so as to have an integrated light amount of 2000 mJ/cm ² to obtain a cured product. For the obtained cured product, the pencil hardness was determined in accordance with JIS K5600-5-4.

The composition and results are shown in Tables 1 to 3 below.

1‧‧‧Electronic parts

2‧‧‧ photoresist film (hardened film)

11‧‧‧Application target member (electronic parts body)

11A‧‧‧Substrate

11B‧‧‧electrode

12‧‧‧ photoresist layer (composition layer)

Claims (14)

A photocurable composition which is applied to a surface of a member to be coated in a localized manner and in a plurality of places, and which comprises an epoxy (meth) acrylate which does not have a carboxyl group and has a weight of 2000 or more. An average molecular weight; a photocurable compound which is not an epoxy (meth) acrylate having a weight average molecular weight of 2,000 or more, and which has a weight average molecular weight of not more than 2,000 and has at least one ethylenically unsaturated bond; a pigment; and a photopolymerization initiator; and the content of the epoxy (meth) acrylate is 5% by weight or more and 30% by weight or less. The photocurable composition according to claim 1, wherein the content of the white pigment is 20% by weight or more and 70% by weight or less. The photocurable composition according to claim 1 or 2, wherein the photocurable compound is not an epoxy (meth) acrylate having a weight average molecular weight of 2,000 or more, and has a weight average molecular weight of not more than 2,000 and has at least One (meth) acrylonitrile group. The photocurable composition according to claim 1 or 2, wherein the content of the epoxy (meth) acrylate is 10% by weight or more and 30% by weight or less. A photocurable composition according to claim 1 or 2, which comprises a thiol group-containing compound having at least one thiol group. The photocurable composition according to claim 1 or 2, wherein a ratio of the content of the photocurable component having a weight average molecular weight of 2,000 or more and the content of the photocurable compound contained in the photocurable composition to the photocurable compound is 1.25. the following. The photocurable composition according to claim 1 or 2, which is cured by light irradiation and used for forming a photoresist film without developing, which is a non-developing type photoresist photocurable composition . The photocurable composition according to claim 1 or 2, wherein the ratio of the viscosity η1 at 25 ° C and 1 rpm to the viscosity η 2 at 25 ° C and 10 rpm is 1.1 or more and 2.2 or less. The photocurable composition of claim 1 or 2 which is not thermally hardened by the action of a thermal hardener. The photocurable composition according to claim 1 or 2, which does not contain a thermosetting compound or contains 5% by weight or less of a thermosetting compound. The photocurable composition of claim 1 or 2 which is not used to form a multilayer photoresist film together with other photocurable compositions. A method of manufacturing an electronic component, comprising the steps of: coating a photocurable composition according to any one of claims 1 to 11 on a surface of an electronic component body, partially or in plurality, to form a composition And a step of irradiating the composition layer with light to form a cured film; and in order to form the cured film, the composition layer is not developed. The method of producing an electronic component according to claim 12, wherein the composition layer is not thermally cured by the action of a thermosetting agent in order to form the cured film. The method of producing an electronic component according to claim 12, wherein the composition layer is a photoresist layer, and the cured film is a photoresist film.