WO2015180351A1 - 有机发光显示面板的封装方法、有机发光显示面板及显示装置 - Google Patents

有机发光显示面板的封装方法、有机发光显示面板及显示装置 Download PDF

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WO2015180351A1
WO2015180351A1 PCT/CN2014/087898 CN2014087898W WO2015180351A1 WO 2015180351 A1 WO2015180351 A1 WO 2015180351A1 CN 2014087898 W CN2014087898 W CN 2014087898W WO 2015180351 A1 WO2015180351 A1 WO 2015180351A1
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organic light
light emitting
blocking oxygen
water blocking
display panel
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PCT/CN2014/087898
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English (en)
French (fr)
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藤野诚治
曾庆慧
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京东方科技集团股份有限公司
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Application filed by 京东方科技集团股份有限公司 filed Critical 京东方科技集团股份有限公司
Priority to US14/435,672 priority Critical patent/US9647236B2/en
Publication of WO2015180351A1 publication Critical patent/WO2015180351A1/zh

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/873—Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/844—Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K2102/00—Constructional details relating to the organic devices covered by this subclass

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  • At least one embodiment of the present invention is directed to a packaging method of an organic light emitting display panel, an organic light emitting display panel, and a display device.
  • an organic light-emitting display panel has gradually become a mainstream in the display field because of its advantages of fast response speed, wide color gamut, ultra-thin, and flexibility.
  • the organic light emitting display panel is provided with a plurality of organic light emitting diodes (OLEDs) arranged in a matrix and circuits of peripheral bonding regions.
  • OLEDs organic light emitting diodes
  • the cathode of an organic light emitting diode is made of a more active metal and is easily oxidized by moisture and oxygen in the air. Oxidation of the cathode causes irreversible effects on the organic layer material in the cathode and OLED, resulting in a shortened lifetime of the OLED and even damage to the OLED. Therefore, the OLED packaging process on the organic light emitting display panel is very important.
  • the OLED of the organic light emitting display panel is usually encapsulated by an organic or inorganic material, and the area corresponding to the OLED on the organic light emitting display panel is completely encapsulated, and the circuit of the peripheral binding region is exposed.
  • the organic light emitting display panel is usually packaged by Atomic Layer Deposition (ALD), and the packaging method includes the following steps.
  • ALD Atomic Layer Deposition
  • Step 1 Prepare an organic light emitting display panel in which a circuit having an OLED of a display area and a peripheral binding region has been fabricated.
  • Step 2 performing a coating of the water-blocking oxygen layer on the organic light-emitting display panel of the first step by using a mask including the pattern of the bonded region.
  • the film formed by the coating is an encapsulation layer, and the coating process is deposited by atomic layer deposition.
  • the mask includes an occlusion region and a hollow region, the occlusion region corresponding to at least the binding region, the cutout region corresponding to the region covered by each OLED.
  • the etch mask forms a water blocking oxygen layer in the region where the OLED is located for encapsulating the OLED, and the bonding region is exposed without forming a water blocking oxygen layer due to the shielding effect of the mask.
  • At least one embodiment of the present invention provides a method of packaging an organic light emitting display panel, an organic light emitting display panel, and a display device to realize a narrow frame organic light emitting display panel.
  • the packaging method of the organic light emitting display panel includes: forming a water blocking oxygen layer covering the entire substrate substrate on a substrate substrate on which the organic light emitting device and the peripheral bonding region are formed; The water-blocking oxygen layer on the substrate is etched to remove at least the water-blocking oxygen layer on the connection terminal in the bonding region, and the water-blocking oxygen layer on the organic light-emitting device is retained.
  • At least one embodiment of the present invention provides an organic light emitting display panel including an organic light emitting device located in a display region, and a bonding region located at a periphery, the organic light emitting display panel being packaged by the above packaging method.
  • At least one embodiment of the present invention provides a display device including the above-described organic light emitting display panel.
  • FIG. 1 is a schematic overall flow chart of a method for packaging an organic light emitting display panel according to an embodiment of the present invention
  • FIG. 2 is a schematic diagram of a relative position of a connection terminal and a binding area according to an embodiment of the present invention
  • FIG. 3 is a second schematic diagram of a relative position of a connection terminal and a binding area according to an embodiment of the present invention
  • FIG. 4 is a schematic top view of an unpackaged organic light emitting display panel according to an embodiment of the present invention.
  • FIG. 5 is a top plan view of an organic light emitting display panel in which a water blocking oxygen layer is formed on the organic light emitting display panel shown in FIG. 4;
  • FIG. 6 is a schematic top plan view of a mask plate structure according to an embodiment of the present invention.
  • FIG. 7 is a schematic view showing the relative positions of the mask shown in FIG. 6 and the organic light-emitting display panel shown in FIG. 5 before etching.
  • a film is formed on a substrate on which an OLED is formed by using a mask plate and an ALD technique, and a film cover formed by an ALD technique is preferable, and a film formed on a substrate corresponding to a hollow region of the mask plate is used.
  • the area of the layer is larger than the area of the hollow area.
  • the film wrapping range formed by the ALD technology is generally about 5 to 10 mm. Therefore, the distance between the connection terminal obtained by the mask process and the edge of the film package is about 5 to 10 mm. It is difficult to achieve a narrower border.
  • At least one embodiment of the present invention provides a method of packaging an organic light emitting display panel.
  • the organic light emitting display panel packaged by the method can realize a narrow border organic light emitting display panel.
  • a packaging method of an organic light emitting display panel includes: forming a water blocking oxygen layer covering the entire substrate substrate on a base substrate on which the organic light emitting device and the peripheral bonding region are formed; The water blocking oxygen layer on the base substrate is etched to remove at least the water blocking oxygen layer on the connection terminals in the bonding region, and the water blocking oxygen layer on the organic light emitting device is retained.
  • the water blocking oxygen layer on the organic light emitting device is used to encapsulate the OLED, preventing external water, oxygen, and/or nitrogen gas from entering the OLED, affecting the performance of the OLED or damaging the OLED.
  • FIG. 1 is a schematic overall flow chart of a method for packaging an organic light emitting display panel according to an embodiment of the present invention. As shown in FIG. 1 , the packaging method includes the following steps:
  • the water blocking oxygen layer may be an organic resin layer or an inorganic insulating layer.
  • the water blocking oxygen layer may be an aluminum oxide layer, a silicon nitride or silicon oxide layer or the like.
  • the OLED is a top emission structure, the emitted light passes through the water blocking oxygen layer, and in order to prevent the water blocking oxygen layer from blocking the light emitted by the OLED, for example, the water blocking oxygen layer may be a transparent film layer.
  • Removing at least the water blocking oxygen layer on the connection terminals in the bonding region may include the following two embodiments.
  • Method 1 Remove all water-blocking oxygen layers in the bonded area.
  • Method 2 Remove the water-blocking oxygen layer on the connection terminal in the bonded area, that is, retain the water-blocking oxygen layer outside the connection terminal.
  • the size and setting position of the binding area of the organic light emitting display panel may be determined according to actual needs.
  • the binding region 3 of the organic light-emitting display panel may have a size in the direction indicated by the arrow in FIG. 2 to be equivalent to the area covered by the connection terminal 31.
  • the binding area 3 is located in an area where the edge of the substrate extends a certain distance toward the center.
  • the binding area 3 of the organic light emitting display panel may have a smaller size in a direction indicated by an arrow in FIG. 3 than an area covered by the connection terminal 31, and a binding area is a distance from the edge of the substrate.
  • the organic light-emitting display panel shown in FIG. 2 and FIG. 3 can achieve a distance d between the bonding region and the water-blocking oxygen layer of the packaged OLED of 0.1 to 2 mm, and ensure that the OLED package is good and tied. The fixed area is exposed.
  • the water blocking oxygen layer may be formed on the base substrate by atomic layer deposition.
  • the water blocking oxygen layer on the substrate may be etched by plasma etching or laser etching.
  • the water blocking oxygen layer is etched by an oxygen plasma or an air plasma.
  • the packaging method of the organic light emitting display panel may further include: forming an etching protection layer on the water blocking oxygen layer, the etching protection a layer covering the organic light emitting device and exposing at least a connection terminal of the bonding region; or placing a mask on the water blocking oxygen layer, the mask being provided with at least a connection terminal with the bonding region A corresponding opening area, a masking area of the mask corresponding to the organic light emitting device.
  • the etch protection layer can avoid etching away the water blocking oxygen layer on the organic light emitting device.
  • the method of packaging the organic light-emitting display panel may further include: removing an etch protection layer on the water-blocking oxygen layer.
  • the distance between the bonding region and the etched water blocking oxygen layer is 0.1 to 2 mm.
  • Step 1 a base substrate on which a connection terminal of an organic light-emitting device and a peripheral bonding region is formed Above, a water-blocking oxygen layer covering the entire substrate is formed by an atomic layer deposition (ALD) method.
  • ALD atomic layer deposition
  • FIG. 4 An unpackaged organic light emitting display panel as shown in FIG. 4, the organic light emitting display panel comprising a substrate substrate 1 and a plurality of organic light emitting devices 2 and peripheral bonding regions 3 on a display region (AA region) on the substrate substrate 1 .
  • the peripheral bonding area 3 is provided with a connection terminal 31; the connection terminal 31 may be a circuit connection line of an IC bonding area on the organic light emitting display panel, and the connection terminal 31 may be exposed after being packaged by the organic light emitting display panel In order to be bound to the IC.
  • FIG. 5 is a top plan view of an organic light emitting display panel in which the water blocking oxygen layer 4 is formed on the organic light emitting display panel shown in FIG. 4.
  • Atomic Layer Deposition is a method of vapor phase thin film deposition in which the deposited material covers the entire substrate.
  • the water blocking oxygen layer formed by the ALD process is advantageous over other water blocking oxygen barrier layers formed by other thin film deposition techniques because the ALD grown film is typically conformally, pinhole-free, and chemically bonded into the substrate.
  • a uniform thickness coating can be deposited in deep trenches, porous media, and around the particles.
  • the water blocking oxygen layer may be an organic resin layer or an inorganic insulating layer.
  • the water blocking oxygen layer may be an aluminum oxide (Al 2 O 3 ) layer or a silicon nitride (SiN X ), silicon oxide (SiO X ).
  • Al 2 O 3 aluminum oxide
  • SiN X silicon nitride
  • SiO X silicon oxide
  • the water blocking oxygen layer may be a transparent film layer.
  • Step 2 etching the water blocking oxygen layer on the organic light emitting device with an etch protection layer to expose the water blocking oxygen layer in the bonding region.
  • the etch protection layer is a protective film layer that acts to prevent the mask from being etched away during etching, and is also referred to as a cover.
  • the etch protection layer may be a reticle or a peelable cover film layer.
  • an etch protection layer may be attached on a region corresponding to the organic light-emitting device on the water-blocking oxygen layer to expose water-blocking oxygen.
  • the area on the layer that corresponds to the binding area may be attached on a region corresponding to the organic light-emitting device on the water-blocking oxygen layer to expose water-blocking oxygen.
  • the etch protection layer is a reticle
  • a mask plate may be placed on the base substrate on which the water blocking oxygen layer is formed, and the reticle is provided with an opening corresponding to the binding region
  • the region corresponding to the organic light emitting device is provided with an etch protection region.
  • FIG. 6 is a schematic top view of a mask 5 according to an embodiment of the present invention
  • FIG. 7 is a front view of the mask shown in FIG. 6 and the organic light-emitting display panel (Panel) shown in FIG. Location map.
  • the etched protective layer is a reticle
  • the mask 5 is located above the organic light emitting display panel, and the opening 51 on the mask 5 corresponds to the bonding region 3 on the organic light emitting display panel, that is, the opening 51 on the mask 5 and the bonding region 3 on the substrate.
  • the projection overlaps, or the opening 51 is slightly larger than the area of the bonding area 3, ensuring that the connection terminals of the bonding area 3 are completely exposed to facilitate good bonding with the chip IC.
  • the second step is an option.
  • Step 3 etching the water blocking oxygen layer by plasma etching or laser etching to remove the water blocking oxygen layer corresponding to the bonding region, and retaining the water blocking oxygen layer corresponding to the organic light emitting device. That is, the portion of the water blocking oxygen layer 4 corresponding to the opening 51 on the mask 5 shown in FIG. 7 is removed, and the bonding region 3 corresponding to the opening 51 is exposed.
  • the plasma etching method may be an etching method such as an oxygen plasma or an air plasma.
  • the pattern and size of the etched water-blocking oxygen layer almost correspond to the pattern and size of the opening 51 on the mask 5 by plasma or laser etching, because of the etching precision of the plasma or laser etching method. Higher, the etching precision is on the order of micrometers.
  • the distance d between the bonded region and the water-blocking oxygen layer of the packaged OLED can be 0.1 to 2 mm, and the OLED package is ensured to be good. Fully exposed.
  • the distance between the binding region and the water blocking oxygen layer may be 0.1 to 2 mm. This makes it possible to realize an organic light-emitting display panel with a narrower border.
  • the organic light-emitting display panel of the embodiment of the present invention can reduce the width of the frame region by about 3 ⁇ compared with the organic light-emitting display panel with a distance of 5 to 10 mm between the connection terminal and the water-blocking oxygen layer of the packaged OLED. 9.9mm.
  • Step 4 removing the etch protection layer on the water blocking oxygen layer.
  • the etch protection layer is a peelable cover film layer
  • the etch protection layer may be peeled off.
  • the etched protective layer is a reticle
  • the reticle can be removed.
  • At least one embodiment of the present invention provides an organic light emitting display panel including an organic light emitting device located in a display region, and a bonding region located at a periphery, the organic light emitting display panel being packaged by the packaging method of the above organic light emitting display panel to make.
  • the distance between the binding region and the water blocking oxygen layer covering the organic light emitting device is 0.1 to 2 mm.
  • At least one embodiment of the present invention provides a display device including any of the above-described organic light emitting display panels.
  • the display device can be: electronic paper, mobile phone, tablet computer, television, display Any product or component that has a display function, such as a display, a notebook, a digital photo frame, and a navigator.
  • the method for packaging an organic light-emitting display panel, the organic light-emitting display panel, and the display device provided by the embodiments of the present invention form an entire lining on a substrate substrate on which a connection terminal of an organic light-emitting device and a peripheral bonding region is formed by an atomic layer deposition method.
  • a water blocking oxygen layer of the base substrate etching the water blocking oxygen layer on the base substrate by a plasma etching method or a laser etching method to remove the water blocking oxygen layer of the bonding region, and retaining the A water blocking oxygen layer on the organic light emitting device.
  • Atomic layer deposition coating is an effective OLED device packaging method.
  • the use of this technology has the advantage of good packaging effect, which makes it difficult for water molecules and oxygen in the air to enter the OLED, and the sealing effect is good.
  • Forming a water blocking oxygen layer in the organic light emitting device and the peripheral bonding region etching the water blocking oxygen layer on the substrate substrate by plasma etching or laser etching to remove the binding
  • the water-blocking oxygen layer of the region retains the water-blocking oxygen on the organic light-emitting device, so as to accurately control the coverage of the water-blocking oxygen layer around the bonded region.

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Abstract

一种有机发光显示面板的封装方法、有机发光显示面板及显示装置，该封装方法包括在形成有有机发光器件（2）和外围绑定区域（3）的衬底基板（1）上形成覆盖整个衬底基板（1）的阻水氧层（4），对该衬底基板（1）上的阻水氧层（4）进行刻蚀，至少去除该绑定区域（3）内的连接端子（31）上的阻水氧层（4），保留该有机发光器件（2）上的阻水氧层（4）。该封装方法可以实现窄边框的有机发光显示面板。

Description

有机发光显示面板的封装方法、有机发光显示面板及显示装置 技术领域
本发明的至少一个实施例涉及一种有机发光显示面板的封装方法、有机发光显示面板及显示装置。
背景技术
在显示技术领域，有机发光显示面板与液晶显示器相比由于其具有响应速度快、色域广、超薄、能实现柔性化等优点，已经逐渐成为显示领域的主流。
有机发光显示面板上设置有呈矩阵排列的多个有机发光二极管(Organic Light Emitting Diode，OLED)和外围绑定区域的电路。有机发光二极管的阴极由较活泼的金属制作而成，很容易被空气中的水分和氧气氧化。阴极被氧化会导致阴极和OLED中的有机层材料受到不可逆的影响，使得OLED的寿命缩短，甚至会损坏OLED。因此，有机发光显示面板上的OLED封装工序非常重要。通常通过有机或无机材料对有机发光显示面板的OLED进行封装，将有机发光显示面板上OLED对应的区域完全封装，将所述外围绑定区域的电路露出。
通常通过原子层沉积法(Atomic Layer Deposition，ALD)封装有机发光显示面板，封装方法包括如下步骤。
步骤一：准备已经制作有显示区域的OLED和外围绑定区域的电路的有机发光显示面板。
步骤二：采用包括所述绑定区域图形的掩模板，对步骤一所述的有机发光显示面板进行阻水氧层的镀膜，镀膜形成的膜层为封装层，镀膜过程采用原子层沉积法沉积；所述掩模板包括遮挡区域和镂空区域，所述遮挡区域至少与所述绑定区域对应，所述镂空区域与所述每一OLED覆盖的区域对应。掩模板的使得OLED所在区域形成阻水氧层用于封装所述OLED，所述绑定区域由于掩模板的遮挡作用，未形成阻水氧层而被露出。
发明内容
本发明的至少一个实施例提供一种有机发光显示面板的封装方法、有机发光显示面板及显示装置，以实现窄边框的有机发光显示面板。
本发明的至少一个实施例提供的所述有机发光显示面板的封装方法包括：在形成有有机发光器件和外围绑定区域的衬底基板上形成覆盖整个衬底基板的阻水氧层；对所述衬底基板上的阻水氧层进行刻蚀，至少去除所述绑定区域内的连接端子上的阻水氧层，保留所述有机发光器件上的阻水氧层。
本发明的至少一个实施例提供一种有机发光显示面板，其包括位于显示区域的有机发光器件，以及位于外围的绑定区域，所述有机发光显示面板采用上述封装方法封装而成。
本发明的至少一个实施例提供了一种显示装置，其包括上述有机发光显示面板。
附图说明
为了更清楚地说明本发明实施例的技术方案，下面将对实施例的附图作简单地介绍，显而易见地，下面描述中的附图仅仅涉及本发明的一些实施例，而非对本发明的限制。
图1为本发明实施例提供的有机发光显示面板的封装方法总体流程示意图；
图2为本发明实施例提供的连接端子与绑定区域相对位置示意图之一；
图3为本发明实施例提供的连接端子与绑定区域相对位置示意图之二；
图4为本发明实施例提供的未封装的有机发光显示面板俯视示意图；
图5为在图4所示的有机发光显示面板上形成阻水氧层的有机发光显示面板俯视示意图；
图6为本发明实施例提供的掩模板结构俯视示意图；
图7为图6所示的掩模板和图5所示的有机发光显示面板在刻蚀前二者的相对位置示意图。
具体实施方式
为使本发明实施例的目的、技术方案和优点更加清楚，下面将结合本发 明实施例的附图，对本发明实施例的技术方案进行清楚、完整地描述。显然，所描述的实施例是本发明的一部分实施例，而不是全部的实施例。基于所描述的本发明的实施例，本领域普通技术人员在无需创造性劳动的前提下所获得的所有其他实施例，都属于本发明保护的范围。
本申请的发明人注意到，采用掩模板和ALD技术在形成有OLED的基板上镀膜，ALD技术形成的薄膜包裹性(Step Coverage)较好，在掩模板的镂空区域对应的基板上形成的膜层的面积大于镂空区域的面积，例如，一般地，ALD技术形成的薄膜包裹范围约5～10mm，因此，采用掩模工艺得到的连接端子与薄膜封装边缘的距离约为5～10mm左右，这样难以实现更窄边框。
本发明的至少一个实施例提供了有机发光显示面板的封装方法，采用该方法封装的有机发光显示面板，可以实现窄边框的有机发光显示面板。
以下将结合附图具体说明本发明实施例提供的技术方案。
本发明的至少一个实施例提供的有机发光显示面板的封装方法包括：在形成有有机发光器件和外围绑定区域的衬底基板上形成覆盖整个衬底基板的阻水氧层；对所述衬底基板上的阻水氧层进行刻蚀，至少去除所述绑定区域内的连接端子上的阻水氧层，保留所述有机发光器件上的阻水氧层。有机发光器件上的阻水氧层用于封装所述OLED，防止外界的水、氧气和/或氮气等进入所述OLED，对OLED的性能造成影响或损坏OLED。
图1为本发明实施例提供的有机发光显示面板的封装方法总体流程示意图，如图1所示，该封装方法包括以下步骤：
S11、在形成有有机发光器件和外围绑定区域的衬底基板上，形成一层覆盖整个衬底基板的阻水氧层。
所述阻水氧层可以为有机树脂层或无机绝缘层，例如，所述阻水氧层可以为氧化铝层、氮化硅或氧化硅层等。当OLED为顶发射结构时，出射光线经过所述阻水氧层，为了避免阻水氧层对OLED发出的光线的阻挡，例如，所述阻水氧层可以为透明膜层。
S12、对所述阻水氧层进行刻蚀，至少去除所述绑定区域内的连接端子上的阻水氧层，保留有机发光器件上的阻水氧层。
至少去除所述绑定区域内的连接端子上的阻水氧层可以包括以下两种实施方式。
方式一：去除绑定区域的所有阻水氧层。
方式二：去除绑定区域内的连接端子上的阻水氧层，即保留连接端子之外的阻水氧层。
有机发光显示面板的绑定区域的大小和设置位置可以根据实际需求而定。例如，如图2所示，有机发光显示面板的绑定区域3沿图2中箭头所示方向的大小可以与连接端子31覆盖的区域相当。绑定区域3位于基板的边缘向中心延伸一定距离的区域。如图3所示，有机发光显示面板的绑定区域3沿图3中箭头所示方向的大小可以小于连接端子31覆盖的区域，绑定区域距离基板边缘设定距离的区域。
在不同实施例中，图2和图3所示的有机发光显示面板，可以做到绑定区域与封装OLED的阻水氧层之间的距离d为0.1～2mm，且保证OLED封装良好，绑定区域被露出。
在一个实施例中，可以通过原子层沉积法在所述衬底基板上形成所述阻水氧层。
在一个实施例中，可以通过等离子体刻蚀法或激光刻蚀法对所述衬底基板上的阻水氧层进行刻蚀。例如，通过氧等离子体或空气等离子体对所述阻水氧层进行刻蚀。
在不同实施例中，对所述阻水氧层进行刻蚀之前，所述有机发光显示面板的封装方法还可以包括：在所述阻水氧层上形成刻蚀保护层，所述刻蚀保护层覆盖所述有机发光器件，且至少露出所述绑定区域的连接端子；或者，在所述阻水氧层上放置掩模板，该掩模板上设置有至少与所述绑定区域的连接端子相对应的开口区域，所述掩膜板的遮盖区域与所述有机发光器件对应。所述刻蚀保护层可以避免将有机发光器件上的阻水氧层刻蚀掉。
在一个实施例中，对所述阻水氧层进行刻蚀之后，所述有机发光显示面板的封装方法还可以包括：去除所述阻水氧层上的刻蚀保护层。
在不同实施例中，所述绑定区域与所述刻蚀后的阻水氧层的距离为0.1～2mm。
以下将结合附图具体说明本发明的上述实施例提供的有机发光显示面板的封装方法。
步骤一：在形成有有机发光器件和外围绑定区域的连接端子的衬底基板 上，通过原子层沉积(ALD)法形成一层覆盖整个衬底基板的阻水氧层。
如图4所示的未封装的有机发光显示面板，该有机发光显示面板包括衬底基板1和位于衬底基板1上显示区域(AA区域)的多个有机发光器件2和外围绑定区域3。外围绑定区域3设置有连接端子31；该连接端子31可以为有机发光显示面板上的芯片绑定区域(IC bonding区域)的电路连接线，该连接端子31可以在有机发光显示面板封装之后露出，以便于与IC绑定。
图5为在图4所示的有机发光显示面板上形成阻水氧层4的有机发光显示面板俯视示意图。
原子层沉积(ALD)是一种气相薄膜沉积的方法，所沉积的材料覆盖衬底基板的各处。ALD法形成的阻水氧层相对于其它薄膜沉积技术形成的阻水氧层具有优势，因为ALD生长的膜典型地是共形地、没有针孔地和化学地结合到基材中。使用ALD法，可在深的沟槽、多孔介质中和颗粒周围沉积厚度均匀的涂层。
所述阻水氧层可以为有机树脂层或无机绝缘层，例如，所述阻水氧层可以为氧化铝(Al2O3)层或氮化硅(SiNX)，氧化硅(SiOX)。当OLED为顶发射结构时，出射光线经过所述阻水氧层，为了避免阻水氧层对OLED发出的光线的阻挡，例如，所述阻水氧层可以为透明膜层。
步骤二：采用刻蚀保护层遮盖有机发光器件上的阻水氧层，露出绑定区域的阻水氧层。所述刻蚀保护层为在刻蚀时起防止被遮盖物被刻蚀掉的作用的保护膜层，也称为遮盖物。
所述刻蚀保护层可以为掩模板，也可以为可剥离的遮盖膜层。
针对所述刻蚀保护层为可剥离的遮盖膜层的情况，例如，可以在所述阻水氧层上与所述有机发光器件对应的区域贴覆一层刻蚀保护层，露出阻水氧层上与绑定区域对应的区域。
针对所述刻蚀保护层为掩模板的情况，例如，可以在所述形成有阻水氧层的衬底基板上放置掩模板，该掩模板上设置有与所述绑定区域相对应的开口区域，与所述有机发光器件对应的区域设置有刻蚀保护区域。
图6为本发明实施例提供的掩模板(Mask)5的俯视示意图，图7为图6所示的掩模板和图5所示的有机发光显示面板(Panel)在刻蚀前二者的相对位置示意图。针对所述刻蚀保护层为掩模板的情况，如图6和图7所示， 掩模板5位于有机发光显示面板的上方，掩模板5上的开口51与有机发光显示面板上的绑定区域3对应，即掩模板5上的开口51和绑定区域3在衬底基板上的投影重叠，或者开口51略大于绑定区域3的面积，保证绑定区域3的连接端子完全露出以便于与芯片IC绑定良好。
所述步骤二为可选项。
步骤三：通过等离子体刻蚀法或激光刻蚀法对所述阻水氧层进行刻蚀，去除所述绑定区域对应的阻水氧层，保留有机发光器件对应的阻水氧层。也就是说，去除图7所示的掩模板5上的开口51对应的阻水氧层4部分，露出开口51对应的绑定区域3。
在不同实施例中，等离子体刻蚀法可以为氧等离子体或空气等离子体等刻蚀法。
通过等离子体或激光刻蚀方法，刻蚀掉的阻水氧层的图形以及大小与掩模板5上的开口51的图形和大小几乎对应，这是因为等离子体或激光刻蚀方法的刻蚀精度较高，刻蚀精度在微米量级，如图5所示，可以做到绑定区域与封装OLED的阻水氧层之间的距离d为0.1～2mm，且保证OLED封装良好，绑定区域完全露出。
所述绑定区域与所述阻水氧层的距离可以为0.1～2mm。这样可以实现更窄边框的有机发光显示面板。相比于连接端子与封装OLED的阻水氧层之间的距离为5～10mm的有机发光显示面板，本发明实施例提供的有机发光显示面板封装方法，可以使边框区域的宽度减少约3～9.9mm。
步骤四：去除所述阻水氧层上的刻蚀保护层。
针对所述刻蚀保护层为可剥离的遮盖膜层的情况，可以将所述刻蚀保护层剥离。针对所述刻蚀保护层为掩模板的情况，可以将所述掩模板移走。
本发明的至少一个实施例提供一种有机发光显示面板，其包括位于显示区域的有机发光器件，以及位于外围的绑定区域，所述有机发光显示面板采用上述有机发光显示面板的封装方法封装而成。
在不同实施例中，所述绑定区域与所述覆盖在所述有机发光器件的阻水氧层之间的距离为0.1～2mm。
本发明的至少一个实施例提供了一种显示装置，其包括上述任一种有机发光显示面板。该显示装置可以为：电子纸、手机、平板电脑、电视机、显 示器、笔记本电脑、数码相框、导航仪等任何具有显示功能的产品或部件。
本发明实施例提供的有机发光显示面板的封装方法、有机发光显示面板及显示装置，通过原子层沉积法在形成有有机发光器件和外围绑定区域的连接端子的衬底基板上形成覆盖整个衬底基板的阻水氧层；通过等离子体刻蚀法或激光刻蚀法对所述衬底基板上的阻水氧层进行刻蚀，去除所述绑定区域的阻水氧层，保留所述有机发光器件上的阻水氧层。原子层沉积法镀膜封装是一种有效的OLED器件封装方式，使用这技术具有封装效果好的优点，这使得空气中的水分子和氧气等难以进入OLED，密封效果好。通过在有机发光器件和外围绑定区域形成一层阻水氧层，通过等离子体刻蚀法或激光刻蚀法对所述衬底基板上的阻水氧层进行刻蚀，去除所述绑定区域的阻水氧层，保留所述有机发光器件上的阻水氧，可以实现精确控制绑定区域周围阻水氧层的覆盖范围。
显然，本领域的技术人员可以对本发明进行各种改动和变型而不脱离本发明的精神和范围。这样，倘若本发明的这些修改和变型属于本发明权利要求及其等同技术的范围之内，则本发明也意图包含这些改动和变型在内。
本申请要求于2014年5月28日递交的中国专利申请第201410232262.0号的优先权，在此全文引用上述中国专利申请公开的内容以作为本申请的一部分。

Claims (11)

  1. 一种有机发光显示面板的封装方法，包括：
    在形成有有机发光器件和外围绑定区域的衬底基板上形成覆盖整个衬底基板的阻水氧层；
    对所述衬底基板上的阻水氧层进行刻蚀，至少去除所述绑定区域内的连接端子上的阻水氧层，保留所述有机发光器件上的阻水氧层。
  2. 根据权利要求1所述的封装方法，其中，通过原子层沉积法在所述衬底基板上形成所述阻水氧层。
  3. 根据权利要求1或2所述的封装方法，其中，通过等离子体刻蚀法或激光刻蚀法对所述衬底基板上的阻水氧层进行刻蚀。
  4. 根据权利要求3所述的封装方法，其中，通过氧等离子体或空气等离子体对所述阻水氧层进行刻蚀。
  5. 根据权利要求1-4任一所述的封装方法，其中，所述阻水氧层为氧化铝层、氮化硅或氧化硅层。
  6. 根据权利要求1-5任一所述的封装方法，其中，所述绑定区域与所述覆盖在所述有机发光器件的阻水氧层之间的距离为0.1～2mm。
  7. 根据权利要求1-6任一所述的封装方法，对所述阻水氧层进行刻蚀之前，还包括：
    在所述阻水氧层上形成一层刻蚀保护层，所述刻蚀保护层覆盖所述有机发光器件，且至少露出所述绑定区域的连接端子；或者
    在所述阻水氧层上放置掩模板，所述掩模板上设置有至少与所述绑定区域的连接端子相对应的开口区域，所述掩膜板的遮盖区域与所述有机发光器件对应。
  8. 根据权利要求7所述的封装方法，对所述阻水氧层进行刻蚀之后，还包括：去除所述阻水氧层上的所述刻蚀保护层。
  9. 一种有机发光显示面板，包括位于显示区域的有机发光器件，以及位于外围的绑定区域，其中，所述有机发光显示面板采用权利要求1-8任一所述的封装方法封装而成。
  10. 根据权利要求9所述的有机发光显示面板，其中，所述绑定区域与 所述覆盖在所述有机发光器件的阻水氧层之间的距离为0.1～2mm。
  11. 一种显示装置，包括如权利要求9或10所述的有机发光显示面板。
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