JP6398996B2 - 発光素子用基板および発光装置 - Google Patents

発光素子用基板および発光装置 Download PDF

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Publication number
JP6398996B2
JP6398996B2 JP2015558799A JP2015558799A JP6398996B2 JP 6398996 B2 JP6398996 B2 JP 6398996B2 JP 2015558799 A JP2015558799 A JP 2015558799A JP 2015558799 A JP2015558799 A JP 2015558799A JP 6398996 B2 JP6398996 B2 JP 6398996B2
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JP
Japan
Prior art keywords
main surface
light emitting
substrate
emitting element
structural unit
Prior art date
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Active
Application number
JP2015558799A
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English (en)
Japanese (ja)
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JPWO2015111452A1 (ja
Inventor
勝寿 中山
勝寿 中山
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
AGC Inc
Original Assignee
Asahi Glass Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asahi Glass Co Ltd filed Critical Asahi Glass Co Ltd
Publication of JPWO2015111452A1 publication Critical patent/JPWO2015111452A1/ja
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Publication of JP6398996B2 publication Critical patent/JP6398996B2/ja
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/64—Heat extraction or cooling elements
    • H01L33/642—Heat extraction or cooling elements characterized by the shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/483—Containers
    • H01L33/486—Containers adapted for surface mounting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/64—Heat extraction or cooling elements
    • H01L33/647—Heat extraction or cooling elements the elements conducting electric current to or from the semiconductor body

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Led Device Packages (AREA)
JP2015558799A 2014-01-24 2015-01-09 発光素子用基板および発光装置 Active JP6398996B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2014011654 2014-01-24
JP2014011654 2014-01-24
PCT/JP2015/050516 WO2015111452A1 (fr) 2014-01-24 2015-01-09 Substrat pour élément électroluminescent et dispositif électroluminescent

Publications (2)

Publication Number Publication Date
JPWO2015111452A1 JPWO2015111452A1 (ja) 2017-03-23
JP6398996B2 true JP6398996B2 (ja) 2018-10-03

Family

ID=53681260

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2015558799A Active JP6398996B2 (ja) 2014-01-24 2015-01-09 発光素子用基板および発光装置

Country Status (3)

Country Link
JP (1) JP6398996B2 (fr)
TW (1) TWI648884B (fr)
WO (1) WO2015111452A1 (fr)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP4053892A4 (fr) * 2019-10-30 2023-11-29 Kyocera Corporation Boîtier de montage d'élément électroluminescent et dispositif électroluminescent

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4238693B2 (ja) * 2003-10-17 2009-03-18 豊田合成株式会社 光デバイス
JP2006093565A (ja) * 2004-09-27 2006-04-06 Kyocera Corp 発光素子用配線基板ならびに発光装置およびその製造方法
JP2006156447A (ja) * 2004-11-25 2006-06-15 Kyocera Corp 発光素子用配線基板ならびに発光装置およびその製造方法
US20080043444A1 (en) * 2004-04-27 2008-02-21 Kyocera Corporation Wiring Board for Light-Emitting Element
KR101241650B1 (ko) * 2005-10-19 2013-03-08 엘지이노텍 주식회사 엘이디 패키지
JP4804109B2 (ja) * 2005-10-27 2011-11-02 京セラ株式会社 発光素子用配線基板および発光装置並びに発光素子用配線基板の製造方法
US7687823B2 (en) * 2006-12-26 2010-03-30 Nichia Corporation Light-emitting apparatus and method of producing the same
JP5200471B2 (ja) * 2006-12-26 2013-06-05 日亜化学工業株式会社 発光装置およびその製造方法
JP5499960B2 (ja) * 2010-07-06 2014-05-21 旭硝子株式会社 素子用基板、発光装置
KR20140039740A (ko) * 2012-09-25 2014-04-02 엘지이노텍 주식회사 발광소자 패키지

Also Published As

Publication number Publication date
WO2015111452A1 (fr) 2015-07-30
JPWO2015111452A1 (ja) 2017-03-23
TWI648884B (zh) 2019-01-21
TW201533935A (zh) 2015-09-01

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