TW201512624A - Heat source apparatus with pulsating heat dissipation - Google Patents

Abstract

A heat source apparatus with pulsating heat dissipation has a heat spreader; a pulsating heat pipe installed in a face of the heat spreader; and a heat source installed on the face with the pulsating heat pipe of the heat spreader, and the heat souse coupled to the pulsating heat pipe.

Description

Thermal source device with pulsed heat dissipation

A heat source device with pulsed heat dissipation, especially a heat source device that uses a pulsed heat pipe to transfer heat energy to achieve a heat dissipation effect.

With the advancement of technology, various electronic products are widely used by people, but today's electronic products are moving toward light, thin, short, and small trends, such as smart phones, notebook computers, digital video players or Luminaires, but the aforementioned electronic products all have a high heat flux characteristic during use, which leads to an increasingly hot problem, which may cause damage to electronic products.

In order to overcome the hot spot problem, the existing processing method is to install a high heat conducting device at the hot spot to dissipate the heat energy of the hot spot into the air. For ease of understanding, the following is a discussion of a light emitting diode lamp.

Referring to FIG. 1 , the existing LED lamp assembly includes a light emitting diode set 10 and a heat dissipation module 11 .

The light emitting diode group 10 is disposed on one side of the heat dissipation module 11, and the heat dissipation module 11 can be a combination of a heat dissipation fin and a heat dissipation fan or a heat dissipation fin. The thermal energy generated by the LED group 10 is conducted to the heat dissipation module 11 to dissipate into the air.

However, most of the existing heat sink fins are mainly made of aluminum. Although the heat energy can be dissipated into the air, the heat sink fins are poor in thermal conductivity due to the material problem, so the heat dissipation area is usually increased to achieve the required heat dissipation effect. This in turn leads to an increase in the overall weight of the heat dissipation module and an increase in product cost.

In addition, only 10~36% of the input power of the light-emitting diode during the light-emitting process is converted into light, and about 64-90% of the energy is converted into heat energy, which leads to an increase in the junction temperature. Like all semiconductor components or electronics The operating environment of the LED in a high temperature will adversely affect the components.

When the light-emitting diode is activated, it is prone to local high temperature, mainly because the grain heat source is too concentrated. If the light-emitting diode is in a high temperature state for a long time, the performance of the light-emitting diode will be affected, which is discussed below.

Please refer to FIG. 2, which is a temperature and comparison output comparison table, which is described by a light-emitting diode.

The temperature of curve A was 69 ° C; the temperature of curve B was 79 ° C; the temperature of curve C was 85 ° C; the temperature of curve D was 96 ° C; the temperature of curve E was 107 ° C; the temperature of curve F was 115 ° C. It can be seen from curves A to F that if the temperature of the light-emitting diode is higher and the use time is longer, the output performance is worse, so that the temperature has a considerable influence on the performance of the light-emitting diode, and the same reason. It can be inferred that if the above heat source is at a high temperature for a long time, its performance will also decline.

In view of the above effects, a common treatment method is to further add a heat pipe in the heat dissipation module, and the heat pipe uses a phase change method, capillary force or gravity to make the working fluid flow to achieve the heat energy transfer effect.

The existing heat pipe has a Vapor Chamber and a capillary structure. The vapor chamber system is used for the flow of the vapor phase fluid. The capillary structure is supplied for reflux of a liquid. When the working fluid absorbs thermal energy at the evaporation end of the heat pipe, the working fluid changes from a liquid phase to a vapor phase vapor phase fluid, and the vapor phase fluid transfers the heat energy from the vapor chamber to the condensation end of the heat pipe, and at the condensation end The thermal energy is released, and the vapor phase fluid is returned to the working fluid in the liquid phase, and the working fluid is again returned to the evaporation end by the capillary structure, and reciprocates in this mode to generate a heat dissipation effect.

However, existing heat pipes have the disadvantages of higher cost and lower heat transfer. If the heat transfer amount is to be increased, the contact area between the heat pipe and the light-emitting diode group is increased, or the contact area between the heat pipe and the heat-dissipating fin is increased, and the aforementioned method of increasing the area increases the light-emitting color in the invisible manner. The overall weight of the polar body luminaire reduces the safety of the illuminating diode lamp and increases the material cost of the illuminating diode lamp.

The present disclosure is a heat source device with pulsed heat dissipation, comprising: a heat sink fin; A pulsating heat pipe is disposed on one side of the heat dissipating fin; and a heat source is disposed on a side of the heat dissipating fin having the pulsating heat pipe, and the heat source is coupled to the pulse heat pipe.

The present disclosure relates to a heat source device with pulsed heat dissipation, comprising: a heat sink fin; a pulse heat pipe, one end of which is disposed on the heat sink fin; and a heat source coupled to the pulse heat pipe The other end.

1‧‧‧Lighting diode

11‧‧‧ Thermal Module

20‧‧‧ Heat sink fins

200‧‧‧Fins

201‧‧‧Setting Department

202‧‧‧Barrier

203‧‧‧ tube slot

21‧‧‧pulse heat pipe

22‧‧‧heat source

23‧‧‧Insulation

30‧‧‧Heat fins

301‧‧‧Setting Department

302‧‧‧ openings

303‧‧‧ Ribs

304‧‧‧ tube slot

31‧‧‧pulse heat pipe

32‧‧‧heat source

40‧‧‧ Heat sink fins

400‧‧‧Fins

401‧‧‧ tube slot

41‧‧‧pulse heat pipe

42‧‧‧Department

420‧‧‧ tube slot

43‧‧‧heat source

50‧‧‧ Heat sink fins

500‧‧‧Fins

501‧‧‧ tube slot

51‧‧‧pulse heat pipe

52‧‧‧heat source

A~I‧‧‧ curve

FIG. 1 is a perspective view of a conventional light-emitting diode lamp.

2 is a comparison table of temperature and comparison output of a light-emitting diode.

FIG. 3 is a perspective view of a first embodiment of a heat source device with pulsed heat dissipation according to the present disclosure.

4 is a perspective exploded view of a first embodiment of a heat source device with pulsed heat dissipation according to the present disclosure.

FIG. 5 is a perspective view of a second embodiment of a heat source device with pulsed heat dissipation according to the present disclosure.

FIG. 6 is a perspective exploded view of a second embodiment of a heat source device with pulsed heat dissipation according to the present disclosure.

FIG. 7 is a perspective view of a third embodiment of a heat source device with pulsed heat dissipation according to the present disclosure.

FIG. 8 is a perspective exploded view of a third embodiment of a heat source device with pulsed heat dissipation according to the present disclosure.

FIG. 9 is a perspective view of a fourth embodiment of a heat source device with pulsed heat dissipation according to the present disclosure.

FIG. 10 is a perspective exploded view of a fourth embodiment of a heat source device with pulsed heat dissipation according to the present disclosure.

Figure 11 is a comparison of temperature and pressure of a pulsed heat pipe.

The embodiments of the present disclosure are described below by way of specific embodiments, and those skilled in the art can easily disclose the contents disclosed in the present specification. Learn about the other benefits and benefits of this disclosure.

Referring to FIG. 3 and FIG. 4 , a first embodiment of a heat source device with pulse heat dissipation according to the present disclosure includes a heat dissipation fin 20 , a pulse heat pipe 21 , a heat source 22 and a heat insulation material. twenty three.

One side of the heat dissipation fin 20 has a plurality of fins 200. The heat dissipation fin 20 further has a setting portion 201, a blocking groove 202 and a tube groove 203.

The setting portion 201 is disposed on the other surface of the heat dissipation fin 20, and the installation portion 201 is a groove to reduce the overall weight of the heat dissipation fin 20.

The barrier groove 202 is disposed on the other surface of the heat dissipation fin 20 and surrounds the periphery of the installation portion 201. The barrier groove 202 is a ring groove, and the ring groove can further reduce the overall weight of the heat dissipation fin 20.

The tube groove 203 is provided on the other surface of the heat dissipation fin 20, and a part of the tube groove 203 extends to the setting portion 201.

The pulse heat pipe 21 is a single-tube heat pipe, which is disposed in the pipe groove 203, and the pulse heat pipe 21 is a bent pipe body. The shape of the pulse heat pipe 21 is equivalent to the shape of the pipe groove 203, and is in the pulse heat pipe 21 There is a working fluid in it. As described above, the pulse heat pipe 21 is a component formed by a bent pipe body, and the working fluid located in the pipe body is subjected to a pressure difference due to heat, thereby causing a pulse phenomenon of two phases, so that the working fluid is Two-phase change to transfer heat energy, so it has better heat transfer performance. In this case, a pulse type multi-tube heat pipe can also be used. The structure and manufacturing method of the pulse type heat pipe are disclosed in the "Pulse type multi-tube heat pipe" of the Republic of China invention patent application No. 102131568, so it will not be repeated here.

The heat source 22 is disposed in the setting portion 201, and the heat source 22 is attached to the pulse heat pipe 21. For example, the heat source 22 can be an electronic component, a semiconductor component, a light emitting diode, an electrical product, or a furnace body. The electronic component can be a central processing unit, and the household electrical appliance can be an oven, a refrigerator or an electric cooker. In order to facilitate the discussion of the disclosure, the drawings and descriptions of the present disclosure are represented by only the light-emitting diodes.

The heat insulating material 23 is disposed between the heat source 22 and the pulse heat pipe 21, and the heat insulating material 23 can be a heat insulating material or an air layer, and the heat insulating material can Enough for rock wool, glass wool or polyurethane foam (Polyurethane, PU).

As described above, when the heat source 22 generates a thermal energy due to the operation, the thermal energy is transmitted to the pulse heat pipe 21, and then transmitted to the heat dissipation fins 20 by the pulse heat pipe 21, and the heat energy is uniformly conducted to the heat dissipation fins 20, The heat sink fins 20 dissipate heat energy into the air.

When thermal energy is conducted from the heat source 22 to the pulsed heat pipe 21, the heat insulating material 23 is capable of blocking the heat energy from dissipating into the air during the conduction.

If there is no heat insulating material 23, the blocking groove 202 also has air, which can prevent the heat source 22 from directly transferring the heat energy to the heat radiating fins 20, and concentrate the heat energy in the setting portion 201 of a specific region of the heat radiating fins 20.

Referring to FIG. 5 and FIG. 6 , the second embodiment of the disclosed heat source device with pulse heat dissipation includes a heat dissipation fin 30 , a pulse heat pipe 31 , and a heat source 32 .

One side of the heat dissipation fin 30 has a plurality of fins 300. The heat dissipation fin 30 further has a setting portion 301, a plurality of openings 302, a plurality of ribs 303 and a tube groove 304.

The installation portion 301 is disposed on the other surface of the heat dissipation fin 30, and the installation portion 301 is a groove that can reduce the overall weight of the heat dissipation fins 30.

The openings 302 are provided around the installation portion 301. The ribs 303 are located between the openings 302 and the setting portion 301. The openings 302 and the ribs 303 can be regarded as the barrier grooves described in the previous embodiment. The openings 302 extend through the heat dissipation fins 30. Therefore, the openings 302 can further reduce the heat dissipation fins 30. Overall weight.

The number of the openings 302 is greater than the number of the ribs 303, or the areas of the openings 302 are larger than the area of the ribs 303. The through openings 302 can reduce the weight of the heat dissipation fins 30, and the air in the openings 302 can prevent the heat source 32 from directly transferring heat energy to the heat dissipation fins 30, so that the heat energy is concentrated on the heat dissipation fins. In the installation portion 301 of a specific region of 30, the heat source 30 is as follows.

The tube groove 304 is formed on the other surface of the heat dissipation fin 30, and a part of the tube groove 304 extends to the setting portion 301.

The pulse heat pipe 31 is provided in the pipe groove 304.

The heat source 32 is disposed in the setting portion 301 , and the heat source 32 is coupled to the pulse heat pipe 31 .

As in the first embodiment described above, when the heat source 32 generates a thermal energy, the thermal energy is transmitted to the pulse heat pipe 31, and the pulse heat pipe 31 conducts the heat energy uniformly to the heat dissipation fins 30, and the heat dissipation fins 30 dissipate the heat energy. In the air. The openings 302 prevent the thermal energy from being transmitted to the heat dissipation fins 30 without being transmitted through the pulse heat pipe 31 during conduction.

Referring to FIG. 7 and FIG. 8 , a third embodiment of the disclosed heat source device with pulse heat dissipation has a heat dissipation fin 40 , a pulse heat pipe 41 , a bearing portion 42 and a heat source 43 .

The heat sink fin 40 has a plurality of fins 400 and a tube groove 401. The fins 400 are located on one side of the heat dissipation fins 40. The tube groove 401 is located on the other side of the heat dissipation fin 40.

One end of the pulse heat pipe 41 is provided in the pipe groove 401.

The receiving portion 42 is located at one end of the heat dissipating fin 40, and the two are separated from each other. One side of the receiving portion 42 has a pipe groove 420 which is provided at the other end of the pulse heat pipe 41.

The heat source 43 is provided on one surface of the socket portion 42 having the pipe groove 420, and the heat source 43 is attached to the pulse heat pipe 43.

Since the heat source 43 is not disposed at the heat dissipation fins 40, the heat dissipation fins 40 can be designed in a small volume, thereby reducing the material for manufacturing the heat dissipation fins 40 and reducing the overall weight of the heat dissipation fins 40 as a heat source. When a thermal energy is generated, the thermal energy is conducted to the pulsed heat pipe 41, and the pulsed heat pipe 41 conducts the heat energy evenly to the heat radiating fins 40 to dissipate into the air.

When thermal energy is conducted to the pulsed heat pipe 41, part of the thermal energy is conducted to the socket 42, which is dissipated into the air by the socket 42.

Referring to FIG. 9 and FIG. 10 , a fourth embodiment of the giant pulse heat dissipation heat source device of the present disclosure has a heat dissipation fin 50 , a pulse heat pipe 51 and a heat source 52 .

The heat dissipation fin 50 has a plurality of fins 500 and a tube groove 501. The fins 500 are located on one side of the heat dissipation fins 50. The tube groove 501 is located on the other side of the heat dissipation fin 50 surface.

One end of the pulse heat pipe 51 is provided in the pipe groove 501.

The heat source 52 is located at one end of the heat dissipation fin 50, and the heat source 52 is coupled to the other end of the pulse heat pipe 51.

When the heat source 52 generates a heat energy, the heat energy is conducted to the pulse heat pipe 51, and the heat energy is evenly conducted by the pulse heat pipe 51 to the heat radiating fins 50 to dissipate into the air.

As described above in various embodiments of the present disclosure, Pulsed Heat Pipes are also referred to as Oscillating Heat Pipes, which are components having a plurality of curved conduits that utilize pipelines. The working fluid is heated by the pressure difference to cause a two-phase flow pulse phenomenon, which is discussed below.

Please refer to FIG. 11 , which is a temperature and a pressure comparison table. The pulse heat pipe has a working fluid as described above; the curve G represents the working fluid as nonafluorobutyl methyl ether; and the curve H represents the working fluid as methanol. Curve I represents that the working fluid is water. The operating temperature of nonafluorobutyl methyl ether is lower than or equal to 60 °C. The working temperature of methanol is between 60 and 80 ° C; the operating temperature of water is greater than or equal to 80 ° C.

If the curve H is discussed, the pulsed heat pipe system is at a temperature difference of ΔT1, and the ΔP1 differential pressure driving force can be obtained. However, if the pulsed heat pipe is raised to a temperature difference of ΔT2, the pressure difference can be greatly increased to ΔP2. The use of this creates a large saturation pressure difference to promote the working fluid to make the pulsed heat pipe operate successfully, effectively creating a pulsed heat pipe starting condition.

Referring to FIG. 3 and FIG. 4 , the setting portion 201 of the first embodiment of the present disclosure is a groove, and the groove is designed to reduce the thickness of the heat sink fin 20 and reduce it by one. The solid heat conduction area limits the thermal energy to a specific area, which is the area where the heat source 22 and the pulse heat pipe 21 are combined, and the heat insulating material 23 or the blocking groove 202 is used to limit the heat energy to the setting portion 201. Thereby, a partial heat insulating region is formed, and the overall weight of the heat dissipation fins 20 can be reduced, thereby reducing the overall weight of the heat source device, improving the safety of the heat source device, and reducing the material cost of the heat source device.

The pulsed heat pipe as described above, when the heat energy generated by the heat source is transmitted to the pulse type In the case of a heat pipe, the pressure difference of the pulsed heat pipe is raised enough to push the working fluid, and the pulsed heat pipe is actuated.

As shown in FIG. 7 to FIG. 10 , the heat dissipation fins of the third embodiment and the fourth embodiment of the present disclosure do not have the installation portions as described in the first embodiment and the second embodiment, so the third implementation of the disclosure. The volume of the heat dissipating fins of the fourth embodiment and the fourth embodiment are reduced to half or less than the volume of the heat dissipating fins of the first embodiment or the second embodiment of the present disclosure, and the operation of the pulse heat pipe as described above, the disclosure The heat sources of the first embodiment to the fourth embodiment are capable of generating a pressure difference between the pulse heat pipes, and the pulse heat pipes are actuated to further achieve the heat dissipation effect, and the overall volume of the heat source device can be reduced, and the heat source can be improved. The safety of the device and the material cost of the heat source device.

The specific embodiments described above are only used to illustrate the features and functions of the present disclosure, and are not intended to limit the scope of the disclosure, and the application of the present invention without departing from the spirit and scope of the disclosure. Equivalent changes and modifications made to the disclosure are still covered by the scope of the following claims.

20‧‧‧ Heat sink fins

200‧‧‧Fins

201‧‧‧Setting Department

202‧‧‧Barrier

203‧‧‧ tube slot

21‧‧‧pulse heat pipe

22‧‧‧heat source

23‧‧‧Insulation

Claims (15)

A heat source device with pulsed heat dissipation, comprising: a heat sink fin; a pulse heat pipe disposed on one side of the heat sink fin; and a heat source disposed on the heat sink fin having the pulse type One side of the heat pipe, and the heat source is coupled to the pulse heat pipe. The heat source device with pulse heat dissipation according to claim 1, wherein the heat dissipation fin has a plurality of fins, a setting portion, a blocking groove and a tube groove; the fins are located in the heat dissipation fin The other side of the sheet; the setting portion is located on one side of the heat dissipating fin, the setting portion is provided for the heat source; the blocking groove is disposed on one side of the heat dissipating fin and surrounds the setting portion; The pulse heat pipe is disposed on one side of the heat dissipation fin, and a part of the pipe groove extends to the installation portion. The heat source device with pulse heat dissipation according to claim 1, wherein the pulse heat pipe is a pulse type single tube type or a multi tube type heat pipe. The heat source device with pulsed heat dissipation according to claim 2, wherein the setting portion is a groove. The heat source device with pulsed heat dissipation according to claim 2, wherein the barrier groove is a ring groove, and the ring groove is provided with the installation portion. The heat source device with pulsating heat dissipation according to claim 2, wherein the blocking groove is a plurality of openings and a plurality of ribs, the openings are located around the setting portion, and the ribs are located at the openings Between this setting. The heat source device with pulse heat dissipation according to claim 2, further comprising a heat insulating material disposed in the barrier groove and located between the heat source and the pulse heat pipe. The heat source device with pulse heat dissipation according to claim 7, wherein the heat insulating material is a heat insulating material or an air layer. The heat source device with pulse heat dissipation according to claim 1, wherein the heat source is an electronic component, a semiconductor component, a light emitting diode, and a battery. Product or a furnace body. A heat source device with pulsating heat dissipation includes: a heat dissipating fin; a pulse type heat pipe having one end attached to the heat dissipating fin; and a heat source coupled to the other end of the pulse heat pipe. The heat source device with pulse heat dissipation according to claim 10, wherein the heat dissipation fin has a plurality of fins and a tube groove, and the fins are located on one side of the heat dissipation fin, the tube groove system Provided by the pulse heat pipe, the pipe groove is located on the other side of the heat dissipation fin. The heat source device with pulse heat dissipation according to claim 10, wherein the heat source is an electronic component, a semiconductor component, a light emitting diode, an electrical product or a furnace body. The heat source device with pulse heat dissipation according to claim 10, further comprising a receiving portion fixed to the other end of the pulse heat pipe. The heat source device with pulse heat dissipation according to claim 13 , wherein the bearing portion has a pipe groove for the pulse heat pipe. The heat source device with pulse heat dissipation according to claim 10, wherein the pulse heat pipe is a pulse type single tube type or a multi tube type heat pipe.