WO2015139264A1 - Ensemble module utilisé dans un circuit intégré ou un élément photoélectrique pour réaliser à la fois une conduction de chaleur et une dissipation de chaleur - Google Patents

Ensemble module utilisé dans un circuit intégré ou un élément photoélectrique pour réaliser à la fois une conduction de chaleur et une dissipation de chaleur Download PDF

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Publication number
WO2015139264A1
WO2015139264A1 PCT/CN2014/073770 CN2014073770W WO2015139264A1 WO 2015139264 A1 WO2015139264 A1 WO 2015139264A1 CN 2014073770 W CN2014073770 W CN 2014073770W WO 2015139264 A1 WO2015139264 A1 WO 2015139264A1
Authority
WO
WIPO (PCT)
Prior art keywords
heat
module
flat end
conducting device
integrated circuit
Prior art date
Application number
PCT/CN2014/073770
Other languages
English (en)
Chinese (zh)
Inventor
陈振贤
叶荣富
范哲骞
Original Assignee
陈振贤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 陈振贤 filed Critical 陈振贤
Priority to DE212014000251.6U priority Critical patent/DE212014000251U1/de
Priority to PCT/CN2014/073770 priority patent/WO2015139264A1/fr
Publication of WO2015139264A1 publication Critical patent/WO2015139264A1/fr

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/51—Cooling arrangements using condensation or evaporation of a fluid, e.g. heat pipes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/71—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks using a combination of separate elements interconnected by heat-conducting means, e.g. with heat pipes or thermally conductive bars between separate heat-sink elements
    • F21V29/717—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks using a combination of separate elements interconnected by heat-conducting means, e.g. with heat pipes or thermally conductive bars between separate heat-sink elements using split or remote units thermally interconnected, e.g. by thermally conductive bars or heat pipes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • the present invention relates to a module for heat conduction and heat dissipation of an integrated circuit or a photovoltaic element, and in particular to a combined module having both heat conduction and heat dissipation.
  • the heat sink with heat pipe is a common method of heat dissipation and heat dissipation.
  • the structure mainly includes a heat pipe and a heat sink.
  • the principle of heat dissipation and heat dissipation is to directly or indirectly connect one end of the heat pipe with the semiconductor IC component. Or the contact of the photoelectric element, the working fluid and the capillary structure provided inside the heat pipe are used to absorb the heat generated by the semiconductor IC component or the photoelectric component, and then quickly radiated to the heat sink for heat dissipation, which is quite relieving on heat management. A way of cooling.
  • the technique is to apply a heat-conducting medium such as a thermal conductive adhesive on the outer surface of the heat pipe to fill the gap generated when the heat pipe is assembled with the heat sink.
  • the heat sink and the heat pipe combination method and the structure thereof for improving the heat conduction efficiency mainly includes a heat sink and a heat pipe, wherein the heat sink has a receiving slot at a central position thereof for receiving the heat sink a heat pipe, a plurality of corresponding slits are extended outwardly on a circumference of the groove, and a perforation is connected to the other end of the slit, and the jig is placed inside the slit by the slit,
  • the circumference of the groove is widened, so that the inner diameter of the groove is larger than the heat pipe, so that the heat pipe is inserted into the groove, and finally the jig is removed, so that the inner wall surface of the groove is closely fitted.
  • the outer peripheral surface of the heat pipe is used to achieve better conduction efficiency between the heat pipe and the heat sink.
  • the prior art uses the jig to expand the circumference of the groove, so that the inner diameter of the groove is larger than the heat pipe, so that the heat pipe is inserted through the groove, and the heat sink material is elastic and fatigued. Or the suspicion of rupture, and the material of the heat sink may not be able to load the force exerted by the fixture for a long time.
  • the position of the seam is wasted heat-dissipating heat sink space, so that the heat dissipation efficiency is affected and decreased.
  • the present invention provides a heat conducting/dissipating module for integrated circuit or optoelectronics devices for an integrated circuit or a photovoltaic element, which includes There is a module, a heat conducting device and a heat dissipating device.
  • the heat sink has a through hole and a through hole communicating with the through hole.
  • the heat conducting device is pre-positioned in the through hole of the heat dissipating device, and then the module is inserted into the through hole of the heat dissipating device, so that the heat conducting device is tightly coupled to the heat dissipating device and the module to achieve the best. Cooling efficiency.
  • the heat transfer device has a flat end
  • the heat sink has a first flat end
  • the module has a second flat end.
  • the flat end of the heat conducting device, the first flat end of the heat sink, and the second flat end of the module form a coplanar surface on which a heat generating component can be disposed for heat dissipation. Effect.
  • the heat generating component may be a light emitting diode component, a solar cell component, a semiconductor component, and other electronic components that generate heat after being energized.
  • the heat conducting device may be a heat pipe or a heat column, or a Vapor Chamber component having a vertical thickness, and the module and the heat sink are the same. Made of materials.
  • the present invention provides a module that combines heat conduction and heat dissipation, and the heat-conducting device can be fixed in the heat-dissipating device by the module by means of tight fitting, and the heat-conducting device can also be The function of tightly engaging the heat sink to increase the efficiency of heat dissipation. In this way, there is no need to worry about the elastic fatigue of the material of the heat sink.
  • FIG. 1 is an exploded perspective view of a preferred embodiment of a module for heat conduction and heat dissipation of an integrated circuit or a photovoltaic element according to the present invention.
  • FIG. 2 is a schematic diagram showing the combined implementation of a module for heat conduction and heat dissipation of an integrated circuit or a photovoltaic element in a preferred embodiment of the present invention.
  • FIG 3 is an exploded perspective view of another preferred embodiment of a module for heat conduction and heat dissipation of an integrated circuit or a photovoltaic element according to the present invention.
  • FIG. 4 is a schematic diagram showing the combination of a module for heat conduction and heat dissipation of an integrated circuit or a photovoltaic element according to another preferred embodiment of the present invention.
  • FIG. 5 is a schematic diagram showing the assembly of a heat generating component of another preferred embodiment of a module for heat conduction and heat dissipation of an integrated circuit or a photovoltaic element according to the present invention.
  • FIG. 6 is a schematic view showing the assembly of another heat-generating component of another preferred embodiment of a module for heat conduction and heat dissipation of an integrated circuit or a photovoltaic element according to the present invention.
  • FIG. 7 is a schematic view showing the assembly of another heat-generating component of another preferred embodiment of a module for heat conduction and heat dissipation of an integrated circuit or a photovoltaic element according to the present invention.
  • FIG. 8 is a schematic diagram showing the assembly of another heat-generating component of another preferred embodiment of a module for heat conduction and heat dissipation of an integrated circuit or a photovoltaic element according to the present invention.
  • heating element 110 second flat end
  • FIG. 1 is an exploded perspective view of a module for heat conduction and heat dissipation of an integrated circuit or a photovoltaic element according to a preferred embodiment of the present invention.
  • a module 1 having both heat conduction and heat dissipation includes a module 10, a heat conducting device 30, and a heat sink 50.
  • the heat dissipating device 50 has a through hole 510 and a through slot 530 communicating with the through hole 510.
  • the heat conducting device 30 further has a flat end 310
  • the heat sink 50 further has a first flat end 550.
  • the module 10 further has a second flat end 110.
  • FIG. 2 is a schematic diagram showing the combined implementation of a module for heat conduction and heat dissipation of an integrated circuit or a photovoltaic element according to a preferred embodiment of the present invention.
  • the heat-conducting device 30 is pre-positioned in the through-hole 510 of the heat-dissipating device 50, and then forcedly inserted into the slot 530 of the heat-dissipating device 50 by the module 10 in a tightly fitting manner, thereby transferring the heat-conducting device.
  • the flat end 310 of the heat conducting device 30, the first flat end 550 of the heat sink 50, and the second flat end 110 of the module 10 will form a coplanar plane, as shown in FIG.
  • the coplanar surface can be provided with a heating element thereon to achieve the effect of accelerating heat dissipation.
  • the heat generating component may be a light emitting diode component, a solar cell component, a semiconductor component, and other electronic components that generate heat after being energized.
  • the heat conducting device 30 can be a heat pipe or a heat column or a uniform temperature having a vertical thickness. Vapor Chamber components.
  • the module 10 may be manufactured from the same material as the heat sink 50, or may be made of other materials having a high thermal conductivity.
  • FIG. 3 is an exploded perspective view of another preferred embodiment of a module for heat conduction and heat dissipation of an integrated circuit or a photovoltaic element according to the present invention.
  • a module 1 for heat conduction and heat dissipation of an integrated circuit or a photovoltaic element provided by the present invention comprises a module 10 and 2 The heat conducting device 30 and a heat sink 50.
  • the heat sink 50 has two through holes 510 and a through slot 530 communicating with the through hole 510.
  • the heat transfer device 30 has a flat end 310, the heat sink 50 further has a first flat end 550, and the module 10 has a second flat end 110.
  • the two heat conducting devices 30 are respectively disposed at two sides of the symmetry center of the module 10
  • the two through holes 510 are also disposed at two sides respectively disposed at the center of the symmetry of the through slots 530. .
  • FIG. 4 is a schematic diagram showing the combination of a module for heat conduction and heat dissipation of an integrated circuit or a photovoltaic element according to another preferred embodiment of the present invention.
  • the two heat conducting devices 30 are pre-positioned in the two perforation holes 510 of the heat dissipating device 50, and then forcibly driven into and through the slot 530 of the heat dissipating device 50 by the module 10 in a tightly fitting manner, thereby
  • the heat conducting device 30 is tightly coupled between the heat sink 50 and the module 10, and also allows the module 10 to be tightly coupled between the two heat conducting devices 30 and the heat sink 50 to achieve optimum heat dissipation efficiency.
  • the flat end 310 of the two heat conducting devices 30, the first flat end 550 of the heat sink 50, and the second flat end 110 of the module 10 will form a coplanar plane, as shown in FIG.
  • the coplanar surface is provided with a heating element disposed thereon to achieve an accelerated heat dissipation effect.
  • the heat generating component can be a light emitting diode component, a solar cell component, a semiconductor component, and other electronic components that generate heat after being energized.
  • the two heat conducting devices 30 can be a heat pipe or a heat guiding column. (Heat column) or a Vapor Chamber component with a vertical thickness.
  • the module 10 may be fabricated from the same material as the heat sink 50, or may be fabricated from other materials having a higher thermal conductivity.
  • the shape of the module 10, the heat conducting device 30 and the heat dissipating device 50 included in the module 1 for heat conduction and heat dissipation of an integrated circuit or a photovoltaic element provided by the present invention is not limited to the illustrated figure. 1 or 2, any shape that can perform the same function as it is included in the scope of the claims of the present invention.
  • FIG. 5 is a schematic diagram showing the assembly of a heat generating component of another preferred embodiment of a module for heat conduction and heat dissipation of an integrated circuit or a photovoltaic element according to the present invention.
  • the heat generating component 70 is mounted on the common plane formed by the second flat end 110, the flat end 310 and the first flat end 550 to achieve the effect of accelerating heat conduction and heat dissipation, that is, Figure 5 shows.
  • the heat transfer device 30 of the present invention may also be an L-shaped or other curved heat pipe.
  • FIG. 6 , FIG. 7 and FIG. 8 illustrate another preferred embodiment of the present invention for use in an integrated circuit or a photovoltaic element having both heat conduction and heat dissipation.
  • a schematic diagram of another heating element assembly of a specific embodiment is completed.
  • the heat generating component 70 is mounted on the flat end 311, 312 or 313 of the heat conducting device 30 to achieve the effects of accelerating heat conduction and heat dissipation, that is, as shown in FIGS. 6, 7, and 8. Show.
  • the heating element 70 can be an LED component, a solar cell component, a semiconductor component, and other devices that are energized. Heated electronic components.
  • the present invention provides a module for heat conduction and heat dissipation of an integrated circuit or a photovoltaic element, and the heat-conducting device can be fixed by the module by tightly fitting the clamping method.
  • the heat sink there is also a function of allowing the heat conducting device to be tightly engaged with the heat sink to increase the efficiency of heat dissipation.
  • the module for heat conduction and heat dissipation of an integrated circuit or a photovoltaic element provided by the present invention will be formed by a heat conduction device, a heat dissipation device and a module after assembly. Plane, or a flat end directly on the heat conducting device, for which components requiring heat dissipation are mounted to achieve its accelerated heat dissipation.

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

L'invention concerne un ensemble module utilisé dans un circuit intégré ou un élément photoélectrique pour réaliser à la fois une conduction de chaleur et une dissipation de chaleur, ledit ensemble comprenant un module, un dispositif de conduction de chaleur et un dispositif de dissipation de chaleur ; le dispositif de dissipation de chaleur comporte un trou traversant et une rainure traversante communiquant avec le trou traversant ; lors de l'utilisation, le dispositif de conduction de chaleur est pré-agencé dans le trou traversant du dispositif de dissipation de chaleur et est passé à travers la rainure traversante du dispositif de dissipation de chaleur par l'intermédiaire du module de manière à être étroitement intégré dans le dispositif de dissipation de chaleur et le module de sorte à obtenir une efficacité de dissipation de chaleur optimale. En outre, le module, le dispositif de conduction de chaleur et une extrémité du dispositif de dissipation de chaleur sont formés de façon à être coplanaires afin qu'un élément de génération de chaleur soit disposé sur ceux-ci, ce qui permet de réaliser une dissipation de chaleur.
PCT/CN2014/073770 2014-03-20 2014-03-20 Ensemble module utilisé dans un circuit intégré ou un élément photoélectrique pour réaliser à la fois une conduction de chaleur et une dissipation de chaleur WO2015139264A1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
DE212014000251.6U DE212014000251U1 (de) 2014-03-20 2014-03-20 Modulsatz, der in einer integrierten Schaltung oder einem fotoelektrischen Element sowohl zur Wärmeleitung als auch Wärmeableitung verwendet wird
PCT/CN2014/073770 WO2015139264A1 (fr) 2014-03-20 2014-03-20 Ensemble module utilisé dans un circuit intégré ou un élément photoélectrique pour réaliser à la fois une conduction de chaleur et une dissipation de chaleur

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/CN2014/073770 WO2015139264A1 (fr) 2014-03-20 2014-03-20 Ensemble module utilisé dans un circuit intégré ou un élément photoélectrique pour réaliser à la fois une conduction de chaleur et une dissipation de chaleur

Publications (1)

Publication Number Publication Date
WO2015139264A1 true WO2015139264A1 (fr) 2015-09-24

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PCT/CN2014/073770 WO2015139264A1 (fr) 2014-03-20 2014-03-20 Ensemble module utilisé dans un circuit intégré ou un élément photoélectrique pour réaliser à la fois une conduction de chaleur et une dissipation de chaleur

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DE (1) DE212014000251U1 (fr)
WO (1) WO2015139264A1 (fr)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102017009427A1 (de) * 2017-10-11 2019-04-11 Emz-Hanauer Gmbh & Co. Kgaa Pyrolyse-Backofen mit einem Leuchtmodul

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN2864561Y (zh) * 2005-11-17 2007-01-31 元瑞科技股份有限公司 散热片和热导管的结合构造改良
CN101076239A (zh) * 2006-05-19 2007-11-21 协禧电机股份有限公司 散热鳍片与热导管的结合方法
CN103206633A (zh) * 2013-04-12 2013-07-17 特能传热科技（中山）有限公司 一种大功率灯具
CN103277766A (zh) * 2013-05-30 2013-09-04 青岛科瑞克绿色能源科技有限公司 一种led散热结构

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1315231A (zh) 2000-04-02 2001-10-03 兰学文 城镇生活垃圾制造新型建筑材料

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN2864561Y (zh) * 2005-11-17 2007-01-31 元瑞科技股份有限公司 散热片和热导管的结合构造改良
CN101076239A (zh) * 2006-05-19 2007-11-21 协禧电机股份有限公司 散热鳍片与热导管的结合方法
CN103206633A (zh) * 2013-04-12 2013-07-17 特能传热科技（中山）有限公司 一种大功率灯具
CN103277766A (zh) * 2013-05-30 2013-09-04 青岛科瑞克绿色能源科技有限公司 一种led散热结构

Also Published As

Publication number Publication date
DE212014000251U1 (de) 2016-10-05

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