WO2015163554A1 - Tampon d'adsorption pour un dispositif de transfert, et dispositif de transfert comportant ce dernier - Google Patents

Tampon d'adsorption pour un dispositif de transfert, et dispositif de transfert comportant ce dernier Download PDF

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Publication number
WO2015163554A1
WO2015163554A1 PCT/KR2014/011390 KR2014011390W WO2015163554A1 WO 2015163554 A1 WO2015163554 A1 WO 2015163554A1 KR 2014011390 W KR2014011390 W KR 2014011390W WO 2015163554 A1 WO2015163554 A1 WO 2015163554A1
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WO
WIPO (PCT)
Prior art keywords
structures
micro
base plate
cili
transfer
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Application number
PCT/KR2014/011390
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English (en)
Korean (ko)
Inventor
정훈의
Original Assignee
국립대학법인 울산과학기술대학교 산학협력단
주식회사 엠프리시젼
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Application filed by 국립대학법인 울산과학기술대학교 산학협력단, 주식회사 엠프리시젼 filed Critical 국립대학법인 울산과학기술대학교 산학협력단
Publication of WO2015163554A1 publication Critical patent/WO2015163554A1/fr

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
    • B23Q3/00—Devices holding, supporting, or positioning work or tools, of a kind normally removable from the machine
    • B23Q3/15—Devices for holding work using magnetic or electric force acting directly on the work
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67712—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrate being handled substantially vertically
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02N—ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR
    • H02N13/00—Clutches or holding devices using electrostatic attraction, e.g. using Johnson-Rahbek effect

Definitions

  • the present invention relates to a suction pad for a transfer device and a transfer device having the same, and more particularly, to a suction device for a transfer device that is composed of micro-cili structures, the micro-cili structures are adsorbed with a transfer object to safely transfer the transfer object. And it relates to a transfer device having the same.
  • a substrate processing apparatus for processing a wafer protects the wafer from foreign matter or chemical contamination in the air, and uses a closed wafer container such as a cassette or a carrier to store and transport the wafer.
  • a transfer apparatus capable of supporting and transferring the wafer is required.
  • Mechanical chucks and electrostatic chucks are used in conventional transfer devices.
  • the wafer In the case of a mechanical chuck, the wafer is generally supported by fixing the wafer in the vertical direction.
  • a problem occurs that the chuck directly touches the wafer surface and the wafer surface is damaged by the chuck.
  • the center of the back surface of the wafer is brought into contact with the adsorption portion of the electrostatic chuck in order to exert sufficient force for supporting the wafer.
  • foreign matter may be attached to the center or a wound may occur.
  • a problem may arise in that the wafer has a force for attracting a foreign material.
  • the adsorption pad 10 for the transfer device manufactured using the micro-ciliary structures may slide the micro-ciliary structures 11 in a horizontal direction while separating the wafers adsorbed to the micro-liquid structures 11, and thus, the wafer and the micro-liquids. Isolate the structures.
  • the micro-ciliary structures 11 positioned in the edge region of the adsorption pad 10 are subjected to strong stress and frictional force by the slide movement.
  • the strong stress and frictional force applied to the microciliary structures 11 positioned at the edge region of the suction pad 10 cause problems of damaging the microciliar structures 11 as shown in FIGS. 1 and 2.
  • the present invention provides a suction pad for a transfer device for transferring a transfer object to a stacked container, the suction plate comprising: a base plate; Micro-ciliary structures that are spaced apart from each other by a set interval in a set central region on the base plate and are adsorbed with the transfer object; And a partition wall disposed at a predetermined edge region on the base plate, the barrier rib being formed to surround the microciliary structures to prevent damage of the microciliar structures located near the edge region of the microciliar structures.
  • the suction pad for the transfer device for transferring the transfer object to the laminated container the base plate; Micro-ciliary structures that are spaced apart from each other by a set interval in a set central region on the base plate and are adsorbed with the transfer object; And damages formed in the set edge region on the base plate so as to be adsorbed to the transfer object and surround the micro-cilia structures so as to prevent damage of the micro-cilia structures positioned close to the edge region of the micro-cilia structures.
  • an adsorption pad for a transfer device comprising anti-micro fine structures.
  • the suction pad for the transfer device for transferring the transfer object to the stacked container the base plate; Micro-ciliary structures that are spaced apart from each other by a set interval in a set central region on the base plate and are adsorbed with the transfer object; And installed in the set edge region on the base plate is adsorbed to the transfer object, is formed surrounding the micro-ciliary structures to prevent damage to the micro-cili structures that are located close to the edge region of the micro-cili structures, Provided is an adsorption pad for a transfer device including damage preventing microciliary structures having a higher density than the microciliar structures.
  • Adsorption pad for a transfer device and a transfer device having the same according to the present invention has the following effects.
  • the damage preventing micro fine structures are adjusted in size and number so as to correspond to the stresses and frictional forces generated in the edge region, thereby preventing the micro fine structures and the damage preventing micro fine structures from being damaged by stress and friction, It may have the effect of safely transporting the transport object by improving the adsorption force.
  • FIG. 1 and 2 are enlarged views of a portion of a conventional suction pad for a transfer apparatus photographed.
  • FIG 3 is a plan view and a cross-sectional view showing a suction pad for a transfer device according to an embodiment of the present invention.
  • FIG. 4 is a plan view and a cross-sectional view showing a suction pad for a transfer device according to another embodiment of the present invention.
  • FIG. 5 is a plan view and a cross-sectional view showing a suction pad for a transfer device according to another embodiment of the present invention.
  • suction pad for the transfer device according to the present invention.
  • the transport apparatus further includes a main body (not shown) and a robot arm (not shown) together with the adsorption pad 100.
  • the main body (not shown) is the robot arm (not shown) is coupled, the main body (not shown) is provided with an operation control unit (not shown) for controlling the operation of the robot arm (not shown) Can be.
  • the operation control unit (not shown) is installed, the operator can directly control the operation control unit (not shown) to control the operation of the robot arm (not shown).
  • the operation of the robot arm (not shown) is not limited to being performed by an operator, but may be automatically performed according to a pre-stored setting.
  • the shape of the main body (not shown) is not specific, and may be formed in various forms in which the robot arm (not shown) may be coupled by a manufacturer.
  • the size of the main body (not shown) was generally large, but recently, the size of the main body (not shown) gradually decreases in order to improve the technology and space utilization.
  • the robot arm (not shown) is coupled to the main body (not shown) and provided with a suction pad 100 for the transfer device according to the present invention.
  • the robot arm (not shown) may be formed in various forms, but is generally formed in a structure having a joint, and the suction pad 100 and the suction pad 100 in various directions of up, down, left, and right.
  • the transfer object adsorbed in the) can be moved.
  • the transfer object for transferring to the suction pad 100 for the transfer device may be, for example, a wafer, a display panel, or the like. In the detailed description of the present invention, the transfer object is a wafer.
  • Figure 3 (a) is a plan view of a suction pad for a transfer device according to an embodiment of the present invention
  • (b) is a cross-sectional view of section A-A ⁇ of (a).
  • the adsorption pad 100 for the transport apparatus includes a base plate 101, microspil structures 110, and a partition wall 130.
  • the base plate 101 supports the microciliary structures 110 and the partition wall 130. More specifically, the micro-ciliary structures 110 and the partition wall 130 are installed on the base plate 101, and the suction pad 100 is moved by the base plate 101 to the robot arm (not shown). Is provided).
  • the base plate 101 is formed in a plate shape of a circular cross section.
  • the base plate 101 is formed only in the form of a plate having a circular cross section is limited to this embodiment, and the base plate 101 does not always need to be formed in a plate shape of a circular cross section.
  • each micro fine structure 110 includes a pillar portion 111 and the contact portion 113.
  • the pillar portion 111 is vertically installed on the base plate 101.
  • the pillar portion 111 is formed in the form of a cylindrical cylinder having a circular cross section that crosses the longitudinal direction. However, this is merely an example and need not be limited thereto.
  • the cross section of the pillar part 111 may be formed in a pillar shape having various cross-sectional shapes such as a triangle or a quadrangle.
  • the contact portion 113 is provided at the tip of the pillar portion 111 and is adsorbed with the transfer object. When the set pressure is applied, the contact portion 113 is in close contact with the transfer object and is adsorbed with the transfer object.
  • the contact portion 113 is formed with a concave surface 113a in contact with the transfer object. However, this is only an example, and is not limited to being concave, but may be formed in a shape having various shapes such as planar shape and convex shape.
  • the protrusion 113b is formed in the front-end
  • the contact part 113 is shown to be provided downward in this embodiment, when the adsorption pad 100 transports the object to be conveyed, the adsorption pad 100 is 180 ° such that the contact part 113 is upward. Is rotated.
  • the present invention is not limited thereto, and the contact part 113 may be in contact with the transfer object in a downward state.
  • the contact portion 113 is provided at the tip of the pillar portion 111 to be in close contact with the transfer object.
  • the protrusion 113b of the contact portion 113 is in contact with the transfer object, an air layer is formed between the transfer object and the contact surface 113a.
  • the contact surface 113a comes into close contact with the transfer object while the air of the air layer is removed between the transfer object and the contact surface 113a.
  • the micro-ciliary structures 110 are provided in plural numbers spaced apart from each other by a predetermined interval.
  • the micro-ciliary structures 110 are arranged in a matrix form so as to form a plurality of rows and a plurality of compartments. do.
  • the number of the micro-ciliary structures 110 is formed according to the size of the base plate 101, the size of the contact portion 113, the size of the object to be transferred to the suction pad 100.
  • the partition wall 130 serves to prevent damage of the micro-ciliary structures 110.
  • the partition wall 130 is installed on the base plate 101.
  • the partition wall 130 is installed at a predetermined edge region of the base plate 101.
  • the partition wall 130 is installed in the edge region of the base plate 101 to prevent damage to the micro-ciliary structures 110 positioned close to the edge region.
  • the partition wall 130 protrudes and extends on the base plate 101 by the edge area. And it is formed to surround the micro-ciliary structures 110 in the circumferential direction of the base plate 101.
  • the partition 101 is also formed along the circumferential direction of the base plate 101 to form a ring-like shape.
  • the height of the partition 130 is the same as the height of the micro-ciliary structures (110). Since the partition wall 130 is formed to prevent damage of the micro-ciliary structures 110, the height of the partition wall 130 should not be lower than the height of the micro-ciliary structures 110. If the height of the barrier 130 is lower than the height of the micro-ciliary structures 110, the stress and frictional force when the micro-ciliary structures 110 are separated from the object to be transferred are not distributed to the barrier 130. Due to the stress and friction force, the micro-ciliary structures 110 are damaged.
  • the height of the barrier 130 is the same as the height of the micro-ciliary structures 110 so that the stress and frictional force when the micro-ciliary structures 110 are separated from the transfer object to be distributed to the partition 130 Thereby preventing the microciliary structures 110 from being damaged.
  • the height of the microciliary structures 110 may be several nanometers to several hundred micrometers larger than the height of the partition wall 130.
  • the height of the microciliary structure 110 is reduced by the weight of the object to be transferred and the acceleration according to the operation of the conveying device, thereby lowering the height of the microciliar structure 110 and the partition wall 130. 130) may be uniformly contacted.
  • the microciliary structure 110 and the transfer object 130 may be easily separated in the vertical direction by elasticity generated by pressing the microciliar structure 110.
  • Figure 4 shows a suction pad 100 ⁇ for the transfer apparatus according to another embodiment of the present invention.
  • Figure 4 (a) is a plan view of a suction pad for a transfer device according to another embodiment of the present invention
  • (b) is a cross-sectional view of section B-B ⁇ of (a).
  • the adsorption pad 100 ⁇ for the transport apparatus is a base plate 101, micro-ciliary structures 110 and Damage prevention microciliary structures 130 ′.
  • the base plate 101 and the micro-ciliary structures 110 have the same configuration as the adsorption pad 100 for the transfer apparatus according to the above-described embodiment, the same reference numerals as in the exemplary embodiment are used, and detailed description thereof will be omitted. .
  • each of the damage preventing micro fine structures 130 ′ also includes a pillar portion 131 ′ and a contact portion 133 ′, and the contact portion 133 ′ is in contact with the surface 133 ′ a and the protrusion 133 ′. b).
  • each of the damage preventing microciliary structures 130 ′ is larger than the cross-sectional area of each of the microciliar structures 110. More specifically, the contact portion 133 ′ of the damage preventing microciliary structure 130 ′ is formed to be larger than the contact portion 113 of the microciliar structure 110. The size of the pillar portion 131 ′ of the damage preventing microciliary structure 130 ′ is greater than or equal to the size of the pillar portion 111 of the microciliar structure 110.
  • the damage preventing micro fine structures 130 ′ are also spaced apart from each other by a predetermined interval in the edge region, and are arranged in a matrix form to form a plurality of rows and a plurality of compartments.
  • the arrangement pitch of the damage preventing micro fine structures 130 ′ that is, the spacing between adjacent damage preventing micro fine structures 130 ′ is an arrangement pitch of the micro fine structures 110, that is, the adjacent fine fibers. Equal to the spacing between the ciliary structures 110.
  • the damage preventing microciliary structures 130 ′ are formed larger than the microciliar structures 110, the stress and frictional force generated in the edge region are greater than the microciliar structures 110. It also prevents damage to the microciliary structures 110 without being easily damaged by excessive friction. Therefore, the size of the damage prevention micro fine structure (130 ⁇ ) is determined in consideration of the stress and friction generated in the edge region.
  • FIG. 5 shows a suction pad 100 ′′ for a transfer device according to another embodiment of the present invention.
  • Figure 5 (a) is a plan view of a suction pad for a transfer device according to another embodiment of the present invention,
  • (b) is a cross-sectional view of section C-C ⁇ of (a).
  • Adsorption pad 100 ′′ for a transfer apparatus according to still another embodiment of the present invention with reference to FIG. 5 includes a base plate 101, microciliary structures 110, and damage preventing microciliar structures 130 ′′. do. Since the base plate 101 and the micro-ciliary structures 110 of the present embodiment also have the same configuration as the adsorption pad 100 for the transfer apparatus according to the above-described embodiment, the description thereof will be omitted using the same reference numerals.
  • the damage preventing microciliary structures 130 ′′ in the present embodiment have the same size as those of the microciliar structures 110. That is, the size of the contact portion 133 ′′ of the damage preventing micro fine structure 130 ′′ and the size of the contact portion 113 of the micro fine structure 110 are formed to be the same.
  • the density of the micro-ciliary structure 110 is installed in the central region of the base plate 101 and the damage preventing fine installed in the edge region of the base plate 101
  • the densities of the ciliary structures 130 ′′ differ from each other.
  • a first density of the damage preventing microciliary structures 130 ′′ installed in the edge region may correspond to those of the microciliar structures 110 installed in the central region. Greater than the second density.
  • the spacing of the micro-ciliary structures 110 is widened in the central region of the base plate 101, and the spacing of the micro-ciliary structures 110 is narrowed in the edge region of the base plate 101. Install it. Therefore, the density of the damage preventing micro fine structures 130 ′′ installed in the edge region is greater than that of the micro fine structures 110 installed in the central region.
  • the damage preventing micro-settle structures 130 ′′ may be installed such that the density of the damage preventing micro-settle structures 130 ′′ gradually increases from the central area to the edge area.
  • the density of the damage preventing micro fine structures 130 ′′ installed in the edge region is increased, the distribution of stress and frictional force generated in the edge area is evenly distributed, thereby preventing the damage preventing micro fine structure 130 130 ′′. It may be prevented from being damaged, and may have an effect of preventing damage to the microciliary structures 110.
  • the adsorption pad for the conveying apparatus By using the adsorption pad for the conveying apparatus according to the present invention, it is possible to develop a conveying apparatus which can safely transport the conveying object by improving the adsorption force and prolong the life.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Manipulator (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

La présente invention se rapporte à un tampon d'adsorption pour un dispositif de transfert et, de façon plus précise, à un tampon d'adsorption pour un dispositif de transfert, qui transfère un objet qui doit être transféré, vers un récipient d'empilage, le tampon d'adsorption comprenant : une plaque de base ; des microstructures ciliaires installées dans une zone centrale prédéterminée sur la plaque de base tout en étant espacées les unes des autres par un intervalle prédéterminé et adsorbées à l'objet à transférer ; et une barrière installée dans une zone périphérique prédéterminée sur la plaque de base et formée de sorte à entourer les microstructures ciliaires de telle sorte que, parmi les microstructures ciliaires, des microstructures ciliaires positionnées de manière adjacente à la zone périphérique ne puissent pas être endommagées.
PCT/KR2014/011390 2014-04-21 2014-11-26 Tampon d'adsorption pour un dispositif de transfert, et dispositif de transfert comportant ce dernier WO2015163554A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020140047393A KR101619876B1 (ko) 2014-04-21 2014-04-21 이송장치용 흡착패드 및 이를 구비하는 이송장치
KR10-2014-0047393 2014-04-21

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WO2015163554A1 true WO2015163554A1 (fr) 2015-10-29

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Publication number Priority date Publication date Assignee Title
KR102609560B1 (ko) 2017-09-08 2023-12-04 삼성전자주식회사 반도체 제조 장치
KR102214706B1 (ko) * 2020-10-11 2021-02-10 주식회사 지논 평판 이송용 패드 구조체

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008074565A (ja) * 2006-09-21 2008-04-03 Nippon Electric Glass Co Ltd 板状物の吸着方法及び吸着パッド
KR20080086340A (ko) * 2007-03-21 2008-09-25 (주)바로텍 척 및 이의 제조방법과 척킹/디척킹 방법
KR101025696B1 (ko) * 2009-11-30 2011-03-30 서울대학교산학협력단 진공접착을 위한 미세섬모 구조물, 이의 사용방법 및 제조방법
KR20120124700A (ko) * 2011-05-04 2012-11-14 엠.씨.케이 (주) 기판 흡착용 패드 및 이의 제조방법
US8524092B2 (en) * 2006-12-14 2013-09-03 Carnegie Mellon University Dry adhesives and methods for making dry adhesives

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008074565A (ja) * 2006-09-21 2008-04-03 Nippon Electric Glass Co Ltd 板状物の吸着方法及び吸着パッド
US8524092B2 (en) * 2006-12-14 2013-09-03 Carnegie Mellon University Dry adhesives and methods for making dry adhesives
KR20080086340A (ko) * 2007-03-21 2008-09-25 (주)바로텍 척 및 이의 제조방법과 척킹/디척킹 방법
KR101025696B1 (ko) * 2009-11-30 2011-03-30 서울대학교산학협력단 진공접착을 위한 미세섬모 구조물, 이의 사용방법 및 제조방법
KR20120124700A (ko) * 2011-05-04 2012-11-14 엠.씨.케이 (주) 기판 흡착용 패드 및 이의 제조방법

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KR20150121482A (ko) 2015-10-29
KR101619876B1 (ko) 2016-05-11

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