WO2015163554A1 - Adsorption pad for transfer device and transfer device having same - Google Patents

Adsorption pad for transfer device and transfer device having same Download PDF

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Publication number
WO2015163554A1
WO2015163554A1 PCT/KR2014/011390 KR2014011390W WO2015163554A1 WO 2015163554 A1 WO2015163554 A1 WO 2015163554A1 KR 2014011390 W KR2014011390 W KR 2014011390W WO 2015163554 A1 WO2015163554 A1 WO 2015163554A1
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Prior art keywords
structures
micro
base plate
cili
transfer
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PCT/KR2014/011390
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French (fr)
Korean (ko)
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정훈의
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국립대학법인 울산과학기술대학교 산학협력단
주식회사 엠프리시젼
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Publication of WO2015163554A1 publication Critical patent/WO2015163554A1/en

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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23QDETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
    • B23Q3/00Devices holding, supporting, or positioning work or tools, of a kind normally removable from the machine
    • B23Q3/15Devices for holding work using magnetic or electric force acting directly on the work
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67712Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrate being handled substantially vertically
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • HELECTRICITY
    • H02GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02NELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR
    • H02N13/00Clutches or holding devices using electrostatic attraction, e.g. using Johnson-Rahbek effect

Definitions

  • the present invention relates to a suction pad for a transfer device and a transfer device having the same, and more particularly, to a suction device for a transfer device that is composed of micro-cili structures, the micro-cili structures are adsorbed with a transfer object to safely transfer the transfer object. And it relates to a transfer device having the same.
  • a substrate processing apparatus for processing a wafer protects the wafer from foreign matter or chemical contamination in the air, and uses a closed wafer container such as a cassette or a carrier to store and transport the wafer.
  • a transfer apparatus capable of supporting and transferring the wafer is required.
  • Mechanical chucks and electrostatic chucks are used in conventional transfer devices.
  • the wafer In the case of a mechanical chuck, the wafer is generally supported by fixing the wafer in the vertical direction.
  • a problem occurs that the chuck directly touches the wafer surface and the wafer surface is damaged by the chuck.
  • the center of the back surface of the wafer is brought into contact with the adsorption portion of the electrostatic chuck in order to exert sufficient force for supporting the wafer.
  • foreign matter may be attached to the center or a wound may occur.
  • a problem may arise in that the wafer has a force for attracting a foreign material.
  • the adsorption pad 10 for the transfer device manufactured using the micro-ciliary structures may slide the micro-ciliary structures 11 in a horizontal direction while separating the wafers adsorbed to the micro-liquid structures 11, and thus, the wafer and the micro-liquids. Isolate the structures.
  • the micro-ciliary structures 11 positioned in the edge region of the adsorption pad 10 are subjected to strong stress and frictional force by the slide movement.
  • the strong stress and frictional force applied to the microciliary structures 11 positioned at the edge region of the suction pad 10 cause problems of damaging the microciliar structures 11 as shown in FIGS. 1 and 2.
  • the present invention provides a suction pad for a transfer device for transferring a transfer object to a stacked container, the suction plate comprising: a base plate; Micro-ciliary structures that are spaced apart from each other by a set interval in a set central region on the base plate and are adsorbed with the transfer object; And a partition wall disposed at a predetermined edge region on the base plate, the barrier rib being formed to surround the microciliary structures to prevent damage of the microciliar structures located near the edge region of the microciliar structures.
  • the suction pad for the transfer device for transferring the transfer object to the laminated container the base plate; Micro-ciliary structures that are spaced apart from each other by a set interval in a set central region on the base plate and are adsorbed with the transfer object; And damages formed in the set edge region on the base plate so as to be adsorbed to the transfer object and surround the micro-cilia structures so as to prevent damage of the micro-cilia structures positioned close to the edge region of the micro-cilia structures.
  • an adsorption pad for a transfer device comprising anti-micro fine structures.
  • the suction pad for the transfer device for transferring the transfer object to the stacked container the base plate; Micro-ciliary structures that are spaced apart from each other by a set interval in a set central region on the base plate and are adsorbed with the transfer object; And installed in the set edge region on the base plate is adsorbed to the transfer object, is formed surrounding the micro-ciliary structures to prevent damage to the micro-cili structures that are located close to the edge region of the micro-cili structures, Provided is an adsorption pad for a transfer device including damage preventing microciliary structures having a higher density than the microciliar structures.
  • Adsorption pad for a transfer device and a transfer device having the same according to the present invention has the following effects.
  • the damage preventing micro fine structures are adjusted in size and number so as to correspond to the stresses and frictional forces generated in the edge region, thereby preventing the micro fine structures and the damage preventing micro fine structures from being damaged by stress and friction, It may have the effect of safely transporting the transport object by improving the adsorption force.
  • FIG. 1 and 2 are enlarged views of a portion of a conventional suction pad for a transfer apparatus photographed.
  • FIG 3 is a plan view and a cross-sectional view showing a suction pad for a transfer device according to an embodiment of the present invention.
  • FIG. 4 is a plan view and a cross-sectional view showing a suction pad for a transfer device according to another embodiment of the present invention.
  • FIG. 5 is a plan view and a cross-sectional view showing a suction pad for a transfer device according to another embodiment of the present invention.
  • suction pad for the transfer device according to the present invention.
  • the transport apparatus further includes a main body (not shown) and a robot arm (not shown) together with the adsorption pad 100.
  • the main body (not shown) is the robot arm (not shown) is coupled, the main body (not shown) is provided with an operation control unit (not shown) for controlling the operation of the robot arm (not shown) Can be.
  • the operation control unit (not shown) is installed, the operator can directly control the operation control unit (not shown) to control the operation of the robot arm (not shown).
  • the operation of the robot arm (not shown) is not limited to being performed by an operator, but may be automatically performed according to a pre-stored setting.
  • the shape of the main body (not shown) is not specific, and may be formed in various forms in which the robot arm (not shown) may be coupled by a manufacturer.
  • the size of the main body (not shown) was generally large, but recently, the size of the main body (not shown) gradually decreases in order to improve the technology and space utilization.
  • the robot arm (not shown) is coupled to the main body (not shown) and provided with a suction pad 100 for the transfer device according to the present invention.
  • the robot arm (not shown) may be formed in various forms, but is generally formed in a structure having a joint, and the suction pad 100 and the suction pad 100 in various directions of up, down, left, and right.
  • the transfer object adsorbed in the) can be moved.
  • the transfer object for transferring to the suction pad 100 for the transfer device may be, for example, a wafer, a display panel, or the like. In the detailed description of the present invention, the transfer object is a wafer.
  • Figure 3 (a) is a plan view of a suction pad for a transfer device according to an embodiment of the present invention
  • (b) is a cross-sectional view of section A-A ⁇ of (a).
  • the adsorption pad 100 for the transport apparatus includes a base plate 101, microspil structures 110, and a partition wall 130.
  • the base plate 101 supports the microciliary structures 110 and the partition wall 130. More specifically, the micro-ciliary structures 110 and the partition wall 130 are installed on the base plate 101, and the suction pad 100 is moved by the base plate 101 to the robot arm (not shown). Is provided).
  • the base plate 101 is formed in a plate shape of a circular cross section.
  • the base plate 101 is formed only in the form of a plate having a circular cross section is limited to this embodiment, and the base plate 101 does not always need to be formed in a plate shape of a circular cross section.
  • each micro fine structure 110 includes a pillar portion 111 and the contact portion 113.
  • the pillar portion 111 is vertically installed on the base plate 101.
  • the pillar portion 111 is formed in the form of a cylindrical cylinder having a circular cross section that crosses the longitudinal direction. However, this is merely an example and need not be limited thereto.
  • the cross section of the pillar part 111 may be formed in a pillar shape having various cross-sectional shapes such as a triangle or a quadrangle.
  • the contact portion 113 is provided at the tip of the pillar portion 111 and is adsorbed with the transfer object. When the set pressure is applied, the contact portion 113 is in close contact with the transfer object and is adsorbed with the transfer object.
  • the contact portion 113 is formed with a concave surface 113a in contact with the transfer object. However, this is only an example, and is not limited to being concave, but may be formed in a shape having various shapes such as planar shape and convex shape.
  • the protrusion 113b is formed in the front-end
  • the contact part 113 is shown to be provided downward in this embodiment, when the adsorption pad 100 transports the object to be conveyed, the adsorption pad 100 is 180 ° such that the contact part 113 is upward. Is rotated.
  • the present invention is not limited thereto, and the contact part 113 may be in contact with the transfer object in a downward state.
  • the contact portion 113 is provided at the tip of the pillar portion 111 to be in close contact with the transfer object.
  • the protrusion 113b of the contact portion 113 is in contact with the transfer object, an air layer is formed between the transfer object and the contact surface 113a.
  • the contact surface 113a comes into close contact with the transfer object while the air of the air layer is removed between the transfer object and the contact surface 113a.
  • the micro-ciliary structures 110 are provided in plural numbers spaced apart from each other by a predetermined interval.
  • the micro-ciliary structures 110 are arranged in a matrix form so as to form a plurality of rows and a plurality of compartments. do.
  • the number of the micro-ciliary structures 110 is formed according to the size of the base plate 101, the size of the contact portion 113, the size of the object to be transferred to the suction pad 100.
  • the partition wall 130 serves to prevent damage of the micro-ciliary structures 110.
  • the partition wall 130 is installed on the base plate 101.
  • the partition wall 130 is installed at a predetermined edge region of the base plate 101.
  • the partition wall 130 is installed in the edge region of the base plate 101 to prevent damage to the micro-ciliary structures 110 positioned close to the edge region.
  • the partition wall 130 protrudes and extends on the base plate 101 by the edge area. And it is formed to surround the micro-ciliary structures 110 in the circumferential direction of the base plate 101.
  • the partition 101 is also formed along the circumferential direction of the base plate 101 to form a ring-like shape.
  • the height of the partition 130 is the same as the height of the micro-ciliary structures (110). Since the partition wall 130 is formed to prevent damage of the micro-ciliary structures 110, the height of the partition wall 130 should not be lower than the height of the micro-ciliary structures 110. If the height of the barrier 130 is lower than the height of the micro-ciliary structures 110, the stress and frictional force when the micro-ciliary structures 110 are separated from the object to be transferred are not distributed to the barrier 130. Due to the stress and friction force, the micro-ciliary structures 110 are damaged.
  • the height of the barrier 130 is the same as the height of the micro-ciliary structures 110 so that the stress and frictional force when the micro-ciliary structures 110 are separated from the transfer object to be distributed to the partition 130 Thereby preventing the microciliary structures 110 from being damaged.
  • the height of the microciliary structures 110 may be several nanometers to several hundred micrometers larger than the height of the partition wall 130.
  • the height of the microciliary structure 110 is reduced by the weight of the object to be transferred and the acceleration according to the operation of the conveying device, thereby lowering the height of the microciliar structure 110 and the partition wall 130. 130) may be uniformly contacted.
  • the microciliary structure 110 and the transfer object 130 may be easily separated in the vertical direction by elasticity generated by pressing the microciliar structure 110.
  • Figure 4 shows a suction pad 100 ⁇ for the transfer apparatus according to another embodiment of the present invention.
  • Figure 4 (a) is a plan view of a suction pad for a transfer device according to another embodiment of the present invention
  • (b) is a cross-sectional view of section B-B ⁇ of (a).
  • the adsorption pad 100 ⁇ for the transport apparatus is a base plate 101, micro-ciliary structures 110 and Damage prevention microciliary structures 130 ′.
  • the base plate 101 and the micro-ciliary structures 110 have the same configuration as the adsorption pad 100 for the transfer apparatus according to the above-described embodiment, the same reference numerals as in the exemplary embodiment are used, and detailed description thereof will be omitted. .
  • each of the damage preventing micro fine structures 130 ′ also includes a pillar portion 131 ′ and a contact portion 133 ′, and the contact portion 133 ′ is in contact with the surface 133 ′ a and the protrusion 133 ′. b).
  • each of the damage preventing microciliary structures 130 ′ is larger than the cross-sectional area of each of the microciliar structures 110. More specifically, the contact portion 133 ′ of the damage preventing microciliary structure 130 ′ is formed to be larger than the contact portion 113 of the microciliar structure 110. The size of the pillar portion 131 ′ of the damage preventing microciliary structure 130 ′ is greater than or equal to the size of the pillar portion 111 of the microciliar structure 110.
  • the damage preventing micro fine structures 130 ′ are also spaced apart from each other by a predetermined interval in the edge region, and are arranged in a matrix form to form a plurality of rows and a plurality of compartments.
  • the arrangement pitch of the damage preventing micro fine structures 130 ′ that is, the spacing between adjacent damage preventing micro fine structures 130 ′ is an arrangement pitch of the micro fine structures 110, that is, the adjacent fine fibers. Equal to the spacing between the ciliary structures 110.
  • the damage preventing microciliary structures 130 ′ are formed larger than the microciliar structures 110, the stress and frictional force generated in the edge region are greater than the microciliar structures 110. It also prevents damage to the microciliary structures 110 without being easily damaged by excessive friction. Therefore, the size of the damage prevention micro fine structure (130 ⁇ ) is determined in consideration of the stress and friction generated in the edge region.
  • FIG. 5 shows a suction pad 100 ′′ for a transfer device according to another embodiment of the present invention.
  • Figure 5 (a) is a plan view of a suction pad for a transfer device according to another embodiment of the present invention,
  • (b) is a cross-sectional view of section C-C ⁇ of (a).
  • Adsorption pad 100 ′′ for a transfer apparatus according to still another embodiment of the present invention with reference to FIG. 5 includes a base plate 101, microciliary structures 110, and damage preventing microciliar structures 130 ′′. do. Since the base plate 101 and the micro-ciliary structures 110 of the present embodiment also have the same configuration as the adsorption pad 100 for the transfer apparatus according to the above-described embodiment, the description thereof will be omitted using the same reference numerals.
  • the damage preventing microciliary structures 130 ′′ in the present embodiment have the same size as those of the microciliar structures 110. That is, the size of the contact portion 133 ′′ of the damage preventing micro fine structure 130 ′′ and the size of the contact portion 113 of the micro fine structure 110 are formed to be the same.
  • the density of the micro-ciliary structure 110 is installed in the central region of the base plate 101 and the damage preventing fine installed in the edge region of the base plate 101
  • the densities of the ciliary structures 130 ′′ differ from each other.
  • a first density of the damage preventing microciliary structures 130 ′′ installed in the edge region may correspond to those of the microciliar structures 110 installed in the central region. Greater than the second density.
  • the spacing of the micro-ciliary structures 110 is widened in the central region of the base plate 101, and the spacing of the micro-ciliary structures 110 is narrowed in the edge region of the base plate 101. Install it. Therefore, the density of the damage preventing micro fine structures 130 ′′ installed in the edge region is greater than that of the micro fine structures 110 installed in the central region.
  • the damage preventing micro-settle structures 130 ′′ may be installed such that the density of the damage preventing micro-settle structures 130 ′′ gradually increases from the central area to the edge area.
  • the density of the damage preventing micro fine structures 130 ′′ installed in the edge region is increased, the distribution of stress and frictional force generated in the edge area is evenly distributed, thereby preventing the damage preventing micro fine structure 130 130 ′′. It may be prevented from being damaged, and may have an effect of preventing damage to the microciliary structures 110.
  • the adsorption pad for the conveying apparatus By using the adsorption pad for the conveying apparatus according to the present invention, it is possible to develop a conveying apparatus which can safely transport the conveying object by improving the adsorption force and prolong the life.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
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Abstract

The present invention relates to an adsorption pad for a transfer device and, more particularly, to an adsorption pad for a transfer device, which transfers an object to be transferred to a stacking container, the adsorption pad comprising: a base plate; micro ciliary structures installed in a predetermined central area on the base plate while being spaced from each other by a predetermined interval and adsorbed to the object to be transferred; and a barrier installed in a predetermined peripheral area on the base plate and formed to surround the micro ciliary structures such that, among the micro ciliary structures, micro ciliary structures positioned adjacent to the peripheral area are prevented from being damaged.

Description

이송장치용 흡착패드 및 이를 구비하는 이송장치Suction pad for transfer device and transfer device with same
본 발명은 이송장치용 흡착패드 및 이를 구비하는 이송장치에 관한 것으로서, 보다 상세하게는 미세섬모 구조물들로 이루어져 미세섬모 구조물들이 이송 대상물과 흡착하여 이송 대상물을 안전하게 이송시킬 수 있는 이송장치용 흡착패드 및 이를 구비하는 이송장치에 관한 것이다.The present invention relates to a suction pad for a transfer device and a transfer device having the same, and more particularly, to a suction device for a transfer device that is composed of micro-cili structures, the micro-cili structures are adsorbed with a transfer object to safely transfer the transfer object. And it relates to a transfer device having the same.
반도체 소자를 제공하기 위하여, 웨이퍼를 처리하는 기판 처리 장치는 대기 중의 이물질이나 화학적인 오염으로부터 웨이퍼를 보호하며, 웨이퍼를 저장 및 운반하기 위해 카세트, 캐리어 등의 밀폐형 웨이퍼 컨테이너를 사용한다. 웨이퍼를 카세트, 캐리어 등의 밀폐형 웨이퍼 컨테이너로 이송하기 위해서는 웨이퍼를 지지하여 이송할 수 있는 이송장치가 필요하다. In order to provide a semiconductor device, a substrate processing apparatus for processing a wafer protects the wafer from foreign matter or chemical contamination in the air, and uses a closed wafer container such as a cassette or a carrier to store and transport the wafer. In order to transfer the wafer to a closed wafer container such as a cassette or a carrier, a transfer apparatus capable of supporting and transferring the wafer is required.
종래의 이송장치에는 기계적 척 및 정전 척이 이용되고 있다. 기계적 척의 경우 일반적으로 웨이퍼를 상하 방향으로 고정하여 웨이퍼를 지지한다. 그런데 전자의 경우와 같이 상기 웨이퍼의 상하 방향으로 고정하여 지지하게 되면, 척이 웨이퍼 표면에 직접 닿아 웨이퍼 표면이 척에 의해 상처가 생기는 문제점이 발생된다. Mechanical chucks and electrostatic chucks are used in conventional transfer devices. In the case of a mechanical chuck, the wafer is generally supported by fixing the wafer in the vertical direction. However, as in the case of the former, when fixed and supported in the vertical direction of the wafer, a problem occurs that the chuck directly touches the wafer surface and the wafer surface is damaged by the chuck.
한편, 정전 척의 경우, 웨이퍼를 지지하기 위한 충분한 힘을 발휘하기 위해 웨이퍼 이면의 중심부를 정전 척의 흡착부와 접촉시켜 고정한다. 그런데 정전 척을 사용하는 경우, 웨이퍼의 이면 중심부가 정척 척의 흡착부와 접촉하여 고정되면서 중심부에 이물질이 부착하거나 상처가 발생할 우려가 있다. 특히, 잔류 전하나 누설 전기장에 흐를 경우, 이들에 의해 웨이퍼가 이물질을 끌어당기는 힘이 갖게 되는 문제점이 발생될 수 있다. 이러한 문제점들을 해결하기 위해 최근에는 미세섬모 구조물을 이용하여 웨이퍼를 이송하기 위한 장치가 개발되고 있다. On the other hand, in the case of the electrostatic chuck, the center of the back surface of the wafer is brought into contact with the adsorption portion of the electrostatic chuck in order to exert sufficient force for supporting the wafer. However, in the case of using the electrostatic chuck, while the center of the back surface of the wafer is fixed in contact with the adsorption portion of the chuck, foreign matter may be attached to the center or a wound may occur. In particular, when a residual electric charge or a leakage electric field flows, a problem may arise in that the wafer has a force for attracting a foreign material. Recently, in order to solve these problems, an apparatus for transferring wafers using a microciliary structure has been developed.
그런데 미세섬모 구조물들을 이용하여 제작된 이송장치용 흡착패드(10)는 미세섬모 구조물(11)들에 흡착된 웨이퍼를 분리시킬 때 미세섬모 구조물(11)들을 수평방향으로 슬라이딩 이동시키면서 웨이퍼와 미세섬모 구조물들을 분리시킨다. 이때, 흡착패드(10)의 가장자리 영역에 위치하는 미세섬모 구조물(11)들은 슬라이드 이동에 의해 강한 응력과 마찰력을 받게 된다. 흡착패드(10)의 가장자리 영역에 위치하는 미세섬모 구조물(11)들에 가해지는 강한 응력과 마찰력은 도 1 및 도 2에 도시된 바와 같이 미세섬모 구조물(11)들을 손상시키는 문제점을 일으킨다.However, the adsorption pad 10 for the transfer device manufactured using the micro-ciliary structures may slide the micro-ciliary structures 11 in a horizontal direction while separating the wafers adsorbed to the micro-liquid structures 11, and thus, the wafer and the micro-liquids. Isolate the structures. At this time, the micro-ciliary structures 11 positioned in the edge region of the adsorption pad 10 are subjected to strong stress and frictional force by the slide movement. The strong stress and frictional force applied to the microciliary structures 11 positioned at the edge region of the suction pad 10 cause problems of damaging the microciliar structures 11 as shown in FIGS. 1 and 2.
본 발명은 미세섬모 구조물들로 이루어져 미세섬모 구조물들이 이송 대상물과 흡착하여 이송 대상물을 안전하게 이송시킬 수 있는 이송장치용 흡착패드 및 이를 구비하는 이송장치를 제공하는 것을 목적으로 한다.It is an object of the present invention to provide a suction device for a transfer device and a transfer device having the same, which consists of micro-ciliary structures, which are capable of safely transporting the transfer object by adsorbing with the transfer object.
본 발명은, 이송 대상물을 적층 컨테이너로 이송시키는 이송장치용 흡착패드에 있어서, 베이스 플레이트; 상기 베이스 플레이트 상의 설정된 중앙 영역에 설정 간격만큼 상호 이격되어 설치되며, 상기 이송 대상물과 흡착되는 미세섬모 구조물들; 및 상기 베이스 플레이트 상의 설정된 가장자리 영역에 설치되어, 상기 미세섬모 구조물들 중 상기 가장자리 영역에 근접하게 위치하는 미세섬모 구조물들의 손상을 방지하도록 상기 미세섬모 구조물들을 둘러싸며 형성되는 격벽을 포함하는 이송장치용 흡착패드를 제공한다.The present invention provides a suction pad for a transfer device for transferring a transfer object to a stacked container, the suction plate comprising: a base plate; Micro-ciliary structures that are spaced apart from each other by a set interval in a set central region on the base plate and are adsorbed with the transfer object; And a partition wall disposed at a predetermined edge region on the base plate, the barrier rib being formed to surround the microciliary structures to prevent damage of the microciliar structures located near the edge region of the microciliar structures. Provide a suction pad.
본 발명의 다른 측면에 따르면, 본 발명은, 이송 대상물을 적층 컨테이너로 이송시키는 이송장치용 흡착패드에 있어서, 베이스 플레이트; 상기 베이스 플레이트 상의 설정된 중앙 영역에 설정 간격만큼 상호 이격되어 설치되며, 상기 이송 대상물과 흡착되는 미세섬모 구조물들; 및 상기 베이스 플레이트 상의 설정된 가장자리 영역에 설치되어 상기 이송 대상물에 흡착되고, 상기 미세섬모 구조물들 중 상기 가장자리 영역에 근접하게 위치하는 미세섬모 구조물들의 손상을 방지하도록 상기 미세섬모 구조물들을 둘러싸며 형성되는 손상방지 미세섬모 구조물들을 포함하는 이송장치용 흡착패드를 제공한다.According to another aspect of the present invention, the present invention, the suction pad for the transfer device for transferring the transfer object to the laminated container, the base plate; Micro-ciliary structures that are spaced apart from each other by a set interval in a set central region on the base plate and are adsorbed with the transfer object; And damages formed in the set edge region on the base plate so as to be adsorbed to the transfer object and surround the micro-cilia structures so as to prevent damage of the micro-cilia structures positioned close to the edge region of the micro-cilia structures. Provided is an adsorption pad for a transfer device comprising anti-micro fine structures.
본 발명의 또 다른 측면에 따르면, 본 발명은, 이송 대상물을 적층 컨테이너로 이송시키는 이송장치용 흡착패드에 있어서, 베이스 플레이트; 상기 베이스 플레이트 상의 설정된 중앙 영역에 설정 간격만큼 상호 이격되어 설치되며, 상기 이송 대상물과 흡착되는 미세섬모 구조물들; 및 상기 베이스 플레이트 상의 설정된 가장자리 영역에 설치되어 상기 이송 대상물에 흡착되고, 상기 미세섬모 구조물들 중 상기 가장자리 영역에 근접하게 위치하는 미세섬모 구조물들의 손상을 방지하도록 상기 미세섬모 구조물들을 둘러싸며 형성되되, 상기 미세섬모 구조물들보다 높은 밀집도를 갖는 손상방지 미세섬모 구조물들을 포함하는 이송장치용 흡착패드를 제공한다.According to another aspect of the invention, the present invention, the suction pad for the transfer device for transferring the transfer object to the stacked container, the base plate; Micro-ciliary structures that are spaced apart from each other by a set interval in a set central region on the base plate and are adsorbed with the transfer object; And installed in the set edge region on the base plate is adsorbed to the transfer object, is formed surrounding the micro-ciliary structures to prevent damage to the micro-cili structures that are located close to the edge region of the micro-cili structures, Provided is an adsorption pad for a transfer device including damage preventing microciliary structures having a higher density than the microciliar structures.
본 발명에 따른 이송장치용 흡착패드 및 이를 구비하는 이송장치는 다음과 같은 효과가 있다. Adsorption pad for a transfer device and a transfer device having the same according to the present invention has the following effects.
첫째, 베이스 플레이트 상에 미세섬모 구조물들을 감싸는 손상방지수단을 구비하여 미세섬모 구조물들과 이송 대상물이 분리될 때 발생되는 응력과 마찰력에 의해 미세섬모 구조물들이 손상되는 것을 방지하는 효과를 갖는다.First, by providing a damage preventing means for enclosing the micro-ciliary structures on the base plate has an effect of preventing the micro-ciliary structures are damaged by the stress and friction generated when the micro-cili structure and the object to be transferred is separated.
특히, 손상방지 미세섬모 구조물들은 가장자리 영역에 발생되는 응력과 마찰력에 대응되도록 크기와 개수를 조절하여 미세섬모 구조물들 및 손상방지 미세섬모 구조물들이 응력과 마찰력에 의해 손상되는 것을 방지하면서도 이송 대상물과의 흡착력을 향상시켜 이송 대상물을 안전하게 이송시키는 효과를 가질 수 있다.In particular, the damage preventing micro fine structures are adjusted in size and number so as to correspond to the stresses and frictional forces generated in the edge region, thereby preventing the micro fine structures and the damage preventing micro fine structures from being damaged by stress and friction, It may have the effect of safely transporting the transport object by improving the adsorption force.
도 1 및 도 2는 종래의 이송장치용 흡착패드의 일 부분을 확대하여 촬영한 부분 확대도이다. 1 and 2 are enlarged views of a portion of a conventional suction pad for a transfer apparatus photographed.
도 3은 본 발명의 일 실시예에 따른 이송장치용 흡착패드가 도시된 평면도 및 단면도이다.3 is a plan view and a cross-sectional view showing a suction pad for a transfer device according to an embodiment of the present invention.
도 4는 본 발명의 다른 실시예에 따른 이송장치용 흡착패드가 도시된 평면도 및 단면도이다.4 is a plan view and a cross-sectional view showing a suction pad for a transfer device according to another embodiment of the present invention.
도 5는 본 발명의 또 다른 실시예에 따른 이송장치용 흡착패드가 도시된 평면도 및 단면도이다.5 is a plan view and a cross-sectional view showing a suction pad for a transfer device according to another embodiment of the present invention.
도 3 내지 도 5에는 본 발명에 따른 이송장치용 흡착패드가 도시되어 있다.3 to 5 there is shown a suction pad for the transfer device according to the present invention.
본 발명에 따른 이송장치용 흡착패드에 대해 먼저 설명하기 전에 도면에는 도시되지 않았으나, 이송장치는 상기 흡착패드(100)와 함께 본체(미도시) 및 로봇암(미도시)을 더 포함한다. 상기 본체(미도시)는 상기 로봇암(미도시)이 결합되는 것이며, 상기 본체(미도시)에는 상기 로봇 암(미도시)의 작동을 제어할 수 있는 작동 제어부(미도시)가 설치되어 있을 수 있다. 상기 작동 제어부(미도시)사 설치되어 있는 경우, 작업자가 상기 작동 제어부(미도시)를 직접 조작하여 상기 로봇 암(미도시)의 작동을 제어할 수 있다. 그러나 상기 로봇 암(미도시)의 작동은 작업자에 의해 이루어지는 것에 한정되지 않고, 미리 저장된 설정에 따라 자동으로 이루어지는 것도 가능하다.Although not shown in the drawings before the adsorption pad for the transport apparatus according to the present invention is described first, the transport apparatus further includes a main body (not shown) and a robot arm (not shown) together with the adsorption pad 100. The main body (not shown) is the robot arm (not shown) is coupled, the main body (not shown) is provided with an operation control unit (not shown) for controlling the operation of the robot arm (not shown) Can be. When the operation control unit (not shown) is installed, the operator can directly control the operation control unit (not shown) to control the operation of the robot arm (not shown). However, the operation of the robot arm (not shown) is not limited to being performed by an operator, but may be automatically performed according to a pre-stored setting.
상기 본체(미도시)의 형태는 특정되어 있는 것이 아니며, 제작자에 의해 상기 로봇 암(미도시)이 결합될 수 있는 다양한 형태로 형성될 수 있다. 초기에는 상기 본체(미도시)의 크기가 상당히 크게 제작되는 것이 일반적이었으나, 최근에는 기술의 발전 및 공간 활용성을 높이기 위해 상기 본체(미도시)의 크기가 점차 줄어드는 추세이다.The shape of the main body (not shown) is not specific, and may be formed in various forms in which the robot arm (not shown) may be coupled by a manufacturer. In the early days, the size of the main body (not shown) was generally large, but recently, the size of the main body (not shown) gradually decreases in order to improve the technology and space utilization.
상기 로봇 암(미도시)은 전술한 바와 같이, 상기 본체(미도시)에 결합되는 동시에 본 발명에 따른 상기 이송장치용 흡착패드(100)가 구비되는 것이다. 상기 로봇 암(미도시)의 형태는 다양하게 형성될 수 있으나, 일반적으로는 관절을 갖는 구조로 형성되어 상, 하, 좌, 우 의 다양한 방향으로 상기 흡착패드(100) 및 상기 흡착패드(100)에 흡착된 상기 이송 대상물을 이동시킬 수 있다. 상기 이송장치용 흡착패드(100)로 이송하기 위한 이송 대상물은 예를 들어 웨이퍼, 디스플레이 패널 등일 수 있다. 본 발명의 상세한 설명에서는 상기 이송 대상물이 웨이퍼인 것을 예로 돈다.As described above, the robot arm (not shown) is coupled to the main body (not shown) and provided with a suction pad 100 for the transfer device according to the present invention. The robot arm (not shown) may be formed in various forms, but is generally formed in a structure having a joint, and the suction pad 100 and the suction pad 100 in various directions of up, down, left, and right. The transfer object adsorbed in the) can be moved. The transfer object for transferring to the suction pad 100 for the transfer device may be, for example, a wafer, a display panel, or the like. In the detailed description of the present invention, the transfer object is a wafer.
먼저, 도 3을 참조하여 본 발명의 일 실시예에 따른 이송장치용 흡착패드에 대해 설명하기로 한다. 도 3의 (a)는 본 발명의 일 실시예에 따른 이송장치용 흡착패드의 평면도가 도시된 것이고, (b)는 (a)의 섹션 A-A`의 단면도이다. 도 3을 참조하여 보면, 본 발명의 일 실시예에 따른 이송장치용 흡착패드(100)는, 베이스 플레이트(101), 미세섬모 구조물(110)들 및 격벽(130)을 포함한다. 상기 베이스 플레이트(101)는 상기 미세섬모 구조물(110)들 및 상기 격벽(130)을 지지한다. 보다 구체적으로, 상기 미세섬모 구조물(110)들 및 상기 격벽(130)은 상기 베이스 플레이트(101) 상에 설치되며, 상기 베이스 플레이트(101)에 의해 상기 흡착패드(100)가 상기 로봇 암(미도시)에 구비된다.First, with reference to Figure 3 will be described with respect to the adsorption pad for the transfer apparatus according to an embodiment of the present invention. Figure 3 (a) is a plan view of a suction pad for a transfer device according to an embodiment of the present invention, (b) is a cross-sectional view of section A-A` of (a). Referring to FIG. 3, the adsorption pad 100 for the transport apparatus according to the exemplary embodiment of the present invention includes a base plate 101, microspil structures 110, and a partition wall 130. The base plate 101 supports the microciliary structures 110 and the partition wall 130. More specifically, the micro-ciliary structures 110 and the partition wall 130 are installed on the base plate 101, and the suction pad 100 is moved by the base plate 101 to the robot arm (not shown). Is provided).
본 실시예에서는 상기 베이스 플레이트(101)가 원형 단면의 플레이트 형태로 형성된다. 상기 베이스 플레이트(101)가 원형 단면의 플레이트 형태로 형성되는 것은 본 실시예에 한정되는 것 일 뿐이며, 상기 베이스 플레이트(101)는 항상 원형 단면의 플레이트 형태로 형성될 필요는 없다. In the present embodiment, the base plate 101 is formed in a plate shape of a circular cross section. The base plate 101 is formed only in the form of a plate having a circular cross section is limited to this embodiment, and the base plate 101 does not always need to be formed in a plate shape of a circular cross section.
상기 미세섬모 구조물(110)들은 상기 베이스 플레이트(101) 상에 부착된다. 상기 미세섬모 구조물(110)들은 도 3에 도시된 바와 같이, 설정 간격만큼 상호 이격되어 복수 개 구비된다. 상기 각 미세섬모 구조물(110)에 대해 보다 구체적으로 살펴보면, 상기 각 미세섬모 구조물(110)은 기둥부(111) 및 접촉부(113)를 포함한다. 상기 기둥부(111)는 상기 베이스 플레이트(101) 상에 수직하게 세워져 설치된다. 상기 기둥부(111)는 예시적으로 길이 방향에 교차하는 단면이 원형인 원기둥의 형태로 형성된다. 그러나 이는 예시적인 것일 뿐, 이에 한정될 필요가 없고 상기 기둥부(111)의 단면이 삼각형 또는 사각형 등의 다양한 단면 형상을 갖는 기둥 형태로 형성될 수 있다.The microciliary structures 110 are attached on the base plate 101. As shown in FIG. 3, the microciliary structures 110 are provided in plurality, spaced apart from each other by a predetermined interval. Looking in more detail with respect to each micro fine structure 110, each micro fine structure 110 includes a pillar portion 111 and the contact portion 113. The pillar portion 111 is vertically installed on the base plate 101. The pillar portion 111 is formed in the form of a cylindrical cylinder having a circular cross section that crosses the longitudinal direction. However, this is merely an example and need not be limited thereto. The cross section of the pillar part 111 may be formed in a pillar shape having various cross-sectional shapes such as a triangle or a quadrangle.
상기 접촉부(113)는 상기 기둥부(111)의 선단에 구비되는 것이며, 상기 이송 대상물과 흡착된다. 설정된 압력이 가해지면 상기 접촉부(113)는 상기 이송 대상물과 밀착하여 상기 이송 대상물과 흡착된다. 상기 접촉부(113)는 상기 이송 대상물과 접촉하는 면(113a)이 오목하게 형성된다. 그러나 이는 예시적인 것일 뿐이며, 오목하게 형성되는 것에 한정되지 않고 평면형상, 볼록형상 등의 다양한 형상을 갖는 형태로 형성될 수 있다. 그리고 상기 이송 대상물과 접촉하는 면(113a)의 선단에는 돌기(113b)가 형성된다. 본 실시예에서는 상기 접촉부(113)가 하향되게 구비된 것으로 도시되어 있으나, 상기 흡착패드(100)가 상기 이송 대상물을 이송할 때에는 상기 접촉부(113)가 상향되도록 상기 흡착패드(100)가 180°회전된다. 그러나 이에 한정되는 것은 아니고, 상기 접촉부(113)가 하향된 상태로 상기 이송 대상물과 접촉할 수도 있다.The contact portion 113 is provided at the tip of the pillar portion 111 and is adsorbed with the transfer object. When the set pressure is applied, the contact portion 113 is in close contact with the transfer object and is adsorbed with the transfer object. The contact portion 113 is formed with a concave surface 113a in contact with the transfer object. However, this is only an example, and is not limited to being concave, but may be formed in a shape having various shapes such as planar shape and convex shape. And the protrusion 113b is formed in the front-end | tip of the surface 113a which contacts the said transfer object. Although the contact part 113 is shown to be provided downward in this embodiment, when the adsorption pad 100 transports the object to be conveyed, the adsorption pad 100 is 180 ° such that the contact part 113 is upward. Is rotated. However, the present invention is not limited thereto, and the contact part 113 may be in contact with the transfer object in a downward state.
상기 접촉부(113)는 전술한 바와 같이, 상기 이송 대상물과 밀착하여 흡착되도록 상기 기둥부(111)의 선단에 구비되는 것이다. 상기 접촉부(113)의 상기 돌기(113b)가 상기 이송 대상물과 접촉하게 되면, 상기 이송 대상물과 상기 접촉하는 면(113a) 사이에 공기층이 형성된다. 이때, 상기 이송 대상물에 설정된 압력을 가하게 되면 상기 이송 대상물과 상기 접촉하는 면(113a) 사이, 공기층의 공기가 제거되면서 상기 접촉하는 면(113a)이 상기 이송 대상물에 밀착되어 흡착하게 된다.As described above, the contact portion 113 is provided at the tip of the pillar portion 111 to be in close contact with the transfer object. When the protrusion 113b of the contact portion 113 is in contact with the transfer object, an air layer is formed between the transfer object and the contact surface 113a. In this case, when the pressure set on the transfer object is applied, the contact surface 113a comes into close contact with the transfer object while the air of the air layer is removed between the transfer object and the contact surface 113a.
전술한 바와 같이, 상기 미세섬모 구조물(110)들은 설정된 간격만큼 상호 이격되어 복수 개 설치되는데, 예를 들어 상기 미세섬모 구조물(110)들이 복수의 열 및 복수의 칸을 이루도록 매트릭스 형태로 배치되어 설치된다. 상기 미세섬모 구조물(110)들이 형성되는 개수는 상기 베이스 플레이트(101)의 크기, 상기 접촉부(113)의 크기, 상기 흡착패드(100)로 이송시키는 상기 이송 대상물의 크기에 따라 달라진다. As described above, the micro-ciliary structures 110 are provided in plural numbers spaced apart from each other by a predetermined interval. For example, the micro-ciliary structures 110 are arranged in a matrix form so as to form a plurality of rows and a plurality of compartments. do. The number of the micro-ciliary structures 110 is formed according to the size of the base plate 101, the size of the contact portion 113, the size of the object to be transferred to the suction pad 100.
상기 격벽(130)은 상기 미세섬모 구조물(110)들의 손상을 방지하는 역할을 한다. 보다 구체적으로 설명하면, 상기 격벽(130)은 상기 베이스 플레이트(101) 상에 설치되는데 특히, 상기 베이스 플레이트(101)의 설정된 가장자리 영역에 설치된다. 상기 격벽(130)은 상기 베이스 플레이트(101)의 상기 가장자리 영역에 설치되어 상기 가장자리 영역에 근접하게 위치하는 미세섬모 구조물(110)들의 손상을 방지하는 역할을 한다.The partition wall 130 serves to prevent damage of the micro-ciliary structures 110. In more detail, the partition wall 130 is installed on the base plate 101. In particular, the partition wall 130 is installed at a predetermined edge region of the base plate 101. The partition wall 130 is installed in the edge region of the base plate 101 to prevent damage to the micro-ciliary structures 110 positioned close to the edge region.
상기 격벽(130)은 상기 가장자리 영역만큼 상기 베이스 플레이트(101) 상에 돌출 연장되어 형성된다. 그리고 상기 베이스 플레이트(101)의 둘레 방향을 따라 상기 미세섬모 구조물(110)들을 둘러싸도록 형성된다. 본 실시예에서는 상기 베이스 플레이트(101)가 원형 단면의 플레이트 형태로 형성되므로, 상기 격벽(101)도 상기 베이스 플레이트(101)의 둘레 방향을 따라 형성되어 링과 같은 형태로 형성된다.The partition wall 130 protrudes and extends on the base plate 101 by the edge area. And it is formed to surround the micro-ciliary structures 110 in the circumferential direction of the base plate 101. In the present embodiment, since the base plate 101 is formed in the shape of a plate having a circular cross section, the partition 101 is also formed along the circumferential direction of the base plate 101 to form a ring-like shape.
일반적으로 상기 격벽(130)의 높이는 상기 미세섬모 구조물(110)들의 높이와 동일하다. 상기 격벽(130)은 상기 미세섬모 구조물(110)들의 손상을 방지하기 위해 형성되는 것이므로, 상기 격벽(130)의 높이가 상기 미세섬모 구조물(110)들의 높이보다 낮지 않아야 한다. 만약 상기 격벽(130)의 높이가 상기 미세섬모 구조물(110)들의 높이보다 낮으면 상기 미세섬모 구조물(110)들이 상기 이송 대상물과 분리될 때의 응력과 마찰력이 상기 격벽(130)으로 분산되지 않기 때문에 응력과 마찰력으로 인해 상기 미세섬모 구조물(110)들이 손상된다. In general, the height of the partition 130 is the same as the height of the micro-ciliary structures (110). Since the partition wall 130 is formed to prevent damage of the micro-ciliary structures 110, the height of the partition wall 130 should not be lower than the height of the micro-ciliary structures 110. If the height of the barrier 130 is lower than the height of the micro-ciliary structures 110, the stress and frictional force when the micro-ciliary structures 110 are separated from the object to be transferred are not distributed to the barrier 130. Due to the stress and friction force, the micro-ciliary structures 110 are damaged.
또한, 상기 격벽(130)이 상기 미세섬모 구조물(110)들의 높이보다 높으면 상기 미세섬모 구조물(110)들이 상기 이송 대상물과 흡착할 수 없어 이송 대상물을 이송시킬 수 없다. 따라서 상기 격벽(130)의 높이를 상기 미세섬모 구조물(110)들의 높이와 동일하게 하여 상기 미세섬모 구조물(110)들이 상기 이송 대상물과 분리할 때의 응력과 마찰력이 상기 격벽(130)으로 분산되게 하여 상기 미세섬모 구조물(110)들이 손상되는 것을 방지한다.In addition, when the partition wall 130 is higher than the height of the microciliary structures 110, the microciliar structures 110 may not be adsorbed with the transfer object and thus cannot transfer the transfer object. Therefore, the height of the barrier 130 is the same as the height of the micro-ciliary structures 110 so that the stress and frictional force when the micro-ciliary structures 110 are separated from the transfer object to be distributed to the partition 130 Thereby preventing the microciliary structures 110 from being damaged.
한편, 상기 미세섬모 구조물(110)들의 높이는 상기 격벽(130)의 높이보다 수 나노미터-수백 마이크로미터 정도 클 수도 있다. 이러한 경우, 상기 이송 대상물의 무게 및 이송장치의 동작에 따른 가속도에 의해 상기 미세섬모 구조물(110)이 눌려 높이가 낮아짐으로써, 상기 미세섬모 구조물(110) 및 상기 격벽(130)이 상기 이송 대상물(130)과 균일하게 접촉할 수 있다. 더불어, 상기 미세섬모 구조물(110)이 눌림으로써 발생되는 탄성에 의해 상기 미세섬모 구조물(110)과 상기 이송 대상물(130)이 수직 방향으로의 분리가 쉽게 이루어질 수 있다.Meanwhile, the height of the microciliary structures 110 may be several nanometers to several hundred micrometers larger than the height of the partition wall 130. In this case, the height of the microciliary structure 110 is reduced by the weight of the object to be transferred and the acceleration according to the operation of the conveying device, thereby lowering the height of the microciliar structure 110 and the partition wall 130. 130) may be uniformly contacted. In addition, the microciliary structure 110 and the transfer object 130 may be easily separated in the vertical direction by elasticity generated by pressing the microciliar structure 110.
도 4는 본 발명의 다른 실시예에 따른 이송장치용 흡착패드(100`)가 도시된 것이다. 도 4의 (a)는 본 발명의 다른 실시예에 따른 이송장치용 흡착패드의 평면도가 도시된 것이고, (b)는 (a)의 섹션 B-B`의 단면도이다. 도 4을 참조하여 본 발명의 다른 실시예에 따른 이송장치용 흡착패드(100`)를 살펴보면, 상기 이송장치용 흡착패드(100`)는 베이스 플레이트(101), 미세섬모 구조물(110)들 및 손상방지 미세섬모 구조물(130`)들을 포함한다. 상기 베이스 플레이트(101) 및 상기 미세섬모 구조물(110)들은 전술한 일 실시예에 따른 이송장치용 흡착패드(100)와 동일한 구성이므로 이에 대해서는 일 실시예와 동일한 부호를 사용하며 구체적인 설명을 생략한다.Figure 4 shows a suction pad 100` for the transfer apparatus according to another embodiment of the present invention. Figure 4 (a) is a plan view of a suction pad for a transfer device according to another embodiment of the present invention, (b) is a cross-sectional view of section B-B` of (a). Looking at the adsorption pad 100` for the transport apparatus according to another embodiment of the present invention with reference to Figure 4, the adsorption pad 100` for the transport apparatus is a base plate 101, micro-ciliary structures 110 and Damage prevention microciliary structures 130 ′. Since the base plate 101 and the micro-ciliary structures 110 have the same configuration as the adsorption pad 100 for the transfer apparatus according to the above-described embodiment, the same reference numerals as in the exemplary embodiment are used, and detailed description thereof will be omitted. .
상기 손상방지 미세섬모 구조물(130`)들은 상기 미세섬모 구조물(110)과 동일한 구조로 형성된다. 즉, 상기 각 손상방지 미세섬모 구조물(130`)도 기둥부(131`) 및 접촉부(133`)를 포함하며, 상기 접촉부(133`)는 접촉되는 면(133`a)과 돌기(133`b)로 이루어진다. The damage preventing microciliary structures 130 ′ are formed in the same structure as the microciliar structures 110. That is, each of the damage preventing micro fine structures 130 ′ also includes a pillar portion 131 ′ and a contact portion 133 ′, and the contact portion 133 ′ is in contact with the surface 133 ′ a and the protrusion 133 ′. b).
상기 각 손상방지 미세섬모 구조물(130`)의 횡단면적은 상기 각 미세섬모 구조물(110)의 횡단면적보다 더 크게 형성된다. 보다 구체적으로는 상기 손상방지 미세섬모 구조물(130`)의 상기 접촉부(133`)가 상기 미세섬모 구조물(110)의 상기 접촉부(113)보다 크게 형성된다. 상기 손상방지 미세섬모 구조물(130`)의 상기 기둥부(131`)의 크기는 상기 미세섬모 구조물(110)의 상기 기둥부(111)의 크기보다 크거나, 동일하게 형성된다. The cross-sectional area of each of the damage preventing microciliary structures 130 ′ is larger than the cross-sectional area of each of the microciliar structures 110. More specifically, the contact portion 133 ′ of the damage preventing microciliary structure 130 ′ is formed to be larger than the contact portion 113 of the microciliar structure 110. The size of the pillar portion 131 ′ of the damage preventing microciliary structure 130 ′ is greater than or equal to the size of the pillar portion 111 of the microciliar structure 110.
상기 손상방지 미세섬모 구조물(130`)들도 상기 미세섬모 구조물(110)들과 마찬가지로 상기 가장자리 영역에 설정된 간격만큼 상호 이격되어 복수 개 설치되며, 복수의 열과 복수의 칸을 이루도록 매트릭스 형태로 배치된다. 다만 상기 손상방지 미세섬모 구조물(130`)들의 배열 피치, 즉 이웃하는 상기 손상방지 미세섬모 구조물(130`)들 사이의 이격 간격은 상기 미세섬모 구조물(110)들의 배열 피치, 즉 이웃하는 상기 미세섬모 구조물(110)들 사이의 이격 간격과 동일하다.Like the micro fine structures 110, the damage preventing micro fine structures 130 ′ are also spaced apart from each other by a predetermined interval in the edge region, and are arranged in a matrix form to form a plurality of rows and a plurality of compartments. . However, the arrangement pitch of the damage preventing micro fine structures 130 ′, that is, the spacing between adjacent damage preventing micro fine structures 130 ′ is an arrangement pitch of the micro fine structures 110, that is, the adjacent fine fibers. Equal to the spacing between the ciliary structures 110.
전술한 바와 같이, 상기 흡착패드(100`)가 상기 이송 대상물과 흡착된 후 분리될 때에는 상기 가장자리 영역에 큰 응력과 마찰력이 발생된다. 상기 손상방지 미세섬모 구조물(130`)들은 상기 미세섬모 구조물(110)들보다 더 크게 형성되므로 상기 가장자리 영역에 발생되는 응력과 마찰력을 버티는 힘이 상기 미세섬모 구조물(110)들에 비해 더 커 응력과 마찰력에 의해 쉽게 손상되지 않으면서 상기 미세섬모 구조물(110)들의 손상도 방지한다. 따라서 상기 손상방지 미세섬모 구조물(130`)의 크기는 상기 가장자리 영역에 발생되는 응력과 마찰력을 고려하여 결정한다.As described above, when the adsorption pad 100 ′ is separated from the transport object after being adsorbed, a large stress and friction force are generated in the edge region. Since the damage preventing microciliary structures 130 ′ are formed larger than the microciliar structures 110, the stress and frictional force generated in the edge region are greater than the microciliar structures 110. It also prevents damage to the microciliary structures 110 without being easily damaged by excessive friction. Therefore, the size of the damage prevention micro fine structure (130`) is determined in consideration of the stress and friction generated in the edge region.
도 5는 본 발명의 또 다른 실시예에 따른 이송장치용 흡착패드(100″)가 도시되어 있다. 도 5의 (a)는 본 발명의 또 다른 실시예에 따른 이송장치용 흡착패드의 평면도가 도시된 것이고, (b)는 (a)의 섹션 C-C`의 단면도이다. 도 5를 참조하여 본 발명의 또 다른 실시예에 따른 이송장치용 흡착패드(100″)는, 베이스 플레이트(101), 미세섬모 구조물(110)들 및 손상방지 미세섬모 구조물(130″)들을 포함한다. 본 실시예의 상기 베이스 플레이트(101), 상기 미세섬모 구조물(110)들도 전술한 일 실시예에 따른 이송장치용 흡착패드(100)와 동일한 구성이므로 이에 대해서는 동일한 부호를 사용하여 설명은 생략한다.5 shows a suction pad 100 ″ for a transfer device according to another embodiment of the present invention. Figure 5 (a) is a plan view of a suction pad for a transfer device according to another embodiment of the present invention, (b) is a cross-sectional view of section C-C` of (a). Adsorption pad 100 ″ for a transfer apparatus according to still another embodiment of the present invention with reference to FIG. 5 includes a base plate 101, microciliary structures 110, and damage preventing microciliar structures 130 ″. do. Since the base plate 101 and the micro-ciliary structures 110 of the present embodiment also have the same configuration as the adsorption pad 100 for the transfer apparatus according to the above-described embodiment, the description thereof will be omitted using the same reference numerals.
본 실시예에서의 상기 손상방지 미세섬모 구조물(130″)들은 크기가 상기 미세섬모 구조물(110)들의 크기와 동일하다. 즉, 상기 손상방지 미세섬모 구조물(130″)의 상기 접촉부(133″)의 크기와 상기 미세섬모 구조물(110)의 상기 접촉부(113)의 크기가 동일하게 형성된다.The damage preventing microciliary structures 130 ″ in the present embodiment have the same size as those of the microciliar structures 110. That is, the size of the contact portion 133 ″ of the damage preventing micro fine structure 130 ″ and the size of the contact portion 113 of the micro fine structure 110 are formed to be the same.
본 실시예에서는 도 5에 도시된 바와 같이, 상기 베이스 플레이트(101)의 중앙 영역에 설치되는 상기 미세섬모 구조물(110)들의 밀집도와 상기 베이스 플레이트(101)의 가장자리 영역에 설치되는 상기 손상방지 미세섬모 구조물(130″)들의 밀집도는 서로 상이하다. 예시적으로 도 5의 (a)에 도시된 바와 같이, 상기 가장자리 영역에 설치되는 상기 손상방지 미세섬모 구조물(130″)들의 제1 밀집도는 상기 중앙 영역에 설치되는 상기 미세섬모 구조물(110)들의 제2 밀집도보다 크다. In this embodiment, as shown in Figure 5, the density of the micro-ciliary structure 110 is installed in the central region of the base plate 101 and the damage preventing fine installed in the edge region of the base plate 101 The densities of the ciliary structures 130 ″ differ from each other. For example, as shown in (a) of FIG. 5, a first density of the damage preventing microciliary structures 130 ″ installed in the edge region may correspond to those of the microciliar structures 110 installed in the central region. Greater than the second density.
즉, 상기 베이스 플레이트(101)의 중앙 영역에는 상기 미세섬모 구조물(110)들의 이격 간격을 넓게 하여 설치하고, 상기 베이스 플레이트(101)의 가장자리 영역에는 상기 미세섬모 구조물(110)들의 이격 간격을 좁게 하여 설치한다. 따라서 상기 가장자리 영역에 설치되는 상기 손상방지 미세섬모 구조물(130″)들의 밀집도가 상기 중앙 영역에 설치되는 상기 미세섬모 구조물(110)들의 밀집도보다 크다.That is, the spacing of the micro-ciliary structures 110 is widened in the central region of the base plate 101, and the spacing of the micro-ciliary structures 110 is narrowed in the edge region of the base plate 101. Install it. Therefore, the density of the damage preventing micro fine structures 130 ″ installed in the edge region is greater than that of the micro fine structures 110 installed in the central region.
또한, 도면에는 도시되지 않았으나, 상기 손상방지 미세섬모 구조물(130″)들의 밀집도는 상기 중앙 영역에서 상기 가장자리 영역으로 갈수록 점진적으로 커지도록 상기 손상방지 미세섬모 구조물(130″)들을 설치할 수도 있다.In addition, although not shown in the drawings, the damage preventing micro-settle structures 130 ″ may be installed such that the density of the damage preventing micro-settle structures 130 ″ gradually increases from the central area to the edge area.
이렇게 상기 가장자리 영역에 설치되는 상기 손상방지 미세섬모 구조물(130″)들의 밀도를 더 크게 하면 상기 가장자리 영역에 더 크게 발생되는 응력 및 마찰력의 분포가 고르게 되어 상기 손상방지 미세섬모 구조물(130″)이 손상되는 것을 방지할 수 있으며, 상기 미세섬모 구조물(110)들의 손상도 방지하는 효과를 가질 수 있다.As the density of the damage preventing micro fine structures 130 ″ installed in the edge region is increased, the distribution of stress and frictional force generated in the edge area is evenly distributed, thereby preventing the damage preventing micro fine structure 130 130 ″. It may be prevented from being damaged, and may have an effect of preventing damage to the microciliary structures 110.
본 발명은 도면에 도시된 실시예를 참고로 설명되었으나 이는 예시적인 것에 불과하며, 본 기술 분야의 통상의 지식을 가진 자라면 이로부터 다양한 변형 및 균등한 다른 실시예가 가능하다는 점을 이해할 것이다. 따라서 본 발명의 진정한 기술적 보호 범위는 첨부된 특허청구범위의 기술적 사상에 의하여 정해져야 할 것이다.Although the present invention has been described with reference to the embodiments shown in the drawings, this is merely exemplary, and it will be understood by those skilled in the art that various modifications and equivalent other embodiments are possible. Therefore, the true technical protection scope of the present invention will be defined by the technical spirit of the appended claims.
본 발명에 따른 이송장치용 흡착패드를 이용하면, 흡착력을 향상시켜 이송 대상물을 안전하게 이송할 수 있으며 수명이 연장되는 이송장치를 개발할 수 있다.By using the adsorption pad for the conveying apparatus according to the present invention, it is possible to develop a conveying apparatus which can safely transport the conveying object by improving the adsorption force and prolong the life.

Claims (14)

  1. 이송 대상물을 적층 컨테이너로 이송시키는 이송장치용 흡착패드에 있어서,In the suction pad for the transfer device for transferring the transfer object to the stacked container,
    베이스 플레이트;Base plate;
    상기 베이스 플레이트 상의 설정된 중앙 영역에 설정 간격만큼 상호 이격되어 설치되며, 상기 이송 대상물과 흡착되는 미세섬모 구조물들; 및Micro-ciliary structures that are spaced apart from each other by a set interval in a set central region on the base plate and are adsorbed with the transfer object; And
    상기 베이스 플레이트 상의 설정된 가장자리 영역에 설치되어, 상기 미세섬모 구조물들 중 상기 가장자리 영역에 근접하게 위치하는 미세섬모 구조물들의 손상을 방지하도록 상기 미세섬모 구조물들을 둘러싸며 형성되는 격벽을 포함하는 이송장치용 흡착패드.Adsorption for a transfer device is installed in the set edge region on the base plate, including a partition wall surrounding the micro-cili structures to prevent damage of the micro-cili structures that are located close to the edge region of the micro-cili structures pad.
  2. 청구항 1에 있어서,The method according to claim 1,
    상기 격벽은 상기 가장자리 영역만큼 상기 베이스 플레이트 상에 돌출되어 연장 형성되는 이송장치용 흡착패드.The partition wall is a suction pad for the transfer device is formed to protrude and extend on the base plate by the edge area.
  3. 청구항 1에 있어서,The method according to claim 1,
    상기 격벽의 높이는 상기 미세섬모 구조물들의 높이와 동일하거나 상기 미세섬모 구조물들의 높이보다 설정 높이만큼 낮게 형성되는 이송장치용 흡착패드.The height of the partition wall is the same as the height of the micro-cili structures, the suction pad for the transfer device is formed by a set height lower than the height of the micro-cili structures.
  4. 이송 대상물을 적층 컨테이너로 이송시키는 이송장치용 흡착패드에 있어서,In the suction pad for the transfer device for transferring the transfer object to the stacked container,
    베이스 플레이트;Base plate;
    상기 베이스 플레이트 상의 설정된 중앙 영역에 설정 간격만큼 상호 이격되어 설치되며, 상기 이송 대상물과 흡착되는 미세섬모 구조물들; 및Micro-ciliary structures that are spaced apart from each other by a set interval in a set central region on the base plate and are adsorbed with the transfer object; And
    상기 베이스 플레이트 상의 설정된 가장자리 영역에 설치되어 상기 이송 대상물에 흡착되고, 상기 미세섬모 구조물들 중 상기 가장자리 영역에 근접하게 위치하는 미세섬모 구조물들의 손상을 방지하도록 상기 미세섬모 구조물들을 둘러싸며 형성되는 손상방지 미세섬모 구조물들을 포함하는 이송장치용 흡착패드.The damage prevention is formed in the set edge region on the base plate is adsorbed to the transfer object, and is formed around the micro-cili structures to prevent damage of the micro-cili structures that are located close to the edge region of the micro-cili structures Adsorption pad for transfer device comprising micro-ciliary structures.
  5. 청구항 4에 있어서,The method according to claim 4,
    상기 손상방지 미세섬모 구조물들의 높이는 상기 미세섬모 구조물들의 높이와 동일하게 형성되는 이송장치용 흡착패드.The height of the damage prevention micro-cili structure is the same as the height of the micro-cili structure structure adsorption pad for the device.
  6. 청구항 4에 있어서,The method according to claim 4,
    상기 각 손상방지 미세섬모 구조물의 횡단면적의 크기는 상기 각 미세섬모 구조물의 횡단면적의 크기보다 크게 형성되는 이송장치용 흡착패드.The size of the cross-sectional area of each of the damage prevention microciliary structure is larger than the size of the cross-sectional area of the micro-cili structure structure adsorption pads.
  7. 청구항 4에 있어서,The method according to claim 4,
    상기 손상방지 미세섬모 구조물들의 배열 피치는 상기 중앙 영역에 설치된 상기 미세섬모 구조물들의 배열 피치와 동일하게 형성되는 이송장치용 흡착패드.The damage pitch of the damage prevention micro fine structures are formed to be the same as the array pitch of the micro fine structures installed in the central region.
  8. 이송 대상물을 적층 컨테이너로 이송시키는 이송장치용 흡착패드에 있어서,In the suction pad for the transfer device for transferring the transfer object to the stacked container,
    베이스 플레이트;Base plate;
    상기 베이스 플레이트 상의 설정된 중앙 영역에 설정 간격만큼 상호 이격되어 설치되며, 상기 이송 대상물과 흡착되는 미세섬모 구조물들; 및Micro-ciliary structures that are spaced apart from each other by a set interval in a set central region on the base plate and are adsorbed with the transfer object; And
    상기 베이스 플레이트 상의 설정된 가장자리 영역에 설치되어 상기 이송 대상물에 흡착되고, 상기 미세섬모 구조물들 중 상기 가장자리 영역에 근접하게 위치하는 미세섬모 구조물들의 손상을 방지하도록 상기 미세섬모 구조물들을 둘러싸며 형성되되, 상기 미세섬모 구조물들보다는 높은 밀집도를 갖는 손상방지 미세섬모 구조물들을 포함하는 이송장치용 흡착패드.Is installed in the set edge region on the base plate is adsorbed to the transfer object, and formed to surround the micro-cili structures to prevent damage of the micro-cili structures that are located close to the edge region of the micro-cili structures, Adsorption pads for transfer devices comprising damage resistant microciliary structures having a higher density than microciliar structures.
  9. 청구항 제8에 있어서,The method according to claim 8,
    상기 각 손상방지 미세섬모 구조물의 횡단면적과 상기 각 미세섬모 구조물의 횡단면적은 동일한 크기로 형성된 이송장치용 흡착패드.And a cross-sectional area of each of the damage preventing microciliary structures and a cross-sectional area of each of the microciliary structures have the same size.
  10. 청구항 제8에 있어서,The method according to claim 8,
    상기 손상방지 미세섬모 구조물들의 밀집도는 상기 중앙 영역에서 상기 가장자리 영역으로 갈수록 점진적으로 커지는 이송장치용 흡착패드.The density of the anti-damage micro-ciliary structures is gradually increased from the central region to the edge region adsorption pad for the transfer device.
  11. 청구항 8에 있어서,The method according to claim 8,
    상기 미세섬모 구조물들이 설치된 영역에서의 밀집도는 전체적으로 동일하고, The density in the area where the microciliary structures are installed is the same as the whole,
    상기 손상방지 미세섬모 구조물들이 설치된 영역에서의 밀집도도 전체적으로 동일한 이송장치용 흡착패드.Adsorption pad for the transfer device, the overall density is also the same in the area where the damage prevention micro-ciliary structures are installed.
  12. 청구항 1, 청구항 4 또는 청구항 8 중 어느 한 항에 있어서,The method according to any one of claims 1, 4 or 8,
    상기 각 미세섬모 구조물 및 상기 각 손상방지 미세섬모 구조물은,The micro-ciliary structures and the damage preventing micro-cilia structures,
    상기 베이스 플레이트 상에 수직하게 세워져 설치되는 기둥부; 및A pillar portion vertically installed on the base plate; And
    상기 기둥부의 선단에 구비되어, 설정된 압력이 가해지면 상기 이송 대상물과 밀착하여 접촉되는 접촉부를 포함하는 이송장치용 흡착패드.And a contact portion provided at the front end of the pillar, the contact portion in close contact with the transfer object when a predetermined pressure is applied thereto.
  13. 청구항 12에 있어서,The method according to claim 12,
    상기 접촉부는 상기 이송 대상물과 접촉하는 면이 오목하게 형성되며,The contact portion is formed to be concave in contact with the transfer object,
    상기 이송 대상물의 상측에서 설정된 압력이 가해지면 상기 이송 대상물과 상기 접촉부 사이의 공기가 제거되면서 흡착되는 이송장치용 흡착패드.Adsorption pad for a transfer apparatus is adsorbed while the air between the transfer object and the contact is removed when the pressure set from the upper side of the transfer object is applied.
  14. 청구항 1, 청구항 4 또는 청구항 8 중 어느 한 항의 이송장치용 흡착패드를 포함하는 이송장치.A transfer apparatus comprising a suction pad for a transfer apparatus of claim 1.
PCT/KR2014/011390 2014-04-21 2014-11-26 Adsorption pad for transfer device and transfer device having same WO2015163554A1 (en)

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JP2008074565A (en) * 2006-09-21 2008-04-03 Nippon Electric Glass Co Ltd Suction-holding method and suction-holding pad for plate-like object
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KR101025696B1 (en) * 2009-11-30 2011-03-30 서울대학교산학협력단 Fine ciliary structure for vacuum adhesion, method of using the same and method of manufacturing the same
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US8524092B2 (en) * 2006-12-14 2013-09-03 Carnegie Mellon University Dry adhesives and methods for making dry adhesives
KR20080086340A (en) * 2007-03-21 2008-09-25 (주)바로텍 Chuck using nano-scale cilium, fabricating method and chucking/de-chucking method for the same
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