WO2015136810A1 - Fil-guide - Google Patents

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Publication number
WO2015136810A1
WO2015136810A1 PCT/JP2014/083515 JP2014083515W WO2015136810A1 WO 2015136810 A1 WO2015136810 A1 WO 2015136810A1 JP 2014083515 W JP2014083515 W JP 2014083515W WO 2015136810 A1 WO2015136810 A1 WO 2015136810A1
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WO
WIPO (PCT)
Prior art keywords
solder
core shaft
metal solder
guide wire
metal
Prior art date
Application number
PCT/JP2014/083515
Other languages
English (en)
Japanese (ja)
Inventor
浩範 河崎
小糸　繁之
Original Assignee
日本ライフライン株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日本ライフライン株式会社 filed Critical 日本ライフライン株式会社
Publication of WO2015136810A1 publication Critical patent/WO2015136810A1/fr

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    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61M—DEVICES FOR INTRODUCING MEDIA INTO, OR ONTO, THE BODY; DEVICES FOR TRANSDUCING BODY MEDIA OR FOR TAKING MEDIA FROM THE BODY; DEVICES FOR PRODUCING OR ENDING SLEEP OR STUPOR
    • A61M25/00—Catheters; Hollow probes
    • A61M25/01—Introducing, guiding, advancing, emplacing or holding catheters
    • A61M25/09—Guide wires
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61M—DEVICES FOR INTRODUCING MEDIA INTO, OR ONTO, THE BODY; DEVICES FOR TRANSDUCING BODY MEDIA OR FOR TAKING MEDIA FROM THE BODY; DEVICES FOR PRODUCING OR ENDING SLEEP OR STUPOR
    • A61M25/00—Catheters; Hollow probes
    • A61M25/01—Introducing, guiding, advancing, emplacing or holding catheters
    • A61M25/09—Guide wires
    • A61M2025/09058—Basic structures of guide wires
    • A61M2025/09083—Basic structures of guide wires having a coil around a core
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61M—DEVICES FOR INTRODUCING MEDIA INTO, OR ONTO, THE BODY; DEVICES FOR TRANSDUCING BODY MEDIA OR FOR TAKING MEDIA FROM THE BODY; DEVICES FOR PRODUCING OR ENDING SLEEP OR STUPOR
    • A61M25/00—Catheters; Hollow probes
    • A61M25/01—Introducing, guiding, advancing, emplacing or holding catheters
    • A61M25/09—Guide wires
    • A61M2025/09108—Methods for making a guide wire
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61M—DEVICES FOR INTRODUCING MEDIA INTO, OR ONTO, THE BODY; DEVICES FOR TRANSDUCING BODY MEDIA OR FOR TAKING MEDIA FROM THE BODY; DEVICES FOR PRODUCING OR ENDING SLEEP OR STUPOR
    • A61M25/00—Catheters; Hollow probes
    • A61M25/01—Introducing, guiding, advancing, emplacing or holding catheters
    • A61M25/09—Guide wires
    • A61M2025/09175—Guide wires having specific characteristics at the distal tip

Definitions

  • the present invention relates to a guide wire.
  • Patent Document 1 a core shaft, a coil body that covers the core shaft, a bulging portion formed at the tip of the core shaft, a tip of the coil body, and a tip of the core shaft are covered with the bulging portion.
  • a guide wire provided with a fixing portion that is fixed to the head is described.
  • the bulging portion is formed of a material having higher rigidity than the fixing portion, specifically, an Au-containing solder containing 80 mass% or more of an Au component, for example, an Au—Sn solder.
  • the fixing portion is formed of solder having a melting point lower than that of the solder forming the bulging portion, for example, Ag—Sn solder.
  • the tip of the core body and the tip of the core shaft are fixed by the fixing portion so as to cover the bulging portion. It is said that the fixing strength can be increased.
  • Patent Document 2 discloses a guide wire including a core shaft, a coil body that covers the core shaft, and a most advanced portion formed of metal solder that fixes the tip portion of the core shaft and the tip portion of the coil body.
  • the metal solder is formed of a first metal solder and a second metal solder adjacent to the front end side of the first metal solder, and the first metal solder is more than the second metal solder.
  • Patent Document 2 describes Au—Sn solder as the first metal solder having a high melting point and hardness for the combination of the first metal solder and the second metal solder.
  • An Ag-Sn solder is described as the metal solder.
  • the first metal solder can surely prevent the second metal solder from flowing out to the proximal end side of the first metal solder, so that the most distal portion of the guide wire Can be stably manufactured, and the fixing strength between the core shaft and the coil body can be secured.
  • the bulging portion is formed of Au-containing solder in the guide wire described in Patent Document 1
  • the tip of the coil body and the tip of the core shaft are soldered (eg, Ag—Sn solder) so as to cover the bulging portion. )
  • the Au-containing solder that forms the bulging portion melts and mixes with the solder for forming the fixed portion. In such a case, a guide wire having a target fixing structure cannot be produced.
  • the distal end portion of the core shaft and the distal end portion of the coil body are fixed with a first metal solder (for example, Au-Sn solder) to form the proximal end side most advanced portion.
  • a first metal solder for example, Au-Sn solder
  • the second metal solder for example, Ag—Sn solder
  • the proximal end most distal portion first It is conceivable that a part of the Au component contained in the first metal solder moves to the second metal solder and diffuses into the tip end side most distal part.
  • the first metal solder that forms the proximal end side most distal end portion melts and mixes with the second metal solder. In such a case, a guide wire having a target fixing structure cannot be produced.
  • Au has the property of being easily dissolved in other metals, and it is called gold cracking that Au is dissolved in other metals.
  • the present invention has been made in view of such problems.
  • the first object of the present invention is to provide a guide wire having a structure as described in Patent Document 1, when the tip of the coil body and the tip of the core shaft are secured to the Au component contained in the bulging portion. A part of the solder moves to the solder for forming the fixing part and is diffused in the fixing part, or the Au-containing solder forming the bulging part melts and is mixed with the solder for forming the fixing part.
  • An object of the present invention is to provide a highly safe guide wire having an increased fixing strength between a core shaft and a coil body.
  • the second object of the present invention is contained in the first metal solder in fixing the tip of the coil body and the tip of the core shaft in the guide wire having a structure as described in Patent Document 2. Part of the Au component moves to the second metal solder and is not diffused, or the first metal solder and the second metal solder are not mixed, and the bending rigidity of the tip portion is more than necessary.
  • An object of the present invention is to provide a guide wire that can secure the fixing strength between the core shaft and the coil body without increasing the length.
  • the guide wire of the present invention includes a core shaft, a coil body that covers the core shaft, a bulge portion that is formed of a first metal solder at the tip of the core shaft, and the coil A fixing portion formed of a second metal solder for fixing the tip of the body and the tip of the core shaft so as to cover the bulging portion; and the bulging portion and the fixing so as to cover an outer periphery of the bulging portion. And a barrier layer formed between the two portions.
  • the guide wire of the present invention includes a core shaft, a coil body that covers the core shaft, and a forefront portion that fixes the tip of the core shaft and the tip of the coil body.
  • the guide wire wherein the most distal end portion is a proximal end most distal portion made of a first metal solder, and a distal end side made of a second metal solder located on the distal end side of the proximal end most distal portion. It is formed from the most advanced part and the barrier layer formed between the said proximal end most advanced part and the said front end most advanced part.
  • the first metal solder is an Au-containing solder
  • the second metal solder is a solder having a melting point lower than that of the first metal solder
  • the first metal solder is Au—Sn solder and the second metal solder is Ag—Sn solder.
  • the barrier layer is preferably made of a resin material that can be used at a temperature higher than the melting point of the second metal solder.
  • the barrier layer is preferably a sputtered layer made of a metal having a melting point higher than that of the second metal solder.
  • the barrier layer is preferably a plate material made of a metal having a melting point higher than that of the second metal solder.
  • the guide wire of the present invention includes a bulging portion and a fixing portion between a bulging portion formed of the first metal solder and a fixing portion formed of the second metal solder. Since a barrier layer that prevents mass transfer between the coil body and the tip of the core shaft is fixed, a part of the Au component contained in the bulging portion forms a fixing portion. The first metal solder that moves to the second metal solder to be diffused and diffused into the fixing part or melts and mixes with the second metal solder to form the fixing part by melting. There is nothing to do. Therefore, the guide wire of the present invention (first invention) has a high safety because the fixing strength between the core shaft and the coil body is reliably increased.
  • the most distal end portion that fixes the distal end of the core shaft and the distal end of the coil body is formed on the proximal end side most distal end portion formed of the first metal solder, Since a barrier layer for preventing mass transfer between the proximal end side distal end portion and the distal end side distal end portion is provided between the distal end side distal end portion formed of the second metal solder, the coil body When fixing the tip of the core and the tip of the core shaft, a part of the Au component contained in the proximal end side most distal portion moves to the second metal solder for forming the distal end side most distal portion.
  • the guide wire of the present invention (the second invention) can secure the fixing strength between the core shaft and the coil body without increasing the bending rigidity more than necessary with respect to the tip portion thereof.
  • FIG. 1 is an overall view of a guide wire showing an embodiment of the present invention (embodiment of the first invention). It is a general view of the guide wire which shows other embodiment (embodiment of 2nd invention) of this invention.
  • FIG. 1 is an overall view showing a guide wire according to a first embodiment of the present invention.
  • the guide wire 1 of the present embodiment includes a core shaft 2, a coil body 3 that covers the core shaft 2, a bulging portion 5 that is formed of a first metal solder that is Au-containing solder at the tip of the core shaft 2, A fixing portion 6 formed of a second metal solder having a melting point lower than that of the first metal solder, which fixes the tip of the coil body 3 and the tip of the core shaft 2 so as to cover the bulging portion 5, and a bulging portion 5 is formed between the bulging portion 5 and the fixing portion 6 so as to cover the outer periphery of the bulge 5, and the mass transfer between the bulging portion 5 and the fixing portion 6 (for example, Au from the bulging portion 5 to the fixing portion 6).
  • a barrier layer 8 for preventing movement of components.
  • a guide wire 1 according to the present embodiment shown in FIG. 1 includes a core shaft 2 and a coil body 3 that covers the tip of the core shaft 2.
  • the core shaft 2 includes a large-diameter portion 2a, a tapered portion 2b that is located at the distal end of the large-diameter portion 2a and whose outer diameter decreases in the distal direction, and a small-diameter portion 2c that is located at the distal end of the tapered portion 2b. have.
  • a bulging portion 5 and a barrier layer 8 that covers the outer periphery of the bulging portion 5 are provided at the distal end portion of the small diameter portion 2 c of the core shaft 2, and the distal end of the small diameter portion 2 c of the core shaft 2 and the coil body 3 are provided. Is fixed by the fixing portion 6 so as to cover the bulging portion 5 via the barrier layer 8.
  • the distal end of the large-diameter portion 2 a of the core shaft 2 and the proximal end of the coil body 3 are fixed by a proximal end bonding portion 9. Further, the intermediate part of the small diameter part 2 c of the core shaft 2 and the intermediate part of the coil body 3 are fixed via an intermediate bonding part 7.
  • the guide wire 1 has the bulging portion 5 formed at the tip of the small-diameter portion 2 c of the core shaft 2, the barrier layer 8 is formed so as to cover the outer periphery of the bulging portion 5, and the thinness of the core shaft 2.
  • the distal end of the diameter portion 2 c and the distal end of the coil body 3 are fixed by the fixing portion 6 so as to cover the bulging portion 5 through the barrier layer 8.
  • the material for forming the core shaft 2 is not particularly limited.
  • a material such as a stainless steel (SUS304), a superelastic alloy such as a Ni—Ti alloy, or a piano wire can be used.
  • a wire having radiopacity or a wire having radiolucency can be used as a material for forming the coil body 3.
  • the material of the wire having radiopacity is not particularly limited. For example, gold, platinum, tungsten, or an alloy containing these elements (for example, platinum-nickel alloy) is used. Can do. Further, the material of the wire having radiation transparency is not particularly limited, but for example, stainless steel (SUS304, SUS316, etc.), super elastic alloy such as Ni—Ti alloy, piano wire, etc. are used. be able to.
  • the coil body 3 on the distal end side with respect to the intermediate bonding portion 7 is formed with a radiopaque element wire
  • the coil body 3 on the proximal end side with respect to the intermediate bonding portion 7 is formed with a radiation transmission element wire.
  • the radiopaque strand and the radiolucent strand may contact each other's end surfaces and be fixed by welding, or may be fixed by covering the contacted portion with the intermediate adhesive portion 7. May be.
  • the bulging portion 5 is formed of first metal solder that is Au-containing solder.
  • the Au-containing solder here is a solder containing even a little, and may contain an element other than Au.
  • the Au-containing solder can easily produce the bulging portion 5 while ensuring the fixing strength of the bulging portion 5 to the small diameter portion 2 c of the core shaft 2.
  • Au solder pure gold solder, Au—Ge solder, Au—Si solder, Au—In solder, Au—Sb solder, Au—Sn Solder and Au—Pb solder, Au—Ag—Sn solder, Au—Sn—Pb solder, Au—Cu—Pd solder, Au—Sn—Wo solder, Au—Sn—Mo solder Au-Sn-Co-P solder, Au-Sn-Co-Ge solder, Au-Sn-Bi-In solder, Au-Cu-Pd-Ag solder, Au-Ag-Cu-Sn-In 3 or more components such as Au-Ag-Cu-Sn-Ga solder, Au-Cu-Ni-Ag-In-Sn solder, Au-Pd-In-Cu-Zn-Re-Ag solder Examples thereof include solder containing metal, and these can be used alone or in combination of two or more.
  • the first metal solder in which the content ratio of the Au component is 60% by mass or more can form the bulging portion 5 that has high rigidity and is difficult to be deformed, so that the tip of the small-diameter portion 2c of the core shaft 2 and the coil body 3 can be formed. It is possible to strongly fix the tip of the. Thereby, it can further prevent that the coil body 3 of the guide wire 1 detaches
  • the melting point of the first metal solder forming the bulging portion 5 is preferably 280 to 370 ° C.
  • the flux is previously applied to the part where the bulging part 5 of the small diameter part 2c of the core shaft 2 is formed. By applying it, the fixing strength between the core shaft 2 and the bulging portion 5 formed from the first metal solder can be increased.
  • the second metal solder for forming the fixing portion 6 Ag-Sn solder, Ag-In solder, In-Sn solder, Ag-Pb solder, Pb-Sn solder, In-Sb solder Solder, Sn—Sb solder and Pb—In solder, Sn—Pb—Ag solder, Pb—Ag—Sn solder, Pb—Ag—In solder, In—Sn—Pb—Ag solder, Examples of the solder include three or more metal components such as Ag—Cu—Ni—P based solder. Among these, Ag—Sn based solder is preferable. In the Ag—Sn solder for forming the fixing portion 6, the mass ratio of the Ag component and the Sn component is preferably 2 to 5:98 to 95.
  • the second metal solder for forming the fixing portion 6 has a lower melting point than the first metal solder for forming the bulging portion 5.
  • the melting point of the second metal solder for forming the fixing portion 6 is preferably 221 to 250 ° C.
  • the fixing part 6 Since the melting point of the second metal solder for forming the fixing part 6 is lower than the melting point of the first metal solder forming the bulging part 5, the fixing part 6 is prevented from being deformed. Can be formed. Further, the distal end of the small diameter portion 2c of the core shaft 2 and the distal end of the coil body 3 are firmly fixed while suppressing the thermal influence on the small diameter portion 2c of the core shaft 2 and the coil body 3 by the second metal solder. be able to.
  • the barrier layer 8 is formed so as to cover the outer periphery of the bulging portion 5, and the outer periphery of the barrier layer 8 is covered with the fixing portion 6. That is, the barrier layer 8 is interposed between the bulging portion 5 and the fixing portion 6 so that the fixing portion 6 (second metal solder) does not directly contact the outer periphery of the bulging portion 5 (first metal solder). Is formed.
  • the barrier layer 8 has a function of preventing mass transfer between the bulging portion 5 (first metal solder) and the fixing portion 6 (second metal solder).
  • the barrier layer 8 can prevent mass transfer between the bulging portion 5 and the fixing portion 6 even under a temperature condition equal to or higher than the melting point of the second metal solder.
  • a second metal solder for forming a fixed portion 6 by a part of the Au component contained in the bulging portion 5 The first metal solder for forming the bulging portion 5 and the second metal solder for forming the fixing portion 6 are prevented from being mixed with each other.
  • the barrier layer 8 is required to have good adhesion to the solder material and heat resistance that can withstand the temperature conditions when the tip of the coil body 3 and the tip of the core shaft 2 are fixed.
  • a resin material that can be used at a temperature higher than the melting point of the second metal solder, preferably higher than the melting point of the first metal solder can be suitably used. That is, the barrier layer 8 can use a material that does not melt at the melting point of the second metal solder.
  • a resin material include a thermosetting resin typified by an epoxy resin.
  • the movement of the Au component from the bulging portion 5 (first metal solder) to the fixing portion 6 (second metal solder) is completely achieved. Can be blocked.
  • the barrier layer 8 is formed by sputtering a metal having a melting point higher than that of the second metal solder, preferably a metal having a melting point higher than that of the first metal solder, on the outer periphery of the bulging portion 5. It may be a sputter layer to be formed. Here, Ni, Mo, and W can be mentioned as suitable metals for forming the barrier layer 8 (sputter layer).
  • the first metal solder for forming the bulging portion 5, the second metal solder for forming the fixing portion 6, and the barrier layer 8 positioned between the bulging portion 5 and the fixing portion 6 are formed.
  • a combination in which the first metal solder is Au—Sn solder, the second metal solder is Ag—Sn solder, and the barrier layer is an epoxy resin can be cited. .
  • the material for forming the intermediate bonding portion 7 that adheres to each other.
  • a metal solder such as Sn alloy, Au—Sn alloy, Au—Si alloy, or synthetic resin such as polyethylene, polypropylene, polyamide, various elastomer materials, or an adhesive such as epoxy resin can be used.
  • the fixing portion 6 when the core shaft 2 and the coil body 3 are fixed by the fixing portion 6, the intermediate bonding portion 7, and the proximal end bonding portion 9, the coil body 3 corresponding to a place where each fixing point is formed.
  • a resin member or metal solder can enter, and the fixing strength of the core shaft 2 to the coil body 3 can be increased.
  • the guide wire 1 of this embodiment can be produced by the following method. First, a coil element wire constituting the coil body 3 is wound around a core body for producing a coil body to form the coil body 3 on the outer periphery of the core metal. Then, the coil body 3 is produced by pulling out the cored bar. In addition, after winding the wire of the coil body 3 around the core metal for coil body production, in order to maintain the shape of the coil body 3, heat treatment is performed, so that the wire of the coil body 3 is for coil body production. You may relieve the stress which generate
  • the core shaft 2 is formed by grinding the large diameter portion 2a, the tapered portion 2b and the small diameter portion 2c using a centerless polishing machine or the like.
  • the distal end of the small diameter portion 2 c of the core shaft 2 is inserted from the proximal end side of the coil body 3 so that the distal end of the small diameter portion 2 c of the core shaft 2 is positioned in the distal direction relative to the distal end of the coil body 3.
  • the coil body 3 is disposed on the side.
  • a flux is applied to the tip of the small diameter portion 2c of the core shaft 2, and then the first metal solder is applied using a soldering iron to the tip of the small diameter portion 2c of the core shaft 2 to which the flux is applied.
  • the bulging part 5 is formed by hitting the part.
  • thermosetting resin (barrier layer forming material) is applied so as to cover the outer periphery of the bulging portion 5 formed at the tip of the small-diameter portion 2c of the core shaft 2, and the coating film is heated and cured.
  • the barrier layer 8 is formed.
  • the coil body 3 is moved in the distal direction so that flux is applied to the proximal end of the coil body 3 and the distal end of the large-diameter portion 2a of the core shaft 2, and a proximal end adhesive portion composed of metal solder. 9, the proximal end of the coil body 3 and the distal end of the large-diameter portion 2 a of the core shaft 2 are fixed.
  • the bulging portion 5 When the bulging portion 5 is smaller than the coil inner diameter of the coil body 3, the bulging portion 5 may be formed before the core shaft 2 is inserted into the coil body 3.
  • the bulging portion 5 and the fixing portion 6 are provided between the bulging portion 5 formed of the first metal solder and the fixing portion 6 formed of the second metal solder. Since the barrier layer 8 that prevents mass transfer between the coil body 3 and the core shaft 2 is fixed, the Au component (first metal) contained in the bulging portion 5 is secured. A part of the Au component derived from the solder moves to the second metal solder for forming the fixing portion 6 and diffuses into the fixing portion 6 or forms the bulging portion 5. Does not melt and mix with the second metal solder for forming the fixing portion 6. Therefore, the guide wire 1 of the present embodiment has a high safety because the fixing strength between the core shaft 2 and the coil body 3 is reliably increased.
  • this invention (1st invention) is not limited to embodiment mentioned above, A various change by those skilled in the art is possible within the technical thought of this invention.
  • the end surface of the tip of the small-diameter portion 2 c of the core shaft 2 is coincident with the tip of the bulging portion 5.
  • the bulging portion 5 may be provided so as to cover the end surface, and the bulging portion 5 may be provided at a position shifted in the proximal direction from the end surface of the distal end of the small diameter portion 2 c of the core shaft 2.
  • FIG. 2 is an overall view showing a guide wire according to a second embodiment of the present invention.
  • the guide wire 21 of the present embodiment is a guide wire that includes a core shaft 22, a coil body 23 that covers the core shaft 22, and a leading end portion 25 that fixes the tip of the core shaft 22 and the tip of the coil body 23.
  • the most distal end portion 25 includes a proximal end most distal end portion 25a made of the first metal solder and a lower melting point than the first metal solder located on the distal end side of the proximal end most distal end portion 25a.
  • the distal end side most distal end portion 25b made of two metal solders, and the proximal end most distal end portion 25a and the distal end side most distal end portion 25b.
  • a barrier layer 25c for preventing mass transfer between them.
  • the guide wire 21 includes a core shaft 22 and a coil body 23 that covers the tip of the core shaft 22.
  • the core shaft 22 and the coil body 23 are fixed by the most distal end portion 25, the intermediate fixing portion 27, and the proximal end fixing portion 29.
  • the most advanced portion 25 is a proximal end most distal portion 25a formed of a first metal solder that is an Au-containing solder, and the first metal solder so as to be positioned on the distal end side of the proximal end most distal portion 25a.
  • a barrier layer 25c that prevents mass transfer between the tip end most distal portion 25b.
  • the first metal solder that forms the proximal end most distal end portion 25a is an Au-containing solder.
  • Specific examples of the first metal solder include Au solder (gold solder), pure gold solder, Au—Ge solder, Au—Si solder, Au—In solder, Au—Sb solder, Au—Sn solder.
  • Au-Pb solder Au-Ag-Sn solder, Au-Sn-Pb solder, Au-Cu-Pd solder, Au-Sn-Wo solder, Au-Sn-Mo solder, Au -Sn-Co-P solder, Au-Sn-Co-Ge solder, Au-Sn-Bi-In solder, Au-Cu-Pd-Ag solder, Au-Ag-Cu-Sn-In solder 3 or more metals such as Au-Ag-Cu-Sn-Ga solder, Au-Cu-Ni-Ag-In-Sn solder, Au-Pd-In-Cu-Zn-Re-Ag solder, etc.
  • Including solder Rukoto can be used in combination alone, or two or more kinds.
  • the second metal solder forming the tip side most distal end portion 25b is a solder having a lower melting point than the first metal solder.
  • the second metal solder examples include Ag—Sn solder, Ag—In solder, In—Sn solder, Ag—Pb solder, Pb—Sn solder, In—Sb solder, Sn—Sb. Solder, Pb—In solder, Sn—Pb—Ag solder, Pb—Ag—Sn solder, Pb—Ag—In solder, In—Sn—Pb—Ag solder, Ag—Cu—Ni
  • solder containing three or more metal components such as -P based solder. Among these, Ag-Sn based solder is preferably used.
  • the first metal solder having a high melting point and hardness tends to have lower fluidity after melting than the second metal solder having a low melting point and hardness.
  • the proximal end most distal end portion 25a composed of the first metal solder is formed, and then the distal end side most distal portion 25b composed of the second metal solder is formed. In order.
  • the barrier layer 25c is formed between the proximal end side most distal end portion 25a and the distal end side most distal end portion 25b, and this barrier layer 25c causes the proximal end most distal end portion 25a (first end). It is possible to avoid direct contact between the distal end of the first metal solder) and the proximal end of the distal end side most distal portion 25b (second metal solder).
  • the barrier layer 25c has a function of preventing mass transfer between the proximal end side most distal portion 25a (first metal solder) and the distal end side most distal portion 25b (second metal solder). Specifically, the tip of the coil body 3 and the tip of the core shaft 2 are fixed with the first metal solder to form the proximal end most distal portion 25a, and then the distal end of the proximal end most distal portion 25a.
  • Au component contained in the proximal end side most advanced portion (first metal solder) when the second metal solder is poured into the side (the distal end side of the barrier layer 25c) to form the distal end side most advanced portion 25b Is prevented from moving to the second metal solder, and the first metal solder and the second metal solder are prevented from being mixed.
  • the barrier layer 25c is required to have good adhesion to the solder material and heat resistance that can withstand the temperature conditions when the tip of the coil body 3 and the tip of the core shaft 2 are fixed.
  • the barrier layer 25c As a constituent material of the barrier layer 25c, a resin material that can be used at a temperature higher than the melting point of the second metal solder, preferably higher than the melting point of the first metal solder can be suitably used. That is, the barrier layer 25c can use a material that does not melt at the melting point of the second metal solder.
  • resin materials include thermosetting resins typified by epoxy resins.
  • the movement of the Au component to can be completely blocked.
  • the constituent material of the barrier layer 25c is a metal having a melting point higher than the melting point of the second metal solder, preferably a metal having a melting point higher than the melting point of the first metal solder, and the tip of the proximal end side most distal portion 25a. It may be a sputtered layer formed by sputtering on the side. Examples of suitable metals for forming the barrier layer 25c (sputter layer) include Ni, Mo, and W.
  • the constituent material of the barrier layer 25c may be a plate material made of a metal having a melting point higher than that of the second metal solder, preferably a metal having a melting point higher than that of the first metal solder.
  • stainless steel can be used as a suitable metal for forming the barrier layer 25c (plate material).
  • first metal solder that forms the proximal end side most distal portion 25a
  • second metal solder that forms the distal end side most distal portion 25b
  • the material that forms the barrier layer 25c As an example, a combination in which the first metal solder is Au—Sn solder, the second metal solder is Ag—Sn solder, and the barrier layer is an epoxy resin can be cited.
  • the most distal end portion 25 for fixing the core shaft 22 and the coil body 23 includes a proximal end distal end portion 25a made of a first metal solder, and a proximal end distal end portion 25a.
  • the barrier layer 25c adjacent to the tip end side and the tip end side most distal end portion 25b made of the second metal solder adjacent to the tip end side of the barrier layer 25c, and the first metal solder is the second metal solder. Since the melting point is higher than that of the first metal solder, it is possible to reliably prevent the second metal solder from flowing out to the base end side of the first metal solder. Thus, the fixing strength between the core shaft 22 and the coil body 23 can be ensured.
  • the length of the guide wire 21 in the long axis direction at the most distal end portion 25 can be shortened, whereby the bending rigidity of the distal end of the guide wire 21 can be reduced. It is also possible to prevent an increase in.
  • proximal end side most distal portion 25a and the distal end side are disposed between the proximal end side most distal portion 25a formed of the first metal solder and the distal end side most distal portion 25b formed of the second metal solder. Since the barrier layer 25c that prevents mass transfer between the distal end portion 25b and the distal end of the coil body 3 and the distal end of the core shaft 2 is fixed, it is contained in the proximal end side distal end portion 25a.
  • a part of the Au component moves to the second metal solder for forming the tip-side most distal portion 25b and diffuses to the tip-side most distal portion 25b
  • the first metal solder forming the proximal end side most distal portion 25a is not melted and mixed with the second metal solder for forming the distal end side most distal portion 25b.
  • Examples of the material for forming the core shaft 22 include materials such as stainless alloys (SUS302, SUS304, SUS316, etc.), superelastic alloys such as Ni—Ti alloys, piano wires, nickel-chromium alloys, cobalt alloys, and tungsten. It can be used, and other known materials can also be used.
  • stainless alloys SUS302, SUS304, SUS316, etc.
  • superelastic alloys such as Ni—Ti alloys, piano wires, nickel-chromium alloys, cobalt alloys, and tungsten. It can be used, and other known materials can also be used.
  • a material for forming the coil body 23 for example, a stainless steel alloy (SUS302, SUS304, SUS316, etc.), a superelastic alloy such as a Ni—Ti alloy, a piano wire, a nickel-chromium alloy, a radiation transparent alloy such as a cobalt alloy, etc.
  • Radiopaque alloys such as metal gold, platinum, tungsten, or alloys containing these elements (for example, platinum-nickel alloys) can be used, and other known materials can also be used.
  • the intermediate fixing part 27 and the base end fixing part 29 are formed of metal solder.
  • the metal solder material include Sn—Zn—Al alloy solder (melting point: about 200 ° C.), Sn—Ag—Cu alloy solder (melting point: about 210 ° C.), Sn—Ag alloy solder (melting point: about 220 ° C.).
  • the hardness of metal solder having a high melting point tends to be generally higher than that of metal solder having a low melting point
  • the hardness of the first metal solder having a higher melting point than that of the second metal solder is The hardness of the second metal solder is higher than that of the second metal solder, so that the fixing strength between the core shaft 22 and the coil body 23 can be ensured.
  • the core shaft 22 and the coil body 23 are fixed using the first metal solder or the second metal solder, a flux is previously applied to the fixed portion of the core shaft 22 and the coil body 23, By applying flux to the first metal solder and the second metal solder, the wettability of the first metal solder with respect to the core shaft 22 and the coil body 23 and the second metal solder with respect to the core shaft 22 and the coil body 23 And the adhesion strength between the core shaft 22 and the coil body 23 can be improved.
  • the most distal portion 25 of the guide wire 21 of the present embodiment forms the distal most distal portion 25b with the second metal solder having a low melting point and hardness, a heat source such as a soldering iron, or The shape of the most distal portion 25 (the distal end most distal portion 25b) can be easily adjusted by a grinding / polishing tool such as a leuter. Thereby, the productivity of the most advanced portion 25 of the guide wire 21 can be improved.
  • the guide wire 21 of this embodiment can be manufactured by the following method. First, the outer periphery of the tip of the core shaft 22 is ground by a centerless grinder to produce the core shaft 22 with the outer diameter of the tip reduced. Next, the metal wire used as the material of the coil body 23 is wound around the core metal for the coil, and then, the metal wire is wound around the core metal for the coil to produce the coil body 23. Moreover, you may heat-process after winding as needed. Next, the distal end of the core shaft 22 is inserted from the proximal end side of the coil body 23, and the proximal end of the coil body 23 and the core shaft 22 are secured by metal solder to form the proximal end securing portion 29.
  • the distal end portion of the core shaft 22 and the distal end portion of the coil body 23 are fixed with a first metal solder (eg, Au—Sn solder) to form the proximal end side most distal end portion 25a.
  • a first metal solder eg, Au—Sn solder
  • thermosetting resin (a material for forming the barrier layer) is poured into the distal end side of the proximal end side most distal portion 25a, and the formed resin layer is cured by heating to form the barrier layer 25c.
  • a second metal solder eg, Ag—Sn solder
  • Ag—Sn solder is poured into the front end side of the barrier layer 25c to form the front end side most distal portion 25b.
  • the guide wire 21 can be produced by adjusting the shape of the fixing portion with a polishing tool such as a leuter.
  • the guide wire 21 is not limited to this manufacturing method, and may be manufactured using a known method and means.

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  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Biophysics (AREA)
  • Pulmonology (AREA)
  • Engineering & Computer Science (AREA)
  • Anesthesiology (AREA)
  • Biomedical Technology (AREA)
  • Heart & Thoracic Surgery (AREA)
  • Hematology (AREA)
  • Animal Behavior & Ethology (AREA)
  • General Health & Medical Sciences (AREA)
  • Public Health (AREA)
  • Veterinary Medicine (AREA)
  • Media Introduction/Drainage Providing Device (AREA)

Abstract

La présente invention concerne un fil-guide comprenant une tige centrale, un corps de bobine, une partie renflée formée au niveau d'une pointe de la tige centrale et une partie de liaison liant un bord avant du corps de bobine à la pointe de la tige centrale tout en couvrant la partie renflée, une partie d'un composant d'Au contenu dans la partie renflée ne migrant vers la brasure utilisée pour former la partie de liaison. Ce fil-guide est pourvu de : une tige centrale (2) ; un corps de bobine (3) recouvrant la tige centrale (2) ; une partie renflée (5) formée au niveau d'une extrémité de la tige centrale (2), la partie renflée étant faite d'une première brasure métallique ; une partie de liaison (6) liant un bord avant du corps de bobine (3) à l'extrémité de la tige centrale (2) tout en couvrant la partie renflée (5) la partie de liaison étant faite d'une seconde brasure métallique ; et une couche barrière (8) formée entre la partie renflée (5) et la partie de liaison (6) tout en couvrant la périphérie externe de la partie renflée (5) de manière à empêcher le transfert de matière entre la partie renflée (5) et la partie de liaison (6).
PCT/JP2014/083515 2014-03-14 2014-12-18 Fil-guide WO2015136810A1 (fr)

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JP2014052669A JP2015173835A (ja) 2014-03-14 2014-03-14 ガイドワイヤ
JP2014-052669 2014-03-14

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107320838A (zh) * 2017-07-17 2017-11-07 佛山市迪华科技有限公司 一种介入治疗导丝的成型方法及设备

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6473463B2 (ja) * 2016-06-24 2019-02-20 朝日インテック株式会社 ガイドワイヤ

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10149943A (ja) * 1996-11-20 1998-06-02 Murata Mfg Co Ltd 磁器コンデンサ
JP2010105029A (ja) * 2008-10-31 2010-05-13 Hakko Kk はんだ取扱い器機用熱伝導部材、該熱伝導部材を備えた電気はんだこておよび電気除はんだ工具
JP2012152478A (ja) * 2011-01-28 2012-08-16 Asahi Intecc Co Ltd ガイドワイヤ
JP2013013448A (ja) * 2011-06-30 2013-01-24 Asahi Intecc Co Ltd ガイドワイヤ

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Publication number Priority date Publication date Assignee Title
JP2007150035A (ja) * 2005-11-29 2007-06-14 Kyocera Corp 熱電モジュール

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10149943A (ja) * 1996-11-20 1998-06-02 Murata Mfg Co Ltd 磁器コンデンサ
JP2010105029A (ja) * 2008-10-31 2010-05-13 Hakko Kk はんだ取扱い器機用熱伝導部材、該熱伝導部材を備えた電気はんだこておよび電気除はんだ工具
JP2012152478A (ja) * 2011-01-28 2012-08-16 Asahi Intecc Co Ltd ガイドワイヤ
JP2013013448A (ja) * 2011-06-30 2013-01-24 Asahi Intecc Co Ltd ガイドワイヤ

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107320838A (zh) * 2017-07-17 2017-11-07 佛山市迪华科技有限公司 一种介入治疗导丝的成型方法及设备
CN107320838B (zh) * 2017-07-17 2023-10-13 佛山市迪华科技有限公司 一种介入治疗导丝的成型方法及设备

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