KR20120124700A - Pad for adsorbing the substrate and manufacturing method thereof - Google Patents

Pad for adsorbing the substrate and manufacturing method thereof Download PDF

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Publication number
KR20120124700A
KR20120124700A KR1020110042513A KR20110042513A KR20120124700A KR 20120124700 A KR20120124700 A KR 20120124700A KR 1020110042513 A KR1020110042513 A KR 1020110042513A KR 20110042513 A KR20110042513 A KR 20110042513A KR 20120124700 A KR20120124700 A KR 20120124700A
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KR
South Korea
Prior art keywords
adsorption
substrate
mold
pad
shape
Prior art date
Application number
KR1020110042513A
Other languages
Korean (ko)
Inventor
문덕주
Original Assignee
엠.씨.케이 (주)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 엠.씨.케이 (주) filed Critical 엠.씨.케이 (주)
Priority to KR1020110042513A priority Critical patent/KR20120124700A/en
Publication of KR20120124700A publication Critical patent/KR20120124700A/en

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/06—Work supports, e.g. adjustable steadies

Abstract

And an adsorption unit having a base and a plurality of microscopic adsorption members provided integrally with the base, wherein the adsorption member includes an adsorption portion formed in a shape of a light beam narrowing in diameter toward an upper side. The pad for adsorption | suction of the board | substrate which has the groove recessed in circular arc shape on the upper surface of a part is disclosed. The disclosed substrate adsorption pad can easily adsorb the substrate as a negative pressure is formed between the arc-shaped grooves of the plurality of adsorption members provided in a fine spatula shape and the surface of the substrate.

Description

Pad for adsorbing the substrate and manufacturing method

The present invention relates to a substrate adsorption pad and a method for manufacturing the same, and more particularly, to a substrate adsorption pad and a method for manufacturing the same that can improve the adsorption force on the substrate.

In general, a substrate such as a glass substrate for a display is required to planarize the surface during the manufacturing process, the chemical mechanical polishing (CMP) process is mainly used for the planarization work.

Chemical mechanical polishing is a process of polishing a surface of a substrate by mechanical friction and at the same time by a chemical abrasive. Here, mechanical polishing is a process of polishing the surface of the substrate by friction between the polishing pad and the substrate surface by pressing and rotating the substrate on the rotating polishing pad. Chemical polishing is a process of polishing a surface of a substrate by a chemical polishing agent such as a slurry supplied between the polishing pad and the substrate.

In order to planarize the surface of the substrate through the chemical mechanical polishing process, an adsorption pad for adsorbing and supporting the substrate is required. The adsorption pad is provided with an adsorption part for adsorbing the substrate.

On the other hand, in recent years, as the display has been enlarged, the substrate used to manufacture it has also grown in size, so that there is a limit to absorbing the substrate through the adsorption portion of the adsorption pad.

In particular, there is a fine curve on the surface of a conventional substrate, there is a problem that the adsorption portion of the adsorption pad is not easy to adsorb the substrate by such a fine bending.

Therefore, the present invention is to solve the above problems, the present invention is to provide a substrate adsorption pad that can easily adsorb the substrate even if the surface of the substrate is curved.

The substrate adsorption pad of the present invention for achieving the above object includes an adsorption unit having a base and a plurality of adsorption members of a fine shape integrally provided with the base,

The adsorption member includes an adsorption part formed in the shape of a light receiving narrower, the diameter of which increases toward the upper side,

The upper surface of the adsorption portion is characterized by having a groove recessed in an arc shape.

The adsorption unit further includes a plurality of adsorption cells protruding at a predetermined interval on the upper surface of the base,

The adsorption member further includes a columnar pillar portion protruding from the upper surface of each of the adsorption cells, wherein the adsorption portion is formed on the upper end of the pillar portion.

The adsorption unit is characterized in that the material capable of elastic deformation.

Method for producing a substrate adsorption pad of the present invention for achieving the above object,

Preparing a mold for manufacturing a suction unit including a base and a plurality of fine suction members integrally formed with the base,

Filling and filling the cavity formed in the mold,

Separating the resin from the mold after curing the resin filled in the cavity,

The adsorption member includes an adsorption part 53 having an arc-shaped groove formed in a shape of an upper and lower narrow narrower diameters toward the upper side and recessed downward in the upper surface thereof.

The mold includes an upper mold and a lower mold joined with the upper mold,

The upper mold is formed with a cavity corresponding to the outer shape of the adsorption unit 20,

The lower mold may include a protrusion protruding in a round shape toward the upper mold at a position corresponding to a portion in which a plurality of adsorption members of the upper mold are formed so that an arc shape of the adsorption portion may be formed. do.

As described above, the substrate adsorption pad of the present invention may be easily adsorbed even when the substrate is polished, as the adsorption unit including the adsorption member having a plurality of spatula-shaped fine adsorption parts is provided.

The substrate adsorption pad of the present invention is provided with a fine spatula shape of the adsorption portion, but is made of a material capable of elastic deformation. Even though there is a curvature on the surface of the substrate when the substrate is adsorbed, the adsorption portion is elastically deformed on the curved substrate. The substrate can be easily adsorbed since it can be corresponded to.

1 is a perspective view showing a substrate adsorption pad of the present invention.
FIG. 2 is an enlarged perspective view of a part of the pad illustrated in FIG. 1.
3 is a cross-sectional view taken along line AA of FIG. 1.
4 is a cross-sectional view showing another embodiment of the pad shown in FIG. 1.
5 is a process diagram schematically showing a manufacturing process of the substrate adsorption pad of the present invention.

Hereinafter, with reference to the drawings will be described in detail for the substrate adsorption pad of the present invention.

As shown in FIG. 1 and FIG. 2, the substrate adsorption pad of the present invention includes a substrate 10 and an adsorption unit 20 adhered to the substrate 10.

The substrate 10 is adhered by an adhesive to the back surface of the adsorption unit 20 manufactured by the manufacturing method to be described later, wherein the substrate 10 may be a PET film.

The adsorption unit 20 includes a base 30, a plurality of adsorption cells 40 protruding from the base 30, and a plurality of adsorption members 50 having a minute shape protruding from each adsorption cell 40. do. At this time, the base 30, the adsorption cell 40 and the adsorption member 50 is formed integrally.

Since the adsorption unit 20 integrally formed as described above has a fine bend on the surface of the substrate (not shown), the adsorption unit 20 is made of a material capable of elastic deformation so as to easily correspond to each bend. For example, the adsorption unit 20 is preferably made of a water-repellent resin such as polyurethane, Teflon, silicone.

Base 30 is made of a water-repellent resin as described above, it is provided in a rectangular plate shape.

Adsorption cell 40 is made of a water-repellent resin as described above is provided integrally with the base 30, a plurality of protruding cells from the upper surface of the base 30 at a predetermined interval is provided.

Adsorption member 50 is made of a water-repellent resin as described above is provided integrally with the base 30 and the adsorption cell 40, a plurality of protruding from the upper surface of each adsorption cell 40 is provided. The adsorption member 50 serves to substantially adsorb the back surface of the substrate in the process of polishing one surface of the substrate.

To this end, as shown in FIGS. 2 and 3, the adsorption member 50 includes a columnar pillar portion 51 protruding from each adsorption cell 40, and an adsorption formed at an end of the column portion 51. The unit 53 is included.

The adsorption part 53 is provided in the edge part of the pillar part 51 formed in column shape as mentioned above. The adsorption portion 53 is larger in diameter from the end of the column portion 51 toward the upper side, that is, is formed in the shape of a light-receiving narrow, the upper surface of the adsorption portion 53 is a circular arc formed to be recessed toward the column portion 51 side It has the groove 53a of shape.

For example, in the present invention, the diameter D1 of the columnar columnar portion 51 may be 1 mm, and the diameter D2 of the uppermost end of the adsorption portion 53 may be 2 mm larger than the diameter D1 of the columnar portion 51, The radius R of the arc-shaped groove 53a formed on the upper surface of the adsorption part 53 may be 4 mm.

That is, in the present invention, each of the adsorption parts 53 is provided in the shape of a spatula-like fine cilia provided on the sole of the gecko gecko, and each of the adsorption parts 53 is adsorbed on the substrate. As the negative pressure is formed between the arc-shaped groove 53a of the adsorption portion 53 and the surface of the substrate, the substrate can be easily adsorbed.

4 is a view showing another embodiment of the adsorption member in the pad of the present invention.

As shown in FIG. 4, the adsorption member 50 does not have a pillar portion as compared with the embodiment shown in FIG. 3. That is, the adsorption member 50 may be provided with a plurality of adsorption parts 153 to protrude in a spatula shape from one surface of each adsorption cell 40.

Hereinafter, a manufacturing method of the substrate adsorption pad of the present invention will be described in detail with reference to the accompanying drawings.

In order to manufacture the substrate adsorption pad of the present invention, as shown in FIG. 5, a mold for preparing a pad including an upper mold 60 and a lower mold 70 is prepared first.

In the upper mold 60, a cavity 65 corresponding to the adsorption unit 20 of the present invention is formed in a predetermined pattern. That is, in the present invention, due to the cavity 65 formed in the upper mold 60, the base 30, the plurality of adsorption cells 40 protruding from the base 30, and the normal light from each of the adsorption cells 40 It is possible to form the outer shape of the adsorption unit 20 including a plurality of adsorption members 50 protruding in the narrow shape.

The lower mold 70 is a portion in which a plurality of adsorption members 50 of the upper mold 60 are formed so that an arc-shaped groove can be formed on the upper surface of the adsorption part 53 of the adsorption member 50 of the present invention. At the position corresponding to the round protrusions 75 protruding toward the upper mold 60 is provided.

After preparing a mold for manufacturing a pad including the upper mold 60 and the lower mold 70 as described above, the resin material 80 is filled in the cavity 65 of the upper mold 60. At this time, the resin material 80 is made of a water-repellent resin such as polyurethane, Teflon, silicone capable of elastic deformation.

After the resin material 80 is filled in the cavity 65 of the upper mold 60, the resin material 80 of the cavity 65 is cured for a predetermined time at room temperature, and thus the resin material 80 is cured. The adhesive 90 is applied to the resin material.

After the adhesive 90 is applied to the resin material 80 filled in the cavity 65, the substrate 10 is adhered. At this time, the substrate 10 may use a PET film.

When the resin material 80 coated on the substrate 10, that is, the adsorption unit 20 is separated from the mold, the production of the substrate adsorption pad of the present invention is completed.

On the other hand, the substrate adsorption pad manufactured by the manufacturing method as described above is provided with an adsorption unit 20 including an adsorption member 50 having a plurality of spatula-shaped fine adsorption portion 53. Therefore, in the present invention, the enlarged substrate can be easily adsorbed using the adsorption unit 20.

In detail, the present invention can easily adsorb the substrate as a negative pressure is formed between the arc-shaped grooves 53a of the plurality of adsorption members 50 provided in a fine spatula shape and the surface of the substrate. Can be.

In addition, according to the present invention, the adsorption portion 53 of the adsorption member 50 is provided in a fine spatula shape, but is made of a material that is elastically deformable. Since the adsorption part 53 can correspond to the surface by elastic deformation, the substrate can be easily adsorbed.

10: substrate 20: adsorption unit
30: base 40: adsorption cell
50: adsorption member 51: pillar portion
53: adsorption portion 53a: groove
60: upper mold 65: cavity
70: lower mold 75: protrusion
80: resin material 90: adhesive

Claims (5)

In the substrate adsorption pad that adsorbs and supports the substrate when polishing the substrate,
The substrate adsorption pad includes a adsorption unit 20 having a base 30 and a plurality of adsorption members 50 having a fine shape integrally formed with the base 30.
The adsorption member 50 includes an adsorption portion 53 formed in a shape of a light beam narrower to a diameter toward the upper side,
And a groove (53a) recessed in an arc shape on an upper surface of the adsorption portion (53). The method of claim 1,
The adsorption unit 20 further includes a plurality of adsorption cells 40 protruding at a predetermined interval on the upper surface of the base 30,
The adsorption member 50 further includes a columnar pillar portion 51 protruding from the upper surface of each of the adsorption cells 40, the adsorption portion 53 is formed on the upper end of the pillar portion 51 A substrate adsorption pad, characterized in that. The method of claim 1,
The adsorption unit 20 is a substrate adsorption pad, characterized in that the material capable of elastic deformation. Preparing a mold for manufacturing the adsorption unit 20 including the base 30 and a plurality of fine adsorption members 50 integrally formed with the base 30,
Filling the resin material 80 in the cavity 65 formed in the mold,
And separating the resin material 80 from the mold after curing the resin material 80 filled in the cavity 65,
The adsorption member 50 includes an adsorption part 53 having an arc-shaped groove 53a which is formed in the shape of an upper light lower narrower diameter which becomes larger toward the upper side and is recessed downward in the upper surface thereof. The manufacturing method of the board | substrate adsorption pad made into. 5. The method of claim 4,
The mold includes an upper mold 60 and a lower mold 70 joined with the upper mold 60,
The upper mold 60 is formed with a cavity 65 corresponding to the outer shape of the adsorption unit 20,
The upper mold at the position corresponding to the portion where the plurality of adsorption members 50 of the upper mold 60 is formed so that the arc shape of the adsorption portion 53 is formed in the lower mold 70. A method for manufacturing a substrate adsorption pad, characterized in that a protrusion (75) protruding in a round shape toward (60) is formed.
KR1020110042513A 2011-05-04 2011-05-04 Pad for adsorbing the substrate and manufacturing method thereof KR20120124700A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020110042513A KR20120124700A (en) 2011-05-04 2011-05-04 Pad for adsorbing the substrate and manufacturing method thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020110042513A KR20120124700A (en) 2011-05-04 2011-05-04 Pad for adsorbing the substrate and manufacturing method thereof

Publications (1)

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KR20120124700A true KR20120124700A (en) 2012-11-14

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Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102013111633A1 (en) 2012-11-06 2014-05-08 Electronics And Telecommunications Research Institute Method and device for radio location
KR101477631B1 (en) * 2013-04-30 2014-12-31 (주)엠프리시젼 Adhesion pad and method of manufacturing the same
WO2015163554A1 (en) * 2014-04-21 2015-10-29 국립대학법인 울산과학기술대학교 산학협력단 Adsorption pad for transfer device and transfer device having same
CN109835714A (en) * 2017-11-29 2019-06-04 株式会社Umi Carrying tool, method for carrying and carrying tool unit
US10804132B2 (en) 2017-09-08 2020-10-13 Samsung Electronics Co., Ltd. Apparatus for manufacturing semiconductor
KR20220059902A (en) 2020-11-03 2022-05-10 고영효 Method for automation transporting of display panel and system thereof

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102013111633A1 (en) 2012-11-06 2014-05-08 Electronics And Telecommunications Research Institute Method and device for radio location
KR101477631B1 (en) * 2013-04-30 2014-12-31 (주)엠프리시젼 Adhesion pad and method of manufacturing the same
WO2015163554A1 (en) * 2014-04-21 2015-10-29 국립대학법인 울산과학기술대학교 산학협력단 Adsorption pad for transfer device and transfer device having same
US10804132B2 (en) 2017-09-08 2020-10-13 Samsung Electronics Co., Ltd. Apparatus for manufacturing semiconductor
CN109835714A (en) * 2017-11-29 2019-06-04 株式会社Umi Carrying tool, method for carrying and carrying tool unit
KR20190063370A (en) * 2017-11-29 2019-06-07 가부시키가이샤 유엠아이 Transport tool, transport method and transport unit
KR20220059902A (en) 2020-11-03 2022-05-10 고영효 Method for automation transporting of display panel and system thereof

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