WO2015111452A1 - Substrat pour élément électroluminescent et dispositif électroluminescent - Google Patents

Substrat pour élément électroluminescent et dispositif électroluminescent Download PDF

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Publication number
WO2015111452A1
WO2015111452A1 PCT/JP2015/050516 JP2015050516W WO2015111452A1 WO 2015111452 A1 WO2015111452 A1 WO 2015111452A1 JP 2015050516 W JP2015050516 W JP 2015050516W WO 2015111452 A1 WO2015111452 A1 WO 2015111452A1
Authority
WO
WIPO (PCT)
Prior art keywords
substrate
light emitting
main surface
emitting element
outer edge
Prior art date
Application number
PCT/JP2015/050516
Other languages
English (en)
Japanese (ja)
Inventor
勝寿 中山
Original Assignee
旭硝子株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 旭硝子株式会社 filed Critical 旭硝子株式会社
Priority to JP2015558799A priority Critical patent/JP6398996B2/ja
Publication of WO2015111452A1 publication Critical patent/WO2015111452A1/fr

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/64—Heat extraction or cooling elements
    • H01L33/642—Heat extraction or cooling elements characterized by the shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/483—Containers
    • H01L33/486—Containers adapted for surface mounting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/64—Heat extraction or cooling elements
    • H01L33/647—Heat extraction or cooling elements the elements conducting electric current to or from the semiconductor body

Abstract

　L'invention concerne un substrat pour élément électroluminescent dans lequel une fissuration du corps de base, provoquée par un corps rayonnant la chaleur ayant une partie inclinée ou une partie étagée sur la surface latérale, est empêchée. Le substrat pour élément électroluminescent comprend un corps de base, un corps rayonnant la chaleur, une première couche de revêtement et une seconde couche de revêtement. Le corps de base présente une première surface principale et une seconde surface principale disposée du côté opposé de la première surface principale. Le corps rayonnant la chaleur comporte une pluralité d'unités constitutives disposées à l'intérieur du corps de base et divisées dans le sens de l'épaisseur du corps de base. La première couche de revêtement est disposée sur la première surface principale et couvre la surface d'extrémité côté première surface principale de la deuxième unité constitutive du corps rayonnant la chaleur disposée côté première surface principale, et le bord extérieur de la première couche de revêtement est disposé à l'extérieur du bord extérieur formé par la surface d'extrémité de la deuxième unité constitutive. La seconde couche de revêtement est disposée entre une pluralité des unités constitutives du corps rayonnant la chaleur et couvre la surface d'extrémité côté première surface principale de la première unité constitutive, qui est l'unité constitutive disposée côté seconde surface principale, et le bord extérieur de la seconde couche de revêtement est disposé à l'extérieur du bord extérieur formé par le côté première surface principale de la première unité constitutive.
PCT/JP2015/050516 2014-01-24 2015-01-09 Substrat pour élément électroluminescent et dispositif électroluminescent WO2015111452A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2015558799A JP6398996B2 (ja) 2014-01-24 2015-01-09 発光素子用基板および発光装置

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2014011654 2014-01-24
JP2014-011654 2014-01-24

Publications (1)

Publication Number Publication Date
WO2015111452A1 true WO2015111452A1 (fr) 2015-07-30

Family

ID=53681260

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2015/050516 WO2015111452A1 (fr) 2014-01-24 2015-01-09 Substrat pour élément électroluminescent et dispositif électroluminescent

Country Status (3)

Country Link
JP (1) JP6398996B2 (fr)
TW (1) TWI648884B (fr)
WO (1) WO2015111452A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7475360B2 (ja) 2019-10-30 2024-04-26 京セラ株式会社 発光素子搭載用パッケージおよび発光装置

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005123477A (ja) * 2003-10-17 2005-05-12 Toyoda Gosei Co Ltd 光デバイス
JP2006156447A (ja) * 2004-11-25 2006-06-15 Kyocera Corp 発光素子用配線基板ならびに発光装置およびその製造方法
JP2007123482A (ja) * 2005-10-27 2007-05-17 Kyocera Corp 発光素子用配線基板および発光装置並びに発光素子用配線基板の製造方法
JP2008244421A (ja) * 2006-12-26 2008-10-09 Nichia Corp 発光装置およびその製造方法
JP2012018948A (ja) * 2010-07-06 2012-01-26 Asahi Glass Co Ltd 素子用基板、発光装置及び素子用基板の製造方法
JP2014068013A (ja) * 2012-09-25 2014-04-17 Lg Innotek Co Ltd 発光素子パッケージ

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20080043444A1 (en) * 2004-04-27 2008-02-21 Kyocera Corporation Wiring Board for Light-Emitting Element
JP2006093565A (ja) * 2004-09-27 2006-04-06 Kyocera Corp 発光素子用配線基板ならびに発光装置およびその製造方法
KR101241650B1 (ko) * 2005-10-19 2013-03-08 엘지이노텍 주식회사 엘이디 패키지
US7687823B2 (en) * 2006-12-26 2010-03-30 Nichia Corporation Light-emitting apparatus and method of producing the same

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005123477A (ja) * 2003-10-17 2005-05-12 Toyoda Gosei Co Ltd 光デバイス
JP2006156447A (ja) * 2004-11-25 2006-06-15 Kyocera Corp 発光素子用配線基板ならびに発光装置およびその製造方法
JP2007123482A (ja) * 2005-10-27 2007-05-17 Kyocera Corp 発光素子用配線基板および発光装置並びに発光素子用配線基板の製造方法
JP2008244421A (ja) * 2006-12-26 2008-10-09 Nichia Corp 発光装置およびその製造方法
JP2012018948A (ja) * 2010-07-06 2012-01-26 Asahi Glass Co Ltd 素子用基板、発光装置及び素子用基板の製造方法
JP2014068013A (ja) * 2012-09-25 2014-04-17 Lg Innotek Co Ltd 発光素子パッケージ

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7475360B2 (ja) 2019-10-30 2024-04-26 京セラ株式会社 発光素子搭載用パッケージおよび発光装置

Also Published As

Publication number Publication date
TWI648884B (zh) 2019-01-21
JPWO2015111452A1 (ja) 2017-03-23
JP6398996B2 (ja) 2018-10-03
TW201533935A (zh) 2015-09-01

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