WO2015199449A1 - Photosensitive resin composition for light shielding and light-shielding layer formed therefrom - Google Patents

Abstract

The present invention relates to a photosensitive resin composition for light shielding, and a light-shielding layer formed using the same. The photosensitive resin composition for light shielding contains (A) a siloxane resin, (B) a pigment, (C) a photopolymerization initiator, and (D) an organic solvent, and optionally may further contain (E) a multi-functional monomer having an unsaturated bond. A coating film for a light shielding layer, formed of the photosensitive resin composition for light shielding, is characterized in that the coating film has excellent electrical characteristics, excellent adhesive strength with a substrate, and no deterioration in optical density, even after a high-temperature process at 300°C or higher.

Description

Light-sensitive photosensitive resin composition and light-shielding layer formed therefrom

The present invention relates to a light-sensitive photosensitive resin composition and a light shielding layer formed therefrom. More specifically, the present invention relates to a light shielding layer comprising a photosensitive resin composition which can be used to manufacture light shielding layers used for various electronic devices using photolithography and a coating film formed by curing the composition.

This application claims priority based on Korean Patent Application No. 10-2014-0079876 filed on June 27, 2014, and all the contents disclosed in the specification of the application are incorporated in this application.

As the manufacturing technology of electronic products such as flat panel display devices such as liquid crystal display devices and touch screen devices is developed, miniaturization and thinning of products are required. In order to miniaturize and thin a product, the degree of integration of the internal device of the product is essentially increased, and accordingly, the electrical performance of materials used for manufacturing the device is required to be further improved.

In general, the black matrix photosensitive resin composition is an essential material for the production of color filters included in display elements such as color filters, liquid crystal displays, organic electroluminescent devices, and display panels. In the color filter of the liquid crystal display device is used to prevent the mixing of R (red), G (green), B (blue), or in the touch panel device may be used for the bezel to cover the X, Y metal electrodes.

In display liquid crystal display devices, low temperature poly-silicon (LTPS) and oxide thin film transistors have been actively studied as devices for use in high-resolution driving over UD (Ultra Definition) and high speed of 240 Hz or more.

In general, since the oxide thin film transistor changes the properties of the semiconductor by light, the above-described problem is minimized by introducing a light blocking layer. The light shielding layer mainly uses a metal light shielding layer because a subsequent process such as PE-CVD is performed at a high temperature after formation of the light shielding layer, but the metal light shielding layer has high reflectivity and light is reflected between the source, drain electrode, and the light shielding layer. There is a problem that the parasitic voltage is generated between the source and drain electrodes to act as an element that resists the operation of the device and increases the load of the data line.

In addition, in the touch panel device, the OGS (One Glass Solution) method for forming a touch panel on the cover glass has been studied in a manner in which a conventional cover glass and a touch panel glass are bonded together for thinning of a product. In the OGS type touch panel, the first shading layer (bezel) formed on the cover glass is first formed, and then the touch panel driver is formed. A high deposition or annealing process is required in the process of forming the transparent electrode of the touch panel driver. However, the black matrix photosensitive resin used in the conventional light shielding layer has a problem in that electrical properties are degraded at such a high temperature process.

Accordingly, an object of the present invention is to provide a light-sensitive photosensitive resin composition such that even at high process temperatures, desired electrical properties such as resistance and dielectric constant, optical properties such as optical density and reflectivity can be obtained. .

In order to solve the above problems, in one aspect of the present invention, (A) a siloxane resin comprising a polymerized unit represented by the following formula (1) and a polymerized unit represented by the following formula (2); (B) pigments; (C) photoinitiator; And (D) there is provided a photosensitive resin composition comprising an organic solvent:

Formula 1

In Chemical Formula 1,

R ₁ is a linear or branched alkylene group having 1 to 20 carbon atoms, an arylene group having 6 to 20 carbon atoms, an alkylene group having 7 to 20 carbon atoms substituted with an aryl group, and an arylene group having 7 to 20 carbon atoms substituted with an alkyl group. Or a group having 7 to 20 carbon atoms, in which an alkylene group and an arylene group are connected;

X is hydroxy, carboxylic acid, carboxylic anhydride, carboxylic anhydride derivative, imide, imide derivative, amide, amide derivative, amine or mercanto,

Formula 2

In Chemical Formula 2,

Each R ₂ is independently hydrogen, a linear, branched or cyclic alkyl group having 1 to 20 carbon atoms, an aryl group having 6 to 10 carbon atoms, an unsaturated hydrocarbon group having 2 to 10 carbon atoms, or an acyloxy group having 2 to 10 carbon atoms, A plurality of R ₂ in the molecule is the same or different from each other,

n is an integer of 0 to 3, and a polymer unit having n = 3 may be used in combination with another polymer unit in which n is not 3.

The siloxane resin may be composed of 5 to 40 mol% of the polymerized units of Formula 1 and 95 to 60 mol% of the polymerized units of Formula 2 based on 100 mol% of the polymerized units of Formula 1 and the polymerized units of Formula 2.

The siloxane resin may have an acid value in the range of 10 to 200 mgKOH / g resin when titrating KOH.

The photosensitive resin composition may further include a polyfunctional monomer having an (E) unsaturated bond.

In addition, the pigment may be a black pigment.

In addition, the pigment may be one or a mixture of two or more selected from the group consisting of carbon black, titanium black, aniline black, perylene black, strontium titanate, chromium oxide and ceria.

In addition, the pigment may be included in an amount of 20 to 130 parts by weight based on 100 parts by weight of the siloxane resin or 100 parts by weight of the polyfunctional monomer having an unsaturated bond when the polyfunctional monomer having an unsaturated bond is used. Can be.

The photopolymerization initiator may be used in an amount of 1 to 30 parts by weight based on 100 parts by weight of siloxane resin or 100 parts by weight of the siloxane resin and the polyfunctional monomer having an unsaturated bond when the polyfunctional monomer having an unsaturated bond is used. May be included.

When the polyfunctional monomer having the unsaturated bond is used, the polyfunctional monomer may be included in an amount of more than 0 parts by weight and 100 parts by weight or less based on 100 parts by weight of the siloxane resin.

The organic solvent may be included in an amount of 20 to 90 parts by weight based on 100 parts by weight of the total photosensitive resin composition.

According to the other aspect of this invention, the light shielding layer containing the coating film formed from the photosensitive resin composition mentioned above is provided.

The light blocking layer may have an optical density in the range of 1.0 to 4.0 per unit μm.

According to another aspect of the invention, (S1) applying a light-sensitive photosensitive resin composition corresponding to an aspect of the present invention to a substrate; (S2) removing the solvent in the composition to form a coating film; (S3) exposing and developing the coating film to form a coating film; And (S4) there is provided a method for manufacturing a light shielding layer coating film comprising the step of heat-treating the coating film at a temperature of 200 ℃ or more less than 300 ℃.

In addition, after the step (S4), (S5) may further comprise the step of heat-treating the coating film at a temperature of 300 ℃ to 600 ℃.

According to the light-sensitive photosensitive resin composition which concerns on one aspect of this invention, the pattern formation is possible by developing in aqueous alkali solution after exposure, and the shape of the pattern formed after the high temperature process of 300 degreeC or more after pattern formation is maintained.

In addition, the coating film formed by curing the light-sensitive photosensitive resin composition has electrical insulation properties of sheet resistance of 1.0E + 10 or more and dielectric constant of 45 or less, and has an optical density of 1.0 or more, preferably 1.0 to 4.0, per unit μm. Since lightness is maintained, it can be used as a light shielding film.

Hereinafter, the present invention will be described in detail. The terms or words used in this specification and claims are not to be construed as limiting in their usual or dictionary meanings, and the inventors may appropriately define the concept of terms in order to best explain their invention in the best way possible. It should be interpreted as meaning and concept corresponding to the technical idea of the present invention based on the principle that the present invention.

The photosensitive resin composition which concerns on one aspect of this invention is (A) the siloxane resin containing the polymerization unit represented by following formula (1) and the polymerization unit represented by following formula (2); (B) pigments; (C) photoinitiator; And (D) an organic solvent, and if necessary, (E) may further include a polyfunctional monomer having an unsaturated bond:

[Formula 1]

In Chemical Formula 1,

R ₁ is a linear or branched alkylene group having 1 to 20 carbon atoms, an arylene group having 6 to 20 carbon atoms, an alkylene group having 7 to 20 carbon atoms substituted with an aryl group, and an arylene group having 7 to 20 carbon atoms substituted with an alkyl group. Or a group having 7 to 20 carbon atoms, in which an alkylene group and an arylene group are connected;

X is hydroxy, carboxylic acid, carboxylic anhydride, carboxylic anhydride derivative, imide, imide derivative, amide, amide derivative, amine or mercanto,

[Formula 2]

In Chemical Formula 2,

Each R ₂ is independently hydrogen, a linear, branched or cyclic alkyl group having 1 to 20 carbon atoms, an aryl group having 6 to 10 carbon atoms, an unsaturated hydrocarbon group having 2 to 10 carbon atoms, or an acyloxy group having 2 to 10 carbon atoms, A plurality of R ₂ in the molecule is the same or different from each other,

n is an integer of 0 to 3, and a polymer unit having n = 3 may be used in combination with another polymer unit in which n is not 3.

Non-limiting examples of R ₁ ,

Examples of the linear alkylene group having 1 to 20 carbon atoms include hydrocarbon groups such as methylene group, ethylene group, propylene group, butylene group, and pentylene group. Examples of the branched alkylene group include isopropylene group and isobutylene group. I can lift it.

Specific examples of the polymerized unit represented by Chemical Formula 1 are shown below, but are not limited thereto.

[Formula 1a]

[Formula 1b]

[Formula 1c]

[Formula 1d]

[Formula 1e]

[Formula 1f]

[Formula 1g]

[Formula 1h]

Formula 1i]

[Formula 1j]

[Formula 1k]

[Formula 1l]

[Formula 1m]

[Formula 1n]

(In each of the above formula, m and n may be each independently an integer of 1 to 20.)

As a specific example of said R <_2> , a methyl group, an ethyl group, n-propyl group, isopropyl group, n-butyl group, isobutyl group, n-pentyl group, etc. are mentioned independently from each other, a C1-C20 aliphatic alkyl group, Specific examples of the cyclic aliphatic alkyl group include cyclopentyl group, cyclohexyl group, norbornyl group, adamantyl group, and the like. Specific examples of the acyloxy group having 2 to 10 carbon atoms include acryloxy methyl, acryloxy ethyl, acryloxy propyl, acryloxy butyl, methacryloxy methyl, methacryloxy ethyl, methacryloxy propyl, methacryloxy butyl and the like. have. Specific examples of the aryl group having 6 to 10 carbon atoms include phenyl group, naphthyl group, anthracenyl group, phenanthrenyl group, and pyrenyl group.

Examples of the monomer forming the polymerized unit represented by the formula (2) include tetraalkoxy silane, trialkoxy silane, methyl trialkoxy silane, ethyl trialkoxy silane, n-propyl trialkoxy silane, isopropyl trialkoxy silane, n-butyl Trialkoxy silane, tert-butyl trialkoxy silane, phenyl trialkoxy silane, naphtha trialkoxy silane, vinyl trialkoxy silane, methacryloxymethyl trialkoxy silane, 2-methacryloxyethyl trialkoxy silane, 3-methacryloxypropyl Trialkoxy silane, 3-methacryloxypropyl methyl dialkoxy silane, 3-methacryloxypropyl ethyl dialkoxy silane, acryloxymethyl trialkoxy silane, 2-acryloxyethyl trialkoxy silane, 3-acryloxypropyl trialkoxy silane , 3-acryloxypropyl methyl dialkoxy silane, 3-acryloxypropyl ethyl dialkoxy silane, 3-glycidyloxy Lopyl trialkoxy silane, 2-epoxycyclohexylethyl trialkoxy silane, 3-epoxycyclohexylpropyl trialkoxy silane, dimethyl alkoxy silane, diethyl dialkoxy silane, dipropyl dialkoxy silane, diphenyl dialkoxy silane, diphenyl silane Diols, phenylmethyl dialkoxysilanes and the like may be used, but are not limited thereto. Here, alkoxy is linear, branched or cyclic aliphatic or aromatic alkoxy having 1 to 7 carbon atoms, and may be a halogen compound capable of hydrolysis.

In the present invention, preferably, at least one of the polymerized units represented by Formula 2 is methacryloxymethyl trialkoxy silane, 2-methacryloxyethyl trialkoxy silane, 3-methacryloxypropyl trialkoxy silane, 3- Methacryloxypropyl methyl dialkoxy silane, 3-methacryloxypropyl ethyl dialkoxy silane, acryloxymethyl trialkoxy silane, 2-acryloxyethyl trialkoxy silane, 3-acryloxypropyl trialkoxy silane, 3-acryloxypropyl Methyldiakoxy silane and 3-acryloxypropyl.

The (A) siloxane resin may have an acid value in the range of 10 ~ 200 mgKOH / g resin when KOH titration.

When using the siloxane resin, due to the thermal stability of the siloxane resin, the interval between the carbon particles used as the pigment can be properly maintained even after a high temperature process of more than 300 ℃ can express a high electrical insulation properties.

The acid value of the siloxane resin is preferably 10 to 200 mg [KOH] per 1g of binder resin when titrated with 0.1N KOH solution.

When the acid value of the siloxane resin is less than 10 mg [KOH] / g [resin], developability of the photosensitive resin is insufficient, the residual film is generated, and when larger than 200 mg [KOH] / g [resin] pattern loss, etc. Problem occurs.

The said (B) pigment is a pigment which has light-shielding property, Preferably it is a black pigment which has light-shielding property. Non-limiting examples of the pigment may be carbon black, titanium black, aniline black, perylene black, strontium titanate, chromium oxide, ceria and the like, depending on the characteristics, but is not limited thereto. Carbon black is preferred.

As the carbon black, the Sisto series of East Sea Carbon, the diagram series of Mitsubishi Chemical, the MA series, the PRINTEX series of Daegu, the Raven series of Columbia Chemicals, etc. can be used.

The particle size of the pigment is preferably adjusted to 50 to 150 nm, more preferably 50 to 80 nm. When the pigment having a particle size of less than 50nm is dispersed in the photosensitive resin composition, even when the same amount of pigment is used, the optical density is lowered. Moreover, when disperse | distributing the pigment which has particle size larger than 150 nm, electrical insulation characteristic and the roughness characteristic of a coating film fall.

The pigment is used in an amount of 20 to 130 parts by weight based on 100 parts by weight of the siloxane resin, or 100 parts by weight of the siloxane resin and the polyfunctional monomer having an unsaturated bond when the polyfunctional monomer having an unsaturated bond is used. Depending on the application, the content may be different within the above numerical range. When the pigment is used in less than 20 parts by weight, the sensitivity of the photosensitive resin composition, the electrical insulating properties and roughness of the coating film is improved, but it is difficult to expect an optical density of 1.0 or more per unit thickness (μm). In addition, when the content of the pigment is more than 130 parts by weight, an optical density of 4.0 or more per unit thickness (μm) is satisfied, but the electrical insulating property is lowered, and the sensitivity of the photosensitive resin composition is lowered.

The photopolymerization initiator (C) is a substance that generates radicals by light to trigger crosslinking, and non-limiting examples are selected from the group consisting of triazine compounds, acetophenone compounds, biimidazole compounds, and oxime compounds. Preference is given to using at least one compound.

Non-limiting examples of the triazine-based compound include 2,4-bis (trichloromethyl) -6- (4-methoxyphenyl) -1,3,5-triazine, 2,4-bis (trichloromethyl ) -6- (4-methoxynaphthyl) -1,3,5-triazine, 2,4-bis (trichloromethyl) -6-piperonyl-1,3,5-triazine, 2, 4-bis (trichloromethyl) -6- [2- (5-methylfuran-2-yl) ethenyl] -1,3,5-triazine, 2,4-bis (trichloromethyl) -6- [2- (furan-2-yl) ethenyl] -1,3,5-triazine and the like, and as the acetophenone compound, 2-hydroxy-2-methyl-1-phenylpropan-1-one, 1 -(4-isopropylphenyl) -2-hydroxy-2-methylpropan-1-one, 4- (2-hydroxyethoxy) -phenyl- (2-hydroxy-2-propyl) ketone, 1- Hydroxycyclohexylphenyl ketone, benzoin methyl ether, benzoin ethyl ether, benzoin isobutyl ether, benzoin butyl ether, 2,2-dimethoxy-2-phenylacetophenone, 2-methyl- (4-methylthio ) Phenyl-2-morpholino-1-propane-1-one, 2-benzyl-2-dimethylamino-1- (4-morpholinophenyl) -butan-1-one, 2- (4-bromo-benzyl-2-dimethylamino-1- (4-morpholinophenyl) -butan-1-one, 2-methyl -1- [4- (methylthio) phenyl] -2-morpholinopropane-1-one, and the like.

In addition, non-limiting examples of the biimidazole-based compound include 2,2-bis (2-chlorophenyl) -4,4 ', 5,5'-tetraphenyl biimidazole, 2,2'-bis (o- Chlorophenyl) -4,4 ', 5,5'-tetraphenyl biimidazole, 2,2'-bis (o-chlorophenyl) -4,4', 5,5'-tetrakis (3,4, 5-trimethoxyphenyl) -1,2'-biimidazole, 2,2'-bis (2,3-dichlorophenyl) -4,4 ', 5,5'-tetraphenyl biimidazole, 2, 2'-bis (o-chlorophenyl) -4,4 ', 5,5'-tetraphenyl-1,2'-biimidazole.

In addition, non-limiting examples of oxime compounds include OXE-02 (trade name, BASF), N1919, NCI-831 (trade name, Adeca), 1,2-octadione-1- (4-phenylthio) phenyl- 2- (o-bonzoyloxime), ethanone-1- (9-ethyl) -6- (2-methylbenzoyl-3-yl) -1- (0-acetyloxime), and the like.

The photopolymerization initiator may be included in an amount of 1 to 30 parts by weight based on 100 parts by weight of 100 parts by weight of the siloxane resin or the polyfunctional monomer having the unsaturated bond when the polyfunctional monomer having the unsaturated bond is used.

In the photosensitive resin composition of this invention, (D) The organic solvent can dissolve the components including the siloxane resin and can be used without limitation as long as it is a solvent that does not impair dispersibility of the pigment. Specific examples include methyl ethyl ketone, methyl-n-propyl ketone, methyl isopropyl ketone, methyl-n-butyl ketone, methyl isobutyl ketone, methyl-n-pentyl ketone, diethyl ketone, dipropyl ketone, diiso Ketone solvents such as butyl ketone, cyclohexanone, cyclopentanone, methyl cyclohexanone, 2,4-pentanedione, acetonyl acetone, gamma-butyrolactone, and gamma-valerolactone; Methyl ethyl ether, methyl di-n-propyl ether, diisopropyl ether, tetrahydrofuran, methyl tetrahydrofuran, ethylene glycol dimethyl ether, ethylene glycol ether, ethylene glycol dibutyl ether, diethylene glycol methyl ethyl ether, triethylene Glycol dimethyl ether, triethylene glycol ether, triethylene glycol methyl ethyl ether, propylene glycol dimethyl ether, propylene glycol ether, propylene glycol-n-propyl ether, propylene glycol dibutyl ether, ethylene glycol methyl ether, ethylene glycol ethyl ether, di Ether solvents such as ethylene glycol monomethyl ether, diethylene glycol ethyl ether, and propylene glycol monomethyl ether; Ether acetates such as ethylene glycol methyl ether propionate, ethylene glycol ethyl ether propionate, ethylene glycol methyl ether acetate, ethylene glycol ethyl ether acetate, propylene glycol methyl ether acetate propylene glycol ethyl ether acetate, propylene glycol propyl ether acetate acetate) solvents, acetonitrile, N-methyl pyrrolidinone, N-ethyl pyrrolidinone, N-propyl pyrrolidinone, N, N-dimethyl formamide, N, N-dimethyl acetamide, N, N-dimethyl Sulfoxide, toluene, xylene and the like, methanol, ethanol, n-propanol, isopropanol, n-butanol, isobutanol, cyclohexanol, methyl cyclohexanol, benzyl alcohol, ethylene glycol, 1,2-propylene glycol, di Alcohol solvents such as ethylene glycol, etc. may be used alone or in combination of two or more thereof. But it can be used, but is not limited to it.

The content of the organic solvent may be appropriately adjusted according to the content of the siloxane resin, the pigment, the photopolymerization initiator and the polyfunctional monomer having an unsaturated bond, and the content is different depending on the method of applying the photosensitive resin composition for forming the light shielding layer to the substrate. . For example, the total amount of the photosensitive resin composition may be used in an amount of 20 to 90 parts by weight of the organic solvent, but is not limited thereto.

The polyfunctional monomer having the above (E) unsaturated bond is a reactive unsaturated compound having at least one unsaturated polymerizable group in a molecule, and these compounds may be used alone or in combination of two or more thereof.

Non-limiting examples of the polyfunctional monomer having an unsaturated bond include ethylene glycol diacrylate, diethylene glycol diacrylate, triethylene glycol diacrylate, triethylene glycol dimethacrylate, 1,6-hexanediol diacryl Latex, pentaerythritol triacrylate, dipentaerythritol pentaacrylate, dipentaerythritol hexaacrylate, bisphenol A epoxy acrylate, ethylene glycol monomethyl ether acrylate, ethylene glycol dimethacrylate or 1,6 -Hexadiol dimethacrylate is mentioned.

The content of the polyfunctional monomer having an unsaturated bond is 0 to 200 parts by weight based on 100 parts by weight of the siloxane resin. If it exceeds 200 parts by weight, the compatibility with the siloxane resin and the carbon particles is lowered, it is difficult to control the pattern shape.

Since the unsaturated resin is contained in the binder resin, the polyfunctional monomer having an unsaturated bond may not be included in the photosensitive resin composition, but may be used for controlling the shape of the pattern, sensitivity, and the like.

In addition, the light-shielding photosensitive resin composition may further contain additives commonly used in the art, such as a curing accelerator, a thermal polymerization inhibitor, a plasticizer, a filler, a solvent, a leveling agent, and an antifoaming agent, as necessary. Examples of the thermal polymerization inhibitor include hydroquinone, hydroquinone monomethyl ether, pyrogarol, tert-butylcatechol, phenodiazine, and the like, and a plasticizer includes dibutyl phthalate, dioctylphthalate, and tricresyl. Examples of the filler include glass fiber, silica, mica, alumina, and the like, and examples of the antifoaming agent and leveling agent include silicone, fluorine and acryl compounds.

Looking at one aspect for forming a light shielding layer (black matrix) using the photosensitive resin composition, (S1) applying a light-sensitive photosensitive resin composition according to the invention on a substrate; (S2) removing the solvent in the composition to form a coating film; (S3) exposing and developing the coating film to form a coating film; And (S4) heat treating the coating film at a temperature of 200 ° C. or higher and less than 300 ° C. In addition, after the step (S4), (S5) may further comprise the step of heat-treating the coating film at a temperature of 300 ℃ to 600 ℃.

(S1) Looking at an example of a process of applying the light-shielding photosensitive resin composition to a substrate, a contact transfer type coating device such as a roll coater, a reverse coater, a bar coater or a spinner on a glass substrate having a clean surface having a thickness of 0.5 to 1.1 mm It can apply | coat using a non-contact type coating apparatus, such as a (rotary coating apparatus) and a curtain flow coater.

In the preparation and coating, in order to improve the adhesion between the glass substrate and the photosensitive resin composition, a silane coupling agent may be blended or applied to the substrate.

Thereafter, (S2) a solvent in the composition is removed to form a coating film.

To this end, it is dried with a hot plate at a temperature of 80 ° C to 120 ° C, preferably 90 ° C to 100 ° C for 60 seconds to 120 seconds, or left at room temperature for several hours to several days, or for several ten minutes in a warm air heater or an infrared heater. After removing a solvent for several hours, the coating film thickness can be adjusted in the range of 0.5 to 5 µm.

Thereafter, (S3) the coating film is exposed and developed to form a coating film.

As a non-limiting example, active energy rays such as ultraviolet rays and excimer laser light can be exposed to a radiation energy dose of 30 to 2000 mJ / cm 2 through a negative mask. The irradiation energy dose may be different depending on the kind of light-sensitive photosensitive composition to be used. The coated film obtained by exposure is developed using the developing solution by the immersion method, the spray method, etc., and a black matrix pattern is formed. As a developing solution used for image development, it is organic type, such as monoethanolamine, diethanolamine, and triethanolamine, and aqueous solution, such as sodium hydroxide, potassium hydroxide, sodium carbonate, ammonia, a quaternary ammonium salt, is mentioned.

In addition, in one aspect of the manufacturing method of the present invention, (S4) may further comprise the step of heat-treating the coating film at a temperature of 200 ℃ or less than 300 ℃, after the (S4) step, (S5) the coating film The heat treatment may further include the step of heat treatment at a temperature of 300 ° C or more and 600 ° C or less.

Heat treatment in (S4) may be carried out for 5 to 60 minutes at a temperature of 200 ℃ or less than 300 ℃, the heat treatment method at this time may use a conventional oven or the like, is not particularly limited.

In addition, the heat treatment in (S5) may be carried out for 5 to 60 minutes at a temperature of 300 ° C or more and 600 ° C or less, the heat treatment method may be a conventional method in the art, such as an oven, etc., is not particularly limited. .

In general, in the coating film prepared by performing an additional heat treatment at 200 ° C. or higher and a light shielding layer including the same, the electric insulation property is reduced, and the electric insulation property is further reduced by the additional heat treatment at 300 ° C. or higher. . This is due to the conductive properties of pigments such as carbon black. When the heat treatment temperature is increased in the manufacturing process of the coating film, the resin surrounding the pigment deteriorates and the separation distance between the pigments decreases, so that the conductivity increases. Insulation characteristics will fall.

However, when manufacturing a coating film by the photosensitive resin composition which concerns on one aspect of this invention, even if it heat-processes at 200 degreeC or more, even at 300 degreeC or more, the coating film which has the outstanding electrical insulation characteristic can be obtained, Electrical insulation properties of the light shielding layer to be included are also improved.

The light shielding layer (black matrix) obtained by the above manufacturing method is useful for various display devices such as a liquid crystal panel and a plasma display panel.

Hereinafter, the present invention will be described in detail with reference to Examples. However, embodiments according to the present invention can be modified in many different forms, the scope of the present invention should not be construed as limited to the embodiments described below. The embodiments of the present invention are provided to more completely explain the present invention to those skilled in the art.

<Synthesis of siloxane resin>

Synthesis Example 1

250 g (1.0 mol) of methyl 3- (triethoxysilyl) propionate (also referred to as 'propionic acid') in a flask equipped with a cooling tube and a stirrer, phenyl trimethoxy silane 198 g (1.0 mol), methyl trimethoxy silane (hereinafter also referred to as 'methyl') 136 g (1.0 mol), methacryloxypropyltrimethoxysilane (hereinafter also referred to as 'methacryl') 497 g (2.0 mol), 2000 g of propylene glycol monomethyl ether acetate are quantified, the solution is stirred, and a mixture of 13.0 g (0.125 mol) of 35% aqueous hydrochloric acid solution and 270 g of water is added dropwise. After completion of the dropwise addition, the reaction temperature was raised to 85 ° C., and the reaction proceeded at the elevated temperature for 6 hours. After completion of the reaction, ether and water were added for extraction, the organic phase was recovered, and residual alcohol and solvent were evaporated to remove 657 g of siloxane resin. The obtained siloxane resin is dissolved in 657 g of propylene glycol monomethyl ether acetate. The weight average molecular weight of the siloxane resin was 4,800.

Synthesis Example 2

250 g (1.0 mol) of methyl 3- (triethoxysilyl) propionate, 297 g (1.5 mol) of phenyl trimethoxy silane, methyl trimeth in a flask equipped with a cooling tube and a stirrer 204 g (1.5 mol) of methoxy silane, 248 g (1.0 mol) of methacryloxypropyltrimethoxysilane, 2000 g of propylene glycol monomethyl ether acetate are quantified, the solution is stirred, and 13.0 g (0.125 mol) of 35% aqueous hydrochloric acid solution And 270 g mixture of water is added dropwise. After completion of the dropwise addition, the reaction temperature was raised to 85 ° C., and the reaction proceeded at the elevated temperature for 6 hours. After completion of the reaction, ether and water were added for extraction, the organic phase was recovered, and residual alcohol and solvent were evaporated to remove 608 g of siloxane resin. The obtained siloxane resin is dissolved in 608 g of propylene glycol monomethyl ether acetate. The weight average molecular weight of the siloxane resin was 4,200.

Synthesis Example 3

264 g (1.0 mol) of methyl 3- (triethoxysilyl) propionate, 396 g (2.0 mol) of phenyl trimethoxy silane, methyl trimeth in a flask equipped with a cooling tube and a stirrer 272 g (2.0 mol) of oxy silane, 2000 g of propylene glycol monomethyl ether acetate are quantified, the solution is stirred, and a mixture of 13.0 g (0.125 mol) of 35% aqueous hydrochloric acid solution and 270 g of water is added dropwise. After completion of the dropwise addition, the reaction temperature was raised to 85 ° C., and the reaction proceeded at the elevated temperature for 6 hours. After the completion of the reaction, the mixture was extracted with ether and water, and the organic phase was recovered. The remaining alcohol and solvent were evaporated to remove 560 g of siloxane resin. The obtained siloxane resin is dissolved in 560 g of propylene glycol monomethyl ether acetate. The weight average molecular weight of the siloxane resin was 3,800.

<Production of Photosensitive Resin for Black Matrix>

Example 1

Alkali-soluble siloxane resin (siloxane resin synthesized in Synthesis Example 1, phenyl / methyl / methacryl / propionic acid = 20/20/40/20, Mw 4800, acid value 36 mg [KOH] / g [%] by weight of the total resin composition) resin]) 12 parts by weight, 3.6 parts by weight of carbon black (100 nm particle size) (used in the form of a dispersion of carbon black 20%. 18 parts by weight in terms of dispersion of carbon black), ethanone-1- [9-ethyl -6- (2-methyl-4tetrahydropyranyloxybenzoyl) -9H-carbazol-3-yl] -1- (o-acetyloxime) (OXE-02, BASF) 1 part by weight, propylene as an organic solvent 69 parts by weight of glycol monomethyl ether acetate were mixed to prepare a photosensitive resin composition.

Example 2

Alkali-soluble siloxane resin used in Example 1 relative to 100 parts by weight of the total resin composition (siloxane resin synthesized in Synthesis Example 1, phenyl / methyl / methacryl / propionic acid = 20/20/40/20, Mw 4800, acid value 36 mg [ 10 parts by weight of KOH] / g [resin]), 6 parts by weight of carbon black (100 nm particle size) (used in the form of a dispersion containing 20% of carbon black, 30 parts by weight in terms of dispersion of carbon black), ethanone-1 1 part by weight of-[9-ethyl-6- (2-methyl-4tetrahydropyranyloxybenzoyl) -9H-carbazol-3-yl] -1- (o-acetyloxime) (OXE-02, BASF) And 59 parts by weight of propylene glycol monomethyl ether acetate was mixed with an organic solvent to prepare a photosensitive resin composition.

Example 3

Alkali-soluble siloxane resin used in Example 1 relative to 100 parts by weight of the total resin composition (siloxane resin synthesized in Synthesis Example 1, phenyl / methyl / methacryl / propionic acid = 20/20/40/20, Mw 4800, acid value 36 mg [ KOH] / g [resin]) 9 parts by weight, carbon black (100 nm particle size) 8 parts by weight (used in the form of a dispersion containing 20% of carbon black. 40 parts by weight in terms of dispersion of carbon black), ethanone-1 1 part by weight of-[9-ethyl-6- (2-methyl-4tetrahydropyranyloxybenzoyl) -9H-carbazol-3-yl] -1- (o-acetyloxime) (OXE-02, BASF) , 50 parts by weight of propylene glycol monomethyl ether acetate was mixed with an organic solvent to prepare a photosensitive resin composition.

Example 4

Alkali-soluble siloxane resin used in Example 1 relative to 100 parts by weight of the total resin composition (siloxane resin synthesized in Synthesis Example 1, phenyl / methyl / methacryl / propionic acid = 20/20/40/20, Mw 4800, acid value 36 mg [ KOH] / g [resin]) 8 parts by weight, carbon black (100 nm particle size) 9.4 parts by weight (used in the form of a dispersion of carbon black 20%, 47 parts by weight in terms of carbon black dispersion), ethanone-1 1 part by weight of-[9-ethyl-6- (2-methyl-4tetrahydropyranyloxybenzoyl) -9H-carbazol-3-yl] -1- (o-acetyloxime) (OXE-02, BASF) , 44 parts by weight of propylene glycol monomethyl ether acetate was mixed with an organic solvent to prepare a photosensitive resin composition.

Example 5

Alkali-soluble siloxane resin (siloxane resin synthesized in Synthesis Example 2, phenyl / methyl / methacryl / propionic acid = 30/30/20/20, Mw 3600, acid value 42 mg [KOH] / g [%] by weight of the total resin composition) resin]) 10 parts by weight, polyfunctional monomer having an unsaturated bond, 2 parts by weight of dipentaerythritol hexaacrylate, 3.6 parts by weight of carbon black (100 nm particle size) (used in the form of a dispersion containing 20% of carbon black. 18 parts by weight), ethanone-1- [9-ethyl-6- (2-methyl-4tetrahydropyranyloxybenzoyl) -9H-carbazol-3-yl] -1- (o -Acetyloxime) (OXE-02, BASF) 1 part by weight, 69 parts by weight of propylene glycol monomethyl ether acetate were mixed with an organic solvent to prepare a photosensitive resin composition.

Example 6

Alkali-soluble siloxane resin used in Example 5 relative to 100 parts by weight of the total resin composition (siloxane resin synthesized in Synthesis Example 2, phenyl / methyl / methacryl / propionic acid = 30/30/20/20, Mw 3600, acid value 42 mg [ KOH] / g [resin]) 8 parts by weight, 4 parts by weight of dipentaerythritol hexaacrylate as a polyfunctional monomer having an unsaturated bond, 3.6 parts by weight of carbon black (100 nm particle size) (20% carbon black dispersion) 18 parts by weight in terms of dispersion of carbon black), ethanone-1- [9-ethyl-6- (2-methyl-4tetrahydropyranyloxybenzoyl) -9H-carbazol-3-yl] 1 part by weight of -1- (o-acetyloxime) (OXE-02, BASF) and 69 parts by weight of propylene glycol monomethyl ether acetate were mixed with an organic solvent to prepare a photosensitive resin composition.

Example 7

Alkali-soluble siloxane resin used in Example 5 relative to 100 parts by weight of the total resin composition (siloxane resin synthesized in Synthesis Example 2, phenyl / methyl / methacryl / propionic acid = 30/30/20/20, Mw 3600, acid value 42 mg [ KOH] / g [resin]) 6 parts by weight, 6 parts by weight of dipentaerythritol hexaacrylate as a polyfunctional monomer having an unsaturated bond, 3.6 parts by weight of carbon black (100 nm particle size) (20% carbon black dispersion) 18 parts by weight in terms of dispersion of carbon black), ethanone-1- [9-ethyl-6- (2-methyl-4tetrahydropyranyloxybenzoyl) -9H-carbazol-3-yl] 1 part by weight of -1- (o-acetyloxime) (OXE-02, BASF) and 69 parts by weight of propylene glycol monomethyl ether acetate were mixed with an organic solvent to prepare a photosensitive resin composition.

Example 8

Alkali-soluble siloxane resin used in Example 5 relative to 100 parts by weight of the total resin composition (siloxane resin synthesized in Synthesis Example 2, phenyl / methyl / methacryl / propionic acid = 30/30/20/20, Mw 3600, acid value 42 mg [ KOH] / g [resin]) 4 parts by weight, 4 parts by weight of dipentaerythritol hexaacrylate as a polyfunctional monomer having an unsaturated bond, 9.4 parts by weight of carbon black (100 nm particle size) (20% carbon black dispersion form) 47 parts by weight in terms of dispersion of carbon black), ethanone-1- [9-ethyl-6- (2-methyl-4tetrahydropyranyloxybenzoyl) -9H-carbazol-3-yl] 1 part by weight of -1- (o-acetyloxime) (OXE-02, BASF) and 44 parts by weight of propylene glycol monomethyl ether acetate were mixed with an organic solvent to prepare a photosensitive resin composition.

Comparative Example 1

Alkaline soluble cardo resin (Mw 5000, acid value 80 mg [KOH] / g [resin], Adeka) to 100 parts by weight of the total resin composition 4 parts by weight of dipentaerythritol hexaacrylate as a polyfunctional monomer having an unsaturated bond Parts by weight, carbon black (100 nm particle size) 9.4 parts by weight (used in the form of a dispersion of carbon black 20%. 47 parts by weight in terms of carbon black dispersion), ethanone-1- [9-ethyl-6- ( 2-methyl-4tetrahydropyranyloxybenzoyl) -9H-carbazol-3-yl] -1- (o-acetyloxime) (OXE-02, BASF) 1 part by weight, propylene glycol mono as organic solvent 44 parts by weight of methyl ether acetate was mixed to prepare a photosensitive resin composition.

Comparative Example 2

Alkali-soluble siloxane resin relative to 100 parts by weight of the total resin composition (siloxane resin synthesized in Synthesis Example 3, phenyl / methyl / propionic acid = 40/40/20, Mw 3800, acid value 40 mg [KOH] / g [resin]) 4 Parts by weight, polyfunctional monomer having an unsaturated bond, 4 parts by weight of dipentaerythritol hexaacrylate, 9.4 parts by weight of carbon black (100 nm particle size) (used in the form of a dispersion containing 20% of carbon black. 47 parts by weight), ethanone-1- [9-ethyl-6- (2-methyl-4tetrahydropyranyloxybenzoyl) -9H-carbazol-3-yl] -1- (o-acetyloxime) (OXE-02, BASF) 1 part by weight, 44 parts by weight of propylene glycol monomethyl ether acetate were mixed with a solvent to prepare a photosensitive resin composition.

Experimental Example

After spin-coating the light-shielding (black matrix) photosensitive resin composition prepared in Examples and Comparative Examples to a glass substrate for LCD-panel to a thickness of 1.2 micrometers, soft-baking at 100 ℃ to remove the solvent and apply A film was formed. The formed coating film was exposed and developed with aqueous alkali solution to form a coating film. After the glass substrate on which the coating film was formed was heat treated in an oven at 230 ° C. for 30 minutes to obtain a final coating film, the sheet resistance, dielectric constant, optical density, pinhole, and adhesive force were measured, and the evaluation was performed by heat-treating again at 380 ° C. for 30 minutes. The results are shown in Table 1 and Table 2.

Sheet resistance measurement

In order to measure the sheet resistance of the formed coating film, the sheet resistance was measured using a Keithley high resistance measuring instrument.

Permittivity measurement

In order to measure the dielectric constant of the formed coating film, a coating film was formed on a glass substrate coated with ITO as a lower electrode, and an upper electrode was formed through aluminum deposition. The dielectric constant was measured using Agilent's 4284 LCR meter.

Optical density measurement

In order to measure the optical density of the formed coating film, the optical density O.D was measured using 361T of X-rite.

Pin hole measurement

Pinhole measurement of the formed coating film was measured using an optical microscope to determine the number of 10cm x 10cm glass substrate. The case where the number of pinholes is 0 to 10 is indicated by ○, the case where 10 to 30 cases are represented by △, and the case where more than 30 cases are indicated by ×.

Adhesion Measurement

After the film was formed on the glass substrate to measure the adhesion, the final cured specimen was scratched to expose the substrate with a crosshatch cutter and then removed by attaching a 3M adhesive tape. The area of the removed area is then 0B if it exceeds 65% of the total test surface, 1B for 35-65%, 2B for 15-35%, 3B for 5-15%, 4B for less than 5%, 5B if no area was removed.

Table 1

	Example 1	Example 2	Example 3	Example 4	Example 5
bookbinder	Synthesis Example 1 12 parts by weight of siloxane resin	Synthesis Example 1 10 parts by weight of siloxane resin	Synthesis Example 1 9 parts by weight of siloxane resin	Synthesis Example 1 8 parts by weight of siloxane resin	Synthesis Example 2 10 parts by weight of siloxane resin
Unsaturated polyfunctional monomer	-	-	-	-	2 parts by weight
Carbon Black Dispersion (20%, 100nm)	18 parts by weight	30 parts by weight	40 parts by weight	47 parts by weight	18 parts by weight
Photopolymerization Initiator	OXE-02 1 part by weight
Organic solvent	69 parts by weight	59 parts by weight	50 parts by weight	44 parts by weight	69 parts by weight
After heat treatment at 230 ℃
Sheet resistance (Ω / □)	3.23E + 17	5.6E + 17	4.3E + 17	8.7E + 16	8.2E + 16
permittivity	6.52	13.94	18.27	20.15	7.21
Optical Density (OD / μm)	1.75	2.10	2.73	3.08	1.71
Pin hole	O	O	O	O	O
Adhesion	5B	5B	5B	5B	5B
Resolution (μm)	5	5	10	10	5
Sensitivity (mJ / cm 2 )	50	50	60	80	<50
After heat treatment at 380 ℃
Sheet resistance (Ω / □)	8.2E + 13	5.4E + 13	4.6E + 13	9.59E + 11	6.7E + 13
permittivity	8.62	16.48	23.38	32.13	9.93
Optical Density (OD / μm)	1.92	2.24	2.69	3.11	1.87
Pin hole	O	O	O	O	O
Adhesion	5B	5B	5B	5B	5B

TABLE 2

	Example 6	Example 7	Example 8	Comparative Example 1	Comparative Example 2
bookbinder	Synthesis Example 2 8 parts by weight of siloxane resin	Synthesis Example 2 6 parts by weight of siloxane resin	Synthesis Example 2 4 parts by weight of siloxane resin	Cardo resin 4 parts by weight	Synthesis Example 3 4 parts by weight of siloxane resin
Unsaturated polyfunctional monomer	4 parts by weight	6 parts by weight	4 parts by weight	4 parts by weight	4 parts by weight
Carbon Black Dispersion (20%, 100nm)	18 parts by weight	18 parts by weight	47 parts by weight	47 parts by weight	47 parts by weight
Photopolymerization Initiator	OXE-02 1 part by weight
Organic solvent	69 parts by weight	69 parts by weight	44 parts by weight	44 parts by weight	44 parts by weight
After heat treatment at 230 ℃
Sheet resistance (Ω / □)	7.7E + 16	8.8E + 16	8.9E + 16	4.5E + 16	7.8E + 16
permittivity	7.83	8.11	22.36	45.30	21.63
Optical Density (OD / μm)	1.75	1.72	3.21	3.03	3.11
Pin hole	O	O	O	O	O
Adhesion	5B	5B	5B	5B	5B
Resolution (μm)	5	5	5	10	30
Sensitivity (mJ / cm 2 )	<50	50	50	80	150
After heat treatment at 380 ℃
Sheet resistance (Ω / □)	8.2E + 11	4.9E + 08	2.6E + 09	4.39E + 05	3.1E + 09
permittivity	12.47	21.37	120.03	190.97	115.58
Optical Density (OD / μm)	1.66	1.04	2.53	2.14	2.64
Pin hole	△	X	△	X	△
Adhesion	5B	4B	3B	0B	1B

Looking at Examples 1 to 4, it can be seen that as the content of the siloxane resin in the resin composition increases, the dielectric constant of the coating film made of the resin composition is lowered, that is, the electrical insulation is improved.

In addition, Examples 5 to 8 relates to a resin composition comprising dipentaerythritol hexaacrylate as a polyfunctional monomer having an unsaturated bond, and the lower the content of the siloxane resin as the content of the siloxane resin increases in the coating films prepared from Examples 5 to 8, respectively. It can be seen that the dielectric constant exhibits excellent electrical insulation.

When Examples 5 and 8 were compared with Examples 1 and 4, Examples 5 and 8 replaced some of the siloxane resin contents in the resin compositions of Examples 1 and 4 with polyfunctional monomers having an unsaturated bond. It can be seen that the coating films formed from the examples 5 and 8 replaced in this way have an inferior electrical insulating effect than the coating films formed from the examples 1 and 4.

On the other hand, the coating film prepared from the resin composition of Comparative Example 1 using the cardo-based resin showed a significantly higher dielectric constant than the coating film prepared from the resin compositions of Examples 1 to 8, and appeared to have very inferior electrical insulating properties.

As shown in Table 1 and Table 2, the coating film prepared in the present invention is excellent in electrical insulation, optical properties, adhesion, pattern resolution, sensitivity, etc. of the coating film even after a high temperature process of 380 ℃ is required to produce a high temperature The light shielding layer including the coating layer may also exhibit excellent electrical insulation, optical characteristics, pattern resolution, and sensitivity as described above.

Claims (17)

1. A siloxane resin comprising a polymerization unit represented by the following Chemical Formula 1 and a polymerization unit represented by the following Chemical Formula 2; Pigments; Photopolymerization initiator; And a light blocking photosensitive resin composition comprising an organic solvent:

   [Formula 1]

   

   In Chemical Formula 1,

   R ₁ is a linear or branched alkylene group having 1 to 20 carbon atoms, an arylene group having 6 to 20 carbon atoms, an alkylene group having 7 to 20 carbon atoms substituted with an aryl group, and an arylene group having 7 to 20 carbon atoms substituted with an alkyl group. Or a group having 7 to 20 carbon atoms, in which an alkylene group and an arylene group are connected.

   X is hydroxy, carboxylic acid, carboxylic anhydride, carboxylic anhydride derivative, imide, imide derivative, amide, amide derivative, amine or mercanto,

   [Formula 2]

   

   In Chemical Formula 2,

   Each R ₂ is independently hydrogen, a linear, branched or cyclic alkyl group having 1 to 20 carbon atoms, an aryl group having 6 to 10 carbon atoms, an unsaturated hydrocarbon group having 2 to 10 carbon atoms, or an acyloxy group having 2 to 10 carbon atoms, A plurality of R ₂ in the molecule is the same or different from each other,

   n is an integer of 0-3, and the polymer unit in which n = 3 is used together with another polymer unit in which n is not 3.
2. The method of claim 1,

   Light-sensitive photosensitive resin composition, characterized in that the polymerization unit represented by the formula (1) is selected from the group consisting of the following formula (1a to 1n):

   [Formula 1a]

   

   [Formula 1b]

   

   [Formula 1c]

   

   [Formula 1d]

   

   [Formula 1e]

   

   [Formula 1f]

   

   [Formula 1g]

   

   [Formula 1h]

   

   Formula 1i]

   

   [Formula 1j]

   

   [Formula 1k]

   

   [Formula 1l]

   

   [Formula 1m]

   

   [Formula 1n]

   

   In each of the above formula, m and n may be each independently an integer of 1 to 20.
3. The method of claim 1,

   The polymerization unit represented by the formula (2) is tetraalkoxy silane, trialkoxy silane, methyl trialkoxy silane, ethyl trialkoxy silane, n-propyl trialkoxy silane, isopropyl trialkoxy silane, n-butyl trialkoxy silane, tert-butyl Trialkoxy silane, phenyl trialkoxy silane, naphtha trialkoxy silane, vinyl trialkoxy silane, methacryloxymethyl trialkoxy silane, 2-methacryloxyethyl trialkoxy silane, 3-methacryloxypropyl trialkoxy silane, 3-metha Acryloxypropyl methyl dialkoxy silane, 3-methacryloxypropyl ethyl dialkoxy silane, acryloxymethyl trialkoxy silane, 2-acryloxyethyl trialkoxy silane, 3-acryloxypropyl trialkoxy silane, 3-acryloxypropyl methyl Dialkoxy silane, 3-acryloxypropyl ethyl dialkoxy silane, 3-glycidyloxypropyl trialkoxy silane, 2-e Poxycyclohexylethyl trialkoxy silane, 3-epoxycyclohexylpropyl trialkoxy silane, dimethyl alkoxy silane, diethyl dialkoxy silane, dipropyl dialkoxy silane, diphenyl dialkoxy silane, diphenyl silanediol and phenylmethyl dialkoxysilane Light-sensitive photosensitive resin composition, characterized in that formed from one or two or more mixtures selected from the group consisting of.
4. The method of claim 3,

   The polymerization unit represented by the said Formula (2) is methacryloxymethyl trialkoxy silane, 2-methacryloxyethyl trialkoxy silane, 3-methacryloxypropyl trialkoxy silane, 3-methacryloxypropyl methyl dialkoxy silane, 3- Methacryloxypropyl ethyl dialkoxy silane, acryloxymethyl trialkoxy silane, 2-acryloxyethyl trialkoxy silane, 3-acryloxypropyl trialkoxy silane, 3-acryloxypropyl methyl dialkoxy silane and 3-acryloxypropyl ethyl Light-sensitive photosensitive resin composition, characterized in that formed from one or two or more mixtures selected from the group consisting of dialkoxy silanes.
5. The method of claim 1,

   The siloxane resin is light-shielding, characterized in that composed of 5 to 40 mol% of the polymerization unit of Formula 1 and 95 to 60 mol% of the polymerization unit of Formula 2 on the basis of 100 mol% of the polymerization unit of Formula 1 and the polymerization unit of Formula 2 Photosensitive resin composition for.
6. The method of claim 1,

   When the siloxane resin is titrated with KOH, the siloxane resin has an acid value in the range of 10 to 200 mgKOH / g resin.
7. The method of claim 1,

   The light-sensitive photosensitive resin composition which further contains the polyfunctional monomer which has an unsaturated bond.
8. The method of claim 1,

   The pigment is a light-shielding photosensitive resin composition, characterized in that the black pigment.
9. The method of claim 1,

   The pigment is a light-sensitive photosensitive resin composition, characterized in that the pigment is one or a mixture of two or more selected from the group consisting of carbon black, titanium black, aniline black, perylene black, strontium titanate, chromium oxide and ceria.
10. The method according to claim 1 or 7,

    When the pigment is 100 parts by weight of the siloxane resin or polyfunctional monomer having an unsaturated bond is used in an amount of 20 to 130 parts by weight based on 100 parts by weight of the total weight of the siloxane resin and the polyfunctional monomer having an unsaturated bond. Light-sensitive photosensitive resin composition made into.
11. The method according to claim 1 or 7,

    When the photopolymerization initiator is 100 parts by weight of the siloxane resin or polyfunctional monomer having an unsaturated bond is used in an amount of 1 to 30 parts by weight based on 100 parts by weight of the total weight of the siloxane resin and the polyfunctional monomer having an unsaturated bond. Light-sensitive photosensitive resin composition characterized by the above-mentioned.
12. The method of claim 7, wherein

    Light-sensitive photosensitive resin composition, characterized in that the polyfunctional monomer having an unsaturated bond is contained in an amount of greater than 0 and 100 parts by weight or less based on 100 parts by weight of the siloxane resin.
13. The method of claim 1,

    The said organic solvent is contained in the quantity of 20-90 weight part with respect to 100 weight part of whole light-sensitive photosensitive resin compositions, The light-shielding photosensitive resin composition characterized by the above-mentioned.
14. The light shielding layer containing the coating film formed from the light-sensitive photosensitive resin composition of any one of Claims 1-13.
15. The method of claim 14,

    A light shielding layer having an optical density in the range of 1.0 to 4.0 per unit thickness (μm).
16. (S1) applying the light-shielding photosensitive resin composition according to claim 1 to a substrate;

    (S2) removing the solvent in the composition to form a coating film;

    (S3) exposing and developing the coating film to form a coating film; And

    (S4) comprising the step of heat-treating the coating film at a temperature of more than 200 ℃ less than 300 ℃

    The manufacturing method of the coating film for light shielding layers.
17. The method of claim 16,

    After the step (S4), (S5) further comprising the step of heat-treating the coating film at a temperature of 300 ° C or more and 600 ° C or less.