WO2015141424A1 - Dispositif d'interconnexion optique - Google Patents

Dispositif d'interconnexion optique Download PDF

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Publication number
WO2015141424A1
WO2015141424A1 PCT/JP2015/055525 JP2015055525W WO2015141424A1 WO 2015141424 A1 WO2015141424 A1 WO 2015141424A1 JP 2015055525 W JP2015055525 W JP 2015055525W WO 2015141424 A1 WO2015141424 A1 WO 2015141424A1
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Prior art keywords
substrate
light
light emitting
light receiving
receiving element
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PCT/JP2015/055525
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English (en)
Japanese (ja)
Inventor
吉司 小川
孝裕 金子
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株式会社ブイ・テクノロジー
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Publication of WO2015141424A1 publication Critical patent/WO2015141424A1/fr

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/12—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof structurally associated with, e.g. formed in or on a common substrate with, one or more electric light sources, e.g. electroluminescent light sources, and electrically or optically coupled thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16135—Disposition the bump connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/16145—Disposition the bump connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being stacked
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73257—Bump and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
    • H01L25/167—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits comprising optoelectronic devices, e.g. LED, photodiodes

Definitions

  • the present invention relates to an optical interconnection device capable of realizing optical interconnection between substrates.
  • Optical interconnection between substrates such as between chips or boards is realized by optical transmission using the space between stacked substrates.
  • an apparatus for realizing such an optical interconnection is provided with a light-emitting element that transmits an optical signal to another substrate and a light-receiving element that receives an optical signal from the other substrate.
  • a plurality of such substrates are stacked, and light receiving elements on other substrates are arranged so as to face the light emitting elements provided on one substrate to perform spatial transmission of optical signals (for example, the following patents) Reference 1).
  • two substrates that transmit and receive optical signals need to arrange a light receiving element of another substrate on a light emitting element of one substrate.
  • the arrangement pattern of the light emitting element and the light receiving element in FIG. 1 has individual patterns, and it is necessary to combine a plurality of types of substrates in order to transmit and receive optical signals between the stacked substrates. For this reason, it is necessary to individually design the pattern of the light emitting elements and the light receiving elements on each substrate.
  • the present invention is an example of a problem to deal with such a problem. That is, it is possible to easily perform alignment between substrates that transmit and receive optical signals without cost and time for forming individual substrates, and to realize optical interconnection between substrates. Is the purpose.
  • an optical interconnection device has the following configuration among several inventions described in the specification.
  • An optical interconnection device that arranges and arranges a plurality of substrates to transmit and receive optical signals between the substrates, and the plurality of substrates have the same arrangement pattern of light emitting elements and light receiving elements on each substrate.
  • the direction of the arrangement pattern of one substrate is rotated by a set angle with respect to the direction of the arrangement pattern of the other substrate, and on the optical axis of the light emitting element provided on one substrate
  • An optical interconnection device in which a light receiving element of another substrate is arranged.
  • (A) is an example in which the planar shape of the substrate is rectangular (square), (b) is an example in which the planar shape of the substrate is rectangular (rectangular), and (c) is a light emitting element or a light receiving device of a certain form. This is an example in which a light emitting element or a light receiving element of another form is formed in the element region. It is explanatory drawing which showed the example of the mounting structure of the board
  • (A) is a mounting example of a single unit, and (b) is a mounting example in a state of being stacked in multiple stages. It is explanatory drawing which showed the electric power feeding structure in the optical interconnection apparatus which concerns on embodiment of this invention.
  • (A) shows a structure using through holes
  • (b) shows a structure in which wires are individually connected. It is explanatory drawing which showed the specific example of the light emitting element or light receiving element in the optical interconnection apparatus which concerns on embodiment of this invention.
  • (A) shows the first light-emitting element A and the second light-receiving element C
  • (b) shows the first light-receiving element B and the second light-emitting element D.
  • It is explanatory drawing which showed the specific method of forming the light emitting element or light receiving element of the optical interconnection apparatus which concerns on embodiment of this invention.
  • (A) to (d) show the respective steps. It is explanatory drawing which showed the specific structural example of the optical interconnection apparatus which concerns on embodiment of this invention.
  • FIG. 1 shows a basic configuration of an optical interconnection apparatus according to an embodiment of the present invention.
  • the optical interconnection device 1 is a device for transmitting and receiving optical signals between the substrates 10 by stacking a plurality of substrates 10 (10a to 10d) such as chips and boards.
  • the arrangement patterns of the light emitting elements 11 and the light receiving elements 12 on the individual substrates 10 are common (for example, coincident).
  • the arrangement pattern referred to here indicates an aspect of a planar positional relationship between the light emitting element 11 and the light receiving element 12 arranged on one substrate 10.
  • the number of the light emitting elements 11 and the light receiving elements 12 may be singular or plural, it is assumed that the light emitting elements 11 and the light receiving elements 12 exist in pairs.
  • two substrates 10 (for example, the substrate 10a and the substrate 10b) that transmit and receive optical signals have a set angle ⁇ that is the direction Sa of the arrangement pattern of one substrate 10a with respect to the direction Sb of the arrangement pattern of the other substrate 10b.
  • the light receiving element 12 of another substrate 10b is arranged on the optical axis of the light emitting element 11 provided on one substrate 10a.
  • the plurality of substrates 10 a to 10 d are stacked so that one surface thereof is parallel to each other, and the above-described “rotation” is rotation around an axis perpendicular to one surface of the substrate 10.
  • optical signals are transmitted and received not only between the substrate 10a and the substrate 10b, but also between the substrate 10b and the substrate 10c, and between the substrate 10c and the substrate 10d, and the arrangement pattern direction Sb of the substrate 10b is the substrate 10c.
  • the “rotation” is a coaxial rotation around an axis perpendicular to one surface of each substrate 10.
  • a plurality can be formed.
  • the plurality of substrates 10 on which the light emitting element 11 and the light receiving element 12 are arranged can be formed at low cost and in a short time.
  • the positional relationship between the light emitting element 11 and the light receiving element 12 among the plurality of substrates 10 can be accurately matched, it is possible to realize optical interconnection between the substrates with reduced crosstalk.
  • the plurality of substrates 10 are arranged in a stacked manner, adjustment in one direction by rotating each substrate 10 by a set angle is sufficient, so that the adjustment work at the time of assembling the apparatus can be simplified.
  • each substrate 10 the arrangement pattern of the light emitting elements 11 and the light receiving elements 12 is such that the position of the light emitting elements 11 rotated by a set angle ⁇ with respect to one point Os on the substrate 10 is the position of the light receiving elements 12. It has become.
  • the planar shape of each substrate 10 may be any shape. When the planar shapes of the plurality of substrates 10 are the same and the planar shapes are invariable with respect to the rotation of the set angle ⁇ about the single point Os, each substrate 10 is supported by a frame having the same shape. Therefore, it becomes easy to support and align the substrate 10.
  • n is an integer of 3 or more
  • ⁇ is an integer of 3 or more
  • FIG. 2 shows a form example of the light emitting element and the light receiving element formed on the substrate 10.
  • the light emitting element 11 and the light receiving element 12 arranged on the substrate 10 can be in the following four forms.
  • the 1st light emitting element A is a form which radiate
  • the first light receiving element B is configured to receive light incident on the substrate 10 from the other surface side of the substrate 10 on one surface side of the substrate 10.
  • the second light emitting element D has a form in which light emitted from the one surface side of the substrate 10 into the substrate 10 is emitted into the space from the other surface side of the substrate 10.
  • the second light receiving element C is configured to receive light incident on the substrate 10 from the other surface side of the substrate 10 on one surface side of the substrate 10.
  • the light emitting element 11 includes a light emitting portion 11a and a light shielding portion 11b
  • the light receiving element 12 includes a light receiving portion 12a and a light shielding portion 12b.
  • the first light emitting element A includes a light emitting portion 11a on one surface side of the substrate 10 and a light shielding portion 11b on the back surface side of the light emitting portion 11a.
  • the first light receiving element B includes a light receiving portion 12 a on one surface side of the substrate 10 and a light shielding portion 12 b on the surface on the one surface side of the substrate 10.
  • the second light emitting element D includes a light emitting unit 11 a on one surface side of the substrate 10 and a light shielding unit 11 b on the surface of one surface side of the substrate 10.
  • the second light receiving element C includes a light receiving portion 12a on one side of the substrate 10 and a light blocking portion 12b on the back side of the light receiving portion 12a.
  • the first light emitting element A and the first light receiving element B are paired between two substrates that transmit and receive optical signals, and the second light emitting element D and The second light receiving element C is paired.
  • the process of arranging the light emitting element 11 and the light receiving element 12 with respect to the substrate 10 can be simplified. It becomes possible.
  • lenses (microlenses) 13 corresponding to the individual light emitting elements 11 and light receiving elements 12 can be provided on the other surface side of the substrate 10.
  • the substrate 10 needs to be light transmissive.
  • Such light emitting element 11 and light receiving element 12 can be formed by using infrared light as the light transmitted through the substrate 10 and using a semiconductor substrate (such as Si) that can transmit infrared light as the substrate 10.
  • FIG. 3 shows an arrangement pattern example of the light emitting elements 11 and the light receiving elements 12 formed on the substrate 10.
  • the four forms of the first light emitting element A, the first light receiving element B, the second light receiving element C, and the second light emitting element D described above are arranged on the substrate 10.
  • a position obtained by rotating the position of the first light emitting element A with respect to one point Os on the substrate 10 by a set angle ⁇ becomes the position of the first light receiving element B, and the position of the second light receiving element C is determined.
  • a position rotated by a set angle ⁇ with respect to one point Os on the substrate 10 is a position of the second light emitting element D.
  • two substrates 10 are stacked so that one point Os is coaxial, and the arrangement pattern direction S of one substrate 10 is the arrangement pattern direction S ′ of the other substrate 10. Is positioned so as to be rotated by a set angle ⁇ . Thereby, the position of the first light emitting element A on one substrate 10 and the position of the first light receiving element B on the other substrate 10 overlap in a plane, and the second light receiving element C and the second light emitting element D The positions are overlapped in a plane, so that an optical signal can be transmitted and received between the first light emitting element A and the first light receiving element B, and the second light receiving element C and the second light emitting element D Optical signals can be transmitted and received between the two.
  • the four types of light emitting elements 11 and light receiving elements 12 of the first light emitting element A, the first light receiving element B, the second light receiving element C, and the second light emitting element D are arranged on one substrate 10.
  • bidirectional transmission / reception of optical signals between the two substrates 10 becomes possible.
  • FIG. 4 shows another example of the arrangement pattern of the light emitting elements 11 and the light receiving elements 12 formed on the substrate 10.
  • the planar shape of the substrate 10 is a rectangle (square), and the first light emission is performed at a position that is equidistant from the point Os on the substrate 10 and at an angle of 90 °.
  • An element A, a first light receiving element B, a second light receiving element C, and a second light emitting element D are arranged.
  • two substrates 10 that transmit and receive optical signals are stacked so that one point Os overlaps, and the direction of the arrangement pattern of one substrate 10 is 90 ° with respect to the direction of the arrangement pattern of another substrate 10.
  • an optical signal can be transmitted and received between the first light-emitting element A on one substrate 10 and the first light-receiving element B on another substrate 10.
  • Optical signals can be transmitted and received between the second light receiving element C and the second light emitting element D on another substrate.
  • FIG. 1 shows an electrode structure that performs electrical connection between the substrates 10 when the plurality of substrates 10 are stacked.
  • power supply pads 14 a and 14 b are arranged on one surface side of the substrate 10
  • power supply bumps 15 a and 15 b are arranged on the other surface side of the substrate 10.
  • the power supply pads 14a on one substrate 10 and the power supply bumps 15a on the other substrate 10 are connected to each other.
  • the power supply pad 14b in the substrate 10 and the power supply bump 15b in the other substrate are connected, and the respective connections are connected to the + power supply and the ⁇ power supply.
  • the power supply pads 14a and 14b are connected to the light emitting element 11 and the light receiving element 12 installed on one surface side of the substrate 10 via a wiring pattern formed on one surface of the substrate 10, and the power supply bumps 15a and 14b are connected.
  • Reference numeral 15b is connected to the light emitting element 11 and the light receiving element 12 installed on one surface side of the substrate 10 via a wiring penetrating the substrate 10 such as a through hole.
  • the positional relationship between the (+) power supply pad 14a and the (+) power supply bump 15a is the same as the positional relationship between the first light emitting element A and the first light receiving element B, and the ( ⁇ ) power supply pad 14b. If the positional relationship between the (-) power supply bump 15b is the same as the positional relationship between the second light receiving element C and the second light emitting element D, the connection relationship is established (the + and-here may be reversed) ).
  • the planar shape of the substrate 10 is rectangular (rectangular), and the first light emission is performed at a position that is equidistant from the point Os on the substrate 10 and separated by an angle of 180 °.
  • a plurality of pairs of the element A and the first light receiving element B and a plurality of pairs of the second light receiving element C and the second light emitting element D are arranged. In one pair, the distance from one point Os to the light emitting element 11 is equal to the distance from one point Os to the light receiving element 12, but in a different pair, the distance from one point Os to the light emitting element 11 and the light receiving element 12 is set. Various settings can be made.
  • two substrates 10 that transmit and receive optical signals are stacked so that one point Os overlaps, and the direction of the arrangement pattern of one substrate 10 is 180 ° with respect to the direction of the arrangement pattern of the other substrate 10.
  • an optical signal can be transmitted and received between the first light-emitting element A on one substrate 10 and the first light-receiving element B on another substrate 10.
  • Optical signals can be transmitted / received between the second light receiving element C in FIG. 2 and the second light emitting element D in the other substrate 10.
  • the direction of the arrangement pattern of one substrate 10 is rotated by 90 ° with respect to the direction of the arrangement pattern of the other substrate 10.
  • an optical signal can be transmitted and received between the first light-emitting element A on one substrate 10 and the first light-receiving element B on the other substrate 10, and the second light-receiving element C on one substrate.
  • a second light emitting element D on another substrate can transmit and receive optical signals.
  • the first light receiving element B is arranged in the region of the first light emitting element A
  • the first light emitting element A is arranged in the region of the second light emitting element D
  • the second light receiving element C is arranged in the region of the first light receiving element B.
  • the light emitting element 11 or the light receiving element 12 of another form may be formed in the region of the light emitting element 11 or the light receiving element 12 of a certain form.
  • FIG. 5 is an explanatory view showing a mounting structure example of the substrate 10.
  • (A) is a mounting example of a single unit, and (b) is a mounting example in a state of being stacked in multiple stages.
  • the substrate 10 can be directly stacked and disposed at a predetermined interval with a spacer or the like interposed therebetween. However, the substrate 10 can be stacked and disposed using the substrate package 100 and the spacing member 101 shown in FIG.
  • the substrate package 100 includes a light transmission window 100a that transmits an optical signal (such as infrared rays) and an external wiring 100b that supplies power to drive the light emitting element 11 and the light receiving element 12 of the substrate 10.
  • an optical signal such as infrared rays
  • the interval holding member 101 includes a leg portion 101a for holding the interval and a light transmission window portion 101b that transmits an optical signal (such as infrared rays).
  • the substrate 10 is supported on the light transmission window portion 100a of the substrate package 100, and a wiring pattern provided on one surface side of the substrate 10 and the external wiring 100b are connected.
  • the interval holding member 101 is placed on one substrate package 100, and another substrate package 100 is placed on the interval holding member 101.
  • the substrate 10 can be arranged in multiple layers with a set interval.
  • a film-like infrared transmission filter 102 is attached so as to cover the light transmission window 100a of the lowermost substrate package 100, and a film-like infrared transmission is provided so as to cover the light transmission window 101b of the uppermost spacing member 101.
  • the filter 103 By attaching the filter 103, noise generated by the incidence of stray light can be prevented.
  • Use of such a substrate package 100 provides advantages such as easy handling of the substrate 10, an increased degree of freedom in wiring, and the elimination of through holes provided in the substrate 10.
  • FIG. 6 is an explanatory view showing a power feeding structure to each board or board package.
  • the substrate 10 or the substrate package 100
  • each substrate 10 or the substrate package 100
  • the electrodes on the uppermost substrate 10 (or the substrate package 100) and the electrodes on the mounting substrate 200 are connected by wires 201.
  • the substrate 10 (or the substrate package 100) of the lowermost layer (or the uppermost layer) from the substrate 10 (or the substrate package 100) of the uppermost layer (or the lowermost layer) via the intermediate substrate 10 (or the substrate package 100). ) Is supplied with electricity.
  • each substrate 10 is individually connected by wires 201.
  • the aforementioned setting angle ⁇ is 90 °, and each substrate 10 is in a state in which the arrangement pattern direction of the light emitting element 11 and the light receiving element 12 is rotated by 90 °.
  • FIG. 7 is an explanatory view showing a specific example of a light emitting element or a light receiving element in the optical interconnection device according to the embodiment of the present invention.
  • (A) shows the first light-emitting element A and the second light-receiving element C
  • (b) shows the first light-receiving element B and the second light-emitting element D.
  • the light emitting element 11 or the light receiving element 12 includes an insulating element isolation layer 20 surrounding the pn junction 10pn on a substrate (semiconductor substrate) 10, and a p-layer electrode and an inner side of the element isolation layer 20 on one side of the substrate 10.
  • a first electrode 21 that is one of the n-layer electrodes is disposed, and a second electrode 22 that is the other of the p-layer electrode and the n-layer electrode is disposed outside the element isolation layer 20.
  • the first electrode 21 is a light-transmitting p-layer electrode 21p
  • the second electrode 22 is a metal n-layer electrode 22n
  • an n + diffusion layer 23 connected to the second electrode 22 is provided on the outer peripheral portion of the element isolation layer 20.
  • Lead wires 21 a and 22 a are connected to the first electrode 21 and the second electrode 22, respectively, and electrical insulation between the first electrode 21 and the second electrode 22 is ensured including the lead wires 21 a and 22 a.
  • the first interlayer insulating film 24 and the second interlayer insulating film 25 are stacked.
  • a light emitting part or a light receiving part is formed on the first electrode 21, and a light shielding layer 30 is formed on the other surface side of the substrate 10 in the light emitting part or the light receiving part. Yes. As a result, light emission or light reception via the light transmissive first electrode 21 becomes possible.
  • the first electrode 21 is a light-reflective metal electrode, and the other surface side of the substrate 10 is a light transmission part 10S. Thereby, light emission or light reception via the light transmission part 10S in the substrate 10 becomes possible.
  • the current flow from the first electrode 21 to the second electrode 22 is n + diffusion formed in the outer peripheral portion of the element isolation layer 20 surrounding the pn junction 10pn. Since the flow path along the layer 23 is formed, relatively uniform light emission or light reception characteristics can be obtained in the light emitting unit or the light receiving unit.
  • FIG. 8 is an explanatory view showing a specific method of forming a light emitting element or a light receiving element of the optical interconnection device according to the embodiment of the present invention.
  • the light emitting / receiving element shown in FIG. 7A will be described as an example.
  • the substrate (Si semiconductor substrate) 10 is processed to form a groove 20e for forming the element isolation layer 20.
  • the groove 20e can be formed by anisotropic etching or the like, for example, and is formed so as to surround the light emitting part or the light receiving part.
  • the n + diffusion layer 23 is formed by ion implantation of n-type impurities.
  • a channel diffusion layer 23 a is formed on the bottom and outside of the groove 20 e, and a contact diffusion layer 23 b for connecting to the second electrode 22 is formed on the surface of the semiconductor substrate 10.
  • an isolation layer 20 is formed by embedding an insulating film such as an oxide film in the groove 20e.
  • a first interlayer insulating film 24 is formed, a contact opening to the n + diffusion layer 23 is formed, and then a pattern of the second electrode 22 is formed.
  • a second interlayer insulating film 25 is formed, and the inside of the element isolation layer 20 that becomes a light emitting portion or a light receiving portion is opened, and a group 13 element, for example, B (boron), Al (aluminum), Ga (gallium)
  • An pn junction 10 pn is formed inside the element isolation layer 20 by implanting an impurity selected from the following.
  • a transparent conductive film such as ITO is formed on the substrate 10 and patterned to form the first electrode 21, and another circuit configuration is formed.
  • a forward voltage Va is applied between the first electrode 21 and the second electrode 22 to cause a current to flow through the pn junction 10pn, and a group 13 element implanted into the semiconductor substrate 10 by an annealing process with Joule heat due to the current,
  • the pn junction 10pn is irradiated with light having a specific wavelength ⁇ from the first electrode 21 side which is a transparent conductive film.
  • dressed photons are generated in the vicinity of the pn junction 10 pn by light irradiation in such an annealing process.
  • the pn junction 10pn in which the dressed photon is generated in this way emits light having a wavelength equivalent to the wavelength ⁇ of the light irradiated in the annealing process.
  • the pn junction portion 10pn functions as a light receiving portion having peak sensitivity with respect to light having a wavelength ⁇ .
  • the first electrode 21 is formed by forming a metal electrode film on the substrate 10 and patterning the first electrode 21, and the second electrode.
  • a forward voltage Va is applied between the two electrodes 22 to cause a current to flow through the pn junction 10 pn, and a group 13 element such as B (boron) or Al (aluminum) implanted into the semiconductor substrate 10 by an annealing process using Joule heat by the current.
  • a group 13 element such as B (boron) or Al (aluminum) implanted into the semiconductor substrate 10 by an annealing process using Joule heat by the current.
  • Ga gallium
  • the light transmission part 10S side is irradiated with light of a specific wavelength ⁇ from the light transmission part 10S side
  • the pn junction part is irradiated by light irradiation in such an annealing process.
  • a dressed photon is generated in the vicinity of 10 pn.
  • the wavelength of light irradiated in the above-described annealing process is set to the same wavelength.
  • the light emission wavelength of the light emitting element 11 and the light reception wavelength of the light receiving element 12 are specified by the wavelength of light irradiated in the annealing process.
  • the wavelength of the light specified here is the wavelength of light that can be transmitted through the substrate 10, and when the substrate 10 is a Si semiconductor substrate, long-wavelength light of near infrared or higher is selected.
  • FIG. 9 shows a specific configuration example of the optical interconnection device according to the embodiment of the present invention.
  • the optical interconnection device 1 performs transmission / reception of optical signals between a plurality of substrates 10 (10-1, 10-2, 10-3), specifically, between the substrate 10-1 and the substrate 10-2.
  • the optical signal is transmitted and received bidirectionally, and the optical signal is transmitted and received bidirectionally between the substrate 10-2 and the substrate 10-3.
  • the light emitting element array region 50 in which the light emitting elements 11 are gathered and the light receiving element array region 60 in which the light receiving elements are gathered are arranged along the four sides of each rectangular substrate 10 and are driven at the center of the substrate 10.
  • the part 70 is arranged, and a wiring pattern is formed between the driving part 70 and the light emitting / receiving element array regions 50 and 60.
  • each light emitting element is the first light emitting element A
  • each light emitting element is the second light emitting element D are arranged in different regions.
  • the light receiving elements are the first light receiving elements B and the light receiving elements are the second light receiving elements C arranged in different regions.
  • the light receiving element array region 60 (first light receiving element B) is positioned at a position where the light emitting element array region 50 (A) of the first light emitting element A is rotated by 90 ° with respect to the center of the substrate 10. B) is disposed, and the light receiving element array region 60 (C) of the second light receiving element C is located at a position obtained by rotating the light receiving element array region 60 (B) of the first light receiving element B by 90 ° with respect to the center of the substrate 10. Is arranged, and the light emitting element array region 50 (D) of the second light emitting element D is disposed at a position obtained by rotating the light receiving element array region 60 (C) of the second light receiving element C by 90 ° with respect to the center of the substrate 10. Has been.
  • a light shielding film 80 is disposed on one surface side of the substrate 10.
  • a light shielding film (not shown) is disposed on the other surface side of the substrate 10. Yes.
  • a metal film such as titanium black can be used as the light shielding film 80 here.
  • the arrangement pattern of the light emitting / receiving element array region on the substrate 10-2 is obtained by rotating the direction of the arrangement pattern of the light emitting / receiving element array region on the substrate 10-1 by 90 °.
  • the arrangement pattern of the light emitting / receiving element array area of the substrate 10-3 is obtained by rotating the arrangement pattern of the light receiving element array area by 90 °.
  • the arrangement pattern of the light emitting / receiving element array region itself is common to all the substrates 10 (10-1, 10-2, 10-3), and the same process is repeated.
  • the light emitting / receiving element array region can be easily formed on all the substrates 10.
  • the light emitting element and the light receiving element between different substrates 10 can be positioned simply by rotating and arranging the direction of the arrangement pattern in the substrate having the common arrangement pattern by 90 ° around the center of the substrate 10, Bidirectional transmission and reception of optical signals can be performed between the substrates 10 facing each other.
  • the optical interconnection device 1 does not require cost and time for forming the individual substrates 10, and easily performs alignment between the substrates 10 that transmit and receive optical signals. Therefore, it is possible to easily realize optical interconnection with reduced crosstalk.
  • 1 optical interconnection device, 10: substrate, 10 pn: pn junction, 11: Light emitting element, 11a: Light emitting part, 11b: Light shielding part, 12: light receiving element, 12a: light receiving part, 12b: light shielding part, 13: Lens (microlens), 14a, 14b: power supply pads, 15a, 15b: power supply bumps, 20: element isolation layer, 20e: groove, 21: 1st electrode, 22: 2nd electrode, 21a, 22a: Lead-out wiring, 23: n + diffusion layer, 23a: channel diffusion layer, 23b: contact diffusion layer, 24: first interlayer insulating film, 25: second interlayer insulating film, 50: Light emitting element array area, 60: Light receiving element array area, 70: driving unit, 80: light shielding film, 100: substrate package, 100a: light transmission window, 100b: external wiring, 101: spacing member, 101a: legs, 101b: light transmission window, 102, 103: infrared transmission filter, 200: mounting substrate,

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  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Electromagnetism (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Photo Coupler, Interrupter, Optical-To-Optical Conversion Devices (AREA)
  • Led Device Packages (AREA)
  • Led Devices (AREA)
  • Light Receiving Elements (AREA)

Abstract

Le but de la présente invention est de réaliser une interconnexion optique de cartes inter-circuits qui permet à des cartes de circuits imprimés servant à émettre et recevoir un signal optique d'être facilement positionnées les unes par rapport aux autres sans qu'un temps et un coût soient nécessaires pour former chacune des cartes de circuits imprimés. Dans une pluralité de cartes de circuits imprimés (10) d'un dispositif d'interconnexion optique (1), un élément d'émission de lumière (11) et un élément de réception de lumière (12) sur chacune des cartes de circuits imprimés (10) ont un motif d'agencement commun. Dans deux cartes de circuits imprimés (10) pour émettre et recevoir un signal optique, la direction du motif d'agencement d'une carte de circuits imprimés (10) oscille à un angle défini par rapport à la direction du motif d'agencement de l'autre carte de circuits imprimés (10) et l'élément de réception de lumière (12) sur l'autre carte de circuits imprimés (10) est disposé sur l'axe optique de l'élément d'émission de lumière (11) situé sur ladite une carte de circuits imprimés (10).
PCT/JP2015/055525 2014-03-20 2015-02-26 Dispositif d'interconnexion optique WO2015141424A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2014-058840 2014-03-20
JP2014058840A JP2015185598A (ja) 2014-03-20 2014-03-20 光インターコネクション装置

Publications (1)

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WO2015141424A1 true WO2015141424A1 (fr) 2015-09-24

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JP (1) JP2015185598A (fr)
TW (1) TW201537904A (fr)
WO (1) WO2015141424A1 (fr)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01202704A (ja) * 1988-02-09 1989-08-15 Fujitsu Ltd 光海底中継器内部ユニットの実装構造
JP2008003634A (ja) * 2005-10-07 2008-01-10 Toyota Motor Corp 複数枚の回路基板を固定する固定部材とそれを利用したモジュール

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01202704A (ja) * 1988-02-09 1989-08-15 Fujitsu Ltd 光海底中継器内部ユニットの実装構造
JP2008003634A (ja) * 2005-10-07 2008-01-10 Toyota Motor Corp 複数枚の回路基板を固定する固定部材とそれを利用したモジュール

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JP2015185598A (ja) 2015-10-22

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