WO2015102149A1 - Composition pour la formation de couche de résine et substrat d'affichage flexible l'utilisant - Google Patents

Composition pour la formation de couche de résine et substrat d'affichage flexible l'utilisant Download PDF

Info

Publication number
WO2015102149A1
WO2015102149A1 PCT/KR2014/001131 KR2014001131W WO2015102149A1 WO 2015102149 A1 WO2015102149 A1 WO 2015102149A1 KR 2014001131 W KR2014001131 W KR 2014001131W WO 2015102149 A1 WO2015102149 A1 WO 2015102149A1
Authority
WO
WIPO (PCT)
Prior art keywords
composition
glass fiber
fiber sheet
bisphenol
group
Prior art date
Application number
PCT/KR2014/001131
Other languages
English (en)
Inventor
Byung-Joon AN
Bo-Mi Lee
Dong-Hee Lee
Heon-Seung Chae
Pil-Rye Yang
Original Assignee
Kolon Industries, Inc.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kolon Industries, Inc. filed Critical Kolon Industries, Inc.
Publication of WO2015102149A1 publication Critical patent/WO2015102149A1/fr

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
    • C08F290/02—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated end groups
    • C08F290/06—Polymers provided for in subclass C08G
    • C08F290/068—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/38—Polysiloxanes modified by chemical after-treatment
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/0008—Organic ingredients according to more than one of the "one dot" groups of C08K5/01 - C08K5/59
    • C08K5/0041—Optical brightening agents, organic pigments
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/05—Alcohols; Metal alcoholates
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/10—Esters; Ether-esters
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D183/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers
    • C09D183/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/42—Block-or graft-polymers containing polysiloxane sequences
    • C08G77/442—Block-or graft-polymers containing polysiloxane sequences containing vinyl polymer sequences
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2383/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen, or carbon only; Derivatives of such polymers
    • C08J2383/04—Polysiloxanes

Definitions

  • the present invention relates to a composition for forming a resin layer, a flexible display substrate using the same, and a manufacturing method thereof.
  • CTR cathode ray tube
  • LCD liquid crystal displays
  • OLED organic light emitting diodes
  • a plastic substrate is an essential material necessary for realizing plastic flat panel displays or next-generation displays, and a demand for a plastic substrate is created in accordance with the development of the flexible display industry. Comparing the physical properties of a plastic substrate for realizing flexible displays with those of a conventional glass substrate, a plastic substrate is excellent in terms of weight, formability, non-breakability, design, roll-to-roll processability and the like, which are essential characteristics of flexible displays. However, in order for an optical plastic film to be used as a plastic substrate, it is required to improve the plastic substrate's physical properties, such as chemical resistance, thermal characteristics, air barrier properties and the like, which are poorer than those of a glass substrate.
  • an object of the present invention is to provide a composition for forming a resin layer, which includes a silicon-based binder and an acrylic monomer or an epoxy resin, a flexible display substrate having improved heat resistance, which is manufactured using the composition, and a method of manufacturing the flexible display substrate.
  • an aspect of the present invention provides a composition for forming a resin layer, including: a silicon-based binder having a structure of Formula 1 below; at least one compound selected from the group consisting of an acrylic monomer and an epoxy resin; and an initiator:
  • R 1 to R 4 are the same as or different from one another, and are each independently an alkyl group of C 1 to C 12 , an allyl group of C 2 to C 12 , an aralkyl group of C 2 to C 12 or an alkenyl group of C 2 to C 12 ;
  • R 5 and R 6 are the same as or different from each other, and are each independently hydrogen or a vinyl group; and S is an integer of 2 to 1000.
  • the mixing ratio of the silicon-based binder and the compound may be 7: 3 to 1: 9 by weight.
  • composition may further include: 9.5 to 70 wt% of the silicon-based binder; 30 to 90 wt% of the at least one compound selected from the group consisting of an acrylic monomer and an epoxy resin; and 0.5 to 20 wt% of the initiator.
  • the acrylic monomer may be at least one selected from the group consisting of bisphenol-A ethylene oxide diacrylate, bisphenol-A ethylene oxide dimethacrylate, bisphenol-A ethoxylate diacrylate, bisphenol-A ethoxylate dimethacrylate, bisphenol-A polyethoxylate diacrylate, bisphenol-A diacrylate, bisphenol-S diacrylate, dicyclopentadienyl diacrylate, pentaerythritol triacrylate, tris(2-hydroxyethyl)isocyanurate triacrylate, pentaerythritol tetracrylate, bisphenol-A dimethacrylate, bisphenol-S dimethacrylate, dicyclopentadienyl dimethacrylate, pentaerythritol trimethacrylate, tris(2-hydroxyethyl)isocyanurate trimethacrylate, and pentaerythritol tetramethacrylate.
  • the epoxy resin may be at least one selected from the group consisting of a glycidyl epoxy resin and an alicyclic epoxy resin.
  • composition may further include a surfactant.
  • composition may further include a solvent.
  • Another aspect of the present invention provides flexible display substrate, including a glass fiber sheet impregnated with the composition.
  • Still another aspect of the present invention provides a method of manufacturing a flexible display substrate including a glass fiber sheet and a resin layer formed on both sides of the glass fiber sheet, including the steps of: impregnating a glass fiber sheet with the composition for a resin layer of claim 1; and UV-irradiating the glass fiber sheet impregnated with the composition to UV-cure the glass fiber sheet.
  • the method may include the steps of: impregnating a glass fiber sheet with the composition for a resin layer of; laminating a release film on both sides of the glass fiber sheet impregnated with the composition; UV-irradiating the glass fiber sheet laminated with the release film to UV-cure the glass fiber sheet; and separating the release film from the UV-cured glass fiber sheet.
  • the method may further include the step of heating the UV-cured glass fiber sheet to 200 to 300°C to thermally cure the glass fiber sheet, after the step of UV-curing the glass fiber sheet.
  • this flexible display substrate When a flexible display substrate is manufactured using the composition for forming a resin layer according to the present invention, this flexible display substrate has excellent formability, is transparent and flexible, and has excellent thermal expansibility, excellent heat resistance and excellent flame retardance. Therefore, this flexible display substrate can replace a conventional glass substrate.
  • the present invention provides a composition for forming a resin layer, including: a silicon-based binder having a structure of Formula 1 below; at least one compound selected from the group consisting of an acrylic monomer and an epoxy resin; and an initiator:
  • R 1 to R 4 are the same as or different from one another, and are each independently an alkyl group of C 1 to C 12 , an allyl group of C 2 to C 12 , an aralkyl group of C 2 to C 12 or an alkenyl group of C 2 to C 12 ;
  • R 5 and R 6 are the same as or different from each other, and are each independently hydrogen or a vinyl group; and S is an integer of 2 to 1000.
  • the acrylic monomer may be a 2-functional or more acrylic or methacrylic compound.
  • the acrylic monomer may be at least one selected from the group consisting of bisphenol-A ethylene oxide diacrylate, bisphenol-A ethylene oxide dimethacrylate, bisphenol-A ethoxylate diacrylate, bisphenol-A ethoxylate dimethacrylate, bisphenol-A polyethoxylate diacrylate, bisphenol-A diacrylate, bisphenol-S diacrylate, dicyclopentadienyl diacrylate, pentaerythritol triacrylate, tris(2-hydroxyethyl)isocyanurate triacrylate, pentaerythritol tetracrylate, bisphenol-A dimethacrylate, bisphenol-S dimethacrylate, dicyclopentadienyl dimethacrylate, pentaerythritol trimethacrylate, tris(2-hydroxyethyl)iso
  • the epoxy resin is referred to as a resin having at least one epoxy group.
  • the epoxy group may be a glycidyl epoxy resin or an alicyclic epoxy resin.
  • the glycidyl epoxy resin may be a bisphenol-A epoxy resin, a bisphenol-F epoxy resin, a bisphenol-S epoxy resin, a naphthalene-type epoxy resin or a hydrogenated compound thereof; an epoxy resin having a dicyclopentadiene backbone; an epoxy resin having a triglycidyl isocyanurate backbone; an epoxy resin having a cardo backbone; or an epoxy resin having a polysiloxane backbone.
  • the alicyclic epoxy resin may be 3,4-epoxycyclohexylmethyl-3',4'-epoxycyclohexanecarboxylate, 1,2,8,9-diepoxylimonene, ⁇ -caprolactone whose both ends are respectively ester-bonded with 3,4-epoycyclohexylmethanol and 3,4-epoxycyclohexane carboxylic acid, or an epoxy resin having a hydrogenated bisphenol-A backbone.
  • the mixing ratio of the silicon-based binder and the compound may be 7: 3 to 1: 9 by weight. It is preferred that the silicon-based binder having high flexibility and heat resistance be used alone. However, the composition including only the silicon-based resin cannot be applied to a roll-to-roll process for attaching a release film unable to resist a temperature of 150°C or higher to both sides of a glass fiber sheet impregnated with the composition and curing the glass fiber sheet coated with the release film, because the thermal cure temperature thereof is 150°C or higher.
  • the silicon-based binder when the silicon-based binder is mixed with an acrylic monomer or an epoxy resin and then used, a release film is attached to both sides of a glass fiber sheet impregnated with the composition, the glass fiber sheet is photocured, the release film is removed from the glass fiber sheet, and then the glass fiber sheet is thermally photocured.
  • the release film can smoothly move along a roll without being sticky when this release film is removed before thermal curing after photocuring during a roll-to-roll process.
  • the mixing ratio of the silicon-based binder and the compound exceeds 7:3, the release film cannot smoothly move along a roll without being sticky when this release film is removed before thermal curing after photocuring during a roll-to-roll process.
  • the mixing ratio of the compound and the silicon-based binder does not reach 1:9, the content of the silicon-based binder in the composition is extremely low and thus the effects of improvement of flexibility and heat resistance cannot be expected.
  • composition for forming a resin layer according to the present invention may further include an initiator for curing the above-mentioned silicon-based binder and compound.
  • the initiator may be a photopolymerization initiator or thermopolymerization initiator.
  • the photopolymerization initiator is referred to as a compound causing decomposition or bonding using lithographic exposure and creating active species capable of initiating the polymerization of the silicon-based binder with the acylic monomer or epoxy resin such as radical, anion, cation or the like.
  • Examples of the photopolymerization initiator may include: acetophenone compounds, such as 4-(2-hydroxyethoxy)phenyl(2-hydroxy-2-propyl)ketone, ⁇ -hydroxy- ⁇ , ⁇ '-dimethylacetophenone, methoxyacetophenone, 2,2-dimethoxy-2-phenylacetophenone, 2,2-diethoxyacetophenone, 1-hydroxycyclohexyl phenyl ketone, and 2-methyl-1-[4-(methylthio)-phenyl]-2-morpholinopropane-1; benzoin ether compounds, such as benzoin ethyl ether, benzoin isopropyl ether, and anisyl methy ether; ⁇ -ketol compounds, such as 2-methyl-2-hydroxypropiophenone; ketal compounds, such as benzyl dimethyl ketal; aromatic sulfonyl chloride compounds, such as 2-naphthalenesulfonyl chloride; photoactive oxime
  • thermopolymerization initiator may include: organic peroxides, such as benzoyl peroxide, t-butyl perbenzoate, cumene hydroperoxide, diisopropyl peroxydicarbonate, di-n-propyl peroxydicarbonate, di(2-ethoxyethyl) peroxydicarbonate, t-butyl peroxyneodecanoate, t-butyl peroxypivalate, (3,5,5-trimethylhexanoyl) peroxide, dipropionyl peroxide, and diacetyl peroxide; and azo compounds, such as 2,2'-azobisisobutyronitrile, 2,2'-azobis(2-methylbutyronitrile, 1,1'-azobis(cyclohexane-1-carbonitrile), 2,2'-azobis(2,4-dimethylvaleronitrile), 2,2'-azobis(2,4-dimethyl-4-methoxyvaleronitrile
  • the composition for forming a resin layer may include 9.5 to 70 wt% of the silicon-based binder; 30 to 90 wt% of the at least one compound selected from the group consisting of an acrylic monomer and an epoxy resin; and 0.5 to 20 wt% of the initiator.
  • the contents of the silicon-based binder, compound and initiator in the composition deviate from the above ranges, respectively, the heat resistance, thermal expansibility and flame retardance of the composition may be deteriorated.
  • the composition for forming a resin layer may further include a surfactant and a solvent for the purpose of realizing specific functions.
  • the surfactant is effective in modifying the surface of a resin layer, and, preferably, may be a silicon-based surfactant or a fluorine-based surfactant.
  • the silicon-based surfactant may include a silicon group and an ionic group.
  • the ionic group may be an anionic group. Specific examples of the anionic group may include carboxylate, sulfonate, phosphonate and the like.
  • the surfactant In order for the surfactant to be converted into fumes during UV-curing or thermal curing in the process of manufacturing a flexible display substrate, it is preferred that the surfactant have a solid content of 80 to 100 wt% based 100 wt% of the total amount thereof and have a flash point of 100°C or higher.
  • the surfactant be included in an amount of 0.005 to 5 parts by weight, preferably 0.01 to 1 parts by weight, based on 100 parts by weight of the solid content of the composition for forming a resin layer.
  • the surfactant is included in an amount of less than 0.005 parts by weight, the effect of modifying the surface of a resin layer may be insufficient, and, when the surfactant is included in an amount of more than 5 parts by weight, the heat resistance of a resin layer may be deteriorated.
  • the solvent may be selected from among ketones, ethers, esters, alcohols, hydrocarbons, acetonitrile, nitromethane, water, and mixtures thereof.
  • the solvent may include: ketones, such as acetone, methyl ethyl ketone, methyl isobutyl ketone, cyclohexanone and the like; ethers, such as tetrahydrofuran, 1,4-dioxane, 1,2-dimethoxyethane and the like; esters, such as ethyl acetate, ethoxyethyl acetate and the like; alcohols, such as methanol, ethanol, 1-propanol, 2-propanol, 1-butanol, 2-butanol, 2-methyl-1-propanol, 2-methyl-2-propanol, 2-ethoxyethanol, 1-methoxy-2-propanol, 2-butoxyethanol and the like; hydrocarbons, such as n-hexane,
  • the method of manufacturing a flexible display substrate may include the steps of: impregnating a glass fiber sheet with the composition for a resin layer; and UV-irradiating the glass fiber sheet impregnated with the composition to UV-cure the glass fiber sheet.
  • the intensity of UV-irradiation may be changed depending on the kind of components included in the composition for forming a resin layer and the amount of the photopolymerization initiator. Further, it is preferred that a release film be laminated on both sides of the glass fiber sheet impregnated with the composition before the step of UV-curing the glass fiber sheet, and that the release film be separated from the both side of the glass fiber sheet after the step of UV-curing the glass fiber sheet.
  • the temperature and pressure of a laminating machine may be adjusted according to the purpose of the present invention. As such, when the glass fiber sheet is laminated with the release film and then UV-cured, it is easy to uniformly control the final thickness of a resin layer formed after UV-irradiation.
  • the method may further include the step of heating the UV-cured glass fiber sheet to thermally cure the glass fiber sheet, after the step of UV-curing the glass fiber sheet, depending on the kind of the composition applied to the glass fiber sheet.
  • the thermal curing temperature may be 200 to 300°C
  • the thermal curing time may be properly adjusted in consideration of the kind of the composition and the thermal curing temperature.
  • the flexible substrate may include a glass fiber sheet impregnated with the composition for forming a resin layer.
  • the flexible display substrate is manufactured by the above method, and may have a thickness of 10 to 200 um.
  • the flexible display substrate is characterized in that it has excellent flexibility and heat resistance.
  • this flexible display substrate may have a thermal expansion coefficient of 10 ppm/°C or less.
  • a glass fiber sheet having a thickness of 40 to 60 um was impregnated with the composition for forming a resin layer at room temperature for 1 hour. Thereafter, a release film was laminated on both sides of the glass fiber sheet impregnated with the composition using a laminating machine, and then the glass fiber sheet laminated with the release film was UV-cured using a UV-exposing machine. Subsequently, the release film was removed from the both sides of the UV-cured glass fiber sheet, and then this glass fiber sheet was thermally cured, thereby finally obtaining a substrate.
  • a glass fiber sheet having a thickness of 40 to 60 um was impregnated with the composition for forming a resin layer at room temperature for 1 hour. Thereafter, a release film was laminated on both sides of the glass fiber sheet impregnated with the composition using a laminating machine, and then the glass fiber sheet laminated with the release film was UV-cured using a UV-exposing machine. Subsequently, the release film was removed from the both sides of the UV-cured glass fiber sheet, and then this glass fiber sheet was thermally cured, thereby finally obtaining a substrate.
  • compositions for forming a resin layer of Examples 1 and 2 25 wt% of bisphenol-A ethoxylate diacrylate, 15 wt% of ethoxylated bisphenol fluorene diacrylate (manufacturer: Hannong Chemical Co., Ltd., product name: BPF-022), 50 wt% of ethoxylated pentaerythritol tetracrylate (manufacturer: Hannong Chemical Co., Ltd., product name: PE-044) and 10 wt% of fluorene acrylate having a bivalent functional group (manufacturer: Miwon Chemical Co., Ltd., product name: HR-6082) were first mixed to obtain a mixture.
  • the substrates of Examples 1 and 2 and Comparative Example 1 were first heated from room temperature to 330°C at a heating rate of 10 °C/min under an N 2 atmosphere of a thermo-mechanical analyzer (TMA), were cooled from 330°C to room temperature at a cooling rate of 5 °C/min, and were then second heated from room temperature to 330°C at a heating rate of 10 °C/min.
  • TMA thermo-mechanical analyzer
  • the CTEs of these substrates were measured at 50°C intervals from room temperature to 330°C, and then the average value thereof was calculated.
  • each of the substrates of Examples 1 and 2 and Comparative Example 1 was heated from room temperature to 150°C at a heating rate of 10 °C/min under an N 2 atmosphere of a thermo-gravimetric analyzer (TGA), and then maintained at 150°C for 10 minutes. Then, each of the substrates was heated cooled from 150°C to 300°C at a heating rate of 10 °C/min, and was then maintained at 300°C for 1 hour and 10 minutes. The weight loss (%) thereof, which had been generated for 1 hour from 2 minutes to 62 minutes after it reached 300°C, was measured.
  • TGA thermo-gravimetric analyzer
  • the ⁇ Ra (roughness) of each of the substrates of Examples 1 and 2 and Comparative Example 1 was evaluated by measuring the surface roughness of each substrate having an area of 1mm x 1mm before and after heat treatment (250°C/10min) using a 10x magnification lens as a 3D profiler.
  • the CTE of the substrate of Comparative Example 1 is 14 ppm/°C or less, whereas that of the Example 1 is 7 ppm/°C or less and that of Example 2 is 9 ppm/°C or less, and that the weight loss of the substrate of Comparative Example 1 is 1.5% or less, whereas that of Example 1 is 1.0% or less and that of Example 2 is 1.2% or less.
  • the ⁇ Ra of the substrate of Comparative Example 1 is 600 nm or less, whereas that of Example 1 is 100 nm or less and that of Example 2 is 200 nm or less.
  • this flexible display substrate When a flexible display substrate is manufactured using the composition for forming a resin layer according to the present invention, this flexible display substrate has excellent formability, is transparent and flexible, and has excellent thermal expansibility, excellent heat resistance and excellent flame retardance. Therefore, this flexible display substrate can replace a conventional glass substrate.

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Materials Engineering (AREA)
  • Engineering & Computer Science (AREA)
  • General Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Wood Science & Technology (AREA)
  • Laminated Bodies (AREA)

Abstract

L'invention concerne une composition pour la formation d'une couche de résine, comprenant : un liant à base de silicium ; au moins un composé choisi dans le groupe constitué par un monomère acrylique et une résine époxy ; et un initiateur. Lorsqu'un substrat d'affichage flexible est fabriqué à l'aide de la composition pour la formation d'une couche de résine, ce substrat d'affichage flexible présente une excellente aptitude au formage, est transparent et flexible, et présente une excellente aptitude à la dilatation thermique, une excellente résistance à la chaleur et un excellent caractère ignifuge. Par conséquent, ce substrat d'affichage flexible peut remplacer un substrat de verre classique.
PCT/KR2014/001131 2013-12-30 2014-02-12 Composition pour la formation de couche de résine et substrat d'affichage flexible l'utilisant WO2015102149A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR10-2013-0167131 2013-12-30
KR1020130167131A KR101575440B1 (ko) 2013-12-30 2013-12-30 수지층 형성용 조성물 및 이를 이용한 플렉서블 디스플레이 기판

Publications (1)

Publication Number Publication Date
WO2015102149A1 true WO2015102149A1 (fr) 2015-07-09

Family

ID=53493486

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR2014/001131 WO2015102149A1 (fr) 2013-12-30 2014-02-12 Composition pour la formation de couche de résine et substrat d'affichage flexible l'utilisant

Country Status (3)

Country Link
KR (1) KR101575440B1 (fr)
TW (1) TWI515280B (fr)
WO (1) WO2015102149A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2018217682A1 (fr) * 2017-05-23 2018-11-29 Alpha Assembly Solutions Inc. Matériaux améliorés et modifiés au graphène pour commutateur tactile à membrane et autres structures électroniques souples

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102590498B1 (ko) * 2016-02-19 2023-10-19 삼성디스플레이 주식회사 플렉서블 표시장치, 윈도우 부재의 제조방법 및 하드 코팅 조성물
KR102169052B1 (ko) * 2019-01-15 2020-10-22 경상대학교산학협력단 3d 프린터용 광경화 조성물

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20090065220A (ko) * 2007-12-17 2009-06-22 제일모직주식회사 감광성 수지 조성물 및 이를 이용하여 제조된 차광층
KR20090075525A (ko) * 2008-01-04 2009-07-08 주식회사 엘지화학 감광성 실리콘 수지 조성물 및 이로부터 제조된 경화막
KR20110125851A (ko) * 2010-05-14 2011-11-22 (주)스마트이노베이션 디스플레이 카드 제조용 수지 조성물 및 이를 이용한 디스플레이 카드 제조방법
KR20120138610A (ko) * 2011-06-15 2012-12-26 코오롱인더스트리 주식회사 플렉서블 디스플레이 기판
KR20130139133A (ko) * 2012-06-12 2013-12-20 제일모직주식회사 복합시트, 그 제조방법 및 이를 포함하는 디스플레이 기판

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20090065220A (ko) * 2007-12-17 2009-06-22 제일모직주식회사 감광성 수지 조성물 및 이를 이용하여 제조된 차광층
KR20090075525A (ko) * 2008-01-04 2009-07-08 주식회사 엘지화학 감광성 실리콘 수지 조성물 및 이로부터 제조된 경화막
KR20110125851A (ko) * 2010-05-14 2011-11-22 (주)스마트이노베이션 디스플레이 카드 제조용 수지 조성물 및 이를 이용한 디스플레이 카드 제조방법
KR20120138610A (ko) * 2011-06-15 2012-12-26 코오롱인더스트리 주식회사 플렉서블 디스플레이 기판
KR20130139133A (ko) * 2012-06-12 2013-12-20 제일모직주식회사 복합시트, 그 제조방법 및 이를 포함하는 디스플레이 기판

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2018217682A1 (fr) * 2017-05-23 2018-11-29 Alpha Assembly Solutions Inc. Matériaux améliorés et modifiés au graphène pour commutateur tactile à membrane et autres structures électroniques souples
US11624000B2 (en) 2017-05-23 2023-04-11 Alpha Assembly Solutions Inc. Graphene enhanced and engineered materials for membrane touch switch and other flexible electronic structures

Also Published As

Publication number Publication date
TW201525093A (zh) 2015-07-01
KR101575440B1 (ko) 2015-12-07
TWI515280B (zh) 2016-01-01
KR20150078060A (ko) 2015-07-08

Similar Documents

Publication Publication Date Title
WO2013137621A1 (fr) Composition adhésive
EP2274394A2 (fr) Compositions adhésives autocollantes, polariseurs et écrans à cristaux liquides comportant de telles compositions
CN109852280B (zh) 粘着剂组合物及表面保护膜
CN112126372B (zh) 抗静电表面保护膜的制造方法、抗静电表面保护膜
WO2013094585A1 (fr) Substrat de résine composite avec fibres de verre
US20140242384A1 (en) Removable water-dispersible acrylic pressure-sensitive adhesive composition and pressure-sensitive adhesive sheet
KR102607576B1 (ko) 점착제 조성물
WO2015102149A1 (fr) Composition pour la formation de couche de résine et substrat d'affichage flexible l'utilisant
KR20140143693A (ko) 점착제 조성물, 그것을 사용한 점착 필름 및 표면 보호 필름
TWI741081B (zh) 黏著劑組合物及表面保護膜
WO2014119425A1 (fr) Composition durcissable par rayonnement d'énergie active pour éléments optiques, article durci, et lentille optique et feuille ou film pour lentilles optiques produits au moyen dudit article durci
WO2018097660A1 (fr) Composition durcissable
JP2008101136A (ja) 熱硬化性樹脂組成物
CN111171761B (zh) 粘着剂组合物及使用了该粘着剂组合物的粘着膜、表面保护膜
WO2012141453A2 (fr) Procédé de préparation d'une composition de résine pour film optique par polymérisation en masse continue et procédés de préparation d'un film optique et d'une plaque de polarisation utilisant ladite composition de résine
TWI682003B (zh) 著色樹脂組成物、及應用其之彩色濾光片和顯示裝置
WO2018097663A1 (fr) Composition durcissable
KR102376111B1 (ko) 고굴절률 경화성 유무기 하이브리머 수지 조성물 및 이의 제조방법
CN110951420B (zh) 粘着剂组合物
WO2022024579A1 (fr) Film polarisant avec couche adhésive sensible à la pression, écran d'affichage d'image, procédé de fabrication d'écran d'affichage d'image et couche adhésive sensible à la pression
KR20150105740A (ko) 우수한 표면조도를 가지는 플렉시블 복합필름 및 이의 제조방법
KR101453847B1 (ko) 광학시트 제조용 친수성 조성물 및 이를 이용하여 제조된 광학시트
WO2017191960A1 (fr) Composition de résine durcissable par rayonnement uv, procédé permettant de la durcir, et produit durci l'utilisant
JP2023085740A (ja) 硬化性樹脂組成物、硬化物及び物品
KR20240062117A (ko) 감광성 수지 조성물

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 14876714

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 14876714

Country of ref document: EP

Kind code of ref document: A1