WO2015199449A1 - Composition de résine photosensible pour protection contre la lumière, et couche de protection contre la lumière formée à partir de cette composition - Google Patents

Composition de résine photosensible pour protection contre la lumière, et couche de protection contre la lumière formée à partir de cette composition Download PDF

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WO2015199449A1
WO2015199449A1 PCT/KR2015/006454 KR2015006454W WO2015199449A1 WO 2015199449 A1 WO2015199449 A1 WO 2015199449A1 KR 2015006454 W KR2015006454 W KR 2015006454W WO 2015199449 A1 WO2015199449 A1 WO 2015199449A1
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formula
weight
silane
light
resin composition
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PCT/KR2015/006454
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English (en)
Korean (ko)
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최정식
김태운
김학준
안정민
이건표
조용일
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주식회사 삼양사
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Priority to CN201580034918.0A priority Critical patent/CN106462071B/zh
Publication of WO2015199449A1 publication Critical patent/WO2015199449A1/fr

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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/075—Silicon-containing compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials

Definitions

  • the present invention relates to a light-sensitive photosensitive resin composition and a light shielding layer formed therefrom. More specifically, the present invention relates to a light shielding layer comprising a photosensitive resin composition which can be used to manufacture light shielding layers used for various electronic devices using photolithography and a coating film formed by curing the composition.
  • the black matrix photosensitive resin composition is an essential material for the production of color filters included in display elements such as color filters, liquid crystal displays, organic electroluminescent devices, and display panels.
  • color filters included in display elements such as color filters, liquid crystal displays, organic electroluminescent devices, and display panels.
  • the color filter of the liquid crystal display device is used to prevent the mixing of R (red), G (green), B (blue), or in the touch panel device may be used for the bezel to cover the X, Y metal electrodes.
  • LTPS low temperature poly-silicon
  • oxide thin film transistors have been actively studied as devices for use in high-resolution driving over UD (Ultra Definition) and high speed of 240 Hz or more.
  • the light shielding layer mainly uses a metal light shielding layer because a subsequent process such as PE-CVD is performed at a high temperature after formation of the light shielding layer, but the metal light shielding layer has high reflectivity and light is reflected between the source, drain electrode, and the light shielding layer.
  • the parasitic voltage is generated between the source and drain electrodes to act as an element that resists the operation of the device and increases the load of the data line.
  • the OGS (One Glass Solution) method for forming a touch panel on the cover glass has been studied in a manner in which a conventional cover glass and a touch panel glass are bonded together for thinning of a product.
  • the first shading layer (bezel) formed on the cover glass is first formed, and then the touch panel driver is formed.
  • a high deposition or annealing process is required in the process of forming the transparent electrode of the touch panel driver.
  • the black matrix photosensitive resin used in the conventional light shielding layer has a problem in that electrical properties are degraded at such a high temperature process.
  • an object of the present invention is to provide a light-sensitive photosensitive resin composition such that even at high process temperatures, desired electrical properties such as resistance and dielectric constant, optical properties such as optical density and reflectivity can be obtained. .
  • a siloxane resin comprising a polymerized unit represented by the following formula (1) and a polymerized unit represented by the following formula (2);
  • B pigments;
  • C photoinitiator;
  • D there is provided a photosensitive resin composition comprising an organic solvent:
  • R 1 is a linear or branched alkylene group having 1 to 20 carbon atoms, an arylene group having 6 to 20 carbon atoms, an alkylene group having 7 to 20 carbon atoms substituted with an aryl group, and an arylene group having 7 to 20 carbon atoms substituted with an alkyl group. Or a group having 7 to 20 carbon atoms, in which an alkylene group and an arylene group are connected;
  • X is hydroxy, carboxylic acid, carboxylic anhydride, carboxylic anhydride derivative, imide, imide derivative, amide, amide derivative, amine or mercanto,
  • Each R 2 is independently hydrogen, a linear, branched or cyclic alkyl group having 1 to 20 carbon atoms, an aryl group having 6 to 10 carbon atoms, an unsaturated hydrocarbon group having 2 to 10 carbon atoms, or an acyloxy group having 2 to 10 carbon atoms, A plurality of R 2 in the molecule is the same or different from each other,
  • the siloxane resin may be composed of 5 to 40 mol% of the polymerized units of Formula 1 and 95 to 60 mol% of the polymerized units of Formula 2 based on 100 mol% of the polymerized units of Formula 1 and the polymerized units of Formula 2.
  • the siloxane resin may have an acid value in the range of 10 to 200 mgKOH / g resin when titrating KOH.
  • the photosensitive resin composition may further include a polyfunctional monomer having an (E) unsaturated bond.
  • the pigment may be a black pigment.
  • the pigment may be one or a mixture of two or more selected from the group consisting of carbon black, titanium black, aniline black, perylene black, strontium titanate, chromium oxide and ceria.
  • the pigment may be included in an amount of 20 to 130 parts by weight based on 100 parts by weight of the siloxane resin or 100 parts by weight of the polyfunctional monomer having an unsaturated bond when the polyfunctional monomer having an unsaturated bond is used. Can be.
  • the photopolymerization initiator may be used in an amount of 1 to 30 parts by weight based on 100 parts by weight of siloxane resin or 100 parts by weight of the siloxane resin and the polyfunctional monomer having an unsaturated bond when the polyfunctional monomer having an unsaturated bond is used. May be included.
  • the polyfunctional monomer having the unsaturated bond may be included in an amount of more than 0 parts by weight and 100 parts by weight or less based on 100 parts by weight of the siloxane resin.
  • the organic solvent may be included in an amount of 20 to 90 parts by weight based on 100 parts by weight of the total photosensitive resin composition.
  • the light shielding layer containing the coating film formed from the photosensitive resin composition mentioned above is provided.
  • the light blocking layer may have an optical density in the range of 1.0 to 4.0 per unit ⁇ m.
  • (S1) applying a light-sensitive photosensitive resin composition corresponding to an aspect of the present invention to a substrate; (S2) removing the solvent in the composition to form a coating film; (S3) exposing and developing the coating film to form a coating film; And (S4) there is provided a method for manufacturing a light shielding layer coating film comprising the step of heat-treating the coating film at a temperature of 200 °C or more less than 300 °C.
  • step (S5) may further comprise the step of heat-treating the coating film at a temperature of 300 °C to 600 °C.
  • the pattern formation is possible by developing in aqueous alkali solution after exposure, and the shape of the pattern formed after the high temperature process of 300 degreeC or more after pattern formation is maintained.
  • the coating film formed by curing the light-sensitive photosensitive resin composition has electrical insulation properties of sheet resistance of 1.0E + 10 or more and dielectric constant of 45 or less, and has an optical density of 1.0 or more, preferably 1.0 to 4.0, per unit ⁇ m. Since lightness is maintained, it can be used as a light shielding film.
  • the photosensitive resin composition which concerns on one aspect of this invention is (A) the siloxane resin containing the polymerization unit represented by following formula (1) and the polymerization unit represented by following formula (2); (B) pigments; (C) photoinitiator; And (D) an organic solvent, and if necessary, (E) may further include a polyfunctional monomer having an unsaturated bond:
  • R 1 is a linear or branched alkylene group having 1 to 20 carbon atoms, an arylene group having 6 to 20 carbon atoms, an alkylene group having 7 to 20 carbon atoms substituted with an aryl group, and an arylene group having 7 to 20 carbon atoms substituted with an alkyl group. Or a group having 7 to 20 carbon atoms, in which an alkylene group and an arylene group are connected;
  • X is hydroxy, carboxylic acid, carboxylic anhydride, carboxylic anhydride derivative, imide, imide derivative, amide, amide derivative, amine or mercanto,
  • Each R 2 is independently hydrogen, a linear, branched or cyclic alkyl group having 1 to 20 carbon atoms, an aryl group having 6 to 10 carbon atoms, an unsaturated hydrocarbon group having 2 to 10 carbon atoms, or an acyloxy group having 2 to 10 carbon atoms, A plurality of R 2 in the molecule is the same or different from each other,
  • linear alkylene group having 1 to 20 carbon atoms examples include hydrocarbon groups such as methylene group, ethylene group, propylene group, butylene group, and pentylene group.
  • branched alkylene group examples include isopropylene group and isobutylene group. I can lift it.
  • n and n may be each independently an integer of 1 to 20.
  • a methyl group, an ethyl group, n-propyl group, isopropyl group, n-butyl group, isobutyl group, n-pentyl group, etc. are mentioned independently from each other, a C1-C20 aliphatic alkyl group, Specific examples of the cyclic aliphatic alkyl group include cyclopentyl group, cyclohexyl group, norbornyl group, adamantyl group, and the like.
  • acyloxy group having 2 to 10 carbon atoms include acryloxy methyl, acryloxy ethyl, acryloxy propyl, acryloxy butyl, methacryloxy methyl, methacryloxy ethyl, methacryloxy propyl, methacryloxy butyl and the like.
  • aryl group having 6 to 10 carbon atoms include phenyl group, naphthyl group, anthracenyl group, phenanthrenyl group, and pyrenyl group.
  • Examples of the monomer forming the polymerized unit represented by the formula (2) include tetraalkoxy silane, trialkoxy silane, methyl trialkoxy silane, ethyl trialkoxy silane, n-propyl trialkoxy silane, isopropyl trialkoxy silane, n-butyl Trialkoxy silane, tert-butyl trialkoxy silane, phenyl trialkoxy silane, naphtha trialkoxy silane, vinyl trialkoxy silane, methacryloxymethyl trialkoxy silane, 2-methacryloxyethyl trialkoxy silane, 3-methacryloxypropyl Trialkoxy silane, 3-methacryloxypropyl methyl dialkoxy silane, 3-methacryloxypropyl ethyl dialkoxy silane, acryloxymethyl trialkoxy silane, 2-acryloxyethyl trialkoxy silane, 3-acryloxypropyl trialkoxy silane , 3-acryloxypropyl methyl dialkoxy silane, 3-
  • At least one of the polymerized units represented by Formula 2 is methacryloxymethyl trialkoxy silane, 2-methacryloxyethyl trialkoxy silane, 3-methacryloxypropyl trialkoxy silane, 3- Methacryloxypropyl methyl dialkoxy silane, 3-methacryloxypropyl ethyl dialkoxy silane, acryloxymethyl trialkoxy silane, 2-acryloxyethyl trialkoxy silane, 3-acryloxypropyl trialkoxy silane, 3-acryloxypropyl Methyldiakoxy silane and 3-acryloxypropyl.
  • the (A) siloxane resin may have an acid value in the range of 10 ⁇ 200 mgKOH / g resin when KOH titration.
  • the interval between the carbon particles used as the pigment can be properly maintained even after a high temperature process of more than 300 °C can express a high electrical insulation properties.
  • the acid value of the siloxane resin is preferably 10 to 200 mg [KOH] per 1g of binder resin when titrated with 0.1N KOH solution.
  • the said (B) pigment is a pigment which has light-shielding property, Preferably it is a black pigment which has light-shielding property.
  • the pigment may be carbon black, titanium black, aniline black, perylene black, strontium titanate, chromium oxide, ceria and the like, depending on the characteristics, but is not limited thereto. Carbon black is preferred.
  • the carbon black As the carbon black, the Sisto series of East Sea Carbon, the diagram series of Mitsubishi Chemical, the MA series, the PRINTEX series of Daegu, the Raven series of Columbia Chemicals, etc. can be used.
  • the particle size of the pigment is preferably adjusted to 50 to 150 nm, more preferably 50 to 80 nm.
  • the pigment having a particle size of less than 50nm is dispersed in the photosensitive resin composition, even when the same amount of pigment is used, the optical density is lowered.
  • distributing the pigment which has particle size larger than 150 nm electrical insulation characteristic and the roughness characteristic of a coating film fall.
  • the pigment is used in an amount of 20 to 130 parts by weight based on 100 parts by weight of the siloxane resin, or 100 parts by weight of the siloxane resin and the polyfunctional monomer having an unsaturated bond when the polyfunctional monomer having an unsaturated bond is used.
  • the content may be different within the above numerical range.
  • the sensitivity of the photosensitive resin composition the electrical insulating properties and roughness of the coating film is improved, but it is difficult to expect an optical density of 1.0 or more per unit thickness ( ⁇ m).
  • an optical density of 4.0 or more per unit thickness ( ⁇ m) is satisfied, but the electrical insulating property is lowered, and the sensitivity of the photosensitive resin composition is lowered.
  • the photopolymerization initiator (C) is a substance that generates radicals by light to trigger crosslinking, and non-limiting examples are selected from the group consisting of triazine compounds, acetophenone compounds, biimidazole compounds, and oxime compounds. Preference is given to using at least one compound.
  • Non-limiting examples of the triazine-based compound include 2,4-bis (trichloromethyl) -6- (4-methoxyphenyl) -1,3,5-triazine, 2,4-bis (trichloromethyl ) -6- (4-methoxynaphthyl) -1,3,5-triazine, 2,4-bis (trichloromethyl) -6-piperonyl-1,3,5-triazine, 2, 4-bis (trichloromethyl) -6- [2- (5-methylfuran-2-yl) ethenyl] -1,3,5-triazine, 2,4-bis (trichloromethyl) -6- [2- (furan-2-yl) ethenyl] -1,3,5-triazine and the like, and as the acetophenone compound, 2-hydroxy-2-methyl-1-phenylpropan-1-one, 1 -(4-isopropylphenyl) -2-hydroxy-2-methylpropan
  • biimidazole-based compound examples include 2,2-bis (2-chlorophenyl) -4,4 ', 5,5'-tetraphenyl biimidazole, 2,2'-bis (o- Chlorophenyl) -4,4 ', 5,5'-tetraphenyl biimidazole, 2,2'-bis (o-chlorophenyl) -4,4', 5,5'-tetrakis (3,4, 5-trimethoxyphenyl) -1,2'-biimidazole, 2,2'-bis (2,3-dichlorophenyl) -4,4 ', 5,5'-tetraphenyl biimidazole, 2, 2'-bis (o-chlorophenyl) -4,4 ', 5,5'-tetraphenyl-1,2'-biimidazole.
  • oxime compounds include OXE-02 (trade name, BASF), N1919, NCI-831 (trade name, Adeca), 1,2-octadione-1- (4-phenylthio) phenyl- 2- (o-bonzoyloxime), ethanone-1- (9-ethyl) -6- (2-methylbenzoyl-3-yl) -1- (0-acetyloxime), and the like.
  • the photopolymerization initiator may be included in an amount of 1 to 30 parts by weight based on 100 parts by weight of 100 parts by weight of the siloxane resin or the polyfunctional monomer having the unsaturated bond when the polyfunctional monomer having the unsaturated bond is used.
  • the organic solvent can dissolve the components including the siloxane resin and can be used without limitation as long as it is a solvent that does not impair dispersibility of the pigment.
  • Specific examples include methyl ethyl ketone, methyl-n-propyl ketone, methyl isopropyl ketone, methyl-n-butyl ketone, methyl isobutyl ketone, methyl-n-pentyl ketone, diethyl ketone, dipropyl ketone, diiso Ketone solvents such as butyl ketone, cyclohexanone, cyclopentanone, methyl cyclohexanone, 2,4-pentanedione, acetonyl acetone, gamma-butyrolactone, and gamma-valerolactone; Methyl ethyl ether, methyl di-n-propyl ether, diisoprop
  • the content of the organic solvent may be appropriately adjusted according to the content of the siloxane resin, the pigment, the photopolymerization initiator and the polyfunctional monomer having an unsaturated bond, and the content is different depending on the method of applying the photosensitive resin composition for forming the light shielding layer to the substrate.
  • the total amount of the photosensitive resin composition may be used in an amount of 20 to 90 parts by weight of the organic solvent, but is not limited thereto.
  • the polyfunctional monomer having the above (E) unsaturated bond is a reactive unsaturated compound having at least one unsaturated polymerizable group in a molecule, and these compounds may be used alone or in combination of two or more thereof.
  • Non-limiting examples of the polyfunctional monomer having an unsaturated bond include ethylene glycol diacrylate, diethylene glycol diacrylate, triethylene glycol diacrylate, triethylene glycol dimethacrylate, 1,6-hexanediol diacryl Latex, pentaerythritol triacrylate, dipentaerythritol pentaacrylate, dipentaerythritol hexaacrylate, bisphenol A epoxy acrylate, ethylene glycol monomethyl ether acrylate, ethylene glycol dimethacrylate or 1,6 -Hexadiol dimethacrylate is mentioned.
  • the content of the polyfunctional monomer having an unsaturated bond is 0 to 200 parts by weight based on 100 parts by weight of the siloxane resin. If it exceeds 200 parts by weight, the compatibility with the siloxane resin and the carbon particles is lowered, it is difficult to control the pattern shape.
  • the polyfunctional monomer having an unsaturated bond may not be included in the photosensitive resin composition, but may be used for controlling the shape of the pattern, sensitivity, and the like.
  • the light-shielding photosensitive resin composition may further contain additives commonly used in the art, such as a curing accelerator, a thermal polymerization inhibitor, a plasticizer, a filler, a solvent, a leveling agent, and an antifoaming agent, as necessary.
  • additives commonly used in the art such as a curing accelerator, a thermal polymerization inhibitor, a plasticizer, a filler, a solvent, a leveling agent, and an antifoaming agent, as necessary.
  • the thermal polymerization inhibitor include hydroquinone, hydroquinone monomethyl ether, pyrogarol, tert-butylcatechol, phenodiazine, and the like
  • a plasticizer includes dibutyl phthalate, dioctylphthalate, and tricresyl.
  • the filler include glass fiber, silica, mica, alumina, and the like
  • examples of the antifoaming agent and leveling agent include silicone, fluorine and acryl compounds.
  • (S1) applying a light-sensitive photosensitive resin composition according to the invention on a substrate; (S2) removing the solvent in the composition to form a coating film; (S3) exposing and developing the coating film to form a coating film; And (S4) heat treating the coating film at a temperature of 200 ° C. or higher and less than 300 ° C.
  • (S5) may further comprise the step of heat-treating the coating film at a temperature of 300 °C to 600 °C.
  • a contact transfer type coating device such as a roll coater, a reverse coater, a bar coater or a spinner on a glass substrate having a clean surface having a thickness of 0.5 to 1.1 mm It can apply
  • a silane coupling agent may be blended or applied to the substrate.
  • the coating film thickness can be adjusted in the range of 0.5 to 5 ⁇ m.
  • active energy rays such as ultraviolet rays and excimer laser light can be exposed to a radiation energy dose of 30 to 2000 mJ / cm 2 through a negative mask.
  • the irradiation energy dose may be different depending on the kind of light-sensitive photosensitive composition to be used.
  • the coated film obtained by exposure is developed using the developing solution by the immersion method, the spray method, etc., and a black matrix pattern is formed.
  • a developing solution used for image development it is organic type, such as monoethanolamine, diethanolamine, and triethanolamine, and aqueous solution, such as sodium hydroxide, potassium hydroxide, sodium carbonate, ammonia, a quaternary ammonium salt, is mentioned.
  • (S4) may further comprise the step of heat-treating the coating film at a temperature of 200 °C or less than 300 °C, after the (S4) step, (S5) the coating film
  • the heat treatment may further include the step of heat treatment at a temperature of 300 ° C or more and 600 ° C or less.
  • Heat treatment in (S4) may be carried out for 5 to 60 minutes at a temperature of 200 °C or less than 300 °C, the heat treatment method at this time may use a conventional oven or the like, is not particularly limited.
  • the heat treatment in (S5) may be carried out for 5 to 60 minutes at a temperature of 300 ° C or more and 600 ° C or less
  • the heat treatment method may be a conventional method in the art, such as an oven, etc., is not particularly limited. .
  • the electric insulation property is reduced, and the electric insulation property is further reduced by the additional heat treatment at 300 ° C. or higher. .
  • the light shielding layer (black matrix) obtained by the above manufacturing method is useful for various display devices such as a liquid crystal panel and a plasma display panel.
  • the reaction temperature was raised to 85 ° C., and the reaction proceeded at the elevated temperature for 6 hours.
  • ether and water were added for extraction, the organic phase was recovered, and residual alcohol and solvent were evaporated to remove 657 g of siloxane resin.
  • the obtained siloxane resin is dissolved in 657 g of propylene glycol monomethyl ether acetate.
  • the weight average molecular weight of the siloxane resin was 4,800.
  • the reaction temperature was raised to 85 ° C., and the reaction proceeded at the elevated temperature for 6 hours.
  • ether and water were added for extraction, the organic phase was recovered, and residual alcohol and solvent were evaporated to remove 608 g of siloxane resin.
  • the obtained siloxane resin is dissolved in 608 g of propylene glycol monomethyl ether acetate.
  • the weight average molecular weight of the siloxane resin was 4,200.
  • siloxane resin is dissolved in 560 g of propylene glycol monomethyl ether acetate.
  • the weight average molecular weight of the siloxane resin was 3,800.
  • Alkali-soluble siloxane resin used in Example 5 relative to 100 parts by weight of the total resin composition (siloxane resin synthesized in Synthesis Example 2, phenyl / methyl / methacryl / propionic acid 30/30/20/20, Mw 3600, acid value 42 mg [ KOH] / g [resin]) 6 parts by weight, 6 parts by weight of dipentaerythritol hexaacrylate as a polyfunctional monomer having an unsaturated bond, 3.6 parts by weight of carbon black (100 nm particle size) (20% carbon black dispersion) 18 parts by weight in terms of dispersion of carbon black), ethanone-1- [9-ethyl-6- (2-methyl-4tetrahydropyranyloxybenzoyl) -9H-carbazol-3-yl] 1 part by weight of -1- (o-acetyloxime) (OXE-02, BASF) and 69 parts by weight of propylene glycol monomethyl ether
  • Alkali-soluble siloxane resin used in Example 5 relative to 100 parts by weight of the total resin composition (siloxane resin synthesized in Synthesis Example 2, phenyl / methyl / methacryl / propionic acid 30/30/20/20, Mw 3600, acid value 42 mg [ KOH] / g [resin]) 4 parts by weight, 4 parts by weight of dipentaerythritol hexaacrylate as a polyfunctional monomer having an unsaturated bond, 9.4 parts by weight of carbon black (100 nm particle size) (20% carbon black dispersion form) 47 parts by weight in terms of dispersion of carbon black), ethanone-1- [9-ethyl-6- (2-methyl-4tetrahydropyranyloxybenzoyl) -9H-carbazol-3-yl] 1 part by weight of -1- (o-acetyloxime) (OXE-02, BASF) and 44 parts by weight of propylene glycol monomethyl ether
  • Alkaline soluble cardo resin (Mw 5000, acid value 80 mg [KOH] / g [resin], Adeka) to 100 parts by weight of the total resin composition 4 parts by weight of dipentaerythritol hexaacrylate as a polyfunctional monomer having an unsaturated bond Parts by weight, carbon black (100 nm particle size) 9.4 parts by weight (used in the form of a dispersion of carbon black 20%.
  • the sheet resistance of the formed coating film was measured using a Keithley high resistance measuring instrument.
  • a coating film was formed on a glass substrate coated with ITO as a lower electrode, and an upper electrode was formed through aluminum deposition.
  • the dielectric constant was measured using Agilent's 4284 LCR meter.
  • the optical density O.D was measured using 361T of X-rite.
  • Pinhole measurement of the formed coating film was measured using an optical microscope to determine the number of 10cm x 10cm glass substrate.
  • the case where the number of pinholes is 0 to 10 is indicated by ⁇
  • the final cured specimen was scratched to expose the substrate with a crosshatch cutter and then removed by attaching a 3M adhesive tape.
  • the area of the removed area is then 0B if it exceeds 65% of the total test surface, 1B for 35-65%, 2B for 15-35%, 3B for 5-15%, 4B for less than 5%, 5B if no area was removed.
  • Example 1 Example 2
  • Example 3 Example 4
  • Example 5 bookbinder Synthesis Example 1 12 parts by weight of siloxane resin Synthesis Example 1 10 parts by weight of siloxane resin Synthesis Example 1 9 parts by weight of siloxane resin Synthesis Example 1 8 parts by weight of siloxane resin Synthesis Example 2 10 parts by weight of siloxane resin Unsaturated polyfunctional monomer - - - - 2 parts by weight Carbon Black Dispersion (20%, 100nm) 18 parts by weight 30 parts by weight 40 parts by weight 47 parts by weight 18 parts by weight Photopolymerization Initiator OXE-02 1 part by weight Organic solvent 69 parts by weight 59 parts by weight 50 parts by weight 44 parts by weight 69 parts by weight After heat treatment at 230 °C Sheet resistance ( ⁇ / ⁇ ) 3.23E + 17 5.6E + 17 4.3E + 17 8.7E + 16 8.2E + 16 permittivity 6.52 13.94 18.27 20.15 7.21 Optical Density (OD / ⁇ m) 1.
  • Examples 5 to 8 relates to a resin composition comprising dipentaerythritol hexaacrylate as a polyfunctional monomer having an unsaturated bond, and the lower the content of the siloxane resin as the content of the siloxane resin increases in the coating films prepared from Examples 5 to 8, respectively. It can be seen that the dielectric constant exhibits excellent electrical insulation.
  • Examples 5 and 8 were compared with Examples 1 and 4, Examples 5 and 8 replaced some of the siloxane resin contents in the resin compositions of Examples 1 and 4 with polyfunctional monomers having an unsaturated bond. It can be seen that the coating films formed from the examples 5 and 8 replaced in this way have an inferior electrical insulating effect than the coating films formed from the examples 1 and 4.
  • the coating film prepared from the resin composition of Comparative Example 1 using the cardo-based resin showed a significantly higher dielectric constant than the coating film prepared from the resin compositions of Examples 1 to 8, and appeared to have very inferior electrical insulating properties.
  • the coating film prepared in the present invention is excellent in electrical insulation, optical properties, adhesion, pattern resolution, sensitivity, etc. of the coating film even after a high temperature process of 380 °C is required to produce a high temperature
  • the light shielding layer including the coating layer may also exhibit excellent electrical insulation, optical characteristics, pattern resolution, and sensitivity as described above.

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Abstract

La présente invention concerne une composition de résine photosensible pour la protection contre la lumière, et une couche de protection contre la lumière formée à l'aide de cette composition. La composition de résine photosensible pour la protection contre la lumière contient (A) une résine de siloxane, (B) un pigment, (C) un initiateur de photopolymérisation, et (D) un solvant organique, et elle peut éventuellement contenir en outre (E) un monomère multifonctionnel ayant une liaison insaturée. Un film de revêtement pour une couche de protection contre la lumière formée à partir de la composition de résine photosensible pour la protection contre la lumière est caractérisé en ce qu'il possède d'excellentes caractéristiques électriques, une excellente résistance d'adhérence à un substrat, et en ce que sa densité optique n'est pas altérée, même après un traitement à haute température à 300 °C ou plus.
PCT/KR2015/006454 2014-06-27 2015-06-24 Composition de résine photosensible pour protection contre la lumière, et couche de protection contre la lumière formée à partir de cette composition WO2015199449A1 (fr)

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TWI554834B (zh) 2016-10-21
CN106462071A (zh) 2017-02-22

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