WO2015139464A1 - 微波炉的半导体微波发生器连接结构、微波炉的半导体微波发生器输入输出连接结构和微波炉 - Google Patents

微波炉的半导体微波发生器连接结构、微波炉的半导体微波发生器输入输出连接结构和微波炉 Download PDF

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Publication number
WO2015139464A1
WO2015139464A1 PCT/CN2014/090741 CN2014090741W WO2015139464A1 WO 2015139464 A1 WO2015139464 A1 WO 2015139464A1 CN 2014090741 W CN2014090741 W CN 2014090741W WO 2015139464 A1 WO2015139464 A1 WO 2015139464A1
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WO
WIPO (PCT)
Prior art keywords
microwave
semiconductor
connection structure
microwave oven
microwave generator
Prior art date
Application number
PCT/CN2014/090741
Other languages
English (en)
French (fr)
Inventor
张斐娜
唐相伟
杜贤涛
Original Assignee
广东美的厨房电器制造有限公司
美的集团股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from CN201420128429.4U external-priority patent/CN203757795U/zh
Priority claimed from CN201420128629.XU external-priority patent/CN203757796U/zh
Priority claimed from CN201420128662.2U external-priority patent/CN203757797U/zh
Priority claimed from CN201410105584.9A external-priority patent/CN103912900A/zh
Application filed by 广东美的厨房电器制造有限公司, 美的集团股份有限公司 filed Critical 广东美的厨房电器制造有限公司
Priority to JP2016557039A priority Critical patent/JP6487936B2/ja
Priority to EP14886039.8A priority patent/EP3121519B1/en
Priority to CA2942672A priority patent/CA2942672C/en
Priority to US15/126,559 priority patent/US10575373B2/en
Publication of WO2015139464A1 publication Critical patent/WO2015139464A1/zh

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B6/00—Heating by electric, magnetic or electromagnetic fields
    • H05B6/64—Heating using microwaves
    • H05B6/66—Circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B6/00—Heating by electric, magnetic or electromagnetic fields
    • H05B6/64—Heating using microwaves
    • H05B6/70—Feed lines
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02B—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS
    • Y02B40/00—Technologies aiming at improving the efficiency of home appliances, e.g. induction cooking or efficient technologies for refrigerators, freezers or dish washers

Definitions

  • the present invention relates to the field of household appliances, and more particularly to a semiconductor microwave generator connection structure for a microwave oven and a microwave oven including the semiconductor microwave generator connection structure, and a semiconductor microwave generator input/output connection for a microwave oven A microwave oven having a structure and an input/output connection junction of the semiconductor microwave generator, and a semiconductor microwave generator connection structure for a microwave oven and a microwave oven including the semiconductor microwave generator connection structure.
  • the semiconductor microwave generator 10' connection structure of the current microwave oven is mainly provided with a microwave output port on the side of the microwave generator 10', and the microwave output device such as the RF connector 20' is connected to the side and from the PCB.
  • the board printed circuit board leads to the microwave signal.
  • the microwave signal from the microwave generator 10' from the microwave generator 10' needs to be transmitted to the microwave feeding device by direct connection or cable connection, and finally to the waveguide box.
  • the microwave of the microwave oven used in the prior art is mainly fed from the top, bottom, left side, right side, etc. of the cooking cavity 30', and the RF connector 20' is connected to the microwave generator 10'.
  • the side surface makes the maximum distance between the microwave generator 10' and the cooking cavity 30' larger, that is, the L value is larger, which leads to an increase in the volume of the microwave oven, thereby limiting the structural design and the shape of the microwave oven, thereby increasing the microwave oven. Manufacturing costs.
  • the prior art realizes microwave transmission by using a cable connection between the waveguide box and the microwave generator 10', so that although the volume of the microwave oven can be reduced, the transmission loss and the working time are increased, at a predetermined heating time. Inside, it may result in insufficient heating of the food; and in mass production, it leads to low production efficiency.
  • Microwave ovens are commonly used appliances for heating or cooking.
  • the principle is to use microwaves to make water molecules of food.
  • a high frequency oscillation is generated, thereby rubbing heat to heat or cook the food.
  • the traditional microwave oven includes a power supply, a transformer, a magnetron, a high voltage capacitor, a cavity, a furnace door, and the like.
  • the magnetron is a core component that generates microwaves, which are excited by a high voltage power source to generate microwaves, which are transmitted through a waveguide and coupled to a cavity in which food is placed.
  • the magnetic tube of the traditional microwave oven has a working voltage of 4,000 volts, and there is a safety hazard of power consumption, and the loss is large, and the shape of the microwave oven is also greatly limited.
  • the semiconductor microwave generator mainly includes a microwave signal generating circuit and a power amplifying circuit, and the microwave is extracted from the microwave generator through a connecting device and It is fed into the waveguide box in a certain way and finally transmitted evenly to the cavity.
  • the microwave generator is powered by a full DC low voltage, safe in use, low in loss, long in service life, and can diversify the shape of the microwave oven.
  • the semiconductor microwave generator connection structure of the microwave oven currently used is mainly provided with a signal input port and a signal output port on the side of the microwave generator, the RF connector is connected to the side, and provides a microwave signal to the PCB board (printed circuit board) simultaneously The PCB board extracts microwave signals.
  • the RF connector is connected to the side of the microwave generator, so that the maximum distance between the microwave generator and the cooking cavity is large, resulting in an increase in the volume of the microwave oven, thereby limiting the structural design and the shape of the microwave oven, thereby increasing the manufacture of the microwave oven. cost.
  • the present invention aims to solve at least one of the technical problems existing in the prior art.
  • a first object of the present invention is to provide a semiconductor microwave generator connection structure of a microwave oven which is simple and compact in structure, can effectively shorten the distance between the microwave generator and the cooking chamber, and ensures microwave conduction efficiency.
  • a second object of the present invention is to provide a microwave oven comprising the above-described semiconductor microwave generator connection structure.
  • a third object of the present invention is to provide a semiconductor microwave generator input/output connection structure of a microwave oven which is simple and compact in structure and can effectively shorten the distance between the microwave generator and the cooking chamber.
  • a fourth object of the present invention is to provide a microwave oven comprising the above-described semiconductor microwave generator input/output connection structure.
  • a fifth object of the present invention is to provide a semiconductor microwave generator connection structure of a microwave oven which is simple and compact in structure and capable of effectively shortening the distance between the microwave generator and the cooking chamber.
  • a sixth object of the present invention is to provide a microwave oven comprising the above-described semiconductor microwave generator connection structure.
  • an embodiment of the first aspect of the present invention provides a semiconductor microwave generator connection structure of a microwave oven, comprising: a semiconductor microwave generator, wherein a front or back surface of the semiconductor microwave generator is provided with a microwave signal output port;
  • the microwave output device has a first end connected to the microwave signal output port and a second end connected to the cooking cavity of the microwave oven.
  • the invention provides a semiconductor microwave generator connection structure of a microwave oven, wherein a microwave signal output port is disposed on a front surface or a back surface of the semiconductor microwave generator, a first end of the microwave output device is connected to the microwave signal output port, and the second end is connected to the cooking cavity
  • the connection that is, the microwave output device is vertically connected to the front or back surface of the semiconductor microwave generator, effectively reducing the maximum distance between the semiconductor microwave generator and the cooking cavity, that is, the L value is greatly reduced, thereby effectively reducing
  • the volume of the microwave oven makes the structure design and shape design of the microwave simple and convenient, thereby effectively reducing the manufacturing cost of the microwave oven.
  • the semiconductor microwave generator connection structure of the microwave oven according to the embodiment of the first aspect of the present invention further has the following additional technical features:
  • a waveguide box is disposed on a cavity wall of the cooking cavity, the waveguide box is in communication with the cooking cavity, and a top surface of the waveguide box is provided with a waveguide hole;
  • the microwave generator includes: a heat sink; a metal substrate, the metal substrate is mounted on the heat sink; and a printed circuit board, the front surface of the printed circuit board is provided with the microwave signal output port, and the back of the printed circuit board Fixedly connected to the metal substrate; and a shield cover disposed on a front surface and a side surface of the printed circuit board; the first end of the microwave output device passes through the shield cover and the microwave The signal output ports are connected, and the second end is in communication with the waveguide box through the waveguide hole.
  • the waveguide box is arranged on the cooking cavity, so that the connection between the microwave output device and the cooking cavity is simple and convenient; the heat dissipation device effectively ensures that the heat of the printed circuit board can be dissipated in time, thereby ensuring the service life of the printed circuit board.
  • the metal substrate makes the connection between the printed circuit board and the heat sink simple and convenient, and the metal has good thermal conductivity, thereby effectively ensuring the heat dissipation effect of the printed circuit board; the shielding cover is arranged to effectively ensure the semiconductor microwave generator Sealing, thus making semi-conductive
  • the microwaves emitted by the bulk microwave generator can all enter the cooking cavity through the microwave output device and the waveguide box.
  • the microwave output device includes: a first RF connector, a socket of the first RF connector is connected to the microwave signal output port; and a second RF connector, the a socket of the second RF connector is connected to the waveguide box through the waveguide hole; a plug of the first RF connector is connected to a plug of the second RF connector, and the first RF connector is One of the plug and the plug of the second RF connector is a male head and the other is a female head.
  • the microwave output device includes a first RF connector and a second RF connector respectively mounted on the semiconductor microwave generator and the waveguide box, and the plug of the paired first RF connector is connected to the plug of the second RF connector,
  • the semiconductor microwave generator is connected with the cavity of the microwave oven.
  • the structure of the RF connector is simple and convenient to install, which effectively reduces the installation difficulty of the connection structure of the semiconductor microwave generator and improves the assembly efficiency of the connection structure of the semiconductor microwave generator.
  • the microwave output device further comprises: a microwave feeding device, the socket of the second RF connector being connected to the waveguide box through the microwave feeding device.
  • the arrangement of the microwave feeding device effectively ensures the microwave transmission efficiency, thereby effectively ensuring that the food in the cooking chamber is sufficiently heated during the predetermined heating time, thereby effectively improving the product quality.
  • the microwave feeding device is an antenna or a probe.
  • Both the antenna and the probe have the advantage of high efficiency, which can effectively improve the microwave transmission efficiency.
  • the microwave output device is a magnetron output assembly
  • the magnetron output assembly comprising: a magnetron antenna, a first bottom plate, a first fixed ring and a second fixed ring, The first fixing ring, the second fixing ring and the first bottom plate are sequentially connected, the first bottom plate is connected to the waveguide box, and the magnetron antenna passes through the first fixing ring, the first Two fixing rings and the first bottom plate are fixed on the waveguide box, and one end of the magnetron antenna is connected to the microwave signal output port through the shielding cover.
  • the magnetron output assembly comprises a magnetron antenna, a first bottom plate, a first fixing ring and a second fixing ring, and has a simple structure, is easy to process and manufacture, thereby effectively reducing the processing difficulty of the microwave output device, and the magnetron output
  • the assembly has the advantages of high power, high efficiency, small size, light weight and low cost, thereby effectively ensuring that the food in the cooking chamber is heated sufficiently during the predetermined heating time, thereby effectively improving the product quality.
  • the microwave output device is a probe output component
  • the probe The needle output assembly includes: a probe, a second bottom plate and a third fixing ring, the third fixing ring is connected to the second bottom plate, the second bottom plate is fixedly connected to the waveguide box, and the probe passes The second bottom plate and the third fixing ring are fixed on the waveguide box, and one end of the probe is connected to the microwave signal output port through the shielding cover.
  • the probe output component comprises a probe, a second bottom plate and a third fixing ring, and has a simple structure and is easy to process and manufacture, thereby effectively reducing the processing difficulty of the microwave output device, and the probe has good microwave conduction efficiency, thereby effectively It is ensured that the food in the cooking chamber is heated sufficiently during the predetermined heating time, thereby effectively improving the product quality.
  • the semiconductor microwave generator includes: a metal substrate mounted on the cooking cavity; a printed circuit board on which a back surface of the printed circuit board is provided with the microwave signal output a rear surface of the printed circuit board fixedly connected to the metal substrate; and a shielding cover disposed on a front side and a side surface of the printed circuit board; the first end of the microwave output device is worn
  • the metal substrate is connected to the microwave signal output port.
  • the semiconductor microwave generator does not have a heat dissipating device, and the metal substrate is closely attached to the cooking cavity, and the cooking cavity is used to dissipate heat, and at the same time, part of the heat is transferred to the cavity. Waste heat utilization effectively improves energy efficiency and saves energy.
  • the embodiment of the second aspect of the present invention provides a microwave oven comprising: a cooking cavity and a semiconductor microwave generator connecting structure of the microwave oven according to any one of the first aspects; the semiconductor microwave generator connecting structure of the microwave oven A second end of the microwave output device is in communication with the cooking cavity.
  • the microwave oven provided by the embodiment of the second aspect of the present invention has the semiconductor microwave generator connection structure of the microwave oven provided by any one of the foregoing first embodiments, and therefore, the microwave oven has the semiconductor microwave of the microwave oven provided by any of the foregoing first embodiments.
  • the whole beneficial effect of the generator connection structure is that the microwave oven has the advantages of small size, low cost and the like.
  • the semiconductor microwave generator connection structure of the microwave oven is located on a top or bottom wall or a side wall or a rear wall of the cooking cavity.
  • the semiconductor microwave generator connection structure is located on the top wall or the bottom wall or the side wall or the back wall of the cooking cavity, so that the installation of the semiconductor microwave generator connection structure is simple and convenient, thereby making the structure design and shape design of the microwave simple and convenient, and thus effective
  • the ground has improved the production efficiency of the microwave oven.
  • a third aspect of the present invention provides a semiconductor microwave generator input and output of a microwave oven
  • the connection structure comprises: a semiconductor microwave generator, the semiconductor microwave generator is provided with a microwave signal output port and a microwave signal input port, the microwave signal output port is located at a front or a back of the semiconductor microwave generator; and the microwave input device
  • the microwave input device is mounted on the semiconductor microwave generator and connected to the microwave signal input port; and a microwave output device mounted on the semiconductor microwave generator, and The microwave signal output ports are connected.
  • the invention provides a semiconductor microwave generator input/output connection structure of a microwave oven, wherein the microwave signal output port is disposed on the front or the back of the semiconductor microwave generator, and the microwave output device is mounted on the semiconductor microwave generator with respect to the microwave signal output port, and is coupled with the microwave
  • the signal output ports are connected, that is, the microwave output device is vertically connected to the front or back surface of the semiconductor microwave generator, thereby effectively reducing the maximum distance between the semiconductor microwave generator and the cooking cavity, thereby effectively reducing the volume of the microwave oven.
  • the structure design and shape design of the microwave are simple and convenient, thereby effectively reducing the manufacturing cost of the microwave oven; the setting of the microwave input device effectively ensures that the semiconductor microwave generator can simultaneously receive and transmit the microwave signal.
  • the semiconductor microwave generator input/output connection structure of the microwave oven provided by the embodiment of the third aspect of the present invention further has the following additional technical features:
  • the semiconductor microwave generator includes: a metal substrate; a printed circuit board, a back surface of the printed circuit board is fixedly connected to the metal substrate, the microwave signal output port and the microwave signal input Ports are disposed on the printed circuit board, the microwave signal output port is located on one side of the front or back of the printed circuit board; and a shield cover is disposed on the front side of the printed circuit board And a side surface; the microwave output device is mounted on the printed circuit board through the shield or the metal substrate.
  • the metal substrate makes the connection between the printed circuit board and the heat sink simple and convenient, and the metal has good thermal conductivity, thereby effectively ensuring the heat dissipation effect of the printed circuit board; the shielding cover is arranged to effectively ensure the semiconductor microwave generator Sealing.
  • the microwave output device is a first RF connector, and a socket of the first RF connector is connected to the microwave signal output port, and a plug of the first RF connector is pierced
  • the shield or the metal substrate is fixedly connected to the shield or the metal substrate through a first flange.
  • the RF connector has a simple structure and is easy to install, effectively reducing the connection of the semiconductor microwave generator
  • the installation difficulty of the structure improves the assembly efficiency of the input and output connection structure of the semiconductor microwave generator; the setting of the first flange ensures the connection strength between the plug of the first RF connector and the shield or the metal substrate.
  • the tightness between the plug of the first RF connector and the semiconductor microwave generator is ensured.
  • the socket of the first RF connector is soldered or snapped or screwed onto the printed circuit board.
  • the soldering or snapping or screwing has good connection strength, thereby effectively ensuring the connection strength between the socket of the first RF connector and the printed circuit board.
  • the microwave output device is a magnetron output assembly, the magnetron output assembly comprising: a magnetron antenna, a first bottom plate and a first fixed ring, the first fixed ring and The first bottom plate is sleeved on the magnetron antenna, and one end of the magnetron antenna is connected to the microwave signal output port through the shield or the metal substrate.
  • the magnetron output component comprises a magnetron antenna, a first bottom plate and a first fixing ring, and has a simple structure, is easy to process and manufacture, thereby effectively reducing the processing difficulty of the microwave output device, and the magnetron output component has a large power.
  • the utility model has the advantages of high efficiency, small size, light weight and low cost, thereby effectively ensuring that the food in the cooking chamber is heated sufficiently in the predetermined heating time, thereby effectively improving the product quality.
  • the microwave output device is a probe output assembly, the probe output assembly comprising: a probe, a second bottom plate and a second fixed ring, the second fixed ring and the second
  • the bottom plate is sleeved on the probe, and one end of the probe is connected to the microwave signal output port through the shielding cover or the metal plate.
  • the probe output component comprises a probe, a second bottom plate and a second fixing ring, has a simple structure, is easy to be processed and manufactured, thereby effectively reducing the processing difficulty of the microwave output device, and the probe has good microwave conduction efficiency, thereby effectively It is ensured that the food in the cooking chamber is heated sufficiently during the predetermined heating time, thereby effectively improving the product quality.
  • the microwave input device is a second RF connector
  • the socket of the second RF connector is connected to the microwave signal input port
  • the plug of the second RF connector is located at the semiconductor The outside of the microwave generator.
  • the RF connector has a simple structure and is easy to install, effectively reducing the connection of the semiconductor microwave generator
  • the installation difficulty of the structure improves the assembly efficiency of the input and output connection structure of the semiconductor microwave generator.
  • the microwave signal input port is located on the front or back or the back of the printed circuit board, and the plug of the second RF connector passes through the shield or the metal substrate and passes through The second flange is fixedly connected to the shield or the metal substrate.
  • the plug of the second RF connector is fixedly connected to the shield or the metal substrate through the second flange, and the second flange is disposed on the one hand to ensure the plug between the second RF connector and the shield or the metal substrate
  • the strength of the connection ensures the tightness between the plug of the second RF connector and the semiconductor microwave generator.
  • the fourth aspect of the present invention provides a microwave oven, comprising: a cooking cavity and a semiconductor microwave generator input/output connection structure of the microwave oven according to any one of the foregoing third embodiments, the semiconductor microwave generator input and output of the microwave oven A microwave input device of the connection structure is in communication with the cooking cavity.
  • the microwave oven provided by the embodiment of the fourth aspect of the present invention has the semiconductor microwave generator input/output connection structure of the microwave oven according to any of the foregoing third embodiments, and the microwave oven has the microwave oven provided by any of the foregoing third embodiments.
  • the whole beneficial effect of the input and output connection structure of the semiconductor microwave generator is that the microwave oven has the advantages of small size, low cost and the like.
  • the semiconductor microwave generator input-output connection structure of the microwave oven is located on a top or bottom wall or a side wall or a rear wall of the cooking cavity.
  • the input/output connection structure of the semiconductor microwave generator is located on the top wall or the bottom wall or the side wall or the back wall of the cooking cavity, so that the installation of the semiconductor microwave generator connection structure is simple and convenient, thereby making the structure design and shape design of the microwave simple and convenient. Thereby, the production efficiency of the microwave oven is effectively improved.
  • An embodiment of the fifth aspect of the present invention provides a semiconductor microwave generator connection structure of a microwave oven, comprising: a semiconductor microwave generator, wherein the semiconductor microwave generator is provided with a microwave signal output port and a microwave signal input port, and the microwave signal The output port is located at the front or the back of the semiconductor microwave generator; the microwave input device is connected to the microwave signal input port; and the microwave output device is configured to pass the converter and the microwave The signal output ports are connected.
  • the invention discloses a semiconductor microwave generator connection structure of a microwave oven, and a microwave signal output port setting On the front or back side of the semiconductor microwave generator, the microwave output device is connected to the microwave signal output port through the converter, that is, the microwave output device is vertically connected to the front or back surface of the semiconductor microwave generator, thereby effectively reducing the semiconductor microwave generator and The maximum distance between the cooking chambers, thereby effectively reducing the volume of the microwave oven, making the structural design and shape design of the microwave oven simple and convenient, thereby effectively reducing the manufacturing cost of the microwave oven; in addition, the structure of the converter is simple, so that the microwave The connection between the output device and the microwave signal output port is simple and reliable, and the assembly difficulty of the semiconductor microwave generator connection structure is effectively reduced.
  • the semiconductor microwave generator connection structure of the microwave oven according to the embodiment of the fifth aspect of the present invention further has the following additional technical features:
  • the semiconductor microwave generator includes: a heat sink; a metal substrate, the metal substrate is mounted on the heat sink; a printed circuit board, a back surface of the printed circuit board and the metal substrate a fixed connection, the microwave signal output port and the microwave signal input port are both disposed on the printed circuit board, and the microwave signal output port is located on one of a front side or a back side of the printed circuit board, the conversion
  • the device is mounted on the printed circuit board with respect to the microwave signal output port; and a shield cover is disposed on a front side and a side surface of the printed circuit board.
  • the heat dissipating device effectively ensures that the heat of the printed circuit board can be dissipated in time, thereby ensuring the service life of the printed circuit board;
  • the metal substrate makes the connection between the printed circuit board and the heat dissipating device simple and convenient, and the metal has good thermal conductivity. Therefore, the heat dissipation effect of the printed circuit board is effectively ensured;
  • the shielding cover is arranged to effectively ensure the sealing performance of the semiconductor microwave generator.
  • the converter is provided with a microstrip line, the first end of the microstrip line is connected to the microwave output device, and the second end is connected to the microwave signal output port.
  • the microwave output device and the semiconductor microwave generator are connected through the microstrip line on the converter, and the microwave signal is transmitted through the microstrip line, thereby effectively ensuring the microwave signal transmission efficiency.
  • the microwave output device is a radio frequency connector, and a socket of the radio frequency connector is connected to the first end of the microstrip line.
  • the RF connector has a simple structure and convenient installation, effectively reduces the installation difficulty of the connection structure of the semiconductor microwave generator, and improves the assembly efficiency of the connection structure of the semiconductor microwave generator.
  • the socket of the RF connector is soldered or snapped or screwed onto the converter; the converter is soldered or snapped or screwed onto the printed circuit board.
  • Soldering or snapping or screwing have good joint strength, which effectively ensures the strength of the connection between the socket of the RF connector and the printed circuit board, and the strength of the connection between the converter and the printed circuit board.
  • the converter is a metal block, and an epoxy layer is disposed between the microstrip line and the metal block.
  • the microstrip line of the epoxy resin is separated from the metal block, which effectively avoids the use of the metal block to affect the performance of the microstrip line, thereby ensuring the use effect of the microstrip line.
  • the microwave output device is a magnetron output assembly, the magnetron output assembly comprising: a magnetron antenna, a first bottom plate and a first fixed ring, the first fixed ring and The first bottom plate is sleeved on the magnetron antenna, and one end of the magnetron antenna is connected to the first end of the microstrip line.
  • the magnetron output component comprises a magnetron, a first bottom plate and a first fixing ring, and has a simple structure, is easy to process and manufacture, thereby effectively reducing the processing difficulty of the microwave output device, and the magnetron output component has high power and efficiency.
  • the advantages of high size, small size, light weight and low cost are effective to ensure that the food in the cooking chamber is heated sufficiently during the predetermined heating time, thereby effectively improving the product quality.
  • the microwave output device is a probe output assembly, the probe output assembly comprising: a probe, a second bottom plate and a second fixed ring, the second fixed ring and the second A bottom plate is sleeved on the probe, and one end of the probe is connected to the first end of the microstrip line.
  • the probe output component comprises a probe, a second bottom plate and a second fixing ring, has a simple structure, is easy to be processed and manufactured, thereby effectively reducing the processing difficulty of the microwave output device, and the probe has good microwave conduction efficiency, thereby effectively It is ensured that the food in the cooking chamber is heated sufficiently during the predetermined heating time, thereby effectively improving the product quality.
  • the sixth aspect of the present invention provides a microwave oven, comprising: a cooking cavity and a semiconductor microwave generator connection structure of the microwave oven according to any one of the fifth aspects, wherein the microwave of the semiconductor microwave generator of the microwave oven is connected An output device is in communication with the cooking cavity.
  • the microwave oven provided by the embodiment of the sixth aspect of the present invention has the semiconductor microwave generator connection structure of the microwave oven provided by any one of the fifth aspect, and therefore, the microwave oven has the semiconductor microwave of the microwave oven provided by any of the foregoing fifth aspects.
  • the full benefit of the generator connection structure, namely the micro The furnace has the advantages of small size and low cost.
  • the semiconductor microwave generator connection structure of the microwave oven is located on a top or bottom wall or a side wall or a rear wall of the cooking cavity.
  • the semiconductor microwave generator connection structure is located on the top wall or the bottom wall or the side wall or the back wall of the cooking cavity, so that the installation of the semiconductor microwave generator connection structure is simple and convenient, so that the structural design and shape design of the microwave oven are simple and convenient, and thus effective
  • the ground has improved the production efficiency of the microwave oven.
  • FIG. 1 is a schematic structural view of a semiconductor microwave generator connection structure used in the prior art
  • FIG. 2A-2B are microwave ovens having the semiconductor microwave generator connection structure shown in Fig. 1 used in the prior art;
  • FIG. 3 is a first structural diagram of a semiconductor microwave generator connection structure of a microwave oven according to a first embodiment of the present invention
  • Figure 4 is a schematic view showing the connection structure of the semiconductor microwave generator of the microwave oven shown in Figure 3 and the waveguide box;
  • FIG. 5 is a schematic structural view showing a connection of a microwave output device and a printed circuit board in a semiconductor microwave generator connection structure of the microwave oven shown in FIG. 3;
  • FIG. 6 is a schematic view showing a first connection structure of a microwave output device and a waveguide box in a semiconductor microwave generator connection structure of the microwave oven shown in FIG. 3;
  • FIG. 7 is a schematic view showing a second connection structure of a microwave output device and a waveguide box in a semiconductor microwave generator connection structure of the microwave oven shown in FIG. 3;
  • FIG. 8 is a schematic view showing a third connection structure of a microwave output device and a waveguide box in a semiconductor microwave generator connection structure of the microwave oven shown in FIG. 3;
  • FIG. 9 is a schematic view showing a second structure of a semiconductor microwave generator connection structure of a microwave oven according to a first embodiment of the present invention, which is connected to a waveguide box;
  • FIG. 10 is a schematic structural view of a microwave output device in a semiconductor microwave generator connection structure of the microwave oven shown in FIG. 9;
  • FIG. 11 is a schematic view showing a third structure of a semiconductor microwave generator connection structure of a microwave oven according to a first embodiment of the present invention, which is connected to a waveguide box;
  • FIG. 12 is a schematic structural view of a microwave output device in a semiconductor microwave generator connection structure of the microwave oven shown in FIG. 11;
  • Figure 13 is a first schematic structural view of a microwave oven according to a second embodiment of the present invention.
  • Figure 14 is a second schematic structural view of a microwave oven according to a second embodiment of the present invention.
  • Figure 15 is a third schematic structural view of a microwave oven according to a second embodiment of the present invention.
  • FIG. 16 is a schematic structural diagram of a semiconductor microwave generator input/output connection structure of a microwave oven according to a third embodiment of the present invention.
  • Figure 17 is a block diagram showing the structure of a semiconductor microwave generator connection structure of a microwave oven according to a fifth embodiment of the present invention.
  • a semiconductor microwave generator connection structure of a microwave oven according to some embodiments of the first aspect of the present invention will be described below with reference to FIGS. 1 through 12.
  • a semiconductor microwave generator connection structure of a microwave oven includes: a semiconductor microwave generator 10 and a microwave output device 20.
  • the front end or the back surface of the semiconductor microwave generator 10 is provided with a microwave signal output port 131; the first end of the microwave output device 20 is connected to the microwave signal output port 131, and the second end is connected to the cooking cavity 50 of the microwave oven.
  • the microwave signal output port 131 is disposed on the front or the back of the semiconductor microwave generator 10, and the first end of the microwave output device 20 is connected to the microwave signal output port 131, and the second The end is coupled to the cooking cavity 50, i.e., the microwave output device 20 is vertically coupled to the front or back side of the semiconductor microwave generator 10, effectively reducing the maximum distance between the semiconductor microwave generator 10 and the cooking cavity 50, i.e., The L value is greatly reduced, thereby effectively reducing the volume of the microwave oven, making the structural design and shape design of the microwave simple and convenient, thereby effectively reducing the manufacturing cost of the microwave oven.
  • a semiconductor microwave generator connection structure of a microwave oven is provided.
  • a waveguide box 60 is disposed on a cavity wall of the cooking cavity 50, and the waveguide box 60 communicates with the cooking cavity 50, and the waveguide case 60 is The top surface is provided with a waveguide hole;
  • the semiconductor microwave generator 10 includes: a heat sink 11, a metal substrate 12, a printed circuit board 13, and a shield cover 14, wherein the metal substrate 12 is mounted on the heat sink 11; the front surface of the printed circuit board 13 is provided The microwave signal output port 131, the back surface of the printed circuit board 13 is fixedly connected to the metal substrate 12; the shield cover 14 is disposed on the front side and the side surface of the printed circuit board 13; the first end of the microwave output device 20 passes through the shield cover 14 and the microwave signal
  • the output port 131 is connected, and the second end is in communication with the waveguide box 60 through the waveguide hole.
  • the waveguide box 60 is disposed on the cooking cavity 50, so that the connection between the microwave output device 20 and the cooking cavity 50 is simple and convenient; the heat dissipation device 11 can effectively ensure that the heat of the printed circuit board 13 can be dissipated in time, thereby ensuring The service life of the printed circuit board 13; the metal substrate 12 makes the connection between the printed circuit board 13 and the heat sink 11 simple and convenient, and the metal has good thermal conductivity, thereby effectively ensuring the heat dissipation effect of the printed circuit board 13; The arrangement of the cover 14 effectively ensures that the microwaves emitted by the semiconductor microwave generator 10 can all enter the cooking cavity 50 via the microwave output device 20 and the waveguide box 60.
  • the heat sink 11 is a heat sink or a fan.
  • the microwave output device 20 includes: a first RF connector 21 and a second RF connector 22, and a plug 212 and a second connector of the first RF connector.
  • the plugs 222 of the RF connector are connected, and one of the plugs 212 of the first RF connector and the plug 222 of the second RF connector are male and the other is a female head; the socket 211 of the first RF connector and the microwave
  • the signal output port 131 is connected; the socket 221 of the second RF connector is connected to the waveguide box 60 through a waveguide hole.
  • the microwave output device 20 includes a first RF connector 21 and a second RF connector 22 mounted on the semiconductor microwave generator 10 and the waveguide box 60, respectively, through the plug 212 and the second RF connection of the paired first RF connector.
  • the plug 222 of the device is connected to connect the semiconductor microwave generator 10 with the microwave cavity.
  • the RF connector has a simple structure and convenient installation, effectively reduces the installation difficulty of the connection structure of the semiconductor microwave generator 10, and improves the semiconductor microwave generator. 10 assembly structure assembly efficiency.
  • the first RF connector 21 and the second RF connector 22 are coaxial RF connectors, and the inner conductor 24 of the coaxial RF connector is connected to the microstrip line 26, and the outer conductor 25 The escaping microstrip line 26 is connected to the printed circuit board 13 board.
  • connection structure is not limited to the coaxial connector, and it is applicable to any connector model, and different fixing methods may be adopted depending on different models.
  • the plug 212 of the first RF connector is soldered or snapped or screwed to the plug 222 of the second RF connector.
  • the plug of the first RF connector and the plug of the second RF connector may be connected by a cable. 222 is connected.
  • the positive pole of the cable and the cable connect the plug 212 of the first RF connector with the female head of the plug 222 of the second RF connector, and the negative pole and the cable connect the plug 212 of the first RF connector with the second
  • the male connector in the plug 222 of the RF connector is connected.
  • the microwave output device 20 further includes a microwave feeding device 23, and the socket 221 of the second RF connector is connected to the waveguide box 60 through the microwave feeding device 23.
  • the arrangement of the microwave feeding device 23 effectively ensures the microwave transmission efficiency, thereby effectively ensuring that the food in the cooking chamber 50 is sufficiently heated during the predetermined heating time, thereby effectively improving the product quality.
  • the microwave feed device 23 is an antenna or a probe.
  • the antenna or the probe has good microwave conduction efficiency, which can effectively improve the microwave transmission efficiency.
  • the microwave output device 20 is a magnetron output assembly 30, and the magnetron output assembly 30 includes: a magnetron antenna 314, a first bottom plate 32, The first fixing ring 33 and the second fixing ring 34, the first fixing ring 33, the second fixing ring 34 and the first bottom plate 32 are sequentially connected, the first bottom plate 32 is connected to the waveguide box 60, and the magnetron antenna 314 passes through the first The fixing ring 33, the second fixing ring 34 and the first bottom plate 32 are fixed to the waveguide case 60, and one end of the magnetron antenna 314 is connected to the microwave signal output port 131 through the shield case 14.
  • the magnetron output assembly 30 includes a magnetron antenna 314, a first bottom plate 32, a first fixing ring 33 and a second fixing ring 34, and has a simple structure and is easy to process and manufacture, thereby effectively reducing the processing difficulty of the microwave output device 20. And the magnetron output assembly has the advantages of high power, high efficiency, small size, light weight and low cost, thereby effectively ensuring that the food in the cooking cavity 50 is sufficiently heated during the predetermined heating time, thereby effectively improving Product quality.
  • the magnetron output assembly includes a ceramic ring 311, an anode output end tube 312, an exhaust port 313, a magnetron antenna 314, and an antenna cap 315.
  • the exhaust port 313 passes through the ceramic ring 311.
  • the anode output end shell 312 is connected, the antenna cap 315 is sleeved on the exhaust port 313, and the magnetron antenna 314 sequentially passes through the exhaust port 313, the ceramic ring 311 and the anode output end shell 312, the first bottom plate 32,
  • the first retaining ring 33 and the second retaining ring 34 are located on the ceramic ring 311 and the anode output end tube 312.
  • the microwave output device is a probe output assembly 40
  • the probe output assembly 40 includes: a probe 41, a second bottom plate 42, and a third The fixing ring 43, the third fixing ring 43 is connected to the second bottom plate 42, and the second bottom plate 42 and the waveguide box 60
  • the probe 41 is fixed to the waveguide case 60 through the second bottom plate 42 and the third fixing ring 43, and one end of the probe 41 is connected to the microwave signal output port 131 through the shield case 14.
  • the probe output assembly 40 includes a probe 41, a second bottom plate 42 and a third fixing ring 43.
  • the structure is simple, easy to process and manufacture, thereby effectively reducing the processing difficulty of the microwave output device 20, and the probe has good microwave conduction. The efficiency, thereby effectively ensuring that the food in the cooking cavity 50 is sufficiently heated during the predetermined heating time, thereby effectively improving the product quality.
  • the semiconductor microwave generator 10 includes: a metal substrate 12, a printed circuit board 13, and a shield case 14
  • the metal substrate 12 is mounted on the cooking cavity 50; the back surface of the printed circuit board 13 is provided with a microwave signal output port 131, the back surface of the printed circuit board 13 is fixedly connected to the metal substrate 12; and the shield cover 14 is disposed on the printed circuit board 13.
  • the front side and the side surface; the first end of the microwave output device 20 is connected to the microwave signal output port 131 through the metal substrate 12.
  • the microwave oven is a flat microwave oven not provided with a waveguide box 60.
  • the semiconductor microwave generator 10 is not provided with a heat dissipating device 11, and the metal substrate 12 is closely attached to the cooking cavity 50, and the cooking cavity 50 is used to dissipate heat, and at the same time, part of the heat is provided. It is transferred into the cavity to realize waste heat utilization, which effectively improves energy utilization and saves energy.
  • a microwave oven includes: a cooking cavity 50 and a semiconductor microwave generator connection structure of the microwave oven provided by any one of the foregoing first embodiments, A second end of the microwave output device of the semiconductor microwave generator connection structure of the microwave oven is coupled to the cooking cavity 50.
  • the microwave oven provided in this embodiment has the semiconductor microwave generator connection structure of the microwave oven provided by any one of the foregoing first embodiments. Therefore, the microwave oven has the semiconductor microwave generator connection structure of the microwave oven provided by any of the foregoing first embodiments.
  • the whole beneficial effect is that the microwave oven has the advantages of small volume, low cost and the like.
  • the semiconductor microwave generator connection structure of the microwave oven is located on the top or bottom wall or side wall or rear wall of the cooking cavity 50.
  • the semiconductor microwave generator connection structure is located on the top wall or the bottom wall or the side wall or the back wall of the cooking cavity 50, so that the installation of the semiconductor microwave generator connection structure is simple and convenient, thereby making the structure design and shape design of the microwave simple and convenient, and further Effectively improve the production efficiency of the microwave oven.
  • a semiconductor microwave generator input-output connection structure of a microwave oven according to some embodiments of the third aspect of the present invention will be described below with reference to FIG.
  • a semiconductor microwave generator input/output connection structure of a microwave oven includes: a semiconductor microwave generator 10, a microwave input device, and a microwave output device.
  • the semiconductor microwave generator 10 is provided with a microwave signal output port 131 and a microwave signal input port 132.
  • the microwave signal output port 131 is located at the front or the back of the semiconductor microwave generator 10; the microwave input device is mounted on the semiconductor microwave generator 10, and The microwave signal input port 132 is connected; the microwave output device is mounted on the semiconductor microwave generator 10 and connected to the microwave signal output port 122.
  • the semiconductor microwave generator input/output connection structure of the microwave oven provided in this embodiment is provided.
  • the microwave signal output port 131 is disposed on the front or the back of the semiconductor microwave generator 10, and the microwave output device is connected to the microwave signal output port 131, that is, the microwave output device and
  • the front side or the back side of the semiconductor microwave generator 10 is vertically connected, which effectively reduces the maximum distance between the semiconductor microwave generator 10 and the cooking cavity, thereby effectively reducing the volume of the microwave oven, and making the structural design and shape design of the microwave. It is simple and convenient, and thus effectively reduces the manufacturing cost of the microwave oven; the setting of the microwave input device effectively ensures that the semiconductor microwave generator can simultaneously receive and transmit microwave signals.
  • the semiconductor microwave generator 10 comprises: a metal substrate 12, a printed circuit board 13 and a shield case 14;
  • the back surface of the printed circuit board 13 is fixedly connected to the metal substrate 12, and the microwave signal output port 131 and the microwave signal input port 132 are both disposed on the printed circuit board 13, and the microwave signal output port 131 is located on one side of the front or back of the printed circuit board 13.
  • the shield cover 14 is disposed on the front surface and the side surface of the printed circuit board 13; the microwave output device is mounted on the printed circuit board 13 through the shield cover 14 or the metal substrate 12 with respect to the microwave signal output port 131.
  • the metal substrate 12 makes the connection between the printed circuit board 13 and the heat sink simple and convenient, and the metal has good thermal conductivity, thereby effectively ensuring the heat dissipation effect of the printed circuit board 13; the shielding cover 14 is disposed to effectively ensure the semiconductor The tightness of the microwave generator 10.
  • the microwave output device is a first RF connector 21, and the socket 211 of the first RF connector is connected to the microwave signal output port 131, and the plug 212 of the first RF connector passes through the shield 14 or
  • the metal substrate 12 is fixedly connected to the shield 14 or the metal substrate 12 through the first flange 71;
  • the microwave input device is the second RF connector 22, and the socket 221 of the second RF connector is connected to the microwave signal input port 132.
  • the plug 222 of the second RF connector is located outside of the semiconductor microwave generator 10.
  • the RF connector has a simple structure and convenient installation, effectively reduces the installation difficulty of the connection structure of the semiconductor microwave generator 10, and improves the assembly efficiency of the input and output connection structure of the semiconductor microwave generator;
  • the first flange 71 is provided, on the one hand, to ensure The strength of the connection between the plug 212 of the first RF connector and the shield 14 or the metal substrate 12, on the other hand, ensures the tightness between the plug 212 of the first RF connector and the semiconductor microwave generator 10.
  • the socket 211 of the first RF connector is soldered or snapped or screwed onto the printed circuit board 13; the microwave signal input port 132 is located on the front or back or side of the printed circuit board 13, and the plug 222 of the second RF connector
  • the shield 14 or the metal substrate 12 is passed through and fixedly connected to the shield 14 or the metal substrate 12 via the second flange 72.
  • welding or snapping or screwing has good connection strength, thereby effectively ensuring the connection strength between the socket 211 of the first RF connector and the printed circuit board 13; the plug 222 of the second RF connector passes the second method
  • the blue disk 72 is fixedly connected to the shield cover 14 or the metal substrate 12, and the second flange 72 is disposed on the one hand to ensure the connection strength between the plug 222 of the second RF connector and the shield cover 14 or the metal substrate 12.
  • the tightness between the plug 222 of the second RF connector and the semiconductor microwave generator 10 is ensured.
  • the microwave output device is a magnetron output component
  • the magnetron output component comprises: a magnetron antenna, a first bottom plate and a first fixing ring, and the first fixing ring and the first bottom plate are sleeved on the magnetron antenna
  • One end of the magnetron antenna is connected to the microwave signal output port 131 through the shield cover 14 or the metal substrate 12.
  • the magnetron output assembly comprises a magnetron antenna, a first bottom plate and a first fixing ring, and has a simple structure, is easy to process and manufacture, thereby effectively reducing the processing difficulty of the microwave output device, and the magnetron antenna output component has a large power.
  • the utility model has the advantages of high efficiency, small size, light weight and low cost, thereby effectively ensuring that the food in the cooking cavity is heated sufficiently in the predetermined heating time, thereby effectively improving the product quality.
  • the microwave output device is a probe output component
  • the probe output component comprises: a probe, a second bottom
  • the plate and the second fixing ring, the second fixing ring and the second bottom plate are sleeved on the probe, and one end of the probe is connected to the microwave signal output port 131 through the shielding cover 14 or the metal substrate 12.
  • the probe output component comprises a probe, a second bottom plate and a second fixing ring, has a simple structure, is easy to be processed and manufactured, thereby effectively reducing the processing difficulty of the microwave output device, and the probe has good microwave conduction efficiency, thereby effectively It is ensured that the food in the cooking chamber is heated sufficiently during the predetermined heating time, thereby effectively improving the product quality.
  • a microwave oven (not shown) provided in some embodiments of the fourth aspect of the present invention includes: a cooking cavity and a semiconductor microwave generator input/output connection structure of the microwave oven provided by any of the foregoing third embodiments, a semiconductor microwave of the microwave oven
  • the microwave input device of the generator input and output connection structure is in communication with the cooking cavity.
  • the microwave oven provided in this embodiment has the semiconductor microwave generator input/output connection structure of the microwave oven according to any one of the foregoing third embodiments. Therefore, the microwave oven has the microwave microwave generator of the microwave oven provided by any of the foregoing third embodiments.
  • the full benefit of the input-output connection structure is that the microwave oven has the advantages of small size, low cost, and the like.
  • the semiconductor microwave generator input-output connection structure of the microwave oven is located on the top or bottom wall or the side wall or the rear wall of the cooking cavity.
  • the input/output connection structure of the microwave generator of the microwave oven is located on the top wall or the bottom wall or the side wall or the back wall of the cooking cavity, so that the installation and connection structure of the semiconductor microwave generator of the microwave oven is simple and convenient, thereby making the structure design of the microwave And the shape design is simple and convenient, which effectively improves the production efficiency of the microwave oven.
  • a semiconductor microwave generator connection structure of a microwave oven according to some embodiments of the fifth aspect of the present invention will be described below with reference to FIG.
  • a semiconductor microwave generator connection structure of a microwave oven includes: a semiconductor microwave generator 10, a microwave input device, and a microwave output device.
  • the semiconductor microwave generator 10 is provided with a microwave signal output port 131 and a microwave signal input port (not shown), and the microwave signal output port 131 is located at the front or the back of the semiconductor microwave generator 10; the microwave input device and the microwave signal input The mouthpiece is connected; the microwave output device is connected to the microwave signal output port 131 through the converter 80.
  • the microwave signal output port 131 is disposed on the front or the back of the semiconductor microwave generator 10, and the microwave output device is connected to the microwave signal output port 131, that is, the microwave output device and the semiconductor microwave
  • the front side or the back side of the generator 10 is vertically connected, which effectively reduces the maximum distance between the semiconductor microwave generator 10 and the cooking cavity, thereby effectively reducing the volume of the microwave oven, and making the structural design and shape design of the microwave oven simple and convenient.
  • the manufacturing cost of the microwave oven is effectively reduced; in addition, the structure of the converter 80 is simple, so that the connection between the microwave output device and the microwave signal output port 131 is simple and reliable, and the assembly difficulty of the connection structure of the semiconductor microwave generator is effectively reduced. .
  • the semiconductor microwave generator 10 includes: a heat sink 11, a metal substrate 12, a printed circuit board 13 and a shield case 14;
  • the metal substrate 12 is mounted on the heat sink 11; the back surface of the printed circuit board 13 is fixedly connected to the metal substrate 12, the microwave signal output port 131 and the microwave signal input port are both disposed on the printed circuit board 13, and the microwave signal output port 131 is located in the printed circuit
  • the converter 80 is mounted on the printed circuit board 13 with respect to the microwave signal output port 131; the shield case 14 is disposed on the front side and the side surface of the printed circuit board 13.
  • the heat dissipating device 11 effectively ensures that the heat of the printed circuit board 13 can be dissipated in time, thereby ensuring the service life of the printed circuit board 13;
  • the metal substrate 12 makes the connection between the printed circuit board 13 and the heat dissipating device 11 simple and convenient, and
  • the metal has good thermal conductivity, thereby effectively ensuring the heat dissipation effect of the printed circuit board 13;
  • the shielding cover 14 is disposed to effectively ensure the sealing performance of the semiconductor microwave generator.
  • the heat sink 11 is a heat sink or a fan.
  • the converter 80 is provided with a microstrip line 81.
  • the first end of the microstrip line 81 is connected to the microwave output device, and the second end is connected to the microwave signal output port 131.
  • the converter 80 is a metal block, and an epoxy resin layer is disposed between the microstrip line 81 and the metal block, and the microstrip line 81 is a copper wire.
  • the epoxy strip microstrip line 81 is separated from the metal block, which effectively prevents the metal block from affecting the performance of the microstrip line 81, thereby ensuring the use effect of the microstrip line 81.
  • the microwave output device is a third RF connector 90, and the socket 91 of the third RF connector is connected to the first end of the microstrip line 81.
  • the third RF connector 90 has a simple structure and is convenient to install, and effectively reduces semiconductor microwave generation.
  • the installation difficulty of the connection structure of the device improves the assembly efficiency of the connection structure of the semiconductor microwave generator.
  • the socket 91 of the third RF connector is soldered or snapped or screwed onto the converter 80; the converter 80 is soldered or snapped or screwed onto the printed circuit board 13; the plug 92 of the third RF connector can be Connected to the cooking cavity.
  • the soldering or the snapping or the screwing have good connection strength, thereby effectively ensuring the connection strength between the socket 91 of the RF connector and the printed circuit board 13, and the connection strength between the converter 80 and the printed circuit board 13. .
  • the microwave output device is a magnetron output assembly (not shown), and the magnetron output assembly includes: a magnetron antenna, a first bottom plate, and a first fixed ring, A fixing ring and a first bottom plate are sleeved on the magnetron antenna, and one end of the magnetron antenna is connected to the first end of the microstrip line 31.
  • the magnetron output component comprises a magnetron antenna, a first bottom plate and a first fixing ring, and has a simple structure, is easy to process and manufacture, thereby effectively reducing the processing difficulty of the microwave output device, and the magnetron output component has a large power.
  • the utility model has the advantages of high efficiency, small size, light weight and low cost, thereby effectively ensuring that the food in the cooking chamber is heated sufficiently in the predetermined heating time, thereby effectively improving the product quality.
  • the microwave output device is a probe output assembly (not shown), and the probe output assembly includes: a probe, a second bottom plate and a second fixed ring, and a second fixed ring and The second bottom plate is sleeved on the probe, and one end of the probe is connected to the first end of the microstrip line 81.
  • the probe output component comprises a probe, a second bottom plate and a second fixing ring, has a simple structure, is easy to be processed and manufactured, thereby effectively reducing the processing difficulty of the microwave output device, and the probe has good microwave conduction efficiency, thereby effectively It is ensured that the food in the cooking chamber is heated sufficiently during the predetermined heating time, thereby effectively improving the product quality.
  • the RF connector is separated, so that the RF connector of this embodiment is modified into a third RF connector, and the third RF connector can be a first RF connector or a second RF connector, "first", " The second and third are for illustrative purposes only.
  • a microwave oven (not shown) provided in some embodiments of the sixth aspect of the present invention, comprising: a cooking cavity and a semiconductor microwave generator connection structure of the microwave oven provided by any of the above fifth embodiments,
  • the microwave output device of the semiconductor microwave generator connection structure of the microwave oven is in communication with the cooking cavity.
  • the microwave oven provided in this embodiment has the semiconductor microwave generator connection structure of the microwave oven provided by any one of the foregoing fifth embodiments. Therefore, the microwave oven has the semiconductor microwave generator connection structure of the microwave oven provided by any of the above fifth embodiments.
  • the whole beneficial effect is that the microwave oven has the advantages of small volume, low cost and the like.
  • the semiconductor microwave generator connection structure of the microwave oven is located on the top or bottom wall or the side wall or the rear wall of the cooking cavity.
  • the semiconductor microwave generator connection structure is located on the top wall or the bottom wall or the side wall or the back wall of the cooking cavity, so that the installation of the semiconductor microwave generator connection structure is simple and convenient, so that the structural design and shape design of the microwave oven are simple and convenient, and thus effective
  • the ground has improved the production efficiency of the microwave oven.
  • the microwave output device is vertically connected to the front or back surface of the semiconductor microwave generator, thereby effectively reducing the semiconductor microwave generator and the cooking cavity.
  • the microwave oven provided by the embodiment has the advantages of small volume, low cost, and the like;
  • the volume of the microwave oven makes the microwave
  • the design and the shape design are simple and
  • the microwave oven provided by the embodiment of the fourth aspect of the present invention has the advantages of small volume, low cost, and the like;
  • the generator connection structure, the microwave signal output port is disposed on the front or the back of the semiconductor microwave generator, and the microwave output device is connected to the microwave signal output port, that is, the microwave output device is vertically connected to the front or back surface of the semiconductor microwave generator, and is effectively reduced
  • the maximum distance between the semiconductor microwave generator and the cooking cavity is reduced, thereby effectively reducing the volume of the microwave oven, making the structural design and shape design of the microwave simple and convenient, thereby effectively reducing the manufacturing cost of the microwave oven;
  • the structure of the device is simple, so that the connection between the microwave output device and the microwave signal output port is simple and reliable, and the connection structure of the semiconductor microwave generator is effectively reduced. Difficulty, the microwave oven provided by the sixth aspect of the invention has the advantages of small size, low cost and the like.
  • connection may be a fixed connection, a detachable connection, or an integral Connections; “connected” can be directly connected or indirectly connected through an intermediate medium.
  • connecting may be a fixed connection, a detachable connection, or an integral Connections; “connected” can be directly connected or indirectly connected through an intermediate medium.
  • the description of the terms “one embodiment”, “some embodiments”, “specific embodiments” and the like means that the specific features, structures, materials, or characteristics described in connection with the embodiments or examples are included in the present invention. At least one embodiment or example.
  • the schematic representation of the above terms does not necessarily refer to the same embodiment or example.
  • the particular features, structures, materials, or characteristics described may be combined in a suitable manner in any one or more embodiments or examples.

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Abstract

一种微波炉的半导体微波发生器连接结构、微波炉的半导体微波发生器输入输出连接结构和微波炉。其中，微波炉的半导体微波发生器连接结构包括：半导体微波发生器（10）和微波输出装置（20），半导体微波发生器（10）的正面或背面设置有微波信号输出口（131）；微波输出装置（20）的第一端与微波信号输出口（131）相连接，第二端与微波炉的烹饪腔体（50）相连通。通过微波输出装置（20）与半导体微波发生器（10）的正面或背面相连接，有效地减小了半导体微波发生器（10）与烹饪腔体（50）之间的最大距离，从而有效地减小微波炉的体积，使得微波的结构设计和形状设计简单方便，进而有效地降低了微波炉的制造成本。

Description

微波炉的半导体微波发生器连接结构、微波炉的半导体微波发生器输入输出连接结构和微波炉 技术领域
本发明涉及家用电器领域，更具体而言，涉及一种用于微波炉的半导体微波发生器连接结构及含有该半导体微波发生器连接结构的微波炉、一种用于微波炉的半导体微波发生器输入输出连接结构及含有该半导体微波发生器输入输出连接结的微波炉、以及另一种用于微波炉的半导体微波发生器连接结构及含有该半导体微波发生器连接结构的微波炉。
背景技术
如图1所示，目前的微波炉的半导体微波发生器10’连接结构，主要是在微波发生器10’的侧面设置微波输出口，射频连接器20’等微波输出装置在侧面与其连接并从PCB板(印刷电路板)引出微波信号。
为了实现微波的传输，需要将射频连接器20’从微波发生器10’引出的微波信号采用直接连接或电缆连接等方式传递到微波馈入装置，最后接入波导盒。
如图2A-2B所示，现有技术使用的微波炉的微波主要从烹饪腔体30’的顶部、底部、左侧、右侧等馈入，而射频连接器20’连接在微波发生器10’侧面，使得微波发生器10’与烹饪腔体30’之间的最大距离较大，即L值较大，导致微波炉的体积增大，从而限制了结构设计与微波炉的形状，进而加大了微波炉的制造成本。
为了解决上述问题，现有技术将波导盒与微波发生器10’采用电缆连接的方式实现微波传输，这样虽然可以使微波炉体积减小，但却增大了传输损耗以及工作时间，在预定加热时间内，可能导致食物加热不充分；并且在批量生产时，导致生产效率低。
微波炉是用来加热或烹饪的常用器具，其原理是利用微波使食物的水分子 产生高频振荡，从而摩擦生热来加热或烹饪食物。传统的微波炉包括电源、变压器、磁控管、高压电容、腔体、炉门等部分。其中，磁控管是产生微波的核心部件，其受高压电源的激励产生微波，通过波导传输并耦合至放置食物的腔体内。传统微波炉的磁控管工作电压为4000伏特，存在用电安全隐患，损耗大，微波炉形状也受到很大限制。
随着技术发展，出现了采用半导体微波发生器代替磁控管产生微波的半导体微波炉，半导体微波发生器主要包括微波信号产生电路和功率放大电路，通过连接装置从微波发生器上引出微波并将其通过一定方式馈入波导盒，最后均匀传送到腔体。该微波发生器采用全直流低电压供电，用电安全，损耗小，使用寿命长，同时可以使微波炉的形状多样化。
目前使用的微波炉的半导体微波发生器连接结构主要是在微波发生器的侧面设置信号输入口和信号输出口，射频连接器在侧面与其连接，并给PCB板(印刷电路板)提供微波信号同时从PCB板引出微波信号。
射频连接器连接在微波发生器侧面，使得微波发生器与烹饪腔体之间的最大距离较大，导致微波炉的体积增大，从而限制了结构设计与微波炉的形状，进而加大了微波炉的制造成本。
发明内容
本发明旨在至少解决现有技术中存在的技术问题之一。
为此，本发明的第一个目的在于，提供一种结构简单紧凑，能够有效地缩短微波发生器与烹饪腔体之间的距离，并保证微波传导效率的微波炉的半导体微波发生器连接结构。
本发明的第二个目的在于，提供一种微波炉，包括上述半导体微波发生器连接结构。
本发明的第三个目的在于，提供一种结构简单紧凑，能够有效地缩短微波发生器与烹饪腔体之间的距离的微波炉的半导体微波发生器输入输出连接结构。
本发明的第四个目的在于，提供一种微波炉，包括上述半导体微波发生器输入输出连接结构。
本发明的第五个目的在于，提供一种结构简单紧凑，能够有效地缩短微波发生器与烹饪腔体之间的距离的微波炉的半导体微波发生器连接结构。
本发明的第六个目的在于，提供一种微波炉，包括上述半导体微波发生器连接结构。
为实现上述目的，本发明第一方面实施例提供了一种微波炉的半导体微波发生器连接结构，包括：半导体微波发生器，所述半导体微波发生器的正面或背面设置有微波信号输出口；和微波输出装置，所述微波输出装置的第一端与所述微波信号输出口相连接，第二端与微波炉的烹饪腔体相连通。
本发明提供的微波炉的半导体微波发生器连接结构，微波信号输出口设置在半导体微波发生器的正面或背面，微波输出装置的第一端与微波信号输出口相连接，第二端与烹饪腔体相连接，即微波输出装置与半导体微波发生器的正面或者背面垂直连接，有效地减小了半导体微波发生器与烹饪腔体之间的最大距离，即使得L值大大降低，从而有效地减小了微波炉的体积，使得微波的结构设计和形状设计简单方便，进而有效地降低了微波炉的制造成本。
另外，根据本发明第一方面实施例提供的微波炉的半导体微波发生器连接结构还具有如下附加技术特征：
根据本发明的一个实施例，所述烹饪腔体的腔壁上设置有波导盒，所述波导盒与所述烹饪腔体相连通，所述波导盒的顶面设置有波导孔；所述半导体微波发生器包括：散热装置；金属基板，所述金属基板安装在所述散热装置上；印刷电路板，所述印刷电路板的正面设置有所述微波信号输出口，所述印刷电路板的背面与所述金属基板固定连接；和屏蔽罩，所述屏蔽罩罩设在所述印刷电路板的正面及侧面；所述微波输出装置的所述第一端穿过所述屏蔽罩与所述微波信号输出口相连接，所述第二端通过所述波导孔与所述波导盒相连通。
在烹饪腔体上设置波导盒，使得微波输出装置与烹饪腔体之间的连接简单方便；散热装置有效地保证了印刷电路板的热量能够及时地散发出去，从而保证了印刷电路板的使用寿命；金属基板使得印刷电路板与散热装置之间的连接简单方便，且金属具有良好的导热性，从而有效地保证了印刷电路板的散热效果；屏蔽罩的设置，有效地保证了半导体微波发生器的密封性，从而使得半导 体微波发生器发出的微波可全部经微波输出装置、波导盒进入烹饪腔体内。
根据本发明的一个实施例，所述微波输出装置包括：第一射频连接器，所述第一射频连接器的插座与所述微波信号输出口相连接；和第二射频连接器，所述第二射频连接器的插座通过所述波导孔与所述波导盒相连接；所述第一射频连接器的插头与所述第二射频连接器的插头相连接，且所述第一射频连接器的插头和所述第二射频连接器的插头中的一个为阳头，另一个为阴头。
微波输出装置包括分别安装在半导体微波发生器和波导盒上的第一射频连接器和第二射频连接器，通过相配对的第一射频连接器的插头和第二射频连接器的插头相连接，将半导体微波发生器与微波炉腔体相连通，射频连接器结构简单，安装方便，有效地降低了半导体微波发生器连接结构的安装难度，提高了半导体微波发生器连接结构的装配效率。
根据本发明的一个实施例，所述微波输出装置还包括：微波馈入装置，所述第二射频连接器的插座与所述波导盒通过所述微波馈入装置相连接。
微波馈入装置的设置有效地保证了微波传输效率，从而有效地保证了在预定加热时间内，烹饪腔体内的食物加热充分，进而有效地提高了产品品质。
根据本发明的一个实施例，所述微波馈入装置为天线或者探针。
天线或者探针均具有效率高的优点，可有效提高微波传输效率。
根据本发明的一个实施例，所述微波输出装置为磁控管输出组件，所述磁控管输出组件包括：磁控管天线、第一底板、第一固定环和第二固定环，所述第一固定环、所述第二固定环和所述第一底板依次连接，所述第一底板与所述波导盒相连接，所述磁控管天线通过所述第一固定环、所述第二固定环和所述第一底板固定在所述波导盒上，所述磁控管天线的一端穿过所述屏蔽罩与所述微波信号输出口相连接。
磁控管输出组件包括磁控管天线、第一底板、第一固定环和第二固定环，结构简单，易加工制造成型，从而有效地降低了微波输出装置的加工难度，且磁控管输出组件具有功率大、效率高、尺寸小、重量轻及成本低等优点，从而有效地保证了在预定加热时间内，烹饪腔体内的食物加热充分，进而有效地提高了产品品质。
根据本发明的一个实施例，所述微波输出装置为探针输出组件，所述探 针输出组件包括：探针、第二底板和第三固定环，所述第三固定环与所述第二底板相连接，所述第二底板与所述波导盒固定连接，所述探针通过所述第二底板和所述第三固定环固定在所述波导盒上，所述探针的一端穿过所述屏蔽罩与所述微波信号输出口相连接。
探针输出组件包括探针、第二底板和第三固定环，结构简单，易加工制造成型，从而有效地降低了微波输出装置的加工难度，且探针具有良好的微波传导效率，从而有效地保证了在预定加热时间内，烹饪腔体内的食物加热充分，进而有效地提高了产品品质。
根据本发明的一个实施例，所述半导体微波发生器包括：金属基板，所述金属基板安装在所述烹饪腔体上；印刷电路板，所述印刷电路板的背面设置有所述微波信号输出口，所述印刷电路板的背面与所述金属基板固定连接；和屏蔽罩，所述屏蔽罩罩设在所述印刷电路板的正面及侧面；所述微波输出装置的所述第一端穿过所述金属基板与所述微波信号输出口相连接。
微波炉为未设有波导盒的平板微波炉时，半导体微波发生器不设置散热装置，将金属基板紧贴在烹饪腔体上，利用烹饪腔体散热，同时将自身的部分热量传送到腔体内，实现废热利用，有效地提高了能量利用率，并节省了能源。
本发明第二方面实施例提供了一种微波炉，包括：烹饪腔体和上述第一方面任一实施例提供的微波炉的半导体微波发生器连接结构；所述的微波炉的半导体微波发生器连接结构的微波输出装置的第二端与所述烹饪腔体相连通。
本发明第二方面实施例提供的微波炉，具有上述第一方面任一实施例提供的微波炉的半导体微波发生器连接结构，因此，该微波炉具有上述第一方面任一实施例提供的微波炉的半导体微波发生器连接结构的全部有益效果，即该微波炉具有体积小、成本低等优点。
根据本发明的一个实施例，所述微波炉的半导体微波发生器连接结构位于所述烹饪腔体的顶壁或者底壁或者侧壁或者后壁上。
半导体微波发生器连接结构位于烹饪腔体的顶壁或者底壁或者侧壁或者后壁上，使得半导体微波发生器连接结构的安装简单方便，从而使得微波的结构设计和形状设计简单方便，进而有效地提高了微波炉的生产效率。
本发明第三方面实施例提供了一种微波炉的半导体微波发生器输入输 出连接结构，包括：半导体微波发生器，所述半导体微波发生器设置有微波信号输出口和微波信号输入口，所述微波信号输出口位于所述半导体微波发生器的正面或背面；微波输入装置，所述微波输入装置安装在所述半导体微波发生器上，并与所述微波信号输入口相连接；和微波输出装置，所述微波输出装置安装在所述半导体微波发生器上，并与所述微波信号输出口相连接。
本发明提供的微波炉的半导体微波发生器输入输出连接结构，微波信号输出口设置在半导体微波发生器的正面或背面，微波输出装置相对于微波信号输出口安装在半导体微波发生器上，并与微波信号输出口相连接，即微波输出装置与半导体微波发生器的正面或者背面垂直连接，有效地减小了半导体微波发生器与烹饪腔体之间的最大距离，从而有效地减小了微波炉的体积，使得微波的结构设计和形状设计简单方便，进而有效地降低了微波炉的制造成本；微波输入装置的设置，有效地保证了半导体微波发生器可同时接收和发送微波信号。
另外，根据本发明第三方面实施例提供的微波炉的半导体微波发生器输入输出连接结构还具有如下附加技术特征：
根据本发明的一个实施例，所述半导体微波发生器包括：金属基板；印刷电路板，所述印刷电路板的背面与所述金属基板固定连接，所述微波信号输出口和所述微波信号输入口均设置在所述印刷电路板上，所述微波信号输出口位于所述印刷电路板的正面或背面中的一面上；和屏蔽罩，所述屏蔽罩罩设在所述印刷电路板的正面及侧面；所述微波输出装置穿过所述屏蔽罩或所述金属基板安装在所述印刷电路板上。
金属基板使得印刷电路板与散热装置之间的连接简单方便，且金属具有良好的导热性，从而有效地保证了印刷电路板的散热效果；屏蔽罩的设置，有效地保证了半导体微波发生器的密封性。
根据本发明的一个实施例，所述微波输出装置为第一射频连接器，所述第一射频连接器的插座与所述微波信号输出口相连接，所述第一射频连接器的插头穿出所述屏蔽罩或所述金属基板，并通过第一法兰盘与所述屏蔽罩或所述金属基板固定连接。
射频连接器结构简单，安装方便，有效地降低了半导体微波发生器连接结 构的安装难度，提高了半导体微波发生器输入输出连接结构的装配效率；第一法兰盘的设置，一方面，保证了第一射频连接器的插头与屏蔽罩或金属基板之间的连接强度，另一方面，保证了第一射频连接器的插头与半导体微波发生器之间的密封性。
根据本发明的一个实施例，所述第一射频连接器的插座焊接或者卡接或者螺接在所述印刷电路板上。
焊接或者卡接或者螺接均具有良好的连接强度，从而有效地保证了第一射频连接器的插座与印刷电路板之间的连接强度。
根据本发明的一个实施例，所述微波输出装置为磁控管输出组件，所述磁控管输出组件包括：磁控管天线、第一底板和第一固定环，所述第一固定环和所述第一底板套设在所述磁控管天线上，所述磁控管天线的一端穿过所述屏蔽罩或所述金属基板与所述微波信号输出口相连接。
磁控管输出组件包括磁控管天线、第一底板和第一固定环，结构简单，易加工制造成型，从而有效地降低了微波输出装置的加工难度，且磁控管输出组件具有功率大、效率高、尺寸小、重量轻及成本低等优点，从而有效地保证了在预定加热时间内，烹饪腔体内的食物加热充分，进而有效地提高了产品品质。
根据本发明的一个实施例，所述微波输出装置为探针输出组件，所述探针输出组件包括：探针、第二底板和第二固定环，所述第二固定环和所述第二底板套设在所述探针上，所述探针的一端穿过所述屏蔽罩或所述金属板与所述微波信号输出口相连接。
探针输出组件包括探针、第二底板和第二固定环，结构简单，易加工制造成型，从而有效地降低了微波输出装置的加工难度，且探针具有良好的微波传导效率，从而有效地保证了在预定加热时间内，烹饪腔体内的食物加热充分，进而有效地提高了产品品质。
根据本发明的一个实施例，所述微波输入装置为第二射频连接器，所述第二射频连接器的插座与所述微波信号输入口相连接，所述第二射频连接器的插头位于半导体微波发生器的外部。
射频连接器结构简单，安装方便，有效地降低了半导体微波发生器连接结 构的安装难度，提高了半导体微波发生器输入输出连接结构的装配效率。
根据本发明的一个实施例，所述微波信号输入口位于所述印刷电路板的正面或者背面或者背面，所述第二射频连接器的插头穿出所述屏蔽罩或所述金属基板，并通过第二法兰盘与所述屏蔽罩或所述金属基板固定连接。
第二射频连接器的插头通过第二法兰盘与屏蔽罩或金属基板固定连接，第二法兰盘的设置，一方面，保证了第二射频连接器的插头与屏蔽罩或金属基板之间的连接强度，另一方面，保证了第二射频连接器的插头与半导体微波发生器之间的密封性。
本发明第四方面实施例提供了一种微波炉，包括：烹饪腔体和上述第三方面任一实施例提供的微波炉的半导体微波发生器输入输出连接结构，所述微波炉的半导体微波发生器输入输出连接结构的微波输入装置与所述烹饪腔体相连通。
本发明第四方面实施例提供的微波炉，具有上述第三方面任一实施例提供的微波炉的半导体微波发生器输入输出连接结构，因此，该微波炉具有上述第三方面任一实施例提供的微波炉的半导体微波发生器输入输出连接结构的全部有益效果，即该微波炉具有体积小、成本低等优点。
根据本发明的一个实施例，所述微波炉的半导体微波发生器输入输出连接结构位于所述烹饪腔体的顶壁或者底壁或者侧壁或者后壁上。
半导体微波发生器输入输出连接结构位于烹饪腔体的顶壁或者底壁或者侧壁或者后壁上，使得半导体微波发生器连接结构的安装简单方便，从而使得微波的结构设计和形状设计简单方便，进而有效地提高了微波炉的生产效率。
本发明第五方面的实施例提供了一种微波炉的半导体微波发生器连接结构，包括：半导体微波发生器，所述半导体微波发生器设置有微波信号输出口和微波信号输入口，所述微波信号输出口位于所述半导体微波发生器的正面或者背面；微波输入装置，所述微波输入装置与所述微波信号输入口相连接；和微波输出装置，所述微波输出装置通过转换器与所述微波信号输出口相连接。
本发明提供的微波炉的半导体微波发生器连接结构，微波信号输出口设置 在半导体微波发生器的正面或背面，微波输出装置通过转换器与微波信号输出口相连接，即微波输出装置与半导体微波发生器的正面或者背面垂直连接，有效地减小了半导体微波发生器与烹饪腔体之间的最大距离，从而有效地减小了微波炉的体积，使得微波炉的结构设计和形状设计简单方便，进而有效地降低了微波炉的制造成本；另外，转换器的结构简单，使得微波输出装置与微波信号输出口之间的连接简单可靠，有效地降低了半导体微波发生器连接结构的装配难度。
另外，根据本发明第五方面实施例提供的微波炉的半导体微波发生器连接结构还具有如下附加技术特征：
根据本发明的一个实施例，所述半导体微波发生器包括：散热装置；金属基板，所述金属基板安装在所述散热装置上；印刷电路板，所述印刷电路板的背面与所述金属基板固定连接，所述微波信号输出口和所述微波信号输入口均设置在所述印刷电路板上，所述微波信号输出口位于所述印刷电路板的正面或背面中的一面上，所述转换器相对于所述微波信号输出口安装在所述印刷电路板上；和屏蔽罩，所述屏蔽罩罩设在所述印刷电路板的正面及侧面。
散热装置有效地保证了印刷电路板的热量可及时的散发出去，从而保证了印刷电路板的使用寿命；金属基板使得印刷电路板与散热装置之间的连接简单方便，且金属具有良好的导热性，从而有效地保证了印刷电路板的散热效果；屏蔽罩的设置，有效地保证了半导体微波发生器的密封性。
根据本发明的一个实施例，所述转换器上设置有微带线，所述微带线的第一端与所述微波输出装置相连接，第二端与所述微波信号输出口相连接。
微波输出装置与半导体微波发生器通过转换器上的微带线连接，通过微带线传导微波信号，有效的保证了微波信号传导效率。
根据本发明的一个实施例，所述微波输出装置为射频连接器，所述射频连接器的插座与所述微带线的所述第一端相连接。
射频连接器结构简单，安装方便，有效地降低了半导体微波发生器连接结构的安装难度，提高了半导体微波发生器连接结构的装配效率。
根据本发明的一个实施例，所述射频连接器的插座焊接或者卡接或者螺接在所述转换器上；所述转换器焊接或者卡接或者螺接在所述印刷电路板上。
焊接或者卡接或者螺接均具有良好的连接强度，从而有效的保证了射频连接器的插座与印刷电路板之间的连接强度，以及转换器与印刷电路板之间的连接强度。
根据本发明的一个实施例，所述转换器为金属块，所述微带线与所述金属块之间设置有环氧树脂层。
采用环氧树脂件微带线与金属块隔开，有效地避免了金属块影响微带线的使用性能，从而保证微带线的使用效果。
根据本发明的一个实施例，所述微波输出装置为磁控管输出组件，所述磁控管输出组件包括：磁控管天线、第一底板和第一固定环，所述第一固定环和所述第一底板套设在所述磁控管天线上，所述磁控管天线的一端与所述微带线的所述第一端相连接。
磁控管输出组件包括磁控管、第一底板和第一固定环，结构简单，易加工制造成型，从而有效地降低了微波输出装置的加工难度，且磁控管输出组件具有功率大、效率高、尺寸小、重量轻及成本低等优点，从而有效地保证了在预定加热时间内，烹饪腔体内的食物加热充分，进而有效地提高了产品品质。
根据本发明的一个实施例，所述微波输出装置为探针输出组件，所述探针输出组件包括：探针、第二底板和第二固定环，所述第二固定环和所述第二底板套设在所述探针上，所述探针的一端与所述微带线的所述第一端相连接。
探针输出组件包括探针、第二底板和第二固定环，结构简单，易加工制造成型，从而有效地降低了微波输出装置的加工难度，且探针具有良好的微波传导效率，从而有效地保证了在预定加热时间内，烹饪腔体内的食物加热充分，进而有效地提高了产品品质。
本发明第六方面实施例提供了一种微波炉，包括：烹饪腔体和上述第五方面任一实施例提供的微波炉的半导体微波发生器连接结构，所述微波炉的半导体微波发生器连接结构的微波输出装置与所述烹饪腔体相连通。
本发明第六方面实施例提供的微波炉，具有上述第五方面任一实施例提供的微波炉的半导体微波发生器连接结构，因此，该微波炉具有上述第五方面任一实施例提供的微波炉的半导体微波发生器连接结构的全部有益效果，即该微 波炉具有体积小、成本低等优点。
根据本发明的一个实施例，所述微波炉的半导体微波发生器连接结构位于所述烹饪腔体的顶壁或者底壁或者侧壁或者后壁上。
半导体微波发生器连接结构位于烹饪腔体的顶壁或者底壁或者侧壁或者后壁上，使得半导体微波发生器连接结构的安装简单方便，从而使得微波炉的结构设计和形状设计简单方便，进而有效地提高了微波炉的生产效率。
本发明的附加方面和优点将在下面的描述部分中给出，部分将从下面的描述中变得明显，或通过本发明的实践了解到。
附图说明
本发明的上述和/或附加的方面和优点从结合下面附图对实施例的描述中将变得明显和容易理解，其中：
图1是现有技术使用的半导体微波发生器连接结构的结构示意图；
图2A-2B是现有技术使用的具有图1所示的半导体微波发生器连接结构的微波炉；
图3是根据本发明第一个实施例所述的微波炉的半导体微波发生器连接结构的第一种结构示意图；
图4是图3所示的微波炉的半导体微波发生器连接结构与波导盒连接结构示意图；
图5是图3所示的微波炉的半导体微波发生器连接结构中微波输出装置与印刷电路板相连接的结构示意图；
图6是图3所示的微波炉的半导体微波发生器连接结构中微波输出装置与波导盒的第一种连接结构示意图；
图7是图3所示的微波炉的半导体微波发生器连接结构中微波输出装置与波导盒的第二种连接结构示意图；
图8是图3所示的微波炉的半导体微波发生器连接结构中微波输出装置与波导盒的第三种连接结构示意图；
图9是根据本发明第一个实施例所述的微波炉的半导体微波发生器连接结构的第二种结构与波导盒连接的示意图；
图10是图9所示的微波炉的半导体微波发生器连接结构中微波输出装置的结构示意图；
图11是根据本发明第一个实施例所述的微波炉的半导体微波发生器连接结构的第三种结构与波导盒连接的示意图；
图12是图11所示的微波炉的半导体微波发生器连接结构中微波输出装置的结构示意图；
图13是根据本发明第二个实施例所述的微波炉的第一种结构示意图；
图14是根据本发明第二个实施例所述的微波炉的第二种结构示意图；
图15是根据本发明第二个实施例所述的微波炉的第三种结构示意图；
图16是根据本发明第三个实施例所述的微波炉的半导体微波发生器输入输出连接结构的结构示意图；
图17是根据本发明第五个实施例所述的微波炉的半导体微波发生器连接结构的结构示意图。
其中，图1至图2B中附图标记与部件名称之间的对应关系为：
10’微波发生器，20’射频连接器，30’烹饪腔体。
图3至图17中附图标记与部件名称之间的对应关系为：
10半导体微波发生器，11散热装置，12金属基板，13印刷电路板，131微波信号输出口，132微波信号输入口，14屏蔽罩，20微波输出装置，21第一射频连接器，211第一射频连接器的插座，212第一射频连接器的插头，22第二射频连接器，221第二射频连接器的插座，222第二射频连接器的插头，23馈入装置，24内导体，25外导体，26微带线，30磁控管输出组件，311陶瓷环，312阳极输出端管壳，313排气口，314磁控管天线，315天线帽，32第一底板，33第一固定环，34第二固定环，40探针输出组件，41探针，42第二底板，43第三固定环，50烹饪腔体，60波导盒，71第一法兰盘，72第二法兰盘，80转换器，81转换器的微带线，90第三射频连接器，91第三射频连接器的插座，92第三射频连接器的插头。
具体实施方式
为了能够更清楚地理解本发明的上述目的、特征和优点，下面结合附 图和具体实施方式对本发明进行进一步的详细描述。需要说明的是，在不冲突的情况下，本申请的实施例及实施例中的特征可以相互组合。
在下面的描述中阐述了很多具体细节以便于充分理解本发明，但是，本发明还可以采用其他不同于在此描述的方式来实施，因此，本发明的保护范围并不受下面公开的具体实施例的限制。
下面参照附图1至附图12描述根据本发明第一方面一些实施例提供的微波炉的半导体微波发生器连接结构。
如图1、图9和图11所示，本发明第一方面一些实施例提供的微波炉的半导体微波发生器连接结构包括：半导体微波发生器10和微波输出装置20。
其中，半导体微波发生器10的正面或背面设置有微波信号输出口131；微波输出装置20的第一端与微波信号输出口131相连接，第二端与微波炉的烹饪腔体50相连通。
本实施例提供的微波炉的半导体微波发生器连接结构，微波信号输出口131设置在半导体微波发生器10的正面或背面，微波输出装置20的第一端与微波信号输出口131相连接，第二端与烹饪腔体50相连接，即微波输出装置20与半导体微波发生器10的正面或者背面垂直连接，有效地减小了半导体微波发生器10与烹饪腔体50之间的最大距离，即使得L值大大降低，从而有效地减小了微波炉的体积，使得微波的结构设计和形状设计简单方便，进而有效地降低了微波炉的制造成本。
根据本发明的一个实施例提供的微波炉的半导体微波发生器连接结构，优选地，烹饪腔体50的腔壁上设置有波导盒60，波导盒60与烹饪腔体50相连通，波导盒60的顶面设置有波导孔；
如图3所示，半导体微波发生器10包括：散热装置11、金属基板12、印刷电路板13和屏蔽罩14，其中，金属基板12安装在散热装置11上；印刷电路板13的正面设置有微波信号输出口131，印刷电路板13的背面与金属基板12固定连接；屏蔽罩14罩设在印刷电路板13的正面及侧面；微波输出装置20的第一端穿过屏蔽罩14与微波信号输出口131相连接，第二端通过波导孔与波导盒60相连通。
在烹饪腔体50上设置波导盒60，使得微波输出装置20与烹饪腔体50之间的连接简单方便；散热装置11可有效地保证了印刷电路板13的热量可及时的散发出去，从而保证了印刷电路板13的使用寿命；金属基板12使得印刷电路板13与散热装置11之间的连接简单方便，且金属具有良好的导热性，从而有效地保证了印刷电路板13的散热效果；屏蔽罩14的设置，有效地保证了半导体微波发生器10发出的微波可全部经微波输出装置20、波导盒60进入烹饪腔体50内。
可选地，散热装置11为散热片或者风扇。
如图4所示，在本实施例的第一个具体实施例中，微波输出装置20包括：第一射频连接器21和第二射频连接器22，第一射频连接器的插头212与第二射频连接器的插头222相连接，且第一射频连接器的插头212和第二射频连接器的插头222中的一个为阳头，另一个为阴头；第一射频连接器的插座211与微波信号输出口131相连接；第二射频连接器的插座221通过波导孔与波导盒60相连接。
微波输出装置20包括分别安装在半导体微波发生器10和波导盒60上的第一射频连接器21和第二射频连接器22，通过相配对的第一射频连接器的插头212和第二射频连接器的插头222相连接，将半导体微波发生器10与微波炉腔体相连通，射频连接器结构简单，安装方便，有效地降低了半导体微波发生器10连接结构的安装难度，提高了半导体微波发生器10连接结构的装配效率。
如图5所示，可选地，第一射频连接器21和第二射频连接器22均为同轴射频连接器，同轴射频连接器的内导体24与微带线26连接，外导体25避让微带线26与印刷电路板13板连接。
当然，上述连接结构并不局限于同轴连接器，其适用于任何连接器型号，根据不同的型号，可以采用不同的固定方式。
可选地，第一射频连接器的插头212与第二射频连接器的插头222相焊接或者相卡接或者相螺接。
可选地，当第一射频连接器的插头212与第二射频连接器的插头222距离较远时，可采用电缆将第一射频连接器的插头212与第二射频连接器的插头 222连接，此时，电缆的正极与电缆将第一射频连接器的插头212与第二射频连接器的插头222中的阴头连接，负极与电缆将第一射频连接器的插头212与第二射频连接器的插头222中的阳头连接。
优选地，如图6、图7和图8所示，微波输出装置20还包括：微波馈入装置23，第二射频连接器的插座221与波导盒60通过微波馈入装置23相连接。微波馈入装置23的设置有效地保证了微波传输效率，从而有效地保证了在预定加热时间内，烹饪腔体50内的食物加热充分，进而有效地提高了产品品质。
可选地，微波馈入装置23为天线或者探针。天线或者探针均具有良好的微波传导效率，可有效提高微波传输效率。
如图9所示，在本实施例的第二个具体实施例中，微波输出装置20为磁控管输出组件30，磁控管输出组件30包括：磁控管天线314、第一底板32、第一固定环33和第二固定环34，第一固定环33、第二固定环34和第一底板32依次连接，第一底板32与波导盒60相连接，磁控管天线314通过第一固定环33、第二固定环34和第一底板32固定在波导盒60上，磁控管天线314的一端穿过屏蔽罩14与微波信号输出口131相连接。
磁控管输出组件30包括磁控管天线314、第一底板32、第一固定环33和第二固定环34，结构简单，易加工制造成型，从而有效地降低了微波输出装置20的加工难度，且磁控管输出组件具有功率大、效率高、尺寸小、重量轻及成本低等优点，从而有效地保证了在预定加热时间内，烹饪腔体50内的食物加热充分，进而有效地提高了产品品质。
具体地，如图10所示，磁控管输出组件包括陶瓷环311、阳极输出端管壳312、排气口313、磁控管天线314和天线帽315，排气口313通过陶瓷环311与阳极输出端管壳312相连接，天线帽315套设在排气口313上，磁控管天线314依次穿过排气口313、陶瓷环311和阳极输出端管壳312，第一底板32、第一固定环33和第二固定环34位于陶瓷环311和阳极输出端管壳312上。
如图11和图12所示，在本实施例的第三个具体实施例中，微波输出装置为探针输出组件40，探针输出组件40包括：探针41、第二底板42和第三固定环43，第三固定环43与第二底板42相连接，第二底板42与波导盒60 固定连接，探针41通过第二底板42和第三固定环43固定在波导盒60上，探针41的一端穿过屏蔽罩14与微波信号输出口131相连接。
探针输出组件40包括探针41、第二底板42和第三固定环43，结构简单，易加工制造成型，从而有效地降低了微波输出装置20的加工难度，且探针具有良好的微波传导效率，从而有效地保证了在预定加热时间内，烹饪腔体50内的食物加热充分，进而有效地提高了产品品质。
如图13和图14所示，根据本发明的另一个实施例提供的微波炉的半导体微波发生器连接结构，优选地，半导体微波发生器10包括：金属基板12、印刷电路板13和屏蔽罩14，金属基板12安装在烹饪腔体50上；印刷电路板13的背面设置有微波信号输出口131，印刷电路板13的背面与金属基板12固定连接；屏蔽罩14罩设在印刷电路板13的正面及侧面；微波输出装置20的第一端穿过金属基板12与微波信号输出口131相连接。
微波炉为未设有波导盒60的平板微波炉上，半导体微波发生器10不设置散热装置11，将金属基板12紧贴在烹饪腔体50上，利用烹饪腔体50散热，同时将自身的部分热量传送到腔体内，实现废热利用，有效地提高了能量利用率，并节省了能源。
如图13、图14和图15所示，本发明第二方面一些实施例提供的微波炉，包括：烹饪腔体50和上述第一方面任一实施例提供的微波炉的半导体微波发生器连接结构，微波炉的半导体微波发生器连接结构的微波输出装置的第二端与烹饪腔体50相连接。
本实施例提供的微波炉，具有上述第一方面任一实施例提供的微波炉的半导体微波发生器连接结构，因此，该微波炉具有上述第一方面任一实施例提供的微波炉的半导体微波发生器连接结构的全部有益效果，即该微波炉具有体积小、成本低等优点。
根据本发明的一个实施例，微波炉的半导体微波发生器连接结构位于烹饪腔体50的顶壁或者底壁或者侧壁或者后壁上。
半导体微波发生器连接结构位于烹饪腔体50的顶壁或者底壁或者侧壁或者后壁上，使得半导体微波发生器连接结构的安装简单方便，从而使得微波的结构设计和形状设计简单方便，进而有效地提高了微波炉的生产效率。
下面参照附图16描述根据本发明第三方面一些实施例提供的微波炉的半导体微波发生器输入输出连接结构。
如图16所示，本发明第三方面一些实施例提供的微波炉的半导体微波发生器输入输出连接结构，包括：半导体微波发生器10、微波输入装置和微波输出装置。
其中，半导体微波发生器10设置有微波信号输出口131和微波信号输入口132，微波信号输出口131位于半导体微波发生器10的正面或背面；微波输入装置安装在半导体微波发生器10上，并与微波信号输入口132相连接；微波输出装置安装在半导体微波发生器10上，并与微波信号输出口122相连接。
本实施例提供的微波炉的半导体微波发生器输入输出连接结构，微波信号输出口131设置在半导体微波发生器10的正面或背面，微波输出装置与微波信号输出口131相连接，即微波输出装置与半导体微波发生器10的正面或者背面垂直连接，有效地减小了半导体微波发生器10与烹饪腔体之间的最大距离，从而有效地减小了微波炉的体积，使得微波的结构设计和形状设计简单方便，进而有效地降低了微波炉的制造成本；微波输入装置的设置，有效地保证了半导体微波发生器可同时接收和发送微波信号。
优选地，半导体微波发生器10包括：金属基板12、印刷电路板13和屏蔽罩14；
印刷电路板13的背面与金属基板12固定连接，微波信号输出口131和微波信号输入口132均设置在印刷电路板13上，微波信号输出口131位于印刷电路板13的正面或背面中的一面上；屏蔽罩14罩设在印刷电路板13的正面及侧面；微波输出装置穿过屏蔽罩14或金属基板12相对于微波信号输出口131安装在所述印刷电路板13上。
金属基板12使得印刷电路板13与散热装置之间的连接简单方便，且金属具有良好的导热性，从而有效地保证了印刷电路板13的散热效果；屏蔽罩14的设置，有效地保证了半导体微波发生器10的密封性。
具体地，微波输出装置为第一射频连接器21，第一射频连接器的插座211与微波信号输出口131相连接，第一射频连接器的插头212穿出屏蔽罩14或 金属基板12，并通过第一法兰盘71与屏蔽罩14或金属基板12固定连接；微波输入装置为第二射频连接器22，第二射频连接器的插座221与微波信号输入口132相连接，第二射频连接器的插头222位于半导体微波发生器10的外部。
射频连接器结构简单，安装方便，有效地降低了半导体微波发生器10连接结构的安装难度，提高了半导体微波发生器输入输出连接结构的装配效率；第一法兰盘71设置，一方面，保证了第一射频连接器的插头212与屏蔽罩14或金属基板12之间的连接强度，另一方面，保证了第一射频连接器的插头212与半导体微波发生器10之间的密封性。
优选地，第一射频连接器的插座211焊接或者卡接或者螺接在印刷电路板13上；微波信号输入口132位于印刷电路板13的正面或者背面或者侧面，第二射频连接器的插头222穿出屏蔽罩14或金属基板12，并通过第二法兰盘72与屏蔽罩14或金属基板12固定连接。
焊接或者卡接或者螺接均具有良好的连接强度，从而有效的保证了第一射频连接器的插座211与印刷电路板13之间的连接强度；第二射频连接器的插头222通过第二法兰盘72与屏蔽罩14或金属基板12固定连接，第二法兰盘72的设置，一方面，保证了第二射频连接器的插头222与屏蔽罩14或金属基板12之间的连接强度，另一方面，保证了第二射频连接器的插头222与半导体微波发生器10之间的密封性。
可选地，微波输出装置为磁控管输出组件，磁控管输出组件包括：磁控管天线、第一底板和第一固定环，第一固定环和第一底板套设在磁控管天线上，磁控管天线的一端穿过屏蔽罩14或金属基板12与微波信号输出口131相连接。
磁控管输出组件包括磁控管天线、第一底板和第一固定环，结构简单，易加工制造成型，从而有效地降低了微波输出装置的加工难度，且磁控管天线输出组件具有功率大、效率高、尺寸小、重量轻及成本低等优点，从而有效地保证了在预定加热时间内，烹饪腔体内的食物加热充分，进而有效地提高了产品品质。
或者，微波输出装置为探针输出组件，探针输出组件包括：探针、第二底 板和第二固定环，第二固定环和第二底板套设在探针上，探针的一端穿过屏蔽罩14或金属基板12与微波信号输出口131相连接。
探针输出组件包括探针、第二底板和第二固定环，结构简单，易加工制造成型，从而有效地降低了微波输出装置的加工难度，且探针具有良好的微波传导效率，从而有效地保证了在预定加热时间内，烹饪腔体内的食物加热充分，进而有效地提高了产品品质。
本发明第四方面一些实施例提供的微波炉(图中未示出)，包括：烹饪腔体和上述第三方面任一实施例提供的微波炉的半导体微波发生器输入输出连接结构，微波炉的半导体微波发生器输入输出连接结构的微波输入装置与烹饪腔体相连通。
本实施例提供的微波炉，具有上述第三方面任一实施例提供的微波炉的半导体微波发生器输入输出连接结构，因此，该微波炉具有上述第三方面任一实施例提供的微波炉的半导体微波发生器输入输出连接结构的全部有益效果，即该微波炉具有体积小、成本低等优点。
优选地，微波炉的半导体微波发生器输入输出连接结构位于烹饪腔体的顶壁或者底壁或者侧壁或者后壁上。
微波炉的半导体微波发生器输入输出连接结构位于烹饪腔体的顶壁或者底壁或者侧壁或者后壁上，使得微波炉的半导体微波发生器输入输出连接结构的安装简单方便，从而使得微波的结构设计和形状设计简单方便，进而有效地提高了微波炉的生产效率。
下面参照附图17描述根据本发明第五方面一些实施例提供的微波炉的半导体微波发生器连接结构。
如图17所示，本发明第五方面一些实施例提供的微波炉的半导体微波发生器连接结构，包括：半导体微波发生器10、微波输入装置和微波输出装置。
其中，半导体微波发生器10设置有微波信号输出口131和微波信号输入口(图中未示出)，微波信号输出口131位于半导体微波发生器10的正面或者背面；微波输入装置与微波信号输入口相连接；微波输出装置通过转换器80与微波信号输出口131相连接。
本实施例提供的微波炉的半导体微波发生器连接结构，微波信号输出口131设置在半导体微波发生器10的正面或背面，微波输出装置与微波信号输出口131相连接，即微波输出装置与半导体微波发生器10的正面或者背面垂直连接，有效地减小了半导体微波发生器10与烹饪腔体之间的最大距离，从而有效地减小了微波炉的体积，使得微波炉的结构设计和形状设计简单方便，进而有效地降低了微波炉的制造成本；另外，转换器80的结构简单，使得微波输出装置与微波信号输出口131之间的连接简单可靠，有效地降低了半导体微波发生器连接结构的装配难度。
具体地，半导体微波发生器10包括：散热装置11、金属基板12、印刷电路板13和屏蔽罩14；
金属基板12安装在散热装置11上；印刷电路板13的背面与金属基板12固定连接，微波信号输出口131和微波信号输入口均设置在印刷电路板13上，微波信号输出口131位于印刷电路板13的正面或背面中的一面上，转换器80相对于微波信号输出口131安装在印刷电路板13上；屏蔽罩14罩设在印刷电路板13的正面及侧面。
散热装置11有效地保证了印刷电路板13的热量可及时的散发出去，从而保证了印刷电路板13的使用寿命；金属基板12使得印刷电路板13与散热装置11之间的连接简单方便，且金属具有良好的导热性，从而有效地保证了印刷电路板13的散热效果；屏蔽罩14的设置，有效地保证了半导体微波发生器的密封性。
可选地，散热装置11为散热片或者风扇。
优选地，转换器80上设置有微带线81，微带线81的第一端与微波输出装置相连接，第二端与微波信号输出口131相连接。
具体地，转换器80为金属块，微带线81与金属块之间设置有环氧树脂层，微带线81为铜线。采用环氧树脂件微带线81与金属块隔开，有效地避免了金属块影响微带线81的使用性能，从而保证微带线81的使用效果。
根据本实施例的一个具体实施例，优选地，微波输出装置为第三射频连接器90，第三射频连接器的插座91与微带线81的第一端相连接。
第三射频连接器90结构简单，安装方便，有效地降低了半导体微波发生 器连接结构的安装难度，提高了半导体微波发生器连接结构的装配效率。
具体地，第三射频连接器的插座91焊接或者卡接或者螺接在转换器80上；转换器80焊接或者卡接或者螺接在印刷电路板13上；第三射频连接器的插头92可与烹饪腔体相连接。焊接或者卡接或者螺接均具有良好的连接强度，从而有效的保证了射频连接器的插座91与印刷电路板13之间的连接强度，以及转换器80与印刷电路板13之间的连接强度。
根据本实施例的另一个具体实施例，微波输出装置为磁控管输出组件(图中未示出)，磁控管输出组件包括：磁控管天线、第一底板和第一固定环，第一固定环和第一底板套设在磁控管天线上，磁控管天线的一端与微带线31的第一端相连接。
磁控管输出组件包括磁控管天线、第一底板和第一固定环，结构简单，易加工制造成型，从而有效地降低了微波输出装置的加工难度，且磁控管输出组件具有功率大、效率高、尺寸小、重量轻及成本低等优点，从而有效地保证了在预定加热时间内，烹饪腔体内的食物加热充分，进而有效地提高了产品品质。
根据本实施例的又一个具体实施例，微波输出装置为探针输出组件(图中未示出)，探针输出组件包括：探针、第二底板和第二固定环，第二固定环和第二底板套设在探针上，探针的一端与微带线81的第一端相连接。
探针输出组件包括探针、第二底板和第二固定环，结构简单，易加工制造成型，从而有效地降低了微波输出装置的加工难度，且探针具有良好的微波传导效率，从而有效地保证了在预定加热时间内，烹饪腔体内的食物加热充分，进而有效地提高了产品品质。
需要说明的是，在本实施例中，为了将射频连接器与第一方面实施例、第二方面实施例、第三方面实施例和第四方面实施例中的第一射频连接器和第二射频连接器区分开，故将本实施例的射频连接器修改为第三射频连接器，实质上第三射频连接器可以是第一射频连接器或第二射频连接器，“第一”、“第二”、“第三”仅用于描述的目的。
本发明第六方面一些实施例提供的微波炉(图中未示出)，包括：烹饪腔体和上述第五方面任一实施例提供的微波炉的半导体微波发生器连接结构， 微波炉的半导体微波发生器连接结构的微波输出装置与烹饪腔体相连通。
本实施例提供的微波炉，具有上述第五方面任一实施例提供的微波炉的半导体微波发生器连接结构，因此，该微波炉具有上述第五方面任一实施例提供的微波炉的半导体微波发生器连接结构的全部有益效果，即该微波炉具有体积小、成本低等优点。
优选地，微波炉的半导体微波发生器连接结构位于烹饪腔体的顶壁或者底壁或者侧壁或者后壁上。
半导体微波发生器连接结构位于烹饪腔体的顶壁或者底壁或者侧壁或者后壁上，使得半导体微波发生器连接结构的安装简单方便，从而使得微波炉的结构设计和形状设计简单方便，进而有效地提高了微波炉的生产效率。
综上所述，本发明第一方面实施例提供的微波炉的半导体微波发生器连接结构，微波输出装置与半导体微波发生器的正面或者背面垂直连接，有效地减小了半导体微波发生器与烹饪腔体之间的最大距离，从而有效地减小微波炉的体积，使得微波的结构设计和形状设计简单方便，进而有效地提高了微波炉的生产效率，并降低了微波炉的制造成本；本发明第二方面实施例提供的微波炉具有体积小、成本低等优点；本发明第三方面实施例提供的微波炉的半导体微波发生器输入输出连接结构，微波信号输出口设置在半导体微波发生器的正面或背面，微波输出装置与微波信号输出口相连接，即微波输出装置与半导体微波发生器的正面或者背面垂直连接，有效地减小了半导体微波发生器与烹饪腔体之间的最大距离，从而有效地减小了微波炉的体积，使得微波的结构设计和形状设计简单方便，进而有效地降低了微波炉的制造成本，本发明第四方面实施例提供的微波炉具有体积小、成本低等优点；本发明第五方面实施例提供的微波炉的半导体微波发生器连接结构，微波信号输出口设置在半导体微波发生器的正面或背面，微波输出装置与微波信号输出口相连接，即微波输出装置与半导体微波发生器的正面或者背面垂直连接，有效地减小了半导体微波发生器与烹饪腔体之间的最大距离，从而有效地减小了微波炉的体积，使得微波的结构设计和形状设计简单方便，进而有效地降低了微波炉的制造成本；另外，转换器的结构简单，使得微波输出装置与微波信号输出口之间的连接简单可靠，有效地降低了半导体微波发生器连接结构的装 配难度，本发明第六方面提供的微波炉具有体积小、成本低等优点。
在本发明的描述中，术语“第一”、“第二”、“第三”仅用于描述的目的，而不能理解为指示或暗示相对重要性，除非另有明确的规定和限定。
在本发明的描述中，术语“安装”、“连接”、“相连”、“固定”等均应做广义理解，例如，“连接”可以是固定连接，也可以是可拆卸连接，或一体地连接；“相连”可以是直接相连，也可以通过中间媒介间接相连。对于本领域的普通技术人员而言，可以根据具体情况理解上述术语在本发明中的具体含义。
在本说明书的描述中，术语“一个实施例”、“一些实施例”、“具体实施例”等的描述意指结合该实施例或示例描述的具体特征、结构、材料或特点包含于本发明的至少一个实施例或示例中。在本说明书中，对上述术语的示意性表述不一定指的是相同的实施例或实例。而且，描述的具体特征、结构、材料或特点可以在任何的一个或多个实施例或示例中以合适的方式结合。
以上所述仅为本发明的优选实施例而已，并不用于限制本发明，对于本领域的技术人员来说，本发明可以有各种更改和变化。凡在本发明的精神和原则之内，所作的任何修改、等同替换、改进等，均应包含在本发明的保护范围之内。

Claims (30)

  1. 一种微波炉的半导体微波发生器连接结构，其特征在于，包括：
    半导体微波发生器，所述半导体微波发生器的正面或背面设置有微波信号输出口；和
    微波输出装置，所述微波输出装置的第一端与所述微波信号输出口相连接，第二端与微波炉的烹饪腔体相连通。
  2. 根据权利要求1所述的微波炉的半导体微波发生器连接结构，其特征在于，
    所述烹饪腔体的腔壁上设置有波导盒，所述波导盒与所述烹饪腔体相连通，所述波导盒的顶面设置有波导孔；
    所述半导体微波发生器包括：
    散热装置；
    金属基板，所述金属基板安装在所述散热装置上；
    印刷电路板，所述印刷电路板的正面设置有所述微波信号输出口，所述印刷电路板的背面与所述金属基板固定连接；和
    屏蔽罩，所述屏蔽罩罩设在所述印刷电路板的正面及侧面；
    所述微波输出装置的所述第一端穿过所述屏蔽罩与所述微波信号输出口相连接，所述第二端通过所述波导孔与所述波导盒相连通。
  3. 根据权利要求2所述的微波炉的半导体微波发生器连接结构，其特征在于，
    所述微波输出装置包括：
    第一射频连接器，所述第一射频连接器的插座与所述微波信号输出口相连接；和
    第二射频连接器，所述第二射频连接器的插座通过所述波导孔与所述波导盒相连接；
    所述第一射频连接器的插头与所述第二射频连接器的插头相连接，且所述第一射频连接器的插头和所述第二射频连接器的插头中的一个为阳头，另一个为阴头。
  4. 根据权利要求3所述的微波炉的半导体微波发生器连接结构，其特征在于，
    所述微波输出装置还包括：
    微波馈入装置，所述第二射频连接器的插座与所述波导盒通过所述微波馈入装置相连接。
  5. 根据权利要求4所述的微波炉的半导体微波发生器连接结构，其特征在于，
    所述微波馈入装置为天线或者探针。
  6. 根据权利要求2所述的微波炉的半导体微波发生器连接结构，其特征在于，
    所述微波输出装置为磁控管输出组件，所述磁控管输出组件包括：磁控管天线、第一底板、第一固定环和第二固定环，所述第一固定环、所述第二固定环和所述第一底板依次连接，所述第一底板与所述波导盒相连接，所述磁控管天线通过所述第一固定环、所述第二固定环和所述第一底板固定在所述波导盒上，所述磁控管天线的一端穿过所述屏蔽罩与所述微波信号输出口相连接。
  7. 根据权利要求2所述的微波炉的半导体微波发生器连接结构，其特征在于，
    所述微波输出装置为探针输出组件，所述探针输出组件包括：探针、第二底板和第三固定环，所述第三固定环与所述第二底板相连接，所述第二底板与所述波导盒固定连接，所述探针通过所述第二底板和所述第三固定环固定在所述波导盒上，所述探针的一端穿过所述屏蔽罩与所述微波信号输出口相连接。
  8. 根据权利要求1所述的微波炉的半导体微波发生器连接结构，其特征在于，
    所述半导体微波发生器包括：
    金属基板，所述金属基板安装在所述烹饪腔体上；
    印刷电路板，所述印刷电路板的背面设置有所述微波信号输出口，所述印刷电路板的背面与所述金属基板固定连接；和
    屏蔽罩，所述屏蔽罩罩设在所述印刷电路板的正面及侧面；
    所述微波输出装置的所述第一端穿过所述金属基板与所述微波信号输出 口相连接。
  9. 一种微波炉，其特征在于，包括：
    烹饪腔体；和
    如权利要求1至8中任一项所述的微波炉的半导体微波发生器连接结构；所述的微波炉的半导体微波发生器连接结构的微波输出装置的第二端与所述烹饪腔体相连通。
  10. 根据权利要求9所述的微波炉，其特征在于，
    所述微波炉的半导体微波发生器连接结构位于所述烹饪腔体的顶壁或者底臂或者侧臂或者后臂上。
  11. 一种微波炉的半导体微波发生器输入输出连接结构，其特征在于，包括：
    半导体微波发生器，所述半导体微波发生器设置有微波信号输出口和微波信号输入口，所述微波信号输出口位于所述半导体微波发生器的正面或背面；
    微波输入装置，所述微波输入装置安装在所述半导体微波发生器上，并与所述微波信号输入口相连接；和
    微波输出装置，所述微波输出装置安装在所述半导体微波发生器上，并与所述微波信号输出口相连接。
  12. 根据权利要求11所述的微波炉的半导体微波发生器输入输出连接结构，其特征在于，
    所述半导体微波发生器包括：
    金属基板；
    印刷电路板，所述印刷电路板的背面与所述金属基板固定连接，所述微波信号输出口和所述微波信号输入口均设置在所述印刷电路板上，所述微波信号输出口位于所述印刷电路板的正面或背面中的一面上；和
    屏蔽罩，所述屏蔽罩罩设在所述印刷电路板的正面及侧面；
    所述微波输出装置穿过所述屏蔽罩或所述金属基板安装在所述印刷电路板上。
  13. 根据权利要求12所述的微波炉的半导体微波发生器输入输出连接结构，其特征在于，
    所述微波输出装置为第一射频连接器，所述第一射频连接器的插座与所述微波信号输出口相连接，所述第一射频连接器的插头穿出所述屏蔽罩或所述金属基板，并通过第一法兰盘与所述屏蔽罩或所述金属基板固定连接。
  14. 根据权利要求13所述的微波炉的半导体微波发生器输入输出连接结构，其特征在于，
    所述第一射频连接器的插座焊接或者卡接或者螺接在所述印刷电路板上。
  15. 根据权利要求12所述的微波炉的半导体微波发生器输入输出连接结构，其特征在于，
    所述微波输出装置为磁控管输出组件，所述磁控管输出组件包括：磁控管天线、第一底板和第一固定环，所述第一固定环和所述第一底板套设在所述磁控管天线上，所述磁控管天线的一端穿过所述屏蔽罩或所述金属基板与所述微波信号输出口相连接。
  16. 根据权利要求12所述的微波炉的半导体微波发生器输入输出连接结构，其特征在于，
    所述微波输出装置为探针输出组件，所述探针输出组件包括：探针、第二底板和第二固定环，所述第二固定环和所述第二底板套设在所述探针上，所述探针的一端穿过所述屏蔽罩或所述金属板与所述微波信号输出口相连接。
  17. 根据权利要求12至16中任一项所述的微波炉的半导体微波发生器输入输出连接结构，其特征在于，
    所述微波输入装置为第二射频连接器，所述第二射频连接器的插座与所述微波信号输入口相连接，所述第二射频连接器的插头位于半导体微波发生器的外部。
  18. 根据权利要求17所述的微波炉的半导体微波发生器输入输出连接结构，其特征在于，
    所述微波信号输入口位于所述印刷电路板的正面或者背面或者侧面，所述第二射频连接器的插头穿出所述屏蔽罩或所述金属基板，并通过第二法兰盘与所述屏蔽罩或所述金属基板固定连接。
  19. 一种微波炉，其特征在于，包括：
    烹饪腔体；和
    如权利要求11至18中任一项所述的微波炉的半导体微波发生器输入输出连接结构，所述微波炉的半导体微波发生器输入输出连接结构的微波输入装置与所述烹饪腔体相连通。
  20. 根据权利要求19所述的微波炉，其特征在于，
    所述微波炉的半导体微波发生器输入输出连接结构位于所述烹饪腔体的顶壁或者底壁或者侧壁或者后壁上。
  21. 一种微波炉的半导体微波发生器连接结构，其特征在于，包括：
    半导体微波发生器，所述半导体微波发生器设置有微波信号输出口和微波信号输入口，所述微波信号输出口位于所述半导体微波发生器的正面或者背面；
    微波输入装置，所述微波输入装置与所述微波信号输入口相连接；和
    微波输出装置，所述微波输出装置通过转换器与所述微波信号输出口相连接。
  22. 根据权利要求21所述的微波炉的半导体微波发生器连接结构，其特征在于，
    所述半导体微波发生器包括：
    散热装置；
    金属基板，所述金属基板安装在所述散热装置上；
    印刷电路板，所述印刷电路板的背面与所述金属基板固定连接，所述微波信号输出口和所述微波信号输入口均设置在所述印刷电路板上，所述微波信号输出口位于所述印刷电路板的正面或背面中的一面上，所述转换器相对于所述微波信号输出口安装在所述印刷电路板上；和
    屏蔽罩，所述屏蔽罩罩设在所述印刷电路板的正面及侧面。
  23. 根据权利要求22所述的微波炉的半导体微波发生器连接结构，其特征在于，
    所述转换器上设置有微带线，所述微带线的第一端与所述微波输出装置相连接，第二端与所述微波信号输出口相连接。
  24. 根据权利要求23所述的微波炉的半导体微波发生器连接结构，其特征在于，
    所述微波输出装置为第三射频连接器，所述第三射频连接器的插座与所述微带线的所述第一端相连接。
  25. 根据权利要求24所述的微波炉的半导体微波发生器连接结构，其特征在于，
    所述第三射频连接器的插座焊接或者卡接或者螺接在所述转换器上；所述转换器焊接或者卡接或者螺接在所述印刷电路板上。
  26. 根据权利要求25所述的微波炉的半导体微波发生器连接结构，其特征在于，
    所述转换器为金属块，所述微带线与所述金属块之间设置有环氧树脂层。
  27. 根据权利要求23所述的微波炉的半导体微波发生器连接结构，其特征在于，
    所述微波输出装置为磁控管输出组件，所述磁控管输出组件包括：磁控管天线、第一底板和第一固定环，所述第一固定环和所述第一底板套设在所述磁控管天线上，所述磁控管天线的一端与所述微带线的所述第一端相连接。
  28. 根据权利要求23所述的微波炉的半导体微波发生器连接结构，其特征在于，
    所述微波输出装置为探针输出组件，所述探针输出组件包括：探针、第二底板和第二固定环，所述第二固定环和所述第二底板套设在所述探针上，所述探针的一端与所述微带线的所述第一端相连接。
  29. 一种微波炉，其特征在于，包括：
    烹饪腔体；和
    如权利要求21至28中任一项所述的微波炉的半导体微波发生器连接结构，所述微波炉的半导体微波发生器连接结构的微波输出装置与所述烹饪腔体相连通。
  30. 根据权利要求29所述的微波炉，其特征在于，
    所述微波炉的半导体微波发生器连接结构位于所述烹饪腔体的顶壁或者底壁或者侧壁或者后壁上。
PCT/CN2014/090741 2014-03-20 2014-11-10 微波炉的半导体微波发生器连接结构、微波炉的半导体微波发生器输入输出连接结构和微波炉 WO2015139464A1 (zh)

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