WO2015149511A1 - 一种led灯的金属散热支架及led光源板和集成散热式led灯 - Google Patents

一种led灯的金属散热支架及led光源板和集成散热式led灯 Download PDF

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Publication number
WO2015149511A1
WO2015149511A1 PCT/CN2014/090223 CN2014090223W WO2015149511A1 WO 2015149511 A1 WO2015149511 A1 WO 2015149511A1 CN 2014090223 W CN2014090223 W CN 2014090223W WO 2015149511 A1 WO2015149511 A1 WO 2015149511A1
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WO
WIPO (PCT)
Prior art keywords
light source
heat
led
bracket
led light
Prior art date
Application number
PCT/CN2014/090223
Other languages
English (en)
French (fr)
Inventor
何润林
Original Assignee
厦门萤火虫节能科技有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
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Publication of WO2015149511A1 publication Critical patent/WO2015149511A1/zh

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F21K9/232—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings specially adapted for generating an essentially omnidirectional light distribution, e.g. with a glass bulb
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/60—Cooling arrangements characterised by the use of a forced flow of gas, e.g. air
    • F21V29/67—Cooling arrangements characterised by the use of a forced flow of gas, e.g. air characterised by the arrangement of fans
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V3/00—Globes; Bowls; Cover glasses
    • F21V3/02—Globes; Bowls; Cover glasses characterised by the shape
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2107/00—Light sources with three-dimensionally disposed light-generating elements
    • F21Y2107/30—Light sources with three-dimensionally disposed light-generating elements on the outer surface of cylindrical surfaces, e.g. rod-shaped supports having a circular or a polygonal cross section
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]

Definitions

  • the invention belongs to the technical field of LED energy-saving lamps, and is particularly related to the metal heat-dissipating bracket structure of the LED lamp, and is also related to the LED light source board and the integrated heat-dissipating LED lamp structure to which the heat-dissipating bracket is applied.
  • an LED bulb comprising: a light transmissive bulb, an LED illumination source, a stem, a drive circuit and a lamp cap.
  • the light-transmissive bulb and the stem are sealed to form a vacuum blister, and the blister is filled with a low viscosity and high thermal conductivity gas (for example, a mixture of helium, hydrogen or helium hydrogen).
  • the LED light source is composed of a high thermal conductivity transparent tube and an LED chip.
  • the high thermal conductivity transparent tube is fixedly mounted on the outer surface of the core column with a transparent glue, and the LED chip is directly fixed on the outer surface of the high thermal conductivity transparent tube with a solid glue. Partly, it is then electrically connected to the driving circuit and the lamp cap, and then covered with a fluorescent layer.
  • the LED bulb reduces the thermal resistance between the LED chip and the low viscosity and high thermal conductivity gas, so when the light is emitted, the LED chip is generated.
  • the heat is dissipated through a large area of high thermal conductivity transparent tube, low viscosity high thermal conductivity gas and light transmissive bulb, and the heat dissipation effect is improved.
  • the high thermal conductivity transparent tube is made of high thermal conductivity transparent ceramic, glass or plastic. In view of the fact that the thermal conductivity of transparent ceramic, glass or plastic is far less than that of metal, the heat dissipation effect of the LED bulb still needs to be improved;
  • the high thermal conductivity transparent tube only has upper and lower openings, can only increase the heat dissipation area, can not form heat convection in the tube, the heat dissipation effect is not ideal;
  • the shape is fixed, so that the size of the LED light source cannot be changed arbitrarily according to the power change of the LED bulb, and the processing and manufacturing cost is high.
  • a metal heat dissipating bracket for an LED lamp has at least two parallel heat dissipating strips extending longitudinally, two parallel heat dissipating strips having a transverse connecting section, two adjacent horizontal connecting sections and two parallel heat dissipating strips enclosing a hollow frame
  • the hollow frame has a conductive sheet, and the parallel heat dissipation strips of the conductive sheet and the edge of the hollow frame are connected by a process connection edge, and the conductive sheet has a gap with the edge of the hollow frame.
  • the heat dissipating bracket has 2N parallel heat dissipating belts. When N ⁇ 2, all the parallel heat dissipating belts are divided into N groups, and gaps are left between the two parallel heat dissipating bands of the adjacent two groups and connected by dots.
  • the parallel heat dissipating belt also forms a notch that is easy to bend.
  • Corresponding type of LED light source board is composed of an LED chip and the above-mentioned heat dissipating bracket, and an insulating frame (injection plastic frame) is disposed at two ends of the horizontal connecting section of the heat dissipating bracket and the ends of the adjacent two conductive sheets, and the LED chip is placed
  • the horizontal connecting section is fixed in the insulating frame, and the LED chip is also electrically connected to the two conductive sheets in the adjacent two hollow frames through the wires, and all the LED chips are connected in series, and the LED chip is coated with the luminescent powder layer.
  • the heat dissipating bracket is formed into a flat shape, a flat ring shape, a U shape, a polygonal shape, a polygonal cylindrical shape or a spiral shape by bending.
  • Another metal heat sink bracket of the LED lamp comprises a heat conducting portion and a conductive portion;
  • the heat conducting portion is composed of a warp and a weft plate which are crisscrossed and crisscrossed, and the adjacent warp and weft plates are surrounded by a hollow frame;
  • the conductive portion is composed of two upper and lower portions.
  • the horizontal plate and the conductive sheet are composed, the upper and lower horizontal plates are respectively located above and below the heat conducting portion, and the upper and lower horizontal plates and the heat conducting portion are separated by a gap, and the upper and lower horizontal plates and the adjacent warp plate and the weft plate are surrounded.
  • the side is hollowed out, the conductive sheet is located in the positive hollow frame and the side hollow frame, and the conductive sheet is connected with the weft plate of the edge of the positive hollow frame and the edge of the side hollow frame through the process connection side, and the conductive sheet located at the side hollow frame is also adjacent to the adjacent horizontal plate. There is also a gap between the conductive sheets and the edges of the positive and empty frames.
  • a longitudinal slit is formed in the weft plate.
  • the upper and lower horizontal plates also form a notch corresponding to the longitudinal slit.
  • Corresponding another LED light source plate is composed of an LED chip and the above-mentioned heat dissipation bracket, and an insulating frame (injection plastic frame) is disposed at an end of the heat dissipation bracket and the adjacent two conductive sheets, and the LED chip is placed on the warp plate.
  • the LED chip is also electrically connected to the adjacent two conductive sheets through the wires, and the LED chip is coated with the luminescent powder layer.
  • the heat dissipating bracket is bent into a flat shape, a flat ring shape, a polygonal tube shape, or the like.
  • the above two LED light source panels are used in an integrated heat dissipation LED lamp, which comprises a glass bulb, a lamp cap, a driving circuit and the above LED light source panel, and the driving circuit is installed in the lamp cap or the glass bulb; the glass bulb
  • the cover is arranged on the lamp cap, and the glass bulb is provided with an erected glass stem.
  • the glass bulb and the glass stem are sealed at the bottom to form a closed cavity, and the closed cavity is filled with a heat-conducting gas (such as helium gas, hydrogen gas or hydrogen-hydrogen gas mixture, etc.).
  • the LED light source plate is fixed on the glass stem, and the LED chip on the LED light source plate is electrically connected to the driving circuit and the lamp cap.
  • the upper end and the lower end of the glass stem are mounted with a bracket and a lower bracket.
  • the two ends of the LED light source board are mounted on the upper bracket and the lower bracket, and the LED light source panel is vertically bent around the glass stem or spiral A light column is formed around the glass stem.
  • a honeycomb metal heat sink is fixedly disposed on the glass stem, a honeycomb structure is formed in the wall of the honeycomb metal heat sink, and a heat dissipation hole is further formed in the wall of the honeycomb metal heat sink, and the LED light source board is bent
  • the light column is formed by vertically surrounding or spirally surrounding the wall of the honeycomb metal heat sink.
  • the glass core column is also fixedly disposed with a honeycomb metal heat sink, a honeycomb structure is formed in the wall of the honeycomb metal heat sink, and a heat dissipation hole is further formed in the wall of the honeycomb metal heat sink, and the LED light source plate is directly fixed on the The top end of the honeycomb metal heat sink, or the above-mentioned LED light source plate is fixed on the aluminum plate and the aluminum plate is fixed on the top end of the honeycomb metal heat sink.
  • the inner side of the cylindrical wall of the honeycomb metal heat sink extends toward the glass core to form a radial piece, and the radial piece further forms a curved piece along the circumference.
  • the glass stem is also fixedly covered with a foam metal, and the LED light source panel is vertically or rounded around the foam metal to form a light column by bending.
  • the glass stem is also fixedly covered with foam metal.
  • the LED light source plate is directly fixed on the top of the metal foam, or the LED light source plate is fixed on the aluminum plate and the aluminum plate is fixed on the top of the metal foam.
  • a fan is also mounted below the LED light source panel, below the LED light source panel and the honeycomb metal heat sink, or below the LED light source panel and the foam metal.
  • the driving circuit is installed in the glass bulb, and the element of the driving circuit is directly soldered on the heat dissipation bracket of the LED light source board.
  • the present invention has the following advantages compared with the prior art:
  • the metal heat-dissipating bracket (such as copper) replaces the high-conductivity transparent tube, and the high thermal conductivity of the metal makes the heat-dissipating effect of the LED bulb greatly improved;
  • the base of the existing LED chip only plays a supporting role, so in addition to the metal base, the existing LED chip needs to specifically add a heat sink for the heat output of the LED chip, and the base only has a pole after the package.
  • a small part of the molded LED light source particles, a large part of the pedestal will be discarded as waste after packaging, resulting in high cost, large amount of waste, and waste of the existing LED chip package; and the existing LED chip package structure
  • the metal heat dissipating bracket of the invention not only provides a bracket for facilitating the packaging of the LED chip, but also provides a heat dissipating belt to facilitate the heat dissipation of the working of the LED chip, so that the raw material of the invention is fully utilized, the heat sink of the prior art is omitted, and the heat dissipation effect is greatly improve;
  • the metal heat sink or further cooperate with the honeycomb metal heat sink, foam metal and fan, etc. not only can increase the heat dissipation area, but also form heat convection inside, the heat dissipation effect is better;
  • the metal heat-dissipating bracket can be bent according to the power design requirements of the LED bulb, and is used for installing different numbers of LED chips to form a corresponding LED light source, which is convenient to manufacture and low in cost.
  • the key of the invention is to integrate the heat conduction of the metal heat-dissipating bracket, the heat conduction of the heat-conducting gas and the heat dissipation of the glass bulb, and fully diffuse the heat of the working of the LED chip through the metal heat-dissipating bracket, fully contact with the heat-conducting gas, and then fully radiate from the glass bulb. Achieve fast and efficient integration of heat dissipation.
  • the invention is particularly suitable for making high-power LED bulbs, such as bulbs, mercury lamps, candle lamps, downlights, spotlights, BR lamps, MR lamps, and the like.
  • FIG. 1 is a schematic structural view of a metal heat dissipation bracket (1) of the present invention
  • Figure 1A is a partial enlarged view of Figure 1;
  • FIG. 2 is a schematic structural view of a metal heat-dissipating bracket (1) of the present invention
  • Figure 2B is a partial enlarged view of Figure 2;
  • FIG. 3 is a schematic structural view of an LED light source panel (1) of the present invention.
  • Figure 3C is a partial enlarged view of Figure 3;
  • 3-1 is a schematic structural view of a whole block of the LED light source panel (1) of the present invention.
  • 3-2 is a schematic view showing a single structure of the LED light source panel (1) of the present invention.
  • FIG. 4 is a schematic view showing a circular ring structure of the LED light source panel (1) of the present invention.
  • 4-1 is a schematic view showing the use of a flat ring structure of the LED light source panel (1) of the present invention
  • Figure 5 is a schematic view showing the polygonal structure of the LED light source panel (1) of the present invention.
  • Figure 6 is a U-shaped structural view of the LED light source panel (1) of the present invention.
  • Figure 7 is a schematic view showing the U-shaped structure of the LED light source panel (1) of the present invention.
  • Figure 8 is a schematic view showing the spiral structure of the LED light source panel (1) of the present invention.
  • Figure 9 is a schematic view showing a polygonal cylindrical structure of the LED light source panel (1) of the present invention.
  • Figure 10 is a cross-sectional view showing the first embodiment (bulb lamp) of the integrated heat dissipating LED lamp (1) of the present invention
  • Figure 11 is a schematic view of the internal structure of Figure 10;
  • Figure 12 is a plan view of the internal structure of Figure 10;
  • Figure 13 is a cross-sectional view showing the second embodiment (bulb lamp) of the integrated heat dissipating LED lamp (1) of the present invention.
  • Figure 14 is a schematic view of the internal structure of Figure 13;
  • Figure 15 is a plan view of the internal structure of Figure 13;
  • Figure 16 is a cross-sectional view showing the third embodiment (mercury lamp) of the integrated heat-dissipating LED lamp of the present invention.
  • Figure 17 is a schematic view showing the internal structure of Figure 16;
  • Figure 18 is an exploded perspective view of the internal structure of Figure 16;
  • Figure 19 is a schematic structural view of a metal foam
  • FIG. 20 is an overall cross-sectional view showing a fourth embodiment (candle lamp) of the integrated heat dissipation type LED lamp of the present invention.
  • FIG. 21 is an overall cross-sectional view showing a fifth embodiment (PAR lamp) of the integrated heat dissipation type LED lamp of the present invention.
  • Figure 22 is an exploded perspective view of the internal structure of Figure 21;
  • BR lamp a sixth embodiment of the integrated heat dissipation type LED lamp of the present invention
  • Figure 24 is an overall cross-sectional view showing the seventh embodiment (MR lamp) of the integrated heat-dissipating LED lamp of the present invention.
  • Figure 25 is an exploded perspective view of the internal structure of Figure 24;
  • 26 is an overall cross-sectional view showing an eighth embodiment of the integrated heat dissipating LED lamp (pluggable T8 lamp) of the present invention.
  • Figure 27 is a schematic view showing the internal structure of Figure 26;
  • IX screw type T8 lamp
  • Figure 29 is a general cross-sectional view showing a tenth embodiment (bulb lamp) of the integrated heat-dissipating LED lamp of the present invention.
  • Figure 30 is a schematic structural view of a metal heat dissipating bracket (2) of the present invention.
  • Figure 30A is a partial enlarged view of Figure 30;
  • Figure 31 is a schematic structural view of a metal heat-dissipating bracket (2) injection molded plastic frame of the present invention
  • Figure 31B is a partial enlarged view of Figure 31;
  • FIG. 32 is a schematic structural view showing a connecting side of a metal heat-dissipating bracket (2) after a plastic injection frame of the present invention
  • Figure 32C is a partial enlarged view of Figure 32;
  • Figure 33 is a schematic view showing the structure of the metal heat-dissipating bracket (2) of the present invention.
  • Figure 33D is a partial enlarged view of Figure 33;
  • Figure 34 is a schematic view showing the structure of the metal heat-dissipating bracket (2) of the present invention.
  • Figure 34E is a partial enlarged view of Figure 34;
  • 35 is a schematic structural view of a metal heat-dissipating bracket (2) point phosphor of the present invention.
  • Figure 35F is a partial enlarged view of Figure 35;
  • Figure 36 is a schematic view showing the structure of the metal heat dissipating bracket (2) of the present invention.
  • Figure 36G is a partial enlarged view of Figure 36;
  • Figure 37 is a schematic view showing the structure of a square flat plate of the LED light source panel (2) of the present invention.
  • Figure 37-1 is a schematic view showing the use of a square flat type structure of the LED light source panel (2) of the present invention.
  • Figure 38 is a schematic view showing the circular structure of the flat plate of the LED light source plate (2) of the present invention.
  • Figure 39 is a schematic view showing the polygonal cylindrical structure of the LED light source panel (2) of the present invention.
  • Figure 40 is a schematic view showing the polygonal tubular docking structure of the LED light source panel (2) of the present invention.
  • Figure 41 is a schematic view showing the use of a polygonal cylindrical structure of the LED light source panel (2) of the present invention.
  • Figure 42 is a cross-sectional view of the first embodiment (bulb lamp) of the integrated heat dissipating LED lamp (2) of the present invention.
  • Figure 43 is a schematic view showing the internal structure of Figure 42;
  • Figure 44 is a plan view of the internal structure of Figure 42;
  • Figure 45 is a cross-sectional view showing the second embodiment (bulb lamp) of the integrated heat dissipating LED lamp (2) of the present invention.
  • Figure 46 is a schematic view showing the internal structure of Figure 45;
  • Figure 47 is an overall cross-sectional view showing the third embodiment (mercury lamp) of the integrated heat-dissipating LED lamp (2) of the present invention.
  • Figure 48 is a perspective exploded perspective view of the internal structure of Figure 47;
  • FIG. 49 is an overall cross-sectional view showing a fourth embodiment (PAR lamp) of the integrated heat dissipation type LED lamp (2) of the present invention.
  • Figure 50 is an exploded perspective view of the internal structure of Figure 49;
  • Figure 51 is a cross-sectional view showing the fifth embodiment (BR lamp) of the integrated heat dissipating LED lamp (2) of the present invention.
  • Figure 52 is an overall cross-sectional view showing the sixth embodiment (MR lamp) of the integrated heat-dissipating LED lamp (2) of the present invention.
  • Figure 53 is a cross-sectional view showing the seventh embodiment of the integrated heat dissipating LED lamp (2) of the present invention (pluggable T8 lamp);
  • Figure 54 is a schematic view showing the internal structure of Figure 53;
  • Figure 55 is a cross-sectional view showing an overall embodiment of the integrated heat-dissipating LED lamp (2) of the present invention (a screw-type T8 lamp);
  • Figure 56 is a general cross-sectional view showing the ninth (bulb lamp) of the integrated heat-dissipating LED lamp (2) of the present invention.
  • Heat dissipation bracket 100 parallel heat dissipation belt 110, transverse connection section 120, hollow frame 130, conductive sheet 140, process connection side 150, gap 160, gap 170, point 180, notch 190;
  • LED light source panel 200 insulating frame 210
  • LED light source panel 400 gold wire 410, phosphor 420.
  • 1 to 29 show the structure of a metal heat dissipation bracket of the first LED lamp of the present invention, and an LED light source panel and an integrated heat dissipation LED lamp thereof.
  • the metal heat dissipation bracket 100 of the first LED lamp disclosed in the present invention is formed by press molding, and has at least two parallel heat dissipation bands 110 extending longitudinally, and between the two parallel heat dissipation bands 110.
  • the plurality of lateral connecting sections 120, the adjacent two horizontal connecting sections 120 and the two parallel heat radiating strips 110 enclose a hollow frame 130, the conductive frame 140 in the hollow frame 130, and the parallel heat radiating strip 110 of the conductive sheet 140 and the edge of the hollow frame 130
  • the process connection edge 150 is connected, and the conductive sheet 150 and the edge of the hollow frame 130 are provided with a gap 160.
  • the process connection side 150 is stamped and removed after the LED chip 4 is packaged, so that the parallel heat dissipation tape 110 is not electrically connected to the conductive sheet 140.
  • a gap 170 is left and connected by a point 180.
  • This structure facilitates disassembling the entire heat dissipation bracket 100 to a desired size.
  • FIG. 3-2 there is only a set of parallel heat dissipation strips 110 in a single row structure.
  • the gap 170 And point 180 also facilitates bending the entire heat sink bracket 100 into the desired configuration.
  • the present invention further forms a notch 190 that is easily bent on the parallel heat dissipating belt 110.
  • the first LED light source panel 200 disclosed by the present invention is composed of the LED chip 4 and the heat dissipation bracket 100 shown in FIG.
  • An insulating frame 210 (which may be an injection molded plastic frame or other insulation) is provided at both ends of the lateral connecting section 120 of the heat dissipating bracket 100 and the ends of the adjacent two conductive sheets 140 as shown in FIG. 2 and FIG. 2B.
  • the material is made into an insulating frame 210), and the process connecting edge 150 of the heat dissipating bracket 100 is punched out (shown by broken lines in FIG.
  • the LED chip 4 is then placed on the lateral connection section 120 and fixed in the insulating frame 210.
  • the LED chip 4 is also electrically connected to the two conductive sheets 140 of the two adjacent hollow frames 130 by wires, and the entire LED light source panel 200 is All of the LED chips 4 are connected in series with each other, and the LED chip 4 is coated with a luminescent powder layer to form a monolithic LED light source panel 200 as shown in FIG. 3-1.
  • the conductive sheet 140 is equivalent to the base of the existing LED light source particles, and the parallel heat dissipation strip 110 and the lateral connecting portion 120 can replace the heat sink of the existing LED light source particles to realize heat conduction and heat dissipation of the LED chip 4.
  • the invention makes full use of the conventional scrap scraps (parallel heat dissipating belt 110 and transverse connecting section 120), so that the raw materials are fully utilized, and the heat dissipating effect is greatly improved.
  • the present invention is characterized in that the LED light source panel 200 can be in the form of a flat plate (Fig. 3), or can be bent into a flat ring shape (Fig. 4), U type (Fig. 6 and Fig. 7), and a polygon by the characteristics of the metal heat dissipating bracket 100. (Fig. 5), polygonal cylinder (Fig. 9) or spiral (Fig. 8), and the like.
  • a first embodiment of the first integrated heat dissipation type LED lamp disclosed in the present invention is a bulb lamp, including a glass bulb 1, a lamp holder 2, a driving circuit 3, and an LED light source panel 200 (LED chip). 4 and the heat sink bracket 100).
  • the drive circuit 3 is mounted on the base 2.
  • the glass bulb 1 is disposed on the lamp cap 2, and the glass bulb 1 is provided with an upright glass stem 6 .
  • the glass bulb 1 and the glass stem 6 are sealed at the bottom to form a closed cavity 11 , and the closed cavity 11 is filled with the heat conductive gas 12 .
  • the upper and lower ends of the glass stem 6 are mounted with a bracket 61 and a lower bracket 62.
  • the LED light source panel 200 is fixed on the glass stem 6, specifically, the two ends of the LED light source panel 200 are erected on the upper bracket 61 and the lower bracket 62, and the LED chip 4 and the driving circuit 3 on the LED light source panel 200 are
  • the lamp cap 2 is electrically connected, and the LED light source panel 200 forms a light column by bending around the glass stem 6 in a spiral shape.
  • the heat generated by the operation of the LED chip 4 is sufficiently diffused by the large area of the heat dissipation bracket 100, and is sufficiently contacted with the heat conductive gas 12, and then fully radiated from the large surface of the glass bulb 1 to realize rapid and effective integrated heat dissipation.
  • a second embodiment of the first integrated heat dissipation LED lamp disclosed in the present invention is a bulb lamp, which also includes a glass bulb 1 , a lamp holder 2 , a driving circuit 3 , and an LED light source panel 200 (LED).
  • the chip 4 and the heat dissipation bracket 100 are composed of).
  • the drive circuit 3 is mounted on the base 2.
  • the glass bulb 1 is disposed on the lamp cap 2, and the glass bulb 1 is provided with an upright glass stem 6 .
  • the glass bulb 1 and the glass stem 6 are sealed at the bottom to form a closed cavity 11 , and the closed cavity 11 is filled with the heat conductive gas 12 . .
  • the upper and lower ends of the glass stem 6 are mounted with a bracket 61 and a lower bracket 62.
  • the LED light source panel 200 is fixed to the glass stem 6, and the series LED chip 4 on the LED light source panel 200 is electrically connected to the driving circuit 3 and the base 2.
  • the difference between the second embodiment and the first embodiment is that the upper metal frame 6 and the lower bracket 62 of the glass stem 6 are also fixedly disposed with a honeycomb metal heat sink 7 , and the honeycomb metal heat sink 7 has a honeycomb structure formed in the wall of the battery.
  • the honeycomb structure can have many specific forms.
  • the honeycomb structure shown in the figure is such that the inner side of the cylindrical wall of the honeycomb metal heat sink 7 extends toward the glass stem 6 to form a radial piece 71, and the radial piece 71 also forms a curved piece along the circumference. 72.
  • the heat dissipation hole 73 is further formed in the wall of the honeycomb metal heat sink 7 for heat convection.
  • the LED light source plate 200 is spirally wound around the wall of the honeycomb metal heat sink 7 to form a light column.
  • the heat generated by the operation of the LED chip 4 is sufficiently diffused by the large area of the heat dissipation bracket 100 and the honeycomb metal heat sink 7, and is sufficiently in contact with the heat conduction gas 12, and is sufficiently radiated by the large surface of the glass bulb 1 to achieve rapid and effective operation. Integrated heat dissipation.
  • the third embodiment of the first integrated heat dissipating LED lamp disclosed in the present invention is a mercury lamp (the outer shape is different from the first embodiment and the second embodiment), and includes a glass bulb 1 and a base 2
  • the driving circuit 3, the LED chip 4, and the LED light source panel 200 (composed of the LED chip 4 and the heat dissipation bracket 100).
  • the drive circuit 3 is mounted on the base 2.
  • the glass bulb 1 is disposed on the lamp cap 2, and the glass bulb 1 is provided with an upright glass stem 6 .
  • the glass bulb 1 and the glass stem 6 are sealed at the bottom to form a closed cavity 11 , and the closed cavity 11 is filled with the heat conductive gas 12 . .
  • the upper and lower ends of the glass stem 6 are mounted with a bracket 61 and a lower bracket 62.
  • the LED light source panel 200 is fixed to the glass stem 6, and the series LED chip 4 on the LED light source panel 200 is electrically connected to the driving circuit 3 and the base 2.
  • the difference between the third embodiment and the first embodiment (as in the second embodiment) is that the upper metal frame 6 and the lower bracket 62 of the glass stem 6 are also fixedly disposed with a honeycomb metal heat sink 7, and the honeycomb metal heat sink 7
  • the honeycomb structure is formed in the wall of the tube.
  • the honeycomb structure can have many specific forms.
  • the honeycomb structure shown in the figure is that the inner side of the wall of the honeycomb metal heat sink 7 extends toward the glass stem 6 to form a radial piece 71, a radial piece. 71 is further formed with a curved piece 72 along the circumference, and a heat dissipation hole 73 is further formed in the wall of the honeycomb metal heat sink 7 for heat convection.
  • the LED light source plate 200 is spirally wound around the tube of the honeycomb metal heat sink 7 by bending. A beam of light is formed on the wall.
  • this third embodiment is different from the second embodiment in that a fan 8 is further disposed below the LED light source panel 200 and the honeycomb metal heat sink 7.
  • the heat generated by the operation of the LED chip 4 is sufficiently diffused by the large area of the heat dissipation bracket 100 and the honeycomb metal heat sink 7, and is in full contact with the heat conduction gas 12, and the heat convection is increased by the fan 8, and then the glass bulb 1 is large.
  • the surface is fully dissipated for fast and efficient integration of heat dissipation.
  • the above-mentioned honeycomb metal heat sink 7 of the present invention can also be replaced by a metal foam 9 to improve the heat dissipation effect and have the same efficacy.
  • the fourth embodiment of the first integrated heat dissipation type LED lamp disclosed in the present invention is a candle lamp (the shape is different from the first to third embodiments), and also includes a glass bulb 1, a lamp holder 2, a driving circuit 3, and an LED.
  • the light source panel 200 (composed of the LED chip 4 and the heat dissipation bracket 100).
  • the drive circuit 3 is mounted on the base 2.
  • the glass bulb 1 is disposed on the lamp cap 2, and the glass bulb 1 is provided with an upright glass stem 6 .
  • the glass bulb 1 and the glass stem 6 are sealed at the bottom to form a closed cavity 11 , and the closed cavity 11 is filled with the heat conductive gas 12 .
  • the LED light source panel 200 is bent in a U-shaped combination as shown in FIG.
  • the serial LED chip 4 on the LED light source panel 200 is electrically connected to the driving circuit 3 and the base 2.
  • the heat generated by the operation of the LED chip 4 is sufficiently diffused by the large area of the heat dissipation bracket 100, and is sufficiently contacted with the heat conductive gas 12, and then fully radiated from the large surface of the glass bulb 1 to realize rapid and effective integrated heat dissipation.
  • a fifth embodiment of the first integrated heat dissipation LED lamp disclosed in the present invention is a PAR lamp.
  • an embodiment of an integrated heat dissipation LED lamp disclosed in the present invention is shown in FIG.
  • a BR lamp as shown in FIG. 24 to FIG. 25
  • a seventh embodiment of an integrated heat dissipation type LED lamp disclosed in the present invention is an MR lamp.
  • Embodiments 5 to 7 also include a glass bulb 1, a base 2, a driving circuit 3, and an LED light source panel 200 (composed of the LED chip 4 and the heat dissipation bracket 100).
  • the drive circuit 3 is mounted on the base 2.
  • the glass bulb 1 is disposed on the lamp cap 2, and the glass bulb 1 is provided with an upright glass stem 6 .
  • the glass bulb 1 and the glass stem 6 are sealed at the bottom to form a closed cavity 11 , and the closed cavity 11 is filled with the heat conductive gas 12 .
  • the LED light source plate 200 is fixed on the glass core column 6.
  • the glass core column 6 is also fixedly disposed on the honeycomb metal heat sink 7, and the honeycomb metal heat sink 7 has a honeycomb structure formed therein, and the honeycomb structure may have In many specific forms (as described above), the wall of the honeycomb metal heat sink 7 further has a heat dissipation hole 73 for heat convection, and the LED light source plate 200 is fixed on the aluminum plate 5 (see FIG.
  • the LED light source panel 200 can also be directly fixed to the top end of the honeycomb metal heat sink 7.
  • the series LED chip 4 on the LED light source panel 200 is electrically connected to the drive circuit 3 and the base 2.
  • the heat generated by the operation of the LED chip 4 is sufficiently diffused by the large area of the heat dissipation bracket 100 and the honeycomb metal heat sink 7, and is in full contact with the heat conduction gas 12, and the heat convection is increased by the fan 8, and then the glass bulb 1 is large.
  • the surface is fully dissipated for fast and efficient integration of heat dissipation.
  • the eighth embodiment of the first integrated heat-dissipating LED lamp disclosed in the present invention is a pluggable T8 lamp.
  • an integrated heat-dissipating LED lamp disclosed in the present invention is shown in FIG. Embodiment 9 is a screw-type T8 lamp, which also includes a glass bulb 1, a lamp cap 2, a driving circuit 3, an LED light source panel 200, and a glass stem 6, between the components of the eighth embodiment and the ninth embodiment.
  • the mutual relationship is the same as that of the first embodiment, and will not be described here. The difference is that the type of the light bulb used is different.
  • the heat generated by the operation of the LED chip 4 is sufficiently diffused by the large area of the heat dissipation bracket 100, and is sufficiently in contact with the heat-conducting gas 12, and then the large surface enlarged by the glass bulb 1 is sufficiently dissipated to realize rapid and effective integrated heat dissipation.
  • a tenth embodiment of the first integrated heat dissipating LED lamp disclosed in the present invention is a bulb lamp, which also includes a glass bulb 1, a lamp cap 2, a driving circuit 3, an LED light source panel 200, and a glass stem 6
  • the relationship between the components of the tenth embodiment is the same as that of the first embodiment, and details are not described herein.
  • the difference between the tenth embodiment and the first embodiment is that the driving circuit 3 is mounted in the glass bulb 1, specifically, the element of the driving circuit 3 is directly welded to the inner side of the heat dissipation bracket 100.
  • the heat generated by the operation of the LED chip 4 and the driving circuit 3 is sufficiently diffused by the large area of the heat dissipating bracket 100, and is in full contact with the heat-conducting gas 12, and then the large surface enlarged by the glass bulb 1 is fully emitted, thereby achieving rapid and effective operation.
  • This embodiment 10 allows the glass bulb 1 to extend as far as possible to the base 2, increasing the light transmission area, and the illumination effect is better.
  • metal heat dissipation bracket structures of a second LED lamp of the present invention are metal heat dissipation bracket structures of a second LED lamp of the present invention, and an LED light source panel and an integrated heat dissipation LED lamp thereof.
  • the improved metal heat dissipating bracket 300 of the second type of LED lamp disclosed in the present invention is formed by stamping, and includes a heat conducting portion 310 and a conductive portion 320.
  • the heat conducting portion 310 is composed of a crisscross warp plate 311 and a weft plate 312, and adjacent warp plates 311 and weft plates 312 enclose a positive hollow frame 313.
  • the conductive portion 320 is composed of upper and lower horizontal plates 321 and 322 and a conductive sheet 323.
  • the upper and lower horizontal plates 321 and 322 are respectively located above and below the heat conducting portion 310, and the upper and lower horizontal plates 321 and 322 and the heat conducting portion 310 are stored.
  • gaps 326, upper and lower horizontal plates 321 and 322 and adjacent warp plates 311 and weft plates 312 enclose a side hollow frame 324, and the conductive sheets 323 are located in the positive hollow frame 313 and the side hollow frame 324, and the conductive sheets 323 and The weft 312 of the hollow frame 313 and the edge of the side hollow frame 324 are connected by the process connecting edge 325, and the conductive piece 323 of the side hollow frame 324 is also connected with the adjacent horizontal plates 321 and 322, and the conductive piece 323 and the positive hollow frame 313 are A gap 327 is also present at the edge of the side cutout frame 324.
  • the process connection side 325 will be stamped away after the LED chip 4 is packaged so that the warp plate 311 and the weft plate 312 of the heat conductive portion 310 are not electrically connected to the upper and lower horizontal plates 321 and 322 and the conductive sheet 324 of the conductive portion 320.
  • the present invention further forms a longitudinal slit 314 on the weft 312, and a corresponding notch 328 is formed on the upper and lower transverse plates 312 and 322, and a longitudinal slit 314 on the weft 312 is also formed. Conducive to convection heat dissipation.
  • the warp plate 311 of the heat dissipating bracket 300 and the end of the adjacent two conductive strips 323 are first.
  • the insulating frame 330 (which may be an injection molded plastic frame or an insulating frame 330 made of other insulating materials) is provided, and as shown in FIG. 32 and FIG. 32C, the process connecting edge 325 of the heat removing bracket 300 is punched out (FIG. 32C).
  • a broken line is shown to indicate the punching and cutting, so that the warp plate 311 and the weft plate 312 are disconnected from the upper and lower horizontal plates 321 and 322 and the conductive sheet 324, and then turned on, and then as shown in FIGS. 33 and 33D,
  • the LED chip 4 is placed on the warp plate 311 and fixed in the insulating frame 330, and as shown in FIGS. 34 and 34E, the LED chip 4 is electrically connected to the adjacent two conductive sheets 323 through wires (gold wires 410).
  • a luminescent powder layer (phosphor 420) is further coated on the LED chip 4.
  • an LED light source panel 400 disclosed in the present invention is fabricated.
  • the upper and lower horizontal plates 321 and 322 are respectively connected to the positive and negative power sources.
  • all the LED chips 4 of each of the weft 312 are connected in series with each other.
  • the plates 312 are connected in parallel with each other, that is, the LED light source plates 400 are in parallel.
  • the entire LED light source panel 400 is made by trimming (shown by broken lines in FIG. 36G to indicate stamping and cutting) and the package is changed in direction of the electrode. All of the LED chips 4 of 400 are connected in series with each other, that is, the LED light source panel 400 is in series.
  • the conductive sheet 323 is equivalent to the base of the existing LED light source particles, and the warp plate 311 and the weft plate 312 of the heat conductive portion 310 can replace the heat sink of the existing LED light source particles to realize heat conduction and heat dissipation of the LED chip 4.
  • the invention makes full use of the conventional scrap material (the plate 311 and the weft plate 312), so that the raw materials are fully utilized, and the heat dissipation effect is greatly improved.
  • the LED light source panel 400 can be in the form of a flat plate by using the characteristics of the metal heat dissipating bracket 300 (Fig. 37, Fig.
  • FIG. 37-1 is an increased heat dissipating aluminum plate 5), or by splicing into a flat ring shape (Fig. 38), or by The bending is in the form of a polygonal cylinder (Fig. 39, Fig. 40 is a polygonal cylindrical butt joint of Fig. 39, Fig. 41 is a honeycomb metal heat sink 7 added to the polygonal cylindrical shape of Fig. 39), and the like.
  • a first embodiment of the second integrated heat dissipation LED lamp disclosed in the present invention is a bulb lamp, including a glass bulb 1, a lamp holder 2, a driving circuit 3, and an LED light source panel 400 (LED chip). 4 and the heat sink bracket 300).
  • the drive circuit 3 is mounted on the base 2.
  • the glass bulb 1 is disposed on the lamp cap 2, and the glass bulb 1 is provided with an upright glass stem 6 .
  • the glass bulb 1 and the glass stem 6 are sealed at the bottom to form a closed cavity 11 , and the closed cavity 11 is filled with the heat conductive gas 12 .
  • the upper and lower ends of the glass stem 6 are mounted with a bracket 61 and a lower bracket 62.
  • the LED light source panel 400 is fixed on the glass stem 6, specifically, the two ends of the LED light source panel 400 are erected on the upper bracket 61 and the lower bracket 62, and the LED chip 4 on the LED light source panel 400 and the driving circuit 3 and the lamp cap 2 Electrically connected, the LED light source panel 400 forms a light column around the glass stem 6 in a vertical shape by bending.
  • the heat generated by the operation of the LED chip 4 is sufficiently diffused by the large area of the heat dissipation bracket 300, and is sufficiently contacted with the heat-conducting gas 12, and then fully radiated from the large surface of the glass bulb 1 to realize rapid and effective integrated heat dissipation.
  • a second embodiment of the second integrated heat dissipation LED lamp disclosed in the present invention is a bulb lamp, which also includes a glass bulb 1, a lamp holder 2, a driving circuit 3, and an LED light source panel 400 (LED).
  • the chip 4 and the heat dissipation bracket 300 are composed of).
  • the drive circuit 3 is mounted on the base 2.
  • the glass bulb 1 is disposed on the lamp cap 2, and the glass bulb 1 is provided with an upright glass stem 6 .
  • the glass bulb 1 and the glass stem 6 are sealed at the bottom to form a closed cavity 11 , and the closed cavity 11 is filled with the heat conductive gas 12 .
  • the upper and lower ends of the glass stem 6 are mounted with a bracket 61 and a lower bracket 62.
  • the LED light source panel 400 is fixed to the glass stem 6, and the LED chip 4 on the LED light source panel 400 is electrically connected to the driving circuit 3 and the base 2.
  • the difference between the second embodiment and the first embodiment is that the upper metal frame 6 and the lower bracket 62 of the glass stem 6 are also fixedly disposed with a honeycomb metal heat sink 7 , and the honeycomb metal heat sink 7 has a honeycomb structure formed in the wall of the battery.
  • the honeycomb structure can have many specific forms.
  • the honeycomb structure shown in the figure is such that the inner side of the cylindrical wall of the honeycomb metal heat sink 7 extends toward the glass stem 6 to form a radial piece 71, and the radial piece 71 also forms a curved piece along the circumference. 72.
  • a heat dissipation hole 73 is further defined in the wall of the honeycomb metal heat sink 7 for heat convection.
  • the LED light source plate 400 is vertically bent around the wall of the honeycomb metal heat sink 7 to form a light column.
  • the heat generated by the operation of the LED chip 4 is sufficiently diffused by the large area of the heat dissipation bracket 300 and the honeycomb metal heat sink 7, and is sufficiently in contact with the heat conduction gas 12, and then fully radiated from the large surface of the glass bulb 1 to achieve rapid and effective operation. Integrated heat dissipation.
  • a third embodiment of the second integrated heat dissipating LED lamp disclosed in the present invention is a mercury lamp (the outer shape is different from the first embodiment and the second embodiment), and includes a glass bulb 1 and a base 2
  • the driving circuit 3, the LED chip 4, and the LED light source panel 400 (composed of the LED chip 4 and the heat dissipation bracket 300).
  • the drive circuit 3 is mounted on the base 2.
  • the glass bulb 1 is disposed on the lamp cap 2, and the glass bulb 1 is provided with an upright glass stem 6 .
  • the glass bulb 1 and the glass stem 6 are sealed at the bottom to form a closed cavity 11 , and the closed cavity 11 is filled with the heat conductive gas 12 . .
  • the upper and lower ends of the glass stem 6 are mounted with a bracket 61 and a lower bracket 62.
  • the LED light source panel 400 is fixed to the glass stem 6, and the LED chip 4 on the LED light source panel 400 is electrically connected to the driving circuit 3 and the base 2.
  • the difference between the third embodiment and the first embodiment (as in the second embodiment) is that the upper metal frame 6 and the lower bracket 62 of the glass stem 6 are also fixedly disposed with a honeycomb metal heat sink 7, and the honeycomb metal heat sink 7
  • the honeycomb structure is formed in the wall of the tube.
  • the honeycomb structure can have many specific forms.
  • the honeycomb structure shown in the figure is that the inner side of the wall of the honeycomb metal heat sink 7 extends toward the glass stem 6 to form a radial piece 71, a radial piece.
  • a curved piece 72 is further formed on the circumference of the casing 71.
  • a heat dissipation hole 73 is further formed in the wall of the honeycomb metal heat sink 7 for heat convection.
  • the LED light source plate 400 is vertically fixed around the honeycomb metal heat sink 7 by bending.
  • a beam of light is formed on the wall of the barrel.
  • this third embodiment is different from the second embodiment in that a fan 8 is further disposed under the LED light source panel 400 and the honeycomb metal heat sink 7.
  • the heat generated by the operation of the LED chip 4 is sufficiently diffused by the large area of the heat dissipation bracket 300 and the honeycomb metal heat sink 7, and is in full contact with the heat conduction gas 12, and the heat convection is increased by the fan 8, and then the glass bulb 1 is large.
  • the surface is fully dissipated for fast and efficient integration of heat dissipation.
  • honeycomb metal heat sink 7 of the present invention can also be replaced by the foam metal 9 shown in Fig. 19 to improve the heat dissipation effect and have the same efficacy.
  • a fourth embodiment of an integrated heat-dissipating LED lamp disclosed in the present invention is a PAR lamp.
  • a fifth embodiment of an integrated heat-dissipating LED lamp disclosed in the present invention is BR lamp
  • Embodiment 6 of an integrated heat dissipation type LED lamp disclosed in the present invention is an MR lamp.
  • Embodiments 4 to 6 also include a glass bulb 1, a lamp cap 2, a driving circuit 3, and an LED light source panel 400 (composed of the LED chip 4 and the heat dissipation bracket 300).
  • the drive circuit 3 is mounted on the base 2.
  • the glass bulb 1 is disposed on the lamp cap 2, and the glass bulb 1 is provided with an upright glass stem 6 .
  • the glass bulb 1 and the glass stem 6 are sealed at the bottom to form a closed cavity 11 , and the closed cavity 11 is filled with the heat conductive gas 12 .
  • the LED light source plate 400 is fixed on the glass core column 6.
  • the glass core column 6 is also fixedly disposed with a honeycomb metal heat sink 7, and the honeycomb metal heat sink 7 has a honeycomb structure formed therein, and the honeycomb structure may have In many specific forms (as described above), the wall of the honeycomb metal heat sink 7 further has a heat dissipation hole 73 for heat convection, and the LED light source plate 400 is fixed on the aluminum plate 5 (see FIG.
  • the LED light source panel 400 can also be directly fixed to the top end of the honeycomb metal heat sink 7.
  • the LED chip 4 on the LED light source panel 400 is electrically connected to the drive circuit 3 and the base 2.
  • the heat generated by the operation of the LED chip 4 is sufficiently diffused by the large area of the heat dissipation bracket 300 and the honeycomb metal heat sink 7, and is sufficiently in contact with the heat conduction gas 12, and then fully radiated from the large surface of the glass bulb 1 to achieve rapid and effective operation. Integrated heat dissipation.
  • a seventh embodiment of an integrated heat-dissipating LED lamp disclosed in the present invention is a pluggable T8 lamp.
  • an integrated heat-dissipating LED lamp disclosed in the present invention is provided.
  • Embodiment 8 is a screw-type T8 lamp, which also includes a glass bulb 1, a lamp cap 2, a driving circuit 3, an LED light source panel 400, and a glass stem 6, between the components of the seventh embodiment and the eighth embodiment.
  • the relationship is the same as that of the first embodiment, and will not be described here. The difference is that the types of bulbs used are different.
  • the heat generated by the operation of the LED chip 4 is sufficiently diffused by the large area of the heat dissipation bracket 300, and is sufficiently in contact with the heat-conducting gas 12, and then the large surface enlarged by the glass bulb 1 is sufficiently emitted to realize rapid and effective integrated heat dissipation.
  • a ninth embodiment of an integrated heat dissipating LED lamp disclosed in the present invention is a bulb lamp, which also includes a glass bulb 1, a lamp cap 2, a driving circuit 3, an LED light source panel 400, and a glass stem 6.
  • the relationship between the components of the ninth embodiment is the same as that of the first embodiment, and will not be described herein.
  • the difference between the embodiment 9 and the first embodiment is that the driving circuit 3 is mounted in the glass bulb 1, specifically, the element of the driving circuit 3 is directly welded to the inner side of the heat dissipation bracket 300.
  • the heat generated by the operation of the LED chip 4 and the driving circuit 3 is sufficiently diffused by the large area of the heat dissipating bracket 300, and is in full contact with the heat-conducting gas 12, and then the large surface enlarged by the glass bulb 1 is fully emitted, thereby achieving rapid and effective operation.
  • This embodiment 9 allows the glass bulb 1 to extend as far as possible to the base 2, increasing the light transmission area, and the illumination effect is better.

Abstract

一种LED灯的金属散热支架（100）及LED光源板（200）和集成散热式LED灯，金属散热支架（100）具有纵向延伸的至少两个平行散热带（110），两个平行散热带（110，110）之间具有横向连接段（120），相邻两个横向连接段（120，120）和两个平行散热带（110，110）围成镂空框（130），镂空框（130）中具有导电片（140），导电片（140）与镂空框（130）边缘的平行散热带（110）通过工艺连接边（150）连接，且导电片（140）与镂空框边缘存有间隙（160，170）。LED光源板（200）应用散热支架（100）。集成散热式LED灯包括玻璃泡壳（1）、灯头（2）、驱动电路（3）和LED光源板（200）。LED灯集金属散热支架热传导、导热气体导热和玻璃泡壳散热于一体，实现快速、有效地集成散热。特别适用于制成大功率LED灯泡，灯泡类型不限，如球泡灯、汞灯、蜡烛灯、筒灯、BR灯、MR灯等等。

Description

一种LED灯的金属散热支架及LED光源板和集成散热式LED灯 技术领域
本发明属于LED节能灯的技术领域，特别与LED灯的金属散热支架结构有关，还与应用此散热支架的LED光源板和集成散热式LED灯结构有关。
技术背景
现有技术中，有一种LED灯泡，包含：透光泡壳、LED发光源、芯柱、驱动电路和灯头。透光泡壳与芯柱密封构成真空的泡壳体，泡壳体内充有低粘度高导热率气体（例如氦、氢或氦氢混合气）。LED发光源由高导热率透明管和LED芯片组成，高导热率透明管用透明胶固定插装在芯柱外表面上，LED芯片被直接用固晶胶固定在高导热率透明管外表面的平面部分上，然后与驱动电路和灯头电连接，再覆盖上一层荧光层。
此LED灯泡因为高导热率透明管具有较大的与低粘度高导热率气体接触的接触面，降低了LED芯片与低粘度高导热率气体之间的热阻，所以通电发光时，LED芯片产生的热量经较大面积的高导热率透明管、低粘度高导热率气体和透光泡壳散热，散热效果有所提高。
仔细分析不难发现，高导热率透明管的作用是起到安装支架和散热，一方面供LED芯片安装，另一方面使LED芯片工作的热量可以得到及时传导。但是，此LED灯泡还存在以下缺点：
一、高导热率透明管是由高导热率透明陶瓷、玻璃或塑料制成，鉴于透明陶瓷、玻璃或塑料的导热性能远不及金属，使得LED灯泡的散热效果仍有待于提高；
二、高导热率透明管仅具有上下开口，只能增大散热面积，不能在管内形成热对流，散热效果不尽理想；
三、高导热率透明管一经成型，形状即为固定，使得LED发光源的大小无法根据LED灯泡的功率改变而随意变化，加工制造成本高。
发明内容
本发明的目的在于提供一种LED灯的金属散热支架，以大幅提高散热效率。
本发明的目的在于还提供一种LED光源板及集成散热式LED灯,以大幅提高散热效率。
为了达成上述目的，本发明的技术方案是：
一种LED灯的金属散热支架，具有纵向延伸的至少两个平行散热带，两个平行散热带之间具有横向连接段，相邻两个横向连接段和两个平行散热带围成镂空框，镂空框中具有导电片，导电片与镂空框边缘的平行散热带通过工艺连接边连接，且导电片与镂空框边缘存有间隙。
所述散热支架具有2N个平行散热带，当N≥2时，所有平行散热带分为N组，相邻两组的两个平行散热带之间留有间隙并通过点连接。
所述平行散热带上还形成易于折弯的缺口。
对应的一种LED光源板，由LED芯片和上述散热支架组成，在上述散热支架的横向连接段两端和相邻两个导电片的端部设置绝缘框架（注塑塑料框架），LED芯片放在横向连接段上并固定在绝缘框架中，LED芯片还通过导线与相邻两个镂空框中的两个导电片电连接，所有LED芯片相互串联，LED芯片上涂布发光粉层。
所述散热支架通过折弯呈平板状、平板环状、U型、多边形、多边形筒状或螺旋型等等。
另一种LED灯的金属散热支架，包括导热部分和导电部分；导热部分由纵横交错的经板和纬板组成，相邻的经板和纬板围成正镂空框；导电部分由上下两个横板和导电片组成，上下两个横板分别位于导热部分的上方和下方，且上下两个横板与导热部分存有间隙，上下两个横板和相邻的经板、纬板围成侧镂空框，导电片位于正镂空框和侧镂空框中，导电片与正镂空框和侧镂空框边缘的纬板通过工艺连接边连接，位于侧镂空框的导电片还与相邻的横板连接，导电片与正镂空框和侧镂空框的边缘也存有间隙。
所述纬板上形成纵向剖槽。
所述上下两个横板对应纵向剖槽还形成缺口。
对应的另一种LED光源板，由LED芯片和上述散热支架组成，在上述散热支架的经板和相邻两个导电片的端部设置绝缘框架（注塑塑料框架），LED芯片放在经板上并固定在绝缘框架中，LED芯片还通过导线与相邻两个导电片电连接，LED芯片上涂布发光粉层。
所述散热支架通过折弯呈平板状、平板环状或多边形筒状等等。
上述两种LED光源板应用于集成散热式LED灯中，该集成散热式LED灯包括玻璃泡壳、灯头、驱动电路和上述LED光源板，驱动电路安装在灯头或玻璃泡壳中；玻璃泡壳罩设在灯头上，玻璃泡壳内设有竖立的玻璃芯柱，玻璃泡壳和玻璃芯柱在底部密封构成封闭腔，封闭腔内充满导热气体（如氦气、氢气或氦氢混合气等）；上述LED光源板固定在玻璃芯柱上，LED光源板上的LED芯片与驱动电路和灯头电连接。
所述玻璃芯柱的上端和下端安装上支架和下支架，上述LED光源板的两端安装在上支架和下支架上，上述LED光源板通过折弯呈竖直状围绕玻璃芯柱或呈螺旋状环绕玻璃芯柱而形成光柱。
所述玻璃芯柱上还固定套置蜂窝状金属散热器，蜂窝状金属散热器的筒壁内形成蜂窝结构，蜂窝状金属散热器的筒壁上还开设散热孔，上述LED光源板通过折弯呈竖直状围绕或螺旋状环绕固定在蜂窝状金属散热器的筒壁上形成光柱。
所述玻璃芯柱上还固定套置蜂窝状金属散热器，蜂窝状金属散热器的筒壁内形成蜂窝结构，蜂窝状金属散热器的筒壁上还开设散热孔，上述LED光源板直接固定在蜂窝状金属散热器的顶端，或者上述LED光源板固定在铝板上而铝板固定在蜂窝状金属散热器的顶端。
所述蜂窝结构是，蜂窝状金属散热器的筒壁内侧向玻璃芯柱延伸形成径向片，径向片上还沿圆周形成弧片。
所述玻璃芯柱上还固定套置泡沫金属，上述LED光源板通过折弯呈竖直状围绕或螺旋状环绕固定在泡沫金属上形成光柱。
所述玻璃芯柱上还固定套置泡沫金属，上述LED光源板直接固定在泡沫金属的顶端，或者上述LED光源板固定在铝板上而铝板固定在泡沫金属的顶端。
所述LED光源板的下方、LED光源板和蜂窝状金属散热器的下方或者LED光源板和泡沫金属的下方，还安装风扇。
所述驱动电路安装在玻璃泡壳中，且驱动电路的元气件直接焊接在LED光源板的散热支架上。
采用上述方案后，本发明与现有技术相比，具有以下优点：
一、由金属散热支架（如铜）代替高导热率透明管，利用金属的高导热性能，使得LED灯泡的散热效果得以大幅提高；
二、现有LED芯片的基座仅仅起到支撑安装作用，所以现有的LED芯片除了金属基座外还需要专门增加热沉供LED芯片工作热量导出，而基座在封装后只留有极少部分于成型的LED光源粒中，极大部分的基座在封装后会被作为废料丢弃，造成现有LED芯片封装的成本高，用量大，浪费严重；与现有的LED芯片封装结构相比，本发明的金属散热支架既提供支架方便LED芯片的封装，又提供散热带方便LED芯片工作热量导出，所以本发明原料得到充分利用，省去了现有技术的热沉，散热效果却大大提高；
三、金属散热支架或进一步配合蜂窝状金属散热器、泡沫金属和风扇等等，不仅能增大散热面积，还能在内部形成热对流，散热效果更好；
四、金属散热支架可根据LED灯泡的功率设计要求折弯呈大小不同形态，用于安装不同个数的LED芯片，制成相应的LED发光源，加工制造方便，成本低。
本发明的关键是集金属散热支架热传导、导热气体导热和玻璃泡壳散热于一体，将LED芯片工作的热量经金属散热支架充分扩散，与导热气体充分接触，再由玻璃泡壳充分散发出去，实现快速、有效地集成散热。本发明特别适用于制成大功率LED灯泡，灯泡类型不限，如球泡灯、汞灯、蜡烛灯、筒灯、射灯、BR灯、MR灯等等。
以下结合附图及实施例对本发明做进一步详细描述。
附图说明
图1是本发明金属散热支架（一）的结构示意图；
图1A是图1的局部放大图；
图2是本发明金属散热支架（一）注塑塑框架的结构示意图；
图2B是图2的局部放大图；
图3是本发明LED光源板（一）的结构示意图；
图3C是图3的局部放大图；
图3-1是本发明LED光源板（一）的整块结构示意图；
图3-2是本发明LED光源板（一）的单条结构示意图；
图4是本发明LED光源板（一）的平板环状结构示意图；
图4-1是本发明LED光源板（一）的平板环状结构使用示意图；
图5是本发明LED光源板（一）的多边形结构示意图；
图6是本发明LED光源板（一）的U型结构示意图；
图7是本发明LED光源板（一）的U型结构组合示意图；
图8是本发明LED光源板（一）的螺旋型结构示意图；
图9是本发明LED光源板（一）的多边形筒状结构示意图；
图10是本发明集成散热式LED灯（一）实施例一（球泡灯）的整体剖示图；
图11是图10的内部结构示意图；
图12是图10的内部结构俯视图；
图13是本发明集成散热式LED灯（一）实施例二（球泡灯）的整体剖示图；
图14是图13的内部结构示意图；
图15是图13的内部结构俯视图；
图16是本发明集成散热式LED灯（一）实施例三（汞灯）的整体剖示图；
图17是图16的内部结构示意图；
图18是图16的内部结构立体分解图；
图19是泡沫金属的结构示意图；
图20是本发明集成散热式LED灯（一）实施例四（蜡烛灯）的整体剖示图；
图21是本发明集成散热式LED灯（一）实施例五（PAR灯）的整体剖示图；
图22是图21的内部结构立体分解图；
图23是本发明集成散热式LED灯（一）实施例六（BR灯）的整体剖示图；
图24是本发明集成散热式LED灯（一）实施例七（MR灯）的整体剖示图；
图25是图24的内部结构立体分解图；
图26是本发明集成散热式LED灯（一）实施例八（可插式T8灯管）的整体剖示图；
图27是图26的内部结构示意图；
图28是本发明集成散热式LED灯（一）实施例九（螺口式T8灯管）的整体剖示图；
图29是本发明集成散热式LED灯（一）实施例十（球泡灯）的整体剖示图。
图30是本发明金属散热支架（二）的结构示意图；
图30A是图30的局部放大图；
图31是本发明金属散热支架（二）注塑塑框架的结构示意图；
图31B是图31的局部放大图；
图32是本发明金属散热支架（二）注塑塑框架后切除工艺连接边的结构示意图；
图32C是图32的局部放大图；
图33是本发明金属散热支架（二）固晶的结构示意图；
图33D是图33的局部放大图；
图34是本发明金属散热支架（二）绑定金线的结构示意图；
图34E是图34的局部放大图；
图35是本发明金属散热支架（二）点荧光粉的结构示意图；
图35F是图35的局部放大图；
图36是本发明金属散热支架（二）剪裁的结构示意图；
图36G是图36的局部放大图；
图37是本发明LED光源板（二）的正方平板型结构示意图；
图37-1是本发明LED光源板（二）的正方平板型结构使用示意图；
图38是本发明LED光源板（二）的平板环状结构示意图；
图39是本发明LED光源板（二）的多边形筒状结构示意图；
图40是本发明LED光源板（二）的多边形筒状对接结构示意图；
图41是本发明LED光源板（二）的多边形筒状结构使用示意图；
图42是本发明集成散热式LED灯（二）实施例一（球泡灯）的整体剖示图；
图43是图42的内部结构示意图；
图44是图42的内部结构俯视图；
图45是本发明集成散热式LED灯（二）实施例二（球泡灯）的整体剖示图；
图46是图45的内部结构示意图；
图47是本发明集成散热式LED灯（二）实施例三（汞灯）的整体剖示图；
图48是图47的内部结构立体分解示意图；
图49是本发明集成散热式LED灯（二）实施例四（PAR灯）的整体剖示图；
图50是图49的内部结构立体分解图；
图51是本发明集成散热式LED灯（二）实施例五（BR灯）的整体剖示图；
图52是本发明集成散热式LED灯（二）实施例六（MR灯）的整体剖示图；
图53是本发明集成散热式LED灯（二）实施例七（可插式T8灯管）的整体剖示图；
图54是图53的内部结构示意图；
图55是本发明集成散热式LED灯（二）实施例八（螺口式T8灯管）的整体剖示图；
图56是本发明集成散热式LED灯（二）实施例九（球泡灯）的整体剖示图。
标号说明
玻璃泡壳1，封闭腔11，导热气体12，灯头2，驱动电路3，LED芯片4，铝板5，玻璃芯柱6，上支架61，下支架62，蜂窝状金属散热器7，径向片71，弧片72，散热孔73，风扇8，泡沫金属9；
散热支架100，平行散热带110，横向连接段120，镂空框130，导电片140，工艺连接边150，间隙160，间隙170，点180，缺口190；
LED光源板200，绝缘框架210；
散热支架300，导热部分310，经板311，纬板312，正镂空框313，纵向剖槽314，导电部分320，横板321、322，导电片323，侧镂空框324，工艺连接边325，间隙326，间隙327，缺口328，绝缘框架330；
LED光源板400，金线410，荧光粉420。
具体实施方式
图1至图29是本发明第一种LED灯的金属散热支架结构，以及其应用的LED光源板和集成散热式LED灯。
如图1和图1A所示，本发明揭示的第一种LED灯的金属散热支架100，是通过冲压成型，具有纵向延伸的至少两个平行散热带110，两个平行散热带110之间具有若干个横向连接段120，相邻两个横向连接段120和两个平行散热带110围成镂空框130，镂空框130中具有导电片140，导电片140与镂空框130边缘的平行散热带110通过工艺连接边150连接，且导电片150与镂空框130的边缘存有间隙160，工艺连接边150在LED芯片4封装后将被冲压去除，使平行散热带110不与导电片140导通。
图1中所示散热支架100具有12个平行散热带110（即2N=12，N=6），使所有平行散热带110分为6组，相邻两组的两个平行散热带110之间留有间隙170并通过点180连接，此结构便于将整块的散热支架100拆解成需要的大小，比如图3-2所示只有一组平行散热带110的单排结构，当然，间隙170和点180也便于将整块的散热支架100折弯成需要的形态。本发明进一步在平行散热带110上还形成易于折弯的缺口190。
再如图3和图3C所示，本发明揭示的第一种LED光源板200，由LED芯片4和图1所示散热支架100组成。配合图2和图2B所示先在上述散热支架100的横向连接段120两端和相邻两个导电片140的端部设置绝缘框架210（可以是注塑加工成型的塑料框架，或者采用其它绝缘材料制成绝缘框架210），再冲压切除散热支架100的工艺连接边150（图3C中用虚线示出表示冲压切除），使导电片140与平行散热带110和横向连接段120都断开，然后将LED芯片4放在横向连接段120上并固定在绝缘框架210中，LED芯片4还通过导线与相邻两个镂空框130中的两个导电片140电连接，整个LED光源板200的所有LED芯片4相互串联，LED芯片4上再涂布发光粉层，即制成图3-1所示的整块LED光源板200。
这样，导电片140相当于现有LED光源粒的基座，平行散热带110和横向连接段120可以代替现有LED光源粒的热沉实现LED芯片4的导热散热。本发明充分利用传统会废弃的边角料（平行散热带110和横向连接段120），使原料得到充分利用，散热效果却大大提高。而且，本发明藉由金属散热支架100的特点，LED光源板200可以呈平板状（图3），或者通过折弯呈平板环状（图4）、U型（图6和图7）、多边形（图5）、多边形筒状（图9）或螺旋型（图8）等等。
如图10至图12所示，本发明揭示的第一种集成散热式LED灯的实施例一是球泡灯，包括玻璃泡壳1、灯头2、驱动电路3和LED光源板200（LED芯片4和散热支架100组成）。驱动电路3安装在灯头2。玻璃泡壳1罩设在灯头2上，玻璃泡壳1内设有竖立的玻璃芯柱6，玻璃泡壳1和玻璃芯柱6在底部密封构成封闭腔11，封闭腔11内充满导热气体12。玻璃芯柱6的上端和下端安装上支架61和下支架62。LED光源板200固定在玻璃芯柱6上，具体地说，LED光源板200的两端竖立安装在上支架61和下支架62上，LED光源板200上的串联LED芯片4与驱动电路3和灯头2电连接，LED光源板200通过折弯呈螺旋状环绕玻璃芯柱6形成光柱。LED芯片4工作时产生的热量，经散热支架100的大面积充分扩散，与导热气体12充分接触，再由玻璃泡壳1的大表面充分散发出去，实现快速、有效地集成散热。
如图13至图15所示，本发明揭示的第一种集成散热式LED灯的实施例二是球泡灯，也包括玻璃泡壳1、灯头2、驱动电路3和LED光源板200（LED芯片4和散热支架100组成）。驱动电路3安装在灯头2。玻璃泡壳1罩设在灯头2上，玻璃泡壳1内设有竖立的玻璃芯柱6，玻璃泡壳1和玻璃芯柱6在底部密封构成封闭腔11，封闭腔11内充满导热气体12。玻璃芯柱6的上端和下端安装上支架61和下支架62。LED光源板200固定在玻璃芯柱6上，LED光源板200上的串联LED芯片4与驱动电路3和灯头2电连接。此实施例二与实施例一的区别是，玻璃芯柱6的上支架61和下支架62上还固定套置蜂窝状金属散热器7，蜂窝状金属散热器7的筒壁内形成蜂窝结构，蜂窝结构可以有很多具体形态，图中所示的蜂窝结构是，蜂窝状金属散热器7的筒壁内侧向玻璃芯柱6延伸形成径向片71，径向片71上还沿圆周形成弧片72，蜂窝状金属散热器7的筒壁上还开设散热孔73以便热对流，LED光源板200通过折弯呈螺旋状环绕固定在蜂窝状金属散热器7的筒壁上形成光柱。LED芯片4工作时产生的热量，经散热支架100和蜂窝状金属散热器7的大面积充分扩散，与导热气体12充分接触，再由玻璃泡壳1的大表面充分散发出去，实现快速、有效地集成散热。
如图16至图18所示，本发明揭示的第一种集成散热式LED灯的实施例三是汞灯（外形与实施例一和实施例二不同），也包括玻璃泡壳1、灯头2、驱动电路3、LED芯片4和LED光源板200（LED芯片4和散热支架100组成）。驱动电路3安装在灯头2。玻璃泡壳1罩设在灯头2上，玻璃泡壳1内设有竖立的玻璃芯柱6，玻璃泡壳1和玻璃芯柱6在底部密封构成封闭腔11，封闭腔11内充满导热气体12。玻璃芯柱6的上端和下端安装上支架61和下支架62。LED光源板200固定在玻璃芯柱6上，LED光源板200上的串联LED芯片4与驱动电路3和灯头2电连接。此实施例三与实施例一的区别（与实施例二一样）是，玻璃芯柱6的上支架61和下支架62上还固定套置蜂窝状金属散热器7，蜂窝状金属散热器7的筒壁内形成蜂窝结构，蜂窝结构可以有很多具体形态，图中所示的蜂窝结构是，蜂窝状金属散热器7的筒壁内侧向玻璃芯柱6延伸形成径向片71，径向片71上还沿圆周形成弧片72，蜂窝状金属散热器7的筒壁上还开设散热孔73以便热对流，LED光源板200通过折弯呈螺旋状环绕固定在蜂窝状金属散热器7的筒壁上形成光柱。另外，此实施例三还与实施例二不同的是，LED光源板200和蜂窝状金属散热器7的下方还安装风扇8。LED芯片4工作时产生的热量，经散热支架100和蜂窝状金属散热器7的大面积充分扩散，与导热气体12充分接触，并配合风扇8加大热对流，再由玻璃泡壳1的大表面充分散发出去，实现快速、有效地集成散热。
配合图19所示，本发明的上述蜂窝状金属散热器7也可由泡沫金属9代替，来提高散热效果，功效相同。
如图20所示，本发明揭示的第一种集成散热式LED灯的实施例四是蜡烛灯（外形与实施例一至三不同），也包括玻璃泡壳1、灯头2、驱动电路3和LED光源板200（LED芯片4和散热支架100组成）。驱动电路3安装在灯头2。玻璃泡壳1罩设在灯头2上，玻璃泡壳1内设有竖立的玻璃芯柱6，玻璃泡壳1和玻璃芯柱6在底部密封构成封闭腔11，封闭腔11内充满导热气体12。LED光源板200折弯呈图7所示U型组合再固定在玻璃芯柱6上形成光柱，LED光源板200上的串联LED芯片4与驱动电路3和灯头2电连接。LED芯片4工作时产生的热量，经散热支架100的大面积充分扩散，与导热气体12充分接触，再由玻璃泡壳1的大表面充分散发出去，实现快速、有效地集成散热。
如图21至图22所示，本发明揭示的第一种集成散热式LED灯的实施例五是PAR灯，如图23所示，本发明揭示的一种集成散热式LED灯的实施例六是BR灯，如图24至图25所示，本发明揭示的一种集成散热式LED灯的实施例七是MR灯。实施例五至实施例七也都包括玻璃泡壳1、灯头2、驱动电路3和LED光源板200（LED芯片4和散热支架100组成）。驱动电路3安装在灯头2。玻璃泡壳1罩设在灯头2上，玻璃泡壳1内设有竖立的玻璃芯柱6，玻璃泡壳1和玻璃芯柱6在底部密封构成封闭腔11，封闭腔11内充满导热气体12。LED光源板200固定在玻璃芯柱6上，具体地说，玻璃芯柱6上还固定套置蜂窝状金属散热器7，蜂窝状金属散热器7的筒壁内形成蜂窝结构，蜂窝结构可以有很多具体形态（如前所述），蜂窝状金属散热器7的筒壁上还开设散热孔73以便热对流，LED光源板200固定在铝板5上（见图4-1），而铝板5固定在蜂窝状金属散热器7的顶端，LED光源板200也可以直接固定在蜂窝状金属散热器7的顶端。LED光源板200上的串联LED芯片4与驱动电路3和灯头2电连接。LED芯片4工作时产生的热量，经散热支架100和蜂窝状金属散热器7的大面积充分扩散，与导热气体12充分接触，并配合风扇8加大热对流，再由玻璃泡壳1的大表面充分散发出去，实现快速、有效地集成散热。
如图26至图27所示，本发明揭示的第一种集成散热式LED灯的实施例八是可插式T8灯管，如图28所示，本发明揭示的一种集成散热式LED灯的实施例九是螺口式T8灯管，也都包括玻璃泡壳1、灯头2、驱动电路3、LED光源板200和玻璃芯柱6，此实施例八和实施例九的各构件之间的相互关系与实施例一相同，在此不做赘述，区别在于运用的灯泡类型不同。LED芯片4工作时产生的热量，经散热支架100的大面积充分扩散，与导热气体12充分接触，再由玻璃泡壳1扩大后的大表面充分散发出去，实现快速、有效地集成散热。
如图29所示，本发明揭示的第一种集成散热式LED灯的实施例十是球泡灯，也包括玻璃泡壳1、灯头2、驱动电路3、LED光源板200和玻璃芯柱6，此实施例十的各构件之间的相互关系与实施例一相同，在此不做赘述。此实施例十与实施例一的区别是，将驱动电路3安装在玻璃泡壳1中，具体是将驱动电路3的元气件直接焊接在散热支架100的内侧。LED芯片4和驱动电路3工作时产生的热量，经散热支架100的大面积充分扩散，与导热气体12充分接触，再由玻璃泡壳1扩大后的大表面充分散发出去，实现快速、有效地集成散热。此实施例十使得玻璃泡壳1可以尽可能向灯头2延伸，增大透光面积，照明效果更好。
图30至图57是本发明第二种LED灯的金属散热支架结构，以及其应用的LED光源板和集成散热式LED灯。
如图30和图30A所示，本发明揭示的第二种LED灯的改良金属散热支架300，是通过冲压成型，包括导热部分310和导电部分320。导热部分310由纵横交错的经板311和纬板312组成，相邻的经板311和纬板312围成正镂空框313。导电部分320由上下两个横板321、322和导电片323组成，上下两个横板321和322分别位于导热部分310的上方和下方，且上下两个横板321和322与导热部分310存有间隙326，上下两个横板321、322和相邻的经板311、纬板312围成侧镂空框324，导电片323位于正镂空框313和侧镂空框324中，导电片323与正镂空框313和侧镂空框324边缘的纬板312通过工艺连接边325连接，位于侧镂空框324的导电片323还与相邻的横板321和322连接，导电片323与正镂空框313和侧镂空框324的边缘也存有间隙327。工艺连接边325在LED芯片4封装后将被冲压去除，使导热部分310的经板311和纬板312不与导电部分320的上下两个横板321、322和导电片324导通。
为了方便截取和拼接，本发明进一步在纬板312上形成纵向剖槽314，在上下两个横板312和322上对应纵向剖槽314还形成缺口328，纬板312上的纵向剖槽314也有利于对流散热。
本发明的第二种LED灯的金属散热支架300应用于加工LED光源板400时，如图31和图31B所示，先在散热支架300的经板311和相邻两个导电片323的端部设置绝缘框架330（可以是注塑加工成型的塑料框架，或者采用其它绝缘材料制成绝缘框架330），再如图32和图32C所示，冲压切除散热支架300的工艺连接边325（图32C中用虚线示出表示冲压切除），使经板311和纬板312与上下两个横板321、322和导电片324都断开而不导通，然后如图33和图33D所示，将LED芯片4放在经板311上并固定在绝缘框架330中，再如图34和图34E所示，将LED芯片4通过导线（金线410）与相邻的两个导电片323电连接，如图35和图35F所示，在LED芯片4上再涂布发光粉层（荧光粉420）。如此制成本发明揭示的一种LED光源板400。
对于图35所示LED光源板400来说，上下两个横板321和322分别接电源正极和负极，整个LED光源板400中，每个纬板312的所有LED芯片4相互串联，而所有纬板312相互并联，即此LED光源板400为并联形式。
对于图36和图36G所示LED光源板400来说，是在图34所示的结构中，通过剪裁（图36G中用虚线示出表示冲压切除）及封装改变电极方向，使整个LED光源板400的所有LED芯片4呈相互串联，即此LED光源板400为串联形式。
这样，导电片323相当于现有LED光源粒的基座，导热部分310的经板311和纬板312可以代替现有LED光源粒的热沉实现LED芯片4的导热散热。本发明充分利用传统会废弃的边角料（经板311和纬板312），使原料得到充分利用，散热效果却大大提高。而且，本发明藉由金属散热支架300的特点，LED光源板400可以呈平板状（图37，图37-1是增加散热铝板5），或者通过拼接呈平板环状（图38），或者通过折弯呈多边形筒状（图39，图40是图39的多边形筒状对接，图41是图39的多边形筒状中增加蜂窝状金属散热器7）等等。
如图42至图44所示，本发明揭示的第二种集成散热式LED灯的实施例一是球泡灯，包括玻璃泡壳1、灯头2、驱动电路3和LED光源板400（LED芯片4和散热支架300组成）。驱动电路3安装在灯头2。玻璃泡壳1罩设在灯头2上，玻璃泡壳1内设有竖立的玻璃芯柱6，玻璃泡壳1和玻璃芯柱6在底部密封构成封闭腔11，封闭腔11内充满导热气体12。玻璃芯柱6的上端和下端安装上支架61和下支架62。LED光源板400固定在玻璃芯柱6上，具体地说，LED光源板400的两端竖立安装在上支架61和下支架62上，LED光源板400上的LED芯片4与驱动电路3和灯头2电连接，LED光源板400通过折弯呈竖直状围绕玻璃芯柱6形成光柱。LED芯片4工作时产生的热量，经散热支架300的大面积充分扩散，与导热气体12充分接触，再由玻璃泡壳1的大表面充分散发出去，实现快速、有效地集成散热。
如图45至图46所示，本发明揭示的第二种集成散热式LED灯的实施例二是球泡灯，也包括玻璃泡壳1、灯头2、驱动电路3和LED光源板400（LED芯片4和散热支架300组成）。驱动电路3安装在灯头2。玻璃泡壳1罩设在灯头2上，玻璃泡壳1内设有竖立的玻璃芯柱6，玻璃泡壳1和玻璃芯柱6在底部密封构成封闭腔11，封闭腔11内充满导热气体12。玻璃芯柱6的上端和下端安装上支架61和下支架62。LED光源板400固定在玻璃芯柱6上，LED光源板400上的LED芯片4与驱动电路3和灯头2电连接。此实施例二与实施例一的区别是，玻璃芯柱6的上支架61和下支架62上还固定套置蜂窝状金属散热器7，蜂窝状金属散热器7的筒壁内形成蜂窝结构，蜂窝结构可以有很多具体形态，图中所示的蜂窝结构是，蜂窝状金属散热器7的筒壁内侧向玻璃芯柱6延伸形成径向片71，径向片71上还沿圆周形成弧片72，蜂窝状金属散热器7的筒壁上还开设散热孔73以便热对流，LED光源板400通过折弯呈竖直状围绕固定在蜂窝状金属散热器7的筒壁上形成光柱。LED芯片4工作时产生的热量，经散热支架300和蜂窝状金属散热器7的大面积充分扩散，与导热气体12充分接触，再由玻璃泡壳1的大表面充分散发出去，实现快速、有效地集成散热。
如图47至图48所示，本发明揭示的第二种集成散热式LED灯的实施例三是汞灯（外形与实施例一和实施例二不同），也包括玻璃泡壳1、灯头2、驱动电路3、LED芯片4和LED光源板400（LED芯片4和散热支架300组成）。驱动电路3安装在灯头2。玻璃泡壳1罩设在灯头2上，玻璃泡壳1内设有竖立的玻璃芯柱6，玻璃泡壳1和玻璃芯柱6在底部密封构成封闭腔11，封闭腔11内充满导热气体12。玻璃芯柱6的上端和下端安装上支架61和下支架62。LED光源板400固定在玻璃芯柱6上，LED光源板400上的LED芯片4与驱动电路3和灯头2电连接。此实施例三与实施例一的区别（与实施例二一样）是，玻璃芯柱6的上支架61和下支架62上还固定套置蜂窝状金属散热器7，蜂窝状金属散热器7的筒壁内形成蜂窝结构，蜂窝结构可以有很多具体形态，图中所示的蜂窝结构是，蜂窝状金属散热器7的筒壁内侧向玻璃芯柱6延伸形成径向片71，径向片71上还沿圆周形成弧片72，蜂窝状金属散热器7的筒壁上还开设散热孔73以便热对流，LED光源板400通过折弯呈竖直状围绕固定在蜂窝状金属散热器7的筒壁上形成光柱。另外，此实施例三还与实施例二不同的是，LED光源板400和蜂窝状金属散热器7的下方还安装风扇8。LED芯片4工作时产生的热量，经散热支架300和蜂窝状金属散热器7的大面积充分扩散，与导热气体12充分接触，并配合风扇8加大热对流，再由玻璃泡壳1的大表面充分散发出去，实现快速、有效地集成散热。
本发明的上述蜂窝状金属散热器7也可由图19所示的泡沫金属9代替，来提高散热效果，功效相同。
如图49至图50所示，本发明揭示的一种集成散热式LED灯的实施例四是PAR灯，如图51所示，本发明揭示的一种集成散热式LED灯的实施例五是BR灯，如图52所示，本发明揭示的一种集成散热式LED灯的实施例六是MR灯。实施例四至实施例六也都包括玻璃泡壳1、灯头2、驱动电路3和LED光源板400（LED芯片4和散热支架300组成）。驱动电路3安装在灯头2。玻璃泡壳1罩设在灯头2上，玻璃泡壳1内设有竖立的玻璃芯柱6，玻璃泡壳1和玻璃芯柱6在底部密封构成封闭腔11，封闭腔11内充满导热气体12。LED光源板400固定在玻璃芯柱6上，具体地说，玻璃芯柱6上还固定套置蜂窝状金属散热器7，蜂窝状金属散热器7的筒壁内形成蜂窝结构，蜂窝结构可以有很多具体形态（如前所述），蜂窝状金属散热器7的筒壁上还开设散热孔73以便热对流，LED光源板400固定在铝板5上（见图37-1），而铝板5固定在蜂窝状金属散热器7的顶端，LED光源板400也可以直接固定在蜂窝状金属散热器7的顶端。LED光源板400上的LED芯片4与驱动电路3和灯头2电连接。LED芯片4工作时产生的热量，经散热支架300和蜂窝状金属散热器7的大面积充分扩散，与导热气体12充分接触，再由玻璃泡壳1的大表面充分散发出去，实现快速、有效地集成散热。
如图53至图54所示，本发明揭示的一种集成散热式LED灯的实施例七是可插式T8灯管，如图55所示，本发明揭示的一种集成散热式LED灯的实施例八是螺口式T8灯管，也都包括玻璃泡壳1、灯头2、驱动电路3、LED光源板400和玻璃芯柱6，此实施例七和实施例八的各构件之间的相互关系与实施例一相同，在此不做赘述，区别在于运用的灯泡类型不同。LED芯片4工作时产生的热量，经散热支架300的大面积充分扩散，与导热气体12充分接触，再由玻璃泡壳1扩大后的大表面充分散发出去，实现快速、有效地集成散热。
如图56所示，本发明揭示的一种集成散热式LED灯的实施例九是球泡灯，也包括玻璃泡壳1、灯头2、驱动电路3、LED光源板400和玻璃芯柱6，此实施例九的各构件之间的相互关系与实施例一相同，在此不做赘述。此实施例九与实施例一的区别是，将驱动电路3安装在玻璃泡壳1中，具体是将驱动电路3的元气件直接焊接在散热支架300的内侧。LED芯片4和驱动电路3工作时产生的热量，经散热支架300的大面积充分扩散，与导热气体12充分接触，再由玻璃泡壳1扩大后的大表面充分散发出去，实现快速、有效地集成散热。此实施例九使得玻璃泡壳1可以尽可能向灯头2延伸，增大透光面积，照明效果更好。
上述实施例和图式并非限定本发明的产品形态和式样，任何所属技术领域的普通技术人员对其所做的适当变化或修饰，皆应视为不脱离本发明的专利范畴。

Claims (19)

1、一种LED灯的金属散热支架，其特征在于：具有纵向延伸的至少两个平行散热带，两个平行散热带之间具有横向连接段，相邻两个横向连接段和两个平行散热带围成镂空框，镂空框中具有导电片，导电片与镂空框边缘的平行散热带通过工艺连接边连接，且导电片与镂空框边缘存有间隙。
2、如权利要求1所述的一种LED灯的金属散热支架，其特征在于：所述散热支架具有2N个平行散热带，当N≥2时，所有平行散热带分为N组，相邻两组的两个平行散热带之间留有间隙并通过点连接。
3、如权利要求1或2所述的一种LED灯的金属散热支架，其特征在于：所述平行散热带上还形成易于折弯的缺口。
4、一种LED光源板，其特征在于：由LED芯片和如权利要求1所述的散热支架组成，在上述散热支架的横向连接段两端和相邻两个导电片的端部设置绝缘框架，LED芯片放在横向连接段上并固定在绝缘框架中，LED芯片还通过导线与相邻两个镂空框中的两个导电片电连接，所有LED芯片相互串联，LED芯片上涂布发光粉层。
5、如权利要求4所述的一种LED光源板，其特征在于：所述散热支架通过折弯呈平板状、平板环状、U型、多边形、多边形筒状或螺旋型。
6、一种LED灯的金属散热支架，其特征在于：包括导热部分和导电部分；导热部分由纵横交错的经板和纬板组成，相邻的经板和纬板围成正镂空框；导电部分由上下两个横板和导电片组成，上下两个横板分别位于导热部分的上方和下方，且上下两个横板与导热部分存有间隙，上下两个横板和相邻的经板、纬板围成侧镂空框，导电片位于正镂空框和侧镂空框中，导电片与正镂空框和侧镂空框边缘的纬板通过工艺连接边连接，位于侧镂空框的导电片还与相邻的横板连接，导电片与正镂空框和侧镂空框的边缘也存有间隙。
7、如权利要求6所述的一种LED灯的改良金属散热支架，其特征在于：所述纬板上形成纵向剖槽。
8、如权利要求6所述的一种LED灯的改良金属散热支架，其特征在于：所述上下两个横板对应纵向剖槽还形成缺口。
9、一种LED光源板，其特征在于：由LED芯片和如权利要求6所述的散热支架组成，在上述散热支架的经板和相邻两个导电片的端部设置绝缘框架，LED芯片放在经板上并固定在绝缘框架中，LED芯片还通过导线与相邻两个导电片电连接，LED芯片上涂布发光粉层。
10、如权利要求9所述的一种LED光源板，其特征在于：所述散热支架通过折弯呈平板状、平板环状或多边形筒状。
11、一种集成散热式LED灯，其特征在于：包括玻璃泡壳、灯头、驱动电路和如权利要求4或9所述的LED光源板，驱动电路安装在灯头或玻璃泡壳中；玻璃泡壳罩设在灯头上，玻璃泡壳内设有竖立的玻璃芯柱，玻璃泡壳和玻璃芯柱在底部密封构成封闭腔，封闭腔内充满导热气体；上述LED光源板固定在玻璃芯柱上，LED光源板上的LED芯片与驱动电路和灯头电连接。
12、如权利要求11所述的一种集成散热式LED灯，其特征在于：所述LED光源板的下方还安装风扇。
13、如权利要求11所述的一种集成散热式LED灯，其特征在于：所述玻璃芯柱的上端和下端安装上支架和下支架，上述LED光源板的两端安装在上支架和下支架上，上述LED光源板通过折弯呈竖直状围绕玻璃芯柱或呈螺旋状环绕玻璃芯柱而形成光柱。
14、如权利要求11所述的一种集成散热式LED灯，其特征在于：所述玻璃芯柱上还固定套置蜂窝状金属散热器，蜂窝状金属散热器的筒壁内形成蜂窝结构，蜂窝状金属散热器的筒壁上还开设散热孔，上述LED光源板通过折弯呈竖直状围绕或螺旋状环绕固定在蜂窝状金属散热器的筒壁上形成光柱，或者上述LED光源板直接固定在蜂窝状金属散热器的顶端，或者上述LED光源板固定在铝板上而铝板固定在蜂窝状金属散热器的顶端。
15、如权利要求14所述的一种集成散热式LED灯，其特征在于：所述LED光源板和蜂窝状金属散热器的下方还安装风扇。
16、如权利要求11所述的一种集成散热式LED灯，其特征在于：所述蜂窝结构是，蜂窝状金属散热器的筒壁内侧向玻璃芯柱延伸形成径向片，径向片上还沿圆周形成弧片。
17、如权利要求11所述的一种集成散热式LED灯，其特征在于：所述玻璃芯柱上还固定套置泡沫金属，上述LED光源板通过折弯呈竖直状围绕或螺旋状环绕固定在泡沫金属上形成光柱，或者上述LED光源板直接固定在泡沫金属的顶端，或者上述LED光源板固定在铝板上而铝板固定在泡沫金属的顶端。
18、如权利要求17所述的一种集成散热式LED灯，其特征在于：所述LED光源板和泡沫金属的下方还安装风扇。
19、如权利要求11所述的一种集成散热式LED灯，其特征在于：所述驱动电路安装在玻璃泡壳中，且驱动电路的元气件直接焊接在LED光源板的散热支架上。
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