WO2015139264A1

WO2015139264A1 - Module set used in integrated circuit or photoelectric element for both heat conduction and heat dissipation

Info

Publication number: WO2015139264A1
Application number: PCT/CN2014/073770
Authority: WO
Inventors: 陈振贤; 叶荣富; 范哲骞
Original assignee: 陈振贤
Priority date: 2014-03-20
Filing date: 2014-03-20
Publication date: 2015-09-24
Also published as: DE212014000251U1

Abstract

A module set used in an integrated circuit or a photoelectric element for both heat conduction and heat dissipation, comprising a module, a heat conducting device and a heat dissipating device; the heat dissipating device has a through hole and a through groove communicating with the through hole; when in use, the heat conducting device is pre-arranged in the through hole of the heat dissipating device, and is passed through the through groove of the heat dissipating device via the module to be closely integrated into the heat dissipating device and the module so as to achieve optimal heat dissipation efficiency. In addition, the module, the heat conducting device and one end of the heat dissipating device are formed coplanar for a heat generating element to be disposed thereon, thereby realizing heat dissipation.

Description

Module for heat conduction and heat dissipation of integrated circuits or optoelectronic components

The present invention relates to a module for heat conduction and heat dissipation of an integrated circuit or a photovoltaic element, and in particular to a combined module having both heat conduction and heat dissipation. Background technique

Driven by technology and new materials, semiconductor IC components and optoelectronic components currently produced, in addition to their increasingly powerful functions, are becoming lighter and thinner, and therefore, while pursuing light weight and high performance, The heat generated by semiconductor IC components, photovoltaic elements, etc. is also amazing. The heat generated by semiconductor IC components, photovoltaic components, etc. directly affects the operational performance and service life of semiconductor IC components, photovoltaic components, etc., so that thermal management becomes At present, the key to the development of the electronics industry.

The heat sink with heat pipe is a common method of heat dissipation and heat dissipation. The structure mainly includes a heat pipe and a heat sink. The principle of heat dissipation and heat dissipation is to directly or indirectly connect one end of the heat pipe with the semiconductor IC component. Or the contact of the photoelectric element, the working fluid and the capillary structure provided inside the heat pipe are used to absorb the heat generated by the semiconductor IC component or the photoelectric component, and then quickly radiated to the heat sink for heat dissipation, which is quite relieving on heat management. A way of cooling.

However, in the prior art, in the assembly process, the heat pipe and the heat sink inevitably have a gap, which causes a thermal resistance between the heat pipe and the heat sink, thereby causing a great influence on heat conduction and heat dissipation. Therefore, in order to solve the above problem, The technique is to apply a heat-conducting medium such as a thermal conductive adhesive on the outer surface of the heat pipe to fill the gap generated when the heat pipe is assembled with the heat sink.

Nowadays, there are many related patents on heat pipes. In this case, please refer to one of them for explanation. Please refer to the method of combining the heat sink and heat pipe and its structure (Taiwan No. 2009/10/01) of Taiwan Patent Publication No. 1315231. The heat sink and the heat pipe combination method and the structure thereof for improving the heat conduction efficiency, the structure mainly includes a heat sink and a heat pipe, wherein the heat sink has a receiving slot at a central position thereof for receiving the heat sink a heat pipe, a plurality of corresponding slits are extended outwardly on a circumference of the groove, and a perforation is connected to the other end of the slit, and the jig is placed inside the slit by the slit, The circumference of the groove is widened, so that the inner diameter of the groove is larger than the heat pipe, so that the heat pipe is inserted into the groove, and finally the jig is removed, so that the inner wall surface of the groove is closely fitted. The outer peripheral surface of the heat pipe is used to achieve better conduction efficiency between the heat pipe and the heat sink.

However, the prior art uses the jig to expand the circumference of the groove, so that the inner diameter of the groove is larger than the heat pipe, so that the heat pipe is inserted through the groove, and the heat sink material is elastic and fatigued. Or the suspicion of rupture, and the material of the heat sink may not be able to load the force exerted by the fixture for a long time. In addition, after the jig is removed, the position of the seam is wasted heat-dissipating heat sink space, so that the heat dissipation efficiency is affected and decreased. Summary of the invention

In order to solve the problems in the prior art, the present invention provides a heat conducting/dissipating module for integrated circuit or optoelectronics devices for an integrated circuit or a photovoltaic element, which includes There is a module, a heat conducting device and a heat dissipating device. The heat sink has a through hole and a through hole communicating with the through hole. In actual use, the heat conducting device is pre-positioned in the through hole of the heat dissipating device, and then the module is inserted into the through hole of the heat dissipating device, so that the heat conducting device is tightly coupled to the heat dissipating device and the module to achieve the best. Cooling efficiency.

Additionally, the heat transfer device has a flat end, the heat sink has a first flat end, and the module has a second flat end. After the foregoing assembly step is completed, the flat end of the heat conducting device, the first flat end of the heat sink, and the second flat end of the module form a coplanar surface on which a heat generating component can be disposed for heat dissipation. Effect. The heat generating component may be a light emitting diode component, a solar cell component, a semiconductor component, and other electronic components that generate heat after being energized.

In addition, the heat conducting device may be a heat pipe or a heat column, or a Vapor Chamber component having a vertical thickness, and the module and the heat sink are the same. Made of materials.

Compared with the prior art, the present invention provides a module that combines heat conduction and heat dissipation, and the heat-conducting device can be fixed in the heat-dissipating device by the module by means of tight fitting, and the heat-conducting device can also be The function of tightly engaging the heat sink to increase the efficiency of heat dissipation. In this way, there is no need to worry about the elastic fatigue of the material of the heat sink. DRAWINGS

1 is an exploded perspective view of a preferred embodiment of a module for heat conduction and heat dissipation of an integrated circuit or a photovoltaic element according to the present invention.

2 is a schematic diagram showing the combined implementation of a module for heat conduction and heat dissipation of an integrated circuit or a photovoltaic element in a preferred embodiment of the present invention.

3 is an exploded perspective view of another preferred embodiment of a module for heat conduction and heat dissipation of an integrated circuit or a photovoltaic element according to the present invention.

FIG. 4 is a schematic diagram showing the combination of a module for heat conduction and heat dissipation of an integrated circuit or a photovoltaic element according to another preferred embodiment of the present invention.

FIG. 5 is a schematic diagram showing the assembly of a heat generating component of another preferred embodiment of a module for heat conduction and heat dissipation of an integrated circuit or a photovoltaic element according to the present invention.

6 is a schematic view showing the assembly of another heat-generating component of another preferred embodiment of a module for heat conduction and heat dissipation of an integrated circuit or a photovoltaic element according to the present invention.

FIG. 7 is a schematic view showing the assembly of another heat-generating component of another preferred embodiment of a module for heat conduction and heat dissipation of an integrated circuit or a photovoltaic element according to the present invention. FIG. 8 is a schematic diagram showing the assembly of another heat-generating component of another preferred embodiment of a module for heat conduction and heat dissipation of an integrated circuit or a photovoltaic element according to the present invention.

The reference numerals are as follows:

1: Module with heat and heat dissipation 10: Module

30: Heat transfer device 50: Heat sink

70: heating element 110: second flat end

310: flat end 311: flat end

312: Flat end 313: Flat end

510: Perforated hole 530: Through slot

550: First flat end

It is to be noted that, although certain specific terms are used throughout the specification (including the claims) to refer to particular elements, those skilled in the art will understand that certain The same component may be referred to by a different noun. Therefore, in understanding the full text of the specification (including the claims), the difference in name should not be used as a means of distinguishing elements, but should be differentiated by the difference in function of the elements. In addition, the terms "including" and "having" as used throughout the specification of the present application are all open-ended terms and should be interpreted as "including but not limited to".

Hereinafter, a detailed description of a module for heat conduction and heat dissipation of an integrated circuit or a photovoltaic element of the present invention will be described. Please refer to FIG. 1. FIG. 1 is an exploded perspective view of a module for heat conduction and heat dissipation of an integrated circuit or a photovoltaic element according to a preferred embodiment of the present invention. As shown in FIG. 1, in a preferred embodiment of the present invention, a module 1 having both heat conduction and heat dissipation includes a module 10, a heat conducting device 30, and a heat sink 50. The heat dissipating device 50 has a through hole 510 and a through slot 530 communicating with the through hole 510. In addition, the heat conducting device 30 further has a flat end 310, and the heat sink 50 further has a first flat end 550. And the module 10 further has a second flat end 110.

Please refer to FIG. 1 and FIG. 2 again. FIG. 2 is a schematic diagram showing the combined implementation of a module for heat conduction and heat dissipation of an integrated circuit or a photovoltaic element according to a preferred embodiment of the present invention. In actual use, the heat-conducting device 30 is pre-positioned in the through-hole 510 of the heat-dissipating device 50, and then forcedly inserted into the slot 530 of the heat-dissipating device 50 by the module 10 in a tightly fitting manner, thereby transferring the heat-conducting device. 30 is tightly coupled between the heat sink 50 and the module 10, while also allowing the module 10 to be tightly coupled between the heat conducting device 30 and the heat sink 50 to achieve optimum heat transfer and heat dissipation efficiency. After the assembly step described above, the flat end 310 of the heat conducting device 30, the first flat end 550 of the heat sink 50, and the second flat end 110 of the module 10 will form a coplanar plane, as shown in FIG. The coplanar surface can be provided with a heating element thereon to achieve the effect of accelerating heat dissipation. The heat generating component may be a light emitting diode component, a solar cell component, a semiconductor component, and other electronic components that generate heat after being energized. The heat conducting device 30 can be a heat pipe or a heat column or a uniform temperature having a vertical thickness. Vapor Chamber components. In addition, the module 10 may be manufactured from the same material as the heat sink 50, or may be made of other materials having a high thermal conductivity.

Please refer to FIG. 3. FIG. 3 is an exploded perspective view of another preferred embodiment of a module for heat conduction and heat dissipation of an integrated circuit or a photovoltaic element according to the present invention. As shown in FIG. 3, in another preferred embodiment of the present invention, a module 1 for heat conduction and heat dissipation of an integrated circuit or a photovoltaic element provided by the present invention comprises a module 10 and 2 The heat conducting device 30 and a heat sink 50. The heat sink 50 has two through holes 510 and a through slot 530 communicating with the through hole 510. In addition, the heat transfer device 30 has a flat end 310, the heat sink 50 further has a first flat end 550, and the module 10 has a second flat end 110. It should be noted that the two heat conducting devices 30 are respectively disposed at two sides of the symmetry center of the module 10, and the two through holes 510 are also disposed at two sides respectively disposed at the center of the symmetry of the through slots 530. .

Referring to FIG. 3 and FIG. 4, FIG. 4 is a schematic diagram showing the combination of a module for heat conduction and heat dissipation of an integrated circuit or a photovoltaic element according to another preferred embodiment of the present invention. In use, the two heat conducting devices 30 are pre-positioned in the two perforation holes 510 of the heat dissipating device 50, and then forcibly driven into and through the slot 530 of the heat dissipating device 50 by the module 10 in a tightly fitting manner, thereby The heat conducting device 30 is tightly coupled between the heat sink 50 and the module 10, and also allows the module 10 to be tightly coupled between the two heat conducting devices 30 and the heat sink 50 to achieve optimum heat dissipation efficiency. After the assembly step described above, the flat end 310 of the two heat conducting devices 30, the first flat end 550 of the heat sink 50, and the second flat end 110 of the module 10 will form a coplanar plane, as shown in FIG. The coplanar surface is provided with a heating element disposed thereon to achieve an accelerated heat dissipation effect. The heat generating component can be a light emitting diode component, a solar cell component, a semiconductor component, and other electronic components that generate heat after being energized. The two heat conducting devices 30 can be a heat pipe or a heat guiding column. (Heat column) or a Vapor Chamber component with a vertical thickness. Alternatively, the module 10 may be fabricated from the same material as the heat sink 50, or may be fabricated from other materials having a higher thermal conductivity.

It should be noted that the shape of the module 10, the heat conducting device 30 and the heat dissipating device 50 included in the module 1 for heat conduction and heat dissipation of an integrated circuit or a photovoltaic element provided by the present invention is not limited to the illustrated figure. 1 or 2, any shape that can perform the same function as it is included in the scope of the claims of the present invention.

Referring to FIG. 5, FIG. 5 is a schematic diagram showing the assembly of a heat generating component of another preferred embodiment of a module for heat conduction and heat dissipation of an integrated circuit or a photovoltaic element according to the present invention. After the assembly process of the present invention is completed, the heat generating component 70 is mounted on the common plane formed by the second flat end 110, the flat end 310 and the first flat end 550 to achieve the effect of accelerating heat conduction and heat dissipation, that is, Figure 5 shows.

In addition, the heat transfer device 30 of the present invention may also be an L-shaped or other curved heat pipe. Referring to FIG. 6 , FIG. 7 and FIG. 8 , FIG. 6 , FIG. 7 and FIG. 8 illustrate another preferred embodiment of the present invention for use in an integrated circuit or a photovoltaic element having both heat conduction and heat dissipation. A schematic diagram of another heating element assembly of a specific embodiment is completed. After the assembly process of the present invention is completed, the heat generating component 70 is mounted on the flat end 311, 312 or 313 of the heat conducting device 30 to achieve the effects of accelerating heat conduction and heat dissipation, that is, as shown in FIGS. 6, 7, and 8. Show. Wherein, the heating element 70 can be an LED component, a solar cell component, a semiconductor component, and other devices that are energized. Heated electronic components.

Compared with the prior art, the present invention provides a module for heat conduction and heat dissipation of an integrated circuit or a photovoltaic element, and the heat-conducting device can be fixed by the module by tightly fitting the clamping method. In the heat sink, there is also a function of allowing the heat conducting device to be tightly engaged with the heat sink to increase the efficiency of heat dissipation. As a result, there is no need to worry about the problem that the existing heat sink material will be elastic and fatigued. In addition, the module for heat conduction and heat dissipation of an integrated circuit or a photovoltaic element provided by the present invention will be formed by a heat conduction device, a heat dissipation device and a module after assembly. Plane, or a flat end directly on the heat conducting device, for which components requiring heat dissipation are mounted to achieve its accelerated heat dissipation.

The features and spirit of the present invention are more clearly described in the above detailed description of the preferred embodiments, and are not intended to limit the scope of the invention. Rather, the intention is to cover various modifications and equivalents within the scope of the appended claims. Therefore, the scope of the claims of the invention should be construed as broadly construed,

Claims

Rights request

A module for heat conduction and heat dissipation of an integrated circuit or a photovoltaic element, comprising: a module;

a heat conducting device;

a heat dissipating device having a perforated hole and a through slot communicating with the perforated hole;

The heat conducting device is predisposed in the through hole, and then the module is inserted into the through slot, so that the heat conducting device is tightly coupled to the heat sink and the module.

2. The module having both heat conduction and heat dissipation according to claim 1, wherein the heat conducting device has a flat end.

3. The module of claim 2, wherein the heat sink further has a first flat end, the module having a second flat end, the heat conducting device being tightly coupled through the module After the heat sink, the flat end, the first flat end and the second flat end are coplanar.

4. The module of claim 2, wherein the heat generating component is disposed on the flat end of the heat conducting device.

5. The module of claim 4, wherein the heat generating component is an electronic component that generates heat after being energized.

6. The module of claim 5, wherein the heat generating component is a light emitting diode component, a solar cell component or an integrated circuit component.

7. The module of claim 1, wherein the heat conducting device is a heat pipe, a heat guiding column or a temperature equalizing plate element.

8. The module of claim 1, wherein the heat conducting device is a metal or non-metallic material pillar.

9. The module of claim 8, wherein the heat conducting device is a copper tube or a ceramic column.

10. The module of claim 1, wherein the module and the heat sink are fabricated from the same material.