WO2015146253A1 - Dispositif d'imagerie à semi-conducteurs - Google Patents

Dispositif d'imagerie à semi-conducteurs Download PDF

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Publication number
WO2015146253A1
WO2015146253A1 PCT/JP2015/051650 JP2015051650W WO2015146253A1 WO 2015146253 A1 WO2015146253 A1 WO 2015146253A1 JP 2015051650 W JP2015051650 W JP 2015051650W WO 2015146253 A1 WO2015146253 A1 WO 2015146253A1
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Prior art keywords
substrate
solid
state imaging
imaging device
light beam
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PCT/JP2015/051650
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English (en)
Japanese (ja)
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良章 竹本
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オリンパス株式会社
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
    • H01L27/1464—Back illuminated imager structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
    • H01L27/14603—Special geometry or disposition of pixel-elements, address-lines or gate-electrodes
    • H01L27/14607—Geometry of the photosensitive area
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
    • H01L27/14625—Optical elements or arrangements associated with the device
    • H01L27/14627—Microlenses
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
    • H01L27/14634—Assemblies, i.e. Hybrid structures

Definitions

  • the present invention relates to a solid-state imaging device.
  • This application claims priority based on Japanese Patent Application No. 2014-066791 for which it applied to Japan on March 28, 2014, and uses the content here.
  • imaging devices such as video cameras and electronic still cameras have been widely used.
  • CCD Charge Coupled Device
  • amplification type solid-state imaging devices introduces an electric signal generated and accumulated by a photoelectric conversion unit such as a photodiode provided in a pixel to which light enters to the amplification unit provided in the pixel, and the amplification unit amplifies the signal.
  • a signal is output from the pixel.
  • the amplification type solid-state imaging device a plurality of such pixels are arranged in a two-dimensional matrix to form a pixel array unit.
  • Examples of the amplification type solid-state imaging device include a CMOS type solid-state imaging device using a CMOS (Complementary Metal Oxide Semiconductor: complementary metal oxide semiconductor) transistor.
  • CMOS type solid-state imaging device having a general monolithic structure (a structure manufactured from a single semiconductor substrate), a plurality of pixels that convert incident light into electrical signals are formed when viewed from the light incident surface.
  • Peripheral circuits such as a vertical scanning circuit, a horizontal scanning circuit, a column processing circuit, and an output circuit are disposed around the pixel array portion. A wiring for transmitting an electric signal is provided between the pixel array unit and these peripheral circuits for each column or each row.
  • Recent CMOS solid-state imaging devices are also required to improve data rates, improve the in-plane imaging performance, and increase functionality.
  • it is difficult to improve the performance of a conventional CMOS solid-state imaging device having a monolithic structure due to a speed limit or a density limit in electric conduction in a planar direction.
  • a CMOS type solid-state imaging device that operates in a state in which a plurality of semiconductor substrates are stacked has been proposed.
  • CMOS-type solid-state imaging device for example, as in Patent Document 1 and Patent Document 2, a technique for improving sensitivity and improving functions by stacking a plurality of semiconductor substrates provided with photoelectric conversion units has been proposed. It is disclosed.
  • Patent Document 1 a first solid-state imaging device in which a photoelectric conversion unit that receives incident light and performs photoelectric conversion is formed, and a photoelectric conversion unit that receives light that has passed through the first solid-state imaging device and performs photoelectric conversion are provided.
  • a technique of a solid-state imaging device is disclosed in which the formed second solid-state imaging element is overlapped and at least one of the solid-state imaging elements is a backside illumination (BSI) type.
  • BSI backside illumination
  • Patent Document 2 a plurality of semiconductor chips each having a photoelectric conversion unit that receives light and performs photoelectric conversion are stacked in a plurality of stages, and each semiconductor chip performs photoelectric conversion according to light of different wavelengths.
  • a technique for a solid-state imaging device is disclosed.
  • a general solid-state imaging device regardless of whether it is a front-side illumination (FSI) type or a back-side illumination type, it is incident only on the upper surface of the semiconductor substrate, that is, the surface of the semiconductor substrate on the side where light enters the photoelectric conversion unit An antireflection film for reducing light reflection is formed.
  • FSI front-side illumination
  • Patent Document 1 in the first solid-state imaging device of the backside illumination type, a color filter and a microlens are formed, and an antireflection film is formed only on the backside surface on which light is incident. It is disclosed.
  • Patent Document 2 does not disclose an antireflection film.
  • a solid-state imaging device having a structure in which semiconductor substrates on which photoelectric conversion units are formed are stacked in a plurality of stages, light rays that pass through the first-stage semiconductor substrate on which light is incident are reflected by the interface on the light emission side. As a result, sufficient light does not reach the second and subsequent semiconductor substrates. As a result, the photoelectric conversion unit formed on the second-stage semiconductor substrate cannot secure a sufficient amount of light due to the influence of the reflection on the first-stage semiconductor substrate, and the level of the electric signal to be generated is low. It will decline. As a result, the solid-state imaging device having a configuration in which a plurality of semiconductor substrates on which photoelectric conversion units are formed has a problem in that sensitivity decreases.
  • the present invention has been made on the basis of the above-described problem recognition, and is formed on the second and subsequent semiconductor substrates in a solid-state imaging device having a configuration in which a plurality of semiconductor substrates on which photoelectric conversion portions are formed are stacked.
  • An object of the present invention is to provide a solid-state imaging device capable of improving an electrical signal generated by a photoelectric conversion unit.
  • the solid-state imaging device is a solid-state imaging device in which a plurality of substrates each having a pixel unit in which a plurality of pixels each having a photoelectric conversion unit are arranged in a two-dimensional matrix are stacked, A first substrate having a first semiconductor layer on which a first photoelectric conversion unit that converts an incident first light beam into an electrical signal is formed, and a second substrate that is incident through the first substrate. And a second substrate having a second semiconductor layer on which a second photoelectric conversion unit for converting the light beam into an electrical signal is formed.
  • the first substrate is formed in contact with a first surface that is a surface on which the first light beam is incident on the first semiconductor layer, and the first light beam is reflected by the first surface.
  • a first antireflection film for reducing the first antireflection film, and the first light ray incident on the first semiconductor layer is transmitted through the first semiconductor layer and emitted as the second light ray.
  • a second antireflection film that is formed in contact with a second surface that is the surface opposite to the surface and that reduces reflection of the second light beam on the second surface.
  • the first antireflection film and the second antireflection film may be formed of different materials.
  • the first antireflection film and the second antireflection film may be formed of the same material.
  • the first antireflection film transmits the first light beam.
  • the spectral transmission characteristic may be different from the spectral transmission characteristic in which the second antireflection film transmits the second light beam.
  • the wavelength with the highest spectral transmittance of the second antireflection film is the spectral transmission of the first antireflection film. It may be on the longer wavelength side than the wavelength with the highest rate.
  • the second substrate is formed on the second semiconductor layer.
  • a third antireflection film that is formed in contact with a third surface that is a surface on which the second light beam is incident and that reduces reflection of the second light beam on the third surface.
  • the wavelength with the highest spectral transmittance of the third antireflection film may be the same as the wavelength with the highest spectral transmittance of the second antireflection film.
  • the third photoelectric conversion that converts the third light beam that has passed through the second substrate and entered into an electrical signal.
  • a third substrate having a third semiconductor layer on which the portion is formed.
  • the second substrate is opposite to the third surface, and the second light beam incident on the second semiconductor layer is transmitted through the second semiconductor layer and emitted as the third light beam.
  • a fourth antireflection film that is formed in contact with the fourth surface and that reduces reflection of the third light beam on the fourth surface.
  • the third substrate is formed in contact with a fifth surface that is a surface on which the third light ray enters the third semiconductor layer, and the third light beam is reflected by the fifth surface.
  • the wavelength with the highest spectral transmittance of the fourth antireflection film may be the same as the wavelength with the highest spectral transmittance of the fifth antireflection film.
  • the solid-state imaging device in the solid-state imaging device having a configuration in which the semiconductor substrates on which the photoelectric conversion units are formed are stacked in multiple stages, the photoelectric conversion units formed on the second and subsequent semiconductor substrates are generated.
  • the electrical signal to be improved can be improved.
  • FIG. 1 is an overview diagram illustrating a schematic configuration of a solid-state imaging device according to a first embodiment of the present invention. It is the top view which showed schematic structure of the 1st board
  • FIG. 1 is an overview diagram showing a schematic configuration of the solid-state imaging device according to the first embodiment.
  • the solid-state imaging device 10 of the first embodiment is configured by stacking a plurality of substrates.
  • a first substrate 11 and a second substrate 12 are joined by a connection layer 13.
  • the number of stacked substrates is not limited to two, Further, a structure in which a larger number of substrates are stacked may be used.
  • connection layer 13 is composed of, for example, a resin film such as a resin adhesive, or at least one inorganic film for performing plasma bonding by surface activation, and bonds the first substrate 11 and the second substrate 12 together. To do. Further, the connection layer 13 includes a connection electrode portion for electrically connecting the first substrate 11 and the second substrate 12.
  • the first substrate 11 is a semiconductor substrate that converts incident light into an electrical signal and outputs the electrical signal.
  • the first substrate 11 includes a first pixel array unit (pixel, pixel unit) 111, a first vertical scanning circuit 112, a first horizontal scanning circuit 113, a bonding pad 114, and a connection electrode array unit. 115 are arranged.
  • the light beam incident on the first substrate 11 is emitted from the surface opposite to the surface on which the light beam is incident.
  • the second substrate 12 is a semiconductor substrate that converts the light emitted from the first substrate 11 into an electrical signal and outputs the electrical signal.
  • FIG. 2 is a plan view illustrating a schematic configuration of the first substrate 11 in the solid-state imaging device 10 according to the first embodiment.
  • the plan view of the first substrate 11 shown in FIG. 2 shows a plan view when viewed from the side where light enters the first substrate 11.
  • the configuration of the first substrate 11 may be a front-illuminated type CMOS solid-state imaging device, and is the same configuration as a CCD-type solid-state imaging device (including front-side illumination type and back-side illumination type). Also good.
  • the first substrate 11 includes the first pixel array unit 111, the first vertical scanning circuit 112, the first horizontal scanning circuit 113, the bonding pad 114, and the connection electrode array unit 115. And are arranged.
  • the first pixel array unit 111 includes a two-dimensional matrix of pixels (hereinafter referred to as “first unit pixels”) including a photoelectric conversion unit that converts incident light into an electric signal and a plurality of transistors. A plurality of pixel portions arranged in a shape.
  • the first vertical scanning circuit 112 drives each first unit pixel in the first pixel array unit 111 and photoelectrically converts the light incident on each first unit pixel (hereinafter referred to as “the first unit pixel”). 1 pixel signal ”) is output to the first horizontal scanning circuit 113.
  • the first vertical scanning circuit 112 includes a drive driver that drives each first unit pixel in the first pixel array unit 111.
  • the first vertical scanning circuit 112 generates a drive signal for driving each first unit pixel in the first pixel array unit 111, and uses the generated drive signal as the first pixel array unit 111.
  • Each first unit pixel in the first pixel array unit 111 is driven for each row.
  • the first horizontal scanning circuit 113 reads the first pixel signal output from the first unit pixel driven by the first vertical scanning circuit 112 for each row, and reads the read first pixel signal to the first pixel signal. The data is sequentially output for each column of the first unit pixels arranged in one pixel array unit 111.
  • the first horizontal scanning circuit 113 includes a readout circuit for sequentially reading out the first pixel signal from the first unit pixel.
  • the readout circuit includes, for example, a CDS (Correlated Double Sampling) processing circuit that performs processing such as noise removal on the readout first pixel signal, and the readout first pixel signal (analogue).
  • An AD converter or the like for analog-to-digital conversion of the signal) may be provided.
  • the bonding pad 114 is a terminal for transmitting and receiving electrical signals between a circuit outside the package and the solid-state imaging device 10 when the solid-state imaging device 10 is assembled (packaged) in a ceramic package or the like, for example. It is.
  • the first pixel signal sequentially output from the first horizontal scanning circuit 113 is output to the outside through the corresponding bonding pad 114.
  • an electrical signal input from an external circuit is input to each component in the first substrate 11 via the corresponding bonding pad 114.
  • the bonding pad 114 is electrically connected to each component in the first substrate 11.
  • the bonding pad 114 is connected to each component in the second substrate 12 through the connection electrode array unit 115. It may be configured to be connected. Further, the bonding pad 114 may be disposed not only on the first substrate 11 but also on the second substrate 12.
  • connection electrode array unit 115 a plurality of connection electrode units for electrically connecting the components in the first substrate 11 and the components in the second substrate 12 are arranged in an array.
  • the components arranged on the first substrate 11 and the second substrate 12 that are joined perform transmission and reception of respective electric signals via the corresponding connection electrode portions arranged on the connection electrode array portion 115.
  • the connection electrode part for example, a structure of a through silicon via (TSV: Through-Silicon-Via) is used.
  • TSV Through-Silicon-Via
  • a structure of a connection electrode part you may use the structure connected by the structure of a microbump produced by the vapor deposition method and the plating method, or a metal wiring layer, for example.
  • the plan view of the first substrate 11 shown in FIG. 2 shows a configuration in which the connection electrode array unit 115 is arranged in parallel with the first horizontal scanning circuit 113.
  • positioned is not limited to the position shown in FIG. For example, it may be arranged at a position on the opposite side of the first pixel array unit 111 in parallel with the first horizontal scanning circuit 113, a position aligned in parallel with the first vertical scanning circuit 112, or a first vertical It may be arranged at a position on the opposite side of the first pixel array unit 111 in parallel with the scanning circuit 112.
  • the connection electrode array unit 115 may be distributed at a plurality of positions, or may be disposed at at least a part of the positions described above.
  • FIG. 3 is a plan view showing a schematic configuration of the second substrate 12 in the solid-state imaging device 10 of the first embodiment.
  • the plan view of the second substrate 12 shown in FIG. 3 shows the plane when viewed from the side where the light beam emitted from the first substrate 11 enters the second substrate 12.
  • the configuration of the second substrate 12 may be a backside illumination type CMOS solid-state imaging device, and is the same configuration as a CCD type solid-state imaging device (including a frontside illumination type and a backside illumination type). Also good.
  • a second pixel array unit (pixel, pixel unit) 121, a second vertical scanning circuit 122, a second horizontal scanning circuit 123, and a connection electrode array unit 115 are arranged. ing.
  • the second pixel array unit 121 is a pixel (hereinafter referred to as “second unit pixel”) including a photoelectric conversion unit that converts a light beam that has passed through the first substrate 11 and converted into an electric signal, and a plurality of transistors. Are pixel portions arranged in a two-dimensional matrix. Each second unit pixel in the second pixel array unit 121 is connected to the first pixel array unit of the first substrate 11 when the second substrate 12 and the first substrate 11 are bonded. The first unit pixel is arranged in a position similar to the position of the first unit pixel arranged in 111.
  • the second vertical scanning circuit 122 drives each second unit pixel in the second pixel array unit 121 for each row. Then, an electrical signal obtained by photoelectrically converting the light incident on each second unit pixel (hereinafter referred to as “second pixel signal”) is sequentially output to the second horizontal scanning circuit 123.
  • the second horizontal scanning circuit 123 Similar to the first horizontal scanning circuit 113 arranged on the first substrate 11, the second horizontal scanning circuit 123 outputs the second unit pixel output from the second unit pixel driven by the second vertical scanning circuit 122. Two pixel signals are read out for each row and sequentially output for each column of the second unit pixel.
  • the second horizontal scanning circuit 123 includes a readout circuit for sequentially reading out the second pixel signal from the second unit pixel. Note that the readout circuit configured in the second horizontal scanning circuit 123 is similar to the readout circuit configured in the first horizontal scanning circuit 113 disposed on the first substrate 11, for example, a CDS processing circuit, An AD converter or the like may be provided.
  • connection electrode array unit 115 a plurality of connection electrode units corresponding to the connection electrode units arranged in the connection electrode array unit 115 arranged on the first substrate 11 are arranged in an array.
  • the same reference numerals are given to indicate that the connection electrode array unit 115 in the second substrate 12 corresponds to the connection electrode array unit 115 in the first substrate 11.
  • the structure of each connection electrode part arranged in the connection electrode array part 115 in the second substrate 12 is the same as the structure of each connection electrode part arranged in the connection electrode array part 115 in the first substrate 11. It is.
  • the connection electrode array unit 115 in the second substrate 12 has the same position as the connection electrode array unit 115 in the first substrate 11 when the second substrate 12 and the first substrate 11 are bonded. It is arranged to become. Therefore, the position where the connection electrode array unit 115 is arranged in the second substrate 12 is changed according to the position where the connection electrode array unit 115 is arranged in the first substrate 11.
  • FIG. 4 is a cross-sectional view illustrating the structure of the solid-state imaging device 10 according to the first embodiment.
  • FIG. 4 shows the first unit pixel in the first pixel array unit 111 arranged on the first substrate 11 shown in FIG. 2 and the first unit pixel arranged on the second substrate 12 shown in FIG. A part of the structure of the area with the second unit pixel in the second pixel array unit 121 is shown.
  • the first substrate 11 and the second substrate 12 are joined by the connection layer 13 and are disposed in the first pixel array unit 111 of the first substrate 11.
  • the position of the first unit pixel and the position of the second unit pixel disposed in the second pixel array unit 121 of the second substrate 12 are arranged to be the same position.
  • the first unit pixel and the second unit pixel are not distinguished, they are simply referred to as “unit pixel”.
  • the first substrate 11 includes a microlens 1111, a color filter 1112, a transparent resin layer 1113, a light shielding film 1114, a silicon oxide film 1115, a first antireflection film 1116, and a first A semiconductor layer 1117 and a metal wiring layer 1120 are included. Further, the second substrate 12 joined to the first substrate 11 by the connection layer 13 is constituted by the metal wiring layer 1211 and the second semiconductor layer 1215.
  • the microlens 1111 condenses the light incident on the solid-state imaging device 10 (hereinafter referred to as “first light”).
  • the micro lens 1111 is formed at a position corresponding to each unit pixel arranged in the solid-state imaging device 10. Then, the microlens 1111 condenses the incident first light beam, for example, between the first semiconductor layer 1117 and the second semiconductor layer 1215.
  • the color filter 1112 changes the spectral transmission characteristics of the first light beam incident on the solid-state imaging device 10 so that the first light beam having a different color is incident on each unit pixel formed immediately below.
  • the color filter 1112 is formed at a position corresponding to each of the microlens 1111 and the unit pixel.
  • the transparent resin layer 1113 is a layer that flattens the surface on which light is incident on the first substrate 11.
  • the light shielding film 1114 shields light between adjacent unit pixels.
  • the light shielding film 1114 is made of a metal material, and is formed of a plurality of layers using, for example, tungsten or aluminum as a main material and titanium or a nitride thereof as an adhesion layer.
  • the silicon oxide film 1115 is a film formed as appropriate in order to form the light shielding film 1114. In the configuration of the solid-state imaging device 10 shown in FIG. 4, the silicon oxide film 1115 is formed only on the lower part of the light shielding film 1114, that is, on the surface opposite to the direction in which the first light beam enters the solid-state imaging device 10. Although the case where it is formed is shown, a silicon oxide film may be formed on the light shielding film 1114, that is, on the surface in the direction in which the first light beam enters the solid-state imaging device 10.
  • the first antireflection film 1116 is a film that reduces the reflection of the first light beam incident on the solid-state imaging device 10.
  • the first antireflection film 1116 is formed of a high-dielectric material.
  • the first antireflection film 1116 is a single layer or a plurality of layers using tantalum oxide, hafnium oxide, or silicon nitride and is in contact with the first semiconductor layer 1117 ( Hereinafter, it is formed on a “first surface”. At this time, the first antireflection film 1116 is formed so that the incident first light beam is incident on the first semiconductor layer 1117 with a predetermined spectral transmission characteristic.
  • hafnium oxide having a thickness of 65 nm is simply used.
  • the reflectance of light in the visible light region can be 20% or less.
  • the first semiconductor layer 1117 is a semiconductor layer that forms a component of the first unit pixel.
  • the first unit pixel is configured in the first semiconductor layer 1117, and the first light beam incident from the first surface is converted into an electric signal (first signal).
  • first signal A case where a photoelectric conversion unit (hereinafter, referred to as a “first photoelectric conversion unit”) 1118 for conversion into a pixel signal) is formed is illustrated. A part of the incident first light beam is converted into a first pixel signal by the first photoelectric conversion unit 1118 formed in the first semiconductor layer 1117.
  • the first semiconductor layer 1117 transmits a part of the first light beam incident from the first surface, and is a surface opposite to the first surface (hereinafter referred to as “second surface”). To the second substrate 12. Therefore, it is desirable that the first semiconductor layer 1117 has a thickness of 5 ⁇ m or less, for example.
  • the first light beam transmitted through the first semiconductor layer 1117 is referred to as “second light beam”.
  • the metal wiring layer 1120 is a layer in which metal wirings connecting the constituent elements of the first unit pixels or the respective constituent elements arranged in the first substrate 11 are formed. In the configuration of the solid-state imaging device 10 illustrated in FIG. 4, the case where the metal wiring 1121 is formed in the metal wiring layer 1120 is illustrated. The respective circuit elements constituting the respective constituent elements arranged on the first substrate 11 are connected by the respective metal wirings 1121 formed in the metal wiring layer 1120.
  • the second antireflection film 1119 is also formed on the metal wiring layer 1120.
  • the second antireflection film 1119 is formed so as to be in contact with the first semiconductor layer 1117 in order to reduce reflection of the second light beam that is transmitted through the first semiconductor layer 1117 and is emitted.
  • the second antireflection film 1119 transmits the second light beam that has been transmitted through the first semiconductor layer 1117 and has a predetermined spectral transmission characteristic. It is formed with a material and film thickness selected to be incident on the layer 1215.
  • the second antireflection film 1119 is a single layer or a plurality of layers using a high dielectric material such as tantalum oxide, hafnium oxide, silicon nitride, or the like, as with the first antireflection film 1116. It is thought that it is formed. However, the material for forming the second antireflection film 1119 is the same material even if a material different from the first antireflection film 1116 is used in consideration of the manufacturing viewpoint of the solid-state imaging device 10. Also good.
  • the metal wiring layer 1211 is a layer in which metal wirings for connecting the constituent elements of the second unit pixel or the respective constituent elements arranged in the second substrate 12 are formed. In the configuration of the solid-state imaging device 10 illustrated in FIG. 4, a case where the metal wiring 1212 is formed in the metal wiring layer 1211 is illustrated. The respective circuit elements constituting the respective constituent elements arranged on the second substrate 12 are connected by the respective metal wirings 1212 formed in the metal wiring layer 1211.
  • a third antireflection film 1213 is also formed on the metal wiring layer 1211.
  • the third antireflection film 1213 is formed in order to reduce reflection of the second light beam that is transmitted through the first semiconductor layer 1117 in the first substrate 11 and is incident on the second semiconductor layer 1215.
  • 2 is a film formed on a surface in contact with the semiconductor layer 1215 (hereinafter referred to as “third surface”).
  • the third antireflection film 1213 also has a second light beam that has been transmitted through the first semiconductor layer 1117 and has been determined in advance.
  • the material for forming the third antireflection film 1213 may be a material different from the first antireflection film 1116 or the second antireflection film 1119 or the same material. However, it is desirable that the third antireflection film 1213 has the same spectral transmission characteristic as that of the second antireflection film 1119. In this case, considering the manufacturing viewpoint of the solid-state imaging device 10, the difference in spectral transmission characteristics between the third antireflection film 1213 and the second antireflection film 1119 is, for example, a difference of ⁇ 5% or less. If there is, it can be considered that they have the same spectral transmission characteristics.
  • the second semiconductor layer 1215 is a semiconductor layer that forms a component of the second unit pixel.
  • the second unit pixel is configured in the second semiconductor layer 1215, and the second unit light that is transmitted through the first substrate 11 and incident from the third surface.
  • the second photoelectric conversion portion 1214 formed in the second semiconductor layer 1215 converts the second light beam that has been transmitted through the first substrate 11 and converted into a second pixel signal.
  • the solid-state imaging device includes a pixel having a photoelectric conversion unit (first photoelectric conversion unit 1118 or second photoelectric conversion unit 1214) in a two-dimensional matrix form.
  • a solid-state imaging device in which a plurality of substrates (first substrate 11 and second substrate 12) each having a plurality of pixel portions (first pixel array portion 111 or second pixel array portion 121) arranged on the substrate are stacked
  • a first substrate 11 having a first semiconductor layer (first semiconductor layer 1117) on which a first photoelectric conversion unit 1118 for converting an incident first light beam into an electrical signal is formed;
  • a second semiconductor layer (second semiconductor layer 1215) having a second photoelectric conversion portion 1214 formed with a second photoelectric conversion portion 1214 that converts the second light beam that has been transmitted through the first substrate 11 and converted into an electrical signal.
  • the first substrate 11 is formed in contact with the first surface that is the surface on which the first light beam is incident on the first semiconductor layer 1117, and the reflection of the first light beam on the first surface is reduced.
  • the first antireflection film (first antireflection film 1116) and the first light beam incident on the first semiconductor layer 1117 are transmitted through the first semiconductor layer 1117 and emitted as the second light beam.
  • a second antireflection film (second antireflection film) that is formed in contact with the second surface that is opposite to the first surface and that reduces the reflection of the second light beam on the second surface.
  • a film 1119 ).
  • the first antireflection film 1116 and the second antireflection film 1119 may be formed of different materials.
  • the first antireflection film 1116 and the second antireflection film 1119 may be formed of the same material.
  • the first light beam incident on the solid-state imaging device 10 having such a configuration is, for example, generated between the first semiconductor layer 1117 and the second semiconductor layer 1215 by the microlens 1111 formed on the first substrate 11.
  • the light is collected in between, passes through each of the color filter 1112, the transparent resin layer 1113, the silicon oxide film 1115, and the first antireflection film 1116, and enters the first semiconductor layer 1117.
  • the first light beam incident on the first semiconductor layer 1117 is partly absorbed by the first photoelectric conversion unit 1118 and converted into a first pixel signal, and a part of the first light beam is absorbed.
  • One light beam passes through the first semiconductor layer 1117 and is emitted to the metal wiring layer 1120.
  • the emitted first light beam passes through the metal wiring layer 1120 (including the second antireflection film 1119) and the connection layer 13, and is incident on the second substrate 12 as the second light beam. . Then, the second light beam passes through the metal wiring layer 1211 (including the third antireflection film 1213), enters the second semiconductor layer 1215, and is absorbed by the second photoelectric conversion unit 1214. 2 pixel signal.
  • the first light beam incident on the solid-state imaging device 10 enters the first photoelectric conversion unit 1118 in the first substrate 11.
  • the first semiconductor layer on the side from which the second light beam transmitted through the first semiconductor layer 1117 is emitted A second antireflection film 1119 is also formed on the second surface of 1117. That is, in the solid-state imaging device 10 of the first embodiment, in addition to the first antireflection film 1116 corresponding to the antireflection film formed on the first surface in the conventional solid-state imaging device, the second A second antireflection film 1119 is also formed on the surface.
  • antireflection films are formed on both surfaces (first surface and second surface) of the first semiconductor layer 1117 in the first substrate 11.
  • the first light beam that is transmitted through the first substrate 11 that is the first-stage semiconductor substrate on which the first light beam is incident and the second light beam is emitted.
  • the reflection of the second light beam at the interface between the two surfaces can be reduced, and sufficient second light beam is delivered to the second unit pixel formed on the second substrate 12 which is the second stage semiconductor substrate. be able to.
  • the 2nd unit pixel can photoelectrically convert the 2nd light ray with which sufficient light quantity was ensured, and can output the 2nd pixel signal which improved the level.
  • the solid-state imaging device 10 of the first embodiment can improve sensitivity.
  • the second light beam on the side on which the second light beam transmitted through the first substrate 11 is incident on the second photoelectric conversion unit 1214 in the second substrate 12.
  • a third antireflection film 1213 is also formed on the third surface of the semiconductor layer 1215.
  • the spectral transmission characteristics of each antireflection film that is, the transmittance with respect to the wavelength of each light beam transmitted through the antireflection film (so-called spectral transmittance).
  • spectral transmittance the transmittance with respect to the wavelength of each light beam transmitted through the antireflection film
  • transmitted light the spectral transmission characteristics of light rays (hereinafter also referred to as “transmitted light”) transmitted through the respective antireflection films.
  • the first unit pixels photoelectrically convert the first light rays.
  • the function of the solid-state imaging device 10 can be improved, for example, by changing the wavelength and the wavelength of the second light beam photoelectrically converted by the second unit pixel.
  • the spectral transmission characteristics (spectral transmittance) are defined in each antireflection film formed in the solid-state imaging device.
  • the first unit pixel formed in the solid-state imaging device of the second embodiment (hereinafter referred to as “solid-state imaging device 20”) photoelectrically converts the first light beam in the visible light region
  • a case where the second unit pixel photoelectrically converts the second light beam in the infrared light region will be described.
  • the configuration of the solid-state imaging device 20 of the second embodiment is the same as that of the first embodiment shown in FIGS. 1 to 4 except that the spectral transmission characteristics (spectral transmittance) of the formed antireflection films are different.
  • FIGS. 5A to 5C are diagrams for explaining the transmittance (spectral transmittance) with respect to the wavelength of light (transmitted light) in the antireflection film formed in the solid-state imaging device 20 of the second embodiment.
  • FIG. 5A shows a first unit pixel in the first pixel array unit 111 arranged on the first substrate 11 constituting the solid-state imaging device 20 and a second pixel arranged on the second substrate 12. A sectional view of a part of the structure in the region with the second unit pixel in the array unit 121 is shown.
  • 5B and 5C show the transmittance of each antireflection film formed in the solid-state imaging device 20 for each wavelength of transmitted light.
  • the solid-state imaging device 20 includes a first antireflection film 1116 and a second antireflection coating, as in the structure of the solid-state imaging device 10 of the first embodiment shown in FIG.
  • a film 1119 and a third antireflection film 1213 are formed. More specifically, the first antireflection film 1116 is formed on the first surface on the side where the first light ray enters the first semiconductor layer 1117 in the first substrate 11, and the first semiconductor layer is formed.
  • a second antireflection film 1119 is formed on the second surface on the side where the first light beam transmitted through 1117 is emitted as the second light beam.
  • a third antireflection film 1213 is formed on the third surface on the side where the second light beam transmitted through the first substrate 11 is incident on the second semiconductor layer 1215 in the second substrate 12. .
  • the first photoelectric conversion unit 1118 formed in the first semiconductor layer 1117 photoelectrically converts the first light beam having a wavelength in the visible region into the first pixel signal, and the second semiconductor layer.
  • a second photoelectric conversion unit 1214 formed in 1215 photoelectrically converts a second light beam having a wavelength in the infrared light region into a second pixel signal.
  • the spectral transmittance of each antireflection film formed in the solid-state imaging device 20 is optimized to the wavelength of each light beam photoelectrically converted by the first photoelectric conversion unit 1118 and the second photoelectric conversion unit 1214. . That is, in the solid-state imaging device 20, the spectral transmittance of each antireflection film formed is different from the spectral transmittance of each antireflection film formed in the solid-state imaging device 10 of the first embodiment. .
  • the first antireflection film 1116 that causes the first light beam to enter the first photoelectric conversion unit 1118 has a wavelength in the visible light region, or a wavelength in a region between visible light and infrared light.
  • the spectral transmittance is optimized so that the first light beam is transmitted. That is, as shown in FIG. 5B, the first antireflection film 1116 having the spectral transmission characteristic (spectral transmittance) that transmits evenly from the visible light region to the infrared light region is formed.
  • the second antireflection film 1119 that emits the second light beam that has passed through the first semiconductor layer 1117 causes the second light beam to enter the second photoelectric conversion unit 1214, infrared light is emitted.
  • the spectral transmittance is optimized so that the second light beam having the wavelength of the region is most transmitted. That is, as shown in FIG. 5C, the second antireflection film 1119 having spectral transmission characteristics (spectral transmittance) having low transmittance in the visible light region and high transmittance in the infrared light region.
  • the second antireflection in which the wavelength having the highest spectral transmittance (peak) (hereinafter referred to as “spectral transmittance peak”) is in the wavelength of the infrared light region (so-called long wavelength side).
  • spectral transmittance peak the wavelength having the highest spectral transmittance (peak)
  • long wavelength side the wavelength of the infrared light region
  • the third antireflection film 1213 that causes the second light beam transmitted through the first semiconductor layer 1117 to enter the second photoelectric conversion unit 1214 also has the same spectral transmission characteristics as the second antireflection film 1119.
  • the spectral transmittance is optimized so that the second light ray having a wavelength in the infrared light region is most transmitted. That is, the third antireflection film 1213 is also formed so as to have a spectral transmission characteristic as shown in FIG. 5C where the peak of the spectral transmittance is at the wavelength (long wavelength side) in the infrared light region.
  • the difference in spectral transmission characteristics (peak of spectral transmittance) between the third antireflection film 1213 and the second antireflection film 1119 is, for example, A difference of ⁇ 5% or less can be considered to have the same spectral transmission characteristic (peak of spectral transmittance).
  • the first antireflection film 1116 transmits the first light beam and the second antireflection film 1119 has the first antireflection film 1119. This is different from the spectral transmission characteristic that transmits two light beams.
  • the wavelength with the highest spectral transmittance of the second antireflection film 1119 is the wavelength with the highest spectral transmittance of the first antireflection film 1116. It is on the longer wavelength side.
  • the second substrate 12 is in contact with the third surface that is the surface on the second semiconductor layer 1215 where the second light beam is incident.
  • a third antireflection film (third antireflection film 1213) that reduces the reflection of the second light beam on the third surface.
  • the wavelength with the highest spectral transmittance of the third antireflection film 1213 is the same as the wavelength with the highest spectral transmittance of the second antireflection film 1119.
  • both surfaces of the first semiconductor layer 1117 in the first substrate 11 (like the solid-state imaging device 10 of the first embodiment) A first surface and a second surface) and a surface (third surface) of the second semiconductor layer 1215 in the second substrate 12 on the side where the second light beam transmitted through the first substrate 11 is incident.
  • An antireflection film is formed on each of the above.
  • the first antireflection film 1116 that causes the first light beam to enter the first semiconductor layer 1117 in the first substrate 11, and the second substrate 12.
  • Spectral transmission characteristics (peaks of spectral transmittance) of the second antireflection film 1119 and the third antireflection film 1213 that cause the second light beam to enter the second semiconductor layer 1215 are made different. That is, in the solid-state imaging device 20 of the second embodiment, the antireflection formed at the wavelength of each light beam photoelectrically converted by the unit pixels formed on the first substrate 11 and the second substrate 12, respectively. Optimize the spectral transmission characteristics (spectral transmission peak) of the film. Thereby, in the solid-state imaging device 20 of the second embodiment, sufficient light can be delivered to each of the unit pixels formed on the first substrate 11 and the second substrate 12, respectively. The unit pixel can improve the function of the solid-state imaging device 20 by photoelectrically converting incident light of each wavelength.
  • the first substrate 11 and the second substrate 12 are joined by the connection layer 13, that is, 2
  • the configuration of the solid-state imaging device in which a single substrate is stacked has been described.
  • the number of substrates stacked in the solid-state imaging device is not limited to two, and a configuration in which a larger number of substrates is stacked may be used.
  • FIG. 6 is a cross-sectional view showing the structure of the solid-state imaging device of the third embodiment.
  • the configuration of the solid-state imaging device 30 of the third embodiment is the same as that of the solid-state imaging device 10 of the first embodiment shown in FIGS. 1 to 4 except that the number of stacked substrates is three. It is the composition. That is, in the solid-state imaging device 30 of the third embodiment, the positions of the components arranged in the respective substrates constitute the solid-state imaging device 10 of the first embodiment shown in FIGS.
  • each component arranged on each substrate can be considered in the same manner. Therefore, in the following description, detailed description regarding the position of each component arranged in each substrate constituting the solid-state imaging device 30 of the third embodiment is omitted.
  • the same components as those of the solid-state imaging device 10 of the first embodiment are the same as those of the solid-state imaging device 10 in the respective components of the solid-state imaging device 30 of the third embodiment.
  • the detailed description regarding each component is abbreviate
  • the first substrate 11 and the second substrate 12 are joined by the connection layer 13, and the second substrate 12 and the third substrate 33 are joined by the connection layer 34.
  • the first unit pixel in the first pixel array unit 111 disposed on the first substrate 11 and the second unit pixel in the second pixel array unit 121 disposed on the second substrate 12 are illustrated.
  • Part of the structure of the area of the unit pixels and the pixels (hereinafter referred to as “third unit pixels”) configured in a third pixel array section (not shown) disposed on the third substrate 33 Is shown.
  • the position of the first unit pixel disposed in the first pixel array unit 111 of the first substrate 11 and the second The position of the second unit pixel arranged in the second pixel array part 121 of the substrate 12 is the same as the position of the third unit pixel arranged in the third pixel array part of the third substrate 33. It is arrange
  • the first unit pixel, the second unit pixel, and the third unit pixel are not distinguished, they are simply referred to as “unit pixels”.
  • the first substrate 11 includes a microlens 1111, a color filter 1112, a transparent resin layer 1113, a light shielding film 1114, a silicon oxide film 1115, a first antireflection film 1116, and a first semiconductor layer 1117. And a metal wiring layer 1120.
  • the second substrate 12 bonded to the first substrate 11 by the connection layer 13 includes a transparent resin layer 1217, a light shielding film 1218, a third antireflection film 1213, a second semiconductor layer 1215, And a metal wiring layer 1211.
  • the second substrate 12 has a configuration similar to that of the back-illuminated CMOS solid-state imaging device. Even if the configuration of the second substrate 12 is the same as that of the front-illuminated CMOS solid-state imaging device or the CCD-type solid-state imaging device (including the front-illuminated type and the back-illuminated type), the same applies. Can think.
  • the third substrate 33 bonded to the second substrate 12 by the connection layer 34 is constituted by the metal wiring layer 3311 and the third semiconductor layer 3315.
  • the third substrate 33 has the same configuration as that of the surface irradiation type CMOS solid-state imaging device is shown. Even if the configuration of the third substrate 33 is the same as that of the backside illumination type CMOS solid-state imaging device or the CCD type solid-state imaging device (including the frontside illumination type and the backside illumination type), the same applies. Can think.
  • the configuration of the first substrate 11 is the same as the configuration of the first substrate 11 in the solid-state imaging device 10 of the first embodiment. Therefore, detailed description regarding the first substrate 11 is omitted.
  • the microlens 1111 is formed so as to collect the incident first light beam between the second semiconductor layer 1215 and the third semiconductor layer 3315, for example. Also good.
  • the transparent resin layer 1217 is a layer that flattens the surface on which light is incident on the second substrate 12, similarly to the transparent resin layer 1113 formed on the first substrate 11.
  • the light shielding film 1218 shields light between adjacent second unit pixels in the second substrate 12, similarly to the light shielding film 1114 formed on the first substrate 11.
  • the third antireflection film 1213 allows the second light beam that has been transmitted through the first semiconductor layer 1117 in the first substrate 11 to enter the second semiconductor layer 1215 with a predetermined spectral transmission characteristic.
  • the surface in contact with the second semiconductor layer 1215 hereinafter, this surface is also referred to as “third surface”. It is a film to be formed.
  • the third antireflection film 1213 has the same spectral transmission characteristics as the second antireflection film 1119, that is, the respective spectral transmittances of the third antireflection film 1213 and the second antireflection film 1119. It is desirable that the peaks of are the same.
  • the difference in spectral transmission characteristics (peak of spectral transmittance) between the third antireflection film 1213 and the second antireflection film 1119 is, for example, A difference of ⁇ 5% or less can be considered to have the same spectral transmission characteristic (peak of spectral transmittance).
  • a silicon oxide film may be formed.
  • the second semiconductor layer 1215 transmits through the first substrate 11 from the third surface.
  • a second unit pixel such as a second photoelectric conversion unit 1214 that converts the incident second light beam into a second pixel signal is formed.
  • the second semiconductor layer 1215 transmits a part of the second light beam incident from the third surface, and is a surface opposite to the third surface (hereinafter referred to as “fourth surface”).
  • the second light beam that is transmitted through the second semiconductor layer 1215 and emitted is referred to as a “third light beam”.
  • the metal wiring layer 1211 in the second substrate 12 in the solid-state imaging device 10 of the first embodiment is disposed between the constituent elements of the second unit pixel or in the second substrate 12.
  • a metal wiring such as a metal wiring 1212 for connecting the respective constituent elements to be arranged is formed.
  • a fourth antireflection film 1216 is also formed on the metal wiring layer 1211.
  • the fourth antireflection film 1216 is used to reduce the reflection of the third light beam transmitted through the second semiconductor layer 1215 and reflected at the interface of the second semiconductor layer 1215. This is a film formed on the fourth surface in contact with 1215.
  • the fourth antireflection film 1216 is emitted through the second semiconductor layer 1215.
  • the third light beam is formed of a material and a film thickness selected so as to be incident on the third semiconductor layer 3315 with a predetermined spectral transmission characteristic.
  • the material for forming the fourth antireflection film 1216 is the same material even if it is a different material from the first antireflection film 1116, the second antireflection film 1119, or the third antireflection film 1213. There may be.
  • the metal wiring layer 3311 is arranged between the constituent elements of the third unit pixel configured in the third pixel array unit (not shown) arranged on the third substrate 33 or in the third substrate 33. This is a layer in which metal wiring for connecting the respective constituent elements is formed. In the configuration of the solid-state imaging device 30 illustrated in FIG. 6, the case where the metal wiring 3312 is formed in the metal wiring layer 3311 is illustrated. The respective circuit elements constituting the respective constituent elements arranged on the third substrate 33 are connected by the respective metal wirings 3312 formed in the metal wiring layer 3311.
  • a fifth antireflection film 3313 is also formed on the metal wiring layer 3311.
  • the fifth antireflection film 3313 is formed of the third light beam that is incident through the first semiconductor layer 1117 in the first substrate 11 and the second semiconductor layer 1215 in the second substrate 12. This film is formed on a surface in contact with the third semiconductor layer 3315 (hereinafter referred to as a “fifth surface”) in order to reduce reflection at the interface of the third semiconductor layer 3315.
  • the fifth antireflection film 3313 is also the first semiconductor layer.
  • the material for forming the fifth antireflection film 3313 is a material different from that of the first antireflection film 1116, the second antireflection film 1119, the third antireflection film 1213, or the fourth antireflection film 1216. Or the same material.
  • the fifth antireflection film 3313 has the same spectral transmission characteristics as the fourth antireflection film 1216, that is, the respective spectral transmittances of the fifth antireflection film 3313 and the fourth antireflection film 1216. It is desirable that the peaks of are the same.
  • the difference in spectral transmission characteristics (peak of spectral transmittance) between the fifth antireflection film 3313 and the fourth antireflection film 1216 is, for example, A difference of ⁇ 5% or less can be considered to have the same spectral transmission characteristic (peak of spectral transmittance).
  • the third semiconductor layer 3315 is a semiconductor layer forming a component of the third unit pixel.
  • the third unit pixel is configured in the third semiconductor layer 3315, and the fifth surface is transmitted through the first substrate 11 and the second substrate 12.
  • a case is shown in which a photoelectric conversion unit (hereinafter referred to as “third photoelectric conversion unit”) 3314 that converts the third light beam incident from is converted into an electrical signal (third pixel signal) is formed.
  • the third photoelectric conversion unit 3314 formed in the third semiconductor layer 3315 the third light beam that has passed through the first substrate 11 and the second substrate 12 and entered is converted into a third pixel signal. Converted.
  • the solid-state imaging device includes a third photoelectric conversion unit (converting the third light beam that has been transmitted through the second substrate 12 and converted into an electrical signal)
  • a third substrate third substrate 33 having a third semiconductor layer (third semiconductor layer 3315) on which the third photoelectric conversion unit 3314) is formed is further provided.
  • the second substrate 12 is a surface opposite to the third surface where the second light beam incident on the second semiconductor layer 1215 is transmitted through the second semiconductor layer 1215 and emitted as a third light beam.
  • a fourth antireflection film (fourth antireflection film 1216) that is formed in contact with the fourth surface and reduces the reflection of the third light beam on the fourth surface.
  • the third substrate 33 is formed in contact with the fifth surface which is the surface on the third semiconductor layer 3315 where the third light beam is incident, and the reflection of the third light beam on the fifth surface is reduced.
  • a fifth antireflection film (fifth antireflection film 3313) is provided.
  • the wavelength with the highest spectral transmittance of the fourth antireflection film 1216 is the same as the wavelength with the highest spectral transmittance of the fifth antireflection film 3313.
  • the first light beam incident on the solid-state imaging device 30 having such a configuration is, for example, formed between the second semiconductor layer 1215 and the third semiconductor layer 3315 by the microlens 1111 formed on the first substrate 11.
  • the light is collected in between, passes through each of the color filter 1112, the transparent resin layer 1113, the silicon oxide film 1115, and the first antireflection film 1116, and enters the first semiconductor layer 1117.
  • the first light beam incident on the first semiconductor layer 1117 is partly absorbed by the first photoelectric conversion unit 1118 and converted into a first pixel signal, and a part of the first light beam is absorbed.
  • One light beam passes through the first semiconductor layer 1117 and is emitted to the metal wiring layer 1120.
  • the emitted first light beam passes through the metal wiring layer 1120 (including the second antireflection film 1119) and the connection layer 13, and is incident on the second substrate 12 as the second light beam. .
  • the second light beam passes through each of the transparent resin layer 1217 and the third antireflection film 1213 and is incident on the second semiconductor layer 1215, and a part of the second light beam is input by the second photoelectric conversion unit 1214.
  • the emitted second light beam passes through the metal wiring layer 1211 (including the fourth antireflection film 1216) and the connection layer 34, and is incident on the third substrate 33 as the third light beam. . Then, the third light beam passes through the metal wiring layer 3311 (including the fifth antireflection film 3313), enters the third semiconductor layer 3315, is absorbed by the third photoelectric conversion unit 3314, and is absorbed. 3 pixel signal.
  • the antireflection film is formed on both surfaces (the first surface and the second surface) of the first semiconductor layer 1117 in the first substrate 11.
  • the third reflection is applied to the surface (third surface) on the side where the second light beam enters the second semiconductor layer 1215 in the second substrate 12.
  • a fourth antireflection film 1216 is formed on the surface (fourth surface) of the second semiconductor layer 1215 on the side from which the third light beam transmitted through the second semiconductor layer 1215 is emitted. .
  • the antireflection film is also formed on both surfaces (third surface and fourth surface) of the second semiconductor layer 1215 in the second substrate 12. Furthermore, in the solid-state imaging device 30 of the third embodiment, the third substrate 33 on the side where the third light beam that has passed through each of the first substrate 11 and the second substrate 12 is incident on the third substrate 33. A fifth antireflection film 3313 is also formed on the surface (fifth surface) of the semiconductor layer 3315. As a result, in the solid-state imaging device 30 of the third embodiment, the first light beam that is transmitted through the first substrate 11 that is the first stage semiconductor substrate on which the first light beam is incident and the second light beam is emitted.
  • a sufficient second light beam can be delivered to the second unit pixel formed on the second substrate 12.
  • the second unit pixel can photoelectrically convert the second light beam with a sufficient amount of light and output a second pixel signal with an improved level.
  • the reflection of the third light beam at the interface of the fifth surface on the side where the third light beam enters the third substrate 33 is reduced, which is sufficient for the third unit pixel formed on the third substrate 33.
  • a third light beam can be delivered.
  • the third unit pixel can photoelectrically convert the third light beam with a sufficient amount of light and output a third pixel signal with an improved level.
  • the solid-state imaging device 30 of the third embodiment can improve sensitivity.
  • the spectral transmission characteristics (peak of spectral transmittance) in each antireflection film are not particularly defined.
  • the spectral transmission characteristics (peaks of spectral transmittance) of the respective antireflection films by defining the spectral transmission characteristics (peaks of spectral transmittance) of the respective antireflection films, The wavelength of the first light beam photoelectrically converted by the first unit pixel, the wavelength of the second light beam photoelectrically converted by the second unit pixel, and the wavelength of the third light beam photoelectrically converted by the third unit pixel. Can be of different wavelengths.
  • the first antireflection film 1116 transmits the visible light region evenly
  • the second antireflection film 1119 and the third antireflection film 1213 transmit the entire region from the blue to the long wavelength side in the visible light region.
  • the transmittance (spectral transmittance) with respect to the wavelength of each light beam is transmitted so that the fourth antireflection film 1216 and the fifth antireflection film 3313 transmit the green to long wavelength region in the visible light region evenly.
  • Each optimized antireflection film can also be formed. Thereby, in the solid-state imaging device 30, it can be set as the structure which photoelectrically converts the light of a 1st unit pixel being blue, a 2nd unit pixel being green, and a 3rd unit pixel being red.
  • the first photoelectric conversion unit 1118 formed in the first semiconductor layer 1117 in the first substrate 11 is used.
  • the structure in which the second photoelectric conversion portion 1214 is formed in the second semiconductor layer 1215 in the second substrate 12 corresponding to each is shown.
  • the third photoelectric conversion is performed on the third semiconductor layer 3315 in the third substrate 33 corresponding to each of the second photoelectric conversion units 1214.
  • a configuration for forming the portion 3314 is shown. That is, the case where each unit pixel formed in the semiconductor layer in each substrate has a one-to-one correspondence has been described.
  • the unit pixel formed on the lower substrate is not limited to the structure formed so as to correspond to the unit pixel formed on the upper substrate.
  • the second unit pixel formed on the second substrate 12 is formed so as to correspond to the plurality of first unit pixels formed on the first substrate 11, and is formed on the third substrate 33.
  • the three unit pixels may be formed so as to correspond to the plurality of second unit pixels formed on the second substrate 12.
  • the second unit pixel outputs the second pixel signal in which the number of pixels of the first unit pixel is reduced, that is, the resolution of the first pixel signal is lowered, and the third unit pixel,
  • the solid-state imaging device 30 that outputs the third pixel signal in which the number of pixels of one unit pixel is further reduced, that is, the resolution of the first pixel signal is further reduced, can be realized.
  • FIG. 7 is a cross-sectional view showing the structure of the solid-state imaging device according to the fourth embodiment.
  • the first substrate 11 and the second substrate 42 are joined by the connection layer 13.
  • one second unit pixel corresponding to the two first unit pixels formed on the first substrate 11 is the second substrate. 42 is formed.
  • the configuration of the solid-state imaging device 40 of the fourth embodiment is the same as that of the first embodiment shown in FIGS.
  • the solid-state imaging device 40 according to the fourth embodiment has a configuration in which the second substrate 12 constituting the solid-state imaging device 10 according to the first embodiment is replaced with the second substrate 42.
  • the positions of the constituent elements arranged in the respective substrates are the respective substrates constituting the solid-state imaging device 10 of the first embodiment shown in FIGS. 2 and 3. It can be considered in the same way as the position of each component to be arranged. Therefore, in the following description, a detailed description regarding the position of each component arranged in each substrate constituting the solid-state imaging device 40 of the fourth embodiment is omitted.
  • FIG. 7 shows a first unit pixel in the first pixel array unit 111 arranged on the first substrate 11 and a second pixel array unit (not shown) arranged on the second substrate 42. Part of the structure of the area with the second unit pixel is shown.
  • the solid-state imaging device 40 the plurality of first unit pixels arranged in the first pixel array unit 111 of the first substrate 11 and the second pixel array unit of the second substrate 42 are arranged. The corresponding second unit pixels are arranged so as to have the same position.
  • the first unit pixel and the second unit pixel are not distinguished, they are simply referred to as “unit pixel”.
  • the first substrate 11 includes a microlens 1111, a color filter 1112, a transparent resin layer 1113, a light shielding film 1114, a silicon oxide film 1115, a first antireflection film 1116, and a first semiconductor layer 1117. And a metal wiring layer 1120.
  • the configuration of the first substrate 11 is the same as the configuration of the first substrate 11 in the solid-state imaging device 10 of the first embodiment. Therefore, detailed description regarding the first substrate 11 is omitted.
  • the second substrate 42 bonded to the first substrate 11 by the connection layer 13 is constituted by the metal wiring layer 4211 and the second semiconductor layer 4215.
  • the second substrate 42 has a configuration similar to that of the surface irradiation type CMOS solid-state imaging device. Even if the configuration of the second substrate 42 is the same as that of the backside illumination type CMOS solid-state imaging device or the CCD type solid-state imaging device (including the frontside illumination type and the backside illumination type), the same applies. Can think.
  • the metal wiring layer 4211 is arranged between the constituent elements of the second unit pixel configured in the second pixel array unit (not shown) arranged on the second substrate 42 or in the second substrate 42. This is a layer in which metal wiring for connecting the respective constituent elements is formed.
  • the metal wiring 4212 is formed in the metal wiring layer 4211 in the configuration of the solid-state imaging device 40 illustrated in FIG. 7, a case where the metal wiring 4212 is formed in the metal wiring layer 4211 is illustrated.
  • the respective circuit elements constituting the respective constituent elements arranged on the second substrate 42 are connected by the respective metal wirings 4212 formed in the metal wiring layer 4211.
  • a third antireflection film 4213 is also formed on the metal wiring layer 4211.
  • the third antireflection film 4213 is the same as the third antireflection film 1213 formed on the metal wiring layer 1211 in the second substrate 12 in the solid-state imaging device 10 of the first embodiment.
  • This surface is also a film formed on the “third surface”.
  • the third antireflection film 4213 also has a predetermined second light beam that is transmitted through the first semiconductor layer 1117.
  • the third antireflection film 4213 may be a material different from the first antireflection film 1116 or the second antireflection film 1119 or the same material. However, it is desirable that the third antireflection film 4213 has the same spectral transmission characteristic as that of the second antireflection film 1119.
  • the difference in spectral transmission characteristics (peak of spectral transmittance) between the third antireflection film 4213 and the second antireflection film 1119 is, for example, A difference of ⁇ 5% or less can be considered to have the same spectral transmission characteristic (peak of spectral transmittance).
  • the second semiconductor layer 4215 is a semiconductor layer that forms a component of the second unit pixel.
  • the second unit pixel is configured in the second semiconductor layer 4215, and the second unit light transmitted through the first substrate 11 and incident from the third surface.
  • a photoelectric conversion unit (hereinafter referred to as “second photoelectric conversion unit”) 4214 that converts the light beam into an electrical signal (second pixel signal) is formed.
  • the second photoelectric conversion unit 4214 formed in the second semiconductor layer 4215 converts the second light beam that has entered through the first substrate 11 and converted into a second pixel signal.
  • the second photoelectric conversion unit 4214 is formed to correspond to the two first photoelectric conversion units 1118 formed in the first semiconductor layer 1117 of the first substrate 11. For this reason, the second pixel signal output by photoelectric conversion of each of the second photoelectric conversion units 4214 is converted into each first photoelectric conversion formed in the first semiconductor layer 1117 of the first substrate 11.
  • the pixel signal is obtained by reducing the resolution of the first pixel signal output from the unit 1118 to 1 ⁇ 2.
  • the area of the light receiving surface where the second photoelectric conversion unit 4214 receives the second light beam is larger than the area of the light receiving surface where the first photoelectric conversion unit 1118 receives the first light beam. For this reason, each of the second photoelectric conversion units 4214 may receive more second light rays that have been transmitted through the first substrate 11 and output a second pixel signal with an improved level. it can.
  • the first light beam incident on the solid-state imaging device 40 having such a configuration is, for example, formed between the first semiconductor layer 1117 and the second semiconductor layer 4215 by the microlens 1111 formed on the first substrate 11.
  • the light is collected in between, passes through each of the color filter 1112, the transparent resin layer 1113, the silicon oxide film 1115, and the first antireflection film 1116, and enters the first semiconductor layer 1117.
  • the first light beam incident on the first semiconductor layer 1117 is partly absorbed by the first photoelectric conversion unit 1118 and converted into a first pixel signal, and a part of the first light beam is absorbed.
  • One light beam passes through the first semiconductor layer 1117 and is emitted to the metal wiring layer 1120.
  • the emitted first light beam passes through the metal wiring layer 1120 (including the second antireflection film 1119) and the connection layer 13, and enters the second substrate 42 as the second light beam. . Then, the second light beam passes through the metal wiring layer 4211 (including the third antireflection film 4213), is incident on the second semiconductor layer 4215, and is absorbed by the second photoelectric conversion unit 4214. 2 pixel signal.
  • the antireflection film is formed on both surfaces (the first surface and the second surface) of the first semiconductor layer 1117 in the first substrate 11. Form. Further, in the solid-state imaging device 40 of the fourth embodiment, the surface of the second semiconductor layer 4215 on the side on which the second light beam transmitted through the first substrate 11 is incident on the second substrate 42 (third). The third antireflection film 4213 is also formed on the surface. Thereby, in the solid-state imaging device 40 according to the fourth embodiment, the first light beam that is transmitted through the first substrate 11 that is the first stage semiconductor substrate on which the first light beam is incident and the second light beam is emitted.
  • a sufficient second light beam can be delivered to the second unit pixel formed on the second substrate 42.
  • the second unit pixel can photoelectrically convert the second light beam with a sufficient amount of light and output a second pixel signal with an improved level.
  • the solid-state imaging device 40 according to the fourth embodiment can improve sensitivity.
  • one second corresponding to the two first photoelectric conversion units 1118 formed in the first semiconductor layer 1117 of the first substrate 11 is used.
  • the photoelectric conversion unit 4214 is formed in the second semiconductor layer 4215 of the second substrate 42. That is, in the solid-state imaging device 40 according to the fourth embodiment, one second unit pixel corresponding to two first unit pixels arranged on the first substrate 11 is provided on the second substrate 42. Deploy. Thereby, in the solid-state imaging device 40 of the fourth embodiment, it is possible to increase the number of second light rays that are transmitted through the first substrate 11 and incident on the second photoelectric conversion unit 4214. The level of the second pixel signal output from the unit pixel can be further improved. Thereby, the solid-state imaging device 40 of the fourth embodiment can further improve the sensitivity of the second unit pixel.
  • first unit pixels are set as one set, and one second unit pixel corresponding to the one set is arranged on the second substrate 42.
  • the case of (forming) has been described.
  • the number of first unit pixels included in one set corresponding to one second unit pixel arranged (formed) on the second substrate 42 is the same as that of the solid-state imaging device 40 of the fourth embodiment.
  • the configuration is not limited. For example, four predetermined first unit pixels formed adjacent to each other vertically and horizontally on the first substrate 11 are set as one set, and one second unit pixel corresponding to the set. Can be arranged (formed) on the second substrate 42.
  • the second pixel signal further reduces the resolution of the first pixel signal.
  • the second unit pixel can increase the area of the light receiving surface of the second photoelectric conversion unit 4214, and the second pixel whose level is improved by receiving more incident second light rays.
  • a signal can be output.
  • one second unit pixel is determined based on the spectral transmission characteristics of the first light beam transmitted by the color filter 1112 such that the center of gravity of the color transmitted by the color filter 1112 does not shift. It is desirable to define a corresponding first unit pixel.
  • the spectral transmission characteristic (peak of spectral transmittance) in each antireflection film is not particularly defined.
  • the spectral transmission characteristics (peaks of spectral transmittance) of the respective antireflection films by defining the spectral transmission characteristics (peaks of spectral transmittance) of the respective antireflection films, The wavelength of the first light beam that is photoelectrically converted by the first unit pixel may be different from the wavelength of the second light beam that is photoelectrically converted by the second unit pixel.
  • connection electrode portion may have a microbump structure. That is, the micro bump structure formed at the position where each component is arranged, not through the connection electrode part of the TSV structure formed within the connection electrode array part 115 arranged at the same position on each substrate.
  • a configuration in which the respective constituent elements in the solid-state imaging device are electrically connected to each other via the connection electrode portion may be employed.
  • solid-state imaging device 50 the solid-state imaging device of the fifth embodiment
  • the configuration of the solid-state imaging device 50 of the fifth embodiment includes the same configuration as the solid-state imaging device 10 of the first embodiment shown in FIGS. Therefore, in the following description, the same components as those of the solid-state imaging device 10 of the first embodiment are the same as those of the solid-state imaging device 10 in the respective components of the solid-state imaging device 50 of the fifth embodiment.
  • the detailed description regarding each component is abbreviate
  • FIG. 8 is a plan view showing a schematic configuration of the first substrate in the solid-state imaging device 50 of the fifth embodiment.
  • the plan view of the first substrate 51 shown in FIG. 8 shows a plan view when viewed from the side where light enters the first substrate 51.
  • the first substrate 51 is a semiconductor substrate that converts an incident first light beam into an electric signal and outputs the electric signal.
  • a first pixel array unit 111, a first vertical scanning circuit 112, a first horizontal scanning circuit 113, and a bonding pad 114 are arranged on the first substrate 51. Further, the first light beam incident on the first substrate 51 is emitted as a second light beam from the surface opposite to the surface on which the light beam is incident.
  • substrate 51 is the same as that of the structure of each component arrange
  • substrate 51 is abbreviate
  • FIG. 9 is a plan view showing a schematic configuration of the second substrate in the solid-state imaging device 50 of the fifth embodiment.
  • the plan view of the second substrate 52 shown in FIG. 9 shows a plane when viewed from the side where the second light beam emitted from the first substrate 51 enters the second substrate 52.
  • the second substrate 52 is a semiconductor substrate that converts the second light beam emitted from the first substrate 51 into an electrical signal and outputs it.
  • a second pixel array unit 121, a second vertical scanning circuit 122, and a second horizontal scanning circuit 123 are disposed on the second substrate 52.
  • Each component arranged on the second substrate 52 is the same as the configuration of each component arranged on the second substrate 12 in the solid-state imaging device 10 of the first embodiment. Therefore, a detailed description of each component arranged on the second substrate 52 is omitted.
  • the first substrate 11 and the second substrate 12 constituting the solid-state imaging device 10 of the first embodiment shown in FIGS. 2 and 3, and the first substrate 51 and the second substrate shown in FIGS. 8 and 9.
  • the first substrate 51 and the second substrate 52 are disposed on the first substrate 11 and the second substrate 12 of the first embodiment, respectively.
  • the connection electrode array unit 115 is not disposed. This is because the solid-state imaging device 50 is configured to electrically connect the first substrate 51 and the second substrate 52 via the connection electrode portion having a microbump structure.
  • FIG. 10 is a cross-sectional view showing the structure of the solid-state imaging device 50 according to the fifth embodiment. 10 shows the first unit pixel in the first pixel array unit 111 arranged on the first substrate 51 shown in FIG. 8 and the second unit 52 arranged on the second substrate 52 shown in FIG. A part of the structure of the area with the second unit pixel in the second pixel array unit 121 is shown. In the solid-state imaging device 50, the first substrate 51 and the second substrate 52 are joined by the connection layer 53.
  • substrate 52 may become the same position. Also in the solid-state imaging device 50 illustrated in FIG. 10, when the first unit pixel and the second unit pixel are not distinguished, they are simply referred to as “unit pixel”.
  • the first substrate 51 has the same configuration as that of the back-illuminated CMOS solid-state imaging device
  • the second substrate 52 has the same configuration as that of the front-illuminated CMOS solid-state imaging device. Shows the case.
  • the configurations of the first substrate 51 and the second substrate 52 are not limited to the configurations shown in FIG. 10 as in the solid-state imaging device 10 of the first embodiment. That is, the configuration of the first substrate 51 and the second substrate 52 is a CCD solid-state imaging device (a front-illumination type and a back-illumination type and a back-illumination type CMOS solid-state imaging device). Even if it is the same structure as a back irradiation type
  • the first substrate 51 includes a micro lens 1111, a color filter 1112, a transparent resin layer 1113, a light shielding film 1114, a silicon oxide film 1115, a first antireflection film 1116, and a first semiconductor layer 1117. And a metal wiring layer 5120.
  • the connection layer 53 that joins the first substrate 51 and the second substrate 52 includes the connection electrode 531 and the insulating portion 532.
  • the second substrate 52 bonded to the first substrate 51 by the connection layer 53 includes a metal wiring layer 5211 and a second semiconductor layer 1215.
  • micro lens 1111 the color filter 1112, the transparent resin layer 1113, the light shielding film 1114, the silicon oxide film 1115, the first antireflection film 1116, and the first semiconductor layer 1117 Since it is the same as the corresponding component (film
  • the metal wiring layer 5120 is a layer in which metal wiring for connecting the constituent elements of the first unit pixels or the respective constituent elements arranged in the first substrate 51 is formed.
  • the metal wiring layer 5120 is connected to a micro bump for electrically connecting to the second substrate 52 formed on the outer surface opposite to the surface on which the first light beam is incident on the first substrate 51. It is also a layer on which metal wiring is formed.
  • FIG. 10 a case where the metal wiring 5121 is formed in the metal wiring layer 5120 is illustrated. A part of the metal wiring 5121 formed in the metal wiring layer 5120 connects circuit elements constituting the constituent elements arranged on the first substrate 51.
  • some of the metal wirings 5121 constitute constituent elements arranged on the first substrate 51 via the micro bumps formed on the first substrate 51 and the micro bumps formed on the second substrate 52.
  • the circuit elements to be connected to the circuit elements constituting the constituent elements arranged on the second substrate 52 are connected.
  • the second antireflection film 1119 is also formed on the second surface of the metal wiring layer 5120 that is in contact with the first semiconductor layer 1117.
  • the second antireflection film 1119 is the same as the second antireflection film 1119 formed on the metal wiring layer 1120 in the first substrate 11 in the solid-state imaging device 10 of the first embodiment. A detailed description of the second antireflection film 1119 is omitted.
  • the connection electrode 531 is an electrode formed by joining the micro bumps formed on the first substrate 51 and the micro bumps formed on the second substrate 52.
  • the components arranged on the first substrate 51 and the second substrate 52 joined to each other transmit and receive electric signals via the connection electrode 531.
  • the connection electrode 531 is a first photoelectric conversion unit 1118 formed in the first semiconductor layer 1117 of the first substrate 51 when viewed from the side on which the first light ray enters the solid-state imaging device 50.
  • the insulating unit 532 insulates the connection electrodes 531 formed by connecting the micro bumps formed on the first substrate 51 and the micro bumps formed on the second substrate 52.
  • the insulating part 532 is formed, for example, by filling a space existing between the connection electrodes 531 with an insulating member such as an adhesive.
  • the metal wiring layer 5211 is a layer in which metal wirings for connecting the components of the second unit pixel or the components arranged in the second substrate 52 are formed. Further, the metal wiring layer 5211 is formed on the outer surface on the side where the second light beam incident on the solid-state imaging device 50 and transmitted through the first semiconductor layer 1117 enters the second substrate 52. It is also a layer in which metal wiring connected to the micro bumps for electrical connection with the first substrate 51 is formed. In the configuration of the solid-state imaging device 50 illustrated in FIG. 10, the case where the metal wiring 5212 is formed in the metal wiring layer 5211 is illustrated. A part of the metal wiring 5212 formed in the metal wiring layer 5211 connects circuit elements constituting the constituent elements arranged on the second substrate 52.
  • some of the metal wirings 5212 constitute components disposed on the second substrate 52 via the micro bumps formed on the second substrate 52 and the micro bumps formed on the first substrate 51.
  • the circuit elements to be connected to the circuit elements constituting the components arranged on the first substrate 51 are connected.
  • the third antireflection film 1213 is also formed on the third surface of the metal wiring layer 5211 that is in contact with the second semiconductor layer 1215.
  • the third antireflection film 1213 is the same as the third antireflection film 1213 formed on the metal wiring layer 1211 in the second substrate 12 in the solid-state imaging device 10 of the first embodiment.
  • the detailed description of the antireflection film 1213 is omitted.
  • the second semiconductor layer 1215 is the same as the second semiconductor layer 1215 constituting the second substrate 12 in the solid-state imaging device 10 of the first embodiment. Omitted.
  • the first light beam incident on the solid-state imaging device 50 having such a configuration is, for example, formed between the first semiconductor layer 1117 and the second semiconductor layer 1215 by the microlens 1111 formed on the first substrate 51.
  • the light is collected in between, passes through each of the color filter 1112, the transparent resin layer 1113, the silicon oxide film 1115, and the first antireflection film 1116, and enters the first semiconductor layer 1117.
  • the first light beam incident on the first semiconductor layer 1117 is partly absorbed by the first photoelectric conversion unit 1118 and converted into a first pixel signal, and a part of the first light beam is absorbed.
  • One light beam passes through the first semiconductor layer 1117 and is emitted to the metal wiring layer 5120.
  • the emitted first light beam passes through the metal wiring layer 5120 (including the second antireflection film 1119) and the region of the insulating portion 532 of the connection layer 53, and the second light beam is the second light beam. Incident on the substrate 52. Then, the second light beam passes through the metal wiring layer 5211 (including the third antireflection film 1213), is incident on the second semiconductor layer 1215, and is absorbed by the second photoelectric conversion unit 1214. 2 pixel signal.
  • the antireflection film is formed on both surfaces (first surface and second surface) of the first semiconductor layer 1117 in the first substrate 51.
  • the surface of the second semiconductor layer 1215 on the side where the second light beam that has passed through the first substrate 51 is incident on the second substrate 52 (third The third antireflection film 1213 is also formed on the surface.
  • the second unit pixel can photoelectrically convert the second light beam with a sufficient amount of light and output a second pixel signal with an improved level.
  • the sensitivity can be improved as in the solid-state imaging device 10 of the first embodiment.
  • the spectral transmission characteristics (spectral transmittance peak) in each antireflection film are not particularly defined.
  • the spectral transmission characteristics (peaks of spectral transmittance) of the respective antireflection films similarly to the solid-state imaging device 20 according to the second embodiment, by defining the spectral transmission characteristics (peaks of spectral transmittance) of the respective antireflection films.
  • the wavelength of the first light beam that is photoelectrically converted by the first unit pixel may be different from the wavelength of the second light beam that is photoelectrically converted by the second unit pixel.
  • the configuration in which the two substrates of the first substrate 51 and the second substrate 52 are stacked has been described.
  • the number of substrates to be stacked is not limited to two, and a configuration in which a larger number of substrates are stacked can be considered in the same manner as the solid-state imaging device 30 of the third embodiment shown in FIG.
  • the solid-state imaging device having a configuration in which the semiconductor substrates on which the photoelectric conversion units are formed are stacked in a plurality of stages, they are arranged on the light incident side, Antireflection films are formed on both sides of the semiconductor layer of the substrate that transmits and emits incident light rays.
  • emits the incident light ray is reduced, and it transmits to the semiconductor layer of the other board
  • the photoelectric conversion unit formed in the semiconductor layer of the other substrate on which the transmitted light beam is incident can photoelectrically convert the light beam with sufficient light quantity, and the level of the electrical signal after the photoelectric conversion can be reduced. And the sensitivity of the solid-state imaging device can be improved.
  • an antireflection film is also formed on a semiconductor layer of a substrate on which a light beam transmitted through another substrate is incident.
  • the spectral transmission characteristics spectral transmittance of the antireflection film formed on the surface on the side of emitting the light transmitted through another substrate that transmits and emits the incident light.
  • the spectral transmission characteristic (peak of spectral transmittance) of the antireflection film formed on the surface on which the light beam is incident on the substrate on which the light beam emitted from the other substrate is incident is the same spectral transmission characteristic ( Spectral transmittance peak).
  • the photoelectric conversion unit formed on the semiconductor layer of the substrate on which the transmitted light beam is incident can further photoelectrically convert the light beam with sufficient light quantity, and the level of the electric signal converted photoelectrically can be reduced. Further improvement can further improve the sensitivity of the solid-state imaging device.
  • an image pickup apparatus equipped with a solid-state image pickup apparatus can generate (capture) an image with good image quality based on an electrical signal with improved sensitivity.
  • the configuration of the solid-state imaging device in which a plurality of substrates are electrically connected has been described.
  • the configuration of the solid-state imaging device is not limited to the configuration shown in the embodiment for carrying out the present invention.
  • a plurality of substrates that output pixel signals are stacked, but each stacked substrate is not electrically connected, and each substrate operates independently, that is, separately from each substrate.
  • the concept of the present invention can be applied to a configuration in which a pixel signal is read out.
  • the photoelectric conversion units formed on the second and subsequent semiconductor substrates are The electric signal to be generated can be improved.
  • Solid-state imaging device 11 51 First substrate 111 First pixel array unit (pixel, pixel unit) DESCRIPTION OF SYMBOLS 1111 Micro lens 1112 Color filter 1113 Transparent resin layer 1114 Light shielding film 1115 Silicon oxide film 1116 1st antireflection film 1117 1st semiconductor layer 1118 1st photoelectric conversion part 1119 2nd antireflection film 1120, 5120 Metal wiring layer 1121, 5121 Metal wiring 112 First vertical scanning circuit 113 First horizontal scanning circuit 114 Bonding pad 115 Connection electrode array section (connection electrode section) 12, 42, 52 Second substrate 121 Second pixel array section (pixel, pixel section) 1211, 4211, 5211 Metal wiring layer 1212, 4212, 5212 Metal wiring 1213, 4213 Third antireflection film 1214, 4214 Second photoelectric conversion unit 1215, 4215 Second semiconductor layer 1216 Fourth antireflection film 1217 Transparent Resin layer 1218 Shielding film 122 Second vertical scanning circuit 123 Second horizontal scanning circuit 13 Connection layer (connection electrode portion) 33 third

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  • Electromagnetism (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
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Abstract

La présente invention concerne un dispositif d'imagerie à semi-conducteurs pourvu : d'un premier substrat comportant une première couche semi-conductrice au niveau de laquelle est formée une première unité de conversion photoélectrique qui convertit des premiers rayons lumineux entrant en un signal électrique ; et d'un second substrat comportant une seconde couche semi-conductrice au niveau de laquelle est formée une seconde unité de conversion photoélectrique qui convertit des seconds rayons lumineux, qui sont entrant après avoir traversé le premier substrat, en un signal électrique. Le premier substrat est pourvu : d'un premier film antireflet formé en contact avec une première surface qui est la surface située du côté entrée des premiers rayons lumineux vers la première couche semi-conductrice ; et d'un second film antireflet formé en contact avec une seconde surface qui est la surface située du côté opposé de la première surface et de laquelle les premiers rayons lumineux ayant traversé la première couche semi-conductrice sortent en tant que seconds rayons lumineux.
PCT/JP2015/051650 2014-03-28 2015-01-22 Dispositif d'imagerie à semi-conducteurs WO2015146253A1 (fr)

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