WO2018163278A1 - Dispositif d'inspection d'apparence et procédé d'inspection d'apparence - Google Patents

Dispositif d'inspection d'apparence et procédé d'inspection d'apparence Download PDF

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Publication number
WO2018163278A1
WO2018163278A1 PCT/JP2017/008976 JP2017008976W WO2018163278A1 WO 2018163278 A1 WO2018163278 A1 WO 2018163278A1 JP 2017008976 W JP2017008976 W JP 2017008976W WO 2018163278 A1 WO2018163278 A1 WO 2018163278A1
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WIPO (PCT)
Prior art keywords
solder
irradiation
substrate
light
reflected
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PCT/JP2017/008976
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English (en)
Japanese (ja)
Inventor
伸章 田端
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ヤマハ発動機株式会社
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Publication date
Application filed by ヤマハ発動機株式会社 filed Critical ヤマハ発動機株式会社
Priority to PCT/JP2017/008976 priority Critical patent/WO2018163278A1/fr
Priority to CN201780087964.6A priority patent/CN110383001B/zh
Priority to JP2019504163A priority patent/JP6733039B2/ja
Publication of WO2018163278A1 publication Critical patent/WO2018163278A1/fr

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/24—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures

Definitions

  • This invention relates to an appearance inspection technique for inspecting solder bonded to a substrate.
  • an appearance inspection technique is used in which light is irradiated onto the solder from above and the light reflected by the solder is imaged.
  • light having different wavelengths infrared, red, green, and blue
  • a camera facing the substrate captures the light reflected by the solder.
  • the longer the wavelength of light the smaller the incident angle to the substrate, and the wavelength of the light that is reflected by the solder slope and incident on the camera differs depending on the slope of the slope.
  • the slope of the solder is gentler, longer wavelength light is imaged.
  • the shape of the solder can be obtained based on an image obtained by imaging the solder.
  • the appearance inspection apparatus of Patent Document 1 directly irradiates light on the solder provided on the surface of the substrate, and images the light reflected by the solder with a camera facing the surface of the substrate.
  • the light reflected by the slope that is gentler than the predetermined angle enters the camera as described above, while the light reflected by the slope that is steeper than the predetermined angle cannot enter the camera. Therefore, as shown in Patent Document 1, the steep slope of the solder in the vicinity of the component cannot be captured by the camera and becomes dark.
  • it is preferable that it can be confirmed that the solder in the vicinity of the component is wet and a steep slope is formed. Therefore, a technique capable of imaging a steep slope of solder has been demanded.
  • the present invention has been made in view of the above problems, and an object thereof is to provide a technique capable of imaging a steep slope of solder.
  • the visual inspection apparatus has a surface on which a solder joint portion is provided, a substrate holding portion that holds a substrate on which solder is joined to the solder joint portion, and emits irradiation light to the surface of the substrate.
  • a first irradiating unit that irradiates the solder with irradiation light reflected by the surface, an imaging unit that images the solder facing the surface, and a control unit that inspects the state of the solder based on the result of imaging the solder by the imaging unit With.
  • the visual inspection method includes a step of irradiating the solder with the irradiation light reflected on the surface by emitting irradiation light to the surface of the substrate in which the solder is bonded to the solder bonding portion, and facing the surface of the substrate. And imaging the solder, and inspecting the state of the solder based on the result of imaging the solder.
  • the present invention (appearance inspection apparatus, appearance inspection method) configured as described above does not directly irradiate the solder with the irradiation light, but emits the irradiation light onto the surface of the substrate, so that the irradiation reflected on the surface is performed. Irradiate the solder with light.
  • the irradiation light applied to the solder through the reflection on the surface of the substrate is incident on the imaging unit after being reflected by the steep slope as compared with the irradiation light directly applied to the solder. As a result, it is possible to image the steep slope of the solder.
  • control unit configures the appearance inspection apparatus so as to inspect the state of the solder based on the result of confirming whether or not there is a part having a luminance equal to or higher than a predetermined threshold luminance in the image obtained by imaging the solder by the imaging unit. You may do it. That is, when the solder is wet and the solder has a steep slope, the light reflected by the steep slope enters the imaging unit. Therefore, it is possible to determine that the state of the solder is good by confirming a portion having a luminance higher than a predetermined level in an image obtained by imaging the solder.
  • the first irradiation unit emits a predetermined projection pattern as irradiation light on the surface
  • the imaging unit images an observation pattern of the irradiation light reflected by the solder
  • the control unit performs soldering based on the observation pattern.
  • You may comprise an external appearance inspection apparatus so that a shape may be calculated
  • control unit may configure the appearance inspection apparatus so as to obtain the solder shape based on the difference in shape between the projection pattern and the observation pattern.
  • the appearance inspection apparatus may be configured such that the projection pattern has a plurality of lines of different colors arranged at intervals. In such a configuration, even when adjacent lines are close to each other in the observation pattern, since these lines can be distinguished by the difference in color, the shape of the solder can be accurately obtained.
  • the first irradiation unit irradiates the surface with three or more sinusoidal fringe patterns having different phases from each other as a projection pattern, and the imaging unit obtains an observation pattern for each of the three or more sinusoidal fringe patterns, Based on the phase calculated by the phase shift method from the observation pattern, the control unit obtains the correspondence between the incident position where the irradiation light is incident on the surface and the reflection position where the irradiation light is reflected by the solder, and based on the correspondence
  • the appearance inspection apparatus may be configured so as to obtain the shape of the solder. In such a configuration, the shape of the solder can be obtained more accurately.
  • a plurality of solder joints are provided on the surface of the substrate, and the first irradiation unit sets a plurality of irradiation ranges on the surface corresponding to the plurality of solder joints, and each of the plurality of irradiation ranges is provided.
  • You may comprise an external appearance inspection apparatus so that the reflected light reflected in the irradiation range may be irradiated to the solder joined to the solder joint location corresponding to the irradiation range by emitting the irradiation light. With such a configuration, it is possible to image a steep slope of each of the plurality of solders.
  • the first irradiation unit simultaneously emits irradiation lights having different wavelengths to a plurality of specific irradiation ranges satisfying a predetermined positional relationship among the plurality of irradiation ranges, and the control unit performs irradiation captured by the imaging unit.
  • the appearance inspection apparatus may be configured to associate the specific irradiation range where the irradiation light is emitted with the solder reflecting the irradiation light reflected in the specific irradiation range. In such a configuration, it is possible to accurately associate the specific irradiation range with the corresponding solder according to the wavelength of the irradiation light.
  • a second irradiating unit that emits three or more lights having different wavelengths to the solder from different angles is further provided, and the control unit determines the state of the solder based on a result of the imaging unit imaging three or more lights reflected by the solder.
  • the visual inspection apparatus may be configured to inspect the above. Thereby, it is possible to take an image of the gentle slope of the solder.
  • the first irradiation unit may be configured as an appearance inspection apparatus so that the irradiation light is emitted to the silk provided on the surface of the substrate.
  • a lens having an optical axis parallel to the normal line of the surface of the substrate and facing the substrate, and light emitted from the substrate and passing through the lens is guided to the imaging unit, and light emitted from the first irradiation unit
  • the visual inspection apparatus may be configured to further include a beam splitter that guides the light to the substrate through the lens. In this way, by sharing the lens between the imaging unit and the first irradiation unit, it is possible to match the range in which the imaging unit can capture an image with the range in which the first irradiation unit can irradiate irradiation light.
  • inspection process of the flowchart of FIG. The figure which shows typically the mode of the steep slope inspection of the solder performed according to the flowchart of FIG. 2 and FIG.
  • FIG. 1 is a diagram schematically showing an example of an appearance inspection apparatus according to the present invention.
  • the appearance inspection apparatus 1 is a solder inspection apparatus that determines whether the solder S bonded to the substrate B is good or bad, and includes a control unit 11 and a user interface 12.
  • the control unit 11 is a processor composed of a CPU (Central Processing Unit), a RAM (Random Access Memory), and the like, and controls the inspection of the solder S bonded to the substrate B.
  • the user interface 12 is configured by a touch panel, for example, and the user can set the inspection condition of the solder S and confirm the inspection result of the solder via the user interface 12.
  • the appearance inspection apparatus 1 includes a substrate transport unit 2 that transports the substrate B, an inspection head H that faces the substrate B from above, and a drive unit 3 that drives the inspection head H.
  • the substrate transport unit 2 is composed of, for example, a pair of conveyors, and fixes the substrate B loaded from the outside to a predetermined holding position (the position of the substrate B in FIG. 1), or unloads the substrate B from the holding position to the outside. To do.
  • An electronic component is attached to the surface Bs of the substrate B with solder S, and the substrate transport unit 2 fixes the substrate B at the holding position while holding the surface Bs of the substrate B horizontally.
  • the driving unit 3 is configured by, for example, an XY robot, and drives the inspection head H two-dimensionally in the horizontal direction, thereby causing the inspection head H to face a predetermined inspection position of the substrate B held at the holding position.
  • the inspection head H includes an optical system 4, a camera 5 attached to the upper end of the optical system 4, a gentle slope illumination 6 provided around the optical system 4, and a steep slope attached to the side surface of the optical system 4. And illumination 7.
  • the optical system 4 includes a lens 41 facing the substrate B from above and a beam splitter 42 facing the substrate B through the lens 41.
  • the lens 41 is a telecentric lens having an optical axis A orthogonal to the surface Bs of the substrate B (in other words, parallel to the normal Bn of the surface Bs) and having telecentricity at least on the substrate B side.
  • the beam splitter 42 is, for example, a half mirror, and guides light emitted from the substrate B and transmitted through the lens 41 to the camera 5, while guiding light emitted from the steep slope illumination 7 to the substrate B through the lens 41.
  • the camera 5 has a solid-state image sensor 51 such as a CCD (Charge Coupled Device) sensor or a CMOS (Complementary MOS) sensor.
  • the camera 5 images the light from the substrate B imaged by the lens 41 by the solid-state image sensor 51.
  • the gentle slope illumination 6 has an annular shape centered on the optical axis A, and has a hollow portion 61 at a portion facing the optical system 4.
  • the gentle slope illumination 6 includes three annular illuminations 62r, 62g, and 62b arranged concentrically around the optical axis A.
  • the annular illuminations 62r, 62g, and 62b have small diameters in this order, and emit light having different wavelengths (colors) from the obliquely upward to the substrate B.
  • the annular illumination 62r arranged at the innermost side emits red light to the substrate B
  • the annular illumination 62g arranged outside the annular illumination 62r emits green light to the substrate B.
  • the annular illumination 62b disposed outside 62g emits blue light to the substrate B.
  • the longer the wavelength of light the smaller the incident angle to the substrate B.
  • the steep slope illumination 7 has a light source 71 and a light modulator 72, and modulates the light emitted from the light source 71 by the light modulator 72.
  • the light modulator 72 a liquid crystal panel or DMD (Digital Mirror Device) can be used.
  • the light modulated by the light modulator 72 is reflected by the beam splitter 42 and then irradiated to the surface Bs of the substrate B by the lens 41.
  • the steep slope illumination 7 can selectively irradiate only a predetermined range of the surface Bs of the substrate B by adjusting the light modulation by the light modulator 72.
  • FIG. 2 is a flowchart showing an example of operations performed by the appearance inspection apparatus of FIG.
  • FIG. 3 is a flowchart showing a first operation example executed in the solder inspection process of the flowchart of FIG.
  • the flowcharts of FIGS. 2 and 3 are executed under the control of the control unit 11.
  • FIG. 4 is a diagram schematically showing the state of the steep slope inspection of the solder executed in accordance with the flowcharts of FIGS. 2 and 3.
  • a component E is attached to the surface Bs of the substrate B by solder S. That is, on the surface Bs of the substrate B, the solder joint location Ps is provided adjacent to the component attachment location Pe, and the solder S joined to the solder joint location Ps is the component E arranged at the component attachment location Pe.
  • the electrode Ed and the solder joint location Ps (terminal) are electrically connected. 2 and 3, the fillet of the solder S is inspected.
  • step S101 the substrate transport unit 2 fixes the substrate B carried in from the outside to the holding position. As a result, the surface Bs of the planar substrate B is held horizontally.
  • step S102 the drive unit 3 moves the camera 5 to the inspection position. As a result, the solder S to be inspected out of the surface Bs of the substrate B falls within the field of view of the camera 5.
  • step S103 a solder inspection process is executed.
  • the annular illuminations 62r, 62g, and 62b of the gentle slope illumination 6 emit light toward the solder S at the same time (step S201). Thereby, the light from the annular illuminations 62r, 62g, and 62b is directly applied to the solder S. Then, the camera 5 captures the light that is totally reflected by the slope S1 of the solder S and imaged on the solid-state image sensor 51 by the lens 41 (step S202).
  • the longer the wavelength of light the smaller the angle of incidence on the surface Bs of the substrate B, and the wavelength of the light reflected by the slant surface Sl of the solder S and incident on the camera 5 is inclined to the slant surface Sl.
  • the longer the slope S1 of the solder S the longer wavelength light is imaged.
  • step S203 the control unit 11 inspects the quality of the solder S based on the shape of the slope S1 of the solder S calculated from the color distribution in the image captured by the camera 5.
  • This pass / fail inspection can be appropriately executed based on a standard used conventionally.
  • the gentle slope illumination 6 directly irradiates the solder S with light from obliquely above. Therefore, of the light totally reflected by the slope S1 of the solder S, the light that passes through the lens 41 and enters the camera 5 is totally reflected by the gentle slope Sg whose inclination angle ⁇ is less than a predetermined angle (at most 45 degrees).
  • the inclination angle ⁇ is an angle (acute angle) formed by the surface Bs of the substrate B and the inclined surface Sl of the solder S. Therefore, in step S203, only the shape of the gentle slope Sg of the solder S is inspected.
  • steps S204 to S207 the shape of the steep slope Ss of the solder S is inspected. That is, the irradiation range Ri for irradiating light from the steep slope illumination 7 is set based on the position of the gentle slope Sg of the solder S confirmed by the gentle slope inspection in step S203 (step S204). Specifically, in the surface Bs of the solder S, a range opposite to the component E with respect to the gentle slope Sg is set as the irradiation range Ri. Thus, the irradiation range Ri is set on the surface Bs of the substrate B exposed without being covered with the component E and the solder S.
  • step S205 the irradiation light Li is irradiated from the steep slope illumination 7 to the set irradiation range Ri.
  • the lens 41 has telecentricity on the substrate B side. Therefore, the irradiation range Ri is irradiated with irradiation light Li parallel to the optical axis A of the lens 41 (in other words, the normal Bn of the surface Bs of the substrate B). And among the irradiation light Li, the diffused light Ld diffusely reflected in the irradiation range Ri is incident on the slant surface Sl of the solder S.
  • the camera 5 is totally reflected by the slope S1 of the solder S and is reflected by the lens 41 in a state where the irradiation light Li (that is, the diffused light Ld) diffusely reflected in the irradiation range Ri is applied to the slope S1 of the solder S.
  • the light imaged on the solid-state image sensor 51 is imaged (step S206).
  • inspects the quality of the solder S based on the image imaged with the camera 5 (step S207).
  • the lens 41 since the lens 41 has telecentricity on the substrate B side, only the reflected light Lr that is totally reflected by the slant surface Sl of the solder S and incident on the lens 41 in parallel with the optical axis A is irradiated. As a result, an image is formed on the solid-state imaging device 51.
  • the steep slope illumination 7 irradiates the slope S 1 of the solder S with the irradiation light Li diffusely reflected by the surface Bs of the substrate B.
  • step S207 if there is a portion having a luminance equal to or higher than a predetermined threshold luminance Lth in the image of the slope S1 of the solder S imaged by the camera 5, it is determined that the shape of the solder S is good, If there is no portion having a luminance equal to or higher than the predetermined threshold luminance Lth, it is determined that the shape of the solder S is defective.
  • step S104 When the solder inspection process is completed in this way, it returns to FIG. 1 and it is determined whether the inspection has been completed for all the solder S on the substrate B (step S104).
  • uninspected solder S remains (in the case of “NO” in step S104)
  • the process returns to step S102, and the inspection head H moves above the solder S to be inspected.
  • the inspection result of each solder S is displayed on the user interface 12 (step S105), and the board B is unloaded. (Step S106).
  • the irradiation light Li is emitted to the surface Bs of the substrate B, and reflected by the surface Bs.
  • the irradiated light Li is applied to the solder S.
  • the irradiation light Li irradiated to the solder S through the reflection on the surface Bs of the solder S in this way is incident on the camera 5 after being reflected by the steep slope Ss. .
  • a gentle slope illumination 6 that emits three or more lights of different wavelengths to the solder S from different angles is provided, and the controller 11 captures the three or more lights reflected by the solder S by the camera 5.
  • the state of the solder S is inspected based on the result. Thereby, it is possible to take an image of the gentle slope Sg of the solder S.
  • the optical system 4 has an optical axis A parallel to the normal Bn of the surface Bs of the substrate B and faces the substrate B.
  • the beam splitter 42 transmits the light emitted from the substrate B and passing through the lens 41.
  • the light emitted from the steep slope illumination 7 is guided to the substrate B through the lens 41.
  • FIG. 5 is a flowchart showing a second operation example executed in the solder inspection process of the flowchart of FIG.
  • the flowchart in FIG. 5 is executed under the control of the control unit 11.
  • differences from the above embodiment will be mainly described, and common points will be denoted by corresponding reference numerals, and description thereof will be omitted as appropriate. It goes without saying that the same effect can be obtained by providing the configuration common to the above embodiment.
  • Step S201 to S203 are executed in the same manner as described above to inspect the gentle slope Sg of the solder S.
  • Step S210 whether the inspection result of the gentle slope Sg is good or not is determined. If the inspection result is defective (in the case of “NO” in step S210), NG determination is determined for the solder S to be inspected (step S211), and the flowchart of FIG. Return to the flowchart.
  • step S210 if the inspection result is good (“YES” in step S210), steps S204 to S207 are executed in the same manner as described above, the inspection is performed on the steep slope Ss of the solder S, and the steep slope is executed in step S212. The quality of the inspection result of Ss is determined. If the inspection result is poor (“NO” in step S212), an NG determination is determined for the solder S to be inspected, whereas if the inspection result is good (“ In the case of “YES”, an OK determination is determined for the solder S to be inspected (step S213). Then, the flowchart of FIG. 5 is terminated, and the process returns to the flowchart of FIG.
  • the steep slope Ss of the solder S is inspected by confirming whether or not the brightness image above the threshold brightness is included in the captured image of the solder S.
  • the specific inspection mode of the steep slope Ss of the solder S is not limited to this, and various changes can be made.
  • FIG. 6 is a diagram schematically showing a first modification of the steep slope inspection of solder.
  • the steep slope illumination 7 irradiates the irradiation range Ri with the projection pattern Ti having the two reference lines I arranged with a gap ⁇ Ii as the irradiation light Li.
  • the camera 5 is totally reflected by the steep slope Ss of the solder S and is reflected by the lens 41 in a state where the projection pattern Ti (that is, the irradiation light Li) diffusely reflected in the irradiation range Ri is applied to the slope S1 of the solder S.
  • the light imaged on the solid-state image sensor 51 is imaged.
  • the steep slope illumination 7 emits a predetermined projection pattern Ti as irradiation light Li onto the surface Bs of the substrate B, and the camera 5 has an observation pattern that the irradiation light Li reflected by the steep slope Ss of the solder S has.
  • the Tr is imaged.
  • the control unit 11 obtains the shape of the solder S, specifically the inclination angle ⁇ of the steep slope Ss, based on the difference in shape between the projection pattern Ti and the observation pattern Tr. As a result, the shape of the solder S can be accurately obtained.
  • the presence of a steep slope Ss having an inclination angle ⁇ equal to or greater than a predetermined threshold angle may be used as a criterion for determining whether the solder S is good or bad.
  • the projection pattern Ti may be composed of a plurality of reference lines I having different colors. In such a configuration, even when adjacent reference lines I are close to each other in the observation pattern Tr, the control unit 11 can distinguish these reference lines I by the difference in color, so that the shape of the solder S is accurately determined. Can be sought.
  • FIG. 7 is a diagram schematically showing a second modification of the steep slope inspection of solder.
  • the steep slope illumination 7 irradiates the irradiation range Ri with the sine wave fringe pattern Ts whose light intensity changes in a sine wave shape as the irradiation light Li.
  • the camera 5 is totally reflected by the steep slope Ss of the solder S in a state where the sinusoidal fringe pattern Ts (that is, the irradiation light Li) diffusely reflected in the irradiation range Ri is applied to the slope S1 of the solder S. 41 images the light imaged on the solid-state image sensor 51.
  • the pattern of the irradiation light Li that is, the reflected light Lr
  • the observation pattern Tr is imaged.
  • the observation pattern Tr is imaged for each sine wave fringe pattern Ts while changing the phase of the sine wave fringe pattern Ts to 0 °, 90 °, 180 °, and 270 °.
  • four observation patterns Tr having phases different from each other by 90 ° are acquired.
  • the control unit 11 calculates the phase ⁇ at each position (x, y) from the four observation patterns Tr by the phase shift method, Find the distribution.
  • x in the parentheses represents an x coordinate position in the xy orthogonal coordinate system
  • y in the parentheses represents a y coordinate position on the xy orthogonal coordinate axis.
  • the control unit 11 associates each position Di (x, y) in the sinusoidal fringe pattern Ts irradiated to the irradiation range Ri with each position Dr (x, y) in the observation pattern Tr by the phase ⁇ . .
  • each position Di (x, y) in the sine wave fringe pattern Ts having the same phase ⁇ is associated with the position Dr (x, y) in the observation pattern Tr.
  • the phase ⁇ of each position Di (x, y) in the sine wave fringe pattern Ts may be obtained by a phase shift method from an image obtained by imaging each sine wave fringe pattern Ts irradiated to the irradiation range Ri. You may obtain
  • the position Di in the sinusoidal fringe pattern Ts and the position Dr in the observation pattern Tr associated with each other correspond to the exit point and the incident point of the same reflected light Lr, respectively. That is, as shown in the “shape calculation” column of FIG. 7, the locus of the reflected light Lr (that is, the diffused light Ld) that is diffusely reflected at the position Di in the irradiation range Ri and incident on the steep slope Ss of the solder S is obtained. It is done. Then, based on the reflection angle ⁇ of the reflected light Lr and the above equation 2, the inclination angle ⁇ of the steep slope Ss of the solder S at the position Di is obtained. By performing this calculation for each combination of the position Di and the position Dr, the shape of the steep slope Ss of the solder S can be obtained.
  • the steep slope illumination 7 irradiates the surface Bs of the substrate B with the four sine wave fringe patterns Ts having different phases as the projection pattern Ti, and the camera 5 uses the four sine wave fringe patterns Ts.
  • the observation pattern Tr is acquired for each.
  • the control unit 11 determines the incident position Di where the irradiation light Li is incident on the surface Bs and the reflection position Dr where the irradiation light Li is reflected by the solder S based on the phase ⁇ calculated from the observation pattern Tr by the phase shift method. And the shape of the solder S is obtained based on the correspondence. In such a configuration, the shape of the solder S can be obtained more accurately.
  • the fact that the steep slope Ss having the inclination angle ⁇ equal to or larger than the predetermined threshold angle exists in the range equal to or larger than the predetermined threshold area may be used as a criterion for determining the quality of the solder S.
  • FIG. 8 is a diagram schematically showing a third modification of the solder steep slope inspection.
  • a plurality (three) of irradiation ranges Ri are set on the surface Bs of the substrate B corresponding to a plurality (three) of solder joint locations Ps. Then, by irradiating the irradiation light Li simultaneously to the plurality of irradiation ranges Ri, the irradiation light Li reflected by the irradiation ranges Ri is applied to the solder S bonded to the solder joint location Ps corresponding to the irradiation range Ri. .
  • the camera 5 simultaneously images the slope S1 of each solder S, and the control unit 11 determines the quality of the solder S based on the imaging result. With such a configuration, it is possible to determine the quality of a plurality of solders S at the same time, and the inspection of the solders S can be performed efficiently.
  • the steep slope illumination 7 simultaneously emits irradiation light Li having different wavelengths (colors) to a plurality (two) of specific irradiation ranges Rs satisfying a predetermined positional relationship among the plurality of irradiation ranges Ri.
  • the predetermined positional relationship can be a relationship in which the distance between each other is less than a predetermined threshold distance, for example.
  • the control unit 11 reflects the specific irradiation range Rs from which the irradiation light Li is emitted and the irradiation light Li reflected by the specific irradiation range Rs based on the wavelength (color) of the irradiation light Li captured by the camera 5. Correlate with the solder S. In such a configuration, the specific irradiation range Rs and the corresponding solder S can be accurately associated with each other by the wavelength (color) of the irradiation light Li.
  • the appearance inspection apparatus 1 corresponds to an example of the “appearance inspection apparatus” of the present invention
  • the substrate transport unit 2 corresponds to an example of the “substrate holding unit” of the present invention
  • the steep slope illumination 7 corresponds to an example of the “first irradiation unit” of the present invention
  • the camera 5 corresponds to an example of the “imaging unit” of the present invention
  • the control unit 11 corresponds to an example of the “control unit” of the present invention.
  • irradiation light Li corresponds to an example of “irradiation light” of the present invention
  • projection pattern Ti corresponds to an example of “projection pattern” of the present invention
  • observation pattern Tr Corresponds to an example of the “observation pattern” of the present invention
  • sine wave fringe pattern Ts corresponds to the “sine wave fringe pattern” of the present invention.
  • the reference line I corresponds to an example of the “line” of the present invention
  • the interval ⁇ Ii corresponds to an example of the “interval” of the present invention
  • the position Di corresponds to the “incident position” of the present invention.
  • the position Dr corresponds to an example of the “reflection position” of the present invention
  • the irradiation range Ri corresponds to an example of the “irradiation range” of the present invention
  • the specific irradiation range Rs corresponds to the “specific irradiation range of the present invention.
  • the gentle slope illumination 6 corresponds to an example of the “second irradiating portion” of the present invention
  • the lens 41 corresponds to an example of the “lens” of the present invention
  • the optical axis A corresponds to the present invention. It corresponds to an example of “optical axis”
  • normal line Bn corresponds to an example of “normal line” of the present invention
  • beam splitter 42 corresponds to an example of “beam splitter” of the present invention
  • threshold luminance Lth corresponds to the present invention.
  • threshold luminance corresponds to an example of “threshold luminance”.
  • the lens 41 is shared by the camera 5 and the steep slope illumination 7.
  • a lens may be provided for each of the camera 5 and the steep slope illumination 7.
  • the specific configuration of the steep slope lighting 7 may be changed as appropriate.
  • the steep slope illumination 7 can adjust the irradiation position of the irradiation light Li by modulating the light by the light modulator 72.
  • the steep slope illumination 7 may be configured so that the light from the light source 71 is collected by the lens without using the light modulator 72.
  • the inspection of the solder S can be executed by controlling the position of the inspection head H so that the light collection range coincides with the irradiation range Ri.
  • the position of the surface Bs of the substrate B where the irradiation light Li is irradiated may be changed as appropriate.
  • the text “ABCD” is written with silk K on the surface Bs of the substrate B. Therefore, the steep slope illumination 7 may be configured to emit the irradiation light Li to the silk K. That is, the silk K having white color can effectively diffuse the irradiation light Li. Therefore, it is possible to secure the irradiation light Li applied to the solder S through the reflection on the silk K, and to suitably image the steep slope Ss of the solder S.
  • the configuration of the lens 41 may be changed as appropriate.
  • the lens 41 may be configured to have telecentricity on both sides.
  • a lens that does not have telecentricity may be used as the lens 41.
  • the irradiation range Ri is set based on the position of the gentle slope Sg of the solder S confirmed by the gentle slope inspection. However, the irradiation range Ri may be set based on data indicating the position of the solder joint location Ps.
  • the number of reference lines I included in the projection pattern Ti in the first modification of the steep slope inspection of solder is not limited to two, and may be three or more.
  • the inclination angle ⁇ at each of a plurality of positions on the steep slope Ss of the solder S can be obtained by applying the relationship of Expression 1 and Expression 2 to two adjacent reference lines I.
  • the number of sinusoidal fringe patterns Ts irradiated in the second modified example of the steep slope inspection of solder is not limited to four. That is, the phase ⁇ may be obtained by irradiating three or more sinusoidal fringe patterns Ts having different phases and the phase shift method.
  • the positional relationship serving as a reference for setting the specific irradiation range Rs is not limited to the reference based on the above-described distance.
  • a plurality of irradiation ranges Ri that have the same positional relationship with the corresponding component E, in other words, provided on the same side with respect to the component E may be set as the specific irradiation range Rs.
  • the configuration of the gentle slope lighting 6 can be changed as appropriate.
  • the heights of the annular lights 62r, 62g, and 62b may be changed.
  • the arrangement of the inspection head H can be changed as appropriate. Therefore, the surface Bs of the substrate B may be disposed downward and the inspection head H may be opposed to the surface Bs of the substrate B from below.
  • SYMBOLS 1 Appearance inspection apparatus, 11 ... Control part, 12 ... User interface, 2 ... Substrate conveyance part (board

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)

Abstract

Selon la présente invention, une lumière d'irradiation (Li) n'est pas directement appliquée à une soudure (S), mais la lumière d'irradiation (Li) est appliquée à une surface (Bs) d'un substrat (B), appliquant ainsi à la soudure (S), la lumière d'irradiation (Li) reflétée par la surface (Bs). La lumière d'irradiation (Li) appliquée à la soudure (S), ladite lumière d'irradiation étant ainsi appliquée à la soudure (S) par l'intermédiaire de la réflexion par la surface (Bs), est différente de la lumière d'irradiation (Li) directement appliquée à la soudure (S), et est entrée dans appareil photographique (5) après avoir été reflétée par une pente raide (Ss). En résultat, une image de la pente raide (Ss) de la soudure (S) peut être captée.
PCT/JP2017/008976 2017-03-07 2017-03-07 Dispositif d'inspection d'apparence et procédé d'inspection d'apparence WO2018163278A1 (fr)

Priority Applications (3)

Application Number Priority Date Filing Date Title
PCT/JP2017/008976 WO2018163278A1 (fr) 2017-03-07 2017-03-07 Dispositif d'inspection d'apparence et procédé d'inspection d'apparence
CN201780087964.6A CN110383001B (zh) 2017-03-07 2017-03-07 外观检查装置、外观检查方法
JP2019504163A JP6733039B2 (ja) 2017-03-07 2017-03-07 外観検査装置、外観検査方法

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Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09196860A (ja) * 1996-01-22 1997-07-31 Shimu:Kk 半田付状態検査方法
JP2001183306A (ja) * 1999-12-22 2001-07-06 Yokogawa Electric Corp 半田接合部の検査装置
JP2001324455A (ja) * 2000-05-15 2001-11-22 Device Link:Kk 実装基板外観検査装置
JP2006029829A (ja) * 2004-07-12 2006-02-02 Shinshu Univ 三次元計測装置
JP2008309580A (ja) * 2007-06-13 2008-12-25 Omron Corp はんだフィレットの検査方法および基板外観検査装置
WO2015104799A1 (fr) * 2014-01-08 2015-07-16 ヤマハ発動機株式会社 Appareil d'inspection visuelle et procédé d'inspection visuelle

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3867724B2 (ja) * 2004-02-27 2007-01-10 オムロン株式会社 表面状態検査方法およびその方法を用いた表面状態検査装置ならびに基板検査装置

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09196860A (ja) * 1996-01-22 1997-07-31 Shimu:Kk 半田付状態検査方法
JP2001183306A (ja) * 1999-12-22 2001-07-06 Yokogawa Electric Corp 半田接合部の検査装置
JP2001324455A (ja) * 2000-05-15 2001-11-22 Device Link:Kk 実装基板外観検査装置
JP2006029829A (ja) * 2004-07-12 2006-02-02 Shinshu Univ 三次元計測装置
JP2008309580A (ja) * 2007-06-13 2008-12-25 Omron Corp はんだフィレットの検査方法および基板外観検査装置
WO2015104799A1 (fr) * 2014-01-08 2015-07-16 ヤマハ発動機株式会社 Appareil d'inspection visuelle et procédé d'inspection visuelle

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CN110383001A (zh) 2019-10-25
CN110383001B (zh) 2020-12-25
JP6733039B2 (ja) 2020-07-29

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