WO2015104799A1 - Appareil d'inspection visuelle et procédé d'inspection visuelle - Google Patents

Appareil d'inspection visuelle et procédé d'inspection visuelle Download PDF

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Publication number
WO2015104799A1
WO2015104799A1 PCT/JP2014/050109 JP2014050109W WO2015104799A1 WO 2015104799 A1 WO2015104799 A1 WO 2015104799A1 JP 2014050109 W JP2014050109 W JP 2014050109W WO 2015104799 A1 WO2015104799 A1 WO 2015104799A1
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WO
WIPO (PCT)
Prior art keywords
solder
result
control unit
dimensional shape
inspection apparatus
Prior art date
Application number
PCT/JP2014/050109
Other languages
English (en)
Japanese (ja)
Inventor
芳邦 鈴木
Original Assignee
ヤマハ発動機株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ヤマハ発動機株式会社 filed Critical ヤマハ発動機株式会社
Priority to CN201480063618.0A priority Critical patent/CN106030240B/zh
Priority to JP2015556659A priority patent/JP6116710B2/ja
Priority to US15/103,428 priority patent/US9933371B2/en
Priority to EP14878058.8A priority patent/EP3070431B1/fr
Priority to PCT/JP2014/050109 priority patent/WO2015104799A1/fr
Priority to KR1020167010036A priority patent/KR101816616B1/ko
Publication of WO2015104799A1 publication Critical patent/WO2015104799A1/fr

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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K31/00—Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by only one of the preceding main groups
    • B23K31/12—Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by only one of the preceding main groups relating to investigating the properties, e.g. the weldability, of materials
    • B23K31/125—Weld quality monitoring
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
    • B23K1/0016—Brazing of electronic components
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/24—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures
    • G01B11/25—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures by projecting a pattern, e.g. one or more lines, moiré fringes on the object
    • G01B11/2531—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures by projecting a pattern, e.g. one or more lines, moiré fringes on the object using several gratings, projected with variable angle of incidence on the object, and one detection device
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956—Inspecting patterns on the surface of objects
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956—Inspecting patterns on the surface of objects
    • G01N21/95684—Patterns showing highly reflecting parts, e.g. metallic elements
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/42—Printed circuits
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956—Inspecting patterns on the surface of objects
    • G01N2021/95638—Inspecting patterns on the surface of objects for PCB's
    • G01N2021/95646—Soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16—Inspection; Monitoring; Aligning
    • H05K2203/163—Monitoring a manufacturing process
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3442—Leadless components having edge contacts, e.g. leadless chip capacitors, chip carriers

Definitions

  • FIG. 4 is a schematic diagram for explaining the direction of the inclination and the angle of the gradient that the minute inclination has.
  • the inclination direction ⁇ and the inclination angle ⁇ are shown for the minute inclination g.
  • the inclination direction ⁇ is obtained as an angle formed by a shadow g (xy) obtained by projecting the minute inclination g on the XY plane and the X direction, and corresponds to the azimuth angle of the minute inclination g.
  • the gradient angle ⁇ is obtained as an angle formed by the straight line 1 parallel to the shadow g (xy) and the minute inclination g, and corresponds to the elevation angle of the minute inclination g.
  • a slope (concave slope region Gc) existing on the surface Bs of the solder B is searched, and the quality of the state of the solder B is determined based on the result. To do.
  • the quality of the state of the solder B is determined based on the result.
  • step S108 the variable T is set to zero in step S201.
  • Such a variable T is set so that the loop calculation of steps S114, S115, and S202 to S205 for correcting the influence of the reflected light is performed until the variable T reaches Tmax.
  • the three-dimensional shape of the imaging region R31 including the surface Bs of the solder B is determined in step S114, and the angles ⁇ and ⁇ are obtained in step S115.
  • step S202 the variable T is incremented, and in step S203, it is determined whether or not the variable T is equal to or less than Tmax. If it is determined in step S203 that the variable T is equal to or less than Tmax, the process proceeds to step S204.
  • Equation 1 Since the light trajectory represented by Equation 1 does not coincide with the surface of the solder B except for the point (X1, Y1, Z1), among the data indicating the three-dimensional shape of the surface Bs of the solder B, the data satisfying Equation 1 is There is only one of (X1, Y1, Z1).
  • the light trajectory expressed by Equation 2 matches the surface Bs of the solder B at points (X3, Y3, Z3) other than the point (X2, Y2, Z2). Therefore, not only data (X2, Y2, Z2) but also data (X3, Y3, Z3) satisfy Equation 2.
  • two (or more) data among the data obtained in step S114 satisfy the equation indicating reflected light.
  • the control device 100 calculates a three-dimensional shape based on the result of specifying the projector 32 that irradiates the reflected light. In such a configuration, it is possible to calculate the three-dimensional shape of the surface Bs of the solder B with high accuracy while suppressing the influence of reflected light.
  • the user interface 200 can be configured to allow the user to set the angles ⁇ and ⁇ that indicate the search condition for the convex slope region Gv. If the convex slope region Gv larger than the predetermined area (the convex slope threshold area) cannot be detected in the added step, it is determined that the state of the solder B is bad in the pass / fail judgment in step S118.
  • the specific method for obtaining the three-dimensional shape of the solder B is not limited to the above-described phase shift method, and may be various other methods such as a method using a stereo camera.

Abstract

La présente invention porte sur un dispositif d'inspection visuelle et un procédé d'inspection visuelle qui permettent de déterminer de façon appropriée l'acceptabilité de l'état d'une pièce de soudure. De façon spécifique, dans lesdits dispositif d'inspection visuelle et procédé d'inspection visuelle, une pente (une région (Gc) inclinée concave) dans la surface (Bs) d'une pièce de soudure (B) est trouvée, et l'acceptabilité de l'état de ladite soudure (B) est déterminée sur la base du résultat de cette dernière. Ainsi, en n'utilisant pas la hauteur de la soudure (B) mais plutôt la pente de la surface (Bs) de cette dernière, l'acceptabilité de l'état de la soudure (B) peut être déterminée de façon appropriée.
PCT/JP2014/050109 2014-01-08 2014-01-08 Appareil d'inspection visuelle et procédé d'inspection visuelle WO2015104799A1 (fr)

Priority Applications (6)

Application Number Priority Date Filing Date Title
CN201480063618.0A CN106030240B (zh) 2014-01-08 2014-01-08 外观检查装置及外观检查方法
JP2015556659A JP6116710B2 (ja) 2014-01-08 2014-01-08 外観検査装置および外観検査方法
US15/103,428 US9933371B2 (en) 2014-01-08 2014-01-08 Visual inspection apparatus and visual inspection method
EP14878058.8A EP3070431B1 (fr) 2014-01-08 2014-01-08 Appareil d'inspection visuelle et procédé d'inspection visuelle
PCT/JP2014/050109 WO2015104799A1 (fr) 2014-01-08 2014-01-08 Appareil d'inspection visuelle et procédé d'inspection visuelle
KR1020167010036A KR101816616B1 (ko) 2014-01-08 2014-01-08 외관 검사 장치 및 외관 검사 방법

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2014/050109 WO2015104799A1 (fr) 2014-01-08 2014-01-08 Appareil d'inspection visuelle et procédé d'inspection visuelle

Publications (1)

Publication Number Publication Date
WO2015104799A1 true WO2015104799A1 (fr) 2015-07-16

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Application Number Title Priority Date Filing Date
PCT/JP2014/050109 WO2015104799A1 (fr) 2014-01-08 2014-01-08 Appareil d'inspection visuelle et procédé d'inspection visuelle

Country Status (6)

Country Link
US (1) US9933371B2 (fr)
EP (1) EP3070431B1 (fr)
JP (1) JP6116710B2 (fr)
KR (1) KR101816616B1 (fr)
CN (1) CN106030240B (fr)
WO (1) WO2015104799A1 (fr)

Cited By (2)

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WO2018163278A1 (fr) * 2017-03-07 2018-09-13 ヤマハ発動機株式会社 Dispositif d'inspection d'apparence et procédé d'inspection d'apparence
WO2023170814A1 (fr) * 2022-03-09 2023-09-14 ヤマハ発動機株式会社 Dispositif de commande pour mesure tridimensionnelle, programme de mesure tridimensionnelle, support d'enregistrement, dispositif de mesure tridimensionnelle et procédé de commande pour mesure tridimensionnelle

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CN108886888B (zh) * 2016-03-29 2020-06-05 株式会社富士 电子元件安装机的动作确认装置
CN110132960B (zh) * 2018-02-09 2021-12-14 飞旭电子(苏州)有限公司 电路板组件的检测方法
CN112683910A (zh) * 2019-10-19 2021-04-20 武汉海川云谷软件技术有限公司 一种基于图像增强算法的汽车遮阳板视觉防错方法
EP3944308A1 (fr) * 2020-07-20 2022-01-26 Nexperia B.V. Dispositif semiconducteur et procédé de fabrication

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Publication number Priority date Publication date Assignee Title
WO2018163278A1 (fr) * 2017-03-07 2018-09-13 ヤマハ発動機株式会社 Dispositif d'inspection d'apparence et procédé d'inspection d'apparence
JPWO2018163278A1 (ja) * 2017-03-07 2019-11-07 ヤマハ発動機株式会社 外観検査装置、外観検査方法
WO2023170814A1 (fr) * 2022-03-09 2023-09-14 ヤマハ発動機株式会社 Dispositif de commande pour mesure tridimensionnelle, programme de mesure tridimensionnelle, support d'enregistrement, dispositif de mesure tridimensionnelle et procédé de commande pour mesure tridimensionnelle

Also Published As

Publication number Publication date
EP3070431B1 (fr) 2023-12-06
US20160320314A1 (en) 2016-11-03
EP3070431A4 (fr) 2017-01-04
KR101816616B1 (ko) 2018-01-09
KR20160056936A (ko) 2016-05-20
CN106030240B (zh) 2019-04-30
JPWO2015104799A1 (ja) 2017-03-23
CN106030240A (zh) 2016-10-12
US9933371B2 (en) 2018-04-03
EP3070431A1 (fr) 2016-09-21
JP6116710B2 (ja) 2017-04-19

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