WO2015192280A1 - 可直视led发光元件 - Google Patents
可直视led发光元件 Download PDFInfo
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- WO2015192280A1 WO2015192280A1 PCT/CN2014/077087 CN2014077087W WO2015192280A1 WO 2015192280 A1 WO2015192280 A1 WO 2015192280A1 CN 2014077087 W CN2014077087 W CN 2014077087W WO 2015192280 A1 WO2015192280 A1 WO 2015192280A1
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- light
- phosphor
- adhesive layer
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- groove
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- 239000000758 substrate Substances 0.000 claims abstract description 39
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims description 61
- 239000010410 layer Substances 0.000 claims description 37
- 239000012790 adhesive layer Substances 0.000 claims description 28
- 239000011521 glass Substances 0.000 claims description 5
- 239000003292 glue Substances 0.000 abstract description 17
- 239000000843 powder Substances 0.000 abstract description 9
- 239000000853 adhesive Substances 0.000 abstract 3
- 230000001070 adhesive effect Effects 0.000 abstract 3
- 238000000034 method Methods 0.000 description 10
- 238000005516 engineering process Methods 0.000 description 8
- 238000004519 manufacturing process Methods 0.000 description 6
- 238000006243 chemical reaction Methods 0.000 description 5
- 230000003595 spectral effect Effects 0.000 description 5
- 238000005286 illumination Methods 0.000 description 3
- 201000009310 astigmatism Diseases 0.000 description 2
- 238000000605 extraction Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 239000011324 bead Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000000084 colloidal system Substances 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000011084 recovery Methods 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
Definitions
- the invention belongs to the technical field of LEDs, and particularly relates to a direct view LED light emitting component. Background technique
- LED blue light chips are generally made into LED light-emitting elements by spectral conversion.
- LED light-emitting elements can generally be divided into human eyes, such as LED light-emitting elements and direct-view LED light-emitting elements.
- the LED light-emitting elements are generally composed of a high-heat-conducting substrate and a high-power LED chip, and have a high luminous intensity per unit area, such as an LED lamp bead, an LED COB light source, and an LED light source made of such a technology, since one light-emitting surface of the LED chip is aluminum The substrate is blocked, and astigmatism is required.
- a frosted or milky white cover is disposed outside the LED light-emitting element, so the light-emitting efficiency is low; and the direct-view LED light-emitting element is generally composed of a light-transmitting substrate and a low-power LED chip, and the luminous intensity per unit area Small, such as LED strips, LED light source made by this technology is like an incandescent light source. Since the LED chip uses a transparent substrate to achieve omnidirectional omnidirectional light output, and does not require astigmatism, the light extraction efficiency is high.
- the direct illumination of the LED light-emitting component must solve the problem of the blue-light spectral conversion technology of the contact surface between the LED chip and the transparent substrate.
- the prior art methods are as follows:
- the phosphor of the technology is a colloid containing a phosphor, and the peripheral surface of the substrate with the chip is covered with a phosphor powder at the same time, thereby solving the technical problem of blue-light spectral conversion of the contact surface between the LED chip and the transparent substrate, but The thickness of the phosphor powder is difficult to control. It is too thick to block the light.
- a phosphor layer (20) is disposed on the upper surface of the transparent substrate (10), and a plurality of LED chips (30) are disposed on the phosphor layer (20), and the plurality of LED chips are disposed. (30) After the LED chip connection line (40) is connected, the phosphor chip glue (20) is further coated on the LED chip (30).
- the thickness of the phosphor layer can be controlled, the light extraction efficiency is improved, and the amount of phosphor of the LED light-emitting component product is reduced, but the glue layer is formed on the substrate, and the shrinkage deformation due to the curing of the glue Large, the thickness of the glue layer should be even and flat, the production process is complicated, and Quantitatively control the amount of phosphor process, because the phosphor is mixed with the glue, the process phosphor can not be recycled, the utilization rate is low, and the cost is high.
- the technical problem to be solved by the present invention is to provide a direct-view LED light-emitting element with high spectral conversion efficiency, quantitative control of the amount of phosphor process, and simple manufacturing process.
- a direct-view LED light-emitting component comprises a light-transmitting substrate (1), an LED chip (2), a phosphor layer (4), and an adhesive layer (5), wherein The upper surface of the light substrate (1) is provided with a groove (11).
- the groove (11) is provided with a phosphor layer (4), and an adhesive layer (5) is disposed on the phosphor layer (4).
- the non-electrode surface of the LED chip (2) is fixed on the adhesive layer (5).
- the present invention can further adopt the following structure:
- the adhesive layer (5) encloses the phosphor layer (4) inside the recess (11), and the upper surface of the adhesive layer (5) is flush with the upper surface of the transparent substrate (1).
- the width of the adhesive layer (5) is greater than or equal to the width of the phosphor layer, and the phosphor layer (4) is enclosed inside the groove (11), and the upper surface of the adhesive layer (5) forms a plane. .
- the light-transmitting substrate (1) is glass.
- the groove having a depth of the inner surface of the transparent substrate (1) is 0. 01- 0. 1 mm.
- the LED chips (2) are connected by a wire (7) and then connected to a power electrode (3).
- the invention has the advantages that the direct-view LED light-emitting component has the advantages that: a groove is arranged on the upper surface of the transparent substrate, a phosphor is arranged in the groove, and a glue layer is disposed on the phosphor powder, because the thickness of the phosphor layer It can be quantitatively controlled by groove depth, and the phosphor and glue can be separated, which can have the following effects:
- the technology of the existing phosphor layer size can not be quantitatively controlled greatly, and the spectral conversion efficiency of the LED chip can be optimized by quantitative control and adjustment of the phosphor.
- the technology of making the phosphor layer on the transparent substrate is greatly improved.
- the process is simple and suitable for mass production.
- the glue layer on the phosphor in the groove can be thin and not shrink, and the rubber layer is flat. It is easy to meet the requirements of solid crystal and wire bonding process of the rear LED chip.
- Fig. 1 is a schematic view showing the structure of an LED light-emitting element of the prior art.
- FIG. 2 is a schematic view showing an application structure of an embodiment of a direct-view LED light-emitting element according to the present invention.
- FIG. 3 is a schematic view showing the application structure of another embodiment of the direct-view LED light-emitting element according to the present invention. detailed description
- FIG. 2 is a schematic structural view of an embodiment of a direct-view LED light-emitting device according to the present invention, which can directly view an LED light-emitting component, including a light-transmitting substrate (1), an LED chip (2), and a power electrode. (3), a phosphor layer (4), an adhesive layer (5), a phosphor glue (6), an LED chip connection line (7), and a groove (the upper surface of the light-transmitting substrate (1) is provided ( 11), the groove (11) is provided with a phosphor layer (4), and an adhesive layer (5) is disposed on the phosphor layer, and the adhesive layer (5) closes the phosphor layer (4) Inside the groove (11), the upper surface of the adhesive layer (5) and the transparent substrate
- the upper surface of (I) is flush, the non-electrode surface of the LED chip (2) is fixed on the adhesive layer (5), and the LED chips (2) are connected by wires (7) and then connected to the power electrode. (3), the other surface of the LED chip (2) is coated with a phosphor paste (6).
- the light transmissive substrate (1) may be glass or other light transmissive material.
- the inner surface of the light-transmissive substrate (1) has a groove depth of 0. 01-0.
- FIG. 3 is a schematic structural view of an embodiment of a direct-view LED light-emitting device according to the present invention, which can directly view an LED light-emitting component, including a light-transmitting substrate (1), an LED chip (2), and a power electrode. (3), a phosphor layer (4), an adhesive layer (5), a phosphor paste (6), an LED chip connection line (7), and a groove on the upper surface of the transparent substrate (1)
- the groove (11) is provided with a phosphor layer (4), and an adhesive layer (5) is disposed on the phosphor layer (4), and the width of the adhesive layer (5) is greater than Or equal to the width of the phosphor layer, and the phosphor layer (4) is enclosed inside the recess (11), the upper surface of the adhesive layer (5) forms a plane, and the non-electrode surface of the LED chip (2) is fixed at The adhesive layer (5) is above, the LED chips (2) are connected by a connecting wire (7) and then connected to the power electrode (3), and the other surfaces of the LED chip (2) are coated with a phosphor layer outside. (6).
- the light transmissive substrate (1) may be glass or other light transmissive material.
- the inner surface of the light-transmitting substrate (1) has a groove depth of 0. 01-0.
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
Abstract
一种可直视LED发光元件,包括透光基板(1)、LED芯片(2)、荧光粉层(4)、粘结胶层(5),所述透光基板(1)的上表面设有凹槽(11),该凹槽(11)内设置有荧光粉层(4),在荧光粉层(4)上面设置一粘结胶层(5),LED芯片(2)的非电极面固定在粘结胶层(5)上面。
Description
可直视 LED发光元件 技术领域
本发明属于 LED技术领域, 具体涉及一种可直视 LED发光元件。 背景技术
在普通照明的使用中, LED蓝光芯片一般通过光谱转换制成 LED发光元件, 在现有技术 中, LED发光元件一般可分为人眼不可直视 LED发光元件与可直视 LED发光元件, 不可直视 LED发光元件一般都由高导热基板和大功率 LED芯片构成, 单位面积发光强度高, 如 LED灯 珠、 LED COB光源, 这种技术制成的 LED光源, 由于 LED芯片的一个发光面被铝基板遮挡, 并且都需要进行散光处理, 如在 LED发光元件外部设置一个磨砂或乳白外罩, 因此出光效率 低; 可直视 LED发光元件一般由透光基板和小功率 LED芯片构成, 单位面积发光强度小, 如 LED灯条, 这种技术制成的 LED光源像白炽灯光源, 由于 LED芯片采用透明基板实现了全方 向无遮挡出光, 并且无需散光处理, 因此出光效率高。
由于采用了透明基板, 可直视 LED发光元件必须解决 LED芯片与透明基板接触面的兰光 光谱转换技术问题, 现有技术的方法如下两种:
1、 如中国专利号为 201210552961. 4的文献中所公开的一种立体 LED白光器, 在透明基 板的上表面上设置 LED芯片, 然后用荧光粉体包裹带芯片的基板。 该技术的荧光粉体为含有 荧光粉的胶体, 由于带芯片的基板的四周面同时用荧光粉体包裹覆盖, 解决了 LED芯片与透 光基板接触面的兰光光谱转换的技术问题, 但由于荧光粉体厚度尺寸难控制, 太厚了遮挡了 出光, 太薄了会漏兰光, 影响 LED芯片的出光效率, 并且 LED发光元件产品的荧光粉用量大, 无法定量控制荧光粉的工艺过程用量, 由于荧光粉与胶混合在一起, 工艺过程荧光粉无法回 收, 利用率低, 成本高。
2、 如图 1, 在透光基板(10)的上表面上设置一层荧光粉胶层 (20), 在荧光粉胶层 (20)上 面设置多个 LED芯片(30), 多个 LED芯片(30)通过 LED芯片连接线 (40 ) 相连接后, 再在 LED 芯片(30)上面再涂粉荧光粉胶 (20 ) 。 该技术虽然比前述技术结构有所改进, 可以控制 荧光粉胶层厚度, 提高了出光效率, 降低了 LED发光元件产品的荧光粉用量, 但在基板上面 制作胶层, 由于胶的固化收縮变形量大, 要把胶层做到厚度均匀平整, 制作工艺复杂, 无法
定量控制荧光粉工艺过程用量, 由于荧光粉与胶混合在一起, 工艺过程荧光粉无法回收, 利 用率低, 成本高。
发明内容
本发明所要解决的技术问题在于提供一种光谱转换效率高、可定量控制荧光粉工艺过程 用量、 制作工艺简单的可直视 LED发光元件。
本发明所述的一种可直视 LED发光元件, 包括透光基板 (1 ) 、 LED芯片 (2) 、 荧光粉 层 (4) 、 粘结胶层 (5) , 其特征在于, 所述透光基板 (1 ) 的上表面设有凹槽 (11 ) , 该凹 槽(11 ) 内设置有荧光粉层(4) , 在荧光粉层(4)上面设置一粘结胶层(5) , LED芯片(2) 的非电极面固定在粘结胶层 (5) 上面。
本发明还可以进一步采用下述结构:
所述粘结胶层 (5) 将荧光粉层 (4) 封闭在凹槽 (11 ) 内部, 粘结胶层 (5 ) 的上表面 与透光基板 (1 ) 的上表面相平齐。
所述粘结胶层 (5) 的宽度大于或者等于荧光粉层的宽度, 并将荧光粉层 (4)封闭在凹 槽 (11 ) 内部, 粘结胶层 (5) 的上表面形成一平面。
所述透光基板 (1 ) 为玻璃。
所述透光基板 (1 ) 的上表面的凹槽深度尺寸为 0. 01- 0. 1毫米。
所述 LED芯片 (2) 之间通过导线 (7) 相连接后再连接至电源电极 (3) 。
本发明所述的一种可直视 LED发光元件的优点在于: 在透光基板上表面设置凹槽, 在凹 槽内设置荧光粉, 在荧光粉上面设置胶层, 由于荧光粉层的厚度尺寸可以由凹槽深度定量控 制, 荧光粉和胶分离使用, 可以有以下效果:
1、 极大改进了现有荧光粉层尺寸不可定量控制的技术, 可通过对荧光粉的定量控制和 调整, 使 LED芯片光谱转换效率达到最佳。
2、 极大改进了现有在透光基板上面制作荧光粉胶层的技术, 工艺简单, 适合批量生产 要求, 凹槽内荧光粉上面的胶层可以做到很薄不收縮, 胶层面平整, 容易符合后道 LED芯片 的固晶、 焊线工艺要求。
3、 极大改进了现有荧光粉及其胶的用量技术, 由于 LED发光元件产品的荧光粉用量是 由透光基板设置的凹槽尺寸决定的, 因此是在满足发光要求下最节省的荧光粉用量; 由于荧
光粉与胶分离使用, 不是现有技术的混合使用, 荧光粉的工艺过程回收率高,可以高达 100%, 荧光粉上面的胶层很薄, 节约了大量的昂贵的荧光粉和胶, 降低了 LED发光元件的制造成本。 附图说明
图 1是现有技术的一种 LED发光元件的结构示意图。
图 2是本发明所述的可直视 LED发光元件的一种实施例的应用结构示意图。
图 3是本发明所述的可直视 LED发光元件的另一种实施例的应用结构示意图。 具体实施方式
如图 2, 是本发明所述的可直视 LED发光元件的一种实施例的结构示意图, 一种可直视 LED发光元件, 包括透光基板 (1 ) 、 LED芯片 (2) 、 电源电极 (3) 、 荧光粉层 (4) 、 粘结 胶层 (5) 、 荧光粉胶 (6) 、 LED 芯片连接线 (7) , 所述透光基板 (1 ) 的上表面设有凹槽 ( 11 ) , 该凹槽 (11 ) 内设置有荧光粉层 (4) , 在荧光粉层上面设置粘结胶层 (5) , 所述 粘结胶层 (5)将荧光粉层 (4)封闭在凹槽 (11 ) 内部, 粘结胶层 (5) 的上表面与透光基板
( I ) 的上表面相平齐, LED芯片 (2) 的非电极面固定在粘结胶层 (5)上面, LED芯片 (2) 之间通过导线 (7) 相连接后再连接至电源电极 (3) , LED芯片 (2) 的其他表面外部涂覆有 荧光粉胶(6) 。 所述透光基板 (1 )可以为玻璃或其他透光材料。 所述透光基板 (1 ) 的上表 面的凹槽深度尺寸为 0. 01-0. 1毫米时效果最好。
如图 3, 是本发明所述的可直视 LED发光元件的一种实施例的结构示意图, 一种可直视 LED发光元件, 包括透光基板 (1 ) 、 LED芯片 (2) 、 电源电极 (3) 、 荧光粉层 (4) 、 粘结 胶层 (5) 、 荧光粉胶 (6) 、 LED 芯片连接线 (7) , 所述透光基板 (1 ) 的上表面设有凹槽
( I I ) , 该凹槽(11 ) 内设置有荧光粉层 (4) , 在荧光粉层 (4)上面设置一粘结胶层 (5) , 所述粘结胶层(5)的宽度大于或者等于荧光粉层的宽度, 并将荧光粉层(4)封闭在凹槽(11 ) 内部, 粘结胶层 (5) 的上表面形成一平面, LED芯片 (2) 的非电极面固定在粘结胶层 (5) 上面, LED芯片 (2) 之间通过连接线 (7) 相连接后再连接至电源电极 (3) , LED芯片 (2) 的其他表面外部涂覆有荧光粉胶层 (6) 。 所述透光基板 (1 ) 可以为玻璃或其他透光材料。 所述透光基板 (1 ) 的上表面的凹槽深度尺寸为 0. 01-0. 1毫米时效果最好。
采用上述两种实施例的结构, 相比现有的荧光粉胶涂层, 可以有更快的生产效率, 且可 以保证荧光粉的定量控制, 同时粘结胶层的上表面平整, 有利于 LED芯片的固定, 节省大量 的荧光粉, 大大降低 LED灯条的生产成本, 其经济效益非常明显。
Claims
1、 一种可直视 LED发光元件, 包括透光基板 (1 ) 、 LED芯片 (2) 、 荧光粉层 (4) 、 粘结 胶层 (5) , 其特征在于, 所述透光基板 (1 ) 的上表面设有凹槽 (11 ) , 该凹槽 (11 ) 内设 置有荧光粉层 (4) , 在荧光粉层 (4) 上面设置一粘结胶层 (5) , LED 芯片 (2 ) 的非电极 面固定在粘结胶层 (5) 上面。
2、 根据权利要求 1所述的可直视 LED发光元件, 其特征在于, 所述透光基板 (1 ) 为玻璃。
3、 根据权利要求 1所述的可直视 LED发光元件, 其特征在于, 所述透光基板 (1 ) 的上表面 的凹槽深度尺寸为 0. 01-0. 1毫米。
4、 根据权利要求 1所述的可直视 LED发光元件, 其特征在于, 所述粘结胶层 (5) 将荧光粉 层 (4) 封闭在凹槽 (11 ) 内部, 粘结胶层 (5) 的上表面与透光基板 (1 ) 的上表面相平齐。
5、 根据权利要求 1所述的可直视 LED发光元件, 其特征在于, 所述粘结胶层 (5) 的宽度大 于或者等于荧光粉层的宽度, 并将荧光粉层 (4) 封闭在凹槽 (11 ) 内部, 粘结胶层 (5) 的 上表面形成一平面。
6、 一种可直视 LED发光元件, 包括透光基板 (21 ) 、 LED芯片 (22) 、 荧光粉胶层 (24) , 其特征在于, 所述透光基板 (21 ) 的上表面设有凹槽 (211 ) , 该凹槽 (211 ) 内设置有荧光 粉胶层 (24) , LED芯片 (22) 的非电极面固定在荧光粉胶层 (24) 上面。
7、 根据权利要求 1所述的可直视 LED发光元件, 其特征在于, 所述透光基板 (1 ) 为玻璃。
8、 根据权利要求 1所述的可直视 LED发光元件, 其特征在于, 所述透光基板 (1 ) 的上表面 的凹槽深度尺寸为 0. 01-0. 1毫米。
9、 根据权利要求 1所述的可直视 LED发光元件, 其特征在于, 所述粘结胶层 (5) 将荧光粉 层 (4) 封闭在凹槽 (11 ) 内部, 粘结胶层 (5) 的上表面与透光基板 (1 ) 的上表面相平齐。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
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PCT/CN2014/077087 WO2015192280A1 (zh) | 2014-06-20 | 2014-06-20 | 可直视led发光元件 |
CN201480068261.5A CN105849919B (zh) | 2014-06-20 | 2014-06-20 | 可直视led发光元件 |
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Application Number | Priority Date | Filing Date | Title |
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PCT/CN2014/077087 WO2015192280A1 (zh) | 2014-06-20 | 2014-06-20 | 可直视led发光元件 |
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WO2015192280A1 true WO2015192280A1 (zh) | 2015-12-23 |
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US20090283788A1 (en) * | 2008-05-16 | 2009-11-19 | Yu-Nung Shen | Light-Emitting Diode Chip Package Body and Method for Manufacturing Same |
JP2010118532A (ja) * | 2008-11-13 | 2010-05-27 | Stanley Electric Co Ltd | 色変換発光装置 |
CN201868426U (zh) * | 2010-10-28 | 2011-06-15 | 王元成 | 一种led光源 |
CN202111089U (zh) * | 2011-06-22 | 2012-01-11 | 浙江英特来光电科技有限公司 | 可调光调色cobled结构 |
CN103840071A (zh) * | 2014-03-21 | 2014-06-04 | 苏州东山精密制造股份有限公司 | 一种led灯条制作方法及led灯条 |
CN103872224A (zh) * | 2014-03-04 | 2014-06-18 | 福建永德吉灯业股份有限公司 | 新型led发光元件 |
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CN103972364A (zh) * | 2014-05-10 | 2014-08-06 | 宋勇飞 | 一种led光源的制造方法 |
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US20090283788A1 (en) * | 2008-05-16 | 2009-11-19 | Yu-Nung Shen | Light-Emitting Diode Chip Package Body and Method for Manufacturing Same |
JP2010118532A (ja) * | 2008-11-13 | 2010-05-27 | Stanley Electric Co Ltd | 色変換発光装置 |
CN201868426U (zh) * | 2010-10-28 | 2011-06-15 | 王元成 | 一种led光源 |
CN202111089U (zh) * | 2011-06-22 | 2012-01-11 | 浙江英特来光电科技有限公司 | 可调光调色cobled结构 |
CN103872224A (zh) * | 2014-03-04 | 2014-06-18 | 福建永德吉灯业股份有限公司 | 新型led发光元件 |
CN103840071A (zh) * | 2014-03-21 | 2014-06-04 | 苏州东山精密制造股份有限公司 | 一种led灯条制作方法及led灯条 |
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