WO2015005546A1 - Composition de résine photosensible noire et couche de blocage de la lumière utilisant celle-ci - Google Patents

Composition de résine photosensible noire et couche de blocage de la lumière utilisant celle-ci Download PDF

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Publication number
WO2015005546A1
WO2015005546A1 PCT/KR2013/011649 KR2013011649W WO2015005546A1 WO 2015005546 A1 WO2015005546 A1 WO 2015005546A1 KR 2013011649 W KR2013011649 W KR 2013011649W WO 2015005546 A1 WO2015005546 A1 WO 2015005546A1
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meth
acrylate
resin composition
photosensitive resin
black
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PCT/KR2013/011649
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English (en)
Korean (ko)
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우치카와키요시
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제일모직 주식회사
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Publication of WO2015005546A1 publication Critical patent/WO2015005546A1/fr

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Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B5/00—Optical elements other than lenses
    • G02B5/20—Filters
    • G02B5/22—Absorbing filters
    • G02B5/223—Absorbing filters containing organic substances, e.g. dyes, inks or pigments
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0045—Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B5/00—Optical elements other than lenses
    • G02B5/20—Filters
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B5/00—Optical elements other than lenses
    • G02B5/20—Filters
    • G02B5/201—Filters in the form of arrays
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0005—Production of optical devices or components in so far as characterised by the lithographic processes or materials used therefor
    • G03F7/0007—Filters, e.g. additive colour filters; Components for display devices
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
    • G03F7/105—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers having substances, e.g. indicators, for forming visible images
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
    • G03F7/11—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers having cover layers or intermediate layers, e.g. subbing layers

Definitions

  • the present substrate relates to a black photosensitive resin composition, a light shielding layer using the same, and a color filter.
  • the black photosensitive resin composition is a material essential for the production of display elements such as a color filter, a liquid crystal display material, an organic light emitting element (EL), and a display panel material.
  • a color filter such as a color liquid crystal display requires a light shielding layer at a boundary between colored layers such as red, green, and blue in order to increase display contrast and color development effects.
  • the light shielding layer is mainly formed of a black photosensitive resin composition.
  • the material used for such a light shielding layer is mainly carbon black.
  • carbon black has been pointed out to be harmful to the human body, causing environmental pollution problems, it is urgent to develop alternatives.
  • Non-carbon materials that can be used as light-shielding materials include inorganic pigments such as titanium oxide and complex oxide pigments such as iron and manganese, black organic pigments, mixtures of inorganic pigments and black organic pigments, and the like.
  • inorganic pigments have a problem of sedimentation due to their high specific gravity, and black organic pigments have a problem in that sufficient light shielding properties are not expressed.
  • the development trend of the light shielding layer material is directed toward lowering the film thickness of the light shielding layer by increasing the optical density (OD) as much as possible. This is because the film thickness of the light shielding layer is high, thereby minimizing the flatness damage that may occur. This is to ensure the drop margin of the liquid crystal even without.
  • One embodiment is to provide a black photosensitive resin composition having high optical density, excellent patternability and resolution.
  • Another embodiment is to provide a light shielding layer manufactured using the black photosensitive resin composition.
  • Another embodiment is to provide a color filter including the light blocking layer.
  • One embodiment includes (A) a colorant comprising lignin black; (B) organic binder resin; (C) photopolymerizable monomer; (D) photoinitiator; And (E) a black photosensitive resin composition comprising a solvent.
  • the colorant including the lignin black may further include a pigment, a dye, or a combination thereof.
  • the weight average molecular weight of the organic binder resin may be 1,000 g / mol to 100,000 g / mol.
  • the organic binder resin may be included in an amount of 10 parts by mass to 60 parts by mass based on 100 parts by mass of the solid content of the organic binder resin, the solid content of the photopolymerizable monomer, and the solid content of the photopolymerization initiator.
  • the black photosensitive resin composition may comprise (A) 1 wt% to 60 wt% of a colorant including the lignin black; (B) 0.5 wt% to 20 wt% of the organic binder resin; (C) 1% to 10% by weight of the photopolymerizable monomer; (D) 0.1% to 10% by weight of the photopolymerization initiator; And (E) may include the remaining amount of the solvent.
  • the photopolymerizable monomer is ethylene glycol di (meth) acrylate, diethylene glycol di (meth) acrylate, triethylene glycol di (meth) acrylate, propylene glycol di (meth) acrylate, neopentyl glycol di (meth) Acrylate, 1,4-butanediol di (meth) acrylate, 1,6-hexanediol di (meth) acrylate, bisphenol A di (meth) acrylate, pentaerythritol di (meth) acrylate, pentaerythritol Tri (meth) acrylate, pentaerythritol tetra (meth) acrylate, pentaerythritol hexa (meth) acrylate, dipentaerythritol di (meth) acrylate, dipentaerythritol tri (meth) acrylate, di Pentaerythri
  • the photosensitive resin composition is malonic acid; 3-amino-1,2-propanediol; Silane coupling agent containing a vinyl group or a (meth) acryloxy group; Leveling agents; Fluorine-based surfactants; Radical polymerization initiators; Or an additive of a combination thereof.
  • the black photosensitive resin composition may be used for the light shielding layer.
  • Another embodiment provides a light shielding layer manufactured using the black photosensitive resin composition.
  • Another embodiment provides a color filter including the light blocking layer.
  • a black photosensitive resin composition having high optical density, excellent patternability and resolution, and good dispersion stability is provided, it can be usefully applied to a light shielding layer used for a color filter or the like.
  • substituted means that at least one hydrogen atom is a halogen atom (F, Cl, Br, I), hydroxy group, C1 to C20 alkoxy group, nitro group, cyano group, amine group, imino group , Azido groups, amidino groups, hydrazino groups, hydrazono groups, carbonyl groups, carbamyl groups, thiol groups, ester groups, ether groups, carboxyl groups or salts thereof, sulfonic acid groups or salts thereof, phosphoric acid or salts thereof, C1 to C20 alkyl group, C2 to C20 alkenyl group, C2 to C20 alkynyl group, C6 to C30 aryl group, C3 to C20 cycloalkyl group, C3 to C20 cycloalkenyl group, C3 to C20 cycloalkynyl group, It means substituted with a substituent of C2 to C20 heterohalogen atom (F, Cl, Br, I),
  • hetero means at least one hetero atom of at least one of N, O, S and P in the ring group unless otherwise specified in the present specification.
  • (meth) acrylate means that both “acrylate” and “methacrylate” are possible
  • (meth) acrylic acid means “acrylic acid” and “methacrylic acid”.
  • Black photosensitive resin composition includes (A) a colorant comprising lignin black; (B) organic binder resin; (C) photopolymerizable monomer; (D) photoinitiator; And (E) a solvent.
  • the lignin black has a high resistance characteristic, a separate coating process is unnecessary, harmless to the human body and environmentally friendly, and has an optical density, patternability, and resolution equivalent to that of a black photosensitive resin composition using a conventional black pigment. It can be used as a next-generation black photosensitive resin composition.
  • Lignin black is a black substance extracted from black solution, a balance of pulp made from wood, and is a natural polymer that can be easily decomposed by microorganisms in the ground.
  • Carbon black which is mainly used as a light blocking layer material, is harmful to the human body and causes environmental pollution problems, whereas the lignin black is an environmentally friendly material and harmless to the human body, and high optical density can be obtained without inhibiting resolution and the like.
  • a colorant including the lignin black may be used in the black photosensitive resin composition in the form of a dispersion by preparing a lignin black dispersion by mixing the colorant, a dispersant, a solvent, and the like. Specifically, a mixture of the lignin black, a dispersant, a solvent, and the like mixed at the same time may be dispersed for a predetermined time to prepare a lignin black dispersion, which may be used in the black photosensitive resin composition.
  • the dispersant may help to uniformly disperse the colorant including the lignin black in the solvent.
  • dispersant examples include nonionic compounds, anionic compounds, cationic compounds, or combinations thereof, and specific examples thereof include polymer dispersants such as polyethyleneimine dispersants, urethane dispersants, and acrylic dispersants.
  • Examples of commercially available products of the dispersant include, for example, DISKBY-101, DISPERBYK-130, DISPERBYK-140, DISPERBYK-160, DISPERBYK-161, DISPERBYK-162, DISPERBYK-163, DISPERBYK-164, DISPERBYK-165, DISPERBYK -166, DISPERBYK-170, DISPERBYK-171, DISPERBYK-182, DISPERBYK-2000, DISPERBYK-2001, and the like; EFKA-47, EFKA-47EA, EFKA-48, EFKA-49, EFKA-100, EFKA-400, EFKA-450, etc.
  • the dispersant may be included in about 0.1 to 15% by weight based on the total amount of the black photosensitive resin composition.
  • the dispersibility of the black photosensitive resin composition is excellent in the stability, developability and patternability in manufacturing the light shielding layer.
  • the solvent is as described later.
  • the colorant including the lignin black may further include a pigment, a dye, or a combination thereof in order to control light blocking properties and color characteristics of the lignin black.
  • the pigment may be used in organic pigments, inorganic pigments or a combination thereof. Among them, the organic pigment and the inorganic pigment may be mixed and used for high optical density.
  • the organic pigment may be used a black organic pigment.
  • the black organic pigment is insulative.
  • black organic pigments examples include perylene black and cyanine black, and these may be used alone or in combination of two or more thereof.
  • the black organic pigments may also be used by mixing two or more organic pigments to have a black color.
  • Any pigment can be used as long as it is a combination of pigments that are black when mixed on the color coordinates, for example, red pigments, blue pigments, green pigments, purple pigments, yellow pigments, cyanine pigments, and magenta. It can be used by blackening by selecting from two types of pigments, combining two or more types. For example, red pigments, blue pigments and green pigments may be mixed and blackened, or green pigments and purple pigments may be mixed and blackened.
  • red pigment examples include perylene pigments, anthraquinone pigments, dianthraquinone pigments, azo pigments, diazo pigments, quinacridone pigments, anthracene pigments, and the like.
  • specific examples of the red pigment include perylene pigments, quinacridone pigments, naphthol AS, cuminamine pigments, anthraquinones (sudan I, II, III, R), dianthraquinoneyllets, Vis azo, benzopyrrole, etc. are mentioned.
  • blue pigment examples include metal phthalocyanine pigments, indanthrone pigments, and indophenol pigments.
  • Specific examples of the blue pigment include phthalocyanine metal complexes such as copper phthalocyanine, chloro copper phthalocyanine, chloro aluminum phthalocyanine, titanyl phthalocyanine, vanazin phthalocyanine, magnesium phthalocyanine, zinc phthalocyanine, cobalt phthalocyanine, and the like.
  • green pigment examples include halogenated phthalocyanine pigments. Specifically, polychloro copper phthalocyanine, polychloro bromine phthalocyanine, etc. are mentioned.
  • Examples of the violet pigment include dioxazine violet, first violet B, methyl violet lake, indanthrene brilliant violet, and the like.
  • yellow pigment examples include a tetra chloro isoindolinone pigment, a hansa pigment, a benzidine yellow pigment, and an azo pigment.
  • hansa yellow (10G, 5G, 3G, G, GR, A, RN, R), benzidine (G, GR), chrome yellow, permanent yellow ) (FGL, H10G, HR) and the like.
  • cyanine pigments examples include metal-free phthalocyanine and merocyanine.
  • the magenta pigment may be dimethyl quinacridone, thio indigo, or the like.
  • the inorganic pigment examples include carbon black, chromium oxide, iron oxide, titanium black, titanium carbon, and the like. Such inorganic pigments exhibit resistance characteristics and may be used alone or in combination of two or more.
  • the organic pigments and inorganic pigments may be mixed and used in a weight ratio of about 1 to 10: 1, for example, may be used in a weight ratio of about 2 to 7: 1.
  • the processability can be stabilized and a low dielectric constant can be ensured.
  • the dispersant may be used together to disperse the pigment well in the black photosensitive resin composition.
  • the dispersant may be added to the inside of the pigment in the form of surface treatment of the pigment in advance, or may be used in the production of a black photosensitive resin composition with the pigment.
  • Pigments, dyes, or combinations thereof that may be further included in the colorant including the lignin black may be included in about 1% by weight to 40% by weight based on the total solids of the black photosensitive resin composition, for example, about 5% by weight % To 30% by weight may be included.
  • the colorant is included in the above range, excellent insulation, high optical density can be obtained, and excellent processability such as developability can be ensured.
  • the colorant including the lignin black may be included in an amount of about 10 wt% to 70 wt%, for example, about 40 wt% to 60 wt%, based on the total solids of the black photosensitive resin composition.
  • the organic binder resin cardo binder resin, acrylic binder resin, polyimide binder resin, polyurethane binder resin, or a combination thereof can be used.
  • the binder resin may be a cardo resin, or a mixture of a cardo resin and an acrylic resin.
  • heat resistance, chemical resistance and adhesion of the photosensitive resin composition may be improved.
  • the weight average molecular weight of the organic binder resin may be about 1,000 g / mol to 100,000 g / mol. If the weight average molecular weight of the said organic binder resin is about 1,000 g / mol or more, a coating film can be made uniform, and developability becomes favorable that the weight average molecular weight of the said organic binder resin is about 100,000 g / mol or less.
  • cardo-based binder resins may be preferably used.
  • heat resistance and chemical resistance of the black photosensitive resin composition may be improved.
  • the cardo-based binder resin may be a compound including a repeating unit represented by Formula 1 below.
  • R 24 to R 27 are the same as or different from each other, a hydrogen atom, a halogen atom, or a substituted or unsubstituted C1 to C20 alkyl group,
  • R 28 and R 29 are the same as or different from each other, a hydrogen atom or CH 2 OR a (R a is a vinyl group, an acryl group or a methacryl group),
  • R 30 is the same as or different from each other, a hydrogen atom, a substituted or unsubstituted C1 to C20 alkyl group, a substituted or unsubstituted C2 to C20 alkenyl group, an acryl group, or a methacryl group,
  • Z 1 is the same or different from each other, a single bond, O, CO, SO 2 , CR b R c , SiR d R e (where R b to R e are the same or different from each other, a hydrogen atom, or a substituted or unsubstituted Ring is a C1 to C20 alkyl group), or any one of compounds represented by the following formula (2) to 12,
  • Z 2 is the same as or different from each other, and is an acid anhydride residue or an acid dianhydride residue.
  • R f is a hydrogen atom, an ethyl group, C 2 H 4 Cl, C 2 H 4 OH, CH 2 CH ⁇ CH 2 or a phenyl group.
  • the cardo-based binder resin may be obtained by reacting a compound represented by the following Chemical Formula 13 with tetracarboxylic dianhydride.
  • the tetratetracarboxylic dianhydride may be an aromatic tetracarboxylic dianhydride.
  • aromatic tetracarboxylic dianhydride examples include pyromellitic dianhydride, 3,3 ', 4,4'-biphenyltetracarboxylic dianhydride, 2,3,3', 4-biphenyltetracarboxylic dianhydride, 2, 2 ', 3,3'-biphenyltetracarboxylic dianhydride, 3,3', 4,4'-benzophenonetetracarboxylic dianhydride, 3,3 ', 4,4'-biphenylethertetracarboxylic dianhydride, 3,3 ', 4,4'-diphenylsulfontetracarboxylic dianhydride, 1,2,3,4-cyclopentanetetracarboxylic dianhydride, 1,2,5,6-naphthalenetetracarboxylic dianhydr
  • the weight average molecular weight of the cardo-based binder resin may be about 1,000 g / mol to 20,000 g / mol, specifically about 3,000 g / mol to 10,000 g / mol. When the weight average molecular weight of the cardo-based binder resin is within the above range, excellent patternability and developability may be obtained when manufacturing the light shielding film.
  • the acrylic resin is a copolymer of a first ethylenically unsaturated monomer and a second ethylenically unsaturated monomer copolymerizable therewith, and is a resin including one or more acrylic repeating units.
  • the first ethylenically unsaturated monomer is an ethylenically unsaturated monomer containing at least one carboxyl group, and specific examples thereof may include acrylic acid, methacrylic acid, maleic acid, itaconic acid, fumaric acid, or a combination thereof.
  • the first ethylenically unsaturated monomer may be included in an amount of 5 wt% to 50 wt%, for example, 10 wt% to 40 wt%, based on the total amount of the acrylic resin.
  • the second ethylenically unsaturated monomer is an aromatic vinyl compound such as styrene, ⁇ -methylstyrene, vinyltoluene, vinylbenzylmethyl ether, etc .; Methyl (meth) acrylate, ethyl (meth) acrylate, butyl (meth) acrylate, 2-hydroxyethyl (meth) acrylate, 2-hydroxy butyl (meth) acrylate, benzyl (meth) acrylate, Unsaturated carboxylic acid ester compounds such as cyclohexyl (meth) acrylate and phenyl (meth) acrylate; Unsaturated carboxylic acid amino alkyl ester compounds such as 2-aminoethyl (meth) acrylate and 2-dimethylaminoethyl (meth) acrylate; Carboxylic acid vinyl ester compounds, such as vinyl acetate and a vinyl benzoate; Unsaturated carboxy
  • acrylic resin examples include methacrylic acid / benzyl methacrylate copolymer, methacrylic acid / benzyl methacrylate / styrene copolymer, methacrylic acid / benzyl methacrylate / 2-hydroxyethyl methacrylate copolymer And methacrylic acid / benzyl methacrylate / styrene / 2-hydroxyethyl methacrylate copolymer, etc. are mentioned, It is not limited to these, These can also be used individually or in combination of 2 or more types.
  • the weight average molecular weight of the acrylic resin may be from 3,000 g / mol to 150,000 g / mol, for example 5,000 g / mol to 50,000 g / mol, for example 2,000 g / mol to 30,000 g / mol can be.
  • the weight average molecular weight of the acrylic resin is within the above range, the physical and chemical properties of the photosensitive resin composition are excellent, the viscosity is appropriate, and the adhesion to the substrate in the manufacture of light shielding layer, column spacer or black spacer is excellent.
  • the acid value of the acrylic resin may be 15 mgKOH / g to 150 mgKOH / g, for example 80 mgKOH / g to 130 mgKOH / g.
  • the acid value of the acrylic resin is within the above range, the resolution of the pixel pattern is excellent.
  • the organic binder resin is a monomer having a carboxyl group such as acrylic acid, methacrylic acid, methyl acrylate, methyl methacrylate, ethyl acrylate, ethyl methacrylate, 2-hydroxyethyl acrylate, 2-hydroxyethyl meta Acrylate, 2-hydroxypropyl methacrylate, N-butyl acrylate, N-butyl methacrylate, isobutyl acrylate, isobutyl methacrylate, benzyl acrylate, benzyl methacrylate, phenoxy acrylate, Phenoxy methacrylate, isobornyl acrylate, isobornyl methacrylate, glycidyl methacrylate, copolymers with styrene, acrylamide, acrylonitrile and the like, and phenol novolak type epoxy acrylate polymers, phenol Novolac-type epoxy methacrylate polymer, Cresol novolac-type
  • Content of the monomer component which has carboxyl groups, such as acrylic acid and methacrylic acid, which comprise the said organic binder resin is about 5 mol%-50 mol%, for example, about 10 mol%-40 mol% based on 100 mol% of organic binder resins. Can be.
  • the weight average molecular weight of the organic binder resin may be about 1,000 g / mol to 100,000 g / mol. If the weight average molecular weight of the said organic binder resin is about 1,000 g / mol or more, a coating film can be made uniform, and developability becomes favorable that the weight average molecular weight of the said organic binder resin is about 100,000 g / mol or less.
  • the organic binder resin may be included in an amount of about 10 parts by weight to 60 parts by weight based on 100 parts by weight of the total content of the solid content of the organic binder resin, the solid content of the photopolymerizable monomer, and the photopolymerization initiator. Since the organic binder resin is included in about 10 parts by weight or more based on 100 parts by weight of the total content of the solid content of the organic binder resin, the solid content of the photopolymerizable monomer, and the photopolymerization initiator, the film can be easily formed during application and drying. After curing, the film strength can be sufficiently increased.
  • the organic binder resin may be included in an amount of about 60 parts by weight or less based on 100 parts by weight of the total content of the solid content of the organic binder resin, the solid content of the photopolymerizable monomer, and the photopolymerization initiator, thereby improving developability.
  • the organic binder resin may be included in about 0.5% to 20% by weight of the total amount of solids of the black photosensitive resin composition, specifically, may be included in about 1% to 10% by weight.
  • the viscosity is appropriately maintained to excellent in patternability, processability and developability in manufacturing a light shielding film.
  • the photopolymerizable monomer is a monomer or oligomer generally used in a black photosensitive resin composition, and a monofunctional or polyfunctional ester of (meth) acrylic acid having at least one ethylenically unsaturated double bond may be used.
  • photopolymerizable monomer examples include ethylene glycol diacrylate, ethylene glycol dimethacrylate, diethylene glycol diacrylate, triethylene glycol diacrylate, triethylene glycol dimethacrylate, 1,6-hexanediol Diacrylate, 1,6-hexanediol dimethacrylate, pentaerythritol triacrylate, pentaerythritol tetraacrylate, dipentaerythritol pentaacrylate, dipentaerythritol hexaacrylate, bisphenol A epoxy acrylate , Ethylene glycol monomethyl ether acrylate, trimethylolpropane triacrylate, trisacryloyloxyethyl phosphate, cardoepoxy diacrylate, and the like.
  • Examples of commercially available products of the reactive unsaturated compounds are as follows.
  • Examples of the monofunctional ester of (meth) acrylic acid include Aronix M-101 ® , M-111 ® , M-114 ®, and the like manufactured by Toagosei Kagaku Kogyo Co., Ltd .; Nihon Kayaku Co., Ltd. KAYARAD TC-110S ® , TC-120S ®, etc .; And V-158 ® and V-2311 ® from Osaka Yuki Chemical Co., Ltd.
  • the (meth) transfer function of an example esters of acrylic acid is such as doah Gosei Kagaku Kogyo Co., Ltd.'s Aronix M-210 ®, the same M-240 ®, the same M-6200 ®; Nihon Kayaku Co., Ltd. KAYARAD HDDA ® , HX-220 ® , R-604 ®, etc .; And V-260 ® , V-312 ® and V-335 HP ® from Osaka Yuki Chemical Co., Ltd.
  • the above products can be used alone or in combination of two or more.
  • the photopolymerizable monomer may be included in an amount of about 1 wt% to 20 wt%, and specifically, about 1 wt% to 15 wt% based on the total solids of the black photosensitive resin composition.
  • the photopolymerizable monomer is included in the above range, compatibility with the organic binder resin is improved, so that the light shielding film has excellent sensitivity in the presence of patterning and oxygen and a smooth surface film can be obtained.
  • the photopolymerization initiator is a photopolymerization initiator generally used in the black photosensitive resin composition, for example, an acetophenone compound, a benzophenone compound, a thioxanthone compound, a benzoin compound, a triazine compound, an oxime compound, or the like can be used. Can be.
  • acetophenone-based compound examples include 2,2'-diethoxy acetophenone, 2,2'-dibutoxy acetophenone, 2-hydroxy-2-methylpropiophenone, pt-butyltrichloro acetophenone, pt-butyldichloro acetophenone, 4-chloro acetophenone, 2,2'-dichloro-4-phenoxy acetophenone, 2-methyl-1- (4- (methylthio) phenyl) -2-morpholinopropane- 1-one, 2-benzyl-2-dimethylamino-1- (4-morpholinophenyl) -butan-1-one, etc. are mentioned.
  • benzophenone-based compound examples include benzophenone, benzoyl benzoic acid, methyl benzoyl benzoate, 4-phenyl benzophenone, hydroxy benzophenone, acrylated benzophenone, 4,4'-bis (dimethyl amino) benzophenone, 4,4 '-Bis (diethylamino) benzophenone, 4,4'-dimethylaminobenzophenone, 4,4'-dichlorobenzophenone, 3,3'-dimethyl-2-methoxybenzophenone and the like.
  • thioxanthone compound examples include thioxanthone, 2-methyl thioxanthone, isopropyl thioxanthone, 2,4-diethyl thioxanthone, 2,4-diisopropyl thioxanthone, 2- Chlorothioxanthone etc. are mentioned.
  • benzoin compound examples include benzoin, benzoin methyl ether, benzoin ethyl ether, benzoin isopropyl ether, benzoin isobutyl ether, benzyldimethyl ketal and the like.
  • triazine-based compound examples include 2,4,6-trichloro-s-triazine, 2-phenyl 4,6-bis (trichloromethyl) -s-triazine and 2- (3 ', 4'- Dimethoxystyryl) -4,6-bis (trichloromethyl) -s-triazine, 2- (4'-methoxynaphthyl) -4,6-bis (trichloromethyl) -s-triazine, 2- (p-methoxyphenyl) -4,6-bis (trichloromethyl) -s-triazine, 2- (p-tolyl) -4,6-bis (trichloromethyl) -s-triazine, 2-biphenyl 4,6-bis (trichloromethyl) -s-triazine, bis (trichloromethyl) -6-styryl-s-triazine, 2- (naphtho-1-yl) -4,
  • Examples of the oxime compound include O-acyl oxime compound, 2- (O-benzoyl oxime) -1- [4- (phenylthio) phenyl] -1,2-octanedione, 1- (O-acetyl oxime) -1- [9-ethyl-6- (2-methylbenzoyl) -9H-carbazol-3-yl] ethanone, O-ethoxycarbonyl- ⁇ -oxyamino-1-phenylpropan-1-one and the like Can be used.
  • O-acyl oxime compound examples include 1,2-octanedione, 2-dimethylamino-2- (4-methylbenzyl) -1- (4-morpholin-4-yl-phenyl) -butane- 1-one, 1- (4-phenylsulfanylphenyl) -butane-1,2-dione-2-oxime-O-benzoate, 1- (4-phenylsulfanylphenyl) -octane-1,2-dione 2-Oxime-O-benzoate, 1- (4-phenylsulfanylphenyl) -octane-1-one oxime-O-acetate and 1- (4-phenylsulfanylphenyl) -butan-1-one oxime- O-acetate or the like can be used.
  • the photopolymerization initiator may be a carbazole compound, a diketone compound, a sulfonium borate compound, a diazo compound, a biimidazole compound, or the like.
  • the said photoinitiator can be used individually or in combination of 2 or more types.
  • the photopolymerization initiator may be used together with a photosensitizer that causes a chemical reaction by absorbing light and transferring energy after being excited.
  • the photopolymerization initiator may be included in an amount of about 1 part by mass to 40 parts by mass based on 100 parts by mass of the total content of the photopolymerizable monomer and the photopolymerization initiator.
  • the photopolymerization initiator may be included in about 0.1 wt% to 10 wt% with respect to the total solids of the black photosensitive resin composition, and specifically, may be included in about 1 wt% to 5 wt%.
  • the photopolymerization initiator is included in the above range, the sensitivity of the radical is good, the color concentration of the black photosensitive resin composition solution is properly maintained, and the decrease in transmittance due to the unreacted initiator can be prevented.
  • the solvent may be a material having compatibility with the colorant including the lignin black, the organic binder resin, the photopolymerizable monomer, and the photopolymerization initiator, but not reacting.
  • the solvent examples include alcohols such as methanol and ethanol; Ethers such as dichloroethyl ether, n-butyl ether, diisoamyl ether, methylphenyl ether and tetrahydrofuran; Glycol ethers such as ethylene glycol methyl ether, ethylene glycol ethyl ether, and propylene glycol methyl ether; Cellosolve acetates such as methyl cellosolve acetate, ethyl cellosolve acetate and diethyl cellosolve acetate; Carbitols such as methyl ethyl carbitol, diethyl carbitol, diethylene glycol monomethyl ether, diethylene glycol monoethyl ether, diethylene glycol dimethyl ether, diethylene glycol methylethyl ether and diethylene glycol diethyl ether; Propylene glycol alkyl ether acetates such as propylene glycol
  • glycol ethers such as ethylene glycol monoethyl ether; Ethylene glycol alkyl ether acetates such as ethyl cellosolve acetate; Esters such as 2-hydroxyethyl propionate; Diethylene glycols such as diethylene glycol monomethyl ether; Propylene glycol alkylether acetates such as propylene glycol monomethylether acetate and propylene glycol propylether acetate can be used.
  • the solvent may be included in the balance of the total amount of solids of the black photosensitive resin composition, specifically, may be included in about 50% by weight to 70% by weight.
  • the solvent is included in the above range, as the black photosensitive resin composition has an appropriate viscosity, processability in manufacturing a light shielding layer is excellent.
  • the photosensitive resin composition includes malonic acid to prevent spots and spots upon application, to improve leveling performance, and to prevent generation of residue by undeveloped; 3-amino-1,2-propanediol; Silane coupling agent containing a vinyl group or a (meth) acryloxy group; Leveling agents; Fluorine-based surfactants; It may further include other additives such as radical polymerization initiators.
  • silane coupling agent examples include trimethoxysilyl benzoic acid, ⁇ -methacryloxypropyl trimethoxysilane, vinyl triacetoxysilane, vinyl trimethoxysilane, ⁇ -isocyanate propyl triethoxysilane, and ⁇ -Glycidoxy propyl trimethoxysilane, (beta)-(3, 4- epoxycyclohexyl) ethyl trimethoxysilane, etc. are mentioned, These can be used individually or in mixture of 2 or more types.
  • fluorine-based surfactants examples include BM-1000 ® , BM-1100 ® , and the like by BM Chemie; Mecha Pack F 142D ® , F 172 ® , F 173 ® , F 183 ®, etc. by Dai Nippon Inky Chemical Co., Ltd .; Prorad FC-135 ® , FC-170C ® , FC-430 ® , FC-431 ®, etc. of Sumitomo 3M Corporation; Asahi Grass Co., Ltd.
  • the content of the additive can be easily adjusted according to the desired physical properties.
  • the photosensitive resin composition may further include an epoxy compound in order to improve adhesion to a substrate.
  • a phenol novolak epoxy compound a tetramethyl biphenyl epoxy compound, a bisphenol-A epoxy compound, an alicyclic epoxy compound, or a combination thereof is mentioned.
  • the epoxy compound may be included in an amount of about 0.01 parts by weight to 5 parts by weight based on 100 parts by weight of the photosensitive resin composition for color filters, and specifically, about 0.1 parts by weight to 5 parts by weight. When the epoxy compound is included in the above range, it is excellent in adhesion, heat resistance and chemical resistance.
  • Another embodiment provides a light blocking layer manufactured using the black photosensitive resin composition described above.
  • the manufacturing method of the said light shielding layer is as follows.
  • the above-mentioned photosensitive resin composition After applying the above-mentioned photosensitive resin composition to a desired thickness, such as 0.5 ⁇ m or 25 ⁇ m, by spin or slit coating, roll coating, screen printing, applicator, etc.
  • an active line of 190 nm to 500 nm is irradiated after interposing a mask of a predetermined form.
  • Low-pressure mercury lamps, high-pressure mercury lamps, ultra-high pressure mercury lamps, metal halide lamps, argon gas lasers, and the like can be used as light sources used for irradiation.
  • the exposure amount depends on the component type, compounding amount, and dry film thickness of the photosensitive resin composition, but when using a high pressure mercury lamp, for example, the exposure amount is 500 mJ / cm 2 or less (in a 365 nm sensor).
  • an alkaline aqueous solution is used as a developer to dissolve and remove unnecessary portions, leaving only the exposed portion to form an image pattern.
  • an image pattern obtained by the above development can be obtained in terms of heat resistance, light resistance, adhesion, crack resistance, chemical resistance, high strength, storage stability, and the like, it can be cured by performing additional heating or active ray irradiation. .
  • required by the light shielding layer can be obtained.
  • Another embodiment provides a color filter including the light blocking layer.
  • the light shielding layer described above may be used for a color filter or the like.
  • Premix by mixing 100 g of lignin black and 30 g of dispersant (BYK165) with 370 g of solvent (PGMEA), and using a bead-type disperser NanoGran Mill (manufactured by Asada Iron Works) using 0.2 mm beads until the dispersed particle system reaches 100 nm. Dispersion over time gave a lignin black dispersion.
  • a black photosensitive resin composition was prepared in the same manner as in Example 1, except that 50 g (50 wt%) of lignin black dispersion and 34.6 g of a solvent were used.
  • a black photosensitive resin composition was manufactured in the same manner as in Example 1, except that 55 g (52 wt%) of carbon black dispersion No. 3877 (manufactured by Tokushiki) and 34.56 g of a solvent were used instead of the lignin black dispersion.
  • a black photosensitive resin composition was manufactured in the same manner as in Example 1, except that 100 g (60 wt%) of titanium black dispersion No. 1043 (manufactured by MIKUNI) and 9.38 g of a solvent were used instead of the lignin black dispersion.
  • Example 1 Example 2 Comparative Example 1 Comparative Example 2 Lignin Black Dispersion 60 g 50 g - - Carbon Black Dispersion No.3877 (TOKUSHIKI) - - 55 g - Titanium Black Dispersion No.1043 (MIKUNI) - - - 100 g Photopolymerization initiator OXE02 (BASF) 1.5 g 1.5 g 1.5 g 1.5 g Photopolymerizable monomer (dipentaerythritol hexa acrylate, DPHA) 3 g 3 g 3 g 3 g 3 g 3 g Organic Binder Resin (Cado Epoxy Acrylate, V259 (Shin-Nitetsu Chemical Co., Ltd.)) 10 g (5.5 g of solids) 10 g (5.5 g of solids) 10 g (5.5 g of solids) 10 g (5.5 g of solids) Solvent (propylene glycol monomethyl ether acetate, PGMEA
  • Example 1 The black photosensitive resin composition of Example 1, Example 2, Comparative Example 1, and Comparative Example 2 was apply
  • the optical density of each coating film was measured using 310TR optical density meter (Exlite). The results are shown in Table 2 below.
  • ⁇ optical density is more than 3.7
  • optical density is 2.5 GHz or more and less than 3.7
  • each of the coating films according to Examples 1 to 3, Comparative Example 1 and Comparative Example 2 obtained in the above Evaluation 1 was used as a broadband exposure machine having a peak of 365 nm in wavelength using a pattern mask having a line width of 2 ⁇ m to 10 ⁇ m. mJ / cm 2 irradiation.
  • USHIO's Proximity Exposure System was equipped with a UV filter that blocks wavelengths below 350nm so that light below 350nm is not irradiated.
  • 1.0 kg / cm 2 Spray development was performed for 60 seconds at the spray pressure.
  • the pattern obtained by this method was cured by heating in an oven at 220 ° C. for 30 minutes, and then the minimum pattern was observed using an optical microscope.
  • Table 2 Resolution values shown in Table 2 below are the minimum reproduced line widths.
  • the black photosensitive resin composition of Examples 1 and 2 including a colorant, an organic binder resin, a photopolymerizable monomer, a photopolymerization initiator, and a solvent containing lignin black according to one embodiment, the existing carbon dispersion

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Abstract

La présente invention se rapporte à une composition de résine photosensible noire et à une couche de blocage de la lumière utilisant celle-ci, la composition de résine photosensible noire comprenant : (A) un agent colorant contenant du noir de lignine ; (B) une résine de liant organique ; (C) un monomère de photopolymérisation ; (D) un initiateur de photopolymérisation ; et (E) un solvant.
PCT/KR2013/011649 2013-07-11 2013-12-16 Composition de résine photosensible noire et couche de blocage de la lumière utilisant celle-ci WO2015005546A1 (fr)

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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20180061173A (ko) * 2015-09-28 2018-06-07 히타치가세이가부시끼가이샤 감광성 수지 조성물, 감광성 엘리먼트, 레지스터 패턴의 형성 방법 및 터치 패널의 제조 방법
KR101934846B1 (ko) 2016-07-18 2019-01-03 삼성에스디아이 주식회사 감광성 수지 조성물, 감광성 수지막 및 이를 포함하는 컬러필터
CN111247484A (zh) * 2017-10-17 2020-06-05 德山新勒克斯有限公司 具有改善的粘附力或粘接性的光敏树脂组合物及使用其的遮光层
US20210165320A1 (en) * 2019-11-28 2021-06-03 Duk San Neolux Co., Ltd Photosensitive Resin Composition And Display Device

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KR101871565B1 (ko) * 2016-01-19 2018-06-27 삼성에스디아이 주식회사 편광판 및 이를 포함하는 표시 장치
CN108474899B (zh) * 2016-01-19 2021-02-19 三星Sdi株式会社 偏光板和包括其的光学显示装置
KR102112864B1 (ko) * 2016-12-21 2020-05-19 삼성에스디아이 주식회사 편광판 및 이를 포함하는 광학 표시 장치
WO2018117410A1 (fr) * 2016-12-21 2018-06-28 삼성에스디아이 주식회사 Plaque polarisante et dispositif d'affichage optique la comprenant
KR102064297B1 (ko) 2017-02-16 2020-01-09 삼성에스디아이 주식회사 감광성 수지 조성물, 이를 이용한 블랙 화소 격벽층 및 디스플레이 장치
KR102087261B1 (ko) * 2017-02-16 2020-03-10 삼성에스디아이 주식회사 감광성 수지 조성물, 이를 이용한 블랙 화소 격벽층 및 디스플레이 장치
KR102063206B1 (ko) * 2017-09-14 2020-01-07 삼성에스디아이 주식회사 편광판 및 이를 포함하는 광학표시장치
KR102126053B1 (ko) * 2017-12-19 2020-06-23 삼성에스디아이 주식회사 편광판 및 이를 포함하는 광학표시장치
KR102126054B1 (ko) * 2017-12-21 2020-06-23 삼성에스디아이 주식회사 편광판 및 이를 포함하는 광학표시장치

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3864276A (en) * 1972-10-02 1975-02-04 Dryden Chemical Limited Lignin dispersing agents and method of making same
US4891070A (en) * 1987-04-13 1990-01-02 Westvaco Corporation Lignin amine salt as binder for aqueous printing ink composition
US4957557A (en) * 1988-10-11 1990-09-18 Westvaco Corporation Submicron lignin dispersions
US5192361A (en) * 1992-01-27 1993-03-09 Westvaco Corporation Submicron lignin-based binders for water-based black ink formulations
EP0829524A1 (fr) * 1996-09-12 1998-03-18 Westvaco Corporation Procédé de fabrication d'agents de dispersion à haute activité à base de lignine pour colorants, les dispersants ainsi produit et les compositions de colorants les contenant

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3864276A (en) * 1972-10-02 1975-02-04 Dryden Chemical Limited Lignin dispersing agents and method of making same
US4891070A (en) * 1987-04-13 1990-01-02 Westvaco Corporation Lignin amine salt as binder for aqueous printing ink composition
US4957557A (en) * 1988-10-11 1990-09-18 Westvaco Corporation Submicron lignin dispersions
US5192361A (en) * 1992-01-27 1993-03-09 Westvaco Corporation Submicron lignin-based binders for water-based black ink formulations
EP0829524A1 (fr) * 1996-09-12 1998-03-18 Westvaco Corporation Procédé de fabrication d'agents de dispersion à haute activité à base de lignine pour colorants, les dispersants ainsi produit et les compositions de colorants les contenant

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20180061173A (ko) * 2015-09-28 2018-06-07 히타치가세이가부시끼가이샤 감광성 수지 조성물, 감광성 엘리먼트, 레지스터 패턴의 형성 방법 및 터치 패널의 제조 방법
KR102522237B1 (ko) 2015-09-28 2023-04-17 가부시끼가이샤 레조낙 감광성 수지 조성물, 감광성 엘리먼트, 레지스터 패턴의 형성 방법 및 터치 패널의 제조 방법
KR101934846B1 (ko) 2016-07-18 2019-01-03 삼성에스디아이 주식회사 감광성 수지 조성물, 감광성 수지막 및 이를 포함하는 컬러필터
CN111247484A (zh) * 2017-10-17 2020-06-05 德山新勒克斯有限公司 具有改善的粘附力或粘接性的光敏树脂组合物及使用其的遮光层
US20200241415A1 (en) * 2017-10-17 2020-07-30 Duk San Neolux Co., Ltd Photosensitive resin composition having improved adhesiveness or adhesion and light blocking layer using same
US11803123B2 (en) * 2017-10-17 2023-10-31 Duk San Neolux Co., Ltd. Photosensitive resin composition having improved adhesiveness or adhesion and light blocking layer using same
CN111247484B (zh) * 2017-10-17 2024-01-09 德山新勒克斯有限公司 具有改善的粘附力或粘接性的光敏树脂组合物及使用其的遮光层
US20210165320A1 (en) * 2019-11-28 2021-06-03 Duk San Neolux Co., Ltd Photosensitive Resin Composition And Display Device
US11774852B2 (en) * 2019-11-28 2023-10-03 Duk San Neolux Co., Ltd. Photosensitive resin composition and display device

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