WO2015111452A1 - Substrat pour élément électroluminescent et dispositif électroluminescent - Google Patents

Substrat pour élément électroluminescent et dispositif électroluminescent Download PDF

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Publication number
WO2015111452A1
WO2015111452A1 PCT/JP2015/050516 JP2015050516W WO2015111452A1 WO 2015111452 A1 WO2015111452 A1 WO 2015111452A1 JP 2015050516 W JP2015050516 W JP 2015050516W WO 2015111452 A1 WO2015111452 A1 WO 2015111452A1
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Prior art keywords
substrate
light emitting
main surface
emitting element
outer edge
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PCT/JP2015/050516
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English (en)
Japanese (ja)
Inventor
勝寿 中山
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旭硝子株式会社
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Priority to JP2015558799A priority Critical patent/JP6398996B2/ja
Publication of WO2015111452A1 publication Critical patent/WO2015111452A1/fr

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/64—Heat extraction or cooling elements
    • H01L33/642—Heat extraction or cooling elements characterized by the shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/483—Containers
    • H01L33/486—Containers adapted for surface mounting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/64—Heat extraction or cooling elements
    • H01L33/647—Heat extraction or cooling elements the elements conducting electric current to or from the semiconductor body

Definitions

  • the present invention relates to a light emitting element substrate and a light emitting device.
  • LED light-emitting diode
  • a heat radiator so as to penetrate the substrate on which the light emitting element is mounted. Further, by providing an inclined portion or a stepped portion on the side surface of the radiator, it is possible to increase the contact area between the radiator and the base that mainly constitutes the substrate, thereby ensuring the adhesive strength between the radiator and the base.
  • the inclined portion and the stepped portion are usually configured such that a cross-sectional area increases (perpendicular to the thickness direction) from one main surface side on which the light emitting element is mounted toward the other main surface side. .
  • the thing of a two-stage structure is known as a heat radiator which has a level
  • the present invention has been made to solve the above-described problems, and provides a light-emitting element substrate and a light-emitting device in which cracking of a base caused by an inclined portion or a stepped portion provided on a side surface of a radiator is suppressed. With the goal.
  • the substrate for a light emitting element of the present invention has a base, a heat radiator, a first coating layer, and a second coating layer.
  • the base is plate-shaped and has a first main surface on which the light emitting element is mounted and a second main surface arranged on the opposite side of the first main surface.
  • the heat dissipating member is arranged inside the base, and has a plurality of configurations in which the area of the end surface on the second main surface side is larger than the area of the end surface on the first main surface side and is divided in the thickness direction of the base Has units.
  • the first covering layer is disposed on the first main surface, covers the end surface on the first main surface side of the second structural unit of the radiator disposed on the first main surface side, and The outer edge of the first coating layer is disposed outside the outer edge formed by the end surface on the first main surface side of the two structural units.
  • the second covering layer is disposed between the plurality of structural units of the heat radiating body, and among these structural units, the first structural unit disposed on the second main surface side with respect to the second structural unit.
  • the outer edge of the second covering layer is arranged outside the outer edge formed by the end face on the first main surface side of the first structural unit while covering the end surface on the first main surface side.
  • the light-emitting device of the present invention includes the light-emitting element substrate of the present invention and a light-emitting element mounted on the light-emitting element substrate.
  • the substrate for a light-emitting element of the present invention is provided with a first covering layer so as to straddle the heat dissipating body and its peripheral base on one main surface side on which the light-emitting element is mounted, A second coating layer is provided so as to straddle the peripheral substrate.
  • substrate for light emitting elements shown in FIG. FIG. 2 is a cross-sectional view of the light emitting element substrate shown in FIG. Explanatory drawing explaining angle (theta) of the side surface of a heat radiator.
  • the top view which shows the positional relationship of a heat radiator and a 2nd coating layer.
  • FIG. 1 is a top view showing a first embodiment of a light emitting element substrate.
  • FIG. 2 is a bottom view of the light-emitting element substrate shown in FIG.
  • FIG. 3 is a cross-sectional view of the light emitting element substrate shown in FIG.
  • the light emitting element substrate 10 has a plate-like substrate 11 as shown in FIG. 3, for example.
  • the base 11 has a first main surface 11a on which the light emitting element is mounted, and a second main surface 11b disposed on the opposite side of the first main surface 11a.
  • a heat radiator 12 composed of two structural units 111 and 112 divided in the thickness direction of the base body 11 is provided inside the base body 11.
  • a first coating layer 13 is provided on the first major surface 11a.
  • a second coating layer 14 is provided between the structural units 111 and 112 of the radiator 12.
  • first main surface 11 a may be provided with the wiring conductor 15 (FIG. 1) and the frame body 16 so as to surround the first covering layer 13 and the wiring conductor 15.
  • External electrodes 17 and 18 are provided on the second main surface 11b.
  • a through conductor (not shown) that connects the wiring conductor 15 and the external electrode 17 is provided inside the base 11.
  • the base 11 has, for example, a square cross-sectional shape in a cross section perpendicular to the thickness direction.
  • the base body 11 includes, for example, a first base body 111 and a second base body 112 in order from the second main surface 11b side.
  • the thickness direction means a direction from the first main surface 11a to the second main surface 11b perpendicularly.
  • the thickness of the substrate 11 is not particularly limited, but is usually 0.20 mm or more and 0.60 mm or less.
  • the thickness of each of the first base 111 and the second base 112 is preferably 0.10 mm or more. When the thickness is 0.10 mm or more, handling of the green sheet at the time of manufacture becomes good. In addition, when the thickness is 0.10 mm or more, it is easy to form the radiator 12 on the green sheet.
  • the thickness of each of the first base 111 and the second base 112 is more preferably 0.15 mm or more. On the other hand, the thicknesses of the first base 111 and the second base 112 can be set to 0.30 mm or less or 0.25 mm or less, respectively.
  • the ratio of the thickness of the first base 111 to the thickness of the second base 112 is 3: 7 to 7 : 3 is preferable, 4: 6 to 6: 4 is more preferable, and 5: 5 (that is, the same thickness) is particularly preferable.
  • the base 11 is made of, for example, an inorganic insulating material.
  • the inorganic insulating material include alumina, aluminum nitride, and glass ceramics.
  • Glass ceramics is a sintered body of a glass ceramic composition containing glass powder and ceramic powder, and includes low temperature co-fired ceramics (LTCC) and the like.
  • the thermal conductivity of aluminum nitride is about 200 W / (m ⁇ K)
  • the thermal conductivity of alumina is about 20 W / (m ⁇ K)
  • the thermal conductivity of glass ceramics is about 4 W / (m ⁇ K).
  • the thermal conductivity of alumina and glass ceramics is significantly lower than that of aluminum nitride. For this reason, when the inorganic insulating material is alumina or glass ceramics, the effect of providing the radiator 12 is large.
  • glass ceramics are preferred because of their low firing temperature.
  • a silver reflective film may be formed on the light emitting element substrate 10 on the first main surface 11a side of the base body 11 in order to increase the light reflectance. Since the firing temperature of glass ceramics is low, the silver reflective film can be fired simultaneously with the firing of glass ceramics. Further, glass ceramics are particularly preferable as the inorganic insulating material from the viewpoint of good workability compared to alumina.
  • the radiator 12 is provided inside the base 11 so as to extend in the thickness direction.
  • the radiator 12 has a square cross-sectional shape in a cross section perpendicular to the thickness direction.
  • the area of the end surface by the side of the 2nd main surface 11b of the heat sink 12 is large compared with the area of the end surface by the side of the 1st main surface 11a of the heat sink 12.
  • cross-sectional area and “cross-sectional area” mean an area in a cross-section perpendicular to the thickness direction
  • cross-sectional shape means a thickness direction. It shall mean the shape in a vertical cross section.
  • the area of the end face of the first main surface 11a side of the radiator 12 is preferably 0.60 mm 2 or less, 0.55 mm 2 or less being more preferred.
  • the area of the end face of the heat dissipating body 12 on the first main surface 11a side is the area of the light emitting element mounting surface (hereinafter referred to as “light emitting element area”), that is, the light emitting element is mounted on the light emitting element substrate. It is preferable that it is small compared with the area of the mounting part.
  • the outer edge of the first covering layer 13 is provided on the outer side of the outer edge formed by the end surface of the heat dissipating body 12 on the first main surface 11a side.
  • the area of the end surface on the first main surface 11a side of the heat radiating element 12 is larger than the area of the light emitting element, inevitably light emission in a plan view (when viewed from the first main surface 11a side).
  • the first coating layer 13 protrudes from the element.
  • the area of the end surface by the side of the 1st main surface 11a of the heat sink 12 is smaller than the area of a light emitting element so that the light of a light emitting element may not be absorbed.
  • the heat radiator 12 has, for example, a stepped portion on the side surface, and the cross-sectional area gradually increases from the first main surface 11a side to the second main surface 11b side. Further, for example, as shown in FIG. 3, the radiator 12 includes a plurality of structural units divided by a plane perpendicular to the thickness direction, and in order from the second main surface 11 b side, the first structural unit 121, And a second structural unit 122.
  • the cross-sectional area of the first structural unit 121 is larger than the cross-sectional area of the second structural unit 122.
  • the thickness of the first structural unit 121 is generally substantially the same as the thickness of the first base 111.
  • the thickness of the second structural unit 122 is generally substantially the same as the thickness of the second base body 112.
  • the ratio (V 2 / V 1 ) of the volume (V 2 ) of the radiator 12 to the total volume (V 1 ) of the base member 11 and the members disposed therein is preferably 10% by volume or more.
  • the heat radiator 12, the 2nd coating layer 14, and a penetration conductor (not shown) are mentioned.
  • the ratio (V 2 / V 1 ) is 10% by volume or more, since the volume of the radiator 12 is sufficiently large, the heat dissipation is good.
  • the ratio (V 2 / V 1 ) is 10% by volume or more
  • the base body 11 starting from the radiator 12 is used. Cracking is likely to occur. Since the substrate for a light emitting device of the embodiment has the above-described coating layer, even when the ratio (V 2 / V 1 ) is 10% by volume or more, generation of cracks is suppressed and good heat dissipation is achieved. Sex is obtained.
  • the ratio (V 2 / V 1 ) of the radiator 12 is more preferably 15% by volume or more.
  • the ratio (V 2 / V 1 ) is preferably 30% by volume or less.
  • the ratio (V 2 / V 1 ) exceeds 30% by volume, the volume (V 1 ) is relatively reduced and the strength of the substrate 11 is lowered, and the first coating layer 13 and the second coating layer 14 are reduced. Even if provided, there is a possibility that the base 11 is cracked starting from the radiator 12. Further, the ratio (V 2 / V 1 ) is more preferably 25% by volume or less.
  • FIG. 4 is an explanatory diagram for explaining the angle ⁇ of the side surface of the radiator 12.
  • the angle ⁇ corresponds to the first straight line 31 extending in the thickness direction of the base 11, and the end surface and the side surface on the second main surface 11 b side in each of the structural units 121 and 122.
  • the angle ⁇ is preferably 20 ° or more.
  • the angle ⁇ is 20 ° or more, the area of the end surface on the second main surface 11b side is sufficiently larger than the area of the end surface on the first main surface 11a side, so that the heat dissipation is improved.
  • the angle ⁇ is more preferably 30 ° or more. On the other hand, an angle ⁇ of about 70 ° is sufficient from the viewpoint of heat dissipation.
  • the angle ⁇ is more preferably 60 ° or less. Usually, the angle ⁇ is particularly preferably about 45 °.
  • the heat dissipating body 12 preferably has a curvature radius of a corner portion formed by two side surfaces in the cross-sectional shape of 0.03 mm or more. That is, when the cross section perpendicular to the thickness direction of the radiator 12 is a square, it is preferable that the curvature radii of the corners present at the four corners of the square are 0.03 mm or more. When the radius of curvature is 0.03 mm or more, cracking of the substrate 11 starting from the corner apex is suppressed.
  • the curvature radius is more preferably 0.05 mm or more.
  • the curvature radius is preferably 0.40 mm or less, and more preferably 0.35 mm or less.
  • the constituent material of the radiator 12 is preferably a metal material having high thermal conductivity.
  • a metal material include metals mainly composed of copper, silver, gold, and the like.
  • a metal composed of silver, silver and platinum, or silver and palladium is preferable.
  • that a certain component is the main component of the constituent material means that the component is contained in an amount exceeding 50 mass% with respect to the total amount of the constituent material.
  • the constituent material of the first constituent unit 121 and the constituent material of the second constituent unit 122 may be the same or different.
  • the constituent material of the radiator 12 is preferably a refractory metal such as tungsten or molybdenum from the viewpoint of suppressing deformation during firing.
  • the first covering layer 13 is disposed on the surface of the base 11 on the first main surface 11a side.
  • the first covering layer 13 has a square cross-sectional shape in accordance with the second structural unit 122 having a square cross-sectional shape.
  • the first coating layer 13 covers the end surface of the second structural unit 122 on the first main surface 11 a side, and the outer edge of the first coating layer is the first main surface of the second structural unit 122. It is arranged outside the outer edge formed by the end surface on the 11a side.
  • the outer edge of the first covering layer 13 is disposed outside the outer edge formed by the end surface of the second structural unit 122 on the first main surface 11a side, so that the base of the peripheral portion of the second structural unit 122 is provided.
  • 11 (second substrate 112) is covered with the first covering layer 13. Thereby, the crack in the surface direction of the base 11 starting from the second structural unit 122 is suppressed.
  • FIG. 5 is a top view showing the positional relationship between the second structural unit 122 and the first coating layer 13.
  • Distance L 1 between the first principal surface 11a side of the end face outer edges of the (square) sides and the outer edge of the first cover layer 13 (squares) each side of the second constitutional unit 122, respectively, 0.03 mm or more is preferable.
  • the distance L 1 is 0.03 mm or more, the base 11 (second base 112) in the periphery of the second structural unit 122 is sufficiently covered with the first coating layer 13. Thereby, the crack in the surface direction of the substrate 11 starting from the second structural unit 122 is further suppressed.
  • the distance L 1 is more preferably equal to or greater than 0.05 mm.
  • the distance L 1 is preferably equal to 0.30 mm, more preferably at most 0.25 mm.
  • the area of the end surface of the second structural unit 122 on the first main surface 11a side is the area of the optical element mounting portion.
  • the outer edge formed by the end surface of the second structural unit 122 on the first main surface 11a side is preferably located on the inner side that does not overlap the outer edge of the light emitting element mounting portion.
  • the outer edge of the first covering layer 13 is shown as a square. However, if the distance L 1 from the outer edge of the second structural unit 122 satisfies the predetermined range as described above.
  • the outer edge of the first covering layer 13 is not limited to a square, and any shape can be applied.
  • the area of the first covering layer 13 is larger than the area of the light emitting element, and when there is a part protruding from the light emitting element, if a layer that absorbs light is formed in this part, the light of the light emitting element is absorbed and light Use efficiency may be reduced. Therefore, the area of the first covering layer 13 is the same as or smaller than the area of the light emitting element so that the light of the light emitting element is not absorbed, and the outer edge of the first covering layer 13 (in plan view) is The light emitting element is preferably located on the same side as the outer edge of the mounting portion or on the inner side.
  • the “inner side” referred to here is not limited to the case where the outer edge of the first covering layer 13 is positioned on the inner side without overlapping the outer edge of the light emitting element mounting portion, but the outer edge of the first covering layer 13. It is interpreted that this also includes a case where a part of the light-emitting element overlaps a part of the outer edge of the light-emitting element mounting portion and is positioned inside.
  • a protective layer which is usually formed on the surface of the first coating layer 13 so as to cover the entire surface is exemplified. It is done.
  • the protective layer include a metal plating layer in which a nickel (Ni) plating layer and a Ni / Au plating layer having a gold (Au) plating layer are stacked in this order from the surface side of the first coating layer 13.
  • the thickness of the first coating layer 13 is preferably 5 ⁇ m or more, more preferably 10 ⁇ m or more, from the viewpoint of suppressing cracking of the substrate 11 due to the second structural unit 122. Further, the thickness of the first coating layer 13 is preferably 20 ⁇ m or less, more preferably 15 ⁇ m or less, from the viewpoint of reducing the influence on the substrate 11 due to its thermal expansion.
  • Examples of the constituent material of the first coating layer 13 include a metal material, a resin material, and the like, and a metal material is preferable because it has a high effect of suppressing cracking of the base 11 and high thermal conductivity.
  • Examples of such a metal material include metals mainly composed of copper, silver, gold, and the like. Specifically, a metal composed of silver, silver and platinum, or silver and palladium is preferable.
  • refractory metals such as tungsten and molybdenum, are preferable.
  • the first covering layer 13 preferably has a dense structure made of these metal materials. According to what has a precise
  • Examples of the resin material include acrylic resin, epoxy resin, and silicone resin.
  • the second coating layer 14 is disposed inside the base 11 and between the first structural unit 121 and the second structural unit 122.
  • the second coating layer 14 has, for example, a square cross-sectional shape in accordance with the radiator 12 having a square cross-sectional shape.
  • the 2nd coating layer 14 covers the end surface by the side of the 1st main surface 11a of the 1st structural unit 121 arrange
  • the outer edge of the second coating layer 14 is arranged outside the outer edge formed by the end surface of the first structural unit 121 on the first main surface 11a side.
  • the outer edge of the second coating layer 14 is disposed outside the outer edge formed by the end surface of the first structural unit 121 on the first main surface 11a side, so that the base of the peripheral portion of the first structural unit 121 is provided.
  • 11 (first substrate 111) is covered with the second covering layer 14.
  • the base 11 (the second main body 11) heads toward the first main surface 11a starting from the corner portion formed by the boundary between the end surface and the side surface on the first main surface 11a side in the first structural unit 121. Cracks in the thickness direction of the substrate 112) are suppressed.
  • FIG. 6 is a top view showing the positional relationship between the first structural unit 121 and the second coating layer 14.
  • the distance L 2 is more than 0.10mm and more preferably.
  • the first substrate 111 and second substrate 112 is easily peeled off.
  • Such peeling of inhibition of the distance L 2 is preferably 0.35mm or less, more preferably 0.30 mm.
  • the outer edge of the second coating layer 14 is shown as a square, but the distance L 2 from the outer edge formed by the end surface of the first structural unit 121 on the first main surface 11 a side is the above-described distance L 2. If the predetermined range is satisfied, the outer edge of the second covering layer 14 is not limited to a square, and any shape can be applied. Although the cross-sectional area of the first structural unit 121 is not particularly limited, it is preferable that the cross-sectional area is larger than the area of the optical element mounting portion because the heat dissipation effect can be enhanced.
  • the thickness of the second coating layer 14 can be the same as that described for the first coating layer 13.
  • the constituent material of the second coating layer 14 can be the same as that described for the first coating layer 13.
  • the shape of the frame 16, the wiring conductor 15, the external electrodes 17 and 18, and the through conductor are not limited, and the shape can be selected as necessary.
  • the constituent material of the frame 16 is preferably the same material as the constituent material of the substrate 11 from the viewpoint of productivity and the like.
  • alumina, aluminum nitride, glass ceramics and the like are preferable, alumina and glass ceramics are more preferable, and glass ceramics such as low temperature co-fired ceramics (LTCC) are particularly preferable.
  • LTCC low temperature co-fired ceramics
  • the constituent materials of the wiring conductor 15, the external electrodes 17 and 18, and the through conductor are preferably the same metal materials as the constituent materials of the radiator 12, the first covering layer 13, and the second covering layer 14.
  • a metal material include metals mainly composed of copper, silver, gold, and the like. Specifically, a metal composed of silver, silver and platinum, or silver and palladium is preferable.
  • refractory metals such as tungsten and molybdenum, are preferable.
  • the light emitting element substrate according to the embodiment has been described with respect to the example including the two structural units such that the heat radiator 12 has the stepped portion on the side surface.
  • a light emitting element substrate is not limited to one in which the radiator has two structural units.
  • the structural unit of the radiator 12 may be three or more. That is, in the light emitting element substrate according to the embodiment, the heat dissipation body 12 may have a configuration in which the cross section of the radiator 12 has three or more steps.
  • the 2nd coating layer 14 should just be arrange
  • the first structural unit can be arbitrarily determined from a plurality of structural units excluding the second structural unit closest to the first main surface 11a side.
  • the cross section of the heat radiating body 12 has a stepped shape of three or more steps, the second between all the structural units of the two or more structural units excluding the second structural unit.
  • the covering layer 14 is preferably disposed.
  • FIG. 7 is a top view showing the first embodiment of the light emitting device.
  • FIG. 8 is a cross-sectional view of the light emitting device shown in FIG.
  • the light emitting device 20 includes the light emitting element substrate 10 of the first embodiment.
  • a light emitting element 21 is mounted on the first covering layer 13 in the light emitting element substrate 10.
  • the light emitting element 21 is a 1-wire type light emitting element, and has electrodes on both main surfaces.
  • One electrode of the light emitting element 21 is electrically connected to the wiring conductor 15 by a bonding wire 22.
  • the other electrode of the light emitting element 21 is electrically connected to the first covering layer 13.
  • the radiator 12 has a function as a conductive part in addition to a function as a heat radiating part.
  • a sealing layer 23 is provided inside the frame 16 so as to cover the light emitting element 21 and the like.
  • a sealing material such as a silicone resin or an epoxy resin generally used for a sealing material of a light emitting device is used without particular limitation.
  • FIG. 9 is a top view showing the light emitting element substrate of the second embodiment.
  • FIG. 10 is a cross-sectional view taken along the line CC of the light emitting element substrate shown in FIG.
  • the radiator 12 has a stepped portion on the side surface, whereas in the light emitting element substrate of the second embodiment, the radiator 12 has an inclined portion on the side surface. It is different in having. Other than that, it is the same as the substrate for a light emitting device of the first embodiment.
  • the light-emitting element substrate of the second embodiment will be described mainly with respect to the radiator 12 different from the light-emitting element substrate of the first embodiment.
  • the radiator 12 has an inclined portion on the side surface.
  • the radiator 12 includes a plurality of structural units divided by a plane perpendicular to the thickness direction.
  • the first structural unit 121 and the second structural unit 122 are sequentially arranged from the second main surface 11b side. Have.
  • the heat radiator 12 may be divided into three or more structural units.
  • the first structural unit can be arbitrarily determined from a plurality of structural units excluding the second structural unit closest to the first main surface 11a side.
  • the second coating layer 14 is disposed between all the structural units of the two or more structural units excluding the second structural unit. It is preferable.
  • the second coating layer 14 is disposed between the first structural unit 121 and the second structural unit 122. Moreover, the 2nd coating layer 14 covers the end surface by the side of the 1st main surface 11a of the 1st structural unit 121 arrange
  • the first covering layer 13 covers the end surface of the second structural unit 122 on the first main surface 11a side as in the first embodiment of the light emitting element substrate described above.
  • the outer edge to the outside from the outer edge of the end surface by a predetermined distance L 1 is arranged so as to be located.
  • the second coating layer 14 is also of the first constitutional unit 121 covers the end surface of the first main surface 11a side, from the outer edge of the end surface by a predetermined distance L 2 indicated above outer edge on the outside It is arranged to be located.
  • the area of the end surface on the first main surface 11a side is preferably smaller than the area of the light emitting element mounting portion.
  • the area of the end surface on the first main surface 11a side is preferably larger than the area of the light emitting element mounting portion.
  • the angle ⁇ of the side surface of the radiator 12 measured in the same manner as described above is preferably 20 ° or more.
  • the angle ⁇ is an angle formed between a first straight line extending in the thickness direction of the base 11 and a second straight line passing through the side surface of the heat radiator 12 when the heat radiator 12 has an inclined portion on the side surface.
  • a method for manufacturing a substrate for a light-emitting element will be described below by taking as an example the case where the substrate is a low-temperature co-fired ceramic (LTCC).
  • substrate for light emitting elements of this invention is not limited to this.
  • the substrate for a light emitting element can be manufactured, for example, through the following steps (A) to (D).
  • a green sheet is produced using a glass ceramic composition containing glass powder and ceramic powder (hereinafter referred to as a sheet production step).
  • a green sheet on which an unfired conductor layer is formed is laminated (hereinafter referred to as a lamination process).
  • the laminated green sheets are fired (hereinafter referred to as a firing step).
  • a slurry is prepared by adding a binder and, if necessary, a plasticizer, a dispersant, a solvent, and the like to a glass ceramic composition containing glass powder and ceramic powder. This slurry is formed into a sheet by a doctor blade method or the like and dried to produce a green sheet. At this time, it is preferable to manufacture a plurality of types of green sheets in accordance with, for example, the number of structural units of the radiator 12 (two or more in the present invention). In addition, the green sheet corresponding to each structural unit may have a single layer structure composed of one sheet, or may have a laminated structure composed of two or more sheets.
  • the glass powder preferably has a glass transition point (Tg) of 550 ° C. or higher and 700 ° C. or lower.
  • Tg glass transition point
  • the glass powder preferably has a glass transition point (Tg) of 550 ° C. or higher and 700 ° C. or lower.
  • the glass powder is preferably crystallized when fired at 800 ° C. or higher and 930 ° C. or lower. When crystals are precipitated, sufficient mechanical strength is obtained. Further, the glass powder preferably has a crystallization peak temperature (Tc) measured by DTA (differential thermal analysis) of 880 ° C. or lower. When the crystallization peak temperature (Tc) is 880 ° C. or lower, the dimensional accuracy is increased.
  • Tc crystallization peak temperature measured by DTA (differential thermal analysis) of 880 ° C. or lower.
  • SiO 2 is 57 mol% or more and 65 mol% or less
  • B 2 O 3 is 13 mol% or more and 18 mol% or less
  • CaO is 9 mol% or more and 23 mol% or less
  • Al 2 O 3 is 3 mol% or more and 8 mol% or less.
  • those containing less 0.5 mol% or more 6 mol% of at least one in total selected from K 2 O and Na 2 O are preferred.
  • the flatness of the surface of the substrate 11 is improved.
  • SiO 2 becomes a glass network former.
  • the content of SiO 2 is preferably 58 mol% or more, more preferably 59 mol% or more, and particularly preferably 60 mol% or more.
  • the content of SiO 2 is preferably 64 mol% or less, more preferably 63 mol% or less.
  • B 2 O 3 is a glass network former. If the content of B 2 O 3 is less than 13 mol%, there is a possibility that the glass melting temperature or the glass transition point (Tg) becomes too high. On the other hand, when the content of B 2 O 3 exceeds 18 mol%, it is difficult to obtain a stable glass and the chemical durability may be lowered.
  • the content of B 2 O 3 is preferably 14 mol% or more, more preferably 15 mol% or more. Further, the content of B 2 O 3 is preferably 17 mol% or less, more preferably 16 mol% or less.
  • Al 2 O 3 is added to increase the stability, chemical durability, and strength of the glass.
  • the content of Al 2 O 3 is less than 3 mol%, the glass may become unstable.
  • the content of Al 2 O 3 exceeds 8 mol%, the glass melting temperature and the glass transition point (Tg) may be excessively high.
  • the content of Al 2 O 3 is preferably 4 mol% or more, more preferably 5 mol% or more.
  • the content of Al 2 O 3 is preferably 7 mol% or less, more preferably 6 mol% or less.
  • CaO is added to increase glass stability and crystal precipitation, and to lower the glass melting temperature and glass transition point (Tg).
  • the content of CaO is less than 9 mol%, the glass melting temperature may be excessively high.
  • the content of CaO exceeds 23 mol%, the glass may become unstable.
  • the content of CaO is preferably 12 mol% or more, more preferably 13 mol% or more, and particularly preferably 14 mol% or more.
  • the CaO content is preferably 22 mol% or less, more preferably 21 mol% or less, and particularly preferably 20 mol% or less.
  • K 2 O and Na 2 O lower the glass transition point (Tg).
  • Tg glass melting temperature
  • Tg glass melting point
  • the total content of K 2 O and Na 2 O is preferably 0.8 mol% or more and 5 mol% or less.
  • glass powder is not necessarily limited to what consists only of the said component, Other components can be contained in the range with which various characteristics, such as a glass transition point (Tg), are satisfy
  • the glass powder is obtained by producing glass having the above glass composition by a melting method and pulverizing it by a dry pulverization method or a wet pulverization method.
  • a dry pulverization method it is preferable to use water as the solvent.
  • a pulverizer such as a roll mill, a ball mill, or a jet mill can be used.
  • the 50% average particle size (D 50 ) of the glass powder is preferably 0.5 ⁇ m or more and 2 ⁇ m or less.
  • the 50% average particle size of the glass powder is 0.5 ⁇ m or more, the glass powder is difficult to aggregate, is easy to handle, and is uniformly dispersed.
  • the 50% average particle diameter of the glass powder is 2 ⁇ m or less, an increase in the glass softening temperature and insufficient sintering are suppressed.
  • the particle size is adjusted by classification or the like.
  • the particle diameter refers to a value obtained by a particle diameter measuring apparatus using a laser diffraction / scattering method.
  • Ceramic powder what is conventionally used for manufacture of glass ceramics can be used.
  • the ceramic powder for example, alumina powder, zirconia powder, or a mixture of alumina powder and zirconia powder can be suitably used.
  • the 50% average particle diameter (D 50 ) of the ceramic powder is preferably 0.5 ⁇ m or more and 4 ⁇ m or less, for example.
  • Glass powder and ceramic powder are blended and mixed to obtain a glass ceramic composition.
  • the ratio of the glass powder to the ceramic powder is preferably 30% by mass to 50% by mass for the glass powder and 50% by mass to 70% by mass for the ceramic powder.
  • a slurry is prepared by adding a binder and, if necessary, a plasticizer, a dispersant, a solvent and the like to the glass ceramic composition.
  • binder examples include polyvinyl butyral and acrylic resin.
  • plasticizer examples include dibutyl phthalate, dioctyl phthalate, and butyl benzyl phthalate.
  • solvent examples include organic solvents such as toluene, xylene, 2-propanol and 2-butanol.
  • the slurry is formed into a sheet by the doctor blade method or the like and dried to obtain a green sheet.
  • the green sheet may be a laminate of a plurality of sheets.
  • three types of green sheets are used as the first base 111, the second base 112, and the frame 16.
  • (B) Conductor layer forming step After forming a hole in the green sheet to be the first substrate 111, the hole is filled with a conductive paste by a screen printing method, and the first structural unit of the radiator 12 is formed. An unfired conductor layer such as 121 is formed. Further, a conductive paste is printed on the front and back surfaces of the green sheet by a screen printing method to form an unfired conductive layer that becomes the second coating layer 14 and the external electrodes 17 and 18.
  • the hole is filled with a conductive paste by a screen printing method to form an unfired conductor layer to be the second structural unit 122 or the like.
  • a conductive paste is printed on the surface of the green sheet by a screen printing method to form an unfired conductor layer that becomes the first coating layer 13 and the wiring conductor 15.
  • a hole having a size that surrounds the first covering layer 13 and the wiring conductor 15 is formed in the green sheet to be the frame body 16.
  • a paste obtained by adding a vehicle such as ethyl cellulose to a metal powder mainly composed of copper, silver, gold or the like, and a solvent or the like as necessary can be used.
  • (D) Firing step Firing for sintering the glass ceramic composition is performed on the integrated green sheet. Thereby, the board
  • the degreasing temperature is preferably 500 ° C. or higher and 600 ° C. or lower.
  • the degreasing time is preferably 1 hour or more and 10 hours or less.
  • the degreasing temperature is 500 ° C. or higher and the degreasing time is 1 hour or longer, the removal of the binder and the like is good.
  • the degreasing temperature is 600 ° C. or less and the degreasing time is 10 hours or less, productivity and the like are good.
  • Calcination temperature is preferably 800 ° C. or higher and 930 ° C. or lower, more preferably 850 ° C. or higher and 900 ° C. or lower, and further preferably 860 ° C. or higher and 880 ° C. or lower in consideration of densification and productivity.
  • the firing time is preferably from 20 minutes to 60 minutes. When the firing temperature is 800 ° C. or higher, densification is good. When the firing temperature is 930 ° C. or lower, deformation is suppressed and productivity is improved. Moreover, when the conductor paste containing silver is used, the deformation
  • Examples 1 to 19 As shown in Table 1, the ratio (V 2 / V 1 ), the thickness of the base 11, the cross-sectional area of the second structural unit 122 (corresponding to the area of the end surface on the first main surface 11a side), the distance L 1 , L 2 , and the radius of curvature were changed, and an evaluation substrate having a structure as shown in FIGS. 1 to 3 was produced.
  • the ratio (V 2 / V 1 ) is a ratio of the volume (V 2 ) of the radiator 12 to the total volume (V 1 ) of the base body 11 and the members disposed therein.
  • the distance L 1 is the distance between each side (square) of the outer edge formed by the end surface of the second structural unit 122 on the first main surface 11 a side and each side (square) of the outer edge of the first covering layer 13.
  • the distance L 2 is the first structural unit 121
  • the outer edge end surface of the first major surface 11a side is formed (squares) each side and outer edge of the second cover layer 14 (squares) It is the distance to each side.
  • a curvature radius is a curvature radius of the square corner
  • the cross-sectional shape of the first structural unit 121 is the same in the thickness direction
  • the cross-sectional shape of the second structural unit 122 is also the same in the thickness direction, and three-dimensionally forms a quadrangular prism. .
  • the planar shapes of the base 11, the heat radiating body 12, the first covering layer 13, and the second covering layer 14 are all square.
  • the length of one side of the base 11 is 3 mm
  • the length of one side of the first structural unit 121 of the radiator 12 is 1.28 mm
  • the length of one side of the second structural unit 122 of the radiator 12 is shown in Table 1.
  • the area value was changed.
  • the length of one side inside the frame 16 is 1.8 mm.
  • the thickness of the first base 111 and the second base 112 is the same.
  • the thickness of the 1st coating layer 13 is 12 micrometers
  • the thickness of the 2nd coating layer 14 is 12 micrometers.
  • the evaluation substrate was manufactured as follows. SiO 2 is 60.4mol%, B 2 O 3 is 15.6mol%, Al 2 O 3 is 6 mol%, CaO is 15mol%, K 2 O is 1 mol%, the raw material as Na 2 O is 2 mol% After mixing and mixing, this raw material mixture was put in a platinum crucible and melted at 1600 ° C. for 60 minutes, and then the molten glass was poured out and cooled. This glass was pulverized with an alumina ball mill for 40 hours to produce a glass powder. In addition, ethyl alcohol was used as a solvent for pulverization.
  • a glass ceramic composition was produced by mixing and mixing the glass powder at 40% by mass and alumina powder (made by Showa Denko KK, trade name: AL-45H) at 60% by mass. 50 g of this glass ceramic composition, 15 g of an organic solvent (mixed with toluene, xylene, 2-propanol, 2-butanol in a mass ratio of 4: 2: 2: 1), a plasticizer (di-2-ethylhexyl phthalate) 2.5 g of polyvinyl butyral (trade name: PVK # 3000K, manufactured by Denka) as a binder and 5 g of a dispersant (trade name: BYK180, manufactured by Big Chemie) were further blended and mixed to prepare a slurry.
  • an organic solvent mixed with toluene, xylene, 2-propanol, 2-butanol in a mass ratio of 4: 2: 2: 1
  • a plasticizer di-2-ethylhexyl phthal
  • the slurry was applied on a PET film by a doctor blade method and dried to produce green sheets to be the first substrate 111, the second substrate 112, and the frame 16.
  • the thicknesses of the substrate 11, the first substrate 111, and the second substrate 112 were adjusted by the thickness of the green sheet.
  • Each green sheet is formed with a hole, filled with a conductive paste, printed, and the like as necessary to form an unfired conductor that becomes the heat radiating body 12, the first coating layer 13, the second coating layer 14, and the like.
  • a layer was formed.
  • the ratio (V 2 / V 1 ), the cross-sectional area of the second structural unit 122 of the radiator 12, and the radius of curvature of the corner in the cross-sectional shape (square shape) are the size and shape of the hole formed in the green sheet Adjusted by.
  • the distances L 1 and L 2 were adjusted according to the printing range of the conductor paste.
  • the conductive paste is composed of conductive powder (manufactured by Daiken Chemical Co., Ltd., trade name: S550), ethyl cellulose as a vehicle in a mass ratio of 85:15, and a solvent so that the solid content is 85 mass%. And then kneaded in a porcelain mortar for 1 hour, and further dispersed three times with a three roll. The conductor paste was filled and printed by screen printing.
  • the green sheets on which the unfired conductor layers were formed were laminated in a predetermined order, and then pressed and integrated. Thereafter, the integrated green sheet was degreased at a degreasing temperature of 550 ° C. and a degreasing time of 5 hours. Further, firing was performed at a firing temperature of 870 ° C. and a firing time of 30 minutes. This produced the board
  • DESCRIPTION OF SYMBOLS 10 Light emitting element substrate, 11 ... Base, 12 ... Radiator, 13 ... First coating layer, 14 ... Second coating layer, 15 ... Wiring conductor, 16 ... Frame body, 17, 18 ... External electrode, 20
  • DESCRIPTION OF SYMBOLS ... Light-emitting device, 21 ... Light emitting element, 22 ... Bonding wire, 31 ... 1st straight line, 32 ... 2nd straight line, 111 ... 1st base

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Led Device Packages (AREA)

Abstract

　L'invention concerne un substrat pour élément électroluminescent dans lequel une fissuration du corps de base, provoquée par un corps rayonnant la chaleur ayant une partie inclinée ou une partie étagée sur la surface latérale, est empêchée. Le substrat pour élément électroluminescent comprend un corps de base, un corps rayonnant la chaleur, une première couche de revêtement et une seconde couche de revêtement. Le corps de base présente une première surface principale et une seconde surface principale disposée du côté opposé de la première surface principale. Le corps rayonnant la chaleur comporte une pluralité d'unités constitutives disposées à l'intérieur du corps de base et divisées dans le sens de l'épaisseur du corps de base. La première couche de revêtement est disposée sur la première surface principale et couvre la surface d'extrémité côté première surface principale de la deuxième unité constitutive du corps rayonnant la chaleur disposée côté première surface principale, et le bord extérieur de la première couche de revêtement est disposé à l'extérieur du bord extérieur formé par la surface d'extrémité de la deuxième unité constitutive. La seconde couche de revêtement est disposée entre une pluralité des unités constitutives du corps rayonnant la chaleur et couvre la surface d'extrémité côté première surface principale de la première unité constitutive, qui est l'unité constitutive disposée côté seconde surface principale, et le bord extérieur de la seconde couche de revêtement est disposé à l'extérieur du bord extérieur formé par le côté première surface principale de la première unité constitutive.
PCT/JP2015/050516 2014-01-24 2015-01-09 Substrat pour élément électroluminescent et dispositif électroluminescent WO2015111452A1 (fr)

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JP2008244421A (ja) * 2006-12-26 2008-10-09 Nichia Corp 発光装置およびその製造方法
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JP2008244421A (ja) * 2006-12-26 2008-10-09 Nichia Corp 発光装置およびその製造方法
JP2012018948A (ja) * 2010-07-06 2012-01-26 Asahi Glass Co Ltd 素子用基板、発光装置及び素子用基板の製造方法
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JP7475360B2 (ja) 2019-10-30 2024-04-26 京セラ株式会社 発光素子搭載用パッケージおよび発光装置

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