WO2011139127A2 - Structure de porte-échantillon double d'appareil de traitement de tranche - Google Patents

Structure de porte-échantillon double d'appareil de traitement de tranche Download PDF

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Publication number
WO2011139127A2
WO2011139127A2 PCT/KR2011/003414 KR2011003414W WO2011139127A2 WO 2011139127 A2 WO2011139127 A2 WO 2011139127A2 KR 2011003414 W KR2011003414 W KR 2011003414W WO 2011139127 A2 WO2011139127 A2 WO 2011139127A2
Authority
WO
WIPO (PCT)
Prior art keywords
boat
wafer
chuck
processing apparatus
pillars
Prior art date
Application number
PCT/KR2011/003414
Other languages
English (en)
Korean (ko)
Other versions
WO2011139127A3 (fr
Inventor
유정호
Original Assignee
나노세미콘(주)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 나노세미콘(주) filed Critical 나노세미콘(주)
Priority claimed from KR1020110043019A external-priority patent/KR20110123692A/ko
Publication of WO2011139127A2 publication Critical patent/WO2011139127A2/fr
Publication of WO2011139127A3 publication Critical patent/WO2011139127A3/fr

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/67303—Vertical boat type carrier whereby the substrates are horizontally supported, e.g. comprising rod-shaped elements

Definitions

  • the present invention relates to a boat in a wafer processing apparatus comprising a chuck supporting a wafer for mounting the wafer to the processing apparatus. More specifically, the present invention relates to a technique for protecting a wafer processing apparatus and a wafer by preventing vibration or damage of the wafer and damage of the wafer transfer unit and the chuck due to a collision between the wafer transfer unit and the chuck when the wafer is mounted on the chuck.
  • Wafers are materials used in semiconductor manufacturing, and silicon wafers are supplied to materials that can be used in semiconductor manufacturing through various processing processes.
  • a silicon wafer is a circular plate in which a thin ingot in which a kind crystal of a material of a silicon semiconductor is grown on a circumference is thinly sliced.
  • oxygen may combine to cause a phenomenon in which a resistance value controlled through impurities on the silicon wafer is shifted from a desired resistance value.
  • a heat treatment process is required to separate oxygen from the wafer and produce a high quality wafer.
  • a heat treatment process may be necessary to reduce wafer processing stress and to reduce defects in wafer crystals.
  • the wafer is processed in a plurality of processes, such as a deposition process and an etching process, to produce a semiconductor.
  • the wafer In order to process the wafer through a plurality of processes, the wafer is supplied into the processing chamber of the wafer processing apparatus. In order to supply the unprocessed wafer to the processing chamber, a wafer transfer section is provided. When the wafer is carried out from the cassette in which the lid is opened by the load port module, the wafer transfer unit fixes one or more wafers and carries them into the process chamber. That is, the wafer transfer unit is a wafer transfer robot.
  • a boat for mounting and processing a wafer is provided inside the processing chamber. If one or more wafers are to be mounted and processed, there is a chuck in the boat for supporting the wafers.
  • the chuck may support and fix the wafer inside the boat, heat the wafer to perform heat treatment, or spray the deposition gas to supply the deposition gas to the wafer in the deposition process.
  • the chuck is formed in a boat in a plurality of stacked forms along the height direction.
  • a boat is generally equipped with a plurality of disc-shaped chucks on a plurality of pillars arranged on the circumference. This allows a plurality of wafers to be stacked and processed in a boat along the height direction without contacting each other.
  • the present invention prevents direct collision between the wafer transfer section and the chuck and prevents damage to the wafer, wafer transfer section and the chuck by allowing the chuck to support the wafer without the wafer safely landing and vibrating on the chuck.
  • the first boat including a plurality of pillars arranged on the circumference, and a connecting member for maintaining the arrangement state by connecting the pillars;
  • a second boat having a plurality of pillars arranged on a circumference, and a connecting member connecting the pillars to maintain an arrangement state, wherein the first boat is accommodated therein.
  • the first boat and the second boat is characterized in that the relative position can be changed in the vertical direction.
  • first chuck grooves are formed in the pillar of the first boat is inserted into the edge of the wafer is supported.
  • a plurality of mounting portions are formed on the pillars of the second boat, and a second chuck plate on which the wafer is placed on the mounting portion and a shower head for injecting process gas into the wafer are installed.
  • the insertion groove is formed in the vertical direction on the outer peripheral surface of the pillar of the second boat, the pillar of the first boat is inserted into the insertion groove is characterized in that the sliding movement in the vertical direction.
  • first boat and the second boat is characterized in that at least one of the sections between the pillars is formed as a wafer entry section through which the wafer can enter.
  • a wafer entry section of the first boat and the second boat is formed to coincide with each other toward the open front of the wafer processing apparatus.
  • a first chuck groove is formed in the pillar of the first boat,
  • the second chuck plate is mounted to the pillar of the second boat,
  • the first chuck groove is positioned above the second chuck plate.
  • a showerhead for injecting a process gas into a wafer mounted on the second chuck plate is mounted on the pillar of the second boat, and the showerhead is mounted at a position spaced upwardly from the second chuck plate. It is done.
  • the edge portion of the wafer is first supported by the first chuck groove of the first boat, and then the first and second boats A two-step process is performed in which the vertical position is changed so that the wafer is placed on the second chuck plate of the second boat.
  • a portion in which the wafer is primarily supported is limited to a portion of the edge of the wafer, and the vibration and impact applied to the wafer are minimized by being placed on the second chuck plate in a second state in a state where the wafer is exactly horizontal.
  • FIG. 1 is a schematic cross-sectional view of a wafer processing apparatus to which a double boat structure of the wafer processing apparatus according to the present invention is applied.
  • FIG. 2 is a perspective view of a first boat of one configuration of the present invention
  • FIG. 3 is a rear view of a second boat as another configuration of the present invention.
  • connecting member 23 second chuck plate
  • shower head 100 wafer processing apparatus
  • the wafer processing apparatus 100 is a cylindrical sealed container, and has a double boat including a first boat 10 and a second boat 20 therein.
  • Each of the first boat 10 and the second boat 20 has a plurality of pillars 11 and 21 arranged on the circumference, and the pillars are connected to the connecting members 12a, 12b, and 22 so as to maintain the arrangement. It is a connected structure, and the first boat 10 is installed inside the second boat 20.
  • first boat 10 and the second boat 20 are installed to be relatively movable in the vertical direction. That is, the first boat 10 is fixed and only the second boat 20 is moved up and down, or only the first boat 10 is moved up and down and the second boat 20 is fixed or the first boat 10 is moved. Both the first boat 10 and the second boat 20 can be installed to be moved up and down in the opposite direction. As such, the first boat 10 and the second boat 20 can be installed to be moved up and down easily using various actuators (pneumatic and hydraulic cylinders, motors, solenoid type linear actuators, etc.) known to those skilled in the art. The detailed description thereof will be omitted.
  • actuators pneumatic and hydraulic cylinders, motors, solenoid type linear actuators, etc.
  • the wafer processing apparatus 100 is provided with a door or cover which can open and close the sealed state in order to insert (mount) the wafer into the double boat or to take out the processed wafer.
  • the first boat 10 includes a plurality of pillars 11 arranged on a circumference (virtual circumference according to a design dimension) and the pillars 11 to interconnect the pillars 11. It comprises a connecting member (12a, 12b) of the hollow circular plate or simple circular plate shape to maintain the arrangement state of the 11).
  • At least one of the sections between the pillars 11 is disposed such that the pillars 11 have a larger gap than the diameter of the wafer W, so that the wafer is disposed inside the first boat 10 through the sections. It is supposed to be able to enter.
  • the pillars 11 are provided with a plurality of first chuck grooves 11a at regular intervals in the vertical direction.
  • the first chuck grooves (11a) are all formed in the same number and the formation interval is the same, so that the first chuck grooves (11a) having the same height exist, such a group of first chuck grooves 11a are present in multiple stages, ie, multiple layers, at regular intervals.
  • the first chuck groove 11a faces an outer portion of the pillar 11 toward the outside of the pillar 11 from an inner portion of the outer circumferential surface of the pillar 11 (a surface facing the inside of the first boat 10). Face) and the bottom face is formed flat.
  • the second boat 20 connects the pillars 21 and the plurality of pillars 21 arranged on the circumference (imaginary circumference according to the design dimension). It includes the connecting member 22 for maintaining the arrangement state of the pillars (21).
  • At least one of the sections between the pillars 21 is disposed such that the pillars 21 have a larger gap than the diameter of the wafer, so that the wafer enters into the second boat 20 through the sections.
  • It is supposed to be. 3 is a rear view of the second boat 20, a portion formed at wide intervals between the pillars 21 at both rear sides of the second boat 20 to allow the wafer to enter.
  • the pillars 21 are provided with mounting portions 21a at regular intervals in the vertical direction, and the second chuck plate 23 and the shower head 24 are mounted on the mounting portions 21a having the same height. . Therefore, the second boat 20 is provided with the second chuck plate 23 and the shower head 24 at regular intervals in the vertical direction. In FIG. 1, the second chuck plate 23 and the shower head ( 24) only one at the top and the rest are omitted.)
  • the second chuck plate 23 and the shower head 24 are both disc-shaped components, and the shower head 24 is mounted on the second chuck plate 23 at predetermined intervals.
  • the second chuck plate 23 and the shower head 24 are installed in the mounting portion 21a in a fixed state, and the distance between them is unchanged.
  • the second chuck plate 23 finally supports the wafer, and the showerhead 24 functions to inject a process gas to the wafer seated on the second chuck plate 23.
  • the shower head 24 may receive a process gas through a pipe line formed in the pillar 21.
  • the wide portions are formed so as to coincide with each other. That is, both the first boat 10 and the second boat 20 are installed such that a wafer entry section is formed in front of the door of the wafer processing apparatus 100, and the wafer entry sections of the first boat 10 and the second boat 20 coincide with each other.
  • FIG. 4 is a front sectional view of the state in which the first boat 10 is installed inside the second boat 20 (as viewed from the front of the two front pillars from the rear),
  • FIG. 5 illustrates a planar cross-section of the first boat 10 in a state in which the first boat 10 is installed inside the second boat 20.
  • each of the pillars 11 of the first boat 10 is installed in a state of being partially inserted into the inner surface of each of the pillars 21 of the second boat (20). That is, the outer circumferential surface of the pillar 21 of the second boat 20 has the same radius as the outer circumferential surface of the pillar 11 of the first boat 10 over the entire up and down direction in a portion facing the inside of the wafer processing apparatus 100. And an insertion groove 21b having a curvature, and the pillar 11 of the first boat 10 is partially inserted into the insertion groove 21b in a radial direction. In this case, the pillar 11 of the first boat 10 may be slid along the longitudinal direction (up and down direction) of the insertion groove 21b in the insertion groove 21b of the pillar 21 of the second boat 20. Can be.
  • the first boat 10 and the second boat 20 can be relative to move in the vertical direction. That is, only the first boat 10 is lifted, or only the second boat 20 is lifted, or the first boat 10 and the second boat 20 are lifted in opposite directions.
  • the first boat 10 and the second boat 20 are the second chuck plate 23 and the shower head 24.
  • the wafer transfer part inserts the wafer W into the space between the second chuck plate 23 and the shower head 24 to place the wafer W over the first chuck groove 11a. 2 state
  • the wafer transfer section then exits from the wafer processing apparatus 100.
  • the second The wafer W is placed on the upper surface of the chuck plate 23.
  • the door (or cover) of the wafer processing apparatus 100 is closed to form a space sealed to the outside, and the wafer processing process is performed.
  • the wafer W when the wafer W is inserted and mounted into the wafer processing apparatus 100, the wafer W first rims the first chuck groove 11a of the first boat 10. Since only a part is covered, the amount of the wafer transfer portion descending to lower the wafer W in the state where the wafer transfer device enters the inside of the wafer processing apparatus 100 is not large.
  • the wafer (W) is only the edge portion over the first chuck groove (11a) without a collision with the surface portion for manufacturing the chip, and then the edge is supported by a plurality of first chuck groove (11a) to be stably By being placed on the upper surface of the second chuck plate 23 in a horizontal state, the vibration or contact shock transmitted to the wafer W is minimized.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

La présente invention concerne une structure de porte-échantillon double d'un appareil de traitement de tranche dans laquelle un premier porte-échantillon est stocké à l'intérieur d'un second porte-échantillon, les premier et second porte-échantillons sont déplacés dans la direction verticale l'un par rapport à l'autre, une première rainure de mandrin est formée au niveau d'un pilier du premier porte-échantillon pour supporter en premier lieu une tranche et une seconde rainure de mandrin est formée au niveau d'un pilier du second porte-échantillon pour supporter en deuxième lieu la tranche afin que la vibration et le choc transmis à la tranche soient réduits et que le rendement du traitement de tranche soit augmenté.
PCT/KR2011/003414 2010-05-07 2011-05-06 Structure de porte-échantillon double d'appareil de traitement de tranche WO2011139127A2 (fr)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
KR10-2010-0042750 2010-05-07
KR20100042750 2010-05-07
KR1020110043019A KR20110123692A (ko) 2010-05-07 2011-05-06 웨이퍼 처리 장치의 이중 보트 구조
KR10-2011-0043019 2011-05-06

Publications (2)

Publication Number Publication Date
WO2011139127A2 true WO2011139127A2 (fr) 2011-11-10
WO2011139127A3 WO2011139127A3 (fr) 2012-03-01

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PCT/KR2011/003414 WO2011139127A2 (fr) 2010-05-07 2011-05-06 Structure de porte-échantillon double d'appareil de traitement de tranche

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WO (1) WO2011139127A2 (fr)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108039336A (zh) * 2017-11-23 2018-05-15 中国电子科技集团公司第五十五研究所 一种石墨舟对中装置
CN113363191A (zh) * 2021-05-31 2021-09-07 北海惠科半导体科技有限公司 晶舟、扩散设备及半导体器件制造方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR0165760B1 (ko) * 1995-06-30 1999-02-01 김주용 박막 증착 장비의 웨이퍼 지지용 보트
KR20000025669A (ko) * 1998-10-13 2000-05-06 윤종용 웨이퍼 보트
JP3167301B1 (ja) * 1999-12-29 2001-05-21 株式会社半導体先端テクノロジーズ ウェーハボートおよびウェーハボートを用いた熱処理装置

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2559627B2 (ja) * 1989-04-14 1996-12-04 信越石英株式会社 ウエーハ保持装置、該装置を用いたウエーハ搬出入方法、主として該搬出入方法に使用する縦形ウエーハボート
JPH06132390A (ja) * 1992-10-15 1994-05-13 M C Electron Kk ウェーハボート

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR0165760B1 (ko) * 1995-06-30 1999-02-01 김주용 박막 증착 장비의 웨이퍼 지지용 보트
KR20000025669A (ko) * 1998-10-13 2000-05-06 윤종용 웨이퍼 보트
JP3167301B1 (ja) * 1999-12-29 2001-05-21 株式会社半導体先端テクノロジーズ ウェーハボートおよびウェーハボートを用いた熱処理装置

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108039336A (zh) * 2017-11-23 2018-05-15 中国电子科技集团公司第五十五研究所 一种石墨舟对中装置
CN108039336B (zh) * 2017-11-23 2024-02-20 中国电子科技集团公司第五十五研究所 一种石墨舟对中装置
CN113363191A (zh) * 2021-05-31 2021-09-07 北海惠科半导体科技有限公司 晶舟、扩散设备及半导体器件制造方法

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Publication number Publication date
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