CN104470323A - Heat source device with pulse type heat dissipation - Google Patents
Heat source device with pulse type heat dissipation Download PDFInfo
- Publication number
- CN104470323A CN104470323A CN201310583063.XA CN201310583063A CN104470323A CN 104470323 A CN104470323 A CN 104470323A CN 201310583063 A CN201310583063 A CN 201310583063A CN 104470323 A CN104470323 A CN 104470323A
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- Prior art keywords
- pulsed
- heat
- radiating fin
- power supply
- heat pipe
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- 230000017525 heat dissipation Effects 0.000 title abstract 3
- 230000005855 radiation Effects 0.000 claims description 34
- 239000012774 insulation material Substances 0.000 claims description 10
- 239000000463 material Substances 0.000 claims description 10
- 239000004065 semiconductor Substances 0.000 claims description 4
- 239000012530 fluid Substances 0.000 description 19
- 230000000694 effects Effects 0.000 description 7
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 6
- 238000000034 method Methods 0.000 description 4
- 239000012071 phase Substances 0.000 description 4
- 238000012545 processing Methods 0.000 description 3
- 238000012546 transfer Methods 0.000 description 3
- 238000005452 bending Methods 0.000 description 2
- 230000005494 condensation Effects 0.000 description 2
- 238000009833 condensation Methods 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 230000008020 evaporation Effects 0.000 description 2
- 238000001704 evaporation Methods 0.000 description 2
- 239000011737 fluorine Substances 0.000 description 2
- 229910052731 fluorine Inorganic materials 0.000 description 2
- -1 fluorine butyl methyl ethers Chemical class 0.000 description 2
- 239000007791 liquid phase Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000011490 mineral wool Substances 0.000 description 2
- 239000004814 polyurethane Substances 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 206010020843 Hyperthermia Diseases 0.000 description 1
- 229920005830 Polyurethane Foam Polymers 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 230000036031 hyperthermia Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000004020 luminiscence type Methods 0.000 description 1
- 230000003534 oscillatory effect Effects 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 239000011496 polyurethane foam Substances 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 230000005514 two-phase flow Effects 0.000 description 1
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0266—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0275—Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
Landscapes
- Engineering & Computer Science (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
A heat source device with pulse heat dissipation comprises: a heat dissipation fin; the impulse type heat pipe is arranged on one surface of the radiating fin; and the heat source is arranged on one surface of the radiating fin, which is provided with the pulse type heat pipe, and is coupled with the pulse type heat pipe.
Description
Technical field
The present invention relates to a kind of heat power supply device with pulsed heat radiation, particularly relate to one and utilize pulsed heat pipe transferring heat energy, to reach the heat power supply device of radiating effect.
Background technology
Along with the progress of science and technology, each electronic product widely apply by people, right electronic product is now towards light, thin, short, little trend development, as intelligent mobile phone, mobile computer, digital audio-video player or light fixture, but aforesaid electronic product is in use procedure, it all has the characteristic of a high heat-flux, and it is cause a hot issue day by day serious, and this high heat-flux may cause the damage of electronic product.
In order to overcome hot issue, existing processing mode installs a high heat-transfer device additional in this focus place, to dissipate in air by the heat energy of this focus, for the ease of understanding, is below as discussion with a LED lamp.
Please coordinate with reference to shown in figure 1, existing LED lamp includes light-emitting diode group 10 and a radiating module 11.
Light-emitting diode group 10 is provided at the one side of radiating module 11, and radiating module 11 can be combination or the radiating fin of radiating fin and radiator fan.The heat energy that light-emitting diode group 10 produces conducts to radiating module 11 place, to dissipate in air.
But existing radiating fin is mostly based on aluminum, though can heat energy be dissipated in air, right radiating fin is because of the problem of material, cause the capacity of heat transmission poor, therefore usually reach required radiating effect to increase area of dissipation, and then cause the overall weight of radiating module to increase, and improving product cost.
In addition, the power that light-emitting diode inputs in luminescence process only has 10 ~ 36% to be converted to light, and the energy conversion of rough 64 ~ 90% is heat energy, and then causes its junction temperature (Junction Temperature) to raise.As all semiconductor elements or electronic installation, light-emitting diode causes bad impact in the operating environment of high temperature by element.
And light-emitting diode is when start, it easily produces localized hyperthermia, and main cause is for chip pyrotoxin is too concentrated.If under the state that light-emitting diode is in high temperature for a long time, the performance of light-emitting diode to affect to some extent, and it is discussed below.
Please coordinate with reference to shown in figure 2, it is a temperature and compare the output table of comparisons, and it is using a light-emitting diode as discussion.
The temperature of curve A is 69 DEG C; The temperature of curve B is 79 DEG C; The temperature of curve C is 85 DEG C; The temperature of curve D is 96 DEG C; The temperature of curve E is 107 DEG C; The temperature of curve F is 115 DEG C.From curve A to F, if the temperature of light-emitting diode is higher, and the words that service time is longer, its output performance is poorer, so known temperature can produce the impact of certain degree on the performance of light-emitting diode, in like manner, if can be derived from above-mentioned thermal source in being in high temperature for a long time when, its performance also can fail thereupon.
Because above-mentioned impact, common processing mode is in radiating module, add heat pipe (Heat Pipe) further, and heat pipe utilizes phase change mode, capillary force or gravity, and make working-fluid flow, to reach thermal energy transfer effect.
There is in existing heat pipe a steam cavity (Vapor Chamber) and a capillary structure.Steam cavity is for a gaseous fluid flowing.Capillary structure is for a liquid backflow.When working fluid is after the evaporation ends of heat pipe absorbs heat energy, working fluid becomes the gaseous fluid of gas phase from liquid phase, this gaseous fluid by steam cavity by this thermal energy transfer to the condensation end of heat pipe, and in this condensation end, this heat energy is disengaged, and make this gaseous fluid return back to the working fluid of liquid phase, this working fluid is back to evaporation ends by capillary structure again, and reciprocation cycle in this manner, and produce radiating effect.
But existing heat pipe has the lower shortcoming of higher with the maximum heat biography amount of cost.If for promoting hot biography amount, the contact area between heat pipe and light-emitting diode group increased, or the contact area increased between heat pipe and radiating fin, the mode of aforesaid increase area, it is in the overall weight that virtually can increase LED lamp, and reduce the fail safe of LED lamp, increase the material cost of LED lamp simultaneously.
Summary of the invention
The object of the present invention is to provide a kind of heat power supply device with pulsed heat radiation, it is in conjunction with a thermal source by pulsed heat pipe, this thermal source makes pulsed heat pipe produce a pressure differential, and make the start of pulsed heat pipe, reach effect of heat radiation more further, and the overall volume of this heat power supply device can be reduced, promote the fail safe of heat power supply device, and reduce the material cost of heat power supply device.
The invention provides a kind of heat power supply device with pulsed heat radiation, it includes:
One radiating fin;
One pulsed heat pipe, it is located at the one side of this radiating fin; And
One thermal source, it is located at the one side that this radiating fin has this pulsed heat pipe, and this thermal source is coupled to this pulsed heat pipe.
The present invention also provides a kind of heat power supply device with pulsed heat radiation, and it includes:
One radiating fin;
One pulsed heat pipe, this radiating fin is located in its one end; And
One thermal source, it is coupled to the other end of this pulsed heat pipe.
Describe the present invention below in conjunction with the drawings and specific embodiments, but not as a limitation of the invention.
Accompanying drawing explanation
Fig. 1 is the schematic perspective view of existing LED lamp;
Fig. 2 be a light-emitting diode temperature with compare the output table of comparisons;
Fig. 3 is a kind of schematic perspective view with the first embodiment of the heat power supply device of pulsed heat radiation of the present invention;
Fig. 4 is the perspective exploded view with the first embodiment of the heat power supply device of pulsed heat radiation of the present invention;
Fig. 5 is the schematic perspective view with the second embodiment of the heat power supply device of pulsed heat radiation of the present invention;
Fig. 6 is the perspective exploded view with the second embodiment of the heat power supply device of pulsed heat radiation of the present invention;
Fig. 7 is the schematic perspective view with the 3rd embodiment of the heat power supply device of pulsed heat radiation of the present invention;
Fig. 8 is the perspective exploded view with the 3rd embodiment of the heat power supply device of pulsed heat radiation of the present invention;
Fig. 9 is the schematic perspective view with the 4th embodiment of the heat power supply device of pulsed heat radiation of the present invention;
Figure 10 is the perspective exploded view with the 4th embodiment of the heat power supply device of pulsed heat radiation of the present invention;
Figure 11 is that the temperature of a pulsed heat pipe and pressure ratio are according to showing.
Wherein, Reference numeral
1 light-emitting diode
11 radiating modules
20 radiating fins
200 fins
201 setting units
202 obstruct grooves
203 tube seats
21 pulsed heat pipes
22 thermals source
23 heat insulation materials
30 radiating fins
301 setting units
302 openings
303 ribs
304 tube seats
31 pulsed heat pipes
32 thermals source
40 radiating fins
400 fins
401 tube seats
41 pulsed heat pipes
42 bearing portion
420 tube seats
43 thermals source
50 radiating fins
500 fins
501 tube seats
51 pulsed heat pipes
52 thermals source
A ~ I curve
Embodiment
By particular specific embodiment, embodiments of the present invention are described below, have in art and usually know that the knowledgeable by content disclosed in the present specification, can understand other advantages of the present invention and effect easily.
Please coordinate with reference to shown in figure 3 and Fig. 4, first embodiment with the heat power supply device of pulsed heat radiation provided by the invention, it includes radiating fin 20, pulsed heat pipe 21, thermal source 22 and a heat insulation material 23.
The one side of radiating fin 20 has multiple fin 200.Radiating fin 20 has setting unit 201, obstruct groove 202 and a tube seat 203 further.
Setting unit 201 is provided at the another side of radiating fin 20, and setting unit 201 is a groove, to alleviate the overall weight of radiating fin 20.
Obstruct groove 202 is provided at the another side of radiating fin 20, and is surrounded on setting unit 201 around, and obstruct groove 202 is an annular groove, and this annular groove is the overall weight that energy structure further alleviates radiating fin 20.
Tube seat 203 is provided at the another side of radiating fin 20, and the tube seat 203 of part extends to setting unit 201.
Pulsed heat pipe 21 is single hose heat pipe, is provided at tube seat 203, and pulsed heat pipe 21 is the bodys for a bending, and the shape of pulsed heat pipe 21 is shapes of equivalent tube seat 203, and is provided with a working fluid in pulsed heat pipe 21.As previously mentioned, the element that the body that pulsed heat pipe 21 is a bending is formed, the working fluid being arranged in body has produced pressure differential because being heated, therefore cause the pulse phenomenon of two-phase, so by two phase change of working fluid, with transferring heat energy, therefore there is preferably heat-conductive characteristic.The present invention also can use impulse type multitube heat pipe, the structure of this pulsed heat pipe and manufacture are exposed in No. 102131568th, TaiWan, China application for a patent for invention " impulse type multitube heat pipe " and Chinese invention patent 201310439322.1, therefore no longer more this does and repeat.
Thermal source 22 is provided at setting unit 201, and thermal source 22 attaches pulsed heat pipe 21, for example, thermal source 22 can be an electronic component, semiconductor element, a light-emitting diode, an electrical article or a body of heater, this electronic component can be a central processing unit, and this family's electrical article can be a baking box, a refrigerator or a grill pan.For the ease of discussing the present invention, accompanying drawing of the present invention and explanation, only with light-emitting diode representatively, special first Chen Ming.
Heat insulation material 23 is arranged at obstruct groove 202, and between thermal source 22 and pulsed heat pipe 21, heat insulation material 23 can be a heat-barrier material or an air layer, and this heat-barrier material can be rock wool, mineral wool or polyurethane foam material (Polyurethane, PU).
As mentioned above, when thermal source 22 produces a heat energy because of start, this heat energy conducts to pulsed heat pipe 21, then conduct to radiating fin 20 by pulsed heat pipe 21, this heat energy conducts to radiating fin 20 equably, and radiating fin 20 is dissipated in air by heat energy.
When heat energy conducts to pulsed heat pipe 21 by thermal source 22, heat insulation material 23 can intercept this heat energy to dissipate in air in this conductive process.
If without heat insulation material 23, then obstruct groove 202 also has air, its be can avoid thermal source 22 directly by thermal energy conduction to radiating fin 20, and make centralized heat energy in the setting unit 201 of a specific region of radiating fin 20.
Please coordinate with reference to figure 5 with shown in Fig. 6, second embodiment with the heat power supply device of pulsed heat radiation of the present invention, its include radiating fin 30, pulsed heat pipe 31, with a thermal source 32.
The one side of radiating fin 30 has multiple fin 300.Radiating fin 30 has a setting unit 301, multiple opening 302, multiple rib 303 and a tube seat 304 further.
Setting unit 301 is provided at the another side of radiating fin 30, and setting unit 301 is a groove, and it can alleviate the overall weight of radiating fin 30.
Those openings 302 are provided at setting unit 301 around.Those ribs 303 are between those opening 302 and setting units 301.Those openings 302 are to be considered as the obstruct groove described in an embodiment with those ribs 303, and those openings 302 run through this radiating fin 30, therefore those openings 302 are the overall weight that further can alleviate radiating fin 30.
The quantity of those openings 302 is the quantity more than those ribs 303, or the area of those openings 302 is the areas being greater than those ribs 303.The opening 302 that those run through is except can alleviating the weight of radiating fin 30, more because there is air in those openings 302, therefore can avoid thermal source 32 directly by thermal energy conduction to radiating fin 30, and making centralized heat energy in the setting unit 301 of a specific region of radiating fin 30, this thermal source 30 sees following.
Tube seat 304 is the another sides being formed at radiating fin 30, and the tube seat 304 of part extends to setting unit 301.
Pulsed heat pipe 31 is provided in tube seat 304.
Thermal source 32 is provided at setting unit 301, and thermal source 32 is coupled to pulsed heat pipe 31.
First embodiment described above, when thermal source 32 produces a heat energy, this heat energy conducts to pulsed heat pipe 31, and uniform thermal power is conducted to radiating fin 30 by pulsed heat pipe 31 again, and radiating fin 30 is dissipated in air by heat energy.Those openings 302 avoid this heat energy in conductive process, not by pulsed heat pipe 31, and is directly conducted to radiating fin 30 place.
Please coordinate with reference to figure 7 with shown in Fig. 8, the 3rd embodiment of the heat power supply device of tool pulsed heat radiation of the present invention, it has radiating fin 40, pulsed heat pipe 41, bearing portion 42 and a thermal source 43.
Radiating fin 40 has multiple fin 400 and a tube seat 401.Those fins 400 are the one sides being positioned at radiating fin 40.Tube seat 401 is the another sides being positioned at radiating fin 40.
One end of pulsed heat pipe 41 is provided at tube seat 401.
Bearing portion 42 is the one end being positioned at radiating fin 40, and both are separated to arrange, and the one side of bearing portion 42 has the tube seat 420 that can arrange for the other end of pulsed heat pipe 41.
Thermal source 43 is provided at the one side that bearing portion 42 has tube seat 420, and thermal source 43 attaches pulsed heat pipe 43.
Because thermal source 43 is not arranged at radiating fin 40 place, so radiating fin 40 can design with a less volume, and then the material manufacturing radiating fin 40 can be reduced, and reduce the overall weight of radiating fin 40, when thermal source 43 produces a heat energy, heat energy conducts to pulsed heat pipe 41, and uniform thermal power is conducted to radiating fin 40 by pulsed heat pipe 41 again, to dissipate in air.
When thermal energy conduction is to pulsed heat pipe 41, part heat energy be conduct to bearing portion 42, this heat energy system by bearing portion 42, to dissipate in air.
Please coordinate with reference to figure 9 with shown in Figure 10, the 4th embodiment of the heat power supply device of giant pulse formula heat radiation of the present invention, it has radiating fin 50, pulsed heat pipe 51 and a thermal source 52.
Radiating fin 50 has multiple fin 500 and a tube seat 501.Those fins 500 are the one sides being positioned at radiating fin 50.This tube seat 501 is the another sides being positioned at radiating fin 50.
One end of pulsed heat pipe 51 is provided at tube seat 501.
Thermal source 52 is the one end being positioned at radiating fin 50, and thermal source 52 is the other ends being coupled to pulsed heat pipe 51.
When thermal source 52 produces a heat energy, heat energy conducts to pulsed heat pipe 51, then by pulsed heat pipe 51, uniform thermal power is conducted to radiating fin 50, to dissipate in air.
Multiple embodiment of the present invention described above, pulsed heat pipe (Pulsating Heat Pipes) is also called as oscillatory type heat pipe (Oscillating Heat Pipes), it is an element with multiple dog leg piping, it utilizes the working fluid in pipeline to be heated produced pressure differential, to cause the phenomenon of two phase flow pulse, it is discussed below.
Please coordinate with reference to shown in Figure 11, it is that a temperature and pressure ratio photograph are shown, and has working fluid in pulsed heat pipe as above; Curve G is that to represent working fluid be nine fluorine butyl methyl ethers; Curve H is that to represent working fluid be methyl alcohol; Curve I is that to represent working fluid be water.The working temperature of nine fluorine butyl methyl ethers is lower than equaling 60 DEG C.The working temperature of methyl alcohol is between 60 ~ 80 DEG C; The working temperature of water is more than or equal to 80 DEG C.
If discuss with curve H, pulsed heat pipe is the temperature difference being in Δ T1, obtainable Δ P1 differential pressure motive force, if but pulsed heat pipe is promoted to the temperature difference of Δ T2, pressure differential can be significantly increased to Δ P2 by it, the larger saturation pressure difference utilizing this to create makes pulsed heat pipe success start with the fluid that pushes the work forward, and effectively creates and can make pulsed heat pipe entry condition.
Please also refer to shown in Fig. 3 and Fig. 4, setting unit 201 described in the first embodiment of the present invention is a groove, the design of this groove can make the local thickness of radiating fin 20 cut down, and reduce a solid thermal conduction surface, and make heat energy be limited in a specific region, this specific region is the region for thermal source 22 and pulsed heat pipe 21 combine, recycle heat insulation material 23 or this heat energy is limited to setting unit 201 by obstruct groove 202, use formation one local adiabatic zone, and the overall weight of radiating fin 20 can be reduced, and then reduce the overall weight of heat power supply device, and promote the fail safe of heat power supply device, and reduce the material cost of heat power supply device.
Pulsed heat pipe as above, when the thermal energy conduction that thermal source produces is to pulsed heat pipe, the pressure differential of pulsed heat pipe is promoted to be enough to the fluid that pushes the work forward, and make the start of pulsed heat pipe.
As shown in Figure 7 to 10, the radiating fin that the third embodiment of the present invention and the 4th implements profit does not have setting unit as described in the first embodiment and the second embodiment, therefore the volume that the third embodiment of the present invention and the 4th implements the radiating fin of profit is the half of the volume of the radiating fin being reduced to the first embodiment of the present invention or the second embodiment or is less than half, and the start of pulsed heat pipe described above, the first embodiment of the present invention all can make pulsed heat pipe produce pressure differential one by one to the thermal source of the 4th embodiment, and make the start of pulsed heat pipe, reach effect of heat radiation more further, and the overall volume of this heat power supply device can be reduced, promote the fail safe of heat power supply device, and reduce the material cost of heat power supply device.
Certainly; the present invention also can have other various embodiments; when not deviating from the present invention's spirit and essence thereof; those of ordinary skill in the art are when making various corresponding change and distortion according to the present invention, but these change accordingly and are out of shape the protection range that all should belong to the claim appended by the present invention.
Claims (15)
1. there is a heat power supply device for pulsed heat radiation, it is characterized in that, include:
One radiating fin;
One pulsed heat pipe, it is arranged at the one side of this radiating fin; And
One thermal source, it is located at the one side that this radiating fin has this pulsed heat pipe, and this thermal source is coupled to this pulsed heat pipe.
2. the heat power supply device with pulsed heat radiation according to claim 1, is characterized in that this radiating fin has multiple fin, a setting unit, an obstruct groove and a tube seat; Those fins are positioned at the another side of this radiating fin; This setting unit is positioned at the one side of this radiating fin, and this setting unit is arranged for this thermal source; This obstruct groove is located at the one side of this radiating fin, and around this setting unit; This tube seat is arranged for this pulsed heat pipe, and this tube seat is positioned at the one side of this radiating fin, and the tube seat of part extends to this setting unit.
3. the heat power supply device with pulsed heat radiation according to claim 1, is characterized in that this pulsed heat pipe is impulse type single hose or multitube heat pipe.
4. the heat power supply device with pulsed heat radiation according to claim 2, is characterized in that this setting unit is a groove.
5. the heat power supply device with pulsed heat radiation according to claim 2, it is characterized in that this obstruct groove is an annular groove, this annular groove ring establishes this setting unit.
6. the heat power supply device with pulsed heat radiation according to claim 2, it is characterized in that this obstruct groove is multiple opening and multiple rib, those openings are positioned at around this setting unit, and those ribs are between those openings and this setting unit.
7. the heat power supply device with pulsed heat radiation according to claim 2, it is characterized in that having a heat insulation material further, this obstruct groove is located at by this heat insulation material, and between this thermal source and this pulsed heat pipe.
8., according to the heat power supply device with pulsed heat radiation that claim 7 is stated, it is characterized in that this heat insulation material is a heat-barrier material or an air layer.
9. the heat power supply device with pulsed heat radiation according to claim 1, is characterized in that this thermal source is an electronic component, semiconductor element, a light-emitting diode, an electrical article or a body of heater.
10. there is a heat power supply device for pulsed heat radiation, it is characterized in that, include:
One radiating fin;
One pulsed heat pipe, this radiating fin is located in its one end; And
One thermal source, it is coupled to the other end of this pulsed heat pipe.
11. as described in claim the 10th have pulsed heat radiation heat power supply device, it is characterized in that this radiating fin has multiple fin and a tube seat, those fins are positioned at the one side of this radiating fin, and this tube seat is arranged for this pulsed heat pipe, and this tube seat is positioned at the another side of this radiating fin.
12. heat power supply devices with pulsed heat radiation according to claim 10, is characterized in that this thermal source is an electronic component, semiconductor element, a light-emitting diode, an electrical article or a body of heater.
13. heat power supply devices with pulsed heat radiation according to claim 10, it has a bearing portion further, and this bearing portion establishes the other end being fixed on this pulsed heat pipe.
14. according to claim have pulsed heat radiation heat power supply device, it is characterized in that this bearing portion have one can for this pulsed heat pipe arrange tube seat.
The heat power supply device with pulsed heat radiation described in 15., is characterized in that this pulsed heat pipe is impulse type single hose or multitube heat pipe.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW102133621A TW201512624A (en) | 2013-09-17 | 2013-09-17 | Heat source apparatus with pulsating heat dissipation |
| TW102133621 | 2013-09-17 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104470323A true CN104470323A (en) | 2015-03-25 |
Family
ID=52915453
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310583063.XA Pending CN104470323A (en) | 2013-09-17 | 2013-11-18 | Heat source device with pulse type heat dissipation |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN104470323A (en) |
| TW (1) | TW201512624A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI707119B (en) * | 2019-06-11 | 2020-10-11 | 大陸商深圳興奇宏科技有限公司 | Pipe type two-phase flow radiator |
| US11320209B2 (en) | 2019-11-04 | 2022-05-03 | Industrial Technology Research Institute | Pulsating heat pipe |
| EP4008953A1 (en) * | 2020-12-02 | 2022-06-08 | NoelleLED Sp. z o.o. | Led light fitting with a cooling system |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11051428B2 (en) * | 2019-10-31 | 2021-06-29 | Hamilton Sunstrand Corporation | Oscillating heat pipe integrated thermal management system for power electronics |
-
2013
- 2013-09-17 TW TW102133621A patent/TW201512624A/en unknown
- 2013-11-18 CN CN201310583063.XA patent/CN104470323A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI707119B (en) * | 2019-06-11 | 2020-10-11 | 大陸商深圳興奇宏科技有限公司 | Pipe type two-phase flow radiator |
| US11320209B2 (en) | 2019-11-04 | 2022-05-03 | Industrial Technology Research Institute | Pulsating heat pipe |
| EP4008953A1 (en) * | 2020-12-02 | 2022-06-08 | NoelleLED Sp. z o.o. | Led light fitting with a cooling system |
Also Published As
| Publication number | Publication date |
|---|---|
| TW201512624A (en) | 2015-04-01 |
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Application publication date: 20150325 |